Display panel and method of manufacturing same

Abstract

A display panel and a method of manufacturing the same are provided. The display panel may include a first region and a second region connected to each other. The first region and the second region may have curved edges and straight edges, respectively, when viewed in a plan view. When viewed in a cross-sectional view, a side surface of the first region may include a central region having a linear shape, and a side surface of the second region may include a central region having a curved shape. In some embodiments, the side surface of the first region has a first roughness, and the side surface of the second region has a second roughness that is smoother than the first roughness.

Description

[0001] This application is a divisional application of the invention patent application "Display panel and method for manufacturing the display panel" with application date of December 7, 2018 and application number 201811495769.X. Technical Field

[0002] The present disclosure relates to a display panel and a method of manufacturing the display panel, and more particularly, to a display panel having a curved edge and a method of manufacturing the display panel with improved yield. Background Art

[0003] A display panel is formed from a working panel. The working panel includes two opposing working substrates. The working panel includes a plurality of unit areas. Each unit area is cut and polished to form a display panel.

[0004] The production efficiency and cost of display panels are determined by the process of cutting and polishing unit areas. Summary of the invention

[0005] Some embodiments of the inventive concept provide a display panel whose edge portion is formed to have a curved shape when viewed in a plan view.

[0006] Some embodiments of the inventive concept provide a method of manufacturing a display panel with reduced manufacturing time and cost.

[0007] According to some embodiments of the inventive concept, a display panel may include: a first region, when viewed in a plan view, the first region includes a curved edge; and a second region, when viewed in a plan view, the second region includes a straight edge and is adjacent to the first region. When viewed in a cross-sectional view, a side surface of the first region may include a central region having a straight line, and when viewed in a cross-sectional view, a side surface of the second region may include a central region having a curved line.

[0008] In some embodiments, the display panel may further include a third region, when viewed in plan, the third region includes a straight edge and is adjacent to the first region. When viewed in cross-sectional view, a side surface of the third region may include a central region corresponding to a central region of the side surface of the first region.

[0009] In some embodiments, the first area and the third area may define a concave area of ​​the display panel when viewed in plan view.

[0010] In some embodiments, when viewed in a cross-sectional view, the side surface of the first region may further include an upper region disposed on a central region of the first region and a lower region disposed below the central region of the first region. When viewed in a cross-sectional view, the upper region may include oblique lines.

[0011] In some embodiments, when viewed in a cross-sectional view, the side surface of the second region may further include an upper region disposed on a central region of the second region and a lower region disposed below the central region of the second region. When viewed in a cross-sectional view, the upper region may include at least a straight line.

[0012] In some embodiments, when viewed in a cross-sectional view, the upper region of the side surface of the second region may further include at least an oblique line, and the straight line of the upper region may be disposed between the oblique line of the upper region and the curved line of the central region of the second region.

[0013] According to some embodiments of the inventive concept, a display panel may include: a first region having a curved edge when viewed in a plan view; and a second region having a straight edge when viewed in a plan view and being continuous with the first region. A side surface of the first region may have a first roughness, and a side surface of the second region may have a second roughness that is smoother than the first roughness.

[0014] In some embodiments, the side surface of the first region may include a central region having a straight line when viewed in a cross-sectional view, and the side surface of the second region may include a central region having a curved line when viewed in a cross-sectional view.

[0015] According to some embodiments of the inventive concept, a display panel may include: a display substrate including a first edge having a first lower region and a second lower region, the first lower region having a curve and the second lower region having a straight line when viewed in a plan view; an encapsulation substrate facing the display substrate and including a second edge having a first upper region and a second upper region, the first upper region having a curve corresponding to the curve of the first lower region, and the second upper region having a straight line corresponding to the straight line of the second lower region; and a sealing element, bonding the display substrate to the encapsulation substrate. When viewed in a cross-sectional view, a side surface of each of the first lower region and the first upper region may include an inner region having a straight line, and when viewed in a cross-sectional view, a side surface of each of the second lower region and the second upper region may include an inner region having a curve.

[0016] In some embodiments, when viewed in cross-section, a side surface of the first lower region and a side surface of the first upper region may be substantially aligned with a side surface of the sealing element.

[0017] In some embodiments, an inner region of each of the first lower region and the first upper region may have a first roughness, and an inner region of each of the second lower region and the second upper region may have a second roughness that may be smoother than the first roughness.

[0018] In some embodiments, the encapsulation substrate may include a glass substrate having a top surface and a bottom surface, and the sealing member may be directly bonded to the bottom surface of the encapsulation substrate.

[0019] In some embodiments, the package substrate may further include a touch sensing unit including sensor electrodes disposed on the top surface.

[0020] In some embodiments, the display substrate may include: a glass substrate; a circuit device layer located on the glass substrate, the circuit device layer including a conductive pattern and a transistor; and a display device layer located on the circuit device layer, the display device layer including an organic light emitting diode.

[0021] In some embodiments, the sealing member may be directly bonded to the conductive pattern of the circuit device layer, and the conductive pattern and the electrode of the transistor may be disposed on the same layer.

[0022] In some embodiments, the display substrate may further include a pad region exposed by the encapsulation substrate when viewed in a plan view.

[0023] According to some embodiments of the inventive concept, a method for manufacturing a display panel may include the following steps: separating a pre-display panel from a working panel, the pre-display panel including a pre-display substrate, a pre-packaging substrate facing the pre-display substrate, and a pre-sealing element bonding the pre-display substrate to the pre-packaging substrate, and when viewed in a plan view, the pre-sealing element includes a straight area and a curved area; forming a pre-bent area in each of the pre-display substrate and the pre-packaging substrate, the pre-bent area corresponding to the curved area of ​​the pre-sealing element; and polishing the pre-bent area.

[0024] In some embodiments, the working panel may include: a working display substrate including a unit area; a working encapsulation substrate facing the working display substrate; and a working sealing element that combines the working display substrate to the working encapsulation substrate. The working sealing element may be arranged to correspond to the unit area. The working encapsulation substrate may include a base substrate and a light blocking pattern, the light blocking pattern being arranged on an outer surface of the base substrate and partially overlapping the working sealing element.

[0025] In some embodiments, the step of separating the pre-display panel may include: photocuring the working sealing element using the light blocking pattern as a mask; and cutting the working display substrate and the working encapsulation substrate along cutting lines to form a plurality of pieces corresponding to the unit areas respectively, the cutting lines overlapping the exposure areas of each working sealing element.

[0026] In some embodiments, the pre-sealed element may further include a concave area when viewed in a plan view. The method may further include the following steps: forming a pre-concave area in each of the pre-display substrate and the pre-package substrate, the pre-concave area corresponding to the concave area of ​​the pre-sealed element; and polishing the pre-concave area.

[0027] In some embodiments, the step of polishing the pre-bent area may be performed so that side surfaces of the pre-bent area of ​​the pre-display substrate and the pre-packaging substrate are substantially aligned with side surfaces of the pre-sealing element when viewed in a cross-sectional view.

