LED die bonding glue material evaluation method and system and computer equipment

Abstract

The invention provides an LED die bonding glue material evaluation method and system and computer equipment, and the method comprises the steps: dispensing multiple times of glue in a single support bowl cup to form a plurality of colloidal particles; standing part of the colloidal particles in a preset environment for preset observation time, observing and detecting forms and performances of the colloidal particles in different stages during standing, and recording corresponding data; judging whether the colloidal particles are preliminarily qualified or not based on the form change and the performance change of the colloidal particles; and if the chip is judged to be preliminarily qualified, carrying out die bonding operation on the chip through corresponding glue, detecting a die bonding condition through detection equipment, and evaluating whether the chip meets a preset requirement or not according to a detection result. According to the method and the device, the actual batched trial-production combat is simulated, and the risk problem points are exposed in advance, so that the glue material for die bonding is quickly screened, the material meeting the requirement is obtained, and the evaluation period is shortened.

Description

Technical Field

[0001] This invention relates to the field of LED packaging technology, and in particular to a method, system and computer equipment for evaluating LED die bond adhesive materials. Background Technology

[0002] With the development of technology, the LED-related industry chain is changing rapidly. In order to adapt to market demand, the LED industry continues to reduce costs. Not only do they reduce the cost of materials themselves, but also ensuring the efficient and high-quality rapid introduction of new materials to replace them is an effective way to reduce costs.

[0003] Currently, existing material evaluation schemes typically involve selecting typical product models (with different power ratings) to create the smallest unit sample for basic performance testing. This process is completed by a dedicated sample production department, and the sample production process is consistent with mass production, reflecting the performance matching degree of the die-bonding adhesive to a certain extent. After the sample is produced, a reliability test is conducted, which generally takes 45 days. If the reliability test is normal, a small-batch trial production is started to verify operability, and the operation is carried out entirely according to the mass production product line and mass production process. Usually, a mass-produced adhesive is set up as a control group. Except for the trial production adhesive, all other materials are the same as the control group. The order quantity of the small-batch trial production is usually controlled within 200K, and the trial production cycle is 15 days. In the above process, the evaluation operation is complicated and the evaluation cycle is long. Summary of the Invention

[0004] Therefore, the purpose of this invention is to provide a method, system, and computer device for evaluating LED die bond adhesive materials, in order to overcome the shortcomings of the prior art.

[0005] To achieve the above objectives, the present invention provides a method for evaluating LED die-attach adhesive materials, the method comprising:

[0006] Apply adhesive multiple times within a single support bowl to form multiple adhesive particles;

[0007] Within a preset environment, a portion of the aforementioned particles were left to stand for a preset observation time. The morphology and properties of the particles at different stages of standing were observed and tested, and the corresponding data were recorded.

[0008] The morphological and performance changes of the adhesive particles are used to determine whether the adhesive particles are initially qualified.

[0009] If the chip is initially deemed qualified, it is then die-bonded using the appropriate adhesive. The die-bonding is then inspected using testing equipment, and the results are used to assess whether the chip meets the preset requirements.

[0010] The step of applying adhesive multiple times inside a single support bowl includes:

[0011] Multiple dispensing points are set within a single support cup, the center position of each dispensing point is determined, and dispensing is performed based on the center position of each dispensing point. The distance between the centers of adjacent dispensing points is greater than 0.36±0.01mm.

[0012] Preferably, the step of applying adhesive multiple times within a single support bowl cup includes:

[0013] Multiple dispensing points are set within a single support cup, the center position of each dispensing point is determined, and dispensing is performed based on the center position of each dispensing point. The distance between the centers of adjacent dispensing points is greater than 0.36±0.01mm.

[0014] Preferably, the step of applying adhesive multiple times within a single support bowl to form multiple adhesive particles includes:

[0015] The diameter of the adhesive particles is controlled to be 0.36±0.01mm by adjusting the dispensing equipment.

[0016] Preferably, the step of detecting the die bonding status using a detection device includes:

[0017] The appearance of the die-bonding process is inspected by microscopic examination;

[0018] The thrust of the die-bonding process was tested using professional CTQ testing equipment.

[0019] Preferably, the preset observation time is 48 hours.

[0020] To achieve the above objectives, the present invention also provides an LED die-bonding adhesive material evaluation system for implementing the LED die-bonding adhesive material evaluation method described above, the system comprising:

[0021] The dispensing module is used to apply adhesive multiple times within a single support bowl to form multiple adhesive particles;

[0022] The settling module is used to settling a portion of the colloidal particles in a preset environment for a preset observation time, observe and detect the morphology and performance of the colloidal particles at different stages during settling, and record the corresponding data.

