A fully automatic semiconductor packaging equipment

Abstract

The present invention provides a fully automatic semiconductor packaging equipment, which mainly comprises a support frame; a chip substrate storage mechanism, comprising a loading layer, a transition layer and a unloading layer, which are used for storing magazines; a chip substrate transmission mechanism, comprising a loading and conveying mechanism, a handling mechanism and a unloading and conveying mechanism arranged on a first mounting platform of the support frame, which are used for transmitting unpackaged and packaged chip substrates; a chip substrate loading mechanism, which makes reciprocating linear movements on the first mounting platform, which is used for handling chip substrates to be packaged and packaged, a press unit, which is used for packaging chip substrates, and a resin providing structure, comprising a resin loading mechanism and a first lifting mechanism, which are used for transmitting resin and handling resin trays; wherein the chip substrate loading mechanism and the resin loading mechanism are arranged in staggered layers, and are linked by the first lifting mechanism, so that the resin supply and the chip substrate can be simultaneously transmitted to between the lower mold and the upper mold of the press unit, thereby improving the packaging efficiency.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor chip substrate packaging, and in particular to a fully automatic semiconductor packaging device. Background Art

[0002] As time goes by, semiconductor technology continues to advance, and more complex semiconductor devices such as integrated circuits and large-scale integrated circuits have gradually been developed. The development of these technologies has greatly promoted the progress of computers, communications, medical treatment and other fields, making our lives more convenient and efficient.

[0003] The compression packaging of chip substrates is an indispensable step. Traditional compression packaging equipment for chip substrates requires manual loading, which has low precision and increased risk factors for manual operation. At the same time, regarding the transmission of resin, traditional equipment needs to be divided into two transmission mechanisms with the transmission of chip substrates and run on the same plane track. The transportation process is that the first loading mechanism first feeds the substrate into the press and then exits the press area. Then the second loading mechanism feeds the resin into the press and then exits. The press performs mold clamping and pressurization to package the chip. This loading method requires a certain amount of time to allow the chip substrate transport mechanism to completely exit the press before the resin can be transported, resulting in a complicated process and low production efficiency. Summary of the invention

[0004] The present invention provides a fully automatic semiconductor packaging equipment, which solves the safety and precision problems caused by the need for manual loading assistance of traditional packaging equipment in the above technical background, as well as the complex and low efficiency process of transmitting chip substrates and resins to a press.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] A fully automatic semiconductor packaging equipment, comprising:

[0007] A support frame, on which a first mounting platform is provided;

[0008] The chip substrate storage mechanism comprises at least one upper material layer, at least one transition layer and at least one lower material layer which are arranged in sequence from bottom to top, and a plurality of magazines can be placed on the upper material layer, the transition layer and the lower material layer, and the magazine is provided with a plurality of interlayers, and the chip substrate is placed on the interlayers of the magazine;

[0009] The chip substrate transmission mechanism comprises a loading conveying mechanism, a handling mechanism and a unloading conveying mechanism arranged on the first mounting platform of the support frame, wherein the loading conveying mechanism is arranged on one side of the loading layer, the unloading conveying mechanism is arranged on one side of the unloading layer, and the handling mechanism is arranged between the loading conveying mechanism and the unloading conveying mechanism;

[0010] A chip substrate loading mechanism, movably disposed on the first mounting platform, used for transporting chip substrates to be packaged and packaged, and the chip substrate loading mechanism can perform reciprocating linear movement on the first mounting platform;

[0011] at least one set of press units, located on one side of the loading mechanism, the press units comprising an upper die and a lower die, and a portion of the chip substrate loading mechanism can enter between the upper die and the lower die;

[0012] A resin supply mechanism is arranged near the end of the moving track of the chip substrate loading mechanism, the resin supply mechanism includes a resin loading mechanism, a first lifting mechanism and a resin tray, the resin loading mechanism can drive the resin tray to reciprocate linearly on the second mounting platform of the support frame, the second mounting platform is arranged below the first mounting platform and has a preset spacing with the first mounting platform, the first lifting mechanism is arranged on the support frame, part of the resin loading mechanism can move above the first lifting mechanism to transport the resin tray to the first lifting mechanism, the first lifting mechanism can drive the resin tray to move to the chip substrate loading mechanism, and move the resin tray into the press unit through the chip substrate loading mechanism or take the resin tray out of the press unit and move it to the first lifting mechanism;

[0013] A waste box is arranged near one side of the conveying mechanism and is located below the first mounting platform. A switchable waste opening is provided on the first mounting platform, and the position of the waste opening corresponds to the position of the movement trajectory of the chip substrate loading mechanism.

[0014] In some embodiments, the upper material layer is provided with a first translation component, the first translation component is provided with a first translation push block, the first translation push block can make reciprocating linear movement on the upper material layer, a first moving module is provided on one side of the upper material layer, the first moving module is arranged on the support frame, the first moving module includes a first X-axis module and a first Z-axis module, the first X-axis module is provided with a first X-axis slider for reciprocating linear movement, the first Z-axis module is arranged on the first X-axis slider, the first Z-axis module is provided with a first support block for reciprocating linear movement, the moving direction of the first X-axis slider is consistent with the moving direction of the first translation push block, and the moving direction of the first support block is consistent with the distribution direction of the upper material layer, the transition layer and the lower material layer.

[0015] In some embodiments, it also includes a chip substrate pushing mechanism arranged on the same side as the first mobile module, the chip substrate pushing mechanism is arranged on the support frame, and a reciprocating pushing claw is provided on the chip substrate pushing mechanism, and the moving direction of the pushing claw is consistent with the interlayer direction of the magazine.

[0016] In some embodiments, a second movable module is further included which is disposed on the other side of the chip substrate storage mechanism, and the second movable module has the same structure as the first movable module.

[0017] In some embodiments, a second translation assembly is provided on the transition layer, and a third translation assembly is provided on the lower material layer, the second translation assembly includes a second translation motor arranged on the support frame, a second translation active synchronous pulley arranged at the output end of the second translation motor, and multiple second translation synchronous belts and multiple second translation driven synchronous pulleys arranged on the support frame, the second translation active synchronous pulley is provided with multiple second mounting grooves distributed at intervals, multiple second translation synchronous belts are wound around the second mounting grooves and around the corresponding second translation driven synchronous pulleys, so that the multiple second translation synchronous belts are arranged in parallel, the third translation assembly has the same structure as the second translation assembly, and the moving direction of the magazine located on the third translation assembly is opposite to the moving direction of the magazine located on the second translation assembly.

[0018] In some embodiments, the loading and conveying mechanism includes a first conveying track with adjustable spacing, a scanning mechanism and a first traction mechanism, the first conveying track includes a first side plate and a second side plate, the first side plate and the second side plate are provided with a first conveying groove, the scanning mechanism is arranged at the loading end of the first conveying track to scan the chip substrate, the first traction mechanism is provided with a first traction clamp, the first traction clamp is arranged between the first side plate and the second side plate and the first traction clamp moves back and forth in a straight line along the length direction of the first conveying track.

[0019] In some embodiments, the transport mechanism includes a first transport component disposed near the loading conveyor mechanism, a second transport component disposed near the unloading conveyor mechanism, and a preset platform disposed between the first transport component and the second transport component, wherein a chip substrate placement area is disposed on the preset platform;

[0020] The first transport assembly includes a first transport swing arm, a second transport swing arm and a first transport clamp, wherein the fixed end of the first transport swing arm is rotatably disposed on the first mounting platform, the fixed end of the second transport swing arm is rotatably disposed on the free end of the first transport swing arm, and the first transport clamp can be lifted and lowered on the free end of the second transport swing arm;

[0021] The second conveying assembly includes an X-axis conveying module provided with a first conveying slider, a Y-axis conveying module provided with a second conveying slider, a Z-axis conveying module and a second conveying clamp, the Y-axis conveying module is fixedly arranged on the first mounting platform, the X-axis conveying module is arranged on the second conveying slider of the Y-axis conveying module, the Z-axis conveying module is arranged on the first conveying slider of the X-axis conveying module, and the second conveying clamp is arranged on the Z-axis conveying module.

[0022] In some embodiments, it also includes a counting detection mechanism disposed on the first mounting platform, the counting detection mechanism is provided with a measuring instrument capable of reciprocating linear movement relative to the first mounting platform, the measuring instrument is used to detect the number and volume of chips on the chip substrate, and the moving direction of the measuring instrument is consistent with the length direction of the chip substrate.

[0023] In some embodiments, the first carrying clamp has the same structure as the second carrying clamp, and the first carrying clamp includes a carrying base plate, two first rotating shafts that rotate relative to the carrying base plate and are symmetrically arranged, a plurality of first claws that are fixedly arranged on the first rotating shaft and are spaced apart, two first connecting rods, a first rocker arm and a first driving member, the two first connecting rods are symmetrically arranged, the first connecting rod is fixedly connected to the first rotating shaft, a first through groove is provided at the free end of at least one first connecting rod for movable connection between the two first connecting rods, the fixed end of the first rocker arm is connected to the first rotating shaft, and the free end of the first rocker arm is connected to the output end of the first driving member so that the first rocker arm drives the first rotating shaft to swing.

[0024] In some embodiments, the chip substrate loading mechanism includes a first base capable of reciprocating linear movement along the first mounting platform, a first moving layer moving relative to the first base, and a second moving layer moving relative to the first moving layer, wherein the moving direction of the first base is perpendicular to the direction of the first moving layer, and the moving direction of the second moving layer is parallel to the direction of the first moving layer;

[0025] The second movable layer is provided with a second movable substrate, and a first suction cup assembly and a first substrate clamping assembly capable of being raised and lowered are provided above the second movable substrate, the first suction cup assembly is arranged close to one side of the press unit, and includes a plurality of first suction cups, and the first substrate clamping assembly is arranged away from one side of the press unit, and the structure of the first substrate clamping assembly is the same as the structure of the first transport clamping claw;

[0026] A second tray clamping assembly and a second suction cup assembly are provided below the second movable substrate. The second suction cup assembly is provided close to the press unit and includes a plurality of second suction cups. The second tray clamping assembly is provided away from the press unit and includes a second main clamping mechanism and a second auxiliary clamping mechanism. The second main clamping mechanism includes at least two second main clamping jaws that open and close relative to the second movable substrate. The second auxiliary clamping mechanism includes at least two second auxiliary clamping jaws that open and close relative to the second movable substrate.

[0027] The first suction cup assembly and the second suction cup assembly are located correspondingly, and the first substrate clamping assembly and the second tray clamping assembly are located correspondingly.

[0028] In some embodiments, the first mounting platform is provided with loading ports matching the number of the first lifting mechanisms, the loading ports correspond to the positions of the first lifting mechanisms, and a portion of the first lifting mechanism can pass through the loading ports and rise to the bottom of the chip substrate loading mechanism, wherein a first sealing component is provided at both the loading port and the waste port, the first sealing component includes a first sliding door movably arranged on the first mounting platform and a sealing drive, the coverage area of ​​the first sliding door is not less than the coverage area of ​​the loading port and the waste port, and the first sliding door is connected to the output end of the sealing drive.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] The present application sets up a chip substrate storage mechanism, a chip substrate transmission mechanism, a chip substrate loading mechanism, a resin providing mechanism and a press unit. In the entire chip substrate loading, transmission, resin providing and packaging process, an automated structure is adopted, and no manual auxiliary operation is required, thus avoiding the safety issues of manual auxiliary operation. At the same time, the chip substrate loading mechanism and the resin loading mechanism are staggered, and the resin tray is transferred to the chip substrate loading mechanism in combination with the first lifting mechanism, so that the chip substrate and the resin can enter the press unit at the same time, thereby improving the transmission efficiency of the chip substrate and the resin, and eliminating the need to make way and wait, thereby further improving the chip substrate packaging efficiency.

[0031] Additional aspects and advantages of the present application will be partially given in the following description, which will become apparent from the following description, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A first stereoscopic view of the fully automatic semiconductor packaging equipment of the present invention;

[0033] Figure 2 A second stereoscopic view of the fully automatic semiconductor packaging equipment of the present invention;

[0034] Figure 3 It is a first schematic diagram of the structure of the first lifting mechanism of the present invention;

[0035] Figure 4 It is a second schematic diagram of the structure of the first lifting mechanism of the present invention;

[0036] Figure 5 A first stereoscopic view of the chip substrate storage mechanism of the present invention;

[0037] Figure 6 for Figure 5 Enlarged view of point A in the middle;

[0038] Figure 7 A second stereoscopic view of the chip substrate storage mechanism of the present invention;

[0039] Figure 8 for Figure 7 Enlarged view of point B in the middle;

[0040] Fig. 9 is a third stereoscopic view of the chip substrate storage mechanism of the present invention;

[0041] Fig.10 for Fig. 9 Enlarged view of point C in the middle;

[0042] Fig.11 It is a cross-sectional view of the transition layer transmission structure of the chip substrate storage mechanism of the present invention;

[0043] Fig.12 for Figure 5 A magnified image of 206;

[0044] Fig.13 It is a first stereoscopic view of the chip substrate transmission mechanism of the present invention;

[0045] Fig.14 It is a structural schematic diagram of the feeding port end of the feeding conveying mechanism of the present invention;

[0046] Fig.15 It is a first stereoscopic view of the feeding and conveying mechanism of the present invention;

[0047] Fig.16 for Fig.15 An enlarged view of the first side panel;

[0048] Fig.17 for Fig.16 Enlarged view of point D in the middle;

[0049] Fig.18 It is a second stereoscopic view of the feeding and conveying mechanism of the present invention;

[0050] Fig.19A first stereoscopic view of a first transport clamping jaw of a transport assembly of the present invention;

[0051] Fig. 20 A second stereoscopic view of the first transport clamp of the transport assembly of the present invention;

[0052] Fig.21 It is a structural schematic diagram of a first rocker of a first transport clamp of the present invention;

[0053] Fig. 22 It is a structural schematic diagram of the counting detection mechanism of the present invention;

[0054] Fig.23 A second stereoscopic view of the chip substrate transmission mechanism of the present invention;

[0055] Fig.24 It is a schematic diagram of the three-dimensional structure of the second handling assembly of the present invention;

[0056] Fig.25 It is a first stereoscopic view of the material unloading and conveying mechanism of the present invention;

[0057] Fig.26 It is a second stereoscopic view of the material unloading and conveying mechanism of the present invention;

