A crane device and wafer cassette transportation method

Abstract

The application provides a crane device and a wafer box transportation method. The crane device comprises a cavity, a grabbing device movably connected in the cavity, the grabbing device being capable of extending out of the cavity or being capable of retracting into the cavity. A detection device is fixedly connected in the cavity and located between a first preset position and a second preset position. The detection device is used for detecting whether a wafer box is in place according to a wafer type in the wafer box after the wafer box is grabbed by the grabbing device. The grabbing device extends out of the cavity, grabs the wafer box and retracts into the cavity. The grabbing device drives the wafer box to move from top to bottom according to the wafer type in the wafer box. When the wafer box is located at the first preset position or the second preset position in the cavity, the detection device detects different feedback signals. According to the feedback signals, the position of the wafer box can be determined, and according to the wafer type and the position of the wafer box, whether the wafer box is in place can be determined, so that the crane device can be compatible with wafer boxes carrying wafers of different sizes.

Description

Technical Field

[0001] This invention relates to the field of wafer transport technology, and more particularly to an overhead crane device and a wafer box transport method. Background Technology

[0002] With the continuous deepening and expansion of research and development in semiconductor chip materials, new semiconductor material wafers are constantly emerging and gradually entering intelligent cleanroom factories where wafers are the main processing product. With technological advancements, the size of wafers for new semiconductor materials has consistently followed a development trend from small to large sizes. Currently, common wafer sizes with mass production value include 6-inch, 8-inch, and 12-inch wafers. Taking silicon carbide (SiC), a third-generation semiconductor material, as an example, cleanrooms processing 6-inch SiC have already appeared on the market. With the successful fabrication of 8-inch SiC wafers in the laboratory, cleanrooms processing both 6-inch and 8-inch SiC wafers are becoming the future development direction.

[0003] Currently, the main material handling system in intelligent cleanrooms is the overhead crane system, which consists primarily of the crane itself and the track. The track is suspended from the ceiling joists of the cleanroom, and the crane runs along it, moving to the target machine via a track that runs throughout the entire factory. The crane's built-in motor drives a belt conveyor for lifting and lowering, simultaneously activating a gripping device to grab the wafer cassette's handle, thus achieving automated material loading and unloading. The widespread adoption of overhead crane systems has solved the problem of insufficient manpower in factories, improved the accuracy of material handling and production efficiency, and reduced product loss caused by human error. Therefore, automated material handling overhead crane systems are highly favored by high-end manufacturing industries. However, due to the difference in wafer cassette size between Type I and Type II wafers, a single overhead crane cannot currently handle both types of wafer cassettes simultaneously.

[0004] Therefore, there is a need for an overhead crane device that can be compatible with wafer cassettes for transporting both type I and type II wafers. Summary of the Invention

[0005] To overcome the problems existing in the related technologies, one of the objectives of the present invention is to provide an overhead crane device that is compatible with wafer cassettes for transporting first-type wafers and wafer cassettes for transporting second-type wafers.

[0006] A crane device includes a cavity, in which a gripping device is movably connected, the gripping device being able to extend from or retract into the cavity; a detection device is fixedly connected within the cavity, the detection device being located between a first preset position and a second preset position; the detection device is used to detect whether the wafer cassette is in position according to the type of wafer in the wafer cassette after the gripping device has gripped it.

[0007] In a preferred embodiment of the present invention, a fixing device is provided near the detection device, the fixing device being used to fix the wafer cassette after the wafer cassette is in place.

[0008] In a preferred embodiment of the present invention, the gripping device includes a gripping part and a conveyor belt, the first end of the conveyor belt being connected to the inner wall of the cavity, and the second end of the conveyor belt being connected to the gripping part.

[0009] In a preferred embodiment of the present invention, the cavity includes a first support member and a second support member, wherein the first support member and the second support member are arranged facing each other.

[0010] In a preferred embodiment of the present invention, the detection device includes a photoelectric transmitter and a photoelectric receiver. The photoelectric transmitter is disposed on the first support member, and the photoelectric receiver is disposed on the second support member. The photoelectric transmitter and the photoelectric receiver are at the same height.

[0011] In a preferred embodiment of the present invention, the fixing device includes a first guardrail and a second guardrail disposed on the first support member, and a third guardrail and a fourth guardrail disposed on the second support member; the first guardrail and the third guardrail are disposed facing each other, and the second guardrail and the fourth guardrail are disposed facing each other; the first guardrail is located above the second guardrail, and the third guardrail is located above the fourth guardrail.

[0012] In a preferred embodiment of the present invention, the cavity further includes a connector, the two ends of which are respectively connected to the first support and the second support, and the connector is connected to the gripping device, which is located between the first support and the second support.

[0013] A second objective of this invention is to provide a wafer cassette transport method, based on the overhead crane device described in any of the preceding claims, the method comprising:

[0014] The system receives a handling instruction and controls the gripping device to grip the wafer cassette according to the handling instruction; wherein the handling instruction includes the wafer type.

