Wheel body moisturizing method in standby state, wafer cleaning device and storage medium

Abstract

The invention provides a wheel body moisturizing method in a standby state, a wafer cleaning device, a storage medium and electronic equipment, the wheel body moisturizing method in the standby state is applied to a driving mechanism in the wafer cleaning device, the driving mechanism comprises a wheel body and a rotating shaft, the rotating shaft and the wheel body synchronously rotate, and a first flow channel is formed in the rotating shaft; the wheel body internally comprises a second flow channel arranged along the radial direction of the wheel body, the outer edge of the wheel body is provided with a gap which is matched with a wafer and is communicated with the second flow channel, and the wheel body moisturizing method in the standby state comprises the following steps: if the wheel body is determined to be in the standby state, firstly controlling fluid to flow into the first flow channel in a second moisturizing mode, the fluid flows out from the outer edge of the wheel body through the second flow channel; and the fluid is sucked from the first flow channel in a negative pressure mode so as to moisturize the wheel body.

Description

Technical Field

[0001] The present application relates to the technical field of wafer cleaning, and in particular to a wheel moisturizing method in a standby state, a wafer cleaning device, a storage medium and an electronic device. Background Art

[0002] In the semiconductor field, CMP (Chemical Mechanical Polishing) is one of the core processes in the wafer manufacturing process. Pollution and / or particulate matter will be introduced into the wafer surface after CMP, so the wafer needs to be post-processed such as cleaning and drying.

[0003] Generally, a scrubbing system for cleaning wafers generally includes a driving module and a spraying module. The driving module drives the wafer to rotate, and the spraying module sprays a cleaning liquid onto the surface of the wafer for cleaning. However, in the prior art, the water consumption for moisturizing the driving module is large, resulting in high loss. Summary of the invention

[0004] In view of this, the present application provides a wheel moisturizing method in a standby state, a wafer cleaning device, a storage medium and an electronic device to at least partially solve the above-mentioned problems.

[0005] According to a first aspect of the present application, a wheel body moisturizing method in a standby state is provided, which is applied to a driving mechanism in a wafer cleaning device, the driving mechanism comprising a wheel body and a rotating shaft, the rotating shaft rotates synchronously with the wheel body, a first flow channel is arranged inside the rotating shaft, the wheel body comprises a second flow channel arranged along the radial direction of the wheel body, the outer edge of the wheel body is provided with a gap that cooperates with the wafer and communicates with the second flow channel, the wheel body moisturizing method in a standby state comprises: if it is determined that the wheel body is in a standby state, first controlling the fluid to flow into the first flow channel in a second moisturizing mode, and the fluid flows out from the outer edge of the wheel body through the second flow channel; and then sucking the fluid from the first flow channel in a negative pressure mode to moisturize the wheel body.

[0006] According to a second aspect of the present application, a wafer cleaning device is provided, comprising: a driving mechanism and a controller, the driving mechanism comprising a wheel body and a rotating shaft, the rotating shaft being used to drive the wheel body to rotate, a first flow channel being arranged inside the rotating shaft, the wheel body comprising a second flow channel arranged along the radial direction of the wheel body, the first flow channel being used to transport fluid to the second flow channel, the fluid flowing out from the outer edge of the wheel body through the second flow channel, the outer edge of the wheel body being provided with a gap which cooperates with the wafer and communicates with the second flow channel; the controller being used to execute the following method of moisturizing the wheel body in a standby state: if it is determined that the wheel body is in a standby state, the fluid is first controlled to flow into the first flow channel in a second moisturizing mode, the fluid flows out from the outer edge of the wheel body through the second flow channel; and then the fluid is sucked from the first flow channel in a negative pressure mode to moisturize the wheel body.

[0007] According to the third aspect of the present application, an electronic device is provided, comprising a processor, a memory, a communication interface and a communication bus, wherein the processor, the memory and the communication interface communicate with each other via the communication bus; the memory is used to store at least one executable instruction, and the executable instruction enables the processor to perform an operation corresponding to the method described in the first aspect.

[0008] According to a fourth aspect of the present application, a computer storage medium is provided, on which a computer program is stored, and when the program is executed by a processor, the method described in the first aspect is implemented.

[0009] In the present application, a first flow channel is arranged inside the rotating shaft of the driving mechanism, and a second flow channel is arranged inside the wheel body along the radial direction of the wheel body. Fluid is transported to the second flow channel through the first flow channel, and the fluid flows out from the outer edge of the wheel body through the second flow channel. The contact position between the wafer and the wheel body can be cleaned, thereby avoiding wear or contamination of the edge of the wafer. At the same time, when it is determined that the wheel body is in the standby state, the fluid is first controlled to flow into the first flow channel in a second moisturizing mode, and the fluid flows out from the outer edge of the wheel body through the second flow channel. Then, the fluid is sucked from the first flow channel in a negative pressure mode. By combining the delivery of fluid to the first flow channel and the second flow channel with the suction of fluid from the first flow channel and the second flow channel, not only the use of fluid can be reduced, but also the uniformity of the moist environment of the wheel body can be ensured, and the moist degree of the environment in which the wheel body is located can be controlled, thereby improving the moisturizing effect of the wheel body, slowing down the degradation of the wheel body due to improper moisturizing, and improving the service life of the wheel body.

