A molding process for improving the molding quality of rigid-flexible circuit boards

Abstract

The present invention discloses a molding process for improving the molding quality of a rigid-flexible circuit board. The present invention relates to the technical field of the production and molding of rigid-flexible circuit boards. The process comprises the following steps: S1, a worker takes out a printed circuit board (1) from a material basket, fixes the horizontal tooling of the printed circuit board (1) on the table of a tooling table of a saw blade cutting machine, and uses the saw blade cutting machine to cut a plurality of stoppers (4) on the top surfaces of the left and right ends of the printed circuit board (1); S2, after the plurality of stoppers (4) are cut and processed on the top surfaces of the left and right ends of the printed circuit board (1), the saw blade cutting machine cuts a plurality of grooves (5) on the top surface of the printed circuit board (1) and between the stoppers (4) on the left and right sides; S5, a hot pressing head is pressed onto the top surface of an FPC board (3), thereby hot pressing and molding the first rigid-flexible circuit board. The present invention has the beneficial effects of greatly improving the molding quality of the rigid-flexible circuit board and increasing the service life of the rigid-flexible circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of production and molding of a rigid-flexible circuit board, and in particular to a molding process for improving the molding quality of a rigid-flexible circuit board. Background Art

[0002] As consumer electronics evolve toward thinner, more integrated, and more multifunctional features, the manufacturing process requirements for rigid-flex PCBs are becoming increasingly demanding. Rigid-flex PCBs, with their superior electrical performance and fast transmission speeds, are widely used in consumer electronics, industrial and medical electronics, and military equipment, where they are highly favored. Furthermore, rigid-flex PCBs boast faster transmission speeds than conventional circuit boards.

[0003] The structure of the rigid-flex circuit board produced in a workshop is as follows Figure 1 As shown, it includes a printed circuit board 1, a layer of cured sheet 2 is hot-pressed in the middle of the printed circuit board 1, and a layer of FPC board 3 is hot-pressed on the top surface of the cured sheet 2. The method of producing this soft and hard combination circuit board in the workshop is:

[0004] S1. A worker takes out a printed circuit board 1 and places it flat on the hot pressing table of a hot press;

[0005] S2. The worker places a curing sheet 2 on the top surface of the printed circuit board 1. Figure 2 As shown, ensure that the four outer edges of the cured sheet 2 are flush with the four outer edges of the printed circuit board 1, and then place an FPC board 3 on the top surface of the cured sheet 2, ensuring that the four outer edges of the FPC board 3 are flush with the four outer edges of the cured sheet 2;

[0006] S3, control the hot pressing head of the hot pressing machine to move downward, and press the hot pressing head onto the top surface of the FPC board 3. At this time, the heat on the hot pressing head is transferred to the FPC board 3, and the FPC board 3 then transfers the heat to the curing sheet 2. When the curing sheet 2 is heated, the curing sheet 2 firmly connects the FPC board 3 and the printed circuit board 1 together, thereby hot pressing and forming the first soft-rigid combination circuit board;

[0007] S4: The worker repeats steps S1 to S3 to continuously produce multiple rigid-flex circuit boards.

[0008] However, although the method used in the workshop can produce a batch of rigid-flex circuit boards, the following technical defects are still reflected in actual production:

[0009] I. When the hot pressing head 7 of the hot pressing machine is pressed onto the top surface of the FPC board 3, the material on the outer edge of the cured sheet 2 overflows to the outside of the printed board 1, and the overflow direction is as follows: Figure 3As shown by the middle arrow, it is attached to the four outer end surfaces of the printed circuit board 1 [the process requires that the four outer end surfaces of the printed circuit board 1 of the produced soft and hard combination circuit board should not be attached with overflowing cured sheet 2]. Therefore, the molding method in the workshop undoubtedly reduces the molding quality of the soft and hard combination circuit board.

