Integrated ultrasonic transducer microelectronic assembly method, ultrasonic probe and system

Abstract

A method of manufacturing an ultrasonic transducer microelectronic assembly includes forming a transducer (302) directly on a flexible circuit (202) of a main circuit assembly (208), without any thing between the flexible circuit and the transducer, where the transducer is a piezoelectric transducer. In some examples, the method further includes integrating an electrode pattern (206) directly into the flex circuit (202). In some examples, the method includes directly attaching a piezo-electric crystal body to the electrode pattern using one of hot pressing, ACF, ACP, and a non-conductive epoxy (904).

Description

Technical Field

[0001] Embodiments of the subject matter disclosed herein relate to a method of manufacturing an ultrasound transducer assembly for an ultrasound probe and a system for using the same. Background Art

[0002] The ultrasonic probe may include various components that are mechanically, conductively or chemically coupled to form an ultrasonic transducer within a housing. For example, the ultrasonic transducer structure may include a crystal / ceramic element having piezoelectric properties. A positive electrode layer and a ground electrode layer may be applied to the back and front of the element, respectively. An acoustic backing material (also referred to as an acoustic absorber or carrier) may be adhered to the back of the element behind the positive electrode, and the ground electrode may be covered with one or more matching layers and / or lenses. The ultrasonic transducer may be communicatively coupled to the main circuit board assembly of the ultrasonic imaging system. In a typical ultrasonic probe, the transducer is connected to the main circuit board assembly via a large detachable connector. In this way, the ultrasonic probe can receive and transmit ultrasonic sound waves to image an object such as a patient. Summary of the invention

[0003] In one embodiment, a method includes forming a transducer directly on a flexible circuit of a main circuit assembly with nothing between the flexible circuit and the transducer, wherein the transducer is a piezoelectric transducer.

[0004] It should be understood that the above brief description is provided to introduce in a simplified form selected concepts that are further described in the detailed description. It is not meant to identify key or essential features of the claimed subject matter, the scope of which is solely defined by the claims that follow the detailed description. Furthermore, the claimed subject matter is not limited to implementations that solve any disadvantages noted above or in any part of this disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] The present invention will be better understood by reading the following description of non-limiting embodiments with reference to the accompanying drawings, in which:

[0006] Figure 1 An ultrasound imaging system is shown according to an exemplary embodiment.

[0007] Figure 2 A first example of a flexible printed circuit board for a transducer assembly according to an exemplary embodiment is shown.

[0008] Figure 3 An ultrasound transducer microelectronics assembly method according to an exemplary embodiment is shown.

[0009] Figure 4 A first example of an ultrasound probe according to an exemplary embodiment is shown.

[0010] Figure 5 A second example of a flexible printed circuit board for a transducer assembly according to an exemplary embodiment is shown.

[0011] Figure 6 A second example of an ultrasound probe according to an exemplary embodiment is shown.

[0012] Figure 7 A third example of a flexible printed circuit board for a transducer assembly according to an exemplary embodiment is shown.

[0013] Figure 8 A third example of an ultrasound probe according to an exemplary embodiment is shown.

[0014] Fig. 9 is a flow chart illustrating a first method of manufacturing an ultrasound probe including an ultrasound transducer microelectronic assembly.

[0015] Fig.10 is a flow chart illustrating a second method of manufacturing an ultrasound probe including an ultrasound transducer microelectronic assembly.

[0016] Fig.11 is a flow chart illustrating a third method of manufacturing an ultrasound probe including an ultrasound transducer microelectronic assembly.

[0017] Fig.12 is a fourth example of a flexible printed circuit board for a transducer assembly according to an exemplary embodiment. DETAILED DESCRIPTION

[0018] The following description relates to various embodiments of an ultrasonic transducer microelectronic assembly method, an ultrasonic probe including an ultrasonic transducer microelectronic assembly, and a medical imaging system including an ultrasonic probe. The ultrasonic transducer microelectronic assembly method allows the manufacture of a compact ultrasonic probe such as a patch probe. The method achieves a high degree of integration and compactness by avoiding the use of one or more detachable connectors that conductively couple the main circuit board assembly to the piezoelectric element including the transducer in a typical ultrasonic probe. Commonly used connectors are bulky and easily disconnected when dropped. Therefore, by avoiding the use of connectors, a more rugged and robust design is achieved while being able to significantly reduce packaging.

[0019] The disclosed ultrasound transducer microelectronic assembly method includes forming a transducer directly on a flexible circuit of a main circuit board assembly, with nothing between the flexible circuit and the transducer, wherein the transducer is a piezoelectric transducer. The present disclosure solves current challenges associated with the manufacture of ultra-compact ultrasound probe designs by improving durability and reducing overall probe size. This is achieved by integrating electrode patterns directly into the flexible circuit. In one example, the electrode pattern can be an electrode of the transducer, such as, for example, a top electrode (also referred to as an active electrode) of the transducer. In another example, the electrode pattern can be electrodes on both sides of the transducer, such as, for example, a top electrode and a bottom electrode (also referred to as a ground electrode) of the transducer. In another example, the electrode pattern can be an electrode (such as, for example, a top electrode or a bottom electrode) and a ground return connection. By integrating the electrode pattern into the flexible circuit, the transducer can be formed directly on the main circuit assembly, thereby avoiding the use of special connectors, cables, wires, etc. For example, a piezoelectric crystal body can be directly attached to the electrode pattern using standard attachment techniques, and additional layers can be applied to the electrode pattern to form a transducer assembly. The method may include folding the flexible circuit and the transducer formed thereon so as to vertically stack the transducer and the main circuit board.A battery may be conductively coupled, interposed between the transducer assembly and the main circuit assembly, and these components enclosed in a housing.

[0020] The main circuit board assembly may be designed with a custom ASIC that includes an acquisition system and a processing system configured to acquire image data corresponding to an object and process the image data to generate one or more data sets corresponding to the object. The ultrasound probe may be wirelessly integrated with a user interface (such as a tablet or smartphone environment) and a medical record system (such as a cloud-based system) via the main circuit board assembly. In this way, the present disclosure provides a compact medical imaging system.

[0021] Figure 1 An example of an ultrasound imaging system including an ultrasound probe is depicted in FIG. Figure 2 An example of a flexible printed circuit board that may be included in the disclosed ultrasound transducer microelectronic assembly is shown in FIG. Figure 3 An example of the disclosed ultrasound transducer microelectronics assembly method is shown in FIG. Figure 4 A first example of an ultrasound probe including the disclosed ultrasound transducer microelectronic assembly is shown in FIG. Figure 5 A second example of a flexible printed circuit board that may be included in the disclosed ultrasound transducer microelectronic assembly is shown in FIG. Figure 6 A second example of an ultrasound probe including an ultrasound transducer microelectronic assembly is shown in FIG. Figure 7 A third example of a flexible printed circuit board that may be included in the disclosed ultrasound transducer microelectronic assembly is shown in FIG. Figure 8A third example of an ultrasound probe including an ultrasound transducer microelectronic assembly is shown in FIG. Figures 9 to 11 A corresponding method for manufacturing an ultrasound probe including an ultrasound transducer microelectronic assembly is depicted in FIG. Fig.12 A fourth example of a flexible printed circuit board that may be included in the disclosed ultrasound transducer microelectronic assembly is shown in FIG.

