Apparatus for cleaning a substrate and related method

Abstract

An apparatus for cleaning a substrate. The device includes a polymeric pad, a frame body, and a coupling member. The polymeric pad has a top surface and a bottom surface. At least a portion of the frame body extends between the top surface and the bottom surface of the polymeric pad. A coupling member extends upwardly from at least a portion of the frame body.

Description

Technical Field

[0001] The present disclosure relates to the field of coupleable devices and associated methods for cleaning substrates. Background Art

[0002] Chemical mechanical planarization is a process in which the substrate is planarized and conditioned through a combination of chemical oxidation and mechanical polishing. The process of chemical mechanical planarization generates residues, particles, and contaminants. Summary of the invention

[0003] Some embodiments relate to an apparatus. In some embodiments, the apparatus includes a polymeric pad having a top surface and a bottom surface. In some embodiments, the apparatus includes a frame body. In some embodiments, at least a portion of the frame body extends between the top surface and the bottom surface of the polymeric pad. In some embodiments, the apparatus includes a coupling member extending from at least a portion of the frame body.

[0004] In some embodiments, the coupling means is configured for coupling the apparatus to an equipment.

[0005] In some embodiments, the coupling member comprises a clamp configured for clamping the device to an apparatus.

[0006] In some embodiments, the coupling member comprises a fastener configured to secure the apparatus to a device.

[0007] In some embodiments, the apparatus further comprises a magnet configured to couple the apparatus to a device.

[0008] In some embodiments, the polymeric pad is configured for at least one of cleaning, polishing, or scrubbing a surface of a semiconductor substrate.

[0009] In some embodiments, the polymeric pad includes a plurality of surface structures extending from the bottom surface of the polymeric pad.

[0010] In some embodiments, the plurality of surface structures are integral to the polymeric pad.

[0011] In some embodiments, the polymeric pad comprises at least one of a flat bottom surface, a flat top surface, or any combination thereof.

[0012] In some embodiments, the polymeric pad comprises a first polymeric material. In some embodiments, the frame body comprises a second polymeric material. In some embodiments, the second polymeric material is different from the first polymeric material.

[0013] In some embodiments, the first polymeric material includes at least one of polyvinyl alcohol, polysulfone, polyphenylene ether sulfone, polypolyaryl sulfone, nylon, polyamide, fluoropolymer, polytetrafluoroethylene (PTFE), polyethylene, polypropylene, cellulose, acetate, or any combination thereof.

[0014] In some embodiments, the second polymeric material includes at least one of polypropylene, polyethylene, copolymers thereof, or any combination thereof.

[0015] In some embodiments, the polymeric pad has a disc shape.

[0016] In some embodiments, the frame body has a disc shape.

[0017] In some embodiments, the frame body includes a plurality of through holes in a surface of the frame body.

[0018] In some embodiments, the frame body and the coupling component are a single integral structure.

[0019] In some embodiments, the polymeric pad is integrally formed with the frame body.

[0020] In some embodiments, the diameter of the polymeric pad is 1 mm to 450 mm.

[0021] In some embodiments, the polymeric mat has a porosity of 50% to 99%.

[0022] Some embodiments are directed to a method. In some embodiments, the method comprises obtaining an apparatus according to any embodiment disclosed herein in any combination. In some embodiments, the method comprises coupling the apparatus to a device.

[0023] In some embodiments, the coupling comprises clamping the device to a mandrel of the apparatus.

[0024] In some embodiments, the coupling comprises securing the device to a spindle of the apparatus.

[0025] In some embodiments, the coupling comprises securing the device to a spindle of the apparatus via magnets.

[0026] Some embodiments relate to a method for forming a device. In some embodiments, the method includes obtaining a frame. In some embodiments, the frame includes: a frame body, which includes a plurality of through holes; and a coupling member, which extends from an edge portion of the frame body. In some embodiments, the method includes placing at least the frame body in a mold. In some embodiments, the method includes obtaining a polymeric material. In some embodiments, the method includes placing the polymeric material in the mold. In some embodiments, the method includes curing the polymeric material.

[0027] In some embodiments, the method further comprises heating the polymeric material to a temperature sufficient to obtain a flowable polymeric material.

