A supporting mechanism in a vacuum chamber of a sputtering coating machine

Abstract

The present invention proposes a supporting mechanism in a vacuum chamber of a sputtering coating machine, including a heating chamber. When a wafer needs to be processed, the supporting mechanism is raised by a second lifting mechanism, and a tray support passes through a corresponding third through hole to receive the wafer entering from a wafer conveying port. Subsequently, the supporting mechanism is lowered by the second lifting mechanism to drop the wafer to the upper surface of a wafer processing tray. The wafer processing tray and the wafer thereon are transported to a designated position for processing by the first lifting mechanism, thereby ensuring the integrity of the wafer during transportation. The structure is simple and has a high degree of automation.

Description

Technical Field

[0001] The present invention relates to the technical field of sputtering coating, and more specifically, to a supporting mechanism in a vacuum chamber of a sputtering coating machine. Background Art

[0002] Sputtering coating technology uses ions to bombard the target surface. The phenomenon of atoms of the target being knocked out is called sputtering. The atoms generated by sputtering are deposited on the surface of the substrate to form a film, which is called sputtering coating. In order to obtain high-quality optical thin films, a certain amount of working gas is filled in the magnetron sputtering device, and the gas is ionized by igniting the target gun. The ions hit the target under the action of the electric field and magnetic field, and the atoms of the target are sputtered and deposited on the substrate to form a film. Accurately control the reaction gas pressure, the distance between the target and the substrate, the sputtering power and other parameters to accurately control the deposition rate to obtain high-quality optical thin film materials.

[0003] The existing technology is to grab the wafer to the wafer carrying mechanism by a robot. Since the wafer is relatively fragile, it is easy to cause the wafer to break or be damaged during the grabbing process. Summary of the invention

[0004] In view of this, in order to solve the above problems, the present invention proposes a supporting mechanism in a vacuum chamber of a sputtering coating machine, including a heating chamber 10, a wafer carrying mechanism 20 connected to the heating chamber 10 through the first through hole 11, a wafer lifting assembly 30 connected to the heating chamber 10 through the second through hole 12, the wafer carrying mechanism 20 includes a first lifting mechanism 21 and a wafer processing tray 22, the lower part of the wafer processing tray 22 is connected to the first lifting mechanism 21, the wafer lifting assembly 30 includes a wafer lifting tray 31 and a second lifting mechanism 32, and the lower side of the wafer lifting tray 31 is connected to the second lifting mechanism 32. Structure 32, the wafer lifting tray 31 is a circular ring structure, and the upper outer ring of the wafer lifting tray 31 is evenly spaced with multiple tray pillars 311. When the wafer needs to be processed, it is lifted by the second lifting mechanism 32, and the tray pillars 311 pass through the corresponding third through holes 221 to receive the wafers entering the wafer conveying port 13. Then, the second lifting mechanism 32 is descended to drop the wafers to the upper surface of the wafer processing tray 22, and the wafer processing tray 22 and the wafers thereon are transported to the designated position for processing by the first lifting mechanism 21 to ensure the integrity of the wafers during transportation. The structure is simple and has a high degree of automation.

