Image acquisition module and semiconductor cavity

Abstract

The utility model provides an image acquisition device and a semiconductor cavity. The image acquisition module is arranged on the semiconductor cavity; the image acquisition device comprises a camera shooting assembly which is used for acquiring an image in the semiconductor cavity; an optical path is formed between the light source assembly and the camera shooting assembly, and the light source assembly is used for providing illumination for the interior of the semiconductor cavity through the optical path; the shading part is arranged on the camera shooting assembly and is used for reducing the luminous flux emitted into the semiconductor cavity by the light source assembly in the optical path; the light transmitting assembly is arranged between the camera shooting assembly and the hole; at least part of the portion, facing the light-transmitting assembly, of the tail end, away from the camera assembly, of the shading part is a plane, and at least part of the plane is attached to the light-transmitting assembly. Through the image acquisition device, the image in the cavity can be effectively acquired, and the problem that the operation condition in the cavity cannot be observed or cannot be clearly observed at present is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor cavities of semiconductor equipment, and in particular to an image acquisition module of a semiconductor cavity and a semiconductor cavity having the image acquisition module. Background Art

[0002] In the prior art, semiconductor cavities are usually provided with multiple observation windows for observing the internal conditions of the cavity. Through the observation windows, process personnel can observe the internal conditions of the cavity with naked eyes. However, by observing the internal conditions through the observation windows, process personnel cannot observe all the time, and there may be a problem that abnormalities in the cavity cannot be known in time. In addition, although some prior art technologies use camera technology to obtain the conditions in the cavity, there is also the problem that the internal image cannot be clearly obtained, and the installation and maintenance are troublesome. Utility Model Content

[0003] The purpose of the utility model is to provide an image acquisition module and a semiconductor cavity having the image acquisition module, which can solve the problem of timely and clearly acquiring the status inside the cavity.

[0004] In order to achieve the above objectives, the utility model is implemented through the following technical solutions:

[0005] An image acquisition module is provided for a semiconductor cavity, wherein the semiconductor cavity comprises a hole, and the image acquisition module is arranged in the hole; the image acquisition module comprises:

[0006] A camera assembly, used for acquiring images inside the semiconductor cavity;

[0007] A light source assembly, forming an optical path between the light source assembly and the camera assembly, and used for providing light into the semiconductor cavity through the optical path;

[0008] A light-transmitting component, the light-transmitting component is arranged between the camera component and the hole;

[0009] A light shielding portion, disposed on the camera assembly, for reducing the light flux emitted from the light source assembly in the optical path to the semiconductor cavity;

[0010] The light-shielding portion includes a connecting portion and an end portion, the connecting portion is connected to the end portion, wherein the connecting portion is configured to be connected to the end of the camera assembly; and a portion of the end portion facing the light-transmitting assembly is at least partially flat, and at least partially the flat surface is in contact with the light-transmitting assembly.

[0011] Optionally, the shading portion is plate-shaped and configured to surround the end of the camera assembly.

[0012] Optionally, the distance between the light-shielding portion and the light-transmitting component decreases from the connecting portion to the end portion.

[0013] Optionally, it is characterized in that the thickness of the shading portion decreases from the connecting portion to the terminal portion.

[0014] Optionally, the connecting portion of the shading portion has the same thickness as the terminal portion.

[0015] Optionally, the cross-section of the shading portion is any one of L-shape, Z-shape, and arc-shape.

[0016] Optionally, the connecting portion and the end of the camera assembly are interference fit.

[0017] Optionally, the shading portion is made of PTFE.

[0018] Optionally, the shading portion has a black appearance.

[0019] Optionally, the light source assembly includes a light source and a reflective plate, the light source and the reflective plate are connected, the light source emits light in the opposite direction of the hole, and the reflective plate reflects the light to the hole to form part of the optical path.

[0020] Optionally, the light source is annular and is arranged around the camera assembly; the reflector is dome-shaped, and the light source is arranged on the dome-shaped edge of the reflector.

[0021] Optionally, the image acquisition module further includes a cover body, and the light source assembly, the camera assembly and the shading portion are all arranged in the cover body.

[0022] Optionally, the image acquisition module further includes a camera component fixing portion, and the camera component is connected to the cover body via the camera component fixing portion.

[0023] Optionally, the image acquisition module further includes a light-transmitting component fixing portion, and the light-transmitting component is connected to the semiconductor cavity via the light-transmitting component fixing portion.

[0024] Optionally, the light-transmitting component fixing portion includes a first fixing portion and a second fixing portion, the first fixing portion is connected to the second fixing portion, the light-transmitting component is connected to the second fixing portion; and the cover body is connected to the first fixing portion.

