Image acquisition module and semiconductor cavity

Abstract

The invention provides an image acquisition device and a semiconductor cavity, and the device comprises a camera shooting assembly which is used for obtaining an image in the semiconductor cavity; an optical path is formed between the light source assembly and the camera shooting assembly, and the light source assembly is used for providing illumination for the interior of the semiconductor cavity through the optical path; the shading assembly is located at the camera shooting end of the camera shooting assembly and used for reducing the luminous flux emitted into the semiconductor cavity by the light source assembly in the optical path; the camera shooting assembly, the light source assembly and the shading assembly are all arranged in the supporting shell; one end of the connecting assembly is connected with the supporting shell, the other end of the connecting assembly is provided with an adjusting assembly, and the adjusting assembly is connected with the shading assembly. The adjusting assembly is arranged, and it is guaranteed that light cannot leak out between the shading assembly and the light transmitting assembly.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor cavities of semiconductor equipment, and in particular to an image acquisition module of a semiconductor cavity and a semiconductor cavity having the image acquisition module. Background Art

[0002] In the prior art, semiconductor cavities are usually provided with multiple observation windows for observing the internal conditions of the cavity. Through the observation windows, process personnel can observe the internal conditions of the cavity with naked eyes. However, by observing the internal conditions through the observation windows, process personnel cannot observe all the time, and there may be problems that abnormalities in the cavity cannot be known in time. In addition, although some prior art uses camera technology to obtain the conditions in the cavity, it is impossible to obtain clear internal images, and installation and maintenance are troublesome. Summary of the invention

[0003] The purpose of the present invention is to provide an image acquisition module and a semiconductor cavity having the image acquisition module, which solves the problem of timely and clear acquisition of the conditions in the cavity.

[0004] In order to achieve the above objectives, the present invention is implemented by the following technical solutions:

[0005] An image acquisition module is used for a semiconductor cavity, wherein the semiconductor cavity comprises a hole, and the image acquisition module is arranged in the hole; comprising:

[0006] A camera assembly, used for acquiring images inside the semiconductor cavity;

[0007] A light source assembly, forming an optical path between the light source assembly and the camera assembly, and used for providing light into the semiconductor cavity through the optical path;

[0008] A shading component, located at the camera end of the camera component, and used to reduce the light flux emitted from the light source component in the optical path to the semiconductor cavity;

[0009] A supporting shell, wherein the camera assembly, the light source assembly and the light shielding assembly are all arranged in the supporting shell;

[0010] A connecting component, one end of which is connected to the supporting shell, and the other end of which is provided with an adjusting component, and the adjusting component is connected to the shading component.

[0011] Optionally, the image acquisition module further includes a light-transmitting component, and the light-transmitting component is disposed between the camera component and the hole.

[0012] Optionally, the shading component includes a shading portion, which is in a plate shape and is configured to surround one end of the camera component close to the semiconductor cavity.

[0013] Optionally, the shading component further includes a connecting portion, which is used to be connected to the connecting component, one end of the connecting portion is connected to the connecting component, and the other end is connected to the shading portion.

[0014] Optionally, the shading portion is a flat plate, and a contact portion extending toward the light-transmitting component is provided at an edge of the shading portion; a lip is provided at one end of the connecting portion, the lip is parallel to an extending direction of the flat plate, and the lip is provided with a first threaded hole.

[0015] Optionally, the connecting component is cylindrical and is arranged around the camera component.

[0016] Optionally, the connecting component is in the shape of a square tube, and a connecting ear is provided at one end of the connecting component, the connecting ear is provided at the inner corner of the square tube, and a second threaded hole is provided on the connecting ear; a connecting lip is provided at the other end of the connecting component, the connecting lip is parallel to the extension direction of the lip, and a through hole is provided on the connecting lip.

[0017] Optionally, the adjustment assembly includes a bolt and a spring, the bolt is inserted into the through hole and cooperates with the first threaded hole, and the spring is arranged between the lip and the connecting lip.

