Electronic device

Abstract

An electronic device is provided. The electronic device comprises a substrate, a plurality of switch assemblies, a first sensing signal line and a second sensing signal line. The substrate has a peripheral region. The plurality of switch assemblies are arranged on the substrate and in the peripheral area. The first sensing signal line is arranged on the substrate and is electrically connected with a first number of switch assemblies. The second sensing signal line is arranged on the substrate and is electrically connected with a second number of switch assemblies. The plurality of switch assemblies are electrically connected to the common signal line, and the first number is different from the second number.

Description

Technical Field

[0001] The present invention relates to an electronic device, and more particularly to an electronic device including an improved switch assembly. Background Art

[0002] Electronic products including chips, such as monitors, smartphones, tablets, laptops and TVs, have become an indispensable necessity in modern society. With the booming development of such electronic products, consumers have high expectations for the quality, functions or prices of these electronic products.

[0003] Electronic products often use sensing electrodes to provide sensing functions. However, as the complexity of electronic products increases, sensing electrodes may produce problems such as mura defects. Therefore, these electronic products do not meet consumers' expectations in all aspects, and there are still some problems with electronic products. Developing improved electronic devices is still one of the current goals. Summary of the invention

[0004] In some embodiments, an electronic device is provided. The electronic device includes a substrate, a plurality of switching elements, a first sensing signal line, and a second sensing signal line. The substrate has a peripheral area. A plurality of switching elements are disposed on the substrate and disposed in the peripheral area. The first sensing signal line is disposed on the substrate and electrically connected to a first number of switching elements. The second sensing signal line is disposed on the substrate and electrically connected to a second number of switching elements. The plurality of switching elements are electrically connected to a common signal line, and the first number is different from the second number.

[0005] In some embodiments, an electronic device is provided. The electronic device includes a substrate, a first switch component, a second switch component, a first sensing signal line, and a second sensing signal line. The substrate has a peripheral area. The first switch component and the second switch component are disposed on the substrate and disposed in the peripheral area. The first sensing signal line is disposed on the substrate and electrically connected to the first switch component. The second sensing signal line is disposed on the substrate and electrically connected to the second switch component. The channel area of ​​the first switch component has a first channel width along a direction, and the channel area of ​​the second switch component has a second channel width along the direction, and the first channel width is different from the second channel width.

[0006] The electronic device disclosed in the present invention can be applied to various types of electronic devices. In order to make the features and advantages of the present invention more obvious and easy to understand, various embodiments are specifically cited below and described in detail with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The following detailed description in conjunction with the accompanying drawings will provide a better understanding of the concepts of the disclosed embodiments. It is worth noting that, according to standard industry practice, some features may not be drawn to scale. In fact, the sizes of different features may be increased or decreased for clarity of discussion.

[0008] Figure 1 An equivalent circuit diagram of an electronic device according to some embodiments of the present disclosure is shown.

[0009] Figure 2 A schematic diagram showing the layout of an electronic device according to some embodiments of the present disclosure.

[0010] Figure 3 A schematic top view of an electronic device according to some embodiments of the present disclosure is shown.

[0011] Figure 4 A schematic top view of an electronic device according to some embodiments of the present disclosure is shown.

[0012]

Explanation of symbols

[0013] 1,2,3,4: Electronic devices

[0014] 10:Substrate

[0015] 12: Integrated Circuits

[0016] 20, 20a, 20b, 20c, 20d: switch assembly

[0017] 21: Gate electrode

[0018] 22: Gate vias

[0019] 23: Semiconductor layer

[0020] 24: Source electrode

[0021] 25,28: Source vias

[0022] 26: Drain electrode

[0023] 27: Drain via

[0024] CAc, CAd: channel area

[0025] CL: Common signal line

[0026] D1: First direction

[0027] D2: Second direction

[0028] DA: Display Area

[0029] GL: Gate Line

[0030] OA: Opening Area

[0031] PA: Peripheral area

[0032] TP1,TPa,TPb,TPc,TPd,TPn: sensing electrodes

[0033] TPL1, TPLa, TPLb, TPLc, TPLd, TPLn: sensing signal lines

[0034] WTPa, WTPb, WTPc, WTPd: electrode width

[0035] Wc, Wc', Wd, Wd': channel width

[0036] Vcom: common voltage

[0037] Vsw: switching voltage DETAILED DESCRIPTION

[0038] The following is a detailed description of the electronic device of each embodiment of the present disclosure. It should be understood that the following description provides many different embodiments for implementing different aspects of some embodiments of the present disclosure. The specific components and arrangements described below are only for simple and clear description of some embodiments of the present disclosure. Of course, these are only used as examples and not for limitation of the present disclosure. In addition, similar and / or corresponding component symbols may be used in different embodiments to indicate similar and / or corresponding components to clearly describe the present disclosure. However, the use of these similar and / or corresponding component symbols is only for the simple and clear description of some embodiments of the present disclosure, and does not represent any correlation between the different embodiments and / or structures discussed.

