Display panel, manufacturing method thereof and display device

Abstract

The invention provides a display panel, a manufacturing method thereof and a display device, and belongs to the technical field of display. The display panel comprises a hole opening area, an isolation area arranged around the hole opening area and a display area arranged around the isolation area, and the display panel further comprises a substrate; the light-emitting devices are located on the substrate of the display area, and organic light-emitting functional layers in the light-emitting devices extend to the isolation areas; the at least one isolation column is located on the substrate of the isolation area, the isolation column is arranged around the opening area, and the organic light-emitting functional layer extending to the isolation area is separated at the position of the isolation column; the packaging layer covers the multiple light-emitting devices, and an inorganic layer in the packaging layer extends to the isolation region and covers the isolation columns and the organic light-emitting functional layer; wherein at least one part of the side surface of the isolation column is coated with an insulating layer. According to the technical scheme, the packaging effect of the display panel can be improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] In the field of OLED (Organic Light Emitting Diode), in order to ensure the working life and luminous stability of EL (Electro-Luminescence) materials, usually after the EL organic light-emitting film layer is completed, a packaging layer is deposited or coated for packaging, and a multi-layer packaging method is used to ensure its packaging characteristics, thereby ensuring the reliability of the product and also extending the water vapor intrusion path.

[0003] Some OLED display products use an AA Hole design, that is, a hole is made in the AA area (Active Area) and sensors such as cameras are placed under the hole in the AA area. In addition, isolation columns are set around the hole to separate the EL material in the horizontal direction to prevent the EL material film from becoming a channel for water vapor to intrude, causing display defects such as growing dark spots (GDS) in the AA area. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a display panel and a manufacturing method thereof, and a display device, which can improve the packaging effect of the display panel.

[0005] To solve the above technical problems, the embodiments of the present invention provide the following technical solutions:

[0006] In one aspect, a display panel is provided, comprising: an opening area, an isolation area arranged around the opening area, and a display area arranged around the isolation area, the display panel further comprising:

[0007] substrate substrate;

[0008] A plurality of light-emitting devices are located on the base substrate of the display area, and the organic light-emitting functional layers in the light-emitting devices extend to the isolation area;

[0009] At least one isolation column is located on the base substrate of the isolation region, the isolation column is arranged around the opening region, and the organic light-emitting functional layer extending to the isolation region is isolated at the position of the isolation column;

[0010] An encapsulation layer, covering the plurality of light-emitting devices, wherein the inorganic layer in the encapsulation layer extends to the isolation region, covering the isolation column and the organic light-emitting functional layer;

[0011] Wherein, at least a portion of the side surface of the isolation column is covered with an insulating layer.

[0012] In some embodiments, the insulating layer is made of organic resin, or the insulating layer is made of inorganic insulating layer.

[0013] In some embodiments, along a direction away from the base substrate, the isolation column includes a first metal pattern and a second metal pattern stacked together, and an orthographic projection of the second metal pattern on the base substrate is located within an orthographic projection of the first metal pattern on the base substrate;

[0014] The insulating layer covers all side surfaces of the isolation column. The central area of ​​the isolation column away from the substrate is not covered by the insulating layer, forming a groove that penetrates the second metal pattern. The inner size of the groove is larger than the size of the opening.

[0015] In some embodiments, along a direction away from the base substrate, the isolation column includes a first metal pattern, a second metal pattern, and a third metal pattern that are stacked, the orthographic projection of the second metal pattern on the base substrate is located within the orthographic projection of the first metal pattern on the base substrate, and the orthographic projection of the second metal pattern on the base substrate is located within the orthographic projection of the third metal pattern on the base substrate;

[0016] The insulating layer covers a portion of the side surface of the isolation column, and another portion of the side surface of the isolation column is formed with a notch.

[0017] An embodiment of the present invention further provides a display device, comprising the display panel as described above.

