GIS withstand voltage test breakdown point positioning method and system based on acousto-optic-electric fusion

Abstract

The invention discloses a GIS withstand voltage test breakdown point positioning method and system based on sound-light-electricity fusion, and relates to the technical field of high-voltage tests, and the method comprises the following steps: extracting all triggered signals of a high-frequency sensor, an ultrasonic sensor and an optical sensor when a GIS withstand voltage test is broken down; evaluating all the extracted trigger signals according to amplitude distribution and time delay logic, and reading the time delay of each ultrasonic signal; according to the time delay, the GIS is regarded as a linear structure, and the position of a breakdown point is determined. According to the method, high-frequency earth current and optical pulse which are high in credibility and difficult in positioning calculation are combined with ultrasonic waves which are simple in sampling and large in interference, and signals which are related to withstand voltage test breakdown and can be used for positioning calculation are extracted through analysis and comparison of amplitude distribution and time delay logic of physical quantities such as the ultrasonic waves, the optical pulse and the high-frequency earth current. Interference signals are removed, and breakdown points are accurately positioned through sound-light-electricity time delay calculation of effective signals.

Description

Technical Field

[0001] The present invention relates to the technical field of high voltage testing, and in particular to a method and system for locating breakdown points of a GIS withstand voltage test by integrating sound, light and electricity. Background Art

[0002] AC withstand voltage test is an important test to check the design, manufacturing and installation level of GIS and determine whether the insulation strength of GIS meets the requirements for commissioning. During the GIS withstand voltage test, breakdown discharge caused by equipment insulation defects often occurs. In order to improve test efficiency, repair faulty equipment as soon as possible, reduce maintenance workload, and avoid repeated pressurization as much as possible, it is very necessary to find the GIS breakdown point in a timely and accurate manner.

[0003] Over the past decade, various types of technologies and devices for GIS withstand voltage test breakdown positioning have been developed at home and abroad. Representative methods and devices include multi-point ultrasonic amplitude positioning, multi-point ultrasonic time delay positioning, acoustic and electrical joint positioning, and multi-point acoustic signal positioning. These methods and devices have promoted the GIS withstand voltage test breakdown positioning point search method from inefficient and extensive means such as "listening to the sound to identify the position", repeated pressurization of changing states, detection of gas decomposition products of each gas chamber, and disassembly inspection of multiple gas chambers to scientific calculation and accurate positioning. However, from a large number of field application experiences, the existing positioning technology still has a considerable probability of missed detection or misjudgment, which affects the equipment maintenance and test efficiency. Breakdown point positioning carried out by acoustic signals, regardless of the frequency band of the acoustic signal, may cause abnormal acoustic signals in some non-breakdown point areas due to oscillation superposition or refraction and reflection in the special structure of the GIS tubular cavity, resulting in the misjudgment that the breakdown point is located in this area. Breakdown point positioning carried out by high-frequency electrical signals, due to the uncertainty of the signal transmission path, coupled with the fact that the fixed measuring point often results in limited signals that can only be collected, the positioning effect is not good in actual applications. The existing combined acoustic and electrical positioning technology reduces the probability of misjudgment through comprehensive judgment of electrical and acoustic signals, but still has not proposed an identification method for the ultrasonic signals generated by oscillation superposition or refraction and reflection in the breakdown area. The positioning accuracy may be affected because non-breakdown related signals are judged as breakdown related signals.

[0004] Therefore, it is urgent to design a method and system for locating the breakdown point of a GIS withstand voltage test that integrates sound, light and electricity. Summary of the invention

[0005] The present invention aims to solve the problems in the prior art that the acoustic signal interference generated by the breakdown of the GIS withstand voltage test is large, the high-frequency signal transmission path is uncertain and difficult to collect, which may lead to the breakdown location missing the breakdown point or misjudging the breakdown point. The present invention aims to provide a GIS withstand voltage test breakdown point positioning method and system that integrates acoustic, optical and electrical fusion, which combines the high-frequency ground current and light pulses that have high credibility but are difficult to locate and calculate with the ultrasonic wave that is simple to sample but has large interference. Through the analysis and comparison of the amplitude distribution and delay logic of physical quantities such as ultrasonic waves, light pulses, and high-frequency ground currents, signals related to the withstand voltage test breakdown and that can be used for positioning calculations are extracted, the interference signals are removed, and then the breakdown point is accurately located through the acoustic, optical and electrical delay calculation of the effective signal.

