Method, device and equipment for determining solidification deformation of winding structure

Abstract

The invention provides a method, a device and equipment for determining solidification deformation of a winding structure. The method comprises the following steps: acquiring geometric parameters of a target winding structure and a target barrel; obtaining first stress distribution of the target winding structure and the target cylinder and a first deformation degree of the target winding structure according to the analog simulation result of the winding state of the target winding structure on the target cylinder; according to the first stress distribution and the first deformation degree, analog simulation is conducted on the curing state of the target winding structure on the target barrel, and second stress distribution and a second deformation result of the cured target winding structure are obtained. According to the scheme, the curing deformation condition of the winding structure can be simulated.

Description

Technical Field

[0001] The invention relates to the technical field of filament winding, and in particular to a method, a device and equipment for determining curing deformation of a winding structure. Background Art

[0002] The basic principle of winding is to impregnate continuous fiber roving with resin glue under controlled tension and predetermined linear shape, and then continuously wind it on a thin-walled aluminum cylinder of corresponding size, and then cure it under heating conditions to make a product of a certain shape. The winding stage and curing stage in the winding process are the key links that affect the quality of the product. Whether the deformation of the product after curing meets the design requirements directly affects the life and reliability of the special equipment.

[0003] However, during the curing process of carbon fiber composite materials, residual stress and deformation will occur in the wound products due to the anisotropy of the thermal expansion coefficient of the composite materials, the chemical shrinkage of the matrix resin during the curing process, the uneven temperature field and asynchronous curing of the winding structure during the curing process, the mismatch of the thermal expansion of the metal lining and the composite materials, and the mutual constraints of each winding layer. These residual stresses will change the stress distribution state of the wound products and cause the products to deform. The determination of the traditional winding molding curing process system requires repeated experiments and explorations, with a long development cycle and high costs, wasting human and material resources, and unable to predetermine the curing deformation of the winding structure. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a method, device and equipment for determining the curing deformation of a winding structure, which can simulate the curing deformation of the winding structure.

[0005] In order to solve the above technical problems, the technical solution of the present invention is as follows:

[0006] A method for determining curing deformation of a winding structure, comprising:

[0007] Obtaining geometric parameters of the target winding structure and the target cylinder;

[0008] According to the simulation result of the winding state of the target winding structure on the target cylinder, a first stress distribution of the target winding structure and the target cylinder and a first deformation degree of the target winding structure are obtained;

[0009] According to the first stress distribution and the first deformation degree, the curing state of the target winding structure on the target cylinder is simulated to obtain a second stress distribution and a second deformation result of the target winding structure after curing.

[0010] Optionally, according to the simulation result of the winding state of the target winding structure on the target cylinder, a first stress distribution of the target winding structure and the target cylinder, and a first deformation degree of the target winding structure are obtained, including:

[0011] Determining a finite element model according to geometric parameters of the target winding structure and the target cylinder;

[0012] Determine the linear thermal expansion coefficient of the target winding structure, and obtain a target temperature difference through equal strain conversion, wherein the target temperature difference is a temperature difference equivalent to the winding tension inside the target winding structure;

[0013] According to the target temperature difference, the first stress distribution of the target winding structure and the target cylinder and the first deformation degree of the target winding structure are obtained through the equilibrium equation and the geometric equation of the target cylinder.

[0014] Optionally, according to the target temperature difference, the first stress distribution of the target winding structure and the target cylinder and the first deformation degree of the target winding structure are obtained through the equilibrium equation and the geometric equation of the target cylinder, including:

[0015] The target temperature difference is input into the equilibrium equation and the geometric equation of the target cylinder for processing, boundary conditions are determined, and the first stress distribution and the first deformation degree are obtained.

[0016] Optionally, according to the first stress distribution and the first deformation degree, a curing state of the target winding structure on the target cylinder is simulated to obtain a second stress distribution and a second deformation result of the target winding structure after curing, including:

[0017] determining a predefined field according to the first stress distribution and the first deformation degree;

[0018] The predefined field is used as an initial state, and a second stress distribution and a second deformation result of the target winding structure after being cured on the target cylinder are obtained through a preset curing deformation prediction model.