[0005] A supporting mechanism in a vacuum chamber of a sputtering coating machine comprises a heating chamber 10, wherein a first through hole 11 is provided at the bottom of the heating chamber 10, a wafer supporting mechanism 20 is connected to the heating chamber 10 via the first through hole 11, a second through hole 12 is further provided at the bottom of the heating chamber 10, the second through hole 12 is provided at the side of the first through hole 11, a wafer lifting assembly 30 is connected to the heating chamber 10 via the second through hole 12, a wafer conveying port 13 is provided at one side of the heating chamber 10, and the wafer supporting mechanism 20 comprises a first lifting mechanism 21 and a wafer processing tray 22, the lower part of the wafer processing tray 22 is connected to the first lifting mechanism 21 for driving the wafer processing tray 22 to move up and down, and the wafer lifting assembly 30 comprises a wafer lifting tray 31 And a second lifting mechanism 32, the lower side of the wafer lifting tray 31 is connected with the second lifting mechanism 32, which is used to drive the wafer lifting tray 31 to move up and down, the wafer lifting tray 31 is a circular ring structure, and the upper outer ring of the wafer lifting tray 31 is evenly spaced with a plurality of tray pillars 311, and the wafer processing tray 22 is provided with third through holes 221 corresponding to the plurality of tray pillars 311. When the wafer needs to be processed, it is lifted by the second lifting mechanism 32, and the tray pillars 311 pass through the corresponding third through holes 221 to receive the wafer entering the wafer conveying port 13, and then it is descended by the second lifting mechanism 32 to drop the wafer to the upper surface of the wafer processing tray 22, and the wafer processing tray 22 and the wafer thereon are transported to the designated position for processing by the first lifting mechanism 21.

[0006] In some embodiments, an air flow duct 222 is disposed on the upper surface of the wafer processing tray 22 . The air flow duct 222 is provided with an air outlet 225 . The air flow duct 222 is connected to the argon gas generating device 70 .

[0007] Furthermore, the airflow duct 222 includes a plurality of airflow sub-ducts 223 and an airflow collecting duct 224. The airflow collecting duct 224 is placed on the outer edge of the upper surface of the wafer processing tray 22. A plurality of air outlets 225 are provided, each air outlet 225 is connected to an airflow sub-duct 223, and the plurality of airflow sub-ducts 223 evenly divide the entire upper surface of the wafer processing tray 22. The plurality of airflow sub-ducts 223 are also connected to the airflow collecting duct 224. The plurality of airflow sub-ducts 223 and the airflow collecting duct 224 make the output argon gas evenly distributed. Due to the Bernoulli principle, the pressure on the side with low flow rate is high, and the pressure on the side with high flow rate is low, so that the wafer can be sucked and fixed on the upper surface of the wafer processing tray 22.

[0008] Furthermore, the upper surface of the wafer processing tray 22 is also provided with a plurality of evenly spaced positioning posts 226 distributed around the center of the wafer processing tray 22. The wafer is clamped with the inner wall of the positioning posts 226 to reduce the contact area with the wafer, making the wafer less susceptible to damage.

[0009] In some embodiments, the first lifting mechanism 21 includes a stepper motor 211, a roller screw 213, a first lifting rod 215 and a first lifting seat 216. The motor shaft of the stepper motor 211 is provided with a first pulley 212. One end of the roller screw 213 is connected to the second pulley 214. The first pulley 212 and the second pulley 214 are connected by a synchronous belt. The other end of the roller screw 213 is threadedly connected to the first lifting seat 216. One end of the first lifting rod 215 is fixedly connected to the bottom of the wafer processing tray 22, and the other end of the first lifting rod 215 is fixedly connected to the first lifting seat 216. The roller screw 213 is driven to rotate by the stepper motor 211, thereby driving the first lifting seat 216 to perform lifting and lowering movements, thereby driving the wafer processing tray 22 to rise and fall. This structure can accurately control the stop position of the wafer processing tray 22 and can move the wafer processing tray 22 to any lifting position.

[0010] Furthermore, the body of the stepper motor 211 is mounted on a stepper motor mounting frame 217, and the stepper motor mounting frame 217 is fixedly connected to the heating chamber 10. A guide column 218 is provided between the stepper motor mounting frame 217 and the first lifting seat 216, so that the stepper motor mounting frame 217 can move linearly up and down.

[0011] In some embodiments, a receiving surface 312 is provided on the top of the tray support 311 for receiving the wafers entering from the wafer conveying port 13 while reducing the contact area with the wafers so that the wafers are not easily damaged.

[0012] Furthermore, an outward-upward guiding slope 313 is provided on the outer side of the receiving surface 312 at the top of the tray support 311 for guiding and positioning the wafer entering the wafer conveying port 13 so that it can accurately fall onto the receiving surface 312 at the top of the tray support 311 .

