Electronic equipment and assembling method of electronic equipment

Abstract

The invention relates to electronic equipment and an assembling method of the electronic equipment. The electronic equipment comprises a middle frame and a display module. The middle frame is provided with a middle frame side wall. The display module is accommodated in the middle frame. The display module comprises a display panel, a cover plate and a protective part, wherein the cover plate and the protective part are connected to the two sides of the display panel. And a colloid is connected between the display panel and the side wall of the middle frame and is positioned among the cover plate, the protective piece and the side wall of the middle frame. And the colloid accurately protects the display panel, so that the mechanical performance of the display panel is improved, and the possibility that the display panel is broken or fails when the electronic equipment falls off or is impacted is reduced. In addition, the colloid also has a sealing effect on the display panel, so that the possibility that the display panel is corroded by external dirt such as sweat stains and oil stains in the use process of the electronic equipment is reduced. The glue plays a bonding role between the display panel and the side wall of the middle frame, so that the display panel and the middle frame are connected together.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment and an assembly method of the electronic equipment. Background Art

[0002] The electronic device includes a display module, and the display module is used to display image information or video information for users to watch.

[0003] At present, the mechanical properties and corrosion resistance of display modules are relatively weak. For example, when electronic equipment is bumped or dropped, the edges of the display modules are prone to cracking, damage or even failure. At the same time, the display modules are also susceptible to corrosion from sweat, oil stains and other dirt, all of which will affect the normal operation of the display modules. Summary of the invention

[0004] The purpose of the present application is to provide an electronic device and an assembly method of the electronic device to solve the problem of weak mechanical properties and corrosion resistance of the display module in the above-mentioned prior art.

[0005] In a first aspect, an embodiment of the present application provides an electronic device, comprising: a middle frame and a display module. The middle frame has a middle frame side wall; the display module is accommodated in the middle frame; wherein the display module comprises a display panel and a cover plate and a protective member connected to both sides of the display panel; a colloid is connected between the display panel and the middle frame side wall, and the colloid is located between the cover plate, the protective member and the middle frame side wall.

[0006] The colloid is located on the periphery of the display panel, thereby achieving precise protection of the display panel, which is beneficial to improving the mechanical properties of the display panel and reducing the possibility of the display panel breaking or failing when the electronic device falls or hits, thereby extending the service life of the display panel. At the same time, the colloid can also seal the display panel, reducing the possibility of corrosion of the display panel by external sweat, oil stains and other dirt during the use of the electronic device, so as to ensure the normal and stable operation of the display panel. On the other hand, the colloid also plays a bonding role between the display panel and the side wall of the middle frame, thereby connecting the display panel to the middle frame. It is beneficial to simplify the assembly process of electronic equipment and improve the assembly efficiency of electronic equipment.

[0007] In a possible implementation manner, the colloid surrounds the display panel along a circumference of the display panel.

[0008] The colloid can protect all edges of the display panel, further improving the mechanical properties and corrosion resistance of the edges of the display panel. At the same time, it also increases the bonding area between the display panel and the side wall of the middle frame to improve the stability of the connection between the display module and the middle frame.

[0009] In a possible implementation, the middle frame further includes a middle frame bottom wall connected to the middle frame side walls; the display module is fixedly connected to the middle frame side walls, and / or the display module is fixedly connected to the middle frame bottom wall.

[0010] The display module is fixedly connected to the side wall of the middle frame and / or the bottom wall of the middle frame to improve the stability of the display module when installed in the middle frame.

[0011] In a possible implementation manner, the display module is fixedly connected to the side wall of the middle frame, and / or the display module is fixedly connected to the back cover.

[0012] The display module is fixedly connected to the side wall and / or the back cover of the middle frame to improve the stability of the display module when installed in the middle frame.

[0013] In a possible implementation manner, a first adhesive member is provided between the protective member and the middle frame side wall along the circumference of the protective member, and the first adhesive member is connected to the protective member and the middle frame side wall.

[0014] The display module and the middle frame are pre-fixed by bonding the first adhesive member to the display module, which is beneficial to improving the stability of the display module installed in the middle frame. In addition to pre-fixing the display module and the middle frame, the first adhesive member also plays a sealing role between the protective member and the side wall of the middle frame, thereby reducing the possibility of the colloid overflowing from the gap between the protective member and the side wall of the middle frame, so as to improve the glue injection effect.

[0015] In a possible implementation manner, the side wall of the middle frame has a protrusion extending toward the inside of the middle frame; along the thickness direction of the electronic device, the first adhesive component is arranged on a side of the protrusion facing the cover plate.

[0016] The raised portion supports and positions the first adhesive component, thereby facilitating the stability of the first adhesive component in the middle frame, reducing the possibility of the first adhesive component sliding along the side wall of the middle frame or falling off the side wall of the middle frame, and further facilitating the stability of the connection between the display module and the side wall of the middle frame.

[0017] In a possible implementation, there is a sealant disposed along the circumference of the cover plate between the cover plate and the middle frame side wall; the sealant is connected to the cover plate and the middle frame side wall, and the sealant blocks the gap between the cover plate and the middle frame side wall.

[0018] The sealant seals the injection space, thereby reducing the possibility of the colloid overflowing from the gap between the cover plate and the side wall of the middle frame, ensuring the effect of the injection, improving the stability and reliability of the injection, and reducing the possibility of colloid waste. At the same time, the sealant can also play a bonding role to improve the stability of the connection between the display module and the middle frame.

[0019] In a possible implementation manner, the middle frame is provided with a glue injection hole and a glue outlet hole; the glue injection hole and the glue outlet hole are both connected to the glue injection space located between the cover plate, the protective component and the side wall of the middle frame.

[0020] The glue injection holes and glue outlet holes are provided on the middle frame to facilitate the use of the middle frame as a glue injection mold for glue injection, which is conducive to simplifying the glue injection steps. In addition, while completing the glue injection on the display panel, the connection between the display panel and the middle frame is also completed, which is conducive to simplifying the assembly process of the electronic device and improving the assembly efficiency of the electronic device.

[0021] In a possible implementation manner, the glue injection hole and the glue outlet hole are opened on the side wall of the middle frame.

[0022] The glue injection hole and the glue outlet hole are opened on the side wall of the middle frame, which is convenient for using the middle frame as a glue injection mold for glue injection and helps to simplify the glue injection steps.

[0023] In a possible embodiment, the middle frame includes a middle frame bottom wall connected to the middle frame side wall; the glue injection hole and the glue outlet hole are opened on the middle frame bottom wall; the protective member is provided with a glue injection matching hole at a position corresponding to the glue injection hole, and the glue injection matching hole is connected to the glue injection hole; and; the protective member is provided with a glue outlet matching hole at a position corresponding to the glue outlet hole, and the glue outlet matching hole is connected to the glue outlet hole.

[0024] Since the surface of the protective member is relatively smooth, injecting glue through the protective member is conducive to increasing the flow speed of the glue in the injection space, thereby improving the efficiency of the injection. That is, when the glue is injected from the bottom of the middle frame, the efficiency of the injection is higher.

[0025] In a possible implementation, the electronic device includes a support member; the middle frame also includes a middle frame bottom wall connected to the middle frame side wall; along the thickness direction of the electronic device, one end of the support member is connected to the protective member, and the other end is connected to the middle frame bottom wall.

[0026] The support member plays a supporting role for the display module, which is not only conducive to improving the stability of the display module installation, but also conducive to improving the impact resistance of the display module, thereby helping to improve the overall reliability of the display module, so as to reduce the possibility of damage to the display module when the electronic device collides or falls, thereby helping to extend the service life of the display module. On the other hand, when the protective member abuts against the support member during the placement of the display module in the middle frame, it means that the display module has reached the preset installation position. Therefore, the support member plays an installation positioning role for the display module, which is conducive to improving the assembly accuracy between the display module and the middle frame. In addition, by adjusting the thickness of the support member, the position of the display module in the middle frame can be adjusted, reducing the requirements for the dimensional accuracy of the middle frame.

[0027] In a second aspect, an embodiment of the present application provides an electronic device, comprising: a housing, a display module and a support member. The display module is accommodated in the housing; the support member is accommodated in the housing, and the support member is located on one side of the display module; wherein the display module comprises a display panel and a cover plate and a protective member connected to both sides of the display panel; along the thickness direction of the electronic device, one end of the support member is connected to the protective member, and the other end of the support member is connected to the bottom wall of the housing.

[0028] The effect of the support member in the embodiment of the present application is the same as the effect of the support member in the above embodiment, and will not be repeated here.

[0029] In a possible implementation manner, along the thickness direction of the electronic device, the thickness D of the support member satisfies: 0.03 mm≤D≤0.2 mm.

[0030] By limiting the size range of the support member, it is helpful to improve the accuracy of positioning the display module in the thickness direction of the protective member, thereby improving the assembly accuracy between the display module and the middle frame. At the same time, it is also helpful to improve the supporting effect of the support member on the display module.