[0028] In some embodiments, the curing comprises cooling the polymeric material to a temperature sufficient to cure the polymeric material. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Some embodiments of the present disclosure are described herein by way of example only with reference to the accompanying drawings. With specific reference now to the drawings in detail, it should be emphasized that the embodiments shown are by way of example and for the purpose of illustrative discussion of the embodiments of the present disclosure. In this regard, the description together with the drawings enables those skilled in the art to understand how the embodiments of the present disclosure may be practiced.

[0030] Figure 1 A side view depicting a non-limiting embodiment of an apparatus coupled to a mandrel of an apparatus according to some embodiments.

[0031] Figure 2 According to some embodiments Figure 1 A cross-sectional view of a non-limiting embodiment of the device depicted in FIG.

[0032] Figure 3 is a cross-sectional view of a non-limiting embodiment of a device according to some embodiments.

[0033] Figure 4A is a cross-sectional view of a non-limiting embodiment of a device according to some embodiments.

[0034] Figure 4B is a perspective view of a non-limiting embodiment of a pyramid structure in accordance with some embodiments.

[0035] Figure 5A is a cross-sectional view of a non-limiting embodiment of a device according to some embodiments.

[0036] Figure 5B is a perspective view of a non-limiting embodiment of a cylindrical column according to some embodiments.

[0037] Figure 5Cis a perspective view of a non-limiting embodiment of a square column, according to some embodiments.

[0038] Figure 6 is a cross-sectional view of a non-limiting embodiment of a device according to some embodiments.

[0039] Figure 7 is a cross-sectional view of a non-limiting embodiment of a device according to some embodiments.

[0040] Figure 8 is a flow chart of a method according to some embodiments.

[0041] Fig. 9 is a flow chart of a method according to some embodiments. DETAILED DESCRIPTION

[0042] Among the benefits and improvements disclosed, other objects and advantages of the present disclosure will become apparent from the following description in conjunction with the accompanying drawings. Detailed embodiments of the present disclosure are disclosed herein; however, it should be understood that the disclosed embodiments are merely illustrative of the disclosure that can be embodied in various forms. In addition, each example given with respect to the various embodiments of the present disclosure is intended to be illustrative and non-limiting.

[0043] Any prior patents and publications cited herein are incorporated by reference in their entirety.

[0044] Throughout the specification and claims, the following terms take the meanings explicitly associated herein, unless the background clearly indicates otherwise. The phrases "in one embodiment," "in an embodiment," and "in some embodiments" as used herein do not necessarily refer to the same embodiment, although they may refer to the same embodiment. In addition, the phrases "in another embodiment" and "in some other embodiments" as used herein do not necessarily refer to different embodiments, although they may refer to different embodiments. All embodiments of the present disclosure are intended to be combinable without departing from the scope or spirit of the present disclosure.

[0045] As used herein, the term "based on" is non-exclusive and allows for being based on additional factors not described unless the context clearly indicates otherwise. Additionally, throughout the specification, the meanings of "a," "an," and "the" include plural references. The meaning of "in..." includes "in..." and "on...".

[0046] Some embodiments of the present disclosure are directed to an apparatus for cleaning substrates. The apparatus includes a polymeric pad embedded in a frame body and a coupling member extending upward from the frame body for securing the apparatus to equipment. The frame body and coupling member are constructed of a material that is typically more rigid than the soft polymeric material used to form the polymeric pad. The rigidity of the frame body and coupling member enhances the structural integrity of the polymeric pad while also replacing the soft polymer extension with a more rigid coupling member to more securely attach the apparatus to the equipment. Additional advantages include easy attachment and detachment from the equipment, longer life of the polymeric pad, improved reliability, and many other advantages that will be apparent based on the disclosure herein.

[0047] In some embodiments, the apparatus disclosed herein is used to clean or scrub substrates used in semiconductor manufacturing, such as silicon wafers. That is, for example, in some embodiments, the substrate undergoes a polishing process, such as a chemical mechanical planarization (CMP) process, in which chemical oxidation and mechanical grinding are used to achieve high substrate flatness. Processes such as CMP typically result in the formation of various residues and contaminants on the surface of the substrate. These residues and contaminants need to be removed before undergoing further semiconductor manufacturing processes. Therefore, the apparatus disclosed herein may be useful in a post-CMP cleaning module, a post-CMP pre-cleaning module, and the like.

