Cleaning nozzle, cleaning apparatus, and method for manufacturing semiconductor element

Abstract

The invention provides a cleaning nozzle, a cleaning apparatus, and a method for manufacturing a semiconductor element, wherein the amount of scattered gas emitted by the cleaning nozzle is smaller than that of the prior art. The cleaning nozzle is provided with: a mixed-phase fluid nozzle that ejects a mixed-phase fluid containing a gas containing water molecules and a liquid containing water molecules from a mixed-phase fluid nozzle ejection port; and an outer peripheral nozzle that ejects a liquid and has an outer peripheral nozzle ejection port that surrounds the mixed-phase fluid nozzle ejection port. Therefore, the washing nozzle which enables the flying amount of the emitted gas to be smaller than that of the prior art can be obtained. In addition, the method for manufacturing the semiconductor element includes: a mounting step of mounting the semiconductor substrate on a stage; and a cleaning step of cleaning the ground surface of the semiconductor substrate through the cleaning nozzle. Therefore, a semiconductor element can be obtained by reducing the scattering amount of the emitted gas than in the prior art.

Description

Technical Field

[0001] The present disclosure relates to a cleaning nozzle that emits a gas containing water molecules and a method for manufacturing a semiconductor element. Background Art

[0002] Conventionally, there is disclosed an object cleaning system that sprays a mixed phase fluid of water vapor and water onto the surface of an object (for example, Patent Document 1).

[0003] Patent Document 1: Japanese Patent Application Publication No. 2010-141251

[0004] However, in the prior art, there is a problem that the gas containing water molecules ejected from the cleaning nozzle scatters after cleaning the cleaning object. Summary of the invention

[0005] The present disclosure has been made to solve the above-mentioned problems, and an object of the present disclosure is to provide a cleaning nozzle and a cleaning device in which the amount of scattered gas containing water molecules is smaller than that of conventional cleaning devices, and a method for manufacturing a semiconductor element using the cleaning device.

[0006] The cleaning nozzle disclosed in the present invention comprises: a mixed-phase fluid nozzle, which ejects a mixed-phase fluid from a mixed-phase fluid nozzle ejection port, wherein the mixed-phase fluid comprises a gas containing water molecules and a liquid containing water molecules; and a peripheral nozzle, which ejects liquid and has a peripheral nozzle ejection port surrounding the mixed-phase fluid nozzle ejection port.

[0007] In addition, the cleaning nozzle disclosed in the present invention comprises: a mixed-phase fluid nozzle, which ejects a mixed-phase fluid from a mixed-phase fluid nozzle ejection port, wherein the mixed-phase fluid includes a gas containing water molecules and a liquid containing water molecules; and a peripheral nozzle, which ejects liquid, and has a wall portion arranged in a manner to surround the mixed-phase fluid nozzle, a connecting portion connecting an end portion of the wall portion on a side opposite to the ejection direction of the mixed-phase fluid to the mixed-phase fluid nozzle, and a peripheral nozzle ejection port arranged on the wall portion and located at an end portion of the wall portion on a side of the ejection direction of the mixed-phase fluid.

[0008] In addition, the cleaning nozzle disclosed in the present invention comprises: a mixed-phase fluid nozzle, which ejects a mixed-phase fluid from an ejection port of the mixed-phase fluid nozzle, wherein the mixed-phase fluid includes a gas containing water molecules and a liquid containing water molecules; and a peripheral nozzle, which ejects liquid, and has a wall portion arranged in a manner to surround the mixed-phase fluid nozzle, a connecting portion that connects an end portion of the wall portion on a side opposite to the ejection direction of the mixed-phase fluid to the mixed-phase fluid nozzle and has an opposite surface of the connecting portion located on one side of the ejection direction of the mixed-phase fluid, and a peripheral nozzle ejection port arranged on the connecting portion and located on the opposite surface of the connecting portion.

[0009] Furthermore, the cleaning device of the present disclosure includes: the cleaning nozzle described above; and a table having a mounting surface provided to face the cleaning nozzle and on which a cleaning object is mounted.

[0010] Furthermore, the method for manufacturing a semiconductor element of the present disclosure includes: a mounting step of mounting a semiconductor substrate on a stage; and a cleaning step of cleaning a ground surface of the semiconductor substrate by passing the cleaning nozzle.

[0011] According to the cleaning nozzle disclosed in the present invention, it is possible to obtain a cleaning nozzle in which the amount of gas containing water molecules ejected from the cleaning nozzle after cleaning the cleaning object is less than before. In addition, according to the method for manufacturing a semiconductor element disclosed in the present invention, it is possible to obtain a semiconductor element in which the amount of gas containing water molecules ejected is less than before. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a cross-sectional view of the cleaning device according to Embodiment 1 of the present disclosure.

[0013] Figure 2 It is a cross-sectional view of the washer nozzle according to Embodiment 1 of the present disclosure.

[0014] Figure 3 It is a cross-sectional view of a washer nozzle according to Embodiment 2 of the present disclosure.

[0015] Figure 4 It is a cross-sectional view of a washer nozzle according to Embodiment 3 of the present disclosure.

[0016] Figure 5 It is a cross-sectional view of a washer nozzle according to a fourth embodiment of the present disclosure.

[0017] Figure 6 It is a cross-sectional view of a washer nozzle according to Embodiment 5 of the present disclosure.

[0018] Figure 7 It is a cross-sectional view of a washer nozzle according to Embodiment 6 of the present disclosure.

[0019] Figure 8 It is a top view of the cleaning nozzle according to the seventh embodiment of the present disclosure.

[0020] Fig. 9 It is a top view of the cleaning nozzle according to Embodiment 8 of the present disclosure.

[0021] Fig.10 It is a top view of the cleaning nozzle according to Embodiment 9 of the present disclosure.

[0022] Fig.11 It is a top view of the cleaning nozzle according to Embodiment 10 of the present disclosure.

[0023] Description of reference numerals:

[0024] 1, 31, 35, 39, 43…mixed-phase fluid nozzle; 2, 18, 22, 32, 36, 40, 44…peripheral nozzle; 9, 33, 37, 41, 45…mixed-phase fluid nozzle outlet; 13, 34, 38, 42, 46…peripheral nozzle outlet; 19, 23…connecting portion; 20, 25…connecting portion opposite surface; 21, 24…wall portion; 101…cleaning device; 201, 202, 203, 204, 205, 206, 207, 208, 209, 210…cleaning nozzle; 301…workbench; 302…exhaust horn; 303…carrying surface; 304…cleaning object. DETAILED DESCRIPTION

[0025] Hereinafter, the embodiments of the present disclosure will be described with reference to the accompanying drawings. In addition, the accompanying drawings are schematically shown, and the mutual relationship of the dimensions and positions shown in different drawings is not necessarily limited to the contents described, and can be appropriately changed. In addition, in the following description, the same components are marked with the same figure numbers and illustrated, and their names and functions are also the same or the same. Therefore, there is a case where their detailed description is omitted.

[0026] Implementation method 1.

[0027] use Figure 1 and Figure 2 The cleaning nozzle 201 in the first embodiment will be described. Figure 1 It is a cross-sectional view of the cleaning device 101 according to the first embodiment.

[0028] The cleaning device 101 of this embodiment includes a cleaning nozzle 201. The cleaning device 101 cleans the cleaning object 304. That is, the cleaning device 101 removes foreign matter from the cleaning object 304. In addition, the cleaning device 101 may further include a workbench 301 and an exhaust horn 302.

[0029] The workbench 301 includes a mounting surface 303. A cleaning object 304 is mounted on the mounting surface 303. The mounting surface 303 is disposed opposite to the cleaning nozzle 201. The cleaning object 304 is mounted on the mounting surface 303 of the workbench 301 and cleaned by the cleaning nozzle 201. In addition, the so-called mounting of the cleaning object 304 on the mounting surface 303 includes the case where the cleaning object 304 is simply placed on the mounting surface 303.

[0030] The table 301 rotates, for example, around a table shaft 305. The cleaning object 304 is, for example, a semiconductor wafer, but may also be other substrates.

[0031] The exhaust horn 302 is provided to surround the cleaning object 304. The exhaust horn 302 sucks the gas and liquid ejected from the cleaning nozzle 201 from the suction port 306. Most of the gas and liquid sucked by the exhaust horn 302 are ejected from the cleaning nozzle 201, hit the cleaning object 304 or the workbench 301 and bounce back. The exhaust horn 302 discharges the sucked gas or liquid from the discharge port 307. In addition, the gas and liquid used for the mixed phase fluid nozzle 1 contain water molecules.

[0032] The exhaust horn 302 may suck only one of gas or liquid from the side where the cleaning object 304 is located and discharge it from the side opposite to the cleaning object 304, or may suck and discharge both gas and liquid.