[0019] Optionally, obtaining a second stress distribution and a second deformation result of the target winding structure after being cured on the target cylinder by presetting a curing deformation prediction model includes:

[0020] Obtaining the heat generated inside the target winding structure through the heat conduction curing sub-model in the curing deformation prediction model;

[0021] Obtaining the thermal strain and shrinkage strain of the target winding structure through the non-mechanical strain sub-model in the curing deformation prediction model;

[0022] Obtaining a relaxation stiffness matrix of the target winding structure through a viscoelastic constitutive submodel in the curing deformation prediction model;

[0023] According to the heat, thermal strain, contraction strain and relaxation stiffness matrix generated inside the target winding structure, a second stress distribution and a second deformation result after curing are obtained.

[0024] Optionally, the heat conduction curing sub-model is: Among them, ρ, C p , T are the density, heat capacity and temperature of the target winding structure respectively; k x , k y , k z are the thermal conductivity coefficients of the target winding structure in three directions; Q is the heat generated inside the target winding structure.

[0025] Optionally, the integral solution of the viscoelastic constitutive submodel is: where σ i (t) is stress, C ij is the stiffness matrix, ξ t and ′ is the converted time, and ε(t′) is the strain.

[0026] The present invention also provides a winding structure curing deformation determination device, comprising:

[0027] An acquisition module, used for acquiring geometric parameters of a target winding structure and a target cylinder;

[0028] A processing module is used to obtain a first stress distribution of a target winding structure and a target cylinder, and a first deformation degree of the target winding structure according to a simulation result of a winding state of the target winding structure on a target cylinder; and simulate the curing state of the target winding structure on the target cylinder according to the first stress distribution and the first deformation degree to obtain a second stress distribution and a second deformation result of the target winding structure after curing.

[0029] The present invention also provides a computing device, comprising: a processor and a memory storing a computer program, wherein when the computer program is run by the processor, the method as described above is executed.

[0030] The present invention also provides a computer-readable storage medium storing instructions, which, when executed on a computer, causes the computer to execute the method as described above.

[0031] The above solution of the present invention includes at least the following beneficial effects:

[0032] The above scheme of the present invention can simulate the curing deformation of the winding structure by: obtaining the geometric parameters of the target winding structure and the target cylinder; obtaining the first stress distribution of the target winding structure and the target cylinder, and the first deformation degree of the target winding structure according to the simulation result of the winding state of the target winding structure on the target cylinder; simulating the curing state of the target winding structure on the target cylinder according to the first stress distribution and the first deformation degree, and obtaining the second stress distribution and the second deformation result of the target winding structure after curing. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a schematic flow chart of a method for determining curing deformation of a winding structure according to an embodiment of the present invention;

[0034] Figure 2 is a schematic diagram of a target cylinder according to an embodiment of the present invention;

[0035] Figure 3 is a numerical simulation flow chart of an embodiment of the present invention;

[0036] Figure 4 is a schematic diagram for comparing experimental data of an embodiment of the present invention;

[0037] Figure 5 It is a structural diagram of a device for determining curing deformation of a winding structure according to an embodiment of the present invention. DETAILED DESCRIPTION

[0038] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present invention and to enable the scope of the present invention to be fully communicated to those skilled in the art.

[0039] like Figure 1 As shown, an embodiment of the present invention provides a method for determining curing deformation of a winding structure, comprising:

[0040] Step 11, obtaining geometric parameters of the target winding structure and the target cylinder;

[0041] Here, the target winding structure is a carbon fiber composite material, and the target cylinder is a thin-walled aluminum cylinder;

[0042] Step 12, obtaining a first stress distribution of the target winding structure and the target cylinder, and a first deformation degree of the target winding structure according to a simulation result of a winding state of the target winding structure on the target cylinder;

[0043] Here, the simulation of the winding process is used to obtain the stress distribution of the target winding structure and the target cylinder under high tension winding conditions;

[0044] Step 13: simulating the curing state of the target winding structure on the target cylinder according to the first stress distribution and the first deformation degree, and obtaining a second stress distribution and a second deformation result of the target winding structure after curing.

[0045] Here, based on the calculation results of the winding process, the curing process is simulated and calculated according to the geometric parameters of the target cylinder, the ply parameters of the target winding structure, the property parameters of the target winding structure, the applied environmental variables and the programmed curing deformation prediction model to obtain the second stress distribution and the second deformation result of the target winding structure after curing.

