Electronic device

Abstract

The invention discloses an electronic device. The electronic device comprises a substrate, a packaging part, a first sensing chip and a second sensing chip, the substrate is provided with an internal space and a first through hole communicated with the internal space. The package is disposed on the substrate and forms a front cavity and a back cavity together with the substrate. The package has an opening. The front cavity is communicated with outside air through the open hole. The internal space forms at least one part of the back cavity, and the back cavity is communicated with the front cavity through the first through hole. The first sensing chip is arranged on the substrate and covers the first through hole, so that airflow in the front cavity and airflow in the back cavity are separated. The second sensing chip is arranged on the substrate and located in the back cavity.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic devices, and in particular to an electronic device. Background Art

[0002] In electronic devices, two sensor chips are often formed into two independent packages (with their own packages and substrates, etc.), and the environmental conditions to be sensed (such as sound, air pressure, temperature, etc.) are detected through openings that are directly connected to the outside air. However, since a certain distance needs to be maintained between the two packages during assembly, the volume adjustment flexibility of the electronic device is relatively small. Summary of the invention

[0003] In order to overcome the shortcomings of the prior art, one of the objectives of the present invention is to provide an electronic device that can improve the volume adjustment flexibility of the electronic device while having better sensing sensitivity.

[0004] One of the purposes of the present invention is achieved by the following technical solution:

[0005] An electronic device includes a substrate, a package, a first sensing chip and a second sensing chip. The substrate has an internal space and a first through hole connected to the internal space. The package is arranged on the substrate and forms a front cavity and a back cavity together with the substrate. The package has an opening. The front cavity is connected to the outside air through the opening. The internal space constitutes at least a part of the back cavity, and the back cavity is connected to the front cavity through the first through hole. The first sensing chip is arranged on the substrate and covers the first through hole to separate the airflow in the front cavity and the airflow in the back cavity. The second sensing chip is arranged on the substrate and is located in the back cavity.

[0006] In one embodiment of the present invention, the first sensor chip includes a diaphragm and an air leakage hole formed on the diaphragm.

[0007] In one embodiment of the present invention, the back cavity is a closed cavity, and the air in the back cavity flows only through the air leakage holes.

[0008] In one embodiment of the present invention, the internal space is formed by a top portion, a bottom portion, and a connecting portion connecting the top portion and the bottom portion of the substrate.

[0009] In one embodiment of the present invention, the electronic device further includes a reinforcement structure disposed in the internal space, and two ends of the reinforcement structure are in direct contact with the top and the bottom respectively.

[0010] In one embodiment of the present invention, the reinforcement structure includes a conductive material, so that the first sensor chip and / or the second sensor chip is electrically connected to the bottom via the top and the reinforcement structure.

[0011] In one embodiment of the present invention, the substrate further includes a solder pad disposed on the bottom and located at an opposite side of the reinforcement structure, and an orthographic projection of the reinforcement structure on the bottom overlaps with an orthographic projection of the solder pad on the bottom.

[0012] In one embodiment of the present invention, the opposite sides do not have any openings.

[0013] In one embodiment of the present invention, the reinforcement structure includes at least one internal reinforcement member disposed in the central area of ​​the internal space.

[0014] In one embodiment of the present invention, the reinforcement structure includes at least one edge reinforcement member disposed in a peripheral area of ​​the internal space and in direct contact with the connecting portion.

[0015] In one embodiment of the present invention, the first sensing chip and the second sensing chip are located on two opposite sides of the top.

[0016] In an embodiment of the present invention, the packaging component is made of metal.

[0017] In one embodiment of the present invention, the second sensing chip includes an environment sensing component to sense air conditions from the external environment.

[0018] In one embodiment of the present invention, the environment sensing component senses the air from the outside entering the back cavity through the front cavity.

[0019] In one embodiment of the present invention, the package comprises a partition wall and a cover body, wherein the partition wall is disposed on the substrate and separates different cavities, and the cover body is disposed on the partition wall.

