Half-bridge module having insulating connection surface between two strip sections and parallel-guided supply line connected to one of strip sections of conductor path layer

Abstract

The half-bridge module is equipped with a first supply line (Z-), a second supply line (Z +), a phase line (PZ) and a carrier (T). The carrier (T) has a conductor track layer (LS) which has a connection surface (P) in an intermediate section (ZA) located between a first and a second transistor strip section (LA, HA) of the conductor track layer (LS). Each connecting surface (P) is insulated in the conductor path layer in a surrounding manner. The first supply line (Z-) is connected to the connection surface (P) and is guided away from the connection surface. The second supply line (Z +) is connected to at least one contact point (3) in the second transistor strip section (HA) and is guided away from the contact point. A phase line (PZ) is connected to at least one contact point (1, 1 ') in the intermediate section (ZA) or the first transistor strip section (LA) and is guided away from the contact point.

Description

Background Art

[0001] A vehicle with an electric drive has an electric motor, the windings of which are energized in a switchable manner. In order to be able to achieve the required power, which is usually more than 100 kW, high currents, which are usually more than 100 amperes, and operating voltages, which are usually more than 100 V, especially 800 V, are used. The windings are thus energized in a switchable manner using power transistors, which generate switching edges with high current swings in a short time. In particular, in order to achieve even shorter switching edges or higher current rise rates of the transistors, extremely fast switching transistors, such as SiC transistors, are used. In order to be able to use such fast switching transistors effectively, very low-inductance wiring is required. In addition, in the case of fast switching of the transistors, the signal transit time caused by the wiring must be taken into account in order to reliably switch the transistors. The object of the present invention is to show the possibility of wiring high-performance transistors into a half-bridge in a low-inductance manner. Summary of the invention

[0002] This object is achieved by a half-bridge module according to claim 1. Further properties, features, embodiments and advantages are derived from the dependent claims, the description and the drawings.

[0003] A half-bridge module having a first power supply lead, a second power supply lead and a phase lead is described. The leads may also be referred to as busbars or busbars. The half-bridge module further comprises a carrier having a conductor track layer. The carrier may be constructed as one or more layers. The conductor track layer is one side of the carrier and is not an embedded layer. The conductor track layer is an uncovered conductor track layer (i.e. a conductor track layer not covered by an insulating layer of the carrier). The conductor track layer is constructed as a structured conductive layer and therefore has surfaces that are not connected to each other via the conductor track layer. This structuring results in a layout.

[0004] The carrier or the printed conductor layer has a division into three strips. These three strips can relate to the entire carrier or the printed conductor layer, or to an area thereof. The strips are preferably located directly together. These strips are geometric divisions and are not necessarily electrical subdivisions with electrical separation from each other. Therefore, the strips are geometric subdivisions of the surface. The subdivision into strips does not involve a printed conductor type subdivision of the printed conductor layer; in particular, the electrical subdivision or layout can differ from this at least partially. The strips include a first strip section and a second strip section and an intermediate section located between the two. The strips extend along the same longitudinal direction along their larger dimensions. The carrier or the printed conductor layer itself can also be designed, for example, as a rectangle, wherein the longer side of the rectangle extends along the longitudinal direction. This direction is also referred to as the first longitudinal direction.

[0005] The first strip section and the second strip section are respectively constructed for being equipped with transistors or other semiconductors, so that these strip sections are also called transistor strip sections. In the middle section, there are connection surfaces as separate pads. These connection surfaces are electrically insulated relative to the remaining, surrounding printed conductor layers in the printed conductor layer itself, so the connection surfaces are preferably surrounded by channels or grooves or trenches extending through the entire thickness of the printed conductor layer. Therefore, the connection surfaces are surrounded by recesses in the printed conductor layer, and the recesses electrically separate the connection surfaces in the printed conductor layer. The connection surfaces are insulated around the printed conductor layer. If the connection surface is located at the edge of the carrier or printed conductor layer, the connection surface is also insulated around the place where the connection surface is surrounded by other printed conductor layers. Therefore, when the connection surface is located at the edge, the printed conductor layer is partially insulated around the printed conductor layer (and therefore insulated around the area of ​​the connection surface located at the edge), wherein the connection surface is completely insulated around the inside of the printed conductor layer. The geometric subdivision into the first strip segments and the middle segment is in particular different from the electrical subdivision into surfaces within these segments or from a layout in both segments. The geometric subdivision into the second strip segments on the one hand and the middle segment on the other hand can correspond to the electrical subdivision into surfaces within these segments or can correspond to a layout that electrically separates the (conductive) surfaces of the second strip segments from the (conductive) surfaces of the middle segment.

[0006] The first power supply lead is connected to the connection surface, for example, by direct mechanical fastening (solder connection, welding connection, in particular friction welding connection, sintering, screw connection, press-fit connection...). The lead is guided away from the connection surface. As a result, the potential of the supply voltage can be fed into the middle area of ​​the printed conductor layer, while the (two) other leads can be guided into the strip section (or into a strip section and the middle area) in order to be connected to the surface of the printed conductor layer there. Therefore, by using the connection surface in the middle section, it is possible to mechanically connect all three leads to the corresponding (respectively single or multiple) contact points of the printed conductor layer, that is, to the same conductive layer. Therefore, no additional layering is required, because the power supply lead can be fastened in the middle section or connected to the connection surface present there.

[0007] Furthermore, the conductor track layout of the conductor track layer enables contact locations for the leads, which are all located in the conductor track layer (even in electrically isolated regions or surfaces of the conductor track layer). This results in a negative and cost-effective connection technology, which also enables short signal transit times. The three leads can be connected to the relevant contact locations of the conductor track layer in the same manner, so that the leads can also be designed to be low-inductance and low-interference.

[0008] Flat conductors such as plates extending away from the printed conductor layer are particularly suitable as leads. For example, two power supply leads can be constructed to be closely located together, wherein a low-inductance connection is possible due to the small area between the power supply leads. Due to the connection of the first power supply lead to the connection surface (in the middle section) and the fastening of the second power supply lead in the second strip section, they are in close contact with each other on the printed conductor layer and can thus be led away from each other closely together. In this case, starting from the contact point where the power supply lead is connected to the printed conductor layer, one power supply lead extends toward the other power supply lead (for example, the second lead extends toward the first lead, or vice versa, or both extend toward each other), so that the two leads can extend away from the carrier along the same stretch. The two leads can be placed one on top of the other (preferably with an insulating layer between them).

