Device and method for film hole detection and storage medium

Abstract

The invention belongs to the technical field of material detection, and particularly relates to a device and method for film hole detection and a storage medium. The device comprises an upper current-conducting plate and a lower insulating plate, the upper current-conducting plate and the lower insulating plate are used for clamping a film, and the lower insulating plate is provided with a through hole; the resistance material linearly changes along with the temperature, the resistance material is electrically connected with a conductive part towards the lower insulating plate, and the conductive part corresponds to the through hole in the lower insulating plate; when the upper conductive plate and the lower insulating plate wrap and clamp the film, part of the conductive parts respectively penetrate out of the holes of the diaphragm and are in contact with the upper conductive plate to form a closed circuit; a power supply, a voltmeter, thermometers and ammeters are arranged on the closed loop, the voltmeter is connected with the power supply in parallel, the thermometers are in contact with the resistance material, and the ammeters are connected to the conductive parts respectively. Through the specific structure and circuit design, the film hole distance can be accurately detected, and the device has the effects of accurate positioning, adaptation to different conditions, high reliability and the like.

Description

Technical Field

[0001] The present invention belongs to the technical field of material detection, and in particular relates to a device, method and storage medium for thin film hole detection. Background Art

[0002] In the field of electronics and electrical engineering, accurate hole detection of thin films made of polymer materials is a critical technology. These films are often used in electronic devices, such as lithium battery separators, and their precise manufacturing is crucial to the performance and safety of the battery. Existing detection methods mainly include physical measurement and image measurement.

[0003] The image measuring instrument is an advanced device that locates and measures holes in thin films by using a high-precision camera system and complex image processing algorithms. Although this method has high accuracy, its disadvantages are high equipment cost, complex operation and the need for specialized programming. In addition, the image measuring instrument usually requires manual intervention to select and locate the measurement points during use, which increases the complexity and time consumption of the operation.

[0004] Another common method is to use traditional tools such as rulers for direct measurement. The advantages of this method are simple equipment and low cost, but its accuracy is limited, and the measurement results are easily affected by the operator's subjective influence, which may lead to large errors and misplacement of unqualified products.

[0005] Given the limitations of existing technologies, the market urgently needs a new type of testing instrument that can meet strict testing standards and is cost-effective. This new instrument should be able to automatically perform high-precision hole size measurements and be easy to operate to reduce manual intervention and related error risks. In addition, the new technology should be able to expand to more testing functions, such as electrical performance testing, to provide a more comprehensive evaluation of material properties. Summary of the invention

[0006] 1. Technical issues to be resolved

[0007] The present invention mainly aims at the above problems and proposes a device, method and storage medium for thin film hole detection, the purpose of which is to solve the accuracy and cost problems of traditional methods.

[0008] (II) Technical solution

[0009] To achieve the above object, the present invention provides a device for thin film hole detection in a first aspect, the device comprising:

[0010] An upper conductive plate and a lower insulating plate, wherein the upper conductive plate is located above the lower insulating plate and is used to sandwich the film, and the lower insulating plate is provided with a plurality of through holes;

[0011] A resistor material, wherein the resistance of the resistor material changes linearly with temperature, the resistor material is located below the lower insulating plate, and the resistor material is electrically connected to two rows of conductive parts toward the lower insulating plate, and each conductive part in each row corresponds to a through hole on the lower insulating plate;

[0012] When the upper conductive plate and the lower insulating plate sandwich the film, some of the conductive parts in each row of the conductive parts respectively pass through the holes of the diaphragm and contact the upper conductive plate to form a closed circuit; a power supply, a voltmeter, a thermometer and a plurality of ammeters are arranged on the closed circuit, wherein the voltmeter is connected in parallel with the power supply, the thermometer is in contact with the resistance material, and the plurality of ammeters are respectively connected to one row of the conductive parts in the two rows of the conductive parts.

[0013] Furthermore, the resistor material is a platinum resistor, a nickel-chromium alloy resistor, a molybdenum-manganese resistor or a tin oxide resistor.

[0014] Furthermore, the conductive part is an elastic probe, and the diameter of the elastic probe is smaller than the diameter of the film hole.

[0015] Furthermore, the upper conductive plate is a copper plate.