[0018] Optionally, the shading component and the connecting component are made of aluminum.

[0019] Optionally, outer surfaces of the shading component and the connecting component are mirror-finished.

[0020] Optionally, the inner surfaces of the shading component and the connecting component are anodized.

[0021] Optionally, a rubber pad is provided on the light-transmitting component, and the rubber pad corresponds to the contact portion of the light-shielding portion.

[0022] Optionally, the light source assembly includes a light source and a reflective plate, the light source and the reflective plate are connected, the light source emits light in the opposite direction of the hole, and the reflective plate reflects the light to the hole to form part of the optical path.

[0023] Optionally, the light source is annular and is arranged around the camera assembly; the reflector is dome-shaped, and the light source is arranged on the dome-shaped edge of the reflector.

[0024] Optionally, the reflective plate is connected to the supporting shell.

[0025] Optionally, the supporting shell includes a cover body and a fixing portion, and the camera assembly and the connecting assembly are both connected to the cover body via the fixing portion.

[0026] Optionally, the image acquisition module further includes a light-transmitting component fixing portion, and the light-transmitting component is connected to the semiconductor cavity via the light-transmitting component fixing portion.

[0027] Optionally, the light-transmitting component fixing portion includes a first fixing portion and a second fixing portion, the first fixing portion is connected to the second fixing portion, the light-transmitting component is connected to the second fixing portion; and the cover body is connected to the first fixing portion.

[0028] Optionally, a gap is formed between the first fixing portion and the light-transmitting component.

[0029] The present invention also provides a semiconductor cavity, comprising:

[0030] a cavity wall, the cavity wall comprising an aperture;

[0031] An image acquisition module is disposed in the hole and is used to acquire the state inside the semiconductor cavity.

[0032] Compared with the prior art, the present invention has the following advantages:

[0033] (1) The present invention can reduce the light flux emitted from the light source component in the optical path to the semiconductor cavity by setting the light shielding portion, thereby ensuring that the image captured by the shooting component is clear.

[0034] (2) The adjustment component is used to adjust the contact tightness between the shading component and the light-transmitting component at various positions, while ensuring that the shading component and the light-transmitting component are always parallel and ensure close contact between the two, thereby ensuring that light cannot leak from between the shading component and the light-transmitting component. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings required for the description. Obviously, the drawings described below are an embodiment of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work:

[0036] Figure 1 A schematic diagram of the installation structure of the image acquisition module provided by the present invention;

[0037] Figure 2 is a cross-sectional view of the image acquisition module of the present invention;

[0038] Figure 3 An exploded diagram of the image acquisition module of the present invention;

[0039] Figure 4 is an enlarged view of the connecting component and the shading component of the present invention;

[0040] Figure 5 This is an actual effect picture taken by the image acquisition module of the present invention. DETAILED DESCRIPTION

[0041] The scheme proposed by the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the accompanying drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the implementation method of the present invention. In order to make the purposes, features and advantages of the present invention more obvious and easy to understand, please refer to the accompanying drawings. It should be noted that the structures, proportions, sizes, etc. illustrated in the accompanying drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no technical substantive significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope of the technical content disclosed by the present invention.

[0042] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of more restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the process, method, article or device including the elements. In addition, the term "connection" herein means that A and B are directly connected, or that A and B are indirectly connected, such as A and B are connected through C, or even through more components such as C and D, and A and B can be connected in one piece, or in separate pieces, or removable, or fixed. The term "optional" herein means that the technical feature can be combined or not combined with any feature in the text.