[0020] In one embodiment of the present invention, the back cavity body includes a first back cavity body and a second back cavity body. The first back cavity body is formed in the inner space of the substrate, and the second back cavity body is formed in the space defined by the partition wall, the cover body and the substrate.

[0021] In one embodiment of the present invention, the first sensing chip and the second sensing chip are arranged in a horizontal direction, and the second sensing chip is located in the second back cavity.

[0022] In one embodiment of the present invention, the substrate comprises a second through hole. The second through hole is offset from the second sensing chip so that the first back cavity body and the second back cavity body are in air communication.

[0023] In one embodiment of the present invention, the orthographic projection of the first back cavity on the substrate overlaps with the orthographic projections of the front cavity and the second back cavity on the substrate.

[0024] The beneficial effects of the present invention are:

[0025] Based on the above, in the structural design of the electronic device of the present invention, at least two sensing chips can be placed in a single packaging body, and the flow path of the outside air can be controlled so that the outside air flows into the front cavity through the opening, and then flows into the back cavity through the sensing chip arranged therein. Therefore, the outside air can be sensed by another sensing chip in the back cavity. In this way, it can improve the volume adjustment flexibility of the electronic device while having better sensing sensitivity.

[0026] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following specifically cites a preferred embodiment and describes it in detail with the accompanying drawings as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a schematic top view of an electronic device according to an embodiment of the present invention;

[0028] Figure 2 is along Figure 1 A schematic cross-sectional view of line A-A' in FIG.

[0029] Figure 3 is a schematic top view of an electronic device according to another embodiment of the present invention;

[0030] Figure 4 is along Figure 3 Schematic cross-sectional view of line BB'.

[0031] In the figure:

[0032] 10, 20: adhesive layer;

[0033] 100, 100A: electronic device;

[0034] 110: substrate;

[0035] 110t: top;

[0036] 110b: bottom;

[0037] 110c: connecting part;

[0038] 111: Internal space;

[0039] 112, 113: through hole;

[0040] 114: welding pad;

[0041] 120: packaging;

[0042] 121: opening;

[0043] 122: Partition wall;

[0044] 123: cover;

[0045] 130, 140: sensing chip;

[0046] 131: diaphragm;

[0047] 131a: vent hole;

[0048] 132: back panel;

[0049] 150: Reinforcement structure;

[0050] 151: internal reinforcement;

[0051] 152: Edge reinforcement;

[0052] 160: Processing chip;

[0053] 161: insulation layer;

[0054] 162: Internal circuit structure;

[0055] AIR: outside air;

[0056] BC, BC1, BC2: dorsal cavity;

[0057] FC: front cavity;

[0058] D: Horizontal direction. DETAILED DESCRIPTION

[0059] Directional terms used herein (eg, up, down, right, left, front, back, top, bottom) are used only with reference to the drawings and are not intended to imply an absolute orientation.

[0060] The present invention is more fully described with reference to the drawings of the present embodiment. However, the present invention may be embodied in various forms and should not be limited to the embodiments described herein. The thickness, size or size of the layers or regions in the drawings may be exaggerated for clarity. The same or similar reference numbers represent the same or similar components, and the following paragraphs will not be repeated one by one. In addition, the description of well-known components, methods and materials may be omitted so as not to obscure the description of the various principles of the present invention.

[0061] It should be understood that although the terms "first", "second", etc. may be used herein to describe various components, parts, regions, layers and / or portions, these components, parts, regions, and / or portions should not be limited by these terms. These terms are only used to distinguish one component, part, region, layer or portion from another component, part, region, layer or portion.

[0062] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

[0063] Figure 1 is a schematic top view of an electronic device according to an embodiment of the present invention. Figure 2 is along Figure 1 Schematic diagram of the line A-A' surface in.

[0064] Please refer to Figure 1 and Figure 2 The electronic device 100 of this embodiment at least includes a substrate 110, a package 120, a first sensing chip 130, and a second sensing chip 140, wherein the substrate 110 has an internal space 111 and a first through hole 112 communicating with the internal space 111. Here, the internal space 111 is, for example, formed by a top 110t, a bottom 110b, and a connecting portion 110c connecting the top 110t and the bottom 110b of the substrate 110. In other words, the internal space 111 may be surrounded by the top 110t, the bottom 110b, and the connecting portion 110c of the substrate 110.