[0046] In this embodiment, the winding stage and the curing stage of the target winding structure on the target cylinder are simulated respectively, which can not only obtain the prestress data of the winding structure layer by layer, but also effectively predict the prestress of the product after curing, and obtain the total deformation that comprehensively considers the influence of the winding process and the curing process, providing a more advanced means for the optimization of the molding process system.

[0047] In an optional embodiment of the present invention, step 12 may include:

[0048] Step 121, determining a finite element model according to geometric parameters of the target winding structure and the target cylinder;

[0049] Here, if Figure 2 As shown, a schematic diagram of the shape of the structural parts is established in the simulation environment for subsequent simulation.

[0050] Step 122, determining the linear thermal expansion coefficient of the target winding structure, and obtaining a target temperature difference through isostrain conversion, wherein the target temperature difference is a temperature difference equivalent to the winding tension inside the target winding structure;

[0051] Step 123, according to the target temperature difference, through the equilibrium equation and the geometric equation of the target cylinder, obtain the first stress distribution of the target winding structure and the target cylinder and the first deformation degree of the target winding structure.

[0052] Specifically, step 123 may include:

[0053] Step 1231, input the target temperature difference into the equilibrium equation and geometric equation of the target cylinder for processing, determine the boundary conditions, and obtain the first stress distribution and the first deformation degree.

[0054] In this embodiment, Figure 3As shown, the winding module uses the temperature parameter method and the life and death unit method to simulate the application of winding tension. The temperature parameter method is a method of structural limit analysis and stability analysis. It uses an elastic analysis program, adopts a linearized yield condition, and solves it through a linear programming method to achieve limit analysis and stability analysis. The life and death unit method is a simulation analysis technology or method, which can activate and kill certain units during the simulation analysis process. Through the temperature parameter method and the life and death unit method, the linear thermal expansion coefficient of each fiber layer is defined, and through equal strain conversion, the winding tension is equivalent to the temperature difference, and the temperature difference is used as the input load. The temperature difference is introduced into the equilibrium equation and geometric equation of the target cylinder, and the boundary conditions are introduced to obtain the target winding structure and the first stress distribution of the target cylinder and the first deformation degree of the target winding structure.

[0055] In an optional embodiment of the present invention, step 13 may include:

[0056] Step 131, determining a predefined field according to the first stress distribution and the first deformation degree;

[0057] Step 132, taking the predefined field as an initial state, and obtaining a second stress distribution and a second deformation result of the target winding structure after being cured on the target cylinder through a preset curing deformation prediction model.

[0058] In this embodiment, the first stress distribution and the first deformation degree simulated by the winding module are taken as the initial state, and the boundary conditions and temperature loads are added in the initial state. The second stress distribution and the second deformation result of the target winding structure after curing on the target cylinder are obtained by calculation through the preset curing deformation prediction model.

[0059] In an optional embodiment of the present invention, step 132 may include:

[0060] Step 1321, obtaining the heat generated inside the target winding structure through the heat conduction curing sub-model in the curing deformation prediction model;

[0061] Here, the heat conduction curing sub-model is: Among them, ρ, C p , T are the density, heat capacity and temperature of the target winding structure respectively; k x , k y , k z are the thermal conductivity coefficients of the target winding structure in three directions; Q is the heat generated inside the target winding structure.

[0062] According to the heat conduction curing sub-model, a heat conduction-curing analysis sub-program is written to define the heat generated inside the material. Where Q is generated by the heat released by resin curing, Where Q is the heat generated by the resin curing, ρr is the resin density, V f is the fiber volume fraction, H r is the total heat released by the curing reaction of unit mass of resin, is the curing rate, and its curing kinetic equation is:

[0063]

[0064] Among them, A1 and A2 are the frequency factors of the first-order reaction kinetic model, α is the degree of resin curing, E1 and E2 are the activation energy of the model, m1, m2, n1, n2 are the reaction orders of the model, R is the ideal gas constant, α is the curing degree of the resin, C0 , α CT is the resin curing degree constant, and D is the correlation factor.

