Camera module and semiconductor cavity

Abstract

The invention provides a camera module and a semiconductor cavity, and the camera module comprises a camera assembly which is used for obtaining an image in the semiconductor cavity; an optical path is formed between the light source assembly and the camera assembly, and the light source assembly is used for providing illumination for the semiconductor cavity through the optical path; the shading assembly is located at the camera shooting end of the camera assembly and used for reducing the luminous flux emitted into the semiconductor cavity by the light source assembly in the optical path; the camera assembly, the light source assembly and the shading assembly are all arranged in the housing; one end of the connecting assembly is connected with the housing, the other end of the connecting assembly is connected with the shading assembly, and the connecting assembly is made of metal. Mirror surface treatment is performed on the outer surface of the metal connecting assembly, anodic oxidation treatment is performed on the inner surface of the metal connecting assembly, light reflection of the outer surface can be increased, light absorption of the inner surface can be increased, and imaging of the camera assembly under good light is guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor cavities of semiconductor equipment, and in particular to a camera module of a semiconductor cavity and a semiconductor cavity having the camera module. Background Art

[0002] In the prior art, semiconductor cavities are usually provided with multiple observation windows for observing the internal conditions of the cavity. Through the observation windows, process personnel can observe the internal conditions of the cavity with naked eyes. However, by observing the internal conditions through the observation windows, process personnel cannot observe all the time, and there may be problems where abnormalities in the cavity cannot be known in time. In addition, although some prior art technologies use camera technology to obtain the conditions in the cavity, it is impossible to obtain a clear internal image, especially the camera cannot perform surface treatment, which further affects the clarity of the image. Summary of the invention

[0003] The purpose of the present invention is to provide a camera module and a semiconductor cavity having the camera module, which solves the problem of timely and clear acquisition of the conditions inside the cavity.

[0004] In order to achieve the above objectives, the present invention is implemented by the following technical solutions:

[0005] A camera module is used for a semiconductor cavity, wherein the semiconductor cavity comprises a hole, and the camera module is arranged in the hole; comprising:

[0006] A camera assembly, used to acquire an image inside the semiconductor cavity;

[0007] a light source assembly, forming an optical path between the light source assembly and the camera assembly, and used for providing illumination into the semiconductor cavity through the optical path;

[0008] A shading component, located at the camera end of the camera component, and used to reduce the light flux emitted from the light source component in the optical path to the semiconductor cavity;

[0009] A housing, wherein the camera assembly, the light source assembly and the light shielding assembly are all arranged in the housing;

[0010] A connecting component, one end of which is connected to the housing, and the other end of which is connected to the shading component;

[0011] Wherein, the connecting component comprises metal material.

[0012] Optionally, the outer surface of the connection component is mirror-finished, and the inner surface of the connection component is anodized.

[0013] Optionally, the shading component includes PTFE material or metal material.

[0014] Optionally, the metal material includes aluminum or stainless steel.

[0015] Optionally, the camera module further includes: a light-transmitting component, wherein the light-transmitting component is disposed between the camera component and the hole.

[0016] Optionally, the shading component includes a connecting portion and a shading portion, the shading portion is configured to surround one end of the camera component close to the semiconductor cavity; the connecting portion is used to connect to the connecting component, one end of the connecting portion is connected to the connecting component, and the other end is connected to the shading portion.

[0017] Optionally, a pad is provided on the light-transmitting component, and the pad is in contact with the edges around the light-shielding portion.

[0018] Optionally, the light source assembly includes a light source and a reflective plate, the light source and the reflective plate are connected, the light source emits light in the opposite direction of the hole, and the reflective plate reflects the light to the hole to form part of the optical path.

[0019] Optionally, the light source is annular and is arranged around the camera assembly; the reflector is dome-shaped, and the light source is arranged on the dome-shaped edge of the reflector.

[0020] Optionally, the reflective plate is connected to the cover shell.