[0009] This parallel, close guidance of the two co-located supply leads results in a low-inductance connection. The measures according to the invention allow the phase lead to be guided away from the two supply leads. Thus, starting from the contact point at which the phase lead is connected to the printed conductor layer, the phase lead can be guided away from the supply lead, in particular away from the contact point at which the supply lead is connected to the printed conductor layer. As a result, interference emitted by the phase lead can only be coupled to the supply lead in small amounts, and vice versa.

[0010] In the direction along the conductor track layer (in the longitudinal direction, in particular in the direction perpendicular to the direction of extension of the segments or in the direction perpendicular to the direction in which the connection surface segments and the connection surfaces alternate), the conductors can be arranged in a row as follows: the second supply conductor (which is fastened to the second strip segment), the first strip segment (which is fastened to the connection surface or fastened in the middle segment) and then the phase conductor, which is connected in particular to the conductor track layer in the first strip segment or to the surface in the middle segment connected to the first strip segment (connection surface segment). In particular, the connection surface allows a sequence in which two supply conductors are arranged in succession, followed by the phase conductor, so that the phase conductor is also physically separated from the supply conductor.

[0011] Thus, the phase conductors can extend from the conductor track layer over one side of the half-bridge module, while the supply conductors extend over the opposite side of the carrier. Thus, the supply conductors on the one hand and the phase conductors on the other hand extend away from the carrier in opposite (generally speaking: in different) directions. No additional connecting elements are required to ensure that the phase conductors should not be arranged between the supply conductors.

[0012] One aspect is that the half-bridge module has at least one first power supply lead and at least one second power supply lead. The first power supply lead is preferably assigned to a negative potential, wherein the second power supply lead can be assigned to a positive potential. These two potentials are preferably the potential of the supply DC voltage. The second lead is connected to the second surface. The first lead is connected to the connection surface. The second lead is connected to the printed conductor layer at a location located in the second strip section, and the location where the first lead contacts the printed conductor layer is located in the middle section. Therefore, in the direction from the second strip section to the first strip section, the connection location of the second lead is first set, followed by the connection location of the first lead. The connection location is in this case the location where the lead is connected to the printed conductor layer. The extension of the phase lead is further guided away from the printed conductor layer along the direction from the second strip section to the first strip section mentioned.

[0013] The region between the supply conductors is free of phase conductors. The phase conductors extend to that side of the region which is located between the phase conductors. The connection surface and its connection to the first conductor result in that the phase conductors do not extend between the supply conductors but can extend away from the supply conductors without intersecting them.

[0014] A first connector is provided, which is connected to the connection surface and in particular starts from the connection surface. These first connectors extend from the connection surface into the first strip section. In particular, the first connector extends from the connection surface toward the first surface, in particular to the portion of the first surface that extends into the first strip section. The first connector extends from an edge area of ​​the connection surface adjacent to the first surface (within the first strip section) into the first strip section (for example, until a transistor contact site or a corresponding contact surface). The first connector extends in particular to an equipment surface area in the first surface or the first strip section. A short distance is obtained for the connector because the connection surface is directly adjacent to the first strip section. A second connector extending from the connection surface section to an equipment surface area in the second surface can be provided.

[0015] In the case where the half-bridge module is already equipped, the first transistor is mounted in the first stripe section, in particular on the portion of the first face that is present in the first stripe section. The first connector extends from the connection face to a contact face or another contact element of the transistor located in the first stripe section. The contact face or contact element can be part of the transistor or can be directly connected to the transistor. The first transistor can exist as a housingless device. This also applies to the second transistor, which can be mounted in the second stripe section or on the second face or in the second face.

[0016] Each transistor can have a first contact surface, and the transistor is mounted on the first or second surface with the first contact surface, or is directly electrically connected to the first or second surface in other ways. The first contact surface is located on the lower side of the transistor. The transistor can have a second contact surface connected to a connector. The second contact surface is located on the upper side of the transistor. The first connector can be connected to the second contact surface of the first transistor. In particular, the connector extends from the contact surface to the second contact surface of the transistor. The contact surface is assigned to the electrode of the power path of the transistor and can be assigned to the source, drain, collector or emitter of the transistor. The connection surface can be connected to multiple transistors (via at least one of the first connectors) or can be connected to only one transistor.

[0017] When the semiconductor module is not equipped, an equipment surface area is provided in the first or second strip section. In other words, the equipment surface area is located on the first and second surfaces. The equipment surface areas are arranged in rows, in particular, along the longitudinal direction or the first direction of the carrier and are spaced apart from each other. The first equipment surface area is located in the first strip section. The transistors in the first strip section can be arranged in rows along one row or along multiple rows, and the rows extend along the first direction or the longitudinal direction. On the second surface, there may be one or more rows of equipment surface areas extending along the longitudinal direction or the first direction. The equipment surface area is particularly constructed for equipping with transistors, for example by means of SMD technology. For this purpose, the equipment surface area may have an equipment layer, for example, a metal layer, a sintering layer or a tinning layer for improving sintering or welding properties. The equipment surface area can be set up for sintering or welding transistors.

[0018] The first surface extends in the first strip section as a continuous surface. The first surface basically completely covers the first strip section. In the first strip section, there is no electrical separation of the first surface, especially in the longitudinal direction. Mechanically continuous surfaces and electrically continuous surfaces, that is, surfaces with the same potential are called continuous surfaces. Surfaces that are subdivided into individual surface sections but directly connected to each other also belong to this. The connecting surface section extends in the middle section. The connecting surface section is connected to the first surface in the first strip section. This can be set by an electrical connection element. However, preferably, the connecting surface section is a portion of the first surface that extends in the middle section, and the first surface also extends in the first strip section in addition. In other words, the connecting surface section can extend into the middle section away from the portion of the first surface located in the first strip section. Therefore, the first surface extends in the first strip section and further includes the connecting surface section in the middle section.

[0019] Preferably, the connecting surface section extends from the first strip section to the second strip section or is adjacent to the second strip section. In other words, the first surface extends to the second strip section or reaches the second surface (but is electrically separated from the second surface). The first surface extends from the first strip section. The connecting surface section is adjacent to the second surface or the second strip section. Therefore, the connecting surface section extends from the first strip section to the second strip section. The printed conductor layer stipulates the electrical separation between the connecting surface section (i.e., between the first surfaces) and the second surface (in the second strip section). The printed conductor layer also stipulates the electrical separation between the connecting surface section (i.e., between the first surfaces) and the connecting surface.

