A carrier copper foil roughening solution and a carrier copper foil roughening method

Abstract

The present disclosure relates to the technical field of carrier copper foil, and in particular to a carrier copper foil roughening solution and a carrier copper foil roughening method. The carrier copper foil roughening solution comprises the following components: 20 g / L to 25 g / L copper, 30 g / L to 50 g / L sulfuric acid, 0.1 g / L to 1 g / L additives, and a solvent; the additives include at least one of carbon nanotubes and non-magnetic metal inorganic salts. The roughening solution disclosed in the present disclosure can make the copper foil layer of the carrier copper foil have a suitable surface roughness, while increasing the surface area of ​​the copper foil layer of the carrier copper foil, thereby improving the bonding force between the copper foil layer and the substrate.

Description

Technical Field

[0001] The present disclosure relates to the technical field of carrier copper foil, and in particular to a carrier copper foil roughening solution and a carrier copper foil roughening method. Background Art

[0002] In the field of electronic materials, carrier copper foil is an important product with good conductivity, reliability and corrosion resistance. Carrier copper foil has good stability under high temperature, high pressure, high frequency and other working environments.

[0003] During the use of the carrier copper foil, the bonding force between the copper foil and the substrate is an issue that needs to be focused on. In order to improve the bonding force between the carrier copper foil and the substrate, in the prior art, the method of increasing the surface roughness of the carrier copper foil is often adopted. When the surface roughness of the carrier copper foil increases, the bonding force between the carrier copper foil and the substrate can be correspondingly improved. However, the surface roughness is actually a manifestation of the surface unevenness of the copper foil layer of the carrier copper foil. Since the thickness of the copper foil layer of the carrier copper foil is relatively small (usually an ultra-thin copper foil layer), the improvement of the surface roughness of the carrier copper foil is limited. For example, when the surface roughness of the carrier copper foil increases, the uneven surface may make the local thickness of the copper foil layer of the carrier copper foil too small, and even affect the intrinsic properties of the carrier copper foil such as the strength.

[0004] Therefore, since the copper foil layer of the carrier copper foil has a relatively small thickness, the improvement of the surface roughness of the carrier copper foil is actually very limited on the basis of maintaining the strength of the copper foil layer itself.

[0005] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0006] According to a first aspect of the present disclosure, a carrier copper foil roughening solution is provided, comprising the following components: 20 g / L~25 g / L copper, 30 g / L~50 g / L sulfuric acid, 0.1 g / L~1 g / L additives and a solvent; the additives include at least one of carbon nanotubes and non-magnetic metal inorganic salts.

[0007] In an exemplary embodiment of the present disclosure, based on the above scheme, the non-magnetic metal inorganic salt includes at least one of zinc sulfate, zinc chloride, aluminum sulfate, aluminum chloride, magnesium sulfate, magnesium chloride, calcium carbonate and calcium chloride.

[0008] In an exemplary embodiment of the present disclosure, based on the above scheme, the solvent is water.

[0009] According to a second aspect of the present disclosure, a method for roughening a carrier copper foil is provided, comprising the following steps:

[0010] The carrier copper foil is subjected to a first roughening treatment and a second roughening treatment in sequence; the first roughening treatment uses the roughening solution of the first aspect, and the second roughening treatment uses the roughening solution of the first aspect.

[0011] In an exemplary embodiment of the present disclosure, based on the above-mentioned solution, the temperature of the roughening solution in the first roughening treatment is 15° C. to 20° C.

[0012] In an exemplary embodiment of the present disclosure, based on the above-mentioned solution, the current density of the first roughening treatment is 70A / square decimeter to 100A / square decimeter.

[0013] In an exemplary embodiment of the present disclosure, based on the above-mentioned solution, the time of the first roughening treatment is 10S to 50S.

[0014] In an exemplary embodiment of the present disclosure, based on the above scheme, the temperature of the roughening solution in the second roughening treatment is 15° C. to 20° C.

[0015] In an exemplary embodiment of the present disclosure, based on the above-mentioned solution, the current density of the second roughening treatment is 10A / square decimeter to 30A / square decimeter.

[0016] In an exemplary embodiment of the present disclosure, based on the above-mentioned solution, the time of the second roughening treatment is 10S to 50S.

[0017] In an exemplary embodiment of the present disclosure, based on the above-mentioned solution, the first roughening treatment and the second roughening treatment are respectively performed in two adjacent roughening tanks, and the two adjacent roughening tanks contain the roughening solution respectively.