[0021] Optionally, the cover shell includes a cover body and a fixing portion, and the camera assembly and the connecting assembly are both connected to the cover body via the fixing portion.

[0022] Optionally, the camera module further includes a light-transmitting component fixing portion, the light-transmitting component is connected to the semiconductor cavity through the light-transmitting component fixing portion; the cover is fixed on the light-transmitting component fixing portion.

[0023] The present invention also provides a semiconductor cavity, comprising:

[0024] a cavity wall, the cavity wall comprising an aperture;

[0025] A camera module is disposed in the hole and is used to obtain the state inside the semiconductor cavity.

[0026] Compared with the prior art, the present invention has the following advantages:

[0027] (1) The present invention can reduce the light flux emitted from the light source component in the optical path to the semiconductor cavity by setting the light shielding portion, thereby ensuring that the image captured by the shooting component is clear.

[0028] (2) At the same time, since the shading part is provided, the camera component is separated from the light source component. By ensuring the airtight contact between the shading part and the light-transmitting component, it is ensured that light cannot leak from between the shading component and the light-transmitting component, thereby improving the clarity of the imaging.

[0029] (3) The outer surface of the metal connection component can be surface treated, and the inner surface can be anodized. On the one hand, it is convenient to install the shielding component, and on the other hand, it allows light to enter the semiconductor cavity at multiple angles, increasing the irradiation range and reducing the overexposure of the image caused by light concentration. In addition, the anodized inner surface can absorb stray light to prevent it from affecting the camera end.

[0030] (4) The light-shielding component is made of PTFE material, which has a certain degree of flexibility. Combined with the pad, it is more convenient to seal and protect the light-transmitting component. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings required for the description. Obviously, the drawings described below are an embodiment of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work:

[0032] Figure 1 A schematic diagram of the installation structure of the camera module provided by the present invention;

[0033] Figure 2 is a cross-sectional view of a camera module of the present invention;

[0034] Figure 3 An exploded view of the camera module of the present invention;

[0035] Figure 4 is an enlarged view of the connecting component and the shading component of the present invention;

[0036] Figure 5 This is a photographic image of the present invention without connecting components. DETAILED DESCRIPTION

[0037] The scheme proposed by the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the accompanying drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the implementation method of the present invention. In order to make the purposes, features and advantages of the present invention more obvious and easy to understand, please refer to the accompanying drawings. It should be noted that the structures, proportions, sizes, etc. illustrated in the accompanying drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no technical substantive significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope of the technical content disclosed by the present invention.

[0038] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of more restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the process, method, article or device including the elements. In addition, the term "connection" herein means that A and B are directly connected, or that A and B are indirectly connected, such as A and B are connected through C, or even through more components such as C and D, and A and B can be connected in one piece, or in separate pieces, or removable, or fixed. The term "optional" herein means that the technical feature can be combined or not combined with any feature in the text.

[0039] The camera module is applied to a semiconductor cavity, which includes a camera module and a cavity wall. The cavity wall includes an upper cavity wall located at the top, a side cavity wall located at the side, and a lower cavity wall located at the bottom. A hole is provided on the cavity wall, and the hole is an image acquisition hole. The hole can be, for example, provided in at least one of the upper cavity wall, the side cavity wall, or the lower cavity wall. The camera module is provided in the hole of the cavity wall. The camera module can be provided on at least one of the upper cavity wall, the side cavity wall, and / or the lower cavity wall, so as to be able to obtain the state inside the cavity from a required viewing angle. Optionally, the semiconductor cavity is, for example, at least one of a vacuum load cavity (Load Lock), a wafer transfer cavity (TM), and a process cavity (PM), wherein the process cavity (PM) can be at least one of CVD, PVD, RTP, epitaxy (Epi), or etching (Etch). The cavity wall is a metal material, such as stainless steel or aluminum.

