Assembly part and electronic system

Abstract

The invention discloses an assembly part and an electronic system, and relates to the technical field of communication. The assembly part is used for being assembled on the outer surface of the electronic equipment, the assembly part comprises a dielectric body, an antenna radiator is arranged on the electronic equipment, and when the assembly part is assembled on the electronic equipment, the dielectric body can be configured to be polarized by the antenna radiator for radiation. And the assembly part can be configured to be detached and separated from the electronic equipment. According to the invention, the assembly part is assembled on the electronic equipment, so that the dielectric body can radiate when being polarized by an antenna radiator on the electronic equipment, and the antenna performance of the antenna radiator is enhanced.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to an assembly part and an electronic system. Background Art

[0002] With the development of technology, electronic devices with communication functions such as mobile phones are becoming more and more popular and more powerful. Electronic devices usually include antennas to realize the communication function of electronic devices. However, the communication performance of antenna radiators in electronic devices in related technologies is not good enough. Summary of the invention

[0003] The present application provides, on one hand, an assembly part for assembly on the outer surface of an electronic device, the assembly part comprising a dielectric body, the electronic device being provided with an antenna radiator, and when the assembly part is assembled on the electronic device, the dielectric body can be configured to be polarized by the antenna radiator for radiation, and the assembly part can be configured to be disassembled and separated from the electronic device.

[0004] In another aspect, the present application provides an electronic system, comprising:

[0005] An electronic device provided with an antenna radiator; and

[0006] The assembly is mounted on the outer surface of the electronic device and can be configured to be disassembled and separated from the electronic device. The assembly includes a dielectric body. When the antenna radiator is working, the dielectric body is configured to be polarized by the antenna radiator to radiate.

[0007] The technical solution described in the present application has the following beneficial effects: the present application assembles the assembly on the electronic device so that the dielectric body can radiate when polarized by the antenna radiator on the electronic device, thereby enhancing the antenna performance of the antenna radiator. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solutions in the implementation modes of the present application, the drawings required for use in the description of the implementation modes will be briefly introduced below. Obviously, the drawings described below are only some implementation modes of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0009] Figure 1 This is a schematic diagram of the structure of an electronic system in some embodiments of the present application;

[0010] Figure 2 for Figure 1 A schematic diagram of the structure of the assembly in some embodiments of the embodiment shown;

[0011] Figure 3 for Figure 2 A cross-sectional view of the assembly at line III-III in the illustrated embodiment;

[0012] Figure 4 for Figure 3 A schematic diagram of the structure of the assembly in the illustrated embodiment in other embodiments;

[0013] Figure 5 for Figure 4 A schematic diagram of the structure of the assembly in the illustrated embodiment in other embodiments;

[0014] Figure 6 for Figure 1 An exploded view of the electronic device in the illustrated embodiment;

[0015] Figure 7 for Figure 1 A schematic diagram of the structure of the electronic system in the illustrated embodiment;

[0016] Figure 8 for Figure 7 An enlarged schematic diagram of a part VIII of the electronic system in the illustrated embodiment;

[0017] Fig. 9 for Figure 8 A comparison diagram of radiation performance when the assembly and the electronic device are matched in the illustrated embodiment;

[0018] Fig.10 for Figure 8 A comparison diagram of radiation performance when the assembly and the electronic device are matched in the illustrated embodiment;

[0019] Fig.11 for Figure 7 A schematic diagram of the structure of the electronic system in the illustrated embodiment in other embodiments;

[0020] Fig.12 for Fig.11 An enlarged view of a portion XII of the electronic system in the illustrated embodiment;

[0021] Fig.13 for Figure 7 The schematic diagram of the structure of the assembly part and the middle frame assembly 40 in the illustrated embodiment. DETAILED DESCRIPTION

[0022] The present application is further described in detail below in conjunction with the accompanying drawings and implementation methods. It is particularly noted that the following implementation methods are only used to illustrate the present application, but do not limit the scope of the present application. Similarly, the following implementation methods are only some implementation methods of the present application rather than all implementation methods. All other implementation methods obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0023] Reference to "embodiment" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0024] See also Figure 1 , Figure 1 Schematic diagram of the structure of the electronic system in some embodiments of the present application. The electronic system 100 may include an assembly 101 and an electronic device 102. The assembly 101 is assembled on the outer surface of the electronic device 102. The assembly 101 can be disassembled and separated from the electronic device 102. The electronic device 102 can independently realize the ability of the antenna to send and receive signals. The assembly of the assembly 101 on the electronic device 102 can enhance the antenna performance of the electronic device 102.

