Semiconductor device assembly equipment and assembly method
By designing a semiconductor device assembly equipment that integrates servo hydraulic cylinders, servo motors and servo asynchronous motors, the problem of slow production speed of existing equipment is solved, efficient loading and cleaning is achieved, and production efficiency and energy-saving effects are improved.
Patent Information
- Application Number
- CN202411735874.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-29
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2044-11-29
AI Technical Summary
The production speed of existing semiconductor device assembly equipment is limited in some links, making it difficult to efficiently load and clean, affecting production efficiency.
A semiconductor device assembly equipment is designed, using a feeding assembly composed of servo hydraulic cylinder, hydraulic rod, pallet, fixing frame and limit rod. It is combined with a servo motor and cleaning roller to achieve electrostatic adsorption and dust removal cleaning on the inside of the fan part, and efficient mobile assembly of semiconductor components and protective components is achieved through servo asynchronous motors and electric push rods.
It improves the production efficiency of assembly equipment, realizes a more efficient loading and cleaning process, reduces the interval time for cleaning roller replacement, and reduces energy consumption.
Smart Images

Figure CN119230456B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of semiconductor devices, and in particular to a semiconductor device assembly device and an assembly method. Background Art
[0002] With the rapid development of electronic technology, semiconductor devices are increasingly used in various fields. Semiconductor device assembly equipment is a key equipment used to assemble semiconductor chips and other components into complete semiconductor devices. In the traditional semiconductor device assembly process, multiple steps are usually required, including chip picking, wire bonding, packaging, etc. In order to improve production efficiency and product quality, semiconductor device assembly equipment is constantly undergoing technical improvements and innovations. The market demand for semiconductor devices continues to grow, and higher requirements are placed on production efficiency. However, the production speed of existing assembly equipment is still limited in some links, and it is not possible to load materials well and clean them more energy-efficiently, which affects production efficiency. In view of this, we propose a semiconductor device assembly equipment and assembly method. Summary of the invention
[0003] The object of the present invention is to provide a semiconductor device assembly equipment and an assembly method to solve the problems raised in the above background technology.
[0004] To achieve the above object, the present invention provides the following technical solutions:
[0005] A semiconductor device assembly device comprises a body, a controller is fixedly installed on the outside of the body, a cabinet door is hingedly installed on the front end of the body, a partition is fixedly installed inside the body, a fan component is fixedly installed inside the side wall of the body, and a loading assembly is arranged inside the body, and the loading assembly comprises:
[0006] A servo hydraulic cylinder, a servo hydraulic cylinder is fixedly installed on the bottom surface of the body, a hydraulic rod is slidably installed inside the servo hydraulic cylinder, the top of the hydraulic rod is fixedly connected to the bottom center of the support plate, a fixing frame is fixedly installed on the top of the support plate, two groups of the fixing frames are provided, and semiconductor elements and protective elements are respectively provided inside the two groups of the fixing frames;
[0007] An operating table is fixedly installed at the center of the top of the partition, the outer side of the hydraulic rod is fixedly connected to one end of the U-shaped frame, and a servo motor is fixedly installed at the other end of the U-shaped frame;
[0008] A rotating shaft is rotatably mounted on the output shaft of the servo motor, a cleaning roller is clamped on the outer side of the rotating shaft, and the outer side of the cleaning roller rolls and fits against the inner outer wall of the fan component.
[0009] Preferably, the cabinet doors are provided in multiple groups and are located at the upper and lower ends of the partition, and the fan component, servo hydraulic cylinder and servo motor are all electrically connected to the controller.
[0010] Preferably, the rotating shaft and cleaning roller are provided in multiple groups, and the multiple groups of rotating shafts and cleaning rollers are arranged in a circular array with equal spacing around the center of the circular cross-section of the servo motor output shaft, thereby achieving a better cleaning effect and improving production efficiency.
