Intelligent manufacturing method of gold jewelry

Abstract

The application relates to a kind of intelligent manufacturing methods of gold jewelry, including processing jewelry body by high-precision electroforming technology, and reserving accommodating space for accommodating chip;Using photoetching technology to prepare conductive channel;Using electroforming technology to deposit high-conductivity metal material to the conductive channel to form antenna structure;The chip is installed in the accommodating space by micro-welding technology to form jewelry embryo;Coating protective layer on the outer surface of the jewelry embryo to form jewelry semi-finished product;The jewelry semi-finished product is heat treated to form jewelry finished product.Through accurate 3D modeling and high-precision manufacturing technology, both modern intelligent application is realized, and the appearance of jewelry is not affected.In addition, high-precision technologies such as photoetching, etching and electroforming ensure the efficient integration and stable performance of the antenna and the chip, which is beneficial to improve the signal transmission efficiency and oxidation resistance.In addition, the local heat treatment technology enhances the structural strength and durability of the embedded part.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of intelligent jewelry manufacturing, and particularly to an intelligent manufacturing method of gold jewelry. BACKGROUND

[0002] At present, most gold jewelry is mainly for decoration, collection and preservation of value. Although with the rise of wearable devices, some smart jewelry products have begun to enter the market, their functions and structural designs are relatively simple, and it is difficult to realize high-end intelligent applications such as identity recognition and payment. Traditional processes cannot meet the close combination of miniaturized electronic components and jewelry metal materials, resulting in low integration, affecting service life and functional reliability.

[0003] Embedding an RFID or NFC chip in jewelry requires embedding an antenna at the same time to ensure effective signal transmission. However, the conductivity and shielding effect of precious metals increase the technical difficulty of integrating the chip and the antenna. Traditional welding, packaging and other processes cannot fully guarantee the stability of antenna signal transmission, and may damage the appearance of the jewelry, reducing the aesthetic and commercial value of the product.

[0004] Lithography, etching and electroforming micro-nano manufacturing technologies are widely used in the semiconductor and electronic fields, but their application in jewelry processing is relatively rare. These technologies have the ability to manufacture high-precision and fine structures, and can realize the production of micron-level antennas and the embedding of chips. However, there are still technical challenges in introducing these technologies into jewelry manufacturing to realize the integrated processing of electronic components and precious metals, such as how to ensure the conductivity of the antenna, the firmness of the chip embedding and the integrity of the appearance. SUMMARY

[0005] The present application aims to provide an intelligent manufacturing method of gold jewelry, which aims to solve the technical problems of existing gold jewelry when embedding chips and antennas, such as poor connection, poor conductivity and incomplete appearance.

[0006] To solve the above technical problems, an intelligent manufacturing method of gold jewelry is provided, comprising:

[0007] A jewelry body is processed by high-precision electroforming technology, and a containing space for accommodating a chip is reserved;

[0008] An electrically conductive channel is prepared using lithography technology;

[0009] A high-conductivity metal material is deposited into the electrically conductive channel to form an antenna structure using electroforming technology;

[0010] The chip is installed in the containing space to form a jewelry blank by micro-welding technology;

[0011] coating a protective layer on the outer surface of the jewelry embryo to form a jewelry semi-finished product;

[0012] performing heat treatment on the jewelry semi-finished product to form a jewelry finished product.

[0013] Further, the preparation of the conductive channel using the photoetching technology comprises:

[0014] coating a positive photoresist on the predetermined antenna area of the jewelry body, and the coating thickness is controlled within the range of 1-5 microns;

[0015] exposing the mask plate provided with the antenna pattern to ultraviolet light, so that the part of the positive photoresist not blocked by the mask undergoes chemical reaction;

[0016] placing the exposed jewelry body into a developing solution to remove the positive photoresist of the exposed part;

[0017] using plasma dry etching or wet chemical etching technology to remove the metal layer exposed on the surface of the jewelry body to form the conductive channel.

[0018] Further, the etched conductive channel is cleaned and deoxidized before electroforming;

[0019] using electroforming liquid for deposition, and the deposition thickness is controlled within the range of 5-10 microns.

[0020] Further, the deposition using the electroforming liquid comprises: controlling the current density within the range of 2-5 A / dm 2 during the electroforming process, and the electroforming time is not more than 60 minutes.