[0020] Both the connection surface section and the connection surface extend in the middle section. The connection surface is electrically separated from the first surface and therefore also electrically separated from the connection surface section (in the printed conductor layer). The connection surface and the connection surface section are also electrically separated from the second surface and therefore electrically separated from the second strip section in the printed conductor layer. The connection surface and the connection surface section are alternately arranged in the middle section. In this case, the connection surface and the connection surface section are arranged in rows staggered or alternately along a direction corresponding to the longitudinal direction or the first direction. Not only the first strip section, the middle section, but also the second strip section extend along the first direction. The first strip section, the middle section, and the second strip section are arranged in rows in a direction perpendicular thereto (i.e., along the width of the carrier). However, the connection surface section and the connection surface are arranged in rows along the first direction (in other words, perpendicular to the direction in which the strip section and the middle section extend respectively). This also applies to the equipment surface area of ​​the transistor or to the transistor itself when the half-bridge module is already equipped.

[0021] A second connector connected to the connection surface section is provided. These second connectors extend into the second transistor strip section. In particular, the second connector extends from the connection surface section into the second strip section, in particular, extends to the equipment surface area on the second surface or extends all the way to the second contact surface of the transistor located on the second surface or in the second surface. One or more connectors can be guided away from the connection surface section. In addition, one or more first connectors can extend away from the connection surface. The connection surface section can be connected to one or more second transistors via one or more second connectors. The connection surface reaches the second surface all the way, so that the second connector can be kept very short. The first connector can also be constructed very short because the connection surface reaches the first strip section or reaches the part of the first surface located in the first strip section. Preferably, the first connector is connected to the edge area of ​​the connection surface that reaches the first strip section or reaches the part of the first surface that is located in the first strip section. The second connector is preferably connected to the connection surface section at the edge area of ​​the connection surface section opposite to the second surface. The connector can be a conductor, in particular a bonding strip or bonding strip, a bridge connector or a connecting element including pins, etc. The connector may be constructed from a conductive material, preferably aluminum or copper.

[0022] The first power supply lead is connected to the connection surface located in the middle section at the contact position. As a result, the first power supply lead can be guided in close proximity to the second power supply lead, and the second power supply lead is led out approximately from the second surface. The phase lead is connected to the printed conductor layer at the contact position located in the middle section or in the first transistor strip section. In the case of the first possibility, starting from the contact position of the phase lead, the distance from the first transistor is roughly the same as that from the second transistor. As a result, the first transistor and the second transistor can be connected to the phase lead symmetrically in terms of resistance and phase transit time. With the second possibility mentioned, the phase lead can be guided at a large distance from the power supply lead to avoid interference. The two possibilities have in common that the power supply lead can be led away on one side, while the phase lead is led away on the opposite side. In particular, it is possible that the phase lead does not have to be led between the power supply leads.

[0023] The embodiment provides that the phase lead is connected to the printed conductor layer at the contact position located in the middle section. These contact positions are located in the center between a row of transistor mounting surfaces in the first transistor strip section and a row of transistor mounting surfaces in the second transistor strip section with deviations, wherein the deviation is not greater than 20 mm, 15 mm, 10 mm or 5 mm. In other words, the contact position at the connection between the phase lead and the printed conductor layer is basically located in the center between the first strip section and the second strip section or in the center between the mounting surfaces present there. According to the first possibility mentioned above, symmetrical leads are obtained. When the half-bridge module is equipped, the transistor mounting surface is equipped with transistors. The transistor mounting surface corresponds in particular to the equipment surface area mentioned above. In this way, the phase lead is guided away from the middle section. The first power supply lead is also guided away from the middle section, but from a different surface (i.e., from the connecting surface) than the phase lead extending away from the connecting surface section, i.e., the part of the first surface located in the middle section.

[0024] Other embodiments provide that the phase lead is connected to the conductor track layer at a first contact location, the first contact location being located in the first strip section or in the middle section. The first supply lead is connected to the connection surface at a second contact location. The second supply lead is connected to the conductor track layer at a third contact location. The third contact location is located in the second strip section or on the second surface. The first contact location is located on the first surface, in particular in a region of the first surface extending in the first strip section.

[0025] The first and second power supply leads and the phase leads respectively have a shunt section opposite to the mentioned contact position in the extension of the leads. Therefore, the leads are extended in the following manner, that is, the leads start from the contact position, extend on other sections if necessary, and then lead to the corresponding shunt section suitable for external connection of the half-bridge module. On the one hand, the shunt section of the power supply lead and on the other hand, the phase lead extend away from the carrier in opposite directions. The leads extend in particular in a direction perpendicular to the first direction or the longitudinal direction. The leads can extend in particular along a plane substantially parallel to the carrier or the printed conductor layer. The leads extend across the assembly surface area or across the mounting surface. This is particularly applicable to the power supply leads, wherein the first contact position can also be located at the outer edge of the middle section, so that the first contact position does not lead across the mounting surface itself. In this case, the first contact position is arranged at the outer edge area of ​​the carrier, and the mounting surface or the equipment surface area is placed closer in the direction of the middle section.

[0026] At least one row of third contact locations can be arranged in a direction perpendicular to the first direction and along the conductor track layer. The third contact location can be followed by a row of second contact locations in the middle section. The first contact location can be arranged after the second contact location in a further extension (perpendicular to the first direction) or can also be arranged at the height of the second contact location. The latter can be achieved in particular by the first contact location and the second contact location being arranged alternately in the longitudinal direction or along the first direction, i.e. alternately on the connection surface and the connection surface section.

[0027] In the extension of the second power supply lead and starting from the third contact position, after the contact position or after the position where the lead is mechanically connected to the third contact position, there may be a connecting section. In the connecting section and along the extension starting from the contact position, the lead is guided away from the carrier or the printed conductor layer. The approach section of the lead after the connecting section can also extend away from the carrier, but can also extend parallel to the carrier or extend towards the carrier (but not completely). In the approach section, the second power supply lead approaches the first power supply lead. In the approach section, the second power supply lead extends along a first lateral direction, which is especially parallel to the carrier and is guided toward the middle section (or toward the area above the middle section). In particular, the second lead extends along a first lateral direction, which points in the direction of the area arranged above the second contact position. Therefore, the first lateral direction leads to a half space above the second contact position or above the middle area. Here, "above" means that the space extends away from the carrier (starting from the printed conductor layer).