[0011] Preferably, an auxiliary component is provided on the outside of the servo hydraulic cylinder, and the auxiliary component includes a pressing rod, the pressing rod is fixedly installed on the bottom end of the U-shaped frame, and a push-type switch is fixedly installed on the outside of the top end of the servo hydraulic cylinder. The pressing rod is located directly above the push-type switch, and the push-type switch is electrically connected to the controller.
[0012] Preferably, a control component is provided inside the machine body, and the control component includes a long strip, one end of the long strip is fixedly installed on the bottom of the support plate, a spring rod is fixedly installed on the top of the other end of the long strip, a through hole is opened in the center of the bottom end of the fixed frame, the spring rod passes through the through hole, a short rod is fixedly installed on the top of the spring rod, and a disc is fixedly installed on the top of the short rod, and the contact area is larger when combined with the disc.
[0013] Preferably, an upper rod is fixedly installed on the top side wall of the spring rod, a movable electrode sheet is fixedly installed on the bottom end of the upper rod, a lower rod is fixedly installed on the top of one end of the long strip close to the spring rod, a fixed electrode sheet is fixedly installed on the top of the lower rod, and the movable electrode sheet is located directly above the fixed electrode sheet, so that the two can fit smoothly.
[0014] Preferably, the long strips, spring rods, through holes, short rods, disks, upper rods, movable electrode sheets, lower rods and fixed electrode sheets are provided in two groups, and the two groups of the long strips, spring rods, through holes, short rods, disks, upper rods, movable electrode sheets, lower rods and fixed electrode sheets are mirrored at both ends of the support plate with the horizontal midline of the support plate as the mirror axis, and the two groups of the disks are respectively attached to the bottom of the semiconductor element and the protective element.
[0015] Preferably, a moving component is provided at the top of the partition, and the moving component includes a servo asynchronous motor, a servo asynchronous motor and a fixed block are fixedly installed on the top of the partition, and the fixed block is provided in two groups, and a vertical screw is fixedly installed on the output end of the servo asynchronous motor, and the vertical screw is rotatably installed between the two groups of fixed blocks, and a vertical threaded block is threadedly installed on the outer side of the vertical screw, and a wheel frame is fixedly installed on the side wall of the vertical threaded block, and a roller is rotatably installed inside the wheel frame, and a limiting track is fixedly installed on the top of the partition, and the roller is rotatably installed inside the limiting track, and the wheel frame, roller and limiting track are provided in two groups, and the two groups of wheel frames are respectively fixedly installed on the two ends of the bottom of the L-shaped plate, and cooperate with the roller and the limiting track to constrain the movement direction of the vertical threaded block.
[0016] Preferably, a servo asynchronous motor and a vertical block are fixedly installed on the inner side of the L-shaped plate, the vertical blocks are provided with two groups, and a transverse screw rod is rotatably installed between the two groups of vertical blocks, the output end of the servo asynchronous motor is fixedly connected to the outer side of the transverse screw rod, a transverse threaded block is threadedly installed on the outer side of the transverse screw rod, a slider is fixedly installed on the top of the transverse threaded block, a slide rail is fixedly installed on the inner side of the L-shaped plate, the slider is slidably installed on the outer side of the slide rail, and the movement direction of the transverse thread block can be constrained by cooperating with the slider and the slide rail, one end of the horizontal plate is fixedly installed on the outer side of the transverse threaded block, an electric push rod is fixedly installed inside the other end of the horizontal plate, an electromagnetic suction cup is fixedly installed on the outer side of the piston end of the bottom end of the electric push rod, and the servo asynchronous motor, servo asynchronous motor, electric push rod and electromagnetic suction cup are all electrically connected to the controller.