[0028] In some embodiments, the method may further include the step of partially cutting the pre-package substrate to expose a portion of the pre-display substrate after the step of separating the pre-display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Example embodiments will be more clearly understood from the following brief description taken in conjunction with the accompanying drawings, which illustrate non-limiting example embodiments as described herein.

[0030] Figure 1A is a perspective view illustrating a display panel according to some embodiments of the inventive concept.

[0031] Figure 1B is a plan view illustrating a display panel according to some embodiments of the inventive concept.

[0032] Figure 1C and Figure 1D are cross-sectional views each showing a display panel according to some embodiments of the inventive concept.

[0033] Figure 2A is a cross-sectional view of a display substrate according to some embodiments of the inventive concept.

[0034] Figure 2B is a plan view of a display substrate according to some embodiments of the inventive concept.

[0035] Figure 2C is a cross-sectional view illustrating a portion of a pixel according to some embodiments of the inventive concept.

[0036] Figure 3A is a plan view showing a working panel according to some embodiments of the inventive concept.

[0037] Figure 3B is an enlarged plan view illustrating a unit area of ​​a working panel according to some embodiments of the inventive concept.

[0038] Figure 3C is a cross-sectional view illustrating a unit area of ​​a working panel according to some embodiments of the inventive concept.

[0039] Figure 4 is a flowchart illustrating a method of manufacturing a display panel according to some embodiments of the inventive concept.

[0040] Figure 5A is a plan view illustrating a first cutting step according to some embodiments of the inventive concept.

[0041] Figure 5B and Figure 5C are enlarged cross-sectional views each showing a first cutting region of the working panel.

[0042] Figure 5D is an enlarged cross-sectional view showing a second cutting region of the working panel.

[0043] Figure 5E is a plan view illustrating a second cutting step according to some embodiments of the inventive concept.

[0044] Fig. 6A is a plan view illustrating a pre-display panel according to some embodiments of the inventive concept.

[0045] Figure 6B is a cross-sectional view illustrating a pre-display panel according to some embodiments of the inventive concept.

[0046] Fig. 7A is a plan view illustrating steps of forming a pre-bent area according to some embodiments of the inventive concept.

[0047] Figure 7B is a plan view illustrating a pre-display panel having a pre-bent area according to some embodiments of the inventive concept.

[0048] Fig. 8A is a plan view illustrating a step of polishing a pre-bent area according to some embodiments of the inventive concept.

[0049] FIG. 8B to FIG. 8D is a cross-sectional view illustrating a step of polishing a pre-bent area according to some embodiments of the inventive concept.

[0050] Fig. 8E is a cross-sectional view illustrating a curved area of ​​a display panel according to some embodiments of the inventive concept.

[0051] Fig. 9A is a cross-sectional view illustrating an edge grinding step according to some embodiments of the inventive concept.

[0052] Fig. 9B is a cross-sectional view showing a display panel having a polished edge.

[0053] Fig. 10A and Fig. 10Bis a cross-sectional image showing a display panel according to some embodiments of the inventive concept.

[0054] FIG. 10C to FIG. 10E are images showing side surfaces of display panels according to some embodiments of the inventive concept.

[0055] FIG. 11A to FIG. 11C is a plan view illustrating a display panel according to some embodiments of the inventive concept.

[0056] Fig.12 yes Figure 6B An enlarged cross-sectional view of a portion of a display panel.

[0057] It should be noted that these figures are intended to illustrate the general characteristics of the methods, structures and / or materials used in certain example embodiments, and are intended to supplement the written description provided below. However, these drawings are not to scale, may not accurately reflect the precise structural characteristics or performance characteristics of any given embodiment, and should not be interpreted as limiting or restricting the range of values ​​or properties contained in the example embodiments. For example, the relative thickness and positioning of molecules, layers, regions and / or structural elements may be reduced or exaggerated for clarity. The use of similar or identical reference numerals in different drawings is intended to indicate the presence of similar or identical elements or features. DETAILED DESCRIPTION

[0058] Example embodiments of the inventive concepts will now be more fully described with reference to the accompanying drawings in which example embodiments are shown. However, example embodiments of the inventive concepts may be implemented in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concepts of the example embodiments to those of ordinary skill in the art. In the accompanying drawings, the thickness of layers and regions is exaggerated for clarity. Like reference numerals in the drawings represent like elements, and therefore their descriptions will be omitted.

[0059] It will be understood that when an element is referred to as being "connected" or "coupled" to another element, the element may be directly connected to or coupled to the other element, or there may be an intermediate element. Conversely, when an element is referred to as being "directly connected" or "directly coupled" to another element, there is no intermediate element. Other words used to describe the relationship between an element or layer should be interpreted in a similar manner (e.g., "between" vs. "directly between", "adjacent to" vs. "directly adjacent to", "on" vs. "directly on"). The same reference numerals always represent the same element. As used herein, the term "and / or" includes any and all combinations of one or more of the related listed items.

[0060] It will be understood that, although the terms "first", "second", etc. may be used herein to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer or part discussed below may be named as the second element, component, region, layer or part.

[0061] For ease of description, spatial relative terms such as "under ...", "below ...", "below ...", "above ...", "on ...", etc. may be used here to describe the relationship between an element or feature and another (other) element or feature as shown in the figure. It will be understood that, in addition to the orientation depicted in the figure, the spatial relative terms are intended to include different orientations of the device in use or operation. For example, if the device in the figure is turned over, the element described as "below" or "below" other elements or features will then be positioned as "above" the other elements or features. Therefore, the exemplary term "below ..." can include both "above" and "below" orientations. The device can be positioned otherwise (rotated 90 degrees or in other orientations), and the spatial relative descriptors used here are interpreted accordingly.

[0062] The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the exemplary embodiments. As used herein, unless the context clearly indicates otherwise, the singular forms "one (kind / person)" and "the (the)" are also intended to include plural forms. It will also be understood that if the terms "comprise", "include" and / or their variations are used herein, it is indicated that there are stated features, wholes, steps, operations, elements, components and / or their groups, but it does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or their groups.

[0063] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the exemplary embodiments of the inventive concepts belong. It will also be understood that, unless expressly defined as such herein, terms (such as those defined in common dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense.

[0064] Figure 1A is a perspective view illustrating a display panel DP according to some embodiments of the inventive concept. Figure 1B is a plan view illustrating a display panel DP according to some embodiments of the inventive concept. Figure 1Cand Figure 1D are cross-sectional views each showing a display panel DP according to some embodiments of the inventive concept, specifically, Figure 1C is a diagram showing some embodiments according to the inventive concept Figure 1B A cross-sectional view of the display panel DP taken along line II', Figure 1D is a diagram showing some embodiments according to the inventive concept Figure 1B 4 is a cross-sectional view of the display panel DP taken along line II-II'.