[0010] II. After this type of rigid-flex circuit board has been used for a period of time, the cured sheet 2 inside the rigid-flex circuit board will easily age and fall off from the printed circuit board 1, causing the FPC board 3 to fall off together with the cured sheet 2 [while the process requires that the cured sheet 2 should not fall off from the printed circuit board 1 after long-term use of the rigid-flex circuit board]. Therefore, the molding method in the workshop undoubtedly further reduces the molding quality of the rigid-flex circuit board and further shortens the service life of the entire rigid-flex circuit board.

[0011] Therefore, there is an urgent need for a molding process that can greatly improve the molding quality of rigid-flex circuit boards and increase the service life of rigid-flex circuit boards. Summary of the Invention

[0012] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a molding process for improving the molding quality of a rigid-flexible circuit board, which greatly improves the molding quality of the rigid-flexible circuit board and increases the service life of the rigid-flexible circuit board.

[0013] The object of the present invention is achieved through the following technical solution: a molding process for improving the molding quality of a rigid-flexible circuit board, which comprises the following steps:

[0014] S1. A worker takes a printed circuit board from a material basket and fixes its horizontal tooling on the table of a saw blade cutting machine. The saw blade cutting machine cuts multiple stoppers on the top surface of the left and right ends of the printed circuit board, ensuring that each stopper is horizontally distributed.

[0015] S2. After cutting a plurality of stoppers on the top surface of the left and right ends of the printed circuit board, a plurality of grooves are cut on the top surface of the printed circuit board between the left and right stoppers using a saw blade cutting machine, while ensuring that the plurality of grooves are distributed longitudinally;

[0016] S3. After cutting and processing a plurality of grooves on the top surface of the printed circuit board, the worker uses the grinding wheel of the grinder to grind off the burrs on the top edge of each stop, and then uses the grinding wheel of the grinding equipment to grind off the burrs on the top surface of each groove;

[0017] S4. The worker takes out a hollow rectangular frame and places it on the hot pressing table of the hot press. Then, the worker places the printed circuit board in the frame. Then, the worker places a curing sheet in the frame, ensuring that the curing sheet covers the top surface of the printed circuit board. Then, the worker places an FPC board in the frame, ensuring that the FPC board covers the top surface of the curing sheet.

[0018] S5. Control the hot pressing head of the hot press to move downward, press the hot pressing head onto the top surface of the FPC board, transfer the heat from the hot pressing head to the FPC board, and the FPC board transfers the heat to the curing sheet. When the curing sheet is heated, the material at the left and right edges of the curing sheet flows into each stop to form a first pulling portion. At the same time, the material in the middle of the curing sheet flows into each groove to form a second pulling portion, thereby forming the first rigid-flex circuit board through hot pressing. After hot pressing, the formed rigid-flex circuit board is removed from the enclosure.

[0019] S6. The worker repeats steps S1 to S5 to continuously produce multiple rigid-flex circuit boards.

[0020] In step S1, the longitudinal distances between two adjacent stoppers are equal.

[0021] In step S2, the horizontal distances between every two adjacent grooves are equal.

[0022] The size of the cured sheet is equal to that of the printed board.

[0023] The hollow rectangular cavity of the surrounding frame matches the outer contour of the printed circuit board.

[0024] The present invention has the following advantages: greatly improving the molding quality of the rigid-flexible circuit board and increasing the service life of the rigid-flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a structural diagram of a rigid-flex circuit board produced in a certain workshop;

[0026] Figure 2 Schematic diagram of placing a curing sheet on the top surface of the printed circuit board;

[0027] Figure 3 This is a schematic diagram of the material on the outer edge of the cured sheet overflowing onto the outside of the printed board;

[0028] Figure 4 A schematic diagram showing a plurality of stoppers cut into the top surfaces of the left and right ends of a printed circuit board;

[0029] Figure 5 for Figure 4 A top view of

[0030] Figure 6 A schematic diagram of cutting a plurality of grooves on the top surface of a printed circuit board between the left and right stoppers;

[0031] Figure 7 for Figure 6 A top view of

[0032] Figure 8 Schematic diagram of the structure of the frame;