[0016] To achieve the above object, the second aspect of the present invention provides a method for detecting film holes, comprising using the above-mentioned device to implement the detection method, the detection method comprising:

[0017] placing the film between an upper conductive plate and a lower insulating plate;

[0018] The diaphragm is sandwiched by an upper conductive plate and a lower insulating plate so that part of the conductive parts in each row of conductive parts respectively pass through the holes of the diaphragm and contact the upper conductive plate to form a closed circuit;

[0019] The starting current and voltage value of the main circuit are detected and obtained through the connected ammeter and voltmeter, and the real-time temperature of the resistance material is obtained through the connected thermometer;

[0020] Calculate the resistance of the resistor material according to the ammeter reading and the voltmeter reading; calculate the resistivity of the resistor material according to the real-time temperature;

[0021] The distance of the hole is calculated based on the cross-section of the resistive material being a fixed value and the calculated resistivity and resistance.

[0022] To achieve the above object, the third aspect of the present invention provides a method for measuring thermal shrinkage of a diaphragm, comprising using the above-mentioned device to implement the method, the method comprising:

[0023] Step S1, placing the film between an upper conductive plate and a lower insulating plate at a first temperature;

[0024] Step S2, sandwiching the diaphragm by the upper conductive plate and the lower insulating plate, so that part of the conductive parts in each row of conductive parts respectively pass through the holes of the diaphragm and contact the upper conductive plate to form a closed circuit;

[0025] Step S3, detecting and obtaining the starting current and voltage value of the trunk line through the connected ammeter and voltmeter, and obtaining the real-time temperature of the resistance material through the connected thermometer;

[0026] Step S4, calculating the resistance of the resistance material according to the ammeter reading and the voltmeter reading; calculating the resistivity of the resistance material according to the real-time temperature;

[0027] Step S5, calculating a first distance of the hole at a first temperature according to the cross section of the resistor material being a fixed value and the obtained resistivity and resistance;

[0028] Step S6, at a second temperature, repeating steps S1 to S5 to calculate a second distance of the holes at the second temperature;

[0029] Step S7, obtaining the thermal shrinkage of the diaphragm according to the temperature difference between the first temperature and the second temperature, and the difference between the first distance and the second distance.

[0030] Furthermore, after testing the thermal shrinkage, the current is controlled by a program, the voltage is continuously increased, the breakdown voltage value is recorded, and outputted through a display.

[0031] To achieve the above-mentioned purpose, the fourth aspect of the present invention provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method described above is implemented.

[0032] (III) Beneficial effects

[0033] Compared with the prior art, the present invention provides a device, method and storage medium for thin film hole detection. In the present invention, the configuration of the upper conductive plate and the lower insulating plate allows the thin film to be sandwiched between the two plates, and the multiple through holes on the lower insulating plate ensure that the position of each hole is accurately aligned with the corresponding conductive part on the resistor material. When the upper conductive plate and the lower insulating plate sandwich the thin film, part of the conductive part passes through the thin film hole and contacts the upper conductive plate to form a closed circuit. At this time, the distance between the two holes is equivalent to the distance between the part of the conductive part connected to the resistor material, so that the current and voltage passing through the hole can be accurately measured by an ammeter and a voltmeter. Combined with the temperature change data of the resistor material monitored by the thermometer, the distance between the two holes is calculated by the calculation formula U=IR and R=ρL / S. This method can not only improve the measurement accuracy, but also greatly reduce the equipment and operating costs, making hole detection faster, more economical and more reliable. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 This is a schematic diagram of the structure of a thin film hole detection device disclosed in this application.

[0035] Figure 2 This is a sampling flow chart of a film disclosed in this application.

[0036] Figure 3 This is a schematic diagram of the structure of a detection device disclosed in this application.

[0037] Reference numerals shown in the figure: 1. upper conductive plate; 2. lower insulating plate; 3. resistor material; 4. conductive part; 5. power supply; 6. voltmeter; 7. ammeter. DETAILED DESCRIPTION

[0038] The present invention will be described in detail below in conjunction with the accompanying drawings, and the technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] It should be noted that when a component is referred to as being "fixed to" another component, it may be directly on the other component or there may also be a component centered. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may also be a component centered. When a component is considered to be "set on" another component, it may be directly set on the other component or there may also be a component centered. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0041] See also Figure 1 As shown, the present invention provides a device for thin film hole detection. Figure 1 In the embodiment shown, the device is mainly composed of an upper conductive plate 1 and a lower insulating plate 2, wherein the upper conductive plate 1 is located on the lower insulating plate 2, and both are specifically used to clamp the film. The lower insulating plate 2 is equipped with a plurality of through holes, which are key parts for precise positioning and measurement.

