Low profile dual-polarized magneto-electric dipole antenna realized on standard multi-layer PCB technology

Abstract

The application provides a low-profile dual-polarized magneto-electric dipole antenna realized on standard multilayer PCB technology, and the antenna is realized through stacking of antenna array elements on the standard multilayer PCB; the antenna array element is a nine-layer structure arranged from top to bottom; and the antenna array element is composed of a top metal layer, two cross-polarized electric dipoles, a magnetic dipole, a through hole, a defective ground plane (DGS), a core, a prepreg layer, a feeding unit and a ground plane layer. The antenna is thin in thickness, balanced in structure, light in weight, easy to manufacture and high in yield. High isolation between elements can generate high beam scanning performance. The antenna is very suitable for packaging technology and standard PCB process, is an attractive candidate for millimeter wave applications in the fifth generation (5G) mobile system, and is simulated. The simulation result shows that the radiation modes of two polarizations of the infinite array of the designed low-profile dual-polarized magneto-electric dipole antenna uniformly cover the beam steering range, and no blind spot appears in the phased array.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of antenna design, and particularly relates to a low-profile dual-polarized magneto-electric dipole antenna array element realized on standard multi-layer PCB technology and an antenna. BACKGROUND

[0002] The fifth generation mobile communication network (5G) will provide unprecedented data rate levels through a dense network infrastructure based on high-capacity small cells. In this case, it is essential to allocate mobile broadband links in the frequency spectrum between 24 and 29.5 GHz. In such a frequency range, both the coverage requirements for user terminals and base stations are high.

[0003] 5G high-frequency band antenna modules require highly integrated and complex architectures, of which three are key elements: 1) radio frequency integrated circuits (ICs) that support beamforming, signal amplification, and frequency conversion functions; 2) antenna array elements; 3) integration and packaging technologies. However, the packaging domain usually does not allow the implementation of wideband antennas compatible with 5G requirements. To cope with this limitation, different solutions have been proposed, mainly increasing the substrate thickness and using low relative permittivity materials. However, millimeter-wave phased arrays require the tight integration of different components, and the most common approach is to distribute different components in multiple technology domains, i.e., ICs, packaging, and PCBs.

[0004] Dual-polarized ME antennas are extremely attractive in specific applications due to their wide operating bandwidth and nearly identical radiation patterns in the E and H planes. Recently, several attempts have been made to reduce the profile of such antennas. Some of them use 3D metal structures to achieve antenna miniaturization while maintaining their performance advantages through carefully designed metal architectures. Others use printed circuit board (PCB) technology to layout the antenna circuit on the PCB to reduce the overall profile height of the antenna.

[0005] Therefore, designing and implementing dual-polarized 5G phased arrays on standard multi-layer PCB technology, applying several low-frequency technologies to achieve wideband operation, allows meeting 5G requirements without increasing the thickness of the dielectric core, and has strong research significance. In addition, the design of such antennas can also maintain a high level of isolation.

[0006] Therefore, it is of great significance to propose a low-profile dual-polarized magneto-electric dipole antenna realized on standard multi-layer PCB technology. SUMMARY

[0007] In order to study and solve the design of the radiating element of the phased array for 5G wireless access applications, so that such antennas meet the coverage requirements of 5G microcells, the present application provides a low-profile dual-polarized magneto-electric dipole antenna realized on standard multi-layer PCB technology to solve the above technical defects.

[0008] In a first aspect, the present application provides a low-profile dual-polarized magnetic electric dipole antenna element, which is a nine-layer structure arranged from top to bottom, and is composed of a top metal layer, two cross-polarized electric dipoles, a magnetic dipole, a through hole, a defective ground plane (DGS), a core, a prepreg layer, a feed unit and a ground plane layer; the top metal layer is coupled to the two cross-polarized electric dipoles and the magnetic dipole; the electric dipoles are used to realize horizontal polarization and vertical polarization, and are connected to the feed unit through a microstrip line; the magnetic dipole interacts with the core, and the core is used to enhance the magnetic field generated by the magnetic dipole; the through hole is used to realize electrical connection between different layers; the DGS interacts with the electric dipoles and the magnetic dipole through electromagnetic field; the prepreg layer serves as a dielectric layer to provide mechanical support and insulation for the antenna element; the feed unit is used to introduce external radio frequency signals into the antenna element and distribute power to the electric dipoles and the magnetic dipole; and the ground plane layer is used to realize impedance matching with the feed unit to reduce signal reflection, and cooperates with the DGS to optimize the performance of the grounding system.