[0033] In addition, the exhaust horn 302 can also be annularly and seamlessly surrounded by the cleaning object 304 continuously throughout the entire circumference in a direction perpendicular to the worktable shaft 305. Figure 1 As shown, the cleaning device may be provided only in a part of the position annularly surrounding the cleaning object 304 in the direction perpendicular to the table axis 305 .

[0034] In addition, arrow A illustrates a part of the path of gas, arrow B illustrates a part of the path of liquid, and arrow C illustrates a part of the path of multiphase fluid. In addition, arrow C indicates the ejection direction of the multiphase fluid. A multiphase fluid is a fluid in which particles of different phases are dispersed. The case where gas and liquid are contained in the multiphase fluid is described, but fluids other than gas and liquid may also be contained in the multiphase fluid. In addition, water molecules are contained in the gas passing through the path of the gas indicated by arrow A.

[0035] The cleaning nozzle 201 of the present embodiment includes a multiphase fluid nozzle 1 and an outer peripheral nozzle 2. The cleaning nozzle 201 cleans the cleaning object 304. That is, the cleaning nozzle 201 removes foreign matter from the cleaning object 304.

[0036] The multiphase fluid nozzle 1 includes a gas inlet 3, a gas flow path 4, a liquid inlet 5, a liquid flow path 6, a gas-liquid mixing section 7, a multiphase fluid flow path 8, and a multiphase fluid nozzle ejection port 9. The multiphase fluid is ejected from the multiphase fluid nozzle ejection port 9. That is, the gas containing water molecules and the liquid are mixed in the gas-liquid mixing section 7 to form a multiphase fluid, and ejected from the multiphase fluid nozzle ejection port 9.

[0037] The flow path from the gas flowing in from the gas inlet 3 to the gas being ejected from the multiphase fluid nozzle ejection port 9 , that is, the gas flow path 4 , the gas-liquid mixing unit 7 , and the multiphase fluid flow path 8 are smoothly connected.

[0038] The gas flow path 4, the gas-liquid mixing section 7 and the multiphase fluid flow path 8 are used as a main flow path. It is preferred that the main flow path is provided in a straight line.

[0039] By providing the flow path through which the gas passes, that is, the main flow path, in a straight manner, the ability of the cleaning nozzle 201 to remove foreign matter from the cleaning target 304 can be improved compared to a case where the main flow path is not provided in a straight manner.

[0040] The liquid flow path 6 is connected to the main flow path through the gas-liquid mixing section 7. The liquid flow path 6 is connected at an angle relative to the main flow path. That is, the liquid flow path 6 is connected at an acute angle relative to the main flow path. Preferably, the angle deviation from the direction from the liquid inlet 5 toward the multiphase fluid nozzle ejection port 9 to the direction from the gas inlet 3 toward the multiphase fluid nozzle ejection port 9 is less than 90 degrees.

[0041] The outer peripheral nozzle 2 includes an outer peripheral nozzle inlet 11 , an outer peripheral nozzle inner flow path 12 , and an outer peripheral nozzle ejection port 13 .

[0042] The peripheral nozzle inlet 11 is provided, for example, in a direction parallel to the ejection direction of the mixed phase fluid, on the side of the peripheral nozzle 2 opposite to the workbench 301. The peripheral nozzle inner flow path 12 includes, for example, a straight portion 14 and an annular portion 15. The straight portion 14 is connected to the annular portion 15 and is continuously provided. That is, the fluid flowing in the straight portion 14 flows toward the annular portion 15.

[0043] like Figure 1 As shown, the peripheral nozzle 2 surrounds the mixed-phase fluid nozzle 1 in a direction perpendicular to the main flow path. That is, the peripheral nozzle 2 surrounds the mixed-phase fluid nozzle 1 in a direction perpendicular to the ejection direction of the mixed-phase fluid. For example, the peripheral nozzle 2 covers the mixed-phase fluid nozzle 1 in an annular shape when viewed from above. The so-called annular shape includes a circular ring shape or a polygonal ring shape. In addition, the so-called peripheral nozzle 2 surrounding the mixed-phase fluid nozzle 1 means that the peripheral nozzle 2 does not need to cover the mixed-phase fluid nozzle 1 continuously throughout the entire circumference, and can also be partially interrupted.

[0044] In addition, if Figure 1 As shown, the peripheral nozzle ejection port 13 surrounds the mixed-phase fluid nozzle ejection port 9 in a direction perpendicular to the main flow path. That is, the peripheral nozzle ejection port 13 surrounds the mixed-phase fluid nozzle ejection port 9 in a direction perpendicular to the ejection direction of the mixed-phase fluid. For example, the peripheral nozzle ejection port 13 covers the mixed-phase fluid nozzle ejection port 9 in an annular shape when viewed from above. The top view refers to the direction of observing the plane perpendicularly from the plane where the peripheral nozzle ejection port 13 and the mixed-phase fluid nozzle ejection port 9 exist. The so-called annular shape includes a circular ring shape or a polygonal ring shape. The so-called peripheral nozzle ejection port 13 surrounds the mixed-phase fluid nozzle ejection port 9, which means that the peripheral nozzle ejection port 13 does not need to cover the mixed-phase fluid nozzle ejection port 9 continuously throughout the entire circumference, and may also be partially interrupted.

[0045] The mixed phase fluid nozzle 1 can move to a position opposite to the mounting surface 303 across the cleaning object 304, and clean the cleaning object 304. Preferably, the distance between the mixed phase fluid nozzle ejection port 9 and the cleaning object 304 is, for example, about 3 mm to 7 mm. By setting the distance between the mixed phase fluid nozzle ejection port 9 and the cleaning object 304 to about 3 mm to 7 mm, the ability of the mixed phase fluid nozzle 1 to remove foreign matter from the cleaning object 304 can be improved.

[0046] use Figure 1 The flow of gas and liquid is explained.

[0047] The gas flows in from the gas inlet 3 of the multiphase fluid nozzle 1. The gas flowing in from the gas inlet 3 passes through the gas flow path 4. The gas passing through the gas flow path 4 reaches the gas-liquid mixing section 7. The gas reaching the gas-liquid mixing section 7 is mixed with the liquid reaching the gas-liquid mixing section 7 to form a multiphase fluid. The multiphase fluid passes through the multiphase fluid flow path 8. The multiphase fluid passing through the multiphase fluid flow path 8 reaches the multiphase fluid nozzle ejection port 9 and is ejected from the multiphase fluid nozzle ejection port 9 to the outside of the multiphase fluid nozzle 1.

[0048] Liquid flows in from the liquid inlet 5 of the multiphase fluid nozzle 1. The liquid flowing in from the liquid inlet 5 passes through the liquid flow path 6. The liquid that has passed through the liquid flow path 6 reaches the gas-liquid mixing section 7. The liquid that has reached the gas-liquid mixing section 7 is mixed with the gas that has reached the gas-liquid mixing section 7 to form a multiphase fluid. The multiphase fluid passes through the multiphase fluid flow path 8. The multiphase fluid that has passed through the multiphase fluid flow path 8 reaches the multiphase fluid nozzle ejection port 9 and is ejected from the multiphase fluid nozzle ejection port 9 to the outside of the multiphase fluid nozzle 1.

[0049] The multiphase fluid ejected from the multiphase fluid nozzle ejection port 9 reaches the cleaning object 304 , and removes foreign matter from the cleaning object 304 .

[0050] Furthermore, it is preferable that the multiphase fluid ejected from the multiphase fluid nozzle ejection port 9 is ejected perpendicularly to the cleaning object 304 and the workbench 301. By ejecting the multiphase fluid perpendicularly to the cleaning object 304 and the workbench 301, the ability of the cleaning nozzle 201 to remove foreign matter from the cleaning object 304 can be improved.

[0051] Furthermore, it is preferable that the gas used in the multiphase fluid nozzle 1 and the liquid used in the multiphase fluid nozzle 1 have the same pressure when mixed in the gas-liquid mixing unit 7. The pressure of the gas used in the multiphase fluid nozzle 1 is preferably about 0.1 MPa to 0.3 MPa, for example.

[0052] In addition, it is preferable that the flow rate of the liquid used in the multiphase fluid nozzle 1 is, for example, about 100 cc / min to 500 cc / min.

[0053] By adjusting the pressure of the gas used in the multiphase fluid nozzle 1 and the flow rate of the liquid used in the multiphase fluid nozzle 1 , the ability of the multiphase fluid nozzle 1 to remove foreign matter from the cleaning target 304 can be improved.