[0028] Since the first current conductor starts from the middle section, that is to say from the contact point or connection surface in the middle section, the second conductor approaches the first conductor due to the approach section. As a result, a smaller area is obtained between the current conductors in the cross section, which leads to a smaller inductance. Alternatively or in combination therewith, the first current conductor can also extend from the relevant contact point (second contact point) to the approach section, in which the first current conductor extends to the second strip section or to an area above the second strip section.

[0029] In other words, for example, the first current supply conductor can be guided away from the carrier, starting from the connection surface, first through a first arch and then through a second arch parallel to the carrier over the second strip section. A space is formed between the second strip section and the first current supply conductor, in which the second current supply conductor extends towards a section of the first current supply conductor, in which the first current supply conductor extends above the carrier and away from the carrier. In other words, the second current supply conductor is first bent parallel to the carrier towards the first current supply conductor, so that it is then guided away at a small distance from the first conductor along the extension of the first current supply conductor (starting from the point where the current supply conductors converge). Therefore, the point where the second conductor meets the first conductor (i.e. the convergence point) is not located above the third contact point, but above the middle section or the edge region of the second strip section adjacent to the middle section. The current supply conductor is not guided above the phase conductor and is also not guided above the contact point where the phase conductor is connected to the conductor track layer (or to the first surface).

[0030] The first current conductor and the second current conductor are preferably mostly guided substantially parallel at a small distance, i.e., for example, at a distance of less than 10 mm, 5 mm, 3 mm, 2 mm or 1 mm from each other. In particular, the first conductor and the second conductor overlap over a large part of their extension and are separated only by an insulating layer or insulating layer. This also applies in particular to the part of the current conductor that is obtained after the position where these conductors converge. The insulating layer can include at least one lacquer layer and / or have a strip made of an electrically insulating material. In particular, starting from the approach section (seen from the carrier), the first and second current conductors extend together, that is, they are electrically insulated from each other, but physically close to each other (in particular at a distance of less than 5 mm, 3 mm, 2 mm or 1 mm). Preferably, an insulating strip or insulating layer with a thickness of less than 10 mm, 5 mm, 3 mm, 2 mm or 1 mm is arranged between the current conductors.

[0031] The phase lead has a first contact section at which it is connected in a planar manner to a surface of a first transistor stripe section or to a connection surface section. The first contact section is in particular connected to the first surface, for example to its connection surface section or to a part of the first surface that extends (continuously) in the transistor stripe section. The contact section can be constructed by a bend in the phase lead, which causes the first contact section to be guided parallel to the first surface. The first contact section is therefore parallel to the first surface and preferably has a lower side that is connected in a planar manner to the first surface or to the connection surface section or to the surface of the first transistor stripe section.

[0032] The power supply lead can also have a contact section that is guided parallel to the printed conductor layer and connected to the printed conductor layer in a planar manner. For this purpose, the power supply lead can also have a bend that leads to the contact section and directs the contact section parallel to the printed conductor layer. The contact section of the power supply lead also has a lower side that is connected to the corresponding surface or surface section of the printed conductor layer in a planar manner. Two contact sections in the contact section of the first power supply lead are connected to the connection surface in a planar manner, that is, connected to the surface in the middle section that is electrically insulated from the first surface in the printed conductor layer. The second power supply lead can have a third contact section, and the second power supply lead is connected to the second surface or to the surface in the second strip section at the third contact section. The contact sections can extend along the printed conductor layer respectively. In particular, the printed conductor sections extend in the same plane. This plane corresponds in particular to the surface of the printed conductor layer. Therefore, the contact section is connected to the same printed conductor layer.

[0033] In one aspect, the second current supply conductor has a contact section, in particular a third contact section, at which the conductor is connected in a planar manner to the connection surface.

[0034] In general, each lead preferably has a plurality of contact sections that contact the conductor track layer at a plurality of locations, wherein these contact locations or contact sections can be arranged for each lead along a row extending in a first direction or longitudinally. A plurality of first contact locations of the phase lead are connected to one another via a first surface. A plurality of third contact locations of the second supply lead are connected to one another via a second surface. A plurality of second contact locations of the first supply lead are connected to one another via the lead itself.

[0035] Each supply lead and / or each phase lead has a plurality of contact sections arranged in a row along a first direction. In the case where each lead has a plurality of contact sections, the contact sections are (electrically) aggregated by the lead itself. In other words, the plurality of contact sections of the lead extend from an integral section of the lead to the associated contact location.

[0036] Each contact section extends along the conductor track layer. The contact section extends in the direction of the middle section in the direction of the extension of the lead wire leading away from the carrier. After the contact section (in the extension of the lead wire) is the connection section. In this connection section, the lead wire extends away from the conductor track layer.

[0037] In the course of the second current conductor, the contact section is followed by a connection section of the conductor, and the connection section is preferably followed by a plurality of (adjacently running) access sections or an access section of the conductor. This applies in particular to the second current conductor and / or the first current conductor.

[0038] The approach section extends in the direction of the area above the middle section. The approach section (of the second current conductor) further preferably extends parallel to the conductor track layer toward the first current conductor. In this case, the approach section extends toward the section of the first current conductor that extends substantially vertically away from the carrier.

[0039] After the approach section is the reverse arch. In the reverse arch, the extension direction of the lead is reversed. The reversal results in a direction leading away from the area above the middle section. Preferably, after the reverse arch is the shunt section (of the lead). The shunt section extends away from the area above the middle section. Subsequently or in further extension, the shunt section extends away from the carrier. The shunt section is set up for connection with an external conductor with a potential. The connection can be direct or can be guided via a shunt connector connected to the shunt section. It is thus possible to adapt the lead to the surrounding application by adapting the shunt connector, in particular to achieve a predetermined size.

[0040] Preferably, each lead has a plurality of contact sections. In each lead, the contact sections are gathered into a common section in a direction of extension leading away from the contact sections. Thus, the lead may have a gathering in which the individual contact sections or the individual sections leading to the contact sections are gathered into a unique section of the lead. These gatherings may be arranged in the connection section of the lead, in the approach section of the lead (especially in the case of the second power supply lead), or may be arranged in an inverted arch, or even only in the shunt section. The contact sections may already be gathered in the subsequent section of the lead, but the contact sections may also be gathered only in the approach section or in the inverted arch or in the section following the preceding section, in which the lead extends, for example essentially vertically, away from the printed conductor layer in a half space above the printed conductor layer. Thus, each lead can have a clustering, wherein in a section leading to the carrier before the clustering the lead is divided or spread out into a plurality of individual (arranged side by side) lead portions, and wherein during or after the clustering the lead is arranged from a single conductor (eg a sheet metal strip).