[0039] It should be understood that relative terms, such as "lower" or "bottom" or "upper" or "top", may be used in various embodiments to describe the relative relationship of one component of the drawings to another component. It is understood that if the device in the drawings is turned upside down, the component described on the "lower" side will become the component on the "upper" side. The embodiments of the present disclosure may be used in conjunction with the attached drawings. Figure 1 It is also understood that the drawings of the present disclosure are also considered as part of the disclosure.

[0040] Furthermore, when a first material layer is said to be located on or over a second material layer, it may include a situation where the first material layer is in direct contact with the second material layer, or the first material layer and the second material layer may not be in direct contact, that is, there may be one or more other material layers between the first material layer and the second material layer. However, if the first material layer is directly located on the second material layer, it means that the first material layer and the second material layer are in direct contact.

[0041] In addition, it should be understood that the ordinal numbers used in the specification and claims, such as "first", "second", etc., are used to modify components. They are not intended to imply any previous ordinal numbers of the component (or components), nor do they represent the order of one component and another component, or the order of the manufacturing method. The use of these ordinal numbers is only used to make a component with a certain name clearly distinguishable from another component with the same name. The claims and the specification may not use the same words. For example, the first component in the specification may be the second component in the claims.

[0042] In some embodiments of the present disclosure, terms related to bonding and connection, such as "connect", "interconnect", "bond", etc., unless otherwise defined, may refer to two structures being in direct contact, or may also refer to two structures not being in direct contact, wherein other structures are disposed between the two structures. Such terms related to connection and bonding may also include situations where both structures are movable, or both structures are fixed. In addition, the terms "electrically connected" or "electrically coupled" include any direct and indirect electrical connection means.

[0043] In the text, the terms "approximate", "about", "substantially" usually mean within 10%, or within 5%, or within 3%, or within 2%, or within 1%, or within 0.5% of a given value or range. The quantity given here is an approximate quantity, that is, in the absence of a specific description of "about", "approximately", "substantially", the meaning of "about", "approximately", "substantially" can still be implied. The term "range is between a first value and a second value" means that the range includes the first value, the second value and other values ​​between them. Furthermore, there may be a certain error between any two values ​​or directions used for comparison. If the first value is equal to the second value, it implies that there may be an error of about 10%, or within 5%, or within 3%, or within 2%, or within 1%, or within 0.5% between the first value and the second value. If the first direction is perpendicular to the second direction, the angle between the first direction and the second direction may be between 80 degrees and 100 degrees. If the first direction is parallel to the second direction, the angle between the first direction and the second direction may be between 0 degrees and 10 degrees.

[0044] Certain words are used throughout the specification and claims of this disclosure to refer to specific components. It should be understood by those skilled in the art that electronic equipment manufacturers may refer to the same components by different names. This document does not intend to distinguish between components that have the same function but different names. In the following specification and claims, words such as "comprise", "contain", "have" are open-ended words, so they should be interpreted as "including but not limited to...". Therefore, when the terms "comprise", "contain" and / or "have" are used in the description of this disclosure, they specify the existence of corresponding parts, areas, steps, operations and / or components, but do not exclude the existence of one or more corresponding parts, areas, steps, operations and / or components.

[0045] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as those commonly understood by those skilled in the art. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined in the embodiments of the present disclosure.

[0046] In the present disclosure, the directions are not limited to the three axes of rectangular coordinates such as the X-axis, the Y-axis, and the Z-axis, and can be interpreted in a broader sense. For example, the X-axis, the Y-axis, and the Z-axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other, but are not limited thereto. For ease of explanation, hereinafter, the X-axis direction is the first direction D1, and the Y-axis direction is the second direction D2. In some embodiments, the top view schematic diagram described herein is a cross-sectional schematic diagram observing the XY plane.

[0047] It should be understood that according to the embodiments of the present disclosure, an optical microscope (OM), a scanning electron microscope (SEM), an α-step, an ellipsometer, or other suitable methods may be used to measure the depth, thickness, width, or height of each component, or the spacing or distance between components. According to some embodiments, a scanning electron microscope may be used to obtain a cross-sectional structural image including the component to be measured, and measure the depth, thickness, width, or height of each component, or the spacing or distance between components.