[0054] In addition, the pressure of the gas used for the mixed phase fluid nozzle 1 and the flow rate of the liquid used for the mixed phase fluid nozzle 1 can be appropriately changed to appropriate values. In addition, by changing the distance between the mixed phase fluid nozzle ejection port 9 and the cleaning object 304, the shape of the mixed phase fluid nozzle ejection port 9, or the shape of the peripheral nozzle 2, the pressure of the gas used for the mixed phase fluid nozzle 1 and the flow rate of the liquid used for the mixed phase fluid nozzle 1 can also be changed. By appropriately changing the pressure of the gas used for the mixed phase fluid nozzle 1, the flow rate of the liquid used for the mixed phase fluid nozzle 1, the distance between the mixed phase fluid nozzle ejection port 9 and the cleaning object 304, the shape of the mixed phase fluid nozzle ejection port 9, or the shape of the peripheral nozzle 2, etc., the ability of the cleaning nozzle 201 to remove foreign matter from the cleaning object 304 can be improved.

[0055] The gas and liquid used in the multiphase fluid nozzle 1 contain water molecules. The gas and liquid used in the multiphase fluid nozzle 1 contain water molecules, so that the ability of the multiphase fluid nozzle 1 to remove foreign matter from the cleaning object 304 can be improved compared with the case where the gas and liquid do not contain water molecules.

[0056] In addition, the gas used in the mixed phase fluid nozzle 1 may also be steam. In addition, the liquid used in the mixed phase fluid nozzle 1 may also be pure water. In addition, the mixed phase fluid nozzle 1 is sometimes also called a steam fluid nozzle. In addition, the temperature of the gas used in the mixed phase fluid nozzle 1 may also be higher than the temperature of the liquid flowing in from the liquid inlet 5. For example, the gas flowing in from the gas inlet 3 is about 100°C, and the mixed phase fluid ejected from the mixed phase fluid nozzle ejection port 9 is about 900°C.

[0057] Liquid flows in from the peripheral nozzle inlet 11 of the peripheral nozzle 2. The liquid flowing in from the peripheral nozzle inlet 11 passes through the peripheral nozzle internal flow path 12. The liquid passing through the peripheral nozzle internal flow path 12 is ejected from the peripheral nozzle ejection port 13 to the outside of the peripheral nozzle 2. Since the peripheral nozzle ejection port 13 is formed to surround the mixed-phase fluid nozzle ejection port 9, the liquid ejected from the peripheral nozzle ejection port 13 is ejected in a manner surrounding the mixed-phase fluid ejected from the mixed-phase fluid nozzle ejection port 9. In addition, the liquid ejected from the peripheral nozzle ejection port 13 is ejected toward the cleaning object 304 and in parallel with the ejection direction of the mixed-phase fluid of the mixed-phase fluid nozzle ejection port 9.

[0058] Since the temperature of the liquid ejected from the peripheral nozzle ejection port 13 is lower than the temperature of the multiphase fluid ejected from the multiphase fluid nozzle ejection port 9, the liquid ejected from the peripheral nozzle ejection port 13 cools down the multiphase fluid ejected from the multiphase fluid nozzle ejection port 9. The liquid ejected from the peripheral nozzle ejection port 13 cools down the multiphase fluid ejected from the multiphase fluid nozzle ejection port 9, so that a part of the gas contained in the multiphase fluid ejected from the multiphase fluid nozzle ejection port 9 becomes liquid. In particular, the water molecules contained in the gas in the multiphase fluid ejected from the multiphase fluid nozzle ejection port 9 are condensed by the liquid ejected from the peripheral nozzle ejection port 13, so that a part of the multiphase fluid becomes water.

[0059] That is, the outer peripheral nozzle 2 can function as a cooling nozzle that cools the multiphase fluid ejected from the multiphase fluid nozzle ejection port 9 .

[0060] Most of the mixed phase fluid in which the gas contained in the mixed phase fluid is cooled down to become liquid and the liquid ejected from the peripheral nozzle ejection port 13 fall in the direction of gravity after cleaning the cleaning object 304. The mixed phase fluid in which the gas contained in the mixed phase fluid is cooled down to become liquid and a part of the liquid ejected from the peripheral nozzle ejection port 13 are scattered and sucked into the exhaust bell 302 from the suction port 306. The liquid sucked into the exhaust bell 302 is discharged from the discharge port 307 of the exhaust bell 302.

[0061] The gas contained in the multiphase fluid that has not become liquid disperses while remaining in the gas state. The dispersed gas is sucked into the exhaust bell 302 from the suction port 306. The gas sucked into the exhaust bell 302 is discharged from the discharge port 307 of the exhaust bell 302.

[0062] When the gas contained in the multiphase fluid is cooled and becomes liquid, the gas scattering can be suppressed compared to the case where the gas is not cooled. That is, the amount of gas scattering can be reduced compared to the conventional case.

[0063] Since the amount of gas scattering can be reduced compared to the past, the exhaust horn 302 for sucking gas or liquid can be reduced. That is, the exhaust horn 302 can fully suck gas and liquid even if the exhaust horn 302 does not continuously surround the cleaning object 304 in a circular shape without gaps all around the entire circumference in the direction perpendicular to the worktable axis 305. In addition, the gas sucked by the exhaust horn 302 contains water molecules.

[0064] Even when the exhaust horn 302 does not continuously surround the cleaning target 304 over the entire circumference, the exhaust horn 302 can still sufficiently suck in gas and liquid, so that the manufacturing cost and maintenance cost of the exhaust horn 302 can be reduced.

[0065] Furthermore, since the amount of gas scattered can be reduced compared to the conventional method, even when the exhaust horn 302 having a suction force smaller than the conventional method is used, the exhaust horn 302 can sufficiently suck in gas and liquid.

[0066] By fully sucking the gas through the exhaust horn 302, the possibility of rusting of the cleaning device 101 can be reduced. In addition, by fully sucking the gas and liquid after cleaning the cleaning object 304 through the exhaust horn 302, the possibility of disturbing the environment of the clean room or the like in which the cleaning device 101 is arranged can be reduced. In addition, by fully sucking the gas and liquid through the exhaust horn 302, the situation in which the field of vision of the clean room or the like in which the cleaning device 101 is arranged can be prevented from being deteriorated.

[0067] The liquid ejected from the peripheral nozzle ejection port 13 may be ejected onto the cleaning object 304 or may be ejected when there is no cleaning object 304. The liquid ejected from the peripheral nozzle ejection port 13 may be ejected onto the workbench 301 or may be ejected when there is no workbench 301.

[0068] In addition, the liquid used in the peripheral nozzle 2 may also be pure water. In addition, the liquid used in the multiphase fluid nozzle 1 and the liquid used in the peripheral nozzle 2 may be the same or different from each other. In addition, the liquid used in the peripheral nozzle 2 is, for example, at room temperature.

[0069] In addition, the inner diameter of the peripheral nozzle inner flow path 12 may be formed to gradually narrow as it approaches the peripheral nozzle ejection port 13. In addition, the peripheral nozzle inner flow path 12 is provided in a spiral shape, and the liquid ejected from the peripheral nozzle ejection port 13 may be ejected in a direction not perpendicular to the mounting surface 303.

[0070] Figure 2 2 is a cross-sectional view of the cleaning nozzle 201 of Embodiment 1. Figure 2 As shown, the mixed phase fluid nozzle outlet 9 and the peripheral nozzle outlet 13 are arranged on the same plane perpendicular to the injection direction of the mixed phase fluid. That is, the mixed phase fluid nozzle outlet 9 and the peripheral nozzle outlet 13 are arranged on the same plane parallel to the mounting surface 303 of the workbench 301.

[0071] By arranging the mixed-phase fluid nozzle ejection port 9 and the peripheral nozzle ejection port 13 on the same plane perpendicular to the ejection direction of the mixed-phase fluid, the manufacturing of the cleaning nozzle 201 becomes easier compared with the case where the mixed-phase fluid nozzle ejection port 9 and the peripheral nozzle ejection port 13 are not arranged on the same plane perpendicular to the ejection direction of the mixed-phase fluid.

[0072] Furthermore, the phrase "arranged on the same plane" includes arrangements slightly offset in the ejection direction of the multiphase fluid, provided that the cleaning effect is the same.

[0073] In addition, the plane where the multiphase fluid nozzle ejection port 9 and the peripheral nozzle ejection port 13 are provided is preferably horizontal. In other words, the plane where the multiphase fluid nozzle ejection port 9 and the peripheral nozzle ejection port 13 are provided is preferably perpendicular to the gravity direction.

[0074] The mixed-phase fluid nozzle 1 includes a surface corresponding to the lower surface of the mixed-phase fluid nozzle 1 and facing the mounting surface 303 of the workbench 301 and the cleaning object 304, that is, the mixed-phase fluid nozzle facing surface 16. In addition, the peripheral nozzle 2 includes a surface corresponding to the lower surface of the peripheral nozzle 2 and facing the mounting surface 303 of the workbench 301 and the cleaning object 304, that is, the peripheral nozzle facing surface 17.

[0075] In addition, in the present embodiment, the mixed-phase fluid nozzle facing surface 16 and the peripheral nozzle facing surface 17 are arranged on the same plane. In addition, the mixed-phase fluid nozzle facing surface 16 and the peripheral nozzle facing surface 17 may not be arranged on the same plane, for example, the mixed-phase fluid nozzle facing surface 16 or the peripheral nozzle facing surface 17 may also include a step difference.

