MEMS loudspeaker

Abstract

The invention relates to a MEMS speaker. Aspects of the subject technology relate to an electronic device having a speaker, such as a micro-electro-mechanical system (MEMS) speaker. The MEMS speaker may include an electrostatically driven corrugated MEMS structure to move air without a magnet, coil or traditional speaker membrane, and thus provide a low power compact speaker with a larger acoustically effective area in a small volume. Adjacent folds in the corrugated MEMS structure may form a pair of MEMS electrodes that may be pushed together and / or pulled apart to deform the MEMS structure in respiratory motion for generating a pressure differential on opposite sides of the corrugated MEMS structure to generate sound. Additional modes of operation are described.

Description

[0001] This application is a divisional application of the invention patent application with application date of July 9, 2021, application number 202110775521.4, and invention name “MEMS Speaker”.

[0002] CROSS-REFERENCE TO RELATED APPLICATIONS

[0003] This application claims the benefit of priority to U.S. Provisional Patent Application No. 63 / 050054, filed on July 9, 2020, and entitled “MEMS Speaker,” the disclosure of which is hereby incorporated herein in its entirety. Technical Field

[0004] The present description relates generally to electronic devices and more particularly, but not exclusively, to microelectromechanical systems (MEMS) speakers. Background Art

[0005] Electronic devices, such as computers, media players, cellular phones, wearable devices, and headphones, are often provided with speakers for generating sound output from the device. However, particularly as devices are implemented in smaller and smaller form factors, and as user demand for high-quality audio increases, providing speakers that generate high-quality sound can be challenging, particularly in compact devices such as portable electronic devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Certain features of the subject technology are set forth in the appended claims. However, for purposes of explanation, several embodiments of the subject technology are set forth in the following drawings.

[0007] Figure 1 A perspective view of an exemplary electronic device having a MEMS speaker in accordance with various aspects of the subject technology is shown.

[0008] Figure 2 A cross-sectional side view of a portion of an exemplary electronic device having a MEMS speaker in accordance with various aspects of the subject technology is shown.

[0009] Figure 3 A perspective view of another exemplary electronic device having a MEMS speaker in accordance with various aspects of the subject technology is shown.

[0010] Figure 4 A schematic cross-sectional side view of an exemplary MEMS speaker in accordance with various aspects of the subject technology is shown.

[0011] Figure 5 A cross-sectional perspective view of a portion of an exemplary MEMS structure of a MEMS speaker in accordance with various aspects of the subject technology is shown.

[0012] Figure 6 A perspective view of an exemplary implementation of a portion of a MEMS speaker implemented with a first substrate and a second substrate having an opening according to various aspects of the subject technology is shown.

[0013] Figure 7 A cross-sectional side view of a portion of an exemplary MEMS speaker having multiple MEMS layers in accordance with various aspects of the subject technology is shown.

[0014] Figure 8 A cross-sectional side view of an exemplary MEMS structure of a MEMS speaker in accordance with various aspects of the subject technology is shown.

[0015] Fig. 9 Cross-sectional side views of exemplary MEMS structures of a MEMS speaker in various operating states are shown in accordance with various aspects of the subject technology.

[0016] Fig.10 A side view of an exemplary MEMS structure of a MEMS speaker arranged for out-of-plane motion in accordance with various aspects of the subject technology is shown.

[0017] Fig.11 A cross-sectional side view of a portion of another exemplary MEMS structure of a MEMS speaker in accordance with various aspects of the subject technology is shown.

[0018] Fig.12 A cross-sectional side view of a portion of another exemplary MEMS structure of a MEMS speaker having a thinned fold in accordance with various aspects of the subject technology is shown.

[0019] Fig.13 A cross-sectional side view of a portion of another exemplary MEMS structure of a MEMS speaker having bellows folds in accordance with various aspects of the subject technology is shown.

[0020] Fig.14 A cross-sectional side view of a portion of another exemplary MEMS structure of a MEMS speaker having tent-like folds in accordance with various aspects of the subject technology is shown.

[0021] Fig.15 A cross-sectional side view of a portion of a MEMS speaker having a MEMS structure with fixed but compliant edges in accordance with various aspects of the subject technology is shown.

[0022] Fig.16A cross-sectional side view of a portion of a MEMS speaker having a MEMS structure with a floating edge is shown in accordance with various aspects of the subject technology.

[0023] Fig.17 A cross-sectional side view of a portion of a MEMS speaker having a MEMS structure with a sliding edge is shown in accordance with various aspects of the subject technology.

[0024] Fig.18 A cross-sectional side view of a portion of a MEMS speaker with fixed electrodes in accordance with various aspects of the subject technology is shown.

[0025] Fig.19 A cross-sectional side view of a portion of a MEMS speaker having a MEMS structure with a variable electrode spacing is shown in accordance with various aspects of the subject technology.

[0026] Fig. 20 A top view of a portion of a MEMS speaker with variable electrode spacing is shown in accordance with various aspects of the subject technology.

[0027] Fig.21 A flow chart of an exemplary process for operating a MEMS speaker according to one or more implementations is shown.

[0028] Fig. 22 An electronic system is shown that can be used to implement one or more implementations of the subject technology. DETAILED DESCRIPTION

[0029] The specific embodiments shown below are intended to be descriptions of various configurations of the subject technology and are not intended to represent the only configuration that the subject technology can be put into practice. The accompanying drawings are incorporated herein and constitute a part of the specific embodiments. The specific embodiments include specific details intended to provide a thorough understanding of the subject technology. However, it will be clear and obvious to those skilled in the art that the subject technology is not limited to the specific details shown herein and can be put into practice without these specific details. In some cases, well-known structures and components are shown in block diagram form to avoid blurring the concept of the subject technology.

[0030] Portable electronic devices (such as mobile phones, portable music players, smart watches, tablets, laptops, other wearable devices, headphones, earbuds, etc.) typically include speakers for generating sound.

[0031] According to various aspects of the subject disclosure, a low-power compact speaker is provided, which includes an electrostatically driven corrugated MEMS structure to move air without a magnet, a coil or a traditional speaker membrane. The speaker (referred to as a MEMS speaker or a micro speaker in various ways herein) is implemented with corrugations in a MEMS structure, which provides a larger acoustic effective area in a small volume. Adjacent corrugations in the corrugated MEMS structure can form a MEMS electrode pair, which can be pushed together and / or pulled apart (e.g., in a breathing motion for generating a pressure difference above and below the corrugated MEMS structure) to generate sound. The speaker may include a plurality of corrugated MEMS structures operating in pairs. One or more corrugated MEMS structures may be installed between the front cavity and the rear cavity of the speaker. In one or more specific implementations, one or more corrugated MEMS structures may be installed between a top substrate and a bottom substrate having an opening to allow airflow in and out of the corrugated MEMS structure. In one or more specific implementations, a multilayer corrugated MEMS structure may be stacked.

[0032] In one or more implementations, wide spacing and / or varying spacing between MEMS electrodes can be provided to tune the corrugated MEMS structure to low frequencies and / or varying frequencies. In these implementations, posts on the top substrate and / or the bottom substrate can extend toward the corrugated MEMS structure to provide fixed (e.g., additional) electrodes for controlling the motion of the MEMS electrodes.

[0033] Figure 1 An exemplary electronic device including a speaker is shown in FIG. Figure 1 In the example of FIG. 1 , device 100 (eg, electronic device) has been implemented using a housing that is small enough to be portable and carried by a user (eg, Figure 1 The device 100 may be a handheld electronic device such as a tablet computer or a cellular phone or a smart phone. Figure 1 As shown, device 100 includes a display such as display 110 mounted on a front face of housing 106. Device 100 includes one or more input / output devices (such as a touch screen incorporated into display 110), buttons or switches (such as button 104), and / or other input-output components disposed on or behind display 110 or disposed on or behind other portions of housing 106. Display 110 and / or housing 106 include one or more openings to accommodate button 104, speakers, light sources, or cameras.

[0034] exist Figure 1In the example of , housing 106 includes two openings 108 on the bottom sidewall of the housing. One or more of openings 108 form ports for audio components. For example, one of openings 108 may form a speaker port for a speaker disposed within housing 106, and another of openings 108 may form a microphone port for a microphone disposed within housing 106. Openings 108 may be open ports, or may be fully or partially covered with a permeable membrane or mesh structure that allows air and sound to pass through the openings. Although in Figure 1 106, but this is merely illustrative. One opening 108, two openings 108, or more than two openings 108 may be provided on the bottom sidewall (as shown), on another sidewall (e.g., the top sidewall, the left sidewall, or the right sidewall), on the rear surface of the housing 106, and / or on the front surface of the housing 106 or the display 110. In some implementations, one or more groups of openings 108 in the housing 106 may be aligned with a single port of an audio component within the housing 106. The housing 106, sometimes referred to as a shell, may be formed of plastic, glass, ceramic, fiber composite material, metal (e.g., stainless steel, aluminum, etc.), other suitable materials, or a combination of any two or more of these materials.