[0018] An embodiment of the present invention further provides a method for manufacturing a display panel, comprising:

[0019] Providing a base substrate, the base substrate comprising an opening area, an isolation area arranged around the opening area, and a display area arranged around the isolation area;

[0020] At least one isolation column is formed in the isolation area of ​​the base substrate and a plurality of light-emitting devices are formed in the display area of ​​the base substrate, wherein the isolation column is arranged around the opening area, and the organic light-emitting functional layer in the light-emitting device extends to the isolation area and is isolated at the position of the isolation column;

[0021] Forming an encapsulation layer covering the plurality of light-emitting devices, wherein the inorganic layer in the encapsulation layer extends to the isolation region and covers the isolation column and the organic light-emitting functional layer;

[0022] The production method further comprises:

[0023] An insulating layer is formed to cover at least a portion of the side surface of the isolation column.

[0024] In some embodiments, forming the isolation column includes:

[0025] forming a first transition structure in the isolation region of the substrate, wherein the first transition structure comprises a first metal film layer, a second metal film layer and a third metal film layer stacked in sequence;

[0026] forming an insulating layer covering the first transition structure;

[0027] After forming the pattern of the pixel definition layer of the display panel, etching the insulating layer to expose a portion of the side surface of the first transition structure;

[0028] The exposed side surface of the first transition structure is etched to form a notch on the side surface of the first transition structure.

[0029] In some embodiments, the insulating layer is made of organic resin.

[0030] In some embodiments, forming the isolation column includes:

[0031] forming a first transition structure in the isolation region of the substrate, wherein the first transition structure comprises a first metal film layer, a second metal film layer and a third metal film layer stacked in sequence;

[0032] removing the third metal film layer to form a second transition structure;

[0033] forming an insulating layer covering the second transition structure;

[0034] After forming the pattern of the pixel defining layer of the display panel, etching the insulating layer to expose the central area of ​​the second transition structure away from the surface of the substrate;

[0035] The central area is etched to form a groove penetrating the second metal pattern, wherein the inner dimension of the groove is larger than the dimension of the opening.

[0036] In some embodiments, the insulating layer is an inorganic insulating layer.

[0037] The embodiments of the present invention have the following beneficial effects:

[0038] In the above solution, at least a part of the side surface of the isolation column is covered with an insulating layer, which can ensure the isolation effect of the isolation column, achieve the power-off effect of the isolation column, and solve the problem of non-power-off packaging failure. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 A schematic diagram of residual photoresist at an isolation column in the related art;

[0040] Figure 2 A schematic diagram of the existence of silver particles at the isolation column in the related art;

[0041] Figure 3 A schematic diagram of a metal sharp corner appearing at an isolation column in the related art;

[0042] Figure 4 A schematic diagram of the existence of silver particles at the undercut position of the isolation column in the related art;

[0043] Figure 5 A schematic diagram of a related art isolation column undercutting too deeply;

[0044] Figure 6 It is a schematic diagram of the structure of a display panel according to an embodiment of the present invention;

[0045] Figure 7-Figure 18 A schematic diagram of manufacturing a display panel according to an embodiment of the present invention.

[0046] Reference numerals

[0047] 01Substrate

[0048] 02 Buffer layer

[0049] 03First gate insulation layer

[0050] 04Second gate insulation layer

[0051] 05Interlayer insulation layer

[0052] 06 Flat layer

[0053] 07Pixel Defining Layer

[0054] 08 Active layer

[0055] 09First gate metal layer

[0056] 10 Second gate metal layer

[0057] 11First source and drain metal layer

[0058] 12 Anode

[0059] 13 Isolation Column

[0060] 14 Insulation layer

[0061] 20Display substrate

[0062] 21 First metal film layer

[0063] 211 First Metal Graphics

[0064] 22 Second metal film layer

[0065] 221 Second Metal Graphics

[0066] 23 Third metal film layer

[0067] 231 Third Metal Graphics

[0068] 24, 26 insulation layer

[0069] 25 Photoresist DETAILED DESCRIPTION

[0070] In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention more clear, a detailed description will be given below with reference to the accompanying drawings and specific embodiments.

[0071] The OLED display panel includes a substrate and a buffer layer, an active layer, a first gate insulating layer, a first gate metal layer, a second gate insulating layer, a second gate metal layer, an interlayer insulating layer, a first source-drain metal layer, a passivation layer, a second source-drain metal layer, a flat layer, an anode, a pixel defining layer and other film layers located on the substrate. In the related art, the first source-drain metal layer or the second source-drain metal layer is used to make the isolation column, but the isolation column is conductive, so the display panel has the problem of failure of uninterrupted packaging.