[0031] In a possible implementation, the support member includes a main body; a material of the main body includes one or more of PET, TPU, ABS, and PMMA.

[0032] Specifically, taking PET as an example, PET material has good mechanical properties, is easy to process and shape, and has good dimensional stability and chemical stability, which is beneficial to improving the reliability of the support member and extending the service life of the support member.

[0033] In a possible implementation, the support member further includes bonding portions located on both sides of the main body; one end of the main body is bonded to the protective member through the bonding portion, and the other end of the main body is bonded to the bottom wall of the shell through the bonding portion.

[0034] By providing the bonding part, the support member also plays a bonding role on the display module, which is conducive to improving the stability of the connection between the display module and the middle frame, that is, improving the stability of the display module installation to ensure that the display module works normally and stably. In addition, during the glue injection process, when the display module is placed in the middle frame, the display module and the middle frame can be pre-fixed by bonding the support member to the display module.

[0035] In a possible implementation, along the thickness direction of the electronic device, a projection area of ​​the protective member is larger than a projection area of ​​the display panel.

[0036] The protective member at the bottom of the display panel can play the role of buffering, shading, heat dissipation and grounding, so as to facilitate the normal and stable operation of the display module and extend the service life of the display module. The projection area of ​​the protective member is larger than the projection area of ​​the display panel. By increasing the effective area of ​​the protective member, it is helpful to improve the effect of the protective member in buffering, shading, heat dissipation, etc., so as to improve the reliability of the protective member and facilitate the normal use of the display module.

[0037] In a possible implementation, the protective element includes a rigid metal sheet.

[0038] Among them, the rigid metal sheet can be a steel sheet (such as a stainless steel sheet, a stainless steel sheet), a titanium alloy sheet or a metal sheet made of other rigid materials. Taking the steel sheet as an example, the steel sheet has good electrical and thermal conductivity. At the same time, it also has greater rigidity and hardness, thereby improving the overall rigidity and hardness of the protective member, so that the protective member plays a reliable supporting and protective role for the display panel, which is beneficial to improving the structural strength of the display panel, reducing the possibility of the display panel being broken and damaged under the action of external force, thereby improving the reliability of the display panel and extending the service life of the display panel. On the other hand, due to the large rigidity of the steel sheet itself, there is no need to inject glue around it, that is, only the periphery of the display panel needs to be injected with glue, which is beneficial to saving the amount of colloid used to save the cost of injection.

[0039] In a possible implementation, the protective member further includes a buffer portion; along the thickness direction of the electronic device, one end of the buffer portion is connected to the display panel; and the other end is connected to the rigid metal sheet.

[0040] The buffer part may include a glue layer and a buffer layer. The glue layer may be a mesh glue having good bonding properties to achieve the connection between the protective member and the display panel. At the same time, the mesh glue also has good air permeability, so that the protective member fits well on the display panel to improve the stability of the connection between the protective member and the display panel. The buffer layer plays a role of buffering and shading.

[0041] In a possible implementation, the buffer portion is a silicone layer.

[0042] The silicone layer not only acts as a buffer but also as an adhesive, thereby achieving the connection between the protective part and the display panel. Since silicone is used, there is no need to set up additional adhesive materials, that is, the above-mentioned adhesive layer and buffer layer can be realized by the silicone layer, which is conducive to simplifying the structure of the protective part and reducing the thickness of the protective part, thereby saving space inside the electronic device and realizing a lightweight design of the electronic device. In addition, silicone has high stability, which is conducive to improving the reliability of the protective part and extending the service life of the protective part.

[0043] In a possible implementation manner, the cover plate includes an arc-shaped area; and the rigid metal sheet is provided with a matching hole or a matching groove at a position corresponding to the arc-shaped area.

[0044] The rigid metal sheet is provided with a matching hole or a matching groove at a position corresponding to the arc-shaped area of ​​the cover plate, which is beneficial to reducing the structural strength of the position and allowing it to undergo a certain amount of deformation, so that the protective member can be well adapted to the cover plate with the arc-shaped area, thereby improving the stability of the protective member in the display module and enabling the protective member to provide reliable protection for the display panel.

[0045] In a third aspect, an embodiment of the present application provides an assembly method of an electronic device, wherein the electronic device comprises a middle frame and a display module; the middle frame comprises a middle frame side wall; the display module comprises a display panel and a cover plate and a protective member located on both sides of the display panel; the assembly method of the electronic device comprises: opening a glue injection hole and a glue outlet hole in the middle frame; placing the display module in the middle frame, and pre-fixing the display module to the middle frame; connecting a glue injection pump to the glue injection hole, so that the glue passes through the glue injection hole into the glue injection space located between the middle frame side wall, the cover plate and the protective member.

[0046] The above-mentioned assembly method limits the scope of glue injection, that is, only the glue injection space surrounded by the cover plate, the protective member and the side wall of the middle frame is injected, so that the colloid is only located on the periphery of the display panel, and there is no need to inject glue on the peripheral wall of the protective member that is not easily damaged and corroded, thereby achieving precise protection of the display panel to improve its mechanical properties. At the same time, the amount of colloid is also saved. On the other hand, the colloid can also seal the display panel to improve the corrosion resistance of the display panel. At the same time, by using the middle frame as a mold for glue injection. It is conducive to simplifying the assembly process of electronic equipment and improving the assembly efficiency of electronic equipment. In addition, since there is no need to use additional inner molds or outer molds for glue injection, the possibility of imprinting on the surface of the display module is reduced, which is conducive to improving the display effect of the display module, and also reduces the possibility that the dimensional accuracy of the display module is affected by the mold.

[0047] In a possible implementation manner, the forming of the glue injection hole and the glue outlet hole in the middle frame specifically includes: forming the glue injection hole and the glue outlet hole on a side wall of the middle frame.

[0048] The glue injection hole and the glue outlet hole are opened on the side wall of the middle frame, which is convenient for using the middle frame as a glue injection mold for glue injection and helps to simplify the glue injection steps.

[0049] In a possible embodiment, the middle frame also includes a middle frame bottom wall connected to the middle frame side wall; opening a glue injection hole and a glue outlet hole in the middle frame specifically includes: opening the glue injection hole and the glue outlet hole in the middle frame bottom wall; opening a glue injection matching hole connected to the glue injection hole in the protective part, and; opening a glue outlet matching hole connected to the glue outlet hole in the protective part.

[0050] Since the surface of the protective member is relatively smooth, injecting glue through the protective member is conducive to increasing the flow speed of the glue in the injection space, thereby improving the efficiency of the injection. That is, when the glue is injected from the bottom of the middle frame, the efficiency of the injection is higher.

[0051] In a possible implementation manner, pre-fixing the display module to the middle frame specifically includes: bonding the protective member to the side wall of the middle frame via a first adhesive member, and the first adhesive member is a ring-shaped structure.

[0052] The display module and the middle frame are pre-fixed by bonding the first adhesive member to the display module, which is beneficial to improving the stability of the display module installed in the middle frame. At the same time, the first adhesive member also plays a sealing role between the protective member and the side wall of the middle frame, thereby reducing the possibility of the colloid overflowing from the gap between the protective member and the side wall of the middle frame, so as to improve the glue injection effect.

[0053] In a possible implementation, after placing the display module in the middle frame and pre-fixing the display module and the middle frame, the method for assembling the electronic device further includes: filling a sealant between the side wall of the cover plate and the side wall of the middle frame.

[0054] The sealant seals the injection space, thereby reducing the possibility of the colloid overflowing from the gap between the cover plate and the side wall of the middle frame, ensuring the effect of the injection, improving the stability and reliability of the injection, and reducing the possibility of colloid waste. At the same time, the sealant can also play a bonding role to improve the stability of the connection between the display module and the middle frame.

[0055] It should be understood that the foregoing general description and the following detailed description are exemplary only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] Figure 1 A schematic diagram of the appearance of an electronic device provided in one embodiment of the present application;

[0057] Figure 2 A schematic diagram of the interior of an electronic device in an embodiment of the present application;

[0058] Figure 3 This is a schematic diagram of the interior of an electronic device in another embodiment of the present application;

[0059] Figure 4 A schematic diagram of a display module, an inner mold, and an outer mold of an electronic device in one embodiment of the present application;

[0060] Figure 5 This is a schematic diagram of a glue injection pump injecting glue into a display module through a mold in one embodiment of the present application;

[0061] Figure 6 for Figure 5 Schematic diagram of the display module after the glue injection is completed;

[0062] Figure 7 for Figure 4 An enlarged view of the junction between the display module and the inner mold is shown in FIG.

