Inspection jig and substrate inspection device

Abstract

An inspection jig and a substrate inspection apparatus, the apparatus comprising: a substrate holding member (2) that holds a substrate (10) to be inspected; an inspection jig (4a) and an inspection jig (4b) having a movable plate (6a), a movable plate (6b), and a support member (7) that supports the movable plate (6a) and the movable plate (6b), the movable plate (6a) and the movable plate (6b) having contact portions (63) and (63) that come into contact with an inspection target portion (13D) and an inspection target portion (13U) of the substrate (10) held by the substrate holding member (2); and a lifting drive mechanism (5a) and a lifting drive mechanism (5b) that lift and displace the inspection jig (4a) and the inspection jig (4b), thereby moving the movable plate (6a) and the movable plate (6b) to an inspection standby position in which the contact portions (63) and (63) approach the inspection target portion (13D) and the inspection target portion (13U).

Description

[0001] Related divisional applications

[0002] This application is a divisional application of the invention patent application with the invention name “Substrate Inspection Device” and application number 201880081787.5. The application date of the original application is November 27, 2018.

[0003] This application is based on Japanese patent application No. 2017-248714 filed on December 26, 2017, and the contents are incorporated herein by reference. Technical Field

[0004] The invention relates to an inspection fixture for inspecting a substrate and a substrate inspection device. Background Art

[0005] In the past, there was a substrate inspection device that performs a continuity inspection between the wiring on the surface side and the wiring pattern on the back side of a circuit substrate placed on a workbench. Among such substrate inspection devices, the following substrate inspection device is known, that is, the substrate inspection device includes: a lifting plate that is movably arranged above a base, and an inspection fixture for conducting a continuity inspection of the circuit substrate is installed on the upper surface; and a plurality of feed screw members, including a screw portion extending in the up-down direction and a nut portion screwed with the screw portion, the plurality of feed screw members move the lifting plate up and down (for example, refer to patent document 1). The substrate inspection device is configured to move the lifting plate up and down by rotating any one of the screw portion and the nut portion of the feed screw member, thereby causing the inspection probe to contact the inspection object portion (wiring pattern) of the circuit substrate.

[0006] In addition, a conductive connector material including anisotropic conductive rubber or the like is provided at a contact portion of a relay connector used for inspection of a substrate (printed wiring substrate) (for example, see Patent Document 2). The relay connector is configured so that electrical conduction can be achieved by bringing the conductive connector material into contact with an inspection target portion of the substrate and applying pressure or the like.

[0007] Prior art literature

[0008] Patent Literature

[0009] Patent Document 1: Japanese Patent Application Publication No. 2001-183407

[0010] Patent Document 2: Japanese Patent Application Publication No. 2000-208187 Summary of the invention

[0011] According to the substrate inspection device disclosed in the patent document 1, the inspection fixture and the lifting plate having a specified weight can be quickly moved to the inspection position by rotating the feed screw member at a high speed. On the other hand, in the lifting drive mechanism having the feed screw member, it is difficult to perform fine position adjustment and crimping force setting due to its large driving force. Therefore, there are the following problems: since the connector material for inspection provided in the inspection fixture is firmly crimped to the inspection object part of the substrate, the inspection probe or the inspection object part is damaged, or conversely, poor inspection is easily caused due to insufficient crimping of the connector material relative to the inspection object part.

[0012] On the other hand, as disclosed in the patent document 2, according to the structure in which the conductive connector material made of anisotropic conductive rubber is provided at the contact portion corresponding to the inspection object portion, the soft anisotropic conductive rubber is in surface contact with the inspection object portion of the substrate, so that high contact stability can be obtained with respect to the fine electrode. However, in the inspection device using the conductive connector material, there is a problem that the conductive connector material is easily damaged if the contact pressure with respect to the inspection object portion of the substrate becomes slightly higher. In addition, there is a problem that erroneous detection is easily caused by the current flowing in a direction other than the plate thickness direction of the conductive connector material.

[0013] An object of the present invention is to provide an inspection device that can easily suppress damage to an inspection target portion of a substrate and a contact portion of an inspection jig.

[0014] A substrate inspection device according to an example of the present invention includes: a substrate holding member for holding a substrate as an inspection object; an inspection fixture having a movable plate and a supporting member for supporting the movable plate, the movable plate having a contact portion that contacts an inspection object portion of the substrate held by the substrate holding member; and a lifting and lowering drive mechanism for lifting and displacing the inspection fixture so as to move the movable plate to an inspection standby position where the contact portion is close to the inspection object portion. In the substrate inspection device, an axial support portion and a swinging drive portion are provided on the supporting member, the axial support portion including a supporting shaft that supports the movable plate in a swingable manner, and the swinging drive portion causes the movable plate to swing and displace with the supporting shaft as a fulcrum so as to bring the contact portion into contact with the inspection object portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a side view showing a schematic configuration of a substrate inspection device according to a first embodiment of the present invention.

[0016] Figure 2 It is a plan view showing the specific structure of the main part of the substrate.

[0017] Figure 3 This shows the general structure of the inspection fixture. Figure 1 Cross-sectional view along line III-III.

[0018] Figure 4 This is a cross-sectional view showing a state where the inspection jig is brought close to the substrate.

[0019] Figure 5 It is a cross-sectional view showing a specific structure of a substrate holding member.

[0020] Figure 6 It is a perspective view showing a state in which the substrate holding member is disassembled.

[0021] Fig. 7A It is a perspective view showing another example of the gasket.

[0022] Figure 7B It is a perspective view showing another example of the gasket.

[0023] Figure 8 It is an exploded cross-sectional view showing a modified example of the substrate holding member.

[0024] Fig. 9 It is a plan view showing a schematic structure of the first inspection jig.

[0025] Fig.10 It is a perspective view showing a schematic structure of a support block.

[0026] Fig.11 It is a cross-sectional view showing the specific structure of the first inspection jig.

