Silicon wafer regularization device and silicon wafer regularization method

Abstract

The present invention discloses a silicon wafer regularization device and regularization method, and relates to the technical field of photovoltaic equipment. The silicon wafer regularization device includes a frame, a regularization mechanism arranged on the frame for regularizing a silicon wafer group, and an air supply mechanism arranged on the frame for supplying air to the bottom of the silicon wafer group. When the silicon wafer carrier for conveying the silicon wafer group runs to the bottom of the frame, the regularization mechanism and the air supply mechanism regularize the silicon wafer group. The silicon wafer regularization method includes: stacking a certain number of silicon wafers to form a silicon wafer group; supplying air to at least two opposite sides of the bottom of the silicon wafer group and overcoming the deadweight of the silicon wafers above the air supply position; extruding and regularizing two opposite side elevations of the silicon wafer group, and at the same time or then extruding and regularizing the other two opposite side elevations of the silicon wafer group, and stopping the air supply after the extrusion and regularization are completed: evacuating the extrusion around the silicon wafer group. The present invention reduces the probability of silicon wafer damage during silicon wafer regularization, and improves the problem that high efficiency and silicon wafer yield cannot be achieved at the same time in the silicon wafer regularization stage during silicon wafer production.

Description

Technical Field

[0001] The present invention relates to the technical field of photovoltaic equipment, and in particular to a silicon wafer regularization device and a silicon wafer regularization method. Background Art

[0002] During the silicon wafer production process, silicon wafer manufacturers need to stack a certain number of silicon wafers neatly in the vertical direction to form a silicon wafer group, and then pack the silicon wafers into boxes for sale. When the silicon wafers are stacked, due to the air interlayer between the silicon wafers, some of the silicon wafers in the silicon wafer group will be offset, resulting in the silicon wafer group boundary not being neatly arranged and unable to be boxed.

[0003] The silicon wafers used in the photovoltaic field are rectangular, and a regular method is usually used to solve the problem of uneven silicon wafer groups. The regular structure and regular process are disclosed in paragraph 100 of the CN116161295B specification: "The loading mechanism 10 is used to arrange and align a stack of loose and irregularly placed silicon wafers to form a stack of stacked silicon wafers. Specifically, it includes a fixed plate 13 placed under the conveyor belt and perpendicular to the length direction of the conveyor belt, a regular block 11 and a regular block 12 arranged at both ends of the fixed plate 13 and used to regularize the side elevations of the silicon wafer group, and a pressure strip 15 located on the top of the conveyor belt. Among them, the regular block 11 and the regular block 12 are relatively arranged at both ends of the fixed plate 13, and are both connected to the fixed plate 13 through a slide 14. The regular block 11 is used to align the side elevations of the silicon wafer group in the width direction, and the regular block 2 12 is used to align the side elevations of the silicon wafer group in the length direction. Then, by controlling the regular block 11 and the regular block 2 12, all the silicon wafers in the silicon wafer group can be regularized so that their side elevations are aligned and stacked up and down."

[0004] However, when the number of silicon wafers to be regularized is large, the above-mentioned regularization structure can only regularize the upper silicon wafer. The lower silicon wafer is under greater pressure due to the large number of silicon wafers stacked above. Directly using a regularization plate or regularization block for regularization will cause the lower silicon wafer to break at the corners, on the surface, or even break over a large area.

[0005] Therefore, it is urgent to develop a silicon wafer trimming device to solve the problem of damage to the lower silicon wafer during the trimming process. Summary of the invention

[0006] The first object of the present invention is to provide a silicon wafer regularization device to achieve the effect of ensuring the integrity of the silicon wafer during the silicon wafer regularization process.

[0007] To achieve this object, the present invention adopts the following technical solutions:

[0008] A silicon wafer tidying device, comprising:

[0009] frame;

[0010] A tidying mechanism, disposed on the frame and used for tidying the silicon wafer group; and

[0011] The air supply mechanism is arranged on the frame and is used to supply air to the lower part of the silicon wafer group when the arranging mechanism arranges the silicon wafer group, so as to overcome the dead weight of at least part of the silicon wafers above the air supply position.