[0065] like Figure 1A As shown in , the display panel DP may include a display substrate DS, an encapsulation substrate ES, and a sealing member SM for attaching the encapsulation substrate ES to the display substrate DS. The display substrate DS may include a plurality of pixels PX configured to generate an image. The encapsulation substrate ES may be configured to hermetically seal the pixels PX, thereby preventing the pixels PX from being damaged by external moisture or the like.

[0066] The display panel DP may further include a driving device DI coupled to the display substrate DS. The driving device DI may be a chip integrated on the display substrate DS. However, the inventive concept is not limited thereto, and in some embodiments, the driving device DI may not be disposed on the display substrate DS.

[0067] Each of the display substrate DS and the encapsulation substrate ES may include a glass substrate serving as a base substrate thereof. The display substrate DS may have an area larger than that of the encapsulation substrate ES. The driving device DI may be disposed in a region of the display substrate DS exposed by the encapsulation substrate ES. However, the inventive concept is not limited thereto, and in some embodiments, the display substrate DS may be disposed to have a shape substantially the same as that of the encapsulation substrate ES.

[0068] In some embodiments, the sealing element SM may be formed of or include glass frit. Glass frit is a ceramic adhesive material melted and solidified by a laser exposure process. Glass frit may include 15-40 wt % V as a main component. 2 O 5 、10-30wt% TeO 2 、1-15wt% P 2 O 5 , 1-15wt% BaO, 1-20wt% ZnO, 5-30wt% ZrO 2 and 5-20wt%WO 3 And Fe used as an additive 2 O 3 , CuO, MnO, Al 2 O 3 、Na 2 O and Nb 2 O5 If the glass frit is prepared to have the above components, the glass frit may have 40-100×10 -7 / ℃ thermal expansion coefficient and glass transition temperature of 250-400℃.

[0069] The encapsulation substrate ES may provide a display surface on which an image generated by the display panel DP is displayed. Figure 1A , the dotted line depicts an area in which the sealing member SM is disposed. The display panel DP may have a front surface parallel to the first direction axis DR1 and the second direction axis DR2. The normal direction of the front surface of the display panel DP (i.e., the thickness direction of the display panel DP) may be referred to as a third direction axis DR3. In each of the layers constituting the display panel DP, the top surface or the front surface may be distinguished from the bottom surface or the rear surface based on the third direction axis DR3. Hereinafter, the first direction to the third direction may be directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3, respectively, and will be identified using the same reference numerals.

[0070] When viewed in a plan view, the display panel DP may include a sealing area DP-SL and a pad (also referred to as a pad) area DP-PD. The sealing area DP-SL may include an inner area defined by a dotted line or by a sealing element SM. The pixels PX of the display panel DP may be disposed within the inner area of ​​the sealing area DP-SL. The pad area DP-PD may be the remaining area of ​​the display panel DP except the sealing area DP-SL. The driving device DI may be disposed in the pad area DP-PD.

[0071] exist Figure 1A exemplarily shows a flat display panel DP, but the inventive concept is not limited thereto. For example, a portion of the display panel DP may be bent so that the display panel DP has a curved front surface. In some embodiments, the display substrate DS may be bent in such a manner that the pad region DP-PD not covered by the encapsulation substrate ES is positioned to face the rear surface of the display panel DP. For example, the display substrate DS may be bent along the second direction axis DR2 serving as the bending axis.

[0072] like Figure 1A and Figure 1B As shown in , when viewed in a plan view, the display panel DP may include a curved area EC having a curved edge and linear areas (straight area) E-S1 and E-S2 having linear edges. In other words, when viewed in a plan view, the display panel DP may have an edge DP-E including a curved portion and a linear portion.

[0073] When viewed in a plan view, the edge DP-E of the display panel DP may have substantially the same shape as that of the edge of the display substrate DS. When viewed in a plan view, the edge of the display substrate DS may have substantially the same shape as that of the edge of the encapsulation substrate ES except for a specific area. Figure 1B As shown in , most of the edge of the display substrate DS may be substantially aligned with the edge of the encapsulation substrate ES when viewed in a plan view, and a lower edge of the encapsulation substrate ES adjacent to the pad region DP-PD may not be aligned with the lower edge of the display substrate DS.

[0074] like Figure 1A and Figure 1B As shown in , when viewed in a plan view, the edge DP-E of the display panel DP may include four curved areas EC (hereinafter, may be referred to as first areas) and six straight areas E-S1 and E-S2. As a result of its manufacturing process, the straight areas E-S1 and E-S2 may be classified into two groups. The cross-sectional shapes of the two groups may be different from each other. This will be described in more detail below.

[0075] When viewed in a plan view, the curved area EC may be disposed at two corner areas of an upper portion of the display panel DP. When viewed in a plan view, a concave area DP-CC may be defined at an upper portion of the display panel DP. Straight area E-S1 (hereinafter, may be referred to as a second area) may be respectively disposed between the concave area DP-CC and the two corner areas. When viewed in a plan view, the concave area DP-CC may be an area of ​​the display panel DP whose edge is recessed toward the center of the display panel DP. The concave area DP-CC may be defined by two curved areas EC and a straight area E-S2 (hereinafter, may be referred to as a third area) located between the two curved areas EC. However, the inventive concept is not limited to the specific shape of the concave area DP-CC.

[0076] When viewed in a plan view, each of the left edge, the right edge, and the lower edge of the display panel DP may have a linear shape. For example, each of the left edge, the right edge, and the lower edge of the display panel DP may be configured to have a straight line area E-S1.

[0077] When viewed in a cross-sectional view, the sealing member SM may be aligned with the display substrate DS and the encapsulation substrate ES in most areas. Figures 1B to 1D As shown in FIG. 1 , when viewed in a cross-sectional view, an edge of the sealing member SM may be substantially aligned with an edge of the display substrate DS and the encapsulation substrate ES in each of the first region EC, the second region E-S1, and the third region E-S2. However, an edge of the sealing member SM adjacent to the pad region DP-PD may not be aligned with an edge of the encapsulation substrate ES and an edge of the display substrate DS.

[0078] When viewed in a plan view, an edge of the display substrate DS may be referred to as a "first edge", and an edge of the encapsulation substrate ES may be referred to as a "second edge". The first edge may include a first lower region, a second lower region, and a third lower region corresponding to the first region EC, the second region E-S1, and the third region E-S2 of the display panel DP, respectively. The second edge may include a first upper region, a second upper region, and a third upper region corresponding to the first region EC, the second region E-S1, and the third region E-S2 of the display panel DP, respectively. The first lower region, the second lower region, and the third lower region may correspond to the first upper region, the second upper region, and the third upper region, respectively, except for the pad region DP-PD.

[0079] Figure 2A is a cross-sectional view illustrating a display substrate DS according to some embodiments of the inventive concept. Figure 2B is a plan view illustrating a display substrate DS according to some embodiments of the inventive concept. Figure 2C is a cross-sectional view illustrating a portion of a pixel PX according to some embodiments of the inventive concept.

