Transport device, resin molding device, and method for manufacturing resin molded article

Abstract

The present invention is a transport device (13) capable of positioning an object to be molded with respect to a groove block having an extension part, the transport device (13) transporting the object to be molded (W1) to a lower die (15) provided with a groove block (141) having an extension part (141b), the transport device (13) comprising: a substrate holding part (3) for holding the object to be molded (W1); and a holding part moving mechanism 4 that moves the substrate holding part 3, moves the substrate holding part 3 toward the groove block 141 in a state in which the object to be molded W1 is separated from the lower die 15, and brings the object to be molded W1 into contact with a side surface 141c below the protruding part 141b in the groove block 141, and after bringing the object to be molded W1 into contact with the side surface 141c by the holding part moving mechanism 4, moves the substrate holding part 3 toward the groove block 141, and moves the substrate holding part 3 toward the groove block 141 in a state in which the object to be molded W1 is separated from the lower die 15. The substrate holding unit (3) releases the holding of the molded object (W1).

Description

Technical Field

[0001] The present invention relates to a conveying device, a resin molding device, and a method for manufacturing a resin molded product. Background Art

[0002] Conventionally, as a conveying device for conveying a molding object to a lower mold provided with a cull portion block having a protruding portion, a device disclosed in Patent Document 1 is considered.

[0003] Specifically, the conveying device is constructed as follows: after the forming object is placed on the upper surface of the lower mold, the forming object is moved toward the rejection section block side by the first contact portion (clamping pin) of the first moving mechanism, so that the groove (pot) side end face of the forming object contacts the end face of the rejection section block for positioning.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent No. 6655148 Summary of the invention

[0007] Problems to be solved by the invention

[0008] However, for example, when the lower mold is provided with a pilot pin for alignment, sometimes the molded object interferes with the pilot pin, and the groove side end face of the molded object cannot be brought into contact with the end face of the rejection block. In addition, for example, when a release film is provided in the lower mold, the first contact portion (clamping pin) may come into contact with the release film and cause poor molding. Here, although it is conceivable to form a backing groove on the release film, the cost will increase. Furthermore, for example, when electronic components are fixed on the lower surface of the molded object, if the molded object is moved while being placed on the lower mold, the electronic components fixed to the lower surface of the molded object may be damaged.

[0009] Therefore, the present invention is made to solve the above-mentioned problems, and its main subject is that, for example, even when a guide pin or a release film is provided on the lower mold, or when electronic parts are fixed on the lower surface of the molded object, the molded object can be positioned relative to the lower mold by using a conveying device.

[0010] Technical means of solving problems

[0011] That is, the conveying device of the present invention is a conveying device for conveying a forming object to a lower mold provided with a groove block having a protruding portion, and is characterized in that it includes: a substrate holding portion for holding the forming object; and a holding portion moving mechanism for moving the substrate holding portion, and the holding portion moving mechanism moves the substrate holding portion toward the groove block when the forming object is separated from the lower mold, so that the forming object contacts the side surface below the protruding portion in the groove block, and after the forming object is contacted with the side surface by using the holding portion moving mechanism, the substrate holding portion releases its holding of the forming object.

[0012] Effects of the Invention

[0013] According to the present invention thus constituted, even when the lower mold is provided with guide pins or a mold release film, or when an electronic component is fixed to the lower surface of the molded object, the molded object can be positioned relative to the lower mold by the conveying device. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] [ Figure 1 ] is a schematic diagram showing the structure of a resin molding device according to one embodiment of the present invention.

[0015] [ Figure 2 ] is a schematic diagram showing the states of the molding module of the same embodiment (a) before mold clamping, (b) during mold clamping, and (c) after mold opening.

[0016] [ Figure 3 ] is a front view schematically showing a state in which a conveying device of the same embodiment holds a formed object.

[0017] [ Figure 4 ] is a side view schematically showing a state (second height position) in which the conveying device of the same embodiment holds a formed object.

[0018] [ Figure 5 ] is a plan view schematically showing the structure of a slot block of the same embodiment.

[0019] [ Figure 6 ] is a plan view schematically showing (a) a state before the forming object is brought into contact with the side surface of the groove and (b) a state after the forming object is brought into contact with the side surface of the groove of the holding portion moving mechanism of the same embodiment.

[0020] [ Figure 7 ] is a side view schematically showing a state in which the conveying device of the same embodiment holds the formed object at the transfer height position (first height position).

[0021] [ Figure 8] is a side view schematically showing the state of the conveying device of the same embodiment after the forming object is brought into contact with the side surface of the groove.

[0022] [ Fig. 9 ] is a side view schematically showing a state in which the conveying device of the same embodiment releases the hold on the formed object and guides the formed object.

[0023] [ Fig.10 ] is a side view schematically showing a state in which the conveying device of the same embodiment releases the holding of the forming object and places the forming object on the lower mold.

[0024] [ Fig.11 ] is a side view schematically showing the state after the pressing member of the conveying device of the same embodiment presses the forming object.

[0025] [ Fig.12 ] is a side view schematically showing a state in which the conveying device of the same embodiment is withdrawn from the lower mold after carrying in the forming object.

[0026] [ Fig.13 ] is a side view schematically showing the state of the conveying device of the same embodiment before holding the formed object.

[0027] [ Fig.14 ] is a partially enlarged view schematically showing the block mechanism of the same embodiment in (a) a state where the pressing member is located at a first height position and (b) a state where the pressing member is located at a pressing position. DETAILED DESCRIPTION

[0028] Next, the technology of the present invention will be described in further detail by taking examples, but the present invention is not limited to the following technology.

[0029] The conveying device of technology 1 of the present invention is a conveying device for conveying a forming object to a lower mold provided with a groove block having a protruding portion, and is characterized in that it includes: a substrate holding portion for holding the forming object; and a holding portion moving mechanism for moving the substrate holding portion, and the holding portion moving mechanism moves the substrate holding portion toward the groove block when the forming object is separated from the lower mold, so that the forming object contacts the side surface below the protruding portion in the groove block, and after the forming object is contacted with the side surface by using the holding portion moving mechanism, the substrate holding portion releases its hold on the forming object.