[0023] The preliminary judgment module is used to determine whether the adhesive particles are initially qualified based on the morphological and performance changes of the adhesive particles;

[0024] The detection module is used to perform a die bonding operation on the chip with the appropriate glue if the chip is initially qualified. The detection equipment is used to detect the die bonding situation and evaluate whether it meets the preset requirements based on the detection results.

[0025] The dispensing module includes:

[0026] The setting unit is used to set multiple dispensing positions within a single support cup, determine the center position of the dispensing positions, perform dispensing operations based on the center position of the dispensing positions, and the distance between the centers of adjacent dispensing positions is greater than 0.36±0.01mm.

[0027] Preferably, the dispensing module includes:

[0028] The control unit is used to control the diameter of the adhesive particles to be 0.36±0.01mm by adjusting the dispensing equipment.

[0029] Preferably, the detection module includes:

[0030] The first inspection unit is used to inspect the appearance of the die-bonding condition by microscopic examination;

[0031] The second detection unit is used to detect the thrust of the die-bonding process using professional CTQ testing equipment.

[0032] To achieve the above objectives, the present invention also provides a computer device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the LED die-bonding adhesive material evaluation method described above.

[0033] The beneficial effects of this invention are as follows: By applying adhesive multiple times within a single support cup to form multiple adhesive particles, and by allowing some of these particles to stand for a predetermined observation time within a preset environment, the morphology and performance of the particles at different stages of standing are observed and tested. The corresponding data are recorded, and the particles are preliminarily deemed qualified based on changes in morphology and performance. If deemed qualified, the chip is then die-bonded using the adhesive. The die-bonding process is then tested using testing equipment, and the adhesive is evaluated based on the test results to determine if it meets the preset requirements. By simulating mass production trials, potential risks are identified in advance, allowing for rapid screening of adhesive materials used for die bonding to obtain materials that meet the requirements, thereby shortening the evaluation cycle.

[0034] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A flowchart of the LCD die-bonding adhesive material evaluation method provided in the first embodiment of the present invention;

[0036] Figure 2 A graph showing the wafer thrust of the adhesive node provided in the first embodiment of the present invention;

[0037] Figure 3A graph showing the thrust of the gold ball of the bottom glue node provided by the first embodiment of the present invention;

[0038] Figure 4 A structural block diagram of an LCD die-bonding glue material evaluation system provided by a second embodiment of the present invention;

[0039] Figure 5 A schematic diagram of the hardware structure of a computer device provided in the third embodiment of the present invention.

[0040] The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0041] To make the objectives, technical solutions, and advantages of this application clearer, the application is described and illustrated below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application. All other embodiments obtained by those skilled in the art based on the embodiments provided in this application without inventive effort are within the scope of protection of this application.

[0042] Obviously, the accompanying drawings described below are merely some examples or embodiments of this application. Those skilled in the art can apply this application to other similar scenarios based on these drawings without any inventive effort. Furthermore, it is understood that although the efforts made in this development process may be complex and lengthy, for those skilled in the art related to the content disclosed in this application, any changes to design, manufacturing, or production based on the technical content disclosed in this application are merely conventional technical means and should not be construed as insufficient disclosure of the content of this application.

[0043] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application may be combined with other embodiments without conflict.

[0044] Unless otherwise defined, the technical or scientific terms used in this application shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms “a,” “an,” “an,” “the,” and similar words used in this application do not indicate quantity limitation and may indicate singular or plural. The terms “comprising,” “including,” “having,” and any variations thereof used in this application are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device that includes a series of steps or modules (units) is not limited to the listed steps or units, but may also include steps or units not listed, or may include other steps or units inherent to these processes, methods, products, or devices. The terms “connected,” “linked,” “coupled,” and similar words used in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. “Multiple” used in this application refers to two or more. “And / or” describes the relationship between related objects, indicating that three relationships may exist; for example, “A and / or B” can represent: A alone, A and B simultaneously, and B alone. The character " / " generally indicates that the preceding and following objects are in an "or" relationship. The terms "first," "second," and "third" used in this application are merely to distinguish similar objects and do not represent a specific ordering of the objects.