[0041] If the leads are provided as conductive strips, for example sheet material strips, such as sheet material, the leads are wider in one or more sections in which they are provided as individual conductors than in the sections in which the feeds are to be gathered or have been gathered. In particular, in the sections in which the gathering is located, the overall width of the leads decreases in the direction of extension leading away from the conductor track layer.

[0042] Each lead, in particular at the contact position, can be provided as a separate spring. In the further extension of the lead away from the printed conductor, these springs are gathered into or lead to a single conductor section, via which the contact section is gathered. This gathering corresponds to a direct electrical connection between the individual springs. In particular, in the corresponding shunt section, the lead is only implemented as a single (and continuous in width) conductor, which is preferably narrower than the width taken by the contact spring or contact position. Thus, the individual contact springs or contact positions are accessed from above the carrier, because the shunt section located above is narrower and does not cover the spring from above. These springs correspond in particular to the contact sections of the corresponding leads.

[0043] Another aspect is that the lead is subdivided into a plurality of parts during the extension from the conductor track layer. In the extension direction, one part follows the next part. A physically independent shunt connector can be provided, which is electromechanically connected to the shunt section. The plurality of parts are preferably connected to one another via connecting links, wherein the parts can be screwed together or riveted, or can also be sintered, soldered or preferably fused to one another. The multi-part nature results in the possibility of geometrically adapting the connection of the half-bridge module to external objects.

[0044] The lead and / or connector and / or printed conductor layer are made of a conductive material, in particular of a metal or alloy, for example of copper or a copper alloy or of aluminum or an aluminum compound. In this case, the material can be constructed as a sheet metal part, in particular a stamped sheet metal part. The connector is preferably constructed for joining or sintering or soldering or bonding (conductively); the connector is in particular constructed for friction welding, sintering, (conductively) bonding or soldering. The transistor is a power transistor, preferably a MOSFET or an IGBT, in particular a SiC power semiconductor, such as a SiC-MOSFET. Other power semiconductors such as diodes can also be arranged on the printed conductor layer, in particular in combination with transistors. The power supply lead is a lead for supplying a voltage (DC), in particular two DC voltage supply potentials having a high voltage voltage with a nominal value greater than 60V or at least 200V, 400V, 600V, 800V or more. The phase lead is used to connect to the phase of the load, and therefore can also be referred to as a load lead. An inverter module such as a traction inverter module may have a plurality of half-bridge modules and a plurality of phase terminals, each of which is electrically connected to a specific phase lead of the phase leads. The inverter module (or half-bridge module) may have a heat sink surface. One or more carriers are fastened to the heat sink surface, in particular to the bottom side opposite the printed conductor layer. The inverter module or half-bridge module is a power module and is in particular designed for a nominal power of at least 10 kW, 100 kW or 250 kW.

[0045] The carrier is in particular designed as a substrate or a circuit board, for example as a PCB, DCB or IMS. The carrier can have a layer for heat dissipation opposite the conductor track layer, which layer is preferably composed of a metallic material (and is electrically insulated from the conductor track layer via an insulating layer). The conductor track layer forms the outer side of the carrier and is in particular not shielded by the insulating layer of the carrier. The half-bridge module shown can be injection-molded (with an insulating material that is not part of the carrier) and / or can be shielded with an insulating lacquer layer (which is not part of the carrier). BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figures 1 to 3 is a schematic diagram of features of a half-bridge module and is used to explain the exemplary embodiment in more detail. DETAILED DESCRIPTION

[0047] Figure 1is a cross section of an equipped half-bridge module. The cross section extends along the width of the carrier T and vertically through the carrier. The carrier T comprises a conductor track layer LS, which can be geometrically divided into a first strip section LA, a middle section ZA and a second strip section HA. This subdivision serves to explain the individual functions in more detail and is a conceptual division that does not necessarily have an electrical correspondence. Since the strip sections can also be equipped with transistors HT, LT or provided for this purpose, the strip sections are also referred to as transistor strip sections.

[0048] An equipped embodiment of a half-bridge module is shown by way of example, wherein the mounting surface formed on the upper side of the conductor track layer LS instead of the transistors LT, HT when the half-bridge module is not equipped. The intermediate section ZA is arranged between the strip sections HA, LA, wherein the sections HA, ZA and LA are arranged in this order in a row (in a direction perpendicular to the longitudinal direction R1, e.g. Figure 2 ). The first surface F1 of the conductor track layer LS is located in the strip section LA, wherein the surface F1 is perpendicular to the plane of the drawing (ie, along the direction R1, as shown in Figure 2 The second surface of the printed conductor layer LS is located in the second strip section HA, and the second surface is also Figure 2 The second surface F2 is shown in FIG. 1 . The second surface is connected to the middle section ZA of the conductor track layer LS or the surface structure present there via the gap L (see Figure 2 , reference numerals VF and P) are separated.

[0049] A first connector V is shown, which connects the upper side or the upper contact surface of the transistor LT to a surface in the middle section. This surface corresponds to Figure 2 The second connector V' connects the transistor HT in the second stripe section HA to the surface in the middle section ZA. This is another surface in the middle section ZA, i.e. part of the first surface, which is also referred to as the connection surface section VF (see Figure 2 ).

[0050] The conductor track layer LS is fastened to the insulating layer IS (which is continuous). The underside of the conductor track layer LS points to the insulating layer IS in this case. The leads Z+, Z- and PZ are connected to the conductor track layer LS. These leads are connected to the conductor track layer LS, in particular, on the upper side of the conductor track layer LS that faces away from the insulating layer IS.

[0051] The first and second power supply leads Z-, Z+ are shown on the left side above the printed conductor layer LS, wherein the third lead, i.e. the phase lead, is indicated by the reference numeral PZ. It can be seen that the ends of the leads pointing away from the carrier T extend in opposite directions. In this case, the two power supply leads Z-, Z+ extend in a direction opposite to the direction in which the phase lead PZ extends. This applies in particular to the shunt sections AA+, AA- and PA. The shunt section AA- is a section of the first power supply lead, the shunt section AA+ is a section of the second power supply lead, and the section PA is a shunt section of the phase lead PZ. The shunt section is used to connect to an external component. The power supply lead is used to connect to a DC voltage power supply device, for example, to a DC voltage on-board power grid or a battery. The phase lead PA is used to connect to the phase of a load or component (for example, a motor).