[0010] In the semiconductor field, wafer cleaning is a necessary process. Wafer cleaning is performed after each process procedure, resulting in a large amount of water consumption in wafer production. Deionized water is usually used for wafer cleaning, and the cost of producing deionized water is also high. It is not conducive to energy saving, emission reduction, and carbon reduction. The solution provided by this application not only improves the yield of wafers, but also saves additional cleaning resources caused by wafer contamination or wear, which is conducive to enterprises to carry out ESG (Environment, Society, Governance) management. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions in the present application or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0012] Figure 1 is a schematic diagram of an exemplary driving mechanism according to an exemplary embodiment of the present application;

[0013] Figure 2 is a schematic diagram of an outer end cover of a wheel body in a driving mechanism according to an exemplary embodiment of the present application;

[0014] Figure 3 It is a flowchart of the steps of a wheel body moisturizing method in a standby state according to an exemplary embodiment of the present application;

[0015] Figure 4 It is a schematic diagram of determining whether a wheel body is in a standby state according to an exemplary embodiment of the present application;

[0016] Figure 5 It is a schematic diagram of the controlled amount of the fluid when the wheel body is in a standby state according to an exemplary embodiment of the present application;

[0017] Figure 6 is a schematic structural diagram of an electronic device according to an exemplary embodiment of the present application;

[0018] Figure 7 It is a schematic structural diagram of a wafer cleaning device according to an exemplary embodiment of the present application. DETAILED DESCRIPTION

[0019] In order to make those skilled in the art better understand the technical solutions in the embodiments, the technical solutions in the embodiments are clearly and completely described below in conjunction with the drawings in the embodiments. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field should fall within the scope of protection of this application.

[0020] Before describing the wheel body moisturizing method in the standby state of the embodiment, the application scenario of the wheel body moisturizing method in the standby state is briefly described for ease of understanding.

[0021] Reference Figure 1 , Figure 1 The present invention is a schematic diagram of an exemplary driving mechanism corresponding to a wheel moisturizing method in a standby state according to an exemplary embodiment of the present application. The wheel moisturizing method in a standby state of the present embodiment can be used for a driving mechanism 100 in a wafer cleaning device. The driving mechanism 100 includes a wheel body and a rotating shaft 103. The rotating shaft 103 can rotate synchronously with the wheel body. A first flow channel 105 is arranged inside the rotating shaft 103. The first flow channel 105 is arranged axially along the rotating shaft 103. The wheel body includes a second flow channel arranged radially along the wheel body. The first flow channel 105 is connected to the second flow channel. The fluid is transported to the second flow channel through the first flow channel 105. The fluid flows out from the outer edge of the wheel body through the second flow channel. The outer edge of the wheel body is provided with a gap that cooperates with the wafer and communicates with the second flow channel. The residual contaminants in the gap between the outer edge of the wheel body and the wafer can be washed by the fluid, thereby preventing the wafer from being contaminated.

[0022] In an embodiment, the wheel body may be the wheel body of a driving wheel or the wheel body of a driven wheel, and the fluid is used to clean the wafer or the wheel body supporting the wafer, which may be water, chemicals or any other appropriate fluid, which is not limited in this application.

[0023] In an optional implementation, the wheel body may include an outer end cover 101, an inner end cover 102 and an annular gasket 104. The outer end cover 101 and the inner end cover 102 are arranged on the rotating shaft 103 to form a gap, and the annular gasket 104 is clamped in the gap. The side of the outer end cover 101 opposite to the annular gasket 104 is provided with a first branch flow channel 108, and the side of the inner end cover 102 opposite to the annular gasket 104 is provided with a second branch flow channel 107. The first branch flow channel 108 and the second branch flow channel 107 constitute a second flow channel. Figure 2 The edge of the outer end cover 101 may be provided with a plurality of notches 109 along the circumferential direction, and the fluid flows out from the notches 109; or the outer end cover 101 may not be provided with notches, and the fluid flows out in the tangential direction of the wheel body.

[0024] In the semiconductor field, wafer cleaning is a necessary process. Wafer cleaning is performed after each process procedure, resulting in a large amount of water consumption in wafer production. Deionized water is usually used for wafer cleaning, and the cost of producing deionized water is also high. It is not conducive to energy saving, emission reduction, and carbon reduction. The solution provided by this application not only improves the yield of wafers, but also saves additional cleaning resources caused by wafer contamination or wear, which is conducive to enterprises to carry out ESG (Environment, Society, Governance) management.

[0025] Reference Figure 3 , shows a step flow chart of a wheel body moisturizing method in a standby state according to an exemplary embodiment of the present application.

[0026] The wheel body moisturizing method in the standby state of this embodiment comprises the following steps:

[0027] S202: Determine whether the wheel body is in a standby state.