[0012] As an optional solution of the silicon wafer tidying device, the tidying mechanism includes

[0013] A first lifting member is disposed on the frame;

[0014] A first regularizing plate group, mounted on the first lifting member and lifted and lowered with the first lifting member, the first regularizing plate group comprising two first regularizing plates capable of moving toward or away from each other and regularizing two opposite side elevations of the silicon wafer group; and

[0015] The second regularizing plate group is installed on the first lifting member and rises and falls with the first lifting member. The second regularizing plate group includes two second regularizing plates that can move toward or away from each other and regularize the other two opposite side surfaces of the silicon wafer group.

[0016] As an optional solution of the silicon wafer aligning device, the air supply mechanism is arranged at the bottom of the first aligning plate and / or the second aligning plate.

[0017] As an optional solution of the silicon wafer tidying device, the air supply mechanism includes an air supply member and an air supply source; the air supply member is provided with at least one air supply port for forming an air knife along the height direction of the side elevation of the silicon wafer group.

[0018] As an optional solution of the silicon wafer tidying device, an exhaust mechanism is provided on the rack, and the exhaust mechanism includes:

[0019] A second lifting member is disposed on the frame; and

[0020] The pressing plate is arranged on the second lifting member and presses the top of the silicon wafer group after the second lifting member descends.

[0021] As an optional solution of the silicon wafer tidying device, the exhaust mechanism also includes

[0022] A fixing plate, disposed at the bottom of the second lifting member; and

[0023] A plurality of connecting rods are arranged on a side of the fixed plate away from the second lifting member, and there is at least one connecting rod between adjacent first regular plates and second regular plates;

[0024] The fixing plate is provided with an avoidance slot, and the first lifting member passes through the avoidance slot.

[0025] As an optional solution of the silicon wafer aligning device, at least one exhaust hole is provided on the pressing plate, the first aligning plate and the second aligning plate.

[0026] As an optional solution of the silicon wafer aligning device, a cleaning mechanism is provided on the top of the first aligning plate and the second aligning plate, which can supply air to clean the side of the first aligning plate and the second aligning plate used for extruding the side elevation of the silicon wafer group.

[0027] The second objective of the present invention is to provide a silicon wafer regularization method that can regularize a large number of silicon wafers without damaging the silicon wafers.

[0028] To achieve this object, the present invention adopts the following technical solutions:

[0029] A silicon wafer regularization method, characterized by comprising the following steps:

[0030] stacking a determined number of silicon wafers to form a silicon wafer group;

[0031] Supply air to at least two sides of the bottom of the silicon wafer group and overcome the weight of the silicon wafers above the air supply position;

[0032] Extruding and regularizing two opposite side elevations of the silicon wafer group, and simultaneously or subsequently extruding and regularizing the other two opposite side elevations of the silicon wafer group, and stopping air supply after the extrusion and regularization are completed;

[0033] Remove the pressure on the silicon wafer assembly.

[0034] As an optional solution of the silicon wafer regularization method, after stopping the air supply, the top of the silicon wafer group is extruded and shaped, and then the extrusion around the silicon wafer group is removed.

[0035] Beneficial effects of the present invention:

[0036] The present invention provides a silicon wafer tidying device, which, by arranging an air supply mechanism, delivers air knives to the silicon wafers at the bottom of a silicon wafer group, thereby overcoming or partially overcoming the deadweight of the silicon wafers above the air supply position, so that the pressure on the silicon wafers at the bottom is greatly reduced, and then drives the tidying mechanism to perform tidying, thereby reducing the risk of corner chipping, surface chipping or fragmentation of the silicon wafers during tidying.

[0037] And the air supply mechanism is installed at the bottom of the regularization mechanism. When the regularization mechanism descends and completes the regularization preparation, the air supply mechanism just corresponds to the bottom of the silicon wafer group. The air supply mechanism is first started to supply air to the silicon wafer group. While continuing to supply air, the regularization mechanism is driven to squeeze the four sides of the silicon wafer group for regularization.