[0006] The present invention is achieved through the following technical solutions:

[0007] The method for locating the breakdown point of the GIS withstand voltage test by integrating sound, light and electricity includes the following steps:

[0008] Connect the high-frequency sensor to the GIS grounding copper busbar through the core, install the ultrasonic sensor on the outer surface of the GIS metal shell, and install the optical sensor on the GIS observation window;

[0009] Then, during the GIS withstand voltage test, all high-frequency sensor, ultrasonic sensor and optical sensor signals are synchronously collected at a sampling rate of no less than A MS / s;

[0010] When the GIS withstand voltage test breaks down, all triggered high-frequency sensor, ultrasonic sensor and optical sensor signals are extracted, and all extracted trigger signals are evaluated according to amplitude distribution and delay logic, and several trigger signals related to the GIS withstand voltage test breakdown and can be used for positioning calculation are selected;

[0011] Among all the trigger signals, read the time delay between each ultrasonic signal and the high-frequency ground current signal, or the time delay between each ultrasonic signal and the optical pulse signal;

[0012] Based on the time delay, the GIS is considered as a linear structure and the breakdown point is located.

[0013] A further solution is that the specific steps of evaluating all the extracted trigger signals according to the amplitude distribution and the time delay logic and selecting several trigger signals associated with the breakdown of the GIS withstand voltage test and capable of being used for positioning calculation include:

[0014] List the signal amplitudes detected by all high-frequency sensors, ultrasonic sensors and optical sensors;

[0015] Find the peak points of all trigger signals of various sensors in the list;

[0016] Mark the area where the peak points of various trigger signals are located. If the ultrasonic signal peak and the high-frequency ground current signal peak are triggered at the same interval or the same section of bus, or the ultrasonic signal peak and the optical pulse signal peak are triggered at the same time, select the corresponding signal triggered by the interval or the section of bus as the trigger signal related to the breakdown of this GIS withstand voltage test;

[0017] Finally, in this interval or this section of busbar, the time delay between the ultrasonic signal peak and the high-frequency ground current signal peak related to the breakdown of this GIS withstand voltage test, or the time delay between the ultrasonic signal peak and the optical pulse signal peak is obtained.

[0018] In a further embodiment, the signal amplitudes of all the ultrasonic sensors are listed as A S ={A S1 , A S2 , ..., A S(i-1) , A Si , A S(i+1)、 ....A SM}, M is the number of ultrasonic sensors arranged on the GIS during this withstand voltage test;

[0019] The signal amplitudes detected by all the high frequency sensors are listed as A H ={A H1 , A H2 , ..., A H(j-1) , A Hj , A H(j+1) ,....A HN}, N is the number of high-frequency sensors arranged on the GIS during this withstand voltage test;

[0020] The signal amplitudes detected by all the optical sensors are listed as A L ={A L1 , A L2 , ..., A L(k-1) , A Lk , A L(k+1)、 ....A LP}, P is the number of optical sensors arranged on the GIS during this withstand voltage test.

[0021] In a further solution, for ultrasonic sensors, high-frequency sensors and optical sensors that do not trigger abnormal signals, the detection signal amplitude is recorded as 0.

[0022] A further solution, the ultrasonic signal peak point A Si Satisfies the expression: A Si -A S(i-1) >0 and A Si -A S(i+1) >0, high frequency ground current signal peak point A HjSatisfies the expression: A Hj -A H(j-1) >0 and A Hj -A H(j+1) >0, optical pulse signal peak point A Lk Satisfies the expression: A Lk -A L(k-1) >0 and A Lk -A L(k+1) >0.

[0023] In a further solution, the time delay between the peak value of the ultrasonic signal and the peak value of the high-frequency ground current signal is expressed as: Δt (Si，Hj) ≥Δt [S(i-1)，Hj] And Δt (Si，Hj) ≥Δt [S(i+1)，Hj] , judge number S (i-1) 、Si、S (i+1) The ultrasonic signal triggered by the ultrasonic sensor and the high-frequency ground current signal triggered by the high-frequency sensor numbered Hj are delayed for positioning calculation;

[0024] The time delay between the peak value of the ultrasonic signal and the peak value of the optical pulse signal is expressed as: Δt (Si，Lk) ≥Δt [S(i-1)，Lk] And Δt (Si，Hj) ≥Δt [S(i+1)，Lk] , judge number S (i-1) 、Si、S (i+1) The time delay between the ultrasonic signal triggered by the ultrasonic sensor numbered Lk and the optical pulse signal triggered by the optical sensor numbered Lk is used for positioning calculation.

