Wafer adsorption method and device, wafer polishing apparatus

Abstract

The application provides a wafer adsorption method and device and a wafer grinding equipment, and belongs to the technical field of semiconductor manufacturing. The device comprises a chuck head and a chuck plate, the chuck head comprises a chuck head inner ring and a chuck head outer ring surrounding the chuck head inner ring; a first gas pipe for feeding gas to the chuck head inner ring and a second gas pipe for feeding gas to the chuck head outer ring; an adsorption pad for adsorbing a wafer; a pressure sensor arranged in the chuck head outer ring, a pressure sensing end of the pressure sensor being exposed to a lower surface of the chuck head outer ring in contact with the adsorption pad and being in contact with the adsorption pad; an adsorption pad snap ring arranged at an outer ring of the adsorption pad, the adsorption pad snap ring limiting the wafer adsorbed by the adsorption pad; and a control unit controlling the second gas pipe to feed gas to the chuck head outer ring, so that the adsorption pad snap ring is in contact with the chuck plate, and whether the chuck head is successfully loaded is judged according to a response time and a detected pressure value of the pressure sensor. The application can solve the problem that the wafer is not limited by the adsorption pad snap ring of the chuck head outer ring during wafer grinding, the wafer is thrown out at the moment of contacting the chuck plate and then broken.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, in particular to a wafer adsorption method and device and wafer grinding equipment. BACKGROUND

[0002] In the prior art, when a wafer is ground, a chucking structure of a polishing head is used to chuck the wafer so as to grind the wafer. The polishing head of the chucking structure comprises a polishing head inner ring and a polishing head outer ring surrounding the polishing head inner ring, and the polishing head outer ring is provided with a chucking grommet for limiting the wafer.

[0003] Currently, before the polishing equipment performs wafer grinding, whether the polishing head outer ring has been lowered and uploaded to the polishing plate is not judged, but the polishing head outer ring is controlled to be lowered first and then the polishing head inner ring is controlled to be lowered later according to the time sequence. However, once the polishing head outer ring is delayed during the lowering process, the polishing head inner ring will be in contact with the polishing plate earlier than the polishing head outer ring. Without the limitation of the chucking grommet of the polishing head outer ring, the wafer will be thrown out at the moment of contacting the polishing plate, resulting in fragments, increasing the production cost, and causing the equipment to be down, thereby affecting the operation efficiency of the equipment. SUMMARY

[0004] The present application provides a wafer adsorption method and device and wafer grinding equipment, which can solve the problem that, during wafer grinding, the wafer is thrown out at the moment of contacting the polishing plate without the limitation of the chucking grommet of the polishing head outer ring, thereby resulting in fragments.

[0005] In order to achieve the above-mentioned purpose, the technical scheme adopted by the embodiments of the present application is as follows:

[0006] A wafer adsorption device comprises:

[0007] A polishing head and a polishing plate are oppositely arranged, and the polishing head comprises a polishing head inner ring and a polishing head outer ring surrounding the polishing head inner ring;

[0008] A first gas pipe for feeding gas to the polishing head inner ring and a second gas pipe for feeding gas to the polishing head outer ring;

[0009] A chucking grommet is arranged on the side of the polishing head facing the polishing plate, and is used to chuck the wafer;

[0010] A pressure sensor is arranged on the polishing head outer ring, and the pressure sensing end of the pressure sensor is in contact with the chucking grommet;

[0011] A chucking grommet is arranged on the polishing head outer ring and located on the side of the chucking grommet facing the polishing plate, and is used to limit the wafer chucked by the chucking grommet, and the position of the pressure sensor corresponds to the position of the chucking grommet;

[0012] A control unit is configured to control the second air pipe to supply air to the outer ring of the chuck, so that the clamping ring of the adsorption pad contacts the chuck plate, and determine whether the chuck is successfully loaded according to the response time and the detected pressure value of the pressure sensor.

[0013] In some embodiments, the control unit is specifically configured to determine that the chuck is successfully loaded when the response time of the pressure sensor is less than a preset pressure detection completion time and the detected pressure value is greater than a preset pressure threshold value; and determine that the chuck is not successfully loaded when the response time of the pressure sensor is not less than the preset pressure detection completion time or the detected pressure value is not greater than the preset pressure threshold value.

