A bonding wire cleaning device and process thereof

Abstract

The invention relates to the technical field of gold bonding wire processing, and discloses a gold bonding wire cleaning device and a process thereof. The gold bonding wire cleaning device comprises a shell and a gold bonding wire, wherein a conveying mechanism is arranged on the shell for conveying the gold bonding wire; a testing mechanism is arranged on the shell for performing a smoothness test on the surface of the gold bonding wire, the testing mechanism comprises a first mounting seat arranged on the shell, a plurality of rotating plates are arranged circumferentially in the first mounting seat, and a complete circular ring fitting with the surface of the gold bonding wire is formed by the plurality of rotating plates; two infusion mechanisms are arranged on the shell in sequence along the conveying direction of the gold bonding wire, respectively for pickling and washing the gold bonding wire; the gold bonding wire cleaning device and the process thereof perform a smoothness test during the conveying process of the gold bonding wire, and only trigger the pickling, washing and grinding processes when a protrusion and unevenness are measured somewhere on the surface, thereby achieving precise cleaning.

Description

Technical Field

[0001] The invention relates to the technical field of gold bonding wire processing, in particular to a gold bonding wire cleaning device and a process thereof. Background Art

[0002] Gold bonding wire is a gold wire that is burned into a small ball at the end of the gold wire with a flame and then ball-bonded to the chip electrode. It is also called ball-bonded gold wire. As the electrical connection lead between the chip and the external circuit, bonding wire is an essential basic raw material in the traditional packaging process of semiconductor integrated circuits, discrete devices, sensors, optoelectronics, etc., and is used in almost all semiconductor parts in the world.

[0003] The forming quality of the bonding wire directly affects the bonding quality. In addition to the purity and mechanical properties of the bonding wire itself, the surface purity and smoothness are equally important. If there is rust or uneven bumps on the surface, the quality of the welded ball will be poor. Therefore, during the processing of the bonding wire, it is necessary to use acid to clean it to remove surface oxide scale, rust and bumps.

[0004] Existing bonding gold wire cleaning devices usually perform overall pickling on the bonding gold wire during transportation. This cleaning method has the following defects: first, overall pickling consumes a lot of resources and takes a long time; second, the bonding gold wire is expensive, and the manufacturing process itself has fewer surface rust protrusions. Overall pickling on the already smooth part may increase the damage rate of the bonding gold wire. Summary of the invention

[0005] The present invention provides a bonding gold wire cleaning device and a process thereof, which are capable of performing a smoothness test during the conveying process of the bonding gold wire, and triggering the pickling, water washing and grinding processes only when uneven protrusions are measured somewhere on the surface, thereby achieving the beneficial effect of precise cleaning. This solves the problem that the prior art mentioned in the above background technology usually pickles the bonding gold wire as a whole during the conveying process. This cleaning method, firstly, consumes a lot of resources and takes a long time for the overall pickling. Secondly, the bonding gold wire is expensive, and the manufacturing process itself has fewer surface rust protrusions. Overall pickling on the already smooth part may increase the damage rate of the bonding gold wire.

[0006] The present invention provides the following technical solution: a bonding gold wire cleaning device, comprising a housing and a bonding gold wire, wherein a conveying mechanism is provided on the housing for conveying the bonding gold wire;

[0007] The shell is provided with a testing mechanism for testing the smoothness of the surface of the bonding gold wire, and the testing mechanism includes a first mounting seat provided on the shell, and a plurality of rotating plates are provided in the first mounting seat for circumferential rotation, and a complete circular ring that fits the surface of the bonding gold wire is formed by the plurality of rotating plates;

[0008] Two infusion mechanisms are sequentially arranged on the housing along the conveying direction of the bonding gold wire, respectively used for pickling and washing the bonding gold wire, the infusion mechanism comprises a liquid storage tank arranged on the housing, the liquid storage tank is provided with a connecting pipe, the connecting pipe is provided with a plurality of nozzles corresponding to a plurality of rotating plates, and a valve assembly is arranged in each of the plurality of nozzles for controlling the opening and closing thereof;

[0009] The shell is also provided with a trigger mechanism, which includes a plurality of first time-delay trigger components, and the plurality of rotating plates are respectively driven by a plurality of first time-delay trigger components and a plurality of valve components close to the starting direction of the bonding gold wire delivery.