[0018] It can be seen from the above technical solution that the present disclosure has the following positive effects:

[0019] When the carrier copper foil is roughened by the roughening solution disclosed in the present invention, the copper foil layer of the carrier copper foil can have a suitable surface roughness, while increasing the surface area of ​​the copper foil layer of the carrier copper foil, thereby improving the bonding force between the copper foil layer of the carrier copper foil and the substrate. That is, unlike the existing method of simply increasing the surface roughness of the copper foil layer of the carrier copper foil, the roughening solution disclosed in the present invention can make the copper foil layer of the carrier copper foil have a suitable surface roughness and a large specific surface area, so that the copper foil layer of the carrier copper foil can maintain good strength and have good bonding force with the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and other features and advantages of the present disclosure will become more apparent by describing in detail example embodiments thereof with reference to the attached drawings.

[0021] Figure 1It is a structural schematic diagram of a carrier copper foil roughening device in an embodiment of the present disclosure.

[0022] Figure 2 It is a structural schematic diagram of an integrated carrier copper foil production device in an embodiment of the present disclosure.

[0023] Figure 3 It is a schematic structural diagram of a carrier copper foil in an embodiment of the present disclosure.

[0024] Figure 4~Figure 7 It is a schematic diagram of the carrier copper foil and the peeling state in Example 1 of the present disclosure.

[0025] The main components in the figure are described as follows:

[0026] 10. Carrier copper foil roughening equipment; 20. First roughening tank; 30. Second roughening tank; 40. Transfer roller; 50. First carrier copper foil; 1. Electrolysis device; 2. Stripping layer generating device; 3. Copper foil layer generating device; 4. Conveying roller group; 5. Terminal processing device; 6. Second carrier copper foil; 61. Carrier layer; 62. Stripping layer; 621. First brush plating layer; 622. Second brush plating layer; 63. Copper foil layer. DETAILED DESCRIPTION

[0027] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be comprehensive and complete and will fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed description will be omitted.

[0028] In order to improve the bonding force between the copper foil layer of the carrier copper foil and substrates such as epoxy resin, PPO, PTFE, etc., the prior art often adopts a method of increasing the surface roughness of the copper foil layer of the carrier copper foil. When the surface roughness of the carrier copper foil layer is increased, the copper foil layer can be better attached to the surface of the substrate, thereby improving the bonding force between the copper foil layer and the substrate. However, since the copper foil layer of the carrier copper foil is usually an ultra-thin copper foil, blindly increasing the surface roughness may destroy the intrinsic properties of the ultra-thin copper foil. For example, when the surface roughness of the ultra-thin copper foil increases, the flatness of the ultra-thin copper foil decreases, and the concave-convex degree of the copper foil surface becomes larger, which will cause the strength of the ultra-thin copper foil in the concave position to decrease, thereby affecting the normal use of the ultra-thin copper foil. That is, in order to keep the ultra-thin copper foil with good intrinsic properties, it is actually difficult to further improve the bonding force between the ultra-thin copper foil and the substrate by increasing the surface roughness.

[0029] In order to solve this technical problem, the embodiment of the present disclosure provides a carrier copper foil roughening solution, including the following components: 20g / L~25g / L copper, 30g / L~50g / L sulfuric acid, 0.1g / L~1g / L additives and solvents; the additives include at least one of carbon nanotubes and non-magnetic metal inorganic salts. When the carrier copper foil is roughened by the roughening solution of the present disclosure, the surface area of ​​the copper foil layer of the carrier copper foil can be increased while the copper foil layer of the carrier copper foil has a suitable surface roughness, thereby improving the bonding force between the copper foil layer of the carrier copper foil and the substrate. That is, unlike the existing method of blindly improving the surface roughness of the copper foil layer of the carrier copper foil, the roughening solution of the present disclosure can make the copper foil layer of the carrier copper foil have a suitable surface roughness, so that the copper foil layer of the carrier copper foil can maintain good strength. On the basis of making the copper foil layer of the carrier copper foil have a suitable roughness, the surface area of ​​the copper foil layer of the carrier copper foil can be increased by the roughening solution of the present disclosure. When the surface area of ​​the copper foil layer of the carrier copper foil is increased, the bonding force between the copper foil layer and the substrate can be effectively improved. For example, compared with the existing roughening solution, the roughening solution in some embodiments of the present disclosure can increase the surface area of ​​the carrier copper foil layer by 200% to 500% on the basis of obtaining a roughness similar to that of the existing roughening solution, thereby greatly improving the bonding force between the copper foil layer and the substrate.

