A multifunctional integrated device for welding head R axis used in a crystal bonding machine

Abstract

The present invention relates to the field of semiconductor packaging technology, and in particular to a multifunctional integrated device for the R axis of a welding head used in a solid crystal machine, comprising a base one and a rotary drive assembly, the front end of the base one is slidably connected to a bearing seat, a rotatable suction assembly is installed on the bearing seat, the rotary drive assembly is installed to the base one and is connected to the suction assembly drive, the rear end of the base one is movably installed with a base three, the rear end of the base three is movably installed with a base two, a force control assembly is installed on the base one, the force control assembly is connected to the bearing seat through a lifting plate, a height measuring contact piece is installed on one side of the front end of the base one through an insulating seat, the upper end of the height measuring contact piece contacts the lower surface of the bearing seat, and the bearing seat and the height measuring contact piece are respectively connected to form a closed loop. At the moment of contacting the chip, once a slight displacement occurs, the bearing seat and the height measuring contact piece are disengaged, the loop is disconnected, and the overall welding head R axis stops moving to ensure that there is no overpressure.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a welding head R-axis multifunctional integrated device used in a crystal bonding machine. Background Art

[0002] A die bonder, also known as a die loading machine, wafer pasting machine or chip bonding machine, is a key device in the semiconductor back-end packaging process. It is an automated production equipment that uses vision-guided technology to automatically pick up chips from wafers and bond (a method of wire bonding in the chip production process) them to lead frames.

[0003] During the bonding process, a welding head is needed to heat the metal wire to a high temperature, then melt it and apply it to the bare wafer and wires to connect them together at high temperature. In order to improve work efficiency, the welding head is often integrated with the chip suction component. This integrated design enables the die bonder to perform the bonding operation immediately after completing the chip pickup. The chip itself is relatively thin, and the chip will break if the contact force of the chip suction component is slightly greater during operation. This breakage not only causes waste in the production process, but may also affect the quality and reliability of the entire semiconductor product. Summary of the invention

[0004] The object of the present invention is to provide a multifunctional integrated device for the R-axis of a welding head used in a die bonding machine to ensure that appropriate force can be applied when picking up and placing chips without overpressure.

[0005] In order to solve the above technical problems, the present invention provides a multifunctional integrated device for the R axis of a welding head used in a crystal bonding machine: it includes a base one and a rotation drive component; the front end of the base one is slidably connected to a bearing seat, a rotatable suction component is installed on the bearing seat, and the rotation drive component is installed to the base one and is driven and connected to the suction component; the rear end of the base one is movably installed with an angle-adjustable base three, and the rear end of the base three is movably installed with an angle-adjustable base two, and by adjusting the angles of the base three and the base two, the suction component is in horizontal contact with the material; a force control component is installed on the base one, and the force control component is connected to the bearing seat through a lifting plate, and the force control component applies a control force when the bearing seat slides along the base one, thereby accurately controlling the contact force between the suction component and the material; a height measuring contact piece is installed on one side of the front end of the base one through an insulating seat, and the upper end of the height measuring contact piece is in contact with the lower surface of the bearing seat, and the bearing seat and the height measuring contact piece are respectively externally connected to form a closed loop.

[0006] Preferably, the force control component includes a voice coil motor and a spring pressure piece, the lifting plate is mounted to the output end of the voice coil motor, the spring pressure piece is mounted to the upper surface of the base, and a compression spring is abutted between the spring pressure piece and the lifting plate.

[0007] Preferably, both the upper surface of the lifting plate and the lower surface of the spring compression piece are provided with limiting holes, the two limiting holes are arranged opposite to each other, and the two ends of the compression spring are respectively embedded in the corresponding limiting holes.

[0008] Preferably, screw holes 1 are provided on both sides of base 1, and oblong holes 1 facing screw holes 1 are provided on both sides of base 3. Base 3 is hinged to base 1 through a pin shaft, and a groove is provided on the lower surface of base 1, and an eccentric pin 1 for angle fine-tuning connected to base 3 is provided in the groove.

[0009] Preferably, a positioning groove is provided on one of the inner walls of the base three, a through hole connected to the outer wall of the base three is provided in the positioning groove, the angle fine-tuning eccentric pin includes a limit plate, the limit plate is embedded in the positioning groove, an adjusting screw cap passing through the through hole is provided at one end of the limit plate, an eccentric pin is provided at the other end of the limit plate, the eccentric pin is located in the groove, and the width of the groove is consistent with the diameter of the eccentric pin.