[0048] In the present disclosure, the electronic device may include a display module, a backlight module, an antenna module, a sensing module or a splicing module, but is not limited thereto. The electronic device may be a bendable or flexible electronic device. The display module may be a non-self-luminous display module or a self-luminous display module. The antenna module may be a liquid crystal type antenna module or a non-liquid crystal type antenna module, and the sensing module may be a sensing module for sensing capacitance, light, heat or ultrasound, but is not limited thereto. Electronic components may include passive components and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. The diode may include a light emitting diode or a photodiode. The light emitting diode may, for example, include an organic light emitting diode (OLED), a sub-millimeter light emitting diode (mini LED), a micro light emitting diode (micro LED) or a quantum dot light emitting diode (quantum dot LED), but is not limited thereto. The splicing module may, for example, be a display splicing module or an antenna splicing module, but is not limited thereto.

[0049] In addition, the appearance of the electronic device can be rectangular, circular, polygonal, with curved edges or other suitable shapes. The electronic device can have peripheral systems such as processing system, driving system, control system, light source system, shelf system, etc. to support the display module or splicing module.

[0050] It should be understood that, for the sake of clarity, some components of the electronic device may be omitted in the accompanying drawings, and only some components are schematically shown. In some embodiments, additional components may be added to the electronic device described below. In other embodiments, some components of the electronic device described below may be replaced or omitted. It should be understood that in some embodiments, additional operating steps may be provided before, during and / or after the method for forming the electronic device. In some embodiments, some of the operating steps described may be replaced or omitted, and the order of some of the operating steps described is interchangeable. In some embodiments, the electronic device may be an embedded touch display (TID) device, but the present disclosure is not limited to this.

[0051] Reference Figure 1 As shown, it shows an equivalent circuit diagram of an electronic device 1 according to some embodiments of the present disclosure. In some embodiments, as Figure 1 As shown, the electronic device 1 may include a substrate 10 and various components disposed on the substrate 10 and various film layers covering the substrate 10. In some embodiments, the electronic device 1 may include a switch component 20, sensing electrodes TP1 to TPn, sensing signal lines TPL1 to TPLn, a gate line GL, and a common signal line CL, but the present disclosure is not limited thereto.

[0052] In some embodiments, the substrate 10 may include a flexible substrate, a soft substrate, a rigid substrate, or a combination thereof, but the present disclosure is not limited thereto. In some embodiments, the substrate 10 may include a wafer, glass, quartz, sapphire, ceramic, polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), polypropylene (PP), other suitable materials, or a combination thereof, but the present disclosure is not limited thereto. In some embodiments, the substrate 10 may be a single-layer or multi-layer structure. In some embodiments, the substrate 10 may include a light-transmitting substrate, a semi-transmitting substrate, or an opaque substrate.

[0053] In some embodiments, the substrate 10 may have a peripheral area PA and a display area DA adjacent to the peripheral area PA. In some embodiments, the display area DA may display an image. For example, display pixels (not shown) may be disposed in the display area DA. In some embodiments, the peripheral area PA may be closer to the edge of the substrate 10 than the display area DA. In some embodiments, the peripheral area PA may surround at least one side of the display area DA. In some embodiments, the peripheral area PA may expose at least one side of the display area DA. In other embodiments, the peripheral area PA does not expose any side of the display area DA. In some embodiments, as Figure 1As shown, the display area DA may have a rectangular shape, but the present disclosure is not limited thereto. For example, the display area DA may have a circular shape, an elliptical shape, a polygonal shape, other suitable shapes, or a combination thereof. For example, the display area DA may include rounded corners, chamfered corners, curved edges, or a combination thereof.

[0054] In some embodiments, Figure 1 As shown, the display area DA may include an opening area OA. Therefore, during the subsequent process, an optical sensing module, a communication module, other suitable modules or a combination thereof may be set in the opening area OA. For example, the optical sensing module may include a camera module, a video module, the like or a combination thereof, but the present disclosure is not limited thereto. For example, the communication module may include a receiver module, a speaker module, the like or a combination thereof, but the present disclosure is not limited thereto.

[0055] In some embodiments, Figure 1 As shown, a plurality of switch components 20 may be disposed on the substrate 10 and disposed in the peripheral area PA of the substrate 10. In some embodiments, the plurality of switch components 20 may include transistors. For example, the transistor may include a switching transistor. In some embodiments, the plurality of switch components 20 may include two transistors in parallel. In some embodiments, the plurality of switch components 20 may include, for example, metal oxide thin film transistors, amorphous silicon (a-Si) thin film transistors or polycrystalline silicon (e.g., low-temperature polysilicon (LTPS)) thin film transistors, or a combination thereof, but the present disclosure is not limited thereto. The metal oxide may include indium gallium zinc oxide (IGZO), indium zinc oxide (IZO), indium gallium oxide (IGO), indium gallium zinc tin oxide (IGZTO), other suitable materials, or a combination thereof, but the present disclosure is not limited thereto.