[0052] The contact sections KA+, KA- and KAP are Figure 1 These contact sections belong to the corresponding leads Z+, Z- and PZ and in particular form the ends of the leads which are fastened to the conductor track layer LS. Figure 2 As can be seen in FIG. 1 , a plurality of contact locations 1 , 2 and 3 are located distributed on the conductor track layer LS (or the corresponding surfaces F1 , F2 , P or surface sections thereof, such as surface section VF), to which contact locations the contact sections KA+, KA− and KAP are fastened.

[0053] In particular, in the middle section ZA, the connecting surfaces P and the connecting surface sections VF alternate in the longitudinal direction R1, such as from Figure 2 In order to contact these multiple connection surfaces P and connection surface sections VF, at least the leads AA-, PZ have separated conductor sections or springs that contact the individual contact locations 1, 2. The conductor sections are arranged at intervals from each other in a first direction or in the longitudinal direction R1 ("arranged in a row", corresponding to the individual contact locations) and are arranged in a row along this direction. These separated conductor sections or segmented line laying can extend on the connection sections VA-, VA2-. In particular, the separated conductor sections can extend up to an arch, with the aid of which the leads Z- and PZ extend again parallel to the carrier. The conductor sections can be gathered in the arch; the gathering can be located within the arch. The individual conductor sections can extend up to the shunt sections PA, AA-, so that the gathering is arranged there.

[0054] Therefore, the lead can have a gathering or gathering position, at which the conductor segments are gathered into a common conductor. Preferably, the conductor is narrower from the gathering position than at the stretching section where the individual conductor segments are present. The web can be arranged between the individual conductor segments or reeds associated with the same lead. The second power supply lead Z+ can also be arranged as multiple conductor segments at the contact section KA+. These conductor segments can also continue along the sections VA and NA individually, especially also in the inverted arch UB. In the inverted arch UB or in the position immediately following it, the individual conductor segments can be gathered into a common conductor. Here, the web can also be arranged between the conductor segments. Through the conductor segments, the corresponding potentials of the leads Z-, Z+ and PZ can be distributed on the printed conductor layer LS along the direction R1 or can be arranged in rows. The symmetrical connection of different transistors is obtained. Furthermore, the aggregation within the leads (leads Z and PZ) has an electrical function when connecting to the connection surface P and the connection surface section VF, because the individual conductor sections and therefore also the individual connection surfaces or connection surface sections are electrically connected to each other by the aggregation. This connection corresponds to a short circuit and allows the potential of the relevant leads to be fed to the individual surfaces P and VF. Since the connection surfaces P are insulated from each other, the potential equality or direct connection between the connection surfaces is provided by the aggregation of the conductor sections in the extension of the first current supply lead Z-. For the connection surface section VF or the contact point 3 on the second surface, such aggregation is not necessarily necessary, because such aggregation already provides a direct connection between the individual surfaces due to the continuous guidance of the second surface F2 in the second strip section HA or the continuous guidance of the first surface in the first strip section LA. Figure 3 By way of example, leads are shown which are divided on a conductor track layer into individual conductor segments which are arranged next to one another (in a direction R1 ) and which are each grouped together to form an overall conductor.

[0055] Figure 2 1 is a top view of a carrier T and is used to understand the half-bridge module described here in more detail. The carrier T is divided into three longitudinal sections or strip sections shown one above the other, namely a first strip section LA, a middle section ZA and a second strip section HA. All three extend along a first direction R1 and are arranged in a row perpendicular to the direction R1, as shown. A portion of the first surface F1 is located in the first strip section LA, wherein the other connecting surface sections VF of the first surface F1 extend separately into the middle section ZA (up to the strip section HA).

[0056] A transistor LT with surface contact OK is mounted on a first face in a strip section LA. The transistor is contacted by means of a connector V, which leads to a connection surface P located in the middle section ZA. The middle section ZA has a connection surface section VF belonging to the first face F1 and also has a connection surface P insulated from the first face (and also from the second face F2). The connection surface P extends between the two strip sections LA and HA. Along the first direction R1, the connection surface sections VF and the connection surfaces P of the first face F1 alternate. The first contact portion is located on the connection surface section VF. Alternatively, the first contact portion can be arranged at an edge section of the first strip section LA, as indicated by the reference numeral 1', wherein the edge section includes the outer edge of the first strip section LA. The contact portion 1' is also located in the portion of the first face F1 located in the strip section LA. It is shown that the alternative first contact portion 1' is offset substantially between the transistors LT or offset upward relative to this. The alternative first contact portion 1' is offset relative to the transistor LT toward the outer edge opposite to the strip section HA.

[0057] The other transistors HT are arranged in the second strip section HA. Like the transistors LT arranged in a row in the first strip section in the direction R1, the transistors HT are also mounted on the second surface F2 and arranged in a row along the second strip section HA. These transistors are arranged in a row at a distance from each other so that hot spots do not occur. These transistors also each have a signal contact SK, which is arranged on the side of the transistor that points to the outer edge of the carrier T opposite to the strip section HA.

[0058] The second connector V' connects the connection surface section VF to the surface contact OK' of the transistor HT. By fastening the transistor to the first and second faces F1, F2, the second surface contact (on the bottom side of the transistor) is directly located on the first and second faces and is fastened to the first and second faces, for example, by means of a solder connection or a sintered connection. The connectors V, V' can in particular be bonding strips made of a metal material, for example of an aluminum material or a copper material.

[0059] The recess L separates the surface F2 on the one hand from the connection surface section VF and the connection surface P, which are led as far as the second surface, on the other hand. The connection surface P is thus also separated from the second surface F2 (within the conductor track layer LS).

[0060] Figure 1 The first contact surface 1 (see Figure 1 and Figure 2 ) is connected to the phase conductor PZ. This also applies to the contact surface 1 '. The contact section KAP is part of the phase conductor PZ. The contact section KAP (see Figure 1) is applied in a planar manner to the first contact location 1 or 1' and is connected to the first contact location (for example by means of a welded connection (for example a friction welded connection), by means of a sintered connection, by means of a solder connection or by means of an adhesive connection). Due to the presence of a plurality of contact locations 1, namely one contact location in each intermediate section, the phase conductor PZ has a plurality of conductor segments or spring strips spaced apart in the direction R1 at the contact section, which are then brought together during the further development of the phase conductor PZ. By bringing together, the phase conductor PZ is narrowed, so that, for example, after the second arch, namely in the diversion section PA, the phase conductor has a width that is smaller than the width of all conductor segments at the contact section KAP (i.e. the width along which the first contact locations 1, 1' are distributed in the direction R1).