[0048] As used herein, the term "residue" refers to particles generated during a process. The term encompasses "post-CMP residue". Post-CMP residue may include, for example and without limitation, particles from a polishing slurry, such as, for example and without limitation, silicon dioxide-containing particles, chemicals in a polishing slurry, reaction byproducts of a polishing slurry, carbon-rich particles, polishing pad particles, brush removal particles, metals (e.g., at least one of copper, aluminum, tungsten, or any combination thereof), metal oxides, organic residues, barrier layer residues, any other material that is a byproduct of a CMP process, or at least one of any combination thereof. It should be understood that the term may encompass other types of residues without departing from the scope of the present disclosure.

[0049] As used herein, the term "contaminant" refers to an undesirable substance. The term includes, for example and without limitation, at least one of a chemical in a CMP slurry, a reaction byproduct of a polishing slurry, any other material that is a byproduct of a CMP process, or any combination thereof. An example of a contaminant includes benzotriazole. It should be understood that the term may include other types of contaminants without departing from the scope of the present disclosure.

[0050] Figure 1A side view of a non-limiting embodiment of a device 100 coupled to a mandrel 202 of an apparatus 200 is depicted. The device 100 may include a device according to any embodiment disclosed herein in any combination. In the illustrated embodiment, the device 100 includes a polymeric pad 102 configured to contact (e.g., clean, scrub, polish, etc.) a surface of a substrate. A coupling member 106, shown extending upward from a frame body (not depicted), is configured for coupling the device 100 to the apparatus 200. In some embodiments, the coupling member 106 is configured to be pulled apart enough to couple the device 100 to the mandrel 202, while also being resilient enough to snap the device 100 back and secure it to the mandrel 202. In some embodiments, as shown, the mandrel 202 may further include a groove 204 to further secure the device 100 to the apparatus.

[0051] Although the side view depicts coupling member 106, in some embodiments, device 100 includes a single coupling member. In some embodiments, device 100 includes multiple coupling members. In some embodiments, polymeric pad 102 is formed in the shape of a disk, wherein the coupling member extends upward from the perimeter or outer perimeter of the disk. In some of these embodiments, the coupling member may extend around all or part of the outer perimeter of the disk.

[0052] Figure 2 1 is a cross-sectional view of a non-limiting embodiment of a device 100 according to some embodiments. The device 100 includes a polymeric pad 102, a frame body 104, and a coupling member 106. The polymeric pad 102 has a top surface 108 and a bottom surface 110. The coupling member 106 is integral with the frame body 104. That is, the coupling member 106 and the frame body are a single unitary structure formed of the same construction material. Since the polymeric pad 102 is typically formed of a relatively soft polymeric material (e.g., polyvinyl alcohol, etc.) used for cleaning substrates, the frame body 104 is typically disposed within the polymeric pad 102 to provide structural rigidity to the device 100. That is, the frame body 104 extends through the polymeric pad 102 between the top surface 108 and the bottom surface 110. In addition, the frame body 104 includes a through hole 112 in a surface of the frame body 104. Through holes 112 allow flowable polymeric material to be disposed in the through holes and above and below frame body 104 during manufacture of device 100, such that when the flowable polymeric material solidifies, the resulting polymeric pad 102 is integrally formed with at least frame body 104. Coupling members 106 extend upward from the periphery of frame body 104 to above polymeric pad 102 to couple device 100 to apparatus 200.

[0053] The polymeric pad 102 typically comprises a softer material than the frame body 104 and the coupling member 106. For example, in some embodiments, the polymeric pad comprises a soft polymeric material, such as polyvinyl alcohol. In some embodiments, the polymeric pad comprises at least one of polysulfone, polyethersulfone, polypolyarylsulfone, nylon, polyamide, fluoropolymer, polytetrafluoroethylene (PTFE), polyethylene, polypropylene, cellulose, acetate, or any combination thereof. In some embodiments, the frame body 104, the coupling member 106, or any combination thereof, comprises a more rigid polymeric material, such as at least one of polypropylene, polyethylene, any copolymer thereof, or any combination thereof. In some embodiments, the frame body 104, the coupling member 106, or any combination thereof, comprises a flowable polymeric material that, once cured, causes the coupling member 106 to be sufficiently elastic so that the coupling member 106 can flex, while also being sufficiently stretchable to sufficiently bias the clamp inward to engage the device 200 (e.g., snap onto and / or detach from the mandrel).