[0056] In some embodiments, Figure 1As shown, a plurality of sensing electrodes TP1 to TPn may be disposed on the substrate 10 and disposed in the display area DA of the substrate 10 to provide a sensing function of the display area DA. Wherein, n may be a positive integer. For example, the value of n may be adjusted according to parameters such as the size of the substrate 10 and the sensing electrodes TP1 to TPn. In some embodiments, the sensing electrodes TP1 to TPn may be arranged in arrays in the display area DA of the substrate 10. In some embodiments, the sensing electrodes TP1 to TPn are not disposed in the peripheral area PA. In some embodiments, the sensing electrodes TP1 to TPn are not disposed in the opening area OA in the display area DA to reduce the probability of interfering with other modules disposed in the opening area OA. In some embodiments, the sensing electrodes TP1 to TPn may be used as shared electrodes, but the present disclosure is not limited thereto. In other embodiments, the electronic device 1 may further include other underlying electrodes electrically connected to the sensing electrodes TP1 to TPn.

[0057] In some embodiments, the sensing electrodes TP1 to TPn may have a shape corresponding to the display area DA. In some embodiments, the sensing electrodes TP1 to TPn may have a rectangular shape, but the present disclosure is not limited thereto. For example, the sensing electrodes TP1 to TPn may have a circular shape, an elliptical shape, a polygonal shape, other suitable shapes, or a combination thereof. For example, the sensing electrodes TP1 to TPn may include rounded corners, chamfered corners, curved edges, or a combination thereof. In some embodiments, the sensing electrodes TP1 to TPn that are close to or adjacent to the opening area OA may have a shape corresponding to the opening area OA. In some embodiments, as Figure 1 As shown, the opening area OA may be elliptical, and the sensing electrode adjacent to the opening area OA may be rectangular with arc-shaped edges, and the arc-shaped edges may correspond to the elliptical shape of the opening area OA.

[0058] In some embodiments, the sensing electrodes TP1 to TPn may include a conductive material. The conductive material may include a metal conductive material, a transparent conductive material, or a combination thereof. For example, the metal conductive material may include copper (Cu), aluminum (Al), molybdenum (Mo), silver (Ag), tin (Sn), tungsten (W), gold (Au), chromium (Cr), nickel (Ni), platinum (Pt), other suitable metals or alloys thereof, the like, or a combination thereof, but the present disclosure is not limited thereto. For example, the transparent conductive material may include a transparent conductive oxide (TCO), such as indium tin oxide (ITO), tin oxide (SnO), zinc oxide (ZnO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), indium tin zinc oxide (ITZO), antimony tin oxide (ATO), antimony zinc oxide (AZO), the like, or a combination thereof, but the present disclosure is not limited thereto. In some embodiments, the sensing electrodes TP1 to TPn may include indium tin oxide. In some embodiments, the sensing electrodes TP1 to TPn may be formed by, for example, chemical vapor deposition, sputtering, resistance heating evaporation, electron beam evaporation, physical vapor deposition, other suitable deposition processes or combinations thereof, but the present disclosure is not limited thereto.

[0059] In some embodiments, Figure 1 As shown, a plurality of sensing signal lines TPL1 to TPLn may be disposed on the substrate 10. In some embodiments, each of the sensing signal lines TPL1 to TPLn may be electrically connected to each of the sensing electrodes TP1 to TPn, respectively. In some embodiments, the plurality of sensing signal lines TPL1 to TPLn may be electrically connected to a plurality of switch components 20. In some embodiments, the sensing signal lines TPL1 to TPLn may be arranged at intervals along a first direction D1, and the sensing signal lines TPL1 to TPLn may extend along a second direction D2. In some embodiments, the material and formation method of the sensing signal lines TPL1 to TPLn may be the same as or different from the material and formation method of the sensing electrodes TP1 to TPn. It should be understood that although Figure 1 A portion of the sensing signal lines TPL1 to TPLn are disposed in the opening area OA, but these sensing signal lines TPL1 to TPLn may be arranged along the edge of the opening area OA. In other words, the sensing signal lines TPL1 to TPLn may not overlap with the opening area OA.

[0060] In some embodiments, Figure 1 As shown, the gate line GL may be disposed on the substrate 10, and the extension direction of the gate line GL is the first direction D1. In some embodiments, the gate line GL is electrically connected to the gates of the plurality of switch elements 20, so that the gate line GL provides a switching voltage Vsw to control the opening or closing of the plurality of switch elements 20. In some embodiments, the material and formation method of the gate line GL may be the same as or different from the material and formation method of the sensing signal lines TPL1 to TPLn.