[0010] As an optional solution of the bonding gold wire cleaning device of the present invention, the conveying mechanism includes two winding rollers rotatably arranged on the housing, the bonding gold wire is wound on the two winding rollers, and the winding directions of the bonding gold wire on the two winding rollers are opposite, and two first motors are arranged on the housing, and the output shafts of the two first motors are respectively connected to the two winding rollers;

[0011] The testing mechanism further comprises a plurality of first springs, one end of each of the plurality of first springs is connected to the first mounting seat, and the other ends of each of the plurality of first springs are respectively connected to a plurality of rotating plates;

[0012] The trigger mechanism also includes a plurality of second time-delay trigger components, and a plurality of valve components close to the starting direction of the bonding gold wire conveying are respectively transmitted to a plurality of valve components close to the ending direction of the bonding gold wire conveying through the plurality of second time-delay trigger components.

[0013] As an optional solution of the bonding wire cleaning device described in the present invention, the valve assembly includes a valve core slidably arranged in the nozzle, a second spring is arranged on the valve core, and two ends of the second spring are respectively connected to the nozzle and the valve core.

[0014] As an optional solution of the bonding wire cleaning device described in the present invention, wherein: a first connecting rod and a second connecting rod are respectively arranged on both sides of the valve core, and the first connecting rod close to the starting direction of the bonding wire conveying is transmitted to the rotating plate through a first delay trigger component;

[0015] The second connecting rod close to the starting direction of the bonding gold wire conveying is transmitted to the first connecting rod close to the ending direction of the bonding gold wire conveying through the second delay trigger component.

[0016] As an optional solution of the bonding wire cleaning device of the present invention, wherein: the first time delay trigger component includes a third connecting rod arranged on the rotating plate, a rotating shaft is rotatably arranged on the housing, and a fifth connecting rod is arranged on the rotating shaft;

[0017] One end of the fifth connecting rod is hinged to the first connecting rod close to the starting direction of the bonding gold wire conveying, and the other end of the fifth connecting rod is provided with a sliding groove;

[0018] The first delay trigger assembly further includes a fourth connecting rod, one end of which is slidably disposed in the slide groove, and the other end of which is hinged to the third connecting rod;

[0019] The structure of the second delay trigger component is the same as that of the first delay trigger component.

[0020] As an optional solution of the bonding wire cleaning device described in the present invention, wherein: the shell is also provided with a plurality of grinding mechanisms corresponding to the plurality of rotating plates respectively, the grinding mechanism comprises a second mounting seat provided on the shell, a slide seat is slidably provided on the second mounting seat, a grinding wheel is rotatably provided on the slide seat, and a rotating assembly is provided on the second mounting seat for driving the grinding wheel to rotate;

[0021] The trigger mechanism further comprises a plurality of third time-delay trigger assemblies, and the plurality of slides are respectively driven by the plurality of third time-delay trigger assemblies and a plurality of second connecting rods close to the delivery end point of the bonding gold wire;

[0022] The structure of the third delay trigger component is the same as that of the first delay trigger component.

[0023] As an optional solution of the bonding wire cleaning device of the present invention, the rotating assembly includes two support plates respectively arranged on the second mounting seat and the sliding seat, a first rotating rod and a second rotating rod are respectively rotatably arranged on the two support plates, and the first rotating rod is slidably arranged on the second rotating rod;

[0024] The first rotating rod and the grinding wheel are both provided with first bevel gears, and the two first bevel gears are meshed;

[0025] A third rotating rod is rotatably arranged on the second mounting seat, and second bevel gears are arranged on both the second rotating rod and the third rotating rod, and the two second bevel gears are meshed.

[0026] As an optional solution of the bonding wire cleaning device of the present invention, wherein: the housing is further provided with two driving mechanisms for driving a plurality of third rotating rods to rotate;

[0027] The driving mechanism includes a second motor arranged on one of the second mounting seats, and the output shaft of the second motor is connected to one of the third rotating rods, wherein two of the third rotating rods are provided with spur gears, and the two spur gears are provided with toothed belts.

[0028] As an optional solution of the bonding gold wire cleaning device described in the present invention, a wiping ring is further provided on the shell, and the bonding gold wire passes through the middle of the wiping ring.