[0076] Furthermore, the multiphase fluid nozzle 1 and the peripheral nozzle 2 may be provided as separate bodies or as an integrated body. When the multiphase fluid nozzle 1 and the peripheral nozzle 2 are provided as separate bodies, the multiphase fluid nozzle 1 and the peripheral nozzle 2 are fixed by, for example, hexagonal bolts.

[0077] For the peripheral nozzle 2, the dimension of the injection direction of the mixed phase fluid is preferably, for example, about 25 mm to 40 mm. More preferably, the dimension of the injection direction of the mixed phase fluid is about 33 mm. For the peripheral nozzle 2, the dimension of the direction perpendicular to the injection direction of the mixed phase fluid is preferably, for example, about 45 mm to 65 mm. More preferably, the dimension of the direction perpendicular to the injection direction of the mixed phase fluid is about 56 mm. By adjusting the size of the peripheral nozzle 2, the amount of gas dispersion can be reduced.

[0078] In addition, the cleaning nozzle 201 may further include other nozzles in addition to the multiphase fluid nozzle 1 and the peripheral nozzle 2. For example, a nozzle further surrounding the peripheral nozzle 2 may be provided.

[0079] In addition, it is preferable that the cleaning nozzle 201 is formed of titanium. When the cleaning nozzle 201 is formed of titanium, it is possible to prevent contamination of the cleaning object 304. In addition, the cleaning nozzle 201 may be formed of a material other than titanium.

[0080] Implementation method 2.

[0081] use Figure 3 The cleaning nozzle 202 in the second embodiment is described. The description of the same structure as the first embodiment is omitted. Figure 3 In, with Figure 1-2The same reference numerals denote the same or corresponding parts.

[0082] Figure 3 2 is a cross-sectional view of the cleaning nozzle 202 of Embodiment 2. Figure 3 As shown, the positional relationship between the multiphase fluid nozzle 1 and the outer peripheral nozzle 2 is different from that of the cleaning nozzle 201 of Embodiment 1. The following description will focus on the differences from the cleaning nozzle 201 of Embodiment 1.

[0083] like Figure 3 As shown, the peripheral nozzle outlet 13 is disposed closer to the injection direction of the mixed phase fluid than the mixed phase fluid nozzle outlet 9. That is, the distance between the peripheral nozzle outlet 13 and the mounting surface 303 is smaller than the distance between the mixed phase fluid nozzle outlet 9 and the mounting surface 303.

[0084] By setting the peripheral nozzle ejection port 13 to be closer to the ejection direction of the mixed fluid than the mixed fluid nozzle ejection port 9, the cleaning ability of the cleaning nozzle 202 and the efficiency of converting the gas contained in the mixed fluid ejected from the mixed fluid nozzle ejection port 9 into liquid can be improved compared to the case where the mixed fluid nozzle ejection port 9 and the peripheral nozzle ejection port 13 are set on the same plane perpendicular to the ejection direction of the mixed fluid.

[0085] In this embodiment, the peripheral nozzle facing surface 17 is disposed in the injection direction of the multiphase fluid more than the multiphase fluid nozzle facing surface 16. That is, the distance between the peripheral nozzle facing surface 17 and the mounting surface 303 is smaller than the distance between the multiphase fluid nozzle facing surface 16 and the mounting surface 303.

[0086] In addition, the distance between the peripheral nozzle facing surface 17 and the mounting surface 303 may not be less than the distance between all points included in the mixed-phase fluid nozzle facing surface 16 and the mounting surface 303. For example, the mixed-phase fluid nozzle facing surface 16 or the peripheral nozzle facing surface 17 may include a step difference, for example, a part of the mixed-phase fluid nozzle facing surface 16 and a part of the peripheral nozzle facing surface 17 may also exist in the same plane. In addition, a part of the mixed-phase fluid nozzle facing surface 16 may exist at a position closer to the mounting surface 303 than a part of the peripheral nozzle facing surface 17.

[0087] Furthermore, the multiphase fluid nozzle 1 and the peripheral nozzle 2 may be provided as separate bodies or integral bodies. When the multiphase fluid nozzle 1 and the peripheral nozzle 2 are provided as separate bodies, the multiphase fluid nozzle 1 and the peripheral nozzle 2 are fixed to each other by, for example, hexagonal bolts.

[0088] exist Figure 3In the figure, although the peripheral nozzle ejection port 13 is arranged closer to the ejection direction of the mixed phase fluid than the mixed phase fluid nozzle ejection port 9, the peripheral nozzle ejection port 13 may be arranged in the opposite direction to the ejection direction of the mixed phase fluid than the mixed phase fluid nozzle ejection port 9. That is, the mixed phase fluid nozzle ejection port 9 may be arranged at a position closer to the cleaning object 304 than the peripheral nozzle ejection port 13.

[0089] In addition, the mixed phase fluid nozzle 1 and the peripheral nozzle 2 may be provided as separate bodies, and the peripheral nozzle 2 may be provided so as to be movable in a direction parallel to the ejection direction of the mixed phase fluid. That is, the peripheral nozzle 2 may be provided so as to be able to adjust the distance between the peripheral nozzle 2 and the mounting surface 303. By providing the peripheral nozzle 2 so as to be movable in a direction parallel to the ejection direction of the mixed phase fluid, the distance between the peripheral nozzle ejection port 13 and the mounting surface 303 may be set independently of the distance between the mixed phase fluid nozzle ejection port 9 and the mounting surface 303.

[0090] By setting the peripheral nozzle 2 to be movable in a direction parallel to the ejection direction of the mixed-phase fluid, the distance between the peripheral nozzle ejection port 13 and the mounting surface 303 and the cleaning object 304 can be changed according to the amount of gas and liquid flowing into the mixed-phase fluid nozzle 1 and the peripheral nozzle 2. By being able to change the distance between the peripheral nozzle ejection port 13 and the mounting surface 303 and the cleaning object 304 according to the amount of gas and liquid flowing into the mixed-phase fluid nozzle 1 and the peripheral nozzle 2, the cleaning ability of the cleaning nozzle 202 and the efficiency of converting the gas contained in the mixed-phase fluid ejected from the mixed-phase fluid nozzle ejection port 9 into liquid can be improved.

[0091] Implementation method 3.

[0092] use Figure 4 The cleaning nozzle 203 in the third embodiment is described. The description of the same structure as the first embodiment is omitted. Figure 4 In, with Figure 1 to Figure 3 The same reference numerals denote the same or corresponding parts.

[0093] Figure 4 2 is a cross-sectional view of the cleaning nozzle 203 of Embodiment 3. Figure 4 As shown, the shape of the outer peripheral nozzle 18 is different from the shape of the outer peripheral nozzle 2 of Embodiment 1. Hereinafter, the difference from the cleaning nozzle 201 of Embodiment 1 will be mainly described.

[0094] The cleaning nozzle 203 of this embodiment includes a connecting portion 19. The connecting portion 19 connects the mixed phase fluid nozzle 1 and the peripheral nozzle 18. Figure 4As shown, the connecting portion 19 is integrated with the peripheral nozzle 18 to connect the mixed-phase fluid nozzle 1 and the peripheral nozzle 18 .

[0095] Furthermore, the connection portion 19 may be provided as a separate body from the peripheral nozzle 18, or the connection portion 19 as a separate body from the peripheral nozzle 18 may connect the multiphase fluid nozzle 1 and the peripheral nozzle 18. Furthermore, the connection portion 19 may be provided as an integral body with the multiphase fluid nozzle 1.

[0096] The connection part 19 includes a connection part facing surface 20 on the side of the injection direction of the multiphase fluid. That is, the connection part 19 includes a connection part facing surface 20 facing the mounting surface 303 and the cleaning object 304 on the side of the mounting surface 303 and the cleaning object 304. The connection part facing surface 20 is, for example, a surface parallel to the mounting surface 303 and the cleaning object 304.

[0097] The connection portion facing surface 20 is arranged to be closer to the direction opposite to the ejection direction of the mixed phase fluid than the mixed phase fluid nozzle ejection outlet 9. That is, the distance between the connection portion facing surface 20 and the mounting surface 303 and the cleaning object 304 is greater than the distance between the mixed phase fluid nozzle ejection outlet 9 and the mounting surface 303 and the cleaning object 304. In addition, in the present embodiment, the distance between the connection portion facing surface 20 and the mounting surface 303 and the cleaning object 304 is greater than the distance between the peripheral nozzle ejection outlet 13 and the mounting surface 303 and the cleaning object 304.

