Modified curing agent, epoxy resin AB glue crystal adhesive and preparation method thereof

Abstract

The application relates to the technical field of AB glue crystal glue, and discloses a modified curing agent, an epoxy resin AB glue crystal glue and a preparation method thereof. The preparation method of the modified curing agent comprises the following steps: adding a catalyst and an epoxy curing agent into a reaction container, increasing the system temperature to 45-50 DEG C, stirring and adding a fatty acid, the adding process is 0.5 h; then the system temperature is increased to 60-70 DEG C, the system is kept for 2 h, then heated to 105 DEG C, vacuum dehydration treatment is carried out for 1 h; the system temperature is reduced to 60-70 DEG C, the first epoxy resin is added, the system is continuously kept and stirred for 6 h, the system viscosity change is monitored, until the system viscosity no longer changes, and the modified curing agent can be obtained. Through the preparation method, the modified curing agent retains the room temperature curing characteristics, has small humidity dependence on the environment, can reduce the demand on the use environment, is applied to the epoxy resin AB glue crystal glue, and after curing, has the performances of high hardness, high transparency, yellowing resistance after curing, high weather resistance after curing and the like.

Description

Technical Field

[0001] The present application relates to the technical field of AB glue and crystal glue, mainly to a modified curing agent, epoxy resin AB glue and crystal glue and a preparation method thereof. Background Art

[0002] Crystal glue is popular among the public as a decoration and handicraft. The crystal glue on the market is mainly epoxy resin AB glue crystal glue and UV crystal glue. Epoxy resin crystal glue currently occupies an important market share due to its advantages such as insulation, corrosion resistance, stability, heat resistance, high mechanical properties, strong cohesion, small curing shrinkage, and low cost. Epoxy resin AB glue crystal glue is composed of A glue epoxy resin as the main body and B glue curing agent as the main body. Among the epoxy resin AB glue crystal glues currently on the market, the vast majority of B glue uses amine curing agents. The use of amine curing agents has certain humidity requirements during curing. When the humidity is greater than 70%, the surface will become foggy, white, opaque, and wrinkled during the curing process. Therefore, epoxy resin AB glue crystal glue generally requires an air humidity between 40% and 60% during curing. Therefore, in the production workshop for batch production, equipment needs to be installed to ensure that the humidity reaches the required range. This will undoubtedly increase production costs. In addition, personal use will also be affected to a certain extent by the environment, affecting the performance of epoxy resin AB glue crystal glue. Therefore, the existing technology still needs to be improved and developed. Summary of the Invention

[0003] In view of the above-mentioned deficiencies in the prior art, the purpose of this application is to provide a modified curing agent, epoxy resin AB glue crystal glue and a preparation method thereof, aiming to solve the problem that the existing B glue using an amine curing agent epoxy resin AB glue crystal glue exhibits surface fogging, whitening, opacity and wrinkling when cured in a high humidity environment.

[0004] The technical solution of this application is as follows:

[0005] In a first aspect, the present application provides a method for preparing a modified curing agent, comprising the following steps:

[0006] Add the catalyst and epoxy curing agent to the reaction vessel, raise the system temperature to 45-50°C, and add the fatty acid with stirring. The addition process takes 0.5 hours.

[0007] Then the system temperature was raised to 60-70°C, kept warm for 2 hours, and then heated to 105°C and vacuumed for dehydration for 1 hour;

[0008] The system temperature is lowered to 60-70° C., the first epoxy resin is added, and the mixture is kept warm and stirred for 6 hours. The viscosity change of the system is monitored until the viscosity of the system no longer changes, thereby obtaining the modified curing agent.

[0009] The modified curing agent provided by the application can reduce the dependence on environmental humidity during curing, can reduce the requirements for the use environment, and can be applied to the curing of epoxy resin AB glue crystal glue, and the cured product has high hardness, high transparency, anti-yellowing performance, and high weather resistance.

[0010] Further, the epoxy curing agent is one or two of polyetheramine D200, polyetheramine D230, curing agent 593, and isophorone diamine.