[0065] In addition, the package 120 is disposed on the substrate 110 and forms a front cavity FC and a back cavity BC together with the substrate 110, and the package 120 has an opening 121 so that the front cavity FC is connected to the outside air AIR through the opening 121, wherein the internal space 111 constitutes at least a part of the back cavity BC, and the back cavity BC is connected to the front cavity FC through the first through hole 112.

[0066] Furthermore, the first sensing chip 130 is disposed on the substrate 110 and covers the first through hole 112 to separate the airflow in the front cavity FC and the airflow in the back cavity BC, and the second sensing chip 140 is disposed on the substrate 110 and located in the back cavity BC. Accordingly, in the structural design of the electronic device 100 of this embodiment, at least two sensing chips (the first sensing chip 130 and the second sensing chip 140) can be placed in a single package, and the flow path of the outside air AIR can be controlled (such as Figure 2 The aforementioned outside air AIR flows into the front cavity FC through the opening 121, and then flows into the back cavity BC through the sensing chip (the first sensing chip 130) disposed therein. Therefore, the outside air AIR can be sensed by another sensing chip (the second sensing chip 140) in the back cavity BC. In this way, it can enhance the volume adjustment flexibility of the electronic device 100 while having better sensing sensitivity.

[0067] Furthermore, the first sensing chip 130 includes a diaphragm 131 and an air leakage hole 131a formed on the diaphragm 131, so that the air in the back cavity BC can flow only through the air leakage hole 131a. In other words, the air in the back cavity BC is indirectly connected to the outside air AIR rather than directly connected to the outside air AIR, but the present invention is not limited to this.

[0068] On the other hand, since the size of the back cavity BC directly affects the sensitivity of the sensing, in the structural design of this embodiment, the package 120 has a partition wall 122 and a cover 123, wherein the partition wall 122 is disposed on the substrate 110 and separates different cavities (such as Figure 2 As shown, the partition wall 122 located in the middle area separates the front cavity FC and the back cavity BC, so that the back cavity BC is a closed cavity), and the cover body 123 is disposed on the partition wall 122. In this way, the back cavity BC can include a first back cavity BC1 and a second back cavity BC2.

[0069] In addition, the substrate 110 may include a second through hole 113, and the first back cavity BC1 is formed in the inner space 111 of the substrate 110, and the second back cavity BC2 is formed in the space defined by the partition wall 122, the cover 123 and the substrate 110, and the second through hole 113 is staggered at the second sensing chip 140 (such as Figure 1 and Figure 2 As shown, Figure 2 The second through hole 113 is located at the rear of the figure instead of directly below the second sensing chip 140), so that the first back cavity BC1 and the second back cavity BC2 are connected by air. In this way, the back cavity BC can be maximized and the sensing sensitivity can be significantly improved to have a better signal-to-noise ratio (SNR), but the present invention is not limited to this.

[0070] In the present embodiment, the orthographic projection of the first back cavity BC1 on the substrate 110 overlaps with the orthographic projections of the front cavity FC and the second back cavity BC2 on the substrate 110, and the first sensing chip 130 and the second sensing chip 140 are arranged in the horizontal direction D, and the second sensing chip 140 is located in the second back cavity BC2, but the present invention is not limited to this.

[0071] In some embodiments, the first sensing chip 130 may be a microphone component to sense the pressure change caused by external sound wave vibration, and the second sensing chip 140 may include an environmental sensing component to sense the air condition from the external environment (such as the air from the outside entering the back cavity BC through the front cavity FC). For example, the second sensing chip 140 may be a pressure sensing component (the interior may be in a vacuum state) to sense the pressure change caused by the external air AIR flowing into the back cavity BC, but the present invention is not limited to this. In other embodiments, it may be a second sensing chip with other sensing functions, such as temperature sensing function. Here, the electronic device 100 is, for example, a sports watch or other suitable electronic device. In addition, when the first sensing chip 130 is a microphone component, the electronic device 100 further includes a processing chip 160, wherein the processing chip 160 may be an application specific integrated circuit (ASIC) to receive and process the signal measured by the microphone component.