[0072] In the related art, the second source-drain metal layer can be used to make the isolation column. After the second source-drain metal layer is used to make the isolation column, the anode and the pixel defining layer need to be made. When making the anode, Figure 1 As shown, it is necessary to coat photoresist on the substrate. Due to the undercut structure at the isolation column, the photoresist at the isolation column is not easy to remove, and photoresist is likely to remain at the isolation column, resulting in poor isolation effect of the isolation column on the organic light-emitting functional layer. In addition, the photoresist is an organic material and can form a water-oxygen channel, affecting the packaging effect.

[0073] In the related art, the anode is made of ITO / Ag / ITO, and the second source and drain metal layer is made of Ti / Al / Ti, that is, the isolation column adopts the structure of Ti / Al / Ti. When the anode is wet-etched, silver ions will enter the etching solution, and the silver ions in the etching solution will be replaced with Al in the isolation column. Figure 2 As shown, silver particles are replaced in the isolation column, and the silver particles are easily connected to the cathode of the light-emitting device, resulting in dark spot defects.

[0074] In the related art, the first source-drain metal layer may be used to make the isolation column. After the first source-drain metal layer is used to make the isolation column, when the second source-drain metal layer is subsequently formed, Figure 3 As shown, metal sharp corners are likely to appear at the isolation column, and the metal sharp corners are likely to pierce the packaging layer, affecting the packaging effect.

[0075] In the related art, after the isolation column is made of the first source-drain metal layer, an anode and a pixel defining layer need to be made. The anode is made of ITO / Ag / ITO, and the first source-drain metal layer is made of Ti / Al / Ti, that is, the isolation column adopts a Ti / Al / Ti structure. When the anode is wet-etched, silver ions will enter the etching solution, and the silver ions in the etching solution will be replaced with Al in the isolation column. Figure 4 As shown, silver particles are replaced in the isolation column, and the silver particles are easily connected to the cathode of the light-emitting device, resulting in dark spot defects.

[0076] In the related art, the isolation column and the anode can also be manufactured by a single patterning process. The anode is made of ITO / Ag / ITO, and the isolation column is made of Ti / Al / Ti. In this patterning process, in order to ensure sufficient etching of the anode, the etching time is relatively long. In addition, during etching, the silver ions in the anode will enter the etching solution, and the silver ions in the etching solution will be replaced with the Al in the isolation column, resulting in a further acceleration of the etching rate. Figure 5 As shown in the figure, long etching time and fast etching rate will cause the undercut of the isolation column to be too deep. When the photoresist is subsequently coated and exposed and developed, the photoresist at the undercut of the isolation column is not easy to be removed, and photoresist residue is likely to be generated; in addition, when the photoresist is coated, the undercut of the isolation column is too deep, resulting in bubbles at the undercut. When the bubbles are discharged and exploded, the uniformity of the photoresist is likely to deteriorate, which in turn leads to the appearance of the halo phenomenon.

[0077] In order to solve the above technical problems, embodiments of the present invention provide a display panel and a manufacturing method thereof, and a display device, which can improve the packaging effect of the display panel.

[0078] An embodiment of the present invention provides a display panel, such as Figure 6 As shown, the display panel comprises: an opening area, an isolation area arranged around the opening area, and a display area arranged around the isolation area, and the display panel further comprises:

[0079] Substrate substrate 01;

[0080] A plurality of light-emitting devices are located on the base substrate 01 of the display area, and the organic light-emitting functional layers in the light-emitting devices extend to the isolation area;

[0081] At least one isolation column 13 is located on the base substrate 01 of the isolation region, the isolation column 13 is arranged around the opening region, and the organic light-emitting functional layer extending to the isolation region is isolated at the position of the isolation column 13;

[0082] An encapsulation layer, covering the plurality of light-emitting devices, wherein the inorganic layer in the encapsulation layer extends to the isolation region, covering the isolation column 13 and the organic light-emitting functional layer;

[0083] At least a portion of the side surface of the isolation column 13 is covered with an insulating layer 14 .

