Open architecture tile integrated radio frequency receive array front end

Abstract

This invention discloses an open-architecture tile-type integrated radio frequency receiver front end. The front end includes an antenna module, a tile-type front-end receiver module, a frequency conversion module, a multi-functional feed board, an integrated digital module, and a power supply module. The antenna module receives spatial electromagnetic signals; the front-end receiver module amplifies the spatial electromagnetic signals received by the antenna, performs subarray-level signal synthesis, and performs amplitude and phase modulation of analog signals; the frequency conversion module converts broadband radio frequency signals into intermediate frequency signals; the multi-functional feed board provides a connection interface for analog and digital signals; the integrated digital module converts analog and radio frequency signals into digital signals, generates a high-speed data stream, and performs unified control of array amplitude and phase frequency conversion; the power supply module provides power supply and power management for each functional module. This invention has the advantages of integrated structure, open architecture, functional reconfigurability, lightweight structure, and broadband reception, and can meet the functional requirements of radar, electronic warfare, and communication.

Description

Technical Field

[0001] This invention relates to the field of system design technology for phased array surfaces, and in particular to an open-architecture, integrated radio frequency receiver front end. Background Technology

[0002] In modern warfare, mastering electromagnetic information is crucial to victory. Faced with complex operational environments, shipborne platforms require robust electromagnetic reception capabilities. Traditional shipborne radio frequency receivers employ numerous receiving channels with varying functions, leading to a continuous increase in antenna equipment in the superstructure. This results in mutual interference between various systems, necessitating additional electromagnetic compatibility design and significantly impacting the ship's electromagnetic stealth capabilities, making it difficult to meet future operational demands.

[0003] Patent CN113938146A discloses a Ka-band highly integrated ultra-low noise tile-type receiver component, which uses a method of assembling a monitoring network and receiving channels inside the component housing to achieve a tile-type highly integrated design for the Ka band. However, the interface inside the component is not open, and it can only be applied to a certain model of product. Patent CN115688210A discloses a tile-type multi-channel transceiver subarray design method, which combines the antenna and transceiver components to form a transceiver subarray, improving the system integration and reducing the array height. However, the subarray integration only extends to the analog channel part, requiring the cooperation of back-end digital power supply and other modules, and still cannot achieve complete independent subarray function.

[0004] To solve the above problems, there is an urgent need for an integrated receiving array that is compatible with radar, electronic warfare, and communication functions, and to implement functional control and unified resource scheduling. Summary of the Invention

[0005] The purpose of this invention is to provide an open architecture for a Watt-type integrated radio frequency receiver front end that is open in architecture, reconfigurable in function, compatible with multiple functional applications, and highly scalable.

[0006] The technical solution to achieve the purpose of this invention is: an open architecture Watt-type integrated radio frequency receiver front end, including an antenna module, a front-end receiver module, a frequency conversion module, a multi-functional feed board, an integrated digital module and a power supply module;

[0007] The antenna module is used to provide matching of spatial electromagnetic and radio frequency transmission channels and to periodically monitor the amplitude and phase changes of each channel of the array.

[0008] The front-end receiving module is used to amplify the spatial electromagnetic signals received by the antenna, perform subarray-level signal synthesis, and perform amplitude and phase modulation of the analog signal according to the beam direction to enhance the signal reception strength in a certain direction in space.

[0009] The frequency conversion module is used to mix, filter, and amplify the broadband radio frequency signal to convert it into an intermediate frequency signal and suppress additional spurious signals.

[0010] The multi-functional power supply board is used to provide a connection interface for analog and digital signals, and to provide connection control signals and power supply in the forward direction.

[0011] The integrated digital module is used to convert analog and radio frequency signals into digital signals, generate high-speed data streams based on input signals for back-end processing, and provide unified control functions for array amplitude and phase conversion.

[0012] The power module uses a high-frequency oscillating switching power supply to convert the input high-voltage signal into various low-voltage power supplies for output, providing power supply and power management for each functional module.