[0025] The utility model also provides a semiconductor cavity, comprising:

[0026] a cavity wall, the cavity wall comprising an aperture;

[0027] An image acquisition module is disposed in the hole and is used to acquire the state inside the semiconductor cavity.

[0028] Compared with the prior art, the utility model has the following advantages:

[0029] (1) By providing the shading portion, the light flux emitted from the light source component in the optical path to the semiconductor cavity is reduced, thereby ensuring that the image captured by the shooting component is clear.

[0030] (2) The end portion of the light shielding portion facing the light-transmitting component is designed to be at least partially flat, and at least part of the flat surface is in contact with the light-transmitting component, thereby preventing light leakage and increasing the light flux entering the camera component. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solution of the utility model, the following is a brief introduction to the drawings required for the description. Obviously, the drawings described below are an embodiment of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work:

[0032] Figure 1 is a cross-sectional view of the image acquisition module 200 of the present invention;

[0033] Figure 2 It is an exploded view of the image capturing module 200 of the present invention.

[0034] Figure 3 (a)-3(e) are enlarged views of multiple embodiments of the light shielding portion 208 of the present invention. DETAILED DESCRIPTION

[0035] The scheme proposed by the utility model is further described in detail below in combination with the accompanying drawings and specific implementation methods. According to the following description, the advantages and features of the utility model will be clearer. It should be noted that the accompanying drawings adopt a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the implementation method of the utility model. In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, please refer to the accompanying drawings. It should be noted that the structure, proportion, size, etc. illustrated by the accompanying drawings of this specification are only used to match the content disclosed in the specification, so that people familiar with this technology can understand and read, and are not used to limit the limiting conditions for the implementation of the utility model, so it has no technical substantive significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effect that the utility model can produce and the purpose that can be achieved, should still fall within the scope of the technical content disclosed by the utility model.

[0036] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of more restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the process, method, article or device including the elements. In addition, the term "connection" herein means that A and B are directly connected, or that A and B are indirectly connected, such as A and B are connected through C, or even through more components such as C and D, and A and B can be connected in one piece, or in separate pieces, or removable, or fixed. The term "optional" herein means that the technical feature can be combined or not combined with any feature in the text.

[0037] The semiconductor chamber includes an image acquisition module 200, a chamber wall and a substrate base, wherein the substrate base is arranged in the chamber wall, and the upper surface of the substrate base is used to place a substrate, and the semiconductor chamber can be used to process one or more substrates. The chamber wall includes an upper chamber wall located at the top, a side chamber wall located at the side, and a lower chamber wall located at the bottom, and a hole is arranged on the chamber wall, and the image acquisition module is arranged in the hole of the chamber wall, and the image acquisition module 200 can be arranged on at least one of the upper chamber wall, the side chamber wall and / or the lower chamber wall, so as to be able to obtain the state inside the chamber from a required perspective. Optionally, the semiconductor chamber is a chamber that is airtight with the outside, for example, at least one of a vacuum load chamber (Load Lock), a wafer transfer chamber (TM), and a process chamber (PM), wherein the process chamber (PM) can be at least one of CVD, PVD, RTP, epitaxy (Epi) or etching (Etch).

[0038] Figure 1 The cross-sectional view of the image acquisition module 200 of the present invention is shown. Figure 2 FIG. 2 shows an exploded view of the image acquisition module 200 of the present invention. Figure 1-2As shown, the image capture module 200 includes a camera component 206, a light source component, a shading portion 208 and a light-transmitting component 214, wherein the camera component 206 is used to obtain an image in the semiconductor cavity 100; an optical path S is formed between the light source component and the camera component 206, and the light source component is used to provide illumination to the semiconductor cavity 100 through a portion of the optical path S; the light-transmitting component 214 is disposed between the camera component 206 and the hole 202; the shading portion 208 is disposed in the camera component 206, and is used to reduce the light flux emitted from the light source component in the optical path S to the semiconductor cavity 100.

[0039] The image captured by the camera component 206 may be in the form of a picture or a video, including but not limited to these.

[0040] Optionally, the light-transmitting component 214 may be quartz glass, which has excellent light transmittance and mechanical properties, which can further improve the clarity of the captured image on the one hand, and improve durability on the other hand; at the same time, the light-transmitting component 214 can achieve gas sealing of the semiconductor cavity and realize the negative pressure required for process treatment; the material of the light-transmitting component 214 includes but is not limited to this.