[0013] Furthermore, a positioning groove 314 is provided at the wafer lifting tray 31, and a welding column 315 is provided on both sides of the bottom of the tray support 311. The two welding columns 315 are arranged at an interval. The welding column 315 is placed in the positioning groove 314 and welded to the bottom surface of the positioning groove 314. During welding, the welding column 315 will be deformed by heat, and the space between the two welding columns 315 can make the welding column 315 have a certain extension after deformation without squeezing the two side walls of the positioning groove 314.

[0014] Furthermore, a limiting column 316 is provided on one side of the welding column 315 close to the wafer and placed at the lower part of the supporting surface 312. The limiting column 316 is close to the side of the welding column 315 and abuts against the inner ring wall of the wafer lifting tray 31 during installation and welding, thereby limiting the position and stabilizing the position for subsequent welding.

[0015] In some embodiments, the second lifting mechanism 32 includes a cylinder body 321, which is fixedly connected to one end of a cylinder bracket 322. The other end of the cylinder bracket 322 passes through the second through hole 12 and is locked to the bottom of the heating chamber 10 through a second flange 326. A second bellows 325 is provided between the second flange 326 and the wafer lifting tray 31. One end of the second bellows 325 is fixedly connected to the bottom of the wafer lifting tray 31, and the other end is fixedly connected to the upper part of the second flange 326, so as to isolate the inside and the outside and prevent the vacuum degree of the heating chamber 10 from being destroyed.

[0016] Furthermore, the cylinder bracket 322 includes a bracket connecting portion 323 and a bracket hollow mounting portion 324. The bracket connecting portion 323 is placed between the bracket hollow mounting portion 324 and the second flange 326. The cylinder shaft of the cylinder body 321 is connected to one end of the second lifting rod 328 through a floating joint 327. The other end of the second lifting rod 328 passes through the bracket hollow mounting portion 324, the bracket connecting portion 323, and the inner cavity of the second bellows 325 in sequence and is fixedly connected to the bottom of one side of the wafer lifting tray 31. The lifting and lowering of the cylinder shaft drives the lifting and lowering of the second lifting rod 328 and the wafer lifting tray 31.

[0017] Furthermore, a limit sleeve 329 is provided on the upper part of the floating joint 327. The limit sleeve 329 is sleeved with the second lifting rod 328 and is placed in the hollow mounting portion 324 of the bracket. The diameter of the limit sleeve 329 is larger than the diameter of the hollow mounting portion 324 of the bracket, and is used to limit the movement of the second lifting rod 328.

[0018] In some embodiments, a vacuum pump water cooling mechanism 40 is provided on the opposite side of the heating chamber 10 where the wafer conveying port 13 is provided, and a vacuum gate valve mechanism 50 is provided between the vacuum pump water cooling mechanism 40 and the heating chamber 10 for separating the vacuum pump water cooling mechanism 40 from the heating chamber 10. A target opening and closing mechanism 60 is provided above the heating chamber 10, and the target opening and closing mechanism 60 is flipably connected to the heating chamber 10 through a flipping mechanism 90 provided on the side, and a magnet is provided at the connection between the target opening and closing mechanism 60 and the heating chamber 10 for making the ion distribution of the sputtering coating more uniform.