[0009] By using the above technical scheme, the top metal layer uses four patch elements and edge-to-edge capacitive coupling to realize cross-polarized electric dipoles, four blind holes connected by patches to realize a magnetic dipole, a small hole to feed into the bottom short wall of the magnetic dipole, and a slot on the bottom plane to generate a loading effect at the end of the waveguide, thereby increasing the current path of the magnetic dipole. In the entire stack, four dielectric layers are used for antenna and feed structures, and the core layer is the first core layer from top to bottom, which is specially used for the realization of radiating elements. The thickness of this layer is limited to 508㎛ to reduce the thickness of the antenna, balance the structure, reduce the weight, and facilitate manufacturing and high yield.

[0010] Preferably, the top metal layer is located in the first layer, and the top metal layer is divided into four patch elements of the same size by an edge gap with a width of d, and an intermediate gap with a width of W2 is arranged between the two pairs of patch elements on the upper and lower sides. An edge part is cut on each of the patch elements at a mutual distance angle, and the four patch elements and the edge part are coupled to realize cross-polarized electric dipoles.

[0011] Further preferably, a circular hole with a diameter of r2 is arranged on each side of the patch element close to each other, and the spacing between the circular holes on the left and right sides is L2; the length and width of the top metal layer are L1 and W1, respectively, wherein L1=4.1mm, L2=1mm, W1=5.05mm, W2=0.75mm, r2=0.6mm, and d=0.2mm.

[0012] More preferably, the iron core includes a first iron core layer and a second iron core layer, the first iron core layer is located in the second layer, the second iron core layer is located in the sixth layer, and the first iron core layer is provided with four blind holes corresponding to the circular hole. The blind holes are connected to the circular hole to realize the magnetic dipole.

[0013] More preferably, the through hole includes an edge through hole disposed at the edge of the first core layer, the edge through holes are symmetrically disposed on the left and right, the diameter of the edge through hole is r1, r1=0.9mm, and transition sheets are disposed at the top and bottom of the edge through hole.

[0014] Preferably, the defective ground plane (DGS) is located in the third layer, and a cross groove is provided in the middle of the defective ground plane (DGS). The cross groove is symmetrical from left to right, and a rectangular cut-off part is provided at the end of each cross groove. Four circular holes are also provided on the defective ground plane (DGS) at the edge of the cross groove.

[0015] Preferably, the power supply unit includes a horizontally polarized balance stripline located on the fifth layer and a vertically polarized balance stripline located on the seventh layer, wherein the balance stripline is in a U-shaped power supply shape.

[0016] Preferably, the prepreg layers are located in the fourth and eighth layers, and the ground plane layer is located in the ninth layer.

[0017] More preferably, the height of the top metal layer is 35 μm, the height of the magnetic dipole is 561 μm, the height of the through-hole is 955 μm, and the height of the defect ground plane (DGS) is 18 μm; the height of the first core layer is 508 μm, the height of the second core layer is 127 μm, and both the first and second core layers are Neltec NX9240 cores with a relative permittivity of 2.4; the height of the vertically polarized balance strip is 35 μm, and the height of the horizontally polarized balance strip is 18 μm; the height of the prepreg layer is 107 μm, and it is set as Isola MT77-1078 prepreg with a relative permittivity of 2.95; and the height of the ground plane layer is 35 μm.

[0018] Secondly, embodiments of the present invention also provide a low-profile dual-polarized magnetoelectric dipole antenna implemented on standard multilayer PCB technology, including antenna array elements as described in the first aspect. The antenna is implemented by stacking the antenna array elements on a standard multilayer PCB, and the antenna function is achieved through the cooperative operation of each of the antenna array elements.

[0019] By the technical scheme, a new low-profile dual-polarized magnetic electric dipole antenna structure is provided, which allows the array element to have a wide beam scanning performance and is competitive in packaging technology and standard PCB process.