[0063] Figure 8 A flowchart of an assembly process of an electronic device in an embodiment of the present application;

[0064] Fig. 9 A top view of a middle frame of an electronic device in an embodiment of the present application;

[0065] Fig.10 This is a schematic diagram of the display module and the middle frame being pre-fixed in the first embodiment of the present application;

[0066] Fig.11This is a schematic diagram of the second embodiment of the present application when the display module and the middle frame are pre-fixed;

[0067] Fig.12 This is a schematic diagram of the display module and the middle frame being pre-fixed in the third embodiment of the present application;

[0068] Fig.13 This is a schematic diagram of the fourth embodiment of the present application when the display module and the middle frame are pre-fixed;

[0069] Fig.14 This is a schematic diagram of a glue injection pump injecting glue into a display module through a glue injection hole on a side wall of a middle frame in an embodiment of the present application;

[0070] Fig.15 It is a schematic diagram of a glue injection pump extending into a first glue injection hole and a second glue injection hole respectively in an embodiment of the present application;

[0071] Fig.16 for Fig.14 Schematic diagram of the display module after the glue injection is completed;

[0072] Fig.17 is a schematic diagram of an assembly process of an electronic device in another embodiment of the present application;

[0073] Fig.18 It is a schematic diagram of setting a sealant between a cover plate and a side wall of a middle frame of an electronic device in one embodiment of the present application;

[0074] Fig.19 is a schematic diagram of an assembly process of an electronic device in another embodiment of the present application;

[0075] Fig. 20 A top view of a middle frame in another embodiment of the present application;

[0076] Fig.21 A top view of a protective member of a display module in an embodiment of the present application;

[0077] Fig. 22 This is a schematic diagram of the display module and the middle frame being pre-fixed in the fifth embodiment of the present application;

[0078] Fig.23 This is a schematic diagram of a glue injection pump injecting glue into a display module through a glue injection hole on a bottom wall of a middle frame in an embodiment of the present application;

[0079] Fig.24 for Fig.23 The schematic diagram of the module after the injection is completed is shown in the figure;

[0080] Fig.25 A schematic diagram of a display module in an embodiment of the present application;

[0081] Fig.26This is a schematic diagram of a display module in another embodiment of the present application;

[0082] Fig. 27 This is a schematic diagram of a display module in another embodiment of the present application;

[0083] Fig.28 It is a partial schematic diagram of a display module in one embodiment of the present application;

[0084] Fig.29 This is a schematic diagram showing that a display module is connected to a bottom wall of a middle frame through a support member in an embodiment of the present application;

[0085] Fig.30 This is a schematic diagram showing that a module is connected to a bottom wall of a middle frame through a support member in another embodiment of the present application;

[0086] Fig.31 This is a schematic diagram showing that a display module is connected to a bottom wall of a middle frame through a support member in another embodiment of the present application;

[0087] Fig.32 A schematic diagram of a candy-bar mobile phone provided in an embodiment of the present application;

[0088] Fig.33 for Fig.32 Schematic diagram of the display panel of the display module of the mid-range mobile phone after glue injection;

[0089] Fig.34 A schematic diagram of a foldable mobile phone in a folded state provided in an embodiment of the present application;

[0090] Fig.35 for Fig.34 A schematic diagram of a display panel of a first display module of a foldable mobile phone after glue injection;

[0091] Fig.36 A schematic diagram of a foldable mobile phone in an unfolded state provided in an embodiment of the present application;

[0092] Fig.37 for Fig.36 Schematic diagram of the display panel of the second display module of the foldable mobile phone after glue injection.

[0093] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application. DETAILED DESCRIPTION

[0094] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0095] In the description of this application, unless otherwise clearly specified and limited, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance; unless otherwise specified or explained, the term "plurality" refers to two or more; the terms "connected" and "fixed" should be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0096] In the description of this specification, it should be understood that the directional words such as "upper" and "lower" described in the embodiments of the present application are described at the angles shown in the accompanying drawings and should not be understood as limiting the embodiments of the present application. In addition, in the context, it should also be understood that when it is mentioned that an element is connected to another element "upper" or "lower", it can not only be directly connected to another element "upper" or "lower", but also indirectly connected to another element "upper" or "lower" through an intermediate element.

[0097] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0098] like Figure 1 As shown, Figure 1 The schematic diagram of the appearance of an electronic device 100 provided in an embodiment of the present application is shown. The embodiment of the present application provides an electronic device 100. The electronic device 100 can be an electronic product such as a mobile phone, a tablet computer, a laptop computer or a wearable device. The following is a specific description taking the electronic device 100 as a mobile phone as an example.

[0099] The electronic device 100 has a display module 10 and a housing 20. The display module 10 is mounted on the housing 20 and is used to display image information or video information for viewing by a user. The display module 10 may be a 2D (Dimensions) display screen (i.e., a flat screen), or a 2.5D curved screen or a 3D curved screen.

[0100] like Figure 2 As shown, Figure 2A schematic diagram of the interior of an electronic device 100 in an embodiment of the present application is shown. The housing 20 includes a middle frame 30 and a back cover 54. The back cover 54 is connected to the middle frame 30 and encloses a first accommodation space 331 with the middle frame 30. The display module 10, the circuit board 52, and the battery 53 can all be accommodated together in the first accommodation space 331. This design is conducive to simplifying the structure of the middle frame 30. At the same time, accommodating components such as the display module 10, the battery 53, and the circuit board 52 in the same accommodation space is conducive to saving space inside the electronic device 100, thereby facilitating a compact design inside the electronic device 100.

[0101] In other embodiments, the middle frame 30 may also be in other shapes, such as an H-shape. Figure 3 As shown, an H-shaped middle frame 30 is shown. Figure 3 A schematic diagram of the interior of an electronic device 100 in another embodiment of the present application is shown. Among them, the middle frame 30 may include a middle frame bottom wall 31 and a middle frame side wall 32 arranged circumferentially around the middle frame bottom wall 31. The middle frame bottom wall 31 and the middle frame side wall 32 enclose a first accommodating space 331. The display module 10 is accommodated in the first accommodating space 331, and the edge of the display module 10 along the circumferential direction is connected to the middle frame side wall 32. The middle frame bottom wall 31 and the back cover 54 enclose a second accommodating space 332. The circuit board 52 and the battery 53 are accommodated in the second accommodating space 332. The above-mentioned middle frame bottom wall 31 isolates the display module 10 from other components such as the circuit board 52, reduces the possibility of interference between the display module 10 and components such as the circuit board 52 during the assembly process, is conducive to reducing the difficulty of assembling the electronic device 100, and is also conducive to improving the stability of the connection between the display module 10 and the middle frame 30.

[0102] The following description takes the H-shaped middle frame as an example. Middle frames of other structures are similar to this and will not be described in detail in this article.

[0103] like Figure 3 As shown, along the thickness direction Z of the electronic device 100 , the display module 10 includes a cover plate 11 , a display panel 12 and a protective member 13 from top to bottom.

[0104] The display panel 12 may be a liquid crystal display (LCD) or an organic light-emitting diode (OLED) display.

[0105] Along the thickness direction Z of the electronic device 100, the cover plate 11 can be bonded to the upper surface of the display panel 12. The surface of the cover plate 11 facing the display panel 12 can be a flat surface or a curved surface. The cover plate 11 is made of a high-strength and high-transparency material, such as glass. The cover plate 11 protects the display panel 12, which helps to reduce the possibility of the upper surface of the display panel 12 being scratched or damaged by external factors, thereby extending the service life of the display panel 12 and ensuring the normal use of the display panel 12.

[0106] Along the thickness direction Z of the electronic device 100 , the projection area of ​​the cover plate 11 may be larger than the projection area of ​​the display panel 12 , that is, the cover plate 11 may completely cover the upper surface of the display panel 12 , so as to improve the protection effect of the display panel 12 .

[0107] Along the thickness direction Z of the electronic device 100, the protective member 13 can be bonded to the lower surface of the display panel 12. The protective member 13 can play the role of buffering, shading, heat dissipation and grounding at the bottom of the display panel 12, so as to facilitate the normal and stable operation of the display module 10 and extend the service life of the display module 10.

[0108] Along the thickness direction Z of the electronic device 100, the projection area of ​​the protective member 13 is larger than the projection area of ​​the display panel 12. By increasing the effective area of ​​the protective member 13, it is beneficial to improve the effects of the protective member 13 in terms of buffering, shading, heat dissipation, etc., and improve the reliability of the protective member 13, so as to facilitate the normal use of the display module 10.

[0109] When the electronic device 100 is bumped or dropped, the edge of the display module 10 is prone to breakage, damage or even failure. On the other hand, the edge of the display module 10 is also easily corroded by dirt such as sweat and oil, thereby affecting the normal operation of the display module 10.

[0110] In order to improve the mechanical properties and corrosion resistance of the edge of the display module 10, before the edge of the display module 10 is assembled with the middle frame 30, glue is injected at the edge of the display module 10 to protect the edge of the display module 10. Moreover, in the display module 10, compared with the cover plate 11 and the protective member 13, the display panel 12 has a higher risk of cracking and corrosion, so the glue injection process mainly protects the edge of the display panel 12.