[0019] Beneficial effects of the present invention: The present invention proposes a supporting mechanism in a vacuum chamber of a sputtering coating machine, comprising a heating chamber 10, a wafer supporting mechanism 20 connected to the heating chamber 10 through the first through hole 11, a wafer lifting assembly 30 connected to the heating chamber 10 through the second through hole 12, the wafer supporting mechanism 20 comprising a first lifting mechanism 21 and a wafer processing tray 22, the lower part of the wafer processing tray 22 is connected to the first lifting mechanism 21, the wafer lifting assembly 30 comprises a wafer lifting tray 31 and a second lifting mechanism 32, and the lower side of the wafer lifting tray 31 is connected to the second lifting mechanism 32 The wafer lifting tray 31 is a circular ring structure, and a plurality of tray pillars 311 are evenly spaced on the upper outer ring of the wafer lifting tray 31. When the wafer needs to be processed, it is lifted by the second lifting mechanism 32, and the tray pillars 311 pass through the corresponding third through holes 221 to receive the wafers entering the wafer conveying port 13. Subsequently, the second lifting mechanism 32 is lowered to drop the wafers to the upper surface of the wafer processing tray 22, and the wafer processing tray 22 and the wafers thereon are transported to the designated position for processing by the first lifting mechanism 21 to ensure the integrity of the wafers during transportation. The structure is simple and has a high degree of automation. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is an overall structural diagram of the supporting mechanism in the vacuum chamber of the sputtering coating machine of the present invention.

[0021] Figure 2 It is a structural diagram of the heating cavity of the supporting mechanism in the vacuum chamber of the sputtering coating machine of the present invention.

[0022] Figure 3 The present invention is a structural diagram of the installation of a heating chamber, a wafer lifting assembly and a wafer bearing mechanism of a supporting mechanism in a vacuum chamber of a sputtering coating machine.

[0023] Figure 4 The present invention is a structural diagram of a wafer lifting assembly of a supporting mechanism in a vacuum chamber of a sputtering coating machine.

[0024] Figure 5 for Figure 4 An enlarged view of part A of FIG.

[0025] Figure 6 for Figure 4 Cross-sectional view of .

[0026] Figure 7 It is a structural diagram of the wafer carrying mechanism of the supporting mechanism in the vacuum chamber of the sputtering coating machine of the present invention.

[0027] Figure 8It is a structural diagram of a wafer processing tray 22 of a wafer carrying mechanism of a supporting mechanism in a vacuum chamber of a sputtering coating machine of the present invention.

[0028] Fig. 9 The present invention is a three-dimensional diagram of a wafer supporting mechanism of a supporting mechanism in a vacuum chamber of a sputtering coating machine.

[0029] Main component symbols

[0030] Heating chamber 10, first through hole 11, second through hole 12, wafer conveying port 13, wafer carrying mechanism 20, first lifting mechanism 21, stepping motor 211, first pulley 212, roller screw 213, second pulley 214, first lifting rod 215, first lifting seat 216, stepping motor mounting frame 217, guide column 218, wafer processing tray 22, third through hole 221, airflow duct 222, airflow sub-duct 223, airflow collecting duct 224, air outlet 225, positioning column 226, wafer lifting assembly 30, Wafer lifting tray 31, tray support 311, receiving surface 312, guide slope 313, positioning groove 314, welding column 315, limit column 316, second lifting mechanism 32, cylinder body 321, cylinder bracket 322, bracket connecting part 323, bracket hollow mounting part 324, second bellows 325, second flange 326, floating joint 327, second lifting rod 328, limit sleeve 329, vacuum pump water cooling mechanism 40, vacuum gate valve mechanism 50, target opening and closing mechanism 60, argon gas generating device 70, flipping mechanism 90.

[0031] The following specific implementation manner will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION Embodiment 1:

