Methods, devices, electronic devices, and storage media for manufacturing circuit boards

Abstract

The present invention discloses a method, device, electronic device, and storage medium for manufacturing a circuit board, relating to the technical field of circuit board manufacturing. The method includes: obtaining a semi-finished circuit board; laminating a protective film on the semi-finished circuit board through an automatic film laminating device, where the automatic film laminating device includes a feeding mechanism, a separating mechanism, a laminating mechanism, and a discharging mechanism; according to the pad positions of the semi-finished circuit board, performing laser windowing on the protective film of the semi-finished circuit board to expose the pads; performing surface treatment on the pads to form a substrate to be punched; and punching the substrate to be punched through a punching device to divide the substrate to be punched into multiple pre-cutting units. According to the method for manufacturing a circuit board in the embodiments of the present invention, laminating a protective film on the semi-finished circuit board through an automatic film laminating device can improve the film laminating efficiency. At the same time, laser windowing is performed after laminating the protective film first, which can improve the accuracy of windowing and avoid the problem of low film laminating accuracy caused by the method of windowing first and then laminating the film.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board manufacturing, and in particular, to a method and device for manufacturing a circuit board, an electronic device, and a storage medium. Background Art

[0002] In order to meet the requirements of circuit board contact and welding, pads need to be provided on the circuit board. At the same time, in order to protect the circuit board, a protective film also needs to be covered on the circuit board. In order for the protective film not to affect the exposure of the pads, in the prior art, usually, according to the size of the pads, openings are made at the corresponding positions on the protective film, and then the protective film after opening is pasted on the circuit board to achieve the protection of the circuit board and the exposure of the pad positions. However, using this method is not applicable to some products with high precision requirements, and it is easy to have the problem that the fitting position of the protective film is not precise enough. Summary of the Invention

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. For this purpose, the present invention provides a method and device for manufacturing a circuit board, an electronic device, and a storage medium, which can improve the way of fitting and windowing the protective film and enhance the accuracy.

[0004] On the one hand, according to an embodiment of the present invention, a method for manufacturing a circuit board includes the following steps:

[0005] Obtain a semi-finished circuit board;

[0006] Attach a protective film to the semi-finished circuit board through an automatic film attaching device; the automatic film attaching device includes a loading mechanism, a separating mechanism, a fitting mechanism, and an unloading mechanism;

[0007] According to the pad positions of the semi-finished circuit board, perform laser windowing on the protective film of the semi-finished circuit board to expose the pads;

[0008] Perform surface treatment on the pads to form a substrate to be punched;

[0009] Punch the substrate to be punched through a punching device to divide the substrate to be punched into multiple pre-cutting units;

[0010] Among them, the step of attaching the protective film to the semi-finished circuit board through the automatic film attaching device includes:

[0011] Load the film to be processed through the loading mechanism; the film to be processed includes a release paper and the protective film provided on the surface of the release paper;

[0012] Separate the protective film from the release paper through the separating mechanism to remove the release paper;

[0013] Attach the protective film to the semi-finished circuit board through the attaching mechanism;

[0014] Discharge the semi-finished circuit board after film pasting through the discharging mechanism.

[0015] According to some embodiments of the present invention, the loading mechanism includes a first loading table, a first moving device, and a lifting and adsorbing device. A limiting device is arranged on the first loading table. The first moving device is located above the first loading table, and the lifting and adsorbing device is arranged on the first moving device. The steps of loading the film to be processed through the loading mechanism include:

[0016] Place a plurality of the films to be processed on the first loading table, and limit the plurality of films to be processed through the limiting device;

[0017] After the lifting and adsorbing device descends and adsorbs the uppermost film to be processed, the lifting and adsorbing device lifts and descends multiple times to shake the adsorbed film to be processed;

[0018] The first moving device drives the lifting and adsorbing device to move, so that the lifting and adsorbing device transfers the adsorbed film to be processed to the separating mechanism.

[0019] According to some embodiments of the present invention, the separating mechanism includes a transfer platform, a second moving device, a rotating and lifting device, a sticky separating roller, an aggregate device, a receiving platform, and a movable grasping device. The second moving device is located above the transfer platform, the rotating and lifting device is arranged on the second moving device, the separating roller is arranged on the rotating and lifting device, the aggregate device is arranged between the transfer platform and the receiving platform, and the grasping device is located above the receiving platform;

[0020] The steps of separating the protective film and the release paper through the separating mechanism and removing the release paper include:

[0021] The transfer platform obtains the film to be processed transferred by the loading mechanism, and drives the film to be processed to move towards the receiving platform to a preset position;

[0022] The second moving device drives the rotating and lifting device to move above the film to be processed, the rotating and lifting device drives the separating roller to descend to the surface of the film to be processed, and the second moving device drives the separating roller to roll back and forth to separate the release paper from the protective film;

[0023] The aggregate device receives the release paper, the grasping device moves towards the transfer platform, grasps the protective film onto the receiving platform, and the receiving platform performs vacuum adsorption on the protective film.