[0058] Fig. 27 A three-dimensional diagram of the chip substrate loading mechanism of the present invention in a retracted state;

[0059] Fig.28 A first stereoscopic view of the chip substrate loading mechanism of the present invention in an extended state;

[0060] Fig.29 A second stereoscopic view of the chip substrate loading mechanism of the present invention in an extended state;

[0061] Fig.30 A top view of the chip substrate loading mechanism of the present invention;

[0062] Fig.31 for Fig.30 Sectional view at GG in the middle;

[0063] Fig.32 for Fig.30 Sectional view at EE;

[0064] Fig.33 for Fig.30 Cross-sectional view at FF;

[0065] Fig.34 An exploded view of a first substrate clamping assembly of a chip substrate loading mechanism of the present invention;

[0066] Fig.35A three-dimensional diagram of a second tray clamping assembly of the chip substrate loading mechanism of the present invention;

[0067] Fig.36 An exploded view of a second tray clamping assembly of the chip substrate loading mechanism of the present invention;

[0068] Fig.37 is a perspective view of the resin loading mechanism of the present invention;

[0069] Fig.38 is a top view of the resin loading mechanism of the present invention;

[0070] Fig.39 An exploded view of the resin loading mechanism of the present invention;

[0071] Fig.40 for Fig.39 A schematic diagram of the structure from another perspective;

[0072] Fig.41 for Fig.38 Cross-sectional view of middle HH;

[0073] Fig.42 A first stereogram of a resin providing mechanism of the present invention;

[0074] Fig.43 A three-dimensional diagram of a first conveying assembly and a second conveying assembly of the present invention;

[0075] Fig.44 is a first stereoscopic view of the cleaning assembly of the present invention;

[0076] Fig.45 is a second stereoscopic view of the cleaning assembly of the present invention;

[0077] Fig.46 is a cross-sectional view of a cleaning assembly of the present invention;

[0078] Fig.47 is a first stereoscopic view of the film sticking assembly of the present invention;

[0079] Fig.48 is a second stereoscopic view of the film sticking assembly of the present invention;

[0080] Fig.49 is a schematic diagram of the resin box and the resin transmission mechanism of the present invention;

[0081] Fig.50 It is a schematic diagram of the three-dimensional structure of the resin powder sprinkling component of the present invention;

[0082] Fig.51 A schematic diagram of the three-dimensional structure of the flip box of the resin powder sprinkling assembly of the present invention;

[0083] Fig.52A cross-sectional view of a flip box of a resin powder sprinkling assembly of the present invention;

[0084] Fig.53 A schematic diagram of the resin laying of the present invention;

[0085] Fig.54 It is a schematic diagram of the three-dimensional structure of the transfer station of the present invention;

[0086] Fig.55 is a first perspective view of a press unit of the present invention;

[0087] Fig.56 A top view of a press unit of the present invention;

[0088] Fig.57 for Fig.56 Sectional view at LL;

[0089] Fig.58 for Fig.57 Enlarged view of T in the middle;

[0090] Fig.59 for Fig.56 Sectional view at KK in the middle;

[0091] Fig.60 for Fig.56 Sectional view at NN in the middle;

[0092] Fig.61 It is a control flow chart of the adjustment component of the press unit of the present invention. DETAILED DESCRIPTION

[0093] The present application is further described in detail below in conjunction with specific drawings. In the description of this embodiment, unless otherwise specified, the terms "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the present application must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present application.

[0094] In one embodiment, Figure 1-4 As shown, a fully automatic semiconductor packaging equipment provided by the present invention mainly includes a support frame 100, on which a first mounting platform 101 and a second mounting platform 102 are arranged, the first mounting platform 101 and the second mounting platform 102 are arranged in staggered layers, and the first mounting platform 101 is located above the second mounting platform 102;

[0095] The chip substrate storage mechanism 200 includes at least one upper material layer 201, at least one transition layer 202 and at least one lower material layer 203. The upper material layer 201, the transition layer 202 and the lower material layer 203 are arranged in sequence from bottom to top. Figure 4As shown, multiple magazines 2010 can be placed in the upper material layer 201, the transition layer 202, and the lower material layer 203. The magazines 2010 can move relative to the upper material layer 201, the transition layer 202, and the lower material layer 203. Each magazine 2010 has the same structure and is provided with multiple interlayers. The interlayers are evenly spaced. The chip substrates are placed on the interlayers of the magazines 2010. Under the push of external force, the chip substrates can be separated from the interlayers or enter the interlayers for storage. In this embodiment, the upper material layer 201 is used to place the magazines 2010 filled with unpackaged chip substrates, the transition layer 202 is used to store empty magazines 2010, and the lower material layer 203 is used to store magazines 2010 with packaged chip substrates.

[0096] Furthermore, in order to facilitate the chip to basically enter the interlayer of the magazine 2010, a guide structure is provided at both ends of the interlayer, and the guide structure is a guide inclined surface or a curved surface or a combination of the two with an opening larger than the width of the interlayer. Figure 5 As shown, in order to make the magazine 2010 move in a specific direction, two adjustment baffles 2021 are provided on the upper material layer 201, the transition layer 202 and the lower material layer 203, and the magazine 2010 is movably provided between the two adjustment baffles 2021, and the distance between the adjustment baffles 2021 is adjustable so that the distance between the two adjustment baffles 2021 is adapted to magazines of different sizes, and the adjustment means of the adjustment baffle 2021 is the existing hole slot combined with the screw adjustment fixing method, which will not be described in detail here;

[0097] The chip substrate transmission mechanism 300, such as Figure 13-15 as well as Fig.18 As shown, it includes a loading conveying mechanism 301, a handling mechanism and a unloading conveying mechanism 304 arranged on the first mounting platform 101, the loading conveying mechanism 301 is arranged at the loading end of the loading layer 201, and is used for the transmission of unpackaged chip substrates, the unloading conveying mechanism 304 is arranged at the loading end of the unloading layer 203, and is used for the transmission of packaged chip substrates, and the handling mechanism is arranged between the loading conveying mechanism 301 and the unloading conveying mechanism 304, and is used for the transportation of unpackaged chip substrates;

[0098] The chip substrate loading mechanism 400 is movably disposed on the first mounting platform 101 and is used for transporting unpackaged chip substrates and packaged chip substrates. The chip substrate loading mechanism 400 can perform reciprocating linear movement on the first mounting platform 101. Specifically, in this embodiment, Figure 3 As shown, two parallel first transport rails 1015 are arranged on the first installation platform 101, and a first straight rack 1016 is arranged between the two parallel first transport rails 1015. The first straight rack 1016 is parallel to the first transport rail 1015. Figure 27-28As shown, a first transport motor 4011 is arranged on the chip substrate loading mechanism 400, and a first driving gear 40111 is arranged at the output end of the first transport motor 4011, and the first driving gear 40111 is meshed with the first straight rack 1016. At least two first transport sliders 4012 are arranged on the chip substrate loading mechanism 400, and the two first transport sliders 4012 are located on different first transport guide rails 1015. The chip substrate loading mechanism 400 is slidably arranged on the first installation platform 101 through the first transport sliders 4012, and the first driving gear 40111 is driven by the forward and reverse rotation of the first transport motor 4011. Combined with the first transport guide rail 1015 and the first transport slider 4012, the reciprocating linear movement of the chip substrate transport mechanism 400 on the first installation platform 102 is realized. Optionally, the transmission structure of the first driving gear 40111 and the first spur rack 1016 can also be replaced by a combination structure of synchronous wheels and synchronous belts, or a screw slider structure for transmission. It can be known that the driving structure and power type of the chip substrate loading mechanism 400 are not limited by the present invention, and the purpose is to drive the chip substrate loading mechanism 400 to perform reciprocating linear movement on the first mounting platform 101.

[0099] At least one set of press units 500 is located on one side of the chip substrate loading mechanism 400, such as Fig.54 The press unit 500 shown includes an upper mold 503 and a lower mold 502 that can move relatively, wherein a portion of the chip substrate loading mechanism 400 can enter between the upper mold 503 and the lower mold 502, to deliver the unpackaged chip substrate into the press unit 500 and to take out the packaged chip substrate from the press unit 500; in this embodiment, the press unit 500 is 4 groups, which are arranged side by side on one side of the first mounting platform 101 in sequence, and optionally, the press unit 500 is 2 groups or 3 groups. According to the current packaging speed and the handling speed of the chip substrate loading mechanism 400, 4 press units 500 maximize the packaging efficiency. In this embodiment, the upper mold 503 of the press unit 500 is fixed, and the lower mold 502 of the press unit 500 can be lifted and moved. Negative pressure mechanisms are provided on the upper mold 503 and the lower mold 502 of the press unit 500 to achieve the adsorption and fixation of the unpackaged chip substrate by the upper mold 503 and the adsorption and fixation of the film loaded with resin by the lower mold 502.

[0100] The resin providing mechanism 600 is disposed near the end of the moving track of the chip substrate loading mechanism 400. The chip substrate loading mechanism 400 reciprocates between the chip substrate storage mechanism 200 and the resin providing mechanism 600. Figure 3 and Fig.42As shown, the resin providing mechanism 600 includes a resin loading mechanism 800, a first lifting mechanism 700 and a resin tray 40344. The resin loading mechanism 800 is movably arranged on the second mounting platform 102 and can perform reciprocating linear movement on the second mounting platform 102. The resin loading mechanism 800 is mainly used for transporting the resin tray with resin laid on it and transporting the empty resin tray 40344 after packaging. The second mounting platform 102 is arranged below the first mounting platform 101, and a preset distance is provided between the two, so as to provide a moving space for the resin loading mechanism 800.

[0101] like Figure 3-4 As shown, the first lifting mechanism 700 is arranged on the support frame 100, and part of the resin loading mechanism 800 can be moved to the top of the first lifting mechanism 700, thereby driving the resin tray 40344 to move the resin tray 40344 to the first lifting mechanism 700, and through the lifting of the first lifting mechanism 700, the resin tray 40344 with resin is driven to move to the bottom of the chip substrate loading mechanism 400, and the chip substrate loading mechanism 400 grabs the resin tray 40344, and then can be moved to between the upper mold 503 and the lower mold 502 of the press unit 500 through the partial structure of the chip substrate loading mechanism 400, thereby completing the resin delivery. Specifically, as shown in Figure 3, the first lifting mechanism 700 mainly includes a first lifting platform 706, a first base 707, a first lifting motor 701, a first lifting screw rod 703, a first lifting nut, a first lifting guide rail 704, a first lifting slider 705 and a first fixed block 702. The first base 707 is fixedly set on the support frame 100, the first lifting motor 701 is set on the first base 107, the output end of the first lifting motor 701 is connected to the first lifting screw rod 703, driving the first lifting screw rod 703 to rotate forward and reverse, the first lifting nut is sleeved on the first lifting screw rod 703, the first lifting guide rail 704 is set on the first base 707, and the axial direction of the first lifting guide rail 704 is parallel to the axial direction of the first lifting screw rod 703, so that the first lifting platform 706 can perform a stable lifting action. The first lifting slider 705 is arranged on the first lifting guide rail 704, the first fixed block 702 connects the first lifting nut and the first lifting slider 705, the first lifting platform 706 is fixedly arranged on the first fixed block 706, and the lifting action of the first lifting nut is realized by the forward and reverse rotation of the first lifting screw 703, and a loading position of the resin tray 40344 is provided on the first lifting platform 706. Optionally, the transmission structure of the first lifting screw 703 and the first lifting nut can be replaced by a structure of a synchronous belt and a synchronous wheel, that is, the synchronous belt is fixedly connected to the first fixed block 702, and optionally, the transmission structure of the first lifting screw 703 and the first lifting nut can also be a telescopic structure of a cylinder, and the first lifting platform 706 is connected to the free end of the push rod of the cylinder.

[0102] By setting up the first lifting platform 706, a transfer transition is made for the resin tray 40344, so as to meet the layered transportation of the chip substrate loading mechanism 400 and the resin loading mechanism 800, so that the operation of the resin and the chip substrate does not interfere with each other, and the transportation efficiency of the chip substrate and the resin is improved. At the same time, the chip substrate loading mechanism 400 can be combined to put the unpackaged chip substrate and the digital tray covered with resin into the press unit 500 at the same time, without the need to transfer the resin and the chip substrate twice, saving time and improving the packaging efficiency. At the same time, the chip substrate loading mechanism 400 can also be used to remove the packaged chip substrate and the empty resin tray from the press unit 500 at the same time, further reducing the transmission time, so as to facilitate the storage of the chip substrate and the next use of the empty resin tray 40344;

[0103] A waste box 308 is provided near one side of the transport mechanism, such as Fig.12 As shown, it is located below the first mounting platform 101, and a switchable waste port 3081 is provided on the first mounting platform 101, and the position of the waste port 3081 corresponds to the position of the movement trajectory of the chip substrate loading mechanism 400. Specifically, in order to facilitate the compactness of the entire device, the waste port 3081 is provided between the two first transport guide rails 1015, and is located at the loading position of the chip substrate loading mechanism 400. When the chip substrate loading mechanism 400 drives the packaged chip substrate to be transported to the unloading conveying mechanism 304, the chip substrate loading mechanism 400 clamps the film waste to the top of the waste port 3081. At this time, the waste port 3081 is opened, and the film waste enters the waste box 308 through the waste port 3081, and then the waste port 3081 is closed. Specifically, as Fig. 22 As shown, a movable warehouse door 3.74 is arranged at the waste opening 3081, and the two sides of the warehouse door 3074 are slidably arranged on two parallel first slide rails 3075, and the two first slide rails 3075 are located on both sides of the waste opening 308. A first driving mechanism 3071 is arranged at the bottom of the first mounting platform 101. In this embodiment, a push rod cylinder is used for driving, and the free end of the push rod of the cylinder is connected to the warehouse door, and the extension and retraction direction of the push rod of the cylinder is parallel to the two parallel first slide rails 3075. The opening and closing of the waste opening 308 is realized by controlling the extension and retraction of the cylinder push rod.