[0025] The assembly 101 may be a protective structure (such as a housing structure such as a protective shell or a protective cover, such as a frame structure) mounted on the outer surface of the electronic device 102, a decorative structure (such as a decorative shell, textured paper, textured film or sticker, etc.), a structure that provides additional functions for the electronic device 102 (such as a mobile power supply, a mobile hard disk, an indicator light, a lighting lamp or a mobile camera, etc.), or a structure that supports or fixes the electronic device 102 (such as a fixing frame, a fixing claw, a supporting frame, a supporting seat or a live broadcasting frame, etc.). Of course, the assembly 101 may also be other structures, which will not be described in detail.

[0026] It is understood that the term "assembly" in this application may refer to a direct connection or fixed relationship between two structures, or a spatial matching relationship between two structures, such as two structures in contact or spaced arrangement. For example, one of the two structures is placed on the other to form a contact relationship, or the other structure is placed on the first structure to form a contact relationship.

[0027] See also Figure 2 , Figure 2 for Figure 1 The illustrated embodiment is a schematic diagram of the structure of the assembly 101 in some embodiments. The assembly 101 may include a body 10 assembled on an electronic device 102 and a dielectric body 20 disposed on the body 10. The body 10 may be assembled on the electronic device 102, or may be disassembled and separated from the electronic device 102. The body 10 may carry the dielectric body 20, so that the dielectric body 20 is easily loaded on the electronic device 102. When the body 10 may be assembled on the electronic device 102, the dielectric body 20 may enhance the antenna performance of the electronic device 102.

[0028] The body 10 may be a shell structure. Of course, the body 10 may change accordingly based on the requirements of the function and structural setting of the assembly 101. Here, only some embodiments are introduced, and the body 10 is not specifically limited. It can also be a structure in other forms that can carry the dielectric body 20. For example, textured paper, textured film, stickers, mobile power supplies, mobile hard disks, indicator lights, lighting lamps, mobile cameras, fixing frames, fixing claws, support frames, support seats or live broadcast frames, etc.

[0029] In some embodiments, the body 10 may be an insulating material such as rubber, plastic, acrylic, etc. In some embodiments, the relative dielectric constant of the body 10 is about 3, and thus the effect on the antenna performance of the electronic device 102 can be ignored. Of course, the body 10 may also be made of other materials that do not affect the antenna performance of the electronic device 102 or have little effect on the antenna performance of the electronic device 102.

[0030] See also Figure 2 The body 10 may include a bottom plate 11 and a frame 12 connected to the bottom plate 11. The bottom plate 11 and the frame 12 may be arranged to form an assembly space 103. When the body 10 is assembled on the electronic device 102, the electronic device 102 may be located in the assembly space 103.

[0031] The bottom plate 11 can be in contact with or spaced apart from the electronic device 102 when the body 10 is assembled on the electronic device 102. In some embodiments, the bottom plate 11 can be used to protect the electronic device 102. In some embodiments, the bottom plate 11 can be used to support the electronic device 102. In some embodiments, the bottom plate 11 can be pasted or magnetically adsorbed on the electronic device 102. In some embodiments, the bottom plate 11 can be omitted.

[0032] The frame 12 may be disposed on one side of the body 10. In some embodiments, the frame 12 may extend from the edge of the bottom plate 11 to one side. In some embodiments, the frame 12 may be used to protect the electronic device 102. In some embodiments, the frame 12 may be used to support the electronic device 102. In some embodiments, the frame 12 may cooperate with the bottom plate 11 to form a structure for protecting, supporting or fixing the electronic device 102. In some embodiments, the frame 12 may be fixed on the electronic device 102. In some embodiments, the frame 12 may cooperate with the bottom plate 11 to be fixed on the electronic device 102.

[0033] In some embodiments, the frame 12 may include a first sub-frame 121, a second sub-frame 122, a third sub-frame 123, and a fourth sub-frame 124 connected end to end in sequence. The first sub-frame 121, the second sub-frame 122, the third sub-frame 123, and the fourth sub-frame 124 are arranged around the bottom plate 11 and may be connected and fixed to the bottom plate 11. In some embodiments, the first sub-frame 121, the second sub-frame 122, the third sub-frame 123, and the fourth sub-frame 124 extend from the edge of the bottom plate 11 to the same side. In some embodiments, the frame 12 may be an integral structure with the bottom plate 11.

[0034] In some embodiments, the first sub-frame 121, the second sub-frame 122, the third sub-frame 123 and the fourth sub-frame 124 are arranged to form a rounded rectangle. Of course, other shapes such as a circle, a triangle, etc. are also possible. In some embodiments, the first sub-frame 121 and the third sub-frame 123 are arranged opposite to each other, and the second sub-frame 122 and the fourth sub-frame 124 are arranged opposite to each other.

[0035] In some embodiments, the frame 12, such as the first sub-frame 121, the second sub-frame 122, the third sub-frame 123 and the fourth sub-frame 124, can be used to support the electronic device 102. In some embodiments, three of the first sub-frame 121, the second sub-frame 122, the third sub-frame 123 and the fourth sub-frame 124 can be omitted.