[0065] Step 1322, obtaining the thermal strain and shrinkage strain of the target winding structure through the non-mechanical strain sub-model in the curing deformation prediction model;

[0066] Here, the thermal strain is caused by temperature change, and the shrinkage strain is caused by resin curing shrinkage. The non-mechanical strain sub-model is i=1,2,3, where For thermal strain, is the shrinkage strain. Since the target winding structure is a composite material, It can be expressed as:

[0067]

[0068] Among them, ΔT is the temperature change, α i is the equivalent thermal expansion coefficient of the composite material in three directions, α1, α2, α3 can be calculated by the following formula:

[0069]

[0070]

[0071] where α if is the thermal expansion coefficient of the fiber in the i direction, E if is the elastic modulus of the fiber in the i direction, V f is the fiber volume fraction, α m is the thermal expansion coefficient of the resin, E m is the elastic modulus of the resin, v 12f is the Poisson's ratio of the fiber in the 12 direction, v m is the Poisson's ratio of the resin.

[0072] The shrinkage strain It can be expressed as:

[0073]

[0074] where α ci is the chemical shrinkage coefficient of the composite material in three directions, and Δt is the time change.

[0075] Step 1323, obtaining a relaxation stiffness matrix of the target winding structure through a viscoelastic constitutive submodel in the curing deformation prediction model;

[0076] Here, a subroutine is written based on the viscoelastic constitutive submodel of the composite material of the target winding structure to obtain the three-dimensional composite material relaxation stiffness matrix at any time during the curing process. The integral solution of the viscoelastic constitutive submodel is: where σ i (t) is stress, C ij is the stiffness matrix, ξ t and ′ is the converted time, and ε(t′) is the strain.

[0077] The stress increment expression can be approximately written as:

[0078]

[0079] in, is the stress increment, is the stiffness matrix, is the strain increment, is the historical strain increment, where:

[0080]

[0081] S i,m is a historical state variable, the initial value is equal to zero and can be expressed by the following recursive equation:

[0082]

[0083] in is the historical state variable at time t, Δξ t is the reduced time variable, W m is the weight factor of the mth branch of the Maxwell model, τ m For relaxation time, is the stiffness matrix when the material is not relaxed, is the stiffness matrix when the material is completely relaxed, α T is the conversion factor.

[0084] Step 1324, obtaining a second stress distribution and a second deformation result after curing according to the heat, thermal strain, contraction strain and relaxation stiffness matrix generated inside the target winding structure.

[0085] Embodiment 1,

[0086] 1. Numerical calculation of winding process. Simulate the winding process with a constant tension of 120N. Calculate the temperature difference applied to the fiber layer through the fiber thermal expansion coefficient and fiber mechanical performance parameters, and use the birth and death unit method to perform winding layer by layer. Compare the calculated value with the test value. Figure 4 shown.

[0087] 2. Numerical calculation of the curing process. The stress-strain result file calculated in 1 is used as the predefined field input for this process calculation, and boundary conditions and temperature loads are applied. The edited subroutine file is submitted for calculation. The calculated deformation of the inner diameter during curing is 0.201 mm, and the test value is 0.200. The calculated value is consistent with the test value, and this method has good calculation accuracy.

[0088] The above method of the present invention can intuitively describe the process of applying prestress in fiber winding, and can obtain more accurate winding prestress field calculation results by using the temperature parameter method and the birth-death unit method. It can realize the whole process simulation calculation method from winding to curing, and can directly predict the stress and deformation state of the product after molding according to the designed molding process system, so that it can be corrected in time according to the predicted results before production, thereby improving the quality of the composite material components obtained in actual production.

[0089] like Figure 5 As shown, an embodiment of the present invention further provides a winding structure curing deformation determination device 50, comprising:

[0090] An acquisition module 51 is used to acquire geometric parameters of a target winding structure and a target cylinder;

[0091] The processing module 52 is used to obtain a first stress distribution of the target winding structure and the target cylinder, and a first deformation degree of the target winding structure according to the simulation results of the winding state of the target winding structure on the target cylinder; according to the first stress distribution and the first deformation degree, simulate the curing state of the target winding structure on the target cylinder to obtain a second stress distribution and a second deformation result of the target winding structure after curing.

[0092] Optionally, according to the simulation result of the winding state of the target winding structure on the target cylinder, a first stress distribution of the target winding structure and the target cylinder, and a first deformation degree of the target winding structure are obtained, including:

[0093] Determining a finite element model according to geometric parameters of the target winding structure and the target cylinder;

[0094] Determine the linear thermal expansion coefficient of the target winding structure, and obtain a target temperature difference through equal strain conversion, wherein the target temperature difference is a temperature difference equivalent to the winding tension inside the target winding structure;

[0095] According to the target temperature difference, the first stress distribution of the target winding structure and the target cylinder and the first deformation degree of the target winding structure are obtained through the equilibrium equation and the geometric equation of the target cylinder.