[0024] According to some embodiments of the present invention, the aggregate device includes a rotating rod, a rotating pressure rod, a telescopic plate, and a collection box. Among them, rotating plates are respectively arranged at both ends of the rotating rod, both ends of the rotating pressure rod are respectively connected to the two rotating plates, the collection box is located below the rotating rod, the telescopic plate is located between the transfer platform and the receiving platform, and the rotating rod is located between the transfer platform and the telescopic plate;

[0025] The steps of the aggregate device receiving the release paper, the grasping device moving towards the transfer platform, grasping the protective film onto the receiving platform, and the receiving platform performing vacuum adsorption on the protective film include:

[0026] The rotating plate drives the rotating pressure rod to rotate between the release paper and the protective film, presses down the release paper, and makes the release paper bypass the rotating rod;

[0027] The telescopic plate extends to be connected to the transfer platform, the rotating rod rotates, conveys the release paper into the collection box, and the transfer platform conveys the protective film onto the telescopic plate;

[0028] The grasping device moves towards the telescopic plate, grasps the protective film onto the receiving platform, and the receiving platform performs vacuum adsorption on the protective film.

[0029] According to some embodiments of the present invention, the laminating mechanism includes: a second feeding table, a first manipulator device, a third moving device, a pressing platform, a second manipulator device, and a positioning and recognition device. The first manipulator device is provided with a first clamping component and a second clamping component, the second manipulator device is provided with a rotatable adsorption component, and the pressing platform is arranged on the third moving device;

[0030] The steps of laminating the protective film on the semi-finished circuit board through the laminating mechanism include:

[0031] Place the semi-finished circuit board on the second feeding table;

[0032] The first manipulator device clamps the semi-finished circuit board to the pressing platform through the first clamping component;

[0033] The third moving device drives the pressing platform to approach the second manipulator device;

[0034] The second robotic arm device adsorbs the protective film from the separation mechanism through the adsorption assembly, positions the semi-finished circuit board on the pressing platform through the positioning and identification device, and rotates the protective film through the adsorption assembly;

[0035] The second robotic arm device presses the protective film on the adsorption assembly onto the semi-finished circuit board.

[0036] According to some embodiments of the present invention, the blanking mechanism includes a blanking platform, and the blanking platform and the second feeding platform are respectively located on both sides of the third moving device;

[0037] The step of blanking the semi-finished circuit board after film sticking through the blanking mechanism includes:

[0038] The third moving device drives the pressing platform to approach the blanking platform;

[0039] The first robotic arm device clamps the semi-finished circuit board without film sticking on the second feeding platform through the first clamping assembly, the second clamping assembly places the semi-finished circuit board on the pressing platform on the blanking platform, and at the same time, the first clamping assembly places the semi-finished circuit board without film sticking on the pressing platform.

[0040] According to some embodiments of the present invention, the punching device includes a frame, on which a lifting platform, a punching device and a third feeding platform are sequentially arranged, a first suction device is arranged above the lifting platform, a second suction device is arranged above the third feeding platform, and a positioning device is arranged on the lifting platform;

[0041] The step of punching the substrate to be punched by the punching device and dividing the substrate to be punched into multiple pre-cutting units includes:

[0042] Place the substrate to be punched on the lifting platform according to the positioning of the positioning device;

[0043] The lifting platform rises, the first suction device sucks the substrate to be punched from the lifting platform, and places the substrate to be punched on the punching device;

[0044] After the punching device performs a first punching on the first area of the substrate to be punched, the second suction device moves the substrate to be punched a first preset distance, and the punching device performs a second punching on the first area of the substrate to be punched to form a first pre-cutting unit; the second suction device moves the substrate to be punched a second preset distance, and after the punching device performs a first punching on the second area of the substrate to be punched, the second suction device moves the substrate to be punched the first preset distance, and the punching device performs a second punching on the second area of the substrate to be punched to form a second pre-cutting unit; repeating the above process to form a plurality of the pre-cutting units;

[0045] The second suction device sucks the punched substrate to be punched onto the third discharging table.

[0046] On the other hand, a circuit board manufacturing device according to an embodiment of the present invention includes at least one control processor and a memory communicatively connected to the at least one control processor; the memory stores instructions executable by the at least one control processor, and the instructions are executed by the at least one control processor to enable the at least one control processor to execute the circuit board manufacturing method described in the above embodiment.

[0047] On the other hand, an electronic device according to an embodiment of the present invention includes:

[0048] A memory for storing program instructions;

[0049] A processor for calling the program instructions stored in the memory and executing the circuit board manufacturing method of the above embodiment according to the obtained program instructions.

[0050] On the other hand, a storage medium according to an embodiment of the present invention stores computer-executable instructions for causing a computer to execute the circuit board manufacturing method described in the above embodiment.

[0051] The circuit board manufacturing method, device, electronic device, and storage medium according to an embodiment of the present invention at least have the following beneficial effects: By using an automatic film laminating device to laminate a protective film on a semi-finished circuit board, the film laminating efficiency can be improved. At the same time, by laminating the protective film first and then performing laser window opening, the window opening accuracy can be improved, avoiding the problem of low film laminating accuracy caused by the method of opening the window first and then laminating the film; By using a punching device to punch a substrate to be punched and dividing the substrate to be punched into a plurality of pre-cutting units, it is convenient to divide one substrate into a plurality of products later.

