Electrostatic filtering device

Abstract

The invention relates to an electrostatic filtering device. The electrostatic filtering device comprises a plurality of positive electrode plates and a plurality of negative electrode plates. At least one first electrode plate exists in the plurality of positive electrode plates and the plurality of negative electrode plates, and the first electrode plate is formed by wrapping a conductive material with a high-resistance material or an insulating material. The at least one first electrode plate is configured to lead out the internal conductive material at and / or near at least one support structure fixation location of the first electrode plate such that there is exposed conductive material at that location. Moreover, if the two adjacent electrode plates are both first electrode plates and have exposed conductive materials, the distance between the exposed conductive materials of the two adjacent electrode plates in the direction perpendicular to the distance between the electrode plates is larger than or equal to the minimum distance between the electrode plates. Therefore, the problem that the performance is obviously reduced under the condition that the supporting structure (especially an insulating supporting structure) is polluted can be solved, meanwhile, the purpose of enhancing the dust holding capacity of the filter can be achieved, and the intensity of an electric field which can be applied between the electrodes is not influenced.

Description

Technical Field

[0001] The present disclosure relates to the technical field of electrostatic dust removal, and in particular to an electrostatic filtering device. Background Art

[0002] Electrostatic filters have been widely used and developed due to their advantages such as low wind resistance and repeated cleaning.

[0003] Electrostatic filters are composed of alternating positive and negative components to form a strong electrostatic field to purify. Electrodes of electrostatic filters are usually made of metal. Some manufacturers also use plastic with conductive surfaces to make electrodes. Its fundamental feature is that both positive and negative electrodes have good conductive properties. Some higher performance electrostatic filters use high resistivity materials or insulating materials wrapped with low resistance conductive materials to improve filter performance.

[0004] Since the electrodes need to maintain a strict relative position to work properly, the electrodes need to be supported. Usually, the supporting material will choose an insulating material to ensure that there is a sufficiently high resistance between the positive and negative electrodes and reduce the leakage current between the electrodes. When the filter is working, some pollutants will adhere to the surface of the supporting material. These pollutants usually have certain conductive properties, which will destroy the insulation performance of the supporting structure. When the resistance of the supporting structure is close to or even lower than the electrode resistance, the filtration performance will be seriously reduced. Therefore, when the electrode is made of high-resistivity material or insulating material wrapped with low-resistance conductive material, the end-to-end resistance of the electrode is very high, and the impact of supporting structure contamination on performance becomes very significant.

[0005] Therefore, there is a need for an electrostatic filtration device that solves the problem of significant performance degradation when the supporting structure is contaminated. Summary of the invention

[0006] A technical problem to be solved by the present disclosure is how to design an electrostatic filtration device that can solve the problem of significant performance degradation when the supporting structure is contaminated.

[0007] The present disclosure provides an electrostatic filtering device, comprising: a plurality of positive electrode plates and a plurality of negative electrode plates, the plurality of positive electrode plates and the plurality of negative electrode plates are arranged alternately and at intervals, the positive electrode plates are connected to the positive pole of a high-voltage power supply, the negative electrode plates are connected to the negative pole of the high-voltage power supply, at least one first electrode plate exists among the plurality of positive electrode plates and the plurality of negative electrode plates, the first electrode plate is formed by wrapping a conductive material with a high-resistance material or an insulating material, at least one first electrode plate is configured to lead out the internal conductive material at a fixed position and / or a nearby position of at least one supporting structure of the first electrode plate so that there is exposed conductive material at the position, and if two adjacent electrode plates are both first electrode plates and both have exposed conductive material, then the distance between the exposed conductive materials of the two adjacent electrode plates in the direction perpendicular to the electrode plate spacing is greater than or equal to the minimum electrode plate spacing.

[0008] Optionally, the electrostatic filtration device also includes: one or more first support structures, each first support structure is used to connect each positive electrode plate; one or more second support structures, each second support structure is used to connect each negative electrode plate; two groups of insulating support plates, the two groups of insulating support plates are respectively located on both sides of the multiple positive electrode plates and the multiple negative electrode plates, each group of insulating support plates includes at least one insulating support plate, and the first support member and the second support member are also respectively connected to one of the insulating support plates in each group of insulating support plates.

[0009] Optionally, each electrode plate includes one or more support structure fixing positions and one or more support structure avoidance positions, the support structure fixing positions are used to fix the support structure connected to the electrode plate, the support structure avoidance positions are used to avoid the support structure of the electrode plate to be connected whose polarity is different from that of the electrode plate, and the support structure fixing positions of two adjacent electrode plates are directly opposite to the support structure avoidance positions.