[0033] Figure 9 for Figure 8 The main cross-sectional diagram of

[0034] Figure 10 A schematic diagram of placing a printed circuit board in a frame;

[0035] Figure 11 Schematic diagram of an FPC board covering the top surface of a cured sheet;

[0036] Figure 12 Schematic diagram of the thermal press head pressing onto the top surface of the FPC board;

[0037] Figure 13 This is a schematic diagram of the structure of the formed rigid-flex circuit board;

[0038] In the picture:

[0039] 1-printed circuit board, 2-curing sheet, 3-FPC board, 4-stop, 5-groove, 6-frame, 7-hot pressing head, 8-first pulling part, 9-second pulling part. DETAILED DESCRIPTION

[0040] The present invention will be further described below with reference to the accompanying drawings, and the protection scope of the present invention is not limited to the following:

[0041] A molding process for improving the molding quality of a rigid-flexible circuit board comprises the following steps:

[0042] S1. The worker takes out a printed circuit board 1 from the material basket, fixes the horizontal tooling on the table of the saw blade cutting machine, and uses the saw blade cutting machine to cut multiple stoppers 4 on the top surface of the left and right ends of the printed circuit board 1. Figure 4~Figure 5 As shown, at the same time, ensure that each stopper 4 is horizontally distributed; the longitudinal spacing between each two adjacent stoppers 4 is equal;

[0043] S2. After a plurality of stoppers 4 are cut on the top surface of the left and right ends of the printed circuit board 1, a plurality of grooves 5 are cut on the top surface of the printed circuit board 1 and between the stoppers 4 on the left and right sides by a saw blade cutting machine. Figure 6-7 As shown, at the same time, ensure that the multiple grooves 5 are distributed longitudinally; the horizontal spacing between each two adjacent grooves 5 is equal;

[0044] S3. After cutting and processing a plurality of grooves 5 on the top surface of the printed circuit board 1, the worker uses the grinding wheel of the grinder to grind away the burrs on the top edge of each stop 4, and then uses the grinding wheel of the grinding equipment to grind away the burrs on the top surface of each groove 5;

[0045] S4, the worker takes out a hollow rectangular frame 6, the structure of the frame 6 is as follows Figures 8 and 9 As shown, the hollow rectangular cavity of the frame 6 matches the outer contour of the printed circuit board 1. The frame 6 is placed on the hot pressing table of the hot press, and then the printed circuit board 1 is placed in the frame 6. Figure 10 As shown, a curing sheet 2 is then placed in the frame 6. The size of the curing sheet 2 is equal to the size of the printed circuit board 1. Ensure that the curing sheet 2 covers the top surface of the printed circuit board 1. Then, an FPC board 3 is placed in the frame 6. Ensure that the FPC board 3 covers the top surface of the curing sheet 2. Figure 11 As shown;

[0046] S5, control the hot pressing head 7 of the hot pressing machine to move downward, and press the hot pressing head onto the top surface of the FPC board 3, as shown in FIG. Figure 12 As shown, the heat on the hot pressing head 7 is transferred to the FPC board 3, and the FPC board 3 then transfers the heat to the curing sheet 2. When the curing sheet 2 is heated, the material at the left and right edges of the curing sheet 2 flows into each stop 4 to form a first pulling portion 8. At the same time, the middle material of the curing sheet 2 flows into each groove 5 to form a second pulling portion 9, thereby forming the first soft and hard combination circuit board through hot pressing. After hot pressing, the formed soft and hard combination circuit board is removed from the frame. The structure of the formed soft and hard combination circuit board is shown in FIG. Figure 13 As shown;

[0047] S6. The worker repeats steps S1 to S5 to continuously produce multiple rigid-flex circuit boards.

[0048] Since the left and right materials of the cured sheet 2 flow into the stoppers 4 located on the left and right sides of the printed board 1 to form the first pulling portions 8 located on the left and right sides of the printed board 1, the first pulling portions 8 located on the left and right sides of the printed board 1 pull the left and right ends of the cured sheet 2, thereby preventing the cured sheet 2 from falling off the printed board 1; in addition, since the middle material of the cured sheet 2 flows into each groove 5 to form the second pulling portion 9, the second pulling portion 9 pulls the middle part of the cured sheet 2, thereby further preventing the cured sheet 2 from falling off the printed board 1.