[0029] The present invention also provides the following technical solution: a cleaning process of a bonding wire cleaning device, comprising the following steps:

[0030] S1, conveying: two first motors are synchronously operated to drive two winding rollers to rotate, thereby conveying the bonding gold wire from one side of the housing to the other side;

[0031] S2, smoothness test: at the same time as step S1, when the bonding gold wire passes through several rotating plates, if there is rust or protrusion at least one place on the surface of the bonding gold wire, it touches the corresponding rotating plate and drives one or several rotating plates to turn over;

[0032] S3, pickling: in step S2, when one or more rotating plates are turned over, one or more first delay trigger components are used to delay transmission to drive one or more valve components in the infusion mechanism storing acid to open and accurately pickle the rust protrusions on the surface of the bonding gold wire;

[0033] S4, water washing: after step S3, one or more second delay trigger components are used to delay transmission to drive one or more valve components in the infusion mechanism storing water to open and accurately wash the pickled part of the bonding wire surface;

[0034] S5, grinding: after step S4, one or more third delay trigger components are used to delay transmission to drive one or more grinding wheels corresponding to the washed surface of the bonding gold wire to move close to the bonding gold wire and rotate and grind under the drive of two second motors in the two driving mechanisms;

[0035] S6, cleaning completed: After step S5, the bonding gold wire finally passes through a wiping ring to remove surface moisture and residual substances and maintain smooth transportation.

[0036] The present invention has the following beneficial effects:

[0037] 1. The bonding gold wire cleaning device and its process are different from the traditional overall pickling process. The device first performs a surface smoothness test on the bonding gold wire during the conveying mechanism of the bonding gold wire. Only when there is at least one uneven protrusion on its surface will it correspondingly contact one or more rotating plates to drive its deflection. Then, the first delay trigger component and the second delay trigger component are used to perform delayed transmission in sequence, and the corresponding valve components are triggered in turn. The uneven protrusions on the surface of the bonding gold wire are first pickled accurately to corrode and dissolve to remove rust and uneven protrusions, and then washed with water to remove residues. Thereby, local cleaning of the protrusions on the surface of the bonding gold wire is achieved instead of overall cleaning, which not only improves the cleaning efficiency and saves resource consumption, but also avoids the erosion and damage that may be caused to the smooth surface of the bonding gold wire by the acid during overall cleaning.

[0038] 2. The bonding wire cleaning device and process thereof, in addition to the cleaning process of pickling and water washing, is also provided with the same number of grinding mechanisms, and the grinding mechanisms are also controlled and triggered by the third delay trigger component with the same structure as the first delay trigger component and the second delay trigger component. When triggered, the grinding wheel at the corresponding position moves toward the surface of the bonding wire, and after contact, the grinding wheel rotates in the opposite direction of the bonding wire to grind, further removing possible residual bumps and unevenness.

[0039] 3. The bonding wire cleaning device and its process are based on the precise pickling, water washing and grinding operations of the bonding wire surface smoothness test, in addition to being triggered by the presence of uneven bulges somewhere on the bonding wire surface. When there are multiple uneven bulges around a certain place on the bonding wire surface, multiple groups of valve components are also independently triggered, and acid and water can be sprayed at the same time for cleaning and grinding. It can also adapt to the different lengths of the bulges on the bonding wire surface. When the unevenness of the bonding wire surface is longer, the time for the rotating plate to be lifted up by the impact is also prolonged, and the corresponding acid spraying and grinding process time is also prolonged. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0041] Figure 2 It is a first overall cross-sectional structural schematic diagram of the present invention.

[0042] Figure 3 For the present invention Figure 2 A partial enlarged view of point A in the middle.

[0043] Figure 4 It is a second overall cross-sectional structural schematic diagram of the present invention.

[0044] Figure 5 For the present invention Figure 4 A partial enlarged view of point B in the middle.

[0045] Figure 6 It is a schematic diagram of the partial structure of the conveying mechanism in the present invention.

[0046] Figure 7 It is a schematic diagram of the partial structure of the infusion mechanism in the present invention.

[0047] Figure 8 It is a schematic diagram of the partial explosion structure of the trigger mechanism in the present invention.

[0048] Fig. 9 It is a schematic diagram of the partial explosion structure of the grinding mechanism in the present invention.

[0049] Fig.10 For the present invention Fig. 9 A partial enlarged view of point C in the middle.

[0050] In the figure: 100, housing; 200, bonding wire; 300, conveying mechanism; 310, winding roller; 320, first motor; 400, testing mechanism; 410, first mounting seat; 420, rotating plate; 430, first spring; 500, infusion mechanism; 510, liquid storage tank; 520, connecting pipe; 530, nozzle; 540, valve assembly; 541, valve core; 542, second spring; 543, first connecting rod; 544, second connecting rod; 545, sealing groove; 546, sealing plate; 600, trigger mechanism; 610, first delay trigger assembly; 611, third connecting rod; Connecting rod; 612, fourth connecting rod; 613, rotating shaft; 614, fifth connecting rod; 615, sliding groove; 620, second delay trigger assembly; 630, third delay trigger assembly; 700, grinding mechanism; 710, second mounting seat; 720, sliding seat; 730, grinding wheel; 740, rotating assembly; 741, supporting plate; 742, first rotating rod; 743, second rotating rod; 744, first bevel gear; 745, third rotating rod; 746, second bevel gear; 800, driving mechanism; 810, second motor; 820, spur gear; 830, toothed belt; 900, wiping ring. DETAILED DESCRIPTION

[0051] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0052] Example 1

[0053] The cleaning device of the conventional bonding gold wire 200 is an overall pickling device. To improve the process, only the rusted and uneven parts of the bonding gold wire 200 are pickled. Embodiment 1 is proposed.