[0010] Preferably, the base one is provided with a positioning pin, a second screw hole and a third oblong hole located on the same central axis, the base two is provided with a positioning hole adapted to the positioning pin and a second oblong hole adapted to the second screw hole, and the oblong hole three is provided with an eccentric pin two for angle fine-tuning connected to the base two.

[0011] Preferably, the angle fine-tuning eccentric pin 2 includes a circular plate embedded in the oblong hole 3, the diameter of the circular plate is consistent with the aperture width of the oblong hole 3, the base 2 is provided with a through hole 2 adapted to the oblong hole 3, and one end of the circular plate is provided with an adjusting screw cap 2 passing through the through hole 2.

[0012] Preferably, the upper end of the height measuring contact piece is in the shape of a ball head.

[0013] Preferably, the rotary drive assembly includes a servo motor, the servo motor is mounted on a base two, a synchronous pulley two is mounted on the output shaft of the servo motor, a synchronous pulley one is mounted on the upper end of the suction assembly, and the synchronous pulley one is connected to the synchronous pulley two via a synchronous belt.

[0014] Preferably, the suction assembly includes a rotating core shaft installed on a bearing seat through a bearing, the synchronous pulley is installed on the upper end of the rotating core shaft, and the lower end of the rotating core shaft is connected to a suction nozzle rod.

[0015] After adopting the above technical solution, the beneficial effects of the present invention are:

[0016] At the moment of contacting the chip, once a slight displacement occurs, the bearing seat and the height measuring contact piece are disengaged, the circuit is disconnected, and the R-axis of the entire welding head stops moving to ensure that there is no overpressure. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 This is a schematic diagram of the installation of the force control component;

[0020] Figure 3 It is a schematic diagram of the structure of the suction component;

[0021] Figure 4 This is the installation diagram of base three;

[0022] Figure 5 for Figure 4 Schematic diagram of the local structure;

[0023] Figure 6 This is the installation diagram of base 2.

[0024] Description of the accompanying drawings: 1-base one, 2-suction assembly, 3-bearing seat, 4-synchronous pulley one, 5-servo motor, 6-synchronous pulley two, 7-base two, 8-synchronous belt, 9-base three, 10-voice coil motor, 11-lifting plate, 12-compression spring, 13-spring pressure piece, 14-slide rail assembly, 15-insulating seat, 16-height measuring contact piece, 17-suction nozzle rod, 18-long round hole one , 19-screw hole one, 20-groove, 21-angle fine-tuning eccentric pin one, 22-pin shaft, 23-limiting plate, 24-eccentric pin, 25-positioning groove, 26-through hole one, 27-adjusting screw cap one, 28-positioning pin, 29-positioning hole, 30-long round hole two, 31-adjusting screw cap two, 32-through hole two, 33-long round hole three, 34-round plate, 35-screw hole two, 36-rotating mandrel. DETAILED DESCRIPTION

[0025] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present invention and are not configured to limit the present invention. For those skilled in the art, the present invention can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by illustrating examples of the present invention.

[0026] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of the present invention. In the description of the present invention, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0027] like Figures 1 to 6 As shown, an embodiment of the present invention provides a welding head R-axis multifunctional integrated device used in a crystal bonding machine, including a base 1, a suction component 2, a bearing seat 3, a force control component and a rotation drive component, to ensure that appropriate force can be applied when picking up and placing chips without overpressure.

[0028] The bearing seat 3 is installed at the front end of the base 1 through the slide rail assembly 14, and the rear end of the base 1 is movably installed with an angle-adjustable base 3 9, and the rear end of the base 3 9 is movably installed with an angle-adjustable base 2 7. The suction assembly 2 includes a rotating mandrel 36, which is installed on the bearing seat 3 through a bearing and is the core rotating component of the suction assembly 2. The upper end of the rotating mandrel 36 is fixedly installed with a synchronous pulley 1 4, and the lower end of the rotating mandrel 36 is fixedly connected with a suction nozzle rod 17. The rotary drive assembly includes a servo motor 5, which is installed on the base 2 7, and a synchronous pulley 2 6 is installed on the output shaft of the servo motor 5. The synchronous pulley 2 6 is connected to the synchronous pulley 1 4 through a synchronous belt 8 to achieve power transmission.