[0028] Specifically, according to different scenarios corresponding to the cleaning of wafers, such as cleaning wafers, replacing wafers, and pausing the cleaning of wafers, the state of the wheel body includes a working state and a standby state. Among them, the working state refers to the state in which the stationary time t of the wheel body is less than or equal to the preset time threshold TH. For example, the working state may include the rotation state of the wheel body (the corresponding scenario is that there is a wafer being cleaned on the wheel body) and the state in which the wheel body is stationary and the stationary time t is less than or equal to the preset time threshold TH (the corresponding scenario is to replace the wafer); the standby state refers to the state in which the stationary time t of the wheel body is greater than the preset time threshold TH, and the corresponding scenario is to suspend the cleaning of the wafer (i.e., there is no wafer on the wheel body for a long time). Among them, the preset time threshold TH can be flexibly set by those skilled in the art according to the interval time of replacing the wafer. For example, the preset time threshold TH can be 10 minutes, and this embodiment does not limit this. The state of the wheel body can be judged by the rotation of the wheel body, or the state of the wheel body can be determined by the opening of the drive mechanism, and this embodiment does not limit this.

[0029] See also Figure 4 In an optional implementation, determining the state of the wheel body includes: monitoring whether the wheel body is in a stationary state; if the wheel body is not in a stationary state, determining that the wheel body is in a working state; if the wheel body is in a stationary state, obtaining the stationary time t of the wheel body, if the stationary time t is less than or equal to a preset time threshold TH, determining that the wheel body is in a working state; if the stationary time t is greater than the preset time threshold TH, determining that the wheel body is in a standby state.

[0030] Exemplarily, a sensor can be used to monitor whether the wheel body is in a stationary state. If it is monitored that the wheel body is not in a stationary state, it is determined that the wheel body is in a working state; if it is monitored that the wheel body is in a stationary state, the stationary time t of the wheel body is further obtained. If the stationary time t is less than or equal to a preset time threshold TH, it is determined that the wheel body is in a working state; if the stationary time t is greater than the preset time threshold TH, it is determined that the wheel body is in a standby state.

[0031] In this implementation, by monitoring whether the wheel body is in a stationary state, it is convenient and quick to determine whether the wheel body is in a working state or a standby state. Furthermore, when the wheel body is in a working state, there may be an interval time for replacing wafers. In order to avoid misjudging the interval time for replacing wafers as a standby state, by setting a preset time threshold TH, the wheel body is further judged to be in a working state or a standby state according to the stationary time t of the wheel body, thereby improving accuracy.

[0032] When the wheel body is in working state, there are basically wafers on the wheel body, so the fluid is controlled to flow into the first flow channel in the first moisturizing mode, specifically, the fluid is controlled to flow into the first flow channel in the micro-positive pressure mode, wherein the pressure of the fluid in the micro-positive pressure mode is greater than 0psi and less than 100psi, thereby, the pressure generated by the fluid at the outer edge of the wheel body can be close to 0, and the micro-positive pressure state is maintained to ensure that contaminants do not flow into the flow channel, and the pressure generated by the fluid does not cause damage to the wafer. If it is monitored that the wheel body switches from a moving state to a stationary state, it means that the wafer cleaning is completed. At this time, the fluid is controlled to flow into the first flow channel in the first moisturizing mode, specifically, the fluid is controlled to flow into the first flow channel in a flushing mode to flush the wheel body, and the fluid can be controlled to increase the flow rate to flush the flow channel and the wheel body to minimize the contaminants remaining from the previous wafer cleaning.

[0033] In addition, if the wheel body is in working state, the control amount of the fluid can be determined according to the film running frequency of the driving mechanism, wherein the film running frequency refers to the number of wafers that the driving mechanism can process per unit time. According to different film running frequencies, different control amounts of the fluid are set to moisturize the wheel body during the film running process. The wheel body can be moisturized after rinsing and before the wheel body carries the next wafer. The control amount of the fluid can include the opening interval, duration and flow rate, etc., which are not limited in this embodiment.

[0034] In an optional implementation, the first moisturizing mode includes a correspondence between different frequency intervals and a control amount of the fluid, the control amount includes an opening interval and a duration, and if the wheel body is in a working state, the fluid is controlled to flow into the first flow channel in the first moisturizing mode to moisturize the wheel body, including: if the wheel body is in a working state, determining the running frequency of the wafer cleaning device for processing the wafer; based on the first moisturizing mode, determining a target control amount of the fluid corresponding to the target frequency interval according to the target frequency interval corresponding to the running frequency; according to the target control amount of the fluid, controlling the fluid to flow into the first flow channel to moisturize the wheel body.

[0035] Exemplarily, the first moisturizing mode includes a correspondence between different frequency intervals and the control amount of the fluid. When the wheel body is in working condition, multiple frequency intervals can be set, corresponding to the control amounts of multiple fluids. By determining the target frequency interval corresponding to the running frequency, the target control amount of the corresponding fluid can be determined, that is, the target opening interval and the target duration; according to the target control amount of the fluid, the fluid is controlled to flow into the first flow channel to moisturize the wheel body.

[0036] In this implementation, when the wheel body is in a working state, a correspondence between different frequency intervals and the control amount of the fluid is set, so that the corresponding control amount of the fluid can be determined according to the frequency interval reached by the running frequency of the wheel body, thereby reducing the fluid loss while ensuring the moisturizing effect of the wheel body in a working state.

