A flush fixture system and wafer etching method

Abstract

The present application relates to a flush fixture system and a wafer etching method, wherein the flush fixture system includes a tray body, a fully insulating cover plate, and a positioning ring. The top surface of the tray body is a flush top plane, and the flush top plane has multiple wafer placement areas. The area surrounding the wafer placement areas is a cover plate placement area. The cover plate is provided with the same number of openings as the wafer placement areas. The cover plate is provided on the cover plate placement area and can fix the wafer in the wafer placement area and expose it from the openings. The positioning ring is made of an insulating material, connected between the tray body and the cover plate, and can simultaneously surround the bottom end face and side end face at the edge of the wafer. The present application eliminates edge pattern distortion caused by electric field deflection caused by the metal area design, thereby improving product quality.

Description

Technical Field

[0001] The present application belongs to the field of wafer etching technology, and in particular relates to a flush fixture system and a wafer etching method. Background Art

[0002] After the sapphire wafer completes the patterning of the photoresist layer on the upper surface in the yellow light process, it enters the etching process to transfer the patterning of the sapphire itself. During this process, a clamping system is required to fix the sapphire wafer.

[0003] There is a clamping system in the prior art, such as Figures 1 to 2 As shown, it includes a lower tray 1 and an upper cover plate 2. Both the upper cover plate 2 and the lower tray 1 are made of Al and mainly play the following roles: (1) carrying multiple wafers; (2) fixing the wafers and providing conditions for cooling the back of the wafers with helium; (3) forming an etching system, and potential difference assisting plasma directional etching. Among them, the lower tray 1 is a convex structure, the convex lower tray 1 has a top surface 11 and a step surface 12, an annular groove is provided on the top surface 11, and a sealing ring 3 is installed in the annular groove; the upper cover plate 2 is provided with a lap joint surface that matches the step surface 12. When the upper cover plate 2 is buckled on the convex lower tray 1, the lap joint surface of the upper cover plate 2 contacts the step surface 12 of the lower tray 1; when the wafer is installed, the lower end surface of the wafer edge directly contacts the top surface 11 of the lower tray 1.

[0004] In addition, the steps of the etching process using this traditional fixture system are as follows:

[0005] ①Load the sealing ring on the lower tray;

[0006] ②Put the lower tray flat;

[0007] ③ Align the matching locator on the sleeve;

[0008] ④ Place the chips into each position one by one;

[0009] ⑤Remove the locator;

[0010] ⑥Align and put on the upper cover;

[0011] ⑦ Turn it over and fix it with screws from the bottom tray;

[0012] ⑧Send to the ICP transmission chamber for etching.

[0013] The above process is repeated each time etching is performed.

[0014] However, this fixture system in the prior art has the following disadvantages: (1) The wafer loading steps are cumbersome, which increases the probability of introducing microscopic defects; (2) The graphics at the very edge of the wafer are affected by the edge effect caused by the design of the metal fixture at the corresponding position, and are prone to distortion; (3) The life of the upper cover is 600 times, and the life of the lower tray is 2500 times, which are short and increase the manufacturing cost of the single wafer. Summary of the Invention

[0015] In view of the above analysis, embodiments of the present invention aim to provide a flush fixture system and a wafer etching method to solve one or more of the above problems existing in the prior art.

[0016] The object of the present invention is achieved like this:

[0017] A flush fixture system comprising:

[0018] A tray body, wherein the top surface of the tray body is a flush top plane, the flush top plane has a plurality of wafer placement areas, and the area surrounding the wafer placement areas is a cover plate placement area;

[0019] A fully insulating cover plate, the cover plate being provided with the same number of openings as the wafer placement area, the cover plate being provided on the cover plate placement area and capable of securing the wafer in the wafer placement area and exposing the wafer from the openings;

[0020] A positioning ring is made of insulating material, is connected between the tray body and the cover plate, and can simultaneously surround the bottom end surface and the side end surface at the edge of the wafer.

[0021] Furthermore, the positioning ring is in sealing contact with the bottom end surface at the edge of the wafer and is provided with a gap with the side end surface at the edge of the wafer.

[0022] Furthermore, the positioning ring includes a first ring assembly and a second ring assembly, the longitudinal cross-section of the solid part of the first ring assembly is an L-shaped structure, having a horizontal portion and a vertical portion, and the horizontal portion and the vertical portion are both annular structures; the second ring assembly is arranged on the horizontal portion and can be in sealing contact with the bottom end face at the edge of the chip; the vertical portion is arranged on the horizontal portion, extending upward on the outside of the outer peripheral side end face of the chip, and there is a gap between the vertical portion and the outer peripheral side end face of the chip.