[0027] Fig.12 It shows the specific structure of the first inspection fixture. Fig.11 Sectional view along line XII-XII.

[0028] Explanation of symbols

[0029] 1: Substrate inspection device

[0030] 2: Substrate holding member

[0031] 4a: First inspection fixture

[0032] 4b: Second inspection fixture

[0033] 5a: First lifting drive mechanism

[0034] 5b: Second lifting drive mechanism

[0035] 6a: First movable plate

[0036] 6b: Second movable plate

[0037] 7: Supporting components

[0038] 8: Axis support

[0039] 9: Support block

[0040] 10: Substrate

[0041] 11: Substrate body

[0042] 12: Side end

[0043] 13D, 13U: Inspection object

[0044] 14D, 14U: Flat face

[0045] 20: Adsorption hole

[0046] 21: Adsorption board

[0047] 22: Connecting hole

[0048] 23: Support plate

[0049] 24, 24a, 24b: Pad

[0050] 25: Middle plate

[0051] 26: Covering plate

[0052] 27: concave part

[0053] 28, 28a, 28b: Opening

[0054] 29: Surrounding

[0055] 30: protrusion

[0056] 31: Embedded hole

[0057] 51: Rotation drive unit

[0058] 52: Screw shaft

[0059] 53, 53a, 53b: Lifting plate

[0060] 54: Buffer drive unit

[0061] 55: Force-applying member

[0062] 61: Movable plate body

[0063] 62: Reinforcement plate

[0064] 63: Contact Department

[0065] 64: Connector

[0066] 65: Incision

[0067] 71: Base plate

[0068] 72: Swing drive unit

[0069] 73: Force-applying member

[0070] 74: Restriction component

[0071] 81: Support shaft

[0072] 82: Support plate

[0073] 83: Bearing

[0074] 91: Installation

[0075] 92: protrusion DETAILED DESCRIPTION

[0076] Hereinafter, embodiments of the present invention will be described based on the drawings. In addition, the same reference numerals in the respective drawings indicate the same configurations, and description thereof will be omitted.

[0077] Figure 1 1 is a schematic diagram showing the overall structure of the substrate inspection device of the present invention. Figure 2 This is a plan view showing the specific structure of the main parts of the substrate. Figure 3 This shows the general structure of the inspection fixture. Figure 1 The III-III line cross-sectional diagram, Figure 4 This is a cross-sectional view showing a state where the inspection jig is brought close to the substrate.

[0078] like Figure 1 As shown, the substrate inspection device 1 includes: a substrate holding member 2 for holding a substrate 10; a first inspection fixture 4a, arranged on the lower side of the substrate 10; a second inspection fixture 4b, arranged on the upper side of the substrate 10; a first lifting drive mechanism 5a, for lifting and shifting the first inspection fixture 4a at the lower side; and a second lifting drive mechanism 5b, for lifting and shifting the second inspection fixture 4b at the upper side.

[0079] The substrate 10 to be inspected may be, for example, a printed wiring substrate, a glass epoxy resin substrate, a flexible substrate, a ceramic multilayer wiring substrate, a packaging substrate for semiconductor packaging, an intermediate substrate, a film carrier or the like; it may also be an electrode plate for displays such as liquid crystal displays, electroluminescent (EL) displays, touch screen displays, electrode plates for touch screens, etc.; it may also be a semiconductor substrate such as a semiconductor wafer, a semiconductor chip, a chip size package (CSP), etc.; it may also be various substrates.

[0080] The substrate 10 in this embodiment includes a substrate body 11 held on the substrate holding member 2 and a side end portion 12 provided in a state of protruding to the side of the substrate holding member 2. Figure 2 and Figure 3 As shown, inspection target parts 13U, 13U including wiring patterns etc. are arranged at a predetermined interval and left and right apart on the upper surface of the side end 12. Also, a flat surface part 14U without any inspection target part is formed between adjacent inspection target parts 13U, 13U.

[0081] On the other hand, on the lower surface of the side end portion 12, inspection object portions 13D, 13D including wiring patterns and the like are arranged in a state of being separated from each other at a predetermined interval, and a flat surface portion 14D where no inspection object portion is present is formed between adjacent inspection object portions 13D, 13D. On each inspection object portion 13D, a plurality of electrode terminals arranged substantially parallel to each other are formed, for example, using wiring patterns. Each of the electrode terminals is used as an inspection point of the inspection object.

[0082] In addition, the inspection object portions 13U, 13U provided on the upper surface of the substrate 10 and the inspection object portions 13D, 13D provided on the lower surface of the substrate 10 are arranged so as to be Figure 3 Thus, the inspection object portion 13U on the upper surface of the substrate and the flat surface portion 14D on the lower surface of the substrate are arranged to face each other vertically, and the inspection object portion 13D on the lower surface of the substrate and the flat surface portion 14U on the upper surface of the substrate are arranged to face each other vertically. In each inspection object portion 13U, a plurality of electrode terminals similar to those of the inspection object portion 13D are formed as inspection points.

[0083] like Figure 1 As shown, the first lifting drive mechanism 5a includes a screw feeding mechanism, which has a rotation driving unit 51 including a servo motor, etc., a screw shaft 52 rotationally driven by the rotation driving unit 51, and a lifting plate 53 provided at the front end (upper end) of the screw shaft 52. The first inspection fixture 4a is installed on the upper surface of the lifting plate 53.

[0084] Similar to the first lifting drive mechanism 5a, the second lifting drive mechanism 5b includes a screw feeding mechanism having a rotation drive unit 51 including a servo motor or the like, and a screw shaft 52 rotationally driven by the rotation drive unit 51. A pair of upper and lower lifting plates 53a and 53b are provided at the front end (lower end) of the screw shaft 52, and the second inspection fixture 4b is mounted on the lower surface of the lower lifting plate 53b.