[0029] The servo motor 5 is started, and its output shaft drives the synchronous pulley 2 6 to rotate. The synchronous belt 8 transmits the rotational power of the synchronous pulley 2 6 to the synchronous pulley 1 4 synchronously. The synchronous pulley 1 4 drives the rotating mandrel 36 to rotate, and then drives the suction nozzle rod 17 to rotate. The suction nozzle rod 17 can rotate during the suction process to adjust the angle of the chip. The air inlet at the upper end of the rotating mandrel 36 is connected to the air circuit through a rotary joint, and the rotation control of any angle within the range of ±360° is performed through the servo control feedback of the servo motor 5.

[0030] A height measuring contact 16 is installed on one side of the front end of the base 1 through an insulating seat 15 to ensure electrical isolation from other components. The upper end of the height measuring contact 16 is in the shape of a ball head and contacts the lower surface of the bearing seat 3. The bearing seat 3 and the height measuring contact 16 are connected to the control system through external connecting wires to form a closed loop. In the initial state, the height measuring contact 16 contacts the bearing seat 3, and the loop is in a conducting state.

[0031] The base 2 7 is installed at the output end of the driving device (not shown) and is used to drive the entire welding head R-axis device to move up and down to perform the task of sucking the chip. When the suction nozzle rod 17 touches the chip when moving down to suck the chip, the bearing seat 3 will be slightly displaced due to the obstruction of the chip. This displacement causes the height measuring contact member 16 to be out of contact with the bearing seat 3, thereby disconnecting the closed circuit. After the circuit is disconnected, the control system detects this change and immediately stops the movement of the entire welding head R-axis to prevent further downward pressure from causing overpressure or damage.

[0032] The force control assembly includes a voice coil motor 10, a lifting plate 11 and a spring pressure piece 13, and the two ends of the lifting plate 11 are respectively connected to the mover of the voice coil motor 10 and the upper surface of the bearing seat 3. The spring pressure piece 13 is installed on the upper surface of the base 1, and a compression spring 12 is abutted between the spring pressure piece 13 and the lifting plate 11. The upper surface of the lifting plate 11 and the lower surface of the spring pressure piece 13 are both provided with limiting holes, and the two limiting holes are arranged oppositely. The two ends of the compression spring 12 are respectively embedded in the corresponding limiting holes, which can prevent the compression spring 12 from falling off or shifting.

[0033] The voice coil motor 10 is a linear motor driven by electromagnetic force. When the voice coil motor 10 drives the lifting plate 11 to move upward, the lifting plate 11 will exert an upward force on the bearing seat 3. The compression spring 12 will provide a basic downward force on the lifting plate 11, thereby preventing the bearing seat 3 from moving upward.

[0034] By controlling the current of the voice coil motor 10, the upward force applied by the lifting plate 11 to the bearing seat 3 can be adjusted to offset the spring force of the compression spring 12. When this upward force is equal to the downward force provided by the compression spring 12, the two are in a balanced state, thereby achieving relative stillness between the suction nozzle rod 17 and the base 1. When the suction nozzle rod 17 contacts the chip, even if the contact force is very small, this balanced state will be broken, and the upward force is greater than the downward force provided by the compression spring 12, and the suction nozzle rod 17 moves upward, thereby causing the height measuring contact member 16 to break contact with the bearing seat 3.

[0035] Screw holes 19 are provided on both sides of the base 1, and oblong holes 18 facing the screw holes 19 are provided on both sides of the base 3 9. The base 3 9 is hinged to the base 1 through a pin shaft 22. A groove 20 is provided on the lower surface of the base 1, and an angle fine-tuning eccentric pin 21 connected to the base 3 9 is provided in the groove 20. A circular positioning groove 25 is provided on one of the inner side walls of the base 3 9, and a through hole 26 connected to the outer side wall of the base 3 9 is provided in the positioning groove 25, and the through hole 26 is coaxial with the positioning groove 25. The angle fine-tuning eccentric pin 21 includes a limit plate 23, which is embedded in the positioning groove 25, and an adjustment screw cap 27 passing through the through hole 26 is provided at one end of the limit plate 23, and an eccentric pin 24 is provided at the other end of the limit plate 23. The inner diameter of the through hole 26 is consistent with the diameter of the adjusting screw cap 27, the shape of the limiting plate 23 is consistent with the shape of the positioning groove 25, and the adjusting screw cap 27 is coaxial with the limiting plate 23. The eccentric pin 24 is located in the groove 20, and the width of the groove 20 is consistent with the diameter of the eccentric pin 24.