[0098] The peripheral nozzle 18 includes a wall portion 21. The wall portion 21 is arranged to extend further in the ejection direction of the mixed phase fluid than the connecting portion opposing surface 20. The wall portion 21 is arranged to surround the mixed phase fluid nozzle ejection port 9. Furthermore, the wall portion 21 is arranged to surround the peripheral nozzle ejection port 13. In the present embodiment, the flow path 12 in the peripheral nozzle is arranged along the wall portion 21.

[0099] The wall 21 has an end on the side opposite to the injection direction of the multiphase fluid. The connection portion 19 connects the end of the wall 21 on the side opposite to the injection direction of the multiphase fluid to the multiphase fluid nozzle 1. In addition, the wall 21 has an end on the side opposite to the injection direction of the multiphase fluid.

[0100] By making the peripheral nozzle 18 include a wall portion 21, such as Figure 4 As shown, there is a region 26 surrounded by the connecting portion facing surface 20 and the wall portion 21. That is, the peripheral nozzle 18 is concave in the ejection direction of the mixed phase fluid. Gas and the like can be stored in the region 26 surrounded by the connecting portion facing surface 20 and the wall portion 21. By storing gas in the region 26, the amount of gas scattering can be reduced.

[0101] Since there is an area 26 surrounded by the connecting portion opposing surfaces 20 and the wall portion 21, gas is accumulated in the area 26. Therefore, compared with a case where there is no area 26 surrounded by the connecting portion opposing surfaces 20 and the wall portion 21, it is easier to mix the gas contained in the mixed-phase fluid ejected from the mixed-phase fluid nozzle ejection port 9 with the liquid ejected from the peripheral nozzle ejection port 13, thereby improving the efficiency of converting the gas contained in the mixed-phase fluid ejected from the mixed-phase fluid nozzle ejection port 9 into liquid.

[0102] like Figure 4 As shown, the cleaning nozzle 203 is the same as the cleaning nozzle 201 of Embodiment 1, and the mixed phase fluid nozzle ejection port 9 and the peripheral nozzle ejection port 13 are arranged on the same plane perpendicular to the ejection direction of the mixed phase fluid. That is, the mixed phase fluid nozzle ejection port 9 and the peripheral nozzle ejection port 13 are arranged on the same plane parallel to the mounting surface 303 of the workbench 301.

[0103] By arranging the mixed-phase fluid nozzle ejection port 9 and the peripheral nozzle ejection port 13 on the same plane perpendicular to the ejection direction of the mixed-phase fluid, the manufacturing of the cleaning nozzle 203 becomes easier compared with the case where the mixed-phase fluid nozzle ejection port 9 and the peripheral nozzle ejection port 13 are not arranged on the same plane perpendicular to the ejection direction of the mixed-phase fluid.

[0104] In addition, the plane where the multiphase fluid nozzle ejection port 9 and the peripheral nozzle ejection port 13 are provided is preferably horizontal. In other words, the plane where the multiphase fluid nozzle ejection port 9 and the peripheral nozzle ejection port 13 are provided is preferably perpendicular to the gravity direction.

[0105] In this embodiment, the mixed-phase fluid nozzle facing surface 16 and the peripheral nozzle facing surface 17 are arranged on the same plane, and the connecting portion facing surface 20 is arranged at a position farther away from the mounting surface 303 and the cleaning object 304 than the mixed-phase fluid nozzle facing surface 16 and the peripheral nozzle facing surface 17 .

[0106] Furthermore, the multiphase fluid nozzle facing surface 16 and the outer peripheral nozzle facing surface 17 may not be provided on the same plane. In addition, the connection portion facing surface 20 may include a step, for example.

[0107] Implementation method 4.

[0108] use Figure 5 The cleaning nozzle 204 in the fourth embodiment is described. The description of the same structure as the third embodiment is omitted. Figure 5 In, with Figure 1 to Figure 4 The same reference numerals denote the same or corresponding parts.

[0109] Figure 5 4 is a cross-sectional view of the cleaning nozzle 204 of Embodiment 4. Figure 5As shown, the positional relationship between the multiphase fluid nozzle 1 and the outer peripheral nozzle 18 is different from that of the cleaning nozzle 203 of the third embodiment. The following description will focus on the differences from the cleaning nozzle 203 of the third embodiment.

[0110] like Figure 5 As shown, the peripheral nozzle outlet 13 is disposed closer to the injection direction of the mixed phase fluid than the mixed phase fluid nozzle outlet 9. That is, the distance between the peripheral nozzle outlet 13 and the mounting surface 303 is smaller than the distance between the mixed phase fluid nozzle outlet 9 and the mounting surface 303.

[0111] By setting the peripheral nozzle ejection port 13 to be closer to the ejection direction of the mixed fluid than the mixed fluid nozzle ejection port 9, the cleaning ability of the cleaning nozzle 204 and the efficiency of converting the gas contained in the mixed fluid ejected from the mixed fluid nozzle ejection port 9 into liquid can be improved compared to the case where the mixed fluid nozzle ejection port 9 and the peripheral nozzle ejection port 13 are set on the same plane perpendicular to the ejection direction of the mixed fluid.

[0112] In this embodiment, the peripheral nozzle facing surface 17 is disposed closer to the multiphase fluid ejection direction than the multiphase fluid nozzle facing surface 16. That is, the distance between the peripheral nozzle facing surface 17 and the mounting surface 303 is smaller than the distance between the multiphase fluid nozzle facing surface 16 and the mounting surface 303.

[0113] The connection portion facing surface 20 is provided at a position farther from the mounting surface 303 and the cleaning object 304 than the multiphase fluid nozzle facing surface 16 and the outer peripheral nozzle facing surface 17. The connection portion facing surface 20 may include a step, for example.

[0114] Furthermore, the multiphase fluid nozzle 1 and the peripheral nozzle 18 may be provided as separate bodies or may be provided as one body. When the multiphase fluid nozzle 1 and the peripheral nozzle 18 are provided as separate bodies, the multiphase fluid nozzle 1 and the peripheral nozzle 18 are fixed to each other by, for example, hexagonal bolts.

[0115] In addition, the mixed phase fluid nozzle 1 and the peripheral nozzle 18 may be provided as separate bodies, and the peripheral nozzle 18 may be provided so as to be movable in a direction parallel to the ejection direction of the mixed phase fluid. That is, the peripheral nozzle 18 may be provided so as to be able to adjust the distance between the peripheral nozzle 18 and the mounting surface 303. By providing the peripheral nozzle 18 so as to be movable in a direction parallel to the ejection direction of the mixed phase fluid, the distance between the peripheral nozzle ejection port 13 and the mounting surface 303 may be set independently of the distance between the mixed phase fluid nozzle ejection port 9 and the mounting surface 303.

[0116] By setting the peripheral nozzle 18 to be movable in a direction parallel to the ejection direction of the mixed-phase fluid, the distance between the peripheral nozzle ejection port 13 and the mounting surface 303 and the cleaning object 304 can be changed according to the amount of gas and liquid flowing into the mixed-phase fluid nozzle 1 and the peripheral nozzle 18. By being able to change the distance between the peripheral nozzle ejection port 13 and the mounting surface 303 and the cleaning object 304 according to the amount of gas and liquid flowing into the mixed-phase fluid nozzle 1 and the peripheral nozzle 18, the cleaning ability of the cleaning nozzle 204 and the efficiency of converting the gas contained in the mixed-phase fluid ejected from the mixed-phase fluid nozzle ejection port 9 into liquid can be improved.

[0117] Implementation method 5.

[0118] use Figure 6 The cleaning nozzle 205 in the fifth embodiment is described. The description of the same structure as the third embodiment is omitted. Figure 6 In, with Figure 1 to Figure 5 The same reference numerals denote the same or corresponding parts.

[0119] Figure 6 2 is a cross-sectional view of the cleaning nozzle 205 of Embodiment 5. Figure 6 As shown, the shape of the outer peripheral nozzle 22 is different from the shape of the outer peripheral nozzle 18 of Embodiment 3. The following description will focus on the differences from the cleaning nozzle 203 of Embodiment 3.

[0120] The cleaning nozzle 205 of this embodiment includes a connecting portion 23. The connecting portion 23 connects the mixed phase fluid nozzle 1 and the peripheral nozzle 22. Figure 6 As shown, the connecting portion 23 is integrated with the peripheral nozzle 22 and connects the mixed-phase fluid nozzle 1 with the peripheral nozzle 22 .

[0121] The connection part 23 includes a connection part facing surface 25 on the side of the injection direction of the multiphase fluid. That is, the connection part 23 includes a connection part facing surface 25 facing the mounting surface 303 and the cleaning object 304 on the side of the mounting surface 303 and the cleaning object 304. The connection part facing surface 25 is, for example, a surface parallel to the mounting surface 303 and the cleaning object 304.

[0122] The connection portion facing surface 25 is arranged in a direction opposite to the injection direction of the mixed phase fluid than the mixed phase fluid nozzle outlet 9. That is, the distance between the connection portion facing surface 25 and the mounting surface 303 and the cleaning object 304 is greater than the distance between the mixed phase fluid nozzle outlet 9 and the mounting surface 303 and the cleaning object 304.