[0085] When inspecting the substrate 10, the rotation drive unit 51 of the first lifting drive mechanism 5a is operated to rotationally drive the screw shaft 52, thereby moving the lifting plate 53 and the first inspection fixture 4a from the initial position below (see Figure 3 ) rises to the upper inspection standby position, i.e. Figure 4As shown, the conductive connector material of the contact portions 63 , 63 in the first inspection jig 4 a described later is raised to a position close to the inspection target portions 13D, 13D provided on the lower surface of the substrate 10 .

[0086] In addition, the structure is as follows: the rotation drive unit 51 of the second lifting drive mechanism 5b is operated to rotate the screw shaft 52, thereby moving the lifting plate 53a, the lifting plate 53b and the second inspection fixture 4b from the upper initial position (refer to Figure 3 ) descends to the inspection standby position below, i.e. Figure 4 As shown, the surfaces of the conductive connector materials of the contact portions 63 , 63 lowered to the second inspection jig 4 b described later are close to the inspection object portions 13U, 13U provided on the upper surface of the substrate 10 .

[0087] The inspection standby position is set to a position where the distance between the inspection object parts 13D, 13D and the surface of the conductive connector material of the contact parts 63, 63 in the first inspection fixture 4a, and the distance between the inspection object parts 13U, 13U and the surface of the conductive connector material of the contact parts 63, 63 in the second inspection fixture 4b is, for example, about 0.1mm to 10.0mm.

[0088] In the second lifting drive mechanism 5b, buffer drive parts 54, 54 are provided between the lifting plates 53a and 53b, and the buffer drive parts 54, 54 include a pair of left and right drive cylinders, and the pair of left and right drive cylinders drive the second inspection fixture 4b to further descend from the inspection standby position. In addition, a pair of left and right force members 55, 55 are provided between the buffer drive parts 54, 54, and the pair of left and right force members 55, 55 include tension springs that force the lifting plates 53b and the second inspection fixture 4b upward against their own weight.

[0089] The buffer driving unit 54 lowers the second inspection jig 4b by driving air of a certain pressure supplied to the driving unit thereof, thereby, if necessary, bringing the contact portions 63, 63 of the second inspection jig 4b into contact with the inspection object portions 13U, 13U of the substrate 10. As the buffer driving unit 54, for example, a low-friction air cylinder such as an MQQT series air cylinder manufactured by SMC (Co., Ltd.) can be used.

[0090] Furthermore, since the air cylinders constituting the buffer drive portions 54, 54 have low friction, pressure control is easily performed, and thus the pressing force of the contact portions 63, 63 with respect to the inspection object portions 13U, 13U can be easily controlled with high accuracy.

[0091] Figure 5 is a cross-sectional view showing a specific structure of a substrate holding member, Figure 6 1 is a perspective view showing a state where the substrate holding member is disassembled. Fig. 7A, Figure 7B It is a perspective view showing another example of the gasket.

[0092] like Figure 5 and Figure 6 As shown, the substrate holding member 2 includes: an adsorption plate 21 having adsorption holes 20 formed therein for adsorbing the substrate 10 according to the suction force of a suction device (not shown); and a support plate 23 having a connecting hole 22 formed therein for guiding the air sucked from the adsorption holes 20 of the adsorption plate 21 to the suction device side. In addition, a pad 24 is provided between the adsorption plate 21 and the intermediate plate 25.

[0093] The adsorption plate 21 includes a plate having a plurality of adsorption holes 20 arranged in a matrix at regular intervals, and its upper surface has a size corresponding to the main portion of the substrate 10 , specifically, a size capable of mounting the substrate body 11 .

[0094] The support plate 23 includes an intermediate plate 25 and a covering plate 26 covering the back of the intermediate plate 25. The intermediate plate 25 has a plurality of connecting holes 22 arranged in a matrix at a certain interval corresponding to the adsorption holes 20 of the adsorption plate 21. A recess 27 connected to a suction device other than the drawing is formed in the covering plate 26. The air in the recess 27 is connected to the adsorption holes 20 of the adsorption plate 21 and the connecting holes 22 of the intermediate plate 25. Figure 5 The adsorption gas is discharged to the outside as shown by the arrow Q, and a negative pressure can be obtained so that the substrate 10 is in close contact with the surface of the adsorption plate 21.

[0095] The pad 24 is provided with an opening 28 having a size corresponding to the adsorption range of the substrate 10 and a surrounding portion 29 surrounding the outer periphery of the opening 28. Furthermore, by disposing the pad 24 between the adsorption plate 21 and the intermediate plate 25 to block the connection between the adsorption holes 20 located outside the adsorption range of the substrate 10 and the communication holes 22, a strong suction force can be generated to firmly and closely contact the main part of the substrate 10 with the upper surface of the adsorption plate 21.

[0096] In addition, it is preferable to set Fig. 7A , Figure 7B As shown in the figure, a plurality of pads 24a and 24b having openings 28a and 28b of different sizes are pre-aligned. Furthermore, by selecting a pad having an opening 28 corresponding to the type of substrate 10 and arranging it between the adsorption plate 21 and the intermediate plate 25, the range of negative pressure generation can be changed according to the size of the substrate 10.

[0097] In addition, it can also be set as follows: Figure 8As shown, on the lower surface of the adsorption plate 21, a plurality of protrusions 30 having a protrusion amount corresponding to the plate thickness of the pad 24 are arranged at a certain interval, and in the surrounding portion 29 of the pad 24, an embedding hole 31 for embedding the protrusion 30 is provided at a position corresponding to the setting portion of the protrusion 30.

[0098] According to the above configuration, when the pad 24 is disposed between the adsorption plate 21 and the intermediate plate 25, the protrusion 30 can be accurately aligned with the pad 24 by inserting it into the insertion hole 31 of the pad 24. In addition, by inserting the protrusion 30 between the adsorption plate 21 and the intermediate plate 25, the interval between the adsorption plate 21 and the intermediate plate 25 can be kept constant. Therefore, there is the following advantage: even if the adsorption plate 21 is formed of a raw material that is easily deformed, the adsorption plate 21 can be suppressed from being deformed due to the negative pressure, etc., and a gap can be prevented from being formed between the substrate 10 and the adsorption plate 21.