[0025] In a further solution, the specific steps of treating the GIS as a linear structure and determining the location of the breakdown point according to the time delay include:

[0026] Calculate the distance between the breakdown point and each ultrasonic sensor according to the time delay between each ultrasonic signal and the high-frequency ground current signal, or the time delay between each ultrasonic signal and the optical pulse signal;

[0027] When the distances between two or more ultrasonic sensors and the breakdown point in the same area are obtained, the location of the breakdown point can be directly determined by considering the GIS as a linear structure.

[0028] A further solution is that if only one ultrasonic sensor triggers a breakdown-related ultrasonic signal in the same area, several suspected breakdown point locations are provided according to the distance between the breakdown point and the ultrasonic sensor.

[0029] A further solution is to calculate the distance between the breakdown point and each ultrasonic sensor as follows:

[0030] L si =v s ×Δtsi ;

[0031] Where, L si is the distance between the ultrasonic sensor numbered Si and the breakdown point, △t si The ultrasonic signal triggered by the ultrasonic sensor numbered Si is related to the breakdown and can be used to locate the time delay of the high-frequency ground current signal or optical pulse signal.

[0032] As a further solution, the present invention also provides a GIS withstand voltage test breakdown point positioning system integrating acoustic, optical and electrical properties, comprising:

[0033] A sensor module, wherein the sensor module includes a plurality of ultrasonic sensors, high-frequency sensors and optical sensors, wherein the ultrasonic sensors, high-frequency sensors and optical sensors are used to detect ultrasonic signals, high-frequency ground current signals and optical pulse signals generated during the breakdown of the GIS withstand voltage test, respectively; the high-frequency sensor is connected to the GIS grounding copper busbar by a through-hole method, the ultrasonic sensor is arranged on the outer surface of the GIS metal shell, and the optical sensor is arranged on the GIS observation window;

[0034] The acquisition module includes a plurality of channels, and synchronously acquires all high-frequency sensor, ultrasonic sensor and optical sensor signals at a sampling rate not less than A MS / s;

[0035] The analysis module is used to evaluate the amplitude distribution and delay logic of the ultrasonic signal, high-frequency ground current signal and optical pulse signal generated when the GIS withstand voltage test is broken down, extract the trigger signal related to the GIS withstand voltage test breakdown and can be used for positioning calculation, and on this basis calculate and give the breakdown point position.

[0036] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0037] 1. The present invention provides a method and system for locating the breakdown point of a GIS withstand voltage test by integrating acoustic, optical and electrical signals. The method collects ultrasonic signals, optical pulse signals and high-frequency ground current signals generated during the GIS withstand voltage test breakdown, evaluates all trigger signals through amplitude distribution and time delay logic, quantifies and selects signals related to the GIS withstand voltage test breakdown and that can be used for positioning calculation, excludes interference signals that are irrelevant to the test breakdown or have waveform distortion, and utilizes the principle that the propagation speed of high-frequency ground current and optical pulses is several orders of magnitude higher than that of ultrasonic waves. During collection, the high-frequency ground current and optical pulse signals can be considered to be equivalent to ultrasonic signals that arrive instantaneously, thereby accurately reading the acoustic, optical and electrical signal delay with high resolution used for positioning calculation, and accurately calculating the breakdown point position, greatly reducing the probability of breakdown positioning failure due to missed detection and misjudgment.

[0038] 2. The present invention provides a method and system for locating the breakdown point of a GIS withstand voltage test by integrating acoustic, optical and electrical signals. The method integrates and analyzes the acoustic, optical and electrical signals at multiple points generated during the breakdown of the GIS withstand voltage test, thereby maximizing the accuracy and reliability of breakdown positioning. Even if only one effective ultrasonic signal is triggered, positioning calculations can be performed. The sampling rate required for the system to collect the time delay of acoustic signals and electro-optical signals is not high, and the computing power required to judge the validity of the signal and locate the signal is not high, thus taking into account both applicability and economy. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and should not be regarded as limiting the scope. For those of ordinary skill in the art, other relevant drawings can be obtained based on these drawings without creative work. In the drawings:

[0040] Figure 1 A schematic diagram of the process flow of the method for locating the breakdown point of a GIS withstand voltage test by integrating sound, light and electricity provided by the present invention;