[0023] Furthermore, the longitudinal cross-section of the solid portion of the second ring assembly is hemispherical, approximately hemispherical or rectangular.

[0024] Furthermore, the longitudinal cross-section of the transverse portion is a rectangle; and the longitudinal cross-section of the vertical portion is a rectangle or a right-angled trapezoid.

[0025] Furthermore, the longitudinal cross-section of the vertical portion is a rectangle, the gap between the vertical portion and the peripheral side end face of the chip is a regular circular space, and the longitudinal cross-section of the circular space is also a rectangle; or, the longitudinal cross-section of the vertical portion is a right-angled trapezoid, the inner side wall of the vertical portion is a slope, the vertical portion is a structure that is narrow at the top and wide at the bottom, and the gap between the vertical portion and the peripheral side end face of the chip is an annular space that is larger at the top and smaller at the bottom.

[0026] Furthermore, the first ring assembly and the second ring assembly are an integral structure and are both made of polymer materials.

[0027] Furthermore, the first ring component is a C, H organic polymer material containing benzene rings or a polymer composite material mixed with glass fiber and C fiber; the second ring component is a highly elastic silicone rubber material.

[0028] Furthermore, a plurality of annular mounting grooves are provided on the tray body at positions corresponding to the wafer placement areas, the transverse portion is installed in the annular mounting grooves, and the depth of the annular mounting grooves is equal to the height of the transverse portion.

[0029] Furthermore, a plurality of pressure claws are provided on the cover plate, and the pressure claws are configured to press the edge of the wafer.

[0030] Furthermore, the longitudinal section of the transverse portion is a rectangle, the length of the rectangle is W1, and the height of the rectangle is H1;

[0031] The vertical portion has a longitudinal cross-section at the position of the pressure claw that is a first right-angled trapezoid, and a longitudinal cross-section at the position of the skirt that is a second right-angled trapezoid; the first right-angled trapezoid has a first height, a first upper base, and a first lower base, and the second right-angled trapezoid has a second height, a second upper base, and a second lower base; wherein the height of the first height is H2, the height of the second height is H3, the length of the first upper base is W3, the length of the second upper base is W2, and the lengths of the first and second lower bases are both W4;

[0032] W1>W3>W2 and W1>3*W2;

[0033] W1 = 2.0 ~ 4.0 mm, H1 = 2.00 ~ 3.0 mm; H2 is smaller than the thickness of the wafer; H3 = 3.0 ~ 4.0 mm.

[0034] Furthermore, the longitudinal cross-section of the solid portion of the second ring assembly is hemispherical;

[0035] The diameter of the hemisphere is D=1200±50 μm.

[0036] On the other hand, a wafer etching method is provided, in which the wafer is loaded using the above-mentioned flush fixture system before entering the ICP etcher, and after loading, the wafer is sent to the ICP transfer chamber for etching.

[0037] Furthermore, the flush fixture system is used to load the film, and the steps are as follows:

[0038] Step 1: Lay the tray body flat;

[0039] Step 2: Place wafers one by one in each wafer position on the tray body;

[0040] Step 3: Put the cover plate on the tray body;

[0041] Step 4: Turn the tray body and the cover plate over as a whole so that the bottom surface of the tray body faces upward, and screw the tray body and the cover plate into place through the tray body to complete the loading.

[0042] Compared with the prior art, the present invention can achieve at least one of the following beneficial effects:

[0043] a) The flush fixture system provided by the present invention adopts a fully flat tray body and a fully insulated cover plate, eliminating edge pattern distortion caused by electric field deflection due to the metal area design, thereby improving product quality.

[0044] b) The flush-type clamp system provided by the present invention has an increased cover thickness, and the areas of the tray body that are easily etched are more resistant to etching. At the same time, it is replaceable, which extends the overall life of the clamp system: the life of the upper cover is increased to 3,000 times; the single use of the tray body is increased to 5,000 times, and after replacing the positioning ring, it can continue to be used 5,000 times. In theory, the tray body can be used indefinitely, thereby reducing the manufacturing cost of a single piece.