[0017] The present invention also provides an assembly method of the semiconductor device assembly equipment as described above, comprising the following steps:
[0018] S1. Cooperate with the controller, servo hydraulic cylinder, hydraulic rod, support plate, fixing frame and limit rod to lift the semiconductor components and protective components to the top of the partition;
[0019] S2. When the hydraulic rod moves up and down, it cooperates with the U-shaped frame to drive the servo motor to move synchronously, thereby cooperating with the rotating shaft and the cleaning roller to electrostatically absorb and remove dust from the inside of the fan parts;
[0020] S3, when the U-shaped frame moves up and down, the pressing rod will contact the pressing switch, thereby controlling the servo motor to rotate step by step, thereby improving the cleaning effect;
[0021] S4, cooperate with the servo asynchronous motor to make the vertical screw rod rotate inside the fixed block, so as to cooperate with the vertical threaded block, wheel frame, roller and limit rail to make the L-shaped plate move forward and backward;
[0022] S5. Cooperate with the servo asynchronous motor to make the horizontal screw rod rotate inside the vertical block, so as to cooperate with the horizontal thread block, the slide rail, the slider, the horizontal plate, the electric push rod and the electromagnetic chuck to move the semiconductor component and the protective component to the operating table for assembly;
[0023] S6. After the assembly is completed, there are no semiconductor components and protective components on the inner side of the fixing frame, so that the long strip blocks can be used to restore the spring rod from the compressed state, so that the through holes, short rods, discs, upper rods and lower rods can be used to move the moving electrode sheet away from the fixed electrode sheet, so that the fan component stops running, thereby saving more energy.
[0024] Compared with the prior art, the present invention provides a semiconductor device assembly device and an assembly method, which have the following beneficial effects:
[0025] 1. In order to better carry out assembly and loading, the semiconductor device assembly equipment and assembly method are provided with a loading assembly, which cooperates with a controller, a servo hydraulic cylinder, a hydraulic rod, a support plate, a fixing frame and a limit rod to lift the semiconductor element and the protective element to the top of the partition. When the hydraulic rod moves up and down, it cooperates with the U-shaped frame to drive the servo motor to move synchronously, thereby cooperating with the rotating shaft and the cleaning roller to electrostatically adsorb and remove dust from the inner side of the fan part, thereby better carrying out assembly and loading.
[0026] 2. In order to improve the cleaning effect and achieve a better assembly effect, the semiconductor device assembly equipment and assembly method are provided with auxiliary components. When the U-shaped frame moves downward, the pressing rod moves downward to resist the pressing switch, thereby cooperating with the controller to control the servo motor to rotate step by step, thereby making full use of multiple groups of cleaning rollers, reducing the interval time for replacing the cleaning rollers, and improving the cleaning effect.
[0027] 3. In order to be more energy-efficient, the semiconductor device assembly equipment and assembly method are provided with a control component. When the assembly is completed, there are no more semiconductor components and protective components on the inner side of the fixed frame, so that the long strip blocks can be used to restore the spring rod from the compressed state, so that the through holes, short rods, discs, upper rods and lower rods can be used to move the movable electrode sheet away from the fixed electrode sheet, so that the controller can be used to stop the fan component from running, thereby achieving more energy conservation.
[0028] 4. In order to make the device body more practical, the semiconductor device assembly equipment and assembly method are provided with a moving component, which cooperates with a servo asynchronous motor to make the vertical screw rotate inside the fixed block, thereby cooperating with the vertical threaded block, the wheel frame, the roller and the limit rail to move the L-shaped plate back and forth, and cooperates with the servo asynchronous motor to make the transverse screw rotate inside the vertical block, thereby cooperating with the transverse threaded block, the slide rail, the slider, the horizontal plate, the electric push rod and the electromagnetic suction cup to move the semiconductor element and the protective element to the operating table for assembly, thereby making the device body more practical. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] Figure 1 It is a schematic top view of the overall structure of the present invention;
[0030] Figure 2 It is a schematic top view of the overall structure of the present invention from another viewing angle;
[0031] Figure 3 It is a bottom view schematic diagram of a part of the structure of the present invention;
[0032] Figure 4 It is a schematic top view of part of the structure of the present invention;
[0033] Figure 5 It is a schematic cross-sectional view of the machine body of the present invention;
[0034] Figure 6 For the present invention Figure 5 A schematic diagram of the enlarged structure of the middle A area;
[0035] Figure 7 For the present invention Figure 5 Schematic diagram of the enlarged structure of the middle B area;
[0036] Figure 8 It is a bottom view schematic diagram of the machine body and some structures of the present invention;
[0037] Fig. 9 For the present invention Figure 8 Schematic diagram of the enlarged structure of the middle C area;
[0038] Fig.10 For the present invention Fig. 9 Schematic diagram of the enlarged structure of the middle D area;
[0039] Fig.11 It is a cross-sectional schematic diagram of the servo hydraulic cylinder of the present invention;
[0040] Fig.12 It is a schematic diagram of the explosion of part of the structure of the present invention;
[0041] Fig.13 The figure is a flow chart of the method of the present invention.