[0054] See also Figure 1-Figure 8 , a bonding gold wire cleaning device, comprising a housing 100 and a bonding gold wire 200, wherein the housing 100 is provided with a conveying mechanism 300 for conveying the bonding gold wire 200;

[0055] The housing 100 is provided with a testing mechanism 400 for testing the smoothness of the surface of the bonding gold wire 200. The testing mechanism 400 includes a first mounting seat 410 disposed on the housing 100. A plurality of rotating plates 420 are rotatably disposed in the first mounting seat 410. The plurality of rotating plates 420 form a complete circular ring that fits the surface of the bonding gold wire 200.

[0056] Two infusion mechanisms 500 are sequentially arranged on the housing 100 along the conveying direction of the bonding gold wire 200, respectively used for pickling and washing the bonding gold wire 200, and the infusion mechanism 500 includes a liquid storage tank 510 arranged on the housing 100, and a connecting pipe 520 is arranged on the liquid storage tank 510, and a plurality of nozzles 530 are arranged on the connecting pipe 520, respectively corresponding to the plurality of rotating plates 420, and a valve assembly 540 is arranged in each of the plurality of nozzles 530 for controlling the opening and closing thereof;

[0057] The housing 100 is also provided with a trigger mechanism 600, which includes a plurality of first time-delay trigger assemblies 610, and a plurality of rotating plates 420 are respectively driven by a plurality of first time-delay trigger assemblies 610 and a plurality of valve assemblies 540 close to the starting direction of the bonding gold wire 200.

[0058] The conveying mechanism 300 includes two winding rollers 310 rotatably disposed on the housing 100, the bonding gold wire 200 is wound on the two winding rollers 310, and the winding directions of the bonding gold wire 200 on the two winding rollers 310 are opposite, and two first motors 320 are disposed on the housing 100, and the output shafts of the two first motors 320 are respectively connected to the two winding rollers 310;

[0059] The testing mechanism 400 further includes a plurality of first springs 430, one end of each of the plurality of first springs 430 is connected to the first mounting seat 410, and the other end of each of the plurality of first springs 430 is connected to the plurality of rotating plates 420 respectively;

[0060] The trigger mechanism 600 further includes a plurality of second time-delay trigger assemblies 620, and a plurality of valve assemblies 540 close to the starting direction of the bonding gold wire 200 conveying are respectively driven by the plurality of second time-delay trigger assemblies 620 and a plurality of valve assemblies 540 close to the end direction of the bonding gold wire 200 conveying;

[0061] A wiping ring 900 is also provided on the housing 100 , and the bonding gold wire 200 passes through the middle of the wiping ring 900 .

[0062] In this embodiment, winding rollers 310 are rotatably mounted on the left and right sides of the housing 100 as the head and tail ends, and the bonding gold wire 200 is wound on the two winding rollers 310 in different spiral directions. The two first motors 320 mounted on the housing 100 are synchronously operated to drive the two winding rollers 310 fixed to their output shafts to rotate, so that the bonding gold wire 200 can be transported from right to left.

[0063] A first mounting seat 410 is fixed on the shell 100 near the right side, and four rotating plates 420 are rotatably mounted on the inner wall of the first mounting seat 410. The four rotating plates 420 form a complete circular ring that fits on the surface of the bonding wire 200, and the four rotating plates 420 are elastically connected to the first mounting seat 410 through four first springs 430 respectively.

[0064] The two liquid storage tanks 510 installed from right to left on the housing 100 store acid and water respectively, and the connecting pipe 520 is a multi-pass pipe, one end of which is connected to the liquid storage tank 510, and the other four ports are respectively equipped with four nozzles 530 corresponding to the four rotating plates 420. The four nozzles 530 are respectively controlled to open and close by four valve assemblies 540.