[0052] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. Brief Description of the Drawings

[0053] The above and / or additional aspects and advantages of the present invention will become apparent and be readily understood from the following description of embodiments in conjunction with the accompanying drawings, in which:

[0054] Figure 1 is a flowchart of the steps of a method for manufacturing a circuit board according to an embodiment of the present invention;

[0055] Figure 2 is a flowchart of the steps of a film pasting process according to an embodiment of the present invention;

[0056] Figure 3 is a schematic structural diagram of an automatic film pasting device according to an embodiment of the present invention;

[0057] Figure 4 is a schematic structural diagram of an automatic film pasting device from a certain perspective according to an embodiment of the present invention;

[0058] Figure 5 is a schematic structural diagram of an automatic film pasting device from a certain perspective according to an embodiment of the present invention;

[0059] Figure 6 is a schematic structural diagram of an automatic film pasting device from a certain perspective according to an embodiment of the present invention;

[0060] Figure 7 is a schematic structural diagram of a punching device according to an embodiment of the present invention;

[0061] Figure 8 is a schematic structural diagram of a substrate to be punched according to an embodiment of the present invention;

[0062] Reference numerals:

[0063] Automatic film pasting device 100, feeding mechanism 200, first material placing table 210, limiting device 211, first moving device 220, lifting and adsorbing device 230, separating mechanism 300, conveying platform 310, second moving device 320, rotating and lifting device 330, separating roller 340, collecting device 350, rotating rod 351, telescopic plate 352, rotating plate 353, material receiving platform 360, grasping device 370, laminating mechanism 400, second material placing table 410, first mechanical hand device 420, first clamping assembly 421, second clamping assembly 422, third moving device 430, pressing platform 440, second mechanical hand device 450, adsorption assembly 460, discharging mechanism 500, discharging platform 510, punching device 600, frame 610, lifting platform 620, positioning device 621, punching device 630, third material placing table 640, first suction device 650, second suction device 660, substrate to be punched 700, first area 710, second area 720, third area 730, pre-cutting unit 740, pre-cutting opening 741. Detailed implementation manners

[0064] The embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and should not be construed as a limitation to the present application. For the step numbers in the following embodiments, they are only set for the convenience of description and explanation, and no limitation is imposed on the order between the steps. The execution order of each step in the embodiments can be adaptively adjusted according to the understanding of those skilled in the art.

[0065] In the description of the present invention, it should be understood that with respect to the orientation description, such as the upper, lower, front, rear, left, right, etc., the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0066] The terms "first", "second", "third", "fourth", etc. in the specification and claims of the present invention and the accompanying drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products or devices.

[0067] Referring to "embodiment" in the present invention means that the specific features, structures or characteristics described in connection with the embodiment can be included in at least one embodiment of the present invention. The appearance of this phrase at various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0068] To meet the needs of contact and soldering of the circuit board, pads need to be provided on the circuit board. At the same time, to protect the circuit board, a protective film also needs to be covered on the circuit board. In order for the protective film not to affect the exposure of the pads, in the prior art, usually, first, according to the size of the pads, openings are made at the corresponding positions on the protective film, and then the protective film after opening is pasted on the circuit board to achieve the protection of the circuit board and the exposure of the positions of the pads. However, using this method is not applicable to some products with high precision requirements, and it is easy to have the problem that the fitting position of the protective film is not precise enough.

[0069] To this end, the embodiments of the present invention provide a method, apparatus, electronic device, and storage medium for manufacturing a circuit board. By using an automatic film laminating device to laminate a protective film on a semi-finished circuit board, the film laminating efficiency can be improved. At the same time, by laminating the protective film first and then performing laser windowing, the accuracy of windowing can be enhanced, avoiding the problem of low film laminating accuracy caused by the method of windowing first and then laminating the film. By using a punching device to punch a substrate to be punched, the substrate to be punched is divided into multiple pre-cutting units, facilitating subsequent division of one substrate into multiple products.

[0070] The following combines the attached Figure 1-8 drawings to describe in detail the method, apparatus, electronic device, and storage medium for manufacturing a circuit board according to the embodiments of the present invention.

[0071] On the one hand, the embodiments of the present invention propose a method for manufacturing a circuit board, as Figure 1 shown, the method includes the following steps:

[0072] Step S100: Obtain a semi-finished circuit board;

[0073] Step S200: Locate a protective film on the semi-finished circuit board through an automatic film laminating device 100;

[0074] Step S300: Perform laser windowing on the protective film of the semi-finished circuit board according to the pad positions of the semi-finished circuit board to expose the pads;

[0075] Step S400: Perform surface treatment on the pads to form a substrate to be punched 700;

[0076] Step S500: Punch the substrate to be punched 700 through a punching device 600 to divide the semi-finished circuit board into multiple pre-cutting units 740.

[0077] It should be noted that the semi-finished circuit board refers to a circuit board that has completed the production of circuits, pads, etc. A protective film needs to be covered on the semi-finished circuit board to protect the semi-finished circuit board.

[0078] As Figure 3 shown, in some embodiments of the present invention, the automatic film laminating device 100 includes a feeding mechanism 200, a separating mechanism 300, a laminating mechanism 400, and a discharging mechanism 500; as Figure 2 shown, the above step S200: The step of laminating a protective film on the semi-finished circuit board through the automatic film laminating device 100 includes the following four steps:

[0079] Step S210: Feed the film to be processed through the feeding mechanism 200; the film to be processed includes a release paper and a protective film provided on the surface of the release paper;

[0080] Step S220: Separate the protective film from the release paper through the separating mechanism 300, and remove the release paper.

[0081] Step S230: Bond the protective film to the semi-finished circuit board through the bonding mechanism 400.

[0082] Step S240: Unload the semi-finished circuit board after film application through the unloading mechanism 500.