[0111] Figure 4 A schematic diagram of a display module 10 , an inner mold 92 , and an outer mold 91 of an electronic device 100 in an embodiment of the present application is shown. Figure 4In order to illustrate the process of glue injection, after the cover plate 11, the display panel 12 and the protective member 13 are assembled into the display module 10, the display module 10 can be fixed by using the mold 90, and then glue is injected. The mold 90 includes an outer mold 91 and an inner mold 92. The outer mold 91 includes an outer mold mother mold 912. The outer mold mother mold 912 has a through hole 912a. The inner mold 92 has a glue injection hole 92a. When injecting glue, the inner mold 92 is first placed in the outer mold mother mold 912, and the glue injection hole 92a is connected to the through hole 912a, and then the display module 10 is placed in the outer mold mother mold 912, so that the display module 10 and the inner mold 92 are surrounded by a glue injection space 40. At this time, the glue injection space 40 is connected to the glue injection hole 92a and the through hole 912a.

[0112] In order to protect all positions of the edge of the display panel 12, the above-mentioned glue injection space 40 needs to surround all positions of the display panel 12 that are not covered by the cover plate 11 and the protective member 13. Based on this, when the display module 10 is placed in the outer mold mother mold 912, the inner mold 92 needs to abut against the bottom of the protective member 13. As mentioned above, since the projection of the cover plate 11 along the Z direction is larger than the display panel 12, in order to play a supporting role, the inner mold 92 also needs to abut against the bottom of the cover plate 11. At this time, the glue injection space 40 surrounds the edge of the display panel 12, that is, covers all positions of the display panel 12 that are not covered by the cover plate 11 and the protective member 13.

[0113] like Figure 5 As shown, Figure 5 A schematic diagram of a glue injection pump 200 injecting glue into a display module 10 through a mold 90 in an embodiment of the present application is shown. The outer mold 91 also includes an outer mold male mold 911. After the display module 10 is placed on the outer mold female mold 912, the outer mold male mold 911 is pressed onto the outer mold female mold 912. Under the pressing action of the outer mold male mold 911 and the outer mold female mold 912, the display module 10 and the inner mold 92 are firmly pressed together, thereby facilitating glue injection. The glue injection pump 200 is extended into the glue injection space 40 through the through hole 912a and the glue injection hole 92a to inject glue into the glue injection space 40.

[0114] After the glue injection is completed, the outer mold male mold 911 is first disassembled from the outer mold female mold 912, and then the display module 10 is taken out from the outer mold female mold 912 to obtain the following Figure 6 The display module 10 is shown. Figure 6 Shows Figure 5 After the glue injection is completed, the colloid 41 not only covers the surroundings of the display panel 12, but also covers the surroundings of the protective member 13, and even extends to the position below the protective member 13, so as to protect the display module 10.

[0115] However, the above solution has the following problems:

[0116] First, the range of glue injection is too large (the glue injection space is too large), which leads to an increase in the amount of glue 41 used, which is not conducive to the miniaturization of the electronic device 100.

[0117] Second, as Figure 7 As shown, Figure 7 Shows Figure 4 FIG. 4 is an enlarged view of the abutment between the display module 10 and the inner mold 92. When the inner mold 92 abuts against the display module 10, due to the influence of manufacturing process errors, a gap a is likely to exist between the inner mold 92 and the cover plate 11, and a gap b is likely to exist between the inner mold 92 and the protective member 13. The colloid injected into the glue injection space 40 is likely to overflow from the above-mentioned gap a and gap b, which not only easily affects the glue injection effect, but also easily causes a waste of colloid.

[0118] Thirdly, under the pressing action of the outer mold male mold 911 and the outer mold female mold 912, the inner mold 92 is likely to leave marks on the surface of the display module 10, thereby easily affecting the display effect of the display module 10 and being detrimental to the user experience.

[0119] Fourthly, the dimensional accuracy of the mold 90 is likely to affect the dimensional accuracy of the glue injection space 40, thereby affecting the dimensional accuracy of the entire display module 10. Therefore, when the dimensional accuracy of the mold 90 is low, the dimensional accuracy of the colloid 41 connected to the display module 10 after glue injection is low, which is likely to affect the subsequent assembly accuracy between the display module 10 and the middle frame 30.

[0120] Fifthly, since the mold 90 has a high cost and a short service life, the production cost of the electronic device increases.

[0121] Sixthly, after the display module 10 is injected with glue, it still needs to be assembled with the middle frame 30 by dispensing glue or back glue, which makes the production process of the entire electronic device more complicated.

[0122] In order to solve the above technical problems, the embodiment of the present application limits the glue injection space 40 between the cover plate 11 and the protective member 13 of the display module 10 to reduce the amount of the glue 41, thereby simplifying the glue injection steps and improving the process efficiency.

[0123] Specifically, an embodiment of the present application provides an assembly method of an electronic device 100 . Figure 8 FIG. 3 is a flow chart showing an assembly process 300 of an electronic device 100 in an embodiment of the present application. Figures 9 to 16 To describe the assembly process 300. The assembly process 300 may include the following steps:

[0124] S311: Set the glue injection hole 42 and glue outlet hole 43 on the middle frame 30. Please refer to Fig. 9 , Fig. 9 The top view of the middle frame 30 of the electronic device 100 in one embodiment of the present application is shown, wherein the glue injection hole 42 is connected to the inner cavity 34 of the middle frame 30 , and the glue outlet hole 43 is connected to the inner cavity 34 of the middle frame 30 .

[0125] The injection holes 42 and the outlet holes 43 are formed on the side wall 32 of the middle frame, which facilitates the use of the middle frame 30 as an injection mold for injection and helps simplify the injection steps. The injection holes 42 and the outlet holes 43 can be formed along the width direction Y of the electronic device 100.

[0126] Specifically, the middle frame side wall 32 may be provided with a first glue injection hole 421, a second glue injection hole 422, a first glue outlet hole 431, and a second glue outlet hole 432, which is conducive to improving the efficiency of glue injection. Along the circumference of the middle frame side wall 32, the first glue injection hole 421, the first glue outlet hole 431, the second glue injection hole 422, and the second glue outlet hole 432 are arranged in sequence. The middle frame side wall 32 has a first long side 32a and a second long side 32b. The first glue injection hole 421 and the first glue outlet hole 431 are provided on the first long side 32a. The second glue injection hole 422 and the second glue outlet hole 432 are provided on the second long side 32b.

[0127] After step S311, proceed to step S312. S312: Please refer to Fig.10 , Fig.10 The schematic diagram of the display module 10 and the middle frame 30 being pre-fixed in the first embodiment of the present application is shown. The display module 10 is placed in the middle frame 30, and the display module 10 and the middle frame 30 are pre-fixed.

[0128] After the display module 10 and the middle frame 30 are pre-fixed, the cover plate 11, the protective member 13 and the middle frame side wall 32 enclose the glue injection space 40 along the thickness direction Z of the electronic device 100. That is, for the glue injection space 40, the cover plate 11 and the protective member 13 can serve as the bottom wall and the top wall of the glue injection space 40 respectively. The display panel 12 and the middle frame side wall 32 can serve as the side walls of the glue injection space 40 respectively. Figure 5 Compared with the glue injection space 40 shown in FIG. 1 , the glue injection space 40 in this embodiment is significantly reduced. Fig. 9 The glue injection space 40 is connected to the glue injection hole 42 and the glue outlet hole 43 provided on the side wall 32 of the middle frame.

[0129] The display module 10 and the middle frame 30 may be pre-fixed in any one or a combination of the following methods.

[0130] The first type: the protective member 13 is pre-fixed to the middle frame side wall 32 .

[0131] Specifically, the outer peripheral wall of the protective member 13 may be provided with a first adhesive member 70. After the display module 10 is placed in the middle frame 30, the first adhesive member 70 is bonded to the middle frame side wall 32; or, the first adhesive member 70 may also be provided on the middle frame side wall 32, and after the display module 10 is placed in the middle frame 30, the first adhesive member 70 is bonded to the protective member 13. The provision of the first adhesive member 70 is conducive to improving the stability of the display module 10 installed in the middle frame 30. In addition to pre-fixing the display module 10 and the middle frame 30, the first adhesive member 70 also plays a sealing role between the protective member 13 and the middle frame side wall 32. The first adhesive member 70 may be provided along the circumference of the protective member 13, that is, the first adhesive member 70 may have an annular structure to seal the bottom of the glue injection space 40, thereby reducing the possibility of the colloid 41 overflowing from the gap between the protective member 13 and the middle frame side wall 32 to improve the glue injection effect.

[0132] Please refer to Fig.11 , Fig.11 The schematic diagram of the display module 10 and the middle frame 30 being pre-fixed in the second embodiment of the present application is shown. The middle frame side wall 32 may be provided with a protrusion 321. The protrusion 321 extends into the interior of the middle frame 30. The above-mentioned first adhesive 70 is arranged on the protrusion 321, and the protrusion 321 supports and positions the first adhesive 70, thereby improving the stability of the first adhesive 70 arranged in the middle frame 30, reducing the possibility of the first adhesive 70 sliding along the middle frame side wall 32 or falling off the middle frame side wall 32, thereby improving the stability of the connection between the display module 10 and the middle frame side wall 32. In some embodiments, the protrusion 321 may be arranged along the circumference of the middle frame side wall 32, that is, the protrusion 321 may be an annular boss. In other embodiments, a plurality of protrusions 321 are provided on the middle frame side wall 32, and the plurality of protrusions 321 are arranged at intervals along the circumference of the middle frame side wall 32.