[0041] Figure 2 A schematic diagram of the arrangement of sensors for the breakdown section of the GIS withstand voltage test provided by the present invention;

[0042] Figure 3 A schematic diagram of the signals collected during the breakdown of the GIS withstand voltage test and the time delay reading provided by the present invention;

[0043] Figure 4 A schematic diagram of the breakdown position location result of the GIS withstand voltage test provided by the present invention;

[0044] Figure 5 Schematic diagram of the GIS voltage withstand test breakdown point positioning system integrating sound, light and electricity provided by the present invention. DETAILED DESCRIPTION

[0045] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with embodiments and drawings. The exemplary embodiments of the present invention and their description are only used to explain the present invention and are not intended to limit the present invention.

[0046] Embodiment 1:

[0047] This embodiment 1 provides a method for locating the breakdown point of a GIS withstand voltage test by integrating sound, light and electricity. Figure 1 As shown, including:

[0048] S1. Connect the high-frequency sensor to the grounding copper bar of the GIS under test through the core. Apply coupling agent to the ultrasonic sensor and stick it close to the outer surface of the GIS metal shell. Put the optical sensor close to the GIS observation window. Number all high-frequency sensors, ultrasonic sensors and optical sensors according to their positions and connect them to the collection device under unified control.

[0049] The specific steps are:

[0050] S1.1. Connect the high-frequency sensor to the grounding copper bar of the circuit breaker, disconnector, voltage transformer, lightning arrester, incoming and outgoing line branches, busbar and other equipment of the tested GIS through the core penetration method;

[0051] S1.2. Apply coupling agent to the ultrasonic sensor and place it close to the outer surface of the metal shell of the GIS circuit breaker, disconnector, voltage transformer, lightning arrester, incoming and outgoing line branches, busbar and other equipment. The distance between each measuring point of the ultrasonic sensor of the incoming and outgoing line branches, busbar and other equipment should not be less than 10 meters;

[0052] S1.3. Place the optical sensor close to the observation window of the GIS disconnector, earthing switch and other equipment. If other equipment is also equipped with an observation window, the optical sensor should also be installed;

[0053] S1.4. Connect all installed high-frequency sensors, ultrasonic sensors and optical sensors to a collection device under unified control.

[0054] Figure 2 This is a schematic diagram of the sensor layout of the breakdown section of a GIS withstand voltage test. It can be seen that ultrasonic sensors are installed on the disconnector, current transformer and circuit breaker, and are named ultrasonic sensor S1, ultrasonic sensor S2, ultrasonic sensor S3, ultrasonic sensor S4 and ultrasonic sensor S5. A high-frequency sensor is installed on the grounding copper busbar of the circuit breaker mechanism box, and is named high-frequency sensor H1.

[0055] S2. During the GIS withstand voltage test, the acquisition device shall synchronously collect all high-frequency sensor, ultrasonic sensor and optical sensor signals at a sampling rate not less than A MS / s; A is 10.

[0056] S3. When the GIS withstand voltage test is broken down, the high-frequency ground current signal collected by each triggered high-frequency sensor, the light pulse signal collected by each optical sensor, and the ultrasonic signal collected by each ultrasonic sensor are extracted.

[0057] S4. Evaluate all the extracted trigger signals according to the amplitude distribution and delay logic, and select the trigger signals that are related to the breakdown of the GIS withstand voltage test and can be used for positioning calculation.

[0058] The specific steps are:

[0059] S4.1. After the GIS withstand voltage breakdown discharge, list the signal amplitudes detected by all ultrasonic sensors to obtain A S ={A S1 , A S2 , ..., A S(i-1) , A Si , A S(i+1)、 ....A SM}, M is the number of ultrasonic sensors arranged on the GIS during this withstand voltage test, and the signal amplitudes detected by all high-frequency sensors are listed to obtain A H ={A H1 , A H2 , ..., A H(j-1) , A Hj , A H(j+1) ,....A HN}, N is the number of high-frequency sensors arranged on the GIS during this withstand voltage test, and the signal amplitudes detected by all optical sensors are listed to obtain A L ={A L1 , A L2 , ..., A L(k-1) , A Lk , A L(k+1)、 ....A LP}, P is the number of optical sensors arranged on the GIS during this withstand voltage test. For ultrasonic sensors, high-frequency sensors and optical sensors that do not trigger abnormal signals, the detection signal amplitude is recorded as 0;