[0014] In some embodiments, the pressure detection completion time is not greater than 3s, and the pressure threshold value is 4500-4800N.

[0015] In some embodiments, the wafer adsorption device further comprises:

[0016] An alarm unit is configured to alarm when the control unit determines that the chuck is not successfully loaded.

[0017] In some embodiments, the control unit is further configured to control the first air pipe to supply air to the inner ring of the chuck when it is determined that the chuck is successfully loaded, so that the wafer adsorbed by the adsorption pad contacts the chuck plate.

[0018] The embodiments of the present application also provide a wafer grinding device comprising the wafer adsorption device.

[0019] The embodiments of the present application also provide a wafer adsorption method applied to the wafer adsorption device, and the method comprises:

[0020] Controlling the second air pipe to supply air to the outer ring of the chuck, so that the clamping ring of the adsorption pad contacts the chuck plate;

[0021] Controlling the control unit to determine whether the chuck is successfully loaded according to the response time and the detected pressure value of the pressure sensor.

[0022] In some embodiments, controlling the control unit to determine whether the wafer is successfully adsorbed according to the response time and the detected pressure value of the pressure sensor comprises:

[0023] The control unit determines that the chuck is successfully loaded when the response time of the pressure sensor is less than a preset pressure detection completion time and the detected pressure value is greater than a preset pressure threshold value; and determines that the chuck is not successfully loaded when the response time of the pressure sensor is not less than the preset pressure detection completion time or the detected pressure value is not greater than the preset pressure threshold value.

[0024] In some embodiments, the method further includes:

[0025] If the control unit determines that the outer ring of the throwing head has failed to load, it will control the alarm unit to issue an alarm.

[0026] In some embodiments, the method further includes:

[0027] When the control unit determines that the outer ring of the blasting head has been successfully loaded, it controls the first air pipe to introduce air into the inner ring of the blasting head, so that the wafer adsorbed by the adsorption pad comes into contact with the blasting disk.

[0028] The beneficial effects of this invention are:

[0029] In this embodiment, a pressure sensor is installed on the outer ring of the polishing head. The pressure sensing end of the pressure sensor contacts the adsorption pad. By measuring the response time and detecting the pressure value, it can be determined whether the outer ring of the polishing head has been successfully loaded. This allows control over the loading of the inner ring of the polishing head, including issuing an alarm and stopping the loading of the inner ring if the outer ring fails to load. If the outer ring is successfully loaded, the inner ring is then loaded. This effectively avoids the problem of wafers being thrown out upon contact with the polishing plate during wafer grinding due to the lack of restraint from the adsorption pad ring on the outer ring, resulting in fragmentation. The technical solution of this embodiment can effectively reduce wafer fragmentation, achieving cost savings and improved equipment efficiency. Attached Figure Description

[0030] Figure 1 and Figure 2 This diagram illustrates the structure of the wafer adsorption device according to an embodiment of the present invention.

[0031] Figure 3 This is a bottom view of the throwing head according to an embodiment of the present invention.

[0032] Figure Labels

[0033] 01 Trachea

[0034] 02 Pressure Sensor

[0035] 03 Adsorption Pad

[0036] 04 Adsorption Pad Retaining Ring

[0037] 05 Throwing Head

[0038] 06 Inner circle of the head

[0039] 07 Outer Ring

[0040] 08 Wafer

[0041] 09 Selling Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention are within the scope of protection of the present invention.

[0043] This invention provides a wafer adsorption method and apparatus, and a wafer grinding equipment, which can solve the problem that when grinding wafer 08, the adsorption pad retaining ring 04 of the outer ring 07 of the polishing head is not limited, and the wafer is thrown out the moment it comes into contact with the polishing plate 09, resulting in fragmentation.

[0044] This invention provides a wafer adsorption device, such as... Figure 1 and Figure 2 As shown, it includes:

[0045] The throwing head 05 and the throwing plate 09 are arranged opposite to each other. The throwing head 05 includes an inner ring 06 and an outer ring 07 surrounding the inner ring 06. The throwing head 05 is located above the throwing plate 09.