[0030] In the carrier copper foil roughening solution disclosed in the present invention, carbon nanotubes have excellent physical and chemical properties, which can affect the microstructure formation of the copper foil surface during the roughening process; the type of non-magnetic metal inorganic salt also has an important influence on the roughening effect. The various components in the roughening solution work together to effectively increase the surface area of ​​the roughened surface of the carrier copper foil, so that the carrier copper foil has good bonding strength with the substrate.

[0031] It can be understood that, in the carrier copper foil roughening solution disclosed in the present invention, the concentration of each component is expressed based on the volume of the carrier copper foil roughening solution, and the mass of each component is based on the concentration of the volume of the carrier copper foil roughening solution.

[0032] For example, the copper concentration indicates the concentration of the copper mass based on the volume of the carrier copper foil roughening solution. Optionally, the copper concentration can be, but is not limited to, 20 g / L, 20.5 g / L, 21 g / L, 21.5 g / L, 22 g / L, 22.5 g / L, 23 g / L, 23.5 g / L, 24 g / L, 24.5 g / L, 25 g / L. It is understood that the copper concentration can also be other suitable selections within the range of 20 g / L to 25 g / L.

[0033] For example, the concentration of sulfuric acid indicates the mass of sulfuric acid based on the volume of the carrier copper foil roughening solution. Optionally, the concentration of sulfuric acid can be, but is not limited to, 30 g / L, 32 g / L, 35 g / L, 38 g / L, 40 g / L, 42 g / L, 45 g / L, 48 g / L, and 50 g / L. It is understood that the concentration of sulfuric acid can also be other suitable selections within the range of 30 g / L to 50 g / L.

[0034] For example, the concentration of the additive indicates the concentration of the mass of the additive based on the volume of the carrier copper foil roughening solution. Optionally, the concentration of the additive can be, but is not limited to, 0.1 g / L, 0.2 g / L, 0.3 g / L, 0.4 g / L, 0.5 g / L, 0.6 g / L, 0.7 g / L, 0.8 g / L, 0.9 g / L, 1 g / L. It is understood that the concentration of the additive can also be other suitable selections within the range of 0.1 g / L to 1 g / L.

[0035] In some embodiments, the carrier copper foil roughening solution is composed of the following components: 20 g / L to 25 g / L copper, 30 g / L to 50 g / L sulfuric acid, 0.1 g / L to 1 g / L additives, and a solvent; the additives include at least one of carbon nanotubes and non-magnetic metal inorganic salts. It is understood that in the carrier copper foil roughening solution of this embodiment, the concentration of copper, the concentration of sulfuric acid, and the concentration of the additive can be selected from the concentrations listed above, and will not be repeated here.

[0036] In some embodiments, the non-magnetic metal inorganic salt includes at least one of zinc sulfate, zinc chloride, aluminum sulfate, aluminum chloride, magnesium sulfate, magnesium chloride, calcium carbonate and calcium chloride. That is, the additive includes at least one of carbon nanotubes, zinc sulfate, zinc chloride, aluminum sulfate, aluminum chloride, magnesium sulfate, magnesium chloride, calcium carbonate and calcium chloride. Optionally, the additive is carbon nanotubes.

[0037] In some embodiments, the solvent is water.

[0038] Another embodiment of the present disclosure provides a method for roughening a carrier copper foil. The method for roughening a carrier copper foil comprises the following steps: performing a first roughening treatment and a second roughening treatment on the carrier copper foil in sequence; the first roughening treatment uses the above-mentioned roughening solution, and the second roughening treatment uses the above-mentioned roughening solution. The two-stage roughening method is used to roughen the carrier copper foil, and while forming a relatively suitable surface roughness on the surface of the copper foil layer of the carrier copper foil, the copper foil layer of the carrier copper foil has a larger surface area, effectively increasing the bonding force between the copper foil layer of the carrier copper foil and the substrate. In this way, the ultra-thin copper foil layer of the carrier copper foil can maintain a good bonding force with the substrate while maintaining good intrinsic performance.