[0010] Optionally, exposed conductive material is arranged only on one side of the first electrode plate, and the exposed conductive material of the first electrode plate belonging to the negative electrode plate is arranged on the side located on the windward side, and the exposed conductive material of the first electrode plate belonging to the positive electrode plate is arranged on the side located on the leeward side, wherein the electrode plate includes two surfaces, two side surfaces, a connecting surface and an opposite surface, the distance between two mutually close surfaces of two adjacent electrode plates is the electrode plate spacing, the connecting surface refers to the surface where the connecting part of the electrode plate and the high-voltage power supply is located, and the opposite surface refers to the surface parallel to the connecting surface.

[0011] Optionally, the internal conductive material is led out at each support structure fixing position and / or a nearby position of each first electrode plate.

[0012] Optionally, all electrode plates are first electrode plates; and / or a surface resistivity of a wrapping material of the first electrode plate used for wrapping the conductive material is greater than or equal to 1E11Ω.

[0013] Optionally, the surface resistivity of the internal conductive material of the first electrode plate is less than or equal to 1E10Ω.

[0014] Optionally, the surface resistivity of the internal conductive material of all the positive electrode plates is less than or equal to 1E5Ω, and the surface resistivity of the internal conductive material of all the negative electrode plates is less than or equal to 1E10Ω.

[0015] Optionally, the surface resistivity of the internal conductive material of at least one pair of electrode plates near each side edge is less than or equal to 1E5Ω, and the surface resistivity of the internal conductive material of other electrode plates is less than or equal to 1E10Ω, wherein each pair of electrode plates in the at least one pair of electrode plates consists of a positive electrode plate and a negative electrode plate.

[0016] Optionally, the surface resistivity of the internal conductive material of the first electrode plate is less than or equal to 1E5Ω.

[0017] The present disclosure configures at least one electrode plate (i.e., the first electrode plate) composed of a conductive material wrapped with a high-resistance material or an insulating material so that the internal conductive material is led out at a fixed position and / or a nearby position of at least one support structure of the first electrode plate so that there is exposed conductive material at the position. Furthermore, if two adjacent electrode plates are both first electrode plates and both have exposed conductive materials, the distance between the exposed conductive materials of the two adjacent electrode plates in the vertical direction of the electrode plate spacing is greater than or equal to the minimum electrode plate spacing. Thus, the power supply can be directly connected to the periphery of the support structure through the exposed and low-resistance conductive material, which can greatly reduce Rs, thereby solving the problem of significant performance degradation when the support structure (especially the insulating support structure) is contaminated, and at the same time, the purpose of enhancing the dust holding capacity of the filter can be achieved. Furthermore, by avoiding the exposed internal conductive material portions of the two adjacent first electrodes, the electric field strength that can be applied between the electrodes is not affected. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and other objects, features and advantages of the present disclosure will become more apparent through a more detailed description of exemplary embodiments of the present disclosure in conjunction with the accompanying drawings, wherein like reference numerals generally represent like components in the exemplary embodiments of the present disclosure.

[0019] Figure 1 A schematic diagram of an abstracted simple model is shown.

[0020] Figure 2 A schematic diagram of a support structure is shown.

[0021] Figure 3 A schematic diagram of another support structure is shown.

[0022] Figure 4 A schematic structural diagram of an electrode plate according to an embodiment of the present disclosure is shown.

[0023] Figure 5 , Figure 6 The schematic diagrams of the structures of electrode plates according to other embodiments of the present disclosure are shown.

[0024] Figure 7 A schematic diagram of the arrangement structure of adjacent electrode plates is shown.

[0025] Figure 8 A schematic structural diagram of an electrode plate according to another embodiment of the present disclosure is shown.

[0026] Fig. 9 Another schematic diagram of the arrangement structure of adjacent electrode plates is shown.

[0027] Fig.10 A schematic structural diagram of an electrostatic precipitator according to an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0028] The preferred embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present disclosure more thorough and complete, and to fully convey the scope of the present disclosure to those skilled in the art.

[0029] A complete electrostatic filter needs to consist of two parts: a charging device and a filtering device. The function of the charging device is to charge the fine particles in the air so that they are charged. The filtering device absorbs the charged particles through the electrostatic field to achieve the effect of air purification. The present disclosure only involves improvements to the filtering device, but not to the charging device. Therefore, the present disclosure does not describe the charging device, but focuses on the filtering device. It should be known that the filtering device (i.e., the electrostatic filtering device) described in the present disclosure can be used in conjunction with the charging device to form a complete electrostatic filter. In other words, the electrostatic filtering device described in the present disclosure can also include a charging device to form a complete electrostatic filter. In addition, some of the test cases mentioned in the article are by default the results of tests with the charging device.

[0030] In this disclosure, the terms "electrode" and "electrode plate" may be used interchangeably.