[0084] In this embodiment, at least a portion of the side surface of the isolation column is covered with an insulating layer, which can ensure the isolation effect of the isolation column, achieve the power-off effect of the isolation column, and solve the problem of non-power-off packaging failure.

[0085] The insulating layer in this embodiment may be made of organic resin or inorganic insulating layer. The display panel includes a base substrate 01 and a buffer layer 02, an active layer 08, a first gate insulating layer 03, a first gate metal layer 09, a second gate insulating layer 04, a second gate metal layer 10, an interlayer insulating layer 05, a first source-drain metal layer 11, a passivation layer, a second source-drain metal layer (not shown), a flat layer 06, an anode 12, a pixel defining layer 07 and other film layers located on the base substrate. The passivation layer or the flat layer may be used as the insulating layer.

[0086] In a specific embodiment, Fig.12 As shown, along the direction away from the base substrate, the isolation column includes a first metal pattern 211, a second metal pattern 221 and a third metal pattern 231 which are stacked, the orthographic projection of the second metal pattern 221 on the base substrate is located within the orthographic projection of the first metal pattern 211 on the base substrate, and the orthographic projection of the second metal pattern 221 on the base substrate is located within the orthographic projection of the third metal pattern 231 on the base substrate;

[0087] The insulating layer 24 covers a portion of the side surface of the isolation column, and another portion of the side surface of the isolation column is formed with a notch, so that an undercut structure of the isolation column can be formed. The side surface of the isolation column is partially covered with an insulating layer, which can ensure the isolation effect of the isolation column, achieve the power-off effect of the isolation column, and solve the problem of non-power-off packaging failure.

[0088] In another specific embodiment, Fig.18 As shown, along the direction away from the base substrate, the isolation column includes a first metal pattern 211 and a second metal pattern 221 stacked, and the orthographic projection of the second metal pattern 221 on the base substrate is located within the orthographic projection of the first metal pattern 211 on the base substrate;

[0089] The insulating layer 26 covers all sides of the isolation column, and the central area of ​​the isolation column away from the substrate is not covered by the insulating layer 26, forming a groove that penetrates the second metal pattern 221, and the inner size of the groove is larger than the size of the opening, so that the undercut structure of the isolation column can be formed. In this embodiment, the sides of the isolation column are all covered with an insulating layer, which can ensure the isolation column's partition effect, achieve the isolation column's power-off effect, and solve the problem of non-power-off packaging failure.

[0090] An embodiment of the present invention further provides a method for manufacturing a display panel, comprising:

[0091] Providing a base substrate, the base substrate comprising an opening area, an isolation area arranged around the opening area, and a display area arranged around the isolation area;

[0092] At least one isolation column is formed in the isolation area of ​​the base substrate and a plurality of light-emitting devices are formed in the display area of ​​the base substrate, wherein the isolation column is arranged around the opening area, and the organic light-emitting functional layer in the light-emitting device extends to the isolation area and is isolated at the position of the isolation column;

[0093] Forming an encapsulation layer covering the plurality of light-emitting devices, wherein the inorganic layer in the encapsulation layer extends to the isolation region and covers the isolation column and the organic light-emitting functional layer;

[0094] Wherein, the manufacturing method further comprises:

[0095] An insulating layer is formed to cover at least a portion of the side surface of the isolation column.

[0096] In this embodiment, at least a portion of the side surface of the isolation column is covered with an insulating layer, which can ensure the isolation effect of the isolation column, achieve the power-off effect of the isolation column, and solve the problem of non-power-off packaging failure.

[0097] In a specific embodiment, Figure 7-Figure 12 As shown, the method for manufacturing a display panel includes the following steps:

[0098] Step a1: Figure 7 As shown, a display substrate 20 is formed, the display substrate 20 includes a film layer structure before the second source-drain metal layer, and a first transition structure is formed in the isolation region of the display substrate 20 using the second source-drain metal layer, the first transition structure includes a first metal film layer 21, a second metal film layer 22 and a third metal film layer 23 stacked in sequence;

[0099] The second source-drain metal layer generally adopts a Ti / Al / Ti structure, therefore, the first metal film layer 21 may be Ti, the second metal film layer 22 may be Al, and the third metal film layer may be Ti.