[0015] The gripping device is controlled to move to a first preset position or a second preset position according to the wafer type;

[0016] The detection device is controlled to detect whether the wafer cassette is in place. If it is in place, the gripping device is controlled to fix the wafer cassette on the fixing device.

[0017] If the overhead crane reaches its destination, the gripping device is controlled to place the wafer cassette at the target location.

[0018] In a preferred embodiment of the present invention, controlling the gripping device to move to a first preset position or a second preset position according to the wafer type includes:

[0019] If the wafer type is a first type wafer, then control the gripping device to move to a first preset position; the first preset position is located between the first guardrail and the third guardrail;

[0020] If the wafer type is a second type wafer, then control the gripping device to move to a second preset position; the second preset position is located between the second guardrail and the fourth guardrail.

[0021] In a preferred embodiment of the present invention, controlling the detection device to detect whether the wafer cassette is in position includes:

[0022] If the wafer type is a first type wafer, and the photoelectric receiver receives the photoelectric signal emitted by the photoelectric transmitter, then the wafer cassette is in place;

[0023] If the wafer type is a second type wafer, and the photoelectric receiver does not receive the photoelectric signal emitted by the photoelectric transmitter, then the wafer cassette is in place.

[0024] In a preferred embodiment of the present invention, controlling the gripping device to fix the wafer cassette on the fixing device includes:

[0025] If the wafer type is a first type wafer, then control the first guardrail and the third guardrail to extend and place the wafer box on the first guardrail and the third guardrail;

[0026] If the wafer type is a second type wafer, then the second guardrail and the fourth guardrail are extended to place the wafer box on the second guardrail and the fourth guardrail.

[0027] In a preferred embodiment of the present invention, controlling the gripping device to place the wafer cassette at the target position includes:

[0028] If the wafer type is a first type wafer, then control the first guardrail and the third guardrail to retract, and control the gripping device to place the wafer box at the target position;

[0029] If the wafer type is a second type wafer, then the second and fourth guardrails are retracted, and the gripping device is controlled to place the wafer box at the target position.

[0030] The beneficial effects of this invention are as follows: This invention provides an overhead crane device, including a cavity, in which a gripping device is movably connected. The gripping device can extend from or retract from the cavity. A detection device is fixedly connected within the cavity, located between a first preset position and a second preset position. The detection device is used to detect whether the wafer cassette is in position according to the type of wafer inside after the gripping device grips it. The gripping device extends from the cavity, grips the wafer cassette, and then retracts into the cavity. The gripping device drives the wafer cassette to move downwards according to the type of wafer inside. When the wafer cassette is at the first or second preset position within the cavity, the feedback signal detected by the detection device is different. The position of the wafer cassette can be determined based on the feedback signal. Combining the wafer type and the position of the wafer cassette, it can be determined whether the wafer cassette is in position, thereby enabling the above-mentioned overhead crane device to be compatible with handling wafer cassettes of different sizes of wafers, such as wafer cassettes for first-type wafers and wafer cassettes for second-type wafers. Attached Figure Description

[0031] Figure 1 This is a front view of the overhead crane device of the present invention;

[0032] Figure 2 This is a front view of the cavity in which the detection device and the fixing device are disposed;

[0033] Figure 3 This is a front view of the cavity of the present invention;

[0034] Figure 4 This is a flowchart of the wafer cassette transportation method of the present invention;

[0035] Figure 5 This is a flowchart of the detection device of the present invention detecting whether the wafer cell is in position.

[0036] Reference numerals: 1. Cavity; 2. Gripping device; 3. Detection device; 4. Wafer box; 5. Fixing device; 6. Gripping part; 7. Conveyor belt; 8. First support member; 9. Second support member; 10. Photoelectric transmitter; 11. Photoelectric receiver; 12. First guardrail; 13. Second guardrail; 14. Third guardrail; 15. Fourth guardrail; 16. Connector. Detailed Implementation

[0037] Preferred embodiments of the invention will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the invention are shown in the drawings, it should be understood that the invention can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the invention will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0038] Example 1

[0039] like Figures 1-3 As shown, this embodiment provides a crane device, including a cavity 1. A gripping device 2 is movably connected inside the cavity 1. The gripping device 2 can extend out of the cavity 1 or retract into the cavity 1. A detection device 3 is fixedly connected inside the cavity 1. The detection device 3 is located between a first preset position and a second preset position. The detection device 3 is used to detect whether the wafer cassette 4 is in place according to the type of wafer in the wafer cassette 4 after the gripping device 2 grips the wafer cassette 4.

[0040] A gripping device 2 is connected to the top of the cavity 1, and the height of the gripping device 2 is adjustable. When it is necessary to grip the wafer cassette 4, the gripping device 2 extends out of the cavity 1 to clamp the mushroom-shaped head on the wafer cassette 4 on the first machine. After gripping the wafer cassette 4, the gripping device 2 shortens and retracts into the cavity 1, at which point the wafer cassette 4 is located above the detection device 3.