[0038] In addition, a cleaning mechanism is also provided on the top of the regularization mechanism. During the regularization process, air is supplied to clean the first regularization plate and the second regularization plate to remove particles from the first regularization plate and the second regularization plate, thereby further reducing the damage to the edge of the silicon wafer caused by particles during the extrusion process. At the same time, the probability of particles entering between adjacent silicon wafers and causing damage to the surface of the silicon wafer is reduced.

[0039] After the regularization is completed, the air between adjacent silicon wafers is discharged by extruding and shaping the top of the silicon wafer group, so that the relative positions of adjacent silicon wafers are better fixed, thereby avoiding the situation where the silicon wafers slip due to the presence of air during the removal of the regularization mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 It is a schematic diagram of the structure of a silicon wafer tidying device provided by an embodiment of the present invention located in a silicon wafer production line;

[0041] Figure 2 is a schematic structural diagram of a silicon wafer tidying device provided in an embodiment of the present invention;

[0042] Figure 3 yes Figure 2 Schematic diagram of the structure after the rack is removed;

[0043] Figure 4 yes Figure 3 A cross-sectional view of

[0044] Figure 5 yes Figure 4 A partial enlarged view of

[0045] Figure 6 It is a structural schematic diagram of an air supply outlet in another embodiment.

[0046] In the figure:

[0047] 100. silicon wafer assembly; 101. silicon wafer carrier;

[0048] 1. Frame;

[0049] 2. Structuring mechanism; 21. First lifting member; 22. First strutting plate group; 221. First strutting plate; 222. First clamping member; 23. Second strutting plate group; 231. Second strutting plate; 232. Second clamping member;

[0050] 3. Air supply mechanism; 31. Air supply member; 311. Air supply port; 32. Air supply source;

[0051] 4. Exhaust mechanism; 41. Second lifting member; 42. Pressing plate; 43. Fixing plate; 431. Avoidance notch; 44. Connecting rod;

[0052] 5. Mounting frame; 51. Mounting plate; 52. Support column;

[0053] 6. Cleaning mechanism; 61. Air outlet; 62. Air supply structure;

[0054] 7. Connect the framework. DETAILED DESCRIPTION

[0055] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0056] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions.

[0057] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] Unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include the first feature being in direct contact with the second feature, or may include the first feature being in contact with the second feature through another feature between them instead of being in direct contact. Moreover, a first feature being "above", "above" and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0059] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0060] like Figure 1-2 As shown, the present application provides a silicon wafer aligning device, including a rack 1, an aligning mechanism 2 arranged on the rack 1 for aligning a silicon wafer group 100, and an air supply mechanism 3 arranged on the rack 1 for supplying air to the bottom of the silicon wafer group 100. The rack 1 is installed on the ground or other work platform, and is used to adapt to the operation of the silicon wafer production line. When the silicon wafer carrier 101 conveying the silicon wafer group 100 runs under the rack 1, the aligning mechanism 2 and the air supply mechanism align the silicon wafer group 100.

[0061] Please combine Figure 2 and Figure 3 In the embodiment of the present application, the aligning mechanism 2 includes a first lifting member 21 installed on the top of the frame 1, a first aligning plate group 22 and a second aligning plate group 23 installed at the bottom of the first lifting member 21, and the first aligning plate group 22 and the second aligning plate group 23 are both driven by the first lifting member 21 to achieve lifting. The first aligning plate group 22 includes two plates that can move toward or away from each other and align the silicon wafer group 100 (see Figure 1 ) wherein the first regularizing plates 221 have two opposite side elevations, and the second regularizing plate group 23 includes two second regularizing plates 231 that can move toward or away from each other and regularize the other two opposite side elevations of the silicon wafer group 100.

[0062] Specifically, the first lifting member 21 may be a conventional telescopic driving member such as a hydraulic cylinder, a pneumatic cylinder, or the like, or may be a matching driving member such as a gear rack, a lead screw nut, or the like.

