A method and system for defect monitoring in a dieless mirror image filament placement process

Abstract

The application belongs to the technical field of material processing, and relates to a defect monitoring method and system in a moldless mirror image filament laying process. The system utilizes left and right conductive plates to contact two sides of a filament tape to form a capacitance detection loop, and reflects the laying state of the filament tape by monitoring the change of the capacitance value. The method controls the left and right conductive plates to continuously contact the filament tape to obtain capacitance data in the moldless mirror image filament laying process, analyzes the defect detection result after processing the obtained capacitance curve. The moldless mirror image filament laying defect monitoring system has the advantages of low cost, high efficiency, high compatibility and high detection precision, and provides strong support for the technical innovation in the field of composite material processing.

Description

Technical Field

[0001] This invention belongs to the field of materials processing technology and relates to a method and system for defect monitoring during moldless mirror fiber placement. Background Technology

[0002] Within the realm of precision manufacturing processes for composite materials, wire layup technology plays a crucial role, particularly in the fabrication of complex structural components such as aircraft wings. However, traditional wire layup processes heavily rely on customized metal molds. These molds must precisely match the unique surface contours of each component, resulting in long production cycles, high material consumption, and the need for individually designed molds for each component. This severely restricts the flexibility and overall efficiency of the production process. Furthermore, the design and manufacturing of molds are highly technical, with both high barriers to entry and high costs, further increasing production challenges.

[0003] To overcome this bottleneck, the materials processing field is exploring an innovative approach: integrating the concept of mirror-image processing into wire placement technology. Specifically, the idea involves deploying two mirror-configured wire placement systems, symmetrically positioned on either side of the workpiece, working collaboratively like reflections in a mirror. In this arrangement, the two wire placement machines can rely on each other to perform precise and symmetrical wire placement tasks without the need for traditional molds, achieving a revolutionary "moldless mirror-image wire placement" technology. If realized, this vision could potentially revolutionize the traditional reliance on molds in wire placement processes, ushering in a new era for composite material processing.

[0004] However, the moldless mirror-image fiber placement process requires the application of dual heat sources and pressure from both sides in a moldless state. This multi-source heat and force can easily lead to complex internal defects, such as voids and delamination within the composite material. These internal defects not only affect the mechanical properties of the product but may also cause premature failure during use. Therefore, to achieve the above goals, real-time monitoring and detection of internal defects during the moldless mirror-image fiber placement process is crucial.

[0005] Currently, the main methods for detecting internal defects include active infrared thermography, laser ultrasonic testing, and current detection.

[0006] Active infrared thermal imaging uses laser light to actively heat the material and then uses an infrared thermal imager to capture surface temperature images to monitor internal defects. While this method is effective in detecting interlayer defects, it is costly, and laser heating is required for each printed layer, affecting efficiency and print quality. Laser ultrasonic testing offers high accuracy, but the equipment is complex and expensive, and integration with moldless mirror-image fiber placement end-mount mechanisms is difficult, making it unsuitable for real-time online inspection.

[0007] Current detection, such as the method and equipment disclosed in patent CN117368281B for real-time monitoring of defects in in-situ additive manufacturing of carbon fiber composite materials, utilizes current detection to detect internal defects. A conductive plate is added before the roller, and an equipotential layer is laid beneath the printed workpiece. A specific voltage is applied between the conductive plate and the equipotential layer, forming a conductive circuit consisting of the conductive plate, the outer layer of the roller, the composite material, and the equipotential layer. Defects are determined by detecting the current in the printed composite material. However, this patent requires laying an equipotential layer at the bottom of the composite material, which not only limits the freedom of fiber placement but also increases the complexity of the system. Furthermore, the detection accuracy is easily affected when the composite material has high capacitance or low resistance.

[0008] In conclusion, existing methods for detecting internal defects are difficult to apply to the concept of moldless mirror-image fiber placement. Summary of the Invention

[0009] The purpose of this invention is to solve the problems existing in the prior art and to provide a method and system for defect monitoring in the moldless mirror fiber placement process.