[0013] Furthermore, the antenna module includes an antenna element, an internal monitoring unit, and a comprehensive cabling layer;

[0014] The antenna element is used for matching the space electromagnetic and radio frequency transmission channels; the antenna element adopts a low-profile broadband antenna, including tightly coupled cross-shaped printed antenna, Vilvadi antenna, butterfly dipole antenna and open slot antenna, to achieve broadband reception;

[0015] The internal monitoring unit synthesizes the coupled signals of each array element into an internal monitoring signal, which is then uniformly fed into the internal monitoring transceiver module at the back end of the internal monitoring unit to periodically monitor the amplitude and phase changes of each channel of the array.

[0016] The integrated cabling layer connects the receiving RF channel and the antenna module port, maintaining phase consistency for each channel;

[0017] The internal monitoring unit and integrated cabling layer are implemented using embedded traces on a multi-layer RF printed circuit board, and are designed as an integrated unit with the antenna module.

[0018] Furthermore, the front-end receiving module adopts a silicon-based packaged microsystem approach to realize the arrangement of the antenna subarray apertures, as detailed below:

[0019] A silicon-based adapter board is used to package the front-end limiting amplifier chip, multi-channel amplitude and phase modulation chip, and combining chip into a surface-mount self-sealing device. The chip is arranged in a height-based manner by stacking and soldering inside the package. The silicon-based packaged microsystem module is then surface-mounted and soldered to the front-end carrier board in a tile-type architecture with the interface facing forward and exiting backward.

[0020] Furthermore, the frequency converter module is packaged in an independent box, or the core functional chip is first packaged in a ceramic micro-package and then packaged in a box to improve the integration; the frequency converter module can integrate channel delay and input switch combination switching functions.

[0021] Furthermore, the multi-functional power supply board uses a multi-layer printed circuit board with micro-interconnect elastic connection for signal distribution. Different functional signal networks are arranged in layers inside the printed circuit board to realize the interconnection of various complex signals.

[0022] Furthermore, the integrated digital module is composed of digital, analog, and optoelectronic devices, including AD chips, FPGA chips, photoelectric conversion chips, and power management chips, and adopts a SOC chip that integrates AD and FPGA computing cores. According to the application requirements of different functions and different payload platforms, the integrated digital module can independently control the operation of subarrays to generate pointing information of targets in specific azimuths, and can also work in coordination among multiple subarrays or the entire array to achieve flexible configuration of array aperture resources.

[0023] Furthermore, the front end of the tile-type integrated RF receiver array adopts a multi-level interface and a tile-type hierarchical connection design. The modules use a universal interface and employ digital preprocessing, receiver dynamic expansion, array RF cancellation, and distributed preprocessing between different subarrays to achieve an open architecture and functional reconfigurability. Each module has an independent functional interface, and the interface definitions are allocated according to power supply, RF, and low-frequency control. Contact-type flexible connectors are used. When each module is used separately, it independently implements its own function. When upgrading technology or replacing modules, each module is upgraded according to the interface.

[0024] Furthermore, the front end of the Watt-type integrated RF receiver array adopts microsystem integration and RF integrated wiring to reduce the size of the front end of the Watt-type integrated RF receiver array; the front end of the Watt-type receiver array adopts a universal architecture, and the array expansion design is carried out according to different load platforms and array sizes to splice together receiver arrays of different sizes.

[0025] Furthermore, the front end of the Watt-type integrated radio frequency receiver array adopts a stacked design. Based on a low-profile conformal antenna, the back-end receiver structure is designed to conform to the surface of the mounting platform.

[0026] Furthermore, the front end of the tile-type integrated radio frequency receiver array adopts an AD chip that meets the requirements for dynamics and sampling rate, covering the working bandwidth of multiple functions, including reconnaissance function, narrowband communication reception function, and can also cooperate with distributed radar to perform various forms of space beam switching.

[0027] Compared with the prior art, the significant advantages of this invention are: (1) It has an open architecture, with the signal flow going forward and backward, clear hierarchical functions, and each function is implemented independently. Modules with the same interface can be replaced independently, and the architecture is open; (2) It has functional reconfigurability, with the front end of the array covering the working frequency and bandwidth of multiple functions, high receiving dynamics, and compatibility with radar, electronic warfare, communication and other functional applications. It can switch working modes at any time in conjunction with the system; (3) It has scalability, with the front end of the receiving array having a planar size smaller than the splicing size of the antenna. The array can be designed to be scalable according to different load platforms and array sizes, and can be arbitrarily spliced ​​to form receiving arrays of different sizes. Attached Figure Description

[0028] Figure 1 This is a schematic diagram showing the design breakdown of the present invention.