[0036] In some embodiments, the frame 12, such as the first sub-frame 121, the second sub-frame 122, the third sub-frame 123 and the fourth sub-frame 124, can be fixed on the electronic device 102 to achieve the assembly of the body 10 on the electronic device 102. In some embodiments, the first sub-frame 121 and the third sub-frame 123 can be omitted. In some embodiments, the second sub-frame 122 and the third sub-frame 123 can be omitted.

[0037] In some embodiments, the lengths of the first sub-frame 121 and the third sub-frame 123 are both longer than the length of the second sub-frame 122 , and longer than the length of the fourth sub-frame 124 .

[0038] See also Figure 2 and Figure 3 , Figure 3 for Figure 2 A cross-sectional view of the assembly 101 at line III-III in the illustrated embodiment. The frame 12, such as the first sub-frame 121, has a contact surface 1211 to contact the electronic device 102. In some embodiments, the contact surface 1211 may also be located at other parts of the frame 12, such as the second sub-frame 122, the third sub-frame 123, and the fourth sub-frame 124. In some embodiments, the contact surface 1211 may also be located at other parts of the body 10, such as the bottom plate 11.

[0039] In some embodiments, see Figure 2 and Figure 3 The contact surface 1211 is provided with a groove 1212 to cooperate with the dielectric body 20. In some embodiments, see Figure 4 , Figure 4 for Figure 3 The schematic diagram of the structure of the assembly 101 in other embodiments in the illustrated embodiment. The groove 1212 can be a through groove.

[0040] See also Figure 3 The frame 12, such as the first sub-frame 121, has a hand-touch surface 1213, so that the user can touch the hand-touch surface 1213 when holding and touching the assembly 101, such as the body 10. In some embodiments, the hand-touch surface 1213 and the contact surface 1211 can be respectively arranged on two opposite sides of the frame 12, such as the first sub-frame 121. In some embodiments, the hand-touch surface 1213 can also be located on other parts of the frame 12, such as the second sub-frame 122, the third sub-frame 123 and the fourth sub-frame 124. In some embodiments, the hand-touch surface 1213 can also be located on other parts of the body 10, such as the bottom plate 11. In some embodiments, the hand-touch surface 1213 and the contact surface 1211 can be respectively arranged on two opposite sides of the body 10.

[0041] In some embodiments, the hand-touch surface 1213 may be disposed such that the groove 1212 , such as a through groove, passes through the hand-touch surface 1213 and the contact surface 1211 .

[0042] See also Figure 2 and Figure 3 , the dielectric body 20 may be a dielectric, made of a dielectric material. In some embodiments, the dielectric body 20 may be formed of an insulator material. In some embodiments, the relative dielectric constant of the dielectric body 20 is greater than or equal to 60. In some embodiments, the dielectric body 20 may include ceramics or a composite material including ceramics. In some embodiments, the dielectric body 20 may include a composite material made of raw materials including ceramic powder. In some embodiments, the dielectric body 20 may include an inorganic dielectric material or a composite material including an inorganic dielectric material. The inorganic dielectric material may include silicon oxide (SiO2, SiO), silicon nitride (SiN, Si3N4), zirconium oxide (ZrO, ZrO2), hafnium oxide (HfO, HfO2), titanium oxide (TiO, TiO2), aluminum nitride (AlN), SrBi2Ta2O9, SrBi2 (Ta 1-x Nb x )2O9、Sr2(Ta 1-x Nb x)2O7, BST (barium strontium titanate), PZT (lead silicate titanate), alumina (Al2O3), BiTiO3, SiTiO3, PbZrO3, PbTiO3 and CaTiO3 and other dielectric materials.

[0043] The dielectric body 20 can be polarized under the vertical electric field generated by the antenna radiator in the electronic device 102, and then can radiate. At this time, the electric field in free space can be jointly composed of the electronic device 102, such as the antenna radiator, and the dielectric body 20, thereby enhancing the antenna performance of the electronic device 102, such as the antenna radiator.

[0044] The dielectric body 20 may be disposed in the groove 1212. In some embodiments, the dielectric body 20 is provided with a contact portion 201 on the side facing the electronic device 102 so as to be in contact with the electronic device 102. In some embodiments, the dielectric body 20, such as the contact portion 201, may also be spaced apart from the electronic device 102. In some embodiments, the surface of the dielectric body 20, such as the contact portion 201, on the side facing the electronic device 102 is flush with the contact surface 1211, so that the overall appearance of the assembly 101 is improved. In addition, the dielectric body 20, such as the contact portion 201, and the contact surface 1211 may contact the electronic device 102 together or be spaced apart from the electronic device 102 together. In some embodiments, when the dielectric body 20, such as the contact portion 201, contacts the electronic device 102, the contact surface 1211 may not contact the electronic device 102. In some embodiments, the dielectric body 20 may also be buried inside the body 10 without being exposed, and the groove 1212 may be omitted.