[0042] In the figure: 1, machine body; 2, controller; 3, cabinet door; 4, partition; 5, fan part; 6, feeding assembly; 61, servo hydraulic cylinder; 62, hydraulic rod; 63, support plate; 64, fixed frame; 65, limit rod; 66, semiconductor element; 67, protective element; 68, operating table; 69, U-shaped frame; 610, servo motor; 611, rotating shaft; 612, cleaning roller; 7, auxiliary assembly; 71, pressing rod; 72, pressing switch; 8, control assembly; 81, long strip; 82, spring rod; 83, through hole; 84, short Rod; 85, disc; 86, upper rod; 87, moving electrode sheet; 88, lower rod; 89, fixed electrode sheet; 9, moving assembly; 91, servo asynchronous motor; 92, fixed block; 93, vertical screw rod; 94, vertical threaded block; 95, L-shaped plate; 96, wheel frame; 97, roller; 98, limit track; 99, servo asynchronous motor; 910, vertical block; 911, horizontal screw rod; 912, horizontal threaded block; 913, slide rail; 914, slider; 915, horizontal plate; 916, electric push rod; 917, electromagnetic suction cup. DETAILED DESCRIPTION
[0043] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0044] See also Figure 1-Figure 13 The present invention provides a technical solution: a semiconductor device assembly device, including a body 1, a controller 2 is fixedly installed on the outside of the body 1, a cabinet door 3 is hingedly installed on the front end of the body 1, and in addition, two groups of cabinet doors 3 are provided, and are located at the upper and lower ends of a partition 4, a partition 4 is fixedly installed inside the body 1, and a fan component 5 is fixedly installed inside the side wall of the body 1.
[0045] In one embodiment of the present invention, a feeding assembly 6 is provided inside the machine body 1, and the feeding assembly 6 includes a servo hydraulic cylinder 61, and the servo hydraulic cylinder 61 is fixedly installed on the bottom surface of the machine body 1, and a hydraulic rod 62 is slidably installed inside the servo hydraulic cylinder 61, and the top of the hydraulic rod 62 is fixedly connected to the bottom center of the support plate 63, and a fixed frame 64 is fixedly installed on the top of the support plate 63. The fixed frame 64 is provided with two groups, and the inner sides of the two groups of fixed frames 64 are respectively provided with semiconductor elements 66 and protective elements 67, and an operating table 68 is fixedly installed at the top center of the partition 4, and the outer side of the hydraulic rod 62 is fixedly connected to one end of a U-shaped frame 69, and the U-shaped A servo motor 610 is fixedly installed at the other end of the frame 69, and the fan component 5, the servo hydraulic cylinder 61 and the servo motor 610 are all electrically connected to the controller 2. A rotating shaft 611 is rotatably installed on the output shaft of the servo motor 610, and a cleaning roller 612 is clamped on the outer side of the rotating shaft 611. The outer side of the cleaning roller 612 rolls and fits against the inner outer wall of the fan component 5. In addition, three groups of rotating shafts 611 and cleaning rollers 612 are provided, and the three groups of rotating shafts 611 and cleaning rollers 612 are arranged in a circular array with equal spacing around the center of the circular cross-section of the output shaft of the servo motor 610, thereby achieving a better cleaning effect and improving production efficiency.