[0043] The image acquisition module can be applied to a semiconductor cavity, which includes an image acquisition module and a cavity wall. The cavity wall includes an upper cavity wall located at the top, a side cavity wall located at the side, and a lower cavity wall located at the bottom. A hole is provided on the cavity wall, and the hole is an image acquisition hole. The hole can be, for example, provided in at least one of the upper cavity wall, the side cavity wall, or the lower cavity wall. The image acquisition module is provided in the hole of the cavity wall. The image acquisition module can be provided on at least one of the upper cavity wall, the side cavity wall, and / or the lower cavity wall, so as to be able to obtain the state inside the cavity from a required perspective. Optionally, the semiconductor cavity is, for example, at least one of a vacuum load chamber (Load Lock), a wafer transfer chamber (TM), and a process chamber (PM), wherein the process chamber (PM) can be at least one of CVD, PVD, RTP, epitaxy (Epi), or etching (Etch).

[0044] Figure 1 FIG. 2 shows a schematic diagram of the installation structure of the image capture module 200 of the present invention. Figure 1 As shown, the image capture module 200 is installed on the cavity wall 100 of the semiconductor cavity. Figure 1 In the embodiment, the cavity wall 100 is the upper cavity wall.

[0045] Figure 2 shows a cross-sectional view of the image acquisition module 200 of the present invention, Figure 3 FIG. 2 shows an exploded view of the image acquisition module 200 of the present invention. Figure 2-3 As shown, the image acquisition module 200 includes a camera component 206, a light source component, a shading component 400, a support shell and a connecting component 300; the camera component 206 is used to obtain an image in the semiconductor cavity; an optical path S is formed between the light source component and the camera component 206, and the light source component is used to provide illumination to the semiconductor cavity through part of the optical path S; the shading component 400 is located at the camera end of the camera component 206, and is used to reduce the light flux emitted from the light source component in the optical path S to the semiconductor cavity; the camera component 206, the light source component and the shading component 400 are all arranged in the support shell; one end of the connecting component 300 is connected to the support shell, and the other end of the connecting component 300 is provided with an adjustment component, and the adjustment component is connected to the shading component 400.

[0046] The image captured by the camera component 206 may be in the form of a picture or a video, including but not limited to these.

[0047] Optionally, the image acquisition module 200 further includes a light-transmitting component 214, which is disposed between the camera component 206 and the hole. The light-transmitting component 214 may be quartz glass, which has excellent light transmittance and mechanical properties, which can further improve the clarity of the captured image on the one hand, and improve durability on the other hand; at the same time, the light-transmitting component 214 can achieve gas sealing of the semiconductor cavity and achieve the negative pressure required for process treatment; the material of the light-transmitting component 214 includes but is not limited to the above. The adjustment component is used to adjust the contact tightness between the shading component 400 and each position of the light-transmitting component 214, while ensuring that the shading component 400 and the light-transmitting component 314 are always parallel, ensuring a closed contact between the two, thereby ensuring that light cannot leak from between the shading component 400 and the light-transmitting component 214.

[0048] Optionally, a rubber pad 230 is provided on the light-transmitting component 214, and the rubber pad 230 is at least one of a square ring, a circular ring, or a polygonal ring, and its shape is adapted to the shape of the light-shielding component 400. The rubber pad 230 further ensures that light cannot leak from between the light-shielding component 400 and the light-transmitting component 214.

[0049] Figure 4 FIG. 4 shows an enlarged view of the shading assembly 400 and the connecting assembly 300 of the present invention. Figure 4 As shown, the shading component 400 includes a shading portion 402 and a connecting portion 406. The shading portion 402 is plate-shaped and is configured to surround one end of the camera component 206 close to the semiconductor cavity. The connecting portion 406 is used to connect with the connecting component, one end of the connecting portion 406 is connected to the connecting component, and the other end is connected to the shading portion 402.