[0104] In one embodiment, Figure 5 and Fig.10As shown, the material loading layer 201 is provided with a first translation assembly, and the first translation assembly is provided with a first translation push block 20151. The first translation push block 20151 can perform a relative reciprocating linear movement relative to the bottom plate of the material loading layer 201, so as to push the magazine 2010 carrying the unpackaged chip substrate, and push the magazine 2010 to the first support block 2055 of the first moving module. Specifically, the first translation assembly also includes a first translation motor 2011, a first translation driving pulley 2012, a first translation synchronous belt 2013, a first translation driven pulley 2014, a first translation slider 2015 and two first translation guide rods 2016. The first translation driving pulley 2012 is rotatably arranged on the output shaft of the first translation motor 2011, the first translation driven pulley 2014 is rotatably arranged on the bottom plate of the material loading layer 201, and the first translation synchronous belt 2013 is wound around On the first translation driving pulley 2012 and the first translation driven pulley 2014, the first translation slider 2015 is passed through the first translation guide rod 2016 and is fixedly connected to the first translation synchronous belt 2013, and a first yielding groove is arranged on the loading layer 201, so that the first translation push block 20151 is fixedly connected to the first translation slider 2015, the two first translation guide rods 2016 are arranged in parallel, and the first translation synchronous belt 2013 is parallel to the first translation guide rod 2016.

[0105] Optionally, the first translation guide rod 2016 can also be set as a guide rail structure, and the first translation slider 2015 is clamped on the guide rail; the transmission structure of the first translation driving pulley 2012, the first translation synchronous belt 2013 and the first translation driven pulley 2014 can also be a screw slider structure.

[0106] Furthermore, if Figure 5 and Figure 6 As shown, there is also a first moving module on one side of the loading layer 201, the first moving module is arranged on the first mounting platform 101, the first moving module includes a first X-axis module 204 and a first Z-axis module 205, a first X-axis slider 2044 for reciprocating movement is provided on the first X-axis module 204, the first Z-axis module 205 is arranged on the first X-axis slider 2044, and a first supporting block 2055 for reciprocating linear movement is provided on the first Z-axis module 205, wherein the moving direction of the first X-axis slider 2044 is consistent with the moving direction of the first translation push block 20151, that is, it is convenient for the first supporting block 20151 to support and take away the fully loaded magazine 2010 from the loading layer 201 or move the empty magazine 2010 to the loading layer 201, in this embodiment, since the first supporting block 2055 has a certain length in the horizontal direction, that is, Figure 8Therefore, a through second paving groove is provided on the upper material layer 201, the transition layer 202 and the lower material layer 203, which is adapted to the first support block 2055 so that the first support block 2055 can completely lift the magazine 2010; the moving direction of the first support block 2055 is consistent with the distribution direction of the upper material layer 201, the transition layer 202 and the lower material layer 203, that is, Figure 5 In the present embodiment, the first support block 2055 is composed of two L-shaped support arms.

[0107] Furthermore, in order to fix the magazine 2010 relative to the first support block 2055, a locking claw 2057 is further provided on the first support block 2055. The locking claw 2057 is lifted and lowered by a cylinder. When the first support block 2055 is lifted to the magazine 2010, the cylinder controls the locking claw 2057 to move so that the locking claw 2057 abuts against the upper surface of the magazine 2010, thereby fixing the magazine between the first support block 2055 and the locking claw 2027. It can be known that the structure of the locking claw 2057 and its corresponding driving structure are not limited by the present invention, as long as the magazine 2010 is fixed relative to the first support block 2055.

[0108] Specifically, Figure 6 As shown, the first X-axis module 204 also includes a first X-axis motor 2041, a first X-axis screw rod 2042, a first X-axis nut, two parallel first X-axis guide rails 2043 and two first X-axis sliders 2044. The first X-axis motor 2041 is arranged on the first mounting platform 101, and the first X-axis screw rod 2042 is rotatably arranged on the first mounting platform 101 through a bearing. The first X-axis screw rod 2042 is directly connected to the output shaft of the first X-axis motor 2041 through a coupling to achieve rotation. The first X-axis nut is matched with the first X-axis screw rod 2042, the first X-axis slider 2044 is connected to the first X-axis nut and the two first X-axis sliders 2044, and the first X-axis slider 2044 is set in an installation position. The bottom plate of the first Z-axis module 205 is arranged on the two first X-axis sliders 2044, thereby driving the first Z-axis module 205 to adjust close to or away from the loading layer 201.

[0109] Optionally, the transmission structure of the first X-axis screw rod 2042 and the first X-axis nut can be implemented by a synchronous belt and synchronous wheel structure or a push rod cylinder structure.

[0110] Furthermore, if Figure 7 and Figure 8As shown, the first Z-axis module 205 also includes a support 2056, a first Z-axis motor 2051, a first Z-axis screw rod 5052, a first Z-axis nut, a first Z-axis guide rail 2053, a first Z-axis slider 2054 and a first Z-axis connecting block. The first Z-axis motor 2051 is fixedly arranged on the support 2056, and the first Z-axis screw rod 2052 is rotatably arranged on the support 2056 through a bearing. One end of the first Z-axis screw rod 2052 is connected to the output end of the first Z-axis motor 2051, and the first Z-axis nut is sleeved on the first Z-axis screw rod 2054 through a threaded fit. 52, the first Z-axis guide rail 2053 is arranged on the support 2056 and is parallel to the axis of the first Z-axis screw rod 2052, and the first Z-axis slider 2054 is slidably arranged on the first Z-axis guide rail 2053, wherein the first Z-axis connecting block connects the first Z-axis nut and the first Z-axis slider 2054, and a mounting position is set on the first Z-axis connecting block for the installation of the first support block 2055. In this embodiment, the first Z-axis connecting block and the first support block 2055 are arranged integrally, that is, the first support block 2055 is directly connected to the first Z-axis nut and the first Z-axis slider 2054.

[0111] Optionally, the transmission structure of the first Z-axis screw rod 2052 and the first Z-axis nut can also be replaced by a synchronous wheel and synchronous belt structure, or a combination of gears and racks, or a push rod cylinder structure for lifting action.

[0112] In one embodiment, Figure 5 and Fig.12 As shown, it also includes a chip substrate pushing mechanism 206 arranged on the same side as the first movable module, which is fixedly arranged on the support frame 100, and a reciprocating pushing claw 2065 is arranged on the chip substrate pushing mechanism 206, and the direction of the pushing claw 2065 is consistent with the interlayer direction of the magazine 2010. In this embodiment, its moving direction is perpendicular to the moving direction of the first X-axis slider 2044 of the first X-axis module 204 and perpendicular to the moving direction of the first bracket 2055 of the first Z-axis module 205. Specifically, the chip substrate pushing mechanism 206 includes a first pushing base 2061 fixedly arranged on the support frame 100, a first pushing cylinder 2062 arranged on the first pushing base 2061, a second pushing base 2063 arranged at the free end of the first pushing cylinder 2062, and a second pushing cylinder 2064 arranged on the second pushing base 2063. The pushing claw 2065 is arranged at the free end of the second pushing cylinder 2064, and the pushing direction of the first pushing cylinder 2062 and the pushing direction of the second pushing cylinder 2064 are consistent with the moving direction of the pushing claw, wherein the width of the pushing claw 2065 is smaller than the width of the magazine 2010, and the thickness of the pushing claw 2065 is slightly larger than the thickness of the chip substrate, so that the pushing claw 2065 can only push one chip substrate to move at a time.

[0113] In one embodiment, the second movable module 207 is also included on the other side of the chip storage mechanism 200. The second movable module 207 is mainly used for lifting and lowering the empty magazine 2010 and lifting and adjusting the magazine 2010 fully loaded with chip substrates. The second movable module 207 has the same structural principle as the first movable module. The specific structure is as mentioned above and will not be described in detail here. The working process of the second movable module 207 is to lift the empty magazine 2010 of the transition layer 202 and correspond to the position of the unloading conveying port 3048 of the unloading conveying mechanism 304. When the magazine 2010 is full of packaged chip substrates, the fully loaded magazine 2010 is lifted and moved to the unloading layer 203, and then descended to the transition layer 202 to take out the empty magazine 2010 and load the next round of packaged chip substrates.

[0114] In one embodiment, Figure 9-11 As shown, a second translation assembly is provided on the transition layer 202, and a third translation assembly is provided on the lower material layer 203. The second translation assembly includes a second translation motor 2021 arranged on the bottom plate of the transition layer 202, a plurality of second translation active synchronous pulleys 2022 arranged at the output end of the second translation motor 2021, a plurality of second translation synchronous belts 2023 of matching number, and a plurality of second translation driven synchronous pulleys 2024 of matching number arranged on the bottom plate of the transition layer 202. The plurality of second translation synchronous belts are wound around the corresponding second translation active synchronous pulleys 2022 and the corresponding second translation driven synchronous pulleys 2024, so that the plurality of second translation synchronous belts 2023 are arranged in parallel. Specifically, in this embodiment, there are three second translation synchronous belts 2023, three second translation active synchronous pulleys 2022, and six second translation driven synchronous pulleys 2024, two in each set, which are respectively arranged at both ends of the bottom plate of the transition layer 202, and each second translation synchronous belt 2023 is wound around two second translation driven synchronous pulleys 2024 and one second translation active synchronous pulley 2022. It should be particularly pointed out that the second translation synchronous belt 2023 of the second translation assembly and the third translation synchronous belt 2033 of the third translation assembly rotate in opposite directions, such as Fig.10 In the direction shown, the second translation synchronous belt 2023 rotates counterclockwise, and the third translation synchronous belt 2033 rotates clockwise. The magazine 2010 is placed on the second translation synchronous belt 2023 or the third translation synchronous belt 2033 and moves through the second translation synchronous belt 2023 or the third translation synchronous belt 2033.

[0115] In one embodiment, Figure 14-17As shown, the loading and conveying mechanism 301 includes a first conveying track, a scanning mechanism 3019 and a first traction mechanism. The spacing of the first conveying track can be adjusted. It includes a first side plate 3015 and a second side plate 3016. A horizontal first conveying groove 30161 is provided on the first side plate 3015 and the second side plate 3016. The scanning mechanism 3019 is arranged above the loading end of the first conveying track to scan the chip substrate to extract the two-dimensional code information or barcode information on the chip substrate. The chip substrate that meets the process card will be continued to the next process. The unqualified products will be returned to the loading magazine 2010 by the first traction clamp, and the direction of the chip substrate will be read at the same time. After the identification is completed, the first traction clamp is arranged between the first side plate 3015 and the second side plate 3016, and the scanned chip substrate is clamped by the first traction clamp and moved to a preset position along the first conveying groove 30161. In this embodiment, Fig.15 and Fig.18 As shown, the first traction mechanism includes a first traction motor 3017, a first traction screw, a first traction nut, a first traction slider 3018 and a first traction bracket 3011. The first traction screw is rotatably arranged on the first mounting platform 101 through a bearing. The output end of the first traction motor 3017 is connected to one end of the first traction screw. The first traction nut is sleeved on the first traction screw through threaded matching. The first traction slider 3018 is connected to the first traction nut and is clamped with the limiting guide rail. The installation direction of the limiting guide rail is consistent with the axis direction of the first traction screw and is parallel to each other. One end of the first traction bracket 3011 is fixedly arranged on the first traction slider 3 018, the first traction clamp is arranged at the other end of the first traction bracket 3011, the axial direction of the first traction screw rod is consistent with the direction of the first conveying groove 30161, the first traction clamp includes a fixed first traction fixed claw 3014 and a first traction movable claw 3013, the first traction movable claw 3013 is telescopically controlled by the first clamp cylinder 3012, the upper end surface of the first traction fixed claw 3014 is coplanar with the lower end surface of the first conveying groove 30161, and the free end of the first clamp cylinder 3012 drives the first traction movable claw 3013 to move and control the distance between it and the first traction fixed claw 3014, thereby realizing the clamping and dragging of the chip substrate.

[0116] Specifically, refer to Fig.15 and Fig.18The first side plate 3015 is fixedly arranged on the first mounting platform 101, and the second side plate 3016 is arranged parallel to the first side plate 3015. At least two first adjustment shafts 30151 are arranged between the first side plate 3015 and the second side plate 3016. One end of the first adjustment shaft 30151 is fixed on the first side plate 3015. A first adjustment guide sleeve 30162 is sleeved on the first adjustment shaft 30151. The first adjustment guide sleeve 30162 is fixedly connected to the second side plate 3016. The first adjustment shaft 30151 is arranged horizontally, so that the second side plate 3016 can be horizontally moved on the first adjustment shaft 30151 through the first adjustment guide sleeve 30162, thereby adjusting the distance between the first side plate 3015 and the second side plate 3016 to adapt to the chip substrate of the same width. Furthermore, a first adjusting screw rod 30156 is provided between the two first adjusting shafts 3015, and a first adjusting nut 30153 is provided on the first adjusting screw rod 30156. The first adjusting nut 30153 is fixedly connected to the second side plate 3016, and the axis of the first adjusting screw rod 30156 is parallel to the axis of the first adjusting shaft 30151. The first adjusting screw rod 30156 is rotatably arranged on the first mounting platform 101 through a bearing. One end of the first adjusting screw rod 30156 close to the first side plate 3015 is connected to a first spacing adjustment motor 30152. The first spacing adjustment motor 30152 drives the first adjusting screw rod 30156 to rotate forward and reverse, thereby realizing automatic adjustment of the spacing between the first side plate 3015 and the second side plate 3016.

[0117] Optionally, the adjustment mechanism of the first adjustment shaft 30151 and the first adjustment guide sleeve 30162 can also be replaced by a slider guide rail structure, for example, the slider is set on the second side plate 3016, and the guide rail is set on the first mounting platform 101, so as to realize the horizontal sliding guide setting of the second side plate 3016.

[0118] Furthermore, a first clearance gap 30154 is provided on the first side plate 3015 and the second side plate 3016. The first clearance gap 30154 extends to and is connected to the first conveying groove 30161. The length of the first clearance gap 30154 is not less than the length of the chip substrate, and is mainly used for moving the chip substrate away from the first conveying groove 30161. A first pressing plate 30153 is arranged at the first clearance gap 30154, and the length of the first pressing plate 30153 matches the length of the first clearance gap 30154. A second substrate clamping clearance groove 301531 is arranged on the first pressing plate, corresponding to the position of the first substrate clamping clearance groove 30155. The first pressing plate 30153 is rotatably arranged on the first side plate 3015 and the second side plate 3016 by a flip shaft. When the first pressing plate 30153 is in a pressed state, the first pressing plate 30153 and the lower end surface of the first conveying groove 30161 form the first conveying groove 30161, thereby preventing the chip substrate from warping during the traction process. When the first pressing plate 30153 is opened, the first conveying assembly 302 can clamp the chip substrate through the first clearance gap 30154. In this embodiment, the flipping of the first pressure plate 30153 is controlled by the flipping push rod cylinder 30163, the free end of the flipping push rod cylinder 30163 is connected to the first pressure plate 30153, and the pressing and opening of the first pressure plate 30153 are controlled by the extension and retraction of the free end of the flipping push rod cylinder 30163.