[0046] Air pipe 01 includes a first air pipe for introducing air into the inner ring 06 of the throwing head and a second air pipe for introducing air into the outer ring 07 of the throwing head;

[0047] An adsorption pad 03 is disposed on the side of the polishing head 05 facing the polishing disk 09 for adsorbing the wafer 08;

[0048] The pressure sensor 02 is disposed on the outer ring 07 of the throwing head, and the pressure sensing end of the pressure sensor 02 is in contact with the adsorption pad 03.

[0049] An adsorption pad retaining ring 04, located on the outer ring 07 of the polishing head and on the side of the adsorption pad 03 facing the polishing disk 09, is used to limit the wafer 08 adsorbed by the adsorption pad 03. The position of the pressure sensor 02 corresponds to the position of the adsorption pad retaining ring 04.

[0050] The control unit is used to control the second air tube to supply air to the outer ring 07 of the throwing head, so that the adsorption pad retaining ring 04 contacts the throwing disc 09, and to determine whether the outer ring 07 of the throwing head has been successfully loaded based on the response time and detected pressure value of the pressure sensor 02.

[0051] In this embodiment, a pressure sensor 02 is installed on the outer ring 07 of the polishing head. The pressure sensing end of the pressure sensor 02 contacts the adsorption pad 03. The response time and detected pressure value of the pressure sensor 02 can determine whether the outer ring 07 of the polishing head has been successfully loaded, thereby controlling the loading of the inner ring 06 of the polishing head. This includes issuing an alarm and stopping the loading of the inner ring 06 if the outer ring 07 fails to load; and loading the inner ring 06 only if the outer ring 07 is successfully loaded. This effectively avoids the problem of the wafer 08 being thrown out and fragmented upon contact with the polishing disk 09 during wafer 08 polishing due to the lack of restraint by the adsorption pad retainer 04 of the outer ring 07. The technical solution of this embodiment can effectively reduce wafer 08 fragmentation, achieving the goals of cost savings and improved equipment efficiency.

[0052] In this embodiment, when it is necessary to grind wafer 08, wafer 08 can be adsorbed using a wafer adsorption device. For example... Figure 1 and Figure 2 As shown, the wafer adsorption device includes an air pipe 01, which includes second air pipes ① and ③ for introducing air into the outer ring 07 of the polishing head, and a first air pipe ② for introducing air into the inner ring 06 of the polishing head. A pressure sensor 02 and an adsorption pad retaining ring 04 are provided on the outer ring 07 of the polishing head. The positions of the pressure sensor 02 and the adsorption pad retaining ring 04 are corresponding. The orthographic projection of the pressure sensor 02 on the horizontal plane falls within the orthographic projection of the adsorption pad retaining ring 04 on the horizontal plane. When the polishing head 05 is lowered and loaded onto the polishing tray 09, the adsorption pad retaining ring 04 contacts the polishing tray 09 and transmits pressure to the pressure sensor 02. If the outer ring 07 of the polishing head is successfully loaded, the pressure sensor 02 will detect a pressure value greater than the preset pressure threshold within the preset pressure detection completion time. If the outer ring 07 of the polishing head is not successfully loaded, the pressure sensor 02 will not be able to detect a pressure value greater than the preset pressure threshold within the preset pressure detection completion time. Therefore, the response time and detected pressure value of pressure sensor 02 can be used to determine whether the outer ring 07 of the sling head has been successfully loaded.

[0053] like Figure 3 As shown, in this embodiment, three pressure sensors 02 can be evenly arranged on the outer ring 07 of the jet head. However, this embodiment is not limited to three pressure sensors 02 evenly arranged on the outer ring 07 of the jet head; a greater number of pressure sensors 02 can also be used. When multiple pressure sensors 02 are used, the response time of each pressure sensor 02 can be determined by the average response time of the multiple pressure sensors 02, and the detected pressure value of each pressure sensor 02 can be determined by the average detected pressure value of the multiple pressure sensors 02.

[0054] In some embodiments, the control unit is specifically used to determine that the outer ring of the throwing head 07 has been successfully loaded when the response time of the pressure sensor 02 is less than a preset pressure detection completion time and the detected pressure value is greater than a preset pressure threshold; and to determine that the outer ring of the throwing head 07 has failed to be loaded when the response time of the pressure sensor 02 is not less than the preset pressure detection completion time or the detected pressure value is not greater than the preset pressure threshold.