[0063] Specifically, a mounting frame 5 is installed at the bottom of the first lifting member 21, and the mounting frame 5 includes two horizontal mounting plates 51 and at least two support columns 52 fixed between the two mounting plates 51. In one embodiment, four support columns 52 are selected. The upper and lower planes of the mounting plate 51 located below are respectively fixed with a first clamping member 222 and a second clamping member 232, and the first clamping member 222 and the second clamping member 232 are perpendicular to each other. The two first regular plates of the first regular plate group are installed at both ends of the first clamping member 222, and the two second regular plates 231 of the second regular plate group 23 are installed at both ends of the second clamping member 232, so that the first regular plates 221 and the second regular plates 231 are arranged interlaced with each other.

[0064] Specifically, the first clamping member 222 and the second clamping member 232 may use a double-cylinder clamping mechanism, such as a hydraulic or pneumatic telescopic structure.

[0065] Please see Figure 3 Furthermore, in order to improve the cleanliness during the aligning process, a cleaning mechanism 6 is provided on the side of the first aligning plate 221 and the second aligning plate 231 facing the silicon wafer group 100, which can clean the first aligning plate 221 and the second aligning plate 231 used for squeezing the silicon wafer group 100 (see Figure 1) Air supply and cleaning is carried out on one side of the side facade.

[0066] Please combine Figure 3 and Figure 4 Specifically, the cleaning mechanism 6 of the first regularized plate 221 and the second regularized plate 231 is located on the same horizontal plane, and the horizontal plane is not lower than the top of the corresponding silicon wafer group 100 after the first regularized plate 221 and the second regularized plate 231 are lowered. The cleaning mechanism 6 includes a transverse air outlet 61 and an air supply structure 62. The air outlet 61 is provided with a plurality of cleaning air outlets (not shown in the figure) arranged along the width direction of the first regularized plate 221 or the second regularized plate 231. The cleaning air outlet is directly opposite or obliquely opposite to the first regularized plate 221 or the second regularized plate 231, and the cleaning air outlet can be a circular hole, a slit or other holes, gaps, etc. of any shape.

[0067] In the embodiment of the present application, the air supply mechanism 3 includes an air supply member 31 and an air supply source 32 . The air supply member 31 is provided with at least one air supply port 311 for forming an air knife along the height direction of the side elevation of the silicon wafer group 100 .

[0068] Furthermore, the wind knife is located on at least two opposite side surfaces of the silicon wafer assembly 100 , and the wind knife applies a force component parallel to the plane along which the silicon wafers are located to at least the side surfaces of the silicon wafer assembly 100 .

[0069] Furthermore, the wind knives are located on four side surfaces of the silicon wafer assembly 100 .

[0070] Furthermore, the air knife may be located at any position along the side length of the silicon wafer of the silicon wafer assembly 100 .

[0071] In one embodiment, the air supply member 31 is installed on the frame 1 , and the air blades delivered by the air supply member 31 face the bottom of the silicon wafer group 100 .

[0072] In another embodiment, the air supply member 31 is installed at the bottom of the first regularization plate 221 and / or the second regularization plate 231, and the air supply member 31 is connected to the air supply source 32 through a flexible connecting pipe. When the first regularization plate 221 and the second regularization plate 231 are lowered and correspond to the side elevation of the silicon wafer group 100, the air supply member 31 is exactly located at the bottom of the silicon wafer group 100, which avoids setting a specific position to fix the air supply member 31 on the rack 1, and can position the air supply member 31 to the bottom of the silicon wafer group 100 during each regularization.

[0073] Please combine Figure 4 and Figure 5 Specifically, the air supply member 31 is installed on the side of the first regularized plate 221 and / or the second regularized plate 231 away from the silicon wafer group 100. Taking the air supply member 31 on the second regularized plate 231 as an example, the bottom of the air supply member 31 does not exceed the bottom of the second regularized plate 221, and one end of the air supply member 31 having an air supply port 311 extends from one side of the second regularized plate 221.

[0074] Please see Figure 5 In one embodiment, the air outlet 311 is configured as a hole array of multiple holes arranged along the height direction of the silicon wafer group 100, and at least one group of the hole array is arranged along the side length direction of the silicon wafer of the silicon wafer group 100.

[0075] Please see Figure 6 In another embodiment, the air supply port 311 is configured as a slit opened along the height direction of the silicon wafer group 100 , and at least one slit is provided along the side length direction of the silicon wafers of the silicon wafer group 100 .

