Micro-control environment carrier with base

Abstract

A component carrier (200) for carrying one or more components (20) to be treated in a component treatment apparatus, such as a press sintering apparatus, and a method thereof are provided, and the component carrier includes a component support (210). The component support (210) comprises: one or more positioning openings (213) formed through the component support from a top surface (210a) of the component support (210) to a bottom surface (210b) of the component support, where each positioning opening (213) defines a component position for holding a component to be processed, and the component held at the component position is exposed at a top surface (210a) of the component support; and one or more movable bases (212) respectively associated with the one or more positioning openings (213) wherein each movable base (212) is received within the associated positioning opening (213) to move in a direction A between the top and bottom surfaces of the component support (210), the movable base (212) has a top end (212a) and a bottom end (212b) that is exposed at a bottom surface (210b) of the component support so that the top end (212a) of the movable base is in contact and out of contact with a component held at a component position defined by the positioning opening, and wherein the bottom end (212b) of each base is exposed at a bottom surface (210b) of the component support so as to be in contact with a heat source for heating the base (212) and the corresponding component when in contact with the base (212).

Description

Technical Field

[0001] The invention relates to a component carrier for carrying a component. The invention also relates to a kit comprising a component carrier, a gas-tight sealing foil and a lower holder plate. The invention also relates to a processing device comprising the component carrier. The invention also relates to a processing method for processing a component. Background Art

[0002] The sintering process is used to produce components by creating a good bond between a device, such as a semiconductor device such as a power IC, and its substrate or carrier. Initially, the device to be sintered is positioned on its substrate or carrier together with the sintering material, which is located between the two. Subsequently, pressure is applied to the relevant component and the sintering material using, for example, an actuator that applies pressure, while the device, the sintering material and the substrate or carrier are heated at around 250°C-300°C. The sintering process allows the creation of a component that is characterized by a particularly strong bond between the device and the substrate or carrier.

[0003] The devices to be processed may involve chips, DBCs, spacers, heat sinks, sensors, power ICs, flip chips, MEMs, etc. Typically, the parts of the product to be sintered are made of highly conductive materials, such as silver or copper, which are not coated with a protective coating. Such metal parts, exposed to the high temperatures of the sintering process, oxidize rapidly when they are surrounded by an atmosphere containing oxygen. The oxides formed on the metal parts deteriorate the quality of the parts, that is, by reducing their conductivity. In addition, at the high temperatures of the sintering process, contaminants are released from the sintered material, which may contaminate the parts themselves. To avoid these problems, the parts are usually sintered in a closed chamber, where an atmosphere mainly containing an inert gas (such as nitrogen) is created. To create this inert atmosphere, inert gas is injected into the chamber to flush away contaminants and oxygen.

[0004] The sintering process usually consists of three stages: a preheating stage, during which the part is preheated; a processing stage, during which the part is heated at the sintering temperature while pressure is applied to the part; and a cooling stage, during which the part is cooled (allowed to cool) to room temperature. These three stages can be performed in the same processing chamber or in separate processing chambers. In both cases, the atmosphere has to be changed at each stage by injecting an inert gas into the chamber, which results in the previously existing atmosphere being evacuated. Since the processing chamber usually has a considerable volume, changing the atmosphere three times results in a rather time-consuming process, which may last longer than the sintering process itself.

[0005] The sintering process was mentioned above. However, there are many more processes that require the component to be heated to high temperatures when processing it. In such methods, the formation of oxides on the component to be processed may lead to disadvantages and quality problems in the component itself, so the limitations, disadvantages and disadvantages mentioned above for the sintering method also apply to such other processing methods. Summary of the invention

[0006] It is an object of the present invention to reduce the cycle time for processing components.

[0007] Another or alternative object of the present invention is to reduce the contamination level of treated components.

[0008] Another or alternative object of the present invention is to prevent undesired chemical reactions, in particular oxidation, from occurring during the processing of a component due to the presence of oxygen or contaminants in the atmosphere surrounding the component.

[0009] Another or alternative object of the present invention is to reduce the amount of inert gas used to create an inert atmosphere during processing in a processing device.

[0010] In one aspect, the invention provides a component carrier for carrying one or more components to be processed in a component processing apparatus, such as a press-sintering apparatus, the component carrier comprising a component support. The component support comprises: one or more positioning openings formed from the top surface of the component support through the component support to the bottom surface of the component support, wherein each positioning opening defines a component position for holding the component to be processed, and the component held at the component position is exposed at the top surface of the component support; and one or more movable bases respectively associated with the one or more positioning openings, wherein each movable base is received in the associated positioning opening to move along direction A between the top surface and the bottom surface of the component support so that the top end of the movable base contacts and discontinuities with the component held at the component position defined by the positioning opening, so as to carry the corresponding component and make thermal contact with the corresponding component during processing of the component in operation, and wherein the bottom end of each base is exposed at the bottom surface of the component support, so as to make thermal contact with a heat source in operation, the heat source being used to heat the base and the corresponding component when in contact with the base.