[0096] Optionally, according to the target temperature difference, the first stress distribution of the target winding structure and the target cylinder and the first deformation degree of the target winding structure are obtained through the equilibrium equation and the geometric equation of the target cylinder, including:

[0097] The target temperature difference is input into the equilibrium equation and the geometric equation of the target cylinder for processing, boundary conditions are determined, and the first stress distribution and the first deformation degree are obtained.

[0098] Optionally, according to the first stress distribution and the first deformation degree, a curing state of the target winding structure on the target cylinder is simulated to obtain a second stress distribution and a second deformation result of the target winding structure after curing, including:

[0099] determining a predefined field according to the first stress distribution and the first deformation degree;

[0100] The predefined field is used as an initial state, and a second stress distribution and a second deformation result of the target winding structure after being cured on the target cylinder are obtained through a preset curing deformation prediction model.

[0101] Optionally, obtaining a second stress distribution and a second deformation result of the target winding structure after being cured on the target cylinder by presetting a curing deformation prediction model includes:

[0102] Obtaining the heat generated inside the target winding structure through the heat conduction curing sub-model in the curing deformation prediction model;

[0103] Obtaining the thermal strain and shrinkage strain of the target winding structure through the non-mechanical strain sub-model in the curing deformation prediction model;

[0104] Obtaining a relaxation stiffness matrix of the target winding structure through a viscoelastic constitutive submodel in the curing deformation prediction model;

[0105] According to the heat, thermal strain, contraction strain and relaxation stiffness matrix generated inside the target winding structure, a second stress distribution and a second deformation result after curing are obtained.

[0106] Optionally, the heat conduction curing sub-model is: Among them, ρ, C p, T are the density, heat capacity and temperature of the target winding structure respectively; k x , k y , k z are the thermal conductivity coefficients of the target winding structure in three directions; Q is the heat generated inside the target winding structure.

[0107] Optionally, the integral solution of the viscoelastic constitutive submodel is: where σ i (t) is stress, C ij is the stiffness matrix, ξ t and ′ is the converted time, and ε(t′) is the strain.

[0108] It should be noted that the device is a device corresponding to the above method, and all implementation methods in the above method embodiments are applicable to the embodiments of the device and can achieve the same technical effects.

[0109] An embodiment of the present invention provides a computing device, comprising: a processor and a memory storing a computer program, wherein when the computer program is executed by the processor, the method described above is executed. All implementations in the above method embodiment are applicable to this embodiment and can achieve the same technical effect.

[0110] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0111] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0112] In the embodiments provided by the present invention, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0113] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0114] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0115] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, server, or network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: various media that can store program codes, such as USB flash drives, mobile hard disks, ROM, RAM, magnetic disks, or optical disks.

[0116] In addition, it should be noted that in the apparatus and method of the present invention, it is obvious that each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent schemes of the present invention. Moreover, the steps of performing the above-mentioned series of processing can naturally be performed in chronological order according to the order of description, but it is not necessary to perform them in chronological order, and some steps can be performed in parallel or independently of each other. For those of ordinary skill in the art, it is understood that all or any steps or components of the method and apparatus of the present invention can be implemented in any computing device (including processors, storage media, etc.) or a network of computing devices in hardware, firmware, software or a combination thereof, which can be achieved by those of ordinary skill in the art using their basic programming skills after reading the description of the present invention.

[0117] Therefore, the purpose of the present invention can also be achieved by running a program or a group of programs on any computing device. The computing device can be a well-known general device. Therefore, the purpose of the present invention can also be achieved by simply providing a program product containing a program code that implements the method or device. That is to say, such a program product also constitutes the present invention, and the storage medium storing such a program product also constitutes the present invention. Obviously, the storage medium can be any well-known storage medium or any storage medium developed in the future. It should also be pointed out that in the device and method of the present invention, it is obvious that each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent schemes of the present invention. In addition, the steps of performing the above-mentioned series of processing can naturally be performed in chronological order according to the order of description, but it is not necessary to perform them in chronological order. Some steps can be performed in parallel or independently of each other.

