Substrate processing system

Abstract

This substrate processing system is provided with a batch processing device, a single-chip processing device, and an interface device that connects the batch processing device and the single-chip processing device. The batch processing device extends rearward. The single-sheet processing devices are arranged so as to face the batch processing device so as to be aligned in the width direction orthogonal to the rear. The interface device is adjacent to one end side of each of the batch processing device and the monolithic processing device, and is disposed so as to extend in the width direction. The batch substrate transfer region of the batch processing apparatus is disposed adjacent to the transfer block and the processing block on the side where the single-sheet processing apparatus is disposed. The interface device includes a posture conversion region and a relay region. The gesture conversion region is disposed on the opposite side of the processing block with the transfer block interposed therebetween.

Description

Technical Field

[0001] The present invention relates to a substrate processing system for processing a substrate. Examples of the substrate include semiconductor substrates, FPD (Flat Panel Display) substrates, photomask glass substrates, optical disk substrates, magnetic disk substrates, ceramic substrates, solar cell substrates, etc. Examples of FPD include liquid crystal display devices, organic EL (electroluminescence) display devices, etc. Background Art

[0002] In a conventional substrate processing system, a loading device, a second interface device, a batch processing device, a first interface device, a single-wafer processing device, and a loading device are arranged in sequence in a U shape (for example, refer to Japanese Patent Laid-Open No. 2021-064652).

[0003] Here, the direction in which the loading device, the second interface device, and the batch processing device are arranged is referred to as the front-to-back direction. In addition, the horizontal direction orthogonal to the front-to-back direction is referred to as the width direction. At this time, in the substrate processing system, the loading device, the second interface device, and the batch processing device are arranged in a row in sequence toward the rear. The unloading device and the single-wafer processing device are arranged in a row in sequence toward the rear. Moreover, the first interface device extends from the batch processing device to the right to the single-wafer processing device. That is, the single-wafer processing device is arranged to the right of the batch processing device. Summary of the invention

[0004] [Problems to be solved by the invention]

[0005] Conventional substrate processing systems have the following problems. For example, in the substrate processing system, a first interface device (interface device) is set behind a batch processing device and behind a single-wafer processing device. In this case, if the batch processing device is lengthened in the front-to-back direction according to the user's wishes, it is necessary to change the transport path of the first interface device or the single-wafer processing device, for example. Such a change may be cumbersome, and thus, the change of the configuration of the batch processing device and the single-wafer processing device may be restricted.

[0006] The present invention has been made in view of such circumstances, and an object of the present invention is to provide a substrate processing system capable of freely changing the configuration of a batch processing apparatus and a single-wafer processing apparatus.

[0007] [Technical means to solve the problem]

[0008] In order to achieve this object, the present invention adopts the following structure. That is, the substrate processing system of the present invention is characterized in that it comprises: a batch processing device for processing a plurality of substrates together, a single-wafer processing device for processing the plurality of substrates one by one, and an interface device for connecting the batch processing device with the single-wafer processing device, and the batch processing device extends along a first horizontal direction, the single-wafer processing device is arranged opposite to the batch processing device in a manner of being arranged in a second horizontal direction orthogonal to the first horizontal direction, the interface device is adjacent to one end side of each of the batch processing device and the single-wafer processing device, and is arranged in a manner of extending along the second horizontal direction, and the batch processing device comprises: a first carrier loading rack for loading carriers, the A carrier is used to store the multiple substrates in a horizontal posture at specified intervals; a transfer block is adjacent to the first carrier mounting rack; a batch processing block is adjacent to the transfer block and extends along the first horizontal direction; and a batch substrate transfer area is arranged adjacent to the transfer block and the batch processing block on the side where the single-wafer processing device is arranged, and one end side extends to the interface device, and the other end side extends along the first horizontal direction; the transfer block has a substrate operating mechanism and a first posture conversion mechanism, the substrate operating mechanism takes out the multiple substrates in a horizontal posture from the carrier mounted on the first carrier mounting rack, and the first posture conversion mechanism has: a first posture conversion mechanism The first posture conversion unit converts the plurality of substrates received from the substrate operation mechanism from a horizontal posture to a vertical posture; and a vertical holding unit holds the plurality of substrates converted to a vertical posture by the first posture conversion unit; the batch processing block comprises a plurality of batch processing tanks, the plurality of batch processing tanks are arranged side by side in the first horizontal direction, and each of the batch processing tanks stores a processing liquid for immersing the plurality of substrates, the batch substrate transfer area comprises a first batch transfer mechanism, the first batch transfer mechanism transfers the plurality of substrates in a vertical posture between the plurality of batch processing tanks, the vertical holding unit and the interface device, the interface device comprises a posture conversion area and a relay area, the posture conversion area The relay area is arranged on the opposite side of the batch processing block across the transfer block, the relay area is adjacent to the posture conversion area and extends along the second horizontal direction, the posture conversion area has a second posture conversion mechanism, the second posture conversion mechanism converts the plurality of substrates processed by the batch processing device from a vertical posture to a horizontal posture, the relay area has a relay substrate conveying mechanism, the relay substrate conveying mechanism conveys the plurality of substrates converted into a horizontal posture by the second posture conversion mechanism to the single-wafer processing device, the single-wafer processing device has: a second carrier mounting rack for mounting the carrier; and a single-wafer processing block adjacent to the second carrier mounting rack;The single-wafer processing block comprises: a plurality of single-wafer processing chambers for performing designated processing on the plurality of substrates processed by the batch processing device one by one; and a horizontal substrate transfer robot for receiving the substrate transferred by the relay substrate transfer mechanism and transferring the received substrate to one of the plurality of single-wafer processing chambers; the horizontal substrate transfer robot stores the substrate processed in one of the plurality of single-wafer processing chambers into the carrier mounted on the second carrier mounting rack. ;

[0009] According to the substrate processing system of the present invention, the posture conversion area of ​​the interface device is arranged on the opposite side of the processing block having the batch processing tanks, with the transfer block of the batch processing device being separated. For example, it is assumed that the length of the batch processing device may change in the first horizontal direction in which the batch processing device extends due to the increase or decrease in the number of batch processing tanks of the batch processing device. Even in this case, at least there is no need to change the configuration of the transfer block of the batch processing device and the interface device. Therefore, the configuration of the batch processing device and the single-wafer processing device can be freely changed.

[0010] In addition, since the posture conversion area is arranged on the opposite side of the processing block through the transfer block, it is possible to avoid the relay area of ​​the interface device and the batch substrate transfer area from intersecting when viewed from above. Therefore, it is possible to prevent the structure from becoming complicated. In addition, the single-wafer processing device is arranged on the opposite side of the transfer block through the batch substrate transfer area. Therefore, it is possible to suppress the size of the side of the transfer block that is blocked by the interface device when viewed from above. In addition, it is possible to ensure a large maintenance area on the side opposite to the batch substrate transfer area through the batch processing tank.

[0011] In addition, in the substrate processing system, the second posture conversion mechanism preferably comprises: a second posture conversion unit, which converts the multiple substrates from a vertical posture to a horizontal posture; and a spare tank, which is arranged between the transfer block and the second posture conversion unit, and stores an immersion liquid for immersing the multiple substrates in a vertical posture.

[0012] The posture conversion mechanism can standby the plurality of substrates while immersing the plurality of substrates in the vertical posture into the immersion liquid stored in the standby tank.

[0013] In addition, in the substrate processing system, it is preferred that the second posture conversion mechanism also has a second batch transfer mechanism, the second batch transfer mechanism has a guide rail arranged on the opposite side of the batch substrate transfer area separated by the spare slot, the second batch transfer mechanism transfers the multiple substrates from the spare slot to the second posture conversion part in a vertical posture along the guide rail, and the first batch transfer mechanism transfers the multiple substrates in a vertical posture between the multiple batch processing slots, the vertical holding part and the spare slot.

[0014] The guide rail is arranged so that a spare groove is arranged between the guide rail and the batch substrate transfer area. Therefore, the second batch transfer mechanism that transfers the substrate along the guide rail passes across between the posture conversion unit and the relay substrate transfer mechanism, thereby preventing interference when transferring the substrate from the underwater posture conversion unit to the relay substrate transfer mechanism.

[0015] In addition, in the substrate processing system, it is preferred that the second batch transport mechanism has a pair of chucks in which a plurality of pairs of holding grooves and a plurality of pairs of passing grooves are alternately arranged. When a group of processed substrates in which the plurality of substrates are alternately arranged with other plurality of substrates are immersed in the immersion liquid in the spare groove, the second batch transport mechanism uses the pair of chucks to take out the plurality of substrates from the group of processed substrates and transports the taken-out plurality of substrates to the posture conversion unit.

[0016] The second batch transfer mechanism can take out a plurality of substrates (the first substrate group) from a processing substrate group in which the plurality of substrates (the first substrate group) and other plurality of substrates (the second substrate group) are alternately arranged. The taken-out plurality of substrates (the first substrate group) are converted into a horizontal posture by a posture conversion unit. In contrast, other plurality of substrates (the second substrate group) can be kept on standby while being immersed in the immersion liquid in the standby tank. Thus, it is possible to prevent other plurality of substrates (the second substrate group) from drying out while being kept on standby.

[0017] In addition, in the substrate processing system, it is preferred that a stacker device is further provided adjacent to the batch processing device and the interface device, and the stacker device includes: a load port for carrying in and out the carrier; and a carrier transport robot for transporting the carrier at least between the load port and the first carrier rack. The carrier transport robot can transport the carrier at least between the load port and the first carrier rack. In addition, even if the length of the single-wafer processing device in the first horizontal direction changes, it is not necessary to change the stacker device structure.

[0018] In addition, in the substrate processing system, an example of the relay substrate transfer mechanism includes a belt conveyor. In addition, in the substrate processing system, an example of the relay substrate transfer mechanism includes a relay hand, and the relay hand holds one substrate and is movable. In addition, in the substrate processing system, an example of the substrate handling mechanism preferably includes a plurality of hands, and the plurality of hands respectively hold the plurality of substrates and are movable as a whole.

[0019] [Effects of the invention]

[0020] According to the substrate processing system of the present invention, the configurations of a batch processing apparatus and a single wafer processing apparatus can be freely changed. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to illustrate the invention, some forms currently considered suitable are shown in the drawings, but it should be understood that the invention is not limited to the illustrated structures and methods.

[0022] Figure 1 This is a plan view showing the schematic structure of the substrate processing system of Example 1.

[0023] Figure 2A to Figure 2C It is a side view for explaining the substrate operating mechanism and the first posture changing mechanism.

[0024] Figure 3 It is a top view showing the structure of the interface device and its surroundings.

[0025] Figure 4A to Figure 4H It is a diagram for explaining four holding patterns of a pair of chucks of the second batch transport mechanism.

[0026] Figure 5A to Figure 5C It is a diagram for explaining the second posture conversion mechanism.

[0027] Figure 6A to Figure 6C It is a diagram for explaining the second posture conversion mechanism.

[0028] Fig. 7A , Figure 7B It is a diagram for explaining the second posture conversion mechanism.

[0029] Figure 8 It is a right side view of the single chip processing device.