[0030] According to the above-mentioned conveying device, the object to be formed is brought into contact with the side surface below the extended portion of the groove block when the object to be formed is separated from the lower mold, and then the holding of the object to be formed is released. Therefore, even if the lower mold is provided with a guide pin or a mold release film, or an electronic component is fixed to the lower surface of the object to be formed, the object to be formed can be positioned and carried into the lower mold. Furthermore, since the object to be formed can be resin-sealed after being positioned by the conveying device, the generation of resin burrs can be reduced, and a resin molded product with good quality can be manufactured.

[0031] The conveying device of technology 2 of the present invention is characterized in that, based on the structure of technology 1, the holding part moving mechanism moves the substrate holding part horizontally toward the groove block when the forming object is located at a height position between the upper surface of the lower mold and the extension part, so that the forming object contacts the side surface.

[0032] According to the above structure, since the object to be formed moves horizontally, the side surface below the extended portion of the groove block can be reliably brought into contact with the groove-side end surface of the object to be formed.

[0033] As specific embodiments of the substrate holding portion, the following can be considered.

[0034] That is, the conveying device of technology 3 of the present invention is characterized in that, based on the structure of technology 1 or 2, the substrate holding part includes: a holding claw that hooks and holds the formed object; and a holding claw driving mechanism that releases the holding performed by the holding claw.

[0035] Regarding the conveying device of technology 4 of the present invention, it can be considered that: on the basis of the structure of technology 3, it also includes a base component, and the base component is provided so that the holding claw can at least be lifted and lowered and moved. In the conveying device, the formed object is received from the outside at a position where the holding claw is raised relative to the base component, and the holding of the formed object is released at a position where the holding claw is lowered relative to the base component.

[0036] Moreover, the conveying device of technology 4 of the present invention is characterized in that, in order to receive the formed object at a position where the holding claw is raised relative to the base member and release the holding of the formed object at a position where the holding claw is lowered relative to the base member, the holding claw driving mechanism comprises: a holding claw driving part, which is arranged on the base member; a first transmission part, which transmits the driving force from the holding claw driving part to the holding claw at a position where the holding claw is raised relative to the base member; and a second transmission part, which transmits the driving force from the holding claw driving part to the holding claw at a position where the holding claw is lowered relative to the base member.

[0037] In the present invention, since the substrate holding portion holding the molding object is moved toward the tank block, there is a possibility that the holding claws of the substrate holding portion interfere with the tank block.

[0038] Therefore, the conveying device of the fifth aspect of the present invention is characterized in that, in addition to the structure of the third aspect or the fourth aspect, a recessed portion is formed in the groove block to avoid interference with the holding claw.

[0039] The conveying device of technology 6 of the present invention is characterized in that, in addition to the structure of any one of technologies 1 to 5, the substrate holding portion includes a guide member that guides the molded object to be released from holding to the upper surface of the lower mold.

[0040] According to the above structure, the molded object is guided by the guide member when it falls to the upper surface of the lower mold after being released, so that the groove side end surface of the molded object can be kept in contact with the side surface of the groove block. As a result, the molded object is placed on the lower mold in a positioned state.

[0041] The conveying device of technology 7 of the present invention is characterized in that, based on the structure of any one of technologies 1 to 6, the substrate holding portion includes: a pressing member that presses the forming object placed on the lower mold; and a lifting and moving mechanism that enables the pressing member to be lifted and moved relative to the forming object.

[0042] According to the above structure, the pressing member presses the molding object placed on the lower mold, thereby suppressing the warping of the molding object.

[0043] The conveying device of technology 8 of the present invention is characterized in that, based on the structure of technology 1 or 2, the substrate holding part includes: a pressing member, which presses the forming object placed on the lower mold; a lifting and moving mechanism, which enables the pressing member to move up and down relative to the forming object; a holding claw, which is movably arranged on the pressing member in the up and down directions, hooks and holds the forming object; and a block mechanism, which stops the holding claw at a specified height position so that the holding claw will not contact the lower mold due to the descent of the pressing member.

[0044] According to the above structure, since the holding claw is provided on the pressing member, it is possible to achieve miniaturization compared with a structure in which the pressing member and the holding claw are provided separately. Moreover, in the structure in which the holding claw is provided on the pressing member, when the pressing member is lowered to press the molding object placed on the lower mold, the holding claw provided on the pressing member so as to be movable in the vertical direction is stopped at a predetermined height position by the stopper mechanism, thereby preventing the holding claw from contacting the lower mold or the release film provided on the lower mold.

[0045] The conveying device of technology 9 of the present invention is characterized in that, based on the structure of technology 8, the substrate holding portion also includes a guiding member, which is movably arranged on the pressing member in the up and down directions, and guides the formed object to be released from holding to the upper surface of the lower mold, and the block mechanism stops the guiding member at a specified height position so that the guiding member will not contact the lower mold due to the descent of the pressing member.

[0046] According to the above structure, since the pressing member is provided with the guide member, it is possible to achieve miniaturization compared with a structure in which the pressing member and the guide member are provided separately. Moreover, in the structure in which the pressing member is provided with the guide member, when the pressing member is lowered to press the molding object placed on the lower mold, the guide member provided on the pressing member so as to be movable in the vertical direction is stopped at a predetermined height position by the stopper mechanism, thereby preventing the guide member from contacting the lower mold or the release film provided on the lower mold.

[0047] The conveying device of technology 10 of the present invention is characterized in that, based on the structure of technology 9, the guide member is configured to be able to move between a guide position for guiding the formed object to the upper surface of the lower mold and a retreat position for retreating from the guide position, and is constructed to be in the guide position under the elastic force of the elastic member, and can move to the retreat position as the pressing member moves.

[0048] According to the above structure, the guide member can be configured not to become an obstacle when the molding object is delivered to the holding claws or when the pressing member presses the molding object.

[0049] Furthermore, a resin molding device including the conveying device according to any one of the above-described techniques 1 to 10 is also one embodiment of the present invention.

[0050] Furthermore, a conveying method is also a mode of the present invention, and the conveying method is a method for conveying a formed object using a conveying device according to any one of the technologies 1 to 10, wherein the formed object is moved toward the groove block when the formed object is separated from the lower mold, so that the formed object contacts the side surface below the protruding portion in the groove block, and after the formed object contacts the side surface, the holding of the formed object is released.