[0055] In this embodiment, the preset pressure detection completion time and preset pressure threshold can be determined in advance through a large amount of experimental data. Specifically, when the outer ring 07 of the jet head is successfully loaded, the response time and detected pressure value of the pressure sensor 02 can be recorded; when the outer ring 07 of the jet head is not successfully loaded, the response time and detected pressure value of the pressure sensor 02 can be recorded; the preset pressure detection completion time and preset pressure threshold can be determined by the recorded values.

[0056] For example, when the outer ring 07 of the slinger is successfully loaded, the pressure sensor 02 will detect the pressure value within 3 seconds, and the detected pressure value is not less than 4500N. Therefore, based on extensive experimental data, it can be determined that the pressure detection completion time is no more than 3 seconds, for example, it can be 0.5s, 0.6s, 0.7s, 0.8s, 0.9s, 1.0s, 1.1s, 1.2s, 1.3s, 1.4s, 1.5s, 1.6s, 1.7s, 1.8s, 1.9s, 2.0s, 2.1s, 2.2s, 2.3s, 2.4s, 2.5s, 2.6s, 2.7s, 2.8s, 2.9s, or 3s; the pressure critical value is 4500-4800N, for example, it can be 4500N, 4550N, 4600N, 4650N, 4700N, 4750N, or 4800N.

[0057] For example, if the pressure threshold is 4500N, then if the response time of pressure sensor 02 is no more than 3s and the pressure value detected by pressure sensor 02 is no less than 4500N, it can be determined that the outer ring 07 of the jet head has been successfully loaded; if the response time of pressure sensor 02 is greater than 3s, or the pressure value detected by pressure sensor 02 is less than 4500N, it can be determined that the outer ring 07 of the jet head has not been successfully loaded.

[0058] In some embodiments, the apparatus further includes:

[0059] An alarm unit is used to issue an alarm when the control unit determines that the outer ring 07 of the wafer ejector head has failed to load. In the event of loading failure of the outer ring 07 of the wafer ejector head, the alarm unit can notify the operator by sounding a horn, flashing lights, or sending an alarm code via email. After receiving the alarm information, the operator can manually intervene and check the wafer adsorption device to prevent equipment downtime.

[0060] In some embodiments, the control unit is further configured to, upon determining that the outer ring 07 of the polishing head has been successfully loaded, control the first air pipe to introduce air into the inner ring 06 of the polishing head, so that the wafer 08 adsorbed by the adsorption pad 03 comes into contact with the polishing disk 09. If the outer ring 07 of the polishing head has been successfully loaded, the inner ring 06 of the polishing head can continue to be loaded, so that the wafer 08 comes into contact with the polishing disk 09 for polishing.

[0061] This invention also provides a wafer grinding apparatus, including the wafer adsorption device described above.

[0062] The wafer grinding equipment of this embodiment can detect whether the outer ring 07 of the polishing head has been successfully loaded before grinding the wafer, and thus control the loading of the inner ring 06 of the polishing head. This includes issuing an alarm and stopping the loading of the inner ring 06 if the outer ring 07 fails to load; and loading the inner ring 06 only if the outer ring 07 is successfully loaded. This effectively avoids the problem of wafer 08 being thrown out and fragmented upon contact with the polishing disk 09 during grinding due to the lack of restraint from the outer ring 07's adsorption pad retaining ring 04. The technical solution of this embodiment can effectively reduce wafer 08 fragmentation, achieving cost savings and improved equipment efficiency.

[0063] This invention also provides a wafer adsorption method, applied to the wafer adsorption device described above, the method comprising:

[0064] Control the second air pipe to supply air to the outer ring 07 of the throwing head, so that the adsorption pad retaining ring 04 contacts the throwing disc 09;

[0065] The control unit determines whether the throwing head 05 has been successfully loaded based on the response time of the pressure sensor 02 and the detected pressure value.