[0133] The second type: the protective member 13 is pre-fixed to the bottom wall 31 of the middle frame.

[0134] Please refer to Fig.12 , Fig.12 The schematic diagram of the display module 10 and the middle frame 30 in the third embodiment of the present application is shown. When the display module 10 is placed in the middle frame 30, the bottom of the protective member 13 in the display module 10 can be bonded to the bottom wall 31 of the middle frame through the second adhesive member 55. Specifically, the second adhesive member 55 can be adhesive. At the same time, the side wall of the protective member 13 can also be bonded to the side wall 32 of the middle frame through the first adhesive member 70.

[0135] Alternatively, please refer to Fig.13 , Fig.13A schematic diagram of the display module 10 and the middle frame 30 being pre-fixed in the fourth embodiment of the present application is shown. A support member 80 may be provided in the space enclosed by the middle frame bottom wall 31 and the middle frame side wall 32, and the support member 80 is located on the middle frame bottom wall 31. When the display module 10 is placed in the middle frame 30, the protective member 13 may abut against the support member 80. Among them, the support member 80 may be installed on the middle frame bottom wall 31, or may be integrally formed with the middle frame bottom wall 31. When the display module 10 is placed in the middle frame 30, when the protective member 13 abuts against the support member 80, it means that the display module 10 has reached the preset installation position. The support member 80 plays an installation and positioning role for the display module 10, which is conducive to improving the assembly accuracy between the display module 10 and the middle frame 30. In addition, by adjusting the thickness of the support member 80, the position of the display module 10 in the middle frame 30 can be adjusted, and the requirements for the dimensional accuracy of the middle frame 30 can be reduced.

[0136] That is, the display module 10 is pre-fixed with the middle frame side wall 32 , and / or the display module 10 is pre-fixed with the middle frame bottom wall 31 .

[0137] In other embodiments, the display module may also be pre-fixed to the back cover.

[0138] After step S312, proceed to step S313. S313: Connect the glue injection pump 200 to the glue injection hole 42, so that the glue 41 enters the glue injection space 40 through the glue injection hole 42. When the glue 41 is discharged from the glue outlet hole 43, the glue injection of the glue injection space 40 is completed, so that the display panel 12 is connected to the middle frame 30 through the glue 41.

[0139] Please refer to Fig.14 , Fig.14 A schematic diagram of an embodiment of the present application is shown in which the glue injection pump 200 injects glue into the display module 10 through the glue injection hole 42 on the middle frame side wall 32. During the glue injection, the glue injection pump 200 extends into the glue injection hole 42 to inject the colloid 41 into the outer peripheral wall of the display panel 12, so that the display panel 12 is connected to the middle frame side wall 32 through the colloid 41.

[0140] like Fig.15 As shown, Fig.15 A schematic diagram is shown in which a glue injection pump 200 is extended into a first glue injection hole 421 and a second glue injection hole 422 respectively in one embodiment of the present application. The middle frame side wall 32 may be provided with two glue injection holes 42, namely a first glue injection hole 421 and a second glue injection hole 422. The first glue injection hole 421 and the second glue injection hole 422 may be connected to a glue injection pump 200 respectively, so that two glue injection pumps 200 may be used to inject glue at the same time to improve the efficiency of glue injection. When the glue injection pump 200 injects colloid into the glue injection space, the colloid flows in the glue injection space. When the glue injection fills the glue space, the colloid is discharged outward through the glue outlet hole 43.

[0141] For more information, see Fig.15 As shown, the glue injection process is described below by taking the first glue injection hole 421 as an example. The first glue injection hole 421 is located between the first glue outlet hole 431 and the second glue outlet hole 432. The path between the first glue injection hole 421 and the first glue outlet hole 431 is L1, and the path between the first glue injection hole 421 and the second glue outlet hole 432 is L2. After the glue is injected from the first glue injection hole 421, the colloid flows through the path L1 and the path L2 respectively, and is discharged from the first glue outlet hole 431 and the second glue outlet hole 432. The principle of the position design between the second glue injection hole 422 and the two glue outlet holes 43 is the same as the principle of the position design between the first glue injection hole 421 and the two glue outlet holes 43, and will not be repeated here.

[0142] The embodiment of the present application limits the positions of the glue injection hole 42 and the glue outlet hole 43, which is beneficial for achieving synchronous glue outlet from the first glue outlet hole 431 and the second glue outlet hole 432 after synchronous glue injection of the first glue injection hole 421 and the second glue injection hole 422, thereby facilitating improved glue injection efficiency.

[0143] Please refer to Fig.16 , Fig.16 Shows Fig.14 Schematic diagram of the display module 10 after the glue injection is completed. Fig.16 The connection structure of the middle frame 30 and the display module 10 shown. The cover plate 11, the protective member 13 and the middle frame side wall 32 of the display module 10 are filled with a colloid 41, and the display panel 12 is connected to the middle frame side wall 32 through the colloid 41, and the colloid 41 protects the display panel 12 along the circumferential direction. Specifically, the colloid 41 can be an adhesive material such as epoxy adhesive.

[0144] The above-mentioned assembly method limits the scope of glue injection, that is, only the glue injection space 40 surrounded by the cover plate 11, the protective member 13 and the middle frame side wall 32 is injected, so that the colloid 41 is only located at the periphery of the display panel 12, and there is no need to inject glue to the peripheral wall of the protective member 13 that is not easy to be damaged and corroded, thereby realizing accurate protection of the display panel 12, which is conducive to improving the mechanical properties of the display panel 12, reducing the possibility of the display panel 12 being broken or failing when the electronic device 100 falls or hits, thereby extending the service life of the display panel 12. At the same time, the amount of colloid 41 is also saved, which is conducive to reducing the weight of the electronic device 100 and reducing the production cost of the electronic device 100. On the other hand, the colloid 41 can also play a sealing role on the display panel 12, reducing the possibility of corrosion of the display panel 12 by external sweat stains, oil stains and other dirt during the use of the electronic device 100, which is also conducive to extending the service life of the display panel 12 and ensuring that the display panel 12 works normally and stably.

[0145] At the same time, the middle frame 30 is used as a mold for glue injection. After the glue injection is completed, the colloid 41 not only protects the display panel 12, but also plays a bonding role between the display panel 12 and the middle frame side wall 32, thereby connecting the display panel 12 and the middle frame 30 together. That is, the embodiment of the present application completes the connection between the display panel 12 and the middle frame 30 while completing the glue injection on the display panel 12, which is beneficial to simplify the assembly process of the electronic device and improve the assembly efficiency of the electronic device. In addition, since there is no need to use additional inner molds or outer molds for glue injection, the possibility of imprinting on the surface of the display module 10 is reduced, which is beneficial to improve the display effect of the display module 10, and also reduces the possibility that the dimensional accuracy of the display module 10 is affected by the mold.

[0146] Fig.17 FIG. 4 is a flow chart showing an assembly process 400 of an electronic device 100 in another embodiment of the present application. Fig.18 To describe the assembly process 400. The assembly process may include the following steps:

[0147] S411: a glue injection hole 42 and a glue outlet hole 43 are provided on the middle frame 30 . The glue injection hole 42 is communicated with the inner cavity 34 of the middle frame 30 , and the glue outlet hole 43 is communicated with the inner cavity 34 of the middle frame 30 .

[0148] In step 411 , the glue injection hole 42 and the glue outlet hole 43 are arranged on the middle frame 30 in the same manner as in step S311 , which will not be described in detail herein.

[0149] After step S411 , the process proceeds to step S412 . S412 : placing the display module 10 in the middle frame 30 , and pre-fixing the display module 10 and the middle frame 30 .

[0150] The pre-fixing method of the display module and the middle frame in step S412 may be the same as that in step S312, and will not be repeated here.

[0151] After step S412, the process proceeds to step S413. S413, the gap between the side wall of the cover plate 11 and the side wall 32 of the middle frame is sealed by the sealant 60, so as to seal the injection space 40.

[0152] Please refer to Fig.18 , Fig.18A schematic diagram of setting a sealant 60 between the cover plate 11 and the middle frame side wall 32 of the electronic device 100 in one embodiment of the present application is shown. There is a sealant 60 between the cover plate 11 and the middle frame side wall 32. The sealant 60 can be arranged along the circumference of the cover plate 11. During the glue injection process, the sealant 60 seals the glue injection space, thereby reducing the possibility of the colloid 41 overflowing from the gap between the cover plate 11 and the middle frame side wall 32, so as to ensure the effect of the glue injection, improve the stability and reliability of the glue injection, and reduce the possibility of waste of the colloid 41. At the same time, the sealant 60 can also play a bonding role to improve the stability of the connection between the display module 10 and the middle frame 30.