[0029] Figure 2 This is a structural block diagram of the front end of a Watt-type integrated radio frequency receiver array with an open architecture according to the present invention.

[0030] Figure 3 This is a schematic diagram of the front end of the open architecture integrated radio frequency receiver array provided in the embodiment.

[0031] Figure 4 This is a schematic diagram of the structure of the front-end receiving module and the frequency conversion module in an embodiment of the present invention.

[0032] Figure 5 This is a schematic diagram illustrating the principle of the extended array in an embodiment of the present invention.

[0033] Figure 6 This is a schematic diagram of the structure of the tile-type receiver front-end extension splicing in an embodiment of the present invention. Detailed Implementation

[0034] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0035] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0036] Combination Figures 1-3The present invention discloses an open-architecture integrated radio frequency receiver front end, which specifically includes the following parts:

[0037] S1. Components: The front end of a tile-architecture integrated radio frequency receiver array mainly includes an antenna module, a front-end receiver module, a frequency conversion module, a multi-functional feed board, an integrated digital module, and a power supply module.

[0038] S2. Working Mechanism: A tile-architecture integrated RF receiver front-end primarily functions to receive electromagnetic signals radiated from space. After analog processing including limiting amplification, amplitude and phase modulation, subarray synthesis, and frequency conversion, the signal enters the AD sampling digital channel for digital preprocessing to generate a high-speed data stream. The data stream contains basic information such as the frequency, amplitude, and phase of the complete spatial electromagnetic signal. Using this as input, various calculations can be performed to obtain spatial electromagnetic sensing information such as signal directionality, modulation information, and target echo characteristics.

[0039] To simultaneously support radar, electronic warfare, and communication functions and provide an integrated universal receiving platform, the analog channel from the electromagnetic signal to the digital sampling end must be designed with as much bandwidth as possible to cover the working bandwidth of multiple functions. The digital receiver uses a high dynamic range, high sampling rate AD chip to improve resolution in complex electromagnetic environments.

[0040] S3, Architecture Design:

[0041] The tile-architecture integrated RF receiver front end is designed in layers according to the signal flow direction in the signal transmission direction, which is spatial radiation. It includes an antenna module, a receiver front end module, a frequency conversion module, a multi-functional feed board, an integrated digital module, and fiber optic output. The multi-functional feed board provides a connection interface for analog and digital signals, and provides auxiliary resources such as connection control signals and power supply in the forward direction.

[0042] S4. Antenna Module: The module's function is further broken down into antenna elements, internal monitoring units, and a structured cabling layer. The antenna elements provide matching for the spatial electromagnetic and RF transmission channels. Various implementation methods exist for broadband receiving antennas, including tightly coupled cross-shaped printed antennas, Vilvadi antennas, butterfly antennas, and slotted antennas. The internal monitoring unit primarily provides additional coupling signals for each array element. The monitoring signals within the array are synthesized and uniformly fed into the backend internal monitoring transceiver module, which can periodically monitor the amplitude and phase changes of each channel. The structured cabling layer mainly matches the connections between the receiving RF channels and the antenna module ports; the design must maintain phase consistency for each channel. The internal monitoring unit and the structured cabling layer are implemented using embedded traces on a multi-layer RF printed circuit board, allowing for integrated design with the antenna elements.

[0043] S5. Front-end Receiving Module: Its main function is to further amplify the spatial electromagnetic signals received by the antenna. It employs subarray-level signal synthesis and performs amplitude and phase modulation of the analog signal according to the beam direction to enhance the signal reception strength in a specific spatial direction. To achieve the arrangement of the antenna subarray apertures, a microsystem integration design is adopted. Specifically, a silicon-based adapter board is used to package the front-end limiting amplifier chip, multi-channel amplitude and phase modulation chip, and combining chip into a small-sized, self-sealed surface-mount device. To improve packaging efficiency, the chips can be further arranged using a stacked soldering method within the package, utilizing height. The silicon-based packaged microsystem module is surface-mount soldered to the front-end carrier board, following a tile-type architecture with the interface facing forward and exiting backward.