[0045] Please see Figure 1 This is a flowchart of the LED die-bonding adhesive material evaluation method in the first embodiment of the present invention. The LED die-bonding adhesive material evaluation is performed at the sample stage. By placing the process of verifying operability during the batch trial production stage at the sample evaluation stage, multiple dispensing verifications are performed using a single bracket cup material resource. This reduces the chip investment, which accounts for a high proportion of material costs, and also reduces the occupation of production equipment resources, improving the first-pass yield of the selected adhesive. It also avoids situations where other performance tests are OK, but operability does not meet requirements, achieving a win-win situation of efficiency and cost reduction. Figure 1 As shown, the method includes the following steps:

[0046] Step S101: Apply adhesive multiple times inside a single support bowl to form multiple adhesive particles;

[0047] In this design, the spacing between adjacent adhesive particles in a single support cup is the same, and the size of each adhesive particle is consistent, so as to facilitate subsequent judgment of the corresponding adhesive.

[0048] Step S102: Place a portion of the colloidal particles in a preset environment for a preset observation time, observe and detect the morphology and performance of the colloidal particles at different stages during the standing period, and record the corresponding data.

[0049] Among them, the preset observation time is 48 hours. During the standing period, the appearance and performance of the colloidal particles are inspected every 6 to 8 hours to obtain the morphological and performance changes of the colloidal particles at different times.

[0050] Step S103: Determine whether the colloidal particles are initially qualified based on the morphological and performance changes of the colloidal particles;

[0051] Among them, observe whether the diameter of the colloidal particles exceeds 0.36 mm ± 0.01 mm of the control requirements. If it exceeds, it is determined that the colloidal particles are unqualified. If it does not exceed, it is determined that the colloidal particles are initially qualified; and, through microscopic examination, detect whether there are phenomena such as glue splashing, trailing, and less glue in the colloidal particles. If there are the above phenomena, it is determined to be unqualified. On the contrary, if there are no the above phenomena, it is determined to be initially qualified.

[0052] Step S104: If it is determined to be initially qualified, perform die bonding operation on the chip with the corresponding glue, and detect the die bonding situation with a detection device, and evaluate whether it meets the preset requirements according to the detection results.

[0053] Among them, on the premise that the colloidal particles are determined to be initially qualified, use the glue corresponding to the colloidal particles to perform die bonding operation on the chip to verify whether the glue meets the preset requirements.

[0054] Through the above steps, apply glue multiple times in a single bracket bowl cup to form multiple colloidal particles. Let some of the colloidal particles stand for the preset observation time in a preset environment, observe and detect the morphology and performance of the colloidal particles at different stages during standing, record the corresponding data, and then judge whether the colloidal particles are initially qualified according to the morphological and performance changes of the colloidal particles. If it is judged to be qualified, perform die bonding operation on the chip with this glue, detect the die bonding situation with a detection device, and then evaluate whether this glue meets the preset requirements according to the detection results. Through simulating mass trial production and actual combat, expose potential risk problem points in advance to quickly screen the glue materials used for die bonding, and obtain materials that meet the requirements, thereby shortening the evaluation cycle.

[0055] In some embodiments, the step of applying glue multiple times in a single bracket bowl cup includes:

[0056] Set multiple glue application positions in a single bracket bowl cup, determine the central positions of the glue application positions, perform glue application operations based on the central positions of the glue application positions, and the distance between the centers of adjacent glue application positions is greater than 0.36 ± 0.01 mm.

[0057] Among them, the diameter of each colloidal particle is controlled within 0.36 mm ± 0.01 mm, and the diameter of the glue application position is greater than 0.36 mm ± 0.01 mm, so as to ensure that the colloidal particles applied at the glue application positions are separated from other colloidal particles and prevent the colloidal particles from sticking directly to each other.

[0058] In some embodiments, the step of applying adhesive multiple times within a single support bowl to form multiple adhesive particles includes:

[0059] The diameter of the adhesive particles is controlled to be 0.36±0.01mm by adjusting the dispensing equipment.

[0060] In some embodiments, the step of detecting the die bonding status using a detection device includes:

[0061] The appearance of the die-bonding process is inspected by microscopic examination;

[0062] The appearance of the die bonding process is inspected by microscopic examination. If any of the following phenomena are detected: non-sticking, broken wires, or die pull-out, it is determined that the preset requirements are not met. Conversely, if none of the above phenomena are present, it is determined that the preset requirements are met.

[0063] The thrust of the die-bonding process was tested using professional CTQ testing equipment.

[0064] Among them, the wafer push force (DST) and gold ball push force (BST) of the bottom adhesive node in die bonding are tested using professional CTQ testing equipment. When the wafer push force and gold ball push force are at certain values, it is determined that they meet the preset requirements. As shown in Figure 2, this is a curve of the wafer push force of the bottom adhesive node. Figure 3 The figure shown is a curve of the gold ball thrust at the bottom rubber node.

[0065] In some embodiments, the preset observation time is 48 hours.