[0050] Optionally, the shading portion 402 is a flat plate, and the edge of the shading portion 402 is provided with a contact portion 404 extending in the direction of the light-transmitting component 214; a lip portion 408 is provided at one end of the connecting portion 406, and the lip portion 408 is parallel to the extending direction of the flat plate, and the lip portion 408 is provided with a first threaded hole. Optionally, the connecting portion 406 is cylindrical, such as a cylinder, a square cylinder or a polygonal cylinder. Preferably, the connecting portion 406 is a square cylinder, the lip portion 408 is a square ring, and there are four first threaded holes, which are respectively provided at the four corners of the square ring of the lip portion 408. The advantage is that it is convenient to set the lip portion 408, which is convenient for installation, and the spacing between two adjacent first threaded holes can be ensured to be the same, so that the parallelism between the shading portion 402 of the shading component 400 and the light-transmitting component 214 is adjusted more uniformly. The light shielding portion 402 is designed to be in a flat plate shape, which can reduce the light that enters the camera component 206 through the light-transmitting component 214 and improve the clarity of the captured image.

[0051] Optionally, the edge profile of the contact portion 404 of the light shielding portion 402 may be at least one of a circle, a square, or a polygon. The edge profile may be designed according to actual needs, including but not limited to the above. Figure 2-4 The square contact portion 404 is only shown as an example. Since the rubber pad 230 is adapted to the contact portion 404 of the light shielding component 400 in shape, the rubber pad 230 can be at least one of a circular ring, a square ring, or a polygonal ring.

[0052] Optionally, the connecting component 300 is cylindrical and is disposed around the camera assembly 206. For example, the connecting component 300 is at least one of a circular cylinder, a square cylinder or a polygonal cylinder, and its shape is consistent with the connecting portion 406. Preferably, the connecting component 300 is a square cylinder.

[0053] Taking a square tube as an example, the connection assembly includes a cylinder 302, one end of which is provided with a connection ear 320, and the number of the connection ears 320 is four, which are respectively provided at the inner corners of the square tube, and the second threaded hole is provided on the connection ear 320; the other end of the connection assembly 300 is provided with a connection lip 304, which is a square ring, and the connection lip 304 is parallel to the extension direction of the lip 408, and the connection lip 304 is provided with a through hole, and the number of the through holes is four, and the through holes are provided at the four corners of the square ring, corresponding to the position of the first threaded hole, that is, the through holes of the connection lip 304 are provided in a one-to-one correspondence with the first threaded holes of the lip 408, and the number of the through holes and the first threaded holes is four, which are respectively located at the four corners of the connection lip 304 and the lip 408. The connection ear 320 is provided on the inner side of one end of the cylinder 302, which saves space and is easy to install.

[0054] Optionally, the adjustment assembly includes a bolt 314 and a spring 316 . The bolt 314 is inserted into the through hole and cooperates with the first threaded hole. The spring 316 is disposed between the lip 408 and the connecting lip 304 .

[0055] Optionally, the shading component 400 and the connecting component 300 are made of aluminum.

[0056] Optionally, the outer surfaces of the shading component 400 and the connecting component 300 are mirror-finished to increase the reflection of light, so that the light entering the semiconductor cavity is more dispersed and it is less likely to have overexposed concentrated bright light, resulting in white light in some areas when the image is acquired. At the same time, it can also increase the amount of light entering the semiconductor cavity to a certain extent.

[0057] Optionally, the inner surfaces of the shading component 400 and the connecting component 300 are anodized to enhance the absorption of light reflected from the semiconductor cavity through the light-transmitting component 214 into the camera component 206 , thereby reducing the effect of light reflection on the camera component 206 .

[0058] The rubber pad 230 corresponds to the contact portion 404 of the shading portion 402, which can effectively prevent the shading component 400 from scratching or breaking the light-transmitting component 214. It can also play a sealing role, further preventing unwanted light leakage from affecting the camera component 206, thereby causing overexposure at the edge of the picture taken by the camera component 206.

[0059] Optionally, the light source assembly includes a light source 210 and a reflective plate 212, the light source and the reflective plate are connected, the light source emits light in the opposite direction of the hole, and the reflective plate reflects the light to the hole, forming part of the optical path.