[0031] Common electrostatic filters include plate type and honeycomb type. The electrostatic filter device in the present disclosure refers to a flat plate type electrostatic filter device. A support structure needs to be provided between the electrodes in the electrostatic filter device to keep the relative positions between the electrodes fixed. The material of the support structure is usually an insulating material. When the insulating performance of the support structure is good, the performance of the electrostatic filter is not affected. However, after the electrostatic filter has been running for a period of time, when pollutants with a certain conductivity are attached to the surface of the support structure, the surface resistivity of the support structure will decrease, which may affect the performance of the electrostatic filter.

[0032] As the use time increases, the surface resistivity of the support structure continues to decrease. In actual use, especially in high temperature and high humidity environments, the surface resistivity of the support structure can easily drop to the level of 1E6Ω to 1E8Ω. If the air dust contains low-resistivity components such as metals, the surface resistivity of the support structure may drop even lower.

[0033] When the surface resistivity of the support structure decreases, the insulation performance between the positive and negative electrodes is destroyed. The reduction in the surface resistivity of the support structure has little effect on the performance of low-resistance electrodes (such as metal electrodes), but for high-resistance electrodes or surface-insulated electrodes, the performance will be greatly affected. High-resistance electrodes refer to electrodes made of conductive materials wrapped with high-resistance materials. Surface-insulated electrodes refer to electrodes made of conductive materials wrapped with insulating materials. Generally speaking, the surface resistivity of high-resistance materials is not less than 1E11Ω, and the surface resistivity of insulating materials is not less than 1E12Ω.

[0034] When the electrostatic filter works for a period of time, the surface of the electrode and the supporting structure will be attached with pollutants. Usually these pollutants are conductive, so after working for a period of time, the surface of the electrode and the supporting structure can no longer be regarded as insulation or high resistance, but is determined by the surface resistivity of the pollutants.

[0035] Figure 1 A schematic diagram of an abstracted simple model is shown.

[0036] See also Figure 1 , the resistance value from the power supply to the electrode surface can be defined as Rs, and the resistance value from the support structure to the electrode surface can be defined as Rp. Rp is equivalent to the short-circuit resistance between the positive and negative electrodes.

[0037] The following calculation shows the voltage loss ratio on Rs when Rs is 100MΩ under different Rp conditions. The calculation results are shown in the following table.

[0038] Rs(Ω) Rp(Ω) Rs voltage loss 1E8 1E12 0.0％ 1E8 1E11 0.1％ 1E8 1E10 1.0％ 1E8 1E9 9.1％ 1E8 1E8 50.0％ 1E8 1E7 98.9％

[0039] It can be seen that when Rp is 2 orders of magnitude higher than Rs, the voltage loss is 1%, which has almost no effect. When Rp is only one order of magnitude higher than Rs, the voltage loss reaches 9.1%, which is acceptable. When Rp is equivalent to Rs, the voltage loss reaches 50%, at which point a significant performance degradation may occur. When Rp is one order of magnitude lower than Rs, the voltage loss reaches 98.9%, and the equipment efficiency is basically completely lost.

[0040] According to conventional design, when pollutants contaminate the electrode support structure, it will inevitably lead to a decrease in Rp. In order to solve the performance degradation caused by the decrease in Rp, it is necessary to reduce Rs or increase Rp.

[0041] The electrode surface wrapping material is usually an insulating material with a surface resistivity greater than 1E12Ω. In some special cases, high resistivity materials can also be selected as electrode surface wrapping materials, but generally their surface resistivity should be greater than 1E11Ω to ensure that the electrostatic filter has a high purification capacity.

[0042] The conductive material wrapped inside the electrode is usually low-resistance. The low resistance mentioned here means that its surface resistivity should be one order of magnitude lower than that of the external wrapping material, that is, less than or equal to 1E10Ω. In some special cases, the surface resistivity of environmental pollutants may be lower, and the surface resistivity of the internal conductive material can be designed to be lower, for example, below 1E5Ω.

[0043] Due to the low resistance characteristics of the conductive material wrapped inside the electrode, the present disclosure proposes that the conductive material wrapped inside the fixed position and / or near the supporting structure of the electrode can be led out to form exposed conductive material, so that the power supply can be directly connected to the periphery of the supporting structure through the exposed and low-resistance conductive material, which can greatly reduce Rs, thereby solving the problem of significant performance degradation when the supporting structure (especially the insulating supporting structure) is contaminated, and at the same time can achieve the purpose of enhancing the dust holding capacity of the filter. In addition, considering that the low-resistance electrodes are facing each other (that is, the exposed conductive materials of adjacent electrodes are facing each other), it will affect the electric field strength that can be applied between the electrodes, so the exposed internal conductive material parts of the two adjacent electrodes need to be avoided.