[0083] It should be noted that the film to be processed is usually composed of a protective film and a release paper. The protective film is adhered to the release paper, and the release paper plays a role in fixing and protecting the protective film. When applying the protective film to the semi-finished circuit board, the release paper needs to be removed first before the protective film can be applied to the semi-finished circuit board. In the embodiments of the present invention, the automatic film application is realized through the automatic film applicator 100.

[0084] Specifically, as Figure 4 shown, in some embodiments of the present invention, the loading mechanism 200 includes a first feeding table 210, a first moving device 220, and a lifting and adsorption device 230. A limiting device 211 is provided on the first feeding table 210. The first moving device 220 is located above the first feeding table 210, and the lifting and adsorption device 230 is disposed on the first moving device 220. It should be noted that in order for the automatic film applicator 100 to realize automatic film application, the film to be processed needs to be placed on the first feeding table 210 first, and multiple films to be processed can be placed at one time. In this example, the limiting device 211 includes a plurality of limiting columns. By placing the limiting columns around the first feeding table 210, the positioning of the film to be processed can be realized, which is convenient for the lifting and adsorption device 230 to grasp the film to be processed. The first moving device 220 includes a first slide rail arranged in the front-rear direction and a sliding mechanism disposed on the first slide rail. When the sliding mechanism moves along the first slide rail, it can drive the lifting and adsorption device 230 to move back and forth. The lifting and adsorption device 230 includes a lifting assembly and a suction cup. The lifting assembly can adopt devices such as air cylinders to drive the suction cup to move up and down, and the suction cup is used to adsorb the film to be processed. In this example, the above-mentioned step S210: Loading the film to be processed through the loading mechanism 200 includes the following three steps:

[0085] (1) Place a plurality of films to be processed on the first feeding table 210, and limit the plurality of films to be processed through the limiting device 211.

[0086] (2) After the lifting and adsorption device 230 descends and adsorbs the uppermost film to be processed, the lifting and adsorption device 230 lifts and lowers multiple times to shake the adsorbed film to be processed.

[0087] (3) The first moving device 220 drives the lifting and adsorption device 230 to move, so that the lifting and adsorption device 230 transfers the adsorbed film to be processed to the separating mechanism 300.

[0088] It should be noted that after placing multiple films to be processed on the first feeding table 210, the first moving device 230 drives the lifting and adsorbing device 230 to move above the films to be processed. Then, the lifting component of the lifting and adsorbing device 230 drives the suction cup to descend, so that the suction cup adsorbs the topmost film to be processed. After that, the lifting component will drive the suction cup to rise and fall multiple times in place, thereby jittering the adsorbed film to be processed to prevent multiple films to be processed from sticking together, which may cause the suction cup to simultaneously pick up multiple films to be processed at one time. After the lifting and adsorbing device 230 adsorbs one film to be processed, the first moving device 220 drives the lifting and adsorbing device 230 to move towards the separating mechanism 300, and conveys the adsorbed film to be processed to the separating mechanism 300.

[0089] As Figure 5 shown, in some embodiments of the present invention, the separating mechanism 300 includes a conveying platform 310, a second moving device 320, a rotating and lifting device 330, a separating roller 340 with adhesiveness, an aggregate device 350, a receiving platform 360, and a movable grasping device 370. The second moving device 320 is located above the conveying platform 310, the rotating and lifting device 330 is arranged on the second moving device 320, the separating roller 340 is arranged on the rotating and lifting device 330, the aggregate device 350 is arranged between the conveying platform 310 and the receiving platform 360, and the movable grasping device 370 is located above the receiving platform 360. After the lifting and adsorbing device 230 picks up the film to be processed, it will place the film to be processed on the conveying platform 310, and the conveying platform 310 will drive the film to be processed to move towards the direction of the receiving platform 360. When the film to be processed is conveyed to the edge of the conveying platform 310, the film to be processed stops moving. At this time, the second moving device 320 drives the rotating and lifting device 330 to move above the film to be processed. Subsequently, the rotating and lifting device 330 drives the separating roller 340 to descend to the surface of the film to be processed, and the second moving device 320 drives the rotating and lifting device 330 to move back and forth, so that the separating roller 340 rolls back and forth on the surface of the film to be processed. Since the separating roller 340 has adhesiveness, the protective film can be pasted up by the separating roller 340 rolling back and forth on the surface of the film to be processed, so that the protective film is separated from the bottom release paper. Subsequently, the aggregate device 350 receives the release paper, the grasping device 370 moves towards the conveying platform 310, and grabs the protective film onto the receiving platform 360, and the receiving platform 360 performs vacuum adsorption on the protective film. In this example, the above step S220: feeding the film to be processed through the feeding mechanism 200 includes the following three steps:

[0090] (1) The conveying platform 310 obtains the film to be processed conveyed by the feeding mechanism 200, and drives the film to be processed to move towards the receiving platform 360 to a preset position;

[0091] (2) The second moving device 320 drives the rotating and lifting device 330 to move above the film to be processed. The rotating and lifting device 330 drives the separating roller 340 to descend to the surface of the film to be processed. The second moving device 320 drives the separating roller 340 to roll back and forth to separate the release paper from the protective film.

[0092] (3) The collecting device 350 receives the release paper. The gripping device 370 moves towards the conveying platform 310 and grips the protective film onto the receiving platform 360. The receiving platform 360 performs vacuum adsorption on the protective film.