[0118] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for determining curing deformation of a winding structure, characterized in that: include: Obtaining geometric parameters of the target winding structure and the target cylinder; According to the simulation result of the winding state of the target winding structure on the target cylinder, a first stress distribution of the target winding structure and the target cylinder and a first deformation degree of the target winding structure are obtained; According to the first stress distribution and the first deformation degree, the curing state of the target winding structure on the target cylinder is simulated to obtain a second stress distribution and a second deformation result of the target winding structure after curing.

2. The method for determining curing deformation of a winding structure according to claim 1, characterized in that: According to the simulation result of the winding state of the target winding structure on the target cylinder, a first stress distribution of the target winding structure and the target cylinder, and a first deformation degree of the target winding structure are obtained, including: Determining a finite element model according to geometric parameters of the target winding structure and the target cylinder; Determine the linear thermal expansion coefficient of the target winding structure, and obtain a target temperature difference through equal strain conversion, wherein the target temperature difference is a temperature difference equivalent to the winding tension inside the target winding structure; According to the target temperature difference, the first stress distribution of the target winding structure and the target cylinder and the first deformation degree of the target winding structure are obtained through the equilibrium equation and the geometric equation of the target cylinder.

3. The method for determining curing deformation of a winding structure according to claim 2, characterized in that: According to the target temperature difference, the first stress distribution of the target winding structure and the target cylinder and the first deformation degree of the target winding structure are obtained through the equilibrium equation and the geometric equation of the target cylinder, including: The target temperature difference is input into the equilibrium equation and the geometric equation of the target cylinder for processing, boundary conditions are determined, and the first stress distribution and the first deformation degree are obtained.

4. The method for determining curing deformation of a winding structure according to claim 1, characterized in that: According to the first stress distribution and the first deformation degree, the curing state of the target winding structure on the target cylinder is simulated to obtain a second stress distribution and a second deformation result of the target winding structure after curing, including: determining a predefined field according to the first stress distribution and the first deformation degree; The predefined field is used as an initial state, and a second stress distribution and a second deformation result of the target winding structure after being cured on the target cylinder are obtained through a preset curing deformation prediction model.

5. The method for determining curing deformation of a winding structure according to claim 4, characterized in that: The second stress distribution and the second deformation result of the target winding structure after being cured on the target cylinder are obtained by presetting the curing deformation prediction model, including: Obtaining the heat generated inside the target winding structure through the heat conduction curing sub-model in the curing deformation prediction model; Obtaining the thermal strain and shrinkage strain of the target winding structure through the non-mechanical strain sub-model in the curing deformation prediction model; Obtaining a relaxation stiffness matrix of the target winding structure through a viscoelastic constitutive submodel in the curing deformation prediction model; According to the heat, thermal strain, contraction strain and relaxation stiffness matrix generated inside the target winding structure, a second stress distribution and a second deformation result after curing are obtained.

6. The method for determining curing deformation of a winding structure according to claim 5, characterized in that: The heat conduction curing sub-model is: Among them, ρ, C p , T are the density, heat capacity and temperature of the target winding structure respectively; k x , k y , k z are the thermal conductivity coefficients of the target winding structure in three directions; Q is the heat generated inside the target winding structure.

7. The method for determining curing deformation of a winding structure according to claim 5, characterized in that: The integral solution of the viscoelastic constitutive submodel is: where σ i (t) is stress, C ij is the stiffness matrix, ξ t and ′ is the converted time, and ε(t′) is the strain.

8. A device for determining curing deformation of a winding structure, characterized in that: include: An acquisition module, used for acquiring geometric parameters of a target winding structure and a target cylinder; A processing module, configured to obtain a first stress distribution of the target winding structure and the target cylinder, and a first deformation degree of the target winding structure according to a simulation result of a winding state of the target winding structure on the target cylinder; According to the first stress distribution and the first deformation degree, the curing state of the target winding structure on the target cylinder is simulated to obtain a second stress distribution and a second deformation result of the target winding structure after curing.

9. A computing device, characterized in that include: A processor and a memory storing a computer program, wherein when the computer program is executed by the processor, the method according to any one of claims 1 to 7 is performed.

10. A computer-readable storage medium, characterized in that: Instructions are stored, and when the instructions are executed on a computer, the computer is caused to execute the method according to any one of claims 1 to 7.

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