[0037] In an optional implementation, the frequency interval includes a first frequency interval, a second frequency interval and a third frequency interval that do not overlap with each other. Based on the first moisturizing mode, according to the target frequency interval corresponding to the running frequency, the target control amount of the fluid corresponding to the target frequency interval is determined, including: if the running frequency of the wheel body is in the first frequency interval, the target control amount of the fluid is determined to be the first control amount; if the running frequency of the wheel body is in the second frequency interval, the target control amount of the fluid is determined to be the second control amount, the value in the second frequency interval is greater than the value in the first frequency interval, and the second control amount is less than the first control amount; if the running frequency of the wheel body is in the third frequency interval, the target control amount of the fluid is determined to be the third control amount, the value in the third frequency interval is greater than the value in the second frequency interval, and the third control amount is less than the second control amount.

[0038] Exemplarily, the frequency interval may include a first frequency interval, a second frequency interval, and a third frequency interval that do not overlap each other. For example, the first frequency interval is less than 5 pcs / h, the second frequency interval is 5-15 pcs / h, and the third frequency interval is 15-30 pcs / h. The first frequency interval, the second frequency interval, and the third frequency interval may be flexibly set by those skilled in the art according to actual conditions, and this embodiment does not limit this. Among them, the value in the second frequency interval is greater than the value in the first frequency interval, and the value in the third frequency interval is greater than the value in the second frequency interval. Correspondingly, the second control amount is less than the first control amount, and the third control amount is less than the second control amount, that is, as the running frequency increases, the opening interval and duration of the fluid decrease.

[0039] Specifically, when the state of the wafer in the wafer cleaning device is combined for targeted control, the movement of the wheel body can be monitored, and the state of the wafer can be judged according to the movement state of the wheel body. If the wheel body is in motion, it means that there is a wafer on the wheel body, and the fluid is controlled to flow into the first flow channel in a micro-positive pressure mode, wherein the pressure of the fluid in the micro-positive pressure mode is greater than 0 psi and less than 100 psi.

[0040] When performing wafer cleaning, refer to Figure 1 , the side 106 of the annular pad 104 away from the rotation axis contacts the edge of the wafer through the gap, the outer end cover 101, the annular pad 104 and the inner end cover 102 rotate synchronously with the wafer around the axis direction of the rotation axis 103, and by maintaining a slight positive pressure of the fluid, after the fluid enters the first flow channel 105, the fluid flows through the first branch flow channel 108 and the second branch flow channel 107 respectively through both sides of the annular pad 104, and flows out from the side of the annular pad 104 away from the rotation axis, that is, flows out from the outer edge of the wheel body in the tangential direction of the wheel body. At this time, the control fluid flows into the first flow channel in a slight positive pressure mode, the fluid speed is low, and the pressure of the fluid is greater than 0psi and less than 100psi. While moisturizing the wheel body, it is ensured that the pollutants will be discharged outward with the flow of the fluid, and the pollutants are avoided from entering the interior of the flushing drive mechanism as much as possible, reducing the residual pollutants and ensuring the cleaning effect of the wafer.

[0041] Further, refer to Figure 2 The edge of the outer end cover 101 is provided with a plurality of notches 109 along the circumferential direction, and the height of the notches 109 can be the same as the gap on the wheel body. After the fluid flows through the first branch channel 108 and the second branch channel 107 respectively, it flows through the two sides of the annular pad 104, then passes through the gap in contact with the wafer, and finally flows out from the notch 109 of the outer end cover 101.

[0042] If it is determined that the wheel body is in the standby state, step S204 is first executed, and then step S206 is executed.

[0043] S204, controlling the fluid to flow into the first flow channel in the second moisturizing mode, and the fluid flows out from the outer edge of the wheel body through the second flow channel.

[0044] The first moisturizing mode is different from the second moisturizing mode.

[0045] For example, if the wheel body is in a standby state, the control amount of the fluid can be determined according to the standby time, and the control amount of the fluid can be set differently according to the different standby times. The control amount of the fluid can include an opening interval, a duration, and a flow rate, etc., which are not limited in this embodiment.

[0046] In an optional implementation, the second moisturizing mode includes a correspondence between different time intervals and a controlled amount of fluid, the controlled amount including an opening interval and a duration. If the wheel body is in a standby state, the fluid is controlled to flow into the first flow channel in the second moisturizing mode to moisturize the wheel body, including: if the wheel body is in a standby state, monitoring the standby time of the wheel body; based on the second moisturizing mode, determining a target controlled amount of the fluid corresponding to the target time interval according to a target time interval corresponding to the standby time; and controlling the fluid to flow into the first flow channel according to the target controlled amount of the fluid to moisturize the wheel body.

[0047] Exemplarily, the second moisturizing mode includes a correspondence between different time intervals and the controlled amount of fluid, referring to Figure 5 When the wheel body is in the standby state, multiple time intervals can be set, corresponding to the control amount of multiple fluids. A timer can be used to monitor the standby time of the wheel body, and the target time interval corresponding to the standby time can be determined, and then the target control amount of the corresponding fluid, that is, the target opening interval and the target duration, can be determined; according to the target control amount of the fluid, the fluid is controlled to flow into the first flow channel to moisturize the wheel body.

[0048] In this implementation, when the wheel body is in the standby state, a correspondence between different time intervals and the control amount of the fluid is set, so that the corresponding control amount of the fluid can be determined according to the time interval reached by the standby time of the wheel body, thereby ensuring the required moisturizing effect of the wheel body in the standby state and reducing fluid loss at the same time.