[0041] Optionally, the light-shielding portion 208 is away from one end of the camera component 206, and the portion facing the light-transmitting component 214 is at least partially flat, and at least a portion of the plane is in contact with the light-transmitting component 214; the light-shielding portion 208 includes a connecting portion 220 and an end portion 222, and the connecting portion 220 and the end portion 222 are connected, wherein the connecting portion 220 is configured to be connected to the end of the camera component 206; and the portion of the end portion facing the light-transmitting component 214 is at least partially flat, and at least a portion of the plane is in contact with the light-transmitting component 214, and the plane may be a lower surface arranged around the edge of the end portion 222 of the light-shielding portion 208 to prevent light leakage and avoid increasing the light flux entering the camera component 206. Optionally, the surface of the shading portion 208 facing the light-transmitting component 214 is an uneven surface, and the uneven surface is the lower surface of all the shading portions 208 except the above-mentioned plane, so as to increase the diffuse reflection of light and prevent light from affecting the image acquisition of the camera component 206.

[0042] Optionally, the shading portion 208 is in a plate shape and is configured to surround the end of the camera assembly 206 .

[0043] Optionally, the distance between the light shielding portion 208 and the light-transmitting component 214 decreases from the connecting portion 220 to the terminal portion 222 .

[0044] Optionally, the thickness of the light shielding portion 208 decreases from the connecting portion 220 to the terminal portion 222 .

[0045] Optionally, the connecting portion 220 and the terminal portion 222 of the light shielding portion 208 have the same thickness.

[0046] Optionally, the cross section of the shading portion 208 is any one of L-shaped, Z-shaped, and arc-shaped. Figure 3 (a)- Figure 3 (e) shows an enlarged view of multiple embodiments of the light shielding portion of the present invention.

[0047] like Figure 3 As shown in (a), the thickness of the shading portion 208 decreases from the connecting portion 220 to the terminal portion 222, which can not only improve the firmness of the connection between the shading portion 208 and the camera component 206, but also improve the fitting effect between the terminal portion 222 and the light-transmitting component 214, thereby further preventing light leakage.

[0048] like Figure 3 As shown in (b), the cross-section of the shading portion 308 is in a "Z" shape, including a connecting portion 320 and an end portion 322, wherein the connecting portion 320 is connected to the end portion 322, and the thickness of the contact portion between the end portion 322 and the light-transmitting component 214 is smaller than the thickness of the contact portion between the connecting portion 320 and the camera component 206.

[0049] like Figure 3 As shown in (c), the cross-section of the shading portion 408 is "L"-shaped, including a connecting portion 420 and a terminal portion 422, wherein the connecting portion 420 is connected to the terminal portion 422, and the thickness of the contact portion between the connecting portion 420 and the camera component 206 is the same as the thickness of the contact portion between the terminal portion and the light-transmitting component 214, thereby improving processing convenience and reducing processing costs.

[0050] like Figure 3 As shown in (d), the cross-section of the shading portion 508 is arc-shaped, including a connecting portion 520 and a terminal portion 522, the connecting portion 520 is connected to the terminal portion 522, the thickness of the contact portion between the connecting portion 520 and the camera component 206 is the same as the thickness of the contact portion between the terminal portion and the light-transmitting component 214, and the arc-shaped design can reduce stress concentration and better prevent deformation of parts.

[0051] like Figure 3As shown in (e), the cross-section of the shading portion 608 is arc-shaped, including a connecting portion 620 and a terminal portion 622, wherein the connecting portion 620 is connected to the terminal portion 622, and the thickness of the contact portion between the terminal portion 622 and the light-transmitting component 214 is smaller than the thickness of the contact portion between the connecting portion 620 and the camera component 206.

[0052] Optionally, the portion where the connecting portion 220 is connected to the end of the camera assembly 206 may be a mounting hole, and the mounting hole is adapted to the shape of the end of the camera assembly 206. The connecting portion 220 and the end of the camera assembly 206 are interference fit. The interference fit can prevent the light emitted by the light source from leaking from the connection between the connecting portion 220 and the camera assembly 206, and can also meet the requirements of the shading portion 208 being detachable and replaceable. When the shading portion 208 is aged, it can be replaced in a timely and convenient manner.

[0053] Optionally, the edge profile of the shading portion 208 may be at least one of a circle, a square, or a polygon. The edge profile may be designed according to actual needs, including but not limited to the above.

[0054] Optionally, the material of the shading portion 208 is PTFE, which has self-lubricating effect and soft hardness, and it is easy to achieve a close fit between the shading portion 208 and the light-transmitting component 214; the color of the shading portion 208 can be black, which can further improve the shooting effect and reduce the reflection of light.