[0054] The polymeric pad 102 can have a thickness in the range of 0.1 mm to 50 mm, or in any range or sub-range between 0.1 mm and 50 mm. In some embodiments, for example, the polymeric pad 102 has a thickness in the range of 1 mm to 10 mm, 1 mm to 9 mm, 1 mm to 8 mm, 1 mm to 7 mm, 1 mm to 6 mm, 1 mm to 5 mm, 1 mm to 4 mm, 1 mm to 3 mm, 1 mm to 2 mm, 2 mm to 10 mm, 3 mm to 10 mm, 4 mm to 10 mm, 5 mm to 10 mm, 6 mm to 10 mm, 7 mm to 10 mm, 8 mm to 10 mm, 9 mm to 10 mm, 2 mm to 7 mm, 2 mm to 6 mm, 2 mm to 5 mm, 2 mm to 4 mm, 3 mm to 7 mm, 4 mm to 7 mm, 5 mm to 7 mm, 6 mm to 7 mm, any range or sub-range therebetween, or any combination thereof.

[0055] The diameter of the polymeric pad 102 can be in a range from 1 mm to 450 mm, or any range or sub-range between 1 mm and 450 mm. In some embodiments, for example, the polymeric pad 102 has a thickness in a range of 1 mm to 25 mm, 1 mm to 50 mm, 1 mm to 75 mm, 1 mm to 100 mm, 1 mm to 125 mm, 1 mm to 150 mm, 1 mm to 200 mm, 1 mm to 300 mm, 1 mm to 450 mm, 25 mm to 450 mm, 50 mm to 450 mm, 75 mm to 450 mm, 100 mm to 450 mm, 125 mm to 450 mm, 150 mm to 450 mm, 200 mm to 450 mm, or 300 mm to 450 mm.

[0056] In some embodiments, the diameter of polymeric pad 102 is less than the diameter of the substrate. In some embodiments, the substrate is a silicon wafer. In some embodiments, the diameter of polymeric pad 102 is less than 25 mm (e.g., 1 mm to 24 mm), less than 51 mm (e.g., 1 mm to 50 mm), less than 76 mm (e.g., 1 mm to 75 mm), less than 100 mm (e.g., 1 mm to 99 mm), less than 125 mm (e.g., 1 mm to 124 mm), less than 150 mm (e.g., 1 mm to 149 mm), less than 200 mm (e.g., 1 mm to 199 mm), less than 300 mm (e.g., 1 mm to 299 mm), or less than 450 mm (1 mm to 449 mm).

[0057] The porosity of the polymeric pad 102 may refer to the dimensionless ratio of the volume of void space to the volume of bulk material. In some embodiments, the porosity of the polymeric pad 102 is 50% to 99%, or any range or sub-range therebetween. In some embodiments, the porosity of the polymeric pad 102 is 60% to 99%, 65% to 99%, 70% to 99%, 75% to 99%, 80% to 99%, 85% to 99%, 90% to 99%, 85% to 95%, 85% to 90%, or 90% to 95%.

[0058] The coupling member 106 can avoid the need for the polymeric pad 102 to have any extension configured to be inserted into the mandrel 202 to secure the device 100 to the apparatus 200. For example, while conventional polymeric pads have a dovetail structure on the top surface of the polymeric pad that couples the conventional polymeric pad to the apparatus, the polymeric pad 102 disclosed herein does not include any structure for coupling the polymeric pad 102 to the apparatus 200. That is, in some embodiments, the polymeric pad 102 has a flat top surface. In some embodiments, the polymeric pad 102 has a non-flat top surface, wherein the non-flat top surface does not include any structure for coupling the polymeric pad 102 to the apparatus 200.

[0059] The polymeric pad 102 has a bottom surface configured for cleaning, polishing, or scrubbing a substrate surface. In some embodiments, the polymeric pad 102 has a flat bottom surface. In some embodiments, the polymeric pad 102 has a non-flat bottom surface. For example, in some embodiments, the polymeric pad 102 includes a plurality of surface structures extending from the bottom surface of the polymeric pad 102. Various embodiments of the surface structures are described below.