[0042] The resistor material 3 is arranged below the lower insulating plate 2. The resistor material 3 is selected to have a property that its resistance value changes linearly with temperature. The resistor material 3 connects two rows of conductive parts 4, each conductive part 4 is precisely aligned with a corresponding through hole on the lower insulating plate 2.

[0043] During operation, the film is tightly sandwiched between the upper conductive plate 1 and the lower insulating plate 2. In this configuration, some of the conductive parts 4 pass through the through holes and the holes in the film and contact the upper conductive plate 1, thus forming a complete closed circuit. The entire system also includes a power supply 5, a voltmeter 6, a thermometer and multiple ammeters 7. The voltmeter 6 is connected in parallel with the power supply 5. The thermometer directly contacts the resistive material 3 to monitor its temperature changes in real time. The ammeter 7 of each conductive part 4 can accurately read the current, thereby calculating the distance of the hole.

[0044] In this embodiment, this resistor material 3 is used to form part of the circuit, which is used to measure the current intensity and voltage change passing through the material. Because the resistance value and cross-sectional area of ​​the resistor material 3 are known, other circuit parameters can be calculated by measuring the voltage across the material and the current flowing through it. When the current passes through the resistor material, the device will record the current (I) and voltage (U) at this time, and use Ohm's law U=IR to solve the resistance R; once the value of the resistor R is known, the formula R=ρL / S can be rearranged to solve L, that is, L=RS / ρ. Here S is the cross-sectional area of ​​the resistor material, and ρ is the resistivity at a given temperature. Since the temperature coefficient of resistance of the resistor material is very low, ρ can be considered as a constant or an accurate value obtained by the real-time temperature of the thermometer. The calculated distance L is the "local length" of the resistor material, which is equivalent to the distance between the holes in the diaphragm. It is then displayed through the output device of the system (such as a display).

[0045] In this embodiment, the resistor material includes but is not limited to a platinum resistor, a nickel-chromium alloy resistor, a molybdenum-manganese resistor or a tin oxide resistor, but this embodiment is not limited thereto.

[0046] In this embodiment, the conductive part is an elastic probe, the diameter of which is smaller than the diameter of the film hole, so that the elastic probe can smoothly pass through the hole and contact the upper conductive plate. Of course, it should be noted that the upper conductive plate is a copper plate or silver with very low resistance.

[0047] The present invention also provides a method for detecting film holes, which is implemented using the above-mentioned device. The detection method includes:

[0048] Step a, placing the film between the upper conductive plate and the lower insulating plate;

[0049] Step b, sandwiching the diaphragm by the upper conductive plate and the lower insulating plate, so that part of the conductive parts in each row of conductive parts respectively pass through the holes of the diaphragm and contact the upper conductive plate to form a closed circuit;

[0050] Step c, detecting and obtaining the starting current and voltage value of the trunk line through the connected ammeter and voltmeter, and obtaining the real-time temperature of the resistance material through the connected thermometer;

[0051] Step d, calculating the resistance of the resistance material according to the ammeter reading and the voltmeter reading; calculating the resistivity of the resistance material according to the real-time temperature;

[0052] Step e: calculating the distance of the hole according to the cross section of the resistor material being a fixed value and the calculated resistivity and resistance.

[0053] In this embodiment, the device may also include the following systems: a positioning system, a circuit system, a heat dissipation system, an input system, a computing system, an output system, a punching system, and a monitoring system.

[0054] Before performing hole detection on a film (diaphragm), the film must first be accurately punched or perforated. Figure 2 As shown in the sample preparation process, the perforation spacing follows the national standard of 10×10 mm. The prepared diaphragm samples are 16×16 mm squares, ensuring sufficient edge space to accommodate the clamping and testing requirements of the test device. These samples are then placed flat in the test instrument and prepared for testing.