[0055] Optionally, the light source assembly includes a light source 210 and a reflective plate 212. The light source 210 is connected to the reflective plate 212, and the light source 210 emits light in the opposite direction of the hole in the cavity wall, and the reflective plate 212 reflects the light to the optical path S formed by the hole; the light source 210 may be annular and arranged around the camera assembly 206; the reflective plate 212 is in a dome shape, and the dome shape includes a first part and a second part, the first part and the second part are connected, the cross section of the first part is arc-shaped, and the cross section of the second part is horizontally arranged, the light source 210 is arranged at one end of the first part of the reflective plate 212 away from the second part, and is arranged toward the reflective surface of the reflective plate 212, and a first opening is arranged in the middle of the second part of the reflective plate 212, and the camera assembly 206 passes through the first opening.

[0056] The complete optical path S includes a first path in which the light source 210 emits light in the opposite direction of the hole 202 to the reflective plate 212, a second path in which the light is reflected by the reflective plate 212 and irradiated into the semiconductor cavity, and a third path in which the light is reflected by the semiconductor cavity and irradiated into the camera component 206.

[0057] The image acquisition module 200 further includes a light-transmitting component fixing portion 216, and the light-transmitting component 214 is connected to the cavity wall through the light-transmitting component fixing portion 216. The light-transmitting component fixing portion 216 includes a first fixing portion 224 and a second fixing portion 226, and the first fixing portion 224 and the second fixing portion 226 are connected, and the light-transmitting component 214 is connected to the second fixing portion 226. The first fixing portion 224 and the second fixing portion 226 may both be annular, the first fixing portion 224 is formed as an outer ring, the second fixing portion 226 is formed as an inner ring, and the light-transmitting component fixing portion 216 is formed as a ring including the inner ring and the outer ring, and the inner ring and the outer ring are connected to form a "Z" shape as a whole. Specifically, the inner side of the lower surface and the outer side of the upper surface of the ring are both formed into an "L" shape. The upper surface of the light-transmitting component 214 is connected to the lower surface of the second fixing part 226, and a gap 228 is formed between the outer edge of the light-transmitting component 214 and the first fixing part 224 on the side facing the first fixing part 224. The gap 228 cooperates with the hole 202 to achieve a better installation effect. Optionally, the lower surface of the light-transmitting component 214 away from the camera component 206 is flush with the lower surface of the first fixing part 224, and the light-transmitting component 214 is circular. A sealing ring (O-ring) is arranged between the light-transmitting component 214 and the second fixing part 226 to achieve gas sealing.

[0058] The image acquisition module 200 also includes a cover 204, and the light source assembly, the camera assembly 206 and the light shielding portion 208 are all arranged in the cover 204. The cover 204 can be a cylinder, a square cylinder, including but not limited to these; the cover 204 can include a first connecting portion, a second connecting portion and a third connecting portion, the first connecting portion is connected to the upper surface of the first fixing portion 224 of the light-transmitting assembly fixing portion 216, and specifically, can be connected to the "L" shape outside the upper surface of the light-transmitting assembly fixing portion 216, the second connecting portion extends in the vertical direction, and is connected to the first connecting portion in an "L" shape, the third connecting portion is connected to the second connecting portion, and forms the top of the cover 204, the top of the cover 204 is provided with a second opening, and the second opening is arranged corresponding to the first opening, and the camera assembly 206 is connected to the top of the cover 204 through the second opening.

[0059] Optionally, the first connecting portion of the cover body 204, the first fixing portion 224 of the light-transmitting component fixing portion 216 and the semiconductor cavity are detachably connected by screws or the like, so as to realize quick disassembly and assembly of the image acquisition module 200 and the semiconductor cavity.

[0060] The second portion of the reflective plate 212 is detachably connected to the third connecting portion of the cover body 204 , and optionally, the connection method may be screw connection.

[0061] Optionally, the image acquisition module 200 further includes a camera component fixing portion, and the camera component 206 is connected to the cover body 204 via the camera component fixing portion. Optionally, the camera assembly fixing part includes a first fixing plate (not shown in the figure) and a second fixing plate 218, the camera assembly 206 is connected to the first fixing plate, the first fixing plate is connected to the second fixing plate 218, the lower surface of the second fixing plate 218 is fixedly connected to the upper surface of the third connecting part of the cover body 204 by screws or the like. With such a design, when it is necessary to replace the camera assembly 206 and / or the shading part 208, the screws can be unscrewed by a tool such as a screwdriver to separate the second fixing plate 218 from the cover body 20, and then the second fixing plate 218 can be pulled upwards to remove the camera assembly 206 and / or the shading part 208 from the cover body 204, and the camera assembly 206 and / or the shading part 208 connected to the second fixing plate 218 can be replaced.