[0030] Fig. 9 This is a flowchart for explaining the operation of the substrate processing system.

[0031] Fig. 10A , Fig. 10B It is a top view for explaining the effect of the substrate processing system.

[0032] Fig.11A , Fig. 11B It is a top view for explaining the effect of the substrate processing system.

[0033] Fig.12 It is a top view showing the schematic structure of the substrate processing system of Example 2.

[0034] Fig.13 It is a top view showing the structure of an interface device and its surroundings according to a modified example.

[0035] Fig.14 It is a top view showing the structure of an interface device and its surroundings according to another variation.

[0036] Fig.15A , Fig. 15B This is a diagram for explaining that a substrate is rotated around a vertical axis by a propeller mechanism of an underwater posture conversion unit. DETAILED DESCRIPTION

[0037] [Example 1]

[0038] Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings. Figure 1 This is a plan view showing the schematic structure of the substrate processing system of Example 1.

[0039] In this specification, for convenience, the direction in which the transfer block 19 (described below) and the processing block 21 (described below) in the batch processing device 3 are arranged is referred to as the "front-rear direction X". The front-rear direction X is horizontal. In the front-rear direction X, for example, the direction from the processing block 21 toward the transfer block 19 is referred to as the "front". The direction opposite to the front is referred to as the "rear". The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y". One direction of the "width direction Y" is appropriately referred to as the "right". The direction opposite to the right is referred to as the "left". The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z". In each figure, the front, rear, right, left, top, and bottom are appropriately shown as references.

[0040] <1. Overall composition>

[0041] Reference Figure 1 The substrate processing system 1 processes the substrate W. The substrate processing system 1 performs, for example, a chemical solution process, a cleaning process, a drying process, etc. on the substrate W.

[0042] The substrate processing system 1 includes a stacker device 2, a batch processing device 3, an interface device 5, and a single-wafer processing device 7. That is, the substrate processing system 1 is a hybrid system including the batch processing device 3 and the single-wafer processing device 7. The batch processing device 3 processes a plurality of (e.g., 25 or 50) substrates W at once. The single-wafer processing device 7 processes a plurality of substrates W one by one. The interface device 5 connects the batch processing device 3 and the single-wafer processing device 7.

[0043] The stacker device 2, the batch processing device 3, the interface device 5, and the single-wafer processing device 7 are arranged in a C-shape or a U-shape. Specifically, the batch processing device 3 extends to the rear. The single-wafer processing device 7 is arranged opposite to the batch processing device 3 in a manner of being arranged in a width direction Y orthogonal to the rear. The interface device 5 is adjacent to one end side of each of the batch processing device 3 and the single-wafer processing device 7. The interface device 5 is arranged in a manner of extending along the width direction Y.

[0044] In addition, the rear direction corresponds to the first horizontal direction of the present invention. The width direction Y corresponds to the second horizontal direction of the present invention.

[0045] <2. Stacker Device>

[0046] The stacker device 2 accommodates at least one carrier C. The stacker device 2 is adjacent to the batch processing device 3, the interface device 5, and the single-wafer processing device 7. The carrier C stores a plurality of substrates W (e.g., 25) in a horizontal position at a predetermined interval (e.g., 10 mm). In the carrier C, the plurality of substrates W are arranged in the vertical direction Z or in the thickness direction of each substrate W. As the carrier C, for example, a FOUP (Front Opening Unify Pod) is used, but it is not limited thereto.

[0047] The stacker device 2 includes a plurality of (e.g., two) load ports 9, a main body region R1, and an extension region R2. The two load ports 9 are adjacent to the front of the main body region R1. The two load ports 9 are arranged along the width direction Y. The two load ports 9 are each used to carry in and carry out the carrier C. The main body region R1 and the extension region R2 are formed in an L shape in a plan view. The main body region R1 is formed in a manner extending along the width direction Y. The extension region R2 is connected to the rear of the right end of the main body region R1.

[0048] The stacker device 2 includes a storage rack 15 and a carrier transport robot 16. The storage rack 15 is disposed in the main body region R1. The storage rack 15 is a rack for storing carriers C. The storage rack 15 is for placing the carriers C thereon.

[0049] The carrier transport robot 16 transports the carrier C between the two load ports 9, the two racks 18, 89, and the storage rack 15. The carrier transport robot 16 includes, for example, a gripping portion 17 that grips a protrusion provided on the upper surface of the carrier C. The gripping portion 17 can be moved in the horizontal direction (front-rear direction X and width direction Y) and the vertical direction Z by the carrier transport robot 16. The carrier transport robot 16 is driven by one or more electric motors. In addition, the carrier transport robot 16 may also be a support portion that supports the lower surface of the carrier C and is movable.

[0050] <3. Batch processing device>

[0051] The batch processing apparatus 3 is briefly described. The batch processing apparatus 3 takes out a plurality of substrates W (for example, 25 substrates) from the carrier C transported to the rack 18. The batch processing apparatus 3 uses the first posture conversion mechanism 23 (described below) to convert the taken-out plurality of substrates W (for example, 25 substrates) from a horizontal posture to a vertical posture. The batch processing apparatus 3 performs a designated batch process on the plurality of substrates W (for example, 25 substrates or 50 substrates) converted to the vertical posture. The batch processing apparatus 3 transports the plurality of substrates W (for example, 25 substrates or 50 substrates) that have been batch processed to the interface apparatus 5.

[0052] Next, the batch processing apparatus 3 is described in detail. The batch processing apparatus 3 includes a rack 18, a transfer block 19, a processing block 21, and a batch substrate transfer region R3. The rack 18 is arranged in the extended region R2. The carrier C is placed on the rack 18. The transfer block 19 is adjacent to the rear of the rack 18. The processing block 21 is adjacent to the rear of the transfer block 19. The processing block 21 extends to the rear.

[0053] The batch substrate transfer area R3 is arranged adjacent to the transfer block 19 and the processing block 21 on the side where the single-wafer processing device 7 is arranged. In addition, one end side of the batch substrate transfer area R3 extends to the interface device 5. The other end side of the batch substrate transfer area R3 extends to the rear. In other words, the batch substrate transfer area R3 is adjacent to the left side of the transfer block 19, the processing block 21 and the posture conversion area R5 (described below). In addition, the batch substrate transfer area R3 may also be adjacent to the rear of the relay area R6 (described below).

[0054] <3-1. Transfer Block>

[0055] The transfer block 19 includes a substrate handling mechanism (robot) HTR and a first posture conversion mechanism 23. The substrate handling mechanism HTR is disposed behind the rack 18. The substrate handling mechanism HTR takes out a plurality of (e.g., 25) substrates W in a horizontal posture from the carrier C placed on the rack 18, and transfers the taken-out substrates W to the first posture conversion mechanism 23.

[0056] Reference Figure 2A to Figure 2C The substrate handling mechanism HTR includes a plurality of (for example, 25) hand portions 25. Each hand portion 25 holds one substrate W. Figure 2A to Figure 2C In the figure, for convenience of illustration, the substrate handling mechanism HTR is assumed to include three hand portions 25. In addition, a pair of horizontal holding portions 31B and a pair of vertical holding portions 31C described below are assumed to hold three substrates W. In addition, a pusher 33A described below is assumed to support six substrates W.

[0057] The substrate handling mechanism HTR also includes a hand support 26, an advance and retreat section 27, and a lifting and rotating section 29. The hand support 26 supports a plurality of hand sections 25. Thus, the plurality of hand sections 25 can move as a whole. The advance and retreat section 27 advances and retreats the plurality of hand sections 25 via the hand support 26. The lifting and rotating section 29 lifts and lowers the plurality of hand sections 25 and the advance and retreat section 27. The lifting and rotating section 29 rotates the advance and retreat section 27 around the vertical axis AX1 to change the orientation of the hand section 25. The lifting and rotating section 29 is fixed to the ground and does not move in the horizontal direction (front-back direction X and width direction Y). In addition, the advance and retreat section 27 and the lifting and rotating section 29 each include an electric motor. In addition, the substrate handling mechanism HTR may also include a hand section (not shown) that is different from the hand 25 and is used to transport only one substrate W and is movable.

[0058] The first posture conversion mechanism 23 includes a posture conversion unit 31 and a pusher mechanism 33. The substrate handling mechanism HTR, the posture conversion unit 31, and the pusher mechanism 33 are sequentially arranged to the left. In other words, the substrate handling mechanism HTR, the posture conversion unit 31, and the pusher mechanism 33 (including the pusher 33A) are arranged along the width direction Y orthogonal to the rear of the processing block 21 from the transfer block 19.

[0059] The posture conversion unit 31 converts a plurality of substrates W (for example, 25 substrates) received from the substrate handling mechanism HTR from a horizontal posture to a vertical posture. Figure 2A As shown in FIG. 1 , the posture conversion unit 31 includes a support table 31A, a pair of horizontal holding portions 31B, a pair of vertical holding portions 31C, and a rotation drive unit 31D. The pair of horizontal holding portions 31B and the pair of vertical holding portions 31C are provided on the support table 31A. When the substrate W is in a horizontal posture, the pair of horizontal holding portions 31B contacts the lower surface of each substrate W and supports the substrate W from below. In addition, when the substrate W is in a vertical posture, the pair of vertical holding portions 31C holds the substrate W. The rotation drive unit 31D rotates the support table 31A around the horizontal axis AX2.

[0060] like Figure 2C As shown in FIG. 1 , the pusher mechanism 33 includes a pusher 33A, a lifting and rotating unit 33B, a horizontal moving unit 33C, and a rail 33D. The pusher 33A holds the lower portion of each of the plurality of substrates W (e.g., 25 or 50) converted into a vertical posture by the posture conversion unit 31. In other words, the pusher 33A holds the plurality of substrates W received from the substrate handling mechanism HTR in a vertical posture via the posture conversion unit 31. The lifting and rotating unit 33B lifts the pusher 33A in the vertical direction Z. In addition, the lifting and rotating unit 33B rotates the pusher 33A around the vertical axis AX3. Thus, the orientation of the element surface of the substrate W indicated by the arrow AR1 can be set to any direction.

[0061] The horizontal moving unit 33C moves the pusher 33A and the lifting and rotating unit 33B horizontally along the rail 33D. The rail 33D extends in the width direction Y. In addition, the rotation drive unit 31D, the lifting and rotating unit 33B, and the horizontal moving unit 33C each include an electric motor.

[0062] In addition, the rack 18 corresponds to the first carrier mounting rack of the present invention. The posture conversion unit 31 corresponds to the first posture conversion unit of the present invention. In addition, the pusher 33A corresponds to the vertical holding unit of the present invention. In addition, the multi-sheet substrate of the present invention may be a part of 25 or 50 sheets of substrates W, for example.

[0063] Here, the operation of the first posture conversion mechanism 23 is described. For example, the following four batch processing tanks BT1 to BT4 of the processing block 21 each process 50 substrates W corresponding to two carriers C together. Therefore, the posture of 50 substrates W (W1, W2) is converted 25 at a time, and the pusher 33A holds the 50 substrates W. The 25 substrates W1 are called the first substrate group. The 25 substrates W2 are called the second substrate group. The 50 substrates W (W1, W2) are called the processed substrate group. When the substrates W1 and W2 are not particularly distinguished, the substrates W1 and W2 are recorded as substrates W.