[0119] In one embodiment, Fig.12 , Fig.18 , Fig. 22 as well as Fig.23 As shown, the transport mechanism includes a first transport component 302, a second transport component 303 and a preset platform 305. The first transport component 302 is arranged close to one side of the loading conveying mechanism 301, and is used to transport the chip substrate on the first conveying slot 30161 for chip quantity detection and chip volume measurement. After the detection is completed, the chip substrate is placed on the preset platform 305 to wait for the second transport mechanism 303 to transport it. The second transport component 303 is arranged close to the unloading conveying mechanism 304, and is used to transport the chip substrate after detection on the preset platform 305 to the chip substrate loading mechanism 400. The preset platform 305 is placed between the two for temporary placement of the chip substrate after detection.

[0120] Specifically, Fig.18As shown, the first transport assembly 302 includes a first transport swing arm 3021, a second transport swing arm 3022 and a first transport clamp 3023, the fixed end of the first transport swing arm 3021 is rotatably arranged on the first mounting platform 101, the fixed end of the first transport swing arm 3021 is rotatably arranged at the free end of the first transport swing arm 3021, and the first transport clamp 3023 is rotatably arranged at the free end of the second transport swing arm 3022. In this embodiment, the swing of the first transport swing arm 3021 and the swing of the second transport swing arm 3022 are both realized by rotating the output shaft of the motor, and similarly, the first transport clamp 3023 is also realized by rotating the output shaft of the motor. In this embodiment, the first transport swing arm 3021 and the second transport swing arm 3022 both make a plane swing, and the plane where the swinging tracks of the two are located is parallel to the first mounting platform 101.

[0121] Specifically, Figure 19-20 As shown, the first transport clamp 3023 includes a transport base plate 30231, two first rotating shafts 30233, a plurality of first claws 30236 spaced apart on the first rotating shaft 30235, two first connecting rods 30234, a first rocker 30233 and a first driving member 30232. The transport base plate 30231 is rotatably arranged relative to the second transport swing arm 3022. The two first rotating shafts 30235 are rotatably arranged on the transport base plate 30231 through a hole-shaft structure and are symmetrically arranged relative to the transport base plate 30231. The first connecting rods 30234 are arranged on the two first rotating shafts 30235. The first rotating shaft 30235 is movably connected through the two first connecting rods 30234, that is, the connection points of the two first connecting rods 30234 can move relative to each other. At the same time, when the first claw 30236 is tightened or opened, a preset angle is provided between the two first connecting rods 30234. In order to make the two first connecting rods swing, at least one of the first connecting rods 30234 is provided with a first U-shaped groove 302332 to compensate for the relative movement at the connection points of the two first connecting rods 30234, so that the two first connecting rods 30234 can rotate around their corresponding first rotating shafts 30235 to avoid rotation interference. One end of the first rocker 30233 is connected to one of the first rotating shafts 30235, and the free end of the first driving member is movably connected to the other end of the first rocker 30233. In this embodiment, the first driving member is preferably a cylinder. Since the cylinder is more sensitive, the free end of the cylinder push rod is movably connected to the other end of the first rocker 30233, that is, a second U-shaped groove 302331 is set on the first rocker 30233, and the first rocker 30233 is driven to swing by the extension and contraction of the cylinder push rod, thereby realizing the rotation of the first rotating shaft 30235 and driving the first claw 30236 to open and close. Correspondingly, as Figure 16-17As shown, a plurality of first substrate clamping and yielding grooves 30155 are provided at the first yielding notches of the first side plate and the second side plate, and the number and position of the first substrate clamping and yielding grooves 30155 correspond to the number and position of the plurality of first claws 30236, so that the plurality of first claws 30236 can enter the position below the chip substrate to lift the chip substrate.

[0122] Furthermore, a first limiting plate 30237 is provided under the conveying substrate 30231. The size of the first limiting plate 30237 matches the length and width of the chip substrate. When the chip substrate is clamped by the first claw 30236, the first claw 30236 is limited so that the chip substrate is only subjected to the lifting force of the first claw 30236, thereby preventing the chip substrate from being clamped and damaged during transportation.

[0123] In this embodiment, Fig.21 As shown, the first rocker arm 30233 and one of the first connecting rods 30234 are integrally arranged.

[0124] Furthermore, the second conveying assembly 303 includes an X-axis conveying module 3031 provided with a first conveying slider, a Y-axis conveying module 3032 provided with a second conveying slider 30323, a Z-axis conveying module 3033 and a second conveying clamp 30340, the Y-axis conveying module 3032 is fixedly arranged on the first mounting platform 101, the X-axis conveying module 3031 is arranged on the second conveying slider 30323 of the Y-axis conveying module 3032, the Z-axis conveying module 3033 is arranged on the first conveying slider 30314 of the X-axis conveying module 3031, and the second conveying clamp 30340 is arranged on the Z-axis conveying module 3033.

[0125] Specifically, Fig.24As shown, the Y-axis transport module 3032 includes two first crossbeam brackets 30322 arranged in parallel and at intervals, and the upper end of the crossbeam bracket 30322 is provided with a first spacing from the first mounting platform 101, so that the second transport clamp 30340 can be lifted and set on the Z-axis transport module 3033, and a second transport slider 30323 that can move back and forth is provided on the crossbeam bracket 30322. In this embodiment, there are two second transport sliders 30323, which are driven by two second transport motors 30321 in forward and reverse directions. The two second transport sliders 30323 realize reciprocating movement through a screw nut structure of the same structure. The X-axis transport module 303 A second crossbeam support 30314 is provided, and both ends of the second crossbeam support 30314 are respectively fixedly connected to two second transport sliders 30323. The second crossbeam support 30314 is vertically arranged relative to the first crossbeam support 30322. In this embodiment, only one second transport motor 30321 can be used to drive one set of screw nut structures to drive the reciprocating movement of the second transport slider 30323. The other second transport slider 30323 is connected through a guide rail slider structure or a guide sleeve guide shaft structure, and the X-axis transport module 3031 can also realize the reciprocating movement of the first crossbeam support 30322 of the Y-axis transport module 3032.

[0126] Furthermore, the driving structure of the X-axis transport module 3031 is the same as the structure on the single first beam support 30322 of the Y-axis transport module 3032, and no further details are given here. To ensure the stability of the Z-axis transport module 3033, a second guide rail 30312 and a second slider 30313 are provided on the second beam support 30314 of the X-axis transport module 3031. The second slider 30313 is slidably provided on the second guide rail 30312. The axial direction of the second guide rail 30312 is parallel to the moving direction of the first transport slider. A second connecting plate 30314 is provided between the second slider 30313 and the first transport slider for connection. The Z-axis transport module is provided on the second connecting plate 30314, so that the Z-axis transport module 3033 is more stable when moving.

[0127] The Z-axis transport module 3033 includes a Z-axis substrate 30334, a Z-axis first slide 30336 that is raised and lowered relative to the Z-axis substrate 30334, a Z-axis second slide 30338 that is raised and lowered relative to the Z-axis first slide 30336, and a second transport clamp 30340 is arranged on the Z-axis second slide 30338. In this example, the lifting and lowering movement direction is the movement direction of the first transport slider of the X-axis transport module 3031 and the movement direction of the second transport slider 30323 of the Y-axis transport module 3032 that are both perpendicular to each other.

[0128] Specifically, Fig.24As shown, a second lifting motor 30331, a second lifting screw rod 30332, a second lifting nut 30333, a second lifting guide rail 30335 and a second lifting slider are arranged on the Z-axis substrate 30334. The second lifting screw rod 30332 is arranged vertically, the second lifting guide rail 30335 is arranged parallel to the second lifting screw rod 23033, the second lifting slider is slidably arranged on the second lifting guide rail 30335, the output end of the second lifting motor 30331 is connected to one end of the second lifting screw rod 30332, the second lifting screw rod 30332 is rotatably arranged on the Z-axis substrate 30334 through a bearing, the second lifting nut 30333 is threadedly arranged on the second lifting screw rod 30332, the Z-axis first slide plate 30336 is connected to the first lifting slider and fixedly connected to the first lifting nut 30333, and the first lifting nut 30333 moves relative to the first lifting screw rod 30332 to drive the Z-axis first slide plate 30334 to be lifted and lowered.

[0129] Furthermore, if Fig.24As shown, a third lifting guide rail 30337 is provided on the first Z-axis slide 30334, and a third lifting slider is provided on the third lifting guide rail 30337, wherein the axial direction of the third lifting guide rail 30337 is parallel to the axial direction of the second lifting guide rail 30335, and a Z-axis second slide 30338 is provided on the third upper lifting slider, and the second carrying clamp 30340 is arranged on the Z-axis second slide 30338. In order to reduce the driving device, two third lifting synchronous wheels are set on the first Z-axis skateboard 30334, and the positions of the two third lifting synchronous wheels correspond to the two end positions of the third lifting guide rail 30337. The third lifting synchronous belt 303362 is wound between the two third lifting synchronous wheels. The third lifting synchronous belt 303362 is parallel to the first Z-axis skateboard 30334 and parallel to the axis of the third lifting guide rail 30337. The second Z-axis skateboard 30338 is fixedly connected to the third lifting synchronous belt 303362 on the side close to the first Z-axis skateboard 30336 through the second connecting block 303381. The Z-axis substrate 30334 is fixedly provided with a first connecting block 303341 and is fixedly connected to the third lifting synchronous belt 303362 on the side away from the first Z-axis skateboard 30336. The specific process is as follows: when the second lifting nut 30333 descends along the second lifting screw rod 30332, the first Z-axis slide plate 30336 is driven to move downward. Since the third lifting synchronous belt 303362 is fixedly connected to the Z-axis substrate 30334 through the first connecting block 303341, the distance between the third lifting synchronous wheel located at the upper end of the first Z-axis slide plate 30336 and the first connecting block 303341 is reduced, and the distance between the second connecting block 303381 located on the second Z-axis slide plate 30336 and the first connecting block 303341 is increased, that is, the second Z-axis slide plate 30338 descends along the third lifting guide rail 30337, thereby causing the second carrying clamp 30340 to descend to grab the chip substrate. Conversely, the second lifting nut 30333 rises along the second lifting screw rod 30332, driving the first Z-axis slide plate 30336 and the second Z-axis slide plate 30338 to rise, and lifting the second carrying clamp 30340.

[0130] In order to avoid the problem that the lifting stroke of the second handling clamp 30340 is insufficient, as Fig.24 As shown, a third lifting cylinder 30339 is also provided on the second slide plate 30336 of the Z axis, and the extension and retraction direction of the free end of the third lifting cylinder 30339 is consistent with the moving direction of the second slide plate 30338 of the Z axis, and the second carrying clamp 30340 is arranged at the free end of the third lifting cylinder 30339.

[0131] In this embodiment, two substrate mounting positions are provided on the pre-setting platform 305, and corresponding third clearance grooves 3051 are provided on the substrate mounting positions, and the third clearance grooves 3051 correspond to the first claws on the first transport clamp 3023 and the second transport clamp 30340. Correspondingly, there are also two third lifting cylinders 30339 and second transport clamps 30340. At the same time, the structure of the second transport clamp 30340 is the same as that of the first transport clamp 3023, as mentioned above, and no further details are given here.

[0132] In one embodiment, it also includes a counting detection mechanism disposed on the first mounting platform 101. The counting detection mechanism 306 includes a measuring instrument 3064. The measuring instrument 3064 can make reciprocating linear movements relative to the first mounting platform 101. The measuring instrument 3064 is mainly used to detect the number of chips and the chip volume on the chip substrate, thereby feeding back the measured data to the resin providing mechanism 600, so that the resin providing mechanism 600 can release and lay a quantitative amount of resin.

[0133] Specifically, Fig. 22 As shown, the counting detection mechanism 306 is arranged below the first mounting platform 101, and a detection slot 1011 is arranged on the first mounting platform 101, and the detection slot 1011 is larger than the size of the chip substrate so that the chip substrate is completely exposed. The counting detection mechanism 306 also includes a first detection motor 3061, a first detection screw rod arranged at the output end of the first detection motor 3061, the first detection screw rod is located on one side of the detection slot 1011, a first detection nut 3062 arranged on the first detection screw rod, a first detection guide rail 3065 arranged on the other side of the detection slot 1011, a first detection slider 3066 arranged on the first detection guide rail 3065, the axis of the first detection guide rail 3065 is parallel to the axis of the first detection screw rod, a first detection bracket 3063 corresponding to the position of the detection slot 1011, and a measuring The instrument 3064 is arranged on the first detection bracket 3063, one end of the first detection bracket 3063 is connected to the first detection slider 3066, and the other end of the first detection bracket 3063 is connected to the first detection nut 3062. The first detection motor 3061 drives the first detection nut 3062 to make reciprocating linear movements through forward and reverse rotation, thereby driving the first detection bracket 3063 and the measuring instrument 3064 arranged on the first detection bracket 3063 to make reciprocating linear movements along the length direction of the detection slot 1011, thereby completing the detection of the number of chips on the chip substrate and the measurement of the chip volume.

[0134] In one embodiment, Fig.25 , Fig.26As shown, the unloading conveying mechanism has the same principle as the loading conveying mechanism, and the unloading conveying mechanism is mainly used to transfer the packaged chip substrate to the magazine 2010. Compared with the loading conveying mechanism, the first unloading push block 30433 of the unloading conveying mechanism 304 can be lifted and moved, and a thickness sensing component is also provided on the unloading conveying mechanism 304 to detect the thickness of the packaged chip substrate.