[0022] Figure 1 A block diagram of a system 100 according to one embodiment is depicted. In the illustrated embodiment, the system 100 is an imaging system, and more specifically an ultrasound imaging system. As shown, the system 100 includes an ultrasound probe 106, a user interface 122, a medical record system 124, and a remote connection subsystem 160. Multiple dashed lines 130 represent communication couplings between components of the system 100. Multiple solid lines 140 represent communication couplings between components of the ultrasound probe 106. These components may be separate but located in a common room, or may be remote from each other. For example, one or more of the modules described herein may operate in a data server that has a different and remote location relative to other components of the system 100, such as a probe and a user interface. In one example, the ultrasound probe 106 may be a patch probe.

[0023] In the illustrated embodiment, the ultrasound probe 106 includes an ultrasound control system integrated into a flexible printed circuit board (PCB) 150 and a piezoelectric transducer including an array of elements 104, which are piezoelectric elements such as piezoelectric ceramics, high dielectric ceramics, single crystals, etc. The PCB 150 may include a controller 116, which may be part of a single processing unit (e.g., a processor) or distributed across multiple processing units. The controller 116 is configured to control the operation of the system 100, including, for example, image acquisition and image processing. In one example, the controller 116 of the PCB 150 controls the transmit beamformer 101 and the transmitter 102, which drives the elements 104 within the ultrasound probe 106 to transmit ultrasound signals (e.g., continuous or pulsed) into the body or volume (not shown) of the object. The controller 116 receives control signals from the receiver 108, the receive beamformer 110, the radio frequency (RF) processor 112, and the memory 114. The elements 104 and the ultrasound probe 106 may have a variety of geometric shapes. The ultrasound signal is backscattered from the in vivo structure (e.g., an inserted needle) to produce an echo that returns to the element 104. The echo is received by the receiver 108. The received echo is provided to the receive beamformer 110, which performs beamforming and outputs a radio frequency (RF) signal. The RF signal is then provided to the RF processor 112 that processes the RF signal. Alternatively, the RF processor 112 may include a complex demodulator (not shown) that demodulates the RF signal to form an I / Q data pair representing the echo signal. The RF or I / Q signal data may then be provided directly to the memory 114 for storage (e.g., temporary storage).

[0024] For example, the controller 116 may include an image processing module that receives image data (e.g., an ultrasound signal in the form of RF signal data or an I / Q data pair) and processes the image data. For example, the image processing module may process the ultrasound signal to generate two-dimensional (2D) slices or frames of ultrasound information (e.g., ultrasound images) or ultrasound waveforms (e.g., continuous or pulsed wave Doppler spectra or waveforms) for display to the operator. The image processing module may be configured to perform one or more processing operations based on a plurality of optional ultrasound modalities on the acquired ultrasound information. By way of example, ultrasound modalities may include color flow, acoustic radiation force imaging (ARFI), B mode, A mode, M mode, spectral Doppler, acoustic flow, tissue Doppler module, C scan, and elastic imaging. In addition, in some examples, one or more processing operations may include one or more image transformations, such as a Radon transform for identifying linear features in ultrasound images.

[0025] When echo signals are received, the acquired ultrasound information may be processed in real time during an imaging session (or scanning session). In addition or alternatively, the ultrasound information may be temporarily stored in the memory 114 during the imaging session and processed in a less than real-time manner in real-time or offline operation. An image memory 120 is included for storing processed slices or waveforms of acquired ultrasound information that are not scheduled for immediate display. The image memory 120 may include any known data storage medium, such as a permanent storage medium, a removable storage medium, etc. In addition, the image memory 120 may be a non-transitory storage medium.

[0026] In operation, the ultrasound system may acquire data, such as 2D data sets, spectral Doppler data sets, and / or volume data sets, by various techniques (e.g., three-dimensional (3D) scanning, real-time 3D imaging, volume scanning, 2D scanning using a probe with a positioning sensor, freehand scanning using voxel correlation techniques, scanning using a 2D or matrix array probe, etc.). An ultrasound spectrum (e.g., waveform) and / or image may be generated (at the controller 116) from the acquired data and displayed to an operator or user on the display device 118.

[0027] The controller 116 is operably connected to a user interface 122 that enables an operator to control at least some operations of the system 100. The ultrasound probe 106 may be communicatively coupled to the user interface 122 via one or more wireless networks. The controller 116 may also be coupled to a remote connection subsystem 160 that includes a remote connection interface 162 and a network server 164. Similarly, the controller 116 is communicatively coupled to a medical record system 124 that is configured to receive and / or store ultrasound image data. The medical record system 124 interacts with an imaging workstation 166. Thus, data and signal transmission between the ultrasound probe 106, the user interface 122, the medical record system 124, and the remote connection subsystem for generating, interpreting, and managing ultrasound images may be achieved via one or more wireless networks. The user interface 122 may include hardware, firmware, software, or a combination thereof that enables an individual (e.g., an operator) to directly or indirectly control the operation of the system 100 and its various components. As shown, the user interface 122 includes a display device 118 having a display area 117. In some embodiments, the user interface 122 may also include one or more user input devices 115, such as a physical keyboard, a mouse, and / or a touchpad. In one embodiment, a touchpad may be configured to the controller 116 and the display area 117 so that when the user moves a finger / glove / stylus on the surface of the touchpad, the cursor on the ultrasound image or Doppler spectrum on the display device 118 moves in a corresponding manner.

[0028] In an exemplary embodiment, the display device 118 is a touch-sensitive display (e.g., a touch screen) that can detect the presence of an operator's touch on the display area 117 and can also identify the location of the touch in the display area 117. The touch can be applied by, for example, at least one of an individual's hand, a glove, a stylus, etc. In this way, the touch-sensitive display can also be characterized as a user input device configured to receive input from an operator (such as a request to adjust or update the orientation of the displayed image). The display device 118 also transmits information from the controller 116 to the operator by displaying the information to the operator. The display device 118 and / or the user interface 122 can also perform audio communication. The display device 118 is configured to present information to the operator during or after an imaging or data acquisition session. The information presented can include ultrasound images (e.g., one or more 2D frames), graphic elements, measurement graphics of the displayed image, user-selectable elements, user settings, and other information (e.g., administrative information, patient's personal information, etc.).