[0044] In view of this, the present disclosure proposes an electrostatic filtration device, which can solve the problem of significant performance degradation when the supporting structure (especially the insulating supporting structure) is contaminated, while achieving the purpose of enhancing the dust holding capacity of the filter without affecting the electric field strength that can be applied between the electrodes.

[0045] The electrostatic filtering device comprises a plurality of positive electrode plates and a plurality of negative electrode plates, which are arranged alternately and spaced apart, the positive electrode plates are connected to the positive pole of the high-voltage power supply, and the negative electrode plates are connected to the negative pole of the high-voltage power supply.

[0046] There is at least one first electrode plate among the multiple positive electrode plates and the multiple negative electrode plates. The first electrode plate is composed of a high-resistance material or an insulating material wrapped with a conductive material. That is, the first electrode plate can be a high-resistance electrode or an insulating electrode. Exemplarily, all electrode plates can be first electrode plates. The surface resistivity of the wrapping material for wrapping the conductive material of the first electrode plate is greater than or equal to 1E11Ω. Furthermore, when the wrapping material for wrapping the conductive material of the first electrode plate is an insulating material, the surface resistivity of the wrapping material is greater than or equal to 1E12Ω.

[0047] At least one (for example, all) first electrode plates are configured to lead out the internal conductive material at and / or near at least one support structure fixing position of the first electrode plate so that there is exposed conductive material at the position.

[0048] If two adjacent electrode plates are both first electrode plates and both have exposed conductive materials, the distance between the exposed conductive materials of the two adjacent electrode plates in the vertical direction of the electrode plate spacing is greater than or equal to the minimum electrode plate spacing so as not to affect the electric field strength that can be applied between the electrodes. The minimum electrode plate spacing refers to the minimum value of the distance between all two adjacent electrode plates in the electrostatic precipitator, that is, the minimum sheet spacing between the positive and negative electrodes.

[0049] The distances between different electrode plates in the same electrostatic precipitator may be the same or different. Moreover, different electrostatic precipitators may have different minimum electrode plate spacings. In some embodiments, the distance of the exposed conductive material in the direction perpendicular to the electrode plate spacing is usually much greater than the minimum electrode plate spacing, such as 2.5 times, 5 times, 12 times, etc.

[0050] In the present disclosure, each electrode plate may include two surfaces, two side surfaces, a connection surface and an opposite surface. The distance between two surfaces of two adjacent electrode plates that are close to each other may be referred to as the plate spacing. The connection surface refers to the surface where the connection portion of the electrode plate and the high voltage power supply is located, and the opposite surface refers to the surface parallel to the connection surface.

[0051] The following first provides an exemplary description of the supporting structure of the electrode plate.

[0052] Figure 2 A schematic diagram of a support structure is shown. Figure 2 and the following Figure 3 Only the schematic diagram when the support structure is arranged on one side of the electrode plate is shown. It should be known that one or more support structures can also be arranged on the other side of the electrode plate.

[0053] like Figure 2As shown in the figure, the simplest support structure is to fix all the electrode plates together directly through the support of insulating material (blue line in the figure). This method is simple to implement, but during the operation of the electrostatic filter, a large amount of fine particles will adhere to the support structure, destroying the insulation and causing conduction resistance between the positive and negative electrodes. In addition, since the conduction path of this support structure is short, it cannot effectively improve Rp.

[0054] As mentioned above, improving Rp can also improve the performance degradation problem caused by the reduction of Rp to a certain extent. Therefore, the present disclosure proposes that the support structure of the positive and negative electrodes in the electrostatic filtration device can be improved, and Rp can be increased by effectively increasing the conductive path of the support structure, thereby improving the performance degradation problem caused by the reduction of Rp.

[0055] Figure 3 A schematic diagram of another support structure is shown.

[0056] like Figure 3 As shown, the positive and negative electrode groups each use an independent support structure. Figure 3 The red line in the figure may represent a support structure for connecting the positive electrode plates. For the sake of distinction, the support structure may be referred to as a first support structure. Figure 3 The blue lines in the figure may represent the support structure for connecting each negative electrode plate. For the sake of distinction, the support structure may be referred to as the second support structure. The electrostatic filter device may include one or more first support structures and one or more second support structures. The number of the first support structure and the second support structure may be flexibly set according to actual conditions.

[0057] It is also necessary to fix the first support structure and the second support structure to the edge of the filter through an insulating component, because this can effectively increase the conduction path of the positive and negative electrodes due to the short circuit of the support structure, thereby increasing Rp. Therefore, the electrostatic filtering device can also include two groups of insulating support plates, the two groups of insulating support plates are respectively located on both sides of the multiple positive electrode plates and the multiple negative electrode plates, each group of insulating support plates includes at least one insulating support plate, and the first support member and the second support member are also respectively connected to one of the insulating support plates in each group of insulating support plates.