[0062] In summary, the utility model can reduce the light flux emitted from the light source component in the optical path to the semiconductor cavity by setting the light shielding part, thereby ensuring that the image captured by the camera component is clear. The part of the end of the light shielding part facing the light-transmitting component is designed to be at least partially flat, and at least part of the flat surface is attached to the light-transmitting component, which can prevent light leakage and avoid increasing the light flux entering the camera component.

[0063] Although the content of the utility model has been described in detail through the above content, it should be recognized that the above description should not be considered as a limitation of the utility model. After reading the above content, various modifications and substitutions of the utility model will be obvious to those skilled in the art. Therefore, the protection scope of the utility model should be limited by the attached patent application scope. The above is only an example of a preferred implementation method of this creation, and it is not intended to limit the scope of implementation. All simple replacements and equivalent changes made according to the patent application scope of this creation and the content of the patent specification are within the scope of the patent application of this creation.

Claims

1. An image acquisition module, used in a semiconductor cavity, wherein the semiconductor cavity comprises a hole, and the image acquisition module is arranged in the hole; characterized in that: include: A camera assembly, used for acquiring images inside the semiconductor cavity; A light source assembly, forming an optical path between the light source assembly and the camera assembly, and used for providing light into the semiconductor cavity through the optical path; A light-transmitting component, the light-transmitting component is arranged between the camera component and the hole; A light shielding portion, disposed on the camera assembly, for reducing the light flux emitted from the light source assembly in the optical path to the semiconductor cavity; The light-shielding portion includes a connecting portion and an end portion, the connecting portion is connected to the end portion, wherein the connecting portion is configured to be connected to the end of the camera assembly; and a portion of the end portion facing the light-transmitting assembly is at least partially flat, and at least partially the flat surface is in contact with the light-transmitting assembly.

2. The image acquisition module according to claim 1, characterized in that: The light shielding portion is in a plate shape and is configured to surround the end of the camera assembly.

3. The image acquisition module according to claim 2, characterized in that: The distance between the light shielding portion and the light transmitting component decreases from the connecting portion to the terminal portion.

4. The image acquisition module according to claim 3, characterized in that: The light shielding portion has a thickness that decreases from the connecting portion toward the terminal portion.

5. The image acquisition module according to claim 3, characterized in that: The connecting portion and the terminal portion of the light shielding portion have the same thickness.

6. The image acquisition module according to claim 3, characterized in that: The cross section of the shading portion is in any one of an L-shape, a Z-shape, and an arc shape.

7. The image acquisition module according to any one of claims 4 to 6, characterized in that: The connecting portion and the end of the camera assembly are in interference fit.

8. The image acquisition module according to any one of claims 1 to 6, characterized in that: The material of the light shielding part is PTFE.

9. The image acquisition module according to any one of claims 1 to 6, characterized in that: The appearance of the light shielding portion is black.

10. The image acquisition module according to claim 1, characterized in that: The light source assembly includes a light source and a reflective plate, wherein the light source and the reflective plate are connected, the light source emits light in the opposite direction of the hole, and the reflective plate reflects the light to the hole to form part of the optical path.

11. The image acquisition module according to claim 10, characterized in that: The light source is annular and arranged around the camera assembly; the reflector is dome-shaped, and the light source is arranged on the dome-shaped edge of the reflector.

12. The image acquisition module according to claim 11, characterized in that: The image acquisition module also includes a cover body, and the light source assembly, the camera assembly and the light shielding portion are all arranged in the cover body.

13. The image acquisition module according to claim 12, wherein: The image acquisition module also includes a camera component fixing portion, and the camera component is connected to the cover body through the camera component fixing portion.

14. The image acquisition module according to claim 13, characterized in that: The image acquisition module further includes a light-transmitting component fixing portion, and the light-transmitting component is connected to the semiconductor cavity via the light-transmitting component fixing portion.

15. The image acquisition module according to claim 14, characterized in that: The light-transmitting component fixing part includes a first fixing part and a second fixing part, the first fixing part is connected to the second fixing part, the light-transmitting component is connected to the second fixing part; the cover body is connected to the first fixing part.

16. A semiconductor cavity, characterized in that: include: a cavity wall, the cavity wall comprising an aperture; The image acquisition module as described in any one of claims 1 to 15, wherein the image acquisition module is arranged in the hole to acquire the state inside the semiconductor cavity.

Images