[0065] During the transportation of the bonding gold wire 200, if there is a protrusion somewhere on the surface, it will push one of the rotating plates 420 to deflect. Then, a first delay trigger component 610 connected thereto drives the corresponding valve component 540 to open, and the delay triggering is performed, so that when the protrusion on the surface of the bonding gold wire 200 is transported to the infusion mechanism 500 located on the right side, the spray head 530 opens to spray acid for pickling.

[0066] After pickling, the valve assembly 540 controlling the spraying of acid liquid is reset, and the corresponding nozzle 530 is closed again. The spraying process is transmitted through the second delay trigger assembly 620, so that the corresponding nozzle 530 located on the left sprays water. After pickling, water washing is performed to remove the residual rust after being dissolved and corroded by the acid.

[0067] Finally, when the entire bonding gold wire 200 passes through the fixedly installed wiping ring 900, the surface residues and moisture are wiped off to complete the cleaning.

[0068] It should be supplemented that, in the present device, the number of rotating plates 420, nozzles 530, and valve assemblies 540 is set to four, and the test accuracy of covering the surface of the bonding gold wire 200 is one-fourth of the corresponding test. The test accuracy can be improved by adding more rotating plates 420, etc., or reduced to reduce the accuracy.

[0069] Example 2

[0070] In order to realize that when the rotating plate 420 is hit by the protrusions on the surface of the bonding gold wire 200 and flips over, the two infusion mechanisms 500 are controlled to trigger the spraying with a corresponding delay, embodiment 2 is proposed;

[0071] This embodiment is an improvement made on the basis of embodiment 1. For details, please refer to Figure 1-Figure 8 The valve assembly 540 includes a valve core 541 slidably disposed in the nozzle 530, a second spring 542 is disposed on the valve core 541, and two ends of the second spring 542 are respectively connected to the nozzle 530 and the valve core 541;

[0072] A first connecting rod 543 and a second connecting rod 544 are respectively provided on both sides of the valve core 541. The first connecting rod 543 close to the starting direction of the bonding gold wire 200 is transmitted through the first delay trigger assembly 610 and the rotating plate 420.

[0073] The second connecting rod 544 close to the starting direction of the bonding gold wire 200 is transmitted to the first connecting rod 543 close to the end direction of the bonding gold wire 200 through the second delay trigger assembly 620;

[0074] The valve assembly 540 further includes two sealing grooves 545 formed on the nozzle 530. The first connecting rod 543 and the second connecting rod 544 are both provided with sealing plates 546, and the two sealing plates 546 are respectively slidably disposed in the two sealing grooves 545.

[0075] The first time-delay trigger assembly 610 includes a third connecting rod 611 disposed on the rotating plate 420 , a rotating shaft 613 is rotatably disposed on the housing 100 , and a fifth connecting rod 614 is disposed on the rotating shaft 613 ;

[0076] One end of the fifth connecting rod 614 is hinged to the first connecting rod 543 close to the starting direction of the bonding gold wire 200, and the other end of the fifth connecting rod 614 is provided with a sliding groove 615;

[0077] The first delay trigger assembly 610 further includes a fourth connecting rod 612, one end of the fourth connecting rod 612 is slidably disposed in the slide groove 615, and the other end of the fourth connecting rod 612 is hinged to the third connecting rod 611;

[0078] The structure of the second delay trigger component 620 is the same as that of the first delay trigger component 610 .

[0079] In this embodiment, when the valve core 541 installed in the nozzle 530 slides out of position, it will open the channel to allow the nozzle 530 to spray liquid, and the valve core 541 is elastically connected to the nozzle 530 through the second spring 542 to provide a reset force.

[0080] Taking the set of nozzles 530 and valve assembly 540 located on the upper side as an example, a first connecting rod 543 is fixed on the right side of the nozzle 530, and a second connecting rod 544 is fixed on the left side. When the third connecting rod 611 fixed on the left end of the rotating plate 420 turns clockwise under the drive of the rotating plate 420, it will drive the fourth connecting rod 612 to turn upward, and the left end of the fourth connecting rod 612 will first slide to the right in the slide groove 615, and the fifth connecting rod 614 will not rotate at this time.

[0081] When the rotating plate 420 rotates and drives the left end of the fourth connecting rod 612 to hit the rightmost side of the slide groove 615, the rotating plate 420 continues to rotate to drive the fifth connecting rod 614 to rotate counterclockwise, and drives the first connecting rod 543 and the valve core 541 to move downward through the lever, and the valve core 541 on the right side moves downward to open the acid to spray out.

[0082] When the valve core 541 on the right side moves downward, the second delay trigger component 620 with the same structure as the first delay trigger component 610 performs delay transmission on the valve core 541 on the left side, so that the valve core 541 on the left side moves upward to open the water spray.