[0051] In addition, a method for manufacturing a resin molded product is also a mode of the present invention. The method for manufacturing a resin molded product is a method for manufacturing a resin molded product by resin molding a molding object, which includes: a positioning step, using a conveying device of any one of the technologies 1 to 10 to position the molding object relative to the groove block; and a molding step, performing resin molding in a state where the molding object is positioned.

[0052] <One embodiment of the present invention>

[0053] Hereinafter, one embodiment of the resin molding device of the present invention will be described with reference to the accompanying drawings. In addition, for the sake of easy understanding, any of the following figures are appropriately omitted or exaggerated and schematically drawn. The same components are marked with the same symbols and the description is appropriately omitted.

[0054] <Overall structure of resin molding device>

[0055] The resin molding apparatus 100 of the present embodiment resin-moldes the molding object W1 to which the electronic component Wx is fixed by transfer molding using a resin material J. The molding object W1 has a rectangular shape in a plan view.

[0056] Here, the molding object W1 includes, for example, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit substrate, a semiconductor substrate, a lead frame, a silicon wafer, a glass wafer, etc., regardless of the presence or absence of wiring. In addition, the resin material J used for resin molding is, for example, a composite material containing a thermosetting resin, and the resin material J is in the form of particles, powder, liquid, sheet, or tablet. In addition, as the electronic component Wx, for example, electronic components such as semiconductor chips, resistor elements, capacitor elements, or electronic components in which at least one of these electronic components is sealed with resin.

[0057] Specifically, if Figure 1 As shown in FIG. 1 , the resin molding apparatus 100 includes a supply module 100A for supplying a molding object W1 and a resin material J before molding, a molding module 100B for performing resin molding, and a storage module 100C for storing a molding object W2 (hereinafter referred to as a resin molded product W2) after molding as components. In addition, the supply module 100A, the molding module 100B, and the storage module 100C are detachable from each other and replaceable relative to other components.

[0058] The supply module 100A is provided with a forming object supply section 11 for supplying a forming object W1, a resin material supply section 12 for supplying a resin material J, and a conveying device 13 (hereinafter referred to as a loader 13) which receives the forming object W1 from the forming object supply section 11 and conveys it to the forming module 100B and receives the resin material J from the resin material supply section 12 and conveys it to the forming module 100B.

[0059] The loader 13 travels between the supply module 100A and the forming module 100B, and moves along a track (not shown) provided across the supply module 100A and the forming module 100B. The loader 13 will be described in detail below.

[0060] like Figure 2 As shown, the molding module 100B has: a lower mold 15, in which a resin injection portion 14 is provided, and a mold cavity 15a is formed for injecting resin material J; an upper mold 16 is provided opposite to the lower mold 15 and a mold cavity 16a is formed for injecting resin material J; and a clamping mechanism 17 is provided to clamp the lower mold 15 and the upper mold 16. The lower mold 15 is provided on a movable plate 101 which is raised and lowered by the clamping mechanism 17 via a lower pressing plate 102. The upper mold 16 is provided on an upper fixed plate (not shown) via an upper pressing plate 103. In addition, Figure 2 Only one side (left side) of the resin injection portion 14 is shown, and the other side (right side) is omitted. Figure 2 The structure of the other side is the same as that of one side.

[0061] The resin injection unit 14 of this embodiment includes: a groove block 141, which is formed with a groove 141a for accommodating the resin material J; and a transfer mechanism 142, which has a plunger 142a disposed in the groove 141a. Here, the transfer mechanism 142 has a plunger 142a for pressurizing the resin material J accommodated in the groove 141a, and a plunger driving unit 142b for driving the plunger 142a. In addition, the plunger 142a pressurizes the resin material J that is heated and melted in the groove 141a.

[0062] The groove block 141 is provided on the lower mold 15 and is elastically supported by the elastic member 144 so as to be able to rise and fall relative to the lower mold 15. In addition, a protruding portion 141b is formed at the upper end of the groove block 141, which protrudes from the upper surface, i.e., the mold surface, of the lower mold 15. When the upper mold 16 and the lower mold 15 are clamped, the upper surface of the protruding portion 141b contacts the upper mold 16, and the lower surface thereof clamps the molding object W1 between the mold surface of the lower mold 15 (see Figure 2 (b)). In addition, the protruding portion 141b becomes a portion protruding upward from the resin molded product W2 when the upper mold 16 and the lower mold 15 are opened after the resin molding (see Figure 2 (c)). Furthermore, a cutout portion and a gate portion (not shown) serving as a resin flow path for guiding the resin material J injected from the groove 141 a to the cavity 15 a and the cavity 16 a may be formed on the upper surface of the groove block 141 .

[0063] The cavity 15a of the lower mold 15 is used to resin-seal the lower surface of the molding object W1, and the cavity 16a of the upper mold 16 is used to resin-seal the upper surface of the molding object W1. Here, the electronic component Wx of the molding object W1 is accommodated in at least one of the cavity 15a of the lower mold 15 or the cavity 16a of the upper mold 16.

[0064] In the upper mold 16, a recessed portion 16b is formed in a portion facing the protruding portion 141b of the groove block 141, and a runner portion 16c is formed to connect the ejection portion and the gate portion with the cavity 15a and the cavity 16a. In addition, a runner portion to connect the ejection portion and the gate portion with the cavity 15a and the cavity 16a may be formed in the lower mold 15. Although not shown, an exhaust port is formed on the side opposite to the groove block 141 in the lower mold 15 or the upper mold 16. The ejection portion, the runner portion, and the gate portion form a resin flow path to supply molten resin material J from the groove to the cavity.

[0065] Moreover, if Figure 2 As shown in (b), when the lower mold 15 and the upper mold 16 are clamped by the clamping mechanism 17, the groove block 141 descends, and the groove side end of the molding object W1 is clamped between the lower surface of the extension 141b of the groove block 141 and the upper surface of the lower mold 15. In this state, when the molten resin material J is injected into the mold cavity 15a and the mold cavity 16a by the plunger 142a, the electronic component Wx of the molding object W1 is sealed with resin.