[0058] Taking the example that each group of insulating support plates includes one insulating support plate, the first support structure and the second support structure are also respectively connected to the same insulating support plate in each group of insulating support plates. Taking the example that each group of insulating support plates can also include two insulating support plates, the first support structure and the second support structure can be respectively connected to different insulating support plates in each group of insulating support plates, and the insulating support plate connected to the positive electrode plate through the first support structure and the insulating support plate connected to the negative electrode plate through the second support structure can also be connected through a connector.

[0059] Under the action of the polarization supports (i.e., polarization plate supports) of the first support structure and the second support structure, the positive electrode plate and the negative electrode plate are not directly connected through the support structure, but are indirectly connected via the insulating support plates on both sides under the support of different support structures. This makes it possible for the conduction path between the positive and negative electrode groups to pass through the insulating support plates on both sides when the surface of the insulating material of the support structure is contaminated, which greatly increases the distance of the short-circuit path, thereby increasing Rp.

[0060] The first support structure and the second support structure may be fixed at the edge of the electrode plate or in the middle of the electrode plate. When the first support structure and the second support structure are fixed at the edge of the electrode plate, the electrode plate may use the concave-convex structure to avoid the support structure with a different polarity. When the first support structure and the second support structure are fixed at the middle of the electrode plate, the electrode plate may use the through hole to avoid the support structure with a different polarity.

[0061] In some embodiments, each electrode plate may include one or more support structure fixing positions and one or more support structure avoidance positions. The support structure fixing positions are used to fix the support structure connected to the electrode plate. The support structure avoidance positions are used to avoid the support structure of the electrode plate to be connected that has a different polarity from the electrode plate. The support structure fixing positions of two adjacent electrode plates are directly opposite to the support structure avoidance positions.

[0062] The structures of high-resistance material wrapped with conductive material and insulating material wrapped with conductive material are exactly the same, and the following is an example of wrapping conductive material with insulating material.

[0063] Figure 4 A schematic structural diagram of an electrode plate according to an embodiment of the present disclosure is shown.

[0064] See also Figure 4 , the oblique line part shown in the figure is used to represent the conductive material. The frame that wraps the conductive material refers to the frame of the insulating material. There are some grooves of different depths on the edge of the insulating material, which are used to install and avoid the support structure. Among them, the shallow groove is the fixed position of the support structure, which is used to fix the support structure. The shallow groove can be flat or have a groove. The deep groove is the avoidance position of the installation rod, which is used to avoid the support structure of the electrode plate with opposite polarity.

[0065] By configuring the electrode plates as Figure 4 The appearance structure shown can be realized Figure 3 As described in the above, electrodes of the same polarity are fixed together separately. In addition, the conductive material inside the electrode plate is exposed in one short side direction for connecting with the power source, and other positions are kept at a certain protection distance from the edge.

[0066] Figure 5 , Figure 6 The schematic diagrams of the structures of electrode plates according to other embodiments of the present disclosure are shown.

[0067] like Figure 5 , Figure 6 As shown, for at least one supporting structure fixing position (i.e., shallow groove) of the electrode plate, the internal conductive material can be led out in a narrow area near the supporting structure fixing position, or in a wider area including the supporting structure fixing position and nearby positions on its left and right sides.

[0068] Thus, the exposed conductive material portion is located at and / or near the fixed position of the support structure, and the width of the exposed conductive material portion can be flexibly set according to actual conditions. Among them, the near position can refer to any position within a certain threshold range of the distance from the fixed position of the support structure in the length direction of the electrode plate.

[0069] The surface resistivity of the internal wrapping material is determined by the product itself. By using an internal wrapping conductive material with a low surface resistivity and leading out the internal conductive material at at least one support structure fixing position and / or near the electrode plate, the power supply can be directly conducted to the periphery of the support structure through the low-resistance conductive material, which can significantly reduce Rs, thereby achieving the purpose of increasing the dust holding capacity of the filter.

[0070] Because the low-resistance electrodes are facing each other, the electric field strength that can be applied between the electrodes will be affected, so the exposed conductive materials of adjacent electrode plates need to avoid each other. Figure 7 A schematic diagram of the arrangement structure of adjacent electrode plates is shown.

[0071] See also Figure 7 , the fixed position of the support structure of the adjacent electrode plates is directly opposite to the avoidance position of the support structure, so the parts where the conductive material is derived naturally have the conditions to avoid each other in the direction perpendicular to the distance between the plates. However, if the width of the side lead-out electrode is too wide, the electrodes will also face each other. Therefore, it is necessary to set a constraint condition, that is, the distance between the exposed conductive materials on the two adjacent electrode plates in the direction perpendicular to the distance between the plates is greater than or equal to the minimum distance between the plates. In this way, the effect of the low-resistance electrodes facing each other (that is, the parts where the conductive material is derived facing each other) on the electric field strength can be effectively reduced.