[0066] The second embodiment of this application also provides an LED die-bonding adhesive material evaluation system, which is used to implement the first embodiment and preferred embodiments described above, and will not be repeated hereafter. As used below, the terms "module," "unit," "subunit," etc., can refer to a combination of software and / or hardware that performs a predetermined function. Although the apparatus described in the following embodiments is preferably implemented in software, hardware implementation, or a combination of software and hardware, is also possible and contemplated.

[0067] Figure 4 The LED die-bonding adhesive material evaluation system of the second embodiment of this application, such as Figure 2 As shown, the system includes:

[0068] The dispensing module 10 is used to dispense adhesive multiple times within a single support bowl to form multiple adhesive particles;

[0069] The settling module 20 is used to settling a portion of the colloidal particles in a preset environment for a preset observation time, observe and detect the morphology and performance of the colloidal particles at different stages during settling, and record the corresponding data.

[0070] The preliminary judgment module 30 is used to determine whether the adhesive particles are initially qualified based on the morphological and performance changes of the adhesive particles;

[0071] The detection module 40 is used to perform a die bonding operation on the chip with the appropriate glue if the chip is initially qualified, and to detect the die bonding situation with the detection equipment, and evaluate whether it meets the preset requirements based on the detection results.

[0072] In some embodiments, the dispensing module 10 includes:

[0073] The setting unit is used to set multiple dispensing positions within a single support cup, determine the center position of the dispensing positions, perform dispensing operations based on the center position of the dispensing positions, and the distance between the centers of adjacent dispensing positions is greater than 0.36±0.01mm.

[0074] In some embodiments, the dispensing module 10 includes:

[0075] The control unit is used to control the diameter of the adhesive particles to be 0.36±0.01mm by adjusting the dispensing equipment.

[0076] In some embodiments, the detection module 40 includes:

[0077] The first inspection unit is used to inspect the appearance of the die-bonding condition by microscopic examination;

[0078] The second detection unit is used to detect the thrust of the die-bonding process using professional CTQ testing equipment.

[0079] In some embodiments, the preset observation time is 48 hours.

[0080] The LCD die bond adhesive material evaluation system provided in this embodiment of the invention has the same implementation principle and technical effect as the aforementioned method embodiment. For the sake of brevity, any parts not mentioned in the device embodiment can be referred to the corresponding content in the aforementioned method embodiment.

[0081] It should be noted that the above modules can be functional modules or program modules, and can be implemented through software or hardware. For modules implemented through hardware, the above modules can reside in the same processor; or the above modules can be located in different processors in any combination.

[0082] In addition, combined Figure 1The LCD die-bonding glue material evaluation method described in the first embodiment of the present application can be implemented by a computer device. Figure 5 Schematic diagram of the hardware structure of a computer device according to the third embodiment of the present application.

[0083] The computer device may include a processor 32 and a memory 33 storing computer program instructions.

[0084] Specifically, the processor 32 may include a central processing unit (CPU), an application specific integrated circuit (ASIC), or one or more integrated circuits that can be configured to implement the embodiments of this application.

[0085] The memory 33 may include a mass storage device for data or instructions. For example, and not limitingly, the memory 33 may include a hard disk drive (HDD), a floppy disk drive, a solid-state drive (SSD), flash memory, an optical disk drive, a magneto-optical disk drive, magnetic tape, or a Universal Serial Bus (USB) drive, or a combination of two or more of these. Where appropriate, the memory 33 may include removable or non-removable (or fixed) media. Where appropriate, the memory 33 may be internal or external to the data processing device. In a particular embodiment, the memory 33 is non-volatile memory. In a particular embodiment, the memory 33 includes read-only memory (ROM) and random access memory (RAM). Where appropriate, the ROM may be a mask-programmed ROM, a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), an electrically alterable read-only memory (EAROM), or flash memory, or a combination of two or more of these. Where appropriate, the RAM can be Static Random-Access Memory (SRAM) or Dynamic Random-Access Memory (DRAM). DRAM can be Fast Page Mode Dynamic Random-Access Memory (FPMDRAM), Extended Data Out Dynamic Random-Access Memory (EDODRAM), Synchronous Dynamic Random-Access Memory (SDRAM), etc.

[0086] The memory 33 can be used to store or cache various data files that need to be processed and / or communicated, as well as possible computer program instructions executed by the processor 32.

[0087] The processor 32 reads and executes computer program instructions stored in the memory 33 to implement any of the LCD die bond adhesive material evaluation methods in the above embodiments.

[0088] In some embodiments, the computer device may further include a communication interface 34 and a bus 31. For example, Figure 5 As shown, the processor 32, memory 33, and communication interface 34 are connected through bus 31 and complete communication with each other.