[0049] In an optional implementation, the duration interval includes a first duration interval, a second duration interval, and a third duration interval that do not overlap with each other. Based on the second moisturizing mode, according to the target duration interval corresponding to the standby time, the target control amount of the fluid corresponding to the target duration interval is determined, including: if the standby time of the wheel body is in the first duration interval, the target control amount of the fluid is determined to be the fourth control amount; if the standby time of the wheel body is in the second duration interval, the target control amount of the fluid is determined to be the fifth control amount, the value in the second duration interval is greater than the value in the first duration interval, and the fifth control amount is less than the fourth control amount; if the standby time of the wheel body is in the third duration interval, the target control amount of the fluid is determined to be the sixth control amount, the value in the third duration interval is greater than the value in the second duration interval, and the sixth control amount is less than the fifth control amount.

[0050] For example, refer to Figure 5 The duration interval may include a first duration interval, a second duration interval, and a third duration interval that do not overlap with each other. For example, the first duration interval is less than 2 hours, the second duration interval is 2 hours to 4 hours, and the third duration interval is greater than 4 hours. The first duration interval, the second duration interval, and the third duration interval may be flexibly set by those skilled in the art according to actual conditions, and this embodiment does not limit this. Among them, the value in the second duration interval is greater than the value in the first duration interval, and the value in the third duration interval is greater than the value in the second duration interval. Correspondingly, the fifth control amount is less than the fourth control amount, and the sixth control amount is less than the fifth control amount, that is, as the standby time increases, the opening interval and duration of the fluid both decrease.

[0051] In this implementation, by setting the opening interval and duration of the fluid to decrease as the standby time increases, the required moisturizing effect of the wheel body in the standby state can be ensured, and at the same time, the fluid loss can be further reduced.

[0052] In an optional implementation, the control quantity also includes the opening flow rate of the fluid. In the first moisturizing mode, the first opening flow rate of the fluid corresponding to different frequency intervals is the same; in the second moisturizing mode, the second opening flow rate of the fluid corresponding to different time intervals is the same; the first opening flow rate is less than or equal to the second opening flow rate.

[0053] S206, sucking fluid from the first flow channel in a negative pressure mode to moisturize the wheel body.

[0054] The above steps S202-S206 can be repeatedly performed until the wheel body no longer needs to be moisturized.

[0055] By sucking fluid from the first flow channel in a negative pressure mode, the fluid or gas in and outside the wheel body can be sucked out.

[0056] In order to provide good support for the wafer and prevent metal ion contamination of the wafer, the parts of the wheel that may have direct or indirect contact with the wafer are generally made of non-metallic materials such as plastic or rubber.

[0057] The fluid is controlled to flow into the first flow channel in the second moisturizing mode. After the fluid flows out from the outer edge of the wheel body through the second flow channel, the fluid will stop flowing into the first flow channel. At this time, some residual droplets will exist in the first flow channel, the second flow channel and the outer surface of the wheel body, and some mist droplets will also exist in the environment. Due to the effects of gravity and other factors, the distribution of droplets and mist droplets is uneven, which leads to differences in the degree of degradation at different positions of the wheel body.

[0058] During the cleaning process, the wheel needs to stably support the wafer and rotate synchronously with the wafer. Wheels with different degrees of degradation will affect the cleaning effect of the wafer.

[0059] The solution provided in this embodiment, which draws fluid from the first flow channel in a negative pressure mode, can ensure a uniform moist environment of the wheel body and control the degree of moisture in the environment where the wheel body is located, thereby improving the moisturizing effect of the wheel body, slowing down the deterioration of the wheel body due to improper moisturizing, and increasing the service life of the wheel body.

[0060] Specifically, the fluid may be sucked from the first flow channel in a negative pressure mode to make water droplets disappear in the gap at the outer edge of the wheel body, so as to moisturize the wheel body through the ambient humidity.

[0061] In addition, the suction pressure in the negative pressure mode can also be greater than 0 psi and less than 100 psi, that is, a slight negative pressure that can suck out water droplets in the gap at the outer edge of the wheel body but will not affect the humidity of the environment.

[0062] In the present application, when it is determined that the wheel body is in the standby state, the fluid is first controlled to flow into the first flow channel in the second moisturizing mode, and the fluid flows out from the outer edge of the wheel body through the second flow channel; then the fluid is sucked from the first flow channel in a negative pressure mode. By combining the delivery of fluid to the first flow channel and the second flow channel with the suction of fluid from the first flow channel and the second flow channel, not only can the use of fluid be reduced, but also the moisturizing environment of the wheel body is ensured to be uniform, and the moisturizing degree of the environment in which the wheel body is located can be controlled, thereby improving the moisturizing effect of the wheel body, slowing down the degradation of the wheel body due to improper moisturizing, and improving the service life of the wheel body.