[0061] In some embodiments, Figure 1 As shown, the common signal line CL may be disposed on the substrate 10, and the extension direction of the common signal line CL is the first direction D1. In some embodiments, the gate line GL and the common signal line CL may be substantially (or substantially) parallel. In some embodiments, the common signal line CL may be electrically connected to a plurality of switch components 20 to provide a common voltage Vcom through the common signal line CL. In some embodiments, the material and formation method of the common signal line CL may be the same as or different from the material and formation method of the sensing signal lines TPL1 to TPLn.

[0062] In some embodiments, the electronic device 1 may further include an integrated circuit (IC) 12 to receive signals from the sensing electrodes TP1 to TPn. In some embodiments, the integrated circuit 12 may be disposed on the peripheral area PA of the substrate 10. In some embodiments, the integrated circuit 12 may be electrically connected to the plurality of switch components 20 via a plurality of sensing signal lines TPL1 to TPLn. In some embodiments, the common signal line CL may be electrically connected to one of the source electrode and the drain electrode of the plurality of switch components 20, and the integrated circuit 12 may be electrically connected to the other of the source electrode and the drain electrode of the plurality of switch components 20.

[0063] In the following, the same or similar component symbols represent the same or similar components, and they are not described in detail for the convenience of description.

[0064] Reference Figure 2 , which shows a schematic diagram of the layout of the electronic device 2 according to some embodiments of the present disclosure. In some embodiments, as Figure 2 As shown, any two sensing signal lines among the plurality of sensing signal lines TPL1 to TPLn are used as examples for description. Hereinafter, the any two sensing signal lines are referred to as the first sensing signal line TPLa and the second sensing signal line TPLb, respectively. In some embodiments, no other sensing signal line is disposed between the first sensing signal line TPLa and the second sensing signal line TPLb. In other embodiments, other sensing signal lines are disposed between the first sensing signal line TPLa and the second sensing signal line TPLb.

[0065] Hereinafter, the sensing electrodes connected to the first sensing signal line TPLa and the second sensing signal line TPLb are referred to as the first sensing electrode TPa and the second sensing electrode TPb, respectively. In some embodiments, the first sensing signal line TPLa is electrically connected to the switch component 20a, and the first sensing signal line TPLa is electrically connected to the first sensing electrode TPa. In some embodiments, the second sensing signal line TPLb is electrically connected to the switch component 20b, and the second sensing signal line TPLb is electrically connected to the second sensing electrode TPb. In some embodiments, Figure 2 As shown, the plurality of switch components 20 may include a first number of switch components 20 a and a second number of switch components 20 b .

[0066] In some embodiments, Figure 2 As shown, the switch element 20a may include a gate electrode 21, a semiconductor layer 23, a source electrode 24, and a drain electrode 26. In some embodiments, the gate electrode 21, the source electrode 24, and the drain electrode 26 may include a conductive material. In some embodiments, the semiconductor layer 23 may include a semiconductor material.

[0067] In some embodiments, the gate electrode 21 may be disposed on the substrate 10. In some embodiments, the gate electrode 21 may be electrically connected to the gate line GL via the gate via 22. Figure 2 As shown, a pair of gate electrodes 21 may be provided to reduce the size of the switch component 20a, but the present disclosure is not limited thereto. In other embodiments, one switch component 20a may have one gate electrode 21. In some embodiments, the semiconductor layer 23 may be provided on the gate electrode 21. In some embodiments, the source electrode 24 and the drain electrode 26 may be provided on the semiconductor layer 23. In some embodiments, the source electrode 24 may be electrically connected to the semiconductor layer 23 via the source via 25, and the drain electrode 26 may be electrically connected to the semiconductor layer 23 via the drain via 27. In some embodiments, the source electrode 24 and the drain electrode 26 may be used interchangeably with each other. In some embodiments, the source electrode 24 may have a U-shape, but the present disclosure is not limited thereto. In some embodiments, the drain electrode 26 may be electrically connected to the common signal line CL. In some embodiments, the first sensing signal line TPLa may be provided on the source electrode 24. In some embodiments, the source electrode 24 may be electrically connected to the first sensing signal line TPLa via the source via 28 , thereby performing layer transfer via the source via 28 .

[0068] In some embodiments, the gate electrode 21 may be the first metal layer (M1 layer) of the electronic device 2, the source electrode 24, the drain electrode 26, the gate line GL and the common signal line CL may be the second metal layer (M2 layer) of the electronic device 2, and the first sensing signal line TPLa may be the third metal layer (M3 layer) of the electronic device 2. In some embodiments, the region of the semiconductor layer 23 between the source electrode 24 and the drain electrode 26 and corresponding to the gate electrode 21 may be used as the channel region of the switch element 20a. In some embodiments, the switch element 20a and the switch element 20b may be substantially the same switch element.