[0099] Fig. 9 is a plan view showing the schematic structure of the first inspection fixture, Fig.10 This is a three-dimensional diagram showing the schematic structure of the support block. Fig.11 is a cross-sectional view showing the specific structure of the first inspection fixture, Fig.12 It shows the specific structure of the first inspection fixture. Fig.11 Sectional view along line XII-XII.

[0100] The first inspection jig 4a and the second inspection jig 4b have the same structure except that they are disposed symmetrically in the vertical direction. Therefore, only the structure of the first inspection jig 4a will be described below, and the description of the structure of the second inspection jig 4b will be omitted.

[0101] The first inspection jig 4a includes a first movable plate 6a disposed on the lower side of the substrate 10 and a support member 7 (see Figure 1 ).like Fig. 9 and Fig.10 As shown in FIG. 1 , contact portions 63, 63 are provided on the upper surface of one side edge of the first movable plate 6a, and the contact portions 63, 63 are provided with a conductive connector material made of conductive rubber. A plurality of detection electrodes are formed on the upper surface of one side edge of the first movable plate 6a so as to face the plurality of electrode terminals of the inspection object part 13D. Furthermore, the contact portion 63 is formed by providing the conductive connector material so as to cover the plurality of detection electrodes.

[0102] As the conductive connector material provided at the contact portions 63, 63, it is preferable to use an anisotropic conductive rubber that becomes conductive when pressurized, such as "pressurized conductive rubber PCR (registered trademark)" manufactured by JMT Co., Ltd. In addition, an anisotropic conductive rubber that becomes conductive in the plate thickness direction simply by contacting with the inspection object even without applying pressure may be used instead of the pressurized conductive rubber.

[0103] like Fig.11 As shown, the first movable plate 6a has a movable plate body 61 including a printed wiring substrate, etc., and a reinforcing plate 62 for reinforcing the lower surface of the movable plate body 61. A connector 64 is provided on the other side of the first movable plate 6a, and the connector 64 is used to connect each detection electrode of the contact portion 63 to the inspection device body outside the drawing via a cable or the like that is omitted from the drawing. In addition, a shaft support portion 8 described later is provided on the other side of the reinforcing plate 62, and the shaft support portion 8 supports the first movable plate 6a in a swingable manner.

[0104] like Figure 3 As shown in FIG. 1 , the contact portions 63, 63 of the first movable plate 6a are provided in a state of being separated into a plurality of locations so as to face the inspection object portions 13D, 13D provided on the lower surface of the substrate 10. In addition, between the locations where the adjacent contact portions 63, 63 are provided, a notch portion 65 is formed which is recessed toward the side of the installation portion of the shaft support portion 8, that is, toward the other side edge portion of the first movable plate 6a (see FIG. 1 ). Fig. 9 and Fig.10 ).

[0105] like Figure 1 , Fig.11 and Fig.12 As shown, the supporting member 7 is provided with: a base plate 71, which is lifted and driven by a first lifting drive mechanism 5a; an axial support portion 8, including a support shaft 81 which serves as a swing fulcrum for the first movable plate 6a; a swing drive portion 72, which swings and shifts the first movable plate 6a with the support shaft 81 as a fulcrum; and a support block 9, which supports the substrate 10.

[0106] The shaft support portion 8 includes: a pair of support plates 82, 82, which are vertically arranged on the base plate 71; a support shaft 81, both ends of which are fixed to the support plates 82, 82; and a bearing portion 83, which is fixed to the reinforcing plate 62 of the first movable plate 6a. The bearing portion 83 is externally fitted to the support shaft 81 and is rotatably supported by the shaft, thereby the first movable plate 6a is supported so as to be swingable with the support shaft 81 as a fulcrum.

[0107] The swing drive unit 72 is configured to swing the first movable plate 6a with the support shaft 81 as a fulcrum, so that the contact parts 63, 63 contact the inspection object parts 13D, 13D of the substrate 10 with a certain pressure. As the swing drive unit 72, for example, an MQQT series air cylinder manufactured by SMC (Co., Ltd.) can be used, similarly to the buffer drive unit 54.

[0108] The base plate 71 includes a plate fixed to the lifting plate 53 of the first lifting drive mechanism 5a. Between the base plate 71 and the reinforcing plate 62 of the first movable plate 6a, a force applying member 73 and a limiting member 74 are provided. The force applying member 73 includes a tension spring that applies force to the first movable plate 6a downward, and the limiting member 74 includes a support that contacts the lower surface of the first movable plate 6a to limit the downward displacement of the first movable plate 6a.

[0109] When the swing drive unit 72 is not in operation, the first movable plate 6a is urged downward by the urging member 73, and the lower surface of the first movable plate 6a abuts against the upper end surface of the limiting member 74. Thus, the downward displacement of the first movable plate 6a is restricted, and the first movable plate 6a is maintained in a substantially horizontal position.

[0110] like Figure 3 and Fig.10 As shown in FIG. 1 , the support block 9 comprises: a mounting portion 91 mounted on the upper surface of one side edge of the base plate 71 by means of mounting screws or the like; and a plurality of protrusions 92, 92 erected on the mounting portion 91. The protrusion 92 has a cross-sectional shape slightly smaller than the cutout portion 65 formed in the first movable plate 6a, so that the upper end of the protrusion 92 can be introduced into the cutout portion 65 of the first movable plate 6a (see FIG. 1 ). Fig. 9 and Fig.10 ).

[0111] Furthermore, during the conduction inspection described later, if the second movable plate 6b of the second inspection fixture 4b is driven by the swing drive unit 72 as shown in FIG. Figure 4 As shown by the arrow P, a pressing force is applied from the second movable plate 6 b to the upper surface of the substrate 10 , and the lower surface of the substrate 10 is supported by the protrusions 92 , 92 of the support block 9 provided on the first inspection jig 4 a .