[0072] In addition, if you want to apply a higher voltage between adjacent electrodes, you can continue to increase the distance between the two adjacent electrode plates in the direction perpendicular to the plate spacing, that is, continue to reduce the width of the side lead-out electrode (i.e., the exposed conductive material), or reduce the number of side lead-out electrodes.

[0073] Figure 8A schematic structural diagram of an electrode plate according to another embodiment of the present disclosure is shown.

[0074] See also Figure 8 Each exposed conductive material near the support structure contributes to improving the dust holding capacity of the filter, so a basic configuration is to deploy exposed conductive materials near all support structures. In other words, the internal conductive material can be led out at each support structure fixed position and / or near each first electrode plate. It should be known that Figure 8 This is just an example. In actual operation, the shape of the exposed conductive material can also be changed, for example, Figure 5 or Figure 6 The exposed conductive material is shaped in the manner shown.

[0075] Fig. 9 Another schematic diagram of the arrangement structure of adjacent electrode plates is shown.

[0076] like Fig. 9 As shown, exposed conductive materials can be deployed near all supporting structures of two adjacent electrode plates. Taking the actual electrode spacing of 1.5 mm as an example, the distance between the exposed conductive materials of two adjacent electrode plates in the vertical direction of the electrode spacing is greater than or equal to 1.5 mm, which meets the spacing requirement.

[0077] Normally, as long as the surface resistivity of the conductive material is less than 1E10Ω, the product can work normally. However, the performance of the conductive material with different surface resistivities will also be different. In principle, the higher the surface resistivity of the internal conductive material, the better the product safety, and the lower the surface resistivity of the internal conductive material, the better the product performance. Therefore, the surface resistivity of the internal conductive material is also a factor that needs to be considered.

[0078] The following experiment demonstrates the effect of the surface resistivity of the internal conductive material on the performance.

[0079] The experiment content is as follows: The filter size of the electrostatic filter is 300*300mm, and all electrodes are made of insulating materials wrapped with conductive materials, with a thickness of 44mm, an electrode spacing of 1.5mm, and an inter-electrode voltage of 6KV between the positive and negative electrode plates. The performance of the traditional completely enclosed internal low-resistance conductive material (except for one side used to connect the positive and negative electrodes) is compared with that of the exposed conductive material deployed near all supporting structures of each electrode. The conductive materials here are also compared in two versions: high-resistance ink (1E8Ω) and low-resistance ink (1E3Ω). The experiment uses the air purifier standard, and tests the CADR filtration performance and CCM dust holding capacity of the filter through cigarettes. The test air volume is about 500m 3 / h. The test results are as follows.

[0080]

[0081] From the test data in the above table, it can be seen that when the exposed conductive material method is adopted, the dust holding performance of the filter is significantly improved. However, when using high-resistance ink, the performance is still limited. This is due to the contamination of the supporting structure in the later stage. Because the surface resistivity of the pollutant smoke oil under laboratory conditions is about 1E7~1E8Ω, the dust holding capacity can be further improved when using lower resistivity ink. Therefore, in some exemplary embodiments, the internal conductive material of at least one (for example, part or all) electrode plates (first electrode plates) can adopt low-resistance conductive material (for example, conductive material with a surface resistivity less than or equal to 1E5Ω) to significantly improve the dust holding performance of the filter.

[0082] The following are some examples of possible configurations proposed in the present disclosure. It should be noted that the possible configurations described below can be used in combination with each other or independently without conflict. In addition, the possible configurations described below can be combined with the above. Figure 3 The positive and negative electrode groups described are each made using an independent support structure.

[0083] Possible configuration 1

[0084] Considering that electrostatic filtration devices usually use negative ion charging, exposed conductive material can be set only on one side of the first electrode plate, and the exposed conductive material of the first electrode plate belonging to the negative electrode plate is set on the side located on the windward side, and the exposed conductive material of the first electrode plate belonging to the positive electrode plate is set on the side located on the leeward side.

[0085] Taking all electrode plates as first electrode plates as an example, bare conductive materials can be deployed near all supporting structures on one side of each electrode plate, and the bare conductive materials of the positive electrode group are placed on the leeward side, and the bare conductive materials of the negative electrode group are placed on the windward side.

[0086] The advantage of this configuration is that the positive electrode group has no exposed electrodes on the windward side, and will not produce induction with the front negative ion charging device, so there is no need to set a large protective gap between the front and rear electrodes, reducing the installation space of the equipment.