[0066] The storage module 100C is provided with a storage section 18 for storing the resin molded product W2 and a conveying device 19 (hereinafter referred to as an unloader 19 ) for receiving the resin molded product W2 from the molding module 100B and conveying it to the storage section 18 .

[0067] The unloader 19 travels between the forming module 100B and the storage module 100C, and moves along a rail (not shown) provided across the forming module 100B and the storage module 100C.

[0068] Reference Figure 2 The basic operation of the resin molding apparatus 100 will be briefly described. The following operation is performed by, for example, a control unit (not shown) provided in the supply module 100A controlling each unit.

[0069] With the lower mold 15 and the upper mold 16 in the open state, the molding object W1 is transported by the loader 13 and Figure 2 (a) is placed on the lower mold 15. At this time, the upper mold 16 and the lower mold 15 are heated to a temperature at which the resin material J can be melted and hardened. In addition, the resin material J is transported by the loader 13 and accommodated in the groove 141a of the groove block 141.

[0070] In the above state, if the lower mold 15 is raised by the mold clamping mechanism 17, Figure 2As shown in (b), the groove block 141 contacts the upper mold 16 and descends relative to the lower mold 15, and the lower surface of the extension 141b contacts the groove side end of the molding object W1. In addition, the lower surface of the upper mold 16 is in contact with the molding object W1 except for the cavity 16a and the exhaust port. As a result, the lower mold 15 and the upper mold 16 are locked. If the plunger 142a is raised by the plunger driving part 142b after the locking, the molten resin material J in the groove 141a passes through the resin flow path and is injected into the cavity 15a and the cavity 16a. Then, after the resin material J in the cavity 15a and the cavity 16a is hardened, as shown in Figure 2 As shown in (c), the mold is opened by the mold clamping mechanism 17. By the mold opening, the groove block 141 rises relative to the lower mold 15, and the unnecessary resin K on the groove block 141 is separated from the resin molded product W2 (gate disconnection). Then, the resin molded product W2 is unloaded by the unloader 19 and transported to the storage unit 18.

[0071] <Specific structure of loader 13>

[0072] Secondly, refer to Figure 3 to Figure 14 The specific structure of the loader 13 in this embodiment will be described. Figure 3 , Figure 4 , Figure 7 to Figure 14 In FIG. 1 , the electronic component Wx is omitted. Figure 4 , Figure 6 to Figure 12 Only the other side (right side) of the resin injection portion 14 is shown, and one side (left side) is omitted, but Figure 4 , Figure 6 to Figure 12 The structure of one side is the same as the structure of the other side. Figure 4 , Figure 7 to Figure 12 The upper mold 16 is omitted in the figure.

[0073] like Figure 3 , Figure 4 , Figure 7 to Figure 13 As shown, the loader 13 includes: a base member 2, which is provided to be movable along a rail (not shown); a substrate holding portion 3, which is provided on the base member 2 and holds the molding object W1; and a holding portion moving mechanism 4, which moves the substrate holding portion 3 relative to the base member 2 toward the tank block 141. In addition, a resin holding portion (not shown) for holding the resin material J is provided on the base member 2.

[0074] like Figure 3 , Figure 4 , Figure 6 to Figure 13 As shown, the substrate holding portion 3 includes a holding mechanism 5 for holding the molding object W1 , a pressing member 6 for pressing the molding object W1 placed on the lower mold 15 , and an elevating mechanism 7 for moving the pressing member 6 up and down.

[0075] like Figure 3 , Figure 4 , Figure 6 to Figure 13 As shown, the holding mechanism 5 includes a pair of holding claws 51 for hooking and holding both ends of the formed object W1, and a holding claw driving mechanism 52 for expanding or reducing the interval between the holding claws 51. By reducing the interval between the holding claws 51 by the holding claw driving mechanism 52, at least a portion of the lower surface of the formed object W1 is supported and held, and by expanding the interval between the holding claws 51, the holding of the formed object W1 is released.

[0076] The holding claw 51 of this embodiment is configured to hook and hold the groove side end portion of the formed object W1 and the end portion on the opposite side to the groove side end portion. In the above structure, in order to avoid interference between the holding claw 51 and the groove block 141, as shown in FIG. Figure 4 and Figure 5 As shown in FIG. 1 and FIG. 2 , in the groove block 141 , a recessed portion 141K is formed at a portion corresponding to the holding claw 51 to avoid interference with the holding claw 51 .

[0077] The holding claw 51 is vertically movable on the pressing member 6. Specifically, the holding claw 51 is provided on a shaft member 53 vertically movable on the pressing member 6, whereby the holding claw 51 is vertically movable on the pressing member 6.

[0078] Here, if Figure 3 , Figure 4 , Figure 7 to Figure 13 As shown, the shaft member 53 is respectively provided at the two ends of the pressing member 6 in a manner corresponding to the two ends of the forming object W1. In addition, the shaft member 53 is supported by the support block 55 so as to be rotatable around the central axis of the shaft member 53 to expand or reduce the interval between the holding claws 51. Furthermore, a guide mechanism 54 is provided between the support block 55 and the pressing member 6, and the guide mechanism 54 guides the movement of the support block 55 (shaft member 53) in the up-down direction relative to the pressing member 6. In addition, the guide mechanism 54 has, for example, a track member provided on the pressing member 6 along the up-down direction, and a sliding member provided on the support block 55 and sliding on the track member.

[0079] like Figure 3 , Figure 4 , Figure 6 to Figure 13 As shown, the holding claw driving mechanism 52 includes a holding claw driving unit 521 provided in a frame portion (not shown) of the loader 13, and a transmission mechanism 522 for transmitting the driving force from the holding claw driving unit 521 to the holding claw 51. Here, the holding claw driving unit 521 is formed using, for example, an air cylinder.

[0080] The transmission mechanism 522 transmits the driving force from the holding claw driving unit 521 to the shaft member 53 provided with the holding claw 51 to rotate the shaft member 53. The rotation of the shaft member 53 increases or decreases the interval between the holding claws 51.

[0081] Specifically, the transmission mechanism 522 includes: a connecting rod portion 522a, which rotates the shaft member 53 through the driving force from the retaining claw driving portion 521; a first transmission portion 522b and a second transmission portion 522c, which are clamped between the connecting rod portion 522a and the retaining claw driving portion 521; and a guiding mechanism 522d, which contacts the retaining claw driving portion 521 and transmits the driving force to the connecting rod portion 522a.