[0045] c) The flush fixture system method provided by the present invention simplifies the steps of loading wafers and is easy to operate, thereby improving wafer loading efficiency and reducing the probability of contamination. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the embodiments of this specification or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of this specification. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0047] Figure 1 It is a cross-sectional schematic diagram of a clamp system at the pressure claw in the prior art;

[0048] Figure 2 It is a cross-sectional schematic diagram of a fixture system at the skirt edge in the prior art;

[0049] Figure 3 A schematic cross-sectional view of the flush-type clamp system provided by the present invention at the pressure claw;

[0050] Figure 4 A schematic cross-sectional view of the flush-type clamp system provided by the present invention at the skirt;

[0051] Figure 5 A schematic cross-sectional view of a positioning ring at a pressure claw provided by the present invention;

[0052] Figure 6 A schematic cross-sectional view of a positioning ring at the skirt provided by the present invention;

[0053] Figure 7 A schematic cross-sectional view of the tray body of the flush-type fixture system provided by the present invention;

[0054] Figure 8 A schematic cross-sectional view of the pressure claws on the cover plate of the flush-type clamp system provided by the present invention;

[0055] Figure 9 A schematic diagram of the planar structure of the flush-type clamp system provided by the present invention;

[0056] Figure 10 This is an electron microscope image of a 0.4mm pattern on the edge of a wafer obtained using a conventional platform raised lower tray.

[0057] Figure 11 This is an electron microscope image of a 0.4 mm pattern of a wafer edge obtained using the tray body with a flush top surface according to the present invention.

[0058] Reference numerals:

[0059] 1. Lower tray; 11. Top surface; 12. Step surface; 2. Upper cover; 3. Sealing ring;

[0060] 100, tray body; 101, flush top surface; 102, annular mounting groove;

[0061] 200, cover plate; 201, pressure claw; 2011, first step surface; 2012, second step surface;

[0062] 300, positioning ring; 301, first ring assembly; 3011, horizontal portion; 3012, vertical portion; 302, second ring assembly;

[0063] 400. Chip. DETAILED DESCRIPTION

[0064] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. It should be noted that, in the absence of conflict, the embodiments in this disclosure and the features in the embodiments can be combined, separated, interchanged and / or rearranged with each other. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0065] In the accompanying drawings, the sizes and relative sizes of components may be exaggerated for clarity and / or descriptive purposes. When the exemplary embodiments can be implemented differently, the specific process sequence may be performed in a different order than described. For example, two processes described in succession may be performed substantially simultaneously or in a reverse order from the described order. In addition, the same reference numerals represent the same components.

[0066] The terms used herein are for the purpose of describing specific embodiments and are not intended to be restrictive. As used herein, unless the context clearly indicates otherwise, the singular forms "one (kind, person)" and "said (the)" are also intended to include plural forms. In addition, when the terms "comprise" and / or "include" and their variations are used in this specification, the features, integral bodies, steps, operations, parts, assemblies and / or their groups stated are explained, but the presence or addition of one or more other features, integral bodies, steps, operations, parts, assemblies and / or their groups is not excluded. It should also be noted that, as used herein, the terms "substantially", "approximately" and other similar terms are used as approximate terms and not as degree terms, so that they are used to explain the inherent deviations of the measured values, calculated values and / or the values provided that will be recognized by those of ordinary skill in the art.

[0067] Example 1

[0068] A specific embodiment of the present invention, as Figures 3 to 9 As shown, a flush type clamp system is disclosed, comprising:

[0069] The tray body 100 has a top surface 101 formed on it, and a plurality of wafer placement areas are formed on the top surface 101. The area surrounding the wafer placement areas is a cover placement area.

[0070] A fully insulating cover plate 200 having the same number of openings as the wafer placement area. The cover plate 200 is disposed on the cover plate placement area and can secure a wafer 400 in the wafer placement area and expose the wafer 400 from the openings.

[0071] A positioning ring 300 , made of an insulating material, is connected between the tray body 100 and the cover plate 200 and can simultaneously encompass the bottom end surface and side end surfaces of the edge of the wafer 400 ;

[0072] The positioning ring 300 is in sealing contact with the bottom end surface at the edge of the wafer 400 , and a gap is provided between the positioning ring 300 and the side end surface at the edge of the wafer 400 .

[0073] It should be noted that the flush top plane 101 in this embodiment means that there is no raised platform or sunken area for placing the chip 400 on the tray body 100, and there is no height difference between the chip placement area and the cover placement area. The two are located on the same plane, which is the only top surface of the tray body 100.