[0093] It should be noted that the gripping device 370 includes a second slide rail arranged in the front-back direction and a clamping jaw arranged on the second slide rail. After the release paper and the protective film are separated, the gripping device 370 will move along the second slide rail close to the protective film. After gripping the protective film through the clamping jaw, it moves back to the receiving platform 360 and places the protective film on the receiving platform 360. The receiving platform 360 is provided with a vacuum adsorption device capable of performing vacuum adsorption on the protective film to prevent the protective film from moving.

[0094] As Figure 5 shown, in some embodiments of the present invention, the collecting device 350 includes a rotating rod 351, a rotating pressure rod (not shown in the figure), a telescopic plate 352, and a collecting frame (not shown in the figure). Among them, rotating plates 353 are respectively arranged at both ends of the rotating rod 351. Both ends of the rotating pressure rod are respectively connected to the two rotating plates. The collecting frame is located below the rotating rod. The telescopic plate 352 is located between the conveying platform 310 and the receiving platform 360. The rotating rod 351 is located between the conveying platform 310 and the telescopic plate 352. In this example, the above steps of: the collecting device 350 receives the release paper, the gripping device 370 moves towards the conveying platform 310 and grips the protective film onto the receiving platform 360, and the receiving platform 360 performs vacuum adsorption on the protective film include the following three steps:

[0095] (1) The rotating plate 353 drives the rotating pressure rod to rotate between the release paper and the protective film, presses down the release paper, and makes the release paper bypass the rotating rod 351.

[0096] (2) The telescopic plate 352 extends to be connected to the conveying platform 310. The rotating rod 351 rotates to convey the release paper into the collecting frame, and the conveying platform 310 conveys the protective film onto the telescopic plate 352.

[0097] (3) The gripping device 370 moves towards the telescopic plate 352 and grips the protective film onto the receiving platform 360. The receiving platform 360 performs vacuum adsorption on the protective film.

[0098] It should be noted that after the release paper and the protective film are separated, the rotating rod 351 will drive the rotating pressure rod to rotate counterclockwise, so that it rotates between the release paper and the protective film, pressing down the release paper so that the release paper is located between the rotating rod 351 and the rotating pressure rod. At this time, when the rotating rod 351 rotates, the release paper will be rolled below by the rotating rod 351 and finally fall into the collection box. Then, the conveying platform 310 conveys the protective film to the telescopic plate 352, and the grasping device 370 moves along the second slide rail to the telescopic plate 352, grabs the protective film through the clamping jaws, and then returns above the material receiving platform 360 and places the protective film on the material receiving platform 360.

[0099] As Figure 6 shown, in some embodiments of the present invention, the laminating mechanism 400 includes: a second feeding table 410, a first manipulator device 420, a third moving device 430, a lamination platform 440, a second manipulator device 450, and a positioning and recognition device (not shown in the figure). The first manipulator device 420 is provided with a first clamping assembly 421 and a second clamping assembly 422. The second manipulator device 450 is provided with a rotatable adsorption assembly 460. The lamination platform 440 is disposed on the third moving device 430. The blanking mechanism 500 includes a blanking platform 510. The blanking platform 510 and the second feeding table 410 are respectively located on both sides of the third moving device 430. Among them, the second feeding table 410 is used to place the semi-finished circuit board; the third moving device 430 can drive the lamination platform 440 to move in the front-rear direction. When the semi-finished circuit board is to be placed on the lamination platform 440, the third moving device 430 moves the lamination platform 440 to one end close to the second feeding table 410. Then, the first clamping assembly 421 will grab the semi-finished circuit board and move it to the lamination platform 440. Then, the third moving device 430 will move the lamination platform 440 to one end close to the second manipulator device 450. The second manipulator device 450 grabs the protective film from the material receiving platform 360 through the adsorption assembly 460. At this time, the material receiving platform 360 stops vacuum adsorption. Then, the second manipulator device 450 drives the adsorption assembly 460 to move above the lamination platform 440 and laminates the protective film on the semi-finished circuit board on the lamination platform 440 to complete the film lamination of the semi-finished circuit board. In this example, the above step S230: laminating the protective film on the semi-finished circuit board through the laminating mechanism 400 includes the following five steps:

[0100] (1) Place the semi-finished circuit board on the second feeding table 410;

[0101] (2) The first manipulator device 420 clamps the semi-finished circuit board to the lamination platform 440 through the first clamping assembly 421;

[0102] (3) The third moving device 430 drives the lamination platform 440 to approach the second manipulator device 450;

[0103] (4) The second manipulator device 450 adsorbs the protective film from the separating mechanism 300 through the adsorption assembly 460, positions the semi-finished circuit board on the pressing platform 440 through the positioning and identification device, and adjusts the position of the protective film through the adsorption assembly 460;

[0104] (5) The second manipulator device 450 presses the protective film on the adsorption assembly 460 onto the semi-finished circuit board.

[0105] It should be noted that in order to ensure the accuracy of the film pasting position, the semi-finished circuit board needs to be positioned through the positioning and identification device before film pasting; at the same time, the adsorption assembly 460 grabs the protective film from the receiving platform 360 and needs to rotate an appropriate angle to exactly paste the protective film on the circuit board.

[0106] In this example, the above-mentioned step S240: discharging the semi-finished circuit board after film pasting through the discharging mechanism 500 includes the following two steps:

[0107] (1) The third moving device 430 drives the pressing platform 440 to approach the discharging platform 510;

[0108] (2) The first manipulator device 420 clamps the semi-finished circuit board without film on the second feeding table 410 through the first clamping assembly 421, and the second clamping assembly 422 places the semi-finished circuit board on the pressing platform 440 on the discharging platform 510. At the same time, the first clamping assembly 421 places the semi-finished circuit board without film on the pressing platform 440.