[0061] The first current supply lead Z- also has a contact section KA-, in which the first current supply lead Z- is divided into individual conductor sections in order to contact the individual connection surfaces P or the contact surfaces 2 arranged there (without causing contact with the first surface F1 or the second surface F2). The second contact surfaces 2 are distributed along the direction R1, so that the individual conductor sections of the lead Z- are led away from these second contact locations 2. Therefore, the conductor sections are arranged in a row in the longitudinal direction R1 and are spaced apart from each other in this direction. The distance between the conductor sections that are in contact with the contact surface 1 or 2 is such that no contact is established between the potentials of the leads.

[0062] The second current supply conductor Z+ is likewise equipped with spaced apart conductor segments in order to contact the third contact surface 3. There, the conductor segments are also guided substantially parallel along the conductor track layer LS and placed on it. In the second current supply conductor Z+, the individual conductor segments are also gathered in the extension of the conductor away from the contact point 3, wherein this gathering occurs as the width of the conductor decreases. In this case, the width is in particular the dimension of the conductor in the direction R1.

[0063] In the extension direction, the leads Z+, Z- and PZ have contact sections, wherein in each contact section the lead in question is fanned out into conductor sections or springs that are guided side by side, in order to thereby contact a plurality of contact surfaces 1, 2 or 3 of the same type (i.e., at the same potential). In the extension away from the conductor layer, the conductor sections are gathered. This is also Figure 3 , which is shown by way of example for leads Z+ and Z−.

[0064] exist Figure 3, the narrowing of the lead due to the gathering of the conductor segments (in the direction of extension away from the contact segment) results in individual (side-by-side, fan-shaped) conductor segments or contact segments being accessible from above. It can be seen that the contact segments KA+ and KA- extend in opposite directions. These contact segments KA+, KA- of the two current supply leads Z+, Z- enable the contact segments to be simply fastened to the corresponding surfaces, for example by friction welding. Thus, a connection type is possible in which the contact segments are fastened to the conductor track layer by processing from above.

[0065] As shown, the contact sections KA-, KA+ are implemented as individual conductor sections, which are brought together in the further development of the leads Z+, Z- and are each converted into a common conductor. The common conductor is present in particular in the shunt sections AA+, AA-. It is also shown that no conductor section or contact section KA+ is provided below these brought together supply leads Z+, Z- or below the shunt sections, in order to thereby enable access from above, for example for fastening by means of friction welding.

[0066] In addition Figure 3 , which are located below the power supply leads Z+ and Z-. In addition, the contact section KA-, that is, its individual conductor sections are connected to the connection surface P. In addition, it is shown that the connection surface section VF belonging to the first surface F1 is arranged between the individual connection surfaces. Finally, it can be seen that a groove is arranged in the printed conductor layer, which, for example, completely surrounds the connection surface P in order to separate the connection surface P from the connection surface section VF, and in order to separate the connection surface section and the connection surface P from the second surface F2. This separation occurs in the printed conductor layer LS and makes it possible to guide different potentials in the connection surface, the connection surface section VF and the second surface F2 all arranged in the same printed conductor layer LS.

[0067] Especially according to Figure 3 The perspective view of , shows that the connection surface P, connection surface section VF and second surface F2 representing the connection potential and phase potential are constructed in the same printed conductor layer. In addition, it can be seen that no additional connecting element is required to establish the connection between the relevant potential surfaces of the lead and printed conductor layer LS.

[0068] Electrically, the transistors shown in the figure constitute a half-bridge with a high-side transistor element and a low-side transistor element. The high-side transistor element is composed of transistors HT connected in parallel, and the low-side transistor element is composed of transistors LT connected in parallel. The parallel connection is obtained by a common surface F1 or F2 connected to the transistors and by the aggregation of the connection surface section VF via the first surface (in the first stripe section) or by the potential of the connection surface being drawn out via the same power supply lead Z-. The connection point between the transistor elements of the half bridge is represented by the first surface F1. The connection point or the first surface F1 is connected to the phase lead PZ. The outer end of the half bridge is composed of a connection surface P on the one hand and a second surface F2 on the other hand. In this case, the connection surface P constitutes the negative power supply terminal of the half bridge. The second surface F2 constitutes the positive power supply terminal of the half bridge.

[0069] The half-bridge module shown is preferably designed as a power half-bridge module, in particular for powers significantly greater than 10 kW, in particular greater than 50 kW. The half-bridge module is in particular designed as a high-voltage half-bridge module with a nominal voltage greater than 60 V and at least 200, 400 or 800 V. The half-bridge module shown is preferably used in a traction inverter of a vehicle, but can also be used in a DC converter (preferably on the vehicle side). Other possible applications are stationary inverters, etc.

[0070] In particular, when used as a traction inverter, a plurality of phases is required, so that the corresponding inverter has at least one half-bridge module for each phase. Therefore, in the case of a three-phase inverter, at least three half-bridge modules (with separate phase leads) are provided, wherein in particular the supply leads Z+, Z- can be designed jointly or separately and can be electrically connected to one another.

[0071] The half-bridge module shown in the figure is based on a rectangular carrier T. The sections LA, ZA, HA shown can completely divide the carrier T or can completely divide the power range of the carrier T.

[0072] The sections LA, ZA and HA are preferably directly adjacent to each other, wherein the distances of the relevant dashed rectangles shown in the figure are only provided for better identification of the individual sections. The gap L shown relates to the physical separation of the second surface F2 from the connection surface and the power supply surface section VF in the printed conductor layer and represents the actual physical separation (in the printed conductor layer). The carrier is preferably constructed as a circuit board, such as a ceramic circuit board or a ceramic carrier, for example in the form of a DCB or other carrier having at least one copper layer or ceramic insulating layer IS. The underside of the carrier, not shown, can be connected to the heat sink, wherein in this case either the insulating layer IS is directly or via a heat conducting layer (such as a copper layer) connected to the heat sink. In addition, the carrier shown can have an equipped underside and / or can have a conductive intermediate layer and / or a connecting element such as a through hole. However, it should be noted that all important connecting elements and devices of the power path of the half-bridge module are located on one side of the carrier, thereby simplifying the current guidance. Figure 3 The very close laying of the supply conductors Z+, Z− that can be achieved thereby in order to reduce disadvantageous inductive properties is shown, and furthermore, the phase conductors can be arranged at a distance from the two supply conductors Z+, Z−. Figure 3 In the further development, the phase conductors can follow at the upper left, thereby showing that the two supply conductors are on one side of the carrier, while the phase conductors are located on the opposite side of the carrier.