[0044] S6, Frequency Conversion Module: Its main function is to convert broadband radio frequency signals into lower intermediate frequency signals through mixing, filtering, and amplification. To preserve the integrity of radio frequency information, the frequency conversion system must have high dynamic range and suppress additional spurious signals generated during frequency conversion. To further coordinate with the array operation, functions such as channel delay and input switch combination switching can be further integrated. Implementation requires chips with multiple functions such as mixing, filtering, amplification, and switching. Due to the large number of internal functional chips and complex interconnections, it can be implemented using independent enclosure packaging or ceramic micro-packaging technology to encapsulate the core functional chips, followed by secondary enclosure packaging to improve integration.

[0045] S7, Multifunctional Power Feeder Board: Its main function is to provide a connection interface for analog and digital signals, and to provide forward connection control signals, power supply and other auxiliary resources. To achieve interconnection of various complex signals within a limited space, it mainly adopts a multi-layer printed circuit board with micro-interconnection for flexible signal distribution. Different functional signal networks are arranged in layers inside the printed circuit board.

[0046] S8, Integrated Digital Module: Its main function is to convert analog and radio frequency signals into digital signals, generate high-speed data streams based on input signals, provide backend computing data, and also provide unified control functions for array amplitude and phase frequency conversion control. In terms of implementation, it mainly consists of digital, analog, and optoelectronic devices such as AD chips, FPGA chips, photoelectric conversion chips, and power management chips. Further, it can utilize a SOC chip integrating AD and FPGA computing cores. The integrated digital module can independently control subarray operation to generate pointing information for specific targets, or it can enable multiple subarrays or the entire array to work collaboratively, achieving flexible configuration of array aperture resources, depending on the application requirements of different functions and payload platforms.

[0047] S9, Power Supply Module: Its main function is to convert the input high-voltage signal into various low-voltage power outputs, providing power supply and power management for each functional module of the subarray, and receiving control signals from the integrated digital module. It employs a high-frequency oscillating switching power supply to improve voltage conversion efficiency and minimize heat dissipation.

[0048] Furthermore, the open-architecture tile-type integrated RF receiver front end adopts a hierarchical design, proceeding forward and backward according to signal flow. The hierarchical functions are clearly defined: the antenna module handles the spatial electromagnetic interface, the front-end receiver module handles amplitude and phase modulation, the frequency conversion module handles RF-to-IF conversion, the integrated digital module handles digital preprocessing and beam control, and the power supply module provides high-to-low voltage conversion. Each module has an independent functional interface, defined according to power supply, RF, and low-frequency control, and implemented using contact-type flexible connectors. If each module is used separately, it can independently perform its respective function. For technology upgrades or module replacements, individual modules can be upgraded according to their interfaces without replacing the entire RF front end.

[0049] Furthermore, the tile-type integrated RF receiver front end employs microsystem integration technology and RF integrated wiring technology, resulting in a significantly reduced size. The planar dimensions of the entire receiver front end are smaller than the antenna splicing dimensions. Therefore, the array can be scalable according to different payload platforms and array sizes. As a universal architecture, the tile-type receiver front end can be arbitrarily spliced ​​to form receiver arrays of different sizes.

[0050] Furthermore, due to its layered design, the tile-type architecture can further employ low-profile conformal antennas and finely design the back-end receiver structure layout to achieve conformal design with the surface of the mounting platform, thereby improving the platform's stealth performance.

[0051] Furthermore, the tile-type integrated RF receiver front-end architecture covers the operating bandwidth of multiple functions and employs a high-dynamic, high-sampling-rate AD chip. It can satisfy the wide-frequency, wide-space coverage and instantaneous broadband reception requirements for reconnaissance functions, while also providing high-dynamic, high-distortion, narrow-bandwidth communication reception capabilities. Simultaneously, it can cooperate with distributed radar for various forms of spatial beam switching. It is compatible with radar, electronic warfare, and communication applications, providing an integrated, reconfigurable receiver platform.

[0052] The front-end expansion and splicing method of tile-type integrated radio frequency receiver array is as follows: Figure 5 , Figure 6 As shown, the use of microsystem integration technology and radio frequency integrated wiring technology greatly reduces the size. The planar size of the entire front end of the receiving array is smaller than the splicing size of the antenna. Therefore, the array can be scalable according to different load platforms and array sizes. The tile-type integrated radio frequency receiving array front end is a universal architecture that can be arbitrarily spliced ​​to form receiving arrays of different sizes.