[0109] It should be noted that the first manipulator device 420 is provided with the first clamping assembly 421 and the second clamping assembly 422. When the first clamping assembly 421 moves above the pressing platform 440, the second clamping assembly 422 is exactly above the discharging platform 510. Through such a setting, when the previous semi-finished circuit board finishes film pasting, the first clamping assembly 421 will grab a semi-finished circuit board without film from the second feeding table 410, and the second clamping assembly 422 will simultaneously grab the semi-finished circuit board that has completed film pasting from the pressing platform 440. Subsequently, the first clamping assembly 421 and the second clamping assembly 422 move to the left together. The first clamping assembly 421 is above the pressing platform 440 and places the semi-finished circuit board without film on the pressing platform 440, and the second clamping assembly 422 is above the discharging platform 510 and places the semi-finished circuit board with film on the discharging platform 510. Through such a setting, the feeding and discharging efficiency of the semi-finished circuit board is greatly improved, thereby improving the production efficiency.

[0110] After the film is applied to the semi-finished circuit board, in order to avoid affecting the connection between the pads of the semi-finished circuit board and external components, it is necessary to perform laser windowing on the protective film of the semi-finished circuit board according to the pad positions of the semi-finished circuit board to expose the pads. Then, it is necessary to perform surface treatment on the pads, such as nickel plating and gold plating, to protect the pads. The finally formed circuit board is the substrate 700 to be die-cut. Subsequently, it is necessary to use a die-cutting device 600 to die-cut the substrate 700 to be die-cut, and divide the substrate 700 to be die-cut into multiple pre-cutting units 740.

[0111] As Figure 7 shown, in some embodiments of the present invention, the die-cutting device 600 includes a frame 610. An elevating platform 620, a die-cutting device 630, and a third loading table 640 are sequentially arranged on the frame 610. A first suction device 650 is arranged above the elevating platform 620, and a second suction device 660 is arranged above the third loading table 640. A positioning device 621 is arranged on the elevating platform 620. Among them, the elevating platform 620 is used to place the substrate 700 to be die-cut, and position the substrate 700 to be die-cut through the positioning device 621. In this example, the positioning device 621 includes positioning pins. The substrate 700 to be die-cut is positioned by passing the positioning pins through the positioning holes (not shown in the figure) of the substrate 700 to be die-cut. After the substrate 700 to be die-cut is placed, the elevating platform 620 rises, facilitating the first suction device 650 to grab the substrate 700 to be die-cut and place it on the die-cutting device 630 for die-cutting. The second suction device 660 is used to place the die-cut substrate 700 to be die-cut on the third loading table 640. In this example, the above step S500: die-cut the substrate 700 to be die-cut through the die-cutting device 600, and divide the substrate 700 to be die-cut into multiple pre-cutting units 740, includes the following four steps:

[0112] (1) Place the substrate to be die-cut on the elevating platform 620 according to the positioning of the positioning device 621;

[0113] (2) The elevating platform 620 rises, and the first suction device 650 sucks the substrate to be die-cut from the elevating platform 620 and places it on the die-cutting device 630;

[0114] After the punching device 630 punches the first area 710 of the substrate to be punched 700 once, the second suction device 660 moves the substrate to be punched 700 by a first preset distance. Then, the punching device 630 punches the first area 710 of the substrate to be punched for the second time to form a plurality of first pre-cutting units. The second suction device 660 moves the substrate to be punched 700 by a second preset distance. After the punching device 630 punches the second area 720 of the substrate to be punched once, the second suction device 660 moves the substrate to be punched 700 by the first preset distance. Then, the punching device 630 punches the second area 720 of the substrate to be punched for the second time to form a plurality of second pre-cutting units. By repeating the above process, a plurality of pre-cutting units 740 are formed.

[0115] (4)The second suction device 660 sucks the plurality of substrates to be punched 700 after punching onto the third discharging table 640.

[0116] As Figure 8 shown, in this example, the substrate to be punched 700 is composed of a plurality of circuit units. Each circuit unit can be used as an individual product. By punching the substrate to be punched, pre-cutting openings 741 can be formed on both sides of each circuit unit, thereby forming a plurality of pre-cutting units 740, which facilitates dividing the entire substrate to be punched 700 into multiple products later. Since the area of the substrate to be punched 700 is relatively large, and the punching die of the punching device 630 can only punch a limited area each time, it is necessary to divide the substrate to be punched 700 into multiple areas, such as Figure 8As shown, in this example, the substrate 700 to be punched is divided into a first region 710, a second region 720, and a third region 730, and each region includes a plurality of circuit units. At the same time, since pre-cutting openings 741 need to be formed on both sides of each circuit unit, and the spacing between both sides of each circuit unit is relatively close, but the spacing between adjacent punching dies of the punching device 630 cannot be too close, therefore, the punching device 630 cannot cut two pre-cutting openings 741 at such a close distance simultaneously. For this reason, after the punching device 630 punches the first region 710 of the substrate 700 to be punched once, pre-cutting openings 741 will be formed on one side of each circuit unit in the first region 710. Then, the second suction device 660 moves the substrate 700 to be punched a first preset distance (the first preset distance is equal to the spacing between the pre-cutting openings on both sides of a circuit unit), so that the punching device 630 punches the first region 710 of the substrate 700 to be punched a second time, thereby forming pre-cutting openings 741 on the other side of each circuit unit in the first region 710. By punching twice, pre-cutting openings 741 are formed on both sides of each pre-cutting unit 740 in the first region 710. Subsequently, the second suction device 660 moves the substrate 700 to be punched a second preset distance (the second preset distance is equal to the spacing between adjacent regions), and the punching device 630 punches the second region 720 of the substrate 700 to be punched twice. The punching process is the same as that of the first region 710, thereby forming a plurality of second pre-cutting units; repeating the above process, a plurality of pre-cutting units are formed to complete the punching of the substrate 700 to be punched.