[0083] It should be supplemented that the second delay trigger component 620 has the same structure as the first delay trigger component 610, but the proportional dimensions can be set differently to achieve the purpose of delaying the spraying of acid and water in sequence.

[0084] When the valve core 541 moves up and down, the two sealing plates 546 fixed to the first connecting rod 543 and the second connecting rod 544 slide up and down in the two sealing grooves 545 to perform a sealing function.

[0085] Example 3

[0086] In order to further clean the surface of the bonding wire 200 and avoid that some protrusions remain after pickling and washing, embodiment 3 is proposed;

[0087] This embodiment is an improvement made on the basis of embodiment 2. For details, please refer to Figure 1-Figure 10 The housing 100 is also provided with a plurality of grinding mechanisms 700 corresponding to the plurality of rotating plates 420 respectively. The grinding mechanism 700 includes a second mounting seat 710 provided on the housing 100, a slide seat 720 is slidably provided on the second mounting seat 710, a grinding wheel 730 is rotatably provided on the slide seat 720, and a rotating assembly 740 is provided on the second mounting seat 710 for driving the grinding wheel 730 to rotate;

[0088] The trigger mechanism 600 further includes a plurality of third time-delay trigger assemblies 630, and the plurality of slide seats 720 are respectively driven by the plurality of third time-delay trigger assemblies 630 and a plurality of second connecting rods 544 close to the delivery end point of the bonding gold wire 200;

[0089] The structure of the third delay trigger component 630 is the same as that of the first delay trigger component 610;

[0090] The rotating assembly 740 includes two supporting plates 741 respectively arranged on the second mounting seat 710 and the sliding seat 720, and the first rotating rod 742 and the second rotating rod 743 are respectively rotatably arranged on the two supporting plates 741, and the first rotating rod 742 is slidably arranged on the second rotating rod 743;

[0091] The first rotating rod 742 and the grinding wheel 730 are both provided with a first bevel gear 744, and the two first bevel gears 744 are meshed;

[0092] A third rotating rod 745 is rotatably disposed on the second mounting seat 710, and a second bevel gear 746 is disposed on both the second rotating rod 743 and the third rotating rod 745, and the two second bevel gears 746 are meshed;

[0093] The housing 100 is also provided with two driving mechanisms 800 for driving a plurality of third rotating rods 745 to rotate;

[0094] The driving mechanism 800 includes a second motor 810 disposed on one of the second mounting seats 710 , and the output shaft of the second motor 810 is connected to one of the third rotating rods 745 , wherein both third rotating rods 745 are provided with spur gears 820 , and both spur gears 820 are provided with toothed belts 830 .

[0095] The two grinding mechanisms 700 are driven by the same driving mechanism 800, which can also reduce the running cost.

[0096] In this embodiment, two groups of grinding mechanisms 700 are fixed on the housing 100 , one group being the upper and the other being the left and the right.

[0097] Taking a set of grinding mechanisms 700 in the up-down direction as an example, the second mounting seat 710 is fixed on the housing 100, and the slide seat 720 slides up and down along the second mounting seat 710 and is reset through 750.

[0098] The second motor 810 drives the toothed belt 830 and the two spur gears 820 to drive the two third rotating rods 745 to rotate, and the two third rotating rods 745 drive the two first rotating rods 742 to rotate through the transmission of the four second bevel gears 746, and the two first rotating rods 742 drive the two grinding wheels 730 to rotate through the transmission of the four first bevel gears 744. The sliding groove between the first rotating rod 742 and the second rotating rod 743 is rectangular, so it can still drive the rotation after extension and retraction.

[0099] The four slides 720 are also delayed-driven by the four third delay trigger components 630 having the same structure as the first delay trigger component 610 and the valve core 541 on the left side.

[0100] Still taking the valve assembly 540 on the upper side as an example, when the valve assembly 540 on the left side moves upward, the third delay trigger assembly 630 drives the grinding wheel 730 on the upper side to move downward to contact the bonding gold wire 200 for grinding.