[0011] In one embodiment, the component support comprises a receiving recess associated with the positioning opening, the receiving recess being recessed relative to the top surface of the component support, and the one or more positioning openings are arranged in the receiving recess.

[0012] In one embodiment, the top surface of the component support completely surrounds the receiving recess.

[0013] In one embodiment, the component support includes a load-bearing member, which is configured to fit into the receiving recess and includes one or more receiving openings. When the load-bearing member is arranged in the receiving recess, the one or more receiving openings correspond to the positions of the one or more components, wherein each receiving opening is configured to carry one of the one or more components and enable the top end of the corresponding movable base to contact the component.

[0014] In one embodiment, the carrying member includes a carrying component that protrudes toward the interior of each receiving opening and is configured to carry the one or more components.

[0015] In one embodiment, the component carrier includes a down-holder mask, which is configured to be mounted to the top surface of the component support, and the down-holder mask includes one or more mask openings, which are configured to allow access to the component, and the positions of the mask openings correspond to the component positions defined by the positioning openings of the component support.

[0016] In one embodiment, the lower holder mask further comprises positioning pins protruding from a bottom surface of the lower holder mask and configured to fit into positioning holes formed in the top surface of the component support.

[0017] In one embodiment, a gas inlet and a gas outlet are provided in the receiving recess, and wherein the gas inlet and the gas outlet are fluidly connected to a gas inlet connection and a gas outlet connection respectively through one or more gas pipes, wherein the gas inlet connection is configured to be connected to a gas source and the gas outlet connection is configured to be connected to an exhaust device to provide a continuous gas flow to the one or more components.

[0018] In one embodiment, the component carrier is configured to hold an air-impermeable foil, sheet or film which completely covers the carried component or components and creates a closed cavity for the component or components.

[0019] In one embodiment, the air-impermeable foil, sheet or film is sandwiched between the lower holder mask and the top surface of the component support when the lower holder mask is mounted onto the top surface of the component support.

[0020] In another aspect, the present invention provides a component carrier for carrying one or more components to be processed in a component processing device such as a press sintering device, the component carrier optionally being a component carrier as claimed in any one of the preceding claims, wherein the component carrier comprises:

[0021] a component support including one or more positioning openings formed in the component support at a top surface of the component support, wherein each positioning opening defines a component position within the positioning opening to hold a component to be processed, and the component held at the component position within the positioning opening is exposed at the top surface of the component support; and

[0022] Two gas inlet connections are in fluid communication with the locating opening of the component support for delivering gas from a gas source, the gas source being connected to one of the gas inlet connections to the locating opening in use for purging the locating opening, wherein each gas inlet connection is configured to be closed when not connected to the gas source.

[0023] In one embodiment, the component support comprises a gas conduit connected to each positioning opening to provide a fluid connection between the gas inlet connection and the positioning opening.

[0024] In one embodiment, the component support comprises two gas outlet connections which are in fluid communication with the positioning openings of the component support to pass gas from the positioning openings to an exhaust device which, when in use, is connected to one of the gas outlet connections to purge these positioning openings, wherein each gas outlet connection is configured to be closed when not connected to the exhaust device.

[0025] In another aspect, the present invention provides a method for processing a component in a processing device, wherein the method includes: using a component carrier. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Further features and advantages of the present invention will be understood from the description of the present invention by way of non-limiting and non-exclusive embodiments. These embodiments should not be construed as limiting the scope of protection. Those skilled in the art will recognize that other alternatives and equivalent embodiments of the present invention may also be conceived and implemented without departing from the scope of the present invention. Embodiments of the present invention will be described with reference to the accompanying drawings, in which similar or identical reference symbols represent similar, identical or corresponding parts, and in which:

[0027] Figure 1 A component handling device is schematically shown;

[0028] Figure 2A and Figure 2B A schematic perspective view and a cross section, respectively, of a component carrier to be used in a component handling device are shown.

[0029] Figure 3A and Figure 3B A component carrier to be used in a component handling device according to an exemplary embodiment of the present invention is schematically shown in a perspective view and in a cross section, respectively.

[0030] Figure 4A and Figure 4B A component carrier to be used in a component handling device according to an exemplary embodiment of the present invention is schematically shown in a perspective view and in a cross section, respectively.

[0031] Figure 5A and Figure 5B Schematically shows FIG. 3A to FIG. 4B Cross-section of the component carrier depicted in the preheating phase of the process and during the handling phase of the process.

[0032] Fig. 6A and Figure 6B A perspective view of a component carrier to be used in a component handling device according to an embodiment of the present invention is schematically shown.