[0063] Another embodiment of the present application provides a wafer cleaning device, including: a fluid supply module, a driving mechanism and a controller, the driving mechanism includes a wheel body and a rotating shaft, the rotating shaft rotates synchronously with the wheel body, a first flow channel is arranged inside the rotating shaft, the wheel body includes a second flow channel arranged along the radial direction of the wheel body, the first flow channel is used to transport the fluid provided by the fluid supply module to the second flow channel, the fluid flows out from the outer edge of the wheel body through the second flow channel, the outer edge of the wheel body is provided with a gap that cooperates with the wafer and communicates with the second flow channel; the controller is used to execute the above-mentioned standby state wheel body moisturizing method.

[0064] In one implementation, the method for moisturizing the wheel body in a standby state may include: if it is determined that the wheel body is in a standby state, first controlling the fluid to flow into the first flow channel in a second moisturizing mode, and the fluid flows out from the outer edge of the wheel body through the second flow channel; then sucking the fluid from the first flow channel in a negative pressure mode to moisturize the wheel body.

[0065] Optionally, in this embodiment, the fluid is sucked from the first flow channel in a negative pressure mode to moisturize the wheel body, including: sucking fluid from the first flow channel in a negative pressure mode to the gap at the outer edge of the wheel body until water droplets disappear, so as to moisturize the wheel body through ambient humidity.

[0066] Optionally, in this embodiment, the suction pressure of the negative pressure mode is greater than 0 psi and less than 100 psi.

[0067] Optionally, in this embodiment, the second moisturizing mode includes a correspondence between different time intervals and the control amount of the fluid, the control amount includes an opening interval and a duration, and if it is determined that the wheel body is in a standby state, the fluid is first controlled to flow into the first flow channel in the second moisturizing mode, and the fluid flows out from the outer edge of the wheel body through the second flow channel, including: if the wheel body is in the standby state, monitoring the standby time of the wheel body; based on the second moisturizing mode, according to the target time interval corresponding to the standby time, determining the target control amount of the fluid corresponding to the target time interval; according to the target control amount of the fluid, controlling the fluid to flow into the first flow channel.

[0068] Optionally, in this embodiment, the time interval includes a first time interval, a second time interval and a third time interval that do not overlap with each other, and the target control amount of the fluid corresponding to the target time interval is determined based on the second moisturizing mode according to the target time interval corresponding to the standby time, including: if the standby time of the wheel body is in the first time interval, the target control amount of the fluid is determined to be a fourth control amount; if the standby time of the wheel body is in the second time interval, the target control amount of the fluid is determined to be a fifth control amount, the value in the second time interval is greater than the value in the first time interval, and the fifth control amount is less than the fourth control amount; if the standby time of the wheel body is in the third time interval, the target control amount of the fluid is determined to be a sixth control amount, the value in the third time interval is greater than the value in the second time interval, and the sixth control amount is less than the fifth control amount.

[0069] Optionally, in this embodiment, the method also includes: monitoring whether the wheel body is in a stationary state; if the wheel body is in a stationary state, obtaining the stationary time t of the wheel body, if the stationary time t is less than or equal to a preset time threshold TH, determining that the wheel body is in the working state; if the stationary time t is greater than the preset time threshold TH, determining that the wheel body is in the standby state.

[0070] Optionally, in this embodiment, the control amount also includes an opening flow rate of the fluid, and in the second moisturizing mode, the second opening flow rates of the fluid corresponding to different time intervals are the same.

[0071] Reference Figure 6 , shows a schematic diagram of the structure of an electronic device according to an exemplary embodiment of the present application. The specific embodiment of the present invention does not limit the specific implementation of the electronic device.

[0072] like Figure 6 As shown, the electronic device may include: a processor (processor) 501, a memory (memory) 503, a communication bus (communication bus) 504, and a communication interface (Communications Interface) 505.

[0073] Wherein: the processor 501 , the memory 503 and the communication interface 505 communicate with each other via the communication bus 504 .

[0074] The communication interface 505 is used to communicate with other electronic devices or servers.

[0075] The processor 501 is used to execute the program 502, and specifically can execute the steps of any one of the wheel body moisturizing methods in the standby state in the above embodiments.

[0076] Specifically, the program 502 may include program codes, which include computer operation instructions.

[0077] The processor 501 may be a central processing unit (CPU), or an application specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the embodiment. The one or more processors included in the smart device may be processors of the same type, such as one or more CPUs; or processors of different types, such as one or more CPUs and one or more ASICs.

[0078] The memory 503 is used to store the program 502. The memory 503 may include a high-speed RAM memory, and may also include a non-volatile memory, such as at least one disk memory.

[0079] Program 502 can be specifically used to enable processor 501 to execute the steps of implementing any one of the wheel moisturizing methods in standby state described in the embodiments. The specific implementation of each step in program 502 can refer to the corresponding descriptions in the steps and units executed by any one of the wheel moisturizing methods in standby state in the above steps, which will not be repeated here. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working process of the above-described equipment and modules can refer to the corresponding process description in the aforementioned method embodiment.

[0080] See also Figure 7 , provides a wafer cleaning device, which may include a fluid supply module, a driving mechanism, and a controller.