[0010] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0011] A defect monitoring system for the moldless mirror fiber placement process, wherein the moldless mirror fiber placement equipment includes a symmetrical left part and a right part;

[0012] The right part includes a main plate and a pressure component. The pressure component includes a pressure roller, a support device, and a cylinder a. The central axis of the pressure roller is parallel to the front-back direction. The support device is located on the right side of the pressure roller and connected to it. The cylinder a is fixed on the main plate and is used to push the pressure roller to the left, cooperating with the pressure roller on the opposite side to squeeze and generate compaction pressure.

[0013] The defect monitoring system includes a left conductive plate, a left tension spring, a right conductive plate, a right tension spring, and a capacitance detection device;

[0014] The left end of the left conductive plate is directly connected to the support device of the left part, and the middle part is connected to the support device of the left part through the left tension spring. The right end of the left conductive plate is located in front of the pressure roller of the left part along the wire feeding direction.

[0015] The right end of the right conductive plate is directly connected to the support device of the right part, and the middle part is connected to the support device of the right part through the right tension spring. The left end of the right conductive plate is located in front of the pressure roller of the right part along the wire feeding direction.

[0016] The left and right conductive plates are connected to the positive and negative interfaces of the capacitance detection device, respectively, which is used to output capacitance data.

[0017] As a preferred technical solution:

[0018] As described above, in a moldless mirror wire laying process defect monitoring system, the left and right conductive plates are symmetrically arranged, as are the left and right tension springs.

[0019] The defect monitoring system described above for the moldless mirror wire placement process also includes a host computer, which is connected to the USB communication interface of the capacitance detection device via a network cable.

[0020] As described above, the defect monitoring system in the moldless mirror filament placement process includes, on the right side, a shearing component, a refeeding component, a tension component, a heat source component, a connector, and a filament placement end motion mechanism. The pressure component, shearing component, refeeding component, and tension component are arranged sequentially from front to back along the filament feeding direction.

[0021] The cutting component includes a cylinder b and a blade. The cylinder b is used to drive the blade to cut the ribbon. The cylinder b is fixed to the main body plate.

[0022] The feeding component includes a drive wheel, a driven wheel, a motor, and a cylinder C. Both the drive wheel and the driven wheel are vertically arranged and parallel to the left-right direction. The motor drives the drive wheel to rotate, and the cylinder C presses the driven wheel onto the drive wheel. The motor and cylinder C are fixed to the main body plate. Before the ribbon is installed and the yarn is laid, the cylinder C is not activated, and the drive wheel and driven wheel are separated. When the yarn laying begins, the ribbon is installed in the channel and passes between the drive wheel and the driven wheel. Then, the cylinder C is activated, and the driven wheel presses the ribbon onto the drive wheel, thus tightening the ribbon. The motor drives the drive wheel to rotate during the yarn laying process, causing the driven wheel to extrude the ribbon.

[0023] The tensioning components include a feed tray and a brake. The feed tray is used to wind the ribbon. During the yarn laying process, the roll is forced to rotate under the drive of the heavy feed component to feed the ribbon. The brake is used to provide torque to the feed tray to maintain a stable tension force for the yarn feeding, so as to prevent the ribbon from being unstablely fed or even falling off due to the high speed rotation of the roll. Both the feed tray and the brake are fixed on the main body plate.

[0024] The heat source components include a laser heater, which is used to heat the ribbon and is fixed to the main body plate;

[0025] The connector is fixed to the main plate and connected to the end of the wire laying end motion mechanism.

[0026] The present invention also provides a defect monitoring method in the process of moldless mirror fiber placement, which adopts a defect monitoring system in the process of moldless mirror fiber placement as described in any of the above claims;

[0027] Moldless mirror lay-up means laying two ribbons in a mirror-symmetrical manner without using a mold, and repeating this lay-up process multiple times;

[0028] Defect monitoring involves controlling the left and right conductive plates to continuously contact the two opposing sides of the two ribbons in each wire laying process, acquiring capacitance data for each wire laying process, processing the capacitance data to obtain capacitance curves, and then analyzing the capacitance curves to obtain defect detection results.

[0029] The vertical axis of the capacitance curve represents capacitance, and each wire-laying process corresponds to one capacitance curve.