[0033] Fig. 7A , Figure 7B and Figure 7C Schematically shows the Fig. 6A and Figure 6B Cross sections of a component carrier at different planes. DETAILED DESCRIPTION

[0034] Figure 1 A component handling device 10 according to an embodiment of the present invention is schematically shown. The component handling device 10 (such as a sintering device or a packaging device, respectively for sintering or packaging components) comprises a preheating station 11 for preheating components, a processing station 12 for processing components and a cooling station 13 for cooling components after processing. The processing device 10 further comprises a transport device (i.e. a gripping device connected to a transport conveyor, a robot arm, a crane, a linear XY table or the like) for carrying one or more components 20.1, 20.2 to be processed and for transporting the products 20.1, 20.2 through the different stations 11, 12 and 13 of the processing device. The one or more components 20.1, 20.2 to be processed (such as power supply ICs, which are provided on their carrier or substrate together with sintering material, the sintering material being between the power supply IC and the substrate) are positioned and placed on the component carrier 200. The transport device 14 transports the carrier 200 carrying the one or more components 20 . 1 , 20 . 2 to the stations 11 , 12 and 13 of the processing apparatus 10 in sequence.

[0035] In the first stage, the carrier 200 is transferred to the preheating platform 111 of the preheating station 11, where the one or more components 20.1, 20.2 are preheated. At least a portion of the preheating platform 111 includes a heating component, which is configured to heat to about 300°C and transfer heat to the components 20.1 and 20.2. When the product reaches a predetermined temperature, which is lower than the temperature of the heating component, the component carrier 200 is transferred by the transfer device 14 to the heating platform 121 of the processing station 12, where the one or more components 20.1, 20.2 are heated to their process temperature and processed by applying pressure to them. At least a portion of the heating platform 121 includes a heating component, which is configured to heat to about 300°C and quickly transfer heat to the components 20.1 and 20.2. The pressure is provided by a pressurizing tool 120 included in the processing station 12, which is configured and arranged to apply a force to the components 20.1 and 20.2 held by the carrier 200 by lowering a movable insert member 120.1 and 120.2 associated with each component 20.1 and 20.2, respectively. Optionally, the pressurizing tool 120 does not include a movable insert member 120.1 and 120.2 associated with each component 20.1 and 20.2, but rather includes a single movable insert member having a large surface and configured to be lowered on all components held on the component carrier 200 so as to apply pressure to all components at once. The movable insert member can be any solid member movable in a certain direction, which is configured and arranged to receive a force or pressure at one end thereof and transmit the force or pressure to a component placed at the other end thereof. After processing, the component carrier 200 is transferred by the transfer device 14 to the support platform 131 of the cooling station 13, where the one or more processed components 20.1 and 20.2 are cooled. Finally, the component carrier 200 holding the one or more components 20.1 and 20.2 is transferred by the transfer device 14 to the outside of the processing device 10 for further processing.

[0036] Figure 2A A schematic perspective view of a component carrier 200 to be used in the component handling device 10 is shown. Figure 2B Shows Figure 2A 2 shows a cross section of a component carrier 200 on which components are mounted. Figure 2B The cross section shown is obtained by Figure 2A The component carrier 200 is projected onto plane B in the mounted configuration.

[0037] The component carrier 200 includes a component support 210 having a substantially planar top surface 210a facing in a first direction A1 toward the press tool 120 when the component carrier 200 is in the processing station 12, and a bottom surface 210b facing in a second direction A2 opposite to the first direction A1.

[0038] Positioning openings 213, each defining a component position, are formed in the top surface 210a of the component support 210 so as to communicate the top surface 210a and the bottom surface 210b of the component support 210. The component carrier 200 is configured to carry a component corresponding to each component position.

[0039] When carried on the component carrier, each component is exposed to the top surface 210a of the component support 210, thereby allowing an insert member of the press tool 120 to contact the component and apply force to the component while the component carrier 200 is in the processing station 12 (ie, during processing of the component 20).

[0040] The component carrier 200 further includes a movable base 212 slidably mounted in the positioning opening 213. The movable base 212 is configured to move along a line A perpendicular to the top surface 210a.

[0041] The movable base 212 is made of a heat conductive material and is configured to contact or move away from the component 20 at different stages of component processing. In addition, the bottom end 212b of each movable base 212 facing the second direction A2 is configured to contact a heat source installed in one or more stations of the processing device 10, that is, the bottom end 212b of each movable base 212 is configured to contact the preheating platform 111 of the preheating station 11 or the heating platform 121 of the processing station 12.

[0042] When the movable base 212 is in contact with the heat source and in contact with the component, such as when the component carrier 200 is in the processing station 12, heat is transferred to the component 20 by contact. In contrast, when the movable base 212 is in contact with the heat source but not in contact with the component, such as when the component carrier 200 is in the preheating station 11, heat is transferred to the component 20 by radiation or convection.

[0043] The movable base 212 is further configured to carry the component 20 at its top end 212a when the component 20 is not in contact with the component support 210, ie, during processing in the processing station 12 of the processing device 10. The function of the movable base during the entire processing of the component will be described in detail later.

[0044] Figure 3A A schematic perspective view of a component carrier 200 to be used in a component handling device 10 according to various examples of the present invention is shown. Figure 3B Shows Figure 3A The cross section of the component carrier 200 is obtained by Figure 3A The component carrier 200 is projected onto plane B in the mounted configuration.