[0041] The wafers inside wafer cassette 4 are of two types: type 1 wafers and type 2 wafers. Wafer cassette 4 for type 2 wafers is higher than that for type 1 wafers. A preset position is determined based on the wafer type, and the gripping device 2 lowers wafer cassette 4 until it reaches the preset position. The preset positions differ for different wafer types. The first preset position for type 1 wafers is located above the second preset position for type 2 wafers; that is, the second preset position is closer to the opening of cavity 1 than the first preset position.

[0042] The first type of wafer and the second type of wafer have the following three combinations: (1) the first type of wafer is a 6-inch wafer and the second type of wafer is an 8-inch wafer; (2) the first type of wafer is a 6-inch wafer and the second type of wafer is a 12-inch wafer; (3) the first type of wafer is an 8-inch wafer and the second type of wafer is a 12-inch wafer.

[0043] The size of the gripping device 2 is smaller than the size of the opening of the cavity 1. When it is necessary to grip the wafer cassette 4, the gripping device 2 extends out of the opening. When it is necessary to send the wafer cassette 4 back into the cavity 1 for fixation, the gripping device 2 clamps the wafer cassette 4 and drives the wafer cassette 4 to retract into the cavity 1 through the opening.

[0044] The detection device 3 is a photoelectric sensor. The photoelectric sensor establishes an optical path within the cavity 1, located between a first preset position and a second preset position. When it is necessary to fix the wafer cassette 4 according to the wafer type, the gripping device 2 moves the wafer cassette 4 towards the opening of the cavity 1. When the wafer cassette 4 descends to the second preset position, it blocks the light, thus breaking the optical path. After the wafer cassette 4 is located within the cavity 1, the gripping device 2 is controlled to descend the wafer cassette 4 to either the first preset position or the second preset position according to the wafer type. Therefore, whether the detection device 3 detects a broken optical path indicates whether the wafer cassette 4 has descended to the second preset position. If the detection device 3 detects a broken optical path, it means the wafer cassette 4 has descended to the second preset position; if the detection device 3 detects an open optical path, it means the wafer cassette 4 has descended to the first preset position.

[0045] Setting the detection device 3 between the first preset position and the second preset position can determine the type of wafer in the wafer cassette 4. After the gripping device 2 grips the wafer cassette 4 containing the first or second type of wafer, it fixes the wafer cassette 4 in the first preset position inside the cavity 1. The overhead crane moves along the track until it reaches the target position. At this time, the gripping device 2 drives the wafer cassette 4 containing the first or second type of wafer to extend out of the opening of the cavity 1, and places the wafer cassette 4 containing the first or second type of wafer at the target position.

[0046] The overhead crane device also includes a controller, which receives transport instructions from the overhead crane dispatching system. The controller controls the gripping device 2 and the detection device 3 to execute the transport instructions. The transport instructions include the wafer type. The wafers in the wafer box 4 are divided into two types: the first type is the first type of wafer, and the second type is the second type of wafer.

[0047] This embodiment of the invention provides an overhead crane device, including a cavity 1. A gripping device 2 is movably connected within the cavity 1, and the gripping device 2 can extend from or retract into the cavity 1. A detection device 3 is fixedly connected within the cavity 1, and the detection device 3 is located between a first preset position and a second preset position. The detection device 3 is used to detect whether the wafer cassette 4 is in position according to the type of wafer in the wafer cassette 4 after the gripping device 2 grips it. The gripping device 2 extends from the cavity 1, grips the wafer cassette 4, and then retracts into the cavity 1. The gripping device 2 drives the wafer cassette 4 to move from top to bottom according to the type of wafer in the wafer cassette 4. When the wafer cassette 4 is in the first preset position and the second preset position within the cavity 1, the feedback signal detected by the detection device 3 is different. The position of wafer cassette 4 can be determined based on the feedback signal. Combining the wafer type and the position of wafer cassette 4, it can be determined whether wafer cassette 4 is in place, so that the above-mentioned overhead crane device can be compatible with wafer cassette 4 for handling wafers of different sizes, such as wafer cassette 4 for the first type of wafer and wafer cassette 4 for the second type of wafer.

[0048] Example 2

[0049] like Figures 1-3 As shown, this embodiment provides an overhead crane device, including a cavity 1. A gripping device 2 is movably connected inside the cavity 1. The gripping device 2 can extend from or retract from the cavity 1. A detection device 3 is fixedly connected inside the cavity 1. The detection device 3 is located between a first preset position and a second preset position. The detection device 3 is used to detect whether the wafer cassette 4 is in place according to the type of wafer in the wafer cassette 4 after the gripping device 2 grips it.

[0050] A fixing device 5 is provided near the detection device 3, and the fixing device 5 is used to fix the wafer cassette 4 after the wafer cassette 4 is in place.

[0051] The gripping device 2 includes a gripping part 6 and a conveyor belt 7. The first end of the conveyor belt 7 is connected to the inner wall of the cavity 1, and the second end of the conveyor belt 7 is connected to the gripping part 6.