[0082] The link portion 522a is used to connect the two shaft members 53 provided on the base member 2, and switch between a holding state in which the holding claw 51 holds the molded object W1 and a release state in which the holding claw 51 releases the holding of the molded object W1. Specifically, the link portion 522a includes a connecting link portion 522a1 that connects the two shaft members 53, and an action rod portion 522a2 that is connected to the connecting link portion 522a1 and to which the driving force from the holding claw driving portion 521 acts.

[0083] In this embodiment, since the pressing member 6 moves up and down relative to the base member 2, the shaft member 53 (holding claw 51) provided on the pressing member 6 also moves up and down relative to the base member 2. That is, the action rod portion 522a2 of the link portion 522a connected to the shaft member 53 also moves up and down relative to the base member 2.

[0084] Here, the first transmission portion 522b is at a position where the action rod portion 522a2 is raised relative to the base member 2 (see Figure 4 , Fig.12 , Fig.13 ), and transmits the driving force from the holding claw driving unit 521 to the holding claw 51. Specifically, the first transmission unit 522b has a contact portion such as a contact roller that is moved by the holding claw driving unit 521 and acts on the rising action rod 522a2. In addition, the position where the action rod 522a2 rises relative to the base member 2 refers to the position where the pressing member 6 is located at the second height position R described later.

[0085] In addition, the second transmission portion 522c is in a position where the action rod portion 522a2 is lowered relative to the base member 2 (see Figure 7 to Figure 11) transmits the driving force from the holding claw driving unit 521 to the holding claw 51. Specifically, the second transmission unit 522c has a contact portion such as a contact roller that is moved by the holding claw driving unit 521 and acts on the descending action rod 522a2. In addition, the position where the action rod 522a2 descends relative to the base member 2 refers to the position where the pressing member 6 is located at the first height position P described later.

[0086] Here, when the driving force acts on the action rod 522a2 through the first transmission part 522b at the position where the action rod 522a2 (pressing member 6) rises relative to the base member 2 (second height position R), the interval between the holding claws 51 is expanded, so that the molding object W1 can be received (see Fig.13 That is, the position (second height position R) at which the action rod portion 522a2 (pressing member 6) rises relative to the base member 2 becomes the receiving position at which the holding claw 51 of the substrate holding portion 3 receives the molded object W1.

[0087] When the driving force acts on the action rod 522a2 through the second transmission part 522c at the position (first height position P) where the action rod 522a2 (pressing member 6) is lowered relative to the base member 2, the interval between the holding claws 51 is expanded, thereby releasing the holding of the molding object W1. That is, the position (first height position P) where the action rod 522a2 (pressing member 6) is lowered relative to the base member 2 becomes the transfer height position where the holding claws 51 of the substrate holding part 3 release the holding of the molding object W1.

[0088] like Figure 3 and Figure 6 As shown, the first transmission part 522b and the second transmission part 522c are configured to be guided by a guide mechanism 522d. The guide mechanism 522d has a guide rail provided on the base member 2 and a sliding member slidably provided on the guide rail. The guide rail is provided along the direction in which the first transmission part 522b and the second transmission part 522c operate the action rod 522a2.

[0089] like Figure 3 , Figure 4 , Figure 7 to Figure 13 As shown, the pressing member 6 suppresses the warping of the formed object W1 by pressing the outer peripheral edge of the formed object W1. A pressing portion (not shown) that contacts the outer peripheral edge of the formed object W1 is provided on the lower surface of the pressing member 6, and a recess (not shown) that accommodates the electronic component Wx mounted on the formed object W1 is formed. The pressing member 6 is provided on the base member 2 so as to be movable in the vertical direction, for example, by two connecting shafts 60. In addition, the connecting shafts 60 of this embodiment penetrate the base member 2 and are connected to each other at the upper part of the base member 2 by a connecting rod 61.

[0090] like Figure 3 , Figure 4 , Figure 6 to Figure 13 As shown, the lifting and lowering mechanism 7 is provided on the base member 2 , and adjusts the height position of the pressing member 6 relative to the lower mold 15 or the molding object W1 placed on the lower mold 15 .

[0091] Specifically, the lifting and moving mechanism 7 includes a first lifting unit 71, which moves the pressing member 6 to a first height position P (see FIG. 1 ) close to the molding object W1. Figure 7 to Figure 10 ) and the pressing position Q (refer to Fig.11 ). In addition, the lifting and moving mechanism 7 has a second lifting part 72, and the second lifting part 72 lifts and moves the pressing member 6 to a second height position R located above the first height position P (see Figure 4 , Fig.12 , Fig.13 The first lifting unit 71 and the second lifting unit 72 are formed by using, for example, air cylinders. The first lifting unit 71 and the second lifting unit 72 of the present embodiment adjust the height position of the pressing member 6 by moving the connecting rod 61 up and down.

[0092] Here, when the pressing member 6 is located at the first height position P, the molding object W1 held by the holding claw 51 is located at a height position between the upper surface of the lower mold 15 and the protruding portion 141b. The first height position P of the pressing member 6 is a transfer height position at which the holding claw 51 of the substrate holding portion 3 releases the holding of the molding object W1. In addition, the second height position R of the pressing member 6 is a receiving position at which the holding claw 51 of the substrate holding portion 3 located on the pressing member 6 receives the molding object W1.

[0093] like Figure 3 , Figure 4 , Figure 6 to Figure 13 As shown in FIG. 1 , the holding portion moving mechanism 4 moves the substrate holding portion 3 holding the molding object W1 horizontally toward the tank block 141 so that the molding object W1 contacts the side surface 141c below the extension portion 141b in the tank block 141. At this time, the molding object W1 held by the substrate holding portion 3 is in a state of being separated from the lower mold 15 by a space (in a state of floating from the upper surface of the lower mold 15). In addition, the molding object W1 before being moved toward the tank block 141 by the holding portion moving mechanism 4 is located at a position further outside than the extension portion 141b.

[0094] The holding portion moving mechanism 4 of the present embodiment moves the pressing member 6 in the horizontal direction, thereby moving the formed object W1 held by the holding claws 51 in the horizontal direction.