[0060] Optionally, the light source 210 is annular and is disposed around the camera assembly to surround the camera assembly; the reflector plate is dome-shaped, and the light source is disposed on the dome-shaped edge of the reflector plate.

[0061] Optionally, the reflective plate 212 is connected to the supporting shell 204 .

[0062] See the attached Figure 2-3 ,like Figure 2-3 As shown, the light source 210 is connected to the reflective plate 212, the light source 210 emits light in the opposite direction of the hole of the cavity wall, and the reflective plate 212 reflects the light to the optical path S formed by the hole; the light source 210 can be annular and arranged around the camera assembly 206; the reflective plate 212 is dome-shaped, the dome includes a first part and a second part connected, the first part and the second part are connected, the cross section of the first part is arc-shaped, and the cross section of the second part is horizontally arranged, the light source 210 is arranged at one end of the first part of the reflective plate 212 away from the second part, and is arranged toward the reflective surface of the reflective plate 212, the middle of the second part of the reflective plate 212 is provided with a first opening, and the camera assembly 206 and the connecting assembly 300 pass through the first opening. Optionally, the light source 210 can be an LED lamp.

[0063] The complete optical path S includes a first path in which the light source 210 emits light in the opposite direction of the hole to the reflective plate 212, a second path in which the light is reflected by the reflective plate 212 and irradiated into the semiconductor cavity, and a third path in which the light is reflected by the semiconductor cavity and irradiated into the camera component 206.

[0064] The image acquisition module 200 further includes a light-transmitting component fixing portion 216, and the light-transmitting component 214 is connected to the cavity wall through the light-transmitting component fixing portion 216. The light-transmitting component fixing portion 216 includes a first fixing portion 224 and a second fixing portion 226, and the first fixing portion 224 and the second fixing portion 226 are connected, and the light-transmitting component 214 is connected to the second fixing portion 226. The first fixing portion 224 and the second fixing portion 226 may both be annular, the first fixing portion 224 is formed as an outer ring, the second fixing portion 226 is formed as an inner ring, and the light-transmitting component fixing portion 216 is formed as a ring including the inner ring and the outer ring, and the cross-sections of the inner ring and the outer ring are formed as a "Z" shape as a whole. Specifically, the inner side of the lower surface and the outer side of the upper surface of the ring are both formed as an "L" shape. The upper surface of the light-transmitting component 214 is connected to the lower surface of the second fixing part 226, and a gap 228 is formed between the outer edge of the light-transmitting component 214 and the first fixing part 224 on the side facing the first fixing part 224, and the gap 228 cooperates with the hole; optionally, the lower surface of the light-transmitting component 214 away from the camera component 206 is arranged flush with the lower surface of the first fixing part 224, the light-transmitting component 214 is circular, and a sealing ring (O-ring) is arranged between the light-transmitting component 214 and the second fixing part 226 to achieve gas sealing.

[0065] The supporting shell includes a cover body 204 and a fixing member 218 . The light source assembly, the camera assembly 206 , the connecting assembly 300 , and the light shielding assembly 400 are all disposed in the supporting shell. The cover body 204 may be barrel-shaped, such as a round barrel, a square barrel or a polygonal barrel, including but not limited to these; the cover body 204 may include a first connection part, a second connection part and a third connection part, the first connection part is arranged on the annular lug of the barrel edge of the barrel of the cover body 204, the second connection part is arranged between the first connection part and the third connection part, the second connection part is a cylindrical barrel wall, and the third connection part is a barrel top; the first connection part is connected to the upper surface of the first fixing part 224 of the light-transmitting component fixing part 216, specifically, it can be connected to the "L" shape outside the upper surface of the light-transmitting component fixing part 216, the second connection part is connected to the first connection part in an "L" shape in cross section, the third connection part is connected to the second connection part and forms the top of the cover body 204, the third connection part of the cover body 204 is provided with a second opening, the second opening is arranged corresponding to the first opening, the camera assembly 206 and the connecting assembly 300 are connected to the supporting shell through the second opening. The second part of the reflective plate 212 is fixed to the inner surface of the edge of the second opening of the third connecting part of the cover body 204. The camera assembly 206 and the connecting assembly 300 are respectively connected to the fixing member 218 through the first opening and the second opening. The fixing member 218 is arranged on the outer surface of the cover body 204 corresponding to the second opening, and the fixing member 218 is connected to the cover body 204.