[0035] Figure 1 The configuration of the device 100 is merely illustrative. In other specific implementations, the device 100 can be a computer, such as a computer integrated into a display (such as a computer monitor), a laptop computer, a smaller portable device (such as a smart watch, a hanging device or other wearable device or micro device), a media player, a gaming device, a navigation device, a computer monitor, a television, headphones, earplugs or other electronic equipment. In some specific implementations, the device 100 can be provided in the form of a computer integrated into a computer monitor. The display 110 can be mounted on the front surface of the housing 106, and a bracket can be provided to support the housing (e.g., on a desktop).

[0036] In some implementations, device 100 may be provided in the form of a wearable device such as a smartwatch. In one or more implementations, housing 106 may include one or more interfaces for mechanically coupling housing 106 to a strap or other structure for securing housing 106 to a wearer. Figure 1 The example of the embodiment includes one opening, but the device 100 may include one, two, three, four or more than four openings. The device 100 may include one, two, three or more than three audio components, each of which is mounted adjacent to one or more of the openings 108.

[0037] A speaker disposed within the housing 106 transmits sound through at least one associated opening 108. A microphone may also be disposed within the housing 106, the microphone receiving sound through at least one associated opening in the housing. In one or more specific implementations, the speaker may be implemented as a micro-electromechanical system (MEMS) speaker.

[0038] Figure 2 A cross-sectional view of a portion of the device 100 is shown with an audio component mounted therein. Figure 2 In the example of FIG. 1 , device 100 includes speaker 200. Speaker 200 includes speaker housing 202 mounted adjacent to at least one opening 108 in housing 106. Speaker housing 202 may be formed of one or more materials, such as plastic or metal. As shown, speaker 200 may include MEMS component 204 disposed within speaker housing 202. Figure 2 As shown, the MEMS component 204 can be mounted between a rear cavity 217 and a front cavity 219 (eg, as defined by one or more portions of the speaker housing 202 and / or the device housing 106). Figure 2 As shown, the speaker housing 202 may include an opening that aligns with the opening 108 in the housing 106 so that sound generated by the MEMS component 204 (e.g., in response to control signals received from the device circuit 206) can be transmitted to the external environment through the opening 108. The opening 108 can be an open port or can include a covering 210 (such as a membrane or mesh structure) that prevents liquid from entering the speaker housing 202, but is permeable to sound and air.

[0039] The MEMS component 204 may be coupled to device circuitry, such as the device circuitry 206 (e.g., one or more processors of the device) via the connector 208. The connector 208 may include a flexible integrated circuit or another flexible or rigid conductive connector. In one or more implementations, the connector 208 may be electrically coupled to one or more contacts on the speaker housing 202 that are electrically coupled (e.g., via wire bonds or other conductive connections) to the MEMS component 204. However, it should be understood that in one or more implementations, the MEMS component 204 may be provided without a separate speaker housing 202 (e.g., and coupled directly to the connector 208 and / or the device circuitry 206). In implementations where the MEMS component 204 is provided without a separate speaker housing, the outer layer of the MEMS component 204 may be attached to an inner surface of the housing 106 (e.g., via an adhesive 212 or another coupling mechanism), mounted to a printed circuit within the device 100, or otherwise mounted within the housing 106 so as to diffuse sound out of the housing 106 through the opening 108.

[0040] Figure 3Another exemplary electronic device that may include a MEMS speaker is shown. Figure 3 In the example of , device 300 is implemented as an earbud having a MEMS speaker formed by MEMS component 204. As shown, device 300 may include a housing 302 having a shape configured to fill an opening of an ear canal of a user wearing the earbud. Device 300 may include one or more openings, such as opening 304 in housing 302. Housing 302 may have a size and shape that conforms to a portion of the outer ear so that when the user wears the earbud, opening 304 may align with the user's ear canal to allow sound generated by MEMS component 204 to enter the user's ear canal. Device 300 may be a wired or wireless earbud that is compatible with a companion device (such as Figure 1 The device 100 of the device 300 communicates with the device 100 to receive instructions and / or signals, thereby operating the MEMS speaker corresponding to the MEMS component 204 to generate sound. The housing 302 of the device 300 and / or the speaker housing within the housing 302 can form (e.g., define) the back cavity and the front cavity of the MEMS component 204.

[0041] Figure 1 and Figure 3 The electronic devices described herein are merely illustrative, and it should be understood that a MEMS speaker as described herein may be implemented in any suitable electronic device where it is desired to generate high quality sound from a small volume.

[0042] Figure 4 An example of a portion of a speaker for an electronic device in which a MEMS actuator (or transducer) is implemented as a MEMS speaker is shown. Figure 4 In the example of FIG. 4 , the speaker 200 includes a MEMS structure 410 that forms a MEMS layer 408 between the rear cavity 217 and the front cavity 219 . Figure 4 An arrangement is shown in which a MEMS structure 410 is disposed in a plane defined by an x-direction and a y-direction, wherein a front cavity and a rear cavity are disposed on opposite sides of the MEMS structure 410 in the z-direction. However, this arrangement is merely illustrative, and other arrangements are contemplated and described herein. As described in further detail herein, the speaker 200 can be operated by applying a voltage to a MEMS structure 410 (such as a corrugated microelectromechanical system (MEMS)) disposed between the front cavity 219 and the rear cavity 217, wherein applying the voltage causes the corrugated MEMS structure to deform due to the applied voltage, thereby generating sound using the speaker. The generated sound can pass through an opening 411 in a speaker housing and / or through one or more openings in a device housing to provide sound to an electronic device, such as for Figure 1 and Figure 3 One of the electronic device 100 and the electronic device 300 provides sound.

[0043] Figure 5 A perspective view of a MEMS structure 410 is shown according to one or more implementations. Figure 5 In the example of FIG. 4 , the MEMS structure 410 is formed by a single continuous structure 501 that is continuous in a first dimension (eg, Figure 5 The MEMS structure 410 may be formed by a plurality of alternating folds 500 disposed between the first edge 502 and the second edge 504. The single continuous structure 501 may be formed using MEMS manufacturing methods (e.g., deposition, etching, lithography, patterning, cutting, etc., which allow the MEMS component 204 to be mass-produced) to form a corrugated MEMS structure defined by alternating folds 500, as shown. As shown, the MEMS structure 410 has deep corrugated structures placed in close proximity with good tolerances. The microscale of the MEMS structure 410 allows for dense packing of the corrugations (which may provide advantages in terms of large surface area of ​​the actuator per total die area). As shown, the single continuous structure 501 may include tabs 514 extending along edges 502 and 504. The tabs 514 may be mounted to or disposed within a support structure or housing structure of the MEMS component 204 in various ways, as discussed in further detail below (e.g., in conjunction with Figures 15 to 17 discussed).

[0044] like Figure 5 As shown, the corrugated MEMS structure may include MEMS electrodes 510, each MEMS electrode forming a portion of a single continuous structure 501, which is perpendicular to the first dimension in a second dimension (eg, Figure 5 The alternating folded portions 500 may include an upper folded portion extending from a first side of the MEMS electrode 510 and located between two adjacent MEMS electrodes 510, and a lower folded portion extending from an opposite second end of the MEMS electrode 510 and located between two adjacent MEMS electrodes 510. The single continuous structure 501 also extends in a third dimension (e.g., perpendicular to the first and second dimensions) and is located between the corresponding pair of alternating folded portions 500. The alternating folded portions 500 may include an upper folded portion extending from a first side of the MEMS electrode 510 and located between two adjacent MEMS electrodes 510, and a lower folded portion extending from an opposite second end of the MEMS electrode 510 and located between two adjacent MEMS electrodes 510. Figure 5 The B dimension of the embodiment extends from the first end 506 to the second end 508. Figure 5 The corrugations in the corrugated MEMS structure (eg, each corrugation including an upper fold 500, a lower fold 500, and an intervening MEMS electrode 510) provide an effective die area to SD ratio (eg, a larger acoustically active area in a small volume).

[0045] In various implementations of the MEMS component 204, Figure 5 The A, B and C dimensions of the MEMS structure can be Figure 4The x, y and z directions are aligned. Figure 5 The B, A and C dimensions of Figure 4 The x-, y- and z-directions of Figure 5 The C, A and B dimensions can be compared with Figure 4 The x-, y- and z-directions are aligned (as an example).