[0021] Further, the mounting of the chip in the accommodating space by the micro-welding technology to form the jewelry embryo comprises: connecting the chip and the conductive terminal of the antenna structure by gold electroplating welding, and the size of the welding point is controlled within the range of 5-10 microns.

[0022] Further, after the welding is completed, the welding point is detected, and if the resistance value of the welding point is within the range of 1-5 ohms, the product is qualified.

[0023] Further, the coating of the protective layer on the outer surface of the jewelry embryo comprises:

[0024] coating an epoxy resin packaging layer on the outer surface of the jewelry embryo, and the thickness of the epoxy resin layer is controlled within the range of 20-50 microns;

[0025] using gold for electroplating treatment on the outer surface of the epoxy resin packaging layer, and the thickness of the electroplating layer is controlled within the range of 3-5 microns.

[0026] Further, a nano coating is formed on the surface of the jewelry embryo using a nano coating protection technology, and the nano coating has a thickness of 10-50 nanometers.

[0027] Further, the heat treatment of the jewelry semi-finished product comprises: locally heating the area where the chip and the antenna structure are arranged, the heating temperature is controlled in the range of 100-200 DEG C, the heating time is not more than 15 minutes, and the heating rate is controlled in the range of 2-5 DEG C / min during the heat treatment.

[0028] Further, before processing the jewelry body, a 3D modeling design is performed using a computer-aided design tool.

[0029] The embodiment of the present application has the following beneficial effects:

[0030] The intelligent manufacturing method of gold jewelry in the embodiment integrates the identity recognition and payment functions into the gold jewelry through accurate 3D modeling and high-precision manufacturing technology, and a special space is reserved in the design, so that the modern intelligent application is realized, and the embedding of the chip and the antenna does not affect the appearance of the jewelry. On the other hand, high-precision technologies such as photoetching, etching and electroforming are used to ensure the efficient integration and stable performance of the antenna and the chip, which is beneficial to improve the signal transmission efficiency and the oxidation resistance, and ensures the reliability in long-term use. In addition, the local heat treatment technology enhances the structural strength and durability of the embedded part, avoids the peeling or cracking problem caused by the difference in the thermal expansion coefficient of the materials, and ensures the overall quality and durability of the jewelry. BRIEF DESCRIPTION OF DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0032] Figure 1 The structure diagram of the gold jewelry described in the embodiment of the present application;

[0033] Figure 2 The intelligent manufacturing method flow chart of the gold jewelry described in the embodiment of the present application;

[0034] Figure 3 The method flow chart for preparing the conductive channel described in the embodiment of the present application;

[0035] Figure 4 The method flow chart for preparing the antenna structure in the conductive channel described in the embodiment of the present application;

[0036] Figure 5 This is a flowchart of the method for forming a protective layer according to an embodiment of the present invention.

[0037] Among them: 100, gold jewelry; 110, jewelry body; 111, storage space; 120, antenna structure; 130, chip; 140, protective layer; 150, necklace. Detailed Implementation

[0038] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0039] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0041] In this embodiment, a smart gold necklace with identity recognition and payment functions is designed to meet diverse user needs. The gold necklace includes a necklace 150 and a pendant portion, with the pendant connected to the necklace 150. The manufacturing method in this embodiment mainly focuses on the pendant portion, which is the gold jewelry 100 mentioned below.

[0042] Please refer to Figures 1-5 This invention provides a smart manufacturing method for gold jewelry 100, comprising:

[0043] The jewelry body 110 is manufactured using high-precision electroforming technology, with a reserved space 111 for accommodating the chip 130. Exemplarily, 99.999% pure gold is used as the material for electroforming. The jewelry body 110 is fabricated using a multi-layer electroforming process, consisting of a base layer and a functional layer. The thickness of the base layer is controlled at 0.4 mm to ensure the necklace 150 is sufficiently robust while preserving space for the antenna and chip 130. During the electroforming of the jewelry body 110, the reserved space 111 for the antenna structure 120 embedding area has a width of 0.6 mm and a depth of 0.5 mm to ensure a secure integration of the antenna structure 120 and the chip 130.

[0044] Conductive channels were fabricated using photolithography.

[0045] The antenna structure 120 is formed by depositing highly conductive metal material onto conductive channels using electroforming technology; for example, in the manufacture of the antenna structure 120, a spiral micro / nano coil structure is used, and the antenna structure 120 is made of pure gold to ensure conductivity and corrosion resistance.