[0060] Figure 33 is a cross-sectional view of a non-limiting embodiment of an apparatus 300 according to some embodiments. The apparatus 300 is similar to the apparatus 100. Therefore, similar reference numbers are used. The apparatus 300 includes a plurality of surface structures 320. The plurality of surface structures 320 are integral with the polymeric pad 302 and extend downwardly from the bottom surface 310 of the polymeric pad 302. The plurality of surface structures 320 are configured to clean the surface of the substrate. Figure 3 As shown in FIG. 4 , the plurality of surface structures 320 have a circular cross-section.

[0061] FIG. 4 is a cross-sectional view of a non-limiting embodiment of a device 400 according to some embodiments. Device 400 is similar to device 100. Therefore, similar reference numbers are used. Device 400 includes a plurality of surface structures 420. The plurality of surface structures 420 are integral with polymeric pad 402 and extend downwardly from a bottom surface 410 of polymeric pad 402. The plurality of surface structures 420 are configured for cleaning a substrate surface. As shown in FIG. 4 , the plurality of surface structures 420 have a triangular cross-section. In some embodiments, the plurality of surface structures 420 include a plurality of pyramid structures extending from bottom surface 410, such as Figure 4B Pyramid structure 430 is shown in FIG.

[0062] Figure 5A 5 is a cross-sectional view of a non-limiting embodiment of an apparatus 500 according to some embodiments. The apparatus 500 is similar to the apparatus 100. Therefore, similar reference numbers are used. The apparatus 500 includes a plurality of surface structures 520. The plurality of surface structures 520 are integral with the polymeric pad 502 and extend downwardly from the bottom surface 510 of the polymeric pad 502. The plurality of surface structures 520 are configured to clean the surface of the substrate. Figure 5A , the plurality of surface structures 520 have a rectangular (or quadrilateral) cross-section. In some embodiments, for example, the plurality of surface structures 520 include a plurality of cylindrical columns extending from the bottom surface 510, for example Figure 5B In some embodiments, the plurality of surface structures 520 include a plurality of square pillars extending from the bottom surface 510, such as Figure 5C The square column 540 is shown in the figure.

[0063] Figure 66 is a cross-sectional view of a non-limiting embodiment of an apparatus 600 according to some embodiments. The apparatus 600 is similar to the apparatus 100. Therefore, similar reference numbers are used. The apparatus 600 includes coupling members 606. Each of the coupling members 606 is configured to fasten the apparatus 600 to a device. In the illustrated embodiment, each of the coupling members 606 is shown to include a fastener 630, such as a mechanical fastener (e.g., a screw, etc.), for fastening the apparatus 600 to the device. In some embodiments, each fastener 630 is configured to pass through the coupling member 606 to a receiving member in the device, which receives the fastener 630 and couples the apparatus 600 to the device.

[0064] Figure 7 is a cross-sectional view of a non-limiting embodiment of a device 700 according to some embodiments. The device 700 is similar to the device 100. Therefore, similar reference numbers are used. The device 700 includes at least one magnet 730 coupled to the top surface 708 of the polymer pad 702. The location and arrangement of the at least one magnet 730 on the top surface 708 of the polymer pad 702 are not particularly limited. In some embodiments, the at least one magnet 730 is a single magnet bent around the outer periphery of the disc-shaped polymer pad 702. For each of the various arrangements of the at least one magnet 730, the device includes at least one second magnet for magnetically coupling the device 700 to the device.

[0065] Figure 8 800 is a flow chart of a method 800 according to some embodiments. The method includes a step 802 of obtaining a device according to any embodiment disclosed herein in any combination. The method includes a step 804 of coupling the device to an apparatus. The device may be coupled according to any embodiment disclosed herein in any combination. For example, the device may be clamped (e.g., snapped) to the apparatus, fastened to the apparatus, coupled to the apparatus via a magnet, or any combination thereof. In some embodiments, the method further includes a step 806 of using the device to clean a substrate. The method may include any one or more of the foregoing steps which may be performed in any order.

[0066] Fig. 9900 includes a step 902 of obtaining a frame including a frame body and a coupling member. The frame may include a frame body according to any embodiment disclosed herein in any combination and a coupling member according to any embodiment disclosed herein in any combination. In some embodiments, the frame body includes a plurality of through holes in a surface of the frame body, and a coupling member extending from an edge portion of the frame body. The method then includes a step 904 of disposing at least the frame body in a mold. The method further includes a step 906 of obtaining a polymeric material (e.g., a flowable polymeric material) and a step 908 of disposing the polymeric material in a mold. The method then includes a step 910 of curing the polymeric material (e.g., sufficient to form a device according to any embodiment disclosed herein in any combination). In some embodiments, the method further includes heating the polymeric material to a temperature sufficient to obtain the flowable polymeric material. In some embodiments, curing includes cooling the polymeric material to a temperature sufficient to cure the polymeric material. The method may include any one or more of the aforementioned steps that may be performed in any order.