[0135] Specifically, a material unloading transmission mechanism 304 is provided with a material unloading pushing assembly, which includes a first material unloading motor 3041, a first material unloading active pulley 3042, a first material unloading synchronous belt 30421, a first material unloading driven pulley, a first material unloading guide rail 3043, a first material unloading slider 30431, a first material unloading cylinder 30432, and a first material unloading pushing block 30433. The first material unloading motor 3041 is fixedly arranged on a side plate of the material unloading transmission mechanism 304, the first material unloading active pulley 3042 is arranged on the output shaft of the first material unloading motor 3041, the first material unloading driven pulley is rotatably arranged on the aforementioned side plate, the first material unloading synchronous belt 30421 is wound around the first material unloading active pulley 3042 and the first material unloading driven pulley, and the first material unloading slider 30431 is arranged on the first On a feeding guide rail 3043, the first feeding guide rail 3043 is arranged on the aforementioned side plate, the first feeding guide rail 3043 is arranged parallel to the first feeding synchronous belt 30421, the first feeding slider 30431 is connected to the first feeding synchronous belt 30421, the first feeding cylinder 30432 is fixedly arranged on the first feeding slider 30431, the first feeding push block 30433 is arranged at the free end of the first feeding cylinder 30432, the width of the first feeding push block 30433 is smaller than the width of the magazine 2010, and its thickness is slightly larger than the thickness of the chip substrate, so that only one chip substrate can be pushed at a time, and the first feeding cylinder 30432 is lifted and lowered, which can drive the first feeding push block 30433 to lift and move to make way for the packaged chip substrate.

[0136] Optionally, the transmission components of the first material unloading active pulley 3042, the first material unloading synchronous belt 30421 and the first material unloading driven pulley can be replaced by a screw slider assembly, or a push rod cylinder can be used to directly push the first material unloading push block.

[0137] Furthermore, the thickness sensing assembly includes a second detection bracket 30471 and a thickness sensor 30472. The thickness sensor 30472 is fixedly arranged on the second detection bracket 30471. The second detection bracket 30471 enables the thickness sensor 30472 to be located directly above the track of the unloading conveying mechanism 304, so as to facilitate the detection of the chip substrate on the track of the unloading conveying mechanism 304. The transmission mode of the thickness sensing assembly is the same as the structural principle of the unloading pushing assembly, which will not be described in detail here, thereby driving the second detection bracket 30471 and the thickness sensor 30472 to move linearly to fully detect the thickness of the packaged chip substrate.

[0138] In one embodiment, Fig. 27 , Fig.28 as well as Fig.29 As shown, the chip substrate loading mechanism 400 includes a first base 401 that can make reciprocating linear movements along a first mounting platform, a first movable layer that moves relative to the first base 401, and a second movable layer that moves relative to the first movable layer, wherein the moving direction of the first base 401 is perpendicular to the moving direction of the first movable layer, and the moving direction of the second movable layer is parallel to the moving direction of the first movable layer, so that the second movable layer can extend between the upper mold 503 and the lower mold 502 of the press unit 500.

[0139] Specifically, Fig. 27 As shown, the chip substrate loading mechanism 400 includes a structure that can move back and forth linearly along the first mounting platform 101 as described above, a first transport motor 4011 is disposed on the first base, and a first transport slider 4012 is fixedly connected to the first base 401. The specific situation will not be described in detail here;

[0140] The first moving layer includes a first moving substrate 402 and two first moving side plates 4024, the two first moving side plates 4024 are arranged in parallel and opposite to each other, and are both arranged vertically on the first translation substrate 402, two parallel first substrate translation guide rails 4015 are arranged on the first base 401, a first substrate translation slider 40151 is arranged on the first substrate translation guide rails 4015, the first moving substrate 402 of the first moving layer is arranged on the first substrate translation slider 40151, and a first substrate translation motor 4013 is also arranged on the first base 401, which rotates the first substrate translation motor 4013 arranged on the first base 401 through a bearing. A substrate translation screw 4014, and a first substrate translation nut 40141 arranged on the first substrate translation screw 4014, the first substrate translation nut 40141 is connected to the first moving layer 402, and the axial direction of the first substrate translation screw 4014 is consistent with the axial direction of the first substrate translation guide rail 4015, the output end of the first substrate translation motor 4013 and the first substrate translation screw 4014 are transmission connected, in this embodiment, the power connection is achieved through a synchronous wheel and a synchronous belt, optionally, it can also be directly connected through a coupling; or the power connection is achieved by gear meshing.

[0141] Second substrate translation guide rails 4023 parallel to each other are arranged on the two first movable side plates 4024, a second substrate translation slider 40231 is arranged on the second substrate translation guide rails 4023, the second movable substrate 403 is fixedly connected to the second substrate translation slider 40231, a second substrate translation motor 4021 is arranged on the first movable substrate 402, a first movable rotating shaft 4022 rotating through a bearing is arranged on the two first movable side plates 4024, a first translation synchronous belt pulley 40221 is arranged on the first movable rotating shaft 4022, and a first movable rotating shaft 4022 is provided with a first movable synchronous belt pulley 40221. 4, a second translation synchronous belt 40223 is arranged on the second substrate translation guide rail 4023, the first translation synchronous belt 40222 is arranged parallel to the second substrate translation guide rail 4023, the first translation synchronous belt 40222 is wound around the first translation synchronous belt 40221 and the second translation synchronous belt 40223, a second fixing clamp 40224 is arranged on the second mobile substrate 402, the second fixing clamp 40224 is fixedly connected to the first translation synchronous belt 40222, the second substrate translation motor 4021 is driven by the synchronous belt and synchronous belt pulley assembly, and the first transmission shaft 4022 is driven to rotate. In this embodiment, in order to facilitate the second mobile layer to react more quickly and without power jam, the second fixing clamp 40224, the first translation synchronous belt 40222, the first translation synchronous belt pulley 40221, and the second translation synchronous belt pulley 40223 are symmetrically arranged about the radial plane where the middle of the first mobile shaft 4022 is located.

[0142] Optionally, the second substrate translation motor 4021 and the first movable shaft 4022 may be connected to each other by gear meshing, or the output shaft of the second substrate translation motor 4021 may be directly connected to the first movable shaft 4022 via a coupling.

[0143] Furthermore, the second movable layer includes a first suction cup assembly 4031 and a first substrate clamping assembly 4032 which are arranged above the second movable layer and can be lifted and lowered. The first suction cup assembly 4031 is arranged close to the press unit 500, and the first substrate clamping assembly 4032 is arranged away from the press unit 500.

[0144] Specifically, Figure 30-31 As shown, the first suction cup assembly 4031 includes a first lifting base 40313, four first guide shafts 4035 are arranged on the first lifting base 40313, and four matching first guide sleeves are arranged on the second movable substrate. The first guide shaft 4035 is movably inserted into the first guide sleeve. At the same time, a first main lifting cylinder 40314 is arranged on the second movable substrate 402, and the fixed end of the first main lifting cylinder 40314 is fixed on the second movable substrate 403, and the free end of the first main lifting cylinder 40314 is fixed under the first lifting base 40313 to drive the first lifting base 40313 to rise and fall. The first suction cup assembly 4031 also includes a plurality of first suction cups 40312 distributed at intervals, and the first suction cup 40312 is connected to the negative pressure mechanism, so as to grab and adsorb and fix the plastic-sealed finished chip substrate. Further, the first suction cup assembly 4031 also includes a first adsorption support 40311, and a plurality of first suction cups 40312 are arranged on the first adsorption support 40311, as shown in FIG. Fig.32 As shown, the first adsorption support 40311 can be lifted and moved relative to the first lifting base 40313. Specifically, the first adsorption support 40311 is connected to two first secondary guide shafts 403152 and a first secondary guide sleeve 403151 disposed on the first lifting base 40313. The first secondary guide shaft 403152 is movably disposed on the first secondary guide sleeve 403151. A first secondary lifting cylinder 40315 is disposed between the first adsorption support 40311 and the first lifting base 40313. The first secondary lifting cylinder 40315 is fixed on the first lifting base 40313, and the free end of the first secondary lifting cylinder 40315 is connected to the first adsorption support 40311. In this embodiment, the first suction cup assembly 4031 is divided into two groups, both of which are disposed on the first lifting base 40313, so that two packaged chip substrates can be sucked at the same time.

[0145] like Fig. 27 , Fig.33As shown, the first substrate clamping assembly 4032 includes a second lifting base 40322, a first substrate clamping claw 40321 arranged on the second lifting base 40322, four guide sleeves are arranged on the second movable base 403, four matching second guide shafts 4036 are arranged on the second lifting base 40322, and a second main lifting cylinder 40324 is arranged on the second movable base 403. The free end of the second main lifting cylinder 40324 is connected to the second lifting base 40322 to drive the second lifting base 40322 to move up and down. Furthermore, a second sub-lifting cylinder 40325 is arranged on the second lifting base 40322, and the free end of the second sub-lifting cylinder 40325 is connected to the first substrate clamp 40321. At the same time, in order to further stabilize the structure, a second sub-guide sleeve 403251 is arranged on the second lifting base 40322, and a second sub-guide shaft 403252 is arranged in the second sub-guide sleeve 403251, and one end of the second sub-guide shaft 403252 is connected to the first substrate clamp 40321. The first substrate clamp 40321 has the same structural principle as the first transport clamp 3023, as mentioned above, and will not be elaborated on here. In the present application, the first substrate clamp 40321 is divided into two groups, which can grasp two chip substrates at the same time. In order to reduce the driving device, a power connecting rod is arranged between the two first rocking arms 30233 of the two first substrate clamps 40321, and the power connecting rod is connected to the free end of the cylinder to synchronize the opening and closing of the two first substrate clamps 40321. Optionally, the first transport clamp 3023 can also be driven by an independent driving cylinder.

[0146] like Fig.31 , Fig.34 As shown, a second tray clamping assembly 4034 and a second suction cup assembly 4033 are provided below the second movable substrate 403. The second suction cup assembly 4033 is arranged close to one side of the press unit 500, and the second tray clamping assembly 4034 is arranged away from the one side of the press unit 500. In this embodiment, the second suction cup assembly 4033 corresponds to the position of the first suction cup assembly 4031, and the second tray clamping assembly 4034 corresponds to the position of the first substrate clamping assembly 4032, that is, when the first suction cup 40312 can adsorb and fix the finished chip substrate, the second suction cup 40331 can adsorb the waste film without horizontal movement, and when the first substrate clamping claw 40321 can transport the unpackaged chip substrate to the upper mold 503 of the press unit 500 by lifting, at this time, the second tray clamping assembly 4034 can place the resin tray 40344 carrying the resin and the film into the lower mold 502 of the press unit 500 for resin delivery.

[0147] Specifically, the second suction cup assembly 4033 includes a plurality of second suction cups 40331. The structure distribution and principle of the plurality of second suction cups 40331 are the same as those of the first suction cup 40312, as mentioned above, and will not be described in detail here.

[0148] like Fig.36 As shown, the second tray clamping assembly 4034 includes a second clamping base, the second clamping base includes a second upper base 40341 ​​and a second lower base 40342 fixedly connected to each other from top to bottom, a preset distance is set between the second upper base 40341 ​​and the second lower base 40342, the second upper base 40341 ​​is fixedly connected to the second movable base 403, and the second tray clamping assembly 4034 also includes a second main clamping mechanism and a second auxiliary clamping mechanism, and its specific mechanism is as follows;

[0149] like Fig.36 As shown, the second main clamping mechanism includes four second main clamping jaws 403424, two second main clamping connecting rods 403423 arranged in parallel with each other, a main clamping cylinder 403433 with two opening and closing free ends, and the two free ends can move away from or towards each other at the same time to realize the opening and closing of the second main clamping jaws 303424; two main clamping push rods 403422, wherein the four second main clamping jaws 403424 are divided into two groups, each group is fixedly arranged at the two ends of the second main clamping connecting rod 403423, and the second main clamping jaws 403424 are connected to the resin The main clamping cylinder 403433 is fixed on the second lower base 40342, and the two main clamping push rods 403422 are respectively fixed on the two opening and closing free ends of the main clamping cylinder 403433. The two free ends of the main clamping cylinder 403433 move toward or away from each other, driving the four second main clamping jaws 403424 to open and close, thereby grabbing or putting down the resin tray 40344. In this embodiment, the second main clamping jaw 403424 is an L-shaped hook.

[0150] Furthermore, four second main guide rails 403426 are arranged on the second lower base 40342, and four corresponding second main sliders 403425 are arranged on the four second main guide rails 403426. The axial direction of the second main guide rails 403426 is consistent with the opening and closing direction of the free end of the main clamping cylinder 403433. The four second main sliders 403425 are respectively fixedly arranged at the two ends of the corresponding two main clamping connecting rods 403423, thereby supporting the second main clamping connecting rods 403423.

[0151] Alternatively, if Fig.35As shown, the second main clamping jaw 403424 can also be configured as a rotating structure, and two parallel second main clamping connecting rods 403434 are rotatably arranged on the second lower base 40342. Specifically, four rotating brackets 403435 are arranged on the second lower base 40342, and the second main clamping connecting rod 403434 is rotatably arranged on the four rotating brackets 403425 through bearings. A second main clamping rocker 403436 is arranged between the two free ends of the main clamping cylinder 403433 and the corresponding two second main clamping connecting rods 403434, and one end of the second main clamping rocker 403436 is fixedly connected to the second main clamping connecting rod 40344. The other end of the clamp rocker 403436 is movably connected to a free end of the main clamp cylinder 403433. For example, a first connecting rod with a first connecting notch of a long strip structure is provided, and one end of the first connecting rod is movably connected to a free end of the main clamp cylinder 403433. The end of the first connecting rod with the first connecting notch is arranged away from the second lower base 40342, so that the first connecting notch compensates for the movement of the first connecting rod in the vertical direction to avoid motion interference. The first connecting notch can be a rectangular structure or a U-shaped groove structure, so that the free end of the main clamp cylinder 403433 that can be opened and closed drives the second main clamp jaw 403424 to rotate. For example, when the two free ends of the main clamp cylinder 403433 are opened and separated, the second main clamp jaw 403424 is not engaged with the resin tray 40344. When the two free ends of the main clamp cylinder 403433 are closed and close, the second main clamp jaw 403424 cooperates and abuts with the clamping groove 403441 of the resin tray.