[0066] The light-transmitting component fixing portion 216 detachably connects the light-transmitting component 214 to the semiconductor cavity by means of, for example, screws; at the same time, the supporting shell detachably fixes the camera component 206, the light source component, the shading component 400 and the connecting component 300 to the upper surface of the first fixing portion 224 of the light-transmitting component fixing portion 216, so as to facilitate inspection and maintenance, and also facilitate adjustment of the adjustment component. For example, when inspecting or maintaining the camera component, or when installing the camera component and needing to adjust the adjustment component, it is only necessary to remove the bolts connecting the supporting shell and the upper surface of the first fixing portion 224 of the light-transmitting component fixing portion 216.

[0067] Optionally, the second portion of the reflector 212 and the third connection portion of the cover 204 can be detachably connected by bolts. The fixing member 218 and the cover 204 are connected by bolts. The camera assembly 206, the connection assembly 300 and the fixing member 218 are connected by bolts.

[0068] Specifically, the connecting assembly 300 is connected to the fixing member 218 through the second threaded hole on the connecting ear 320, and the camera assembly 206 is connected to the fixing member 218 through a bolt. With such a design, when it is necessary to replace any one of the camera assembly 206, the connecting assembly 300, and the light shielding assembly 400, the fixing plate 218 can be separated from the cover body 204 first, and then the fixing plate 218 can be pulled upward, and the camera assembly 206, the connecting assembly 300, and the light shielding assembly 400 can be taken out from the second outlet of the cover body 204, so that the camera assembly 206, the connecting assembly 300, and the light shielding assembly 400 can be quickly replaced.

[0069] Figure 5 The actual effect diagram taken by the image acquisition module 200 of the present invention is shown. Figure 5 As shown, the semiconductor cavity is a wafer transfer cavity (TM), and the image acquisition module 200 is arranged on the hole of the upper cavity wall of the cavity wall. The picture taken by the image acquisition module 200 of the present invention presents a very clear picture, and the staff can understand the situation in the semiconductor cavity in a timely and accurate manner.

[0070] In summary, the present invention can reduce the light flux emitted from the light source component in the optical path to the semiconductor cavity by setting the light shielding part, thereby ensuring that the shooting component shoots a clear picture. The adjustment component is used to adjust the contact tightness between the light shielding component and the light transmitting component at each position, and at the same time ensure that the light shielding component and the light transmitting component are always parallel to ensure a closed contact between the two, thereby ensuring that light cannot leak from between the light shielding component and the light transmitting component.

[0071] Although the content of the present invention has been described in detail through the above content, it should be recognized that the above description should not be considered as a limitation of the present invention. After reading the above content, various modifications and substitutions of the present invention will be obvious to those skilled in the art. Therefore, the protection scope of the present invention should be limited by the attached patent application scope. The above is only an example of a preferred embodiment of the present invention, and is not intended to limit the scope of implementation. All simple replacements and equivalent changes made according to the patent application scope of this creation and the content of the patent specification belong to the scope of the patent application of this creation.

Claims

1. An image acquisition module, used in a semiconductor cavity, wherein the semiconductor cavity comprises a hole, and the image acquisition module is arranged in the hole; characterized in that: include: A camera assembly, used for acquiring images inside the semiconductor cavity; A light source assembly, forming an optical path between the light source assembly and the camera assembly, and used for providing light into the semiconductor cavity through the optical path; A shading component, located at the camera end of the camera component, and used to reduce the light flux emitted from the light source component in the optical path to the semiconductor cavity; A supporting shell, wherein the camera assembly, the light source assembly and the light shielding assembly are all arranged in the supporting shell; A connecting component, one end of which is connected to the supporting shell, and the other end of which is provided with an adjusting component, and the adjusting component is connected to the shading component.