[0020] Compared with the prior art, the beneficial results of the present application are that:

[0021] The antenna is stacked in the first five metal layers of a PCB, and a defective ground plane structure (DGS) is used to reduce the mutual coupling in order to reduce the blind spot in wide beam steering applications. The antenna is thin in thickness, balanced in structure, light in weight, easy to manufacture, and high in yield. The high isolation between elements can produce high beam scanning performance. The design proposed by the present application is very suitable for packaging technology and standard PCB process and is an attractive candidate for millimeter wave applications in the fifth generation (5G) mobile system. The simulation results of the designed low-profile dual-polarized magnetic electric dipole antenna show that the radiation patterns of the two polarizations of the infinite array uniformly cover the beam steering range, and there is no blind spot in the phased array. BRIEF DESCRIPTION OF DRAWINGS

[0022] The accompanying drawings are included to provide a further understanding of embodiments and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments and, together with the description, serve to explain the principles of the present application. Other embodiments and many of the intended advantages of the embodiments will be readily appreciated as the same becomes better understood by reference to the following detailed description. The elements of the drawings are not necessarily to scale relative to each other. Like reference numerals designate corresponding similar parts.

[0023] Figure 1 is a front view of a low-profile dual-polarized magnetic electric dipole antenna element of an embodiment of the present application;

[0024] Figure 2 is a side view of a low-profile dual-polarized magnetic electric dipole antenna of an embodiment of the present application;

[0025] Figure 3 is a top view of a low-profile dual-polarized magnetic electric dipole antenna of an embodiment of the present application;

[0026] Figure 4 is a layered perspective view of a low-profile dual-polarized magnetic electric dipole antenna element of an embodiment of the present application;

[0027] Figure 5 is an S parameter plot of a low-profile dual-polarized magnetic electric dipole antenna element of an embodiment of the present application;

[0028] Figure 6 is a schematic diagram of the effect of a low-profile dual-polarized magnetic electric dipole antenna of an embodiment of the present application embedded in an infinite array on the horizontal polarization radiation pattern;

[0029] Figure 7 Effect diagram of embedding a low-profile dual-polarized magnetic electric dipole antenna in a vertical polarized radiation mode of an infinite array for an embodiment of the present application.

[0030] BRIEF DESCRIPTION OF DRAWINGS: 100, top metal layer; 131, magnetic dipole; 160, via hole; 200, first core layer; 300, defective ground plane DGS; 400, first prepreg layer; 500, horizontally polarized balanced stripline; 600, second core layer; 700, vertically polarized balanced stripline; 800, second prepreg layer; 900, ground plane layer. DETAILED DESCRIPTION

[0031] The present application will be further described below in conjunction with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the related application, and are not a limitation on the application. In addition, it should be noted that only the parts related to the application are shown in the drawings for ease of description.

[0032] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The present application will be described in detail below with reference to the drawings and in conjunction with the embodiments.

[0033] In a first aspect, an embodiment of the present application discloses a low-profile dual-polarized magnetic electric dipole antenna element, as shown in Figure 1 The antenna element is a nine-layer structure arranged from top to bottom, and the antenna element is composed of a top metal layer 100, two cross-polarized electric dipoles, a magnetic dipole 131, a via hole 160, a defective ground plane DGS 300, a core, a first prepreg layer 400, a second prepreg layer 800, a feed unit, and a ground plane layer 900.

[0034] In a second aspect, an embodiment of the present application further discloses a low-profile dual-polarized magnetic electric dipole antenna realized on a standard multilayer PCB technology, as shown in Figure 2 The antenna includes the antenna element of the first aspect, and the antenna is realized by stacking the antenna elements on the standard multilayer PCB, and the functions of the antenna are realized by the cooperative work of the antenna elements.

[0035] The embodiment of the present application discloses a new low-profile dual-polarized magnetic electric dipole antenna structure, allows array elements with wide beam scanning performance, and is competitive in packaging technology and standard PCB process.

[0036] Further, the top metal layer 100 is coupled to two cross-polarized electric dipoles and a magnetic dipole 131; the electric dipoles are used to realize horizontal and vertical polarization and are connected to the feed unit through microstrip lines; the magnetic dipole 131 interacts with the core, which is used to enhance the magnetic field generated by the magnetic dipole 131; the through hole 160 is used to realize electrical connection between different layers; the defect ground plane DGS 300 interacts with the electric dipoles and the magnetic dipole 131 through electromagnetic field; the first prepreg layer 400 serves as a dielectric layer to provide mechanical support and insulation for the antenna array element; the feed unit is used to introduce external radio frequency signals into the antenna array element and distribute power to the electric dipoles and the magnetic dipole 131; the ground plane layer 900 is used to realize impedance matching with the feed unit to reduce signal reflection, and cooperates with the defect ground plane DGS 300 to optimize the performance of the grounding system.