[0053] In terms of planar dimensions, the subarray antenna dimensions are calculated based on the phased array surface:

[0054]

[0055] The antenna subarray dimensions are:

[0056]

[0057] in, The spacing between array elements; The wavelength of the highest operating frequency; The scanning angle; The number of elements in the subarray horizontal antenna array; The number of vertical antenna array elements in the subarray.

[0058] The planar dimensions of all functional modules of the receiving front-end subarray are constrained within Within the range, and using front and rear tile splicing to form the receiving front subarray. Depending on the size of the array of the adapted platform, the receiving front subarray can be two-dimensionally expanded into a receiving array with any multiple of subarray elements.

[0059] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0060] Example

[0061] This embodiment provides a tile-architecture integrated RF receiver front end, which mainly includes an antenna module, a front-end receiver module, a frequency conversion module, a multi-functional feed board, an integrated digital module, a power supply module, etc.

[0062] In terms of design, the schematic diagram decomposed from functional applications is as follows: Figure 1 As shown, the front-end architecture of the tile-type integrated radio frequency receiver array is designed to meet the functional applications of radar, electronic warfare, and communications, providing an integrated and reconfigurable receiving platform. The design adopts an open architecture, featuring functional reconfigurability, a lightweight structure, and wideband reception.

[0063] In terms of implementation, to achieve full spatial coverage of broadband reception, and to cooperate with the system, multi-beam, analog-digital beamforming, and fully polarized receiving channels are used; to achieve lightweight design, various miniaturized components such as low-profile broadband antennas, RF microsystem integration, and digital SOC integration are adopted; to achieve open architecture and functional reconfigurability, the design adopts multi-level interfaces, tile-type hierarchical connection design, and universal interfaces between modules, giving full play to digital preprocessing technology, receiver dynamic expansion, array RF cancellation, and distributed preprocessing technology between different subarrays.

[0064] Working principle block diagram, such as Figure 2As shown, the signal flow is as follows: space radiation, antenna module, receiving front-end module, frequency conversion module, multi-functional feeder board, integrated digital module, and fiber optic output. The multi-functional feeder board provides the interface for connecting analog and digital signals, and forward-facing auxiliary resources such as connection control signals and power supply. Its main function is to receive electromagnetic signals radiated from space, and after analog processing such as limiting amplification, amplitude and phase modulation, subarray synthesis, and frequency conversion, the signals enter the AD sampling digital channel for digital preprocessing to generate a high-speed data stream. The data stream contains basic information such as the frequency, amplitude, and phase of the complete space electromagnetic signal. The receiving front-end covers multiple functional operating frequencies and bandwidths, employing a high-dynamic, high-sampling-rate AD chip. It can satisfy the wide-frequency, wide-spatial coverage and instantaneous wide-bandwidth reception requirements for reconnaissance functions, and also provide high-dynamic, high-distortion, low-distortion narrow-bandwidth communication reception functions. Simultaneously, it can cooperate with distributed radar for various forms of space beam switching.

[0065] A three-dimensional structure diagram of the front-end subarray of the tile-type integrated radio frequency receiver array is shown below. Figure 3 As shown. The channel section includes a 3D structural diagram of the receiving front-end module and the frequency conversion module, as shown below. Figure 4 As shown, the open architecture of the Watt-type integrated RF receiver front end adopts a hierarchical design, with signals flowing forward and backward. The hierarchical functions are clearly defined: the antenna module is responsible for receiving spatial electromagnetic signals, the front-end receiver module is responsible for amplitude and phase modulation, the frequency conversion module is responsible for RF to IF conversion, the integrated digital module is responsible for digital preprocessing and beam control, and the power supply module provides high-to-low voltage conversion. Each module has an independent functional interface, with interface definitions assigned according to power supply, RF, and low-frequency control, and implemented using contact-type flexible connectors. If each module is used separately, it can independently achieve its own function. For technology upgrades or module replacements, each module can be upgraded according to its interface, without replacing the entire RF front end.