[0080] like Figure 2A As shown in , the display substrate DS may include a base substrate DS-G and a circuit device layer DS-CL and a display device layer DS-OLED disposed on the base substrate DS-G. Although not shown, the display substrate DS may further include a functional layer (eg, a cover layer, an anti-reflection layer, and a refractive index control layer).

[0081] The base substrate DS-G may be a glass substrate. The circuit device layer DS-CL may include at least one insulating layer and at least one circuit device. The circuit device may include a signal line and a circuit for driving the pixel PX. The formation of the circuit device layer DS-CL may include the following steps: forming an insulating layer, a semiconductor layer, and a conductive layer using a coating or deposition process; and then patterning these layers using a photolithography process.

[0082] The display device layer DS-OLED may include at least one light emitting device. For example, the display device layer DS-OLED may include an organic light emitting diode. The display device layer DS-OLED may also include an organic layer that may be used as, for example, a pixel defining layer.

[0083] like Figure 2A and Figure 2BAs shown in , the display substrate DS may include a display area DS-DA and a non-display area DS-NDA. The pixel PX may be disposed in the display area DS-DA. The sealing element SM may be disposed to overlap the non-display area DS-NDA. The sealing element SM may be substantially attached to the circuit device layer DS-CL. The sealing element SM may be attached to the insulating layer and / or the conductive pattern of the circuit device layer DS-CL.

[0084] like Figure 2B As shown in FIG. 1 , the display substrate DS may include a driving circuit GDC, a plurality of signal lines SGL, a plurality of signal pads DS-PD, and a plurality of pixels PX. Each pixel PX may include an organic light emitting diode and a pixel driving circuit connected to the organic light emitting diode. The driving circuit GDC, the signal lines SGL, the signal pads DS-PD, and the pixel driving circuit may include Figure 2A The circuit device layer DS-CL is shown in FIG.

[0085] The driving circuit GDC may include a scan driving circuit. The scan driving circuit may be configured to generate a plurality of scan signals and sequentially output the scan signals to a plurality of scan lines GL. The scan driving circuit may include a plurality of thin film transistors formed by the same method as that of the driving circuit for the pixel PX or by, for example, a low temperature polycrystalline silicon (LTPS) process or a low temperature polycrystalline oxide (LTPO) process.

[0086] The signal line SGL may include a scan line GL, a data line DL, a power line PWL, and a control signal line CSL. Each scan line GL may be connected to a corresponding pixel PX in the pixels PX, and each data line DL may be connected to a corresponding pixel PX in the pixels PX. The power line PWL may be connected to the pixel PX. The control signal line CSL may be configured to provide a control signal to the scan drive circuit. The signal pads DS-PD may be connected to the signal lines SGL, respectively.

[0087] The display substrate DS may include a chip mounting area NDA-TC placed in the non-display area DS-NDA. The driving device DI (eg, Figure 1A ) can be mounted on the chip mounting area NDA-TC.

[0088] The first chip pad TC-PD1 and the second chip pad TC-PD2 may be disposed in the chip mounting area NDA-TC. The first chip pad TC-PD1 may be connected to the data line DL, and the second chip pad TC-PD2 may be connected to the signal pad DS-PD through the signal line. The terminal of the driving device DI may be connected to the first chip pad TC-PD1 and the second chip pad TC-PD2. Therefore, the data line DL may be electrically connected to the signal pad DS-PD via the driving device DI.

[0089] like Figure 2C As shown in , the circuit device layer DS-CL and the display device layer DS-OLED may be sequentially disposed on the base substrate DS-G. In this embodiment, the circuit device layer DS-CL may include a buffer layer BFL, a first inorganic layer 10, a second inorganic layer 20, and an organic layer 30. The inorganic material and the organic material in the circuit device layer DS-CL are not limited to specific materials, and in some embodiments, the buffer layer BFL may be selectively disposed or may be omitted.

[0090] The first transistor T1 and the second transistor T2 may be disposed on the buffer layer BFL. In some embodiments, at least one of the first transistor T1 and the second transistor T2 may be disposed to have a bottom gate structure.

[0091] The pixel defining layer PDL and the organic light emitting diode OLED may be disposed on the organic layer 30. The pixel defining layer PDL may be formed of or include an organic material. The first electrode AE ​​may be disposed on the organic layer 30. The first electrode AE ​​may be connected to the output electrode of the second transistor T2 through a penetration hole penetrating the organic layer 30. An opening OP may be defined in the pixel defining layer PDL. The opening OP of the pixel defining layer PDL may be configured to expose at least a portion of the first electrode AE. In some embodiments, the pixel defining layer PDL may be omitted. The hole control layer HCL, the light emitting layer EML, the electron control layer ECL, and the second electrode CE may be sequentially disposed on the first electrode AE.

[0092] Figure 3A is a plan view illustrating a work panel WP according to some embodiments of the inventive concept. Figure 3B is an enlarged plan view illustrating an area AA of a working panel WP according to some embodiments of the inventive concept. Figure 3C is an enlarged cross-sectional view showing a unit area US of a working panel WP according to some embodiments of the inventive concept, specifically, Figure 3C is a diagram showing some embodiments according to the inventive concept Figure 3B A cross-sectional view of the unit area US of the working panel WP taken along line III-III'. Figure 4 is a flowchart illustrating a method of manufacturing a display panel DP according to some embodiments of the inventive concept.

[0093] like FIG. 3A to FIG. 3CAs shown in , the working panel WP may include: a working display substrate WS1; a working encapsulation substrate WS2, which is arranged to face the working display substrate WS1; and a working sealing element SM-W, which is arranged to join or bond the working display substrate WS1 to the working encapsulation substrate WS2. The working display substrate WS1 and the working encapsulation substrate WS2 may be manufactured by separate processes and then may be joined to each other to form the working panel WP. The working sealing element SM-W may be formed in the unit areas US of the working display substrate WS1 and the working encapsulation substrate WS2, respectively, and may be used as an adhesive member for joining the working display substrate WS1 to the working encapsulation substrate WS2.

[0094] For each unit region US, the working display substrate WS1 may be constructed to have a reference FIG. 2A to FIG. 2C The layer structure described. Figure 3C As shown in , the circuit device layer WS1-CL and the display device layer WS1-OLED may be disposed in each unit region US on the base substrate WS1-G.

[0095] like Figure 3C As shown in , the working package substrate WS2 may include a base substrate WS2-G and a light blocking pattern LSP, and the light blocking pattern LSP is disposed on the top surface or outer surface of the base substrate WS2-G. The base substrate WS2-G may be a glass substrate. The light blocking pattern LSP may be disposed in each unit region US.

[0096] like Figure 3B and Figure 3C As shown in , when viewed in a plan view, the light blocking pattern LSP may be disposed on three side surfaces of the unit area US. The light blocking pattern LSP may partially overlap the working sealing member SM-W. When viewed in a plan view, the three light blocking patterns LSP may be disposed to face the left side surface, the right side surface, and the upper side surface of the unit area US.