[0072] Furthermore, when the second sensing chip 140 is a pressure sensing component, it may have a component similar to the diaphragm 131 (not shown) to obtain the required physical quantity by deforming the diaphragm with pressure. When the second sensing chip 140 is a temperature sensing component, it may not have a component similar to the diaphragm 131. Therefore, the specific design of the second sensing chip 140 can be determined according to the physical quantity to be sensed, and the present invention is not limited to this.

[0073] In some embodiments, the first sensing chip 130, the processing chip 160 and the second sensing chip 140 can be disposed on the substrate 110 by means of an adhesive layer 10 (such as adhesive glue or any other suitable chip adhesive material), and the partition wall 122 can also be bonded to the cover body 123 using an adhesive layer 20, but the present invention is not limited thereto.

[0074] In some embodiments, the substrate 110 may be a circuit substrate. For example, the substrate 110 may be a printed circuit board (PCB), and the processing chip 160 may be disposed adjacent to the first sensing chip 130, so that the top pad of the first sensing chip 130 is electrically connected to the processing chip 160 by wire bonding, the top pad of the processing chip 160 is electrically connected to the top pad of the substrate 110 by wire bonding, and the top pad of the second sensing chip 140 is electrically connected to the substrate 110 by wire bonding, that is, the first sensing chip 130 and the second sensing chip 140 are both electrically connected to the same substrate 110. In this way, the thickness of the substrate 110 may be effectively reduced while satisfying the length of the circuit layout. However, the present invention is not limited thereto. The processing chip 160, the first sensing chip 130 and the second sensing chip 140 may be configured and connected according to actual design requirements.

[0075] In addition, the processing chip 160 may further include an insulating layer 161 and an inner circuit structure 162, wherein the insulating layer 161 covers the aforementioned bonding wires, and the inner circuit structure 162 is electrically connected to the aforementioned bonding wires. Here, the insulating layer 161 and the inner circuit structure 162 may be any suitable components applied to the processing chip 160, and the present invention is not limited thereto.

[0076] In some embodiments, in order to improve the structural rigidity of the substrate 110, the substrate 110 further includes a reinforcement structure 150 disposed in the internal space 111, wherein the two ends of the reinforcement structure 150 are directly in contact with the top 110t and the bottom 110b respectively, so that the stress acting on the substrate 110 can be effectively dispersed to improve the reliability of the electronic device 100, but the present invention is not limited thereto. Here, the present invention does not limit the size of the reinforcement structure 150, which can be determined according to actual design requirements.

[0077] In some embodiments, the substrate 110 further includes a pad 114 disposed on the bottom 110 b and located on the opposite side of the reinforcement structure 150 . Figure 2 As shown, under the structural design of the present invention, the opening 121 connected to the outside air AIR and the pad 114 are located on opposite sides of the package body, so the probability of pollutants (such as tin splashing) from the pad 114 entering the opening 121 and affecting the performance of the electronic device 100 can be reduced, and the processing is easy, but the present invention is not limited thereto. Here, the pad 114 can be an electrode.

[0078] In some embodiments, there is no opening on the opposite side of the bottom 110 b , that is, the external air AIR cannot enter the electronic device 100 from the bottom 110 b of the substrate 110 , but the present invention is not limited thereto.

[0079] In some embodiments, the reinforcement structure 150 includes at least one internal reinforcement member 151 and / or at least one edge reinforcement member 152, wherein the internal reinforcement member 151 is disposed in the central area of ​​the internal space 111, and the edge reinforcement member 152 is disposed in the peripheral area of ​​the internal space 111 and is in direct contact with the connecting portion 110c. In this way, the entire electronic device 100 can be effectively provided with supporting rigidity, but the present invention is not limited to this.