[0037] By adopting the above technical scheme, the top metal layer 100 uses four patch elements and edge-to-edge capacitive coupling to realize cross-polarized electric dipoles, four blind holes connected to the patches realize the magnetic dipole 131, the small hole feeds into the bottom short wall of the magnetic dipole 131, and the slot on the bottom plane produces a loading effect at the end of the waveguide, increasing the current path of the magnetic dipole 131. In the entire stack, four dielectric layers are used for the antenna and feed structure, the core layer is the first core layer from top to bottom, which is specially used for the realization of the radiating element, and the thickness of this layer is limited to 508㎛ to reduce the thickness of the antenna, balance the structure, reduce the weight, and facilitate manufacturing and high yield.

[0038] Further, the reduction of the thickness of the antenna medium strongly affects its impedance and bandwidth, to solve this limitation, a defect ground plane structure (DGS) 300 is adopted, which creates four circular holes under the horizontal patch ground angle. The presence of the DGS affects the capacitive effect of the edge field in the stripline, making the electric dipole antenna input impedance imaginary part flat, and helping to balance the electric dipole and the magnetic dipole 131 impedance real part. Secondly, the electric field between the two horizontal patches and the ground plane finds an additional path to a relatively low ground plane, resulting in an effective increase in the thickness of the electric dipole. Due to the stripline coupling between the DGS and the slot, the magnetic dipole 131 is also affected, ultimately reducing its resonant frequency.

[0039] Specifically, as shown in Figure 3 The top metal layer 100 is located in the first layer, and the top metal layer 100 is evenly divided into four patch elements of the same size by edge slots with a width of d, and a middle slot with a width of W2 is arranged between the two pairs of patch elements on the upper and lower sides, and the patch elements are cut to form edge parts at mutually distant angles, and the four patch elements and the edge parts are coupled to realize cross-polarized electric dipoles. The corners of the patch are cut to balance the impedance matching at the edge frequency.

[0040] The top metal layer 100 is the first layer, carrying two cross-polarized electric dipoles, realized using four patch elements and edge capacitively coupling, where the corners of the patch are cut to equalize the impedance matching at the edge frequency, the patch is deformed along the vertical plane to match the technology requirements related to the via.

[0041] The side of the patch element close to each other is provided with a circular hole with a diameter of r2, and the interval between the circular holes on the left and right sides is L2; the length and width of the top metal layer 100 are L1 and W1 respectively, wherein L1=4.1mm, L2=1mm, W1=5.05mm, W2=0.75mm, r2=0.6mm, d=0.2mm.

[0042] Further, as shown in Figure 3 and Figure 4 The core includes a first core layer 200 and a second core layer 600, the first core layer 200 is located on the second layer, and the second core layer 600 is located on the sixth layer. The first core layer 200 is provided with four blind holes corresponding to the circular holes, and the blind holes are connected with the circular holes to realize the magnetic dipole 131. That is, the magnetic dipole 131 is realized by the top metal layer 100 on the top and the four blind holes in the DGS intermediate core. The via 160 is attached to the edge of the blind hole. The via 160 includes an edge via 160 provided on the edge of the first core layer 200, and the edge via 160 is symmetrically arranged on the left and right. The diameter of the edge via 160 is r1, r1=0.9mm, and the top and bottom of the edge via 160 are provided with an over-thin sheet.

[0043] Specifically, the blind holes are distributed in the middle of the second layer core, are axisymmetric, are connected with the top metal layer 100, the magnetic dipole 131 is formed by the vertical current flowing in opposite directions in the vertical direction, the bottom of the blind hole is connected with the slot on the plane, and the loading effect is generated at the end of the waveguide, thereby increasing the current path of the magnetic dipole 131. The edge via 160 is distributed on the edge of the second core layer, is left-right symmetric, and the top and bottom of the via have an over-thin sheet with an increased radius.

[0044] Further, the defect ground plane DGS 300 is located on the third layer, and the middle of the defect ground plane DGS 300 is provided with a cross slot portion, the cross slot portion is left-right symmetric, the end of the cross slot portion is provided with a rectangular-shaped truncated portion, and the edge of the defect ground plane DGS 300 located in the cross slot portion is further provided with four circular holes. The defect ground plane realizes the excitation of two polarizations, the horizontal layout creates four circular holes, realizes the vertical polarization of the antenna input impedance, and for the horizontal polarization, a similar aperture is also realized. The shape is a cross slot shape.