[0055] This technical solution is suitable for testing various resistance materials and cross-sectional areas to adapt to different voltage and current conditions. Especially in the application of lithium battery separators, considering that the breakdown voltage is usually more than 1KV, and the part with holes may be broken down at 0.5KV, choosing the right voltage level is crucial to ensure the accuracy of the test.

[0056] In addition, the positioning system in the device is responsible for ensuring that each hole is accurately aligned with the corresponding position in the circuit, while the heat dissipation system uses a heat conductive plate to control the temperature change of the resistor material to prevent performance changes or measurement errors caused by temperature increase, ensuring the accuracy and reliability of the test process.

[0057] This method puts the perforated film into the instrument according to the positioning system, then closes the hatch, and sandwiches the diaphragm through the upper conductive plate and the lower insulating plate, so that part of the conductive parts in each row of conductive parts pass through the holes of the diaphragm and contact the upper conductive plate to form a closed circuit, and then the system conducts electricity according to a fixed voltage and a fixed current. Since the diaphragm of the polymer material has the property of non-conductivity, only the punched position can be energized. Then the built-in circuit forms a loop. The connected ammeter and voltmeter are tested. The starting current and voltage through the main circuit are obtained. Inside is a resistor material with a fixed cross-section. This material has a very low temperature coefficient of resistance, and the resistance changes linearly with temperature. The thermometer on the resistance meter returns the real-time temperature of the resistor in real time. Then the CPU will calculate the resistivity of the material at this temperature. In the parallel structure of the circuit, after the ammeter reading of the resistor material branch is obtained, the voltage value of the resistor material side can be known through the voltmeter of the other branch. The length can be calculated using the formula. U=IR and R=ρL / S are calculated. It can be known that L=RS / ρ. Calculate the distance L between the two holes and display it on the monitor using the output system.

[0058] The present invention also provides a method for measuring thermal shrinkage of a diaphragm, comprising using the above-mentioned device to implement the method, the method comprising:

[0059] Step S1, placing the film between an upper conductive plate and a lower insulating plate at a first temperature;

[0060] Step S2, sandwiching the diaphragm by the upper conductive plate and the lower insulating plate, so that part of the conductive parts in each row of conductive parts respectively pass through the holes of the diaphragm and contact the upper conductive plate to form a closed circuit;

[0061] Step S3, detecting and obtaining the starting current and voltage value of the trunk line through the connected ammeter and voltmeter, and obtaining the real-time temperature of the resistance material through the connected thermometer;

[0062] Step S4, calculating the resistance of the resistance material according to the ammeter reading and the voltmeter reading; calculating the resistivity of the resistance material according to the real-time temperature;

[0063] Step S5, calculating a first distance of the hole at a first temperature according to the cross section of the resistor material being a fixed value and the obtained resistivity and resistance;

[0064] Step S6, at a second temperature, repeating steps S1 to S5 to calculate a second distance of the holes at the second temperature;

[0065] Step S7, obtaining the thermal shrinkage of the diaphragm according to the temperature difference between the first temperature and the second temperature, and the difference between the first distance and the second distance.

[0066] In this embodiment, after testing the thermal shrinkage, the current can be controlled by a program, and then the voltage can be continuously increased. After the diaphragm is broken down, the voltage value is recorded, and then the breakdown voltage is output on a display.

[0067] like Figure 3 As shown, the device can be used to measure the hole distance of multiple films simultaneously and detect electrical weak points. Figure 3 There are nine separate measurement circuits that can detect nine films. The dotted part is the resistor and wiring placement position, which is implemented as a partition to divide the test area into 9 areas. Each area is 15*15. The resistors and lines in each area are separate and not connected. In the weak point detection section, by increasing the voltage to the preset threshold, the voltage point at which the film breaks down is monitored. This point is the weak point of the film, and the breakdown voltage is recorded. All test results will be displayed on the monitor for technicians to analyze and record; evaluate the weak point data of the film to determine whether the film meets the safety standards for electrical applications.

[0068] The present invention also provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method described above is implemented.