2. The image acquisition module according to claim 1, characterized in that: Also includes: A light-transmitting component is arranged between the camera component and the hole.

3. The image acquisition module according to claim 2, characterized in that: The shading component includes a shading portion, which is in a plate shape and is configured to surround one end of the camera component close to the semiconductor cavity.

4. The image acquisition module according to claim 3, characterized in that: The shading component also includes a connecting portion, which is used to be connected to the connecting component, one end of the connecting portion is connected to the connecting component, and the other end is connected to the shading portion.

5. The image acquisition module according to claim 4, characterized in that: The shading portion is a flat plate, and a contact portion extending toward the light-transmitting component is disposed at an edge of the shading portion; a lip portion is disposed at one end of the connecting portion, the lip portion is parallel to an extending direction of the flat plate, and the lip portion is disposed with a first threaded hole.

6. The image acquisition module according to claim 5, characterized in that: The connecting component is cylindrical and is arranged around the camera component.

7. The image acquisition module according to claim 6, characterized in that: The connecting component is in the shape of a square tube, and a connecting ear is arranged at one end of the connecting component, and the connecting ear is arranged at the inner corner of the square tube, and a second threaded hole is opened on the connecting ear; a connecting lip is arranged at the other end of the connecting component, and the connecting lip is parallel to the extension direction of the lip, and a through hole is opened on the connecting lip.

8. The image acquisition module according to claim 7, characterized in that: The adjustment assembly includes a bolt and a spring. The bolt is inserted from the through hole and matched with the first threaded hole. The spring is arranged between the lip and the connecting lip.

9. The image acquisition module according to claim 1, characterized in that: The shading component and the connecting component are made of aluminum.

10. The image acquisition module according to claim 9, characterized in that: The outer surfaces of the shading component and the connecting component are mirror-finished.

11. The image acquisition module according to claim 10, characterized in that: The inner surfaces of the shading component and the connecting component are anodized.

12. The image acquisition module according to claim 5, characterized in that: A rubber pad is arranged on the light-transmitting component, and the rubber pad corresponds to the contact portion of the light-shielding portion.

13. The image acquisition module according to claim 1, characterized in that: The light source assembly includes a light source and a reflective plate, wherein the light source and the reflective plate are connected, the light source emits light in the opposite direction of the hole, and the reflective plate reflects the light to the hole to form part of the optical path.

14. The image acquisition module according to claim 13, characterized in that: The light source is annular and arranged around the camera assembly; the reflector is dome-shaped, and the light source is arranged on the dome-shaped edge of the reflector.

15. The image acquisition module according to claim 14, characterized in that: The reflective plate is connected to the supporting shell.

16. The image acquisition module according to claim 15, characterized in that: The supporting shell includes a cover body and a fixing portion, and the camera assembly and the connecting assembly are both connected to the cover body through the fixing portion.

17. The image acquisition module according to claim 16, wherein: The image acquisition module further includes a light-transmitting component fixing portion, and the light-transmitting component is connected to the semiconductor cavity via the light-transmitting component fixing portion.

18. The image acquisition module according to claim 17, characterized in that: The light-transmitting component fixing part includes a first fixing part and a second fixing part, the first fixing part is connected to the second fixing part, the light-transmitting component is connected to the second fixing part; the cover body is connected to the first fixing part.

19. The image acquisition module according to claim 18, characterized in that: A gap is formed between the first fixing portion and the light-transmitting component.

20. A semiconductor cavity, characterized in that: include: a cavity wall, the cavity wall comprising an aperture; The image acquisition module as described in any one of claims 1-19, wherein the image acquisition module is arranged in the hole to acquire the state inside the semiconductor cavity.

Images