[0046] The chip 130 is installed within the accommodating space 111 using micro-welding technology to form a jewelry blank; for example, the chip 130 is used to implement identity recognition and payment functions.

[0047] A protective layer 140 is coated on the outer surface of the jewelry blank to form a semi-finished jewelry product;

[0048] The semi-finished jewelry is heat-treated to form the finished jewelry. For example, the finished jewelry is the gold jewelry 100 mentioned above.

[0049] Please refer to Figure 1 , Figure 2 In one possible implementation, fabricating conductive channels using photolithography includes:

[0050] Positive photoresist is coated on a predetermined antenna area of ​​the jewelry body 110, with the coating thickness controlled within the range of 1-5 micrometers. For example, the photoresist is a photosensitive material that undergoes a chemical reaction when exposed to ultraviolet light. The positive photoresist changes from a dissolved state to an insoluble state in the exposed areas, while remaining dissolved in the unexposed areas.

[0051] A photomask with an antenna pattern is exposed to ultraviolet light, causing a chemical reaction in the unmasked portions of the positive photoresist. Specifically, the positive photoresist undergoes a cross-linking reaction under ultraviolet light, which alters the molecular structure of the exposed portions, making them insoluble in the developer. The unexposed portions remain unchanged, continuing to dissolve in the developer and be removed.

[0052] The exposed jewelry body 110 is placed in a developing solution to remove the positive photoresist from the exposed areas. Exemplarily, the developing solution contains organic solvents, alkaline solutions, and other components that effectively decompose and remove the photoresist. After ultraviolet light exposure, the photoresist is treated in the developing solution. The developing solution acts on the photoresist in the exposed areas, causing it to dissolve from the substrate surface and form conductive channels.

[0053] The exposed metal layer on the surface of the jewelry body 110 is removed using plasma dry etching or wet chemical etching techniques to form conductive channels. For example, plasma dry etching is used to remove the exposed metal surface to a depth of 5 micrometers, ensuring the formation of conductive channels for the antenna structure 120. To ensure the conductivity and signal stability of the antenna structure 120, a subsequent electroplating process is performed. Gold is used as the electroplating material, and the deposition thickness is controlled at 8 micrometers to ensure that the antenna structure 120 has good electromagnetic performance and long-term stability.

[0054] Please refer to Figure 1 , Figure 3 In one possible implementation, the etched conductive channels undergo cleaning and deoxidation treatment before electroforming. Exemplarily, cleaning and deoxidation removes impurities and oxides from the surface of the conductive channels, which, if not removed, can affect the adhesion and uniformity of the electroformed metal. Ensuring surface cleanliness improves the quality and uniformity of the electroformed layer. A clean surface enhances the adhesion between the electroformed metal and the substrate material. This is because removing obstacles that could impede direct contact between the metal and the substrate strengthens the bond between them. If contaminants or oxides are present on the conductive channel surface, bubbles or other defects may form during electroforming, affecting the electromagnetic properties of the final product. Deoxidation treatment helps avoid such defects. Oxides and other contaminants are typically non-conductive, and their presence on the conductive channels reduces overall conductivity. Cleaning and deoxidation ensure good conductivity in the conductive channels. Cleaning and deoxidation not only improves the quality of the electroforming process but also helps extend the lifespan of the final product because a good electroformed layer reduces maintenance needs and improves corrosion resistance.

[0055] Please refer to Figure 1 , Figure 4 Electroforming solution is used for deposition, and the deposition thickness is controlled within 5-10 micrometers. For example, a 2-micrometer-thick layer of positive photoresist is first coated on the antenna region of the jewelry body 110 to ensure the uniformity and flatness of the photoresist layer. Using mask exposure technology, the micro / nano coil pattern of the antenna is exposed on the photoresist layer. The linewidth of the antenna coil is 15 micrometers, and the coil spacing is 20 micrometers.

[0056] Please refer to Figure 1, Figure 4 In one possible implementation, deposition using an electroforming solution includes controlling the current density at 2-5 A / dm³ during the electroforming process. 2 The electroforming time shall not exceed 60 minutes. For example, during electroforming, a pure gold electroforming solution is used, and preferably, the current density is set to 3 A / dm³. 2 The electroforming time is set to 40 minutes to ensure a uniform coating. It is important to note that special attention should be paid to the surface smoothness and thickness control of the area embedded in the antenna to avoid affecting antenna signal transmission due to an excessively thick electroformed layer. Of course, in specific applications, the current density can also be set to 2A / dm³. 2 Or 4A / dm 2 Or 5A / dm 2 The electroforming time can also be set to 30 minutes, 40 minutes, or 50 minutes.