[0011] In the application, the epoxy curing agent has good room temperature curing performance, the epoxy curing agent is modified by the provided preparation method, the curing performance under high humidity is improved, and the product cured under low humidity is also more transparent and has high hardness.

[0012] Further, the fatty acid is one of tung oil acid and linolenic acid.

[0013] In the application, the epoxy curing agent is chain-extended by using the fatty acid, the carbon chain is increased, the hydrophobic performance is enhanced, the influence of high humidity is reduced, and the transparency after curing is ensured.

[0014] Further, the first epoxy resin is one of a polymer of 4,4'-(1-methylethylidene) bisphenol and (chloromethyl) oxirane and 2,2-bis-(4-glycidyloxyphenyl) propane.

[0015] Further, in the preparation method of the modified curing agent, the first epoxy resin, the fatty acid, and the epoxy curing agent are added in a weight ratio of 10:5:85.

[0016] The catalyst is one or two of boron trifluoride, aluminum trichloride, organic tin, and organic bismuth.

[0017] The catalyst is added in a weight of 0.05% of the total amount of the first epoxy resin, the fatty acid, and the epoxy curing agent.

[0018] In a second aspect, the application also provides a modified curing agent, which is prepared by the preparation method of the modified curing agent in the first aspect.

[0019] In a third aspect, the application also provides a high-humidity-resistant cured epoxy resin AB glue crystal glue, which comprises A glue and B glue.

[0020] The B glue comprises the following components in parts by weight: 95-97 parts of the modified curing agent according to the second aspect, and 3-5 parts of alkyl primary amine.

[0021] Furthermore, the active diluent is one or two of n-butyl glycidyl ether, allyl glycidyl ether, and propylene carbonate;

[0022] The second epoxy resin is one of a polymer of 4,4'-(1-methylethylene)bisphenol and (chloromethyl)ethylene oxide and 2,2-bis-(4-glycolylaminophenyl)propane.

[0023] Furthermore, the primary alkyl amine is one of octadecylamine and hexadecylamine;

[0024] The anti-yellowing additive is one or two of antioxidant 1010, UV-9 ultraviolet absorber, and ultraviolet absorber 326.

[0025] In a fourth aspect, the present application further provides a method for preparing the high-humidity curing-resistant epoxy resin AB glue crystal glue as described in the third aspect, which comprises the following steps:

[0026] The second epoxy resin, reactive diluent and anti-yellowing agent are added to a reaction vessel in parts by weight, heated to 35-40° C., dispersed in a high-speed disperser at a stirring speed of 1000-1200 rpm for 15-20 minutes, and then vacuum-degassed to obtain the A glue;

[0027] The modified curing agent and alkyl primary amine are added to a reaction container in parts by weight, heated to 35-40° C., dispersed for 15-20 minutes using a high-speed disperser with a stirring speed of 1000-1200 rpm, and then vacuumed and degassed to obtain the B glue.

[0028] Beneficial effects: This application modifies the epoxy curing agent, extends the chain through fatty acids, reduces the content of amino groups in the molecule, and increases the molecular weight, thereby enhancing the hydrophobicity and further enhancing the moisture resistance, so that it can be cured normally under high humidity conditions and retains the original room temperature curing characteristics. The cured product has high hardness, high transparency and other characteristics. DETAILED DESCRIPTION

[0029] This application provides a modified curing agent, epoxy resin AB glue crystal glue, and a preparation method thereof. To make the purpose, technical solution, and effects of this application clearer and more specific, this application is further described below. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0030] Among the existing AB glues, amine curing agents have a relatively small molecular weight, so they are suitable for room temperature curing, and the cured product has high hardness and high transparency. However, because the amino groups in its structure are highly water-soluble, they are more sensitive to humidity and easily absorb moisture in the air, resulting in whitening, fogging, and wrinkling on the surface during curing.