[0045] The component carrier 200 includes Figure 2A and Figure 2B The component support 210 of the component carrier 200 is similar to the component support 210 . Figure 2A and Figure 2B The component support 210 of the present embodiment further includes a receiving recess 211 formed in the top surface 210a of the component support 210. Optionally, as Figure 3A and Figure 3B As shown, the top surface 210 a completely surrounds the receiving recess 211 .

[0046] and Figure 2A and Figure 2B Similar to the component carrier 200 of FIG. 1 , the movable base 212 is slidably mounted in a positioning opening 213 formed in the bottom surface 211a of the receiving recess 211. For a detailed description of the component carrier 200 and its function, please refer to Figure 2A and Figure 2B Description of the related component carrier 200.

[0047] In one embodiment, Figure 3A and Figure 3B The component support 210 is configured to receive the carrying component 220 on the bottom surface 211 a of the receiving recess 211 .

[0048] The carrier member 220 is a substantially planar component configured to carry one or more components 20 and configured to fit into the receiving recess 211 of the component support 210. One or more receiving openings 221 are formed in the carrier member 220 corresponding to the component positions defined by the positioning openings 213 of the component support 210.

[0049] When the bearing member 220 is fitted into the receiving recess 211, the position of the receiving opening 221 corresponds to the position of the positioning opening 213 formed in the bottom surface 211a of the receiving recess 211, that is, corresponds to the component position. In this embodiment, the component is carried at the position of the receiving opening 221 of the bearing member 220, that is, each receiving opening 221 of the bearing member 220 defines a component position for carrying one component.

[0050] Optionally, the component 20 is carried on a carrying protrusion 222 that protrudes toward the inside of each receiving opening 221. The positions of the carrying protrusions 222 generally correspond to the four edges of the receiving opening 221. However, those skilled in the art will recognize that the protrusions can be formed at any position within the relevant receiving opening without changing the scope of the present invention.

[0051] The carrying protrusion 222 is configured so that, when the carrying member 220 is fitted into the receiving recess 211 of the component support 210 , the height of the carried component measured along the axis A does not exceed the level of the top surface 210 a of the component support 210 .

[0052] Using the carrying member 220 to carry the component 20 can make the positioning of the component on the component carrier 200 more accurate and stable.

[0053] In another embodiment, Figure 3A and Figure 3B The component carrier 200 further includes a down-holder mask 230 configured to be mounted on the top surface 210a of the component support 210. The down-holder mask 230 includes one or more mask openings 231 configured to enable an insert member of the press tool 120 to contact the component and apply force to the component when the component carrier 200 is in the processing station 12 (i.e., during processing of the component).

[0054] When the lower holder mask is mounted on the top surface 210 a of the component support 210 , the position of the one or more mask openings 231 corresponds to the component position defined by the positioning openings 213 formed in the bottom surface 211 a of the receiving recess 211 .

[0055] The lower holder mask 230 provides a guide for the insert member of the press tool 120 to contact and apply force to the component 20. The presence of the lower holder mask 230 can also prevent the application of force to the component in the event that the component carrier 200 is misaligned with the press tool 120 of the processing station 12. In fact, if the mask opening 231 is not aligned with the insert member of the press tool 120 due to the misalignment of the component carrier 200 when it is provided to the processing station 12 of the processing device 10, the top surface of the lower holder mask 230 acts as a stop component for the movement of the insert member toward the component 20 to be processed.

[0056] In the case where the carrier member 220 is used to carry a component, when the lower holder mask 230 is mounted on the top surface 210a of the component support 210 so as to cover the carrier member 220 fitted in the receiving recess 211, the weight of the lower holder mask 230 prevents the carrier member 220 from moving in the vertical direction A. In order to provide further stability to the carrier member 220, the lower holder mask 230 may be fixed to the component support 210 by screws, bolts or any other suitable fastening members.

[0057] When the component carrier 200 including the component support 210, the carrying member 220 and the lower holder mask 230 is in the mounted configuration, the mask openings 231 of the lower holder mask 230, the receiving openings 221 of the carrying member 220 and the positioning openings 213 of the component support 210 are aligned so that their positions substantially correspond.

[0058] Figure 4A A schematic perspective view of a component carrier 200 to be used in a component handling device 10 according to various examples of the present invention is shown. Figure 4B Shows Figure 4A The cross section of the component carrier 200 is obtained by Figure 4A The component carrier 200 is projected onto plane B in the mounted configuration. Figure 4A and Figure 4B The component carrier 200 is similar to the Figure 3A and Figure 3B The component carrier 200 is similar.

[0059] Apart from Figure 3A and Figure 3B In addition to the features of the component carrier 200, Figure 4A and Figure 4B The component carrier 200 also includes a recess gas inlet 214 formed in a bottom surface 211 a of the receiving recess 211 and configured to allow a gas (typically an inert gas such as nitrogen N 2 ) to be introduced into the receiving recess 211 .

[0060] Furthermore, a recess gas outlet 215 is formed in a bottom surface 211 a of the receiving recess 211 , and is configured to allow gas to be extracted from the receiving recess.