[0032] like Figure 1-3As shown, a supporting mechanism in a vacuum chamber of a sputtering coating machine includes a heating chamber 10, a first through hole 11 is provided at the bottom of the heating chamber 10, a wafer supporting mechanism 20 is connected to the heating chamber 10 through the first through hole 11, a second through hole 12 is further provided at the bottom of the heating chamber 10, the second through hole 12 is provided on the side of the first through hole 11, a wafer lifting assembly 30 is connected to the heating chamber 10 through the second through hole 12, a wafer conveying port 13 is provided on one side of the heating chamber 10, the wafer supporting mechanism 20 includes a first lifting mechanism 21 and a wafer processing tray 22, the lower part of the wafer processing tray 22 is connected to the first lifting mechanism 21 for driving the wafer processing tray 22 to move up and down, and the wafer lifting assembly 30 includes a wafer lifting tray 31 and The second lifting mechanism 32 is connected to the lower side of the wafer lifting tray 31, and is used to drive the wafer lifting tray 31 to move up and down. The wafer lifting tray 31 is a circular ring structure, and the upper outer ring of the wafer lifting tray 31 is evenly spaced with a plurality of tray pillars 311, and the wafer processing tray 22 is provided with third through holes 221 corresponding to the plurality of tray pillars 311. When the wafer needs to be processed, it is lifted by the second lifting mechanism 32, and the tray pillars 311 pass through the corresponding third through holes 221 to receive the wafer entering the wafer conveying port 13. Then, it is lowered by the second lifting mechanism 32 to drop the wafer to the upper surface of the wafer processing tray 22, and the wafer processing tray 22 and the wafer thereon are transported to the designated position for processing by the first lifting mechanism 21.

[0033] A vacuum pump water cooling mechanism 40 is provided on the opposite side of the heating chamber 10 where the wafer conveying port 13 is provided. A vacuum gate valve mechanism 50 is provided between the vacuum pump water cooling mechanism 40 and the heating chamber 10 for separating the vacuum pump water cooling mechanism 40 from the heating chamber 10. A target opening and closing mechanism 60 is provided above the heating chamber 10. The target opening and closing mechanism 60 is flipably connected to the heating chamber 10 through a flipping mechanism 90 provided on the side. A magnet is provided at the connection between the target opening and closing mechanism 60 and the heating chamber 10 for making the ion distribution of the sputtering coating more uniform.

[0034] like Figure 7-9As shown, an airflow duct 222 is provided on the upper surface of the wafer processing tray 22, and the airflow duct 222 is provided with an air outlet 225. The airflow duct 222 is connected to the argon gas generating device 70, and the airflow duct 222 includes a plurality of airflow sub-ducts 223 and an airflow collecting duct 224. The airflow collecting duct 224 is placed on the outer edge of the upper surface of the wafer processing tray 22, and a plurality of air outlets 225 are provided, each of which is connected to an airflow sub-duct 223. The plurality of airflow sub-ducts 223 evenly divide the upper surface of the entire wafer processing tray 22. The flow channel 223 is also connected to the airflow collection channel 224. The plurality of airflow channel 223 and airflow collection channel 224 make the output argon gas evenly distributed. Due to the Bernoulli principle, the pressure on the side with low flow rate is high, and the pressure on the side with high flow rate is low, so that the wafer can be sucked and fixed on the upper surface of the wafer processing tray 22. The upper surface of the wafer processing tray 22 is also provided with a plurality of positioning columns 226 evenly spaced and distributed at the center of the wafer processing tray 22. The wafer is clamped with the inner wall of the positioning column 226 to reduce the contact area with the wafer, so that the wafer is not easily damaged. The first lifting mechanism 21 includes A stepper motor 211, a roller screw 213, a first lifting rod 215 and a first lifting seat 216. The motor shaft of the stepper motor 211 is provided with a first pulley 212. One end of the roller screw 213 is connected to the second pulley 214. The first pulley 212 and the second pulley 214 are connected through a synchronous belt. The other end of the roller screw 213 is threadedly connected to the first lifting seat 216. One end of the first lifting rod 215 is fixedly connected to the bottom of the wafer processing tray 22. The other end of the first lifting rod 215 is fixedly connected to the first lifting seat 216. 11 drives the roller screw 213 to rotate, thereby driving the first lifting seat 216 to perform lifting movement, thereby driving the wafer processing tray 22 to move up and down. This structure can accurately control the stop position of the wafer processing tray 22 and can move the wafer processing tray 22 to any lifting position. The body of the stepper motor 211 is installed on the stepper motor mounting frame 217, and the stepper motor mounting frame 217 is fixedly connected to the heating chamber 10. A guide column 218 is provided between the stepper motor mounting frame 217 and the first lifting seat 216, so that the stepper motor mounting frame 217 can perform linear lifting movement.