[0045] See also Figure 4 The dielectric body 20 may be disposed in the groove 1212, such as a through groove. In some embodiments, a hand touch portion 202 is disposed on a side of the dielectric body 20 away from the electronic device 102. The hand touch portion 202 may be touched when a user touches the contact surface 1211, so that the human body, such as a hand, serves as a dielectric body, thereby enhancing the antenna performance of the electronic device 102.

[0046] In some scenarios, the user touches the hand contact portion 202 while holding the antenna in hand. Due to the presence of the dielectric body 20, the hand material (user's hand) can be better stimulated, and the antenna performance in the hand-holding state can be improved.

[0047] In some embodiments, the groove 1212 may not be a through groove, but is disposed on the hand-touch surface 1213. Furthermore, in some embodiments, the surface of the dielectric body 20, such as the hand-touch portion 202, which is away from the electronic device 102, is flush with the hand-touch surface 1213, so that the overall appearance of the assembly 101 is improved.

[0048] In some embodiments, the dielectric body 20 may be extended in the extension direction of the frame 12 , such as the first sub-frame 121 .

[0049] See also Figure 5 , Figure 5 for Figure 4 Schematic diagram of the structure of the assembly 101 in other embodiments in the illustrated embodiment. The dielectric body 20 can be arranged on the main body 10 in the manner of the arrangement in the above-mentioned embodiment. Specifically, the dielectric body 20 can be arranged on any two adjacent sub-frames in the frame 12. For example, the dielectric body 20 can be partially arranged on the first sub-frame 121 and partially arranged on the second sub-frame 122. For example, the dielectric body 20 can be partially arranged on the second sub-frame 122 and partially arranged on the third sub-frame 123. For example, the dielectric body 20 can be partially arranged on the third sub-frame 123 and partially arranged on the fourth sub-frame 124. For example, the dielectric body 20 can be partially arranged on the fourth sub-frame 124 and partially arranged on the first sub-frame 121.

[0050] Here, it is taken as an example that the dielectric body 20 can be partially disposed on the first sub-frame 121 and partially disposed on the second sub-frame 122 . The configuration methods in other embodiments may refer to this embodiment and will not be described in detail.

[0051] See also Figure 5 The dielectric body 20 includes a first sub-dielectric body 21 and a second sub-dielectric body 22 which are bent and connected. The first sub-dielectric body 21 can be arranged on the first sub-frame 121. The second sub-dielectric body 22 can be arranged on the second sub-frame 122.

[0052] See also Figure 6 , Figure 6 for Figure 1 An exploded view of the electronic device 102 in the illustrated embodiment. The electronic device 102 may be provided with an antenna radiator 30. The antenna radiator 30 may receive and send signals, thereby generating a vertical electric field, so that the dielectric body 20 is located in the vertical electric field, and the dielectric body 20 is polarized by the antenna radiator 30 to radiate, thereby enhancing the antenna performance of the antenna radiator 30.

[0053] As used herein, "electronic devices" (which may also be referred to as "terminals" or "mobile terminals" or "electronic devices") include, but are not limited to, devices configured to receive / send communication signals via a wireline connection (e.g., via a public switched telephone network (PSTN), a digital subscriber line (DSL), digital cable, a direct cable connection, and / or another data connection / network) and / or via a wireless interface (e.g., for a cellular network, a wireless local area network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and / or another communication terminal). Communication terminals configured to communicate via a wireless interface may be referred to as "wireless communication terminals," "wireless terminals," or "mobile terminals." Examples of mobile terminals include, but are not limited to, satellite or cellular phones; personal communication system (PCS) terminals that may combine cellular radiotelephones with data processing, fax, and data communication capabilities; PDAs that may include radiotelephones, pagers, Internet / Intranet access, Web browsers, organizers, calendars, and / or global positioning system (GPS) receivers; and conventional laptop and / or palmtop receivers or other electronic devices that include radiotelephone transceivers.

[0054] In some embodiments, the electronic device 102 may include but is not limited to a mobile phone, a mobile internet device (MID), an e-book, a portable player station (Play Station Portable, PSP) or a personal digital assistant (Personal Digital Assistant, PDA) and other electronic devices with communication functions.

[0055] The antenna radiator 30 can be a combination of one or more of a flexible printed circuit (FPC) antenna, a laser direct structuring (LDS) antenna, a print direct structuring (PDS) antenna, and a metal frame antenna (also called a metal branch antenna). Of course, the antenna radiator 30 can also be other types of antennas, which will not be described in detail.