[0153] Specifically, the sealant 60 can be a caulking glue. After the display module 10 is placed in the middle frame 30 and pre-fixed with the middle frame 30, a dispensing mechanism (not shown) can be used to apply the caulking glue in the gap between the cover plate 11 and the side wall 32 of the middle frame.

[0154] After step S413, the process proceeds to step S414. S414: connecting the glue injection pump 200 to the glue injection hole 42, allowing the glue 41 to enter the glue injection space 40 through the glue injection hole 42, and when the glue is discharged from the glue outlet hole 43, the glue injection into the glue injection space is completed.

[0155] The method of injecting and discharging the colloid 41 into the glue injection space 40 in step 414 may be the same as that in step S313 , which will not be described in detail herein.

[0156] The above is about injecting glue from the side of the middle frame 30, that is, the injection hole 42 and the glue outlet hole 43 are set on the middle frame side wall 32. In other embodiments, the glue can also be injected from the bottom of the middle frame 30, that is, the injection hole 42 and the glue outlet hole 43 are set on the middle frame bottom wall 31. The following describes in detail the injection of glue from the bottom of the middle frame 30.

[0157] Fig.19 FIG. 5 is a flowchart of an assembly process 500 of an electronic device 100 in another embodiment of the present application. Figures 19 to 24 To describe the assembly process 500. The assembly process 500 may include the following steps:

[0158] S511 : setting a glue injection hole 42 and a glue outlet hole 43 on the middle frame 30 , and setting a glue injection matching hole 135 and a glue outlet matching hole 136 on the protective member 13 .

[0159] For more information, see Fig. 20 , Fig. 20: A top view of the middle frame 30 in another embodiment of the present application is shown. The glue injection hole 42 and the glue outlet hole 43 are provided on the bottom wall 31 of the middle frame, and are both connected to the inner cavity of the middle frame 30. Among them, the middle frame bottom wall 31 may be provided with a first glue injection hole 421, a second glue injection hole 422, a first glue outlet hole 431 and a second glue outlet hole 432. Along the circumference of the middle frame side wall 32, the first glue injection hole 421, the first glue outlet hole 431, the second glue injection hole 422, and the second glue outlet hole 432 are sequentially arranged.

[0160] Please also refer to Fig.21 , Fig.21 The top view of the protective member 13 of the display module 10 in one embodiment of the present application is shown. The protective member 13 may be provided with a first glue injection matching hole 135a, a second glue injection matching hole 135b, a first glue outlet matching hole 136a, and a second glue outlet matching hole 136b. Along the circumference of the protective member 13, the first glue injection matching hole 135a, the first glue outlet matching hole 136a, the second glue injection matching hole 135b, and the second glue outlet matching hole 136b are sequentially arranged.

[0161] S512 : placing the display module 10 in the middle frame 30 , and pre-fixing the display module 10 and the middle frame 30 .

[0162] The pre-fixing method of the display module 10 and the middle frame 30 in step S512 may be the same as that in step S312, and will not be described again here.

[0163] Please refer to Fig. 22 , Fig. 22 Schematic diagram of the display module 10 and the middle frame 30 being pre-fixed in the fifth embodiment of the present application is shown. After the display module 10 and the middle frame 30 are pre-fixed, the glue injection hole 42 is connected to the glue injection space 40 through the glue injection matching hole 135. Fig. 22 Not shown) through the glue outlet matching hole ( Fig. 22 4 (not shown) is connected to the glue injection space 40.

[0164] Specifically, the position of the first glue injection matching hole 135a corresponds to the position of the first glue injection hole 421, that is, along the thickness direction Z of the electronic device 100, the first glue injection matching hole 135a is connected to the first glue injection hole 421. The first glue outlet matching hole 136a corresponds to the position of the first glue outlet hole 431, that is, along the thickness direction Z of the electronic device 100, the first glue outlet matching hole 136a is connected to the first glue outlet hole 431. The position of the second glue injection matching hole 135b corresponds to the position of the second glue injection hole 422, that is, along the thickness direction Z of the electronic device 100, the second glue injection matching hole 135b is connected to the second glue injection hole 422. The position of the second glue outlet matching hole 136b corresponds to the position of the second glue outlet hole 432, that is, along the thickness direction Z of the electronic device 100, the second glue outlet matching hole 136b is connected to the second glue outlet hole 432.

[0165] After step S512, the process proceeds to step S513. S513, the gap between the side wall of the cover plate 11 and the side wall 32 of the middle frame is sealed by the sealant 60, so as to seal the injection space 40.

[0166] This step is the same as the above step S413 and will not be repeated here.

[0167] After step S513 , the process proceeds to step S514 . S514 : Connect the glue injection pump 200 to the glue injection hole 42 , so that the glue 41 enters the glue injection space 40 through the glue injection hole 42 . When the glue 41 is discharged from the glue outlet hole 43 , the glue injection into the glue injection space 40 is completed.

[0168] Please refer to Fig.23 , Fig.23 The schematic diagram of the glue injection pump 200 in one embodiment of the present application injecting glue into the display module 10 through the glue injection hole 42 on the bottom wall 31 of the middle frame is shown. The glue injection pump 200 extends into the glue injection space 40 through the glue injection hole 42 and the glue injection matching hole 135 to inject glue into the glue injection space 40.

[0169] Please refer to Fig.24 , Fig.24 Shows Fig.23 Schematic diagram of the module 10 after the glue injection is completed is shown in FIG. The glue 41 is filled into the above-mentioned glue injection space by the glue injection pump 200. Fig. 20 and Fig.21 When the glue injection space is filled with the glue 41, the glue 41 is discharged from the glue injection space through the glue outlet matching hole 136 on the protective member 13, and then discharged to the outside of the middle frame 30 through the glue outlet hole 43 on the middle frame 30. After the glue is injected synchronously from the first glue injection matching hole 135a and the second glue injection matching hole 135b, the glue 41 can be discharged from the first glue outlet matching hole 136a and the second glue outlet matching hole 136b at the same time. This is conducive to improving the efficiency of glue injection.

[0170] Since the surface of the protective member 13 is relatively smooth, injecting glue through the protective member 13 is conducive to increasing the flow speed of the colloid 41 in the injection space 40, thereby improving the efficiency of the injection. Therefore, when injecting glue from the bottom of the middle frame 30, the efficiency of the injection is higher.

[0171] In addition, in the above embodiments, after the glue injection is completed, the glue injection hole and the glue outlet hole can be sealed, for example, by filling the glue injection hole and the glue outlet hole with sealant, or by using a component such as a tape to block the glue injection hole and the glue outlet hole. Alternatively, the glue injection hole and the glue outlet hole can be directly sealed using the above-mentioned colloid.

[0172] like Fig.25 As shown, Fig.25A schematic diagram of a display module 10 in an embodiment of the present application is shown. Along the thickness direction Z of the protective member 13, the protective member 13 may be a multi-layer structure. Specifically, the protective member 13 may have a buffer portion and a flexible metal sheet 137, wherein the buffer portion may include a glue layer 131 and a buffer layer 132. The glue layer 131 may be a mesh glue having good bonding properties to achieve the connection between the protective member 13 and the display panel 12. At the same time, the mesh glue also has good air permeability, so that the protective member 13 fits well on the display panel 12 to improve the stability of the connection between the protective member 13 and the display panel 12. The glue layer 131 may also use other glue materials as long as it meets the use requirements of the display module 10. The buffer layer 132 plays a role of buffering and shading. The buffer layer 132 may be made of foam, and of course other materials with good buffering properties may also be used. The flexible metal sheet 137 may be a metal material such as copper foil or aluminum foil.

[0173] The following is an example in which the flexible metal sheet 137 is copper foil. Copper foil has good electrical and thermal conductivity, which is beneficial to improving the reliability of the protective member 13. Since the copper foil is relatively soft, the protective member 13 can be well adapted to a straight screen or a curved screen. However, relatively speaking, since the copper foil is easily deformed under the impact of external forces, the reliability is relatively low. In order to improve the mechanical properties of the copper foil, it is necessary to inject glue on the periphery of the copper foil, that is, it is necessary not only to inject glue on the periphery of the display panel 12, but also to inject glue on the periphery of the protective member 13, resulting in an increase in the amount of colloid used and an increase in cost. In addition, since the glue layer 131, the buffer layer 132 and the flexible metal sheet 137 are relatively soft, the overall rigidity of the protective member 13 is relatively low, making it difficult to provide reliable protection for the display panel 12, resulting in the display panel 12 being broken or even failing when impacted, which is not conducive to improving the service life of the display panel 12.