[0030] When the defect monitoring system contains a host computer, the host computer performs the operation of "processing the capacitance data to obtain the capacitance curve, and then analyzing the capacitance curve to obtain the defect detection result"; when the defect monitoring system does not contain a host computer, a human is required to perform the operation of "processing the capacitance data to obtain the capacitance curve, and then analyzing the capacitance curve to obtain the defect detection result".

[0031] As a preferred technical solution:

[0032] As described above, in a defect monitoring method during a moldless mirror fiber placement process, the horizontal axis of the capacitance curve represents the fiber placement time or the product of the fiber placement time and the fiber placement speed, with each fiber placement process starting from 0 in the timer.

[0033] As described above, in a defect monitoring method during a moldless mirrored wire laying process, for two adjacent wire laying processes, the two wires laid in the latter process are located on opposite sides of the two wires laid in the former process.

[0034] As described above, in a defect monitoring method during the moldless mirror filament placement process, when the difference between the maximum and minimum capacitance of the capacitance curve is less than or equal to 10nF, the defect detection result is: the overall structure composed of the filaments laid in this and all previous filament placement processes has no obvious defects.

[0035] When the difference between the maximum and minimum capacitance of the capacitance curve is greater than 10nF and less than or equal to 30nF, and the maximum capacitance is greater than 20nF and less than or equal to 40nF, the defect detection result is: the whole composed of the ribbons laid in this and all previous ribbon laying processes has a relatively serious defect.

[0036] When the difference between the maximum and minimum capacitance of the capacitance curve is greater than 30nF and the maximum capacitance is greater than 40nF, the defect detection result is: the whole composed of the ribbons laid in this and all previous ribbon laying processes has a very serious defect.

[0037] No obvious defects means that the total area of ​​voids and delamination on the cross section of the whole formed by the ribbons laid in this and all previous ribbon laying processes is less than 3%, that is, the interior is compact and there are no obvious voids or delamination.

[0038] A more serious defect is that the total area of ​​voids and delamination on the cross-section of the whole formed by the ribbons laid in this and all previous ribbon laying processes is greater than or equal to 3% but less than 8%, that is, there are a small number of voids and delamination inside.

[0039] A very serious defect is that the total area of ​​voids and delamination on the cross-section of the whole formed by the ribbons laid in this and all previous ribbon laying processes is greater than or equal to 8%, that is, there are a lot of voids and delamination inside.

[0040] Beneficial effects:

[0041] (1) The present invention uses the cooperation of the left conductive plate, the right conductive plate and the capacitance detection device to continuously contact the ribbon during the moldless mirror fiber laying process to obtain capacitance data, and then analyzes the defect detection results. It can monitor the internal defects during the moldless mirror fiber laying process in real time and accurately, including complex defects such as voids and delamination inside the composite material, and provides a strong basis for timely adjustment of process parameters and ensuring product quality.

[0042] (2) Compared with existing methods such as active infrared thermal imaging and laser ultrasonic detection, the capacitance detection method of the present invention has lower cost and is easy to integrate with moldless mirror fiber placement equipment. At the same time, the method does not rely on the equipotential layer at the bottom of the composite material, which improves the freedom of fiber placement. It can still maintain high detection accuracy when the composite material has high capacitance or low resistance, and is not easily affected by environmental factors, thus having high stability and reliability. Attached Figure Description

[0043] Figure 1 A schematic diagram of a moldless mirror fiber placement device;

[0044] Figure 2 This is a schematic diagram of the process of performing moldless mirror placement using a whole consisting of a moldless mirror placement equipment and a defect monitoring system. Some components of the moldless mirror placement equipment are omitted in the diagram.

[0045] Figure 3 This is a schematic diagram of the end of an assembly consisting of a left conductive plate, a left tension spring, a right conductive plate, a right tension spring, a pressure roller, and a support device.

[0046] Figure 4 A schematic diagram illustrating the process of using a defect monitoring system to monitor internal defects during the moldless mirror fiber placement process;

[0047] Figure 5 This is a diagram illustrating the ribbon installation process.

[0048] Figure 6This is a schematic diagram showing the situation where the difference between the maximum and minimum capacitance of the capacitance curve is greater than 10nF and less than or equal to 30nF, and the maximum capacitance is greater than 20nF and less than or equal to 40nF. The detection position is the product of the fiber placement time and the fiber placement speed.