[0101] Example 4

[0102] A cleaning process for a bonding wire cleaning device;

[0103] For details, please refer to Figure 1-Figure 10 , including the following steps:

[0104] S1. Conveying: The two first motors 320 are operated synchronously to drive the two winding rollers 310 to rotate, thereby conveying the bonding gold wire 200 from one side to the other side of the housing 100;

[0105] S2, smoothness test: at the same time as step S1, when the bonding gold wire 200 passes through a plurality of rotating plates 420, if there is rust or protrusion at least one place on the surface of the bonding gold wire 200, the corresponding rotating plate 420 is touched and one or more rotating plates 420 are turned over;

[0106] S3, pickling: In step S2, when one or more rotating plates 420 are turned over, one or more first delay trigger components 610 are used to delay transmission to drive one or more valve components 540 in the infusion mechanism 500 storing acid to open and accurately pickle the rust protrusions on the surface of the bonding gold wire 200;

[0107] S4, water washing: after step S3, one or more second time-delay trigger components 620 are used to delay transmission to drive one or more valve components 540 in the infusion mechanism 500 storing water to open and accurately wash the surface of the bonding gold wire 200 after pickling;

[0108] S5, grinding: after step S4, one or more third delay trigger components 630 are used to delay transmission to drive one or more grinding wheels 730 corresponding to the washed surface of the bonding gold wire 200 to move close to the bonding gold wire 200 and rotate and grind under the drive of two second motors 810 in two driving mechanisms 800;

[0109] S6. Cleaning is completed: After step S5, the bonding gold wire 200 finally passes through the wiping ring 900 to remove surface moisture and residual substances and then remains smooth for transportation.

[0110] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0111] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A bonding gold wire cleaning device, comprising a housing (100) and a bonding gold wire (200), characterized in that: The housing (100) is provided with a conveying mechanism (300) for conveying the bonding gold wire (200); The shell (100) is provided with a testing mechanism (400) for performing a smoothness test on the surface of the bonding gold wire (200), the testing mechanism (400) comprising a first mounting seat (410) provided on the shell (100), a plurality of rotating plates (420) being rotatably provided in the circumferential direction inside the first mounting seat (410), and a complete circular ring that fits the surface of the bonding gold wire (200) is formed by the plurality of rotating plates (420); Two infusion mechanisms (500) are sequentially arranged on the housing (100) along the conveying direction of the bonding gold wire (200) for pickling and washing the bonding gold wire (200) respectively, the infusion mechanism (500) comprising a liquid storage tank (510) arranged on the housing (100), a connecting pipe (520) being arranged on the liquid storage tank (510), a plurality of nozzles (530) being arranged on the connecting pipe (520) and corresponding to a plurality of rotating plates (420) respectively, and a valve assembly (540) being arranged in each of the plurality of nozzles (530) for controlling the opening and closing thereof; The housing (100) is also provided with a trigger mechanism (600), the trigger mechanism (600) comprising a plurality of first time-delay trigger components (610), and the plurality of rotating plates (420) are respectively driven by the plurality of first time-delay trigger components (610) and a plurality of valve components (540) close to the starting direction of conveying the bonding gold wire (200); The first time-delay trigger component (610) comprises a third connecting rod (611) arranged on the rotating plate (420); a rotating shaft (613) is rotatably arranged on the housing (100); and a fifth connecting rod (614) is arranged on the rotating shaft (613); One end of the fifth connecting rod (614) is hinged to the first connecting rod (543) close to the starting direction of conveying the bonding gold wire (200), and the other end of the fifth connecting rod (614) is provided with a sliding groove (615); The first time-delay trigger component (610) further comprises a fourth connecting rod (612), one end of the fourth connecting rod (612) being slidably disposed in the slide groove (615), and the other end of the fourth connecting rod (612) being hinged to the third connecting rod (611).

2. A bonding wire cleaning device according to claim 1, characterized in that: The conveying mechanism (300) comprises two winding rollers (310) rotatably arranged on a housing (100), the bonding gold wire (200) is wound on the two winding rollers (310), and the winding directions of the bonding gold wire (200) on the two winding rollers (310) are opposite, and two first motors (320) are arranged on the housing (100), and the output shafts of the two first motors (320) are respectively connected to the two winding rollers (310).

3. A bonding wire cleaning device according to claim 1, characterized in that: The testing mechanism (400) further comprises a plurality of first springs (430), one end of each of the plurality of first springs (430) being connected to the first mounting seat (410), and the other ends of each of the plurality of first springs (430) being connected to the plurality of rotating plates (420); The trigger mechanism (600) further comprises a plurality of second time-delay trigger assemblies (620), and a plurality of valve assemblies (540) close to the starting direction of conveying the bonding gold wire (200) are respectively transmitted to a plurality of valve assemblies (540) close to the ending direction of conveying the bonding gold wire (200) through the plurality of second time-delay trigger assemblies (620).