[0052] The fixing device 5 can be used to fix different types of wafer cassettes 4. After the detection device 3 detects that the wafer cassette 4 has been positioned according to its type, the controller sends a command to the fixing device 5. The fixing device 5 then activates and secures the wafer cassette 4, preventing it from shaking or falling during movement. After the gripping device 2 places the wafer cassette 4 at the target location, the fixing device 5 closes, and the gripping device 2 places the wafer cassette 4 at the target location, thus completing the wafer cassette 4 handling process.

[0053] The gripping unit 6 is adapted to the mushroom head of the wafer cassette 4. The mushroom heads of both the first-type and second-type wafer cassettes 4 are set to the same size, allowing the gripping unit 6 to grip both types of wafer cassettes 4. Preferably, the conveyor belt 7 descends, causing the gripping unit 6 to descend as well. The gripping unit 6 is connected to a cylinder, and under the driving action of the cylinder, the gripping unit 6 grips the wafer cassette 4.

[0054] After the gripper 6 picks up the wafer cassette 4, the conveyor belt 7 rises, pulling the gripper 6 upwards as well. The gripper 6 then retracts the wafer cassette 4 into the cavity 1 of the overhead crane device. The detection device 3 begins operation, detecting that the wafer cassette 4 is in place based on its type. Then, the fixing device 5 activates, securing the wafer cassette 4. The overhead crane device moves along the track with the wafer cassette 4. Once the overhead crane device reaches above the second platform, i.e., the target position, the fixing device 5 closes, and the conveyor belt 7 lowers the gripper 6, placing the wafer cassette 4 at the target position. After placing the wafer cassette 4, the conveyor belt 7 raises the gripper 6 until it retracts back into the cavity 1. At this point, the overhead crane device has completed one wafer cassette 4 transport cycle and is now idle, awaiting the next transport command.

[0055] The first type of wafer and the second type of wafer have the following three combinations: (1) the first type of wafer is a 6-inch wafer and the second type of wafer is an 8-inch wafer; (2) the first type of wafer is a 6-inch wafer and the second type of wafer is a 12-inch wafer; (3) the first type of wafer is an 8-inch wafer and the second type of wafer is a 12-inch wafer.

[0056] In this embodiment, a fixing device 5 is provided near the detection device 3. The fixing device 5 is used to fix the wafer cassette 4 after it is in place. The gripping device 2 includes a gripping part 6 and a conveyor belt 7. The first end of the conveyor belt 7 is connected to the inner wall of the cavity 1, and the second end of the conveyor belt 7 is connected to the gripping part 6. The gripping part 6 is controlled by the conveyor belt 7 to descend and grip different types of wafer cassettes 4. After the detection device 3 detects that the wafer cassette 4 has been in place according to its type, the fixing device 5 is activated. The fixing device 5 fixes the wafer cassette 4, so that the wafer cassette 4 will not shake or fall during the handling process. At the same time, by setting the mushroom head of different types of wafer cassettes 4 to a uniform size, the gripping part 6 can grip wafer cassettes 4 of different types of wafers, improving the accuracy of the wafer cassette 4 handling process and the production efficiency.

[0057] Example 3

[0058] like Figures 1-3 As shown, this embodiment provides an overhead crane device, including a cavity 1. A gripping device 2 is movably connected inside the cavity 1. The gripping device 2 can extend from or retract from the cavity 1. A detection device 3 is fixedly connected inside the cavity 1. The detection device 3 is located between a first preset position and a second preset position. The detection device 3 is used to detect whether the wafer cassette 4 is in place according to the type of wafer in the wafer cassette 4 after the gripping device 2 grips it.

[0059] A fixing device 5 is provided near the detection device 3, and the fixing device 5 is used to fix the wafer cassette 4 after the wafer cassette 4 is in place.

[0060] The cavity 1 includes a first support member 8 and a second support member 9, which are arranged facing each other.

[0061] The detection device 3 includes a photoelectric transmitter 10 and a photoelectric receiver 11. The photoelectric transmitter 10 is disposed on the first support member 8, and the photoelectric receiver 11 is disposed on the second support member 9. The photoelectric transmitter 10 and the photoelectric receiver 11 are at the same height.

[0062] The fixing device 5 includes a first guardrail 12 and a second guardrail 13 disposed on the first support member 8, and a third guardrail 14 and a fourth guardrail 15 disposed on the second support member 9; the first guardrail 12 and the third guardrail 14 are disposed facing each other, and the second guardrail 13 and the fourth guardrail 15 are disposed facing each other; the first guardrail 12 is located above the second guardrail 13, and the third guardrail 14 is located above the fourth guardrail 15.

[0063] The cavity 1 further includes a connector 16, with the first support member 8 and the second support member 9 connected to its two ends respectively. The connector 16 is connected to the gripping device 2, which is located between the first support member 8 and the second support member 9.