[0040] Figure 1 FIG. 2 shows a schematic diagram of the installation structure of the camera module 200 of the present invention. Figure 1 As shown, the camera module 200 is mounted on the cavity wall 100 of the semiconductor cavity. Figure 1 In the embodiment, as an example, the semiconductor cavity is a wafer transfer cavity, the cavity wall 100 is an upper cavity wall, and the camera module 200 is used to observe the status of the robot and the wafer in the wafer transfer cavity.

[0041] Figure 2 2 shows a cross-sectional view of a camera module 200 of the present invention, Figure 3 FIG. 2 shows an exploded view of the camera module 200 of the present invention. Figure 2-3 As shown, the camera module 200 includes a housing 201, a camera assembly 202, a light source assembly 203, a shading assembly 204, and a connecting assembly 205; the camera assembly 202 is used to obtain an image in the semiconductor cavity; the light source assembly 203 is used to provide light to the semiconductor cavity, so as to form an optical path S between the camera assembly 202 and the light source assembly 203, the light source assembly 203 illuminates the semiconductor cavity through a portion of the optical path S, and the reflected light in the semiconductor cavity reaches the camera assembly 202 through a portion of the optical path S. The shading assembly 204 is located at the camera end of the camera assembly 202, and is used to reduce the light flux of the light source assembly 203 in the optical path S that is emitted to the semiconductor cavity. The camera assembly 202, light source assembly 203 and shading assembly 204 are all arranged in the cover shell 201; one end of the connecting assembly 205 is connected to the cover shell 201, and the other end is connected to the shading assembly 204. The connecting assembly 205 can be made of metal material so as to perform some optical processing on the metal surface.

[0042] The image captured by the camera component 202 can be in the form of a picture or a video, including but not limited to the above. The present invention can reduce the light flux entering the semiconductor cavity by setting the light shielding component 204, avoid overexposure, and thus avoid displaying a white image on the camera component. At the same time, the connection component 205 is made of metal material, which can be easily processed on its surface to improve the optical properties.

[0043] Optionally, the camera module 200 further includes a light-transmitting component 206, which is disposed between the camera component 202 and the hole. The light-transmitting component 206 may be made of quartz glass, which has good light transmittance and mechanical properties; at the same time, the light-transmitting component 206 can achieve gas sealing of the semiconductor cavity and achieve the negative pressure required for process treatment; the material of the light-transmitting component 206 includes but is not limited to the following. The light-transmitting component 206 is in close contact with the lower edge of the surrounding edges of the light-shielding component 204, thereby ensuring that there is no light leakage at the contact portion between the light-transmitting component 206 and the light-shielding component 204.

[0044] Optionally, the connection component 205 is arranged around the camera component 202 and can be made of aluminum or stainless steel. The outer surface of the connection component 205 is mirror-finished, and the inner surface of the connection component 205 is anodized. Among them, the mirror treatment increases the reflection of light, so that the light entering the semiconductor cavity is more dispersed, and it is not easy to have overexposed concentrated bright light, resulting in white light or gray in some areas when the image is acquired. At the same time, it can also increase the amount of light entering the semiconductor cavity to a certain extent. Anodizing can enhance the absorption of light reflected from the semiconductor cavity through the light-transmitting component 206 to the inner surface of the camera component and the connection component 205, thereby reducing the influence of stray light on the edge of the camera end of the camera component.

[0045] Optionally, a pad 2061 is provided on the light-transmitting component 206, and the pad 2061 is at least one of a square ring, a circular ring, or a polygonal ring, and its shape is adapted to the shape of the edge profile of the light-shielding component 204. The pad 2061 further ensures that light cannot leak from between the light-shielding component 204 and the light-transmitting component 206. Optionally, the pad 2061 is a rubber pad.

[0046] Figure 4 FIG. 2 shows an enlarged view of the shading assembly 204 and the connecting assembly 205 of the present invention. Figure 4As shown, the light shielding component 204 includes a light shielding portion 211 and a connecting portion 212. The bottom of the light shielding portion 211 extends radially outward and is configured to surround one end of the camera component 202 close to the semiconductor cavity. The connecting portion 212 is used to connect with the connecting component 205. One end of the connecting portion 212 is connected to the connecting component 205, and the other end is connected to the light shielding portion 211.