[0049] Figure 7 This is a schematic diagram when the difference between the maximum and minimum capacitance of the capacitance curve is greater than 30nF and the maximum capacitance is greater than 40nF. The detection position is the product of the fiber placement time and the fiber placement speed.

[0050] Figure 8 This is a schematic diagram when the difference between the maximum and minimum capacitance of the capacitance curve is greater than 30nF and the maximum capacitance is greater than 40nF. The detection position is the product of the fiber placement time and the fiber placement speed.

[0051] Figure 9 yes Figure 6 Cross-sectional view at 60mm from the detection position;

[0052] Figure 10 yes Figure 7 Cross-sectional view at the detection position 40mm in the middle;

[0053] Figure 11 yes Figure 8 Cross-sectional view at 60mm from the detection position;

[0054] Among them, 1-pressure roller, 2-cylinder a, 3-cylinder b, 4-laser heater, 5-motor, 6-driven wheel, 7-cylinder c, 8-material tray, 9-connector, 10-main plate, 11-right conductive plate, 12-left tension spring, 13-capacitance detection device, 14-host computer, 15-ribbon, 16-bracket, 17-support device. Detailed Implementation

[0055] The present invention will be further described below with reference to specific embodiments. It should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, it should be understood that after reading the teachings of this invention, those skilled in the art can make various alterations or modifications to the invention, and these equivalent forms also fall within the scope defined by the appended claims.

[0056] A defect monitoring system for moldless mirror fiber placement process, such as Figure 1 As shown, the moldless mirror filament placement equipment includes a left part and a right part;

[0057] The right part includes a main plate 10, a pressure component, a shearing component, a refeeding component, a tension component, a heat source component, a connector 9, and a yarn-laying end motion mechanism;

[0058] The pressure component, shearing component, refeeding component, and tension component are arranged sequentially from front to back along the wire feeding direction;

[0059] The pressure component includes a pressure roller 1, a support device 17, and a cylinder a 2. The central axis of the pressure roller 1 is parallel to the front-back direction. The support device 17 is located on the right side of the pressure roller 1 and connected to it. The cylinder a 2 is fixed on the main body plate 10 and is used to push the pressure roller 1 to the left.

[0060] The cutting component includes a cylinder b3 and a blade. The cylinder b3 is used to drive the blade to cut the ribbon. The cylinder b3 is fixed on the main body plate 10.

[0061] The heavy conveying component includes a drive wheel, a driven wheel 6, a motor 5, and a cylinder c 7. The drive wheel and the driven wheel 6 are both arranged vertically and parallel to the left and right directions. The motor 5 is used to drive the drive wheel to rotate, and the cylinder c 7 is used to press the driven wheel 6 onto the drive wheel. The motor 5 and the cylinder c 7 are fixed on the main body plate 10.

[0062] The tensioning components include a tray 8 and a brake 15. The tray 8 is used to wind the ribbon, and the brake 15 is used to provide torque to the tray 8 to maintain a stable tension force for the ribbon feeding. Both the tray 8 and the brake 15 are fixed on the main body plate 10.

[0063] The heat source component includes a laser heater 4, which is used to heat the ribbon and is fixed on the main body plate 10.

[0064] Connector 9 is fixed on the main plate 10 and connected to the end of the filament laying end motion mechanism;

[0065] The following example illustrates the process of using a moldless mirror fiber placement device, with two separate fiber placement steps:

[0066] (1) Ribbon installation;

[0067] like Figure 5 As shown, after the ribbon 15 is wound on the material roll and loaded into the filament laying channel, it leaves the material roll and passes between the driving wheel and the driven wheel, through the blade to the pressure roller, and is then fixed on the bracket 16, which is a vertical frame or a truss fixed on the ground. After that, the connector is connected to the end of the filament laying end motion mechanism (robotic arm).

[0068] When the ribbon 15 passes between the driving wheel and the driven wheel, the cylinder c starts, and the driven wheel presses the ribbon 15 onto the driving wheel, thus compressing the ribbon 15; the motor starts, drives the driving wheel to rotate, and drives the driven wheel to extrude the ribbon 15 together.