[0029] In addition to the image processing module, the controller 116 may also include one or more of a graphics module, an initialization module, a tracking module, and an analysis module. The image processing module, the graphics module, the initialization module, the tracking module, and / or the analysis module may coordinate with each other to present information to the operator during and / or after the imaging session. For example, the image processing module may be configured to display the acquired image on the display device 118, and the graphics module may be configured to display a specified graphic with the displayed image, such as an optional icon related to the image (e.g., an image rotation icon) and a measurement parameter (e.g., data).

[0030] The screen of the display area 117 of the display device 118 is composed of a series of pixels that display data acquired using the ultrasound probe 106. The acquired data includes one or more imaging parameters calculated for each pixel or a group of pixels of the display (e.g., a group of pixels assigned the same parameter value), wherein the one or more calculated image parameters include one or more of intensity, velocity (e.g., blood flow velocity), color blood flow velocity, texture, granularity, contractility, deformation, and deformation rate values. This series of pixels then constitutes a display image and / or Doppler spectrum generated from the acquired ultrasound data.

[0031] Figures 2 to 8An example configuration with relative positioning of each component is shown. In at least one example, if it is shown as directly contacting or directly coupled to each other, such elements may be referred to as directly contacting or directly coupled, respectively. Similarly, in at least one example, the elements shown as being adjacent or adjacent to each other may be adjacent or adjacent to each other, respectively. For example, components placed in coplanar contact with each other may be referred to as being in coplanar contact. For another example, in at least one example, elements positioned to be spaced apart from each other and having only space therebetween without other components may be described and referenced as such. For another example, elements shown as being located above / below each other, located on opposite sides of each other, or located on the left / right side of each other may be described and referenced as such relative to each other. In addition, as shown in the figure, in at least one example, the topmost element or the point of the element may be referred to as the "top" of the component, and the bottommost element or the point of the element may be referred to as the "bottom" of the component. As used herein, top / bottom, upper / lower, above / below may be relative to the vertical axis of the figure, and may be used to describe the position of the elements relative to each other in the figure. Thus, in one example, elements shown as being above other elements are positioned vertically above other elements. For another example, the shapes of the elements depicted in the figures may be referred to as having those shapes (e.g., such as being round, straight, planar, curved, rounded, chamfered, angled, etc.). In addition, in at least one example, elements shown as intersecting each other may be referred to as intersecting elements or intersecting each other. In addition, in one example, elements shown as being within another element or being shown as being outside another element may be described and referenced as such.

[0032] exist Figure 2 An axis system 299 including a y-axis, an x-axis, and a z-axis is depicted in the following figures for indicating the relative positioning of components relative to each other. In an example, the y-axis may be a vertical axis (e.g., parallel to the gravity axis), the x-axis may be a lateral axis (e.g., a horizontal axis), and the z-axis may be a longitudinal axis. However, in other examples, the axes may have other orientations.

[0033] Reference now Figure 2 , schematically depicts a flexible printed circuit board 200 that may be included in a transducer assembly according to one embodiment. In one example, the flexible printed circuit board 200 may be included in Figure 1 The PCB 150 in the illustrated ultrasound probe 106 is the same or similar.

[0034] The flexible printed circuit board 200 can include a flexible circuit 202 that is integral with a main circuit board assembly (PCB) 208. In one example, an electrode pattern 206 can be directly integrated into the flexible circuit 202. In one example, the flexible circuit 202 is an elongated flexible segment having a plurality of electrical traces 204 routed therethrough. The electrical traces 204 are conductively coupled to the electrode pattern 206. In one example, the electrode pattern 206 is a top electrode 212. In one example, the elongated flexible segment including the flexible circuit 202 extends laterally from a side 210 of the PCB 208.

[0035] In some examples, the flexible circuit 202 can be made of a thin layer of polyimide or any other type of plastic that can withstand high temperatures and is highly resistant to chemicals and radiation. In some examples, the circuit can then be printed onto the polyimide layer using copper traces or conductive inks that form the electrical traces 204 and the top electrode 212. Additionally or alternatively, a copper foil can be rolled and annealed to the polyimide using an adhesive. In some examples, the copper can be coated with a photosensitive layer that is then exposed and etched to obtain the desired pattern of conductors and terminal pads.

[0036] In one example, flexible printed circuit board 200 may be a flexible-flexible board, such that flexible circuit 202 and PCB 208 are flexible structures. In other examples, PCB 208 may be a rigid-flexible board, such that flexible circuit 202 is a flexible structure and PCB 208 is a rigid structure. In some examples, PCB 208 may include a single-sided board. In other examples, PCB 208 may include a double-sided board. In yet other examples, PCB 208 may include a multi-layer board.

[0037] In one example, PCB 208 may include a reference Figure 1 The main circuit board of the ultrasound control system described above. For example, PCB 208 may include one or more of the following: transmitter and receiver channels for generating and processing ultrasound signals; analog-to-digital converters for converting analog transducer signals into digital signals; digital circuitry for performing beamforming, filtering, and other algorithms for processing ultrasound data; memory including RAM and / or flash memory; complex programmable logic devices (CPLDs); and control circuitry including one or more microcontrollers. PCB 208 may be prepared with a custom ASIC to integrate ultrasound control functions, improve performance, and increase efficiency.

[0038] Reference now Figure 3 , schematically depicts a transducer assembly 300 according to one embodiment. Specifically, the transducer assembly 300 including a manufacturing method is shown. The transducer assembly 300 includes a flexible printed circuit board 200 and a piezoelectric crystal body 302. Figure 2The components of the flexible printed circuit board 200 described above are numbered in the same manner and will not be reintroduced.

[0039] The piezoelectric crystal body 302 can be directly attached to the flexible circuit 202. Specifically, the piezoelectric crystal body 302 is directly attached to the electrode pattern 206 including the top electrode 212. The piezoelectric crystal body 302 uses the flexible circuit 202 and the electrode pattern 206 integrated therein as the transducer element conductor without applying a conductive coating or electrode pattern to the piezoelectric material. The piezoelectric crystal body 302 can be attached to the flexible circuit 202 using standard attachment strategies, including, for example, heat pressing, anisotropic conductive glue (ACP), anisotropic conductive film (ACF), ultrasonic bonding, non-conductive epoxy, etc. In this way, the piezoelectric crystal body 302 is directly attached to the main processing system (e.g., PCB 208, PCB 150) without anything between the piezoelectric crystal body and the main processing system, and without using detachable connectors, cables, or other standard conductive couplings.