[0069] The present application implements all or part of the processes in the above-mentioned embodiment method, which can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a computer-readable storage medium. When the computer program is executed by the processor, the steps of each of the above-mentioned method embodiments can be implemented. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may at least include: any entity or device capable of carrying the computer program code to an electronic device, a recording medium, a computer memory, a read-only memory (ROM), a random access memory (RAM), an electric carrier signal, a telecommunication signal, and a software distribution medium. For example, a USB flash drive, a mobile hard disk, a magnetic disk or an optical disk.

[0070] Those of ordinary skill in the art will appreciate that the devices and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0071] In the embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interface, indirect coupling or communication connection of devices, which can be electrical, mechanical or other forms.

[0072] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A device for thin film hole detection, characterized in that: The device comprises: An upper conductive plate and a lower insulating plate, wherein the upper conductive plate is located above the lower insulating plate and is used to sandwich the film, and the lower insulating plate is provided with a plurality of through holes; A resistor material, wherein the resistance of the resistor material changes linearly with temperature, the resistor material is located below the lower insulating plate, and the resistor material is electrically connected to two rows of conductive parts toward the lower insulating plate, and each conductive part in each row corresponds to a through hole on the lower insulating plate; When the upper conductive plate and the lower insulating plate sandwich the film, some of the conductive parts in each row of the conductive parts respectively pass through the holes of the diaphragm and contact the upper conductive plate to form a closed circuit; a power supply, a voltmeter, a thermometer and a plurality of ammeters are arranged on the closed circuit, wherein the voltmeter is connected in parallel with the power supply, the thermometer is in contact with the resistance material, and the plurality of ammeters are respectively connected to one row of the conductive parts in the two rows of the conductive parts.

2. The device for thin film hole detection according to claim 1, characterized in that: The resistor material is a platinum resistor, a nickel-chromium alloy resistor, a molybdenum-manganese resistor or a tin oxide resistor.

3. The device for thin film hole detection according to claim 1, characterized in that: The conductive part is an elastic probe, and the diameter of the elastic probe is smaller than the diameter of the film hole.

4. The device for thin film hole detection according to claim 1, characterized in that: The upper conductive plate is a copper plate.

5. A method for detecting film holes, characterized in that: The detection method is implemented by using the device according to any one of claims 1 to 4, and the detection method comprises: placing the film between an upper conductive plate and a lower insulating plate; The diaphragm is sandwiched by an upper conductive plate and a lower insulating plate so that part of the conductive parts in each row of conductive parts respectively pass through the holes of the diaphragm and contact the upper conductive plate to form a closed circuit; The starting current and voltage value of the main circuit are detected and obtained through the connected ammeter and voltmeter, and the real-time temperature of the resistance material is obtained through the connected thermometer; Calculate the resistance of the resistor material according to the ammeter reading and the voltmeter reading; calculate the resistivity of the resistor material according to the real-time temperature; The distance of the hole is calculated based on the cross-section of the resistive material being a fixed value and the calculated resistivity and resistance.

6. A method for measuring thermal shrinkage of a diaphragm, characterized in that: The method comprises using the device according to any one of claims 1 to 4 to implement the method, the method comprising: Step S1, placing the film between an upper conductive plate and a lower insulating plate at a first temperature; Step S2, sandwiching the diaphragm by the upper conductive plate and the lower insulating plate, so that part of the conductive parts in each row of conductive parts respectively pass through the holes of the diaphragm and contact the upper conductive plate to form a closed circuit; Step S3, detecting and obtaining the starting current and voltage value of the trunk line through the connected ammeter and voltmeter, and obtaining the real-time temperature of the resistance material through the connected thermometer; Step S4, calculating the resistance of the resistance material according to the ammeter reading and the voltmeter reading; calculating the resistivity of the resistance material according to the real-time temperature; Step S5, calculating a first distance of the hole at a first temperature according to the cross section of the resistor material being a fixed value and the obtained resistivity and resistance; Step S6, at a second temperature, repeating steps S1 to S5 to calculate a second distance of the holes at the second temperature; Step S7, obtaining the thermal shrinkage of the diaphragm according to the temperature difference between the first temperature and the second temperature, and the difference between the first distance and the second distance.

7. A method for measuring thermal shrinkage of a diaphragm according to claim 6, characterized in that: After testing the thermal shrinkage, use the program to control the current, continuously increase the voltage, record the breakdown voltage value, and output it through the display.

8. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the method according to claim 5 or 6 is implemented.

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