[0035] like Figure 4-6As shown, a receiving surface 312 is provided on the top of the tray support column 311 for receiving the wafer entering from the wafer conveying port 13 while reducing the contact area with the wafer so that the wafer is not easily damaged. A guiding inclined surface 313 facing outward and upward is provided on the outer side of the receiving surface 312 on the top of the tray support column 311 for guiding and positioning the wafer entering from the wafer conveying port 13 so that it can accurately fall onto the receiving surface 312 on the top of the tray support column 311. A positioning groove 314 is provided at the wafer lifting tray 31. A welding column 315 is provided on both sides of the bottom of the tray support column 311. The two welding columns 315 are spaced apart. The welding columns 315 are placed in the positioning groove 314 and The bottom surface of the positioning groove 314 is welded. During welding, the welding column 315 will be deformed by heat. The space between the two welding columns 315 can make the welding column 315 stretch to a certain extent after deformation without squeezing the two side walls of the positioning groove 314. The welding column 315 is close to one side of the wafer and is placed at the lower part of the receiving surface 312. A limiting column 316 is provided. The limiting column 316 is close to the side of the welding column 315 and is in contact with the inner ring wall of the wafer lifting tray 31 during installation and welding. The limiting effect plays a role in stabilizing the position for subsequent welding. The second lifting mechanism 32 includes a cylinder body 321, and the cylinder body 321 is fixedly connected to one end of the cylinder bracket 322. The cylinder The other end of the bracket 322 passes through the second through hole 12 and is locked with the bottom of the heating chamber 10 through the second flange 326. A second bellows 325 is provided between the second flange 326 and the wafer lifting tray 31. One end of the second bellows 325 is fixedly connected to the bottom of the wafer lifting tray 31, and the other end is fixedly connected to the upper part of the second flange 326 to isolate the inside and the outside and prevent the vacuum degree of the heating chamber 10 from being destroyed. The cylinder bracket 322 includes a bracket connecting portion 323 and a bracket hollow mounting portion 324. The bracket connecting portion 323 is placed between the bracket hollow mounting portion 324 and the second flange 326. The cylinder shaft of the cylinder body 321 is through It is connected to one end of the second lifting rod 328 through the floating joint 327, and the other end of the second lifting rod 328 passes through the hollow mounting portion 324 of the bracket, the bracket connecting portion 323, the inner cavity of the second bellows 325 in sequence and is fixedly connected to the bottom of one side of the wafer lifting tray 31. The lifting and lowering of the cylinder shaft drives the lifting and lowering of the second lifting rod 328 and the wafer lifting tray 31. A limit sleeve 329 is also provided on the upper part of the floating joint 327. The limit sleeve 329 is sleeved with the second lifting rod 328 and the limit sleeve 329 is placed in the hollow mounting portion 324 of the bracket. The diameter of the limit sleeve 329 is larger than the diameter of the hollow mounting portion 324 of the bracket, and is used to limit the movement of the second lifting rod 328.