[0046] In one or more implementations, the MEMS component 204 can include one or more MEMS structures 410 mounted between substrates. Figure 6 and Figure 7 An example is shown in which the MEMS structure 410 is disposed between substrates of the MEMS components. However, it should be understood that Figure 6 and Figure 7 The examples are illustrative, and specific implementations of a MEMS component of a MEMS speaker that does not include a substrate disposed on opposite sides of the MEMS component are also disclosed. For example, Figure 5 The MEMS component 410 and / or Figures 7 to 17 or Fig.21 The MEMS component in any example may or may not be provided with a substrate, such as a combination of Figure 6 and Figure 7 The described substrate.

[0047] exist Figure 6 In the example of FIG. 2 , an example of a MEMS component 204 is shown, which includes a first substrate 400 having a first set of openings 402, a second substrate 404 having a second set of openings 406 that are not aligned with the first set of openings, and a micro-electromechanical system (MEMS) structure 410 disposed between the first substrate 400 and the second substrate 404. In this example in which the substrate 400 and the substrate 404 are provided, Figure 2 and Figure 4 The rear cavity 217 and the front cavity 219 can be disposed outside the opening 402 and the opening 406, respectively. Figure 6 As shown in the example of FIG. 4 , the first set of openings 402 may include multiple rows of openings, each row along Figure 4 y direction. Figure 6 , but the second set of openings 406 may also be included in Figure 4 A plurality of rows of openings spaced apart in the y direction.

[0048] As shown, the MEMS component 204 may include a plurality of MEMS structures 410 that form a MEMS layer 408 between a first substrate 400 and a second substrate 404. Figure 6In the example of FIG. 4 , the MEMS layer 408 includes a MEMS structure 410 having an elongated dimension extending in a direction parallel to the rows of openings 402 and the rows of openings 406 (eg, along Figure 6 The y direction of the Figure 6 In the example of FIG. 4 , a MEMS structure 410 is Figure 6 The x-direction of the second substrate 404 (eg, in a direction perpendicular to the direction in which the rows of openings 402 and the rows of openings 406 are spaced apart) is disposed at a position between each row of openings 402 and an adjacent row of openings 406 in the second substrate 404. Figure 6 As shown, the MEMS component 204 may include a plurality of corrugated MEMS structures 410 disposed between a first substrate and a second substrate, wherein the plurality of corrugated MEMS structures are not aligned with either the first plurality of openings 402 or the second plurality of openings 406 .

[0049] Each MEMS structure 410 may be a corrugated MEMS structure, as described above in conjunction with, for example Figure 5 As described. Figure 6 As shown in the example of , a space 699 can be provided between adjacent MEMS structures in the MEMS structure 410. In this example, actuation of the MEMS structure 410 can be coordinated to generate a pressure differential in the space 699 between the actuators. The pressure differential generated in the space 699 between the actuators causes air to be pushed toward or pulled through the openings 402 and 406 to generate a pressure differential in the front and rear cavities of the speaker. In one or more specific implementations, a small space can be provided between the MEMS structure 410 and the first substrate 400 and the second substrate 404 to act as an acoustic seal, thereby preventing the pressure differential in the space 699 from escaping to the adjacent space 699. In various specific implementations, the ripples in the MEMS structure 410 can be along Figure 4 Arranged in the x direction or y direction.

[0050] exist Figure 6 In the example of FIG. 4 , the corrugated MEMS structures (eg, MEMS structure 410) are spaced apart in a direction parallel to a second dimension (eg, C dimension) of the MEMS structure. The MEMS structure 410 is disposed between the first substrate 400 and the second substrate 404. Figure 6 In the example, Figure 5 The C, A and B dimensions of the image are aligned with the x, y and z directions.

[0051] exist Figure 6 In the example of FIG. 1 , the corrugated MEMS structure (eg, MEMS structure 410) is parallel to Figure 4The MEMS electrodes 510 of each MEMS structure 410 can be actuated by applying an electrical input to the electrodes (e.g., an electrostatic input applied without using a magnet and coil assembly common in conventional speakers) to generate various movements of the MEMS structure 410, thereby generating a pressure differential (e.g., in the space 699) that pulls and / or pushes air into and / or out of the openings 402 and 406.

[0052] exist Figure 6 In the example of FIG. 4 , an exemplary implementation of the MEMS component 204 is described, wherein the MEMS layer 408 (including the plurality of MEMS structures 410) is disposed between the first substrate and the second substrate 404. However, it should also be understood that in one or more implementations, multiple layers of corrugated MEMS structures may be stacked.

[0053] Figure 7 An example is shown in which the MEMS component 204 includes a third substrate 700, which is disposed between the first substrate 400 and the second substrate 404. Figure 7 In the example of Figure 5 The described corrugated MEMS structure) is disposed (e.g., in the first MEMS layer 408-1) between the first substrate 400 and the third substrate 700, and an additional corrugated MEMS structure (e.g., the additional MEMS structure 410) is disposed (e.g., in the second MEMS layer 408-2) between the third substrate 700 and the second substrate 404. Figure 7 Each MEMS structure 410 shown can be combined with the above Figure 5 and Figure 6 The alignment described herein can be arranged and can be operated in any of the various operating motions or modes described herein. Figure 7 In the example of FIG. 4 , the MEMS structure 410 of the first MEMS layer 408 - 1 is aligned with the MEMS structure 410 of the second MEMS layer 408 - 2 to form a back cavity 702 (eg, corresponding to a back cavity 702 ) on a first side of the MEMS structure 410 . Figure 2 and / or Figure 4 The back cavity 217 of the MEMS structure 410 and the front cavity 704 (eg, corresponding to the back cavity 217 of the MEMS structure 410) are formed on the opposite second side. Figure 2 and / or Figure 4 front cavity 219).

[0054] exist Figure 7In the example of , openings are not included in the substrate because the MEMS actuator can separate the front and rear cavities in this implementation. However, it should be understood that each of the first substrate 400, the second substrate 404, and the third substrate 700 can be provided with an opening that passes from the first side of the substrate to the second side of the substrate to allow air to flow through the opening (e.g., in response to electrostatic actuation of the MEMS structure 410). For example, in various implementations, the third substrate 700 can include multiple rows of openings aligned with the openings 402 in the first substrate 400 and not aligned with the openings 406 in the second substrate 404, multiple rows of openings aligned with the openings 406 in the second substrate 404 and not aligned with the openings 402 in the first substrate 400, or multiple rows of openings aligned with the openings 402 in the first substrate 400 and aligned with the openings 406 in the second substrate 404.

[0055] Various movements of the MEMS structure 410 (eg, when the MEMS structure is provided with or without Figure 6 and Figure 7 400 and 404). The MEMS structure 410 may be configured to move in a manner similar to that of the first and second substrates 400 and 404. ... In this way, the MEMS structure 410 may be mounted in an arrangement that provides a low power, compact speaker that includes an electrostatically driven bellows MEMS structure to move air without magnets, coils, or conventional speaker membranes.

[0056] Each upper fold 500 or each lower fold 500 in the corrugated MEMS structure can elastically couple a pair of MEMS electrodes 510 together, which can be pushed together and / or pulled apart (e.g., in a breathing motion for generating a pressure differential above and below the corrugated MEMS structure) to generate sound. The MEMS speaker may include multiple corrugated MEMS structures, such as MEMS structure 410 (e.g., which may also operate in pairs). One or more corrugated MEMS structures may be installed between the front cavity and the rear cavity (e.g., and / or installed between the first substrate 400 and the second substrate 404 having the opening 402 and the opening 406) to generate a pressure differential in the front cavity and the rear cavity to generate sound.

[0057] Figure 8 Shown along parallel to Figure 5 A cross-sectional side view of the MEMS structure 410 taken along the A dimension line. Figure 5 In the example of , it can be seen that the MEMS electrode 510 (e.g., in the C dimension) extends between adjacent folds 500 (e.g., between a corresponding upper fold and a corresponding lower fold). The MEMS structure 410 can be formed of a semiconductor material (e.g., including silicon, silicon nitride, polymers, metals, ceramics, polycrystalline silicon, single crystal silicon, silicon nitride including softer materials such as polyparaxylene, polyimide, and / or composites of these materials and / or other materials). The MEMS electrode 510 can be formed of the same material as the MEMS structure 410 itself and / or can include additional or other materials (e.g., metal applied to the MEMS structure by electroplating, evaporation and / or sputtering processes). As shown in FIG. Figure 5 As shown, each fold 500 may include an insulating element 800 that electrically insulates adjacent MEMS electrodes 510 from each other. The insulating element may be formed of, for example, silicon dioxide or other insulating materials, and may be formed as shown in FIG. Figure 8 As shown, it is formed at the center of each fold or formed elsewhere between the MEMS electrodes 510. Figure 8 In the example of , MEMS structure 410 is shown without an applied electrostatic input, illustrating how MEMS electrodes 510 may be evenly spaced (e.g., by the elastic force of fold 500) in a rest state (e.g., in which no voltage is applied to MEMS electrodes 510).