[0045] Specifically, the defect ground surface (DGS) 300 is a cross-slot structure, which is left-right symmetrical, has four circular holes, and has a cross gap in the middle, and the gap edge is truncated by four rectangles. The DGS makes the imaginary part of the input impedance of the electric dipole antenna flat, and helps to balance the real part of the impedance of the electric dipole and the magnetic dipole 131. Secondly, the electric field between the two horizontal patches and the ground plane finds an additional path to a relatively low ground plane, thereby causing the effective height of the electric dipole thickness to increase.

[0046] Further, the feeding unit includes a horizontally polarized balanced strip line 500 on the fifth layer and a vertically polarized balanced strip line 700 on the seventh layer, and the balanced strip line is in a U-shaped feeding shape. The first prepreg layer 400 and the second prepreg layer 800 are respectively located on the fourth layer and the eighth layer, and the ground plane layer 900 is located on the ninth layer.

[0047] Specifically, the feeding is composed of the balanced strip line structure in the fifth layer and the seventh layer, and is horizontally polarized and vertically polarized, and the fourth layer and the eighth layer are both prepreg layers. The ground plane is the ninth layer, which protects the feed line and the antenna from the interference of the control line and the direct current line located below the phased array stack.

[0048] Referring to Figure 4 , preferably, in the embodiment, the height of the top metal layer 100 is 35 μm, the height of the magnetic dipole 131 is 561 μm, the height of the through hole 160 is 955 μm, and the height of the defect ground surface DGS 300 is 18 μm; the height of the first core layer 200 is 508 μm, the height of the second core layer 600 is 127 μm, and the first core layer 200 and the second core layer 600 are both set as Neltec NX9240 cores with a relative dielectric constant of 2.4; the height of the vertically polarized balanced strip line 700 is 35 μm, and the height of the horizontally polarized balanced strip line 500 is 18 μm; the height of the first prepreg layer 400 and the second prepreg layer 800 is 107 μm, which is set as Isola MT77-1078 prepreg with a relative dielectric constant of 2.95, and the height of the ground plane layer 900 is 35 μm. In other embodiments, the sizes of the various components, such as length, width, etc. can be designed as appropriate, and will not be described again.

[0049] Further, Figure 5 The S parameter diagram of the low-profile dual-polarized magneto-electric dipole antenna array element proposed in the application is shown, and the simulation results are shown in Figure 5 , the -10dB impedance bandwidth is between 28.6GHz and 28.7GHz, and the entire S21 is less than -20dB within the -10dB impedance bandwidth.

[0050] Figure 6The simulation shows the horizontal polarized radiation pattern of the proposed low-profile dual-polarized magnetic-electric dipole antenna embedded in an infinite array. The peak gain of the antenna in the horizontal polarization case is 6 dB.

[0051] Figure 7 The simulation shows the vertical polarized radiation pattern of the proposed low-profile dual-polarized magnetic-electric dipole antenna embedded in an infinite array. The peak gain of the antenna in the vertical polarization case is 5 dB. The radiation pattern shows one main lobe, which is slightly narrower in the vertical polarization case. Both polarized radiation patterns uniformly cover the beam steering range, which means there are no blind spots in the phased array.

[0052] The antenna stack disclosed in the application is stacked in the first five metal layers of a PCB, and a defective ground plane structure (DGS) is used to reduce the mutual coupling and blind spots in wide beam steering applications. The antenna is thin, balanced in structure, light in weight, easy to manufacture, and has a high yield. The high isolation between elements can produce high beam scanning performance. The design proposed in the application is very suitable for packaging technology and standard PCB processes, and is an attractive candidate for millimeter wave applications in the fifth generation (5G) mobile system. The simulation results of the designed low-profile dual-polarized magnetic-electric dipole antenna show that the two polarized radiation patterns of the infinite array uniformly cover the beam steering range, and there are no blind spots in the phased array.

[0053] The above description is merely preferred embodiments of the application and a description of the principles of the technology used. Those skilled in the art should understand that the scope of the application disclosed herein is not limited to the technical solutions formed by the specific combinations of the above technical features, and should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the above inventive concept. For example, the above features can be replaced with technical features disclosed in the application (but not limited to) having similar functions to form technical solutions.