[0064] Reference Figure 2A . The posture conversion unit 31 receives 25 substrates W1 from the substrate operation mechanism HTR. At this time, the 25 substrates W1 are in a horizontal posture and are arranged at a full pitch (for example, 10 mm intervals). In addition, the full pitch is also called a normal pitch. In addition, the component surface of each substrate W1 faces upward. In addition, the component surface of the substrate W is the surface on which the electronic circuit is formed, and is called the "front side". In addition, the back side of the substrate W refers to the surface on which the electronic circuit is not formed. The surface on the opposite side of the component surface is the back side.

[0065] Reference Figure 2B The rotation drive unit 31D of the posture conversion unit 31 rotates a pair of horizontal holding units 31B and the like by 90 degrees around the horizontal axis AX2, and converts the 25 substrates W1 from the horizontal posture to the vertical posture. Then, the pusher mechanism 33 raises the pusher 33A to receive the 25 substrates W1 from the posture conversion unit 31. Then, the pusher mechanism 33 rotates the pusher 33A by 180 degrees around the vertical axis AX3. Thus, the orientation of the 25 substrates W1 is changed from the left to the right.

[0066] Then, the posture conversion unit 31 receives 25 substrates W2 from the substrate handling mechanism HTR and converts the 25 substrates W2 from the horizontal posture to the vertical posture. Then, the pusher mechanism 33 raises the pusher 33A holding the 25 substrates W1. Thus, the pusher 33A further receives 25 substrates W2.

[0067] Reference Figure 2C . The pusher 33A holds 50 substrates W (W1, W2). 25 substrates W1 and 25 substrates W2 are arranged alternately. The 50 substrates W are arranged at a half pitch (for example, 5 mm interval). In addition, the half pitch is an interval of half the full pitch. Then, the pusher mechanism 33 moves the pusher 33A holding the 50 substrates W along the track 33D to the substrate transfer position PP below a pair of chucks 37, 38 (described below) of the batch transport mechanism WTR1 (described below).

[0068] <3-2. Processing Block (Batch Processing Block)>

[0069] The processing block 21 includes a batch processing area R4. The batch processing area R4 is adjacent to the rear of the transfer block 19. The batch processing area R4 includes a plurality of (e.g., four) batch processing tanks BT1 to BT4. The four batch processing tanks BT1 to BT4 are arranged side by side in the rear or front-to-back direction X where the batch processing device 3 extends. The four batch processing tanks BT1 to BT4 each perform immersion processing on a plurality of (e.g., 25 or 50) substrates W at a time. The four batch processing tanks BT1 to BT4 each store a processing liquid (e.g., a chemical solution or pure water) for immersing the plurality of substrates W.

[0070] The four batch processing tanks BT1 to BT4 include, for example, two chemical processing tanks BT1 and BT3 and two water washing processing tanks BT2 and BT4. The chemical processing tank BT1 and the water washing processing tank BT2 are set as one group, and the chemical processing tank BT3 and the water washing processing tank BT4 are set as another group. In addition, the combination of the chemical processing tank and the water washing processing tank is not limited to this example. In addition, the number of batch processing tanks is not limited to 4, and can be 1 or more than 2.

[0071] The two chemical liquid treatment tanks BT1 and BT3 each perform etching processing using chemical liquid. As the chemical liquid, phosphoric acid is used, for example. The chemical liquid treatment tanks BT1 and BT3 each store chemical liquid supplied from a chemical liquid discharge pipe not shown. The two water washing treatment tanks BT2 and BT4 each perform pure water washing processing for washing chemical liquid attached to the plurality of substrates W using pure water. As the pure water, deionized water (DIW) is used, for example. The water washing treatment tanks BT2 and BT4 each store pure water supplied from a pure water discharge pipe not shown.

[0072] Four lifters LF1 to LF4 are respectively provided in the four batch processing tanks BT1 to BT4. For example, lifter LF1 holds substrates W arranged in a vertical posture at a specified interval, i.e., half pitch (e.g., 5 mm interval). Lifter LF1 lifts and lowers multiple substrates W between a processing position inside the batch processing tank BT1 and a transfer position above the batch processing tank BT1. The other three lifters LF2 to LF4 are also constructed in the same manner as lifter LF1. In addition, Figure 1 The region R20 shown is, for example, a region for preparing the chemical solution to be supplied to the chemical solution processing tanks BT1 and BT3 (for example, a region for adjusting the temperature and concentration of the chemical solution to be supplied).

[0073] <3-3. Batch substrate transfer area>

[0074] The batch substrate transfer region R3 is arranged on the opposite side of the substrate handling mechanism HTR via the first posture conversion mechanism 23 (including the pusher 33A). One end of the batch substrate transfer region R3 extends to the posture conversion region R5 (described below) of the interface device 5. The other end of the batch substrate transfer region R3 extends backward. In other words, the batch substrate transfer region R3 extends along the front-back direction X.

[0075] The batch substrate transfer region R3 includes a batch transfer mechanism (robot) WTR1 that transfers a plurality of substrates W in a vertical posture between four batch processing tanks BT1 to BT4, a first posture conversion mechanism 23 (including a pusher 33A), and an interface device 5 (a spare tank 45 described below).

[0076] The four batch processing tanks BT1 to BT4, the substrate transfer position PP, the standby tank 45 (described below) and the underwater posture changer 43 (described below) are arranged in a row in the front-rear direction X. Therefore, the batch transfer mechanism WTR1 transfers a plurality of substrates W in a vertical posture in parallel with the rear or front-rear direction X.

[0077] The batch transport mechanism WTR1 includes a pair of chucks 37, 38 and a guide rail 39. The pair of chucks 37, 38 includes, for example, 50 pairs of holding grooves to hold 50 substrates W. That is, the two chucks 37, 38 each include 50 holding grooves. The two chucks 37, 38 each extend in the width direction Y ( Figure 1 ) extend in parallel. The batch transport mechanism WTR1 opens or closes the two chucks 37 and 38. The guide rail 39 extends in the front-rear direction X. The batch transport mechanism WTR1 moves a pair of chucks 37 and 38 along the guide rail 39. The batch transport mechanism WTR1 is driven by an electric motor.

[0078] <4. Interface device>

[0079] The interface device 5 is described in general. The interface device 5 receives the plurality of substrates W that have been subjected to a designated batch process in one of the two water washing treatment tanks BT2 and BT4 from the batch transport mechanism WTR1. The interface device 5 converts the received plurality of substrates W from a vertical posture to a horizontal posture. The interface device 5 transfers the plurality of substrates W converted to a horizontal posture to the single-wafer processing device 7.

[0080] Next, the interface device 5 will be described in detail. Figure 1 , Figure 3The interface device 5 includes a posture conversion area R5 and a relay area R6 arranged along the width direction Y. The posture conversion area R5 is arranged on the opposite side of the processing block 21 with the transfer block 19 interposed therebetween. That is, the posture conversion area R5 is adjacent to the front of the transfer block 19. The posture conversion area R5 is adjacent to the left of the extension area R2 of the stacker device 2, and is adjacent to the rear of the main area R1. The posture conversion area R5 is arranged on the left of the rack 18.

[0081] <4-1. Second posture conversion mechanism>

[0082] The posture conversion region R5 includes a second posture conversion mechanism 41. The second posture conversion mechanism 41 converts the plurality of substrates W processed by the batch processing apparatus 3 from a vertical posture to a horizontal posture. The second posture conversion mechanism 41 includes an underwater posture conversion unit 43, a spare tank 45, and a second batch transport mechanism WTR2. The underwater posture conversion unit 43 corresponds to the second posture conversion unit of the present invention.

[0083] The standby tank 45 is provided in front of the substrate transfer position PP. In addition, the standby tank 45 is provided between the transfer block 19 and the underwater posture conversion unit 43. The standby tank 45 is provided with a lifter LF7. The lifter LF7 is configured in the same manner as the lifter LF1. The standby tank 45 stores an immersion liquid for immersing a plurality of substrates W in a vertical posture. Pure water is used as the immersion liquid. Pure water (e.g., DIW) is supplied from a pure water discharge pipe (not shown).

[0084] The second batch transport mechanism WTR2 transports a plurality of substrates (e.g., 25 substrates) W from the standby tank 45 to the underwater posture conversion unit 43 in a vertical posture along the guide rail 51. The second batch transport mechanism WTR2 includes a pair of chucks 47, 48, and a support column 49 (see Figure 5B ), and a guide rail 51. The support column 49 supports a pair of chucks 47 and 48 at its upper end. The support column 49 allows the first chuck 47 to rotate around the horizontal axis AX4, and also allows the second chuck 48 to rotate around the horizontal axis AX5 (see Figure 4A ). The horizontal axes AX4 and AX5 each extend along the width direction Y.

[0085] The pair of chucks 47, 48 and the support column 49 can move along a guide rail 51 extending in the front-rear direction X. The guide rail 51 is provided at a height position closer to the floor of the posture conversion region R5 than the top surface. The guide rail 51 is provided directly or indirectly on the floor of the posture conversion region R5. The second batch transport mechanism WTR2 is driven by, for example, an electric motor.

[0086] The guide rail 51 is provided on the opposite side of the batch substrate transfer region R3 via the spare tank 45. That is, the guide rail 51 is provided on the right side of the underwater posture conversion unit 43 and the spare tank 45. Thus, the second batch transfer mechanism WTR2 that transfers the substrate W along the guide rail 51 passes across between the underwater posture conversion unit 43 and the relay substrate transfer mechanism 81 (described below), thereby preventing the substrate from being disturbed when being transferred from the underwater posture conversion unit 43 to the relay substrate transfer mechanism 81.

[0087] Next, the pair of chucks 47 and 48 will be described. For example, a processing substrate group (for example, 50 substrates W1 and W2) in which a plurality of substrates W1 and another plurality of substrates W2 are alternately arranged is assumed to be immersed in the immersion liquid in the standby tank 45. In this case, the second batch transfer mechanism WTR2 uses the pair of chucks 47 and 48 to take out the plurality of substrates W1 (W2) from the processing substrate group in the standby tank 45, and transfers the taken-out plurality of substrates W1 (W2) to the underwater posture conversion unit 43.

[0088] The pair of chucks 47 and 48 has a plurality of (eg, four) holding patterns. Figure 4A to Figure 4H is a diagram for explaining the four holding modes. Figure 4A , Figure 4C , Figure 4E , Figure 4G Each represents the Figure 3 This is a side view of a pair of chucks 47 and 48 as viewed along arrow AR2. Figure 4B , Figure 4D , Figure 4F , Figure 4H Each is a cross-sectional view of a pair of clamps 47 and 48. Figure 4A to Figure 4H In the figure, for the convenience of illustration, six substrates W1 and W2 are used for illustration.

[0089] Figure 4A , Figure 4B 1 is a diagram showing the first holding mode. In the first holding mode, a pair of chucks 47 and 48 have a pair of passing grooves 59 and 60. In the case of the first holding mode, a pair of chucks 47 and 48 cannot hold any of the 50 substrates W1 and W2 held by the lifter LF7. That is, the 50 substrates W1 and W2 pass between the chucks 47 and 48 (through the grooves 59 and 60).