[0058] Fig. 9 Shows Figure 8 FIG. 4 is a cross-sectional view of a MEMS structure 410 with various operating voltages applied. Fig. 9As shown, a DC voltage (e.g., Vdc) may be applied to the MEMS structure 410 to move adjacent MEMS electrodes 510 in a pair 900 to a predetermined distance apart. As shown, the fold 500 between the electrodes may bend, flex, bend, or otherwise deform (e.g., inwardly or outwardly) to allow the MEMS electrodes 510 to move to a desired spacing in response to the DC voltage.

[0059] An AC voltage (e.g., alternating between +Vac and -Vac) may be added to the DC voltage Vdc to cause pairs of adjacent MEMS electrodes to move away from and toward each other. Fig. 9 As indicated, when the MEMS electrodes 510 of the pair 900 are moved apart from the DC spacing (e.g., by a reduced voltage Vdc-Vac), a positive pressure (e.g., P+) may be generated above the MEMS structure (e.g., in the front cavity 219 and / or in the space 699), and a negative pressure (e.g., P-) may be generated below the MEMS structure (e.g., in the rear cavity 217 and / or in the adjacent space 699). When the MEMS electrodes 510 of the pair 900 are moved together from the DC spacing (e.g., by an increased voltage Vdc+Vac), a positive pressure (e.g., P+) may be generated below the MEMS structure (e.g., in the rear cavity 217 and / or in the adjacent space 699), and a negative pressure (e.g., P-) may be generated above the MEMS structure (e.g., in the front cavity 219 and / or in the space 699). As shown, pressure changes above and below the MEMS structure can push (e.g., when the pressure is P+) and pull (e.g., when the pressure is P-) air into and out of the speaker housing and / or into and out of the space 699 between the MEMS structures (e.g., in a specific implementation including two substrates with openings therein). The pressure difference and the movement of air result in the generation of sound. The voltage Vac can be varied regularly and / or irregularly to generate sound of a desired frequency using the MEMS component 204.

[0060] Fig. 9 The example of FIG. 4 shows actuation consisting of electrode pairs / unit actuators moving out of phase to generate a pressure gradient in a first operating mode corresponding to a breathing mode of the MEMS structure 410. It should also be understood that other operating modes (e.g., off-plane modes and / or mixed modes) are possible for the MEMS structure 410, depending on the boundary conditions at the ends and / or edges of the MEMS structure 410.

[0061] For example, Fig.101000 and 1002 (e.g., including motion along the C dimension defined by the MEMS electrodes 510 in the in-plane state 1000). Hybrid mode operation of the MEMS structure 410 may use breathing mode operation (e.g., as described above in conjunction with Fig. 9 described) and off-plane mode operation (e.g., as Fig.10 As shown in the following, the linear superposition of the two is performed. Figures 15 to 17 Various boundary conditions at the ends and / or edges of the MEMS structure 410 are described in further detail.

[0062] Before discussing the following boundary conditions, it should be understood that Figure 8 and Fig. 9 The arrangement of the folding portion 500 shown is merely illustrative, and other arrangements may be used in one or more implementations. Fig.11 and Fig.12 A portion of the MEMS structure 410 is shown in an implementation in which the fold 500 has a different thickness. Fig.11 In the example of Figure 8 and Fig. 9 Arrange as shown. Fig.12 In the example of , the fold 500 is implemented as a thinned fold 1200, showing that the thickness of the fold 500 can be adjusted to control the resilience of the corrugation to the deformation caused by the applied voltage. The thinned fold 1200 can have a sufficiently small thickness to allow the thinned fold 1200 to buckle when deformed by the applied voltage.

[0063] Fig.13 A portion of MEMS structure 410 is shown in a specific implementation where fold 500 is implemented as a corrugated fold 1300. Corrugated fold 1300 may allow fold 500 to provide a spring-like motion at the ends of the fold, wherein the spring-like (corrugated) portion of the fold is coupled to MEMS electrode 510 through a rigid portion 1302 of the fold. Fig.14 A portion of the MEMS structure 410 is shown in a specific implementation in which the fold 500 is implemented as a tent-shaped fold. Fig.14 As shown, the tent-like folds may be formed by linear rigid portions 1400 of the MEMS structure 410 that meet at compliant apex 1402 . Figure 12 to Figure 14 The illustrated implementation may help increase the compliance of the fold and the available displacement of the MEMS electrode 510 .

[0064] As mentioned above, for example Figures 8 to 10 As described, in various implementations, various boundary conditions for the MEMS structure 410 can be provided to arrange the MEMS structure 410 for various modes of operation and / or movement. Fig.15 , Fig.16 and Fig.17 Various examples of boundary conditions for MEMS structure 410 are shown, which may each be used in one or more implementations.

[0065] exist Fig.15 In the example of FIG. 4 , the edge of the MEMS structure 410 (eg, Figure 5 The first edge 502 and the second edge 504 of the embodiment are fixed. Fig.15 In the example of , the tab 514 of the MEMS structure 410 is secured to a corresponding elastic connector (e.g., the elastic connector 1502) that can flex to provide limited movement to the end of the MEMS structure. In this example, the elastic connector 1502 extends between portions of the rigid connector structure 1500 of the MEMS component 204. Securing the tab 514 to the elastic connector 1502 can provide an acoustic seal and compliance to the structure. In one or more specific implementations, the rigid connector structure 1500 can be an edge structure that extends along the edges of the MEMS component 204 and the MEMS structure 410 to support the MEMS structure. In a specific implementation where the MEMS component 204 is provided with a first substrate 400 and a second substrate 404 (e.g., as in Figure 6 ), the rigid connector structure 1500 may form a continuous portion of a monolithic structure that makes up the first substrate 400 and the second substrate 404, or may be a separate structure attached to the first substrate 400 and the second substrate 404.

[0066] Fig.16 and Fig.17 Implementations of the MEMS component 204 are shown in which the MEMS structure 410 is provided with floating edges 502 and 504. In these implementations, the available displacement of the MEMS structure 410 in response to an applied voltage can be increased relative to fixed edge implementations. Fig.16 In the example of , a portion 1600 of the tab 514 is disposed in a recess 1602 in the rigid connector structure 1500. In this example, one or more posts (such as post 1604) extending between the folded portion 500 of the MEMS structure 410 and the support structure 1605 may be provided. The support structure 1605 may be mounted to a portion of the speaker housing, may be formed from an integral portion of the speaker housing, or may be formed from a portion of the first substrate 400 and / or the second substrate 404 (e.g., in a specific implementation where a first substrate and a second substrate are provided). Fig.16In the example of , a single post 1604 extends as a central beam at the axis of symmetry of the MEMS structure to the support structure 1605. In other embodiments, one or more additional posts 1604 may be provided at selected locations as anchoring beams. The recess 1602 may extend along the entire length of the MEMS structure 410 (e.g., such that the portion 1600 extends along the entire tab 514), or the portion 1600 of the tab 514 may be an extension that extends into a separate recess 1602 provided along an edge of the MEMS structure 410. Fig.16 In the example of , the MEMS component 204 is provided with at least one anchoring beam (e.g., post 1604) extending from one of the plurality of alternating folds 500 to the support structure 1605. However, it should be understood that two or more anchoring beams (e.g., post 1604) extending from the MEMS structure 410 to one, two, or more support structures may be provided. For example, in one or more specific implementations, two or more attachment areas may be provided for slides and stability. Fig.16 In the example of FIG. 5 , the recess 1602 can act as an air roller for the portion 1600 of the tab 514 and can also provide an acoustic seal (eg, due to the high acoustic resistance in the narrow recess).

[0067] Fig.17 Another implementation of a floating edge of a MEMS structure 410 is shown in which a portion 1700 of a tab 514 rests on a low friction film 1704 within a recess 1702 in a rigid connector structure 1500. In this example, the interface 1706 between the low friction film 1704 and the portion 1700 of the tab 514 is a low friction interface that allows the tab to slide within the recess 1702. In this example, the MEMS structure 410 is not provided with a post that acts as an anchoring beam. However, in one or more implementations, the MEMS structure 410 may also be provided with a low friction film 1704 within a recess 1702. Fig.17 In a specific implementation of the sliding edge, one or more posts 1604 are provided.