[0031] To address this problem, the present application provides a method for preparing a modified curing agent, which comprises the following steps:

[0032] S1. Add the catalyst and epoxy curing agent to the reaction vessel, raise the system temperature to 45-50°C, and add the fatty acid with stirring. The addition process takes 0.5 hours.

[0033] S2, then raise the system temperature to 60-70°C, keep warm for 2 hours, then heat to 105°C, and vacuum dehydrate for 1 hour;

[0034] S3. Lower the temperature to 60-70°C, add epoxy resin, continue to keep warm and stir for 6 hours, monitor the viscosity change of the system until the viscosity of the system no longer changes, and then obtain the modified curing agent.

[0035] The epoxy curing agent is modified by the preparation method provided in the present application, and the chain is extended by fatty acids to reduce the content of amino groups in the molecule, while increasing the molecular weight, thereby enhancing the hydrophobicity and further enhancing the moisture resistance, so that it can be cured normally under high humidity conditions and retain the original room temperature curing characteristics. The cured product has high hardness, high transparency and other characteristics.

[0036] Furthermore, the epoxy curing agent is one or two of polyetheramine D200, polyetheramine D230, curing agent 593, and isophorone diamine. In this application, the selected epoxy curing agent has good room temperature curing properties. The preparation method provided herein modifies the amine epoxy curing agent to improve its curing properties under high humidity. The product cured under low humidity is also brighter, more transparent, and has higher hardness. Furthermore, after modification, the original room temperature curing properties are maintained, facilitating curing.

[0037] Furthermore, the fatty acid is one of eleostearic acid and linoleic acid. In the present application, the chain of the epoxy curing agent is extended by using fatty acid to increase the carbon chain, thereby enhancing the hydrophobicity, reducing the influence of water vapor under high humidity, and ensuring the transparency after curing.

[0038] Further, the first epoxy resin is one of a polymer of 4,4'-(1-methylethylidene) bisphenol and (chloromethyl)oxirane, and 2,2-bis-(4-aminophenoxy)propane. In the present application, the selected epoxy resin has a suitable molecular weight and epoxy equivalent weight, and has a high reaction performance while keeping the viscosity of the epoxy resin itself not high, which is beneficial to keeping the prepared modified curing agent having a good curing ability.

[0039] Further, in the preparation method of the modified curing agent, the adding weight ratio of the first epoxy resin, the fatty acid, and the epoxy curing agent is (first epoxy resin:fatty acid:epoxy curing agent=10:5:85). In the present application, the use amount of the first epoxy resin, the fatty acid, and the epoxy curing agent will affect the overall performance of the modified curing agent, and the suitable ratio is explored through experiments, which can balance the comprehensive performance of the modified curing agent. The present ratio is suitable for fine tuning. If the adding ratio of the epoxy resin is too high, the overall viscosity of the modified curing agent will be large, which will cause the AB adhesive to foam during mixing. If the adding ratio of the epoxy curing agent is too high, the humidity resistance performance will be reduced, and the modification effect will not be obvious. If the content of the fatty acid is too high, the yellowing resistance performance after curing will be poor. The present ratio can ensure the good curing effect of the modified curing agent.

[0040] In the present application, the selected epoxy curing agent has an amino group, and through the reaction of the fatty acid and the epoxy curing agent in step S1, the carboxyl group in the fatty acid and the amino group in the epoxy curing agent are dehydrated and condensed, the long carbon chain of the fatty acid is introduced into the epoxy curing agent, and the content of the amino group in the curing agent system is reduced. After the reaction, the introduced long carbon chain can enhance the hydrophobic property. At the same time, the prepared modified curing agent has high compatibility with the alkyl primary amine used in the B adhesive subsequently, which can avoid the curing defects caused by the insufficient compatibility of the B adhesive. Specifically, taking the reaction of tung oil acid and polyetheramine D230 as an example, the reaction formula is as follows:

[0041] .

[0042] Specifically, after step S1, water is generated in the reaction system, which is removed in step S2 to avoid affecting the subsequent reaction and the performance of the modified curing agent.