[0056] The antenna radiator 30 may support a medium-high frequency band and / or a low frequency band. In some embodiments, the antenna radiator 30 may support a WiFi (Wireless-Fidelity) frequency band. In some embodiments, the antenna radiator 30 may support a WiFi 2.4G frequency band.

[0057] See also Figure 7 and Figure 8 , Figure 7 for Figure 1The schematic diagram of the structure of the electronic system 100 in the embodiment shown, Figure 8 for Figure 7 The enlarged schematic diagram of the local VIII of the electronic system 100 in the illustrated embodiment. When the assembly 101 is assembled on the electronic device 102, the dielectric body 20, such as the contact portion 201, can contact the electronic device 102, such as the antenna radiator 30. Of course, the dielectric body 20, such as the contact portion 201, may not contact the electronic device 102, or the dielectric body 20, such as the contact portion 201, may contact the electronic device 102 but not the antenna radiator 30, so as to achieve the cooperation between the dielectric body 20 and the antenna radiator 30.

[0058] In some embodiments, the antenna radiator 30 has a free end 301 in the extension direction of the antenna radiator 30. The dielectric body 20 has an end 203 closest to the free end 301. The orthographic projection of the end 203 on the antenna radiator 30 is located on the antenna radiator 30. The antenna radiator 30 has a radiating portion including the free end 301. The distance L between the end 203 and the free end 301 is greater than or equal to 1 / 16 of the wavelength corresponding to the operating frequency of the radiating portion. In some embodiments, the radiating portion including the free end 301 may be the antenna radiator 30 or a portion of the antenna radiator 30. In some embodiments, the radiating portion including the free end 301 may support a medium-high frequency band and / or a low frequency band, that is, the operating frequency of the radiating portion may be a medium-high frequency band and / or a low frequency band. In some embodiments, the radiating portion including the free end 301 may support a WiFi (Wireless-Fidelity) frequency band, that is, the operating frequency of the radiating portion may be a WiFi frequency band. In some embodiments, the radiation portion including the free end 301 may support the WiFi 2.4G frequency band, that is, the operating frequency of the radiation portion may be the WiFi 2.4G frequency band.

[0059] In some embodiments, see Fig. 9 , Fig. 9 for Figure 8A comparison diagram of radiation performance when the assembly and the electronic device 102 are matched in the illustrated embodiment. The horizontal axis is frequency (GHz) and the vertical axis is in dB. Curve A1 is a radiation efficiency curve of the assembly 101 assembled on the electronic device 102, curve A2 is a system efficiency curve of the assembly 101 assembled on the electronic device 102, curve B1 is a radiation efficiency curve of a conventional assembly (assembly 101 without a dielectric body 20) assembled on the electronic device 102, and curve B2 is a system efficiency curve of a conventional assembly assembled on the electronic device 102. The radiation efficiency of curve A1 at 1-2.8 GHz is higher than that of curve B1. The system efficiency of curve A2 at 1.5-4 GHz is higher than that of curve B2. The radiation efficiency of curve A1 at 2.4388 GHz is -4.3694914 dB, and the radiation efficiency of curve B1 at 2.4388 GHz is -5.6088476 dB. The provision of the dielectric body 20 can improve the radiation efficiency by 1.24 dB. The system efficiency of curve A2 at 2.4388 GHz is -4.7513659 dB, and the system efficiency of curve B2 at 2.4388 GHz is -6.2776389 dB. The provision of the dielectric body 20 can improve the system efficiency by 1.53 dB.

[0060] In some embodiments, see Fig.10 , Fig.10 for Figure 8 A comparison diagram of radiation performance when the assembly 101 and the electronic device 102 are matched in the illustrated embodiment. The horizontal axis is frequency (GHz) and the vertical axis is in dB. Curve A3 is a radiation efficiency curve when the assembly 101 is assembled on the electronic device 102, curve A4 is a system efficiency curve when the assembly 101 is assembled on the electronic device 102, curve B3 is a radiation efficiency curve when the electronic device 102 is not assembled with the assembly 101, and curve B4 is a system efficiency curve when the electronic device 102 is not assembled with the assembly 101. The radiation efficiency of curve A3 at 1.2-4GHz is higher than that of curve B3. The system efficiency of curve A4 at 2.3-4GHz is higher than that of curve B4. The radiation efficiency of curve A3 at 2.4388GHz is -4.9709887dB, and the radiation efficiency of curve B3 at 2.4388GHz is -5.4486948dB. The setting of the assembly 101 can improve the radiation efficiency by 0.478dB. The system efficiency of curve A4 at 2.4388 GHz is -6.2507135 dB, and the system efficiency of curve B4 at 2.4388 GHz is -6.7475452 dB. The setting of assembly 101 can improve the system efficiency by 0.497 dB.