[0074] In this embodiment, the tray body 100 is made of Al, the tray body 100 is processed to be horizontal on the entire surface, and the cover plate placement area is on the flush top surface 101 .

[0075] In this embodiment, the shape of the opening on the cover plate 200 is the same as that of the wafer 400 , the size of the opening is larger than that of the wafer 400 , and the number of the openings is the same as the number of wafer placement areas on the tray body 100 .

[0076] In this embodiment, the cover plate 200 is provided with a plurality of pressure claws 201, each of which is arranged with a plurality of pressure claws 201. The pressure claws 201 extend toward the center of the opening and are configured to press the edge of the wafer 400. In other words, a plurality of pressure claws 201 are radially and evenly arranged at the top of each opening in the cover plate 200. The radial extension length of the pressure claws 201 is sufficient to press the edge of the wafer 400 without affecting etching. The pressure claws 201 are provided with a stepped structure, and the edge of the wafer 400 is fixed within the space defined by the stepped structure. The stepped structure has a first stepped surface 2011 and a second stepped surface 2012. The first stepped surface 2011 is in pressurized contact with the top surface of the wafer edge, and the second stepped surface 2012 is in pressurized contact with the top surface of the vertical portion 3012.

[0077] In this embodiment, a vertically arranged helium channel is provided in the area below each wafer 400, that is, the wafer placement area on the tray body 100, for communicating He gas.

[0078] In this embodiment, the positioning ring 300 includes a first ring assembly 301 and a second ring assembly 302. The longitudinal cross-section of the solid part of the first ring assembly 301 is an L-shaped structure, having a horizontal portion 3011 and a vertical portion 3012, and the horizontal portion 3011 and the vertical portion 3012 are both annular structures; the second ring assembly 302 is arranged on the horizontal portion 3011, and can be sealed in contact with the bottom end face at the edge of the chip 400; the vertical portion 3012 is arranged on the horizontal portion 3011, extending upward on the outside of the outer peripheral side end face of the chip 400, and there is a gap between the vertical portion 3012 and the outer peripheral side end face of the chip 400 to prevent jamming.

[0079] In one optional embodiment, the longitudinal cross-section of the solid portion of the second ring assembly 302 is hemispherical, approximately hemispherical, rectangular, or other polygonal. The second ring assembly 302 with a hemispherical longitudinal cross-section can also be understood as a raised ring disposed on the surface of the transverse portion 3011 of the first ring assembly 301, and the raised ring can have a hemispherical, approximately hemispherical, rectangular, or other polygonal longitudinal cross-section. The number of raised rings can be one or more.

[0080] In one optional embodiment, the longitudinal cross-section of the horizontal portion 3011 is rectangular; the longitudinal cross-section of the vertical portion 3012 can be rectangular or right-angled trapezoidal.

[0081] In the technical solution in which the vertical portion 3012 has a rectangular longitudinal section, the gap between the vertical portion 3012 and the peripheral end surface of the wafer 400 is a regular annular space, and the longitudinal section of the annular space is also rectangular.

[0082] In the technical solution in which the longitudinal section of the vertical portion 3012 is a right-angled trapezoid, the inner side wall of the vertical portion 3012 is an inclined surface, the vertical portion 3012 is a structure that is narrow at the top and wide at the bottom, and the gap between the vertical portion 3012 and the outer peripheral end face of the chip 400 is an annular space that is larger at the top and smaller at the bottom.

[0083] In this embodiment, the positioning ring 300 is a whole, that is, the first ring component 301 and the second ring component 302 are an integrated structure.

[0084] In one optional embodiment, the first ring assembly 301 and the second ring assembly 302 are made of a polymer material. Exemplarily, the polymer material for preparing the first ring assembly 301 includes a C, H organic polymer material containing a benzene ring or a polymer composite material mixed with glass fiber and C fiber. The first ring assembly 301 made of a polymer material has high hardness and is resistant to etching, which means that the polymer material in the gap between the edge of the wafer 400 and the skirt in the skirt area is more resistant to etching, and damage to the tray body 100 is limited. The second ring assembly 302 is a highly elastic silicone rubber material. Since the first ring assembly 301 and the second ring assembly 302 are both made of polymer materials, C and H are the main molecules at the atomic level, and they can be processed in an integrated manner, while polymer materials and metal Al materials cannot be processed in an integrated manner.