[0087] The above experiment was repeated for this configuration, and the test data obtained is as follows.

[0088]

[0089] From the above test data, we can see that exposing the conductive material only on one side of the electrode plate also has a good effect of improving the dust holding capacity, but the degree of improvement is lower than that of fully exposing the conductive material.

[0090] Possible configuration 2

[0091] Since the higher the surface resistivity of the internal conductive material, the better the product safety, and the lower the surface resistivity of the internal conductive material, the better the product performance. Therefore, in consideration of both safety and product performance, the electrostatic filter device can be configured as follows: a high surface resistivity material is used inside the electrode plate of one polarity to ensure the safety of the filter; at the same time, a low surface resistivity material is used inside the electrode plate of the other polarity to improve product performance, that is, to improve the dust holding capacity of the product.

[0092] Since the charging device is usually negatively charged, the positive electrode plate is more easily contaminated. Therefore, all positive electrode plates can be configured to use low surface resistivity materials inside, and all negative electrode plates can be configured to use high surface resistivity materials inside.

[0093] In some embodiments, the surface resistivity of the conductive material inside the negative electrode group can be set to be less than or equal to 1E10Ω, and the surface resistivity of the conductive material inside the positive electrode group can be controlled to be within the range of ≤1E5Ω. That is, the surface resistivity of the conductive material inside all positive electrode plates is less than or equal to 1E5Ω, and the surface resistivity of the conductive material inside all negative electrode plates is less than or equal to 1E10Ω. Among them, the surface resistivity of the negative electrode plate should also be greater than that of the positive electrode plate. Therefore, illustratively, the surface resistivity of the conductive material inside the negative electrode plate can be controlled within the range of 1E6Ω to 1E10Ω.

[0094] This configuration enables the filter to achieve a significant improvement in dust holding performance while ensuring safety performance.

[0095] Possible configuration 3

[0096] The internal conductive material of at least one pair of electrode plates near each side edge can be configured to use low-resistance conductive material, while the internal conductive materials of other intermediate electrode plates can all be configured to use high-resistance conductive material, or partially use high-resistance conductive material and partially use low-resistance conductive material. Wherein, each pair of electrode plates in the at least one pair of electrode plates is composed of a positive electrode plate and a negative electrode plate. A positive electrode plate and a negative electrode plate in a pair of electrode plates mentioned here can be two adjacent electrode plates or two non-adjacent electrode plates. For example, a small number of electrodes can be spaced between the positive electrode plate and the negative electrode plate in a pair of electrode plates.

[0097] This configuration can reduce the impact of the supporting structure on the performance while taking into account the safety of the filter.

[0098] The low-resistance conductive material mentioned here may refer to a conductive material with a surface resistivity less than or equal to 1E5Ω. The high-resistance conductive material mentioned here may refer to a conductive material with a surface resistivity less than or equal to 1E10Ω, for example, a conductive material with a value range of 1E6Ω to 1E10Ω.

[0099] Feasible configuration 3 can be combined with feasible configuration 2 or the configuration of "the surface resistivity of the internal conductive materials of all electrode plates is less than or equal to 1E10Ω", and can be regarded as a reinforcement configuration of either of the two configurations.

[0100] For example, in a typical configuration, the internal conductive materials of a pair of electrode plates near each edge are configured to use low-resistance conductive materials, while the internal conductive materials of other electrode plates in the middle are configured to use high-resistance conductive materials.

[0101] For another example, another typical configuration is that the internal conductive materials of a pair of electrode plates near each side edge are configured to use low-resistance conductive materials, while the internal conductive materials of other negative electrode plates in the middle are all configured to use high-resistance conductive materials, and the internal conductive materials of other positive electrode plates in the middle are all configured to use low-resistance conductive materials.

[0102] Fig.10 A schematic structural diagram of an electrostatic precipitator according to an embodiment of the present disclosure is shown.

[0103] See also Fig.10 The red electrode plates and blue electrode plates at the edges of both sides can represent the positive electrode plates and the negative electrode plates respectively. The red electrode plates and blue electrode plates at the edges of both sides use low-resistance conductive materials inside, and the conductive materials inside the remaining electrodes in the middle are all high-resistance conductive materials.

[0104] In practical applications, some adjustments can be made based on the technical concept of this configuration to form other feasible configurations. For example, the number of low-resistance electrodes using low-resistance conductive materials can be increased. For another example, some high-resistance electrodes can be inserted between two adjacent low-resistance electrodes to enhance safety. I will not go into details here.

[0105] The above experiment was repeated for this configuration, and the test data obtained is as follows.

[0106]

[0107]

[0108] It can be seen that through this feasible configuration, the dust holding capacity of the filter is also effectively enhanced.