[0066] The antenna module's functionality is further broken down into antenna elements, an internal monitoring unit, and a structured cabling layer. The antenna elements provide matching for the spatial electromagnetic and radio frequency transmission channels. Various implementation methods exist for broadband receiving antennas, including tightly coupled cross-shaped printed antennas, Vilvadi antennas, butterfly antennas, and slotted antennas. The internal monitoring unit primarily provides additional coupling signals for each array element. The monitoring signals within the array are synthesized and then uniformly fed into the backend internal monitoring transceiver module, which can periodically monitor the amplitude and phase changes of each channel. The structured cabling layer mainly matches the connections between the receiving radio frequency channels and the antenna module ports; the design must maintain phase consistency for each channel. The internal monitoring unit and the structured cabling layer are implemented using embedded traces on a multi-layer radio frequency printed circuit board, allowing for integrated design with the antenna elements.

[0067] The main function of the receiving front-end module is to further amplify the spatial electromagnetic signals received by the antenna. It employs subarray-level signal synthesis and performs amplitude and phase modulation of the analog signal according to the beam direction to enhance the signal reception strength in a specific spatial direction. To achieve the arrangement of the antenna subarray apertures, a microsystem integration design is used. Specifically, a silicon-based adapter board is used to package the front-end limiting amplifier chip, multi-channel amplitude and phase modulation chip, and combining chip into a small-sized, self-sealed surface-mount device. To improve packaging efficiency, the chips can be further arranged using a stacking and soldering method within the package, utilizing height. The silicon-based packaged microsystem module is surface-mount soldered to the front-end carrier board, following a tile-type architecture with the interface facing forward and exiting backward.

[0068] The main function of a frequency converter module is to convert broadband radio frequency signals into lower intermediate frequency signals through mixing, filtering, and amplification. To preserve the integrity of the radio frequency information, the frequency converter system must have high dynamic range and suppress additional spurious signals generated during the frequency conversion process. To further coordinate with the array operation, functions such as channel delay and input switch combination switching can be further integrated. Implementation requires chips with multiple functions such as mixing, filtering, amplification, and switching. Due to the large number of internal functional chips and complex interconnections, implementation can employ independent enclosure packaging or ceramic micro-packaging technology to encapsulate the core functional chips, followed by secondary enclosure packaging to improve integration.

[0069] The main function of the multi-functional power supply board is to provide a connection interface for analog and digital signals, and to provide forward connection control signals, power supply and other auxiliary resources. To achieve the interconnection of various complex signals within a limited space, the implementation mainly adopts a multi-layer printed circuit board with micro-interconnection flexible connection to achieve signal distribution. Different functional signal networks are arranged in layers inside the printed circuit board.

[0070] The main function of the integrated digital module is to convert analog and radio frequency signals into digital signals, generate high-speed data streams based on input signals, provide backend computing data, and also provide unified control functions for array amplitude and phase frequency conversion control. In terms of implementation, it mainly consists of digital, analog, and optoelectronic devices such as AD chips, FPGA chips, photoelectric conversion chips, and power management chips. Further, a SOC chip integrating AD and FPGA computing cores can be used. The integrated digital module can independently control subarrays to generate pointing information for targets in specific azimuths, or multiple subarrays or the entire array can work collaboratively, achieving flexible configuration of array aperture resources, depending on the application requirements of different functions and payload platforms.

[0071] Power Supply Section: Its main function is to convert the input high-voltage signal into various low-voltage power outputs, providing power supply and power management for each functional module of the subarray, and receiving control signals from the integrated digital module. It employs a high-frequency oscillating switching power supply to improve voltage conversion efficiency and minimize heat dissipation of the power supply module.

[0072] Three-dimensional diagram of front-end expansion and splicing of tile-type integrated radio frequency receiver array as shown below Figure 6 As shown, the use of microsystem integration technology and RF integrated wiring technology significantly reduces the size; the planar dimension of the entire receiver array front end is smaller than the antenna splicing size. Therefore, the array can be scalable according to different payload platforms and array sizes. The tile-type integrated RF receiver array front end, as a universal architecture, can be arbitrarily spliced ​​to form receiver arrays of different sizes.