[0057] Please refer to Figure 1 , Figure 2 In one possible implementation, mounting the chip 130 within the accommodating space 111 to form a jewelry blank using micro-welding technology includes: connecting the chip 130 to the conductive terminals of the antenna structure 120 via electroplated gold welding, with the weld joint size controlled within 5-10 micrometers. Exemplarily, the RFID / NFC chip 130 is embedded in the accommodating space 111, and the chip 130 is connected to the antenna structure 120 via micro-welding technology. The weld joint diameter is 6 micrometers, and the electroplated gold welding process ensures that the resistance of the connection point does not exceed 2 ohms, thereby guaranteeing the reliability of signal transmission. Micro-welding technology enables extremely high precision control of the weld joint size, within the 5-10 micrometer range mentioned herein. This precise welding ensures a high degree of reliability and stability in the connection between the chip 130 and the antenna, which is crucial for maintaining long-term signal transmission performance. Micro-welding technology allows for precise control of the weld joint resistance value within the 1-5 ohm range. Low and stable resistance values ​​help reduce energy loss during signal transmission, improving the overall system efficiency and response speed. Because micro-soldering technology allows for extremely small solder joints, it enables miniaturized jewelry designs. This means that the chip 130 and antenna can be more compactly embedded within the jewelry without compromising its appearance or wearing comfort. The precise soldering process also helps to better protect the chip 130 and antenna during packaging, preventing damage caused by packaging materials or processes, thus extending the lifespan of the smart jewelry.

[0058] In a possible implementation, after welding is completed, the welding points are inspected. If the resistance value of the welding points is within the range of 1 - 5 ohms, the product is qualified. Exemplarily, after welding, a precision instrument is used to measure the resistance of the connection (i.e., the welding point) between the chip 130 and the antenna structure 120 to ensure that the resistance value is between 1 - 5 ohms. After the chip 130 is embedded, the gold jewelry 100 is inspected to ensure good electromagnetic coupling between the antenna structure 120 and the chip 130, with a reading distance of not less than 6 cm and a data transmission rate of 106 kbps supported.

[0059] Please refer to Figure 1 、 Figure 5 In a possible implementation, coating the outer surface of the jewelry embryo with a protective layer 140 includes:

[0060] Coating an epoxy resin encapsulation layer on the outer surface of the jewelry embryo, and controlling the thickness of the epoxy resin layer within 20 - 50 microns; Exemplarily, in order to protect the embedded chip 130 and antenna structure 120, epoxy resin is used for encapsulation in this embodiment. The thickness of the epoxy resin encapsulation layer is 30 microns, ensuring transparency and firmness, and effectively preventing the external environment from corroding and wearing the chip 130. The epoxy resin encapsulation layer covers the outer surface of the jewelry embryo, and its thickness is controlled within the range of 20 - 50 microns. The setting of this layer can effectively protect the internal chip 130 and antenna structure 120, preventing the external environment such as moisture, dust and other possible corrosion factors from damaging the internal electronic components. Secondly, by performing gold electroplating treatment on the outer surface of the epoxy resin, not only the protection function of the encapsulation layer is enhanced, but also the consistency in color and appearance between the encapsulated jewelry and the parent material can be ensured. This not only improves the durability and functionality of the jewelry, but also maintains the beauty and commercial value of the jewelry, achieving a perfect combination of function and aesthetics.

[0061] Performing gold electroplating treatment on the outer surface of the epoxy resin encapsulation layer, and controlling the thickness of the electroplated layer within 3 - 5 microns. Exemplarily, after the epoxy resin is cured, electroplating treatment is performed on its surface, the thickness of the electroplated layer is 4 microns, and the electroplating material is gold, which is beneficial to the appearance consistency between the encapsulated area and the main body of the necklace 150. Of course, in specific applications, the thickness of the electroplated layer can also be set to 3 microns, or 5 microns.