[0039] Furthermore, the carrier copper foil prepared by the roughening method disclosed in the present invention has the characteristics of ultra-thinness, low roughness, high peel strength and good etching properties, and is suitable for high-end application scenarios such as high-frequency and high-speed copper-clad laminates, flexible printed circuit boards and high-density interconnection technology boards, and can effectively expand the application scope of carrier copper foil in the field of electronic materials. For example, in high-frequency and high-speed circuits, the low roughness and high bonding performance of the carrier copper foil prepared by the roughening method disclosed in the present invention helps to reduce signal transmission loss and improve signal integrity; in flexible printed circuit boards, good etching properties and strength ensure the performance stability of the circuit board under conditions such as bending.

[0040] Furthermore, the two-stage roughening process disclosed in the present invention can make the roughening process more stable and efficient. The appropriate temperature range avoids the problem of excessive energy consumption or poor roughening effect. Reasonable current density and time settings ensure the roughening efficiency while helping to obtain a copper foil layer with good consistency. For example, in large-scale production, the roughening method disclosed in the present invention can stably produce carrier copper foil products with consistent performance, reduce the defective rate caused by product performance fluctuations, and improve production efficiency and economic benefits.

[0041] In some embodiments, the temperature of the roughening solution in the first roughening treatment is 15°C to 20°C. If the temperature of the roughening solution is too low, it is difficult to obtain a good roughening effect. If the temperature of the roughening solution is too high, on the one hand, it will produce higher energy consumption, and on the other hand, the roughening speed will be too fast, and it will be difficult to control the stable growth of the surface area of ​​the copper foil layer of the carrier copper foil. Optionally, the temperature of the roughening solution in the first roughening treatment is 15°C, 16°C, 17°C, 18°C, 19°C, 20°C. It is understandable that the temperature of the roughening solution in the first roughening treatment can also be selected in the range of 15°C to 20°C.

[0042] In some embodiments, the current density of the first roughening treatment is 70A / square decimeter to 100A / square decimeter. If the current density of the first roughening treatment is too small, it is difficult to obtain a high roughening efficiency, and if the current density of the first roughening treatment is too large, it is difficult to obtain a copper foil layer with good consistency. Optionally, the current density of the first roughening treatment can be 70A / square decimeter, 80A / square decimeter, 90A / square decimeter, 100A / square decimeter, etc.

[0043] In some embodiments, the first roughening treatment time is 10S to 50S. If the first roughening treatment time is too short, it is difficult to obtain a good roughening effect. If the first roughening treatment time is too long, on the one hand, it will generate high energy consumption, and on the other hand, it may cause excessive damage to the copper foil layer of the carrier copper foil, affecting the performance of the copper foil layer. Optionally, the first roughening treatment time can be 10S, 20S, 30S, 40S, 50S, etc.

[0044] In some embodiments, the temperature of the roughening solution in the second roughening treatment is 15°C to 20°C. If the temperature of the roughening solution is too low, it is difficult to obtain a good roughening effect. If the temperature of the roughening solution is too high, on the one hand, it will produce higher energy consumption, and on the other hand, the roughening speed will be too fast, and it will be difficult to control the stable growth of the surface area of ​​the copper foil layer of the carrier copper foil. Optionally, the temperature of the roughening solution in the second roughening treatment is 15°C, 16°C, 17°C, 18°C, 19°C, 20°C. It is understandable that the temperature of the roughening solution in the second roughening treatment can also be selected in the range of 15°C to 20°C.

[0045] In some embodiments, the current density of the second roughening treatment is 10A / square decimeter to 30A / square decimeter. If the current density of the second roughening treatment is too small, it is difficult to obtain a high roughening efficiency, and if the current density of the second roughening treatment is too large, it is difficult to obtain a copper foil layer with good consistency. Optionally, the current density of the second roughening treatment can be 10 A / square decimeter, 15A / square decimeter, 20A / square decimeter, 25A / square decimeter, 30A / square decimeter, etc.

[0046] In some embodiments, the second roughening treatment time is 10S to 50S. If the second roughening treatment time is too short, it is difficult to obtain a good roughening effect. If the second roughening treatment time is too long, on the one hand, it will generate higher energy consumption, and on the other hand, it may cause excessive damage to the copper foil layer of the carrier copper foil, affecting the performance of the copper foil layer. Optionally, the second roughening treatment time can be 10S, 20S, 30S, 40S, 50S, etc.