[0061] The recess gas inlet 214 is provided on the first side 200a of the component support 210, and the recess gas outlet 215 is provided on the second side 200b of the component support 210, wherein the first side 200a is opposite to the second side 200b. Optionally, the recess gas inlet and / or the recess gas outlet include a plurality of gas inlet nozzles and / or gas outlet nozzles (not shown) distributed along one side of the bottom surface 211a of the receiving recess 211.

[0062] The component support 210 may further include a carrier gas inlet connection 216 and a carrier gas outlet connection 217 disposed on a top surface 210 a of the component support 210 , the carrier gas inlet connection and the carrier gas outlet connection being configured to be connected to a gas source and an exhaust device of the processing device 10 , respectively.

[0063] A carrier gas inlet connection 216 is provided on the first side 200a of the component support 210, and a carrier gas outlet connection 217 is provided on the second side 200b of the component support 210. Those skilled in the art will appreciate that, without changing the scope of the present invention, in an alternative embodiment, the carrier gas inlet connection 216 and the carrier gas outlet connection 217 may be placed on the bottom surface 210b of the component support, and the carrier gas inlet connection 216 and the carrier gas outlet connection 217 may be located on the second side 200b and the first side 200a of the component support 210, respectively. In addition, as Figure 4A and Figure 4B As shown, the number of carrier gas inlet connections 216 and the number of carrier gas outlet connections 217 are not limited to one.

[0064] One or more gas conduits 218 formed in the component support 210 are configured to provide fluid connections between the carrier gas inlet connection 216 and the recess gas inlet 214 and between the recess gas outlet 215 and the carrier gas outlet connection 217. When gas is introduced into the carrier gas inlet connection 216, it flows within the gas conduit 218 and enters the receiving recess 211 through the recess gas inlet 214, flows through the receiving recess as a gas flow (not shown) to the gas outlet 215. The gas flow then leaves the receiving recess 211 through the recess gas outlet 215 and flows to the carrier gas outlet connection 217 through the gas conduit 222.

[0065] In order to contain the gas within the receiving recess 211, an airtight foil, sheet or film 250 (e.g. Teflon) is provided and attached to the upper surface 210a of the component support 210 so as to completely cover the component 20 carried on the component carrier 200 or ultimately on the carrying member 220.

[0066] If the component carrier 200 includes a lower holder mask 230, the lower holder mask is further configured to hold an airtight foil, sheet or film 250 (e.g., Teflon) so that the airtight foil, sheet or film 250 completely covers the component 20 carried on the component carrier or ultimately carried on the carrying member 220. When the lower holder mask 230 is mounted on the component support 210, the airtight foil, sheet or film is sandwiched between the lower holder mask 230 and the top surface 210a of the component support 210. In this case, the airtight foil, sheet or film 250 and the lower holder mask 230 themselves act as a sealing component and prevent the gas introduced into the receiving recess 211 from leaking. In addition, the gas is contained in the receiving recess 211 through the movable base 212 installed in the positioning opening 213 of the component support.

[0067] Since the component 20 is not hermetically carried on the component carrier 200 or ultimately on the carrying member 220 (i.e. on the carrying protrusion 222), the gas supplied to the receiving recess 211 can circulate freely around the component, i.e. in the space included between the component and the sealing foil, film or sheet 250 and in the space included between the component and the movable base 212.

[0068] The gas is provided to the component 20 before the component carrier 200 is in the processing station 12, i.e., when the movable base 212 and the component 20 are not in contact with each other. In this way, the inert gas flowing from the recess gas inlet 214 to the recess gas outlet 215 can form an atmosphere consisting mainly of the inert gas around the component 20. In addition, the presence of the inert gas flow allows the extraction of oxygen and contaminants, which are not conducive to the proper processing of the component 20 and may be harmful to the environment outside the component carrier 200.

[0069] Figure 5A and Figure 5B 4 during a preheating phase of the process and during a treatment phase of the process. Figure 5A In the embodiment, the component carrier 200 is provided to the preheating platform 111 of the preheating station 11. Figure 5B In the process, the component carrier 200 is provided onto the heating platform 121 of the heating station 12 .

[0070] In a method of processing components, one or more components 20 are provided on a component carrier 200. Each component is placed in a component position corresponding to an associated positioning opening 213 of a component support 210.

[0071] Optionally, one or more components 20 are provided on a carrier member 220 of a component carrier 200. Each component is placed in a component position corresponding to an associated receiving opening 221 of the carrier member 220. If a carrier protrusion 222 is present, the component is provided on the carrier protrusion 222. The carrier member 220 is then provided on the receiving recess 211 of the component support 210.

[0072] When the component is carried on the component carrier 200 or on the carrying member 220 , an airtight foil, sheet or film 250 is provided and attached to the top surface 210 a of the component support 210 so as to completely cover the component 20 .

[0073] Optionally, the lower holder mask 230 is provided on an airtight foil, sheet or film 250 and is finally fixed to the top surface 210a of the component support 210 by fastening means (i.e. screws, bolts or the like). The weight of the lower holder mask 230 and / or the fastening of the lower holder mask 230 to the component support 210 and the presence of the sealing foil, film or sheet 250 provide sealability to the receiving recess 211.