[0095] Specifically, the holding portion moving mechanism 4 includes a guide mechanism 41 for moving the pressing member 6 in the horizontal direction relative to the base member 2 , and a horizontal driving portion 42 for moving the pressing member 6 along the guide mechanism 41 .

[0096] The guide mechanism 41 includes a rail 411 provided in the base member 2 along a first direction toward the tank block 141 side, and a slide member 412 that slides on the rail 411. The pressing member 6 is provided on the slide member 412 so as to be slidable in the up-down direction. The horizontal drive unit 42 is formed using, for example, an air cylinder.

[0097] In addition, the base member 2 of the present embodiment is provided with a movement restriction portion 2s which contacts the sliding member 412 and restricts its further movement toward the tank block 141 side (see Figure 6 ). When the molding object W1 contacts the side surface 141c of the groove block 141 located below the extension portion 141b, the movement limiting portion 2s contacts the sliding member 412 moved by the horizontal driving portion 42, preventing it from moving further. Thus, excessive force is prevented from being applied to the molding object W1 contacting the side surface 141c.

[0098] Furthermore, if Figure 3 , Figure 4 , Figure 7 to Figure 13 As shown, the substrate holding portion 3 of the present embodiment includes a first guide member 81 for guiding the molded object W1 whose holding is released to the upper surface of the lower mold 15. The first guide member 81 contacts or approaches the end of the molded object W1 opposite to the groove side end, and guides the molded object W1 to the upper surface of the lower mold 15.

[0099] Specifically, the first guide member 81 is rotatably provided on the shaft member 53 connected to the holding claw 51. The first guide member 81 can guide the molding object W1 to the guide position G1 (see Figure 3 , Figure 7 to Figure 11 ) and a retreat position H1 retreated from the guide position G1 (refer to Figure 4 , Fig.12 , Fig.13 The retreat position H1 is a position rotated outward from the guide position G1 and is a position that does not hinder the holding claws 51 from receiving the forming object W1.

[0100] The first guide member 81 of this embodiment is provided with elastic force by the elastic member 81a so as to be in the guide position G1. When the pressing member 6 is located at the first height position P and the pressing position Q (see Figure 3 , Figure 7 to Figure 11), the first guide member 81 is at the guide position G1. On the other hand, when the pressing member 6 rises from the first height position P to the second height position R (refer to Figure 4 , Fig.12 , Fig.13 ), the cam portion 81b provided on the first guide member 81 contacts the lower surface 2a of the base member 2. And, as the pressing member 6 moves, the first guide member 81 rotates around the shaft member 53 as the rotation center and moves to the retreat position H1. The cam portion 81b and the lower surface 2a of the base member 2 constitute a cam mechanism 81K that moves the first guide member 81 to the retreat position H1.

[0101] Furthermore, if Figure 3 , Figure 4 , Figure 7 to Figure 13 As shown, the substrate holding portion 3 of the present embodiment has a second guide member 82, which plays a guiding role when holding the formed object W1 by contacting or approaching the end face of the formed object W2 other than the end face in contact with the side surface 141c of the groove block 141, and also plays a guiding role when causing the formed object W1 to fall to the lower mold 15.

[0102] The second guide member 82 is received in a recess formed on the lower surface of the pressing member 6 via an elastic member 82a. The second guide member 82 is provided at a guide position G2 (see FIG. 1 ) where it can protrude from the lower surface of the pressing member 6 and guide the molding object W1. Figure 3 , Figure 4 , Figure 7 to Figure 10 , Fig.12 , Fig.13 ), and a retreat position H2 (refer to Fig.11 ) between the first height position P and the second height position R. Figure 3 , Figure 4 , Figure 7 to Figure 10 , Fig.12 , Fig.13 ), the second guide member 82 protrudes from the lower surface and is in the guide position G2 to guide the formed object W1. In addition, when the pressing member 6 is lowered from the first height position P to the pressing position Q (refer to Fig.11 ), the second guide member 82 contacts and is buried in the upper surface of the lower mold 15 (the release film if there is a release film) as the pressing member 6 moves, thereby being in the retreat position H2. The second guide member 82 is buried in the retreat position H2, so that it does not become an obstacle when the pressing member 6 presses the molding object W1.

[0103] Furthermore, if Figure 3 , Fig.14 As shown, the loader 13 of this embodiment includes a stopper mechanism 9 that stops the holding claw 51 and the first guide member 81 at a predetermined height position so that the holding claw 51 and the first guide member 81 do not contact the lower die 15 due to the descent of the pressing member 6 .

[0104] The stopper mechanism 9 includes a hooking portion 91 and a stopper portion 92. The hooking portion 91 is provided on the support block 55 that supports the shaft member 53 to be rotatable, and the stopper portion 92 is provided on the base member 2 and is hooked by the hooking portion 91. Fig.14 As shown in FIG. 1 , the hooking portion 91 of the support block 55 is hooked on the stopper portion 92 when the pressing member 6 is lowered from the first height position P to the pressing position Q. As a result, the holding claw 51 and the first guide member 81 do not follow the lowering of the pressing member 6 but stay at a predetermined height position, and the holding claw 51 and the first guide member 81 do not contact the upper surface of the lower mold 15 (the release film if there is a release film).

[0105] <Operation of the loader 13>

[0106] Secondly, refer to Figure 4 , Figure 6 to Figure 14 The conveying operation and positioning operation of the loader 13 will be described.

[0107] In the supply module 100A, the loader 13 is made to hold the molding object W1. Then, the loader 13 is moved to the molding module 100B, as shown in FIG. Figure 4 As shown in FIG. 1 , the loader 13 holding the molding object W1 is moved to the top of the lower mold 15. At this time, the pressing member 6 is at the second height position R. Then, the pressing member 6 is lowered from the second height position R to the first height position P (see FIG. 1 ) by the second lifting part 72 of the lifting and moving mechanism 7. Figure 7 At this time, the connecting rod 61 connected to the pressing member 6 contacts the first lifting portion 71 of the lifting and moving mechanism 7, and the pressing member 6 is at the first height position P. As a result, the height position of the molding object W1 held by the holding claw 51 becomes the height position (transfer height position) between the upper surface of the lower mold 15 and the extension portion 141b.