[0047] In some embodiments, the first roughening treatment and the second roughening treatment are respectively performed in two adjacent roughening tanks, and the two adjacent roughening tanks contain roughening solutions respectively. The first roughening treatment and the second roughening treatment are respectively performed in two adjacent roughening tanks to obtain a more sufficient roughening effect, so that the copper foil layer of the carrier copper foil has both a larger surface area and better surface consistency.

[0048] Please see Figure 1 In another embodiment of the present disclosure, a carrier copper foil roughening device 10 is provided. The carrier copper foil roughening device 10 includes a first roughening tank 20 and a second roughening tank 30 sequentially arranged along the transmission direction of the first carrier copper foil 50. Roughening solution and roughening solution are contained in the first roughening tank and the second roughening tank, respectively. The carrier copper foil is subjected to a first roughening treatment and a second roughening treatment in the first roughening tank and the second roughening tank, respectively. The solution, solution temperature, current density, treatment time, etc. used in the first roughening treatment and the second roughening treatment can be selected correspondingly from the parameters listed above, and will not be repeated here.

[0049] It can be understood that the carrier copper foil roughening device further includes a transfer roller 40, through which the first carrier copper foil 50 is sequentially transferred to the first roughening tank and the second roughening tank.

[0050] In some embodiments, the carrier copper foil can be prepared by the following integrated carrier copper foil production equipment. Figure 2 As shown, the integrated carrier copper foil production equipment includes an electrolytic device 1, a peeling layer generating device 2, a copper foil layer generating device 3 and a conveying roller group 4. Among them, the electrolytic device is used to generate the carrier layer; the peeling layer generating device is used to prepare the peeling layer on the preset surface of the carrier layer; the copper foil layer generating device is arranged at the rear side of the peeling layer generating device, and is used to prepare the copper foil layer on the surface of the peeling layer away from the carrier layer; the conveying roller group is connected between the electrolytic device and the peeling layer generating device, and is used to transfer the carrier layer to the peeling layer generating device within a predetermined time. It can be understood that in the copper foil generating device, the copper foil layer is prepared on the surface of the peeling layer away from the carrier layer by the above-mentioned copper electrodeposition liquid.

[0051] As for the carrier copper foil, it can be a single-sided rough copper foil or a double-sided smooth copper foil. Conventional production equipment can only form a single-sided rough copper foil, but the integrated carrier copper foil production equipment disclosed in the present invention can continuously produce three key processes of foil production-stripping layer preparation-body copper foil production online, and can form copper foil on both sides of the carrier layer to obtain a carrier copper foil with double-sided smooth copper foil.

[0052] The carrier copper foil of the present disclosure is further described below.

[0053] Figure 3 The schematic diagram of the structure of a second carrier copper foil 6 in the embodiment of the present disclosure is shown, which specifically includes a carrier layer 61, a peeling layer 62 and a copper foil layer 63. It can be understood that Figure 3 In the figure, the S surface represents the non-cathode roller surface of the carrier copper foil, which is also called the non-pressing surface or S surface (Smooth surface). The M surface represents the cathode roller surface of the carrier copper foil, which is also called the pressing surface or M surface (Matte surface). In this embodiment, the peeling layer 62 is formed on the non-cathode roller surface of the carrier layer 61. It can be seen that in the present application, the method for preparing a strippable copper layer on the non-cathode roller surface is compared with the method of preparing a strippable copper layer on the cathode roller surface in the prior art, and the present method has the following significant technical advantages and effects:

[0054] Specifically, the preparation of the stripping layer on the non-cathode roller surface can make the back of the carrier copper foil product smooth, which is convenient for obtaining a double-sided smooth carrier copper foil product, which provides greater flexibility for the application of copper foil. When preparing the strippable copper layer on the cathode roller surface, it is difficult to generate the required roughness on the other side of the copper foil (non-cathode roller surface) due to the smooth surface of the cathode roller. This limits the performance of copper foil in some applications. By preparing the strippable copper layer on the non-cathode roller surface, we can use specific process conditions (such as brush plating technology) to generate the required roughness on this side. This not only improves the adhesion of the copper foil, but also enhances the stability of the carrier layer in subsequent processing. For example, in the manufacturing process of printed circuit boards, the increase in roughness can significantly improve the bonding force between the carrier layer copper foil and the substrate, and reduce the risk of peeling after lamination. As a result, the carrier layer can still be used as copper foil. Among them, the thickness of the copper foil layer is 0.5μm~5μm. The copper foil layer with a thickness in this range can meet the thickness requirements of electronic products for ultra-thin copper foil layers, and the copper foil layer has a high elongation, so it has a good application prospect. Optionally, the thickness of the copper foil layer may be 0.5 μm, 1 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, 5 μm, etc. It is understandable that the thickness of the copper foil layer may be other suitable choices within the range of 0.5 μm to 5 μm.