[0060] S4.2. Find the peak points of all trigger signals of various sensors, the peak point A of ultrasonic signal Si Satisfies the expression: A Si -A S(i-1) >0 and A Si -A S(i+1) >0, high frequency ground current signal peak point A Hj Satisfies the expression: A Hj -A H(j-1) >0 and A Hj -A H(j+1) >0, optical pulse signal peak point A Lk Satisfies the expression: A Lk -A L(k-1) >0 and A Lk -A L(k+1) >0;

[0061] S4.3. Mark the area where the peak points of various signals are located. If the same interval or the same section of busbar triggers the ultrasonic signal peak and the high-frequency ground current signal peak at the same time, or the ultrasonic signal peak and the optical pulse signal peak at the same time, select the corresponding signal triggered by the interval or the section of busbar as the trigger signal related to the breakdown of this GIS withstand voltage test;

[0062] S4.4. Read the time delay between the peak value of the ultrasonic signal and the peak value of the high-frequency ground current signal or the peak value of the optical pulse signal related to the breakdown of the GIS withstand voltage test in the same interval or the same section of the busbar. The acoustic and electrical signal delay satisfies the expression: Δt (Si，Hj) ≥Δt [S(i-1)，Hj] And Δt (Si，Hj) ≥Δt [S(i+1)，Hj] , judge number S (i-1) 、Si、S (i+1) The time delay between the ultrasonic signal triggered by the ultrasonic sensor and the high-frequency ground current signal triggered by the high-frequency sensor numbered Hj can be used for positioning calculation. The acoustic and optical signal delay satisfies the expression: Δt (Si，Lk) ≥Δt [S(i-1)，Lk] And Δt (Si，Hj) ≥Δt [S(i+1)，Lk] , judge number S (i-1) 、Si、S (i+1) The time delay between the ultrasonic signal triggered by the ultrasonic sensor and the optical pulse signal triggered by the optical sensor numbered Lk can be used for positioning calculation.

[0063] S5. Read the time delay of each breakdown-related ultrasonic signal that can be used for positioning calculation and the high-frequency ground current signal or optical pulse signal that can be used for positioning calculation. Each time delay is the time it takes for the ultrasonic signal at the breakdown point to be transmitted to the ultrasonic sensor.

[0064] Figure 3 It is a schematic diagram of the signal and delay reading collected during the breakdown of a certain GIS withstand voltage test. It can be seen that when the GIS withstand voltage test was broken down, the high-frequency sensor H1 triggered a signal, the ultrasonic sensors S1 and S2 triggered signals, and other sensors in the area did not trigger signals. The time delay between the ultrasonic sensor S1 trigger signal and the high-frequency sensor H1 trigger signal was about 32.8ms, and the time delay between the ultrasonic sensor S2 trigger signal and the high-frequency sensor H1 trigger signal was about 15ms. All of them were selected as trigger signals related to the breakdown of this GIS withstand voltage test and can be used for positioning calculations.

[0065] S6. According to the time when the ultrasonic signal at the breakdown point is transmitted to each ultrasonic sensor, the tested GIS is regarded as a linear structure and the breakdown point position is calculated.

[0066] The specific steps are:

[0067] S6.1. Calculate the distance between the breakdown point and each ultrasonic sensor according to the time delay between each breakdown-related ultrasonic signal that can be used for positioning calculation and the breakdown-related high-frequency ground current signal or optical pulse signal that can be used for positioning calculation. The expression is: L si =v s ×Δt si , where L si is the distance between the ultrasonic sensor numbered Si and the breakdown point, △t si The ultrasonic signal triggered by the ultrasonic sensor numbered Si is related to the breakdown and can be used for the time delay of the high-frequency ground current signal or optical pulse signal for positioning calculation;

[0068] S6.2, if the distances between two or more ultrasonic sensors and the breakdown point in the same area are obtained, the location of the breakdown point can be directly determined by treating the GIS as a linear structure;

[0069] S6.3. If only one ultrasonic sensor triggers a breakdown-related ultrasonic signal in the same area, the breakdown point cannot be accurately located. Instead, several suspected breakdown point locations are provided based on the distance between the breakdown point and the ultrasonic sensor.