[0069] When the ribbon 15 passes through the pressure roller, the cylinder a is activated, causing the pressure rollers on both sides to push out and cooperate with the pressure roller on the opposite side to squeeze, further pressing the ribbon 15.

[0070] (2) First silk laying;

[0071] After the ribbon 15 is fixed on the bracket 16, the end motion mechanism of the filament laying begins to move along the filament laying path. At the same time, the laser heater 4 is activated to heat the ribbon 15. When the first filament laying is about to be completed, the cylinder b is activated to drive the blade to cut the ribbon 15 and cut off the excess part. After cutting, the cylinder b is reset, and the reserved ribbon 15 between the blade and the pressure roller continues to be laid until the first laying is completed.

[0072] (3) Second silk laying;

[0073] After the first laying is completed, the yarn laying end motion mechanism moves to the initial position and then moves along the yarn laying path (the two yarns 15 laid in the second laying are located on opposite sides of the two yarns 15 laid in the first laying process). At the same time, the laser heater 4 is activated to heat the yarns 15. When the second laying is about to be completed, the cylinder b is activated to drive the blade to cut the yarns 15 and cut off the excess. After cutting, the cylinder b is reset and the reserved yarns 15 between the blade and the pressure roller continue to be laid until the second laying is completed. Then, the cylinder c, motor, cylinder a, cylinder c, and laser heater 4 are turned off, and the connection between the connector and the end of the yarn laying end motion mechanism is disconnected.

[0074] like Figure 2 and Figure 3 As shown, the defect monitoring system includes a left conductive plate, a left tension spring 12, a right conductive plate 11, a right tension spring, a capacitance detection device 13, and a host computer 14;

[0075] The left conductive plate and the right conductive plate 11 are arranged symmetrically, and the left tension spring 12 and the right tension spring are arranged symmetrically.

[0076] The left end of the left conductive plate is directly connected to the support device 17 of the left part, and the middle part is connected to the support device 17 of the left part through the left tension spring 12. The right end of the left conductive plate is located in front of the pressure roller 1 of the left part along the wire feeding direction.

[0077] The right end of the right conductive plate 11 is directly connected to the support device 17 of the right part, and the middle part is connected to the support device 17 of the right part through the right tension spring. The left end of the right conductive plate 11 along the wire feeding direction is located in front of the pressure roller 1 of the right part.

[0078] The left conductive plate and the right conductive plate 11 are respectively connected to the positive and negative interfaces of the capacitance detection device 13, which is used to output capacitance data.

[0079] The host computer 14 is connected to the USB communication interface of the capacitance detection device 13 via a network cable;

[0080] The process of using this defect monitoring system to monitor internal defects during the wire laying process is as follows: Figure 4 As shown, in each wire laying process, the left and right conductive plates are controlled to continuously contact the two opposing sides of the two wires in this wire laying process. The capacitance data of each wire laying process is acquired by the capacitance detection device. After processing the capacitance data of each wire laying process to obtain the corresponding capacitance curve, the capacitance curve is analyzed to obtain the defect detection result. The horizontal axis of the capacitance curve is the wire laying length (i.e., the product of wire laying time and wire laying speed). Each wire laying process starts timing from 0. The vertical axis of the capacitance curve is the capacitance.

[0081] When the difference between the maximum and minimum capacitances of the capacitance curve is less than or equal to 10nF (e.g.) Figure 6 When the defect detection result is as shown, the overall structure (i.e., composite material) formed by the ribbons laid in this and previous ribbon laying processes has no obvious defects; no obvious defects means that the total area of ​​voids and delamination on the cross-section of the overall structure formed by the ribbons laid in this and previous ribbon laying processes is less than 3%; to verify the accuracy of the defect detection method, the following data is obtained: Figure 6 A cross-sectional view at 60mm from the detection position, as shown in the image. Figure 9 As shown, the test results indicate Figure 9 The total area of ​​voids and delamination is 0.47%, which is consistent with the aforementioned conclusion that "the total area of ​​voids and delamination on the cross section is less than 3%", thus indicating that the defect monitoring method of the present invention is accurate.