[0152] like Fig.36As shown, the second secondary clamping mechanism includes a secondary clamping cylinder 403421, on which two free ends capable of moving toward or away from each other are provided, a secondary moving seat 403428 is provided at the free end of the secondary clamping cylinder 403421, on which a first secondary clamping block 403431 is provided, and the first secondary clamping block 403431 can clamp and cover one side of the resin tray 40344, and on the secondary moving seat 403428, a first main clamping block 403430 capable of being raised and lowered is provided. The second lifting cylinder 403429 is provided on the movable seat 403428, and the free end of the second lifting cylinder 403429 is connected to the first main clamping block 403430. The first main clamping block 403430 is lifted and lowered to close and open with the first auxiliary clamping block 403431, and the film is clamped and fixed. Then, in combination with the auxiliary clamping cylinder 403421, the auxiliary movable seat 403428 is brought closer, so as to fix the edge of the film carrying the resin, so that the film is fixed relative to the resin tray 40344. In this embodiment, the auxiliary movable seat 403428, the first auxiliary clamping block 40341, the first main clamping block 40340, and the second lifting cylinder 403429 are all two groups, which are symmetrically arranged about the second upper base 40341, so as to clamp and fix the film at the edge of the resin tray 40344, so that the resin tray 40344 and the film keep moving synchronously.

[0153] Furthermore, a second auxiliary guide rail 403411 is provided on the second upper base 40341, and a second auxiliary slider 403432 is provided on the second auxiliary guide rail 403411. The second auxiliary slider 403432 is connected to the auxiliary movable seat 403428, thereby providing support for the auxiliary movable seat 403428, and the axial direction of the second auxiliary guide rail 403411 is consistent with the opening and closing movement direction of the free end of the auxiliary clamp cylinder 403421.

[0154] In this embodiment, Fig.36 As shown, the first auxiliary clamping block 403431 and the first main clamping block 403430 are located on two opposite sides of the resin tray 40344 , and the second main clamping jaw 403424 is located on the other two opposite sides of the resin tray 40344 .

[0155] In one embodiment, Fig.37 , Fig.38 As shown, as mentioned above, the resin providing mechanism 600 includes a resin loading mechanism 800, and the resin loading mechanism 800 includes a third base 801, a third movable layer and a fourth movable layer, wherein the third base 801 is slidably disposed on the second mounting platform 102, the third movable layer can extend to one side relative to the third base 801, and the fourth movable layer can extend to one side relative to the third movable layer, and is consistent with the extending direction of the third movable layer.

[0156] Specifically, a third guide rail 1025 is provided on the second mounting platform 102, a third slider 8013 is provided on the third guide rail 1025, and the third base 801 is fixedly connected to the third slider 8013. In this embodiment, there are two third guide rails 1025, which are arranged in parallel. A second spur rack 1026 is provided between the two parallel third guide rails 1025, and the second spur rack 1026 is parallel to the third guide rail 1025. Fig.39 As shown, a third drive motor 8011 is disposed on the third base 801, and a second gear 8012 is disposed on the output shaft of the third drive motor 8011, and the second gear 8012 meshes with the second spur rack 1026. In this embodiment, the second spur rack 1026 and the first spur rack 1016 are installed in the same direction.

[0157] Optionally, the transmission structure of the second spur rack 1026 and the second gear 8012 can also be set as a transmission structure of a screw nut, and the nut is connected to the third slider 8013 for limiting, so as to achieve reciprocating linear movement; optionally, the transmission structure of the second spur rack 1026 and the second gear 8012 can also be a cylinder push rod structure, or a synchronous wheel and synchronous belt structure.

[0158] Furthermore, if Fig.40 As shown, the third moving layer includes a third moving substrate 802, the third moving substrate 802 is slidably arranged on the third base 801, a fourth driving motor 8021 is arranged on the third moving substrate 801, a fourth driving pulley 8022 is connected to the output shaft of the fourth driving motor 8021, a rotating fourth driven pulley 8024 is arranged on the third moving substrate 802, and the two are connected by a fourth synchronous belt 8025; two parallel fourth guide rails 8013 are arranged on the third base 801, a fourth slider 8023 is arranged on the fourth guide rail 8013, and the third moving substrate 802 is fixedly arranged on the fourth slider 8023, wherein a third connecting block 8014 is arranged on the third base 801, and the third connecting block 8014 is fixedly connected to the fourth synchronous belt 8025, thereby driving the third moving substrate 802 to move relative to the third base 801;

[0159] Further, the fourth moving layer includes a fourth moving base plate 803, on which a tray transport mechanism 8031 ​​is provided, which is used to transport an empty resin tray 80344 or to transport a resin tray 80344 with a film and resin. Two parallel fifth guide rails 8026 are provided on the third moving base plate 802, on which a fifth slider 8032 is provided, and the fourth moving base plate 803 is fixedly provided on the fifth slider 8032. In this embodiment, in order to reduce the number of driving devices, such as Fig.40 and Fig.41As shown, a fourth connecting block 8033 is provided on the fourth movable base plate 803, and the fourth connecting block 8033 is fixedly connected to the fourth synchronous belt 8025. In the initial position, the third connecting block 8014 is close to the fourth driven pulley 8024, and the fourth connecting block 8033 is close to the fourth driving pulley 8022. When the fourth driving motor 8021 rotates, the third movable layer and the fourth movable layer are driven to move relative to the third connecting block 8014 on the third base 801. At the same time, since the fourth connecting block 8033 is fixedly connected to the fourth synchronous belt 8025, and the fourth connecting block 8033 is fixedly connected to the fourth movable base plate 803, the fourth movable base plate 803 moves synchronously with the third movable base plate 802. It should be particularly pointed out that the structure and principle of the pallet transport mechanism 8031 ​​and the second pallet clamping assembly 4034 are the same, as mentioned above, and no further elaboration is made here.

[0160] Optionally, the fourth movable substrate 803 may also be driven by a separate driving device, such as a motor-screw-slider structure, or a motor combined with a synchronous wheel and synchronous belt structure, or a cylinder structure with a push rod.

[0161] In one embodiment, Fig.42 As shown, the resin providing mechanism also includes a cleaning component 601, a film sticking component 602, a resin powder sprinkling component 603 and a transfer table 604. The cleaning component 601 is arranged close to one side of the third guide rail 1025, and is mainly used for cleaning the dirty resin tray 40344; the film sticking component 602 is arranged close to the cleaning component 601, and is mainly used for vacuum film sticking, laying a film on the bottom of the resin tray 40344, and after the film is laid, the resin tray 40344 laid with the film is transferred to the bottom of the resin powder sprinkling component 603 for powder sprinkling; the resin powder sprinkling component 603 is mainly used for powder sprinkling and laying of resin powder, so that the resin powder is evenly laid on the film of the resin tray 40344; the transfer table 604 is mainly used for temporary transfer and placement of the resin tray 40344 laid with resin, so that the tray transport mechanism 8031 ​​can grab it. In this embodiment, the resin tray 40344 moves in a straight line between the cleaning component 601 and the film-applying component 602, and its movement trajectory is perpendicular to the third guide rail 1025. The resin tray 40344 moves in a straight line between the transfer table 604 and the resin powdering component 603, and its movement trajectory is perpendicular to the third guide rail 1025. The movement trajectory of the resin tray 40344 between the film-applying component 602 and the resin powdering component 603 is straight and parallel to the third guide rail 1025, wherein the resin powdering component 603 and the transfer table 604 are arranged close to one side of the press unit 500. Among them, a first tray conveying component 605 is arranged between the cleaning component 601 and the film-applying component 602, and a second tray conveying component 606 is arranged between the resin powdering component 603 and the transfer table 604, both of which are used to convey the resin tray 40344.

[0162] Specifically, Figures 44-46 As shown, the cleaning assembly 601 includes a cleaning base 6011 that can be lifted and lowered relative to the second mounting platform 102, that is, a first lifting cylinder 60111 is arranged on the second mounting platform 102, and a free end of the first lifting cylinder 60111 is fixedly connected to the bottom of the cleaning base 6011, and a plurality of first cleaning guide shafts 6015 are arranged between the cleaning base 6011 and the second mounting platform 102, which are used to support the lifting of the cleaning base 6011, and a cleaning installation position for placing the resin tray 40344 is arranged on the cleaning base 6011, and a cleaning support 6011 connected to the cleaning base 6011 by a plurality of cleaning fixing rods 60122 is arranged below the cleaning base 6011, wherein a cleaning cylinder 60121 is arranged on the cleaning support 6011, and the cleaning cylinder 60121 is arranged on the cleaning support 6011. A cleaning base plate 60123 is provided at the free end of the cleaning cylinder 60121, and a foldable cleaning airbag 6014 is provided on the cleaning base plate 60123. A plurality of cleaning holes are provided on the cleaning airbag 6014, and the cleaning holes are aligned with the inner frame edge of the resin tray. The free end of the cleaning cylinder 60121 is repeatedly raised and lowered to compress the cleaning airbag 6014, and the resin tray 40344 is cleaned. Furthermore, the cleaning airbag 6014 is provided with a first recovery hole 60141 and a second recovery hole 60142 connected to the cleaning airbag 6014, the first recovery hole 60141 is provided on the upper side of the cleaning airbag 6014 close to the resin tray 40344, and the second recovery hole 60142 is provided on the side of the cleaning airbag 6014 close to the cleaning support 6012, for the recovery of residual particles. In this embodiment, there are two cleaning installation positions, so that two resin trays 40344 can be cleaned at the same time.

[0163] like Figures 47-48As shown, the film sticking assembly 602 includes a first reel 6028, a support roller 60281, two parallel film sticking brackets 6025, and a film sticking cross beam 6025. The film sticking bracket 6025 is set at a certain distance from the second mounting platform 102. The film sticking cross beam 6026 is slidably set on the two parallel film sticking brackets 6025. A film pressing mechanism is set at one end of the film sticking bracket 6025 close to the first reel 6028. The film pressing mechanism includes a film pressing base 6024, a lower pressing module 60244 fixedly set on the film pressing base 6024, and an upper film pressing block 60241 which can be raised and lowered relative to the film pressing base 6024. The film can be movably passed between the upper film pressing block 60241 and the lower pressing module 60244. When the upper pressing module 60241 and the lower pressing module 60244 are closed, the film is fixed. The lifting and lowering of the upper pressing module 60241 is controlled by the film pressing cylinder 60242. The upper pressing module 60241 is arranged at the free end of the film pressing cylinder 60242. The film pressing cylinder 60242 is fixedly arranged on the film pressing base 6024. Two parallel film pressing guide shafts 60243 are also arranged on the upper pressing module 60241 to further provide stable support for the lifting and lowering movement of the upper pressing module 60241. One end of the film pressing guide shaft 60243 is fixedly connected to the upper pressing module 60241, and the other end thereof is movably penetrated into the film pressing base 6024. The installation direction of the film pressing guide shaft 60243 is consistent with the telescopic direction of the free end of the film pressing cylinder 60241.

[0164] Furthermore, if Fig.48 As shown, the first reel 6028 is slidably arranged so that the tension of the film can be adjusted. The support roller 60281 can be arranged as a movable structure to adjust the tension of the film. In this embodiment, the rotation of the first reel 6028 is driven by a motor, thereby reducing the tension during the film transportation process to prevent the film from being broken or torn.

[0165] Furthermore, a film cutting knife 60215 is provided on the film sticking assembly 602. The film cutting knife 60215 can move in a direction perpendicular to the film conveying direction to cut the film. Specifically, a film cutting screw 60211 and a film cutting guide rail 60213 which are axially parallel to each other are arranged on the film pressing base 6024, and the film cutting screw 60211 and the film cutting guide rail 60213 are arranged horizontally relative to the second mounting platform 102, a film cutting nut 60212 is arranged on the film cutting screw 60211, and a film cutting slider 60214 is arranged on the film cutting guide rail 60213, wherein the film cutting slider 60214 and the film cutting nut 60212 are connected by a fifth connecting block, and the film cutting knife is arranged on the fifth connecting block 602151, and the film cutting motor 6021 is arranged on the second mounting platform 102, and the output end of the film cutting motor 6021 is connected to one end of the film cutting screw 60211 for power connection. In this embodiment, power transmission is realized by means of synchronous wheels and synchronous belts. Optionally, it can also be a gear meshing method, or the output shaft of the film cutting motor 6021 is directly connected to the film cutting screw 60211 for power connection through a coupling.

[0166] Furthermore, a preset film cutting distance is set between the film cutting knife 60215 and the upper pressing module 60241 in the film moving direction, so that a preset length can be left after the film is cut, so that the film clamping block of the film beam 6026 can clamp the film for the next round of film laying.

[0167] Further, refer again to Fig.47, parallel film sticking rails 60251 are respectively arranged on two parallel film sticking brackets 6025, the film sticking rails 60251 are arranged horizontally, at least one film sticking slider 602511 is respectively arranged on the two film sticking rails 60251, a film sticking crossbeam 6026 is connected with the film sticking slider 602511, and the film sticking crossbeam 6026 is perpendicular to the two film sticking brackets 6025, a film sticking driving wheel 6022 and a film sticking driven wheel 6023 are arranged at both ends of the film sticking bracket 6025, and a film sticking synchronous belt 60221 is wound around for power connection, and part of the film sticking crossbeam 6025 is fixed to the film sticking synchronous belt 60221; further, in order to avoid a large span of the film sticking crossbeam 6026, uneven power, and a stuck response during movement, the film sticking driving wheel 6022, the film sticking driven wheel 6023 and the film sticking synchronous belt 60221 are fixed to the film sticking synchronous belt 60221. Belt 60221 is simultaneously arranged on two film sticking brackets 6025, and a film sticking shaft 6027 is arranged between the two film sticking driving wheels 6022 for fixed connection. The film sticking shaft 6027 is rotatably arranged on the film sticking bracket 6025, and the two ends of the film sticking beam 6026 are respectively connected with the two film sticking synchronous belts 60221. In this embodiment, in order to facilitate the installation of the film sticking motor 60272 and occupy less installation space, the film sticking motor 60272 is arranged on the second installation platform 102, and a first driven transmission pulley 60271 is arranged on the film sticking shaft 6027, and a first driving transmission pulley 60273 is arranged on the output shaft of the film sticking motor 60272. The first driven synchronous pulley 60271 and the first driving transmission pulley 60273 are connected in power through the first transmission synchronous belt 60274. Optionally, in this embodiment, the film sticking motor 60272 can also be directly connected to the film sticking shaft through a coupling, or the power transmission between the film sticking motor 60272 and the film sticking shaft 6027 can be achieved through gear meshing.