[0047] Optionally, the shading portion 211 is a contact portion 213 having a tilt toward the light-transmitting component, and the shading portion 211 is in the shape of a brim of a fisherman's hat; a lip portion 214 is provided at one end of the connecting portion 212, and the lip portion 214 is provided with a first threaded hole. Optionally, the connecting portion 212 is cylindrical, such as a cylinder, a square cylinder or a polygonal cylinder. Preferably, the connecting portion 212 is a cylinder, the lip portion 214 is a square ring, and there are four first threaded holes, which are respectively provided at the four corners of the square ring of the lip portion 214 for easy installation. Optionally, the contact portion 213 is designed to have a flange with a tilt angle toward the light-transmitting component 206, which can be in close contact with the light-transmitting component 206. Optionally, the material of the shading component 204 is aluminum or PTFE (polytetrafluoroethylene). Preferably, the material of the shading component 204 is PTFE. Since PTFE has a certain degree of deformation, the flange can be deformed after being subjected to pressure and be in close contact with the light-transmitting component 206. Such a design can conveniently reduce the problem of loose contact caused by processing errors, and the inclined contact portion 213 can make the shading portion 211 in close contact with the light-transmitting component 206 like a suction cup.

[0048] Optionally, the edge profile of the contact portion 213 of the shading portion 211 may be at least one of a circle, a square, or a polygon. The edge profile may be designed according to actual needs, including but not limited to the above. Figure 4 The circular contact portion 213 is only shown as an example. Since the rubber pad 2061 is adapted to the shape of the contact portion 213 of the shading component 204, the rubber pad 2061 can be at least one of a circular ring, a square ring or a polygonal ring.

[0049] Figure 5 2 shows a captured image without the connection component 205. In this solution, the light shielding component 204 is directly mounted on the camera end of the camera component. Figure 5 As can be seen in FIG. 2 , since there is no connection component 205, the surface of the camera component 202 cannot be processed, so that the light cannot be reflected by the side wall of the camera component, resulting in the light being unable to be dispersed, resulting in a gray ring 300 ( Figure 5The present invention provides a connection component 205, the metal material of the connection component 205 is easy to be surface treated, such as mirror treatment, which increases the range of light reflection and eliminates the gray ring band 300.

[0050] Optionally, the connecting component 205 is cylindrical and is disposed around the camera component 202. For example, the connecting component 205 is at least one of a circular cylinder, a square cylinder or a polygonal cylinder. Preferably, the connecting component 205 is a square cylinder.

[0051] Taking a square tube as an example, the connection assembly 205 includes a cylinder 215, one end of which is provided with a connection ear 216, and the number of the connection ears 216 is four, which are respectively arranged at the inner corners of the square tube, and the second threaded hole is provided on the connection ear 216; the other end of the connection assembly 205 is provided with a connection lip 217, and the connection lip 217 is a square ring, and the connection lip 217 is parallel to the extension direction of the lip 214, and the connection lip 217 is provided with a through hole, and the number of the through holes is four, and the through holes are arranged at the four corners of the square ring, corresponding to the position of the first threaded hole, that is, the through holes of the connection lip 217 are arranged one-to-one with the first threaded holes of the lip 214, and the number of the through holes and the first threaded holes is four, which are respectively located at the four corners of the connection lip 217 and the lip 214. The connection ear 216 is arranged on the inner side of one end of the cylinder 215, which saves space and is easy to install.