[0061] See also Figure 6The electronic device 102 may include a middle frame assembly 40 provided with an antenna radiator 30, a battery cover 50 connected to one side of the middle frame assembly 40, and a display screen 60 provided on the other side of the middle frame assembly 40 and used to display information. The display screen 60 may be a display screen of a type such as a liquid crystal display (LCD) or an organic light-emitting diode display (OLED) for displaying information and images.

[0062] The material of the middle frame assembly 40 can be a metal such as magnesium alloy, aluminum alloy, stainless steel, etc. Of course, the material is not limited thereto, and can also be other materials such as insulating materials, such as hard materials. The middle frame assembly 40 can be placed between the battery cover 50 and the display screen 60. The middle frame assembly 40 can be used to carry the display screen 60. The middle frame assembly 40 and the battery cover 50 are snap-fitted to form the housing of the electronic device 102, and a accommodating cavity is formed inside the housing. The accommodating cavity can be used to accommodate electronic components such as the camera, circuit board, battery, processor (arranged on the circuit board, so in some embodiments it can be part of the circuit board), antenna radiator 30 and various types of sensors in the electronic device 102.

[0063] The battery cover 50 can be made of the same material as the middle frame assembly 40, or other materials. The battery cover 50 can be integrally formed with the middle frame assembly 40. In some embodiments, the battery cover 50 can wrap the middle frame assembly 40 and can carry the display screen 60. The battery cover 50 can be formed with a rear camera hole, a fingerprint recognition module installation hole, and other structures.

[0064] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0065] See also Figure 6 The middle frame assembly 40 may include a substrate 41 for carrying the display screen 60 and a frame body 42 arranged around the substrate 41. The substrate 41 is arranged opposite to the battery cover 50. The frame body 42 may be used for snapping and connecting with the battery cover 50. That is, the substrate 41, the frame body 42 and the battery cover 50 are arranged to form a receiving cavity.

[0066] The substrate 41 may be a conductive metal, or other materials. A ground plane and a feed source may be provided on the substrate 41 to cooperate with the antenna radiator 30. The ground plane serves as a ground. The antenna radiator 30 may be directly or indirectly electrically connected to the ground plane and / or the feed source to achieve excitation of the antenna radiator 30 by the feed source. In some embodiments, the ground plane and the feed source may not be provided on the substrate 41, but may be directly provided on the circuit main board. In some embodiments, the substrate 41 may be omitted.

[0067] The frame 42 may be a conductive metal, so the frame 42 may also be referred to as a "metal frame". Of course, the frame 42 may also be other materials, such as insulating materials. The frame 42 may also be made of the same material as the substrate 41. The frame 42 may include a first sub-frame 421, a second sub-frame 422, a third sub-frame 423, and a fourth sub-frame 424 connected end to end in sequence. The first sub-frame 421, the second sub-frame 422, the third sub-frame 423, and the fourth sub-frame 424 are arranged around the substrate 41 and may be connected and fixed to the substrate 41. In some embodiments, the frame 42 may be an integral structure with the battery cover 50. For example, the frame 42 extends from the edge of the battery cover 50 to one side of the display screen 60 to be snap-fitted and connected to the display screen 60.

[0068] In some embodiments, the first sub-frame 421, the second sub-frame 422, the third sub-frame 423 and the fourth sub-frame 424 are arranged to form a rounded rectangle. Of course, other shapes such as a circle, a triangle, etc. are also possible. In some embodiments, the first sub-frame 421 and the third sub-frame 423 are arranged opposite to each other, and the second sub-frame 422 and the fourth sub-frame 424 are arranged opposite to each other.

[0069] In some embodiments, the lengths of the first sub-frame 421 and the third sub-frame 423 are both longer than the length of the second sub-frame 422 , and longer than the length of the fourth frame 42 .

[0070] It can be understood that the middle frame assembly 40 and the battery cover 50 can form a housing. In some embodiments, the housing may not be limited to the middle frame assembly 40 and the battery cover 50, but may also include other components, which will not be described in detail.

[0071] See also Figure 7, when the assembly 101 is assembled on the electronic device 102, the body 10 can be assembled on the casing. In some embodiments, the bottom plate 11 can be directly or indirectly connected and fixed to the battery cover 50, or can be arranged at intervals. The bottom plate 11 can protect the battery cover 50. In some embodiments, the frame 12, such as the first sub-frame 121, the second sub-frame 122, the third sub-frame 123 and the fourth sub-frame 124, can be directly or indirectly fixed on the frame 42, such as the first sub-frame 421, the second sub-frame 422, the third sub-frame 423 and the fourth sub-frame 424. In some embodiments, the frame 12, such as the first sub-frame 121, the second sub-frame 122, the third sub-frame 123 and the fourth sub-frame 124, can be fixed on the frame 42, such as the first sub-frame 421, the second sub-frame 422, the third sub-frame 423 and the fourth sub-frame 424. In some embodiments, the first sub-frame 121 can contact the first sub-frame 421 to protect the first sub-frame 421. In some embodiments, the second sub-frame 122 may contact the second sub-frame 422 to protect the second sub-frame 422. In some embodiments, the third sub-frame 123 may contact the third sub-frame 423 to protect the third sub-frame 423. In some embodiments, the fourth sub-frame 124 may contact the fourth sub-frame 424 to protect the fourth sub-frame 424.