4. A bonding wire cleaning device according to claim 3, characterized in that: The valve assembly (540) comprises a valve core (541) slidably disposed in the spray head (530), a second spring (542) being disposed on the valve core (541), and two ends of the second spring (542) being respectively connected to the spray head (530) and the valve core (541); A first connecting rod (543) and a second connecting rod (544) are respectively provided on both sides of the valve core (541), and the first connecting rod (543) close to the starting direction of conveying the bonding gold wire (200) is transmitted via a first time delay trigger component (610) and a rotating plate (420); The second connecting rod (544) close to the starting direction of conveying the bonding gold wire (200) is transmitted to the first connecting rod (543) close to the ending direction of conveying the bonding gold wire (200) via the second time delay trigger component (620).

5. A bonding wire cleaning device according to claim 4, characterized in that: The structure of the second delay trigger component (620) is the same as that of the first delay trigger component (610).

6. A bonding wire cleaning device according to claim 4, characterized in that: The housing (100) is also provided with a plurality of grinding mechanisms (700) respectively corresponding to the plurality of rotating plates (420), the grinding mechanism (700) comprising a second mounting seat (710) provided on the housing (100), a slide seat (720) being slidably provided on the second mounting seat (710), a grinding wheel (730) being rotatably provided on the slide seat (720), and a rotating assembly (740) being provided on the second mounting seat (710) for driving the grinding wheel (730) to rotate; The trigger mechanism (600) further comprises a plurality of third time-delay trigger assemblies (630), and the plurality of slide seats (720) are respectively connected to a plurality of second connecting rods (544) close to the delivery end point of the bonding gold wire (200) through the plurality of third time-delay trigger assemblies (630); The structure of the third time-delay trigger component (630) is the same as that of the first time-delay trigger component (610).

7. A bonding wire cleaning device according to claim 6, characterized in that: The rotating assembly (740) comprises two support plates (741) respectively arranged on the second mounting seat (710) and the sliding seat (720); a first rotating rod (742) and a second rotating rod (743) are respectively rotatably arranged on the two support plates (741), and the first rotating rod (742) is slidably arranged on the second rotating rod (743); The first rotating rod (742) and the grinding wheel (730) are both provided with a first bevel gear (744), and the two first bevel gears (744) are meshed; A third rotating rod (745) is rotatably arranged on the second mounting seat (710), and second bevel gears (746) are arranged on both the second rotating rod (743) and the third rotating rod (745), and the two second bevel gears (746) are meshed.

8. A bonding wire cleaning device according to claim 7, characterized in that: The housing (100) is also provided with two driving mechanisms (800) for driving a plurality of third rotating rods (745) to rotate; The driving mechanism (800) comprises a second motor (810) arranged on one of the second mounting seats (710), and the output shaft of the second motor (810) is connected to one of the third rotating rods (745), wherein two of the third rotating rods (745) are each provided with a spur gear (820), and the two spur gears (820) are provided with a toothed belt (830).

9. The bonding wire cleaning device according to claim 1, characterized in that: A wiping ring (900) is also provided on the housing (100), and the bonding gold wire (200) passes through the middle of the wiping ring (900).

10. A process for cleaning a bonding wire according to any one of claims 1 to 9, characterized in that: The steps include: S1, conveying: two first motors (320) are operated synchronously to drive two winding rollers (310) to rotate, thereby conveying the bonding gold wire (200) from one side of the housing (100) to the other side; S2, smoothness test: at the same time as step S1, when the bonding gold wire (200) passes through a plurality of rotating plates (420), if there is rust or protrusion at least one place on the surface of the bonding gold wire (200), the corresponding rotating plate (420) is touched, and one or more rotating plates (420) are turned over; S3, pickling: in step S2, when one or more rotating plates (420) are turned over, one or more first delay trigger components (610) are used to delay transmission to drive one or more valve components (540) in the infusion mechanism (500) storing acid to open and accurately pickle the rust protrusions on the surface of the bonding gold wire (200); S4, water washing: after step S3, one or more corresponding second time-delay trigger components (620) are used to delay transmission to drive one or more valve components (540) in the infusion mechanism (500) storing water to open and accurately wash the surface of the bonding gold wire (200) after pickling; S5, grinding: after step S4, one or more third delay trigger components (630) are used to delay transmission to drive one or more grinding wheels (730) corresponding to the washed surface of the bonding gold wire (200) to move close to the bonding gold wire (200) and rotate under the drive of two second motors (810) in two driving mechanisms (800) to perform grinding; S6, cleaning completed: After step S5, the bonding gold wire (200) finally passes through the wiping ring (900) to remove surface moisture and residual substances and then remains smooth for transportation.

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