[0074] Alternatively, the sealability of the receiving recess 211 is ensured by the presence of a sealing component (ie an O-ring or the like) between the top surface 210a of the component support 210 and the air-impermeable foil, sheet or film 250 extending along the entire circumference of the top surface 210a.

[0075] As described above, when the component carrier 200 carrying the component 20 is mounted, the component carrier 200 is provided to different stations of the processing device 10 for processing.

[0076] Throughout the entire processing process, the component carrier 200 is continuously connected to a gas source and exhaust device in order to create an inert gas atmosphere and a continuous gas flow F around the product. The connection is also maintained during the transfer between the stations of the processing device 10. Inert gas, typically nitrogen (N2), is introduced into the receiving recess 211 from the gas source through the carrier gas inlet connection 216 and is withdrawn from the receiving recess 211 through the carrier gas outlet connection 217. In this way, as described above, the inert gas flows in the gas conduit 218 to the recess gas inlet 214 and thus enters the receiving recess 211.

[0077] The gas flow passes over, under and along the components 20, carrying away contamination generated by the components and removing oxygen present in the receiving cavity 211. The gas flow leaves the receiving cavity 211 through the cavity gas outlet 215 and flows to the carrier gas outlet connection 217.

[0078] The atmosphere surrounding the component thus comprises mainly inert gas, namely N2, during all processing stages and during transport between the various stations of the processing device 10. This prevents oxidation of the (metal) component parts and removes contaminants released from the component itself.

[0079] Once the component carrier 200 is mounted and once the gas connection is established, the component carrier 200 is transported to the preheating station 11 of the processing device 10 so that the bottom surface 210b of the component support 210 is provided on the preheating plate 111 of the preheating station 11, as shown in FIG. Figure 5A shown.

[0080] The preheating plate 111 includes at least one preheating plate opening 112, the position of which corresponds to the positioning opening 213 of the component support 210. The at least one opening 112 of the preheating plate is configured to enable the movable base 212 to remain out of contact with the component and to contact the heating assembly 113 placed below the preheating plate 111 with its bottom end 212b.

[0081] The heating assembly 113 is configured to heat to about 250-300°C and transfer heat to the thermally conductive movable base 212. Optionally, the heating assembly 113 is configured to heat to a temperature below 250-300°C to prevent the temperature of the thermally conductive movable base 212 from reaching a temperature higher than that required in the preheating stage. Therefore, when the component carrier 200 is carried on the preheating plate 111, a space is defined between each movable base 212 and the associated component 20, and the movable base 212 is heated to a lower temperature than the heating assembly 113 based on the time the component carrier 200 spends in the preheating station 11. Heat is transferred from the movable base 212 to the components 20 by convection and / or radiation, and the components are heated at a desired predetermined temperature, which is lower than the temperature of the movable base / heating assembly.

[0082] When the component 20 reaches a predetermined temperature, the component carrier 200 is transferred to the processing station so that the bottom surface 210b of the component support 210 is provided on the heating plate 121. The heating plate 121 includes a heating portion 121a configured to heat to about 250-300° C. The heating plate 121 is configured so that, when the component carrier 200 is provided to the processing station 12, the position of the heating portion 121a of the heating plate 121 corresponds to the position of the movable base 212 of the component carrier 200.

[0083] When the component carrier 200 is provided on the heating plate 121, the movable base 212 is pushed toward the component 20 and contacts it, such as Figure 5BAs shown. In the process of the movable base 212 moving toward the component 20, the movable base (these) contacts the component 20, and then the component (these) is slightly lifted and supported on the top end 212a of the movable base 212. The heat-conductive movable base 212 in contact with the heating portion 121a of the heating plate 121 is quickly heated to a temperature of about 250-300°C below the heating portion 121a, and heat is transferred to the component 20 through contact, and the component (these) quickly reaches the same temperature.

[0084] To process the components, pressure is applied to the components by a press tool 120 included in the processing station 12, which is configured and arranged to apply pressure to the components by lowering a movable insert member onto each component to make contact and apply pressure. The components 20 are maintained under pressure and temperature conditions until the components are processed. A component typically includes two components, such as a device (such as a semiconductor device, such as a power IC) and its substrate or carrier, which are bonded during sintering by applying pressure and temperature to a sintering material placed between the two components.

[0085] After processing, the component carrier 200 is transferred to the cooling station 13 for cooling. Subsequently, the component carrier 200 is transferred to the outside of the processing device 10 for further processing.

[0086] Fig. 6A and Figure 6B 1 shows a perspective view of a component carrier 200 to be used in a component handling device 10. For the sake of clarity, Fig. 6A , the lower holder mask 230 and the foil 250 are shown separated from the rest of the component carrier 200, while Figure 6B A component carrier 200 is shown with a lower holder mask 230 mounted thereon. Fig. 7A and 7B Shows Fig. 6A and 6B Cross-sections of the component carrier 200 along different axes.

[0087] Fig. 6A , Figure 6B , Fig. 7A and Figure 7B The functions and features of the component carrier 200 are similar to those mentioned above. Figure 4A and 4B The functions and features of the component carriers 200 shown are similar.