[0123] The peripheral nozzle 22 includes a wall portion 24. The wall portion 24 is provided to extend further in the ejection direction of the multiphase fluid than the connection portion facing surface 25. The wall portion 24 is provided to surround the multiphase fluid nozzle ejection port 9. Furthermore, the wall portion 24 is provided to surround the peripheral nozzle ejection port 13.

[0124] The wall portion 24 has an end portion on the side opposite to the injection direction of the multiphase fluid. The connection portion 23 connects the end portion of the wall portion 24 on the side opposite to the injection direction of the multiphase fluid to the multiphase fluid nozzle 1. In addition, the wall portion 24 has an end portion on the side opposite to the injection direction of the multiphase fluid.

[0125] like Figure 6 As shown, there is a region 26 surrounded by the connection portion facing surface 25 and the wall portion 24. That is, the peripheral nozzle 22 is in a cup-like shape. Gas and the like can be stored in the region 26 surrounded by the connection portion facing surface 25 and the wall portion 24. By storing gas in the region 26, the amount of gas scattering can be reduced.

[0126] Since there is an area 26 surrounded by the connecting portion opposing surfaces 25 and the wall portion 24, gas is stored in the area 26. Therefore, compared with a case where there is no area 26 surrounded by the connecting portion opposing surfaces 25 and the wall portion 24, the gas contained in the mixed-phase fluid ejected from the mixed-phase fluid nozzle ejection port 9 is easily mixed with the liquid ejected from the peripheral nozzle ejection port 13, thereby improving the efficiency of converting the gas contained in the mixed-phase fluid ejected from the mixed-phase fluid nozzle ejection port 9 into liquid.

[0127] The connection part 23 of this embodiment has the peripheral nozzle ejection port 13 on the connection part facing surface 25. That is, the peripheral nozzle ejection port 13 is provided on the connection part facing surface 25. That is, the liquid ejected from the peripheral nozzle ejection port 13 is ejected toward the area 26 surrounded by the connection part facing surface 25 and the wall part 24.

[0128] By making the liquid ejected from the peripheral nozzle ejection port 13 be ejected toward the area 26 surrounded by the connecting portion opposing surface 25 and the wall portion 24, the gas accumulated in the area 26 surrounded by the connecting portion opposing surface 25 and the wall portion 24 is easily mixed with the liquid ejected from the peripheral nozzle ejection port 13, thereby improving the efficiency of converting the gas contained in the mixed-phase fluid ejected from the mixed-phase fluid nozzle ejection port 9 into liquid.

[0129] Since the connection portion facing surface 25 is arranged in a direction opposite to the injection direction of the mixed phase fluid than the injection port 9 of the mixed phase fluid nozzle, the peripheral nozzle injection port 13 arranged on the connection portion facing surface 25 is arranged in a direction opposite to the injection direction of the mixed phase fluid than the injection port 9 of the mixed phase fluid nozzle. That is, the distance between the peripheral nozzle injection port 13 and the mounting surface 303 and the cleaning object 304 is greater than the distance between the injection port 9 of the mixed phase fluid nozzle and the mounting surface 303 and the cleaning object 304.

[0130] In the present embodiment, the outer peripheral nozzle inlet 11 and the outer peripheral nozzle inner flow path 12 are provided in the connection portion 23. Alternatively, the outer peripheral nozzle inlet 11 and the outer peripheral nozzle inner flow path 12 may be provided in the wall portion 24.

[0131] In this embodiment, the mixed-phase fluid nozzle facing surface 16 and the peripheral nozzle facing surface 17 are arranged on the same plane, and the connecting portion facing surface 25 is arranged at a position farther away from the mounting surface 303 and the cleaning object 304 than the mixed-phase fluid nozzle facing surface 16 and the peripheral nozzle facing surface 17 .

[0132] Furthermore, the multiphase fluid nozzle facing surface 16 and the peripheral nozzle facing surface 17 may not be provided on the same plane. In addition, the connection portion facing surface 25 may include a step, for example.

[0133] In addition, the connection portion 23 may be provided as a separate body from the wall portion 24 of the outer peripheral nozzle 22. In addition, the connection portion 23 may be provided integrally with the multiphase fluid nozzle 1.

[0134] Implementation method 6.

[0135] use Figure 7 The cleaning nozzle 206 in the sixth embodiment is described. The description of the same structure as the fifth embodiment is omitted. Figure 7 In, with Figure 1 to Figure 6 The same reference numerals denote the same or corresponding parts.

[0136] Figure 7 2 is a cross-sectional view of the cleaning nozzle 206 of Embodiment 6. Figure 7 As shown, the positional relationship between the multiphase fluid nozzle 1 and the outer peripheral nozzle 22 is different from that of the cleaning nozzle 205 of the fifth embodiment. The following description will focus on the differences from the cleaning nozzle 205 of the fifth embodiment.

[0137] In this embodiment, the peripheral nozzle facing surface 17 is disposed closer to the multiphase fluid ejection direction than the multiphase fluid nozzle facing surface 16. That is, the distance between the peripheral nozzle facing surface 17 and the mounting surface 303 is smaller than the distance between the multiphase fluid nozzle facing surface 16 and the mounting surface 303.

[0138] The connection portion facing surface 25 is provided at a position farther from the mounting surface 303 and the cleaning object 304 than the multiphase fluid nozzle facing surface 16 and the outer peripheral nozzle facing surface 17. The connection portion facing surface 25 may include a step, for example.

[0139] Furthermore, the multiphase fluid nozzle 1 and the peripheral nozzle 22 may be provided as separate bodies or may be provided as one body. When the multiphase fluid nozzle 1 and the peripheral nozzle 22 are provided as separate bodies, the multiphase fluid nozzle 1 and the peripheral nozzle 22 are fixed to each other by, for example, hexagonal bolts.

[0140] In addition, the mixed phase fluid nozzle 1 and the peripheral nozzle 22 may be provided as separate bodies, and the peripheral nozzle 22 may be provided to be movable in a direction parallel to the injection direction of the mixed phase fluid. By providing the peripheral nozzle 22 to be movable in a direction parallel to the injection direction of the mixed phase fluid, the distance between the peripheral nozzle injection port 13 and the mounting surface 303 may be set independently of the distance between the mixed phase fluid nozzle injection port 9 and the mounting surface 303.

[0141] By setting the peripheral nozzle 22 to be movable in a direction parallel to the ejection direction of the mixed phase fluid, the distance between the peripheral nozzle ejection port 13 and the mounting surface 303 and the cleaning object 304 can be changed according to the amount of gas and liquid flowing into the mixed phase fluid nozzle 1 and the peripheral nozzle 22. By being able to change the distance between the peripheral nozzle ejection port 13 and the mounting surface 303 and the cleaning object 304 according to the amount of gas and liquid flowing into the mixed phase fluid nozzle 1 and the peripheral nozzle 22, the cleaning ability of the cleaning nozzle 206 and the efficiency of converting the gas contained in the mixed phase fluid ejected from the mixed phase fluid nozzle ejection port 9 into liquid can be improved.

[0142] Implementation method 7.

[0143] use Figure 8 The cleaning nozzle 207 in the seventh embodiment is described. The description of the same structure as that in the first embodiment is omitted. Figure 8 In, with Figure 1 to Figure 7 The same reference numerals denote the same or corresponding parts.

[0144] Figure 8 It is a top view of the cleaning nozzle 207 of Embodiment 7. Figure 8 This is a diagram showing the cleaning nozzle 207 as viewed from the workbench 301 side. Figure 8 As shown, the cleaning nozzle 207 includes a mixed-phase fluid nozzle 31 and a peripheral nozzle 32 .

[0145] The multiphase fluid nozzle 31 includes a multiphase fluid nozzle ejection port 33. For example, one multiphase fluid nozzle ejection port 33 is provided in the multiphase fluid nozzle 31. Alternatively, two or more multiphase fluid nozzle ejection ports 33 may be provided.

[0146] For example, Figure 8As shown, the mixed-phase fluid nozzle ejection port 33 may also be formed into a shape formed by combining a straight line and an arc. In addition, the mixed-phase fluid nozzle ejection port 33 may be circular or elliptical, or may be a shape formed by combining only straight lines, or may be a shape formed by combining only arcs. The size of the mixed-phase fluid nozzle ejection port 33 may be appropriately changed. The size of the mixed-phase fluid nozzle ejection port 33 may also be, for example, a rectangle of 2 mm×7 mm. By appropriately changing the size of the mixed-phase fluid nozzle ejection port 33, the ability of the cleaning nozzle 207 to remove foreign matter from the cleaning object 304 may be improved.