[0068] exist Figures 15 to 17 In the example of FIG. 4 , a fixed edge and a floating edge of the MEMS structure 410 are described. It should also be understood that the end 506 and the end 508 (see FIG. 4 ) are fixed edges and floating edges of the MEMS structure 410. Figure 5) may also be fixed ends and / or floating ends. Fixed ends 506 and / or 508 may be provided by fixing discrete points on the ends of MEMS structure 410 to a connector structure (such as a portion of connector structure 1500 that extends along an edge of MEMS structure 410), to a substrate mounted adjacent to the MEMS structure, and / or by fixing the entire end of MEMS structure 410 to a connector structure or substrate. Fixed edges may be provided for MEMS structure 410 by fixing tabs 514 at the edges of the MEMS structure to a support structure of MEMS component 204 (e.g., such as Fig.15 ). In various implementations, the MEMS structure 410 can be mounted in the following configurations: a free-free configuration, in which the edges and ends of the MEMS structure are floating edges and floating ends; a free-fixed configuration, in which the edges of the MEMS structure are floating edges and the ends of the MEMS structure are fixed ends; a fixed-free configuration, in which the edges of the MEMS structure are fixed edges and the ends of the MEMS structure are floating ends; or a fixed-fixed configuration, in which the edges and ends of the MEMS structure are at least partially fixed. For example, in one or more implementations of the MEMS structure 410, the MEMS structure 410 is formed by a single continuous structure that is perpendicular to the first dimension (e.g., the A dimension) and the second dimension (e.g., the C dimension). Figure 5 The MEMS structure 410 extends from the first end 506 to the second end 508 in the B dimension (shown), and at least one of the first end or the second end is fixed. As another example, in one or more specific implementations, the MEMS structure 410 is formed by a single continuous structure that is perpendicular to the first dimension (e.g., the A dimension) and the second dimension (e.g., the C dimension). Figure 5 The B dimension (as shown) extends from the first end 506 to the second end 508, and the first end 506 and the second end 508 are floating ends.

[0069] As mentioned above, for example Figure 8 and Fig. 9 As described, when no voltage is applied to the corrugated MEMS structure, the alternating folds 500 and MEMS electrodes 510 can be densely packed along a first dimension (e.g., the A dimension) of the MEMS structure, with spacing allowing adjacent MEMS electrodes 510 to operate as pairs 900. However, in one or more specific implementations, a MEMS structure 410 can be provided in which some or all of the MEMS electrodes are more widely spaced (e.g., to increase the low frequency range of a MEMS speaker).

[0070] Fig.18The MEMS electrodes 510 of the MEMS structure 410 are shown to include a specific implementation of widely spaced electrodes that operate as part of a set of electrodes that includes fixed electrodes extending from one of a first substrate (such as the first substrate 400) or a second substrate (such as the second substrate 404). Fig.18 As shown, the MEMS component 204 may include one or more posts extending from at least one of the first substrate or the second substrate in a direction parallel to a second dimension (eg, C dimension) of the MEMS structure 410. Fig.18 In the example of , the MEMS component 204 includes a post 1800 extending from the first substrate 400 in the direction of the second substrate 404 and a post 1802 extending from the second substrate 404 in the direction of the first substrate 400 (e.g., in a direction parallel to the second dimension of the MEMS structure 410). In this example, each of the widely spaced MEMS electrodes 510 can operate in cooperation with a pair of posts 1800 and 1802 to actuate the MEMS electrode 510. As shown, each of the posts 1800 and 1802 extends from a corresponding substrate on a corresponding side of the MEMS structure 410 in the direction of the other substrate without passing through the MEMS structure or reaching the other substrate.

[0071] As mentioned above, for example Figure 8 and Fig. 9 As described, when no voltage is applied to the corrugated MEMS structure, the alternating folds 500 and the MEMS electrodes 510 (e.g., corrugations) of the MEMS structure 410 may be evenly spaced apart along a first dimension (e.g., A dimension) of the MEMS structure. However, in one or more other implementations, when no voltage is applied to the corrugated MEMS structure, the folds 500 and the MEMS electrodes 510 may be unevenly spaced apart along the first dimension.

[0072] Fig.19 2 shows a MEMS component 204 in an implementation where the MEMS structure 410 includes MEMS electrodes 510 that are unevenly spaced along a first dimension when no voltage is applied to the corrugated MEMS structure. Fig.19 As shown, the MEMS structure 410 may have: one or more high frequency sections 1900, wherein the MEMS electrodes 510 are closely spaced so that the MEMS electrodes operate in pairs (e.g., as described above in conjunction with Fig. 9 and one or more low frequency portions 1902, wherein the MEMS electrodes 510 are spaced widely to operate in cooperation with the fixed electrodes formed by the posts 1800 and / or 1802 (e.g., as described above in conjunction with Fig.18As described in the figure, each MEMS electrode 510 in the low frequency portion 1902 may be disposed between a pillar 1800 extending from a first substrate (such as the first substrate 400) and a second pillar extending from a second substrate (such as the second substrate 404). Fig.18 and Fig.19 As shown, each of posts 1800 and 1802 may form a fixed electrode positioned adjacent to at least one corresponding electrode of the plurality of MEMS electrodes 510. For example, each MEMS electrode 510 may be actuated by a pair of fixed electrodes formed by posts 1800 and 1802.

[0073] Fig. 20 A top view of a MEMS component 204 implemented with a varying pitch of MEMS electrodes 510 is shown. Fig. 20 In the example of FIG. 1 , the high frequency region 2002 (eg, having closely spaced electrodes, such as in FIG. 1 ) may be a plurality of electrodes having closely spaced electrodes, such as in FIG. Fig.19 The high frequency portion 1900 of FIG. 4 is visible through some of the openings 402, and the low frequency region 2000 (e.g., having electrodes with wider spacing, such as in FIG. 4 ) is visible through some of the openings 402, and the low frequency region 2000 (e.g., having electrodes with wider spacing, such as in FIG. Fig.19 The low frequency portion 1902 of the high frequency region 2002 is visible through the other openings 402. In one or more specific implementations, the high frequency region 2002 and the low frequency region 2000 may be used Fig.19 The MEMS structure 410 and the pillars 1800 and 1802 can be implemented, and / or multiple individual MEMS structures 410 can be implemented, each of which has a uniform electrode spacing (e.g., Figure 8 One or more MEMS structures 410 and Fig.18 One or more MEMS structures shown).

[0074] Fig.21 A flowchart of an exemplary process for operating a MEMS speaker according to one or more specific implementations is shown. For the purpose of explanation, this document mainly refers to Figure 1 Device 100 or Figure 3 The process 2100 is described with reference to the device 300. However, the process 2100 is not limited to Figure 1 Device 100 or Figure 3The device 300 of process 2100, and one or more blocks (or operations) of process 2100 may be performed by one or more other components and other suitable devices (e.g., any electronic device including a MEMS speaker as described herein). Further for the purpose of explanation, the blocks of process 2100 are described herein as occurring sequentially or linearly. However, multiple blocks of process 2100 may occur in parallel. In addition, the blocks of process 2100 do not have to be performed in the order shown, and / or one or more blocks of process 2100 do not have to be performed and / or may be replaced by other operations.

[0075] At block 2102, a voltage may be applied to a corrugated microelectromechanical system (MEMS) structure (e.g., MEMS structure 410 as described herein) disposed between a front cavity (e.g., front cavity 219) and a back cavity (e.g., back cavity 217). In some examples, the MEMS structure may be disposed between a first substrate (e.g., first substrate 400) having a first opening (e.g., first plurality of openings 402) and a second substrate (e.g., substrate 404) having a second opening (e.g., second plurality of openings 406) that is not aligned with the first opening. In other examples, the MEMS structure may be openly exposed to the front cavity and / or the back cavity.

[0076] At block 2104, the corrugated MEMS structure may be deformed by the applied voltage to generate sound using a speaker. In one or more implementations, the corrugated MEMS structure is formed of a single continuous structure having a first dimension (e.g., Figure 5 The corrugated MEMS structure may include one or more MEMS electrodes 510, each MEMS electrode forming a portion of a single continuous structure that extends in a second dimension perpendicular to the first dimension (e.g., A dimension) from a first edge (e.g., first edge 502) to a second edge (e.g., second edge 504), and includes one or more alternating folds 500 disposed between the first edge and the second edge. Figure 5 The MEMS structure may extend in the C dimension of the first substrate and the second substrate, and may be located between the corresponding pair of alternating folds 500. Deforming the corrugated MEMS structure may generate a pressure difference in the front cavity and the rear cavity to generate sound. In some examples, a pressure difference may be formed in the space 699 between the MEMS structures disposed between the first substrate and the second substrate, and the pressure difference causes air to move through the first opening in the first substrate and the second opening in the second substrate to generate sound.