[0040] The piezoelectric crystal body 302 is a piezoelectric material, such as lead zirconate titanate (PZT). In one example, the piezoelectric crystal body 302 can be a single crystal body. In one example, the piezoelectric crystal body 302 can be a composite material. The acoustic stack can be attached pre-processed, or alternatively formed on the piezoelectric crystal body 302 during the manufacture of the transducer assembly 300. In one entity, manufacturing the transducer on the flexure can include sub-dicing the element after the crystal body is attached to the flexure, with or without a subsequent cut filling step. In addition to the piezoelectric crystal body 302, the acoustic stack can also include one or more other layers, such as but not limited to a backing material, one or more matching layers, and a lens material. The specifications of the transducer assembly can be selected based on the application.

[0041] With the piezoelectric crystal body 302 conductively coupled to the PCB 208 and the acoustic stack formed thereon, the transducer assembly 300 can be folded so as to stack the PCB 208 and the piezoelectric crystal body 302 vertically. For example, a first fold can be made along the side 210 of the PCB 208 to vertically orient the flexible circuit 202. As used herein, when an object, feature, or component is oriented, it is generally parallel to the direction of an axis or plane. For example, when the flexible circuit 202 is vertically oriented, it is generally parallel to the y-axis. The first fold can be a downward fold about the axis system 299. A second fold can be made along line 304 to horizontally orient the flexible circuit 202 and the piezoelectric crystal body 302 mounted thereon in the xz plane relative to the axis system 299. In this way, the transducer assembly 300 provides a compact package.

[0042] Figure 4An ultrasound probe 400 is shown. The ultrasound probe 400 includes a housing 402, a transducer assembly 300 positioned inside the housing, and a battery 416 coupled to the transducer assembly 300. Figure 3 The components of the transducer assembly 300 described above are numbered in the same manner and will not be reintroduced. Figure 2 Components of the flexible printed circuit board 200 described above are numbered in the same manner and will not be reintroduced. The ultrasound probe 400 can be communicatively coupled to subsystems of the medical imaging system via one or more wireless networks, including, for example, a user interface, a medical record system, and a remote connection subsystem. In some examples, the ultrasound probe 400 can be connected to the reference Figure 1 The ultrasound probe 106 may be the same or similar to the medical imaging system 100 described in detail herein.

[0043] In one example, the housing 402 generally conforms to the shape of the transducer assembly 300 positioned therein. The housing 402 may be a layered construction, including, for example, a plastic shell exterior, a metal shield, and an acoustic insulator. In one example, the housing 402 may include a phase change chamber configured to be thermally connected to one or more heat generating components in the ultrasound probe 400 to dissipate heat generated by the components of the ultrasound probe 400. For example, the housing 402 may include a material configured to change phases (e.g., solid and liquid phases) in response to heat received from components of the ultrasound probe 400. In some examples, the ultrasound probe 400 may be controlled to cycle between scanning (e.g., for a few seconds) and stopping scanning (e.g., for a few minutes). Including a phase change material in the housing 402 may distribute heat dissipation over time. The ultrasound probe 400 may be attached or coupled to a patient in various ways. For example, the ultrasound probe 400 may be directly attached to the patient using one or more of a bandage, a strip, and an adhesive. An adhesive 436 applied to the peripheral portion 418 is schematically shown.

[0044] The ultrasound probe 400 includes a piezoelectric transducer 410. In one example, the piezoelectric transducer 410 may include a piezoelectric crystal body 302 formed on a top electrode 212 of a flexible circuit 202. In addition, the piezoelectric transducer 410 may include one or more additional layers to form a transducer structure. For example, the transducer structure or acoustic stack may include an acoustic backing material, a top electrode, a PZT crystal body, a bottom electrode, one or more matching layers, and / or a lens aligned along the y-axis. In one example, the lens may be positioned at a peripheral portion 418 of the transducer housing 402, through which ultrasonic radiation may be emitted and received. The acoustic stack is acoustically coupled to the lens, positioned along the y-axis so as not to obstruct the lens from receiving ultrasonic waves. The acoustic stack may include an array of piezoelectric elements (such as, for example, a piezoelectric crystal body 302) for converting received ultrasonic vibrations into voltage signals and for converting received voltage signals into ultrasonic vibrations. The acoustic backing material may be bonded to the side of the acoustic stack facing away from the lens. In one example, the transducer structure may include a bottom electrode (referred to as a ground electrode) applied to the piezoelectric crystal body 302, which may be electrically coupled to the flexible circuit 202 via a ground return connection to complete the circuit. The coupling of the ground return to the flexible circuit 202 may be accomplished by direct connections during assembly. For example, the ultrasound probe 400 may include a jumper wire coupling the flexible layer and the bottom electrode applied to the piezoelectric crystal body 302.

[0045] The ultrasound probe 400 includes a PCB 208. In one example, the PCB 208 includes a core PCB 408, a top shielding layer 414, and a bottom shielding layer 412. An insulating layer 404 is disposed above the PCB 208. The insulating layer 404 may be above the top shielding layer 414 and in coplanar contact with the top shielding layer. The insulating layer 404 may be sandwiched between the top shielding layer 414 and the inner surface of the housing 402. The flexible circuit 202 is integral with the core PCB 408. In one example, the flexible circuit 202 is folded into a vertical plane 424 and a horizontal plane 426. The horizontal plane 426 includes a top electrode 212 on which a piezoelectric transducer 410 is built. Folded in this manner, a surface 430 of the piezoelectric transducer 410, such as a lens, faces downward in the direction of the peripheral portion 418 of the ultrasound probe 400. In one example, the flexible circuit 202 also includes a flexible circuit tab 428 to facilitate easy connection to the battery 416.

[0046] The ultrasound probe 400 includes a battery 416 electrically coupled to the transducer assembly 300. In one example, the battery 416 is coupled to the PCB 208 via a flexible circuit tab 428. The battery 416 is interposed between the piezoelectric transducer 410 and the PCB 208. For example, the battery 416 is disposed below the bottom shield 412 (e.g., there is nothing between the battery and the bottom shield) and disposed above the piezoelectric transducer 410 (with the flexible circuit 202 between the battery and the piezoelectric transducer). In one example, the ultrasound probe 400 may include a thermistor to measure heating and limit operation in response to detecting heat greater than a threshold.

[0047] Reference now Figure 5 , schematically depicts a second example of a flexible printed circuit board 500 that may be included in a transducer assembly. In one example, the flexible printed circuit board 500 may be included in Figure 1 The PCB 150 in the illustrated ultrasound probe 106 is the same or similar.

[0048] The flexible printed circuit board 500 is configured similarly to the flexible printed circuit board 200. For example, the flexible printed circuit board 500 may include a flexible circuit 502 integral with a main circuit board assembly (PCB) 508. The flexible circuit 502 includes an electrode pattern 506 directly integrated into a flexible material (e.g., polyimide or a suitable material). The electrode pattern 506 may include a top electrode 512 and a ground return connection 514 directly integrated into the flexible circuit 502. The electrode pattern 506 may be conductively coupled to the PCB 508 via a plurality of electrical traces 504.