[0069] In some embodiments, Figure 2 As shown, the first sensing signal line TPLa is electrically connected to a first number of multiple switch components 20, and the second sensing signal line TPLb is electrically connected to a second number of multiple switch components 20, and the first number is different from the second number. Since the first number is different from the second number, the recovery ability of the common voltage Vcom of the sensing electrodes electrically connected to the first number of multiple switch components 20 and the second number of multiple switch components 20 can be adjusted respectively. Therefore, the present disclosure can be applied to electronic devices including sensing electrodes of different areas or shapes.

[0070] For example, with Figure 1 and Figure 2 As shown, in order to comply with the design rule of the electronic device 1 and / or 2, the area or shape of the sensing electrode of the adjacent opening area OA may be different from the area or shape of the sensing electrode far from the opening area OA, resulting in different resistance values ​​of the sensing signal lines connected to different sensing electrodes. During the operation of the electronic device, due to the capacitive coupling effect, the potential level of the common voltage Vcom will shift. Therefore, the integrated circuit 12 controls the switch component to restore the potential of the common voltage Vcom. When the resistance of the sensing signal line is too high, the recovery speed of the potential of the common voltage Vcom by the switch component is slow, resulting in brightness differences between different sensing electrodes, thereby causing problems such as mura defects. Therefore, compared to making the first number and the second number the same, making the first number and the second number different can enhance the recovery ability of the switch component corresponding to a specific sensing electrode, thereby reducing the brightness difference between the sensing electrodes, enhancing the brightness uniformity of the sensing electrodes and / or enhancing the luminous effect of the electronic device.

[0071] In some embodiments, Figure 2 As shown in , the first number is 2, and the second number is 1. It should be noted that, Figure 2The first quantity and the second quantity shown are examples only, but the present disclosure is not limited thereto. In some embodiments, the first quantity and the second quantity may be positive integers. For example, the first quantity may be 1, 2, 3, 4, 5, 10, or any value between the aforementioned values, or a numerical range consisting of any values, but the present disclosure is not limited thereto. For example, the second quantity may be 1, 2, 3, 4, 5, 10, or any value between the aforementioned values, or a numerical range consisting of any values, but the present disclosure is not limited thereto. In some embodiments, the first quantity may be greater than or less than the second quantity.

[0072] In some embodiments, Figure 2 As shown, the first sensing electrode TPa has a first electrode width WTPa along a direction, the second sensing electrode TPb has a second electrode width WTPb along the direction, and the first electrode width WTPa of the first sensing electrode TPa is different from the second electrode width WTPb of the second sensing electrode TPb. In some embodiments, the direction is the extension direction of the gate line GL, that is, the first direction D1.

[0073] In some embodiments, Figure 2 As shown, the first electrode width WTPa of the first sensing electrode TPa may be greater than the second electrode width WTPb of the second sensing electrode TPb, and the first number may be greater than the second number. Accordingly, when the first electrode width WTPa is greater than the second electrode width WTPb, the first number of switch components electrically connected to the first sensing electrode TPa and the first sensing signal line TPLa is increased so that the first number is greater than the second number, thereby reducing the brightness difference between the first sensing electrode TPa and the second sensing electrode TPb, improving the brightness uniformity of the first sensing electrode TPa and the second sensing electrode TPb, and / or improving the luminous effect of the electronic device 2.

[0074] In some embodiments, the ratio of the first electrode width WTPa to the second electrode width WTPb (first electrode width WTPa / second electrode width WTPb) may be greater than 1.2. For example, the ratio of the first electrode width WTPa to the second electrode width WTPb (first electrode width WTPa / second electrode width WTPb) may be 1.2, 1.21, 1.5, 1.6, 1.7, 1.8, 1.9, 2, 2.5, 3, 3.5, 4, or any value between the aforementioned values ​​or a range of values ​​composed of any values, but the present disclosure is not limited thereto. In some embodiments, compared to the second sensing electrode TPb, the first sensing electrode TPa may be closer to the opening area OA to reduce the brightness difference between the sensing electrode close to the opening area OA and the sensing electrode far from the opening area OA, improve brightness uniformity, and / or enhance the light-emitting effect of the electronic device 2.

[0075] Reference Figure 3, which shows a schematic top view of an electronic device 3 according to some embodiments of the present disclosure. In some embodiments, Figure 3 As shown, any two sensing signal lines among the plurality of sensing signal lines TPL1 to TPLn are used as examples for description. Hereinafter, the any two sensing signal lines are referred to as the third sensing signal line TPLc and the fourth sensing signal line TPLd, respectively. In some embodiments, no other sensing signal line is disposed between the third sensing signal line TPLc and the fourth sensing signal line TPLd. In other embodiments, other sensing signal lines are disposed between the third sensing signal line TPLc and the fourth sensing signal line TPLd.