[0100] Step a2: If Figure 8 As shown, an insulating layer 24 covering the first transition structure is formed. The insulating layer 24 can be a flat layer of the display panel. The insulating layer 24 can be about 1000 mm thick. The organic resin may be benzocyclobutene (BCB) or other organic materials;

[0101] Step a3: If Fig. 9 As shown, after forming the pattern of the anode and pixel defining layer of the display panel, a photoresist 25 is coated on the insulating layer 24, and the pattern of the photoresist 25 is formed by exposure and development;

[0102] Step a4: Fig.10 As shown, the insulating layer 24 is dry-etched using the pattern of the photoresist 25 as a mask to expose part of the side surface of the first transition structure;

[0103] Step a5: Fig.11 As shown, the exposed side of the first transition structure is etched to form a notch on the side of the first transition structure, thereby obtaining an isolation column with an undercut structure, wherein the isolation column includes a first metal pattern 211, a second metal pattern 221, and a third metal pattern 231 stacked in sequence, wherein the orthographic projection of the second metal pattern 221 on the substrate is located within the orthographic projection of the first metal pattern 211 on the substrate, and the orthographic projection of the second metal pattern 221 on the substrate is located within the orthographic projection of the third metal pattern 231 on the substrate.

[0104] Step a6: Fig.12 As shown, the photoresist is removed.

[0105] In the present embodiment, after forming the first transition structure of the isolation column, an insulating layer covering the first transition structure is formed, and after the anode and pixel defining layer of the display panel are manufactured, the insulating layer is etched to form an undercut structure of the isolation column. In the process of manufacturing the anode and the pixel defining layer, the insulating layer covers the first transition structure, and the first transition structure does not have an undercut structure, so the coated photoresist will not remain at the first transition structure, and the process after the isolation column is formed does not require the coating of photoresist, which can avoid residual photoresist at the isolation column, thereby ensuring the isolation effect and packaging effect of the isolation column.

[0106] In the present embodiment, after forming the first transition structure of the isolation column, an insulating layer covering the first transition structure is formed, and after the anode and pixel defining layer of the display panel are manufactured, the insulating layer is etched to form the bottom cut structure of the isolation column. In the process of manufacturing the anode and the pixel defining layer, the insulating layer covers the first transition structure, and the silver ions in the etching solution cannot be replaced with the Al of the isolation column, which can avoid the problem of silver particles being adsorbed at the isolation column position, avoid the occurrence of dark spots, and ensure the display effect of the display panel.

[0107] In this embodiment, the second source-drain metal layer is used to make the isolation column. Thus, after the isolation column is made, there is no need to form a source-drain metal layer, which can avoid the occurrence of metal corners at the isolation column and ensure the packaging effect of the display panel.

[0108] In this embodiment, after forming the first transition structure of the isolation column, an insulating layer covering the first transition structure is formed, and after the anode and pixel defining layer of the display panel are manufactured, the insulating layer is etched to form the undercut structure of the isolation column. In this embodiment, after manufacturing the anode, a special patterning process is used to form the undercut structure of the isolation column, which can control the etching time of the isolation column, and does not cause the problem of replacement of silver ions in the etching solution with Al of the isolation column. The etching rate can be controlled, thereby controlling the undercut depth and range of the isolation column to avoid excessive undercut depth of the isolation column. In this way, when the photoresist is subsequently coated, there will be no bubbles at the undercut, thereby avoiding the occurrence of the halo phenomenon.

[0109] In another specific embodiment, Figure 13-Figure 18 As shown, the method for manufacturing a display panel includes the following steps:

[0110] Step b1: Figure 7 As shown, a display substrate 20 is formed, the display substrate 20 includes a film layer structure before the first source-drain metal layer, and a second transition structure is formed in the isolation region of the display substrate 20 using the first source-drain metal layer, the second transition structure includes a first metal film layer 21, a second metal film layer 22 and a third metal film layer 23 stacked in sequence;

[0111] The first source-drain metal layer generally adopts a Ti / Al / Ti structure, therefore, the first metal film layer 21 may be Ti, the second metal film layer 22 may be Al, and the third metal film layer may be Ti.