[0052] Optionally, the outer surface of the shading component 204 is mirror-finished to increase the reflection of light, so that the light entering the semiconductor cavity is more dispersed, and it is not easy to have overexposed concentrated light, resulting in some areas being white or gray when the image is acquired. At the same time, the amount of light entering the semiconductor cavity can be increased to a certain extent. The inner surface of the shading component 204 is anodized, and the anodization treatment can enhance the absorption of light reflected from the semiconductor cavity through the light-transmitting component 206 to the camera component and the shading component, thereby reducing the influence of stray light on the edge of the camera end of the camera component.

[0053] It should be noted that the PTFE shading component 204 has a relatively low hardness and can be in closer contact with the light-transmitting component 206 to reduce light leakage between the two. On the other hand, it can protect the light-transmitting component 206 from scratches. For the aluminum shading component 204, due to its high hardness, it is not easy to seal and scratches are easily generated on the light-transmitting component 206, so it can be used in conjunction with the rubber pad 2061. Whether it is PTEE or aluminum, the outer surface of the shading component 204 can be mirror-finished, and the inner surface can be anodized.

[0054] The light source assembly 203 provided by the present invention is mainly used to illuminate the interior of the semiconductor cavity. In order to prevent the incident light generated by the light source assembly 203 from being overexposed, the camera end of the camera assembly 202 is surrounded by the light shielding assembly 204 to shield part of the incident light, and the other parts of the camera assembly 202 are also surrounded by the connecting assembly 205. In addition, the rubber pad 2061 corresponds to the contact portion 213 of the light shielding portion 211, which can effectively prevent the light shielding assembly 204 from scratching or breaking the light-transmitting assembly 206, and can also play a sealing role, further preventing the unwanted light leakage from affecting the camera assembly 202, thereby causing the edge of the picture taken by the camera assembly 202 to be overexposed.

[0055] Optionally, the light source assembly 203 includes a light source 218 and a reflective plate 219, the light source 218 and the reflective plate 219 are connected, the light source 218 emits light in the opposite direction of the hole, and the reflective plate 219 reflects the light to the hole, forming part of the optical path S.

[0056] Optionally, the light source 218 is annular and is disposed around the camera assembly 202 to surround the camera assembly 202 ; the reflective plate 219 is dome-shaped, and the light source 218 is disposed on the dome-shaped edge of the reflective plate 219 .

[0057] Optionally, the reflective plate 219 is connected to the cover shell 201 .

[0058] See the attached Figure 2-3 ,like Figure 2-3 As shown, the light source 218 is connected to the reflective plate 219, and the light source 218 emits light in the opposite direction of the hole of the cavity wall 100, and the reflective plate 219 reflects the light to the optical path S formed by the hole; the light source can be annular and arranged around the camera assembly 202; the reflective plate 219 is in a dome shape, and the dome shape includes a first part and a second part connected, the first part and the second part are connected, the cross section of the first part is arc-shaped, and the cross section of the second part is horizontally arranged, the light source 218 is arranged at one end of the first part of the reflective plate 219 away from the second part, and is arranged toward the reflective surface of the reflective plate 219, and a first opening is arranged in the middle of the second part of the reflective plate 219, and the camera assembly 202 and the connecting assembly 205 pass through the first opening. Optionally, the light source 218 can be an LED lamp.

[0059] The complete optical path S includes a first path in which the light source 218 emits light in the opposite direction of the hole to the reflecting plate 219, a second path in which the light is reflected by the reflecting plate 219 and irradiated into the semiconductor cavity, and a third path in which the light is reflected by the semiconductor cavity and irradiated into the camera assembly.