[0077] Deforming the corrugated MEMS structure may generate a first pressure in the front cavity and a second pressure in the back cavity, the first pressure being different from the second pressure to generate sound (e.g., and / or to move air). In some examples, deforming the corrugated MEMS structure may generate a first pressure in a first set of spaces 699 between the corrugated MEMS structures and a second pressure in a set of adjacent spaces 699 between the corrugated MEMS structures, the first pressure being different from the second pressure to move air. Deforming the corrugated MEMS structure may include moving the paired MEMS electrodes 510 toward or away from each other along a first dimension (e.g., as described above in conjunction with Fig. 9 Deforming the corrugated MEMS structure may also or alternatively include deforming a single continuous structure in a direction parallel to the second dimension (e.g., in a direction as described above in conjunction with Fig.10 In one or more embodiments, the direction parallel to the second dimension extends along the surface of the second substrate (e.g., as described above in conjunction with Figure 6 described).

[0078] Fig. 22 An electronic system 2200 is shown that can be used to implement one or more implementations of the subject technology. The electronic system 2200 can be Figure 1 One or more of the devices 100 or 300 shown, and / or may be a part thereof. The electronic system 2200 may include various types of computer-readable media and interfaces for various other types of computer-readable media. The electronic system 2200 includes a bus 2208, one or more processing units 2212, a system memory 2204 (and / or a cache), a ROM 2210, a permanent storage device 2202, an input device interface 2214, an output device interface 2206, and one or more network interfaces 2216, or subsets and variations thereof.

[0079] The bus 2208 generally represents all system, peripheral, and chipset buses that communicatively connect the many internal devices of the electronic system 2200. In one or more specific implementations, the bus 2208 communicatively connects one or more processing units 2212 with the ROM 2210, the system memory 2204, and the permanent storage device 2202. The one or more processing units 2212 retrieve instructions to be executed and data to be processed from these various memory units in order to perform the processes disclosed in the present subject matter. In different specific implementations, the one or more processing units 2212 can be a single processor or a multi-core processor.

[0080] ROM 2210 stores static data and instructions required by one or more processing units 2212 and other modules of the electronic system 2200. On the other hand, permanent storage device 2202 can be a read-write memory device. Permanent storage device 2202 can be a non-volatile memory unit that stores instructions and data even when the electronic system 2200 is turned off. In one or more specific implementations, a mass storage device (such as a magnetic or optical disk and its corresponding disk drive) can be used as permanent storage device 2202.

[0081] In one or more specific implementations, a removable storage device (such as a floppy disk, a flash drive and its corresponding disk drive) can be used as the permanent storage device 2202. Like the permanent storage device 2202, the system memory 2204 can be a read-write memory device. However, unlike the permanent storage device 2202, the system memory 2204 can be a volatile read-write memory, such as a random access memory. The system memory 2204 can store any of the instructions and data that one or more processing units 2212 may need at runtime. In one or more specific implementations, the processes disclosed in the subject matter are stored in the system memory 2204, the permanent storage device 2202, and / or the ROM 2210. The one or more processing units 2212 retrieve instructions to be executed and data to be processed from these various memory units in order to perform the processes of one or more specific implementations.

[0082] The bus 2208 is also connected to an input device interface 2214 and an output device interface 2206. The input device interface 2214 enables a user to transmit information and select commands to the electronic system 2200. Input devices that can be used with the input device interface 2214 may include, for example, an alphanumeric keyboard and a pointing device (also referred to as a "cursor control device"). The output device interface 2206 may enable, for example, the display of images generated by the electronic system 2200. Output devices that can be used with the output device interface 2206 may include, for example, a printer and a display device, such as a liquid crystal display (LCD), a light emitting diode (LED) display, an organic light emitting diode (OLED) display, a flexible display, a flat panel display, a solid-state display, a projector, or any other device for outputting information. One or more specific implementations may include a device that acts as both an input device and an output device, such as a touch screen. In these specific implementations, the feedback provided to the user may be any form of sensory feedback, such as visual feedback, auditory feedback, or tactile feedback; and input from the user may be received in any form, including acoustic, voice, or tactile input.

[0083] Finally, if Fig. 22As shown, bus 2208 also couples electronic system 2200 to one or more networks and / or to one or more network nodes via one or more network interfaces 2216. In this manner, electronic system 2200 may be part of a computer network, such as a LAN, a wide area network ("WAN"), or an intranet, or may be part of a network of networks, such as the Internet. Any or all components of electronic system 2200 may be used with the subject disclosure.

[0084] According to some aspects of the subject disclosure, a speaker is provided, the speaker comprising: a front cavity; a rear cavity; and a corrugated micro-electromechanical system (MEMS) structure disposed between the front cavity and the rear cavity.

[0085] According to other aspects of the subject disclosure, a method of operating a speaker is provided, the method comprising: applying a voltage to a corrugated microelectromechanical system (MEMS) structure disposed between a front cavity and a rear cavity; and deforming the corrugated MEMS structure by the applied voltage to generate sound using the speaker.

[0086] According to other aspects of the subject disclosure, an electronic device is provided. The electronic device includes a speaker. The speaker includes: a front cavity; a rear cavity; and a corrugated micro-electromechanical system (MEMS) structure disposed between the front cavity and the rear cavity.

[0087] According to other aspects of the subject disclosure, a speaker is provided, comprising: a first substrate having a first plurality of openings; a second substrate having a second plurality of openings that are not aligned with the first plurality of openings; and a corrugated microelectromechanical system (MEMS) structure disposed between the first substrate and the second substrate.

[0088] According to other aspects of the subject disclosure, there is provided a method of operating a speaker, the method comprising: applying a voltage to a corrugated microelectromechanical system (MEMS) structure disposed between a first substrate and a second substrate, the first substrate having a first plurality of openings, the second substrate having a second plurality of openings that are not aligned with the first plurality of openings; and deforming the corrugated MEMS structure by the applied voltage to generate sound using the speaker.

[0089] According to other aspects of the subject disclosure, an electronic device is provided, the electronic device including a speaker, the speaker including: a first substrate having a first plurality of openings; a second substrate having a second plurality of openings that are not aligned with the first plurality of openings; and a corrugated microelectromechanical system (MEMS) structure disposed between the first substrate and the second substrate.

[0090] Implementations within the scope of the present disclosure may be implemented in part or in whole using a tangible computer-readable storage medium (or multiple tangible computer-readable storage media of one or more types) programmed with one or more instructions. Tangible computer-readable storage media may also be non-transitory in nature.

[0091] Computer-readable storage media can be any storage media that can be read, written, or otherwise accessed by a general or special computing device, including any processing electronics and / or processing circuitry capable of executing instructions. For example, without limitation, computer-readable media can include any volatile semiconductor memory, such as RAM, DRAM, SRAM, T-RAM, Z-RAM, and TTRAM. Computer-readable media can also include any non-volatile semiconductor memory, such as ROM, PROM, EPROM, EEPROM, NVRAM, flash memory, nvSRAM, FeRAM, FeTRAM, MRAM, PRAM, CBRAM, SONOS, RRAM, NRAM, racetrack memory, FJG, and Millipede memory.

[0092] In addition, the computer-readable storage medium may include any non-semiconductor memory, such as optical disk storage, magnetic disk storage, magnetic tape, other magnetic storage devices, or any other medium capable of storing one or more instructions. In one or more specific implementations, the tangible computer-readable storage medium may be directly coupled to the computing device, while in other specific implementations, the tangible computer-readable storage medium may be indirectly coupled to the computing device, for example, via one or more wired connections, one or more wireless connections, or any combination thereof.

[0093] Instructions can be directly executable, or can be used to develop executable instructions. For example, instructions can be implemented as executable or non-executable machine code, or can be implemented as high-level language instructions that can be compiled to produce executable or non-executable machine code. In addition, instructions can also be implemented as data, or can include data. Computer executable instructions can also be organized in any format, including routines, subroutines, programs, data structures, objects, modules, applications, applets, functions, etc. As recognized by those skilled in the art, the details including but not limited to the number, structure, sequence and organization of instructions can be significantly different without changing the underlying logic, function, processing and output.