[0043] In the present application, through the reaction of the epoxy resin and the epoxy curing agent in step S3, the content of the amino group in the epoxy curing agent can be further reduced, and the reaction activity can be maintained. Specifically, taking the reaction of 2,2-bis-(4-aminophenoxy)propane and polyetheramine D230 as an example, the reaction formula is as follows:

[0044] .

[0045] Furthermore, the catalyst is one or two of boron trifluoride, aluminum trichloride, organic tin, and organic bismuth; the added weight of the catalyst is 0.05% of the total amount of the first epoxy resin, fatty acid, and epoxy curing agent.

[0046] By adjusting the curing properties of the epoxy curing agent through the preparation method provided in this application, a modified curing agent with good overall curing properties can be obtained, which can maintain good curing properties even under high humidity and avoid the problem of fogging during curing.

[0047] The present application also provides a modified curing agent, wherein the modified curing agent is prepared by the preparation method of the modified curing agent as described above. The prepared modified curing agent can be well applied to epoxy resin crystal glue to improve its curing performance and help improve the apparent performance after curing.

[0048] The present application also provides an epoxy resin AB glue crystal glue resistant to high humidity curing, comprising glue A and glue B, wherein glue A comprises the following components by weight: 85-90 parts of a second epoxy resin, 10-15 parts of a reactive diluent, and 0.5-1 part of an anti-yellowing additive;

[0049] Glue B comprises the following components by weight: 95-97 parts of the modified curing agent described above, and 3-5 parts of an alkyl primary amine;

[0050] The modified curing agent provided in this application can reduce the dependence of epoxy resin AB glue crystal glue on environmental humidity during curing, and can reduce the requirements for the use environment. In addition to the original room temperature curing characteristics, the prepared epoxy resin AB glue crystal glue also maintains high hardness, high transparency, yellowing resistance after curing, and high weather resistance after curing.

[0051] Specifically, the mass ratio of A glue and B glue in the high humidity resistant curing epoxy resin AB glue crystal glue is 2:1.

[0052] Furthermore, the active diluent is one or two of n-butyl glycidyl ether, allyl glycidyl ether, and propylene carbonate. In the present application, the active diluent selected can reduce the overall viscosity, thereby making it easy to eliminate bubbles generated after the mixture of glue A and glue B. In addition, the active diluent selected also has a certain reactivity and can ensure a transparent and bright degree after participating in the curing. Among them, the amino group in the modified curing agent of the present application has been adjusted, and the addition ratio of the active diluent should not be too high, as too high a ratio will reduce the overall reaction speed of the crystal glue.

[0053] Furthermore, the second epoxy resin is selected from a polymer of 4,4'-(1-methylethylidene)bisphenol and (chloromethyl)oxirane, or 2,2-bis-(4-glycolylaminophenyl)propane. In this application, the selected second epoxy resin has good curing properties and is consistent with the properties of the modified curing agent, which helps ensure high transparency after curing and avoid defects.

[0054] Furthermore, the alkyl primary amine is one of octadecylamine and hexadecylamine. In the present application, the selected octadecylamine and hexadecylamine can play a hydrophobic role, which can increase the hydrophobicity of the entire system, and at the same time act on the crystal glue curing reaction process to reduce the influence of moisture, which is conducive to improving transparency. Among them, the addition ratio of the alkyl primary amine should not be too high, as it will reduce the reaction speed.

[0055] The present application overcomes the problem of amine curing agents absorbing water during curing under high humidity conditions, resulting in fogging, wrinkling, and opacity on the surface, by modifying the epoxy curing agent and adding an alkyl primary amine.

[0056] Furthermore, the anti-yellowing agent is one or two of antioxidant 1010, UV-9 ultraviolet absorber, and ultraviolet absorber 326.