[0088] Fig. 6A and Figure 6BThe component carrier 200 includes a plurality of components stacked on top of each other, namely a component support 210, a carrier component 220 and a lower holder mask 230. When the component carrier 200 is in the mounted configuration, the component support 210, the carrier component 220 and the lower holder mask 230 are held together by their weight or may be fastened to each other by fastening components 207, such as screws, bolts or the like.

[0089] Fig. 6A , Figure 6B , Fig. 7A and Figure 7B The component support 210 of the component carrier 200 further comprises an additional first side area 211b.1 and a second side area 211b.2 at the first side 200a and the second side 200b of the component carrier 200, respectively. The first additional side area 211b.1 and the second additional side area 211b.2 are recessed relative to the top surface 210a of the component support 210 and are configured to allow mounting of a carrier gas inlet connection / carrier gas outlet connection. The component carrier 200 comprises a first carrier gas inlet connection 216 and a first carrier gas outlet connection 217, which are provided on the first side area 211b.1 of the component carrier 200 close to the first part 200a and the second part 200b, respectively. A second carrier gas inlet connection 216' and a second carrier gas outlet connection 217' are provided on the second side area 211b.2 of the component carrier 200 close to the second part 200b and the first part 200a, respectively.

[0090] With Figure 4A and Figure 4B Similar to the description of the component carrier 200 of FIG. 1 , the first carrier gas inlet connection 216 and the second carrier gas inlet connection 216′ are configured to allow gas to be introduced into the receiving recess 211, and the first carrier gas outlet connection 217 and the second carrier gas outlet connection 217′ are configured to allow gas to be extracted from the receiving recess 211. The first carrier gas inlet connection 216 and the second carrier gas outlet connection 217 are configured to be connected to a gas source and an exhaust device, respectively.

[0091] exist Fig. 6A and Figure 6B In the embodiment, the component carrier 200 is configured to carry eight components, that is, the carrying member 220 includes eight receiving openings 221, the component support 210 includes eight positioning openings 213 and eight movable bases 212, and the lower holder mask 230 includes eight mask openings 231. However, those skilled in the art will understand that a number of components to be processed other than eight may be implemented in the component carrier 200 without changing the scope of the present invention.

[0092] A movable base 212 made of a thermally conductive material and including a top 212a and a bottom 212b is slidably mounted in each positioning opening 213 of the component support 210. Regarding the function (i.e., movement) and features of the movable base 220, please refer to the description related to any previous figures. The size of the top end 212a of the movable base is larger than the size of the relevant positioning opening, and the bottom end 212b of the movable base 212 is configured to fit and slide in the relevant positioning opening 213. The top end 212a of the movable base 212 faces the component carried on the carrying protrusion 222. When the movable base is away from the component 20, the top end 212a of the movable base 212 engages with the bottom surface 211a of the receiving recess 211 surrounding each positioning opening 213 to prevent the movable base 212 from sliding out of the relevant positioning opening 213, as shown in FIG. Fig. 7A and Figure 7B shown.

[0093] The component support 210 optionally includes support assemblies 224 provided on a bottom surface 210b of the component support 210, and these support assemblies are configured to support the component carrier 200 when they are provided on a surface. In addition, the first carrier gas inlet connection 216 and the second carrier gas outlet connection 217 further include mechanical valves 260 (only shown for the gas outlet connection), which allow to control the flow of gas to / from the receiving recess 211. When the component carrier 200 is not connected to a gas source or exhaust, the valve spring 261 holds the valve 260 in a closed position, thereby preventing gas from entering / leaving the receiving recess 211. In contrast, when the component carrier 200 is connected to a gas source or exhaust, the valve spring 261 is pushed downwards, thereby opening the valve 260, thereby allowing gas to enter / leave the receiving recess 211. When a gas source or exhaust of the processing device 10 is connected to the carrier gas inlet / carrier gas outlet, respectively, the component carrier 200 is connected to the gas source or exhaust.

[0094] Optionally, the gas inlet 216 has inlet nozzles on both the top surface 210a of the component support 210 and the bottom surface 210b of the component support 210. In this case, the valve 260 is used to determine whether to allow gas to pass through the nozzles located on the top surface 210a or the bottom surface 210b of the component support 210. The operation mechanism of the valve 260 for controlling whether to allow gas flow through the nozzles located on the top surface 210a or the bottom surface 210b of the component support 210 is similar to the operation of the valve 260 described above.

[0095] and Figure 4A and Figure 4B Similar to the component carrier 200 of FIG. 1 , a sealing foil, film or sheet 250 of an airtight material, such as Teflon, is sandwiched between the lower holder mask 230 and the top surface 210a of the component support 210. Figure 4A and Figure 3B The disclosed lower holder plate 230, the lower holder mask 230 further includes positioning pins 233 protruding from the bottom surface 230b of the lower holder plate 230 toward the top surface 210a of the component support 210. The positioning pins 233 are configured to fit into the positioning holes 223 formed in the top surface 210a of the component support 210 and allow the lower holder plate 230 to be properly positioned on the component support 210. The lower holder mask 230 has a substantially planar shape including an arcuate edge 234 substantially around the entire perimeter, which further facilitates positioning the lower holder mask 230 on the component support 210.