[0072] See also Figure 8 , the antenna radiator 30 may be disposed on the first sub-frame 421. In some embodiments, the antenna radiator 30 may be extended in the extension direction of the frame 42, such as the first sub-frame 421. In some embodiments, the free end 301 may be disposed on a side of the antenna radiator 30 facing the second sub-frame 422. Of course, it may also be disposed on a side of the antenna radiator 30 facing the fourth sub-frame 424.

[0073] See also Fig.11 and Fig.12 , Fig.11 for Figure 7 The illustrated embodiment is a schematic diagram of the structure of the electronic system 100 in other embodiments. Fig.12 for Fig.11An enlarged view of a local XII of the electronic system 100 in the illustrated embodiment. The antenna radiator 30 may be arranged on the housing in the manner described in the above embodiments. Specifically, the antenna radiator 30 may be arranged on any two adjacent sub-frames in the frame 42. For example, the antenna radiator 30 may be partially arranged on the first sub-frame 421 and partially arranged on the second sub-frame 422. For example, the antenna radiator 30 may be partially arranged on the second sub-frame 422 and partially arranged on the third sub-frame 423. For example, the antenna radiator 30 may be partially arranged on the third sub-frame 423 and partially arranged on the fourth sub-frame 424. For example, the antenna radiator 30 may be partially arranged on the fourth sub-frame 424 and partially arranged on the first sub-frame 421.

[0074] Here, it is taken as an example that the antenna radiator 30 can be partially disposed on the first sub-frame 421 and partially disposed on the second sub-frame 422 . The configuration methods in other embodiments may refer to this embodiment and will not be described in detail.

[0075] See also Fig.12 , the antenna radiator 30 includes a first sub-radiator 31 and a second sub-radiator 32 that are bent and connected. The first sub-radiator 31 can be set on the first sub-frame 421. The second sub-radiator 32 can be set on the second sub-frame 422. In some embodiments, the first sub-dielectric body 21 cooperates with the first sub-radiator 31, and the second sub-dielectric body 22 cooperates with the second sub-radiator 32. The specific cooperation method can refer to the above embodiment. In some embodiments, the first sub-dielectric body 21 contacts the first sub-radiator 31, and the second sub-dielectric body 22 contacts the second sub-radiator 32. In some embodiments, the free end 301 can be set at an end of the first sub-radiator 31 away from the second sub-radiator 32. In some embodiments, the free end 301 can be set at an end of the second sub-radiator 32 away from the first sub-radiator 31.

[0076] The antenna radiator 30 may be mounted on the middle frame assembly 40. In some embodiments, the antenna radiator 30 may be a part of the middle frame assembly 40. Of course, in some embodiments, the antenna radiator 30 may also be mounted on other locations of the housing, such as the battery cover 50. In some embodiments, the antenna radiator 30 may be processed from the housing. For example, the antenna radiator 30 appears as a slot antenna. In some embodiments, the antenna radiator 30 may be directly fixed to the housing.

[0077] See also Fig.13 . Fig.13 for Figure 7 The schematic diagram of the structure of the assembly 101 and the middle frame assembly 40 in the embodiment shown. The antenna radiator 30 is arranged in the frame 42, such as the first sub-frame 421. It can be understood that

[0078] In one embodiment, the antenna radiator 30 may be electrically connected to a feed source and / or a ground on the substrate 41 or the circuit board. Specifically, the connection between the antenna radiator 30 and the feed source and / or the ground may be achieved through an antenna spring.

[0079] The first sub-frame 421 is provided with a slit 4211 so that the first sub-frame 421 is divided into two parts. A slit 4212 connected to the slit 4211 is provided between the first sub-frame 421 and the substrate 41. The slit 4211 and the slit 4212 cooperate so that an end 4213 of the first sub-frame 421 close to the slit 4211 is a free end 301. In some embodiments, the slit 4212 can be extended from the position connected to the slit 4211 to a side close to the second sub-frame 422 or the fourth sub-frame 424.

[0080] It can be understood that the antenna radiator 30 utilizes the first sub-frame 421 , which can effectively improve the performance loss of the antenna radiator 30 .

[0081] In addition, in order to stabilize the connection strength between the substrate 41 and the frame 42, such as the first sub-frame 421, and the antenna radiator 30, an insulating material, such as resin, can be filled between the gap 4211 and the gap 4212 to realize that the antenna radiator 30 is a part of the frame 42, such as the first sub-frame 421, and the appearance of the electronic device 102 is further improved.