[0064] The first guardrail 12 and the third guardrail 14 are of the same height. Together, they secure the wafer cassette 4 of the first type of wafer. When the first guardrail 12 and the third guardrail 14 are extended, they can lift the wafer cassette 4 of the first type of wafer. The second guardrail 13 and the fourth guardrail 15 are of the same height. Together, they secure the wafer cassette 4 of the second type of wafer. When the second guardrail 13 and the fourth guardrail 15 are extended, they can lift the wafer cassette 4 of the second type of wafer. All four guardrails (first, second, third, and fourth) are driven by motors and gears. When the four guardrails retract, the gripping device 2 can raise and lower the wafer cassette 4.

[0065] The first type of wafer and the second type of wafer have the following three combinations: (1) the first type of wafer is a 6-inch wafer and the second type of wafer is an 8-inch wafer; (2) the first type of wafer is a 6-inch wafer and the second type of wafer is a 12-inch wafer; (3) the first type of wafer is an 8-inch wafer and the second type of wafer is a 12-inch wafer.

[0066] A photoelectric transmitter 10 is positioned between the first guardrail 12 and the second guardrail 13, and a photoelectric receiver 11 is positioned between the third guardrail 14 and the fourth guardrail 15. The photoelectric transmitter 10 and the photoelectric receiver 11 together form a photoelectric sensor, and the optical path of the photoelectric sensor is parallel to the connector 16. After the gripping device 2 grips the wafer cassette 4 and returns to the cavity 1, the photoelectric sensor begins to operate. When the optical path of the photoelectric sensor is blocked, it is determined that the gripping device 2 has gripped a wafer cassette 4 containing second-type wafers. When the optical path of the photoelectric sensor is not blocked, it is determined that the gripping device 2 has gripped a wafer cassette 4 containing first-type wafers.

[0067] After the crane receives the transport instruction, it moves above the second platform, i.e., the target position. The controller then controls the gripping device 2 to grip the wafer cassette 4. After the gripping device 2 grips the wafer cassette 4 and returns to the cavity 1, the detection device 3 starts working. The photoelectric transmitter 10 emits a photoelectric signal. If the photoelectric receiver 11 receives the photoelectric signal, it confirms that the gripped wafer cassette 4 is a type 1 wafer. The controller then controls the motor, which drives the first guardrail 12 and the third guardrail 14 to extend. After the first guardrail 12 and the third guardrail 14 extend, they can lift the wafer cassette 4 of the type 1 wafer.

[0068] When the photoelectric receiver 11 does not receive a photoelectric signal, the controller confirms that the wafer cassette 4 being grabbed is the wafer cassette 4 of the second type of wafer. The controller then controls the second guardrail 13 and the fourth guardrail 15 to extend. After the second guardrail 13 and the fourth guardrail 15 extend, they can support the wafer cassette 4 of the second type of wafer.

[0069] After the wafer cassette 4 is secured by the fixing device 5, the overhead crane begins to move with the wafer cassette 4. Once the overhead crane has moved above the second platform, i.e., the target position, the fixing device 5 closes. When the wafer cassette 4 being transported is a first-type wafer cassette 4, the controller retracts the first guardrail 12 and the third guardrail 14; when the wafer cassette 4 being transported is a second-type wafer cassette 4, the controller retracts the second guardrail 13 and the fourth guardrail 15. The controller then controls the gripping device 2 to place the wafer cassette 4 at the target position. At this point, the overhead crane has completed one transport of the wafer cassette 4, and the overhead crane is in an idle state, waiting for the next transport command.

[0070] The first support member 8 and the second support member 9 are both vertically arranged, and the connector 16 is located between the first support member 8 and the second support member 9, and the connector 16 is horizontally arranged. The first support member 8, the second support member 9 and the connector 16 together constitute the cavity 1. A conveyor belt 7 is connected to the inner side of the connector 16, and a gripping device 2 is connected to the side of the conveyor belt 7 away from the connector 16.

[0071] The detection device 3 in this embodiment includes a photoelectric transmitter 10 and a photoelectric receiver 11. The photoelectric transmitter 10 is disposed on the first support member 8, and the photoelectric receiver 11 is disposed on the second support member 9. The photoelectric transmitter 10 and the photoelectric receiver 11 are at the same height. When the light path of the photoelectric sensor is not blocked, it is determined that the wafer cassette 4 of the first type of wafer has been grasped. At this time, the controller controls the first guardrail 12 and the third guardrail 14 to extend. Under the combined action of the grasping device 2, the first guardrail 12 and the third guardrail 14, the wafer cassette 4 of the first type of wafer is fixed. When the light path of the photoelectric sensor is blocked, it is determined that the wafer cassette 4 of the second type of wafer has been grasped. At this time, the controller controls the second guardrail 13 and the fourth guardrail 15 to extend. Under the combined action of the grasping device 2, the second guardrail 13 and the fourth guardrail 15, the wafer cassette 4 of the second type of wafer is fixed.

[0072] Example 4

[0073] like Figure 4 As shown, this embodiment provides a wafer cassette transportation method based on the overhead crane device described in any one of Embodiments 1-4. The method includes:

[0074] S1: Receive a handling instruction and control the gripping device to grip the wafer cassette according to the handling instruction; wherein, the handling instruction includes the wafer type.