[0067] aspect

[0068] Various aspects are described below. It should be understood that any one or more of the features recited in the following aspects may be combined with any one or more other aspects.

[0069] Aspect 1. A device comprising:

[0070] a polymeric pad having a top surface and a bottom surface;

[0071] Frame body,

[0072] wherein at least a portion of the frame body extends between the top surface and the bottom surface of the polymeric mat; and

[0073] A coupling member extends from at least a portion of the frame body.

[0074] Aspect 2. The apparatus according to aspect 1, wherein the coupling component is configured to couple the apparatus to an equipment.

[0075] Aspect 3. The apparatus according to any one of aspects 1 to 2, wherein the coupling member comprises a clamp configured to clamp the apparatus to a device.

[0076] Aspect 4. The apparatus according to any one of aspects 1 to 3, wherein the coupling member comprises a fastener configured to fasten the apparatus to a device.

[0077] Aspect 5. The apparatus according to any one of aspects 1 to 4, further comprising a magnet configured to couple the apparatus to a device.

[0078] Aspect 6. The device of any one of aspects 1 to 5, wherein the polymeric pad is configured for at least one of cleaning, polishing, or scrubbing a surface of a semiconductor substrate.

[0079] Aspect 7. The device of any one of aspects 1 to 6, wherein the polymeric pad comprises a plurality of surface structures extending from the bottom surface of the polymeric pad.

[0080] Aspect 8. The device of aspect 7, wherein the plurality of surface structures are integral to the polymeric pad.

[0081] Aspect 9. The device of any one of aspects 1 to 8, wherein the polymeric pad comprises at least one of a flat bottom surface, a flat top surface, or any combination thereof.

[0082] Aspect 10. The device according to any one of aspects 1 to 9,

[0083] wherein the polymeric pad comprises a first polymeric material,

[0084] wherein the frame body comprises a second polymeric material,

[0085] Wherein the second polymeric material is different from the first polymeric material.

[0086] Aspect 11. A device according to aspect 10, wherein the first polymer material comprises at least one of polyvinyl alcohol, polysulfone, polyphenylene ether sulfone, polypolyaryl sulfone, nylon, polyamide, fluoropolymer, polytetrafluoroethylene (PTFE), polyethylene, polypropylene, cellulose, acetate, or any combination thereof.

[0087] Aspect 12. The device of aspect 10, wherein the second polymeric material comprises at least one of polypropylene, polyethylene, copolymers thereof, or any combination thereof.

[0088] Aspect 13. The device according to any one of aspects 1 to 12, wherein the polymeric pad has a disc shape.

[0089] Aspect 14. The device according to any one of aspects 1 to 13, wherein the frame body has a disc shape.

[0090] Aspect 15. The device according to any one of aspects 1 to 14, wherein the frame body includes a plurality of through holes in a surface of the frame body.

[0091] Aspect 16. The device according to any one of aspects 1 to 15, wherein the frame body and the coupling component are a single integral piece.

[0092] Aspect 17. The device according to any one of aspects 1 to 16, wherein the polymeric pad is integrally formed with the frame body.

[0093] Aspect 18. The device according to any one of aspects 1 to 17, wherein the diameter of the polymeric pad is 1 mm to 450 mm.

[0094] Aspect 19. The device according to any one of aspects 1 to 18, wherein the porosity of the polymeric mat is 50% to 99%.

[0095] Aspect 20. A method comprising:

[0096] Obtaining the apparatus according to any one of aspects 1 to 19; and

[0097] The apparatus is coupled to a device.

[0098] Aspect 21. The method according to aspect 20, wherein the coupling comprises clamping the device to a mandrel of the apparatus.

[0099] Aspect 22. The method according to any one of aspects 20 to 21, wherein the coupling comprises fastening the device to a spindle of the apparatus.

[0100] Aspect 23. The method according to any one of aspects 20 to 22, wherein the coupling comprises securing the device to a spindle of the apparatus via magnets.