[0049] It can be seen from this that when the rigid-flex circuit board is used for a long time, the cured sheet 2 will not fall off the printed circuit board 1. Compared with the molding method in the workshop, the molding quality of the rigid-flex circuit board is greatly improved, and at the same time, the service life of the rigid-flex circuit board is extended.

[0050] In addition, it can be seen from step S4 that when the hot pressing head is hot-pressed on the FPC board 3, the frame 6 surrounds the printed circuit board 1, the curing sheet 2 and the FPC board 3, thereby effectively preventing the curing sheet 2 from overflowing onto the four outer end surfaces of the printed circuit board 1. Compared with the molding method in the workshop, the molding quality of the soft-hard combination circuit board is further greatly improved.

[0051] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or substitute equivalents for some of the technical features. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A molding process for improving the molding quality of a rigid-flex circuit board, characterized by: It includes the following steps: S1. A worker takes out a printed circuit board (1) from a material basket, fixes the horizontal tooling on the table of the saw blade cutting machine, and uses the saw blade cutting machine to cut a plurality of stoppers (4) on the top surface of the left and right ends of the printed circuit board (1), while ensuring that each stopper (4) is horizontally distributed; S2. After a plurality of stoppers (4) are cut on the top surface of the left and right ends of the printed circuit board (1), a plurality of grooves (5) are cut on the top surface of the printed circuit board (1) and between the stoppers (4) on the left and right sides by a saw blade cutting machine, and at the same time, it is ensured that the plurality of grooves (5) are all distributed longitudinally; S3. After cutting and processing a plurality of grooves (5) on the top surface of the printed circuit board (1), the worker grinds away the burrs on the top edge of each stop (4) with the grinding wheel of the grinder, and then grinds away the burrs on the top surface of each groove (5) with the grinding wheel of the grinding equipment; S4. The worker takes out a hollow rectangular frame (6), places the frame (6) on the hot pressing table of the hot press, and then puts the printed circuit board (1) into the frame (6), and then puts a curing sheet (2) into the frame (6), ensuring that the curing sheet (2) covers the top surface of the printed circuit board (1), and then puts an FPC board (3) into the frame (6), ensuring that the FPC board (3) covers the top surface of the curing sheet (2); S5, control the hot pressing head (7) of the hot pressing machine to move downward, and press the hot pressing head onto the top surface of the FPC board (3), and the heat on the hot pressing head (7) is transferred to the FPC board (3), and the FPC board (3) then transfers the heat to the curing sheet (2). When the curing sheet (2) is heated, the material at the left and right edges of the curing sheet (2) flows into each stop (4) to form a first pulling portion (8). At the same time, the material in the middle of the curing sheet (2) flows into each groove (5) to form a second pulling portion (9), thereby forming the first soft and hard combination circuit board by hot pressing. After hot pressing, the formed soft and hard combination circuit board is taken out from the enclosure; S6. The worker repeats steps S1 to S5 to continuously produce multiple rigid-flex circuit boards.

2. A molding process for improving the molding quality of a rigid-flexible circuit board according to claim 1, characterized in that: In step S1, the longitudinal spacing between each two adjacent stoppers (4) is equal.

3. The molding process for improving the molding quality of a rigid-flexible circuit board according to claim 1, characterized in that: In step S2, the horizontal spacing between each two adjacent grooves (5) is equal.

4. The molding process for improving the molding quality of a rigid-flexible circuit board according to claim 1, characterized in that: The size of the cured sheet (2) is equal to the size of the printed board (1).

5. The molding process for improving the molding quality of a rigid-flexible circuit board according to claim 1, characterized in that: The hollow rectangular cavity of the surrounding frame (6) matches the outer contour of the printed circuit board (1).

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