[0112] Step b2: Fig.13 As shown, the third metal film layer 23 is removed;

[0113] Step b3: Fig.14 As shown, an insulating layer 26 covering the second transition structure is formed. The insulating layer 26 can be a passivation layer of a display panel. The insulating layer 26 can be a thickness of Oxides, nitrides or oxynitride compounds of

[0114] Step b4: Fig.15 As shown, after forming the patterns of the anode and pixel defining layer of the display panel, a photoresist 25 is coated on the insulating layer 26, and the pattern of the photoresist 25 is formed by exposure and development;

[0115] Step b4: Fig.16 As shown, the insulating layer 26 is dry-etched using the pattern of the photoresist 25 as a mask to expose the central area of ​​the second transition structure away from the surface of the substrate side;

[0116] Step b5: Fig.17As shown, the central area is etched to form a groove that passes through the second metal pattern, and the internal size of the groove is larger than the size of the opening, so as to obtain an isolation column with an undercut structure, and the isolation column includes a first metal pattern 211 and a second metal pattern 221 stacked in sequence, and the orthographic projection of the second metal pattern 221 on the base substrate is located within the orthographic projection of the first metal pattern 211 on the base substrate.

[0117] Step b6: Fig.18 As shown, the photoresist is removed.

[0118] In the present embodiment, after forming the second transition structure of the isolation column, an insulating layer covering the second transition structure is formed, and after the anode and pixel defining layer of the display panel are manufactured, the insulating layer is etched to form an undercut structure of the isolation column. In the process of manufacturing the anode and the pixel defining layer, the insulating layer covers the second transition structure, and the second transition structure does not have an undercut structure, so the coated photoresist will not remain at the second transition structure, and the process after the isolation column is formed does not require the coating of photoresist, which can avoid residual photoresist at the isolation column, thereby ensuring the isolation effect and packaging effect of the isolation column.

[0119] In the present embodiment, after forming the second transition structure of the isolation column, an insulating layer covering the second transition structure is formed, and after the anode and pixel defining layer of the display panel are manufactured, the insulating layer is etched to form the bottom cut structure of the isolation column. In the process of manufacturing the anode and the pixel defining layer, the insulating layer covers the second transition structure, and the silver ions in the etching solution cannot be replaced with the Al of the isolation column, which can avoid the problem of silver particles being adsorbed at the isolation column position, avoid the occurrence of dark spots, and ensure the display effect of the display panel.

[0120] In this embodiment, after forming the second transition structure of the isolation column, an insulating layer covering the second transition structure is formed, and after the anode and pixel defining layer of the display panel are manufactured, the insulating layer is etched to form the undercut structure of the isolation column. In this embodiment, after manufacturing the anode, a special patterning process is used to form the undercut structure of the isolation column, which can control the etching time of the isolation column, and does not cause the problem of replacement of silver ions in the etching solution with Al of the isolation column. The etching rate can be controlled, thereby controlling the undercut depth and range of the isolation column to avoid excessive undercut depth of the isolation column. In this way, when the photoresist is subsequently coated, there will be no bubbles at the undercut, thereby avoiding the occurrence of the halo phenomenon.

[0121] An embodiment of the present invention further provides a display device, comprising the display panel as described above.

[0122] The display device includes but is not limited to: a radio frequency unit, a network module, an audio output unit, an input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, and a power supply. Those skilled in the art will appreciate that the structure of the above-mentioned display device does not constitute a limitation on the display device, and the display device may include more or less of the above-mentioned components, or a combination of certain components, or different component arrangements. In an embodiment of the present invention, the display device includes but is not limited to a display, a mobile phone, a tablet computer, a television, a wearable electronic device, a navigation display device, and the like.

[0123] The display device may be any product or component with a display function, such as a television, a monitor, a digital photo frame, a mobile phone, a tablet computer, etc., wherein the display device further includes a flexible circuit board, a printed circuit board and a backplane.

[0124] In the various method embodiments of the present invention, the serial numbers of the steps cannot be used to limit the sequence of the steps. For ordinary technicians in this field, without paying creative work, changes to the sequence of the steps are also within the protection scope of the present invention.

[0125] It should be noted that each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the embodiments, since they are basically similar to the product embodiments, the description is relatively simple, and the relevant parts can be referred to the partial description of the product embodiments.