[0174] In response to the above technical issues, such as Fig.26 As shown, Fig.26A schematic diagram of a display module 10 in another embodiment of the present application is shown. The present application embodiment provides a rigid metal sheet 133 to replace the above-mentioned flexible metal sheet 137. The rigid metal sheet 133 can play the role of heat dissipation, light shielding, grounding and support. The rigid metal sheet 133 can be a steel sheet (for example, a 304 stainless steel sheet, a 316 stainless steel sheet), a titanium alloy sheet or a metal sheet made of other rigid materials. Taking the steel sheet as an example, the steel sheet has good electrical conductivity and thermal conductivity. At the same time, it also has greater rigidity and hardness, thereby improving the overall rigidity and hardness of the protective member 13, so that the protective member 13 plays a reliable supporting and protective role for the display panel 12, which is conducive to improving the structural strength of the display panel 12, reducing the possibility of the display panel 12 being broken and damaged under the action of external force, thereby improving the reliability of the display panel 12 and extending the service life of the display panel 12. On the other hand, due to the large rigidity of the steel sheet itself, there is no need to inject glue around it, that is, only the outer periphery of the display panel 12 needs to be injected, which is conducive to saving the amount of colloid 41 and saving the cost of injection. Therefore, in this embodiment, the protective member 13 uses a rigid metal sheet 133 instead of the flexible metal sheet 137 to help reduce the volume of the injected glue.

[0175] The process of glue injection is as described in the above embodiments, and will not be repeated here. Fig.24 After the injection is completed, the colloid 41 can be carried on the protective member 13. Under the support of the rigid metal sheet 133, the possibility of deformation of the protective member 13 under the influence of the gravity of the colloid 41 is reduced, thereby improving the stability of the colloid 41.

[0176] like Fig. 27 As shown, Fig. 27 A schematic diagram of a display module 10 in another embodiment of the present application is shown. The buffer portion in the protective member 13 may be a silicone layer 134. Specifically, along the thickness direction Z of the protective member 13, the protective member 13 may be provided with a silicone layer 134 and a rigid metal sheet 133 from top to bottom. The silicone layer 134 not only plays a buffering role but also plays a bonding role, thereby realizing the connection between the protective member 13 and the display panel 12. Since there is no need to set an additional glue material after adopting silicone, that is, the above-mentioned glue layer and buffer layer can be realized by the silicone layer, which is conducive to simplifying the structure of the protective member 13 and reducing the thickness of the protective member 13, thereby helping to save space inside the electronic device 100, so as to realize a lightweight design of the electronic device 100. In addition, silicone has high stability, which is conducive to improving the reliability of the protective member 13 and extending the service life of the protective member 13.

[0177] like Fig.28 As shown, Fig.28A partial schematic diagram of a display module 10 in an embodiment of the present application is shown. The display module 10 may be a curved screen. Specifically, the cover plate 11 includes a straight area 111 and an arc area 112. The arc area 112 is located at the edge of the straight area 111 and is bent at a certain angle relative to the straight area 111 to form a curved surface. The display panel 12 may be a flexible display panel that can be deformed under the action of an external force to fit on the cover plate 11 having the arc area 112. The rigid metal sheet 133 is provided with a mating hole 133a or a mating groove ( Fig.28 ), which is beneficial to reduce the structural strength of this position, allowing it to undergo a certain amount of deformation, so that the protective member 13 can be well adapted to the cover plate 11 having the arc-shaped area 112, so as to improve the stability of the protective member 13 in the display module 10, so that the protective member 13 can play a reliable protective role on the display panel 12.

[0178] The above-mentioned matching hole 133 a or matching groove may be formed on the rigid metal sheet 133 by a stamping process, or the above-mentioned matching hole 133 a or matching groove may be formed by an etching process.

[0179] like Fig.29 As shown, Fig.29 A schematic diagram showing a display module 10 connected to the bottom wall 31 of the middle frame through a support member 80 in an embodiment of the present application is shown. Along the thickness direction Z of the electronic device 100, the support member 80 is arranged between the protective member 13 and the bottom wall 31 of the middle frame. One end of the support member 80 is connected to the protective member 13, and the other end is connected to the bottom wall 31 of the middle frame. Specifically, the above-mentioned support member 80 can abut against the rigid metal sheet 133 in the protective member 13. Due to the large rigidity and hardness of the rigid metal sheet 133, the possibility of deformation of the protective member 13 when abutting against the support member 80 is reduced, which is beneficial to improve the supporting effect of the support member 80. At the same time, it also reduces the possibility of marks appearing at the position where the protective member 13 abuts against the support member 80, thereby affecting the display effect of the display module 10.

[0180] The support member 80 supports the display module 10, which is not only conducive to improving the stability of the display module 10 during installation, but also conducive to improving the impact resistance of the display module 10, thereby improving the overall reliability of the display module 10, so as to reduce the possibility of damage to the display module 10 when the electronic device 100 collides or falls, thereby helping to extend the service life of the display module 10. On the other hand, when the protective member 13 abuts against the support member 80 during the placement of the display module 10 in the middle frame 30, it means that the display module 10 has reached the preset installation position. Therefore, the support member 80 plays a role in installing and positioning the display module 10, which is conducive to improving the assembly accuracy between the display module 10 and the middle frame 30.

[0181] In other embodiments, the support member may be located in a space enclosed by the back cover and the middle frame. In the thickness direction of the electronic device, one end of the support member may abut against the protective member, and the other end may abut against the back cover.

[0182] The number of the support member 80 can be one or more. Specifically, when the number of the support member 80 is one, the support member 80 can be arranged in the middle area of ​​the bottom wall 31 of the middle frame (such as Fig.29 ), so as to improve the supporting effect of the display module 10. When there are two supporting members 80 (not shown in the figure), the two supporting members 80 can be arranged at intervals along the width direction Y of the electronic device 100, or can be arranged at intervals along the length direction X of the electronic device 100. When there are multiple supporting members 80, the multiple supporting members 80 can be arranged at intervals along the circumference of the protective member 13.

[0183] like Fig.30 As shown, Fig.30 A schematic diagram showing another embodiment of the present application in which the display module 10 is connected to the bottom wall 31 of the middle frame through the support member 80. In some embodiments, the support member 80 is arranged along the circumference of the protective member 13, that is, the support member 80 has an annular structure. Such a design is conducive to increasing the contact area between the support member 80 and the protective member 13, so that the display module 10 is supported more evenly, thereby improving the support effect of the support member 80, and further improving the reliability of the display module 10.

[0184] Along the thickness direction Z of the electronic device 100, the thickness D of the support member 80 satisfies: 0.03mm≤D≤0.2mm. Specifically, the thickness D of the support member 80 can be 0.03mm, 0.04mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm or 0.2mm, and of course other values ​​within the above range are also possible. By limiting the size range of the support member 80, it is helpful to improve the accuracy of its positioning of the display module 10 in the thickness direction Z of the protective member 13, thereby helping to improve the assembly accuracy between the display module 10 and the middle frame 30. At the same time, it is also helpful to improve the supporting effect of the support member 80 on the display module 10.

[0185] like Fig.31 As shown, Fig.31A schematic diagram showing another embodiment of the present application in which the display module 10 is connected to the bottom wall 31 of the middle frame through a support member 80 is shown. The support member 80 includes a body portion 81. The body portion 81 plays a major supporting role. In some embodiments, the body portion 81 may be a single-layer structure. For example, the body portion 81 may be a PET (polyethylene terephthalate) layer, a TPU (thermoplastic polyurethanes) layer, an ABS (acrylonitrile butadiene styrene) layer, or a PMMA (polymethyl methacrylate) layer. Taking the PET layer as an example, the PET material has good mechanical properties, is easy to process and shape, and has good dimensional stability and chemical stability, which is conducive to improving the reliability of the support member 80 and extending the service life of the support member 80. In the embodiment of the present application, the main body 81 may also be made of other materials that can play a supporting role, as long as the use requirements of the electronic device 100 are met.

[0186] In other embodiments, the main body 81 may be a multi-layer composite structure. For example, the main body 81 may be a composite of a PET layer and a TPU layer, so that the support member 80 can reliably support the display module 10 and improve the reliability of the display module 10.

[0187] like Fig.31 As shown, the support member 80 may also include bonding portions 82 located on both sides of the main body 81. Along the thickness direction Z of the electronic device 100, one end of the main body 81 is bonded to the protective member 13 through the bonding portion 82, and the other end is bonded to the bottom wall 31 of the middle frame through the bonding portion 82. The support member 80 also plays a bonding role on the display module 10, which is beneficial to improve the stability of the connection between the display module 10 and the middle frame 30, that is, it improves the stability of the installation of the display module 10 to ensure that the display module 10 works normally and stably. In addition, during the glue injection process, when the display module 10 is placed in the middle frame 30, the display module 10 and the middle frame 30 can be pre-fixed by bonding the support member 80 to the display module 10.

[0188] Specifically, the support member 80 may be pre-set on the middle frame bottom wall 31 , and when the display module 10 reaches a preset installation position, the display module 10 abuts against the support member 80 , thereby being bonded to the middle frame bottom wall 31 through the support member 80 .