[0066] In this embodiment, a pressure sensor 02 is installed on the outer ring 07 of the polishing head. The pressure sensing end of the pressure sensor 02 contacts the adsorption pad 03. The response time and detected pressure value of the pressure sensor 02 can determine whether the outer ring 07 of the polishing head has been successfully loaded, thereby controlling the loading of the inner ring 06 of the polishing head. This includes issuing an alarm and stopping the loading of the inner ring 06 if the outer ring 07 fails to load; and loading the inner ring 06 only if the outer ring 07 is successfully loaded. This effectively avoids the problem of the wafer 08 being thrown out and fragmented upon contact with the polishing disk 09 during wafer 08 polishing due to the lack of restraint by the adsorption pad retainer 04 of the outer ring 07. The technical solution of this embodiment can effectively reduce wafer 08 fragmentation, achieving the goals of cost savings and improved equipment efficiency.

[0067] In some embodiments, controlling the control unit to determine whether the adsorption of wafer 08 is successful based on the response time of pressure sensor 02 and the detected pressure value includes:

[0068] The control unit determines that the outer ring 07 of the throwing head has been successfully loaded when the response time of the pressure sensor 02 is less than the preset pressure detection completion time and the detected pressure value is greater than the preset pressure threshold; and determines that the outer ring 07 of the throwing head has failed to be loaded when the response time of the pressure sensor 02 is not less than the preset pressure detection completion time or the detected pressure value is not greater than the preset pressure threshold.

[0069] In this embodiment, the preset pressure detection completion time and preset pressure threshold can be determined in advance through a large amount of experimental data. Specifically, when the outer ring 07 of the jet head is successfully loaded, the response time and detected pressure value of the pressure sensor 02 can be recorded; when the outer ring 07 of the jet head is not successfully loaded, the response time and detected pressure value of the pressure sensor 02 can be recorded; the preset pressure detection completion time and preset pressure threshold can be determined by the recorded values.

[0070] For example, when the outer ring 07 of the slinger is successfully loaded, the pressure sensor 02 will detect the pressure value within 3 seconds, and the detected pressure value is not less than 4500N. Therefore, based on extensive experimental data, it can be determined that the pressure detection completion time is no more than 3 seconds, for example, it can be 0.5s, 0.6s, 0.7s, 0.8s, 0.9s, 1.0s, 1.1s, 1.2s, 1.3s, 1.4s, 1.5s, 1.6s, 1.7s, 1.8s, 1.9s, 2.0s, 2.1s, 2.2s, 2.3s, 2.4s, 2.5s, 2.6s, 2.7s, 2.8s, 2.9s, or 3s; the pressure critical value is 4500-4800N, for example, it can be 4500N, 4550N, 4600N, 4650N, 4700N, 4750N, or 4800N.

[0071] The pressure threshold can be 4500N. When the response time of pressure sensor 02 is no more than 3s and the pressure value detected by pressure sensor 02 is no less than 4500N, it can be determined that the outer ring 07 of the jet head has been successfully loaded. When the response time of pressure sensor 02 is greater than 3s, or the pressure value detected by pressure sensor 02 is less than 4500N, it can be determined that the outer ring 07 of the jet head has not been successfully loaded.

[0072] In one specific embodiment, when the grinding action of the polishing head 05 begins, the air intake of the air pipes ① and ③ is controlled to act on the outer ring 07 of the polishing head. Within 3 seconds, the adsorption pad retaining ring 04 on the outer ring of the adsorption pad 03 first contacts the polishing disc 09, detects the pressure value detected by the pressure sensor 02, and feeds back the detected pressure value to the control unit. The control unit determines that the loading action of the outer ring 07 of the polishing head is completed.

[0073] If the pressure value detected by pressure sensor 02 is not less than 4500N within 3 seconds, it means that the outer ring 07 of the polishing head has been successfully loaded, and the adsorption pad retainer 04 has been effectively loaded onto the polishing tray 09. The control unit can control the air intake from the air pipe ② to apply internal pressure to the inner ring 06 of the polishing head, so that the wafer 08 adsorbed by the adsorption pad 03 comes into contact with the polishing tray 09, pressing the wafer 08 onto the polishing tray 09 to begin grinding. If the pressure value detected by pressure sensor 02 does not reach 4500N within 3 seconds, it means that the outer ring 07 of the polishing head has failed to be loaded, and the adsorption pad retainer 04 has not been effectively loaded onto the polishing tray 09. The alarm unit can notify the operator by sounding a horn, flashing lights, sending an alarm code via email, or control the equipment to stop. After receiving the alarm information, the operator can manually intervene and check the wafer adsorption device.