[0085] In this embodiment, a plurality of annular mounting grooves 102 are provided on the tray body at positions corresponding to the wafer placement areas. The transverse portion 3011 of the positioning ring 300 is installed in the annular mounting groove 102. The groove depth of the annular mounting groove 102 is equal to the height of the transverse portion 3011. The top surface of the transverse portion 3011 is flush with the top surface of the tray body. The vertical portion 3012 of the positioning ring 300 extends in the lateral direction of the outer peripheral side end surface of the wafer 400.

[0086] In this embodiment, Figures 5 and 6 The longitudinal cross-sectional shape and size parameters of the transverse portion 3011 and the vertical portion 3012 of the first ring assembly 301 and the solid portion of the second ring assembly 302 are shown.

[0087] The longitudinal cross-section of the solid portion of the transverse portion 3011 is rectangular, the length of the rectangle is W1, the height of the rectangle is H1, W1 = 2.0 ~ 4.0 mm, H1 = 2.00 ~ 3.0 mm, this parameter design facilitates the processing and subsequent assembly of the positioning ring 300;

[0088] The longitudinal cross-section of the solid part of the vertical portion 3012 is a right-angled trapezoid, the longitudinal cross-section of the vertical portion 3012 at the position of the pressure claw 201 is a first right-angled trapezoid, and the longitudinal cross-section of the vertical portion 3012 at the position of the skirt is a second right-angled trapezoid; the first right-angled trapezoid has a first height, a first upper base and a first lower base, and the second right-angled trapezoid has a second height, a second upper base and a second lower base; wherein, the height of the first height is H2, the height of the second height is H3, the length of the first upper base is W3, the length of the second upper base is W2, the lengths of the first lower base and the second lower base are both W4, W1>W3>W2 and W1>3*W2, this setting is conducive to the downward sliding and positioning of the chip 400 more accurately.

[0089] H2 is smaller than the thickness of the wafer 400, which is generally 600-1300 μm. Since the step depth of the pressing claw 201 on the cover plate 200 is equal to the thickness of the wafer 400, H2 is usually smaller than the step depth of the pressing claw 201 on the cover plate 200.

[0090] H3 is much larger than the thickness of the wafer 400, H3 = 3.0 ~ 4.0mm;

[0091] In one preferred embodiment, the longitudinal cross-section of the solid portion of the second ring assembly 302 is hemispherical, with its diameter parameters set based on the dimensional parameters of the transverse portion 3011 of the first ring assembly 301. For example, the second ring assembly 302 includes only one hemispherical protrusion, and the hemispherical diameter D is approximately 1200 μm, such as D = 1200 ± 50 μm, which can effectively provide a sealing effect, enhance stress control on the edge, and accelerate the etching rate.

[0092] In this embodiment, the cover plate 200 is made of a fully insulating material, such as quartz, insulating ceramic, a polymer with good thermal conductivity, or a composite polymer. Because the top surface of the tray body 100 is completely flat and the cover plate 200 is insulating, this means that even if the metal design at the wafer edge is significantly different, the electric field offset is virtually eliminated, and there is no risk of edge pattern distortion. This allows the cover plate 200 and pressure jaws 201 to be designed to be thicker, at least six times the thickness of a traditional Al cover plate, resulting in a longer lifespan. Preferably, the cover plate 200 in this embodiment is 3-5 mm thick, and the pressure jaws 201 are 0.5-2 mm thick.

[0093] This embodiment also provides a wafer etching method. Before entering the ICP etcher, the wafer is loaded using the flush fixture system described above in this embodiment. After loading, the wafer is sent to the ICP transmission chamber for etching.

[0094] The process of loading a film using the flush fixture system includes steps 1 to 4. The steps of loading a film are as follows:

[0095] Step 1: Lay the tray body 100 flat;

[0096] Step 2: Place wafers 400 one by one in each wafer position on the tray body 100;

[0097] Step 3: Put the cover plate 200 on the tray body 100;

[0098] Step 4: Turn the tray body 100 and the cover plate 200 over as a whole so that the bottom surface of the tray body 100 faces upward, and screw the tray body 100 and the cover plate 200 together to complete the installation.

[0099] The wafer etching method further includes step 5: after the wafer loading is completed, the tray body 100 and the cover plate 200 are flipped over again and sent to the ICP transmission chamber for etching, and etching is performed according to the set parameters to complete the etching of the wafer 400.

[0100] From the above, it can be seen that chip etching using the existing convex lower tray clamping system includes 8 steps, while the chip etching method using the flush type clamping system in this application only requires 5 steps, which is simpler to operate and has higher loading efficiency.