[0189] In other embodiments, the bonding portion of the support member may be bonded to the back cover.

[0190] like Fig.32 As shown, Fig.32 FIG. 1 is a schematic diagram of a bar phone provided in an embodiment of the present application. The electronic device 100 may be a bar phone. Fig.33 As shown, Fig.33 Shows Fig.32 Schematic diagram of the display panel 12 of the display module 10 of the mid-range mobile phone after the glue is injected. For the display module 10 used in the candy-bar mobile phone, the colloid 41 can be arranged along the circumference of the display panel 12, that is, the four peripheries of the display panel 12 are provided with the colloid 41, thereby increasing the effective area of ​​the colloid 41, so that the colloid 41 protects the periphery of the entire display panel 12, which is conducive to improving the reliability of the display panel 12.

[0191] In some other embodiments, the colloid 41 may also be disposed on both sides of the display panel 12, for example, the colloid 41 is disposed on both sides of the display panel 12 along the width direction Y of the electronic device 100, or the colloid 41 is disposed on both sides of the display panel 12 along the length direction X of the electronic device 100. Such a design is conducive to further saving the amount of the colloid 41 while protecting the display panel 12, thereby reducing the production cost of the electronic device 100.

[0192] like Fig.34 As shown, Fig.34 A schematic diagram of a foldable mobile phone in a folded state provided by an embodiment of the present application is shown. The above-mentioned electronic device 100 may be a foldable mobile phone. The foldable mobile phone has a first display module 10A. The first display module 10A may be the outer screen of the foldable mobile phone. When the mobile phone is in a folded state, the first display module 10A is located on the outside for the user to use. Specifically, the first display module 10A may be a screen without a folding function. Also refer to Fig.35 , Fig.35 Shows Fig.34 Schematic diagram of the display panel 10Aa of the first display module 10A of the foldable mobile phone after the glue is injected. For the first display module 10A, the colloid 41 can be arranged along the four sides of the first display panel 10Aa in the first display module 10A to protect the periphery of the first display panel 10Aa. Of course, according to the use requirements of the electronic device 100, the colloid 41 can also be arranged on both sides of the first display panel 10Aa along the width direction Y, or on both sides of the first display panel 10Aa along the length direction X.

[0193] like Fig.36 As shown, Fig.36The figure shows a schematic diagram of a foldable mobile phone in an unfolded state provided by an embodiment of the present application. The foldable mobile phone also has a second display module 10B, and the second display module 10B can be the inner screen of the foldable mobile phone. Specifically, the second display module 10B can be a screen with a foldable function. When the mobile phone is in the unfolded state, the second display module 10B is also in the unfolded state for the user to use. Also refer to Fig.37 , Fig.37 Shows Fig.36 Schematic diagram of the display panel 10Ba of the second display module 10B of the foldable mobile phone after the glue is injected. For the second display module 10B, the second display module 10B can rotate around the rotation axis 51. The glue 41 can be set on both sides of the second display panel 10Ba along the width direction Y and away from the rotation axis 51 to reduce the possibility of the glue 41 affecting the normal operation of the rotation axis 51, thereby facilitating the unfolding and folding of the mobile phone.

[0194] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An electronic device, characterized in that: include: A middle frame, wherein the middle frame has a middle frame side wall; A display module, the display module is accommodated in the middle frame; The display module includes a display panel and a cover plate and a protective member connected to both sides of the display panel; a colloid is connected between the display panel and the side wall of the middle frame, and the colloid is located between the cover plate, the protective member and the side wall of the middle frame.

2. The electronic device according to claim 1, characterized in that: The colloid surrounds the display panel along a circumference of the display panel.

3. The electronic device according to claim 1, characterized in that: The middle frame further comprises a middle frame bottom wall connected to the middle frame side wall; The display module is fixedly connected to the side wall of the middle frame, and / or the display module is fixedly connected to the bottom wall of the middle frame.

4. The electronic device according to claim 3, characterized in that: A first adhesive member is provided between the protective member and the middle frame side wall and is arranged along the circumference of the protective member. The first adhesive member is connected to the protective member and the middle frame side wall.

5. The electronic device according to claim 4, characterized in that: The side wall of the middle frame has a protrusion extending toward the inside of the middle frame; Along the thickness direction of the electronic device, the first adhesive component is arranged on a side of the raised portion facing the cover plate.

6. The electronic device according to any one of claims 1 to 5, characterized in that: There is a sealant between the cover plate and the side wall of the middle frame arranged along the circumference of the cover plate; The sealant is connected to the cover plate and the side wall of the middle frame, and the sealant blocks the gap between the cover plate and the side wall of the middle frame.

7. The electronic device according to any one of claims 1 to 6, characterized in that: The middle frame is provided with a glue injection hole and a glue outlet hole; The glue injection hole and the glue outlet hole are both communicated with the glue injection space located between the cover plate, the protective component and the side wall of the middle frame.

8. The electronic device according to claim 7, characterized in that: The glue injection hole and the glue outlet hole are arranged on the side wall of the middle frame.

9. The electronic device according to claim 7, characterized in that: The middle frame includes a middle frame bottom wall connected to the middle frame side wall; The glue injection hole and the glue outlet hole are provided on the bottom wall of the middle frame; The protective member is provided with a glue injection matching hole at a position corresponding to the glue injection hole, and the glue injection matching hole is connected to the glue injection hole; and; The protective member is provided with a glue outlet matching hole at a position corresponding to the glue outlet hole, and the glue outlet matching hole is communicated with the glue outlet hole.

10. The electronic device according to any one of claims 1 to 6, characterized in that: The electronic device comprises a support member; The middle frame further comprises a middle frame bottom wall connected to the middle frame side wall; Along the thickness direction of the electronic device, one end of the support member is connected to the protective member, and the other end of the support member is connected to the bottom wall of the middle frame.

11. An electronic device, characterized in that: include: case; a display module, the display module being accommodated in the housing; A support member, the support member is accommodated in the housing, and the support member is located at one side of the display module; Among them, the display module includes a display panel and a cover plate and a protective member connected to both sides of the display panel; along the thickness direction of the electronic device, one end of the support member is connected to the protective member, and the other end of the support member is connected to the bottom wall of the shell.

12. The electronic device according to claim 11, characterized in that: Along the thickness direction of the electronic device, the thickness D of the support member satisfies: 0.03 mm ≤ D ≤ 0.2 mm.

13. The electronic device according to claim 11, characterized in that: The support member includes a body portion; The material of the main body includes one or more of PET, TPU, ABS, and PMMA.

14. The electronic device according to claim 13, characterized in that: The support member also includes bonding portions located on both sides of the main body portion; One end of the main body is bonded to the protective member through the bonding portion, and the other end is bonded to the bottom wall of the shell through the bonding portion.

15. The electronic device according to any one of claims 1 to 14, characterized in that: The guard comprises a rigid sheet of metal.

16. The electronic device according to claim 15, characterized in that: The protective member further includes a buffer portion; Along the thickness direction of the electronic device, one end of the buffer portion is connected to the display panel; and the other end is connected to the rigid metal sheet.

17. The electronic device according to claim 15, characterized in that: The cover plate includes an arc-shaped area; The rigid metal sheet is provided with a matching hole or a matching groove at a position corresponding to the arc-shaped area.

18. A method for assembling an electronic device, characterized in that: The electronic device comprises a middle frame and a display module; the middle frame comprises a middle frame side wall; the display module comprises a display panel and a cover plate and a protective member located on both sides of the display panel; The electronic device assembly method comprises: A glue injection hole and a glue outlet hole are provided in the middle frame; Placing the display module in the middle frame, and pre-fixing the display module and the middle frame; The glue injection pump is connected to the glue injection hole, so that the glue enters the glue injection space located between the side wall of the middle frame, the cover plate and the protective member through the glue injection hole.

19. The method for assembling an electronic device according to claim 18, characterized in that: The glue injection holes and glue outlet holes are provided in the middle frame specifically including: The glue injection hole and the glue injection hole are opened on the side wall of the middle frame.

20. The method for assembling an electronic device according to claim 18, characterized in that: The middle frame further comprises a middle frame bottom wall connected to the middle frame side wall; The glue injection holes and glue outlet holes are provided in the middle frame specifically including: The glue injection hole and the glue outlet hole are provided on the bottom wall of the middle frame; A glue injection matching hole connected to the glue injection hole is provided in the protective member, and a glue outlet matching hole connected to the glue outlet hole is provided in the protective member.

21. The method for assembling an electronic device according to any one of claims 18 to 20, characterized in that: Pre-fixing the display module and the middle frame specifically includes: The protective member is bonded to the side wall of the middle frame by a first bonding member, and the first bonding member is an annular structure.

22. The method for assembling an electronic device according to any one of claims 18 to 20, characterized in that: After placing the display module in the middle frame and pre-fixing the display module and the middle frame, the method for assembling the electronic device further includes: A sealant is filled between the side wall of the cover plate and the side wall of the middle frame.

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