[0097] The light blocking pattern LSP may be formed of or may include a metal material. Although not shown, a metal pattern may also be provided on the top surface of the base substrate WS2-G and in an area surrounded by the light blocking pattern LSP. The metal pattern may be provided directly on the top surface of the base substrate WS2-G, or may be formed on an insulating layer provided on the top surface of the base substrate WS2-G. The metal pattern may constitute a signal line of a touch sensing unit. A sensor electrode SP constituting a touch sensing unit may also be provided on the top surface of the base substrate WS2-G. The sensor electrode SP may be formed of or may include at least one of a transparent metal oxide material (e.g., indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO)).

[0098] The working sealing element SM-W can be light-cured. Figure 3C As shown in , the area of ​​the working sealing element SM-W exposed by the light blocking pattern LSP can be directly exposed by light (e.g., a laser beam). Since the laser beam is reflected by the light blocking pattern LSP, the area of ​​the working sealing element SM-W overlapping the light blocking pattern LSP may be insufficiently cured or hardly cured. For example, the light blocking pattern LSP can be used as a mask in a photocuring process.

[0099] like Figure 4 As shown in FIG. 3A to FIG. 3C The working panel WP described above manufactures the display panel DP according to the present embodiment. For example, the working panel WP may be divided into pre-display panels corresponding to the unit regions US (in S10), and each pre-display panel may be formed to have a square shape or a rectangular shape when viewed in a plan view. Thereafter, a pre-bending region may be formed in each pre-display panel (in S20). Next, a polishing process may be performed on the pre-bending region (in S30). As a result of the polishing process, a pre-bending region having a rectangular shape may be formed. Figure 1A and Figure 1B The display panel DP is disposed in a curved area (eg, the first area EC).

[0100] Figure 5A is a plan view illustrating a first cutting step according to some embodiments of the inventive concept. Figure 5B and Figure 5C are enlarged cross-sectional views each showing a first cutting region of the working panel WP, specifically, Figure 5B is shown along Figure 5A An enlarged cross-sectional view of the first cutting area of ​​the working panel WP taken along line IV-IV', Figure 5CIt is shown Figure 5B An enlarged cross-sectional view of area BB in the first cutting area. Figure 5D is an enlarged cross-sectional view showing a second cutting area of ​​the working panel WP, specifically, Figure 5D is shown along Figure 5A An enlarged cross-sectional view of a second cutting area of ​​the working panel WP taken along line V-V'. Figure 5E is a plan view showing a second cutting step according to some embodiments of the inventive concept. FIG. 5A to FIG. 5E Described in more detail in Figure 4 The steps of cutting the pre-display panel are shown in FIG.

[0101] In reference FIG. 3A to FIG. 3C After the exposure process of the working panel WP described above is performed, the working panel WP may be divided into a plurality of unit bars CST (for example, see Figure 5E ). The working panel WP in which the unit regions US are arranged in a matrix shape may be cut in a row direction or a column direction to form a plurality of unit bars CST, each of which includes a plurality of unit regions US arranged in a row direction or a column direction. Figure 5E As shown in FIG. 8 , each cell stick CST may be formed to include a single row of unit regions US, but the inventive concept is not limited thereto.

[0102] Hereinafter, the steps of forming the unit rod CST will be described in more detail. FIG. 5A to FIG. 5C As shown in FIG. 1 , a scribing line SL may be formed in each of the base substrates WS1 -G and WS2 -G along a first cutting line CL1 using a cutting wheel CH. The scribing line SL may be formed by partially removing each of the base substrates WS1 -G and WS2 -G.

[0103] The first cutting line CL1 may be formed between the display device layer WS1-OLED and the reference line CL-0, where the reference line CL-0 may be defined along a boundary between an exposed area and an unexposed area of ​​the working sealing element SM-W or along an inner edge of the light blocking pattern LSP. The scribe line SL may be formed to have a depth when measured along the third direction DR3: in an area not overlapping the working sealing element SM-W (e.g., a concave area SM-CC, reference line CL-0). Fig. 6A ) is larger at other regions overlapping with the working seal element SM-W. The regions of the scribe line SL not overlapping with the working seal element SM-W may be formed to completely penetrate the base substrates WS1-G and WS2-G in the third direction DR3.

[0104] like Figure 5C As shown in , since the working seal member SM-W is partially exposed by light, the internal stress of the base substrates WS1-G and WS2-G varies. Figure 5CIn FIG. 1 , the thin dotted line depicts the internal stress and the thick dotted line depicts the cleavage line of the working panel WP. For example, if the scribe line SL is formed in the working panel WP, each unit bar CST can be cut along the cleavage line depicted by the thick dotted line due to the internal stress generated in the base substrates WS1-G and WS2-G.

[0105] As reference Figure 3C As described, if only the inner area of ​​the working sealing element SM-W is exposed to light, stress from the exposed area will be applied to the base substrates WS1-G and WS2-G after the working sealing element SM-W is cured. On the contrary, the unexposed area of ​​the working sealing element SM-W can only contact the base substrates WS1-G and WS2-G without applying stress to the base substrates WS1-G and WS2-G. This is because, during the curing process after the exposure process, the volume of the exposed area shrinks to apply stress to the base substrates WS1-G and WS2-G, but this phenomenon does not occur at the unexposed area. If an external force is applied to the working panel WP on which a scribing or cutting process has been performed, the working panel WP can be spontaneously cut along the cleavage line depicted by the thick dotted line.

[0106] like Figure 5D As shown in FIG. 1 , the working display substrate WS1 and the working package substrate WS2 can be cut along the second cutting line CL2 using a cutting wheel CH. Figure 5E As shown in , a unit rod CST can be formed.

[0107] A cutting wheel CH may be used to form a scribing line SL in the base substrates WS1-G and WS2-G along the third cutting line CL3, and as a result, each cell bar CST may be divided into a plurality of pre-display panels. Figure 5B and Figure 5C The unit rod CST is cut into pre-display panels respectively corresponding to the unit areas US in the same manner as described.

[0108] Fig. 6A is a plan view illustrating a pre-display panel DP-P according to some embodiments of the inventive concept. Figure 6B is a cross-sectional view showing a pre-display panel DP-P according to some embodiments of the inventive concept, specifically, Figure 6B is a diagram showing some embodiments according to the inventive concept Fig. 6A 4 is a cross-sectional view of the pre-display panel DP-P taken along line VI-VI'. Fig. 7A is a plan view illustrating steps of forming a pre-bent area according to some embodiments of the inventive concept. Figure 7B is a plan view showing a pre-display panel having a pre-bent area according to some embodiments of the inventive concept. 6A to 7B Describe in more detail Figure 4The step of forming a pre-bent area.