[0168] Furthermore, in order to ensure the automation of film laminating, a film clamping group is arranged on the film laminating beam 6026, and the film clamping group includes a film clamping cylinder 60261, a main film clamping block 60262 and an auxiliary film clamping block 60263. The fixed end of the film clamping cylinder 60261 is arranged on the film laminating beam 6026, and the free end of the film clamping cylinder 60261 is connected to the main film clamping block 60262 to drive the main film clamping block 60262 to move up and down, thereby realizing the clamping and movement of the film with a preset length left at the film pressing mechanism. In this embodiment, the up and down lifting direction is the vertical direction to the second mounting platform 102; the width of the main film block 60262 and the auxiliary film block 60263 is greater than the width of the film, so that the film can be completely clamped between the main film block 60262 and the auxiliary film block 60263. In this embodiment, the clamping part of the main film block 60262 is an L-shaped structure, so that the film with a preset length left by the film cutting knife 60215 can be clamped.

[0169] In one embodiment, Fig.43 As shown, two first conveying brackets 6058 are arranged on the second mounting platform 102, and a first conveying assembly is arranged on the first conveying brackets 6058. The two first conveying brackets 6058 are arranged at a certain distance from the second mounting platform 102. The first conveying assembly includes a first pallet conveying guide rail 6056 arranged on one of the first conveying brackets 6058, a first pallet conveying slider 6057 arranged on the first pallet conveying guide rail 6056, and a first pallet conveying motor 6054, a first pallet conveying screw rod and a first pallet conveying nut arranged on the other first conveying bracket 6058. A first pallet conveying mounting block 6055 is arranged on the first pallet conveying nut. The axis of the first pallet conveying screw rod is parallel to the axis of the first pallet conveying guide rail 6056. The first pallet conveying motor 6054 is fixedly arranged on the first conveying bracket 6058. The first pallet conveying screw rod is rotatably arranged on the first conveying bracket 6058 through a bearing, and the first pallet conveying nut is sleeved on the first pallet conveying screw rod through threaded cooperation.

[0170] The first pallet transport assembly 605 includes a film substrate 6053, a first film clamping mechanism 6051 that can be raised and lowered relative to the film substrate 6053, one end of the film substrate 6053 is fixedly connected to the first pallet transport slider 6057, and the other end of the film substrate 6053 is fixedly connected to the first pallet transport mounting plate 6055. The film substrate 6053 is horizontally arranged, which means being parallel to the plane where the second mounting platform 102 is located. A film lifting cylinder 6052 is arranged on the film substrate 6053, and the free end of the film lifting cylinder 6052 is fixedly connected to the film clamping assembly 6051.

[0171] Specifically, the film clamping claw assembly 6051 includes a film base, a film clamping cylinder, a film push rod, a film connecting rod and a film clamping claw. The film clamping cylinder is arranged on the film base. The film clamping cylinder has two free ends that can be opened and closed. The free end of the film clamping cylinder is connected to one end of the film push rod, and the other end of the film push rod is connected to the film connecting rod. Two film clamping claws are arranged at both ends of the film connecting rod. In this embodiment, there are four film clamping claws, and there are two film connecting rods and film push rods. The principle is the same as that of the second main clamping mechanism mentioned above, as mentioned above, and no further elaboration is made here.

[0172] like Fig.47 As shown, the film sticking assembly 602 also includes a film sticking platform 6029 movably arranged on the second mounting platform 102. The film sticking platform 6029 reciprocates between the film sticking assembly 602 and the resin powder sprinkling assembly 603, and moves the resin tray 40344 with the film stuck to the bottom of the resin powder sprinkling assembly 603 for uniform powder sprinkling.

[0173] Specifically, a rotating first movable screw and a fixed first movable guide rail are arranged on the second mounting platform 102, a portion lower than the first movable slider is arranged on the first movable guide rail, and the line of the first movable guide rail is parallel to the axis of the first movable screw. In this embodiment, the first movable screw is arranged directly above the first movable guide rail, and a first movable nut is arranged on the first movable screw, and the first movable nut is fixedly connected to the first movable slider. A first movable motor 60291 is arranged at one end of the first movable screw, and the first movable motor 60291 is arranged on the second mounting platform 102. The output end of the first movable motor 60291 is power-connected to one end of the first movable screw, and the first movable nut is driven to make reciprocating linear movements along the first movable screw through the forward and reverse rotation of the first movable motor 60291.

[0174] Furthermore, if Fig.47 As shown, a first mounting block 60292 is arranged on the first moving nut, a platform lifting cylinder 60293 is arranged on the first mounting block 60292, a film pasting platform 6029 is arranged at the free end of the platform lifting cylinder 60293, and a mounting position is arranged on the film pasting platform 6029 for placing the resin tray 40344;

[0175] Furthermore, a plurality of first adsorption holes are provided on the film sticking platform 6029, and the plurality of first adsorption holes are used for vacuum extraction. When the film is located on the film sticking platform, it can be fixed by vacuum adsorption through the first adsorption holes;

[0176] In this embodiment, the transmission combination of the first movable screw rod and the first movable nut can be replaced by a synchronous wheel and synchronous belt combination. When the stroke is short, it can also be replaced by the extension and retraction of the free end of the cylinder. It can be known that the reciprocating structure of the first mounting block 60292 in this embodiment is not limited by the present invention. The purpose is to drive the film sticking platform 6029 on the first mounting block 60292 to reciprocate between the film sticking assembly 602 and the powder spreading assembly 603.

[0177] In one embodiment, Fig.43 As shown, two second conveying brackets 6068 are arranged on the second mounting platform 102, and a certain distance is arranged between the second conveying bracket 6068 and the second mounting platform 102. In this embodiment, the second conveying bracket 6068 and the first conveying bracket 6058 are of the same height, and one of the second conveying brackets 6068 and one of the first conveying brackets 6058 are shared as a whole. A second conveying assembly is arranged on the second conveying bracket 6068. The second conveying assembly has the same structure and principle as the aforementioned first conveying assembly, and will not be elaborated herein.

[0178] like Fig.50As shown, the resin powder sprinkling assembly 603 includes a powder sprinkling base 60310, a flip assembly and a flip box 60325. The powder sprinkling base 60310 is connected to the second conveying assembly and can move back and forth linearly on the second conveying bracket 6068. A through flipping slot 603101 is set on the powder sprinkling base 60310, and the flip box 60325 is rotatably set on the flipping slot 603101. The flip box 60325 is rotatably set on the powder sprinkling base 60310 through the flip assembly.

[0179] Specifically, the flipping assembly includes a flipping motor 60311, a flipping driving pulley, a flipping driven pulley, a flipping synchronous belt 60312 and a flipping shaft 60313. The flipping motor 60311 is fixedly arranged on the powder sprinkling base 60310. The flipping driving pulley is arranged on the output shaft of the flipping motor 60311. The flipping shaft 60313 is rotatably arranged on the powder sprinkling base 60310 through a bearing and is arranged along the edge of the flipping slot 603101. The flipping driven pulley is fixedly arranged at one end of the flipping shaft 60313 and is located on one side with the flipping driving pulley. The flipping synchronous belt 60312 is wound around the flipping driving pulley and the flipping synchronous pulley for power transmission. In this embodiment, the size of the flipping slot 603101 is larger than the size of the flipping box 60325 to meet the flipping angle of the flipping box 60325. In this embodiment, the structure of the flip driving pulley, flip driven pulley and flip synchronous belt can be replaced by the meshing of the driving gear and the driven gear, or the flip motor 60311 can be directly connected to the flip shaft 60313 through a coupling for power.

[0180] Furthermore, if Fig.51 , Fig.52 As shown, the flip box 60325 includes a horizontal storage area 603254 and a discharge port 603253. The discharge port 603253 of the flip box 60325 matches the width of the chip substrate. The discharge port 603253 is connected to the horizontal storage area 603254. A plurality of spaced parallel partitions 603251 are arranged in the flip box 60325. The partitions 603251 are evenly distributed along the length direction of the flip box 60325 to separate the horizontal storage area 603254 into a plurality of storage troughs 603252, thereby evenly distributing the resin entering the flip box 60325 to avoid resin clumping and make the resin laying more uniform.

[0181] In one embodiment, Fig.49As shown, the resin supply mechanism 600 also includes a resin box 60321, a resin funnel 60322, a resin transmission component, a spray port 60324, and a weighing device 60326. The weighing device 60326 cooperates with the resin box 60321 to accurately weigh and release the resin. The lower discharge port of the resin box 60321 is directly opposite to the resin funnel 60322. The resin transmission component includes a resin pipeline 60323, a screw 60328 and a screw motor 60327. The screw motor 60327 is arranged at At one end of the resin pipe 60323, the spiral device 60328 is rotatably disposed in the resin pipe 60323, one end of which is connected to the output end of the spiral motor 60327, the resin funnel 60322 is connected to the resin pipe 60323, the spray port 60324 is disposed at one end of the resin pipe 60323 away from the spiral motor 60327, the position of the spray port 60324 corresponds to the position of the flip box 60325, and the outer side of the resin pipe 60323 is connected to the weighing device 60326 to weigh the resin. In this embodiment, the spiral device 60328 and the weighing device 60326 are existing mechanisms, and will not be elaborated on in detail.

[0182] Furthermore, in order to ensure accurate release of the resin, the resin providing mechanism 600 also includes a resin metering unit, which is mainly used to receive the number and volume of chips on the chip substrate measured by the aforementioned measuring instrument, so as to accurately release the required amount of resin for chip substrate packaging, thereby avoiding resin waste or insufficient resin, and saving materials. In this embodiment, the resin metering unit cooperates with the resin box to achieve accurate supply of resin weight.

[0183] The resin laying process is as follows: the film-laying platform with the resin tray 43044 is moved to the bottom of the flip box after the resin metering unit receives the data of the volume and number of the chip substrates measured by the measuring instrument 3064, and the resin box 60321 and the weighing device 60326 cooperate, and the resin box 60321 releases a certain weight of resin, which falls into the resin pipe 60323 through the resin funnel 60322, and moves the resin to the spray port 60324 through the spiral device 60328, and the spray port transfers the resin to the flip box 60325;

[0184] In the initial position, the unloading port 603253 of the flip box 60325 is close to an inner side of the resin tray 40344, and the first moving motor 60291 drives the film sticking platform 6029 to move slowly and uniformly. At the same time, the flip motor 60311 drives the flip box 60325 to rotate, so that the flip box 60325 is slowly tilted, and the resin is evenly sprinkled from the unloading port 603253 of the flip box 60325 into the resin tray 40344 with the film, and is laid in a straight line. On the one hand, the resin is evenly laid, and on the other hand, combined with the flipping of the flip box 60325 and the uniform movement of the film sticking platform 6029, it is directly laid according to the width of the chip substrate, such as Fig.53 As shown, compared with the existing resin laying method, there is no need to swing back and forth, which improves the resin laying efficiency.

[0185] The second pallet handling assembly 606 further includes a pallet handling clamp mechanism 6061, which can be lifted and lowered on a conveying substrate 6063. The pallet handling clamp mechanism 6061 is disposed below the conveying substrate 6063. Specifically, a fifth lifting cylinder 6062 is disposed on the conveying substrate 6063, and a free end of the fifth lifting cylinder 6062 is fixedly connected to the pallet handling clamp mechanism 6061. It should be noted that in this embodiment, the pallet handling clamp mechanism 6061 and the second pallet clamping assembly 4034 have the same structural principle, as described above, and will not be described in detail herein.

[0186] In one embodiment, Fig.54 As shown, the transfer table 604 is a liftable structure, which is arranged below the pallet transporting clamp mechanism 6061. The transfer table 604 is provided with a mounting position, which is mainly used for storing the resin tray 40344 carrying the film and the resin, that is, the waiting area of ​​the resin tray 40344. Specifically, a sixth lifting cylinder 6041 is arranged on the second mounting platform 102, one end of the sixth lifting cylinder 6041 is fixed on the second mounting platform 102, and the free end of the sixth lifting cylinder 6041 is connected with the transfer platform 6042.

[0187] Furthermore, to ensure the smooth lifting structure of the transfer platform 604, a plurality of sixth guide shafts 6043 are arranged parallel to the free end of the sixth lifting cylinder 6041 between the transfer platform 6042 and the second installation platform 102. One end of the sixth guide shaft 6043 is fixedly connected to the bottom 6042 of the transfer platform, and the other end is movably inserted into the second installation platform 102 through a guide sleeve. In this embodiment, there are 4 sixth guide shafts, and optionally 3, 2, etc. It can be known that the number of the sixth guide shafts 6043 is not limited by the present invention.

[0188] In one embodiment, Fig.55 and Fig.56As shown, the press unit 500 includes an upper mold 503 and a lower mold 502, wherein the upper mold 503 is fixedly arranged, and the lower mold 502 can be moved up and down to form a closed mold.

[0189] Specifically, the press unit 500 includes a press base 501, on which four mold guide columns 504 are provided, one end of the mold guide column 504 is fixedly connected to the mold base 501, and the mold guide columns 504 are arranged parallel to each other, wherein the lower mold 502 is movably sleeved on the mold guide column 504, and the upper mold 503 is fixedly arranged on the upper end of the mold guide column 504, and a first negative pressure mechanism is arranged on the upper mold 503 to adsorb and fix the chip substrate, and a second negative pressure mechanism is arranged on the lower mold 502 to adsorb and fix the film carrying resin.

[0190] Furthermore, a mold clamping motor 5011, a mold clamping screw 5015, a mold clamping nut 5016 and a mold clamping connecting rod assembly 506 are arranged on the press base 501, wherein both ends of the mold clamping screw 5015 are rotatably arranged on the mold clamping base 501 through bearings, the mold clamping nut 5016 is sleeved on the mold clamping screw 5015 through threaded fitting, the axis of the mold clamping screw 5015 is parallel to the axis of the mold clamping guide column 504, a mold clamping active pulley 5012 is arranged at the output end of the mold clamping motor 5011, a mold clamping driven pulley 5014 is arranged at one end of the mold clamping screw 5015 close to the mold clamping base 501, a mold clamping driven belt 5013 is wound around the mold clamping active pulley 5012 and the mold clamping driven pulley 5014 for power transmission, and the lower mold 502 is driven to perform a mold clamping action through the forward and reverse rotation of the mold clamping motor 5011.