[0080] In some embodiments, the reinforcement structure 150 is disposed adjacent to the processing chip 160 , the first sensing chip 130 , and the second sensing chip 140 , such as directly below them, to more securely support the processing chip 160 , the first sensing chip 130 , and the second sensing chip 140 , but the invention is not limited thereto.

[0081] In some embodiments, a computer simulation system may be used to analyze the rigidity distribution of the overall structure of the electronic device 100 to obtain a better location for the reinforcement structure 150 , but the present invention is not limited thereto.

[0082] In some embodiments, the long side reinforcement structure 150 of the electronic device 100 may be disposed at the long side of the electronic device 100 to reduce the probability of deformation of the long side, but the present invention is not limited thereto.

[0083] In some embodiments, the reinforcement structure 150 includes a conductive material, so that the first sensor chip 130 and / or the second sensor chip 140 are electrically connected to the bottom 110b through the top 110t and the reinforcement structure 150, so as to shorten the conductive path. In addition, when the pad 114 is solder paste, a high temperature process such as reflow is required, so the position where the pad 114 is located will be subjected to greater stress, which is prone to warping, thereby reducing the sensitivity of the product. Therefore, in this embodiment, the orthographic projection of the reinforcement structure 150, which is a conductive member, on the bottom 110b overlaps with the orthographic projection of the pad 114 on the bottom 110b. In this way, in addition to shortening the conductive path, the stress at the position where the pad 114 is located can also be effectively dispersed, but the present invention is not limited thereto. In other embodiments, the reinforcement structure 150 can be an electrically insulating material, so that the first sensor chip 130 and / or the second sensor chip 140 are electrically connected to the bottom 110b through the top 110t and the connecting portion 110c.

[0084] In some embodiments, the package 120 is made of metal, for example, to have an electromagnetic shielding function. For example, the material of the partition wall 122 includes stainless steel or brass, and the material of the cover 123 includes stainless steel or copper, but the present invention is not limited thereto.

[0085] In some embodiments, the material of the diaphragm 131 includes plastic (eg, polytetrafluoroethylene (PTFE), polyethylene (PE), polyimide (PI), or polyetheretherketone (PEEK)).

[0086] In some embodiments, the first sensor chip 130 further includes a back plate 132 having a plurality of through holes, wherein the back plate 132 can be made of a suitable insulating material, which is not limited in the present invention.

[0087] It should be noted that each of the above components can be replaced by any other suitable materials. In addition, the above film layers and components can be formed and mutually configured (such as providing a substrate, placing a sensor chip thereon, and then encapsulating it with a package, etc.) using any suitable process (such as a through hole can be formed using a drilling process), and the present invention is not limited thereto.

[0088] It must be noted here that the following embodiments continue to use the component numbers and some contents of the above-mentioned embodiments, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical content is omitted. For the description of the omitted parts, please refer to the above-mentioned embodiments, and the following embodiments will not be repeated.

[0089] Figure 3 is a schematic top view of an electronic device according to another embodiment of the present invention. Figure 4 is along Figure 3 Schematic cross-sectional view of line BB'.

[0090] Please refer to Figure 3 and Figure 4 , compared to Figure 1 and Figure 2 For the electronic device 100A, the first sensor chip 130 and the second sensor chip 140 of the electronic device 100A are located on opposite sides of the top 110t to reduce the lateral volume. Further, the orthographic projection of the second sensor chip 140 on the substrate 110 can overlap with the orthographic projection of the first sensor chip 130 on the substrate 110 and / or the orthographic projection of the processing chip 160 on the substrate 110. In addition, the electronic device 100A may not have a Figure 2 The first back cavity body BC1 and the second back cavity body BC2 are separated by the second through hole 113 , that is, in this embodiment, the substrate 110 only has the first through hole 112 but not the second through hole, but the present invention is not limited thereto.

[0091] In this embodiment, the partition wall 122 may be bonded to the substrate 110 via the adhesive layer 20 , but the invention is not limited thereto.