[0109] like Fig. 6A and Figure 6B As shown in , when viewed in a plan view, the pre-display panel DP-P may have a square shape or a rectangular shape. The pre-display panel DP-P may include a pre-display substrate DS-P, a pre-encapsulation substrate ES-P, and a pre-sealing element SM-P configured to join or bond the pre-display substrate DS-P to the pre-encapsulation substrate ES-P.

[0110] and Figure 1A and Figure 1B Compared with the display substrate DS shown in FIG. 1 , the pre-display substrate DS-P may be configured to have substantially the same stacking structure but a different planar shape. The pre-encapsulation substrate ES-P may be configured to have a substantially same stacking structure as the display substrate DS shown in FIG. Figure 1A and Figure 1B The planar shape of the encapsulation substrate ES shown in FIG. 1 is different from the planar shape of the encapsulation substrate ES shown in FIG.

[0111] When viewed in a plan view, the pre-sealing element SM-P may include at least one straight region and at least one curved region. The pre-sealing element SM-P may include a region defined as a concave region SM-CC. The pre-sealing element SM-P may include regions corresponding to Figure 1B The pre-sealing element SM-P may further include: a first straight line area SM-PS1 corresponding to Figure 1B A second area E-S1; and a second straight line area SM-PS2, corresponding to Figure 1B The third area E-S2.

[0112] Different from Figure 1B At the edge DP-E of the display panel DP, the pre-sealing element SM-P may be disposed in contact with the pad area DP-PD (eg, see Figure 1A ) has a curved shape at the adjacent corner area. However, the inventive concept is not limited thereto. In some embodiments, the pre-sealing element SM-P is Figure 1A A corner region adjacent to the pad region DP-PD may have a linear shape (or a straight line shape).

[0113] The pre-display panel DP-P may include a Figures 1A to 1D The second area E-S1 of the display panel DP and the first straight line area SM-PS1 of the pre-display panel DP-P corresponding to the second area E-S1 of the display panel DP may have a shape substantially the same as the shape of the area of ​​the display panel DP shown in FIG. Figure 6B The side or cross-sectional structure shown in FIG. Figure 5B and Figure 5CAs described, since the base substrates WS1-G and WS2-G are cut using the internal stress difference, the second area E-S1 of the display panel DP and the first straight area SM-PS1 of the pre-display panel DP-P may have curved side surfaces. When viewed in a cross-sectional view, the side surface DP-SS2 of the first straight area SM-PS1 may include a central area DP-C that is curved to form an outwardly convex shape (or an outwardly convex line).

[0114] The straight line area E-S1 of the edge DP-E of the display panel DP may be formed in the step of dividing the working panel WP into the pre-display panels DP-P corresponding to the unit areas US. In some embodiments, it may not be necessary to perform a polishing process on the first straight line area SM-PS1 of the edge of the pre-display panel DP-P, and thus, it may be possible to reduce the processing time for the polishing process to be described below. In addition, this may be able to reduce the total processing time spent on manufacturing the display panel.

[0115] When viewed in a cross-sectional view, the side surface DP-SS2 of the first straight area SM-PS1 may further include an upper area DP-U located above the center area DP-C and a lower area DP-L located below the center area DP-C. When viewed in a cross-sectional view, at least a portion of each of the upper area DP-U and the lower area DP-L may have a linear line (or a straight line or a linear shape or a flat profile). Figure 6B As shown in , when viewed in a cross-sectional view, each of the upper area DP-U and the lower area DP-L may have only linear lines. Figure 5B and Figure 5C The side surfaces of the upper region DP-U and the lower region DP-L are formed by the scribe line SL shown in FIG.

[0116] Reference Figure 6B The central area DP-C may include the second inner area DS-I as part of the display substrate DS, the pre-sealing member SM-P, and the second inner area ES-I as part of the encapsulation substrate ES. The lower area DP-L may correspond to the second outer area DS-O of the display substrate DS, and the upper area DP-U may correspond to the second outer area ES-O of the encapsulation substrate ES.

[0117] After cutting the pre-display panel DP-P, Fig. 6A The fourth cutting line CL4 partially cuts the pre-package substrate ES-P. The partial cutting can be performed using a cutting wheel CH. Figure 1A As shown in FIG. 1 , the encapsulation substrate ES may be formed so that a portion of the pre-display substrate DS-P on which the driving device DI is to be disposed is exposed. In addition, the encapsulation substrate ES may be formed so that the signal pad DS-PD (eg, see Figure 2B ) is exposed. The process of cutting the pre-packaged substrate ES-P along the fourth cutting line CL4 may not be limited in terms of process sequence. For example, the process of cutting the pre-packaged substrate ES-P along the fourth cutting line CL4 may be performed after a subsequent process of forming or polishing the pre-bent region.

[0118] like Fig. 7A As shown in FIG. 1 , the pre-bending area of ​​the pre-display panel DP-P may be formed at a position corresponding to the bending area SM-PC of the pre-sealing element SM-P. The pre-display substrate DS-P and the pre-encapsulation substrate ES-P may be partially cut using a laser source LS. The laser source LS may be a CO 2 Or UV laser source.

[0119] In some embodiments, a plurality of holes (hereinafter referred to as hole lines) may be formed in the pre-display substrate DS-P and the pre-package substrate ES-P along the curved cutting line CL-P using a laser source LS. If an external force is applied, the pre-display substrate DS-P and the pre-package substrate ES-P may be partially cut along the curved hole lines. The pre-display substrate DS-P and the pre-package substrate ES-P cut along the hole lines may be formed to have uneven side surfaces.

[0120] The pre-display panel DP-P may be formed to include a pre-concave region DP-CCP corresponding to the concave region SM-CC of the pre-sealing member SM-P (see Figure 7B ). In some embodiments, the cutting line CL-P can be set in such a way that the cutting line CL-P is continuously extended from the curved area SM-PC of the pre-sealing element SM-P to intersect with the second straight area SM-PS2 of the pre-sealing element SM-P, and then, the pre-display substrate DS-P and the pre-packaging substrate ES-P can be cut along the cutting line CL-P using the laser source LS.

[0121] like Figure 7B As shown in FIG. 1 , the pre-bending area E-CP of the pre-display panel DP-P may be formed to be aligned with the bending area EC of the display panel DP (eg, see FIG. 1 ). Figure 1B ). In addition, the pre-concave area DP-CCP of the pre-display panel DP-P may be formed to correspond to the concave area DP-CC of the display panel DP (eg, see Figure 1B ). The pre-concave area DP-CCP may be defined by the pre-bent area E-CP and the pre-straight area E-S2P. In some embodiments, the pre-concave area DP-CCP of the pre-display panel DP-P may be omitted according to the shape of the display panel DP.