[0082] The present application can improve the antenna performance of the antenna radiator 30 to a certain extent, enhance the receiving and transmitting capabilities of the antenna radiator 30, and improve the user experience.

[0083] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An assembly part, used for assembly on the outer surface of an electronic device, characterized in that: The assembly includes a dielectric body, and the electronic device is provided with an antenna radiator. When the assembly is assembled on the electronic device, the dielectric body can be configured to be polarized by the antenna radiator for radiation, and the assembly can be configured to be disassembled and separated from the electronic device.

2. The assembly according to claim 1, characterized in that: The assembly also includes a body, the dielectric body is arranged on the body, and the body is used to be assembled on the outer surface of the electronic device. When the body is assembled on the electronic device, the body can be configured to be detached from the electronic device.

3. The assembly according to claim 2, characterized in that: The body is provided with a contact surface that contacts the electronic device, the contact surface is provided with a groove, the dielectric body is arranged in the groove and contacts the antenna radiator.

4. The assembly according to claim 3, characterized in that: The body is provided with a hand touch surface, the hand touch surface and the contact surface are respectively provided on two opposite sides of the body, the groove runs through the hand touch surface and the contact surface, and the dielectric body is provided with a hand touch portion on a side away from the electronic device.

5. The assembly according to any one of claims 2 to 4, characterized in that: The body comprises: Base plate; The frame is connected to the bottom plate and is arranged with the bottom plate to form an assembly space. When the body is assembled on the electronic device, the electronic device is located in the assembly space.

6. The assembly according to claim 5, characterized in that: The dielectric body is arranged on the frame.

7. The assembly according to any one of claims 1 to 4, characterized in that: The antenna radiator has a free end in the extension direction of the antenna radiator, the dielectric body has an end portion closest to the free end, the orthographic projection of the end portion on the antenna radiator is located on the antenna radiator, the antenna radiator has a radiating portion including the free end, and the distance between the end portion and the free end is greater than or equal to 1 / 16 of a wavelength corresponding to an operating frequency of the radiating portion.

8. The assembly according to any one of claims 1 to 4, characterized in that: The relative dielectric constant of the dielectric body is greater than or equal to 60.

9. An electronic system, characterized in that: include: An electronic device is provided with an antenna radiator; as well as The assembly is mounted on the outer surface of the electronic device and can be configured to be disassembled and separated from the electronic device. The assembly includes a dielectric body. When the antenna radiator is working, the dielectric body is configured to be polarized by the antenna radiator to radiate.

10. The electronic system according to claim 9, characterized in that: The assembly also includes a body, the dielectric body is arranged on the body, and the body is mounted on the outer surface of the electronic device and can be configured to be detached from the electronic device.

11. The electronic system according to claim 10, characterized in that: The body is provided with a contact surface that contacts the electronic device, the contact surface is provided with a groove, the dielectric body is arranged in the groove and contacts the antenna radiator.

12. The electronic system according to claim 11, characterized in that: The body is provided with a hand touch surface, the hand touch surface and the contact surface are respectively provided on two opposite sides of the body, the groove runs through the hand touch surface and the contact surface, and the dielectric body is provided with a hand touch portion on a side away from the electronic device.

13. The electronic system according to any one of claims 10 to 12, characterized in that: The body comprises: Base plate; The frame is connected to the bottom plate and is arranged with the bottom plate to form an assembly space. When the body is assembled on the electronic device, the electronic device is located in the assembly space.

14. The electronic system according to claim 13, characterized in that: The dielectric body is arranged on the frame.

15. The electronic system according to claim 13, characterized in that: The dielectric body includes a first sub-dielectric body and a second sub-dielectric body connected in a bent manner, the antenna radiator includes a first sub-radiator and a second sub-radiator connected in a bent manner, the first sub-dielectric body contacts the first sub-radiator, and the second sub-dielectric body contacts the second sub-radiator.

16. The electronic system according to any one of claims 9 to 12, characterized in that: The antenna radiator has a free end in the extension direction of the antenna radiator, the dielectric body has an end portion closest to the free end, the orthographic projection of the end portion on the antenna radiator is located on the antenna radiator, the antenna radiator has a radiating portion including the free end, and the distance between the end portion and the free end is greater than or equal to 1 / 16 of a wavelength corresponding to an operating frequency of the radiating portion.

17. The electronic system according to claim 16, characterized in that: The operating frequency of the radiation unit includes a wireless fidelity WiFi frequency band.

18. The electronic system according to claim 17, characterized in that: The WiFi frequency band includes the WiFi 2.4G frequency band.

19. The electronic system according to any one of claims 9 to 12, characterized in that: The relative dielectric constant of the dielectric body is greater than or equal to 60.

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