[0073] The above are merely preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A front end of an open-architecture integrated radio frequency receiver array, characterized in that, It includes an antenna module, a front-end receiving module, a frequency conversion module, a multi-functional feeder board, an integrated digital module, and a power supply module, all of which are connected in a tile-like hierarchical design. The antenna module is used to provide matching of spatial electromagnetic and radio frequency transmission channels and to periodically monitor the amplitude and phase changes of each channel of the array. The front-end receiving module is used to amplify the spatial electromagnetic signals received by the antenna, perform subarray-level signal synthesis, and perform amplitude and phase modulation of the analog signal according to the beam direction to enhance the signal reception strength in a certain direction in space. The frequency conversion module is used to mix, filter, and amplify the broadband radio frequency signal to convert it into an intermediate frequency signal and suppress additional spurious signals. The multi-functional power supply board is used to provide a connection interface for analog and digital signals, and to provide connection control signals and power supply in the forward direction. The integrated digital module is used to convert analog and radio frequency signals into digital signals, generate high-speed data streams based on input signals for back-end processing, and provide unified control functions for array amplitude and phase conversion. The power module uses a high-frequency oscillating switching power supply to convert the input high-voltage signal into various low-voltage power supplies for output, providing power supply and power management for each functional module. The antenna module includes an antenna unit, an internal monitoring unit, and a comprehensive cabling layer; The antenna element is used for matching the space electromagnetic and radio frequency transmission channels; the antenna element adopts a low-profile broadband antenna, including tightly coupled cross-shaped printed antenna, Vilvadi antenna, butterfly dipole antenna and open slot antenna, to achieve broadband reception; The internal monitoring unit synthesizes the coupled signals of each array element into an internal monitoring signal, which is then uniformly fed into the internal monitoring transceiver module at the back end of the internal monitoring unit to periodically monitor the amplitude and phase changes of each channel of the array. The integrated cabling layer connects the receiving RF channel and the antenna module port, maintaining phase consistency for each channel; The internal monitoring unit and integrated cabling layer are implemented using embedded traces on a multi-layer RF printed circuit board, and are integrated with the antenna unit. The front-end receiving module adopts a silicon-based packaged microsystem approach, as detailed below: A silicon-based adapter board is used to package the front-end limiting amplifier chip, multi-channel amplitude and phase modulation chip, and combining chip into a surface-mount self-sealing device. The chip is arranged in a height-based manner by stacking and soldering inside the package. The silicon-based packaged microsystem module is then surface-mounted and soldered to the front-end carrier board in a tile-type architecture with the interface facing forward and exiting backward.

2. The front end of the open architecture integrated radio frequency receiver array according to claim 1, characterized in that, The frequency converter module is packaged in an independent box, or the core functional chip is first packaged in a ceramic micro-package and then packaged in a box to improve the integration. The frequency converter module can integrate channel delay and input switch combination switching functions.

3. The front end of the open architecture integrated radio frequency receiver array according to claim 1, characterized in that, The multi-functional power supply board uses a multi-layer printed circuit board with micro-interconnect elastic connection for signal distribution. Different functional signal networks are arranged in layers inside the printed circuit board to realize the interconnection of various complex signals.

4. The front end of the open architecture integrated radio frequency receiver array according to claim 1, characterized in that, The integrated digital module is composed of digital, analog, and optoelectronic devices, including AD chips, FPGA chips, photoelectric conversion chips, and power management chips. It adopts a SOC chip that integrates AD and FPGA computing cores. According to the application requirements of different functions and different payload platforms, the integrated digital module can independently control the operation of subarrays to generate pointing information of targets in specific directions, and can also work in coordination among multiple subarrays or the entire array to achieve flexible configuration of array aperture resources.

5. The front end of the open architecture integrated radio frequency receiver array according to claim 1, characterized in that, The front end of the Watt-type integrated RF receiver array adopts microsystem integration and RF integrated cabling to reduce the size of the front end of the Watt-type integrated RF receiver array. The front end of the Watt-type integrated RF receiver array adopts a generalized architecture, and the array expansion design is carried out according to different payload platforms and array sizes to splice together receiver arrays of different sizes.

6. The front end of the open architecture integrated radio frequency receiver array according to claim 1, characterized in that, The front end of the Watt-type integrated radio frequency receiver array adopts a stacked design. Based on a low-profile conformal antenna, the back-end receiver structure is designed to conform to the surface of the mounting platform.

7. The front end of the open architecture integrated radio frequency receiver array according to claim 1, characterized in that, The front end of the Watt-type integrated radio frequency receiver array uses an AD chip that meets the requirements for dynamic range and sampling rate, covering the working bandwidth of multiple functions, and has both reconnaissance function and narrowband communication reception function.

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