[0112] As a result, the substrate 10 is suppressed from shifting downward, and the contact portions 63, 63 of the second movable plate 6b are appropriately pressed according to the pressing force, thereby making the conductive connector material conductive in the thickness direction thereof. As a result, the electrode terminals formed on the inspection object parts 13U, 13U and the detection electrodes of the contact portions 63, 63 of the second movable plate 6b are in a conductive state.

[0113] Similarly, when the first movable plate 6a of the first inspection jig 4a disposed below the substrate 10 is driven by the swing drive unit 72 and a pressing force is applied from the first movable plate 6a to the lower surface of the substrate 10, the contact portions 63, 63 of the first movable plate 6a are appropriately pressurized while the upper surface of the substrate 10 is supported by the protrusions 92, 92 of the support block 9 provided on the second inspection jig 4b, thereby the conductive connector material is conducted in the thickness direction thereof. As a result, the electrode terminals formed on the inspection object portions 13D, 13D and the detection electrodes of the contact portions 63, 63 of the first movable plate 6a are in a conductive state.

[0114] When the substrate 10 is inspected using the substrate inspection device 1 having the above structure, the first and second inspection jigs 4a and 4b are moved to the positions of the first and second inspection jigs 4a and 4b respectively, while the substrate 10 is supported on the substrate holding member 2. The rotation drive units 51 of the first and second lifting drive mechanisms 5a and 5b are operated to rotationally drive the screw shafts 52. Figure 4 Inspection standby position shown.

[0115] Then, by operating the swing driving parts 72 of the first inspection jig 4a and the second inspection jig 4b, the first movable plate 6a and the second movable plate 6b are respectively swung and displaced with the support shaft 81 as a fulcrum. Thus, the contact part 63 of the first movable plate 6a is pressed against the inspection object part 13D on the lower surface of the substrate with a predetermined pressing force, and the contact part 63 of the second movable plate 6b is pressed against the inspection object part 13U on the upper surface of the substrate with a predetermined pressing force.

[0116] In this way, the contact parts 63, 63 are in contact with the inspection object parts 13D and 13U of the substrate 10 under a moderately pressurized state, whereby the detection electrodes of the contact parts 63, 63 and the electrode terminals of the inspection object parts 13D and 13U are in a conductive state. Then, for example, a measuring current is supplied from the contact part 63 of the first inspection jig 4a to the electrode terminals of the inspection object parts 13D and 13U of the substrate 10, and a voltage generated by the measuring current is output from the contact part 63 of the second inspection jig 4b to the inspection device body outside the drawing via the conductive connector material, thereby determining whether the substrate 10 is good or not.

[0117] In addition, as described later, the operation of the swing drive unit 72 of the second inspection fixture 4b is stopped as needed and the second movable plate 6b is maintained in a horizontal state. The second inspection fixture 4b is lifted and lowered by operating the buffer drive unit 54 of the second lifting drive mechanism 5b, thereby allowing the contact portion 63 of the second movable plate 6b to contact the inspection object portion 13U of the substrate 10 with a certain pressure.

[0118] As described above, the substrate inspection device 1 includes: a substrate holding member 2 for holding the substrate 10; a first inspection fixture 4a having a first movable plate 6a and a supporting member 7 for supporting the first movable plate 6a, wherein the first movable plate 6a is provided with a contact portion 63 for contacting the inspection object portions 13D, 13D of the substrate 10; a second inspection fixture 4b having a second movable plate 6b and a supporting member 7 for supporting the second movable plate 6b, wherein the second movable plate 6b has a contact portion 63 for contacting the inspection object portions 13U, 13U of the substrate 10; and a first lifting drive mechanism 5a and a second lifting drive mechanism 5b for moving the first inspection fixture 4a and the second inspection fixture 4b. 4b are respectively moved to the inspection standby position. In the substrate inspection device 1, an axial support portion 8 and a swinging drive portion 72 are provided on the supporting member 7. The axial support portion 8 includes a supporting shaft 81 for supporting the first movable plate 6a and the second movable plate 6b in a swingable manner. The swinging drive portion 72 causes the first movable plate 6a and the second movable plate 6b to swing and shift with the supporting shaft 81 as a fulcrum, so that the contact portions 63, 63 are respectively in contact with the inspection object portion 13U and the inspection object portion 13D. According to the substrate inspection device 1, the substrate 10 can be accurately inspected while suppressing damage to the inspection object portion 13U, the inspection object portion 13D and the contact portion 63.

[0119] That is, the first lifting drive mechanism 5a and the second lifting drive mechanism 5b only need to have the function of lifting and displacing the first movable plate 6a and the second movable plate 6b to the inspection standby position close to the substrate 10, and do not need fine position control and driving force control. Therefore, as shown in the embodiment, by using the first lifting drive mechanism 5a and the second lifting drive mechanism 5b including the following screw feeding mechanism, the first inspection fixture 4a and the second inspection fixture 4b having a specified weight can be easily and quickly moved from the initial position to the inspection standby position, and the screw feeding mechanism has a rotation drive unit 51 including a servo motor, etc., and a screw shaft 52 driven by the rotation drive unit 51, and a large driving force can be obtained.

[0120] In the state where the first inspection fixture 4a and the second inspection fixture 4b are moved to the inspection standby position, the first movable plate 6a and the second movable plate 6b are swung and displaced with the support shaft 81 as a fulcrum by the swing driving unit 72, so that the contact parts 63, 63 are in contact with the inspection object part 13U, 13D, and the driving resistance at this time is only the sliding resistance of the shaft support part 8. Therefore, by using a low-friction and high-sensitivity air cylinder as the swing driving unit 72, the contact parts 63, 63 can be brought into contact with the inspection object parts 13U, 13D accurately with a moderate pressure, so that the substrate 10 can be properly inspected.