[0101] Figure 10 The electron microscope image of the 0.4mm pattern of the wafer edge obtained using the conventional platform raised lower tray is shown. Figure 11 The electron microscope image of the wafer edge 0.4 mm pattern obtained using the tray body with a flush top surface in this embodiment is shown. Comparing the two images above, it can be seen that the latter is more symmetrical than the former.

[0102] Compared with the prior art, the flush fixture system and wafer etching method provided in this embodiment have the following beneficial effects:

[0103] 1. The use of a fully flat tray body and a fully insulated cover eliminates edge pattern distortion caused by electric field deflection due to the metal area design, thereby improving product quality.

[0104] 2. The thickness of the cover is increased, and the easily etched areas of the tray body are more resistant to etching. At the same time, it is replaceable, which extends the overall life of the fixture system: the life of the upper cover is increased to 3,000 times; the single use of the tray body is increased to 5,000 times. After replacing the positioning ring, it can continue to be used for 5,000 times. In theory, the tray body can be used indefinitely, thereby reducing the manufacturing cost of a single piece.

[0105] 3. The steps of loading wafers are simpler and easier to operate, which improves the loading efficiency and reduces the probability of contamination.

[0106] The specific implementation methods described above further illustrate the purpose, technical solutions and beneficial effects of this application. It should be understood that the above description is only the specific implementation methods of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of this application should be included in the scope of protection of this application.

Claims

1. A flush fixture system, characterized in that: include: A tray body, wherein the top surface of the tray body is a flush top plane, the flush top plane has a plurality of wafer placement areas, and the area surrounding the wafer placement areas is a cover plate placement area; A fully insulating cover plate, the cover plate being provided with the same number of openings as the wafer placement area, the cover plate being provided on the cover plate placement area and capable of securing the wafer in the wafer placement area and exposing the wafer from the openings; A positioning ring, made of an insulating material, connected between the tray body and the cover plate, and capable of simultaneously surrounding the bottom end surface and the side end surface of the wafer edge; The positioning ring is in sealing contact with the bottom end surface at the edge of the wafer and is provided with a gap with the side end surface at the edge of the wafer; The positioning ring includes a first ring assembly and a second ring assembly. The longitudinal cross-section of the solid part of the first ring assembly is an L-shaped structure, with a horizontal portion and a vertical portion, and the horizontal portion and the vertical portion are both annular structures; the second ring assembly is arranged on the horizontal portion and can be in sealing contact with the bottom end face at the edge of the wafer; the vertical portion is arranged on the horizontal portion and extends upward on the outside of the outer peripheral side end face of the wafer, and there is a gap between the vertical portion and the outer peripheral side end face of the wafer.

2. The flush fixture system according to claim 1, characterized in that The longitudinal cross-section of the solid portion of the second ring component is hemispherical, approximately hemispherical or rectangular.

3. The flush fixture system according to claim 1, characterized in that The longitudinal cross-section of the horizontal portion is a rectangle; the longitudinal cross-section of the vertical portion is a rectangle or a right-angled trapezoid.

4. The flush fixture system according to claim 3, characterized in that The vertical portion has a rectangular longitudinal section, and the gap between the vertical portion and the peripheral end surface of the wafer is a regular annular space, and the longitudinal section of the annular space is also rectangular; or, The vertical portion has a longitudinal cross-section of a right-angled trapezoid, an inner sidewall of the vertical portion is an inclined surface, and the vertical portion has a structure that is narrow at the top and wide at the bottom. The gap between the vertical portion and the peripheral end face of the wafer is an annular space that is larger at the top and smaller at the bottom.

5. The flush fixture system according to claim 1, wherein: The first ring assembly and the second ring assembly are an integral structure and are both made of polymer materials.

6. The flush fixture system according to claim 5, characterized in that The first ring component is a C, H organic polymer material containing benzene rings or a polymer composite material mixed with glass fiber and C fiber; the second ring component is a highly elastic silicone rubber material.

7. The flush fixture system according to claim 1, wherein: A plurality of annular mounting grooves are provided on the tray body at positions corresponding to the wafer placement areas, the transverse portion is installed in the annular mounting grooves, and the depth of the annular mounting grooves is equal to the height of the transverse portion.

8. A wafer etching method, characterized in that: Before entering the ICP etcher, the flat fixture system according to any one of claims 1 to 7 is used to load the wafer, and after loading, the wafer is sent to the ICP transfer chamber for etching.

Images