[0055] When the thickness of the copper foil layer is 1.5 μm, the unit area weight of the carrier copper foil can be 18 g / m 2 Up to 22g / m 2 When the thickness of the copper foil layer is 3 μm, the unit area weight of the carrier copper foil can be 31 g / m 2 Up to 35g / m 2 When the thickness of the copper foil layer is 5 μm, the unit area weight of the carrier copper foil can be 48 g / m 2 Up to 54g / m 2 range; of course, in other embodiments of the present disclosure, the unit area weight of the carrier copper foil can also be other suitable values. Exemplarily, the roughness of the copper foil layer on the side close to the carrier layer is less than 2μm, and the roughness of the copper foil layer on the side away from the carrier layer is also less than 2μm, the thickness of the carrier layer is 18μm, and the peel strength of the peeling layer at room temperature is not less than 3g / cm, and not more than 30g / cm. The carrier copper foil has the characteristics of ultra-thinness, low roughness, high peel strength and good etching properties, and is suitable for other suitable application scenarios such as high-frequency and high-speed copper clad laminates, flexible printed circuit boards, and high-density interconnect technology boards.

[0056] The performance indicators of the carrier copper foil of the present invention were tested, and the results are shown in Table 1. It can be seen that the carrier copper foil of the present invention has excellent thickness, roughness, peel strength, etc. and has good customizability.

[0057] Table 1

[0058]

[0059] By preparing a strippable copper layer on the non-cathode roller surface and using a double-stripping technique to generate a double stripping layer, the thickness and roughness of the coating can be controlled more accurately. Specifically, the first brush plating generates a phosphating film, and the second brush plating generates a phosphating metal layer. This method not only ensures the uniformity of the coating, but also achieves fine control of the roughness by adjusting the pressure, speed and current of the brush plating roller. This is particularly important in high-end applications, because uniform coating and controllable roughness can significantly improve the performance and reliability of copper foil.

[0060] This application not only solves the shortcomings of the prior art in generating a double-sided optical carrier layer and ensuring the roughness of the back of the carrier layer by preparing a strippable copper layer on the non-cathode roller surface and combining the double-stripping layer technology, but also significantly improves the performance and application range of the copper foil by precisely controlling the uniformity and roughness of the coating. This provides a more reliable and efficient solution for the manufacture of high-end electronic products.

[0061] In this embodiment, the stripping layer 62 includes a first brush-plated layer 621 formed by the first brush plating and a second brush-plated layer 622 formed by the second brush plating. Specifically, the first brush-plated layer 621 is a phosphating film formed by the first brush plating, and the second brush-plated layer 622 is a phosphide layer formed by the second brush plating. In the process of forming the phosphide layer, an anti-oxidation treatment reaction with the non-cathode roller surface of the carrier layer is also included, and the non-cathode roller surface of the carrier layer can also be surface treated.

[0062] This embodiment prepares the peeling layer 62 on the non-cathode roller surface, combines the double brush plating technology and anti-oxidation treatment, not only ensures the uniformity and roughness of the peeling layer, but also improves the surface quality and performance of the copper foil. This provides a more reliable and efficient solution for the manufacture of high-end electronic products.

[0063] It is obvious to those skilled in the art that the deposition formation may be varied, including but not limited to applying the solvent to the predetermined surface of the carrier layer by methods such as immersion, dip coating, brush coating, spray coating, coating, plating, roller plating, and rack plating. In addition, the equipment using the above scheme is not limited to a one-piece machine in which the raw foil and the post-processing equipment for preparing the carrier foil are prepared online, or a segmented non-one-piece machine in which the raw foil and the post-processing equipment are prepared in series.

[0064] Example 1

[0065] In this embodiment, the components of the carrier copper foil roughening solution are: 22 g / L copper, 40 g / L sulfuric acid, 0.4 g / L carbon nanotubes, and the solvent is water.