[0121] In addition, the screw feeding mechanism including the rotation driving unit 51 including a servo motor and the screw shaft 52 rotationally driven by the rotation driving unit 51 may be replaced by a first lifting and lowering driving mechanism 5a and a second lifting and lowering driving mechanism 5b composed of a hydraulic cylinder or a large air cylinder, etc., wherein the hydraulic cylinder or the large air cylinder has a driving force that can easily and quickly move the first inspection fixture 4a and the second inspection fixture 4b from the initial position to the inspection standby position.

[0122] In addition, instead of the swing drive unit 72 including the air cylinder, a screw feed mechanism including a screw shaft that swings and displaces the first movable plate 6a and the second movable plate 6b with the support shaft 81 as a fulcrum, and a small servo motor that rotationally drives the screw shaft may be used.

[0123] Instead of the above-mentioned embodiment in which a conductive connector material made of conductive rubber is provided on the contact portion 63, a configuration in which the contact portion 63 is provided with the following contact terminals: a probe-type contact terminal including a wire probe having moderate elasticity; or a probe-type contact terminal including a plunger including a conductor, a cylindrical body supporting the plunger in a slidable manner, and a force applying member applying force in a direction in which the front end portion of the plunger protrudes out of the cylindrical body.

[0124] As shown in the above embodiment, when a structure is set in which a conductive connector material made of soft conductive rubber is arranged on the contact portion 63 of the first movable plate 6a and the second movable plate 6b, there is an advantage that high contact stability can be obtained with respect to fine electrodes by making the conductive connector material contact the inspection object portion 13U and the inspection object portion 13D on a surface. In addition, the conductive connector material made of conductive rubber has the following advantages: even if it is a fine electrode, it has a large allowable range with respect to positional deviation, and it does not cause damage to the inspection object portion 13U and the inspection object portion 13D of the substrate 10, and the substrate inspection device can be made light and thin.

[0125] In addition, in the inspection device using the conductive connector material made of the conductive rubber, there is a tendency that the conductive connector material is easily damaged. However, as described above, since the first inspection fixture 4a and the second inspection fixture 4b in the inspection standby position are swung and displaced with the support shaft 81 as a fulcrum by the swing drive unit 72, the weight of the first inspection fixture 4a and the second inspection fixture 4b is supported by the support shaft 81, and the first inspection fixture 4a and the second inspection fixture 4b can be swung and displaced with a small force. As a result, it is easy to control the pressure of the contact parts 63, 63 pressed against the inspection object part 13U, the inspection object part 13D, so that the contact pressure of the contact parts 63, 63 can be controlled with high precision. Therefore, it is easy to suppress damage to the conductive connector material.

[0126] Furthermore, in the embodiment, it includes a first inspection fixture 4a having a first movable plate 6a arranged on the lower side of the substrate 10, a second inspection fixture 4b having a second movable plate 6b arranged on the upper side of the substrate 10, a first lifting drive mechanism 5a for lifting and lowering the first inspection fixture 4a, and a second lifting drive mechanism 5b for lifting and lowering the second inspection fixture 4b. Due to the above-mentioned structure, the first movable plate 6a and the second movable plate 6b can be quickly moved to the inspection standby position close to the substrate 10 by the first lifting drive mechanism 5a and the second lifting drive mechanism 5b.

[0127] Moreover, it has the following advantages: by operating the swing drive part 72 of the first inspection fixture 4a and the second inspection fixture 4b, the first movable plate 6a and the second movable plate 6b located in the inspection standby position are swung and shifted respectively, so that the contact parts 63 of the first movable plate 6a and the second movable plate 6b are respectively in contact with the inspection object part 13D and the inspection object part 13U arranged on the upper surface and the lower surface of the substrate 10 with appropriate pressure and accurately.

[0128] In addition, a configuration may be adopted in which one of the first movable plate 6a and the second movable plate 6b is omitted, and one of the first lifting drive mechanism 5a and the second lifting drive mechanism 5b for driving the first movable plate 6a and the second lifting drive mechanism 5b for driving the first movable plate 6a and the second lifting drive mechanism 5b for driving the first movable plate 6a and the second lifting drive mechanism 5b for driving the first movable plate 6a and the second lifting drive mechanism 5a ...

[0129] In addition, in the embodiment, the following structure is set: on the first movable plate 6a and the second movable plate 6b, contact portions 63, 63 are respectively provided in a state of being separated into multiple places, and between adjacent contact portions 63, 63, a cut-out portion 65 recessed toward the side of the axial support portion 8 is formed, and on the supporting members 7 of the first inspection fixture 4a and the second inspection fixture 4b, support blocks 9 having protrusions 92 are respectively provided, and the protrusions 92 are introduced into the cut-out portions 65.

[0130] According to the above configuration, the first movable plate 6a and the second movable plate 6b are driven by the swing drive unit 72 in a state where the upper surface and the lower surface of the substrate 10 are supported by the protrusions 92 and 92 of the support block 9, respectively, so that a moderate pressing force can be applied to the lower surface and the upper surface of the substrate 10. Therefore, even in the case where the substrate 10 is formed of a material that is easily elastically deformed, the displacement of the substrate 10 upward and downward can be suppressed by the support block 9. As a result, by appropriately pressurizing the contact portions 63 and 63 of the first movable plate 6a and the second movable plate 6b according to the above pressing force, the contact portions 63 and 63 can be appropriately connected to the inspection object portion 13D and the inspection object portion 13U of the substrate 10.