[0126] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0127] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “under” another element, it can be “directly on” or “under” the other element or intervening elements may be present.

[0128] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0129] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A display panel, characterized in that: include: An opening area, an isolation area arranged around the opening area, and a display area arranged around the isolation area, the display panel further comprising: substrate substrate; A plurality of light-emitting devices are located on the base substrate of the display area, and the organic light-emitting functional layers in the light-emitting devices extend to the isolation area; At least one isolation column is located on the base substrate of the isolation region, the isolation column is arranged around the opening region, and the organic light-emitting functional layer extending to the isolation region is isolated at the position of the isolation column; An encapsulation layer, covering the plurality of light-emitting devices, wherein the inorganic layer in the encapsulation layer extends to the isolation region, covering the isolation column and the organic light-emitting functional layer; Wherein, at least a portion of the side surface of the isolation column is covered with an insulating layer.

2. The display panel according to claim 1, characterized in that: The insulating layer is made of an organic resin, or the insulating layer is made of an inorganic insulating layer.

3. The display panel according to claim 1, characterized in that: Along a direction away from the base substrate, the isolation column includes a first metal pattern and a second metal pattern which are stacked, and an orthographic projection of the second metal pattern on the base substrate is located within an orthographic projection of the first metal pattern on the base substrate; The insulating layer covers all side surfaces of the isolation column. The central area of ​​the isolation column away from the substrate is not covered by the insulating layer, forming a groove that penetrates the second metal pattern. The inner size of the groove is larger than the size of the opening.

4. The display panel according to claim 1, characterized in that: Along the direction away from the base substrate, the isolation column includes a first metal pattern, a second metal pattern and a third metal pattern which are stacked, the orthographic projection of the second metal pattern on the base substrate is located within the orthographic projection of the first metal pattern on the base substrate, and the orthographic projection of the second metal pattern on the base substrate is located within the orthographic projection of the third metal pattern on the base substrate; The insulating layer covers a portion of the side surface of the isolation column, and another portion of the side surface of the isolation column is formed with a notch.

5. A display device, characterized in that: The invention comprises a display panel as claimed in any one of claims 1 to 4.

6. A method for manufacturing a display panel, characterized in that: include: Providing a base substrate, the base substrate comprising an opening area, an isolation area arranged around the opening area, and a display area arranged around the isolation area; At least one isolation column is formed in the isolation area of ​​the base substrate and a plurality of light-emitting devices are formed in the display area of ​​the base substrate, wherein the isolation column is arranged around the opening area, and the organic light-emitting functional layer in the light-emitting device extends to the isolation area and is isolated at the position of the isolation column; Forming an encapsulation layer covering the plurality of light-emitting devices, wherein the inorganic layer in the encapsulation layer extends to the isolation region and covers the isolation column and the organic light-emitting functional layer; The production method further comprises: An insulating layer is formed to cover at least a portion of the side surface of the isolation column.

7. The method for manufacturing a display panel according to claim 6, characterized in that: Forming the isolation column includes: forming a first transition structure in the isolation region of the substrate, wherein the first transition structure comprises a first metal film layer, a second metal film layer and a third metal film layer stacked in sequence; forming an insulating layer covering the first transition structure; After forming the pattern of the pixel definition layer of the display panel, etching the insulating layer to expose a portion of the side surface of the first transition structure; The exposed side surface of the first transition structure is etched to form a notch on the side surface of the first transition structure.

8. The method for manufacturing a display panel according to claim 7, characterized in that: The insulating layer is made of organic resin.

9. The method for manufacturing a display panel according to claim 6, wherein: Forming the isolation column includes: forming a first transition structure in the isolation region of the substrate, wherein the first transition structure comprises a first metal film layer, a second metal film layer and a third metal film layer stacked in sequence; removing the third metal film layer to form a second transition structure; forming an insulating layer covering the second transition structure; After forming the pattern of the pixel defining layer of the display panel, etching the insulating layer to expose the central area of ​​the second transition structure away from the surface of the substrate; The central area is etched to form a groove penetrating the second metal pattern, wherein the inner dimension of the groove is larger than the dimension of the opening.

10. The method for manufacturing a display panel according to claim 9, characterized in that: The insulating layer is an inorganic insulating layer.

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