[0057] The present application also provides a method for preparing the epoxy resin AB glue crystal glue resistant to high humidity curing as described above, which comprises the following steps:

[0058] Add the second epoxy resin, reactive diluent and anti-yellowing additive into a reaction vessel according to weight, heat, stir and then vacuum degas to obtain glue A;

[0059] Add the modified curing agent and alkyl primary amine in parts by weight into a reaction container, heat, stir and then vacuum degas to obtain glue B;

[0060] In this preparation method, the heating temperature is 35-40°C and the heating time is 15-20 minutes;

[0061] In the preparation method, the stirring is carried out by a high-speed disperser, the stirring speed is 1000-1200 rpm, and the dispersion time is 15-20 minutes.

[0062] The preparation method provided in this application is simple and easy to implement, and is suitable for batch industrial production.

[0063] The following is further described with reference to specific examples.

[0064] The preparation method of the modified curing agent used in the examples of the present application comprises the following steps:

[0065] Add the catalyst and epoxy curing agent to the reaction vessel, raise the system temperature to 50°C, and add the fatty acid with stirring. The addition process takes 0.5 hours.

[0066] The system temperature was then raised to 70°C, kept warm for 2 h, and then heated to 105°C and vacuumed for dehydration for 1 h;

[0067] The system temperature was lowered to 65° C., the first epoxy resin was added, and the mixture was kept warm and stirred for 6 h. The viscosity change of the system was monitored until the viscosity of the system no longer changed to obtain the modified curing agent.

[0068] The epoxy curing agent is polyetheramine D230, the fatty acid is eleostearic acid, and the first epoxy resin is 2,2-bis-(4-glycolylaminophenyl)propane. The weight ratio of 2,2-bis-(4-glycolylaminophenyl)propane, eleostearic acid, and polyetheramine D230 is 10:5:85. The catalyst is an organotin catalyst, added at a weight of 0.05% of the total weight of 2,2-bis-(4-glycolylaminophenyl)propane, eleostearic acid, and polyetheramine D230.

[0069] Example 1

[0070] The high humidity curing resistant epoxy resin AB glue crystal glue of Example 1 is made by mixing glue A and glue B in a weight ratio of 2:1;

[0071] Glue A comprises the following components by weight: 85 parts of 2,2-bis-(4-glycolylaminophenyl)propane, 15 parts of propylene carbonate, and 0.5 parts of UV-9 ultraviolet absorber. The components are poured into a reaction vessel at once, heated to 40° C., dispersed in a high-speed disperser at a stirring speed of 1200 rpm for 20 minutes, and vacuum-degassing to obtain glue A.

[0072] Glue B includes the following components by weight: 95 parts of modified curing agent and 5 parts of hexadecylamine; each component is poured into a reaction kettle at once, heated to 40°C, dispersed with a high-speed disperser at a stirring speed of 1200 rpm for 20 minutes, and vacuum degassing to obtain glue B.

[0073] Example 2

[0074] The high humidity curing resistant epoxy resin AB glue crystal glue of Example 2 is made by mixing glue A and glue B in a weight ratio of 2:1;

[0075] Glue A comprises the following components by weight: 87 parts of 2,2-bis-(4-glycolylaminophenyl)propane, 13 parts of propylene carbonate, and 0.5 parts of UV-9 ultraviolet absorber. The components are poured into a reaction vessel at once, heated to 40° C., dispersed in a high-speed disperser at a stirring speed of 1200 rpm for 20 minutes, and vacuum-degassing to obtain glue A.

[0076] Glue B includes the following components by weight: 95 parts of modified curing agent and 5 parts of hexadecylamine; each component is poured into a reaction kettle at once, heated to 40°C, dispersed with a high-speed disperser at a stirring speed of 1200 rpm for 20 minutes, and vacuum degassing to obtain glue B.

[0077] Example 3

[0078] The high humidity curing resistant epoxy resin AB glue crystal glue of Example 3 is made by mixing glue A and glue B in a weight ratio of 2:1;

[0079] Glue A comprises the following components by weight: 90 parts of 2,2-bis-(4-glycolylaminophenyl)propane, 10 parts of propylene carbonate, and 0.5 parts of UV-9 ultraviolet absorber. The components are poured into a reaction vessel at once, heated to 40° C., dispersed in a high-speed disperser at a stirring speed of 1200 rpm for 20 minutes, and vacuum-degassing to obtain glue A.