[0108] In the above state, Figure 6 and Figure 8As shown, the pressing member 6 is horizontally moved toward the groove side together with the sliding member 412 by the holding portion moving mechanism 4. Furthermore, the holding portion moving mechanism 4 makes the groove side end portion of the formed object W1 held by the holding claw 51 contact the side surface 141c below the protruding portion 141b in the groove block 141. Thus, the formed object W1 is positioned relative to the groove block 141 when viewed from above. In addition, the first lifting portion 71 of the lifting and moving mechanism 7 is provided on the sliding member 412, and when the sliding member 412 moves toward the groove side, the first lifting portion 71 of the lifting and moving mechanism 7 also moves toward the groove side.

[0109] Secondly, if Fig. 9 As shown, the interval between the holding claws 51 is expanded by the holding claw driving mechanism 52. At this time, the contact portion of the second transmission portion 522c presses the action rod portion 522a2 of the link portion 522a, thereby expanding the interval between the holding claws 51. In addition, since the recessed portion 141K is formed in the groove block 141, the holding claws 51 and the groove block 141 do not interfere with each other. As a result, the holding of the molding object W1 is released, and the molding object W1 falls and is placed on the lower mold 15 (refer to Fig.10 When the molded object W1 falls, the molded object W1 is guided by the first guide member 81 and the second guide member 82 .

[0110] Then, if Fig.11 As shown, the first lifting part 71 of the lifting and moving mechanism 7 moves the pressing member 6 from the first height position P to the pressing position Q, and the pressing member 6 contacts and presses the outer peripheral edge of the positioned forming object W1. When the pressing member 6 is lowered from the first height position P to the pressing position Q, the stopper part 92 of the stopper mechanism 9 hooks the hook hanging part 91, and the holding claw 51 and the first guide member 81 do not follow the lowering of the pressing member 6 and stay at a predetermined height position (refer to Fig.11 and Fig.14 (b)) Thus, the holding claws 51 and the first guide members 81 do not come into contact with the upper surface (mold release film) of the lower mold 15 .

[0111] In addition, in a state where the pressing member 6 contacts and presses the molding object W1, the molding object W1 is held by suction on the lower mold 15 by a suction mechanism (not shown) provided on the lower mold 15. In the present embodiment, even when the molding object W1 is deformed, the molding object W1 can be held by suction because it is pressed by the pressing member 6. In addition, when the lower mold 15 is provided with a release film, a through hole corresponding to the substrate suction hole of the lower mold 15 is formed in the release film.

[0112] After being held by suction, the first lifting section 71 of the lifting and moving mechanism 7 raises the pressing member 6 from the pressing position Q to the first height position P. At this time, the hooking section 91 of the stopper mechanism 9 is separated from the stopper section 92, and the holding claw 51 and the first guide member 81 are placed on the pressing member 6 to follow the rise of the pressing member 6.

[0113] In addition, the holding portion moving mechanism 4 moves the pressing member 6 in a direction away from the groove block 141. Then, the second lifting portion 72 of the lifting and moving mechanism 7 raises the pressing member 6 from the first height position P to the second height position R. At this time, the cam portion 81b provided at the upper end of the first guide member 81 contacts the lower surface 2a of the base member 2, and the first guide member 81 rotates around the shaft member 53 as the rotation center and moves to the retreat position H1 (refer to Fig.12 ). In this way, the first guide member 81 moves to the retreat position H1, as shown in FIG. Fig.13 As shown, when the next molded object W1 is held by the holding claws 51 , the first guide member 81 does not become an obstacle.

[0114] After this series of positioning operations (carrying-in operations), in the supply module 100A, the resin material J held by the resin holding portion (not shown) when the molding object W1 is held by the loader 13 is accommodated in the groove 141a of the groove block 141. At this time, the second lifting portion 72 of the lifting and moving mechanism 7 raises the pressing member 6 to the second height position R above the first height position P. Thus, during the supply operation of the resin holding portion to supply the resin material J to the groove block 141, the pressing member 6 is prevented from contacting the molding object W1 and the like.

[0115] <Effects of the present embodiment>

[0116] According to the resin molding apparatus 100 of the present embodiment, the molding object W1 is brought into contact with the side surface 141c below the protruding portion 141b in the groove block 141 while the molding object W1 is separated from the lower mold 15, and then the holding of the molding object W1 is released. Therefore, even when the lower mold 15 is provided with guide pins or a mold release film, or when electronic components are fixed to the lower surface of the molding object W1, the molding object W1 can be positioned by the loader 13 and carried into the lower mold 15. In addition, since the molding object W1 positioned by the loader 13 can be sealed with resin, the generation of resin burrs can be reduced, and a resin molded product W2 with good quality can be manufactured.

[0117] In addition, in the present embodiment, since the holding portion moving mechanism 4 moves the molding object W1 horizontally, the side surface 141c below the protruding portion 141b of the groove block 141 can be reliably brought into contact with the groove side end surface of the molding object W1.

[0118] Furthermore, since the substrate holding portion 3 has the first guide member 81 and the second guide member 82, when the molded object W1 that has been released from holding falls onto the upper surface of the lower mold 15, the groove side end surface of the molded object W1 can be kept in contact with the side surface 141c of the groove block 141. As a result, the molded object W1 can be placed on the lower mold 15 in a positioned state.

[0119] In addition, since the substrate holding portion 3 has the pressing member 6, warping of the molding object W1 can be suppressed. Here, since the pressing member 6 is provided with the holding claw 51 and the guide member 81, the guide member 82, miniaturization can be achieved compared with a structure in which the pressing member 6 and the holding claw or the guide member 81, the guide member 82 are provided separately. Moreover, in the structure in which the pressing member 6 is provided with the holding claw 51 and the guide member 81, the guide member 82, when the pressing member 6 is lowered to press the molding object W1, the holding claw 51 and the guide member 81, the guide member 82 provided on the pressing member 6 in a movable manner in the up-down direction are stopped at a predetermined height position by the stopper mechanism 9, so that the holding claw 51 and the guide member 81, the guide member 82 can be prevented from contacting the lower mold 15 or the release film provided on the lower mold 15.

[0120] <Other Modified Embodiments>

[0121] In addition, the present invention is not limited to the above-described embodiments.