[0090] Figure 4C , Figure 4D2 is a diagram showing the second holding mode. In the second holding mode, a pair of chucks 47 and 48 includes a plurality of pairs (e.g., 25 pairs) of holding grooves 53A and 54A and a plurality of pairs (e.g., 25 pairs) of through grooves 55A and 56A. The 25 pairs of holding grooves 53A and 54A and the 25 pairs of through grooves 55A and 56A are alternately arranged. The first chuck 47 includes 25 holding grooves 53A and 25 through grooves 55A alternately arranged. The second chuck 48 includes 25 holding grooves 54A and 25 through grooves 56A alternately arranged. The pair of chucks 47 and 48 in the second holding mode holds 25 substrates W1 out of 50 substrates W1 and W2.

[0091] Figure 4E , Figure 4F 2 is a diagram showing a third holding mode. In the third holding mode, a pair of chucks 47 and 48 includes, for example, 50 pairs of holding grooves 63 and 64. A pair of chucks 47 and 48 can hold 50 substrates W1 and W2 using the 50 pairs of holding grooves 63 and 64.

[0092] Figure 4G , Figure 4H 4 is a diagram showing the fourth holding mode. In the fourth holding mode, a pair of chucks 47, 48 includes a plurality of pairs (e.g., 25 pairs) of holding grooves 53B, 54B and a plurality of pairs (e.g., 25 pairs) of through grooves 55B, 56B. The 25 pairs of holding grooves 53B, 54B and the 25 pairs of through grooves 55B, 56B are alternately arranged. The pair of chucks 47, 48 in the fourth holding mode holds 25 substrates W2 out of 50 substrates W1, W2.

[0093] In addition, if Figure 4B , Figure 4F As shown, for example, in the first chuck 47, a holding groove 63 related to the third holding mode is provided on the surface opposite to the through groove 59 related to the first holding mode via the horizontal axis AX4. Figure 4D , Figure 4H As shown, for example, in the first chuck 47 , the holding groove 53B and the passing groove 55B related to the fourth holding mode are provided on the surface opposite to the holding groove 53A and the passing groove 55A related to the second holding mode across the horizontal axis AX4.

[0094] For example, Figure 4A Based on the first holding mode shown in FIG. 1 , the first chuck 47 is rotated 90 degrees in the clockwise direction around the horizontal axis AX4, and the second chuck 48 is rotated 90 degrees in the counterclockwise direction around the horizontal axis AX5. Figure 4CIn addition, based on the first holding mode, the first chuck 47 is rotated 180 degrees in the clockwise direction around the horizontal axis AX4, and the second chuck 48 is rotated 180 degrees in the counterclockwise direction around the horizontal axis AX5. Figure 4E The 3rd hold mode is shown.

[0095] Similarly, based on the first holding mode, the first chuck 47 is rotated 270 degrees in the clockwise direction, and the second chuck 48 is rotated 270 degrees in the counterclockwise direction. Figure 4G The 4th hold mode is shown.

[0096] Next, the underwater posture conversion unit 43 will be described. The underwater posture conversion unit 43 converts the plurality of substrates W from a vertical posture to a horizontal posture. Figure 3 , Figure 5A As shown, the underwater posture conversion unit 43 is provided in front of the backup tank 45. The underwater posture conversion unit 43 includes a tank carrier 67, a lifter LF8, a posture conversion tank 69, a rotation mechanism 71, a propeller mechanism 73 and a horizontal push mechanism 75 (see Figure 7B ).

[0097] The in-tank carrier 67 can accommodate multiple (e.g., 25 or 50) substrates W. The in-tank carrier 67 includes an inlet and outlet 67A and a back opening 67B. The inlet and outlet 67A is an opening for the substrate W to enter and exit. The back opening 67B is opposite to the inlet and outlet 67A. In addition, the back opening 67B is formed with a width smaller than the diameter of the substrate W in the radial direction of the accommodated substrate W. Therefore, multiple substrates W cannot pass through the back opening 67B.

[0098] The lifter LF8 includes two carrier support parts 77 for supporting the in-tank carrier 67. The lifter LF8 raises and lowers the two carrier support parts 77. The posture conversion tank 69 accommodates the in-tank carrier 67, the two carrier support parts 77 of the lifter LF8, and the pusher 73A (described below). The posture conversion tank 69 stores pure water (e.g., DIW) supplied from a pure water spray pipe (not shown). Thus, the in-tank carrier 67 can be immersed in the pure water in the posture conversion tank 69.

[0099] The rotating mechanism 71 includes two shafts 71A facing each other. The two shafts 71A each penetrate the posture conversion groove 69. The rotating mechanism 71 clamps the in-groove carrier 67 with the two shafts 71A and holds the in-groove carrier 67. Furthermore, the rotating mechanism 71 can rotate the in-groove carrier 67 held by the two shafts 71A around the horizontal axis AX6 of the shaft 71A. The horizontal axis AX6 extends in the front-rear direction X.

[0100] The pusher mechanism 73 includes a pusher 73A that holds the lower portion of a plurality of (eg, 25) substrates W in a vertical posture. The pusher mechanism 73 can move the pusher 73A up and down, and can also rotate it around a vertical axis AX7 (see FIG. 1 ). Figure 5B The horizontal push-out mechanism 75 includes a push-out member 75A (see Figure 7B When the inlet and outlet 67A of the carrier 67 in the tank faces leftward, the pusher member 75A moves leftward while passing through the back opening 67B and the inlet and outlet 67A. The lifter LF8, the rotating mechanism 71, the pusher mechanism 73 and the horizontal pusher mechanism 75 are each driven by at least one of an electric motor and an air cylinder.

[0101] <4-2. Operation of the Second Posture Conversion Mechanism>

[0102] Here, the operation of the second posture conversion mechanism 41 will be described. Figure 5A 50 substrates W held in a vertical position by the lifter LF7 are immersed in the pure water in the standby tank 45. Figure 2C As shown, the 50 substrates W are composed of 25 substrates W1 and 25 substrates W2 arranged alternately.

[0103] The second batch transport mechanism WTR2 moves to the upper side of the spare tank 45. The second batch transport mechanism WTR2 sets the pair of chucks 47 and 48 to the first holding mode (see Figure 4A , Figure 4B Then, the lifter LF7 raises the 50 substrates W to a position higher than the pair of chucks 47 and 48 while allowing the 50 substrates W to pass between the chucks 47 and 48 .

[0104] Then, the second batch transport mechanism WTR2 sets the pair of chucks 47 and 48 to the second holding mode (see Figure 4C , Figure 4D ). Then, the lifter LF7 lowers the 50 substrates W. Thus, the second batch transport mechanism WTR2 receives 25 substrates W1 out of the 50 substrates W from the lifter LF7. Therefore, 25 substrates W2 remain in the lifter LF7. The lifter LF7 immerses the 25 substrates W2 in the pure water in the standby tank 45. Then, the second batch transport mechanism WTR2 transports the 25 substrates W1 to the top of the posture conversion tank 69 and the pusher 73A.

[0105] Reference Figure 5BThe two carrier support parts 77 of the lifter LF8 support the in-tank carrier 67 with the entrance 67A facing upward. The pusher mechanism 73 moves the pusher 73A upward while passing between the two carrier support parts 77, the back opening 67B and the entrance 67A. Thus, the pusher 73A receives the 25 substrates W1 from the pair of chucks 47 and 48 indicated by the dotted line by holding the lower part of the 25 substrates W1 held by the pair of chucks 47 and 48.

[0106] Then, the second batch transport mechanism WTR2 sets the pair of chucks 47 and 48 to the first holding mode (see Figure 4A , Figure 4B Then, the pusher mechanism 73 lowers the pusher 73A while passing the 25 substrates W1 held by the pusher 73A between the chucks 47 and 48. The pusher 73A lowers to a position where it does not interfere with the pair of chucks 47 and 48. Then, the second batch transport mechanism WTR2 moves from above the pusher 73A.

[0107] Then, the pusher mechanism 73 rotates the 25 substrates W1 around the vertical axis AX7 so that the device surface faces upward when the 25 substrates W1 are converted to a horizontal posture. Thus, the orientation of the 25 substrates W1 is adjusted. This adjustment is performed at a position higher than the surface of the pure water in the posture conversion tank 69, for example.

[0108] Reference Figure 5C The lifter LF8 raises the two carrier support parts 77 supporting the in-tank carrier 67 with the inlet 67A facing upward from the position P1 to the position P2. Thus, the 25 substrates W1 held by the pusher 73A are stored in the in-tank carrier 67. The position P2 is, for example, a position higher than the surface of the pure water in the posture conversion tank 69.

[0109] Reference Fig. 6A Then, the pusher mechanism 73 lowers the pusher 73A to the bottom surface of the in-tank carrier 67. In addition, the lifter LF8 lowers the two carrier support parts 77 from the position P2 to the position P1. Thus, the 25 substrates W1 stored in the in-tank carrier 67 are immersed in the pure water in the posture conversion tank 69.

[0110] Reference Figure 6B Then, the rotating mechanism 71 uses two shafts 71A to hold the carrier 67 in the groove. Figure 6C. Then, the lifter LF8 lowers the two carrier support parts 77 from position P1 to position P3. As a result, the in-tank carrier 67 is held only by the two shafts 71A. In addition, position P3 is a position near the bottom surface of the in-tank carrier 67. Then, the rotating mechanism 71 rotates the in-tank carrier 67 90 degrees around the horizontal axis AX6. As a result, the 25 substrates W1 in the in-tank carrier 67 are converted from a vertical posture to a horizontal posture. At this time, the component surface of each substrate W1 faces upward.

[0111] Reference Fig. 7A Then, the lifter LF8 raises the two carrier support parts 77 from the position P3 to the position P4. Thus, the two carrier support parts 77 come into contact with the lower surface of the in-tank carrier 67. Then, the rotating mechanism 71 causes the two shafts 71A to separate from the in-tank carrier 67. Thus, the in-tank carrier 67 is held only by the two carrier support parts 77.

[0112] Reference Figure 7B Then, the lifter LF8 raises the two carrier support parts 77, so that one substrate W1 comes out of the pure water in the posture conversion tank 69. Then, the horizontal push-out mechanism 75 pushes the one substrate W1 taken out of the pure water to the left using the push-out member 75A. The pushed-out substrate W1 is transported to the relay substrate transport mechanism 81 (described below) of the relay region R6.

[0113] Then, after 25 substrates W1 are transferred from the in-tank carrier 67, the remaining 25 substrates W2 immersed in the pure water in the standby tank 45 are turned into a horizontal posture. In addition, when receiving 25 substrates W2 from the lifter LF7, the second batch transfer mechanism WTR2 sets the pair of chucks 47 and 48 to the fourth holding mode (see Figure 4G , Figure 4H ). Except for this, the posture conversion of the 25 substrates W2 is performed in the same manner as the posture conversion of the 25 substrates W1 (see Figure 5A to Figure 7B ).