[0080] Glue B includes the following components by weight: 95 parts of modified curing agent and 5 parts of hexadecylamine; each component is poured into a reaction kettle at once, heated to 40°C, dispersed with a high-speed disperser at a stirring speed of 1200 rpm for 20 minutes, and vacuum degassing to obtain glue B.

[0081] The performance test of the high humidity curing resistant epoxy resin AB glue crystal glue prepared in Examples 1-3 was carried out. The curing test results of Examples 1-3 under different humidity environments are shown in Table 1:

[0082] Table 1

[0083] Test items Example 1 Example 2 Example 3 25°C, 60% humidity The surface is bright, transparent, without white fog and wrinkles The surface is bright, transparent, without white fog and wrinkles The surface is bright, transparent, without white fog and wrinkles 25℃, 70% humidity The surface is bright, transparent, without white fog and wrinkles The surface is bright, transparent, without white fog and wrinkles The surface is bright, transparent, without white fog and wrinkles 25℃, 75% humidity The surface is bright, transparent, without white fog and wrinkles The surface is bright, transparent, without white fog and wrinkles The surface is bright, transparent, without white fog and wrinkles 25℃, 80% humidity The surface is bright, transparent, without white fog and wrinkles The surface is bright, transparent, without white fog and wrinkles The surface is bright, transparent, without white fog and wrinkles 25℃, 90% humidity The surface is bright, transparent, without white fog and wrinkles The surface is bright, transparent, without white fog and wrinkles The surface is bright, transparent, without white fog and wrinkles

[0084] The high humidity curing resistant epoxy resin AB glue crystal glue prepared in Examples 1-3 can maintain good curing performance under different humidity conditions, is not easy to absorb water, and does not show surface fogging, wrinkling, or opacity even under a high humidity of 90%.

[0085] Comparative Example 1

[0086] The AB glue crystal glue of Comparative Example 1 is prepared by mixing glue A and glue B in a weight ratio of 3:1;

[0087] Glue A is the same as that in Example 1;

[0088] Only epoxy curing agent 593 is used for B glue.

[0089] Comparative Example 2

[0090] The AB glue crystal glue of comparative example 2 is prepared by mixing glue A and glue B in a weight ratio of 3:1;

[0091] Glue A is the same as that in Example 1;

[0092] B glue only uses polyetheramine D230.

[0093] Comparative Example 3

[0094] The AB glue crystal glue of comparative example 3 is prepared by mixing glue A and glue B in a weight ratio of 3:1;

[0095] Glue A is the same as that in Example 1;

[0096] Glue B uses only isophorone diamine.

[0097] The performance test of the AB glue crystal glue prepared in Comparative Examples 1-3 was carried out. The curing test results of Comparative Examples 1-3 under different humidity environments are shown in Table 2:

[0098] Table 2

[0099] Test items Comparative Example 1 Comparative Example 2 Comparative Example 3 25°C, 60% humidity The surface is wrinkled and opaque The surface is bright, transparent, without white fog and wrinkles The surface is wrinkled and opaque 25℃, 70% humidity The surface is wrinkled and opaque The surface is bright, transparent, without white fog and wrinkles The surface is wrinkled and opaque 25℃, 75% humidity The surface is wrinkled and opaque The surface is foggy and wrinkled The surface is wrinkled and opaque 25℃, 80% humidity The surface is wrinkled and opaque The surface is foggy and wrinkled The surface is wrinkled and opaque

[0100] The AB glue crystal glue of Comparative Examples 1 and 3 showed wrinkles and opacity on the surface when cured under different humidity environments. The curing performance of Comparative Example 2 was better at 60% humidity and 70% humidity, but fogging and wrinkling occurred at 75% humidity and 80% humidity.