[0082] When the difference between the maximum and minimum capacitances on the capacitance curve is greater than 10nF and less than or equal to 30nF, and the maximum capacitance is greater than 20nF and less than or equal to 40nF (e.g.) Figure 7 When the condition is as shown, the defect detection result is: the composite material formed by the ribbons laid in this and previous ribbon laying processes has relatively serious defects; a relatively serious defect is defined as the total area of ​​voids and delamination on the cross-section of the composite material formed by the ribbons laid in this and previous ribbon laying processes being greater than or equal to 3% and less than 8%; to verify the accuracy of the defect monitoring results, the following data is obtained: Figure 7 A cross-sectional view at 60mm from the detection position, as shown in the image. Figure 10 As shown, the test results indicate Figure 10 The total area of ​​voids and delamination is 3.79%, which meets the aforementioned conclusion that "the total area of ​​voids and delamination on the cross section is greater than or equal to 3% and less than 8%", thus indicating that the defect monitoring method of the present invention is accurate.

[0083] When the difference between the maximum and minimum capacitances of the capacitance curve is greater than 30nF and the maximum capacitance is greater than 40nF (e.g.) Figure 8When the condition is as shown, the defect detection result is: the composite material formed by the ribbons laid in this and previous ribbon laying processes has a very serious defect; a very serious defect is defined as the total area of ​​voids and delamination on the cross-section of the composite material formed by the ribbons laid in this and previous ribbon laying processes being greater than or equal to 8%; to verify the accuracy of the defect monitoring result, the following data is obtained: Figure 8 A cross-sectional view at 60mm from the detection position, as shown in the image. Figure 11 As shown, the test results indicate Figure 11 The total area of ​​voids and delamination accounts for 13.635%, which is consistent with the aforementioned conclusion that "the total area of ​​voids and delamination on the cross section is greater than or equal to 8%", thus indicating that the defect monitoring method of the present invention is accurate.

[0084] If the overall structure formed by the ribbons laid in this and all previous ribbon-laying processes has no obvious defects, ribbon-laying continues. If there are more serious defects, the quality of subsequent ribbon-laying is improved by adjusting process parameters (such as ribbon-laying pressure, laser power, and ribbon-laying speed). Increasing the ribbon-laying pressure is a common method. When the ribbon-laying pressure is too low, increasing the pressure can usually significantly improve the defect situation. However, if the ribbon-laying pressure is already relatively high, increasing the ribbon-laying pressure will not help much in improving the effect. For defects caused by temperature issues, the appropriate laser power needs to be determined by the temperature curve of an infrared thermal imager. The power should be reduced when the temperature is high and increased when the temperature is low. If there are very serious defects, the sample is scrapped directly, and a new ribbon-laying process is started.

Claims

1. A defect monitoring system in a dieless mirror image filament laying process, characterized by, The moldless mirror image filament laying device comprises a left part and a right part which are symmetrical; The right part comprises a main plate (10) and a pressure component, the pressure component comprises a pressure roller (1), a support device and a cylinder a (2), the central axis of the pressure roller (1) is parallel to the front-back direction, the support device is located on the right side of the pressure roller (1) and connected with the pressure roller (1), and the cylinder a (2) is fixed on the main plate (10) and used for pushing the pressure roller (1) to the left; The defect monitoring system comprises a left conductive plate, a left tension spring (12), a right conductive plate (11), a right tension spring and a capacitance detection device (13); The left end of the left conductive plate is directly connected with the support device of the left part, the middle part is connected with the support device of the left part through the left tension spring (12), and the right end of the left conductive plate is located on the front side of the pressure roller (1) of the left part along the filament direction; The right end of the right conductive plate (11) is directly connected with the support device of the right part, the middle part is connected with the support device of the right part through the right tension spring, and the left end of the right conductive plate (11) is located on the front side of the pressure roller (1) of the right part along the filament direction; The left conductive plate and the right conductive plate (11) are respectively connected with the positive electrode interface and the negative electrode interface of the capacitance detection device (13), and the capacitance detection device (13) is used for outputting capacitance data.

2. A defect monitoring system in a dieless mirror imaging deposition process as claimed in claim 1, wherein, The left conductive plate and the right conductive plate (11) are symmetrically arranged, and the left tension spring (12) and the right tension spring are symmetrically arranged.