[0114] <4-3. Intermediate substrate transport mechanism>

[0115] Reference Figure 1 , Figure 3 . The relay region R6 is adjacent to or connected to the left side of the posture conversion region R5. The relay region R6 extends in the width direction Y. That is, the relay region R6 extends to the left from the posture conversion region R5. The relay region R6 includes a relay substrate conveying mechanism 81. The relay substrate conveying mechanism 81 conveys the plurality of substrates W converted into a horizontal posture by the second posture conversion mechanism 41 to the single-wafer processing device 7. The relay substrate conveying mechanism 81 includes a belt conveyor 83. The relay region R6 blocks the gas outside the substrate processing system 1 by a shell 82.

[0116] The belt conveyor 83 includes two pulleys 84, two belts 85, and a pin lifting unit 87 (see Figure 3 ). Two belts 85 are mounted on two pulleys 84. A pin lifter 87 is provided at the front end of the belt conveyor 83. The pin lifter 87 has three lift pins PN, and uses the three lift pins PN to lift a substrate W on the two belts 85. At least one of the two pulleys 84 and the pin lifter 87 are each driven by an electric motor.

[0117] <5. Single chip processing device>

[0118] Reference Figure 1 The wafer processing device 7 performs designated wafer processing on the plurality of substrates W received from the interface device 5 one by one, and transports the plurality of wafer-processed substrates W to the carrier C mounted on the rack 89 .

[0119] The single wafer processing apparatus 7 is provided on the opposite side of the transfer block 19 and the processing block 21 via the batch substrate transfer area R3 of the batch processing apparatus 3. That is, the single wafer processing apparatus 7 is provided on the left side of the batch processing apparatus 3. A maintenance area R7 is provided between the batch processing apparatus 3 and the single wafer processing apparatus 7.

[0120] The single-wafer processing device 7 includes a rack 89 for mounting a carrier C, and a single-wafer processing block 90. ​​The single-wafer processing block 90 is adjacent to the rear of the rack 89. The single-wafer processing block 90 includes a plurality of single-wafer processing chambers (a first single-wafer processing chamber SW1 and a second single-wafer processing chamber SW2) (described below) for performing designated processing on a plurality of substrates W processed by the batch processing device 3 one by one. The rack 89 is arranged in the main region R1. In addition, the rack 89 corresponds to the second carrier mounting rack of the present invention.

[0121] The single-wafer processing block 90 includes a delivery area R8, a single-wafer substrate transfer area R9, and two single-wafer substrate processing areas R10 and R11. The delivery area R8 is adjacent to the front end of the relay area R6 and the rack 89. The single-wafer substrate transfer area R9 extends backward from the delivery area R8. The first single-wafer substrate processing area R10 is adjacent to the left of the single-wafer substrate transfer area R9. The second single-wafer substrate processing area R11 is adjacent to the right of the single-wafer substrate transfer area R9. The two single-wafer substrate processing areas R10 and R11 each extend in the front-rear direction X.

[0122] The first single substrate processing region R10 includes a front tower TW1, a rear tower TW2, and a substrate transfer robot CR1. The front tower TW1, the substrate transfer robot CR1, and the rear tower TW2 are sequentially provided along the single substrate transfer region R9.

[0123] The front tower TW1 is disposed in front of the substrate transport robot CR1. The rear tower TW2 is disposed in the rear of the substrate transport robot CR1. Figure 8 As shown, the front tower TW1 includes one first single-wafer processing chamber SW1 and two second single-wafer processing chambers SW2 stacked in the vertical direction Z. The rear tower TW2 includes three second single-wafer processing chambers SW2 stacked in the vertical direction Z. That is, the first single-wafer substrate processing region R10 includes a total of six single-wafer processing chambers (the first single-wafer processing chamber SW1 and the second single-wafer processing chamber SW2). Each single-wafer processing chamber (the first single-wafer processing chamber SW1 and the second single-wafer processing chamber SW2) is set along the single-wafer substrate transfer region R9 to perform a designated process on one substrate W.

[0124] The substrate transport robot CR1 includes a hand 91, an advance / retract portion 92, and an elevating / rotating portion 93. The hand 91 holds a substrate W in a horizontal position. The advance / retract portion 92 moves the hand 91 forward and backward. The elevating / rotating portion 93 elevates the hand 91 and the advance / retract portion 92. In addition, the elevating / rotating portion 93 rotates the hand 91 and the advance / retract portion 92 around a vertical axis AX8 to change the orientation of the hand 91. The substrate transport robot CR1 transports a substrate W in a horizontal position between three single-wafer processing chambers (the first single-wafer processing chamber SW1 and the second single-wafer processing chamber SW2) of the front tower TW1 and three second single-wafer processing chambers SW2 of the rear tower TW2.

[0125] The second single-wafer substrate processing area R11 is provided with a front tower TW1, a rear tower TW2, and a substrate transfer robot CR2 in the same manner as the first single-wafer substrate processing area R10. That is, the second single-wafer substrate processing area R11 is provided with six single-wafer processing chambers (the first single-wafer processing chamber SW1 and the second single-wafer processing chamber SW2). The substrate transfer robot CR2 is configured in the same manner as the substrate transfer robot CR1. In addition, the type and number of single-wafer processing chambers provided in the front tower TW1 and the rear tower TW2 are appropriately set.

[0126] The first single-wafer processing chamber SW1 includes, for example, a holding and rotating unit 94 and a nozzle 95. The holding and rotating unit 94 includes a rotating chuck that holds a substrate W in a horizontal position, and an electric motor that rotates the rotating chuck around a vertical axis passing through the center of the substrate W. The nozzle 95 supplies a processing liquid onto the substrate W held by the holding and rotating unit 94. As the processing liquid, for example, pure water (for example, DIW) and IPA (isopropyl alcohol) are used. After the first single-wafer processing chamber SW1 cleans the substrate W with, for example, pure water, a liquid film of IPA is formed on the upper surface of the substrate W.

[0127] Each of the second single-wafer processing chambers SW2 performs a drying process, for example, using a supercritical fluid. As the fluid, for example, carbon dioxide is used. When the fluid is carbon dioxide, the supercritical state 2 is obtained when the critical temperature is 31° C. and the critical pressure is 7.38 MPa. By performing the drying process using a supercritical fluid, the pattern on the substrate W can be made less likely to collapse.

[0128] The second single-wafer processing chamber SW2 includes a chamber body (container) 96, a support plate 97, and a cover. The chamber body 96 includes a processing space provided inside, an opening for placing the substrate W into the processing space, a supply port, and an exhaust port. The substrate W is supported by the support plate 97 and accommodated in the processing space. The cover covers the opening of the chamber body 96. For example, each second single-wafer processing chamber SW2 makes the fluid into a supercritical state, and supplies the supercritical fluid from the supply port to the processing space in the chamber body 96. A single substrate W is dried using the supercritical fluid supplied to the processing space.

[0129] The single-wafer substrate transfer region R9 is provided with a substrate transfer robot CR3. The substrate transfer robot CR3 transfers one substrate W in a horizontal posture between the relay substrate transfer mechanism 81, 12 single-wafer processing chambers (the first single-wafer processing chamber SW1 and the second single-wafer processing chamber SW2), and the carrier C mounted on the rack 89. In addition, the substrate transfer robot CR3 receives the substrate W transferred by the relay substrate transfer mechanism 81, and transfers the received substrate W to one first single-wafer processing chamber SW1 among the plurality of (for example, 12) single-wafer processing chambers (the first single-wafer processing chamber SW1 and the second single-wafer processing chamber SW2). The substrate transfer robot CR3 stores the substrate W processed in one second single-wafer processing chamber SW2 among the plurality of (for example, 12) single-wafer processing chambers (the first single-wafer processing chamber SW1 and the second single-wafer processing chamber SW2) in the carrier C mounted on the rack 89.

[0130] The substrate transport robot CR3 is provided with a hand 91, an advance and retreat part 92, and an elevating and rotating part 93 in the same manner as the substrate transport robot CR1. The substrate transport robot CR3 is also provided with a guide rail 101 extending in the front-rear direction X. One end of the guide rail 101 extends to the transfer area R8. The elevating and rotating part 93 of the substrate transport robot CR3 can move along the guide rail 101. In addition, the substrate transport robot CR3 preferably has two hand parts 91. In this case, the first hand part 91 is used to transport the wet substrate W, and the second hand part 91 is used to transport the substrate W dried in the second single-wafer processing chamber SW2. In addition, each of the substrate transport robots CR1 to CR3 corresponds to the horizontal substrate transport robot of the present invention.

[0131] <6. Control Unit>

[0132] The substrate processing system 1 includes a control unit 110 (see Figure 1 ) and a storage unit (not shown). The control unit 110 controls each component of the substrate processing system 1. The control unit 110 includes one or more processors such as a central processing unit (CPU). The storage unit includes at least one of a ROM (Read-Only Memory), a RAM (Random-Access Memory), and a hard disk. The storage unit stores computer programs required to control each component of the substrate processing system 1.

[0133] <7. Operation of substrate processing system>

[0134] Next, refer to Fig. 9 The operation of the substrate processing system 1 is described in the flowchart of FIG. Figure 1 The external transfer robot (not shown) transfers the two carriers C to the load port 9 .

[0135] [Step S01] Remove the substrate from the carrier

[0136] The carrier transport robot 16 of the stacker device 2 transports the first carrier C containing 25 substrates W1 before processing from the load port 9 to the rack 18. Then, the substrate handling mechanism HTR of the batch processing device 3 takes out 25 substrates W1 (first substrate group) from the first carrier C transported to the rack 18, and transports the 25 substrates W1 to the posture conversion unit 31.

[0137] Then, the carrier transport robot 16 transports the first carrier C (empty carrier) from which 25 substrates W1 have been taken out from the rack 18 to the rack 89. Then, the carrier transport robot 16 transports the second carrier C containing 25 substrates W2 before being processed from the load port 9 to the rack 18. Then, the substrate handling mechanism HTR takes out 25 substrates W2 (second substrate group) from the second carrier C transported to the rack 18, and transports the 25 substrates W2 to the posture conversion unit 31.

[0138] Then, the carrier transfer robot 16 transfers the second carrier C (empty carrier) having taken out 25 substrates W2 from the rack 18 to the storage rack 15. The second carrier C is stored in the storage rack 15 until it can be transferred to the rack 89.

[0139] [Step S02] Convert the posture to a vertical posture

[0140] like Figure 2A to Figure 2CAs shown, the posture conversion unit 31 converts the 25 substrates W1 and the 25 substrates W2 individually from the horizontal posture to the vertical posture. In addition, the pusher 33A of the pusher mechanism 33 holds the 50 substrates W (substrates W1, W2) in which the 25 substrates W1 and the 25 substrates W2 are alternately arranged in a vertical posture. Then, the pusher mechanism 33 transports the 50 substrates W to the substrate transfer position PP.

[0141] [Step S03] Chemical solution treatment

[0142] The batch transfer mechanism WTR1 receives 50 substrates W in a vertical posture from the pusher mechanism 33 at the substrate delivery position PP, and transfers the 50 substrates W to one of the two lifters LF1, LF3 of the two chemical processing tanks BT1, BT3.