[0046] In one embodiment of the present invention, an auxiliary component 7 is provided on the outside of the servo hydraulic cylinder 61, and the auxiliary component 7 includes a pressing rod 71. The pressing rod 71 is fixedly installed on the bottom end of the U-shaped frame 69, and a push switch 72 is fixedly installed on the outside of the top end of the servo hydraulic cylinder 61. The pressing rod 71 is located directly above the push switch 72, and the push switch 72 is electrically connected to the controller 2.
[0047] In one embodiment of the present invention, a control component 8 is provided inside the machine body 1, and the control component 8 includes a long strip block 81, one end of the long strip block 81 is fixedly installed at the bottom of the support plate 63, and a spring rod 82 is fixedly installed on the top of the other end of the long strip block 81, and a through hole 83 is provided at the center of the bottom end of the fixing frame 64, and the spring rod 82 passes through the through hole 83, and a short rod 84 is fixedly installed on the top of the spring rod 82, and a disc 85 is fixedly installed on the top of the short rod 84, and the contact area is larger with the disc 85. In addition, an upper rod 86 is fixedly installed on the side wall of the top end of the spring rod 82, and a movable electrode sheet 87 is fixedly installed on the bottom end of the upper rod 86, and a lower rod 88 is fixedly installed on the top of one end of the long strip block 81 close to the spring rod 82, and a lower rod 88 is fixedly installed on the top of the lower rod 88. The fixed electrode sheet 89 and the movable electrode sheet 87 are located directly above the fixed electrode sheet 89, so that the two can fit together smoothly. In addition, two groups of long strips 81, spring rods 82, through holes 83, short rods 84, disks 85, upper rods 86, movable electrode sheets 87, lower rods 88 and fixed electrode sheets 89 are provided, and the two groups of long strips 81, spring rods 82, through holes 83, short rods 84, disks 85, upper rods 86, movable electrode sheets 87, lower rods 88 and fixed electrode sheets 89 are all mirrored at both ends of the support plate 63 with the horizontal midline of the support plate 63 as the mirror axis, and the two groups of disks 85 are respectively fitted to the bottom of the semiconductor element 66 and the protective element 67, and the two groups of movable electrode sheets 87 and fixed electrode sheets 89 are in a circuit parallel relationship.
[0048] In one embodiment of the present invention, a moving component 9 is provided at the top of the partition 4, and the moving component 9 includes a servo asynchronous motor 91. The servo asynchronous motor 91 and a fixed block 92 are fixedly installed on the top of the partition 4. The fixed block 92 is provided with two groups. A vertical screw rod 93 is fixedly installed at the output end of the servo asynchronous motor 91. The vertical screw rod 93 is rotatably installed between the two groups of fixed blocks 92. A vertical threaded block 94 is threadedly installed on the outer side of the vertical screw rod 93. A wheel frame 96 is fixedly installed on the side wall of the vertical threaded block 94. A roller 97 is rotatably installed inside the wheel frame 96. A limited track 98 is fixedly installed on the top of the partition 4. The roller 97 is rotatably installed inside the limited track 98. Two groups of wheel frames 96, rollers 97 and limited track 98 are provided. The two groups of wheel frames 96 are respectively fixedly installed at the two ends of the bottom of the L-shaped plate 95, and the rollers 97 and the limited track 98 can constrain the movement direction of the vertical threaded block 94. In addition, a servo is fixedly installed on the inner side of the L-shaped plate 95. The servo asynchronous motor 99 and the vertical block 910 are provided with two groups of vertical blocks 910, and a transverse screw rod 911 is rotatably installed between the two groups of vertical blocks 910. The output end of the servo asynchronous motor 99 is fixedly connected to the outer side of the transverse screw rod 911, and a transverse thread block 912 is threadedly installed on the outer side of the transverse screw rod 911. A slider 914 is fixedly installed on the top of the transverse thread block 912. A slide rail 913 is fixedly installed on the inner side of the L-shaped plate 95. The slider 914 is slidably installed on the outer side of the slide rail 913, and the slider 914 and the slide rail 913 can constrain the movement direction of the transverse thread block 912. One end of a horizontal plate 915 is fixedly installed on the outer side of the transverse thread block 912, and an electric push rod 916 is fixedly installed inside the other end of the horizontal plate 915. An electromagnetic suction cup 917 is fixedly installed on the outer side of the piston end at the bottom of the electric push rod 916. The servo asynchronous motor 91, the servo asynchronous motor 99, the electric push rod 916 and the electromagnetic suction cup 917 are all electrically connected to the controller 2.