[0075] S2: Control the gripping device to move to a first preset position or a second preset position according to the wafer type.

[0076] S3: Control the detection device to detect whether the wafer cassette is in place. If it is in place, control the gripping device to fix the wafer cassette on the fixing device.

[0077] S4: If the overhead crane reaches the destination, control the gripping device to place the wafer cassette at the target position.

[0078] Both the gripping device 2 and the fixing device 5 are controlled by motors and gears. The input of the motor is connected to the output of the controller, and the input of the controller is connected to the overhead crane dispatching system. The manufacturing execution system issues handling requests to the material control system, which collects these requests and sends them to the overhead crane dispatching system. The overhead crane dispatching system sends handling instructions to the overhead crane device, which receives and executes the instructions.

[0079] The cleanroom has a track suspended from the ceiling keel. The overhead crane moves along the track to the top of the first machine. The controller controls the built-in motor of the overhead crane to drive the conveyor belt 7 to rise and fall, so that the gripping device 2 extends out from the opening of the cavity 1.

[0080] The controller controls the gripping device 2 to clamp the mushroom-shaped head on the wafer cassette 4, causing the wafer cassette 4 to retract into the cavity 1. The handling command includes the wafer type, which includes a first type of wafer and a second type of wafer. If the wafer type is a first type of wafer, the gripping device 2 moves the first type of wafer to a first preset position; if the wafer type is a second type of wafer, the gripping device 2 moves the second type of wafer to a second preset position.

[0081] The first type of wafer and the second type of wafer have the following three combinations: (1) the first type of wafer is a 6-inch wafer and the second type of wafer is an 8-inch wafer; (2) the first type of wafer is a 6-inch wafer and the second type of wafer is a 12-inch wafer; (3) the first type of wafer is an 8-inch wafer and the second type of wafer is a 12-inch wafer.

[0082] The detection device 3 determines whether the wafer box 4 has reached the first preset position or the second preset position based on the received photoelectric signal. If the wafer box 4 has reached the first preset position or the second preset position, the gripping device 2 places the wafer box 4 on the fixing device 5, and the fixing device 5 fixes the wafer box 4.

[0083] During the process of gripping wafer cassette 4 by gripping device 2 and securing wafer cassette 4 to fixing device 5, the overhead crane remains stationary on the track. After securing wafer cassette 4 to fixing device 5, the overhead crane continues to move under the guidance of the track until it reaches above the second platform, i.e., the target position. Gripping device 2 then extends wafer cassette 4 from the opening of cavity 1 and places it at the target position.

[0084] This embodiment provides a method for transporting a wafer cassette 4, including receiving a handling instruction and controlling a gripping device 2 to grip the wafer cassette 4 according to the handling instruction; wherein the handling instruction includes a wafer type. Based on the wafer type, the gripping device 2 is controlled to move to a first preset position or a second preset position, and a detection device 3 is controlled to detect whether the wafer cassette 4 is in position. If it is in position, the gripping device 2 is controlled to fix the wafer cassette 4 to a fixing device 5. If the overhead crane reaches its destination, the gripping device 2 is controlled to place the wafer cassette 4 at the target position. This transportation method obtains the wafer type and uses the detection device 3 to detect whether the wafer cassette 4 has reached the preset position corresponding to the wafer type. When using an overhead crane, it can accommodate both first-type and second-type wafers, reducing the losses incurred when a cleanroom for first-type wafers is converted to a cleanroom for second-type wafers, and increasing the factory's chip processing capacity.

[0085] Example 5

[0086] like Figure 4As shown, this embodiment provides a wafer cassette transportation method based on the overhead crane device described in any one of Embodiments 1-4. The method includes:

[0087] S1: Receive a handling instruction and control the gripping device to grip the wafer cassette according to the handling instruction; wherein, the handling instruction includes the wafer type.

[0088] S2: Control the gripping device to move to a first preset position or a second preset position according to the wafer type.

[0089] S3: Control the detection device to detect whether the wafer cassette is in place. If it is in place, control the gripping device to fix the wafer cassette on the fixing device.

[0090] S4: If the overhead crane reaches the destination, control the gripping device to place the wafer cassette at the target position.

[0091] The step of controlling the gripping device to move to a first preset position or a second preset position according to the wafer type includes:

[0092] S21: If the wafer type is a first type wafer, then control the gripping device to move to a first preset position; the first preset position is located between the first guardrail and the third guardrail.

[0093] S22: If the wafer type is a second type wafer, then control the gripping device to move to a second preset position; the second preset position is located between the second guardrail and the fourth guardrail.

[0094] Preferably, there is a gap between the first guardrail 12 and the third guardrail 14, and the first preset position is located in the middle of the gap between the first guardrail 12 and the third guardrail 14. There is a gap between the second guardrail 13 and the fourth guardrail 15, and the second preset position is located in the middle of the gap between the second guardrail 13 and the fourth guardrail 15.