[0066] use Figure 1 The roughening equipment shown in the figure performs the first roughening treatment and the second roughening treatment on the carrier copper foil in sequence. In the first roughening treatment, the temperature of the roughening solution is 18°C, the current density is 80A / square decimeter, and the time of the first roughening treatment is 18S. In the second roughening treatment, the temperature of the roughening solution is 18°C, the current density is 20A / square decimeter, and the time of the second roughening treatment is 18S.

[0067] Figure 4~Figure 7 Schematic diagram showing the carrier copper foil and the peeling state in Example 1. Figure 4~Figure 7 It can be seen that the carrier copper foil in the present disclosure has good peeling performance and no residue is left after peeling. Through testing, the width of the carrier copper foil in the present disclosure can reach 1295mm, and the width, thickness, etc. have good customizability, which can effectively meet the different needs of consumers.

[0068] Embodiment 2~6

[0069] Compared with Example 1, the difference between Examples 2 to 6 is that the roughening solutions are different, and the specific differences are shown in Table 2.

[0070] Example 7

[0071] Compared with Example 1, the difference of this example is that the carbon nanotubes are replaced with zinc sulfate.

[0072] Comparative Examples 1 to 3

[0073] Compared with Example 1, the difference between Comparative Examples 1 to 3 is that the roughening solutions are different, and the specific differences are shown in Table 2.

[0074] The surface roughness (Rz, in micrometers) of the copper foil layer of the carrier copper foil obtained in the embodiment and the comparative example was tested, and the results are shown in Table 1. The peel strength (in kg / cm) between the roughened surface of the carrier copper foil obtained in the embodiment and the comparative example and the epoxy resin substrate was tested, and the results are shown in Table 2.

[0075] Table 2

[0076]

[0077] It can be seen from Table 2 that the peel strength between the roughened surface of the carrier copper foil and the substrate in the example is greater than that in the comparative example, indicating that the roughening solution disclosed in the present invention can effectively improve the bonding strength between the carrier copper foil and the substrate.

[0078] It should be understood that the present disclosure does not limit its application to the detailed structure and arrangement of the components proposed in the present disclosure. The present disclosure can have other embodiments and can be implemented and executed in a variety of ways. The aforementioned variations and modifications fall within the scope of the present disclosure. It should be understood that the present disclosure and the limited present disclosure extend to all alternative combinations of two or more individual features mentioned or evident in the text and / or the drawings. All of these different combinations constitute multiple alternative aspects of the present disclosure. The embodiments described in the present disclosure illustrate the best modes known for implementing the present disclosure and will enable those skilled in the art to utilize the present disclosure.

Claims

1. A method for roughening a carrier copper foil, characterized in that: The steps include: The carrier copper foil is subjected to a first roughening treatment and a second roughening treatment in sequence; the thickness of the copper foil layer of the carrier copper foil is 0.5 μm to 5 μm; The first roughening treatment uses a roughening solution, and the current density of the first roughening treatment is 70A / square decimeter to 100A / square decimeter; the second roughening treatment uses a roughening solution, and the current density of the second roughening treatment is 10A / square decimeter to 30A / square decimeter; the roughening solution includes the following components: 22g / L~24g / L copper, 35g / L~45g / L sulfuric acid, 0.1g / L~1g / L additives and solvents; the additives include at least one of carbon nanotubes and non-magnetic metal inorganic salts; the non-magnetic metal inorganic salts include at least one of zinc sulfate, zinc chloride, aluminum sulfate, aluminum chloride, magnesium sulfate, magnesium chloride, calcium carbonate and calcium chloride.

2. The method for roughening a carrier copper foil according to claim 1, characterized in that: The solvent is water.

3. The method for roughening a carrier copper foil according to claim 1, characterized in that: The temperature of the roughening solution in the first roughening treatment is 15°C to 20°C.

4. The method for roughening a carrier copper foil according to claim 1, characterized in that: The first roughening treatment takes 10 seconds to 50 seconds.

5. The method for roughening a carrier copper foil according to claim 1, characterized in that: The temperature of the roughening solution in the second roughening treatment is 15°C to 20°C.

6. The method for roughening a carrier copper foil according to claim 1, characterized in that: The second roughening treatment takes 10 to 50 seconds.

7. The method for roughening a carrier copper foil according to any one of claims 1 to 6, characterized in that: The first roughening treatment and the second roughening treatment are respectively performed in two adjacent roughening tanks, and the two adjacent roughening tanks contain the roughening solution respectively.

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