[0049] The flexible circuit 502 extends laterally from the side 510 of the PCB 508. A piezoelectric crystal body, such as the piezoelectric crystal body 302, may be directly attached to the top electrode 512 and the transducer formed thereon, such as additional layers applied thereto, if used. For example, a bottom electrode (or ground electrode) may be applied to the piezoelectric crystal body 302. The flexible circuit 502 may be folded along line 518 to place the ground return connection 514 in coplanar contact with the transducer (e.g., with the bottom electrode of the transducer). The flexible circuit 502 may include additional folds to vertically stack the PCB 508 and the transducer. For example, a first fold may be made along the side 510 of the PCB 508 to vertically orient the flexible circuit 502, which may be a downward fold about the axis system 299. A second fold may be made along line 516 to horizontally orient the flexible circuit 502 and the transducer mounted thereon in the xz plane relative to the axis system 299.

[0050] In one example, PCB 508 may include a reference Figure 1The main circuit board of the ultrasound control system described above. For example, PCB 508 may include one or more of the following: transmitter and receiver channels for generating and processing ultrasound signals; analog-to-digital converters for converting analog transducer signals into digital signals; digital circuitry for performing beamforming, filtering, and other algorithms for processing ultrasound data; memory including RAM and / or flash memory; complex programmable logic devices (CPLDs); and control circuitry including one or more microcontrollers. PCB 208 may be prepared with a custom ASIC to integrate ultrasound control functions, improve performance, and increase efficiency.

[0051] Figure 6 An ultrasound probe 600 is shown. The ultrasound probe 600 includes a housing 602, a transducer assembly 606 positioned inside the housing, and a battery 616 coupled to the transducer assembly 606. The ultrasound probe 600 can be communicatively coupled to subsystems of a medical imaging system via one or more wireless networks, including, for example, a user interface, a medical record system, and a remote connection subsystem. In some examples, the ultrasound probe 600 can communicate with a reference Figure 1 The components included in the ultrasound probe 600 may be the same as or similar to the ultrasound probe 106 described in the medical imaging system 100 of FIG. Figure 4 The components of the ultrasound probe 400 described in FIG. 1 are similar.

[0052] In one example, the housing 602 generally conforms to the shape of the transducer assembly 606 positioned therein. The housing 602 can be a layered construction including, for example, a plastic shell exterior, a metal shield, an acoustic insulator, and in some examples, can also include a phase change chamber configured to dissipate heat generated by components of the ultrasound probe 600, such as reference Figure 4 In some examples, the ultrasound probe 600 may be bandaged, wrapped, or glued to the patient, such as in reference Figure 4 Adhesive 636 applied to peripheral portion 618 is schematically shown.

[0053] Transducer assembly 606 can be similar to transducer assembly 300. For example, transducer assembly 606 includes: flexible circuit 502 and PCB 508; electrode pattern 506, which is directly integrated into flexible circuit 502; and piezoelectric transducer 610, which is directly attached to electrode pattern 506. In one example, piezoelectric transducer 610 may include Figure 3502 is formed on a top electrode 512 of a flexible circuit 502. In addition, the transducer assembly 606 may include one or more additional layers to form a transducer structure, such as, for example, an acoustic backing material, one or more matching layers, and / or a lens aligned along the y-axis. The transducer structure may include a bottom electrode applied to the piezoelectric crystal body 302, which may be electrically coupled to the PCB 508 via a ground return connection 514. In contrast to the ultrasound probe 400, the electrical coupling between the bottom electrode patterned on the piezoelectric crystal body and the ground return connection 514 is achieved by folding and bonding the flexible layer rather than using a jumper wire.

[0054] In one example, the PCB 508 includes a core PCB 608, a top shield layer 614, and a bottom shield layer 612. The insulating layer 604 is disposed above the PCB 508. For example, the insulating layer 604 may be sandwiched between the top shield layer 614 and the inner surface of the housing 602. The flexible circuit 502 is integral with the core PCB 608. In one example, the flexible circuit 202 also includes a flexible circuit tab 632 to provide a ground return connection. In one example, the flexible circuit 502 is folded into a first vertical plane 624, a first horizontal plane 626, a second vertical plane 628, and a second horizontal plane 630. The first horizontal plane 626 includes a top electrode 512 on which the piezoelectric transducer 610 is built. The second horizontal plane 630 includes a ground return connection 514 in coplanar contact with the piezoelectric transducer 610. Folded in this manner, a surface 634 of the piezoelectric transducer 610, such as a lens, faces downward in the direction of the peripheral portion 618 of the ultrasound probe 600.

[0055] The ultrasound probe 600 includes a battery 616 electrically coupled to the transducer assembly 606. In one example, the battery 616 is coupled to the PCB 508 via a flexible circuit tab 632. The battery 616 is interposed between the piezoelectric transducer 610 and the PCB 508. For example, the battery 616 is disposed below the bottom shield layer 612 (e.g., there is nothing between the battery and the bottom shield layer) and disposed above the piezoelectric transducer 610 (with the flexible circuit 502 between the battery and the piezoelectric transducer).

[0056] In this manner, the ultrasound probe 600 provides a durable and compact package including a top electrode and ground return connection without using a removable connector, cable, or other standard conductive coupling between the main circuit assembly and the transducer.

[0057] Reference now Figure 7 , schematically depicts a third example of a flexible printed circuit board 700 that may be included in a transducer assembly. In one example, the flexible printed circuit board 700 may be included in Figure 1The PCB 150 in the illustrated ultrasound probe 106 is the same or similar.

[0058] The flexible printed circuit board 700 and the Figure 2 and Figure 5 The flexible printed circuit board 200 and the flexible printed circuit board 500 described are configured similarly. For example, the flexible printed circuit board 700 may include a flexible circuit 702 integral with a main circuit board assembly (PCB) 708. The flexible circuit 702 includes an electrode pattern 706 directly integrated into a flexible material (e.g., polyimide or a suitable material). The electrode pattern 706 may include a first electrode and a second electrode of a transducer assembly directly integrated into the flexible circuit 702. For example, the first electrode may be a top electrode 712 and the second electrode may be a bottom electrode 714. The electrode pattern 706 may be conductively coupled to the PCB 708 via a plurality of electrical traces 704.