[0070] Figure 4 This is a schematic diagram of the results of locating the breakdown position of a GIS pressure test. It is calculated that the breakdown point is about 5.25 meters away from the ultrasonic sensor S1, and the breakdown point is about 2.4 meters away from the ultrasonic sensor S2. The distance between the ultrasonic sensor S1 and the ultrasonic sensor S2 is about 7.7 meters, indicating that the breakdown point is located between the ultrasonic sensor S1 and the ultrasonic sensor S2.

[0071] Example 2

[0072] This embodiment 2 also provides a GIS withstand voltage test breakdown point positioning system integrating sound, light and electricity, such as Figure 5 As shown, the method for locating the breakdown point of the GIS withstand voltage test by implementing the aforementioned acoustic, optical and electrical integration includes:

[0073] The sensor module is composed of a plurality of ultrasonic sensors, high-frequency sensors and optical sensors, and is used to detect ultrasonic signals, high-frequency ground current signals and optical pulse signals generated when the GIS withstand voltage test is broken down.

[0074] The acquisition module has multiple channels and is used to synchronously acquire all high-frequency sensor, ultrasonic sensor and optical sensor signals at a sampling rate not less than A MS / s.

[0075] The analysis module is used to evaluate the amplitude distribution and delay logic of the ultrasonic signal, high-frequency ground current signal and optical pulse signal generated when the GIS withstand voltage test is broken down, extract the trigger signal related to the GIS withstand voltage test breakdown and can be used for positioning calculation, and on this basis calculate and give the breakdown point position.

[0076] The specific implementation methods described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A method for locating breakdown points of GIS withstand voltage test by integrating acoustics, photoelectricity and other elements, characterized in that: The following steps are involved: Connect the high-frequency sensor to the GIS grounding copper busbar through the core, install the ultrasonic sensor on the outer surface of the GIS metal shell, and install the optical sensor on the GIS observation window; Then, during the GIS withstand voltage test, all high-frequency sensor, ultrasonic sensor and optical sensor signals are synchronously collected at a sampling rate of no less than A MS / s; When the GIS withstand voltage test breaks down, all triggered high-frequency sensor, ultrasonic sensor and optical sensor signals are extracted, and all extracted trigger signals are evaluated according to amplitude distribution and delay logic, and several trigger signals related to the GIS withstand voltage test breakdown and can be used for positioning calculation are selected; Among all the trigger signals, read the time delay between each ultrasonic signal and the high-frequency ground current signal, or the time delay between each ultrasonic signal and the optical pulse signal; Based on the time delay, the GIS is considered as a linear structure and the breakdown point is located.

2. The method for locating the breakdown point of the GIS withstand voltage test by integrating sound, light and electricity according to claim 1 is characterized in that: The specific steps of evaluating all the extracted trigger signals according to the amplitude distribution and the time delay logic and selecting several trigger signals associated with the breakdown of the GIS withstand voltage test and capable of being used for positioning calculation include: List the signal amplitudes detected by all high-frequency sensors, ultrasonic sensors and optical sensors; Find the peak points of all trigger signals of various sensors in the list; Mark the area where the peak points of various trigger signals are located. If the ultrasonic signal peak and the high-frequency ground current signal peak are triggered at the same interval or the same section of bus, or the ultrasonic signal peak and the optical pulse signal peak are triggered at the same time, select the corresponding signal triggered by the interval or the section of bus as the trigger signal related to the breakdown of this GIS withstand voltage test; Finally, in this interval or this section of busbar, the time delay between the ultrasonic signal peak and the high-frequency ground current signal peak related to the breakdown of this GIS withstand voltage test, or the time delay between the ultrasonic signal peak and the optical pulse signal peak is obtained.

3. The method for locating the breakdown point of the GIS withstand voltage test by integrating sound, light and electricity according to claim 2 is characterized in that: The signal amplitudes of all the ultrasonic sensors are listed as A S ={A S1 , A S2 , ..., A S(i-1) , A Si , A S(i+1)、 ....A SM }, M is the number of ultrasonic sensors arranged on the GIS during this withstand voltage test; The signal amplitudes detected by all the high frequency sensors are listed as A H ={A H1 , A H2 , ..., A H(j-1) , A Hj , A H(j+1) ,....A HN }, N is the number of high-frequency sensors arranged on the GIS during this withstand voltage test; The signal amplitudes detected by all the optical sensors are listed as A L ={A L1 , A L2 , ..., A L(k-1) , A Lk , A L(k+1)、 ....A LP }, P is the number of optical sensors arranged on the GIS during this withstand voltage test.