[0143] For example, the batch transport mechanism WTR1 transports 50 substrates W in a vertical position to the lifter LF1 of the chemical liquid treatment tank BT1. The lifter LF1 receives the 50 substrates W at a position above the chemical liquid treatment tank BT1. The lifter LF1 immerses the 50 substrates W in the chemical liquid (e.g., phosphoric acid) in the chemical liquid treatment tank BT1. Thus, an etching process (batch process) is performed. After the etching process, the lifter LF1 pulls up the 50 substrates W from the phosphoric acid in the chemical liquid treatment tank BT1. In addition, when the 50 substrates W are transported to the lifter LF3 of another chemical liquid treatment tank BT3, the same process as that of the chemical liquid treatment tank BT1 is also performed.

[0144] [Step S04] Pure water cleaning treatment

[0145] The batch transport mechanism WTR1 receives, for example, 50 substrates W in a vertical position from the lifter LF1, and transports the 50 substrates W to the lifter LF2 of the water washing treatment tank BT2. The lifter LF2 receives the 50 substrates W at a position above the water washing treatment tank BT2. The lifter LF2 immerses the 50 substrates W in the pure water in the water washing treatment tank BT2. Thus, a cleaning process (batch process) is performed.

[0146] When the batch transport mechanism WTR1 receives 50 substrates W in a vertical position from the lifter LF3, the batch transport mechanism WTR1 transports the 50 substrates W to the lifter LF4 of the water washing treatment tank BT4. The lifter LF4 immerses the 50 substrates W in the pure water in the water washing treatment tank BT4.

[0147] [Step S05] The posture is changed to a horizontal posture and the substrate is transported

[0148] The batch transport mechanism WTR1 receives 50 substrates W that have been subjected to the pure water cleaning process from one of the two lifters LF2 and LF4. When transporting the 50 substrates W, for example, the lifter LF2 pulls up the 50 substrates W from the pure water in the water cleaning tank BT2. The batch transport mechanism WTR1 causes the received 50 substrates W to pass the substrate delivery position PP of the first posture conversion mechanism 23, and transports the 50 substrates W to the lifter LF7 of the spare tank 45 of the interface device 5. The lifter LF7 receives the 50 substrates W at a position above the spare tank 45.

[0149] like Figure 5A to Figure 7B As shown, the underwater posture conversion unit 43 converts the 25 substrates W1 and 25 substrates W2 from the vertical posture to the horizontal posture individually. The underwater posture conversion unit 43 transfers the 25 substrates W1 (25 substrates W2) converted to the horizontal posture one by one to the belt conveyor 83 of the relay substrate transfer mechanism 81. The belt conveyor 83 transfers the one substrate W in the horizontal posture to the left to a position above the pin lifting unit 87. Then, the pin lifting unit 87 raises the one substrate W on the two belts 85 using the three lift pins PN.

[0150] [Step S06] First single chip processing

[0151] The substrate transport robot CR3 receives the wet substrate W lifted by the three lift pins PN of the pin lifter 87 using the first hand 91. Then, the substrate transport robot CR3 transports the substrate W received by the first hand 91 to one of the two first single wafer processing chambers SW1 of the two front towers TW1.

[0152] Each first single-wafer processing chamber SW1 holds the substrate W with the component surface facing upward in a horizontal posture by the holding and rotating unit 94 and rotates it, and supplies pure water to the component surface from the nozzle 95. Then, each first single-wafer processing chamber SW1 supplies IPA to the component surface (upper surface) of the substrate W from the nozzle 95, and the pure water on the substrate W is replaced by IPA.

[0153] [Step S07] Second single chip processing

[0154] The substrate W is processed in the first single-wafer processing chamber SW1 of the first single-wafer processing area R10. In this case, the substrate transport robot CR1 transports the substrate W replaced with IPA from the first single-wafer processing chamber SW1 of the first single-wafer processing area R10 to any one of the five second single-wafer processing chambers SW2 of the first single-wafer processing area R10. Similarly, the substrate W is processed in the first single-wafer processing chamber SW1 of the second single-wafer processing area R11. In this case, the substrate transport robot CR2 transports the substrate W replaced with IPA from the first single-wafer processing chamber SW1 of the second single-wafer processing area R11 to any one of the five second single-wafer processing chambers SW2 of the second single-wafer processing area R11.

[0155] Each second single-wafer processing chamber SW2 performs a drying process on one substrate W using carbon dioxide in a supercritical state (supercritical fluid). By performing the drying process using the supercritical fluid, pattern collapse on the pattern surface (device surface) of the substrate W is suppressed.

[0156] [Step S08] Place the substrate in the carrier

[0157] The substrate transport robot CR3 receives one substrate W1 from the second single-wafer processing chamber SW2 that has been subjected to drying processing using the second hand 91 of the two hands 91. Then, the substrate transport robot CR3 transports the substrate W1 received by the second hand 91 to the first carrier C mounted on the rack 89.

[0158] When 25 substrates W1 are stored in the first carrier C, the carrier transfer robot 16 transfers the first carrier C from the rack 89 to one of the two load ports 9. In addition, the carrier transfer robot 16 transfers the second carrier C (empty carrier) from the storage rack 15 to the rack 89 from which the first carrier C was transferred.

[0159] Similarly, the substrate transport robot CR3 receives one substrate W2 from the second single-wafer processing chamber SW2 that has been subjected to the drying process using the second hand 91. Then, the substrate transport robot CR3 transports the substrate W2 received by the second hand 91 to the second carrier C placed on the rack 89. When 25 substrates W2 are stored in the second carrier C, the carrier transport robot 16 transports the second carrier C from the rack 89 to one of the two load ports 9. The external transport mechanism (not shown) transports the two carriers C from the load port 9 to the next destination in sequence.

[0160] According to the present embodiment, the posture conversion area R5 of the interface device 5 is disposed on the opposite side of the processing block 21 having the four batch processing tanks BT1 to BT4 via the transfer block 19 of the batch processing device 3. For example, it is assumed that the length of the batch processing device 3 may change at the rear of the extended batch processing device 3 due to the increase or decrease in the number of batch processing tanks of the batch processing device 3. Even in this case, at least there is no need to change the configuration of the transfer block 19 of the batch processing device 3 and the interface device 5 (posture conversion area R5 and relay area R6). Therefore, the configuration of the batch processing device 3 and the single-wafer processing device 7 can be freely changed.

[0161] This effect will be supplemented. Fig. 10A FIG. 1 is a top view showing a substrate processing system 1 in which an interface device 5 is connected to the rear of a batch processing device 3 and a single-wafer processing device 7. In this case, for example, Fig. 10B As shown, Fig. 10A The batch processing device 3 (processing block 21) shown is lengthened at the rear. Fig. 10B As shown, the substrate transfer region R9 needs to be lengthened in the front-rear direction X.

[0162] In contrast, Fig.11A 1 is a top view showing the substrate processing system 1 of Example 1. In this case, for example, Fig. 11B As shown, Fig.11A The batch processing device 3 (processing block 21) shown is lengthened at the rear. Even with such a change, for example, the configuration of the transfer block 19 and the interface device 5 (posture conversion area R5 and relay area R6) does not need to be changed. In addition, the configuration of the delivery area R8 and the stacker device 2, and the positions of the two racks 18 and 89 also do not need to be changed. In addition, "no change is required" does not mean that the change is restricted.

[0163] Therefore, even if the batch processing device 3 is extended at the rear, the stacker device 2, the transfer block 19, the interface device 5, etc. can be used in their original state. Even if the single-wafer processing device 7 is extended at the rear, the same is true. Therefore, the configuration of the batch processing device 3 and the single-wafer processing device 7 can be freely changed (for example, a change in extension and contraction in the front-rear direction X).

[0164] In addition, since the posture conversion area R5 is arranged on the opposite side of the transfer block 19 through the processing block 21, it is possible to avoid the relay area R6 of the interface device 5 from intersecting with the batch substrate transfer area R3 when viewed from above. Therefore, it is possible to prevent the structure from becoming complicated. In addition, the single-wafer processing device 7 is arranged on the opposite side of the transfer block 19 through the batch substrate transfer area R3. Therefore, it is possible to suppress the size (in the form of the interface device 5) of blocking one side (front) of the transfer block 19 when viewed from above. Figure 3In the embodiment, the interface device 5 does not block the space between the rack 18 and the transfer block 19. In addition, for example, a large maintenance area can be ensured on the side opposite to the batch substrate transfer area R3 through the batch processing tank BT4.

[0165] In addition, the second posture conversion mechanism 41 includes: an underwater posture conversion unit 43 that converts the plurality of substrates W from the vertical posture to the horizontal posture; and a standby tank 45 that is provided between the transfer block 19 and the underwater posture conversion unit 43 and stores an immersion liquid for immersing the plurality of substrates W in the vertical posture. The second posture conversion mechanism 41 can immerse the plurality of substrates W in the vertical posture into the immersion liquid stored in the standby tank 45 while keeping the plurality of substrates W in standby.

[0166] In addition, the second batch transfer mechanism WTR2 includes, for example, a pair of chucks 47 and 48 in which a plurality of pairs of holding grooves 53A and 54A and a plurality of pairs of passing grooves 55A and 56A are alternately arranged. When a processed substrate group in which a plurality of substrates W1 and other plurality of substrates W2 are alternately arranged are immersed in the immersion liquid in the standby tank 45, the second batch transfer mechanism WTR2 uses the pair of chucks 47 and 48 to take out, for example, a plurality of substrates W1 from the processed substrate group, and transfers the taken-out plurality of substrates W1 to the underwater posture conversion unit 43.

[0167] The second batch transfer mechanism WTR2 can take out a plurality of substrates W1 (first substrate group) from a processing substrate group in which the plurality of substrates W1 (first substrate group) and other plurality of substrates W2 (second substrate group) are alternately arranged. The taken-out plurality of substrates W1 (first substrate group) are converted into a horizontal posture by the underwater posture conversion unit 43. In contrast, other plurality of substrates W2 (second substrate group) can be kept on standby while being immersed in the immersion liquid in the standby tank 45. Thus, it is possible to prevent other plurality of substrates W2 (second substrate group) from drying out while on standby. In addition, by taking out the plurality of substrates W1 (first substrate group), the spacing between the plurality of substrates W1 (first substrate group) and other plurality of substrates W2 (second substrate group) (the spacing between two adjacent substrates W1 (W2)) can be enlarged.

[0168] [Example 2]

[0169] Next, a second embodiment of the present invention will be described with reference to the drawings. Note that descriptions overlapping with those of the first embodiment will be omitted. Fig.12 It is a plan view showing a schematic structure of a substrate processing system 1 according to the second embodiment.

[0170] In the first embodiment, the stacker device 2 conveys the carrier C to the rack 18 adjacent to the batch processing device 3, and receives the carrier C from the rack 89 adjacent to the single-wafer processing device 7. In this regard, the stacker device 2 may not receive the carrier C from the rack 89. In other words, the stacker device 2 may not be able to approach the rack 89.

[0171] In the first embodiment, the single wafer processing apparatus 7 includes the first single wafer processing chamber SW1 and the second single wafer processing chamber SW2. In this regard, in the second embodiment, the single wafer processing apparatus 7 may include the first single wafer processing chamber SW1 instead of the second single wafer processing chamber SW2.