[0060] The camera module 200 further includes a light-transmitting component fixing portion 207, through which the light-transmitting component 206 is connected to the cavity wall 100. The light-transmitting component fixing portion 207 includes a first fixing portion 221 and a second fixing portion 222, the first fixing portion 221 and the second fixing portion 222 are connected, and the light-transmitting component 206 is connected to the first fixing portion 221. The first fixing portion 221 and the second fixing portion 222 may both be annular, the first fixing portion 221 is formed as an upper ring, the second fixing portion 222 is formed as a lower ring, the light-transmitting component fixing portion 207 is formed as a ring including the upper ring and the lower ring, and the cross-sections of the upper ring and the lower ring are formed in a "Z" shape as a whole, specifically, the inner side of the lower surface and the outer side of the upper surface of the ring are both formed in an "L" shape. The upper surface of the light-transmitting component 206 is connected to the lower surface of the first fixing part 221, and a gap is formed between the outer edge of the light-transmitting component 206 and the second fixing part 222 on the side facing the second fixing part 222, and the gap cooperates with the hole; optionally, the lower surface of the light-transmitting component 206 away from the camera assembly is arranged flush with the lower surface of the second fixing part 222, the light-transmitting component 206 is circular, and a sealing ring (O-ring) is arranged between the light-transmitting component 206 and the first fixing part 221 to achieve gas sealing.

[0061] The housing 201 includes a housing 223 and a fixing member 224 . The camera assembly 202 , the light source assembly 203 , the light shielding assembly 204 and the connecting assembly 205 are all disposed in the housing 201 . The cover body 223 may be barrel-shaped, such as a round barrel, a square barrel or a polygonal barrel, including but not limited to these; the cover body 223 may include a first connection part, a second connection part and a third connection part, the first connection part is arranged on the annular lug of the barrel edge of the barrel of the cover body 223, the second connection part is arranged between the first connection part and the third connection part, the second connection part is a barrel wall, and the third connection part is a barrel top; the first connection part is connected to the upper surface of the second fixing part 222 of the light-transmitting component fixing part 207, specifically, it can be connected to the "L" shape outside the upper surface of the light-transmitting component fixing part 207, the second connection part is connected to the first connection part in an "L" shape, and the third connection part is connected to the second connection part and forms the top of the cover body 223, the third connection part of the cover body 223 is provided with a second opening, and the second opening is arranged corresponding to the first opening, and the camera assembly 202 and the connection assembly 205 are both connected to the cover shell 201 through the second opening. The second part of the reflective plate 219 is fixed to the inner surface of the edge of the second opening of the third connecting part of the cover body 223. The camera component 202 and the connecting component 205 are respectively connected to the fixing member 224 through the first opening and the second opening. The fixing member 224 is arranged on the outer surface of the cover body 223 corresponding to the second opening, and the fixing member 224 is connected to the cover body 223.

[0062] The light-transmitting component fixing portion 207 detachably connects the light-transmitting component 206 to the semiconductor cavity by means of, for example, screws; at the same time, the cover shell 201 detachably fixes the camera component 202, the light source component 203, the shading component 204 and the connecting component 205 to the upper surface of the second fixing portion 222 of the light-transmitting component fixing portion 207, so as to facilitate inspection and maintenance.

[0063] Optionally, the second portion of the reflector 219 and the third connection portion of the cover 223 can be detachably connected by bolts. The fixing member 224 and the cover 223 are connected by bolts. The camera assembly 202, the connection assembly 205 and the fixing member 224 are connected by bolts.

[0064] Specifically, the connecting assembly 205 is connected to the fixing member 224 through the second threaded hole on the connecting ear 216, and the camera assembly 202 is connected to the fixing member 224 through a bolt. With such a design, when any one of the camera assembly 202, the connecting assembly 205, and the light shielding assembly 204 needs to be replaced, the fixing member 224 can be separated from the cover body 223 first, and then the fixing member 224 can be pulled up, and the camera assembly 202, the connecting assembly 205, and the light shielding assembly 204 can be taken out from the second outlet of the cover body 223, so that the camera assembly 202, the connecting assembly 205, and the light shielding assembly 204 can be quickly replaced.