[0036] The base 1 is provided with a positioning pin 28, a second screw hole 35 and a third oblong hole 33 located on the same central axis, the base 27 is provided with a positioning hole 29 adapted to the positioning pin 28 and a second oblong hole 30 adapted to the second screw hole 35, and the third oblong hole 33 is provided with an angle fine-tuning eccentric pin 2 connected to the base 27. The angle fine-tuning eccentric pin 2 includes a circular plate 34 embedded in the third oblong hole 33, and the diameter of the circular plate 34 is consistent with the aperture width of the third oblong hole 33. The base 27 is provided with a second through hole 32 adapted to the third oblong hole 33, and one end of the circular plate 34 is provided with a second adjusting screw cap 31 passing through the second through hole 32, and the diameter of the second adjusting screw cap 31 is consistent with the inner diameter of the second through hole 32.

[0037] In order to ensure that the nozzle rod 17 is in horizontal contact with the chip, it is necessary to fine-tune the angle through the angle fine-tuning eccentric pin 1 21 and the angle fine-tuning eccentric pin 2. Horizontal contact can ensure that the contact surface between the nozzle rod 17 and the chip is completely consistent, avoiding uneven contact or misalignment caused by angle deviation. If the contact between the nozzle rod 17 and the chip is not horizontal, it is likely to cause damage or scratches on the chip surface.

[0038] Since the base 2 7 is installed at the output end of the driving device, the base 2 7 is fixed as an adjustment reference during the adjustment process.

[0039] When the adjusting screw cap 27 is rotated, since the position of the adjusting screw cap 27 is fixed relative to the base 3 9, it will push the eccentric pin 24 to rotate in the groove 20. The rotation of the eccentric pin 24 will generate a torque, which pushes the inner wall of the groove 20, causing the base 1 to deflect around the pin 22 as a whole. The deflection of the base 1 will change the angle between it and the base 3 9, thereby achieving fine adjustment of the angle when the nozzle rod 17 installed on the base 1 contacts the chip. After the angle adjustment is completed, tighten the bolt on the screw hole 19 to complete the position locking of the base 1.

[0040] When the adjusting screw cap 2 31 is rotated, since the position of the adjusting screw cap 2 31 is fixed relative to the base 2 7, it will drive the circular plate 34 to rotate in the oblong hole 3 33. The rotation of the circular plate 34 will generate a torque, which pushes the inner wall of the oblong hole 33, causing the base 3 9 to deflect around the positioning pin 28 as a whole. The deflection of the base 3 9 will change the angle between it and the base 2 7, thereby achieving fine adjustment of the angle when the nozzle rod 17 installed on the base 1 contacts the chip. After completing the angle adjustment, tighten the bolt on the screw hole 2 35 to complete the position locking of the base 3 9.

[0041] According to the embodiments of the present invention as described above, these embodiments do not describe all the details in detail, nor do they limit the invention to specific embodiments. Obviously, many modifications and changes can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can make good use of the present invention and the modified use based on the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for preventing overpressure in a die bonding machine, characterized in that: Based on a welding head R-axis multifunctional integrated device used in a crystal bonding machine, the welding head R-axis multifunctional integrated device comprises a base one (1) and a rotary drive component; the front end of the base one (1) is slidably connected to a bearing seat (3), a rotatable suction component (2) is installed on the bearing seat (3), and the rotary drive component is installed on the base one (1) and is drivably connected to the suction component (2); the rear end of the base one (1) is movably installed with an angle-adjustable base three (9), and the rear end of the base three (9) is movably installed with an angle-adjustable base two (7), and by adjusting the angles of the base three (9) and the base two (7), the suction component (2) is in horizontal contact with the material; a force control component is installed on the base one (1), and the force control component is connected to the bearing seat (3) through a lifting plate (11), and the force control component is in contact with the bearing seat (3 ) applies a control force when sliding along the base one (1), thereby accurately controlling the contact force between the suction component (2) and the material; the force control component comprises a voice coil motor (10) and a spring pressure piece (13), the lifting plate (11) is mounted on the output end of the voice coil motor (10), the spring pressure piece (13) is mounted on the upper surface of the base one (1), and a compression spring (12) is abutted between the spring pressure piece (13) and the lifting plate (11); the upper surface of the lifting plate (11) and the lower surface of the spring pressure piece (13) are both provided with limit holes, the two limit holes are arranged opposite to each other, and the two ends of the compression spring (12) are respectively embedded in the corresponding limit holes; a height measuring contact piece (16) is installed on one side of the front end of the base one (1) through an insulating seat (15), and the bearing seat (3) and the height measuring contact piece (16) are respectively connected to form a loop; In the initial state, the upper end of the height measuring contact member (16) contacts the lower surface of the bearing seat (3), the circuit is connected, the upward force applied by the voice coil motor (10) to the bearing seat (3) through the lifting plate (11) is equal to the downward force applied by the compression spring (12), and the system reaches a balanced state; When the welding head R-axis multifunctional integrated device moves downward to absorb the chip, when the end of the absorption component (2) contacts the chip, the equilibrium state is broken, the height measuring contact piece (16) is disengaged from the bearing seat (3), the circuit is disconnected, and the welding head R-axis multifunctional integrated device stops moving downward to prevent overpressure.