[0059] The flexible circuit 702 extends laterally from the side 710 of the PCB 708. A piezoelectric crystal body (such as Figure 3 The piezoelectric crystal body 302 of the PCB 708 may be directly attached to the top electrode 712 and the transducer formed thereon, such as additional layers applied thereto if used. The flexible circuit 202 may be folded along lines 718 and 720 to place the bottom electrode 714 in coplanar contact with the transducer. The flexible circuit 702 may include additional folds to stack the PCB 708 and the transducer vertically. For example, a third fold may be made along the side 710 of the PCB 708 to vertically orient the flexible circuit 702, which third fold may be a downward fold about the axis system 299. A fourth fold may be made along line 716 to horizontally orient the flexible circuit 702 and the transducer mounted thereon in the xz plane relative to the axis system 299.

[0060] In one example, PCB 708 may include a reference Figure 1 The main circuit board of the ultrasound control system described above. For example, PCB 708 may include one or more of the following: transmitter and receiver channels for generating and processing ultrasound signals; analog-to-digital converters for converting analog transducer signals into digital signals; digital circuitry for performing beamforming, filtering, and other algorithms for processing ultrasound data; memory including RAM and / or flash memory; complex programmable logic devices (CPLDs); and control circuitry including one or more microcontrollers. PCB 208 may be prepared with a custom ASIC to integrate ultrasound control functions, improve performance, and increase efficiency.

[0061] Figure 8An ultrasound probe 800 is shown. The ultrasound probe 800 includes a housing 802, a transducer assembly 806 positioned inside the housing, and a battery 816 coupled to the transducer assembly 806. The ultrasound probe 800 can be communicatively coupled to subsystems of a medical imaging system via one or more wireless networks, including, for example, a user interface, a medical record system, and a remote connection subsystem. In some examples, the ultrasound probe 800 can communicate with a reference Figure 1 The components included in the ultrasound probe 800 may be the same as or similar to the ultrasound probe 106 described in the medical imaging system 100 of FIG. Figure 4 Ultrasound probe 400 and Figure 6 The components of the ultrasound probe 600 described in FIG. 1 are similar.

[0062] In one example, the housing 802 generally conforms to the shape of the transducer assembly 806 positioned therein. The housing 802 can be a layered construction including, for example, a plastic shell exterior, a metal shield, and an acoustic insulator, and in some examples, can include a phase change chamber configured to dissipate heat generated by components of the ultrasound probe 800. In some examples, the ultrasound probe 800 can be bandaged, wrapped, or glued to the patient, such as with reference to Figure 4 and Figure 6 Adhesive 836 applied to peripheral portion 818 is schematically shown.

[0063] The transducer assembly 806 may be similar to the transducer assembly 300. For example, the transducer assembly 806 includes: a flexible printed circuit board 700 including a flexible circuit 702 and a PCB 708; an electrode pattern 706 directly integrated into the flexible circuit 702; and a piezoelectric transducer 810 directly attached to the electrode pattern 706. In one example, the piezoelectric transducer 810 may include a piezoelectric crystal body 302 formed on a top electrode 712 and a bottom electrode 714 attached to an opposite side of the piezoelectric crystal body 302. In some examples, the piezoelectric transducer 810 may include one or more additional layers to form a transducer structure, such as, for example, an acoustic backing material, an acoustic stack, one or more matching layers, and / or a lens aligned along the y-axis. Compared to the ultrasound probes 400 and 600, the bottom electrode 714 coupled between the PCB 708 and the piezoelectric crystal body is completely formed by wrapping the piezoelectric crystal body in a flexible layer.

[0064] In one example, the PCB 708 includes a core PCB 808, a top shielding layer 814, and a bottom shielding layer 812. The insulating layer 804 is disposed above the core PCB 808. For example, the insulating layer 804 may be sandwiched between the top shielding layer 814 and the inner surface of the housing 802. The flexible circuit 702 is integral with the core PCB 808. In one example, the flexible circuit 202 also includes a flexible circuit tab 832. In one example, the flexible circuit 702 is folded into a first vertical plane 824, a first horizontal plane 826, a second vertical plane 828, and a second horizontal plane 830. The first horizontal plane 826 includes the top electrode 712, on which the piezoelectric transducer 810 is built. The second horizontal plane 830 includes the bottom electrode 714, replacing any additional processing steps to pattern the piezoelectric transducer 810 with a ground return contact. Folded in this manner, a surface 834 of the piezoelectric transducer 810, such as a lens, faces downward in the direction of the peripheral portion 818 of the ultrasound probe 800.

[0065] The ultrasound probe 800 includes a battery 816 electrically coupled to the transducer assembly 806. In one example, the battery 816 is coupled to the core PCB 808 via a flexible circuit tab 832. The battery 816 is interposed between the piezoelectric transducer 810 and the core PCB 808. For example, the battery 816 is disposed below the bottom shield layer 812 (e.g., there is nothing between the battery and the bottom shield layer) and disposed above the piezoelectric transducer 810 (with the flexible circuit 702 between the battery and the piezoelectric transducer).

[0066] In this manner, ultrasound probe 800 provides a durable and compact package including top and bottom electrodes without the use of removable connectors, cables, or other standard conductive couplings between the main circuit assembly and the transducer.

[0067] Fig. 9 , Fig.10 and Fig.11 are flow charts of methods 900, 1000, and 1100, respectively, for making an ultrasonic transducer assembly, the method comprising forming a piezoelectric transducer directly on a flexible circuit of a main circuit assembly, with nothing between the flexible circuit and the transducer. Figures 2 to 4 The example depicted in the method 900 describes the Figure 5 to Figure 6 The example depicted in FIG. 1000 describes method 1000 and with respect to Figures 7 and 8 The example depicted in describes method 1100; however, it should be understood that methods 900, 1000, and 1100 may be implemented to produce other examples without departing from the scope of the present disclosure.

[0068] Reference now Fig. 9 , can be manufactured using method 900 Figure 4Ultrasound probe 400.

[0069] At 902, method 900 may include preparing a main circuit board assembly on a flexible or hybrid rigid-flexible substrate. In one example, the flexible portion of the assembly may include an elongated flexible segment having a plurality of electrical traces routed therethrough that are conductively coupled to a top electrode pattern integrated therein. In this step, standard electronic assembly is also performed.

[0070] At 904, method 900 may include directly attaching a lead zirconate titanate (PZT) crystal body or other suitable piezoelectric material to the top electrode pattern. For example, direct attachment may include fixing the PZT crystal body to the top electrode pattern using one of heat pressing, ACP, ACF, and non-conductive epoxy.

[0071] At 906 , method 900 can include scribing the attached piezoelectric crystal body.

[0072] At 908, method 900 can include applying a bottom electrode pattern to the PZT crystal body. For example, a conductive layer can be formed on the front side of the crystal body by electroplating a thin film of gold or silver on the surface.

[0073] At 910 , method 900 may include conductively coupling a bottom electrode to a main circuit board assembly, such as via a wire bond connection.

[0074] At 912, method 900 can include conductively coupling a battery to a main circuit board assembly. For example, the battery can be coupled via a length of a flexible circuit.