[0036] Beneficial effects of the present invention: The present invention proposes a supporting mechanism in a vacuum chamber of a sputtering coating machine, comprising a heating chamber 10, a wafer supporting mechanism 20 connected to the heating chamber 10 through the first through hole 11, a wafer lifting assembly 30 connected to the heating chamber 10 through the second through hole 12, the wafer supporting mechanism 20 comprising a first lifting mechanism 21 and a wafer processing tray 22, the lower part of the wafer processing tray 22 is connected to the first lifting mechanism 21, the wafer lifting assembly 30 comprises a wafer lifting tray 31 and a second lifting mechanism 32, and the lower side of the wafer lifting tray 31 is connected to the second lifting mechanism 32 The wafer lifting tray 31 is a circular ring structure, and a plurality of tray pillars 311 are evenly spaced on the upper outer ring of the wafer lifting tray 31. When the wafer needs to be processed, it is lifted by the second lifting mechanism 32, and the tray pillars 311 pass through the corresponding third through holes 221 to receive the wafers entering the wafer conveying port 13. Subsequently, the second lifting mechanism 32 is lowered to drop the wafers to the upper surface of the wafer processing tray 22, and the wafer processing tray 22 and the wafers thereon are transported to the designated position for processing by the first lifting mechanism 21 to ensure the integrity of the wafers during transportation. The structure is simple and has a high degree of automation.

[0037] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A supporting mechanism in a vacuum chamber of a sputtering coating machine, comprising a heating chamber (10), wherein a first through hole (11) is provided at the bottom of the heating chamber (10), a wafer supporting mechanism (20) is connected to the heating chamber (10) via the first through hole (11), a second through hole (12) is provided at the bottom of the heating chamber (10), the second through hole (12) is provided on the side of the first through hole (11), a wafer lifting assembly (30) is connected to the heating chamber (10) via the second through hole (12), and a wafer conveying port (13) is provided on one side of the heating chamber (10), characterized in that: The wafer carrying mechanism (20) comprises a first lifting mechanism (21) and a wafer processing tray (22); the lower part of the wafer processing tray (22) is connected to the first lifting mechanism (21) for driving the wafer processing tray (22) to move up and down; the wafer lifting assembly (30) comprises a wafer lifting tray (31) and a second lifting mechanism (32); the lower side of the wafer lifting tray (31) is connected to the second lifting mechanism (32) for driving the wafer lifting tray (31) to move up and down; the wafer lifting tray (31) is a circular ring structure; the upper part of the wafer lifting tray (31) A plurality of tray pillars (311) are evenly spaced on the outer ring, and third through holes (221) are provided at locations corresponding to the plurality of tray pillars (311) on the wafer processing tray (22). When wafer processing is required, the tray is raised by the second lifting mechanism (32), and the tray pillars (311) pass through the corresponding third through holes (221) to receive wafers entering from the wafer conveying port (13). Subsequently, the second lifting mechanism (32) is lowered to drop the wafers onto the upper surface of the wafer processing tray (22), and the wafer processing tray (22) and the wafers thereon are transported to a designated location for processing by the first lifting mechanism (21).

2. The supporting mechanism in the vacuum chamber of the sputtering coating machine as claimed in claim 1, characterized in that: An airflow duct (222) is provided on the upper surface of the wafer processing tray (22), and the airflow duct (222) is provided with an air outlet (225). The airflow duct (222) is connected to the argon gas generating device (70), and the airflow duct (222) includes a plurality of airflow sub-ducts (223) and an airflow collecting duct (224). The airflow collecting duct (224) is placed on the outer edge of the upper surface of the wafer processing tray (22), and a plurality of air outlets (225) are provided, and each air outlet (225) 5) connecting an air flow pipe (223), wherein the plurality of air flow pipes (223) evenly divide the upper surface of the entire wafer processing tray (22), and the plurality of air flow pipes (223) are also connected to an air flow collection pipe (224). The plurality of air flow pipes (223) and the air flow collection pipe (224) allow the output argon gas to be evenly distributed. Due to the Bernoulli principle, the side with a low flow rate has a high pressure, and the side with a high flow rate has a low pressure, so that the wafer can be sucked and fixed on the upper surface of the wafer processing tray (22).

3. The supporting mechanism in the vacuum chamber of the sputtering coating machine as claimed in claim 1, characterized in that: The upper surface of the wafer processing tray (22) is also provided with a plurality of positioning posts (226) distributed at a uniform interval with respect to the center of the wafer processing tray (22), and the wafer is clamped with the inner wall of the positioning posts (226) to reduce the contact area with the wafer, thereby making the wafer less susceptible to damage.