Claims

1. A half-bridge module, comprising a first supply conductor (Z-), a second supply conductor (Z+) and a phase conductor (PZ) and a carrier (T), the carrier having a conductor track layer (LS), the conductor track layer having connection surfaces (P) in a middle section (ZA) between a first and a second transistor strip section (LA, HA) of the conductor track layer (LS), each of the connection surfaces being insulated all around in the conductor track layer, wherein the first supply conductor (Z-) is connected to the connection surfaces (P) and is led away from the connection surfaces, the second supply conductor (Z+) is connected to at least one contact location (3) in the second transistor strip section (HA) and is led away from the contact location, and the phase conductor (PZ) is connected to at least one contact location (1, 1') in the middle section (ZA) or in the first transistor strip section (LA) and is led away from the contact location. 2 . The half-bridge module according to claim 1 , wherein a first connector (V) is provided, which is connected to the connection surface (P) and extends from the connection surface (P) into the first transistor stripe section (LA).

3. A half-bridge module according to claim 1 or 2, wherein the first surface (F1) of the printed conductor layer (LS) extends as a continuous surface in the first transistor strip segment (LA) and further extends in the intermediate segment (ZA) as individual connecting surface segments (VF) between the connecting surfaces (P), wherein the connecting surface segments (VF) extend from the first transistor strip segment (LA) to the second transistor strip segment (HA). 4 . The half-bridge module according to claim 3 , wherein a second connector (V′) is provided, which is connected to the connection surface section (VF) and extends from the connection surface section (VF) into the second transistor stripe section (HA).

5. A half-bridge module (M) according to any of the preceding claims, wherein the first power supply lead (Z-) is connected to a connection surface (P) located in the middle section (ZA) at a contact point (2), and the phase lead (PZ) is connected to the printed conductor layer (LS) at a contact point (1) located in the middle section (ZA) or in the first transistor strip section (LA).

6. A half-bridge module (M) according to any one of the preceding claims, wherein the phase lead (PZ) is connected to the printed conductor layer (LS) at a contact location (1) located in the middle section (ZA), wherein the contact location (1) is located with a deviation in the center between a row of transistor mounting surfaces in the first transistor strip section (LA) and a row of transistor mounting surfaces in the second transistor strip section (LA), and the deviation is no greater than 20 mm, 15 mm, 10 mm or 5 mm.

7. A half-bridge module (M) according to any one of the preceding claims, wherein the phase lead (PZ) is connected to the printed conductor layer (LS) at at least one first contact location (1, 1'), the first contact location (1, 1') being located in the first transistor strip section (LA) or in the middle section (ZA), the first supply lead (Z-) being connected to the connection surface (P) at at least one second contact location (2), and the second supply lead (Z+) being connected to the printed conductor layer at at least one third contact location (3). (LS) connection, wherein at least one third contact point (3) is located in the second transistor strip section (HA), and wherein the first and second supply leads (Z-, Z+) and the phase lead (PZ) respectively have shunt sections (AA-, AA+, PA) opposite to the first, second and third contact points (1, 2, 3) in the extension of the leads, wherein the shunt sections (AA-, AA+) of the supply leads (Z-, Z+) on the one hand and the phase lead (PZ) on the other hand extend away from the carrier (T) in opposite directions.

8. A half-bridge module (M) according to claim 7, wherein in the extension of the second power supply lead (Z+), starting from the at least one third contact position (3), an approach section (NA) follows, the approach section (NA) extending in the direction of the area above the second contact position (2), and the first and second power supply leads (Z-, Z+) are located together starting from the approach section (NA) and extend at least as far as the shunt section (AA-, AA+) of the first and second power supply leads (Z-, Z+).

9. A half-bridge module (M) according to claim 8, wherein in the extension of the second power supply lead (Z+), a connecting section (VA) leading to the approach section (NA) follows the third contact position (3), wherein in the connecting section the second power supply lead (Z+) extends away from the carrier (T), and in the approach section (NA), the second power supply lead (Z+) extends along a first lateral direction (QR1), which first lateral direction points essentially parallel to the carrier (T) in the direction of the area above the second contact position (2).

10. A half-bridge module (M) according to any one of the preceding claims, wherein the phase lead (PZ) has a first contact section (KAP), at which the phase lead is connected to the surface (F1) of the first transistor strip section (LA) or to the connection surface section (VF) in a planar manner, the first power supply lead (Z-) has a second contact section (KA-), at which the first power supply lead is connected to the connection surface (P) in a planar manner, and the second power supply lead (Z-) has a third contact section (KA+), at which the second power supply lead is connected to the connection surface (P) in a planar manner, wherein the contact sections (KAP, KA-, KA+) extend respectively along the printed conductor layer (LS).

11. A half-bridge module (M) according to any one of the preceding claims, wherein the second supply lead (Z+) has a contact section (KA+), at which the second supply lead is connected to the connection surface (P) in a planar manner, and the contact section (KA+) extends along the printed conductor layer (LS) in the direction of the middle section (ZA), in the extension of the second supply lead (Z+), after the contact section (KA+) is a connection section (VA) of the lead (Z+), the connection section extends away from the printed conductor layer (LS), after the connection section (VA) is the lead ( The invention relates to a first supply lead (Z+) and an approach section (NA) of the first supply lead (Z+), which extends in the direction of the area above the middle section (ZA) or extends parallel to the printed wiring layer (LS) toward the first supply lead (Z-), and after the approach section (NA) there is an inverted arch (UB), in which the extension direction of the lead (Z+) is reversed into a direction leading away from the area above the middle section (ZA), and after the inverted arch (UB) there is a shunt section (AA-) of the second supply lead (Z+), which extends from the area above the middle section (ZA) and then extends away from the carrier (T).

12. A half-bridge module (M) according to any one of the preceding claims, wherein each lead (Z, Z+, PZ) is fastened to the printed conductor layer (LS) via a plurality of contact sections (KAP, KA-, KA+) and in each lead the contact sections (KAP, KA-, KA+) are gathered into a connecting section (VA, VA', VA") of the lead after the contact section in an extension direction leading away from the contact sections (KAP, KA-, KA+).

13. The half-bridge module according to claim 1, wherein the lead (Z-, Z+, PZ) is subdivided into a plurality of parts in its extension from the conductor track layer (LS), and the plurality of parts are connected to one another via connecting links.

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