[0147] The peripheral nozzle 32 includes a peripheral nozzle ejection port 34. For example, a plurality of peripheral nozzle ejection ports 34 are provided in the peripheral nozzle 32. Figure 8 As shown, for example, 16 outer peripheral nozzle ejection holes 34 are provided in the outer peripheral nozzle 32. The plurality of outer peripheral nozzle ejection holes 34 are arranged in a ring shape at intervals so as to surround the multiphase fluid nozzle 31 in the ejection direction of the multiphase fluid.

[0148] The outer peripheral nozzle ejection port 34 may be provided in the wall portion 21 or in the connection portion facing surface 25. In addition, the outer peripheral nozzle ejection port 34 may be provided in both the wall portion 21 and the connection portion facing surface 25.

[0149] The peripheral nozzle ejection port 34 may be formed, for example, Figure 8 The outer peripheral nozzle ejection port 34 may be a circular or elliptical shape, or may be a shape formed by combining only straight lines or only arcs.

[0150] Implementation method 8.

[0151] use Fig. 9 The cleaning nozzle 208 in the eighth embodiment is described. The description of the same structure as that in the first embodiment is omitted. Fig. 9 In, with Figures 1 to 8 The same reference numerals denote the same or corresponding parts.

[0152] Fig. 9 It is a top view of the cleaning nozzle 208 of Embodiment 8. Fig. 9 This is a diagram showing the cleaning nozzle 208 as viewed from the workbench 301 side. Fig. 9 As shown, the cleaning nozzle 208 includes a mixed-phase fluid nozzle 35 and a peripheral nozzle 36 .

[0153] The multiphase fluid nozzle 35 includes a multiphase fluid nozzle ejection port 37. For example, one multiphase fluid nozzle ejection port 37 is provided in the multiphase fluid nozzle 35. Alternatively, two or more multiphase fluid nozzle ejection ports 37 may be provided.

[0154] The mixed phase fluid nozzle ejection port 37 may also be as follows Fig. 9 In addition, the multiphase fluid nozzle ejection port 37 may be circular or elliptical, or may be a shape formed by combining only straight lines or only arcs.

[0155] The peripheral nozzle 36 includes a peripheral nozzle ejection port 38. For example, a plurality of peripheral nozzle ejection ports 38 are provided in the peripheral nozzle 36. Fig. 9 As shown, for example, 32 outer peripheral nozzle ejection holes 38 are provided in the outer peripheral nozzle 36. The plurality of outer peripheral nozzle ejection holes 38 are formed in a ring shape of 16 for example so as to surround the multiphase fluid nozzle 35, and are arranged in concentric circles.

[0156] The peripheral nozzle ejection port 38 may be provided on the wall portion 21 or on the connection portion facing surface 25. In addition, the peripheral nozzle ejection port 38 may be provided on both the wall portion 21 and the connection portion facing surface 25. In the case where the peripheral nozzle ejection port 38 is formed in a ring shape and two rings are provided, one of the rings may be provided on the wall portion 21 and the other may be provided on the connection portion facing surface 25. In addition, the number of rings formed by the peripheral nozzle ejection port 38 may be three or more.

[0157] The peripheral nozzle ejection port 38 may also be, for example, Fig. 9 In addition, the outer peripheral nozzle ejection port 38 may be circular or elliptical, or may be a shape formed by combining only straight lines or only arcs.

[0158] Implementation method 9.

[0159] use Fig.10 The cleaning nozzle 209 in the ninth embodiment is described. The description of the same structure as that in the first embodiment is omitted. Fig.10 In, with Figures 1 to 9 The same reference numerals denote the same or corresponding parts.

[0160] Fig.10 It is a top view of the cleaning nozzle 209 of Embodiment 9. Fig.10 This is a diagram showing the cleaning nozzle 209 as viewed from the workbench 301 side. Fig.10 As shown, the cleaning nozzle 209 includes a mixed-phase fluid nozzle 39 and a peripheral nozzle 40 .

[0161] The multiphase fluid nozzle 39 includes a multiphase fluid nozzle ejection port 41. For example, one multiphase fluid nozzle ejection port 41 is provided in the multiphase fluid nozzle 39. Alternatively, two or more multiphase fluid nozzle ejection ports 41 may be provided.

[0162] The mixed phase fluid nozzle ejection port 41 may also be as follows Fig.10 In addition, the multiphase fluid nozzle ejection port 41 may be an ellipse, a shape formed by combining only straight lines, a shape formed by combining only arcs, or a shape formed by combining straight lines and arcs.

[0163] The peripheral nozzle 40 includes a peripheral nozzle ejection port 42. For example, a plurality of peripheral nozzle ejection ports 42 are provided in the peripheral nozzle 40. Fig.10 As shown, for example, sixteen outer peripheral nozzle ejection holes 42 are provided in the outer peripheral nozzle 40. The plurality of outer peripheral nozzle ejection holes 42 are arranged in a ring shape so as to surround the multiphase fluid nozzle 39, for example.

[0164] The outer peripheral nozzle ejection port 42 may be provided in the wall portion 21 or in the connection portion facing surface 25. In addition, the outer peripheral nozzle ejection port 42 may be provided in both the wall portion 21 and the connection portion facing surface 25.

[0165] The outer peripheral nozzle ejection port 42 may be formed, for example, Fig.10 In addition, the peripheral nozzle ejection port 42 may be an ellipse, or may be a shape formed by combining only straight lines, or may be a shape formed by combining only arcs, or may be a shape formed by combining straight lines and arcs.

[0166] Implementation method 10.

[0167] use Fig.11 The cleaning nozzle 210 in the tenth embodiment is described. The description of the same structure as that in the first embodiment is omitted. Fig.11 In, with Figures 1 to 10 The same reference numerals denote the same or corresponding parts.

[0168] Fig.11 It is a top view of the cleaning nozzle 210 of Embodiment 10. Fig.11 This is a diagram showing the cleaning nozzle 210 as viewed from the workbench 301 side. Fig.11 As shown, the cleaning nozzle 210 includes a mixed-phase fluid nozzle 43 and a peripheral nozzle 44 .

[0169] The multiphase fluid nozzle 43 includes a multiphase fluid nozzle ejection port 45. For example, one multiphase fluid nozzle ejection port 45 is provided in the multiphase fluid nozzle 43. Alternatively, two or more multiphase fluid nozzle ejection ports 45 may be provided.

[0170] The mixed phase fluid nozzle ejection port 45 may also be as follows Fig.11In addition, the multiphase fluid nozzle ejection port 45 may be an ellipse, a shape formed by combining only straight lines, a shape formed by combining only arcs, or a shape formed by combining straight lines and arcs.

[0171] The peripheral nozzle 44 includes a peripheral nozzle ejection port 46. For example, one peripheral nozzle ejection port 46 is provided in the peripheral nozzle 44. Fig.11 As shown, for example, one outer peripheral nozzle ejection port 46 is provided continuously in an annular shape so as to surround the multiphase fluid nozzle 43. Alternatively, two or more outer peripheral nozzle ejection ports 46 may be provided.

[0172] The outer peripheral nozzle ejection port 46 may be provided in the wall portion 21 or in the connection portion facing surface 25. When two or more outer peripheral nozzle ejection ports 46 are provided, they may be provided in both the wall portion 21 and the connection portion facing surface 25.

[0173] The peripheral nozzle ejection port 46 may be, for example, Fig.11 In addition, the outer peripheral nozzle ejection port 46 may be a shape formed by combining only straight lines, a shape formed by combining only arcs, or a shape formed by combining straight lines and arcs.

[0174] Implementation method 11.

[0175] A method for manufacturing a semiconductor device in Embodiment 11 will be described. Description of the same structure as that in Embodiment 1 will be omitted.

[0176] The method for manufacturing a semiconductor element in this embodiment includes: a mounting step 1001 of mounting a semiconductor substrate on a workbench; a grinding step 1002 of grinding the semiconductor substrate mounted on the workbench in the mounting step 1001 to reduce the thickness; and a cleaning step 1003 of cleaning the ground surface of the semiconductor substrate ground in the grinding step 1002 by a cleaning nozzle 201. The mounting step 1001, the grinding step 1002, and the cleaning step 1003 are performed in this order. That is, the grinding step 1002 is performed between the mounting step 1001 and the cleaning step 1003.

[0177] In the grinding process 1002, the semiconductor substrate is ground to reduce the thickness. That is, the semiconductor substrate is ground to be thinned. In addition, for the cleaning nozzle used in the cleaning process 1003, any cleaning nozzle from the cleaning nozzle 201 of the first embodiment to the cleaning nozzle 210 of the tenth embodiment may be used. In addition, in the cleaning process 1003, cleaning, for example, refers to removing foreign matter from the cleaning object 304. The cleaning process 1003 is sometimes also referred to as a foreign matter removal process.