[0076] Optionally, the air supply source 32 and the air supply structure 62 may share the same one or be established separately.

[0077] Please combine Figure 1-3 In one embodiment, an exhaust mechanism 4 is provided on the frame 1, and the exhaust mechanism 4 includes a second lifting member 41 installed on the frame 1 and a pressing plate 42 fixed to the bottom of the second lifting member 41. The pressing plate 42 can squeeze the top of the silicon wafer group 100 after the second lifting member 41 descends, thereby exhausting the air between adjacent silicon wafers, which is convenient for shaping the silicon wafer group 100.

[0078] In one embodiment, the exhaust mechanism 4 also includes a fixed plate 43 at the bottom of the second lifting member 41 and at least two connecting rods 44 fixed to the lower surface of the fixed plate 43, preferably four connecting rods 44 are respectively fixed to the four corners of the upper surface of the pressing plate 42, so that during the descending process of the second lifting member 41, the lower surface of the pressing plate 42 can squeeze the silicon wafer group 100 more evenly.

[0079] Furthermore, at least one exhaust hole is formed on the pressing plate 42 to facilitate exhaust during the extrusion process of the pressing plate 42 .

[0080] Furthermore, at least one exhaust hole is provided on the first regular plate 221 and the second regular plate 231 to facilitate exhaust during the extrusion process of the pressing plate 42 .

[0081] Please combine Figure 3 and Figure 4 In one embodiment, the second lifting member 41 and the frame 1 are connected via a connecting frame, so that the bottom of the second lifting member 41 is fixed to the middle position of the upper surface of the fixing plate 43, preferably to the center position of the fixing plate 43. The first lifting member 21 vertically passes through the connecting frame 7 to avoid the installation of the second lifting member 41.

[0082] Specifically, one side of the fixed plate 43 is concave to form an avoidance slot 431 to facilitate the vertical passage of the first lifting member 21, so that the first regularizing plate 221 and the second regularizing plate 231 connected to the first lifting member 21 are located below the fixed plate 43, thereby enabling the regularizing mechanism 2 to descend before the pressure plate 42.

[0083] Specifically, the four connecting rods 44 are respectively located between the adjacent first regularizing plates 221 and the second regularizing plates 231, thereby making the structural layout of the regularizing mechanism 2 and the exhaust mechanism 4 more compact, and at the same time realizing that the first lifting member 21 and the second lifting member 41 respectively drive the regularizing mechanism 2 and the exhaust mechanism 4 without interfering with each other.

[0084] The silicon wafer aligning device provided in this embodiment is suitable for aligning large quantities of silicon wafers. Specifically, four air supply members 31 are used, with a flow rate of 200L / min and an air pressure of 0.6MPa, which can overcome the deadweight of 225 silicon wafers of 210 specifications, and is currently the leading aligning quantity in the industry. Specifically, according to the actual aligning quantity and the deadweight of the silicon wafers, the wind force that can overcome the deadweight of part of the silicon wafers can be selected to achieve aligning.

[0085] The present application also provides a silicon wafer regularization method, comprising the following steps:

[0086] Stacking a certain number of silicon wafers to form a silicon wafer group 100;

[0087] Supply air to at least two pairs of sides of the bottom of the silicon wafer group 100 and overcome the deadweight of the silicon wafers above the air supply position;

[0088] Extruding and shaping two opposite side faces of the silicon wafer group 100, and simultaneously or subsequently extruding and shaping the other two opposite side faces of the silicon wafer group 100, and stopping the air supply after the extrusion and shaping are completed;

[0089] The pressure on the periphery of the silicon wafer group 100 is removed.

[0090] Furthermore, air is supplied to the four sides of the silicon wafer group 100 so that the silicon wafers can be evenly stressed, thereby better overcoming the deadweight of the silicon wafers above the air supply position.

[0091] Furthermore, after the air supply is stopped, the top of the silicon wafer group 100 is squeezed to discharge the air between adjacent silicon wafers, thereby achieving shaping of the silicon wafer group 100 .