[0172] In the first embodiment, the substrate transport region R9 includes a substrate transport robot CR3 capable of transporting substrates W along the guide rails 101 in the front-rear direction X. In this regard, in the second embodiment, the substrate transport region R9 may include a shuttle mechanism 112 and a substrate transport robot CR4.

[0173] Reference Fig.12 The main area R1 of the stacker device 2 is not adjacent to the single-wafer processing device 7. In the second embodiment, the single-wafer processing block 90 of the single-wafer processing device 7 has a transfer area 113. In addition, the single-wafer processing device 7 has a plurality of (for example, two) racks 114. In addition, the rack 114 may be one. Each rack 114 is equivalent to the second carrier mounting rack of the present invention.

[0174] The transfer area 113 is adjacent to the front of the transfer area R8. In addition, two racks 114 are adjacent to the front of the transfer area 113. A transport path RT (refer to FIG. 1 ) of an external transport mechanism (e.g., OHT (Overhead Hoist Transport)) not shown in the figure is set in a certain section. Fig.12 ) is formed so as to extend linearly in the width direction Y. A plurality of load ports 9 and a plurality of racks 114 are arranged so as to overlap with the transport path RT in a plan view.

[0175] When the substrate handling mechanism HTR of the batch processing apparatus 3 takes out 25 substrates W from the carrier C placed on the rack 18, the carrier transport robot 16 transports the empty carrier C from the rack 18 to the load port 9. The external transport mechanism transports the empty carrier C from the load port 9 to the rack 114 along the transport path RT.

[0176] The transfer area 113 is equipped with a substrate transport robot CR5. The substrate transport robot CR5 is equipped with a hand 115, a multi-joint arm 117 and a lifting platform 119. The hand 115 holds a substrate W and is movable. The multi-joint arm 117 is, for example, a selective compliance assembly robot arm (SCARA: selective compliance assembly robot arm) type robot arm. The base end of the multi-joint arm 117 is mounted on the lifting platform 119 so as to be rotatable around a vertical axis. The hand 115 is mounted on the front end of the multi-joint arm 117. The multi-joint arm 117 and the lifting platform 119 are each driven by an electric motor. The substrate transport robot CR5 transports the substrate W from the substrate loading unit PS1 (described below) to the carrier C mounted on the rack 114.

[0177] The single substrate transfer region R9 includes a shuttle mechanism 112. The shuttle mechanism 112 is provided between the two substrate transfer robots CR4 and CR5. The shuttle mechanism 112 includes a substrate placement portion PS1, a guide rail 121, and an electric motor (not shown).

[0178] The substrate mounting portion PS1 is configured to mount a plurality of substrates W. Therefore, the substrate mounting portion PS1 includes a plurality of mounting plates (not shown) arranged along the vertical direction Z. In addition, the substrate mounting portion PS1 may be configured to mount only one substrate W. The guide rail 121 extends along the front-rear direction X. In addition, one end of the guide rail 121 extends to the transfer region R8. The substrate mounting portion PS1 can move along the guide rail 121.

[0179] The shuttle mechanism 112 moves the substrate mounting portion PS1 between the intermediate position P11, the processing side position P12, and the storage side position P13 by means of an electric motor. The intermediate position P11 is a position where the substrate transport robot CR6 described below can approach the substrate mounting portion PS1. The processing side position P12 is a position where the substrate transport robot CR4 can approach the substrate mounting portion PS1. The storage side position P13 is a position where the substrate transport robot CR5 can approach the substrate mounting portion PS1.

[0180] The first single-wafer processing region R10 does not have Figure 1 The substrate transfer robot CR1 shown in the figure includes a front tower TW1 and a rear tower TW2. Each of the front tower TW1 and the rear tower TW2 does not include a second single wafer processing chamber SW2, but includes three first single wafer processing chambers SW1 stacked in the vertical direction Z.

[0181] The second single-wafer processing region R11 does not have Figure 1The substrate transfer robot CR2 shown in the figure is provided with a front tower TW1 and a rear tower TW2. The front tower TW1 and the rear tower TW2 each do not have a second single-wafer processing chamber SW2, but have three first single-wafer processing chambers SW1 stacked in the vertical direction Z. Each of the 12 first single-wafer processing chambers SW1 of the two single-wafer substrate processing areas R10 and R11 processes one substrate W using, for example, pure water and IPA, and then spin-dries it.

[0182] In addition, the second single-substrate processing region R11 includes a substrate transfer robot CR6 provided between the relay region R6 and the front tower TW1. The substrate transfer robot CR6 is configured similarly to the substrate transfer robot CR1. The substrate transfer robot CR6 includes, for example, a movable hand portion 91. The substrate transfer robot CR6 transfers one substrate W from the belt conveyor 83 to the substrate placement portion PS1.

[0183] The substrate transport robot CR4 is surrounded by two front towers TW1 and two rear towers TW2. The substrate transport robot CR4 is provided with, for example, two hand parts 91, an advance and retreat part 92, and an elevation and rotation part 93, similarly to the substrate transport robot CR1. The substrate transport robot CR4 transports one substrate W between the twelve first single-wafer processing chambers SW1 and the substrate placement part PS1.

[0184] The operation of the single-wafer processing device 7 of this embodiment will be briefly described. The belt conveyor 83 of the relay substrate transport mechanism 81 transports a single substrate W in a horizontal position to a position above the pin lift 87. Then, the pin lift 87 lifts the single substrate W. The lifted substrate W is in a horizontal position, and its component surface is wet. The substrate transport robot CR6 of the second single-wafer substrate processing area R11 receives the single substrate W lifted by the pin lift 87. Then, the substrate transport robot CR6 transports the received substrate W to the substrate placement part PS1 that has moved to the intermediate position P11.

[0185] Then, the shuttle mechanism 112 moves the substrate mounting portion PS1 from the intermediate position P11 to the processing side position P12. The substrate transport robot CR4 of the single-wafer transport region R9 takes out a single substrate W in a horizontal posture from the substrate mounting portion PS1 using the first hand portion 91. Then, the substrate transport robot CR4 transports the taken-out substrate W to any one of the 12 first single-wafer processing chambers SW1.

[0186] Each first single-wafer processing chamber SW1 processes one substrate W in a horizontal position using pure water and IPA, and then dries one substrate W by spin drying. Then, the substrate transport robot CR4 receives one dried substrate W from the first single-wafer processing chamber SW1 that has been processing the single wafer using the second hand 91, and transports the received substrate W to the substrate mounting portion PS1.

[0187] Then, the shuttle mechanism 112 moves the substrate mounting portion PS1 from the processing side position P12 to the storage side position P13. The substrate transport robot CR5 in the transfer area 113 transports one dried substrate W from the substrate mounting portion PS1 to the carrier C mounted on the rack 114. When, for example, 25 substrates W are stored in the carrier C, the external transport mechanism (not shown) transports the carrier C storing the processed substrates W from the rack 114 to the next destination along the transport path RT.

[0188] According to this embodiment, Fig.12 The stacker device 2 shown is Figure 1 Even when the stacker device 2 shown is different, the substrate processing system 1 of this embodiment has the same effects as those of the first embodiment.

[0189] In addition, Fig.12 In the embodiment, the shuttle mechanism 112 and the three substrate transfer robots CR4, CR5, and CR6 transfer one substrate W between the belt conveyor 83 (relay substrate transfer mechanism 81), the twelve first single-wafer processing chambers SW1, and the carrier C placed on the rack 114. In this regard, at least one substrate transfer robot (e.g. Figure 1 The substrate transfer robot CR3 shown in the figure transfers one substrate W between the belt conveyor 83, the 12 first single-wafer processing chambers SW1, and the carrier C placed on the rack 114. In addition, the shuttle mechanism 112 and the three substrate transfer robots CR4, CR5, and CR6 are each equivalent to the horizontal substrate transfer robot of the present invention. In addition, part of the structure of the second embodiment can also be applied to the substrate processing system 1 of the first embodiment.

[0190] The present invention is not limited to the above-described embodiment, and can be implemented in various modifications as described below.

[0191] (1) In the above-described embodiments, the relay substrate transport mechanism 81 includes the belt conveyor 83. In this regard, the relay substrate transport mechanism 81 may also include Fig.13 The substrate transfer robot 131 and the substrate placement unit PS2 are shown. The substrate transfer robot 131 includes a relay hand portion 133 , an advance / retract portion 135 , a rotation portion 137 , and a horizontal movement portion 139 .

[0192] The relay hand 133 holds one substrate W in a horizontal position and can move. The advancing and retreating portion 135 advances and retreats the relay hand 133. The rotating portion 137 rotates the relay hand 133 and the advancing and retreating portion 135 around a vertical axis AX9 set in the rotating portion 137. The horizontal moving portion 139 moves the relay hand 133, the advancing and retreating portion 135, and the rotating portion 137 along the width direction Y. The advancing and retreating portion 135, the rotating portion 137, and the horizontal moving portion 139 are each driven by an electric motor. The substrate placement portion PS2 can place one or more substrates W.

[0193] The substrate placement unit PS2 is provided between the substrate transfer robot 131 and the delivery region R8. That is, the substrate placement unit PS2 is provided on the left side of the substrate transfer robot 131. In addition, in the case of this variation, it is also possible not to provide Figure 7B The horizontal push-out mechanism 75 is shown.

[0194] The operation of this variation will be described. The underwater posture conversion unit 43 converts, for example, 25 substrates W1 (the first substrate group) from a vertical posture to a horizontal posture. Then, the substrate transport robot 131 causes the relay hand 133 to enter the inside of the tank carrier 67 partially pulled up from the pure water in the posture conversion tank 69, and uses the relay hand 133 to take out one substrate W1 from the tank carrier 67 of the underwater posture conversion unit 43.

[0195] Then, the rotation unit 137 rotates the relay hand 133 around the vertical axis AX9 to change the direction of the relay hand 133 from the in-tank carrier 67 (underwater posture conversion unit 43) to the substrate mounting unit PS2. The substrate transfer robot 131 transfers the taken-out substrate W1 to the substrate mounting unit PS2 by causing the substrate mounting unit PS2 to enter the relay hand 133 facing the substrate mounting unit PS2. Then, the substrate transfer robot CR3 takes out the substrate W from the substrate mounting unit PS2 and transfers it to one of the two first single-wafer processing chambers SW1 of the two front towers TW1.

[0196] (2) In each of the above-mentioned embodiments, the second posture conversion mechanism 41 includes an underwater posture conversion unit 43, a spare tank 45, and a second batch transfer mechanism WTR2. In this regard, the second posture conversion mechanism 41 may also include a multi-joint robot (posture conversion unit) and a spare tank 45. In this case, the multi-joint robot includes a hand portion that holds a substrate W and can move. The multi-joint robot uses the hand portion to take out a substrate W in a vertical posture from the lifter LF7 of the spare tank 45, and converts the taken-out substrate W into a horizontal posture. Then, the multi-joint robot may also transfer the substrate W in a horizontal posture to the relay substrate transfer mechanism 81. In addition, the multi-joint robot may also include a plurality of hand portions.