[0094] Although the above discussion mainly relates to a microprocessor or multi-core processor that executes software, one or more specific implementations are performed by one or more integrated circuits such as ASICs or FPGAs. In one or more specific implementations, such integrated circuits execute instructions stored on the circuit itself.

[0095] The various functions described above may be implemented in digital electronic circuits, computer software, firmware or hardware. The technology may be implemented using one or more computer program products. A programmable processor and a computer may be included in a mobile device or packaged as a mobile device. The process and logic flow may be performed by one or more programmable processors and one or more programmable logic circuits. General and special computing devices and storage devices may be interconnected via a communication network.

[0096] Some specific implementations include electronic components such as microprocessors, storage devices, and memories that store computer program instructions in machine-readable or computer-readable media (or computer-readable storage media, machine-readable media, or machine-readable storage media). Some examples of such computer-readable media include RAM, ROM, CD-ROM, CD-R, CD-RW, digital versatile disk (e.g., DVD-ROM, double-layer DVD-ROM), various recordable / rewritable DVDs (e.g., DVD-RAM, DVD-RW, DVD+RW, etc.), flash memory (e.g., SD card, mini-SD card, micro-SD card, etc.), magnetic and / or solid-state hard drives, ultra-density optical disks, any other optical or magnetic media, and floppy disks. Computer-readable media can store computer programs that can be executed by at least one processing unit and include instruction sets for performing various operations. Examples of computer programs or computer codes include machine code, such as machine code generated by a compiler, and files including higher-level code that can be executed by a computer, electronic component, or microprocessor using an interpreter.

[0097] Although the above discussion mainly involves microprocessors or multi-core processors that execute software, some implementations are performed by one or more integrated circuits such as application specific integrated circuits (ASICs) or field programmable gate arrays (FPGAs). In some implementations, such integrated circuits execute instructions stored on the circuits themselves.

[0098] As used in this specification and any claims of this patent application, the terms "computer", "processor" and "memory" refer to electronic or other technical devices. These terms exclude people or groups of people. For the purposes of this specification, the terms "display" or "displaying" mean displaying on an electronic device. As used in this specification and any claims of this patent application, the terms "computer-readable medium" and "computer-readable media" are entirely limited to tangible, tangible objects that store information in a form that can be read by a computer. These terms do not include any wireless signals, wired download signals, and any other transient signals.

[0099] Many of the features and applications described above can be implemented as a software process specified as a set of instructions recorded on a computer-readable storage medium (also referred to as a computer-readable medium). When these instructions are executed by one or more processing units (e.g., one or more processors, cores of a processor, or other processing units), these instructions cause the one or more processing units to perform the actions indicated in the instructions. Examples of computer-readable media include, but are not limited to, CD-ROMs, flash drives, RAM chips, hard drives, EPROMs, etc. Computer-readable media do not include carrier waves and electrical signals transmitted wirelessly or through wired connections.

[0100] In this specification, the term "software" is intended to include firmware residing in a read-only memory or applications stored in a magnetic storage device, which can be read into a memory for processing by a processor. Similarly, in some specific implementations, while retaining the different software aspects disclosed in this subject, multiple software aspects disclosed in this subject can be implemented as sub-parts of a larger program. In some specific implementations, multiple software aspects can also be implemented as independent programs. Finally, any combination of independent programs that jointly implement the software aspects described herein is within the scope of this subject disclosure. In some specific implementations, when installed to run on one or more electronic systems, the software program defines one or more specific machine implementations that execute and enforce the operations of the software program.

[0101] A computer program (also referred to as a program, software, software application, script, or code) may be written in any form of programming language, including compiled or interpreted languages, declarative or procedural languages, and may be deployed in any form, including as a stand-alone program or as a module, component, subroutine, object, or other unit suitable for use in a computing environment. A computer program may, but need not, correspond to a file in a file system. A program may be stored in a portion of a file that holds other programs or data (e.g., one or more scripts stored in a markup language document), in a single file dedicated to the program in discussion, or in multiple coordinated files (e.g., files storing one or more modules, subroutines, or code portions). A computer program may be deployed to execute on one computer or on multiple computers located at the same site or distributed across multiple sites and interconnected by a communications network.

[0102] It should be understood that the specific order or the hierarchical structure of the frame in the process disclosed by the present invention are the illustration of exemplary methods. Based on the design preferred requirements, it should be understood that the specific order or the hierarchical structure of the frame in the process can be rearranged or all the frames shown are executed. Some frames in these frames can be executed simultaneously. For example, in some cases, multitasking and parallel processing may be advantageous. In addition, the division of each system component in the above-mentioned embodiment should not be understood as requiring this type of division in all embodiments, and it should be understood that the program component and system can be generally integrated in a single software product or encapsulated in a plurality of software products.

[0103] The previous description is provided to enable those skilled in the art to practice the various aspects described herein. Various modifications of these aspects are apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects. Therefore, the claims are not intended to be limited to the aspects shown herein, but are intended to make the full scope consistent with the language claims, wherein reference to elements in singular values ​​is not intended to mean "one and only one", but to refer to "one or more", unless specifically noted. Unless otherwise specifically stated, the term "some" refers to one or more. Male pronouns (e.g., his) include female and neutral (e.g., her and its), and vice versa. Titles and subtitles (if any) are used only for convenience and do not limit the subject disclosure.

[0104] The predicate words "configured to," "operable to," and "programmed to" do not imply any specific tangible or intangible modification of a subject matter but are intended to be used interchangeably. For example, a component or a processor configured to monitor and control an operation may also mean that the processor is programmed to monitor and control the operation or that the processor is operable to monitor and control the operation. Likewise, a processor configured to execute code may be interpreted as a processor programmed to execute code or operable to execute code.

[0105] Phrases such as "aspects" do not mean that the aspect is essential to the subject technology or that the aspect applies to all configurations of the subject technology. A disclosure related to an aspect may apply to all configurations, or one or more configurations. Phrases such as aspects may refer to one or more aspects and vice versa. Phrases such as "configurations" do not mean that the configuration is essential to the subject technology or that the configuration applies to all configurations of the subject technology. A disclosure related to a configuration may apply to all configurations or one or more configurations. Phrases such as configurations may refer to one or more configurations and vice versa.

[0106] The word “exemplary” is used herein to mean “serving as an example or illustration.” Any aspect or design described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other aspects or designs.

[0107] In one aspect, the term "coupled" or the like may refer to a direct coupling. On the other hand, the term "coupled" or the like may refer to an indirect coupling.

[0108] Terms such as top, bottom, front, back, side, horizontal, vertical, etc. refer to an arbitrary frame of reference, not the usual gravitational frame of reference. Thus, such terms may extend upward, downward, diagonally, or horizontally in a gravitational frame of reference.

[0109] All structural and functional equivalents of the elements throughout the various aspects described in this disclosure that are known or later become known to those of ordinary skill in the art are expressly incorporated herein by reference and are intended to be covered by the claims. In addition, anything disclosed herein is not intended to be provided to the public, regardless of whether the disclosure is explicitly stated in the claims. No claim element should be interpreted under the provisions of 35 U.S.C. §112(f) unless the element is explicitly stated using the phrase "device for..." or, in the case of a method claim, the element is stated using the phrase "step for..." In addition, the terms "including", "having", etc. are used in the specification or claims to the extent that such terms are intended to be included in a manner similar to how the term "including" is interpreted when used as a transitional word in a claim.

Claims

1. An audio transducer, comprising: Anterior cavity; rear cavity; and A corrugated micro-electromechanical system (MEMS) structure, wherein the corrugated MEMS structure is arranged between the front cavity and the rear cavity, wherein the corrugated MEMS structure comprises a single continuous structure extending from a first edge to a second edge in a first dimension, the single continuous structure comprising a plurality of alternating folds disposed between the first edge and the second edge, and comprising a plurality of MEMS electrodes, each MEMS electrode forming a portion of the single continuous structure, the portion extending between a corresponding pair of alternating folds in the plurality of alternating folds in a second dimension perpendicular to the first dimension, wherein a first MEMS electrode of the plurality of MEMS electrodes has a first cross-sectional thickness, and Wherein for the first MEMS electrode among the plurality of MEMS electrodes, each fold of a corresponding pair of alternating folds among the plurality of alternating folds has a second cross-sectional thickness that is less than the first cross-sectional thickness.

2. The audio transducer according to claim 1, wherein: The plurality of MEMS electrodes are configured to move toward and away from each other along the first dimension in response to a voltage applied to the corrugated MEMS structure.

3. The audio transducer according to claim 1, wherein: Movement of the plurality of MEMS electrodes toward and away from each other is configured to generate a respiratory motion that generates a pressure differential above and below the corrugated MEMS structure to generate sound for the audio transducer.