[0191] Furthermore, if Fig.59 As shown, the mold clamping link assembly 506 includes a first link 5063, a second link 5062 and a third link 5061, wherein one end of the first link 5063 is hinged to the lower mold 502, one end of the second link 5062 is hinged to the upper mold 503, the other end of the first link 5063 is hinged to the other end of the second link 5062, one end of the third link 5061 is hinged to the mold clamping nut 5016, and the other end of the third link 5061 is hinged to the first link 5063. In this embodiment, the first link 5063, the second link 5062 and the third link 5061 are symmetrically arranged about the mold clamping screw 5015. In the initial state, the hinge point of the first connecting rod 5063 and the second connecting rod 5062 is set close to one side of the mold clamping screw 5015. When the lower mold 502 rises, the hinge point of the first connecting rod 5063 and the second connecting rod 5062 begins to slowly move away from the mold clamping screw 5015.

[0192] Furthermore, if Fig.60As shown, a nut guide shaft 5017 is also provided on the mold base 501. The nut guide shaft 5017 is arranged parallel to the mold screw 5015. The nut guide shaft 5017 is passed through the mold nut 5016. In this embodiment, there are two nut guide shafts 5017, which are symmetrically arranged with respect to the mold screw 5015. The axis of the mold screw 5015 and the axes of the two mold guide shafts 5017 are on the same plane.

[0193] like Fig.57 and Fig.58 As shown, multiple groups of adjustment components 505 are arranged on the upper mold 503, and the number of the adjustment components 505 matches the number of the mold clamping guide shafts 504. Specifically, the adjustment component 505 includes an adjustment motor 5051, which is fixedly arranged on the upper mold 503 through a mounting bracket. A reduction gear component 5052 is arranged at the output end of the adjustment motor 5051. The reduction gear component 5052 includes an active reduction gear, a driven reduction gear and an annular rack. The number of teeth of the active reduction gear is much smaller than that of the driven reduction gear, so as to achieve a deceleration effect. The driven reduction gear is meshed with the active reduction gear and the annular rack respectively. The active reduction gear is arranged on the output shaft of the adjustment motor 5051. The output end of the driven reduction gear is connected to the upper flange 5053. A fixedly connected lower flange 5054 is arranged below the upper flange 5053. The flange 5054 is fixedly connected to the correction nut 5056, and a corresponding correction thread is arranged on the upper end portion of the mold closing guide shaft 504. The correction nut 5056 is sleeved on the mold closing guide shaft 5054 through the correction thread, and an annular clearance groove is arranged on the upper mold 503. The size of the annular clearance groove is adapted to the size of the correction nut 5056, and the correction nut 5056 can rotate relative to the upper mold 503 in the annular clearance groove; further, a detachable limit block 5055 is also arranged on the upper mold 503 to limit the correction nut 5056 in the axial direction of the mold closing guide shaft 504, so as to facilitate the correction nut 5056 to be movably installed in the annular clearance groove of the upper mold 503.

[0194] Furthermore, a return spring 5041 is provided below the upper die 503 to assist in returning the upper die 503. Specifically, a spring bracket 5042 is provided on the mold closing guide shaft 504, one end of the return spring 5041 abuts against the spring bracket 5042, and the other end of the return spring 5041 abuts against the lower wall of the upper die 503, when the upper die 503 moves downward under the action of the adjusting motor 5051, the return spring 5041 is squeezed, and when the upper die 503 moves upward under the action of the adjusting motor 5051, the return spring 5041 returns to its initial state.

[0195] In one embodiment, Fig.61As shown, the press unit 500 also includes a pressure sensor 5043, a pressure amplifier and a controller. The controller includes a storage unit, an operation unit, a comparison unit and a control instruction unit. The pressure sensor 5043 is arranged on the mold closing guide shaft 504, and is used to detect the pressure of each mold closing guide shaft 5043 when the mold is closed, so as to confirm whether there is a pressure difference. The pressure amplifier is used to convert the micro-deformation of the pressure difference into analog-to-digital, and transmit the converted data to the storage unit of the controller. The operation unit calculates and processes the converted data in the storage unit, and compares the calculation result with the standard value set by the comparison unit. According to the comparison result, the control instruction unit issues an adjustment instruction to fine-tune the correction nut 5056 of one or more adjustment components 505 to achieve the adjustment of the mold closing pressure, so that the multiple mold closing guide shafts 5056 are evenly stressed, thereby ensuring the balance of the thickness of the package body.

[0196] In one embodiment, the present invention further provides a method for adjusting the mold clamping of a press unit 500:

[0197] S1; the mold closing motor 5051 rotates, driving the lower mold 502 to move upward for mold closing;

[0198] S2: When the mold is closed, the pressure sensor 5043 detects the pressure values ​​of the multiple mold closing guide shafts 504 in real time, and converts the deformation amount into analog-to-digital through the pressure amplifier, and stores the detection data in the storage unit of the controller;

[0199] S3: The computing unit of the controller calculates and processes the detection data in the storage unit, and compares the calculated data with the standard value of the comparison unit to obtain a deviation value, and feeds the deviation value back to the control instruction unit of the controller;

[0200] S4: The control command unit issues a command according to the deviation value, and issues an adjustment command to one or more adjustment motors 5051, driving the correction nut 5056 to perform fine adjustment, so that the force magnitude of the multiple mold clamping guide shafts 504 is within the range of the specified standard value.

[0201] The above is only a preferred embodiment of the present invention. It should be noted that a person skilled in the art can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be considered as the protection scope of the present invention.

Claims

1. A fully automatic semiconductor packaging equipment, characterized in that: include: A support frame, on which a first mounting platform is provided; The chip substrate storage mechanism comprises at least one upper material layer, at least one transition layer and at least one lower material layer which are arranged in sequence from bottom to top, and a plurality of relatively movable magazines can be placed on the upper material layer, the transition layer and the lower material layer, and the magazine is provided with a plurality of interlayers, and the chip substrate is placed on the interlayers of the magazine; The chip substrate transmission mechanism comprises a loading conveying mechanism, a handling mechanism and a unloading conveying mechanism arranged on the first mounting platform of the support frame, wherein the loading conveying mechanism is arranged on one side of the loading layer, the unloading conveying mechanism is arranged on one side of the unloading layer, and the handling mechanism is arranged between the loading conveying mechanism and the unloading conveying mechanism; A chip substrate loading mechanism, movably disposed on the first mounting platform, used for transporting chip substrates to be packaged and packaged, and the chip substrate loading mechanism can perform reciprocating linear movement on the first mounting platform; at least one set of press units, located on one side of the loading mechanism, the press units comprising an upper die and a lower die, and a portion of the chip substrate loading mechanism can enter between the upper die and the lower die; A resin supply mechanism is arranged near the end of the moving track of the chip substrate loading mechanism, the resin supply mechanism includes a resin loading mechanism, a first lifting mechanism and a resin tray, the resin loading mechanism can drive the resin tray to reciprocate linearly on the second mounting platform of the support frame, the second mounting platform is arranged below the first mounting platform and has a preset spacing with the first mounting platform, the first lifting mechanism is arranged on the support frame, part of the resin loading mechanism can move above the first lifting mechanism to transport the resin tray to the first lifting mechanism, the first lifting mechanism can drive the resin tray to move to the chip substrate loading mechanism, and move the resin tray into the press unit through the chip substrate loading mechanism or take the resin tray out of the press unit and move it to the first lifting mechanism; A waste box is arranged near one side of the conveying mechanism and is located below the first mounting platform. A switchable waste opening is provided on the first mounting platform, and the position of the waste opening corresponds to the position of the movement trajectory of the chip substrate loading mechanism.

2. A fully automatic semiconductor packaging equipment according to claim 1, characterized in that: The material loading layer is provided with a first translation component, the first translation component is provided with a first translation push block, the first translation push block can make reciprocating linear movement on the material loading layer, a first moving module is provided on one side of the material loading layer, the first moving module is arranged on the support frame, the first moving module includes a first X-axis module and a first Z-axis module, the first X-axis module is provided with a first X-axis slider for reciprocating linear movement, the first Z-axis module is arranged on the first X-axis slider, the first Z-axis module is provided with a first supporting block for reciprocating linear movement, the moving direction of the first X-axis slider is consistent with the moving direction of the first translation push block, and the moving direction of the first supporting block is consistent with the distribution direction of the material loading layer, the transition layer and the lower material layer.

3. A fully automatic semiconductor packaging equipment according to claim 2, characterized in that: It also includes a chip substrate pushing mechanism arranged on the same side as the first mobile module, the chip substrate pushing mechanism is arranged on the support frame, and a reciprocating pushing claw is provided on the chip substrate pushing mechanism, and the moving direction of the pushing claw is consistent with the interlayer direction of the magazine.

4. The fully automatic semiconductor packaging equipment according to claim 2, characterized in that: It also includes a second movable module arranged on the other side of the chip substrate storage mechanism, and the second movable module has the same structure as the first movable module.

5. The fully automatic semiconductor packaging equipment according to claim 2, characterized in that: A second translation assembly is provided on the transition layer, and a third translation assembly is provided on the lower material layer. The second translation assembly includes a second translation motor arranged on the support frame, a second translation active synchronous pulley arranged at the output end of the second translation motor, and multiple second translation synchronous belts and multiple second translation driven synchronous pulleys arranged on the support frame. The second translation active synchronous pulley is provided with multiple second mounting grooves distributed at intervals. Multiple second translation synchronous belts are wound around the second mounting grooves and around the corresponding second translation driven synchronous pulleys, so that multiple second translation synchronous belts are arranged in parallel. The third translation assembly has the same structure as the second translation assembly, and the moving direction of the magazine located on the third translation assembly is opposite to the moving direction of the magazine located on the second translation assembly.

6. The fully automatic semiconductor packaging equipment according to claim 1, characterized in that: The loading and conveying mechanism includes a first conveying track with adjustable spacing, a scanning mechanism and a first traction mechanism, the first conveying track includes a first side plate and a second side plate, the first side plate and the second side plate are provided with a first conveying groove, the scanning mechanism is arranged at the loading end of the first conveying track to scan the chip substrate, the first traction mechanism is provided with a first traction clamp, the first traction clamp is arranged between the first side plate and the second side plate and the first traction clamp moves back and forth in a straight line along the length direction of the first conveying track.

7. The fully automatic semiconductor packaging equipment according to claim 6, characterized in that: The conveying mechanism comprises a first conveying assembly arranged near the loading conveying mechanism, a second conveying assembly arranged near the unloading conveying mechanism, and a preset platform arranged between the first conveying assembly and the second conveying assembly, wherein a chip substrate placement area is arranged on the preset platform; The first transport assembly includes a first transport swing arm, a second transport swing arm and a first transport clamp, wherein the fixed end of the first transport swing arm is rotatably disposed on the first mounting platform, the fixed end of the second transport swing arm is rotatably disposed on the free end of the first transport swing arm, and the first transport clamp can be lifted and lowered on the free end of the second transport swing arm; The second conveying assembly includes an X-axis conveying module provided with a first conveying slider, a Y-axis conveying module provided with a second conveying slider, a Z-axis conveying module and a second conveying clamp, the Y-axis conveying module is fixedly arranged on the first mounting platform, the X-axis conveying module is arranged on the second conveying slider of the Y-axis conveying module, the Z-axis conveying module is arranged on the first conveying slider of the X-axis conveying module, and the second conveying clamp is arranged on the Z-axis conveying module.

8. The fully automatic semiconductor packaging equipment according to claim 7, characterized in that: It also includes a counting and detecting mechanism arranged on the first mounting platform, the counting and detecting mechanism is provided with a measuring instrument capable of reciprocating linear movement relative to the first mounting platform, the measuring instrument is used to detect the number and volume of chips on the chip substrate, and the moving direction of the measuring instrument is consistent with the length direction of the chip substrate.

9. The fully automatic semiconductor packaging equipment according to claim 7, characterized in that: The first carrying clamp has the same structure as the second carrying clamp, and the first carrying clamp includes a carrying base plate, two first rotating shafts that rotate relative to the carrying base plate and are symmetrically arranged, a plurality of first claws that are fixedly arranged on the first rotating shaft and are spaced apart, two first connecting rods, a first rocking arm and a first driving member, the two first connecting rods are symmetrically arranged, the first connecting rod is fixedly connected to the first rotating shaft, a first through groove is provided at the free end of at least one first connecting rod for movably connecting the two first connecting rods, the fixed end of the first rocking arm is connected to the first rotating shaft, and the free end of the first rocking arm is connected to the output end of the first driving member, so that the first rocking arm drives the first rotating shaft to swing.

10. The fully automatic semiconductor packaging equipment according to claim 9, characterized in that: The chip substrate loading mechanism comprises a first base capable of reciprocating linear movement along the first mounting platform, a first moving layer moving relative to the first base, and a second moving layer moving relative to the first moving layer, wherein the moving direction of the first base is perpendicular to the direction of the first moving layer, and the moving direction of the second moving layer is parallel to the direction of the first moving layer; The second movable layer is provided with a second movable substrate, and a first suction cup assembly and a first substrate clamping assembly capable of being raised and lowered are provided above the second movable substrate, the first suction cup assembly is arranged close to one side of the press unit, and includes a plurality of first suction cups, and the first substrate clamping assembly is arranged away from one side of the press unit, and the structure of the first substrate clamping assembly is the same as the structure of the first transport clamping claw; A second tray clamping assembly and a second suction cup assembly are provided below the second movable substrate. The second suction cup assembly is provided close to the press unit and includes a plurality of second suction cups. The second tray clamping assembly is provided away from the press unit and includes a second main clamping mechanism and a second auxiliary clamping mechanism. The second main clamping mechanism includes at least two second main clamping jaws that open and close relative to the second movable substrate. The second auxiliary clamping mechanism includes at least two second auxiliary clamping jaws that open and close relative to the second movable substrate. The first suction cup assembly and the second suction cup assembly are located correspondingly, and the first substrate clamping assembly and the second tray clamping assembly are located correspondingly.

11. The fully automatic semiconductor packaging equipment according to claim 1, characterized in that: The first mounting platform is provided with loading ports matching the number of the first lifting mechanisms, the loading ports correspond to the positions of the first lifting mechanisms, and a portion of the first lifting mechanism can pass through the loading ports and rise to the bottom of the chip substrate loading mechanism, wherein a first sealing component is provided at both the loading port and the waste port, the first sealing component comprises a first sliding door movably arranged on the first mounting platform and a sealing drive, the coverage area of ​​the first sliding door is not less than the coverage area of ​​the loading port and the waste port, and the first sliding door is connected to the output end of the sealing drive.

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