[0122] Fig. 8A is a plan view illustrating a step of polishing the pre-bent region E-CP according to some embodiments of the inventive concept. FIG. 8B to FIG. 8Dis a cross-sectional view showing a step of polishing a pre-bent region E-CP according to some embodiments of the inventive concept, specifically, Figure 8B is a diagram showing some embodiments according to the inventive concept Fig. 8A A cross-sectional view of the step of polishing the pre-bent region E-CP taken along line VII-VII'. Fig. 8E is a cross-sectional view showing a curved area of ​​a display panel DP according to some embodiments of the inventive concept. FIG. 8A to FIG. 8E Describe in more detail Figure 4 The steps of polishing the pre-bent area E-CP are shown in FIG.

[0123] The pre-bend area E-CP can be polished using a PM grinder. FIG. 8B to FIG. 8D As shown in , the grinder PM may be rotated to polish the side surfaces of the pre-display substrate DS-P and the pre-package substrate ES-P. The polishing surface of the grinder PM may be covered with diamond.

[0124] The grinder PM may include a center PC, an upper PU, and a lower PL. The center PC may be shaped like a cylinder, and each of the upper PU and the lower PL may be shaped like a truncated cone. Each of the upper PU and the lower PL may have a diameter that increases as the distance from the center PC increases.

[0125] The shape of the side surface of the first region EC of the display panel DP may vary according to the polishing amount. Figure 8C As shown in, in the pre-bending area E-CP, the side surfaces of the pre-display substrate DS-P and the pre-encapsulation substrate ES-P may be partially polished. Polishing may be performed to control the surface roughness value of the side surfaces of the pre-display substrate DS-P and the pre-encapsulation substrate ES-P cut along the curved hole line. In this case, the side surface of the pre-sealing element SM-P may not be aligned with the side surfaces of the pre-display substrate DS-P and the pre-encapsulation substrate ES-P.

[0126] like Fig.8D As shown in FIG. 1 , in the pre-bending region E-CP, the pre-display substrate DS-P and the pre-encapsulation substrate ES-P may be polished so that the pre-display substrate DS-P and the pre-encapsulation substrate ES-P have edges that are substantially aligned with the edges of the pre-sealing element SM-P. In this case, the side surface of the pre-sealing element SM-P may be aligned with the side surfaces of the pre-display substrate DS-P and the pre-encapsulation substrate ES-P. The pre-sealing element SM-P that has undergone this process may be referred to as Fig. 8E The sealing element SM is shown in FIG.

[0127] In order to form the concave region DP-CC from the pre-concave region DP-CCP (see, for example, Figure 1B), both the pre-bending region E-CP and the pre-straight region E-S2P may be polished by the same process. Therefore, the pre-bending region E-CP and the pre-straight region E-S2P may have cross-sectional shapes corresponding to each other.

[0128] As a reference FIG. 8B to FIG. 8D As a result of the polishing process described above, the side surface of the display panel DP may have a Fig. 8E The shape of the side surface DP-SS1 shown in FIG. 5 is substantially the same shape. When viewed in a cross-sectional view, the side surface DP-SS1 of each of the first region EC and the third region E-S2 may include a central region DP-C having a straight line shape (or a straight line).

[0129] When viewed in a cross-sectional view, the side surface DP-SS1 of the first region EC may further include an upper region DP-U located on the central region DP-C and a lower region DP-L located below the central region DP-C. When viewed in a cross-sectional view, the upper region DP-U and the lower region DP-L may be inclined at a certain angle relative to the top surface of the encapsulation substrate ES. That is, when viewed in a cross-sectional view, the upper region DP-U and the lower region DP-L may include an inclined shape (or an inclined line).

[0130] The central area DP-C may include the first inner area DS-I of the display substrate DS, the sealing member SM, and the first inner area ES-I of the encapsulation substrate ES. The lower area DP-L of the display panel DP may correspond to the first outer area DS-O of the display substrate DS, and the upper area DP-U of the display panel DP may correspond to the first outer area ES-O of the encapsulation substrate ES.

[0131] In the method for manufacturing the display panel DP according to the present embodiment, during the formation of the pre-bent area E-CP, the areas corresponding to the corner area and the concave area of ​​the pre-display substrate DS-P and the pre-encapsulation substrate ES-P may be removed in advance, which may make it possible to reduce or minimize the amount of polishing in the polishing process. In this case, the use of an expensive grinder may be reduced, thereby reducing the production cost required for manufacturing the display panel DP.

[0132] Fig. 9A is a cross-sectional view illustrating an edge grinding step according to some embodiments of the inventive concept. Fig. 9B is a cross-sectional view showing the display panel DP having a polished edge.

[0133] In reference FIG. 5A to FIG. 5EIn the step of cutting the pre-display panel DP-P described above, the second area E-S1 of the display panel DP may not be polished, and the base substrate may have a sharp corner. Therefore, the corner of the second area E-S1 of the display panel DP may be polished using an edge grinder PM-E. This process may be performed using a chamfering method.

[0134] When viewed in a cross-sectional view, the side surface DP-SS2 of the second area E-S1 may include an upper area DP-U located above the center area DP-C and a lower area DP-L located below the center area DP-C. When viewed in a cross-sectional view, at least a portion of each of the upper area DP-U and the lower area DP-L may have a linear line (or a straight line or a linear shape or a flat profile). Fig. 9B As shown in , when viewed in a cross-sectional view, each of the upper area DP-U and the lower area DP-L may further include a portion inclined at a certain angle relative to the top surface of the encapsulation substrate ES. The inclined area may be located outside the straight area. For example, when viewed in a cross-sectional view, in each of the upper area DP-U and the lower area DP-L, the straight area may be located between the inclined area and the curved area. That is, when viewed in a cross-sectional view, each of the upper area DP-U and the lower area DP-L may include a linear line located between a curve and an oblique line.

[0135] Fig. 10A and Fig. 10B is a cross-sectional image showing a display panel DP according to some embodiments of the inventive concept. FIG. 10C to FIG. 10E is an image showing a side surface of the display panel DP according to some embodiments of the inventive concept.

[0136] Fig. 10A is with Fig. 9B The image corresponding to the structure is Fig. 10B is with Fig. 8E The image corresponding to the structure. Fig. 10C is with Figure 1B The image corresponds to the side surface of the second region E-S1 and shows Fig. 10A The side surface of the structure shown in FIG. Fig. 10D is with Figure 1B The image corresponds to the side surface of the first region EC and shows Fig. 10B The side surface of the structure shown in FIG. Fig. 10E is with Figure 1B The image corresponds to the side surface of the right corner area of ​​the structure and corresponds to the boundary area between the first area EC and the second area E-S1.

[0137] The side surface of the first region EC may have a first roughness, and the side surface of the second region E-S1 may have a second roughness smoother than the first roughness. This difference may be because, as a result of the polishing process, the side surface of the first region EC has a rough surface, while the second region E-S1 is cut by a crack phenomenon caused by a stress difference without passing through the polishing process. For example, the side surface of the first region EC may have a surface roughness Ra in the range of 1.6μm to 6.3μm, and the side surface of the second region E-S1 may have a surface roughness Ra in the range of 0.025μm to 0.1μm. Although not shown, the side surface of the third region E-S2 may have a roughness substantially the same as that of the side surface of the first region EC.