[0081] Specifically, the wafer cleaning device includes a box body 601, a driving mechanism and a wafer 602 are placed in the box body; the driving mechanism may include: an A driving wheel 603, a B driving wheel 604 and a driven wheel 605, the A driving wheel 603 and the B driving wheel 604 are used to support the wafer 602, and the driven wheel 605 is used to detect the rotation speed of the wafer, and any one or more of the A driving wheel 603, the B driving wheel 604 and the driven wheel 605 may adopt the above-mentioned driving structure. The A driving wheel, the B driving wheel and / or the driven wheel adopting the above-mentioned driving structure are also connected to the fluid supply module. When the wafer is cleaned, the fluid supply module controls the fluid pressure so that the fluid flows into the corresponding A driving wheel, the B driving wheel and / or the driven wheel, thereby cleaning the wafer.

[0082] The driving wheel or driven wheel may include: a wheel body and a rotating shaft, the rotating shaft rotates synchronously with the wheel body, a first flow channel is arranged inside the rotating shaft, the wheel body includes a second flow channel arranged along the radial direction of the wheel body, the first flow channel is used to transport fluid to the second flow channel, the fluid flows out from the outer edge of the wheel body through the second flow channel, and the outer edge of the wheel body is provided with a gap that matches the wafer and communicates with the second flow channel. The specific structure is as above and will not be repeated here.

[0083] The embodiment further provides a computer storage medium on which a computer program is stored. When the program is executed by a processor, the wheel body moisturizing method in the standby state as described in any one of the above-mentioned multiple method embodiments is implemented.

[0084] The embodiment further provides a computer program product, including computer instructions, which instruct a computing device to execute operations corresponding to the wheel body moisturizing method in the standby state described in any one of the above-mentioned multiple method embodiments.

[0085] It should be pointed out that, according to the needs of implementation, the various components / steps described in the embodiment can be split into more components / steps, or two or more components / steps or partial operations of components / steps can be combined into new components / steps to achieve the purpose of the embodiment.

[0086] The above-mentioned method according to the embodiment can be implemented in hardware, firmware, or can be implemented as software or computer code that can be stored in a recording medium (such as CD ROM, RAM, floppy disk, hard disk or magneto-optical disk), or can be implemented as computer code that is originally stored in a remote recording medium or a non-temporary machine-readable medium downloaded through a network and will be stored in a local recording medium, so that the method described herein can be stored in such software processing on a recording medium using a general-purpose computer, a special-purpose processor or programmable or special-purpose hardware (such as ASIC or FPGA). It can be understood that a computer, a processor, a microprocessor controller or programmable hardware includes a storage component (e.g., RAM, ROM, flash memory, etc.) that can store or receive software or computer code, and when the software or computer code is accessed and executed by a computer, a processor or hardware, the method described herein is implemented. In addition, when a general-purpose computer accesses the code for implementing the method shown here, the execution of the code converts the general-purpose computer into a special-purpose computer for executing the method shown here.

[0087] Those of ordinary skill in the art will appreciate that the units and method steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0088] The above implementation modes are only used to illustrate the present application, and are not intended to limit the present application. Ordinary technicians in the relevant technical field may make various changes and modifications without departing from the spirit and scope of the present application. Therefore, all equivalent technical solutions also belong to the scope of the present application, and the scope of patent protection of the present application shall be limited by the claims.

Claims

1. A method for moisturizing a wheel body in a standby state, characterized in that: A driving mechanism used in a wafer cleaning device, the driving mechanism comprising a wheel body and a rotating shaft, the rotating shaft and the wheel body rotating synchronously, a first flow channel arranged inside the rotating shaft, the wheel body comprising a second flow channel arranged along the radial direction of the wheel body, the outer edge of the wheel body is provided with a gap matched with the wafer and communicating with the second flow channel, the wheel body moisturizing method in the standby state comprises: If it is determined that the wheel body is in the standby state, the fluid is first controlled to flow into the first flow channel in the second moisturizing mode, and the fluid flows out from the outer edge of the wheel body through the second flow channel; then the fluid is sucked from the first flow channel in a negative pressure mode to moisturize the wheel body.

2. The wheel moisturizing method in standby state according to claim 1, characterized in that: The step of sucking fluid from the first flow channel in a negative pressure mode to moisturize the wheel body comprises: Fluid is sucked from the first flow channel in a negative pressure mode to the water droplets at the gap at the outer edge of the wheel body, so that the wheel body is moisturized by environmental humidity.

3. The wheel body moisturizing method in standby state according to claim 1, characterized in that: The suction pressure in the negative pressure mode is greater than 0 psi and less than 100 psi.

4. The wheel moisturizing method in standby state according to claim 1, characterized in that: The second moisturizing mode includes a correspondence between different time intervals and a control amount of the fluid, the control amount includes an opening interval and a duration, and if it is determined that the wheel body is in a standby state, the fluid is first controlled to flow into the first flow channel in the second moisturizing mode, and the fluid flows out from the outer edge of the wheel body through the second flow channel, including: If the wheel body is in the standby state, monitoring the standby time of the wheel body; Based on the second moisturizing mode, determining a target control amount of the fluid corresponding to the target time interval according to the target time interval corresponding to the standby time; The fluid is controlled to flow into the first flow channel according to a target controlled amount of the fluid.