3. A defect monitoring system in a dieless mirror imaging deposition process as claimed in claim 1, wherein, The defect monitoring system further comprises a host computer (14), and the host computer (14) is connected with the USB communication interface of the capacitance detection device (13) through a network cable.

4. A defect monitoring system in a dieless mirror imaging deposition process as claimed in claim 1, wherein, The right part further comprises a cutting component, a re-feeding component, a tension component, a heat source component, a connecting piece (9) and a filament laying end movement mechanism, and the pressure component, the cutting component, the re-feeding component and the tension component are sequentially arranged from front to back along the filament direction; The cutting component comprises a cylinder b (3) and a blade, the cylinder b (3) is used for driving the blade to cut the filament tape, and the cylinder b (3) is fixed on the main plate (10); The re-feeding component comprises a driving wheel, a driven wheel (6), a motor (5) and a cylinder c (7), the driving wheel and the driven wheel (6) are vertically arranged and parallel to the left-right direction, the motor (5) is used for driving the driving wheel to rotate, the cylinder c (7) is used for pressing the driven wheel (6) to the driving wheel, and the motor (5) and the cylinder c (7) are fixed on the main plate (10); The tension component comprises a disc (8) and a brake, the disc (8) is used for winding the filament tape, the brake is used for providing torque for the disc (8) to maintain the stable tension of the filament feeding, and the disc (8) and the brake are fixed on the main plate (10); The heat source component comprises a laser heater (4), the laser heater (4) is used for heating the filament tape, and the laser heater (4) is fixed on the main plate (10); The connecting piece (9) is fixed on the main plate (10) and connected with the end of the filament laying end movement mechanism.

5. A method for defect monitoring in a dieless mirror image filament laying process, characterized by, The defect monitoring system in the moldless mirror image filament laying process is adopted; The moldless mirror image filament laying is not using a mold, and two filament tapes are laid through the mirror image symmetry, and the laying process is repeated for multiple times. The defect monitoring comprises: controlling the left and right conductive plates (11) to respectively and continuously contact two sides of two tapes in each fiber laying process, obtaining the capacitance data of each fiber laying process, processing the capacitance data to obtain the capacitance curve, and analyzing the capacitance curve to obtain the defect detection result. The vertical coordinate of the capacitance curve is capacitance, and each fiber laying process corresponds to one capacitance curve.

6. A method of defect monitoring in a dieless mirror imaging deposition process as claimed in claim 5, wherein, The horizontal coordinate of the capacitance curve is the fiber laying time or the product of the fiber laying time and the fiber laying speed, and each fiber laying process starts from 0.

7. A method of defect monitoring in a dieless mirror imaging deposition process as claimed in claim 5, wherein, For two adjacent fiber laying processes, the two tapes laid in the latter fiber laying process are located on the two sides of the two tapes laid in the former fiber laying process.

8. A method of defect monitoring in a dieless mirror imaging deposition process as claimed in claim 7, wherein, When the difference between the maximum capacitance and the minimum capacitance of the capacitance curve is less than or equal to 10 nF, the defect detection result is that the whole of the tapes laid by all the fiber laying processes has no obvious defect. When the difference between the maximum capacitance and the minimum capacitance of the capacitance curve is greater than 10 nF and less than or equal to 30 nF, and the maximum capacitance is greater than 20 nF and less than or equal to 40 nF, the defect detection result is that the whole of the tapes laid by all the fiber laying processes has relatively serious defect. When the difference between the maximum capacitance and the minimum capacitance of the capacitance curve is greater than 30 nF, and the maximum capacitance is greater than 40 nF, the defect detection result is that the whole of the tapes laid by all the fiber laying processes has very serious defect. No obvious defect means that the total area ratio of the gap and the delamination on the cross section of the whole of the tapes laid by all the fiber laying processes is less than 3%. Relatively serious defect means that the total area ratio of the gap and the delamination on the cross section of the whole of the tapes laid by all the fiber laying processes is greater than or equal to 3% and less than 8%. Very serious defect means that the total area ratio of the gap and the delamination on the cross section of the whole of the tapes laid by all the fiber laying processes is greater than or equal to 8%.

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