[0117] According to the method for manufacturing a circuit board of an embodiment of the present invention, by using the automatic film laminating device 100 to laminate a protective film on the semi-finished circuit board, the film laminating efficiency can be improved. At the same time, by laminating the protective film first and then performing laser windowing, the accuracy of windowing can be improved, and the problem of low film laminating accuracy caused by the method of windowing first and then laminating the film can be avoided; by using the punching device 600 to punch the substrate 700 to be punched, the substrate 700 to be punched is divided into a plurality of pre-cutting units 740, which is convenient for subsequently dividing one substrate into a plurality of products.

[0118] On the other hand, an embodiment of the present invention also proposes a device for manufacturing a circuit board, including:

[0119] A processor, which can be implemented by using a general-purpose central processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, etc., and is used to execute relevant programs to implement the technical solutions provided by the embodiments of the present application;

[0120] The memory can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM), etc. The memory can store an operating system and other application programs. When implementing the technical solutions provided in the embodiments of this specification through software or firmware, the relevant program codes are stored in the memory and are called by the processor to execute the manufacturing method of the circuit board in the embodiments of this application.

[0121] On the other hand, an embodiment of the present invention further provides an electronic device, including the manufacturing device of the circuit board as described above.

[0122] An embodiment of this application further provides a storage medium, which is a computer-readable storage medium. The storage medium stores a computer program, and when the computer program is executed by a processor, the manufacturing method of the above-mentioned circuit board is implemented.

[0123] As a non-transitory computer-readable storage medium, the memory can be used to store non-transitory software programs and non-transitory computer-executable programs. In addition, the memory can include a high-speed random access memory, and can also include a non-transitory memory, such as at least one magnetic disk storage device, a flash memory device, or other non-transitory solid-state storage devices. In some embodiments, the memory may optionally include a memory remotely provided with respect to the processor, and these remote memories can be connected to the processor through a network. Examples of the above-mentioned network include but are not limited to the Internet, an enterprise intranet, a local area network, a mobile communication network, and combinations thereof. The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separated, and may be located in one place, or may be distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0124] Those of ordinary skill in the art will understand that all or some of the steps and systems disclosed in the above methods can be implemented as software, firmware, hardware, and appropriate combinations thereof. Some physical components or all physical components can be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or can be implemented as hardware, or can be implemented as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, which can include a computer storage medium (or non-transitory medium) and a communication medium (or transitory medium). As is well known to those of ordinary skill in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information, such as computer-readable instructions, data structures, program modules, or other data. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to store the desired information and can be accessed by a computer. In addition, it is well known to those of ordinary skill in the art that communication media typically includes computer-readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transmission mechanism, and can include any information delivery medium.

[0125] The above is a specific description of the preferred embodiment of the present invention. However, the present invention is not limited to the above embodiments. Those skilled in the art can make various equivalent deformations or substitutions without departing from the spirit of the present invention, and these equivalent deformations or substitutions are all included within the scope defined by the claims of the present invention.

Claims

1. A method for manufacturing a circuit board, characterized in that, Including the following steps: Obtain a semi-finished circuit board; Attach a protective film to the semi-finished circuit board through an automatic film attaching device; the automatic film attaching device includes a feeding mechanism, a separating mechanism, a laminating mechanism, and a discharging mechanism; According to the pad positions of the semi-finished circuit board, perform laser windowing on the protective film of the semi-finished circuit board to expose the pads; Perform surface treatment on the pads to form a substrate to be die-cut; Die-cut the substrate to be die-cut through a die-cutting device to divide the substrate to be die-cut into multiple pre-cutting units; Among them, the step of attaching the protective film to the semi-finished circuit board through the automatic film attaching device includes: Feed the film to be processed through the feeding mechanism; the film to be processed includes a release paper and the protective film provided on the surface of the release paper; Separate the protective film from the release paper through the separating mechanism and remove the release paper; Attach the protective film to the semi-finished circuit board through the laminating mechanism; Discharge the semi-finished circuit board after film attachment through the discharging mechanism; The separating mechanism includes a conveying platform, a second moving device, a rotating and lifting device, a sticky separating roller, an aggregating device, a receiving platform, and a movable grasping device. The second moving device is located above the conveying platform, the rotating and lifting device is arranged on the second moving device, the separating roller is arranged on the rotating and lifting device, the aggregating device is arranged between the conveying platform and the receiving platform, and the grasping device is located above the receiving platform; The step of separating the protective film from the release paper through the separating mechanism and removing the release paper includes: The conveying platform obtains the film to be processed conveyed by the feeding mechanism and drives the film to be processed to move towards the receiving platform to a preset position; The second moving device drives the rotating and lifting device to move above the film to be processed, the rotating and lifting device drives the separating roller to descend to the surface of the film to be processed, and the second moving device drives the separating roller to roll back and forth to separate the release paper from the protective film; The aggregating device receives the release paper, the grasping device moves towards the conveying platform and grabs the protective film onto the receiving platform, and the receiving platform performs vacuum adsorption on the protective film.