[0076] Hereinafter, the sensing electrodes connected to the third sensing signal line TPLc and the fourth sensing signal line TPLd are referred to as the third sensing electrode TPc and the fourth sensing electrode TPd, respectively. In some embodiments, the third sensing signal line TPLc is electrically connected to the switch element 20c, and the third sensing signal line TPLc is electrically connected to the third sensing electrode TPc. In some embodiments, the fourth sensing signal line TPLd is electrically connected to the switch element 20d, and the fourth sensing signal line TPLd is electrically connected to the fourth sensing electrode TPd.

[0077] In some embodiments, Figure 3 As shown, the size of the channel area CAc of the switch element 20c along a direction is different from the size of the channel area CAd of the switch element 20d along the direction. In some embodiments, the direction may be the extension direction of the gate line GL, that is, the first direction D1. In some embodiments, the direction may be perpendicular to the extension direction of the gate line GL, that is, the second direction D2.

[0078] In some embodiments, Figure 3As shown, the third sensing electrode TPc is connected to the third sensing signal line TPLc and has a third electrode width WTPc along the extension direction (first direction D1) of the gate line GL. In some embodiments, the fourth sensing electrode TPd is connected to the fourth sensing signal line TPLd and has a fourth electrode width WTPd along the extension direction of the gate line GL. In some embodiments, the third electrode width WTPc is greater than the fourth electrode width WTPd. In some embodiments, the channel area CAc of the switch component 20c has a channel width Wc along a direction (second direction D2) perpendicular to the extension direction of the gate line GL, and the channel area CAd of the switch component 20d has a channel width Wd along a direction perpendicular to the extension direction of the gate line GL. In some embodiments, the channel width Wc is greater than the channel width Wd. Accordingly, by increasing the channel width Wc of the switch component 20c, the brightness difference between the third sensing electrode TPc and the fourth sensing electrode TPd is reduced, the brightness uniformity of the third sensing electrode TPc and the fourth sensing electrode TPd is improved, and / or the light emitting effect of the electronic device 3 is improved. Specifically, by increasing the size of the channel region CAc along the extension direction of the source electrode 24 or the drain electrode 26 , the recovery capability of the switch element corresponding to the specific sensing electrode is improved. In other words, the recovery capability of the switch element 20 c is increased.

[0079] Reference Figure 4 , which shows a top view schematic diagram of an electronic device 4 according to some embodiments of the present disclosure. In some embodiments, as Figure 4 As shown, the third sensing electrode TPc is connected to the third sensing signal line TPLc and has an electrode width WTPc along the extension direction (first direction D1) of the gate line GL. In some embodiments, the fourth sensing electrode TPd is connected to the fourth sensing signal line TPLd and has an electrode width WTPd along the extension direction of the gate line GL. In some embodiments, the electrode width WTPc is greater than the electrode width WTPd. In some embodiments, the channel area CAc of the switch component 20c has a channel width Wc' along the extension direction (first direction D1) of the gate line GL, and the channel area CAd of the switch component 20d has a channel width Wd' along the extension direction of the gate line GL. In some embodiments, the channel width Wc' is less than the channel width Wd'. Accordingly, by reducing the channel width Wc' of the switch component 20c, the brightness difference between the third sensing electrode TPc and the fourth sensing electrode TPd is reduced, the brightness uniformity of the third sensing electrode TPc and the fourth sensing electrode TPd is improved, and / or the light emitting effect of the electronic device 4 is improved. Specifically, by reducing the size of the channel region CAc from the source electrode 24 to the drain electrode 26, the recovery capability of the switch element corresponding to a specific sensing electrode is improved. In other words, the recovery capability of the switch element 20c is increased.

[0080] In other embodiments, the recovery capability of the switch component corresponding to a specific sensing electrode can be improved by increasing the size of the channel region of the switch component along the extension direction of the source electrode or the drain electrode and reducing the size of the channel region of the switch component spanning from the source electrode to the drain electrode. For example, the recovery capability of the switch component corresponding to the specific sensing electrode can be improved by increasing the ratio of the size along the extension direction of the source electrode (or the drain electrode) to the size spanning from the source electrode to the drain electrode (the size along the extension direction of the source electrode (or the drain electrode) / the size spanning from the source electrode to the drain electrode). In some embodiments, when the electrode width WTPc is greater than the electrode width WTPd, the channel width Wc is greater than the channel width Wd, and the channel width Wc' is less than the channel width Wd'.