[0075] At 914, method 900 can include folding the flexible substrate. For example, the flexible substrate can be folded to vertically stack the transducer and the main circuit board assembly.

[0076] At 916, method 900 may include packaging the transducer assembly and a battery coupled thereto into a probe housing. For example, the housing may be a layered construction including, for example, a plastic shell exterior, a metal shield, an acoustic insulator, and in some examples, may include a phase change chamber.

[0077] At 918 , method 900 may include attaching an acoustic matching layer material to a bottom of the packaging assembly.

[0078] Reference now Fig.10 , can be manufactured using method 1000 Figure 6 Ultrasound probe 600.

[0079] At 1002, method 1000 may include preparing a main circuit board assembly on a flexible or hybrid rigid-flexible substrate. In one example, the flexible portion of the assembly may include an elongated flexible segment having a plurality of electrical traces routed therethrough that are conductively coupled to a top electrode pattern and a ground return connection integrated therein. In this step, standard electronic assembly is also performed.

[0080] At 1004, method 1000 may include directly attaching a lead zirconate titanate (PZT) crystal body or other suitable piezoelectric material to the top electrode. For example, direct attachment may include fixing the PZT crystal body to the top electrode pattern using one of heat pressing, ACP, ACF, and non-conductive epoxy.

[0081] At 1006 , method 1000 can include scribing the attached piezoelectric crystal body.

[0082] At 1008, method 1000 can include applying a bottom electrode pattern to the PZT crystal body. For example, a conductive layer can be formed on the front side of the crystal body by electroplating a thin film of gold or silver on the surface.

[0083] At 1010, method 1000 can include conductively coupling a ground return connection to the bottom electrode to the main circuit board assembly. Similarly, the ground return connection can be coupled to the bottom electrode using standard attachment methods such as heat compression or the like.

[0084] At 1012, method 1000 can include conductively coupling a battery to a main circuit board assembly. For example, the battery can be coupled to a length of a flexible circuit.

[0085] At 1014, method 1000 can include folding the flexible substrate. For example, the flexible substrate can be folded to vertically stack the transducer and the main circuit board assembly.

[0086] At 1016, method 1000 may include packaging the transducer assembly and a battery coupled thereto into a probe housing. For example, the housing may be a layered construction including, for example, a plastic shell exterior, a metal shield, an acoustic insulator, and in some examples, may include a phase change chamber.

[0087] At 1018 , method 1000 may include attaching an acoustic matching layer material to a bottom of the packaging assembly.

[0088] Reference now Fig.11 , can be manufactured using method 1100 Figure 8 Ultrasound probe 800.

[0089] At 1102, method 1100 may include preparing a main circuit board assembly on a flexible or hybrid rigid-flexible substrate. In one example, the flexible portion of the assembly may include an elongated flexible segment having a plurality of electrical traces routed therethrough that are conductively coupled to a top electrode pattern and a bottom electrode integrated therein. In this step, standard electronic assembly is also performed.

[0090] At 1104, method 1100 may include directly attaching a lead zirconate titanate (PZT) crystal body or other suitable piezoelectric material to the top electrode. For example, direct attachment may include securing the PZT crystal body to the top electrode pattern using one of heat pressing, ACP, ACF, and non-conductive epoxy. The top electrode may be coupled to the back side of the PZT crystal body.

[0091] At 1106 , method 1100 can include scribing the attached piezoelectric crystal body.

[0092] At 1108, method 1100 may include attaching the PZT crystal body directly to the bottom electrode. Similarly, the PZT crystal body may be coupled to the bottom electrode using standard attachment methods such as heat pressing, etc. The bottom electrode may be coupled to the front side of the PZT crystal body.

[0093] At 1110, method 1100 can include conductively coupling a battery to a main circuit board assembly. For example, the battery can be coupled to a length of a flexible circuit.

[0094] At 1112, method 1100 can include folding the flexible substrate. For example, the flexible substrate can be folded to vertically stack the transducer and the main circuit board assembly.

[0095] At 1114, method 1100 may include packaging the transducer assembly and a battery coupled thereto into a probe housing. For example, the housing may be a layered construction including, for example, a plastic shell exterior, a metal shield, an acoustic insulator, and in some examples, may include a phase change chamber.

[0096] At 1116 , method 1000 can include attaching an acoustic matching layer material to a bottom of the packaging assembly.

[0097] Fig.12 A fourth example of a flexible printed circuit board 1200 that may be included in a transducer assembly is shown. The flexible printed circuit board 1200 may be included in Figure 1 The PCB 150 in the illustrated ultrasound probe 106 is the same or similar.

[0098] The flexible printed circuit board 1200 and the reference Figure 2 , Figure 5 and Figure 7The flexible printed circuit board 200, the flexible printed circuit board 500, and the flexible printed circuit board 700 described are similarly configured. For example, the flexible printed circuit board 1200 may include a flexible circuit 1202 integral with a main circuit board assembly (PCB) 1208. The flexible circuit 1202 includes an electrode pattern 1206 directly integrated into a flexible material (e.g., polyimide or a suitable material). The electrode pattern 1206 may include a top electrode 1212 and a bottom electrode 1214 directly integrated into the flexible circuit 1202. The electrode pattern 1206 may be conductively coupled to the PCB 1208 via a plurality of electrical traces 1204. Compared to the flexible printed circuit board 700, the top electrode 1212 may include a ground loop, and the bottom electrode 1214 may include a plurality of element traces. Configured in this manner, the ground loop is arranged closer to the PCB 1208, and the element traces are arranged farther away from the PCB 1208. In some examples, such a configuration may simplify manufacturing.

[0099] In this way, the piezoelectric transducer is built directly onto the main circuit board assembly of the ultrasound imaging system, thereby avoiding the use of bulky, expensive and fragile removable connectors. The technical effect is an ultra-compact ultrasound probe with increased durability.

[0100] The present disclosure also provides support for a method, the method comprising: forming a transducer directly on a flexible circuit of a main circuit component, with nothing between the flexible circuit and the transducer, wherein the transducer is a piezoelectric transducer. In a first example of the method, the method further comprises: integrating an electrode pattern directly into the flexible circuit. In a second example of the method (optionally including the first example), the forming comprises attaching a piezoelectric crystal body directly to the electrode pattern using one of hot pressing, ACF, ACP, and non-conductive epoxy. In a third example of the method (optionally including one or both of the first and second examples), the flexible circuit comprises an elongated flexible segment having a plurality of electrical traces routed therethrough, the plurality of electrical traces being conductively coupled to the electrode pattern integrated therein. In a fourth example of the method (optionally including one or more or each of the first to third examples), the method further comprises folding the flexible circuit so as to vertically stack the transducer and the main circuit component. In a fifth example of the method (optionally including one or more or each of the first to fourth examples), the electrode pattern is an electrode of the transducer. In a sixth example of the method (optionally including one or more or each of the first to fifth examples), the electrode pattern includes electrodes on both sides of the transducer. In a seventh example of the method (optionally including one or more or each of the first to sixth examples), the electrode pattern is an electrode and a ground return connection. In an eighth example of the method (optionally including one or more or each of the first to seventh examples), the method further includes: finely dicing the attached piezoelectric crystal body.