[0065] In summary, the present invention can reduce the light flux emitted from the light source component in the optical path to the semiconductor cavity by setting the shading portion, thereby ensuring that the shooting component takes clear pictures. At the same time, since the shading portion is set, the camera component and the light source component are separated, and the airtight contact between the shading portion and the light-transmitting component is ensured, thereby ensuring that light cannot leak out from between the shading component and the light-transmitting component. The outer surface of the metal connecting component can be surface treated, and the inner surface can be anodized. On the one hand, it is convenient to install the shielding component, and on the other hand, it allows light to enter the semiconductor cavity at multiple angles, thereby increasing the irradiation range and reducing the overexposure of the image caused by light concentration.

[0066] The shading component is made of PTFE material, which has a certain flexibility and is combined with a pad to make it easier to seal and protect the light-transmitting component.

[0067] Although the content of the present invention has been described in detail through the above content, it should be recognized that the above description should not be considered as a limitation of the present invention. After reading the above content, various modifications and substitutions of the present invention will be obvious to those skilled in the art. Therefore, the protection scope of the present invention should be limited by the attached patent application scope. The above is only an example of a preferred embodiment of the present invention, and is not intended to limit the scope of implementation. All simple replacements and equivalent changes made according to the patent application scope of this creation and the content of the patent specification belong to the scope of the patent application of this creation.

Claims

1. A camera module for a semiconductor cavity, wherein the semiconductor cavity comprises a hole, and the camera module is arranged in the hole, wherein: include: A camera assembly, used to acquire an image inside the semiconductor cavity; a light source assembly, forming an optical path between the light source assembly and the camera assembly, and used for providing illumination into the semiconductor cavity through the optical path; A shading component, located at the imaging end of the camera component, and used to reduce the light flux emitted from the light source component in the optical path to the semiconductor cavity; A housing, wherein the camera assembly, the light source assembly and the light shielding assembly are all arranged in the housing; A connecting component, one end of which is connected to the housing, and the other end of which is connected to the shading component; Wherein, the connecting component comprises metal material.

2. A camera module as claimed in claim 1, characterized in that: The outer surface of the connection component is mirror-finished, and the inner surface of the connection component is anodized.

3. A camera module as claimed in claim 2, characterized in that: The shading component includes PTFE material or metal material.

4. A camera module as claimed in claim 1 or 3, characterized in that: The metal material includes aluminum or stainless steel.

5. A camera module as claimed in claim 1, characterized in that: Also includes: A light-transmitting component is disposed between the camera component and the hole.

6. A camera module as claimed in claim 1, characterized in that: The shading component includes a connecting portion and a shading portion, wherein the shading portion is configured to surround one end of the camera component close to the semiconductor cavity; the connecting portion is used to be connected to the connecting component, one end of the connecting portion is connected to the connecting component, and the other end is connected to the shading portion.

7. A camera module as claimed in claim 6, characterized in that: A pad is arranged on the light-transmitting component, and the pad is in contact with the edges around the light-shielding portion.

8. A camera module as claimed in claim 1, characterized in that: The light source assembly includes a light source and a reflective plate, wherein the light source and the reflective plate are connected, the light source emits light in the opposite direction of the hole, and the reflective plate reflects the light to the hole to form part of the optical path.

9. A camera module as claimed in claim 8, characterized in that: The light source is annular and is arranged around the camera assembly; the reflector is dome-shaped, and the light source is arranged on the dome-shaped edge of the reflector.

10. A camera module as claimed in claim 9, characterized in that: The reflective plate is connected to the cover shell.

11. A camera module as claimed in claim 10, characterized in that: The cover shell comprises a cover body and a fixing portion, and the camera assembly and the connecting assembly are both connected to the cover body via the fixing portion.

12. A camera module as claimed in claim 11, characterized in that: The camera module also includes a light-transmitting component fixing portion, and the light-transmitting component is connected to the semiconductor cavity through the light-transmitting component fixing portion; the cover shell is fixed on the light-transmitting component fixing portion.

13. A semiconductor cavity, characterized in that: include: a cavity wall, the cavity wall comprising an aperture; The camera module as described in any one of claims 1-12, wherein the camera module is arranged in the hole to obtain the state inside the semiconductor cavity.

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