[0081] In some embodiments, Figures 1 to 4 The electronic devices 1, 2, 3 and / or 4 shown can be used in any combination. Figures 1 to 4 The switch elements 20 , 20 a , 20 b , 20 c and / or 20 d , the first to fourth sensing electrodes TPa to TPd, and / or the first to fourth sensing signal lines TPLa to TPLd shown may be used in any combination.

[0082] In summary, according to an embodiment of the present disclosure, an electronic device is provided, which can improve the recovery ability of the switch component corresponding to a specific sensing electrode by adjusting the number of switch components connected to the sensing electrode and / or the size of the channel area, thereby reducing the brightness difference between the sensing electrodes, improving the brightness uniformity of the sensing electrodes and / or improving the luminous effect of the electronic device.

[0083] The features between the embodiments of the present disclosure can be mixed and matched as long as they do not violate the spirit of the invention or conflict with each other. In addition, the scope of protection of the present disclosure is not limited to the processes, machines, manufactures, material compositions, devices, methods and steps in the specific embodiments described in the specification. Any person skilled in the art can understand the current or future developed processes, machines, manufactures, material compositions, devices, methods and steps from the disclosure of the present disclosure. As long as substantially the same functions can be implemented in the embodiments described herein or substantially the same results can be obtained, they can be used according to the present disclosure. Therefore, the scope of protection of the present disclosure includes the above-mentioned processes, machines, manufactures, material compositions, devices, methods and steps. The scope of protection of the present disclosure shall be determined by the scope of the claims. Any embodiment or claim of the present disclosure is not required to achieve all the purposes, advantages and / or features disclosed in this disclosure.

[0084] Several embodiments are summarized above so that those skilled in the art can better understand the concepts of the embodiments of the present disclosure. Those skilled in the art should understand that they can design or modify other processes and structures based on the embodiments of the present disclosure to achieve the same purposes and / or advantages as the embodiments introduced herein. Those skilled in the art should also understand that such equivalent processes and structures do not deviate from the spirit and scope of the present disclosure, and they can make various changes, substitutions and replacements without violating the spirit and scope of the present disclosure.

Claims

1. An electronic device, comprising: A substrate having a peripheral region; A plurality of switch components are disposed on the substrate and in the peripheral area; a first sensing signal line disposed on the substrate and electrically connected to a first number of the plurality of switch elements; as well as a second sensing signal line disposed on the substrate and electrically connected to a second number of the plurality of switch elements; The plurality of switch components are electrically connected to a common signal line, and the first number is different from the second number.

2. The electronic device according to claim 1, wherein: The plurality of switch components include transistors.

3. The electronic device according to claim 1, wherein: The first sensing signal line is connected to a first sensing electrode, the second sensing signal line is connected to a second sensing electrode, and a first electrode width of the first sensing electrode along a direction is different from a second electrode width of the second sensing electrode along the direction.

4. The electronic device as claimed in claim 3, characterized in that: The direction is an extending direction of a gate line.

5. The electronic device as claimed in claim 4, characterized in that: The first electrode width is greater than the second electrode width, and the first quantity is greater than the second quantity.

6. The electronic device as claimed in claim 4, characterized in that: A ratio of the first electrode width to the second electrode width is greater than 1.

2.

7. The electronic device as claimed in claim 3, characterized in that: The substrate has a display area adjacent to the peripheral area. The display area includes an opening area. The first sensing electrode is closer to the opening area than the second sensing electrode.

8. An electronic device comprising: A substrate having a peripheral region; A first switch component and a second switch component are disposed on the substrate and in the peripheral area; a first sensing signal line, disposed on the substrate and electrically connected to the first switch component; as well as a second sensing signal line, disposed on the substrate and electrically connected to the second switch component; The channel region of the first switch component has a first channel width along a direction, the channel region of the second switch component has a second channel width along the direction, and the first channel width is different from the second channel width.

9. The electronic device as claimed in claim 8, further comprising: A gate line is disposed on the substrate and has an extension direction; a first sensing electrode connected to the first sensing signal line and having a first electrode width along the extending direction; as well as a second sensing electrode connected to the second sensing signal line and having a second electrode width along the extending direction, and the first electrode width is greater than the second electrode width, The channel region of the first switch component has the first channel width along a direction perpendicular to the extension direction, and the channel region of the second switch component has the second channel width along a direction perpendicular to the extension direction, and the first channel width is greater than the second channel width.

10. The electronic device as claimed in claim 8, further comprising: A gate line is disposed on the substrate and has an extension direction; a first sensing electrode connected to the first sensing signal line and having a first electrode width along the extending direction; as well as a second sensing electrode connected to the second sensing signal line and having a second electrode width along the extending direction, and the first electrode width is greater than the second electrode width, The channel region of the first switch component has the first channel width along the extension direction, and the channel region of the second switch component has the second channel width along the extension direction, and the first channel width is smaller than the second channel width.

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