[0096] Fig. 6A and Figure 6B The component carrier 200 is used for the referenced Figure 1 Figure 5A and Figure 5B Describes the component handling method.

Claims

1. A component carrier (200) for carrying one or more components (20) to be processed in a component processing device such as a press sintering device, the component carrier comprising a component support (210), The component support comprises: one or more positioning openings (213) formed through the component support from a top surface (210a) of the component support to a bottom surface (210b) of the component support, wherein each positioning opening defines a component position for holding a component to be processed, and the component held at the component position is exposed at the top surface of the component support, and one or more movable bases (212), the one or more movable bases being respectively associated with the one or more positioning openings, wherein each movable base is received in an associated locating opening to move along a direction A between the top and bottom surfaces of the component support to bring a top end (212a) of the movable base into and out of contact with a component held in the component position defined by the locating opening to carry and thermally contact the corresponding component during processing of the component in operation, and The bottom end (212b) of each pedestal is exposed at the bottom surface (210b) of the component support so as to be in thermal contact with a heat source in operation for heating the pedestal and the corresponding component when in contact with the pedestal.

2. A component carrier as claimed in the preceding claim, wherein the component support comprises a receiving recess (211) associated with the positioning opening (213), the receiving recess being recessed relative to the top surface of the component support and wherein the one or more positioning openings are arranged in the receiving recess.

3. The component carrier according to the preceding claim, wherein the top surface of the component support completely surrounds the receiving recess.

4. A component carrier as described in the preceding claim, wherein the component support includes a carrying member (220), which is configured to fit into the receiving recess and includes one or more receiving openings (221), and when the carrying member is arranged in the receiving recess, the one or more receiving openings correspond to the one or more component positions, wherein each receiving opening is configured to carry one of the one or more components and enable the top end of the corresponding movable base to contact the component.

5. The component carrier according to the preceding claim, wherein the carrying member comprises a carrying component (222) which projects towards the interior of each receiving opening and is configured to carry the one or more components.

6. A component carrier as described in any one of claims 2-5, wherein the component carrier further includes a lower holder mask (230), the lower holder mask is configured to be mounted on the top surface of the component support, the lower holder mask includes one or more mask openings (231), the one or more mask openings are configured to allow access to the component, and the position of the mask opening corresponds to the component position defined by the positioning opening of the component support.

7. A component carrier as described in the previous claim, wherein the lower holder mask further includes positioning pins (233), which protrude from the bottom surface (230b) of the lower holder mask and are configured to fit into positioning holes (223) formed in the top surface of the component support.

8. The component carrier according to any one of claims 2 to 7, wherein a gas inlet (214) and a gas outlet (215) are provided in the receiving recess, and wherein the gas inlet and the gas outlet are fluidically connected to a gas inlet connection (216) and a gas outlet connection (217), respectively, via one or more gas ducts (218), The gas inlet connection is configured to be connected to a gas source, and the gas outlet connection is configured to be connected to an exhaust device to provide a continuous gas flow to the one or more components.

9. A component carrier as claimed in any one of claims 3 to 8, wherein the component carrier is configured to hold an airtight foil, sheet or film (250), which completely covers the one or more components carried and creates a closed cavity for the one or more components.

10. A component carrier according to the preceding claim, wherein When the lower holder mask is mounted onto the top surface of the component support, the air-impermeable foil, sheet or film is sandwiched between the lower holder mask and the top surface of the component support.

11. A component carrier (200) for carrying one or more components (20) to be processed in a component processing device such as a press sintering device, the component carrier optionally being a component carrier according to any of the preceding claims, The component carrier comprises: a component support (210), the component support comprising one or more positioning openings (213) formed in the component support at a top surface (210a) of the component support, wherein each positioning opening defines a component position within the positioning opening to hold a component to be processed, and the component held at the component position within the positioning opening is exposed at the top surface of the component support; as well as Two gas inlet connections (216) are fluidly connected to the locating opening of the component support to deliver gas from a gas source, the gas source being connected to one of the gas inlet connections leading to the locating opening when in use to purge the locating opening, wherein each gas inlet connection is configured to be closed when not connected to the gas source.

12. The component carrier according to the preceding claim, wherein the component support comprises a gas duct (218) connected to each positioning opening to provide a fluid connection between the gas inlet connection and the positioning opening.

13. A component carrier as described in any of the two preceding claims, wherein the component support includes two gas outlet connections (217), which are fluidly connected to the positioning opening of the component support to transfer gas from the positioning opening to an exhaust device, and the exhaust device is connected to one of the gas outlet connections when in use to purify the positioning opening, wherein each gas outlet connection is configured to be closed when not connected to the exhaust device.

14. A method for processing a component in a processing device (10), wherein the method comprises: A component carrier as claimed in any one of the preceding claims is used.

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