[0101] The performance comparison of Comparative Example 2 and Examples 1, 2, and 3 after curing at 75% humidity is shown in Table 3:

[0102] Table 3

[0103] Test items Comparative Example 2 Example 1 Example 2 Example 3 Surface appearance Opaque, wrinkled Bright and transparent Bright and transparent Bright and transparent Hardness (Shore D) 82D 81D 82D 82D 1 week outdoors after curing Yellowing in less than a week (more serious than indoors) No yellowing (no change compared to indoor) No yellowing (no change compared to indoor) No yellowing (no change compared to indoor)

[0104] The high-humidity-resistant epoxy resin AB glue crystal glue provided in the embodiments of the present application overcomes the problem of amine-based curing agents absorbing water during curing in high humidity, resulting in surface fogging, wrinkling, and opacity. Furthermore, the cured product exhibits high hardness, high transparency, and yellowing resistance.

[0105] It should be understood that the application of this application is not limited to the above examples. For ordinary technicians in this field, they can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of this application.

Claims

1. A method for preparing a modified curing agent, characterized in that: The following steps are involved: Add the catalyst and epoxy curing agent to the reaction vessel, raise the system temperature to 45-50°C, and add the fatty acid with stirring. The addition process takes 0.5 hours. Then the system temperature was raised to 60-70°C, kept warm for 2 hours, and then heated to 105°C and vacuumed for dehydration for 1 hour; Lower the system temperature to 60-70° C., add the first epoxy resin, continue to maintain the temperature and stir for 6 hours, and monitor the viscosity change of the system until the viscosity of the system no longer changes to obtain the modified curing agent; The epoxy curing agent is polyetheramine D230, the fatty acid is eleostearic acid, the first epoxy resin is 2,2-bis-(4-glycolylaminophenoxy)propane, and the weight ratio of 2,2-bis-(4-glycolylaminophenoxy)propane, eleostearic acid and polyetheramine D230 is 10:5:

85.

2. The method for preparing a modified curing agent according to claim 1, wherein The catalyst is one or two of boron trifluoride, aluminum trichloride, organotin and organobismuth; The added weight of the catalyst is 0.05% of the total added weight of the first epoxy resin, fatty acid and epoxy curing agent.

3. A modified curing agent, characterized in that The modified curing agent is prepared by the preparation method of any one of claims 1 to 2.

4. A high humidity resistant epoxy resin AB glue crystal glue, comprising A glue and B glue, characterized in that: The glue A comprises the following components by weight: 85-90 parts of a second epoxy resin, 10-15 parts of a reactive diluent, and 0.5-1 part of an anti-yellowing additive; The B glue comprises the following components in parts by weight: 95-97 parts of the modified curing agent as claimed in claim 3 and 3-5 parts of alkyl primary amine.

5. The high humidity curing resistant epoxy resin AB glue crystal glue according to claim 4, characterized in that: The active diluent is one or two of n-butyl glycidyl ether, allyl glycidyl ether, and propylene carbonate; The second epoxy resin is one of a polymer of 4,4'-(1-methylethylene)bisphenol and (chloromethyl)ethylene oxide, and 2,2-bis-(4-glycolylaminophenyl)propane.

6. The high humidity curing resistant epoxy resin AB glue crystal glue according to claim 4, characterized in that: The primary alkyl amine is one of octadecylamine and hexadecylamine; The anti-yellowing additive is one or two of antioxidant 1010, UV-9 ultraviolet absorber, and ultraviolet absorber 326.

7. A method for preparing the high humidity curing resistant epoxy resin AB glue crystal glue according to any one of claims 4 to 6, characterized in that: The following steps are involved: The second epoxy resin, reactive diluent and anti-yellowing agent are added to a reaction vessel in parts by weight, heated to 35-40° C., dispersed in a high-speed disperser at a stirring speed of 1000-1200 rpm for 15-20 minutes, and then vacuum-degassed to obtain the A glue; The modified curing agent and alkyl primary amine are added to a reaction container in parts by weight, heated to 35-40° C., dispersed for 15-20 minutes using a high-speed disperser with a stirring speed of 1000-1200 rpm, and then vacuumed and degassed to obtain the B glue.