[0138] The roughness value is measured based on ISO 1302: 1992. The conversion between the roughness value Ra and the roughness grade can be given in Table 1 below.

[0139] [Table 1]

[0140] FIG. 11A to FIG. 11C is a plan view illustrating a display panel DP according to some embodiments of the inventive concept. Fig.12 yes Figure 6B For the sake of simplicity, the previously referenced Figures 1A to 10E Described elements may be identified by the same reference numerals without repeating their repeated descriptions.

[0141] and Figures 1A to 1D Compared with the display panel DP, FIG. 11A to FIG. 11C The display panel DP may be configured to have a partially different planar shape. Fig.11A The display panel DP may be configured to have a concave region DP-CC defined only by the curved region EC. In addition, the concave region DP-CC may be configured in an off-center manner (eg, at a right portion of the display panel DP). Fig. 11B As shown in FIG. 1 , the concave region DP-CC may be omitted from the display panel DP. Fig. 11B In the process of the display panel DP shown in FIG. 1 , the step of forming the concave region DP-CC may be omitted. Fig. 11C As shown in , the display panel DP may include a pair of concave areas DP-CC. The pair of concave areas DP-CC may be symmetrically disposed at two opposite portions (eg, a left portion and a right portion) of the display panel DP.

[0142] like Fig.12As shown in FIG. 1 , the sealing member SM may be adhered to the circuit device layer DS-CL. The sealing member SM may be adhered to the second inorganic layer 20. In addition, the sealing member SM may be adhered to the conductive pattern MP, which is connected to the first transistor T1 and the second transistor T2 (eg, see FIG. 1 ). Figure 2C ) and the conductive pattern MP may be disposed on the same layer as the electrodes of the first transistor T1 and the second transistor T2. In addition, the sealing member SM may be directly adhered to the bottom surface of the base substrate ES-G (eg, a glass substrate) of the encapsulation substrate ES.

[0143] According to some embodiments of the inventive concept, a majority of the straight line area of ​​the edge of the display panel can be formed in the step of dividing the working panel into pre-display panels corresponding to the unit areas. Since the edge of the pre-display panel constitutes the edge of the display panel, the processing time required for polishing the edge of the display panel can be reduced. Therefore, the total time spent on manufacturing the display panel can be reduced.

[0144] In addition, in the process of manufacturing the display panel, the use of a grinder containing expensive materials (e.g., diamond) can be reduced. This is because most of the straight area of ​​the edge of the pre-display panel constitutes the straight area of ​​the edge of the display panel, and because in order to reduce the amount of polishing in the process of forming the pre-bent area, the corner area of ​​the pre-display substrate and the pre-package substrate is removed in advance before using the grinder.

[0145] In the display panel manufactured by the manufacturing method, the edge of the sealing member is aligned with the edges of the display substrate and the encapsulation substrate in most areas, and thus, the bezel area can be formed to have an elongated shape.

[0146] While example embodiments of the inventive concepts have been particularly shown and described, it will be understood by those skilled in the art that changes in form and details may be made therein without departing from the spirit and scope of the claims.

Claims

1. A display panel, comprising: a first region, the first region comprising a curved edge when viewed in plan; as well as a second region, when viewed in plan, comprising a straight edge and adjacent to the first region, wherein, when viewed in cross-section, the side surface of the first region includes a central region having a straight line, and When viewed in a cross-sectional view, the side surface of the second region includes a central region having a curved line.

2. The display panel according to claim 1, further comprising a third region, wherein when viewed in a plan view, the third region comprises a straight edge and is adjacent to the first region, in, When viewed in a cross-sectional view, the side surface of the third region includes a central region corresponding to the central region of the side surface of the first region.

3. The display panel according to claim 2, wherein: When viewed in a plan view, the first area and the third area define a concave area of ​​the display panel.

4. The display panel according to claim 1, wherein: When viewed in a cross-sectional view, the side surface of the first region further includes an upper region disposed on the central region of the first region and a lower region disposed below the central region of the first region, and When viewed in cross-section, the upper region includes oblique lines.

5. The display panel according to claim 1, wherein: When viewed in a cross-sectional view, the side surface of the second region further includes an upper region disposed on the central region of the second region and a lower region disposed below the central region of the second region, and When viewed in cross-section, the upper region includes at least a straight line.

6. The display panel according to claim 5, wherein: When viewed in cross-section, the upper region of the side surface of the second region includes at least a slash line, and The straight line of the upper region is disposed between the oblique line of the upper region and the curved line of the central region of the second region.

7. A display panel, comprising: a first region having a curved edge when viewed in plan; as well as a second region, which has straight edges when viewed in plan and is continuous with the first region, wherein the side surface of the first region has a first roughness, and The side surface of the second region has a second roughness smoother than the first roughness.

8. The display panel according to claim 7, wherein: When viewed in cross-section, the side surface of the first region includes a central region having a straight line, and When viewed in a cross-sectional view, the side surface of the second region includes a central region having a curved line.

9. A display panel, comprising: a display substrate including a first edge having a first lower region and a second lower region, the first lower region having a curved line and the second lower region having a straight line when viewed in a plan view; a packaging substrate facing the display substrate and including a second edge having a first upper region and a second upper region, the first upper region having a curved line corresponding to the curved line of the first lower region, and the second upper region having a straight line corresponding to the straight line of the second lower region; as well as a sealing element, bonding the display substrate to the encapsulation substrate, wherein, when viewed in a cross-sectional view, a side surface of each of the first lower region and the first upper region includes an inner region having a straight line, When viewed in a cross-sectional view, a side surface of each of the second lower region and the second upper region includes an inner region having a curved line.

10. The display panel according to claim 9, wherein: The side surface of the first lower region and the side surface of the first upper region are aligned with side surfaces of the sealing element when viewed in a cross-sectional view.

11. The display panel according to claim 9, wherein: The inner region of each of the first lower region and the first upper region has a first roughness, and The inner region of each of the second lower region and the second upper region has a second roughness that is smoother than the first roughness.

12. The display panel according to claim 9, wherein: The encapsulation substrate includes a glass substrate having a top surface and a bottom surface, and The sealing element is directly bonded to the bottom surface of the package substrate. 13 . The display panel of claim 12 , further comprising a sensor electrode disposed on the top surface of the package substrate.

14. The display panel according to claim 9, wherein: The display substrate comprises: Glass substrate; a circuit device layer, located on the glass substrate, the circuit device layer comprising a conductive pattern and a transistor; and The display device layer is located on the circuit device layer, and the display device layer includes an organic light emitting diode.

15. The display panel according to claim 14, wherein: The sealing element is directly bonded to the conductive pattern of the circuit device layer, and The conductive pattern and the electrode of the transistor are disposed on the same layer.

16. The display panel according to claim 9, wherein: When viewed in a plan view, the display substrate further includes a pad region exposed by the encapsulation substrate.

Images