[0109] The electrostatic filtering device of the present disclosure has been described in detail so far. The electrostatic filtering device of the present disclosure can avoid the low initial efficiency and easy discharge and sparking problems of the low-resistance material filter with exposed surface represented by metal materials, and at the same time greatly improve the low dust holding capacity when the low-resistance material is completely wrapped, especially the performance is significantly reduced when the insulating support structure is contaminated, and does not affect the electric field strength that can be applied between the electrodes.

[0110] In general, the electrostatic filtration device disclosed in the present invention has good safety, high initial working efficiency, and continuous and stable filtration performance, and can be realized as an air filtration product with high efficiency, low resistance, and long service life.

[0111] The embodiments of the present disclosure have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. An electrostatic filtration device, characterized in that: include: A plurality of positive electrode plates and a plurality of negative electrode plates, wherein the plurality of positive electrode plates and the plurality of negative electrode plates are arranged alternately and spaced apart, the positive electrode plates are connected to the positive electrode of a high-voltage power supply, and the negative electrode plates are connected to the negative electrode of a high-voltage power supply, There is at least one first electrode plate among the plurality of positive electrode plates and the plurality of negative electrode plates, and the first electrode plate is formed by a high-resistance material or an insulating material wrapped with a conductive material. At least one of the first electrode plates is configured to lead out the internal conductive material at at least one support structure fixing position and / or a position near the first electrode plate so that there is exposed conductive material at the position, Furthermore, if two adjacent electrode plates are both first electrode plates and both have the exposed conductive material, the distance between the exposed conductive materials of the two adjacent electrode plates in a direction perpendicular to the electrode plate spacing is greater than or equal to the minimum electrode plate spacing.

2. The electrostatic filtration device according to claim 1, characterized in that: Also includes: One or more first support structures, each of which is used to connect a respective positive electrode plate; One or more second support structures, each of which is used to connect a respective negative electrode plate; Two groups of insulating support plates, the two groups of insulating support plates are respectively located on both sides of the multiple positive electrode plates and the multiple negative electrode plates, each group of insulating support plates includes at least one insulating support plate, and the first support member and the second support member are also respectively connected to one of the insulating support plates in each group of insulating support plates.

3. The electrostatic filtration device according to claim 2, characterized in that: Each electrode plate includes one or more support structure fixing positions and one or more support structure avoidance positions, wherein the support structure fixing positions are used to fix the support structure connected to the electrode plate, and the support structure avoidance positions are used to avoid the support structure of the electrode plate to be connected that has a different polarity from the electrode plate. The support structure fixing position of two adjacent electrode plates is directly opposite to the support structure avoidance position.

4. The electrostatic filtration device according to claim 1, characterized in that: The exposed conductive material is disposed only on one side of the first electrode plate, Furthermore, the exposed conductive material of the first electrode plate belonging to the negative electrode plate is arranged on the side located on the windward side, and the exposed conductive material of the first electrode plate belonging to the positive electrode plate is arranged on the side located on the leeward side. Among them, the electrode plate includes two surfaces, two side surfaces, a connecting surface and an opposite surface. The distance between the two surfaces of two adjacent electrode plates that are close to each other is the electrode plate spacing. The connecting surface refers to the surface where the connecting part of the electrode plate and the high-voltage power supply is located, and the opposite surface refers to the surface parallel to the connecting surface.

5. The electrostatic filtration device according to claim 1, characterized in that: The internal conductive material is led out at each support structure fixing position and / or a position near each first electrode plate.

6. The electrostatic filtration device according to claim 1, characterized in that: All electrode plates are the first electrode plates; and / or The surface resistivity of the wrapping material of the first electrode plate for wrapping the conductive material is greater than or equal to 1E11Ω.

7. The electrostatic filtration device according to any one of claims 1 to 6, characterized in that: The surface resistivity of the internal conductive material of the first electrode plate is less than or equal to 1E10Ω.

8. The electrostatic filtration device according to any one of claims 1 to 6, characterized in that: The surface resistivity of the internal conductive material of all positive electrode plates is less than or equal to 1E5Ω, The surface resistivity of the internal conductive material of all negative electrode plates is less than or equal to 1E10Ω.

9. The electrostatic filtration device according to any one of claims 1 to 6, characterized in that: The surface resistivity of the internal conductive material of at least one pair of electrode plates near each side edge is less than or equal to 1E5Ω, and the surface resistivity of the internal conductive material of other electrode plates is less than or equal to 1E10Ω, wherein each pair of electrode plates in the at least one pair of electrode plates consists of a positive electrode plate and a negative electrode plate.

10. The electrostatic filtration device according to any one of claims 1 to 6, characterized in that: The surface resistivity of the internal conductive material of the first electrode plate is less than or equal to 1E5Ω.

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