[0122] For example, in the above embodiment, the holding claw 51 or the first guide member 81 is provided on the pressing member 6, but the holding claw 51 or the first guide member 81 may be provided on a member (for example, the base member 2) different from the pressing member 6. Here, when the holding claw 51 or the first guide member 81 is provided on a member different from the pressing member 6, the pressing member 6 may be configured not to move horizontally.

[0123] In addition, the holding mechanism 5 of the above-described embodiment is configured to hook and hold the molded object by the holding claws 51 , but may be configured to hold the object by suction using a suction pad.

[0124] Furthermore, in the above-described embodiment, the lifting and moving mechanism 7 of the pressing member 6 is constituted by the first lifting unit 71 and the second lifting unit 72 , but the mechanism may be constituted so as to move among the first height position P, the pressing position Q, and the second height position R by one lifting unit.

[0125] In addition, in the above embodiment, the structure of the first guide member 81 and the structure of the second guide member 82 are different from each other, but the structure of the first guide member 81 and the structure of the second guide member 82 may be the same. For example, the first guide member 81 and the second guide member 82 may be the structure of the second guide member 82 in the above embodiment, that is, they may be accommodated in the recessed portion formed on the lower surface of the pressing member 6 via the elastic member, and may be protruded or buried relative to the lower surface of the pressing member 6.

[0126] In addition, in the above-mentioned embodiment, the cavity is formed in the lower mold, but the cavity may not be formed. In addition, guide pins for positioning may be provided on the upper surface of the lower mold.

[0127] In addition, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.

[0128] Industrial Applicability

[0129] According to the present invention, the object to be formed can be positioned relative to the groove block having the protruding portion.

[0130] Explanation of symbols

[0131] 100…Resin molding device

[0132] W1… Object before forming

[0133] W2… Molded object after molding (resin molded product)

[0134] 13…Loader (transportation device)

[0135] 141...Slot Block

[0136] 141b…Extension

[0137] 141c…Side view below the extension

[0138] 141K…concave

[0139] 15…Lower die

[0140] 2…Base member

[0141] 3…Substrate holding part

[0142] 4…Moving mechanism for holding part

[0143] 51…Keep claws

[0144] 52…Retaining claw drive mechanism

[0145] 521…Holding claw drive unit

[0146] 522b ... first transmission unit

[0147] 522c ... second transmission unit

[0148] 6…Pressing member

[0149] 7…Lifting and moving mechanism

[0150] 81 ... first guide member

[0151] 81a…Elastic member

[0152] G1…Guide position

[0153] H1…Retreat position

[0154] 82 ... second guide member

[0155] 82a…Elastic member

[0156] G2…Guide position

[0157] H2…Retreat position

[0158] 9…Block mechanism

Claims

1. A conveying device for conveying a formed object to a lower mold provided with a groove block having a protruding portion, the conveying device comprising: A substrate holding portion for holding the formed object; as well as A holding portion moving mechanism moves the substrate holding portion, and The holding portion moving mechanism moves the substrate holding portion toward the tank block when the molding object is separated from the lower mold, so that the molding object contacts the side surface below the protruding portion in the tank block. After the molding object is brought into contact with the side surface by the holding portion moving mechanism, the substrate holding portion releases the holding of the molding object.

2. The conveying device according to claim 1, wherein the holding portion moving mechanism moves the substrate holding portion horizontally toward the groove block when the molding object is located at a height position between the upper surface of the lower mold and the protruding portion, so that the molding object contacts the side surface.

3. The conveying device according to claim 1 or 2, wherein the substrate holding portion comprises: A holding claw for holding the formed object; as well as The holding claw driving mechanism releases the holding performed by the holding claw.

4. The conveying device according to claim 3, further comprising a base member on which the holding claw is provided so as to be at least movable in a vertical direction. The conveying device receives the molding object from the outside at a position where the holding claw is raised relative to the base member, and releases the holding of the molding object at a position where the holding claw is lowered relative to the base member. The holding claw driving mechanism comprises: A holding claw driving portion, disposed on the base member; a first transmission portion that transmits a driving force from the holding claw driving portion to the holding claw at a position where the holding claw rises relative to the base member; and The second transmission portion transmits the driving force from the holding claw driving portion to the holding claw at a position where the holding claw is lowered relative to the base member. 5 . The conveying device according to claim 3 , wherein a recessed portion is formed in the groove block to avoid interference with the holding claw. 6 . The conveying device according to claim 1 , wherein the substrate holding portion includes a guide member that guides the molded object whose holding is released to an upper surface of a lower mold.

7. The conveying device according to any one of claims 1 to 6, wherein the substrate holding portion comprises: A pressing member for pressing the molding object placed on the lower mold; as well as The lifting and moving mechanism causes the pressing member to move upward and downward relative to the forming object.

8. The conveying device according to claim 1 or 2, wherein the substrate holding portion comprises: A pressing member for pressing the molding object placed on the lower mold; A lifting and moving mechanism, which enables the pressing member to move up and down relative to the forming object; A holding claw is provided on the pressing member so as to be movable in the up-down direction, and hooks and holds the forming object; as well as The stopper mechanism stops the holding claw at a predetermined height position so that the holding claw does not contact the lower mold due to the descent of the pressing member.

9. The conveying device according to claim 8, wherein the substrate holding portion further comprises a guide member, the guide member being movably provided on the pressing member in the up-down direction, and guiding the molded object to be released from holding to the upper surface of the lower mold, The stopper mechanism stops the guide member at a predetermined height position so that the guide member does not come into contact with the lower mold due to the descent of the pressing member.

10. The conveying device according to claim 9, wherein the guide member is configured to be movable between a guide position for guiding the formed object to the upper surface of the lower mold and a retreat position for retreating from the guide position, and is configured to be in the guide position under the elastic force of the elastic member, and can move to the retreat position as the pressing member moves.

11. A resin molding device comprising the conveying device according to any one of claims 1 to 10.

12. A method for manufacturing a resin molded product, wherein a molding object is subjected to resin molding, the method comprising: A positioning step of positioning the formed object relative to the tank block using a conveying device as claimed in any one of claims 1 to 10; as well as The molding step is to perform resin molding in a state where the molding object is positioned.

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