Claims

1. A low-profile dual-polarized magneto-electric dipole antenna element, characterized by, The antenna array element is a nine-layer structure arranged from top to bottom, which is top metal layer, first iron core layer, defective ground plane DGS, first prepreg layer, horizontally polarized balanced strip line, second iron core layer, vertically polarized balanced strip line, second prepreg layer and ground plane layer, and the antenna array element comprises two cross-polarized electric dipoles, magnetic dipoles, through holes, feed units and ground planes. The electric dipoles and magnetic dipoles are cross-polarized, and the top metal layer is coupled to the two cross-polarized electric dipoles and magnetic dipoles; the electric dipoles are used to realize horizontal polarization and vertical polarization, and are connected to the feed unit through a microstrip line; the magnetic dipoles interact with the iron core layer, and the iron core layer is used to enhance the magnetic field generated by the magnetic dipoles; the through holes are used to realize electrical connection between different layers; wherein the top metal layer is divided into four patch elements of the same size by an edge gap with a width of d, and an intermediate gap with a width of W2 is arranged between the two pairs of patch elements on the upper and lower sides, and an edge part is cut on the top corner part of each of the four patch elements, and the four patch elements and the edge part are coupled to realize the cross-polarized electric dipoles; the iron core layer comprises the first iron core layer and the second iron core layer, and a circular hole is arranged on one side of each of the patch elements, four blind holes corresponding to the circular holes are arranged on the first iron core layer, and the blind holes are connected to the circular holes to realize the magnetic dipoles. The defective ground plane DGS and the electric dipoles and magnetic dipoles interact with each other through electromagnetic fields; the prepreg layer serves as a dielectric layer to provide mechanical support and insulation for the antenna array element; the feed unit is used to introduce external radio frequency signals into the antenna array element and distribute power to the electric dipoles and magnetic dipoles; the ground plane layer is used to realize impedance matching and reduce signal reflection in cooperation with the feed unit, and cooperates with the defective ground plane DGS to optimize the performance of the grounding system.

2. The low-profile dual-polarized magneto-electric dipole antenna array of claim 1, wherein, The diameter of the circular hole is r2, and the distance between the centers of the circular holes on the left and right sides is L2; The length and width of the top metal layer are L1 and W1, respectively, wherein L1=4.1mm, L2=1mm, W1=5.05mm, W2=0.75mm, r2=0.6mm, and d=0.2mm.

3. The low-profile dual-polarized magneto-electric dipole antenna array of claim 2, wherein, The through hole comprises an edge through hole arranged at the edge of the first iron core layer, the edge through hole is symmetrically arranged, the diameter of the edge through hole is r1, r1=0.9mm, and the top and bottom of the edge through hole are provided with an over-thin sheet.

4. The low-profile dual-polarized magneto-electric dipole antenna array of claim 1, wherein, The defective ground plane DGS is located on the third layer, and a cross groove is arranged in the middle of the defective ground plane DGS, the cross groove is symmetrically arranged on the left and right sides, the end of the cross groove is provided with a rectangular-shaped truncated part, and four circular holes are further arranged on the edge of the cross groove of the defective ground plane DGS.

5. The low-profile dual-polarized magneto-electric dipole antenna array of claim 1, wherein, The feeding unit comprises horizontal polarization balanced stripline on the fifth layer and vertical polarization balanced stripline on the seventh layer, and the balanced striplines are in U-shaped feeding form.

6. The low-profile dual-polarized magneto-electric dipole antenna array of claim 1, wherein, The prepreg layers are respectively on the fourth layer and the eighth layer, and the ground plane layer is on the ninth layer.

7. The low-profile dual-polarized magneto-electric dipole antenna array of claim 5, wherein, The height of the top metal layer is 35μm, the height of the magnetic dipole is 561μm, the height of the via is 955μm, and the height of the defective ground plane DGS is 18μm. The height of the first iron core layer is 508μm, the height of the second iron core layer is 127μm, and the first iron core layer and the second iron core layer are both set as Neltec NX9240 iron core with a relative dielectric constant of 2.4; the height of the vertical polarization balanced stripline is 35μm, and the height of the horizontal polarization balanced stripline is 18μm; the height of the prepreg layer is 107μm, and the prepreg layer is set as Isola MT77-1078 prepreg with a relative dielectric constant of 2.95; and the height of the ground plane layer is 35μm.

8. A low profile dual-polarized magneto-electric dipole antenna implemented on standard multi-layer PCB technology, characterized in that, The antenna array element comprises the antenna array element according to any one of claims 1-7, and the antenna is realized through stacking of the antenna array element on a standard multi-layer PCB, and functions of the antenna are realized through cooperation of the antenna array elements.

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