[0092] Furthermore, the pressure on the periphery of the silicon wafer group 100 is released, and at the same time, the pressure on the top of the silicon wafer group 100 is released either front to back or back to front.

[0093] The above contents are only preferred embodiments of the present invention. For ordinary technicians in this field, according to the concept of the present invention, there will be changes in the specific implementation methods and application scopes. The content of this specification should not be understood as limiting the present invention.

Claims

1. A silicon wafer tidying device, characterized in that: include: Rack(1); A tidying mechanism (2) arranged on the frame (1) and used for tidying the silicon wafer group (100); and The air supply mechanism (2) is arranged on the frame (1) and is used to supply air to the bottom of the silicon wafer group (100) when the aligning mechanism (2) is aligning the silicon wafer group (100), so as to overcome the deadweight of at least part of the silicon wafers above the air supply position, thereby reducing the pressure on the silicon wafers at the bottom, and then driving the aligning mechanism to perform aligning.

2. A silicon wafer aligning device according to claim 1, characterized in that: The regulating mechanism (2) comprises A first lifting member (21) is arranged on the frame (1); a first regularizing plate group (22) mounted on the first lifting member (21) and raised and lowered along with the first lifting member (21), the first regularizing plate group (22) comprising two first regularizing plates (221) capable of moving towards or away from each other and regularizing two opposite side elevations of the silicon wafer group (100); and The second regularizing plate group (23) is mounted on the first lifting member (21) and is lifted and lowered along with the first lifting member (21), the second regularizing plate group (23) comprising two second regularizing plates (231) that can move towards or away from each other and regularize the other two opposite side elevations of the silicon wafer group (100).

3. A silicon wafer aligning device according to claim 2, characterized in that: The air supply mechanism (3) is arranged at the bottom of the first regularized plate (221) and / or the second regularized plate (231).

4. A silicon wafer aligning device according to claim 2 or 3, characterized in that: The air supply mechanism (3) comprises an air supply member (31) and an air supply source (32); the air supply member (31) is provided with at least one air supply port (311) for forming an air knife along the height direction of the side elevation of the silicon wafer group (100).

5. The silicon wafer aligning device according to claim 2, characterized in that: The frame (1) is provided with an exhaust mechanism (4), and the exhaust mechanism (4) comprises: a second lifting member (41) disposed on the frame (1); and The pressing plate (42) is arranged on the second lifting member (41) and presses the top of the silicon wafer group (100) after the second lifting member (41) descends.

6. The silicon wafer aligning device according to claim 5, characterized in that: The exhaust mechanism (4) also includes A fixing plate (43) disposed at the bottom of the second lifting member (41); and A plurality of connecting rods (44) are arranged on a side of the fixed plate away from the second lifting member (41), and there is at least one connecting rod (44) between adjacent first regularized plates (221) and second regularized plates (231); The fixing plate (43) is provided with an avoidance slot (431), and the first lifting member (21) passes through the avoidance slot (431).

7. The silicon wafer aligning device according to claim 5, characterized in that: At least one exhaust hole is provided on the pressing plate (42), the first regular plate (221) and the second regular plate (231).

8. The silicon wafer aligning device according to claim 2, characterized in that: A cleaning mechanism (6) is provided on the top of the first regularized plate (221) and the second regularized plate (231), capable of supplying air to clean the side of the first regularized plate (221) and the second regularized plate (231) used for extruding the side elevation of the silicon wafer group (100).

9. A silicon wafer regularization method, characterized in that: The steps include: Stacking a certain number of silicon wafers to form a silicon wafer group (100); Supplying air to at least two opposite sides of the bottom of the silicon wafer group (100) and overcoming the deadweight of the silicon wafers above the air supply position; Extruding and regularizing two opposite side elevations of the silicon wafer group (100), and simultaneously or subsequently extruding and regularizing another two opposite side elevations of the silicon wafer group (100), and stopping air supply after the extrusion and regularization are completed; The pressure on the silicon wafer group (100) is removed.

10. A silicon wafer regularization method according to claim 9, characterized in that: After the air supply is stopped, the top of the silicon wafer group (100) is pressed and shaped, and then the pressing around the silicon wafer group (100) is removed.

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