[0095] The bottom ends of the wafer cassette 4 of the first type of wafer abut against the first guardrail 12 and the third guardrail 14 respectively. The first guardrail 12 and the third guardrail 14 together support the wafer cassette 4 of the first type of wafer, thus fixing the wafer cassette 4 of the first type of wafer. The bottom ends of the wafer cassette 4 of the second type of wafer abut against the second guardrail 13 and the fourth guardrail 15 respectively. The second guardrail 13 and the fourth guardrail 15 together support the wafer cassette 4 of the second type of wafer, thus fixing the wafer cassette 4 of the second type of wafer.

[0096] When the first guardrail 12 and the third guardrail 14 jointly support the first type of wafer cassette 4, the first type of wafer cassette 4 will not block the photoelectric signal emitted by the detection device 3, and the optical path is open at this time. When the second guardrail 13 and the fourth guardrail 15 jointly support the second type of wafer cassette 4, the second type of wafer cassette 4 extends above the first guardrail 12 and the third guardrail 14, that is, the second type of wafer cassette 4 blocks the photoelectric signal emitted by the detection device 3, and the optical path is broken at this time.

[0097] The first type of wafer and the second type of wafer have the following three combinations: (1) the first type of wafer is a 6-inch wafer and the second type of wafer is an 8-inch wafer; (2) the first type of wafer is a 6-inch wafer and the second type of wafer is a 12-inch wafer; (3) the first type of wafer is an 8-inch wafer and the second type of wafer is a 12-inch wafer.

[0098] like Figure 5 As shown, the control of the detection device to detect whether the wafer cassette is in position includes:

[0099] S31: If the wafer type is a first type wafer, and the photoelectric receiver receives the photoelectric signal emitted by the photoelectric transmitter, then the wafer cassette is in place.

[0100] S32: If the wafer type is a second type wafer and the photoelectric receiver does not receive the photoelectric signal emitted by the photoelectric transmitter, then the wafer cassette is in place.

[0101] If the wafer type is a first type wafer, the wafer cassette 4 is placed on the first guardrail 12 and the third guardrail 14. When the photodetector 11 receives the photoelectric signal emitted by the photoelectric transmitter 10, the wafer cassette 4 is located in the first preset position. If the wafer type is a second type wafer, the wafer cassette 4 is placed on the second guardrail 13 and the fourth guardrail 15. When the photodetector 11 does not receive the photoelectric signal emitted by the photoelectric transmitter 10, the wafer cassette 4 is located in the second preset position.

[0102] The photoelectric transmitter 10 and the photoelectric receiver 11 are at the same height and are set facing each other. By detecting whether the photoelectric receiver 11 receives a photoelectric signal, it can be determined whether the wafer cell 4 is in place.

[0103] The control of the gripping device to fix the wafer cassette on the fixing device includes:

[0104] S33: If the wafer type is a first type wafer, then control the first guardrail and the third guardrail to extend and place the wafer box on the first guardrail and the third guardrail.

[0105] S34: If the wafer type is a second type wafer, then control the second guardrail and the fourth guardrail to extend and place the wafer box on the second guardrail and the fourth guardrail.

[0106] During the process of the gripping device 2 extending from the opening of the cavity 1 to grip the wafer cassette 4, and during the process of the gripping device 2 driving the wafer cassette 4 back into the cavity 1, the first guardrail 12, the second guardrail 13, the third guardrail 14, and the fourth guardrail 15 are all in the closed state, that is, the four guardrails do not extend. When the gripping device 2 drives the wafer cassette 4 to the first preset position, the first guardrail 12 and the third guardrail 14 extend, and the first guardrail 12 and the third guardrail 14 together fix the wafer cassette 4. When the gripping device 2 drives the wafer cassette 4 to the second preset position, the second guardrail 13 and the fourth guardrail 15 extend, and the second guardrail 13 and the fourth guardrail 15 together fix the wafer cassette 4.

[0107] The control of the gripping device to place the wafer cassette at the target location includes:

[0108] S41: If the wafer type is a first type wafer, then control the first guardrail and the third guardrail to retract, and control the gripping device to place the wafer box at the target position.

[0109] S42: If the wafer type is a second type wafer, then control the second guardrail and the fourth guardrail to retract, and control the gripping device to place the wafer box at the target position.

[0110] When the crane moves along the track to above the second machine platform (the target position), the wafer cassette 4 needs to be placed on the second machine platform. If the wafer type is a first-class wafer, the first guardrail 12 and the third guardrail 14, which are in the extended state, are retracted. At this time, the wafer cassette 4 is held by the gripping device 2, and the conveyor belt 7 descends, causing the gripping device 2 to descend as well. The gripping device 2 then causes the wafer cassette 4 to extend from the opening of the cavity 1, and the gripping device 2 places the first-class wafer cassette 4 on the second machine platform. If the wafer type is a second-class wafer, the second guardrail 13 and the fourth guardrail 15, which are in the extended state, are retracted. At this time, the wafer cassette 4 is held by the gripping device 2, and the conveyor belt 7 descends, causing the gripping device 2 to descend as well. The gripping device 2 then causes the wafer cassette 4 to extend from the opening of the cavity 1, and the gripping device 2 places the second-class wafer cassette 4 on the second machine platform.