5. The wheel moisturizing method in standby state according to claim 4, characterized in that: The time interval includes a first time interval, a second time interval and a third time interval which do not overlap with each other, and the determining, based on the second moisturizing mode and according to the target time interval corresponding to the standby time, the target control amount of the fluid corresponding to the target time interval includes: If the standby time of the wheel body is within the first time interval, determining the target control amount of the fluid to be a fourth control amount; If the standby time of the wheel body is in the second time interval, the target control amount of the fluid is determined to be the fifth control amount, the value in the second time interval is greater than the value in the first time interval, and the fifth control amount is less than the fourth control amount; If the standby time of the wheel body is in the third time interval, the target control amount of the fluid is determined to be the sixth control amount, the value in the third time interval is greater than the value in the second time interval, and the sixth control amount is less than the fifth control amount.

6. The method for moisturizing a wheel body in a standby state according to claim 4, characterized in that: The method further comprises: Monitoring whether the wheel body is in a stationary state; If the wheel body is in a stationary state, the stationary time length of the wheel body is obtained. If the stationary time length is less than or equal to the preset time length threshold, it is determined that the wheel body is in the working state; if the stationary time length is greater than the preset time length threshold, it is determined that the wheel body is in the standby state.

7. The method for moisturizing a wheel body in a standby state according to claim 4, characterized in that: The control amount also includes an opening flow rate of the fluid. In the second moisturizing mode, the second opening flow rates of the fluid corresponding to different time intervals are the same.

8. A wafer cleaning device, characterized in that: include: Drive mechanism and controller, The driving mechanism includes a wheel body and a rotating shaft, the rotating shaft is used to drive the wheel body to rotate, a first flow channel is arranged inside the rotating shaft, the wheel body includes a second flow channel arranged along the radial direction of the wheel body, the first flow channel is used to transport fluid to the second flow channel, the fluid flows out from the outer edge of the wheel body through the second flow channel, and the outer edge of the wheel body is provided with a gap that matches the wafer and communicates with the second flow channel; The controller is used to execute the following wheel body moisturizing method in standby state: If it is determined that the wheel body is in the standby state, the fluid is first controlled to flow into the first flow channel in the second moisturizing mode, and the fluid flows out from the outer edge of the wheel body through the second flow channel; then the fluid is sucked from the first flow channel in a negative pressure mode to moisturize the wheel body.

9. The method for moisturizing a wheel body in a standby state according to claim 8, characterized in that: The step of sucking fluid from the first flow channel in a negative pressure mode to moisturize the wheel body comprises: Fluid is sucked from the first flow channel in a negative pressure mode to the water droplets at the gap at the outer edge of the wheel body, so that the wheel body is moisturized by environmental humidity.

10. The method for moisturizing a wheel body in a standby state according to claim 8, characterized in that: The suction pressure in the negative pressure mode is greater than 0 psi and less than 100 psi.

11. The method for moisturizing a wheel body in a standby state according to claim 8, characterized in that: The second moisturizing mode includes a correspondence between different time intervals and a control amount of the fluid, the control amount includes an opening interval and a duration, and if it is determined that the wheel body is in a standby state, the fluid is first controlled to flow into the first flow channel in the second moisturizing mode, and the fluid flows out from the outer edge of the wheel body through the second flow channel, including: If the wheel body is in the standby state, monitoring the standby time of the wheel body; Based on the second moisturizing mode, determining a target control amount of the fluid corresponding to the target time interval according to the target time interval corresponding to the standby time; The fluid is controlled to flow into the first flow channel according to a target controlled amount of the fluid.

12. The method for moisturizing a wheel body in a standby state according to claim 11, characterized in that: The time interval includes a first time interval, a second time interval and a third time interval which do not overlap with each other, and the determining, based on the second moisturizing mode and according to the target time interval corresponding to the standby time, the target control amount of the fluid corresponding to the target time interval includes: If the standby time of the wheel body is within the first time interval, determining the target control amount of the fluid to be a fourth control amount; If the standby time of the wheel body is in the second time interval, the target control amount of the fluid is determined to be the fifth control amount, the value in the second time interval is greater than the value in the first time interval, and the fifth control amount is less than the fourth control amount; If the standby time of the wheel body is in the third time interval, the target control amount of the fluid is determined to be the sixth control amount, the value in the third time interval is greater than the value in the second time interval, and the sixth control amount is less than the fifth control amount.

13. The method for moisturizing a wheel body in a standby state according to claim 11, characterized in that: The method further comprises: Monitoring whether the wheel body is in a stationary state; If the wheel body is in a stationary state, the stationary time length of the wheel body is obtained. If the stationary time length is less than or equal to the preset time length threshold, it is determined that the wheel body is in the working state; if the stationary time length is greater than the preset time length threshold, it is determined that the wheel body is in the standby state.

14. The method for moisturizing a wheel body in a standby state according to claim 11, characterized in that: The control amount also includes an opening flow rate of the fluid. In the second moisturizing mode, the second opening flow rates of the fluid corresponding to different time intervals are the same.

15. An electronic device, characterized in that: include: A processor, a memory, a communication interface and a communication bus, wherein the processor, the memory and the communication interface communicate with each other via the communication bus; The memory is used to store at least one executable instruction, and the executable instruction enables the processor to perform an operation corresponding to the method according to any one of claims 1 to 7.

16. A computer storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the method according to any one of claims 1 to 7 is implemented.

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