[0089] The communication interface 34 is used to enable communication between the various modules, devices, units, and / or equipment in the embodiments of this application. The communication interface 34 can also enable data communication with other components such as external devices, image / data acquisition devices, databases, external storage, and image / data processing workstations.

[0090] Bus 31 includes hardware, software, or both, that couples components of a computer device together. Bus 31 includes, but is not limited to, at least one of the following: data bus, address bus, control bus, expansion bus, and local bus. For example, and not as a limitation, bus 31 may include an Accelerated Graphics Port (AGP) or other graphics bus, an Extended Industry Standard Architecture (EISA) bus, a Front Side Bus (FSB), a Hyper Transport (HT) interconnect, an Industry Standard Architecture (ISA) bus, an InfiniBand interconnect, a Low Pin Count (LPC) bus, a memory bus, a Micro Channel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a Serial Advanced Technology Attachment (SATA) bus, a Video Electronics Standards Association Local Bus (VLB) bus, or other suitable buses, or a combination of two or more of these. Where appropriate, bus 31 may include one or more buses. Although specific buses are described and illustrated in the embodiments of this application, this application considers any suitable bus or interconnection.

[0091] The computer device can execute the LCD die-bonding adhesive material evaluation method in this application embodiment based on the acquired computer program, thereby achieving bonding. Figure 1 A method for evaluating LCD die-bonding adhesive materials is described.

[0092] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0093] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A method for evaluating LED die-bonding glue materials, characterized in that: The method comprises: Apply glue multiple times in a single support bowl to form multiple glue particles; Leaving part of the colloid particles to stand for a preset observation time in a preset environment, observing and testing the morphology and performance of the colloid particles at different stages during the standing, and recording corresponding data; Judging whether the colloid particles are preliminarily qualified based on the morphological changes and performance changes of the colloid particles; If it is judged to be preliminarily qualified, the chip will be bonded with the corresponding glue, and the bonding condition will be tested by the testing equipment. According to the test results, it will be evaluated whether it meets the preset requirements; The step of applying glue multiple times in a single bracket bowl includes: A plurality of glue dispensing positions are arranged in a single bracket bowl, the center position of the glue dispensing positions is determined, and the glue dispensing operation is performed based on the center position of the glue dispensing positions, and the spacing between the centers of adjacent glue dispensing positions is greater than 0.36±0.01 mm.

2. The LED bonding glue material evaluation method according to claim 1, characterized in that: The step of applying glue multiple times in a single support bowl to form multiple glue particles comprises: The diameter of the glue particles is controlled to be 0.36±0.01 mm by debugging the glue dispensing equipment.

3. The LED bonding glue material evaluation method according to claim 1, characterized in that: The step of detecting the bonding condition by using a detection device comprises: Check the appearance of the solid crystal by microscopic inspection; The thrust of the die bonding situation is tested using professional CTQ testing equipment.

4. The LED bonding glue material evaluation method according to claim 1, characterized in that: The preset observation time is 48 hours.

5. A LED bonding glue material evaluation system, used to implement the LED bonding glue material evaluation method according to any one of claims 1 to 4, characterized in that: The system comprises: The glue dispensing module is used to dispense glue multiple times in a single bracket bowl to form multiple glue particles; A static module, used to place part of the colloid particles in a preset environment for a preset observation time, observe and detect the morphology and performance of the colloid particles at different stages during the static state, and record corresponding data; A preliminary judgment module, used to judge whether the colloid particles are preliminarily qualified based on the morphological changes and performance changes of the colloid particles; The detection module is used to perform a die bonding operation on the chip using the corresponding glue if it is judged to be preliminarily qualified, and to detect the die bonding condition through the detection equipment, and to evaluate whether it meets the preset requirements according to the detection results; Wherein, the dispensing module comprises: The setting unit is used to set multiple glue dispensing positions in a single bracket bowl, determine the center position of the glue dispensing position, and perform glue dispensing operations based on the center position of the glue dispensing position. The spacing between the centers of adjacent glue dispensing positions is greater than 0.36±0.01mm.

6. The LED die-bonding glue material evaluation system according to claim 1, characterized in that: The dispensing module comprises: The control unit is used to control the diameter of the glue particles to be 0.36±0.01 mm by debugging the glue dispensing equipment.

7. The LED die-bonding glue material evaluation system according to claim 1, characterized in that: The detection module comprises: A first detection unit is used to detect the appearance of the die bonding condition through microscopic inspection; The second detection unit is used to detect the thrust of the die bonding condition by using professional CTQ testing equipment.

8. A computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the LED die-bonding glue material evaluation method according to any one of claims 1 to 4 is implemented.

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