[0074] It should be noted that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, since the embodiments are basically similar to the product embodiments, the descriptions are relatively simple, and the relevant parts can be referred to the descriptions of the product embodiments.

[0075] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0076] It is understandable that when a component such as a layer, film, region, or substrate is referred to as being "above" or "below" another component, the component may be "directly" located "above" or "below" the other component, or there may be intermediate components present.

[0077] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0078] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A wafer adsorption device, characterized in that, include: The sling head and sling plate are arranged opposite to each other, and the sling head includes an inner ring and an outer ring surrounding the inner ring; A first air pipe for introducing air into the inner ring of the sling head and a second air pipe for introducing air into the outer ring of the sling head; An adsorption pad is disposed on the side of the polishing head facing the polishing plate for adsorbing wafers; A pressure sensor is disposed on the outer ring of the throwing head, and the pressure sensing end of the pressure sensor is in contact with the adsorption pad. An adsorption pad retaining ring is disposed on the outer ring of the polishing head, on the side of the adsorption pad facing the polishing disk, for limiting the wafer adsorbed by the adsorption pad. The position of the pressure sensor corresponds to the position of the adsorption pad retaining ring. The control unit is used to control the second air tube to supply air to the outer ring of the throwing head, so that the adsorption pad retaining ring contacts the throwing disc, and to determine whether the outer ring of the throwing head has been successfully loaded based on the response time and detected pressure value of the pressure sensor.

2. The wafer adsorption device according to claim 1, characterized in that, The control unit is specifically used to determine that the outer ring of the throwing head has been successfully loaded when the response time of the pressure sensor is less than the preset pressure detection completion time and the detected pressure value is greater than the preset pressure threshold; and to determine that the outer ring of the throwing head has failed to be loaded when the response time of the pressure sensor is not less than the preset pressure detection completion time or the detected pressure value is not greater than the preset pressure threshold.

3. The wafer adsorption device according to claim 2, characterized in that, The pressure detection completion time is no more than 3 seconds, and the pressure threshold value is 4500-4800N.

4. The wafer adsorption device according to claim 1, characterized in that, Also includes: An alarm unit is used to issue an alarm when the control unit determines that the outer ring of the throwing head has failed to load.

5. The wafer adsorption device according to claim 1, characterized in that, The control unit is also used to control the first air pipe to introduce air into the inner ring of the polishing head when it is determined that the outer ring of the polishing head has been successfully loaded, so that the wafer adsorbed by the adsorption pad comes into contact with the polishing disk.

6. A wafer grinding apparatus, characterized in that, Includes the wafer adsorption device as described in any one of claims 1-5.

7. A wafer adsorption method, characterized in that, The method, applied to the wafer adsorption apparatus as described in any one of claims 1-5, comprises: Control the second air pipe to introduce air into the outer ring of the throwing head, so that the adsorption pad retaining ring contacts the throwing disc; The control unit determines whether the throwing head has been successfully loaded based on the response time of the pressure sensor and the detected pressure value.

8. The wafer adsorption method according to claim 7, characterized in that, The control unit determines whether wafer adsorption is successful based on the response time of the pressure sensor and the detected pressure value, including: The control unit determines that the outer ring of the throwing head has been successfully loaded when the response time of the pressure sensor is less than the preset pressure detection completion time and the detected pressure value is greater than the preset pressure threshold; and determines that the outer ring of the throwing head has failed to be loaded when the response time of the pressure sensor is not less than the preset pressure detection completion time or the detected pressure value is not greater than the preset pressure threshold.

9. The wafer adsorption method according to claim 8, characterized in that, The method further includes: If the control unit determines that the outer ring of the throwing head has failed to load, it will control the alarm unit to issue an alarm.

10. The wafer adsorption method according to claim 8, characterized in that, The method further includes: When the control unit determines that the outer ring of the blasting head has been successfully loaded, it controls the first air pipe to introduce air into the inner ring of the blasting head, so that the wafer adsorbed by the adsorption pad comes into contact with the blasting disk.

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