[0178] The method for manufacturing a semiconductor element can reduce the amount of scattered gas emitted than before and obtain a semiconductor element by including the cleaning step 1003. In addition, the method for manufacturing a semiconductor element can improve the efficiency of removing debris generated by grinding by including the cleaning step 1003.

[0179] In addition, in the above-mentioned embodiments described in this specification, there are cases where the material, material, size, shape, relative configuration relationship or implementation conditions of each component are recorded, but these are all examples in all aspects and are not limited to the description of each embodiment. Therefore, within the scope of each embodiment, it is envisaged that there are countless unillustrated variations. For example, including the case of deforming, adding or omitting any component, and also including the case of extracting at least one component in at least one embodiment and combining it with the components of other embodiments.

[0180] As mentioned above, although the preferred embodiments and the like have been described in detail, the present invention is not limited to the above-described embodiments and the like, and various modifications and substitutions can be made to the above-described embodiments and the like without departing from the scope described in the claims.

[0181] Hereinafter, each aspect of the present disclosure will be described collectively as supplementary notes.

[0182] (Note 1)

[0183] A cleaning nozzle, comprising:

[0184] a mixed-phase fluid nozzle, which ejects a mixed-phase fluid from an ejection port of the mixed-phase fluid nozzle, wherein the mixed-phase fluid comprises a gas containing water molecules and a liquid containing water molecules; and

[0185] The peripheral nozzle ejects liquid and has a peripheral nozzle ejection port surrounding the ejection port of the multiphase fluid nozzle.

[0186] (Note 2)

[0187] A cleaning nozzle, comprising:

[0188] a mixed-phase fluid nozzle, which ejects a mixed-phase fluid from an ejection port of the mixed-phase fluid nozzle, wherein the mixed-phase fluid comprises a gas containing water molecules and a liquid containing water molecules; and

[0189] A peripheral nozzle that ejects liquid, comprising a wall portion arranged in a manner to surround the above-mentioned mixed-phase fluid nozzle, a connecting portion connecting the end portion of the above-mentioned wall portion on the side opposite to the ejection direction of the above-mentioned mixed-phase fluid to the above-mentioned mixed-phase fluid nozzle, and a peripheral nozzle ejection port arranged on the above-mentioned wall portion and located at the end portion of the above-mentioned wall portion on the side of the ejection direction of the above-mentioned mixed-phase fluid.

[0190] (Note 3)

[0191] A cleaning nozzle, comprising:

[0192] a mixed-phase fluid nozzle, which ejects a mixed-phase fluid from an ejection port of the mixed-phase fluid nozzle, wherein the mixed-phase fluid comprises a gas containing water molecules and a liquid containing water molecules; and

[0193] A peripheral nozzle that ejects liquid, comprising a wall portion arranged in a manner to surround the above-mentioned mixed-phase fluid nozzle, a connecting portion that connects the end of the above-mentioned wall portion on the side opposite to the ejection direction of the above-mentioned mixed-phase fluid to the above-mentioned mixed-phase fluid nozzle and has a connecting portion opposite surface located on the side of the ejection direction of the above-mentioned mixed-phase fluid, and a peripheral nozzle ejection port arranged on the above-mentioned connecting portion and located on the above-mentioned connecting portion opposite surface.

[0194] (Note 4)

[0195] In the cleaning nozzle according to any one of Supplementary Notes 1 to 3,

[0196] The multiphase fluid nozzle ejection port and the peripheral nozzle ejection port are arranged on the same plane perpendicular to the ejection direction of the multiphase fluid.

[0197] (Note 5)

[0198] In the cleaning nozzle according to any one of Supplementary Notes 1 to 3,

[0199] The outer peripheral nozzle ejection port is disposed closer to the ejection direction of the multi-phase fluid than the multi-phase fluid nozzle ejection port.

[0200] (Note 6)

[0201] In the cleaning nozzle according to any one of Supplementary Notes 1 to 3,

[0202] The mixed phase fluid nozzle and the peripheral nozzle are arranged in a separate manner.

[0203] The outer peripheral nozzle is movable in a direction parallel to the ejection direction of the multiphase fluid.

[0204] (Note 7)

[0205] In the cleaning nozzle according to any one of Supplementary Notes 1 to 7,

[0206] A plurality of the outer peripheral nozzle ejection ports are provided so as to surround the multiphase fluid nozzle ejection port.

[0207] (Note 8)

[0208] In the cleaning nozzle according to any one of Supplementary Notes 1 to 6,

[0209] The outer peripheral nozzle ejection port is provided in an annular shape so as to surround the multiphase fluid nozzle ejection port.

[0210] (Note 9)

[0211] A cleaning device, comprising:

[0212] A cleaning nozzle as described in any one of Supplementary Notes 1 to 8; and

[0213] A workbench is provided which is opposed to the cleaning nozzle and has a mounting surface for mounting the cleaning object.

[0214] (Note 10)

[0215] A method for manufacturing a semiconductor element, comprising:

[0216] A step of placing a semiconductor substrate on a stage; and

[0217] A cleaning step of cleaning the ground surface of the semiconductor substrate by passing the cleaning nozzle according to any one of claims 1 to 9.

[0218] (Note 11)

[0219] In the method for manufacturing a semiconductor device according to Supplementary Note 10,

[0220] Between the mounting step and the cleaning step, a grinding step of grinding the semiconductor substrate mounted on the stage to reduce the thickness of the semiconductor substrate is included.

Claims

1. A cleaning nozzle, characterized in that: have: a mixed-phase fluid nozzle, which ejects a mixed-phase fluid from an ejection port of the mixed-phase fluid nozzle, wherein the mixed-phase fluid comprises a gas containing water molecules and a liquid containing water molecules; and The peripheral nozzle ejects liquid and has a peripheral nozzle ejection port surrounding the ejection port of the mixed-phase fluid nozzle.

2. A cleaning nozzle, characterized in that: have: a mixed-phase fluid nozzle, which ejects a mixed-phase fluid from an ejection port of the mixed-phase fluid nozzle, wherein the mixed-phase fluid comprises a gas containing water molecules and a liquid containing water molecules; and A peripheral nozzle that ejects liquid, comprising a wall portion arranged in a manner to surround the mixed-phase fluid nozzle, a connecting portion connecting the end portion of the wall portion on the side opposite to the ejection direction of the mixed-phase fluid to the mixed-phase fluid nozzle, and a peripheral nozzle ejection port arranged on the wall portion and located at the end portion of the wall portion on the side of the ejection direction of the mixed-phase fluid.

3. A cleaning nozzle, characterized in that: have: a mixed-phase fluid nozzle, which ejects a mixed-phase fluid from an ejection port of the mixed-phase fluid nozzle, wherein the mixed-phase fluid comprises a gas containing water molecules and a liquid containing water molecules; and A peripheral nozzle that ejects liquid, comprising a wall portion arranged in a manner to surround the mixed-phase fluid nozzle, a connecting portion that connects an end portion of the wall portion on the side opposite to the ejection direction of the mixed-phase fluid to the mixed-phase fluid nozzle and has a connecting portion opposite surface located on the side of the ejection direction of the mixed-phase fluid, and a peripheral nozzle ejection port arranged on the connecting portion and located on the connecting portion opposite surface.

4. The cleaning nozzle according to any one of claims 1 to 3, characterized in that The multiphase fluid nozzle ejection port and the peripheral nozzle ejection port are arranged on the same plane perpendicular to the ejection direction of the multiphase fluid.

5. The cleaning nozzle according to any one of claims 1 to 3, characterized in that: The outer peripheral nozzle ejection port is disposed closer to the ejection direction of the multiphase fluid than the multiphase fluid nozzle ejection port.

6. The cleaning nozzle according to any one of claims 1 to 3, characterized in that: The mixed phase fluid nozzle and the peripheral nozzle are arranged in a separate manner, The peripheral nozzle is movable in a direction parallel to the ejection direction of the multiphase fluid.

7. The cleaning nozzle according to any one of claims 1 to 6, characterized in that: A plurality of the peripheral nozzle ejection ports are provided so as to surround the multiphase fluid nozzle ejection port.

8. The cleaning nozzle according to any one of claims 1 to 6, characterized in that: The outer peripheral nozzle ejection port is provided in an annular shape so as to surround the mixed-phase fluid nozzle ejection port.

9. A cleaning device, characterized in that: have: The cleaning nozzle according to any one of claims 1 to 8; and A workbench is provided which is opposed to the cleaning nozzle and has a mounting surface on which a cleaning object is mounted.

10. A method for manufacturing a semiconductor element, characterized in that: include: A step of placing a semiconductor substrate on a worktable; as well as A cleaning step of cleaning the ground surface of the semiconductor substrate by passing the cleaning nozzle according to any one of claims 1 to 9.

11. The method for manufacturing a semiconductor device according to claim 10, wherein: Between the mounting step and the cleaning step, a grinding step of grinding the semiconductor substrate mounted on the stage to reduce the thickness of the semiconductor substrate is included.

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