4. The supporting mechanism in the vacuum chamber of the sputtering coating machine as claimed in claim 1, characterized in that: The first lifting mechanism (21) comprises a stepping motor (211), a roller screw (213), a first lifting rod (215) and a first lifting seat (216); a first belt pulley (212) is provided on the motor shaft of the stepping motor (211); one end of the roller screw (213) is connected to a second belt pulley (214); the first belt pulley (212) and the second belt pulley (214) are connected via a synchronous belt; the other end of the roller screw (213) is threadedly connected to the first lifting seat (216); One end of the lifting rod (215) is fixedly connected to the bottom of the wafer processing tray (22), and the other end of the first lifting rod (215) is fixedly connected to the first lifting seat (216). The stepping motor (211) drives the roller screw (213) to rotate, thereby driving the first lifting seat (216) to perform lifting movement, thereby driving the wafer processing tray (22) to move up and down. This structure accurately controls the stop position of the wafer processing tray (22) and moves the wafer processing tray (22) to any lifting position.

5. The supporting mechanism in the vacuum chamber of the sputtering coating machine as claimed in claim 4, characterized in that: The body of the stepper motor (211) is mounted on a stepper motor mounting frame (217); the stepper motor mounting frame (217) is fixedly connected to the heating chamber (10); and a guide column (218) is provided between the stepper motor mounting frame (217) and the first lifting seat (216) so that the stepper motor mounting frame (217) can move in a linear manner.

6. The supporting mechanism in the vacuum chamber of the sputtering coating machine as claimed in claim 1, characterized in that: The top of the tray support (311) is provided with a receiving surface (312) for receiving the wafer entering from the wafer conveying port (13) while reducing the contact area with the wafer, thereby making the wafer less likely to be damaged.

7. The supporting mechanism in the vacuum chamber of the sputtering coating machine as claimed in claim 1, characterized in that: An outward-upward guiding inclined surface (313) is provided on the outer side of the receiving surface (312) at the top of the tray support (311) for guiding and positioning the wafer entering from the wafer conveying port (13) so that it can accurately fall onto the receiving surface (312) at the top of the tray support (311).

8. The supporting mechanism in the vacuum chamber of the sputtering coating machine as claimed in claim 1, characterized in that: A positioning groove (314) is provided at the tray support (311), and a welding column (315) is provided on both sides of the bottom of the tray support (311). The two welding columns (315) are arranged at an interval, and the welding column (315) is placed in the positioning groove (314) and welded to the bottom surface of the positioning groove (314). During welding, the welding column (315) will be deformed by heat, and the space between the two welding columns (315) can enable the welding column (315) to stretch after deformation without squeezing the two side walls of the positioning groove (314).

9. The supporting mechanism in the vacuum chamber of the sputtering coating machine as claimed in claim 8, characterized in that: A limiting column (316) is provided on one side of the welding column (315) close to the wafer and located at the lower part of the receiving surface (312). The limiting column (316) is close to the side of the welding column (315) and abuts against the inner ring wall of the wafer lifting tray (31) during installation and welding, thus having a limiting effect and stabilizing the position for subsequent welding.

10. The supporting mechanism in the vacuum chamber of the sputtering coating machine as claimed in claim 1, characterized in that: The second lifting mechanism (32) includes a cylinder body (321), the cylinder body (321) is fixedly connected to one end of a cylinder bracket (322), the other end of the cylinder bracket (322) passes through the second through hole (12), and is locked to the bottom of the heating chamber (10) through a second flange (326), a second bellows (325) is provided between the second flange (326) and the wafer lifting tray (31), one end of the second bellows (325) is fixedly connected to the bottom of the wafer lifting tray (31), and the other end is fixedly connected to the upper part of the second flange (326), so as to isolate the inside and the outside and prevent the vacuum degree of the heating chamber (10) from being destroyed.

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