[0111] This embodiment provides a method for transporting a wafer cassette 4, including: if the wafer type is a first type wafer, controlling the extension of the first guardrail 12 and the third guardrail 14 to place the wafer cassette 4 on the first guardrail 12 and the third guardrail 14; if the wafer type is a second type wafer, controlling the extension of the second guardrail 13 and the fourth guardrail 15 to place the wafer cassette 4 on the second guardrail 13 and the fourth guardrail 15. When the crane device runs above the target position, if the wafer type is a first type wafer, controlling the retraction of the first guardrail 12 and the third guardrail 14, and controlling the gripping device 2 to place the wafer cassette 4 at the target position; if the wafer type is a second type wafer, controlling the retraction of the second guardrail 13 and the fourth guardrail 15, and controlling the gripping device 2 to place the wafer cassette 4 at the target position.

[0112] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of this application. Any specific values ​​in all examples shown and discussed herein should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0113] It should be understood that spatial relative terms are intended to encompass different orientations of a device in use or operation, in addition to the orientation described in the figures. For example, if a device in the figures is inverted, a device described as "above" or "on top of" other devices or structures will subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below". The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0114] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this application.

[0115] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A crane device, characterized in that, The device includes a cavity, in which a gripping device is movably connected. The gripping device can extend from or retract into the cavity. A detection device is fixedly connected to the cavity and is located between a first preset position and a second preset position. The detection device is used to detect whether the wafer cassette is in place according to the type of wafer in the wafer cassette after the gripping device has gripped it. A fixing device is provided near the detection device, which is used to fix the wafer cassette after it is in place; The cavity includes a first support member and a second support member, which are arranged facing each other. The fixing device includes a first guardrail and a second guardrail disposed on the first support member, and a third guardrail and a fourth guardrail disposed on the second support member; the first guardrail and the third guardrail are disposed facing each other, and the second guardrail and the fourth guardrail are disposed facing each other; the first guardrail is located above the second guardrail, and the third guardrail is located above the fourth guardrail.

2. The overhead crane device according to claim 1, characterized in that, The gripping device includes a gripping part and a conveyor belt. The first end of the conveyor belt is connected to the inner wall of the cavity, and the second end of the conveyor belt is connected to the gripping part.

3. The overhead crane device according to claim 1, characterized in that, The detection device includes a photoelectric transmitter and a photoelectric receiver. The photoelectric transmitter is mounted on the first support member, and the photoelectric receiver is mounted on the second support member. The photoelectric transmitter and the photoelectric receiver are at the same height.

4. The overhead crane device according to claim 1, characterized in that, The cavity also includes a connector, with the first support and the second support respectively connected to its two ends. The connector is connected to the gripping device, which is located between the first support and the second support.

5. A method for transporting a wafer cassette, characterized in that, Based on the overhead crane device according to any one of claims 1-4, the method includes: The system receives a handling instruction and controls the gripping device to grip the wafer cassette according to the handling instruction; wherein the handling instruction includes the wafer type. The gripping device is controlled to move to a first preset position or a second preset position according to the wafer type; The detection device is controlled to detect whether the wafer cassette is in place. If it is in place, the gripping device is controlled to fix the wafer cassette on the fixing device. If the overhead crane reaches its destination, the gripping device is controlled to place the wafer cassette at the target location.

6. The wafer cassette transport method according to claim 5, characterized in that, The step of controlling the gripping device to move to a first preset position or a second preset position according to the wafer type includes: If the wafer type is a first type wafer, then control the gripping device to move to a first preset position; the first preset position is located between the first guardrail and the third guardrail; If the wafer type is a second type wafer, then control the gripping device to move to a second preset position; the second preset position is located between the second guardrail and the fourth guardrail.

7. The wafer cassette transport method according to claim 6, characterized in that, The control of the detection device to detect whether the wafer cassette is in position includes: If the wafer type is a first type wafer, and the photoelectric receiver receives the photoelectric signal emitted by the photoelectric transmitter, then the wafer cassette is in place; If the wafer type is a second type wafer, and the photoelectric receiver does not receive the photoelectric signal emitted by the photoelectric transmitter, then the wafer cassette is in place.

8. The wafer cassette transport method according to claim 5, characterized in that, The control of the gripping device to fix the wafer cassette on the fixing device includes: If the wafer type is a first type wafer, then control the first guardrail and the third guardrail to extend and place the wafer box on the first guardrail and the third guardrail; If the wafer type is a second type wafer, then the second guardrail and the fourth guardrail are extended to place the wafer box on the second guardrail and the fourth guardrail.

9. The wafer cassette transport method according to claim 5, characterized in that, The control of the gripping device to place the wafer cassette at the target location includes: If the wafer type is a first type wafer, then control the first guardrail and the third guardrail to retract, and control the gripping device to place the wafer box at the target position; If the wafer type is a second type wafer, then the second and fourth guardrails are retracted, and the gripping device is controlled to place the wafer box at the target position.

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