[0062] In one possible implementation, a nano-coating protection technique is used to form a nano-coating on the surface of the jewelry blank, with a nano-coating thickness of 10-50 nanometers. Exemplarily, the protective layer 140 includes an epoxy resin encapsulation layer, an electroplating layer, and a nano-coating sequentially disposed from the inside out. To further improve the wear resistance of the gold jewelry 100, a nano-coating technique is used to protect the surface of the necklace 150. The coating material is silica, with a thickness of 30 nanometers, exhibiting excellent waterproof, scratch-resistant, and fingerprint-resistant properties, which helps the gold jewelry 100 maintain its bright appearance during long-term wear. Of course, in specific applications, the thickness of the nano-coating can also be set to 20 nanometers or 40 nanometers.

[0063] Please refer to Figure 1 , Figure 2 In one possible implementation, heat treatment of the semi-finished jewelry includes: locally heating the area containing the chip 130 and antenna structure 120, with the heating temperature controlled within the range of 100-200°C, the heating time not exceeding 15 minutes, and the heating rate controlled at 2-5°C / minute. Exemplarily, after the chip 130 and antenna structure 120 are embedded, local heat treatment is used to strengthen the embedded area. The heat treatment temperature is controlled at 150°C, and the treatment time is 10 minutes, ensuring that the overall hardness and durability of the necklace 150 are enhanced. The heating rate is 3°C / minute, ensuring good bonding between the electroformed layer and the metal of the jewelry body 110, avoiding peeling or cracking problems caused by differences in the thermal expansion coefficients of the materials. Through heat treatment, the bonding strength between the electroformed layer and the antenna structure 120 and chip 130 is significantly improved, which is beneficial to improving the durability and electromagnetic performance of the gold jewelry 100 in actual wear. Of course, in specific applications, the heating temperature can also be set to 120°C, 180°C, or 200°C. The heating rate can also be set to 2℃ / minute, 4℃ / minute, or 5℃ / minute.

[0064] In summary, the reasons why the jewelry necklace 150 of this application can improve signal transmission efficiency and antioxidant properties can be mainly attributed to the following points:

[0065] First, high-precision antenna design: Employing a helical micro / nano coil antenna, precisely manufactured using photolithography, ensures the antenna's conductivity. Precise control of the antenna linewidth and coil spacing (10-20 micrometers and no more than 30 micrometers, respectively) optimizes high-frequency signal transmission, improves energy transfer efficiency, and sets the operating frequency to 13.56 MHz to support NFC functionality.

[0066] Second, electroforming deposition technology: High-precision electroforming deposition is performed in the conductive channels of the antenna, using gold material with a thickness controlled at 5-10 micrometers, ensuring the antenna's electromagnetic performance and oxidation resistance. Strict control of current density and electroforming time (2-5 A / dm²) is maintained.2 (And no more than 60 minutes) ensured the uniformity and good conductivity of the plating. Third, efficient connection between chip 130 and the antenna: Electroplated gold soldering technology was used to connect the RFID / NFC chip 130 to the antenna, with the solder joint size controlled within 5-10 micrometers, ensuring the reliability of the connection between chip 130 and the antenna. Furthermore, after soldering, the connection point was tested, and the resistance value remained within the range of 1-5 ohms, further ensuring the stability and efficiency of signal transmission.

[0067] Fourth, encapsulation protection: Using transparent epoxy resin as the encapsulation material with a thickness controlled at 20-50 micrometers not only provides good protection for the chip 130 and antenna area, preventing corrosion from the external environment, but also ensures that the encapsulation is consistent with the material and color of the jewelry mother body by performing gold electroplating treatment on its surface (3-5 micrometers thick), without affecting the appearance quality.

[0068] Fifth, nano-coating protection technology: The surface of gold jewelry is treated with a nano-coating, using alumina or silicon dioxide materials, with a coating thickness of 10-50 nanometers. This provides waterproof, wear-resistant, and fingerprint-resistant effects, extending the lifespan of the jewelry while maintaining its clean appearance, and indirectly improving the stability of signal transmission and oxidation resistance.