[0131] In addition, as described above, the substrate holding member 2 is provided with an adsorption plate 21, a support plate 23, and a pad 24. The adsorption plate 21 is formed with an adsorption hole 20 for adsorbing the substrate 10 according to the suction force of the suction device outside the attached drawings. The support plate 23 is formed with a connecting hole 22 for guiding the air sucked from the adsorption hole 20 of the adsorption plate 21 to the suction device side. The pad 24 is arranged between the adsorption plate 21 and the support plate 23. In addition, the pad 24 is provided with an opening 28 and a surrounding portion 29. The opening 28 has a size corresponding to the adsorption range of the substrate 10. The surrounding portion 29 surrounds the outer periphery of the opening 28. In the case of the above structure, the connection between the adsorption hole 20 located outside the adsorption range of the substrate 10 and the connecting hole 22 is blocked by the pad 24. Therefore, the main part of the substrate 10 can be firmly and closely attached to the adsorption plate 21.

[0132] Furthermore, we can Fig. 7A , Figure 7B As shown, multiple pads 24a and 24b having openings 28a and 28b of different sizes are pre-aligned, and the user can select a pad 24 corresponding to the type of substrate 10 and arrange it between the adsorption plate 21 and the support plate 23, specifically, between the adsorption plate 21 and the intermediate plate 25. By constructing in the above manner, various substrates 10 of different sizes can be appropriately held on the substrate holding member 2.

[0133] That is, by disposing the pad 24 having the opening 28 corresponding to the size of the substrate 10 between the adsorption plate 21 and the intermediate plate 25 of the substrate holding member 2 when the adsorption plate 21 and the intermediate plate 25 are separated, the range of negative pressure generation can be changed in accordance with the size of the substrate 10. Therefore, the substrate holding member 2 can be made versatile with a simple structure, so that substrates 10 of various sizes can be adsorbed on the adsorption plate 21 and appropriately held.

[0134] In addition, a buffer drive unit 54 including a drive cylinder is provided in the second lifting drive mechanism 5b, and the drive cylinder drives the second inspection fixture 4b to lift and lower so that the contact portion 63 of the second movable plate 6b contacts the inspection object portion 13U of the substrate 10 with a certain pressure. According to the embodiment, it has the following advantages: by selectively operating the buffer drive unit 54 of the second lifting drive mechanism 5b and the swing drive unit 72 of the second inspection fixture 4b as needed, various substrates 10 can be inspected appropriately respectively.

[0135] For example, when the substrate 10 is inspected using a probe-type contact terminal that requires elastic deformation of the connector material provided in the contact portion 63, when the contact portion 63 is brought into contact with the inspection object portion 13U by swinging and displacing the second movable plate 6b by a predetermined amount with the support shaft 81 as a fulcrum, there is a concern that the first movable plate 6a will become tilted. As a result, depending on the type of substrate, the contact portion 63 may not be brought into proper contact with the inspection object portion 13U.

[0136] Therefore, in the case where it is necessary to ensure the descending amount of the second movable plate 6b to a certain extent as described above, it is preferred to operate the buffer driving unit 54 of the second lifting driving mechanism 5b while stopping the operation of the swing driving unit 72 and keeping the second movable plate 6b in a horizontal state to lower the second inspection fixture 4b to a specified position, thereby allowing the contact portion 63 to properly contact the inspection object portion 13U.

[0137] On the other hand, when it is not necessary to set the descending amount of the second movable plate 6b so large and it is necessary to control the contact pressure of the contact portion 63 relative to the inspection object portion 13U with high precision, it is preferred to stop the operation of the buffer drive portion 54 and swing the second movable plate 6b around the support shaft 81 through the swing drive portion 72, thereby controlling the contact pressure of the contact portion 63 relative to the inspection object portion 13U to an appropriate value.

[0138] Furthermore, when inspecting the substrate 10, when it is not necessary to control the lifting and lowering positions of the first movable plate 6a and the second movable plate 6b with high precision, and when it is necessary to set the contact pressure of the contact portion 63 relative to the inspection object portion 13U to be larger, the contact portion 63 can also be made to contact the inspection object portion 13U according to the driving force of the first lifting drive mechanism 5a and the second lifting drive mechanism 5b.

[0139] For example, when inspecting the substrate 10 using many probe terminals, the first lifting drive mechanism 5a and the second lifting drive mechanism 5b can be operated by operating the rotation drive unit 51 while stopping the operation of the swing drive unit 72 and maintaining the first movable plate 6a and the second movable plate 6b in a horizontal state, so that the first inspection fixture 4a and the second inspection fixture 4b can be lifted and shifted, thereby making the contact portion 63 contact the inspection object portion 13U.

[0140] Thus, the substrate inspection apparatus of the present invention can appropriately inspect various substrates 10 by appropriately selecting the driving unit used when inspecting the substrate 10 according to the type of the substrate 10 and the structure of the contact unit 63, thereby having the advantage of excellent versatility.

[0141] In addition, in the embodiment, a pair of left and right force members 55, 55 are arranged between the buffer drive parts 54, 54, and the pair of left and right force members 55, 55 include tension springs that apply force upward to the lifting plate 53b and the second inspection fixture 4b against their own weight. Therefore, even when a small cylinder is used as the buffer drive parts 54, 54, the second inspection fixture 4b and the like can be easily and quickly lifted and moved.

[0142] In addition, the buffer drive units 54, 54 may be omitted, or the buffer drive units 54, 54 may be provided in both the second lifting drive mechanism 5b located above the substrate 10 and the first lifting drive mechanism 5a located below the substrate 10. Furthermore, the buffer drive units 54, 54 may be provided only in the first lifting drive mechanism 5a located below the substrate 10.

[0143] That is, a substrate inspection device of an example of the present invention includes: a substrate holding member for holding a substrate as an inspection object; an inspection fixture having a movable plate and a supporting member for supporting the movable plate, the movable plate having a contact portion that contacts the inspection object portion of the substrate held by the substrate holding member; and a lifting and lowering drive mechanism for lifting and displacing the inspection fixture so as to move the movable plate to an inspection standby position where the contact portion is close to the inspection object portion, wherein an axial support portion and a swinging drive portion are provided on the supporting member of the inspection fixture, the axial support portion including a supporting shaft that supports the movable plate in a swingable manner, and the swinging drive portion causes the movable plate to swing and displace with the supporting shaft as a fulcrum, thereby causing the contact portion to contact the inspection object portion.