4. The method for locating the breakdown point of the GIS withstand voltage test by integrating sound, light and electricity according to claim 3 is characterized in that: For ultrasonic sensors, high-frequency sensors, and optical sensors that do not trigger abnormal signals, the detection signal amplitude is recorded as 0.

5. The method for locating the breakdown point of the GIS withstand voltage test by integrating sound, light and electricity according to claim 3 is characterized in that: Ultrasonic signal peak point A Si Satisfies the expression: A Si -A S(i-1) >0 and A Si -A S(i+1) >0, high frequency ground current signal peak point A Hj Satisfies the expression: A Hj -A H(j-1) >0 and A Hj -A H(j+1) >0, optical pulse signal peak point A Lk Satisfies the expression: A Lk -A L(k-1) >0 and A Lk -A L(k+1) >0.

6. The method for locating the breakdown point of the GIS withstand voltage test by integrating sound, light and electricity according to claim 5 is characterized in that: The time delay between the peak value of the ultrasonic signal and the peak value of the high-frequency ground current signal is expressed as: Δt (Si，Hj) ≥Δt [S(i-1)，Hj] And Δt (Si，Hj) ≥Δt [S(i+1)，Hj] , judge number S (i-1) 、Si、S (i+1) The ultrasonic signal triggered by the ultrasonic sensor and the high-frequency ground current signal triggered by the high-frequency sensor numbered Hj are delayed for positioning calculation; The time delay between the peak value of the ultrasonic signal and the peak value of the optical pulse signal is expressed as: Δt (Si，Lk) ≥Δt [S(i-1)，Lk] And Δt (Si，Hj) ≥Δt [S(i+1)，Lk] , judge number S (i-1) 、Si、S (i+1) The time delay between the ultrasonic signal triggered by the ultrasonic sensor numbered Lk and the optical pulse signal triggered by the optical sensor numbered Lk is used for positioning calculation.

7. The method for locating breakdown points of GIS withstand voltage test by integrating sound, light and electricity according to claim 1 is characterized in that: The specific steps of considering GIS as a linear structure and determining the location of the breakdown point according to the time delay include: Calculate the distance between the breakdown point and each ultrasonic sensor according to the time delay between each ultrasonic signal and the high-frequency ground current signal, or the time delay between each ultrasonic signal and the optical pulse signal; When the distances between two or more ultrasonic sensors and the breakdown point in the same area are obtained, the location of the breakdown point can be directly determined by considering the GIS as a linear structure.

8. The method for locating the breakdown point of the GIS withstand voltage test by integrating sound, light and electricity according to claim 7 is characterized in that: If only one ultrasonic sensor triggers a breakdown-related ultrasonic signal in the same area, several suspected breakdown point locations are provided according to the distance between the breakdown point and the ultrasonic sensor.

9. The method for locating breakdown points of GIS withstand voltage test by integrating sound, light and electricity according to claim 7 is characterized in that: The formula for calculating the distance between the breakdown point and each ultrasonic sensor is: L si =v s ×Δt si ; Where, L si is the distance between the ultrasonic sensor numbered Si and the breakdown point, △t si The ultrasonic signal triggered by the ultrasonic sensor numbered Si is related to the breakdown and can be used to locate the time delay of the high-frequency ground current signal or optical pulse signal.

10. A GIS withstand voltage test breakdown point positioning system integrating acoustics, photoelectricity and light, characterized in that: include: A sensor module, wherein the sensor module includes a plurality of ultrasonic sensors, high-frequency sensors and optical sensors, wherein the ultrasonic sensors, high-frequency sensors and optical sensors are used to detect ultrasonic signals, high-frequency ground current signals and optical pulse signals generated during the breakdown of the GIS withstand voltage test, respectively; the high-frequency sensor is connected to the GIS grounding copper busbar by a through-hole method, the ultrasonic sensor is arranged on the outer surface of the GIS metal shell, and the optical sensor is arranged on the GIS observation window; The acquisition module includes a plurality of channels, and synchronously acquires all high-frequency sensor, ultrasonic sensor and optical sensor signals at a sampling rate not less than A MS / s; The analysis module is used to evaluate the amplitude distribution and delay logic of the ultrasonic signal, high-frequency ground current signal and optical pulse signal generated when the GIS withstand voltage test is broken down, extract the trigger signal related to the GIS withstand voltage test breakdown and can be used for positioning calculation, and on this basis calculate and give the breakdown point position.

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