[0069] In one possible implementation, 3D modeling is performed using computer-aided design tools before processing the jewelry body 110. Exemplarily, CAD software is used to precisely model the necklace 150 as a whole, with a design focus on concealing the RFID / NFC chip 130 and antenna structure 120, ensuring a balance between functional integration and aesthetic appeal. The chip 130 is embedded in the pendant portion of the necklace 150, with a pendant thickness of 3 mm. The accommodating space 111 has a depth of 0.8 mm and a diameter of 1.2 mm, ensuring a secure embedding of the chip 130. It is understood that the accommodating space 111 can completely accommodate the chip 130, so that the gold jewelry 100, after embedding its chip 130 and antenna, does not affect the appearance of the jewelry itself. In this embodiment, the accommodating space 111 is cylindrical. Of course, in specific applications, the shape of the accommodating space 111 is not limited to this. For example, as an alternative, the shape of the accommodating space 111 can also be prismatic or elliptical cylinder, with its shape and size adapted to the size of the chip 130. The antenna is designed as a spiral micro-nano coil structure, located in the middle of the Necklace 150 chain. The chain is 2 mm wide, the antenna is 0.6 mm wide, and the length is about 5 cm, ensuring that it can effectively transmit signals and remain concealed.

[0070] The actual effect of embedding chip 130 was simulated using computer-aided design tools (such as CAM), taking into account wearing comfort, chip 130 installation location, and the spatial rationality of antenna embedding. After the final design was completed, the model was 3D printed to ensure that the size and shape of each component met the expected standards.

[0071] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the scope of protection of the present invention. Therefore, the scope of protection of this patent should be determined by the appended claims.

Claims

1. A method for intelligent manufacturing of gold jewelry, characterized in that, The application relates to a method for manufacturing a jewelry product with an embedded chip. The jewelry body is processed by high-precision electroforming technology, and a containing space for accommodating the chip is reserved; An electroconductive channel is prepared by using photoetching technology; High-conductivity metal material is deposited into the electroconductive channel to form an antenna structure by using electroforming technology; The chip is mounted in the containing space by micro-welding technology to form a jewelry embryo; The chip is connected with the electroconductive terminal of the antenna structure by gold plating welding, and the size of the welding point is controlled to be 5-10 microns; A protective layer is coated on the outer surface of the jewelry embryo to form a jewelry semi-finished product; wherein the protective layer is an epoxy resin encapsulation layer with a thickness of 20-50 microns, and the outer surface of the encapsulation layer is subjected to gold plating treatment, and the thickness of the gold plating layer is controlled to be 3-5 microns; The jewelry semi-finished product is subjected to heat treatment to form a jewelry finished product.

2. The method of intelligent manufacturing of gold jewelry as claimed in claim 1 wherein, The method comprises the following steps: Positive photoresist is coated on the predetermined antenna area of the jewelry body, and the coating thickness is controlled to be in the range of 1-5 microns; A mask plate provided with an antenna pattern is subjected to ultraviolet light exposure, so that the part of the positive photoresist not shielded by the mask is subjected to chemical reaction; The jewelry body after exposure is placed in a developing solution to remove the positive photoresist of the exposed part; The exposed part of the jewelry body is subjected to plasma dry etching or wet chemical etching to remove the metal layer of the exposed part of the jewelry body to form the electroconductive channel.

3. The method of intelligent manufacturing of gold jewellery as claimed in claim 2, wherein, The electroconductive channel after etching is subjected to cleaning and deoxidation treatment before electroforming; Deposition is performed by using electroforming liquid, and the deposition thickness is controlled to be 5-10 microns.

4. The method of intelligent manufacturing of gold jewellery as claimed in claim 3, wherein, The deposition using the electroforming solution includes: controlling the current density in the electroforming process at 2-5 A / dm 2 , and the electroforming time is not more than 60 minutes.

5. The method of intelligent manufacturing of gold jewellery as claimed in claim 1 wherein, After welding, the welding point is detected, and if the resistance value of the welding point is in the range of 1-5 ohms, the product is qualified.

6. The intelligent manufacturing method of gold jewelry as claimed in claim 1, wherein, A nano coating is formed on the surface of the jewelry embryo by using nano coating protection technology, and the thickness of the nano coating is 10-50 nanometers.

7. The method of intelligent manufacturing of gold jewellery as claimed in claim 6 wherein, The heat treatment of the jewelry semi-finished product comprises the following steps: the chip and the antenna structure area are locally heated, the heating temperature is controlled to be in the range of 100-200 DEG C, the heating time is not more than 15 minutes, and the heating rate is controlled to be 2-5 DEG C / min during heat treatment.

8. The method of intelligent manufacturing of gold jewellery as claimed in claim 1 wherein, Before the jewelry body is processed, 3D modeling design is performed by using computer-aided design tools.

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