[0049] The present invention also provides an assembly method for semiconductor device assembly equipment, comprising the following steps:
[0050] S1, cooperate with the controller 2 to start the servo hydraulic cylinder 61, so that the hydraulic rod 62 extends to drive the support plate 63 to move upward, so that the fixing frame 64 and the limit rod 65 move synchronously, and cooperate with the limit rod 65 to better position, so as to lift the semiconductor element 66 and the protective element 67 to the top of the partition 4, so that it is better to load the materials conveniently without opening the cabinet door 3 of the operating space at the top of the partition 4;
[0051] S2. When the hydraulic rod 62 moves up and down, it drives the U-shaped frame 69 to move synchronously, thereby driving the servo motor 610 to move synchronously, thereby cooperating with the rotating shaft 611 to make the cleaning roller 612 rotate, so that the cleaning roller 612 can electrostatically absorb and clean the inner side of the fan part 5;
[0052] S3, when the U-shaped frame 69 moves downward, the pressing rod 71 moves downward to contact the pressing switch 72, thereby cooperating with the controller 2 to control the servo motor 610 to rotate step by step, thereby making full use of multiple groups of cleaning rollers 612, shortening the interval time for replacing the cleaning rollers 612, and improving the cleaning effect;
[0053] S4, cooperate with the controller 2 to start the servo asynchronous motor 91, so that the vertical screw rod 93 rotates inside the fixed block 92, so that the vertical threaded block 94 moves, and cooperate with the wheel frame 96 to make the roller 97 move synchronously on the limit track 98, so that the L-shaped plate 95 moves forward and backward;
[0054] S5, cooperate with the controller 2 to start the servo asynchronous motor 99, so that the horizontal screw rod 911 rotates inside the vertical block 910, so that the horizontal threaded block 912 moves, and the slider 914 slides synchronously inside the slide rail 913, so as to cooperate with the horizontal plate 915, the electric push rod 916 and the electromagnetic suction cup 917 to move the semiconductor element 66 and the protective element 67 to the operating table 68 for assembly (a single semiconductor element 66 and a single protective element 67 are stacked together for bonding and packaging, and then taken away by the material taking mechanism. Since this is an existing device in the prior art, it will not be described here);
[0055] S6. After the assembly is completed, there are no semiconductor elements 66 and protective elements 67 on the inner side of the fixing frame 64, so that the long strip 81 cooperates with the spring rod 82 to restore its deformation from the compressed state, so that the through hole 83, the short rod 84, the disc 85, the upper rod 86 and the lower rod 88 cooperate to make the movable electrode sheet 87 move away from the fixed electrode sheet 89, so that the controller 2 cooperates with the fan component 5 to stop running, thereby saving more energy.
[0056] The above generally describes the present invention in detail, but it is obvious to a person skilled in the art that some modifications or improvements can be made to the present invention. Therefore, modifications or improvements that do not depart from the spirit of the present invention are within the scope of protection of the present invention.