[0197] (3) In the above-described embodiments, the second posture conversion mechanism 41 includes the backup groove 45, but may not include the backup groove 45 (see Fig.14 In this case, the batch transport mechanism WTR1 directly transports the 25 substrates W processed by the batch processing device 3 to the underwater posture conversion unit 43. Fig.15A As shown, the pusher 73A of the underwater posture conversion unit 43 receives 25 substrates W arranged in the width direction Y from the batch transfer mechanism WTR1 in a vertical posture.

[0198] The propeller mechanism 73 of the underwater posture conversion unit 43 rotates the propeller 73A holding the 25 substrates W by 90 degrees around the vertical axis AX7. Fig. 15B As shown, the pusher mechanism 73 arranges the 25 substrates W in the front-rear direction X. Then, the underwater posture conversion unit 43 rotates the 25 substrates W around the horizontal axis AX6 extending in the width direction Y, thereby making the 25 substrates W in a horizontal posture (see Figure 6C ).

[0199] like Fig.14 , Fig.15A , Fig. 15B As shown, the relay substrate transfer mechanism 81, for example, a substrate transfer robot 131 receives a substrate W from the underwater posture conversion unit 43 using a relay hand 133, and transfers the substrate W to the substrate placement unit PS2 on the interface device 5 side. Alternatively, the relay substrate transfer mechanism 81 may be a belt conveyor 83.

[0200] (4) In the above-mentioned embodiments, the posture conversion unit of the second posture conversion mechanism 41 may be configured as follows. That is, the posture conversion unit includes a substrate storage unit (e.g., a tank carrier 67) for storing a plurality of substrates. The substrate storage unit can rotate around a horizontal axis AX6 parallel to each element surface of the plurality of substrates W. The horizontal axis AX6 extends in the rear, front-back direction X, or the width direction Y.

[0201] (5) In the above-described embodiments and variations, the transfer block 19 includes the substrate handling mechanism HTR, the posture conversion unit 31, and the pusher 33A. In this regard, the transfer block 19 may include the substrate handling mechanism HTR and the pusher 33A instead of the posture conversion unit 31. That is, the substrate handling mechanism HTR may include the posture conversion unit 31 (function of the posture conversion unit 31).

[0202] In this case, the substrate handling mechanism HTR includes a multi-joint robot. The multi-joint robot takes out a plurality of (e.g., 5) substrates W from a carrier and converts the plurality of substrates W from a horizontal posture to a vertical posture. Then, the multi-joint robot arranges the plurality of substrates W in the vertical posture on the pusher 33A.

[0203] (6) In the first embodiment and each variation, the two single-wafer processing areas R10 and R11 each include six single-wafer processing chambers (first single-wafer processing chamber SW1 and second single-wafer processing chamber SW2). In this regard, the two single-wafer processing areas R10 and R11 each may include six first single-wafer processing chambers SW1 instead of the second single-wafer processing chamber SW2. In this case, each of the six first single-wafer processing chambers SW1 may process one substrate W using pure water and IPA, and then spin-dry it. In addition, in the case of this variation, the two substrate transfer robots CR1 and CR2 may not be provided.

[0204] (7) In the first embodiment and the various variations, the substrate transport robot CR3 transports one substrate W in a horizontal position between the relay substrate transport mechanism 81, the 12 single-wafer processing chambers (the first single-wafer processing chamber SW1 and the second single-wafer processing chamber SW2), and the carrier C placed on the rack 89. The substrate transport may be shared by a plurality of substrate transport robots. One substrate W may be directly transferred between two substrate transport robots. Alternatively, one substrate W may be transferred via a substrate placement unit.

[0205] (8) In the above-described embodiments and modifications, at least one of the six substrate transfer robots CR1 to CR6 may move the hand portion 91 using a multi-joint arm.

[0206] (9) In the above-described embodiments and variations, for example, the batch processing tank BT1 performs immersion processing on 50 substrates W arranged alternately with 25 substrates W1 and 25 substrates W2. The 50 substrates W (W1, W2) are arranged at a half pitch (e.g., 5 mm). In this regard, the batch processing tank BT1 may perform immersion processing on 25 substrates W arranged at a full pitch (e.g., 10 mm) at a time.

[0207] (10) In the above-mentioned embodiments and variations, for example, the batch processing tank BT1 performs immersion processing on a processing substrate group, i.e., 50 substrates W. Among the 50 substrates W (W1, W2), when the component surfaces of the 25 substrates W1 of the first substrate group face rightward, the component surfaces of the 25 substrates W2 of the second substrate group may face leftward. In addition, when the component surfaces of the 25 substrates W1 of the first substrate group face rightward, the component surfaces of the 25 substrates W2 of the second substrate group may face rightward.

[0208] The present invention may be implemented in other specific forms without departing from the spirit or essence thereof. Therefore, reference should be made to the appended claims rather than the above description to indicate the scope of the invention.

[0209] Explanation of symbols

[0210] 1: Substrate processing system

[0211] 2: Stacker device

[0212] 3: Batch processing device

[0213] 5: Interface device

[0214] 7: Single-chip processing device

[0215] 9: Load port

[0216] 16: Carrier transport robot

[0217] 18, 89, 114: rack

[0218] 19: Move block

[0219] 21: Processing blocks

[0220] HTR: Substrate Handling Mechanism

[0221] 23: First posture conversion mechanism

[0222] 25: Hand shape department

[0223] 33A: Thruster

[0224] BT1~BT4: Batch processing tank

[0225] WTR1: Bulk transport agency

[0226] 41: Second posture conversion mechanism

[0227] 43: Underwater posture conversion unit

[0228] 45: Spare slot

[0229] WTR2: Second batch transport mechanism

[0230] 51: Guide rail

[0231] 53A, 54A, 53B, 54B: Retaining groove

[0232] 55A, 56A, 55B, 56B: Through slot

[0233] 81: Relay substrate transport mechanism

[0234] 83: Belt conveyor

[0235] 90: Single chip processing block

[0236] CR1~CR6: Substrate transfer robot

[0237] 110: Control Department

[0238] 112: Shuttle mechanism

[0239] 131: Substrate transport robot

[0240] R3: Batch substrate transfer area

[0241] R5: Posture Transition Area

[0242] R6: Relay zone.

Claims

1. A substrate processing system, characterized in that The invention comprises: a batch processing device for processing a plurality of substrates at once, a single-wafer processing device for processing the plurality of substrates one by one, and an interface device for connecting the batch processing device and the single-wafer processing device, and The batch processing device extends along a first horizontal direction, The single-wafer processing device is arranged opposite to the batch processing device in a manner of being arranged in a second horizontal direction orthogonal to the first horizontal direction. The interface device is adjacent to one end side of each of the batch processing device and the single-wafer processing device, and is arranged in a manner extending along the second horizontal direction. The batch processing device comprises: A first carrier loading rack for loading carriers, the carriers being used to store the plurality of substrates in a horizontal position at predetermined intervals; A transfer block, adjacent to the first carrier rack; a batch processing block, adjacent to the transfer block and extending along the first horizontal direction; as well as A batch substrate transfer area is arranged adjacent to the transfer block and the batch processing block on the side where the single-wafer processing device is arranged, and one end side extends to the interface device and the other end side extends along the first horizontal direction; The transfer block includes a substrate operation mechanism and a first posture conversion mechanism. The substrate handling mechanism takes out the plurality of substrates in a horizontal posture from the carrier mounted on the first carrier mounting frame, The first posture conversion mechanism comprises: A first posture conversion unit converts the plurality of substrates received from the substrate handling mechanism from a horizontal posture to a vertical posture; as well as a vertical holding section for holding the plurality of substrates converted into a vertical posture by the first posture conversion section; The batch processing block includes a plurality of batch processing tanks, which are arranged side by side in the first horizontal direction and each of which stores a processing liquid for immersing the plurality of substrates. The batch substrate transfer area includes a first batch transfer mechanism, and the first batch transfer mechanism transfers the plurality of substrates in a vertical posture between the plurality of batch processing tanks, the vertical holding portion, and the interface device. The interface device includes a posture conversion area and a relay area, wherein the posture conversion area is arranged on the opposite side of the batch processing block across the transfer block, and the relay area is adjacent to the posture conversion area and extends along the second horizontal direction. The posture conversion area includes a second posture conversion mechanism, and the second posture conversion mechanism converts the plurality of substrates processed by the batch processing device from a vertical posture to a horizontal posture. The relay area includes a relay substrate transfer mechanism, and the relay substrate transfer mechanism transfers the plurality of substrates converted into a horizontal posture by the second posture conversion mechanism to the single-wafer processing device. The single-chip processing device comprises: a second carrier mounting frame for mounting the carrier; and a single-wafer processing block, adjacent to the second carrier rack; The single-chip processing block has: A plurality of single-wafer processing chambers for performing designated processing on the plurality of substrates processed by the batch processing device one by one; as well as a horizontal substrate transport robot, receiving the substrate transported by the relay substrate transport mechanism, and transporting the received substrate to one of the plurality of single-wafer processing chambers; The horizontal substrate transfer robot stores a substrate processed in one of the plurality of single-wafer processing chambers in the carrier mounted on the second carrier mounting shelf.

2. The substrate processing system according to claim 1, characterized in that: The second posture conversion mechanism comprises: A second posture conversion unit converts the plurality of substrates from a vertical posture to a horizontal posture; and The backup tank is provided between the transfer block and the second posture conversion unit and stores an immersion liquid for immersing the plurality of substrates in a vertical posture.

3. The substrate processing system according to claim 2, characterized in that: The second posture conversion mechanism further comprises a second batch conveying mechanism. The second batch transfer mechanism includes a guide rail disposed on the opposite side of the batch substrate transfer area through the spare slot. The second batch transfer mechanism transfers the plurality of substrates from the backup tank to the second posture conversion unit in a vertical posture along the guide rail. The first batch transfer mechanism transfers the plurality of substrates in a vertical posture between the plurality of batch processing tanks, the vertical holding portion, and the spare tank.

4. The substrate processing system according to claim 3, characterized in that: The second batch conveying mechanism comprises a pair of chucks alternately arranged with a plurality of pairs of holding grooves and a plurality of pairs of passing grooves. When a processing substrate group in which the plurality of substrates are alternately arranged with other plurality of substrates is immersed in the immersion liquid in the standby tank, the second batch transfer mechanism uses the pair of chucks to take out the plurality of substrates from the processing substrate group and transfers the taken-out plurality of substrates to the posture conversion unit.

5. The substrate processing system according to any one of claims 1 to 4, characterized in that: Also provided is a stacker device adjacent to the batch processing device and the interface device, The stacker device comprises: a load port for loading and unloading the carrier; and The carrier transport robot transports the carrier at least between the load port and the first carrier mounting rack.

6. The substrate processing system according to any one of claims 1 to 4, characterized in that: The relay substrate transport mechanism includes a belt conveyor.

7. The substrate processing system according to any one of claims 1 to 4, characterized in that: The relay substrate transfer mechanism includes a relay hand portion that holds one substrate and is movable.

8. The substrate processing system according to any one of claims 1 to 4, characterized in that: The substrate handling mechanism includes a plurality of hand portions, and the plurality of hand portions respectively hold the plurality of substrates and are movable in an integrated manner.

Images