4. The audio transducer according to claim 1, wherein: Each of the alternating folds comprises a thinned fold.

5. The audio transducer according to claim 1, wherein Each of the alternating folds comprises a corrugated fold.

6. The audio transducer according to claim 5, wherein: Each corrugated fold includes a pair of rigid portions connected by a corrugated portion of the corrugated fold, each rigid portion of the pair of rigid portions being coupled to a respective one of a pair of the MEMS electrodes.

7. The audio transducer according to claim 1, wherein: Each of the alternating folds comprises a tent fold.

8. The audio transducer according to claim 7, wherein: Each tent-like fold includes a pair of linear rigid portions that meet at a compliant apex.

9. A loudspeaker, comprising: Anterior cavity; rear cavity; and A corrugated micro-electromechanical system (MEMS) structure, wherein the corrugated MEMS structure is arranged between the front cavity and the rear cavity, wherein the corrugated MEMS structure comprises a single continuous structure extending from a first edge to a second edge in a first dimension, the single continuous structure comprising a plurality of alternating folds disposed between the first edge and the second edge, and comprising a plurality of MEMS electrodes, each MEMS electrode forming a portion of the single continuous structure, the portion extending between a corresponding pair of alternating folds in the plurality of alternating folds in a second dimension perpendicular to the first dimension, wherein the plurality of MEMS electrodes comprise a plurality of MEMS electrode pairs elastically coupled together by corresponding folding portions in the alternating folding portions, and wherein each pair of MEMS electrodes in the MEMS electrode pairs is configured to be pushed together and pulled apart during a breathing movement, wherein the breathing movement generates a pressure difference above and below the corrugated MEMS structure to generate sound for the speaker.

10. The loudspeaker according to claim 9, wherein: The plurality of MEMS electrode pairs are configured to be pushed together and pulled apart out of phase to generate the breathing motion.

11. The loudspeaker according to claim 10, wherein: The plurality of MEMS electrodes are further configured to cause out-of-plane motion of the corrugated MEMS structure in a direction parallel to the second dimension.

12. The speaker of claim 9, further comprising a first substrate and a second substrate, wherein the corrugated MEMS structure is disposed between the first substrate and the second substrate, and the first substrate and the second substrate are spaced apart along a third dimension perpendicular to the first dimension and the second dimension.

13. The loudspeaker according to claim 12, wherein: The first substrate includes a first plurality of openings, the second substrate includes a second plurality of openings, and the first plurality of openings are not aligned with the second plurality of openings.

14. The loudspeaker of claim 13, further comprising a plurality of additional corrugated MEMS structures disposed between the first substrate and the second substrate, wherein the corrugated MEMS structure and the plurality of additional corrugated MEMS structures are misaligned with both the first plurality of openings and the second plurality of openings.

15. The loudspeaker according to claim 9, wherein The single continuous structure extends in the first dimension from an edge of the first moveable mount to an edge of the second moveable mount.

16. The loudspeaker of claim 15, further comprising at least one anchoring beam extending from one of the plurality of alternating folds to a support structure.

17. A method comprising: applying a voltage to a corrugated micro-electromechanical system (MEMS) structure of a loudspeaker, wherein the corrugated MEMS structure comprises a single continuous structure extending from a first edge to a second edge in a first dimension, the single continuous structure comprising a plurality of alternating folds disposed between the first edge and the second edge, and comprising a plurality of MEMS electrodes, each MEMS electrode forming a portion of the single continuous structure, the portion extending between a corresponding pair of the plurality of alternating folds in a second dimension perpendicular to the first dimension, and wherein the plurality of MEMS electrodes comprises a plurality of MEMS electrode pairs elastically coupled together by corresponding ones of the alternating folds; and The corrugated MEMS structure is deformed in a breathing motion by pushing each of the MEMS electrode pairs together and pulling apart by an applied voltage, the breathing motion generating a pressure differential above and below the corrugated MEMS structure to generate sound for the speaker.

18. The method according to claim 17, wherein: Deforming the corrugated MEMS structure during the breathing motion causes air to move through openings in a substrate disposed adjacent to the corrugated MEMS structure to generate the sound.

19. The method according to claim 17, wherein: Deforming the corrugated MEMS structure in the breathing motion includes pushing one or more pairs of MEMS electrodes in the MEMS electrode pairs together and apart through the applied voltage out of phase with pushing the other one or more pairs of MEMS electrodes in the MEMS electrode pairs together and apart.

20. The method of claim 17, further comprising deforming the corrugated MEMS structure by the applied voltage in an out-of-plane motion in addition to the breathing motion.

21. A loudspeaker, comprising: Anterior cavity; rear cavity; and A micro-electromechanical system (MEMS) structure, wherein the MEMS structure is arranged between the front cavity and the rear cavity, Wherein the MEMS structure comprises a plurality of MEMS element pairs, and wherein each pair of MEMS element pairs is configured to be pushed together and pulled apart in a breathing motion that generates sound for the speaker.

22. The speaker of claim 21, further comprising a first substrate and a second substrate, wherein the MEMS structure is disposed between the first substrate and the second substrate.

23. The loudspeaker according to claim 22, wherein The first substrate includes a first plurality of openings, the second substrate includes a second plurality of openings, and the first plurality of openings are not aligned with the second plurality of openings.

24. The speaker of claim 23, further comprising a plurality of additional MEMS structures disposed between the first substrate and the second substrate, wherein the MEMS structure and the plurality of additional MEMS structures are misaligned with both the first plurality of openings and the second plurality of openings.

25. The loudspeaker according to claim 21, wherein The MEMS structure includes a single continuous structure extending from an edge of a first movably mounted edge to an edge of a second movably mounted edge.

26. The loudspeaker of claim 25, further comprising at least one anchor extending from a location between one of the pair of MEMS elements to a support structure.

27. The loudspeaker of claim 21, wherein: The plurality of MEMS element pairs are configured to be pushed together and pulled apart out of phase to generate the breathing motion.

28. The loudspeaker according to claim 27, wherein The plurality of MEMS element pairs are also configured to cause out-of-plane motion of the MEMS structure.

29. The loudspeaker of claim 21, wherein: The plurality of MEMS element pairs include a plurality of MEMS electrode pairs, each of the plurality of MEMS electrode pairs being coupled together through a corresponding fold in the MEMS structure.

30. The loudspeaker of claim 21, wherein The MEMS structure comprises a corrugated MEMS structure, and wherein the plurality of MEMS element pairs comprises a plurality of parallel portions of the corrugated MEMS structure.

31. A method comprising: applying a voltage to a micro-electromechanical system (MEMS) structure of a speaker, wherein the MEMS structure includes a plurality of MEMS element pairs; as well as The MEMS structure is deformed in a breathing motion by pushing each of the MEMS element pairs together and pulling apart by an applied voltage, the breathing motion generating sound for the speaker.

32. The method according to claim 31, wherein: Deforming the MEMS structure during the breathing motion causes air to move through an opening in a substrate disposed adjacent to the MEMS structure to generate the sound.

33. The method of claim 32, wherein: Deforming the MEMS structure in the breathing motion includes pushing one or more pairs of the MEMS elements in the pair together and pulling them apart through the applied voltage out of phase with pushing the other one or more pairs of the MEMS elements in the pair together and pulling them apart.

34. The method of claim 33, further comprising deforming the MEMS structure by the applied voltage also in an out-of-plane motion in addition to the breathing motion.

35. The method of claim 31, wherein: Pushing each pair of MEMS elements in the pair of MEMS elements together and pulling them apart by the applied voltage includes pushing a first portion of each MEMS element in each pair of MEMS elements together and pulling them apart while maintaining a distance between a second portion of each MEMS element in the pair of MEMS elements, the second portion being located at the ends of the pair of MEMS elements.

36. The method of claim 35, wherein: The second portion of each of the MEMS elements comprises a portion of a fold of the MEMS structure, and wherein the first portion of each of the MEMS elements comprises a MEMS electrode extending from the fold.

37. A micro-electromechanical system (MEMS) structure, comprising: A plurality of MEMS element pairs, wherein each pair of MEMS element pairs is configured to be pushed together and pulled apart in a breathing motion that generates sound for a speaker.

38. The MEMS structure of claim 37, wherein: The MEMS structure is configured to be disposed between a front cavity and a rear cavity of the speaker.

39. The MEMS structure of claim 37, wherein: Each of the pairs of MEMS elements includes a pair of MEMS electrodes formed from a portion of the MEMS structure.

40. The MEMS structure of claim 39, wherein: The MEMS structure is a corrugated MEMS structure.

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