[0101] The present disclosure also provides support for an ultrasound probe, the ultrasound probe comprising: a housing; a transducer assembly, the transducer assembly being positioned inside the housing, the transducer assembly comprising: a flexible printed circuit board, the flexible printed circuit board comprising a flexible circuit and a main circuit board assembly; an electrode pattern, the electrode pattern being directly integrated into the flexible circuit; and a piezoelectric transducer, the piezoelectric transducer being directly attached to the electrode pattern; and a battery, the battery being electrically coupled to the transducer assembly. In a first example of the system, the housing is a layered structure, including one or more of a plastic shell exterior, a metal shield, an acoustic insulator, and a phase change chamber. In a second example of the system (optionally including the first example), the electrode pattern also includes one of a bottom electrode and a ground return connection of the transducer assembly. In a third example of the system (optionally including one or both of the first and second examples), the piezoelectric transducer is conductively coupled to the main circuit board assembly via the flexible circuit without a detachable connector. In a fourth example of the system (optionally including one or more or each of the first to third examples), the ultrasound probe is communicatively coupled to the user interface via one or more wireless networks. In a fifth example of the system (optionally including one or more or each of the first to fourth examples), the ultrasound probe is a patch probe directly attached to the patient using one or more of a bandage, a strip, and an adhesive.

[0102] The present disclosure also provides support for an imaging system, the imaging system comprising: an ultrasound probe, the ultrasound probe comprising: a housing; a transducer assembly, the transducer assembly is positioned inside the housing, the transducer assembly comprising: a flexible printed circuit board, the flexible printed circuit board comprising a flexible circuit and a main circuit board assembly; an electrode pattern, the electrode pattern is directly integrated into the flexible circuit; and a piezoelectric transducer, the piezoelectric transducer is directly attached to the electrode pattern; and a battery, the battery is electrically coupled to the transducer assembly; and a user interface, the user interface is communicatively coupled to the ultrasound probe via one or more wireless networks, the user interface comprising a display device and a user input device, wherein the main circuit board assembly is configured to collect image data corresponding to an object and process the image data to generate one or more data sets corresponding to the object. In a first example of the system, the housing is a layered structure, including one or more of a plastic shell exterior, a metal shield, an acoustic insulator, and a phase change chamber. In a second example of the system (optionally including the first example), the electrode pattern is a first electrode of the transducer assembly. In a third example of the system (optionally including one or both of the first and second examples), the electrode pattern also includes one of a second electrode of the transducer assembly and a ground return connection. In a fourth example of the system (optionally including one or more or each of the first to third examples), the piezoelectric transducer includes a piezoelectric crystal body that is conductively coupled to the main circuit board assembly via the flexible circuit without a detachable connector.

[0103] As used herein, the elements or steps listed in the singular and beginning with the word "one" or "a kind of" should be understood as not excluding a plurality of said elements or steps, unless such exclusion is explicitly stated. In addition, the reference to "one embodiment" of the present invention is not intended to be interpreted as excluding the existence of additional embodiments that also include the cited features. In addition, unless explicitly stated to the contrary, "comprising", "including" or "having" an embodiment of an element or multiple elements with a specific characteristic may include additional such elements that do not have the characteristic. The terms "including" and "in..." are used as the concise language equivalents of the corresponding terms "including" and "wherein". In addition, the terms "first", "second" and "third" etc. are only used as marks, and are not intended to impose numerical requirements or specific positional order on their objects. As used herein, unless otherwise specified, the term "approximately" is understood to mean ±5% of the range.

[0104] This written description uses examples to disclose the invention, including the best mode, and also to enable a person skilled in the relevant art to practice the invention, including making and using any devices or systems and performing any included methods. The patentable scope of the invention is defined by the claims, and may include other examples that occur to a person skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insignificant differences from the literal language of the claims.

Claims

1. A method, comprising: A transducer (302) is formed directly on a flexible circuit (202) of a main circuit assembly (208) with nothing between the flexible circuit and the transducer, wherein the transducer is a piezoelectric transducer.

2. The method of claim 1, further comprising integrating an electrode pattern (206) directly into the flexible circuit (202).

3. The method of claim 2, wherein the forming comprises directly attaching the piezoelectric crystal body to the electrode pattern using one of heat pressing, ACF, ACP, and non-conductive epoxy (904).

4. The method of claim 2, wherein the flexible circuit (202) comprises an elongated flexible segment having a plurality of electrical traces (204) routed therethrough, the plurality of electrical traces being conductively coupled to the electrode pattern (206) integrated therein.

5. The method of claim 1, further comprising folding the flexible circuit to vertically stack the transducer and the main circuit assembly (914).

6. The method of claim 2, wherein the electrode pattern is an electrode of the transducer (902).

7. The method of claim 2, wherein the electrode pattern comprises electrodes on both sides of the transducer (714, 706).

8. The method of claim 2, wherein the electrode pattern is an electrode (506) and a ground return connection (514).

9. The method of claim 3, further comprising dicing the attached piezoelectric crystal body (906).

10. An ultrasound probe (400), comprising: Housing (402); A transducer assembly (300), the transducer assembly being positioned inside the housing, the transducer assembly comprising: A flexible printed circuit board (200), the flexible printed circuit board comprising a flexible circuit (202) and a main circuit board assembly (208); an electrode pattern (206) directly integrated into the flexible circuit; and a piezoelectric transducer (302) directly attached to the electrode pattern; and A battery (416) is electrically coupled to the transducer assembly.

11. The ultrasound probe of claim 10, wherein the housing (402) is a layered construction including one or more of a plastic shell exterior, a metal shield, an acoustic insulator, and a phase change chamber.

12. The ultrasound probe of claim 10, wherein the electrode pattern further comprises one of a bottom electrode (714) of the transducer assembly and a ground return connection (514).

13. The ultrasound probe of claim 10, wherein the piezoelectric transducer (302) is conductively coupled to the main circuit board assembly (208) via the flexible circuit (202) without a detachable connector.

14. The ultrasound probe of claim 10, wherein the ultrasound probe is communicatively coupled to a user interface (122) via one or more wireless networks.

15. The ultrasound probe of claim 10, wherein the ultrasound probe is a patch probe that is directly attached to the patient using one or more of a bandage, a tape, and an adhesive (636).

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