Claims
1. A semiconductor device assembly device, comprising a body (1), a controller (2) fixedly mounted on the outside of the body (1), a cabinet door (3) hingedly mounted on the front end of the body (1), a partition (4) fixedly mounted inside the body (1), and a fan component (5) fixedly mounted inside the side wall of the body (1), characterized in that: A loading assembly (6) is arranged inside the machine body (1), and the loading assembly (6) comprises: A servo hydraulic cylinder (61), wherein the servo hydraulic cylinder (61) is fixedly mounted on the bottom surface of the machine body (1), a hydraulic rod (62) is slidably mounted inside the servo hydraulic cylinder (61), the top of the hydraulic rod (62) is fixedly connected to the bottom center of a support plate (63), a fixing frame (64) is fixedly mounted on the top of the support plate (63), two groups of the fixing frames (64) are provided, and semiconductor elements (66) and protective elements (67) are respectively provided inside the two groups of the fixing frames (64); An operating table (68), wherein the operating table (68) is fixedly mounted at the center of the top of the partition (4), the outer side of the hydraulic rod (62) is fixedly connected to one end of a U-shaped frame (69), and a servo motor (610) is fixedly mounted at the other end of the U-shaped frame (69); A rotating shaft (611) is rotatably mounted on the output shaft of the servo motor (610), a cleaning roller (612) is clamped on the outer side of the rotating shaft (611), and the outer side of the cleaning roller (612) rolls against the inner outer wall of the fan component (5).
2. The semiconductor device assembly equipment according to claim 1, characterized in that: The cabinet doors (3) are provided in multiple groups and are located at the upper and lower ends of the partition (4). The fan component (5), the servo hydraulic cylinder (61) and the servo motor (610) are all electrically connected to the controller (2).
3. The semiconductor device assembly equipment according to claim 2, characterized in that: The rotating shafts (611) and cleaning rollers (612) are provided in multiple groups, and the multiple groups of rotating shafts (611) and cleaning rollers (612) are arranged in a circular array with equal spacing, with the center of the circular cross section of the output shaft of the servo motor (610) as the center of the array.
4. The semiconductor device assembly equipment according to claim 3, characterized in that: An auxiliary component (7) is arranged on the outside of the servo hydraulic cylinder (61), and the auxiliary component (7) includes a pressing rod (71). The pressing rod (71) is fixedly mounted on the bottom end of the U-shaped frame (69), and a pressing switch (72) is fixedly mounted on the outside of the top end of the servo hydraulic cylinder (61). The pressing rod (71) is located directly above the pressing switch (72), and the pressing switch (72) is electrically connected to the controller (2).
5. The semiconductor device assembly equipment according to claim 4, characterized in that: A control assembly (8) is arranged inside the machine body (1), and the control assembly (8) comprises a long strip (81), one end of the long strip (81) is fixedly mounted on the bottom of the support plate (63), a spring rod (82) is fixedly mounted on the top of the other end of the long strip (81), a through hole (83) is provided at the center of the bottom end of the fixing frame (64), the spring rod (82) passes through the through hole (83), a short rod (84) is fixedly mounted on the top of the spring rod (82), and a disc (85) is fixedly mounted on the top of the short rod (84).
6. The semiconductor device assembly equipment according to claim 5, characterized in that: An upper rod (86) is fixedly mounted on the top side wall of the spring rod (82), a movable electrode sheet (87) is fixedly mounted on the bottom end of the upper rod (86), a lower rod (88) is fixedly mounted on the top of one end of the long strip (81) close to the spring rod (82), a fixed electrode sheet (89) is fixedly mounted on the top of the lower rod (88), and the movable electrode sheet (87) is located directly above the fixed electrode sheet (89).
7. The semiconductor device assembly equipment according to claim 6, characterized in that: The long strip block (81), the spring rod (82), the through hole (83), the short rod (84), the disk (85), the upper rod (86), the movable electrode sheet (87), the lower rod (88) and the fixed electrode sheet (89) are provided in two groups, and the two groups of the long strip block (81), the spring rod (82), the through hole (83), the short rod (84), the disk (85), the upper rod (86), the movable electrode sheet (87), the lower rod (88) and the fixed electrode sheet (89) are mirror-imaged at both ends of the support plate (63) with the horizontal midline of the support plate (63) as the mirror axis, and the two groups of the disk (85) are respectively attached to the bottom of the semiconductor element (66) and the bottom of the protective element (67).