[0101] Aspect 24. A method for forming a device, comprising:

[0102] Get the framework,

[0103] The framework includes:

[0104] a frame body including a plurality of through holes; and

[0105] a coupling member extending from an edge portion of the frame body;

[0106] placing at least the frame body in a mold;

[0107] obtaining polymeric materials;

[0108] placing the polymeric material in the mold; and

[0109] The polymeric material is cured sufficiently to form a device according to any one of aspects 1 to 17.

[0110] Aspect 25. The method according to aspect 24, further comprising heating the polymeric material to a temperature sufficient to obtain a flowable polymeric material.

[0111] Aspect 26. The method according to any one of aspects 24 to 25, wherein the solidifying comprises cooling the polymeric material to a temperature sufficient to solidify the polymeric material.

[0112] It should be understood that changes may be made in detail, particularly in the materials of construction employed and in the shape, size and arrangement of parts without departing from the scope of the present disclosure.The specification and described embodiments are examples, with the true scope and spirit of the disclosure being indicated by the appended claims.

Claims

1. A device comprising: a polymeric pad having a top surface and a bottom surface; Frame body, wherein at least a portion of said frame body extends between said top surface and said bottom surface of said polymeric mat; and A coupling member extends from at least a portion of the frame body.

2. The apparatus of claim 1, wherein the coupling means is configured to couple the apparatus to an appliance.

3. The device of claim 1, wherein the coupling member comprises a clamp configured to clamp the device to an apparatus.

4. The apparatus of claim 1, wherein the coupling member comprises a fastener configured to secure the apparatus to a device.

5. The device of claim 1, further comprising a magnet configured for coupling the device to an apparatus.

6. The device of claim 1, wherein the polymeric pad is configured for at least one of cleaning, polishing, or scrubbing a surface of a semiconductor substrate.

7. The apparatus of claim 1, wherein the polymeric pad comprises a plurality of surface structures extending from the bottom surface of the polymeric pad.

8. The device of claim 7, wherein the plurality of surface structures are integral to the polymeric pad.

9. The device of claim 1, wherein the polymeric pad comprises at least one of a flat bottom surface, a flat top surface, or any combination thereof.

10. The device according to claim 1, wherein the polymeric pad comprises a first polymeric material, wherein the frame body comprises a second polymeric material, Wherein the second polymeric material is different from the first polymeric material.

11. The device of claim 10, wherein the first polymeric material comprises at least one of polyvinyl alcohol, polysulfone, polyethersulfone, polypolyarylsulfone, nylon, polyamide, fluoropolymer, polytetrafluoroethylene (PTFE), polyethylene, polypropylene, cellulose, acetate, or any combination thereof.

12. The device of claim 10, wherein the second polymeric material comprises at least one of polypropylene, polyethylene, copolymers thereof, or any combination thereof.

13. The device of claim 1, wherein the polymeric pad has a disc shape.

14. The device according to claim 1, wherein the frame body has a disc shape.

15. The device of claim 1, wherein the frame body comprises a plurality of through holes in a surface of the frame body.

16. The device of claim 1, wherein the frame body and the coupling member are a single unitary structure.

17. The device of claim 1, wherein the polymeric pad is integrally formed with the frame body.

18. The device of claim 1, wherein the polymeric pad has a diameter of 1 mm to 450 mm.

19. The device of claim 1, wherein the porosity of the polymeric mat is 50% to 99%.

20. A method comprising: Obtaining a device according to any one of claims 1 to 17; and The apparatus is coupled to a device.

21. The method of claim 18, wherein the coupling comprises clamping the device to a mandrel of the apparatus.

22. The method of claim 18, wherein the coupling comprises securing the device to a mandrel of the apparatus.

23. The method of claim 18, wherein the coupling comprises securing the device to a spindle of the apparatus via magnets.

24. A method for forming a device, comprising: Get the framework, The framework includes: a frame body including a plurality of through holes; and a coupling member extending from an edge portion of the frame body; placing at least the frame body in a mold; obtaining polymeric materials; placing the polymeric material in the mold; and The polymeric material is cured sufficiently to form a device according to any one of claims 1-17.

25. The method of claim 22, further comprising heating the polymeric material to a temperature sufficient to obtain a flowable polymeric material.

26. The method of claim 22, wherein the curing comprises cooling the polymeric material to a temperature sufficient to cure the polymeric material.

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