[0144] According to the above configuration, the inspection fixture can be easily and quickly moved from the initial position to the inspection standby position by the lifting drive mechanism. Moreover, the movable plate is swung and displaced with the support shaft as a fulcrum by the swing drive unit, so that the contact part can contact the inspection object part with appropriate pressure, so that the substrate can be inspected accurately.

[0145] A configuration may be adopted in which a conductive connector material made of conductive rubber is disposed in the contact portion.

[0146] According to the above configuration, there are advantages such as high contact stability can be obtained with respect to fine electrodes by making the soft conductive connector material contact the inspection object part of the substrate, and high inspection accuracy can be obtained. In addition, there are the following advantages: even if it is a fine electrode, it has a large allowable range with respect to positional deviation, and the inspection object part of the substrate is not damaged, and the substrate inspection device can be formed to be light and thin. Moreover, the inspection fixture in the inspection standby position is swung and displaced with the support shaft as a fulcrum by the swing drive part, and the contact part can be brought into contact with the inspection object part with a light pressure as described above. By configuring in this way, damage to the conductive connector material can be easily suppressed.

[0147] In addition, it is preferred that the inspection fixture includes: a first inspection fixture having a first movable plate arranged on the lower side of the substrate; and a second inspection fixture having a second movable plate arranged on the upper side of the substrate, and the lifting drive mechanism includes: a first lifting drive mechanism for lifting and lowering the first inspection fixture; and a second lifting drive mechanism for lifting and lowering the second inspection fixture.

[0148] According to the above configuration, the first movable plate and the second movable plate can be quickly moved to the inspection standby position close to the substrate by the first lifting drive mechanism and the second lifting drive mechanism, respectively. Moreover, the following advantages are provided: the first movable plate and the second movable plate are swung and displaced by the swing drive parts of the first inspection fixture and the second inspection fixture, respectively, so that the contact parts of the first movable plate and the second movable plate can be brought into contact with the inspection object parts provided on the upper surface and the lower surface of the substrate respectively with appropriate pressure and accurately.

[0149] In addition, the following configuration may be adopted: the contact portions are respectively provided on the first movable plate and the second movable plate in a state of being separated into a plurality of locations, and a cutout portion recessed toward the axial support portion is formed between adjacent contact portions, and support blocks supporting the substrate are respectively provided on the support members of the first inspection fixture and the second inspection fixture, and the support blocks have protrusions introduced into the cutout portions.

[0150] According to the above configuration, the first movable plate and the second movable plate are driven by the swing driving unit while the upper and lower surfaces of the substrate are supported by the protrusions of the support block, respectively, so that a moderate pressing force can be applied to the lower and upper surfaces of the substrate. Therefore, even when the substrate is formed of a raw material that is easily elastically deformed, the displacement of the substrate upward and downward can be suppressed by the support block, respectively. Therefore, by appropriately pressurizing the contact portions of the first movable plate and the second movable plate according to the pressing force, the contact portions can be appropriately connected to the inspection object portion of the substrate.

[0151] In addition, it is preferred that the substrate holding component comprises: an adsorption plate formed with adsorption holes for adsorbing the substrate according to the suction force of a suction device; a support plate formed with a connecting hole for conducting air sucked from the adsorption holes of the adsorption plate to the suction device side; and a gasket arranged between the adsorption plate and the support plate, wherein an opening portion and a surrounding portion are provided in the gasket, the opening portion having a size corresponding to the adsorption range of the substrate, and the surrounding portion surrounding the outer periphery of the opening portion.

[0152] According to the above configuration, the connection between the adsorption holes outside the adsorption range of the substrate and the communication holes is blocked by the gasket, so that the main part of the substrate can be firmly and closely attached to the adsorption plate. In addition, by pre-aligning a plurality of gaskets having openings of different sizes, and selecting a gasket corresponding to the type of substrate and arranging it between the adsorption plate and the support plate, various substrates of different sizes can be appropriately held on the substrate holding member.

[0153] In addition, the following configuration may be adopted: the lifting and lowering driving mechanism may further include a buffer driving unit, the buffer driving unit including a driving cylinder, and the driving cylinder drives the inspection fixture to be lifted and lowered so that the contact portion contacts the inspection object portion with a certain pressure.

[0154] According to the above configuration, there is an advantage that various substrates can be properly inspected by selectively operating the lifting drive mechanism and the swing drive unit of the second inspection fixture as needed during the inspection of the substrate. In this way, by using the drive unit for substrate inspection separately according to the type of substrate and the structure of the contact part, various substrates can be properly inspected, so there is an advantage of excellent versatility.

[0155] According to the substrate inspection device having such a configuration, it is possible to easily suppress damage to the inspection target portion of the substrate and the contact portion of the inspection jig.

[0156] In addition, the specific embodiments or examples presented in the section of the specific embodiments are only used to clarify the technical content of the present invention, and the present invention should not be limited to such specific examples and interpreted narrowly.

Claims

1. An inspection fixture, comprising: a movable plate provided with a contact portion that contacts an inspection object portion of a substrate of an inspection object; as well as a supporting member supporting the movable plate, The support member is provided with a shaft support portion, the shaft support portion including a support shaft supporting the movable plate in a swingable manner, The support shaft is disposed at one end of the movable plate. The contact portion is disposed at the other end of the movable plate, The contact portion is brought into contact with the inspection object portion by applying a force to a portion between the one end portion and the other end portion.

2. The inspection fixture according to claim 1, wherein: A conductive connector material made of conductive rubber is disposed in the contact portion.

3. The inspection fixture according to claim 1, wherein: The contact portions are provided in a plurality of separated locations on the movable plate, and a notch portion recessed toward the shaft support portion is formed between adjacent contact portions.

4. A substrate inspection device, comprising the inspection fixture according to any one of claims 1 to 3.

Images