2. The overpressure prevention method for taking out materials from a crystal bonding machine according to claim 1 is characterized in that: The base one (1) is provided with a screw hole one (19) on both sides, the base three (9) is provided with an oblong hole one (18) facing the screw hole one (19) on both sides, the base three (9) is hinged to the base one (1) via a pin shaft (22), the lower surface of the base one (1) is provided with a groove (20), and the groove (20) is provided with an eccentric pin one (21) for fine-tuning the angle connected to the base three (9).

3. The overpressure prevention method for taking out materials from a crystal bonding machine according to claim 2, characterized in that: A positioning groove (25) is provided on one of the inner side walls of the base three (9), and a through hole (26) communicating with the outer side wall of the base three (9) is provided in the positioning groove (25). The angle fine-tuning eccentric pin (21) comprises a limiting plate (23), and the limiting plate (23) is embedded in the positioning groove (25). An adjusting screw cap (27) passing through the through hole (26) is provided at one end of the limiting plate (23), and an eccentric pin (24) is provided at the other end of the limiting plate (23). The eccentric pin (24) is located in the groove (20), and the width of the groove (20) is consistent with the diameter of the eccentric pin (24).

4. The overpressure prevention method for taking out materials from a crystal bonding machine according to claim 1, characterized in that: The base one (1) is provided with a positioning pin (28), a second screw hole (35) and a third oblong hole (33) located on the same central axis; the base two (7) is provided with a positioning hole (29) adapted to the positioning pin (28) and a second oblong hole (30) adapted to the second screw hole (35); and the third oblong hole (33) is provided with an eccentric pin for fine-tuning an angle connected to the base two (7).

5. The overpressure prevention method for taking out materials from a crystal bonding machine according to claim 4, characterized in that: The angle fine-tuning eccentric pin 2 comprises a circular plate (34) embedded in the oblong hole 3 (33), the diameter of the circular plate (34) being consistent with the aperture width of the oblong hole 3 (33), the base 2 (7) being provided with a through hole 2 (32) adapted to the oblong hole 3 (33), and one end of the circular plate (34) being provided with an adjusting screw cap 2 (31) passing through the through hole 2 (32).

6. The overpressure prevention method for taking out materials from a die bonder according to claim 1, characterized in that: The upper end of the height measuring contact piece (16) is in the shape of a ball head.

7. The overpressure prevention method for taking out materials from a crystal bonding machine according to claim 1 is characterized in that: The rotary drive assembly comprises a servo motor (5), the servo motor (5) being mounted on a second base (7), a second synchronous pulley (6) being mounted on an output shaft of the servo motor (5), a first synchronous pulley (4) being mounted on an upper end of the suction assembly (2), and the first synchronous pulley (4) being connected to the second synchronous pulley (6) via a synchronous belt (8).

8. The overpressure prevention method for taking out materials from a crystal bonding machine according to claim 7, characterized in that: The suction assembly (2) comprises a rotating core shaft (36) mounted on a bearing seat (3) via a bearing, the synchronous pulley 1 (4) is mounted on the upper end of the rotating core shaft (36), and the lower end of the rotating core shaft (36) is connected to a suction nozzle rod (17).

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