[0092] In summary, the structural design of the electronic device of the present invention can accommodate at least two sensing chips in a single package, and can control the flow path of the outside air so that the outside air flows into the front cavity through the opening, and then flows into the back cavity through the sensing chip disposed therein. Therefore, the outside air can be sensed by another sensing chip in the back cavity. In this way, it can enhance the volume adjustment flexibility of the electronic device while having better sensing sensitivity.

[0093] Although the present invention has been disclosed as above by way of embodiments, it is not intended to limit the present invention. Any person having ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the attached patent application.

Claims

1. An electronic device, characterized in that: include: The substrate has an internal space and a first through hole communicating with the internal space; A packaging component is disposed on the substrate and forms a front cavity and a back cavity together with the substrate, wherein the packaging component has an opening, the front cavity is connected to the outside air through the opening, the internal space constitutes at least a part of the back cavity, and the back cavity is connected to the front cavity through the first through hole; A first sensing chip is disposed on the substrate and covers the first through hole to separate the airflow in the front cavity and the airflow in the back cavity; as well as The second sensing chip is disposed on the substrate and located in the back cavity.

2. The electronic device according to claim 1, wherein: The first sensing chip includes a diaphragm and an air leakage hole formed on the diaphragm.

3. The electronic device according to claim 2, wherein: The back cavity is a closed cavity, and the air in the back cavity flows only through the air leakage holes.

4. The electronic device according to claim 1, wherein: The internal space is formed by the top and bottom of the substrate and a connecting portion connecting the top and the bottom.

5. The electronic device as claimed in claim 4, characterized in that: It further includes a reinforcement structure disposed in the internal space, wherein two ends of the reinforcement structure are in direct contact with the top and the bottom respectively.

6. The electronic device as claimed in claim 5, characterized in that: The reinforcement structure includes a conductive material, so that the first sensing chip and / or the second sensing chip is electrically connected to the bottom through the top and the reinforcement structure.

7. The electronic device according to claim 6, wherein: The substrate further includes a welding pad disposed on the bottom and located at an opposite side of the reinforcement structure, and an orthographic projection of the reinforcement structure on the bottom overlaps with an orthographic projection of the welding pad on the bottom.

8. The electronic device as claimed in claim 7, characterized in that: The opposite side does not have any openings thereon.

9. The electronic device as claimed in claim 5, characterized in that: The reinforcement structure includes at least one internal reinforcement member disposed in the central area of ​​the internal space.

10. The electronic device as claimed in claim 5, characterized in that: The reinforcement structure includes at least one edge reinforcement piece, which is arranged in the peripheral area of ​​the inner space and directly contacts with the connecting portion.

11. The electronic device as claimed in claim 4, characterized in that: The first sensing chip and the second sensing chip are located on two opposite sides of the top.

12. The electronic device as claimed in claim 1, wherein: The packaging component is made of metal.

13. The electronic device as claimed in claim 1, wherein: The second sensing chip includes an environment sensing component for sensing air conditions from the external environment.

14. The electronic device according to claim 13, wherein: The environment sensing component senses the air from the outside entering the back cavity through the front cavity.

15. The electronic device as claimed in claim 1, wherein: The packaging component has a partition wall and a cover body. The partition wall is arranged on the substrate and separates different cavities. The cover body is arranged on the partition wall.

16. The electronic device as claimed in claim 15, characterized in that: The back cavity body includes a first back cavity body and a second back cavity body. The first back cavity body is formed in the internal space of the substrate, and the second back cavity body is formed in a space defined by the partition wall, the cover body, and the substrate.

17. The electronic device according to claim 16, wherein: The first sensing chip and the second sensing chip are arranged in a horizontal direction, and the second sensing chip is located in the second back cavity.

18. The electronic device as claimed in claim 16, wherein: The substrate includes a second through hole, and the second through hole is offset from the second sensing chip so that the first back cavity body and the second back cavity body are in air communication.

19. The electronic device according to claim 16, wherein: The orthographic projection of the first back cavity on the substrate overlaps with the orthographic projections of the front cavity and the second back cavity on the substrate.

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