2. The manufacturing method of the circuit board according to claim 1, wherein The feeding mechanism includes a first unwinding table, a first moving device, and a lifting and adsorbing device. A limiting device is arranged on the first unwinding table, the first moving device is located above the first unwinding table, and the lifting and adsorbing device is arranged on the first moving device. The step of feeding the film to be processed through the feeding mechanism includes: Place a plurality of the films to be processed on the first unwinding table and limit the plurality of films to be processed through the limiting device; After the lifting and adsorbing device descends and adsorbs the uppermost film to be processed, the lifting and adsorbing device lifts and lowers multiple times to shake the adsorbed film to be processed; The first mobile device drives the lifting and adsorbing device to move, so that the lifting and adsorbing device conveys the adsorbed membrane to be processed to the separation mechanism.

3. The manufacturing method of the circuit board according to claim 1, characterized in that, The aggregate device includes a rotating rod, a rotating pressure rod, a telescopic plate and a collection box. Wherein, rotating plates are respectively arranged at both ends of the rotating rod, both ends of the rotating pressure rod are respectively connected to the two rotating plates, the collection box is located below the rotating rod, the telescopic plate is located between the transfer platform and the material receiving platform, and the rotating rod is located between the transfer platform and the telescopic plate; The steps of the aggregate device receiving the release paper, the grasping device moving towards the transfer platform, and grasping the protective film to the material receiving platform, and the material receiving platform performing vacuum adsorption on the protective film include: The rotating plate drives the rotating pressure rod to rotate between the release paper and the protective film, presses down the release paper, and makes the release paper bypass the rotating rod; The telescopic plate extends to be connected with the transfer platform, the rotating rod rotates, conveys the release paper into the collection box, and the transfer platform conveys the protective film onto the telescopic plate; The grasping device moves towards the telescopic plate, grasps the protective film to the material receiving platform, and the material receiving platform performs vacuum adsorption on the protective film.

4. The manufacturing method of the circuit board according to claim 1, characterized in that The laminating mechanism includes: a second feeding table, a first manipulator device, a third mobile device, a lamination platform, a second manipulator device and a positioning and recognition device. The first manipulator device is provided with a first clamping component and a second clamping component. The second manipulator device is provided with a rotatable adsorption component. The lamination platform is arranged on the third mobile device; The steps of laminating the protective film on the semi-finished circuit board through the laminating mechanism include: Placing the semi-finished circuit board on the second feeding table; The first manipulator device clamps the semi-finished circuit board to the lamination platform through the first clamping component; The third mobile device drives the lamination platform to approach the second manipulator device; The second manipulator device adsorbs the protective film from the separation mechanism through the adsorption component, positions the semi-finished circuit board on the lamination platform through the positioning and recognition device, and rotates the protective film through the adsorption component; The second manipulator device presses the protective film on the adsorption component onto the semi-finished circuit board.

5. The manufacturing method of the circuit board according to claim 4, characterized in that, The blanking mechanism includes a blanking platform, and the blanking platform and the second feeding table are respectively located on both sides of the third mobile device; The steps of blanking the semi-finished circuit board after film laminating through the blanking mechanism include: The third mobile device drives the lamination platform to approach the blanking platform; The first manipulator device clamps the semi-finished circuit board without film laminating on the second feeding table through the first clamping component, and the second clamping component places the semi-finished circuit board on the lamination platform on the blanking platform. At the same time, the first clamping component places the semi-finished circuit board without film laminating on the lamination platform.

6. The manufacturing method of the circuit board according to claim 1, characterized in that, The punching device includes a frame, on which a lifting platform, a punching device and a third feeding table are sequentially arranged. A first suction device is arranged above the lifting platform, a second suction device is arranged above the third feeding table, and a positioning device is arranged on the lifting platform; The step of punching the substrate to be punched by the punching device and dividing the substrate to be punched into a plurality of pre-cutting units includes: Placing the substrate to be punched on the lifting platform according to the positioning of the positioning device; The lifting platform rises, and the first suction device sucks the substrate to be punched from the lifting platform and places the substrate to be punched on the punching device; After the punching device performs a first punching on the first area of the substrate to be punched, the second suction device moves the substrate to be punched a first preset distance, and the punching device performs a second punching on the first area of the substrate to be punched to form a first pre-cutting unit; the second suction device moves the substrate to be punched a second preset distance, and after the punching device performs a first punching on the second area of the substrate to be punched, the second suction device moves the substrate to be punched the first preset distance, and the punching device performs a second punching on the second area of the substrate to be punched to form a second pre-cutting unit; repeating the above process to form a plurality of the pre-cutting units; The second suction device sucks the substrate to be punched after punching to the third feeding table.

7. A manufacturing device for a circuit board, characterized in that, It includes at least one control processor and a memory for communicating with the at least one control processor; the memory stores instructions executable by the at least one control processor, and the instructions are executed by the at least one control processor so that the at least one control processor can execute the method for manufacturing a circuit board according to any one of claims 1 to 6.

8. An electronic device, characterized in that, It includes the device for manufacturing a circuit board according to claim 7.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions for causing a computer to execute the method for manufacturing a circuit board according to any one of claims 1 to 6.

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