8. The semiconductor device assembly equipment according to claim 7, characterized in that: A moving assembly (9) is arranged at the top of the partition (4), and the moving assembly (9) comprises a servo asynchronous motor (91). The servo asynchronous motor (91) and a fixed block (92) are fixedly mounted on the top of the partition (4). The fixed block (92) comprises two groups. A vertical screw rod (93) is fixedly mounted at the output end of the servo asynchronous motor (91). The vertical screw rod (93) is rotatably mounted between the two groups of fixed blocks (92). The outer side of the vertical screw rod (93) is threadedly mounted with A vertical threaded block (94), a wheel frame (96) is fixedly mounted on the side wall of the vertical threaded block (94), a roller (97) is rotatably mounted inside the wheel frame (96), a limiting track (98) is fixedly mounted on the top of the partition (4), and the roller (97) is rotatably mounted inside the limiting track (98), and two groups of the wheel frame (96), the roller (97) and the limiting track (98) are provided, and the two groups of the wheel frame (96) are respectively fixedly mounted on the two ends of the bottom of the L-shaped plate (95).
9. The semiconductor device assembly equipment according to claim 8, characterized in that: A servo asynchronous motor (99) and a vertical block (910) are fixedly mounted on the inner side of the L-shaped plate (95); two groups of the vertical blocks (910) are provided, and a transverse screw rod (911) is rotatably mounted between the two groups of the vertical blocks (910); an output end of the servo asynchronous motor (99) is fixedly connected to the outer side of the transverse screw rod (911); a transverse threaded block (912) is threadedly mounted on the outer side of the transverse screw rod (911); a slider (914) is fixedly mounted on the top of the transverse threaded block (912); and a A slide rail (913), the slider (914) is slidably mounted on the outside of the slide rail (913), one end of a horizontal plate (915) is fixedly mounted on the outside of the transverse threaded block (912), an electric push rod (916) is fixedly mounted inside the other end of the horizontal plate (915), an electromagnetic suction cup (917) is fixedly mounted on the outside of the piston end at the bottom end of the electric push rod (916), and the servo asynchronous motor (91), the servo asynchronous motor (99), the electric push rod (916) and the electromagnetic suction cup (917) are all electrically connected to the controller (2).
10. An assembly method of the semiconductor device assembly equipment according to claim 9, characterized in that: The following steps are involved: S1, cooperate with the controller (2), the servo hydraulic cylinder (61), the hydraulic rod (62), the support plate (63), the fixing frame (64) and the limit rod (65) to lift the semiconductor element (66) and the protective element (67) to the top of the partition (4); S2, when the hydraulic rod (62) moves up and down, it cooperates with the U-shaped frame (69), the servo motor (610), the rotating shaft (611) and the cleaning roller (612) to electrostatically absorb and clean the inner side of the fan part (5); S3, when the U-shaped frame (69) moves up and down, the pressing rod (71) and the pressing switch (72) are coordinated to control the servo motor (610) to rotate step by step, thereby improving the cleaning effect; S4, cooperate with the servo asynchronous motor (91), the fixed block (92), the vertical screw rod (93), the vertical threaded block (94), the wheel frame (96), the roller (97) and the limiting track (98) to make the L-shaped plate (95) move forward and backward; S5, cooperate with the servo asynchronous motor (99), the vertical block (910), the horizontal screw rod (911), the horizontal threaded block (912), the slide rail (913), the slider (914), the horizontal plate (915), the electric push rod (916) and the electromagnetic suction cup (917) to move the semiconductor element (66) and the protective element (67) to the operating table (68) for assembly; S6. After the assembly is completed, the long strip (81), the spring rod (82), the through hole (83), the short rod (84), the disk (85), the upper rod (86), the movable electrode sheet (87), the lower rod (88) and the fixed electrode sheet (89) are coordinated to stop the fan member (5) from running, thereby further saving energy.
Citation Information
Patent Citations
Feeding and discharging manipulator for wafer cleaning
CN118039541A
Conveying device for semiconductor element processing
CN118954010A