Plating pot for electron beam evaporation coating

Abstract

The invention relates to the technical field of semiconductor equipment, in particular to a plating pot for electron beam evaporation coating, which comprises a vacuum cavity, an electron beam emission hole is arranged at the bottom in the vacuum cavity, a crucible is arranged in the vacuum cavity, a support is rotatably connected in the vacuum cavity, a plurality of planet pots are connected to the support, and planet shafts are arranged in the centers of the planet pots. The planet shaft is rotationally connected with the support through a rotating frame, a driving shaft is rotationally connected to the support, the axis of the driving shaft and the axis of the planet shaft are arranged in a staggered mode, and the driving shaft is connected with the planet shaft through an inclined connecting rod. The wafer is attached to the planetary pot, and the support drives the planetary pot to revolve for film coating. The driving shaft is started, the planet shaft rotates around the axis of the driving shaft, the planet pot continuously swings in a reciprocating mode, and the inclination angle of the planet pot during film coating is changed, especially for a film coating sample with an inclined side wall angle. The coating property of the inclined side wall of the sample can be greatly improved, and the situation that the side wall film coating is broken or the connection strength is not enough is avoided.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor equipment, and in particular to a plating pot for electron beam evaporation coating. Background Art

[0002] Electron beam evaporation is a commonly used thin film preparation technology in the semiconductor manufacturing process. Existing evaporation machines usually use electron beam evaporation crucible coating materials to coat wafers loaded on the orbiting planetary system.

[0003] The concave pot surface of the planetary pot in the orbiting planetary system makes the wafer loaded on the planetary pot not horizontally located directly above the crucible, and the orbital axis and the rotational axis of the planetary pot are not parallel, so the coating formed by the plating material evaporated from the same crucible and deposited on the same wafer that orbits and rotates at the same time will produce unevenness on the same wafer, affecting the coating effect of the wafer. Summary of the invention

[0004] In order to improve the uniformity of the coating, the present application provides a coating pot for electron beam evaporation coating.

[0005] The present application provides a coating pot for electron beam evaporation coating, which adopts the following technical solution: A plating pot for electron beam evaporation coating comprises a vacuum chamber, an electron beam emission hole is provided at the inner bottom of the vacuum chamber, a crucible is provided in the vacuum chamber and is located above the electron beam emission hole, a bracket is rotatably connected in the vacuum chamber and is located above the crucible, a plurality of planetary pots are connected to the bracket, a planetary shaft is provided at the center of the planetary pot, the planetary shaft is rotatably connected to the bracket through a rotating frame, a driving shaft is rotatably connected to the bracket, the axis of the driving shaft is staggered with the axis of the planetary shaft, and the driving shaft is connected to the planetary shaft through an inclined connecting rod.

[0006] By adopting the above technical solution, the wafer is attached to the planetary pot, and the bracket drives the planetary pot to revolve for coating. The drive shaft starts to drive the planetary shaft to rotate through the inclined connecting rod. Since the axes of the drive shaft and the planetary shaft are staggered, when the drive shaft drives the planetary shaft to rotate, the planetary shaft rotates around the axis of the drive shaft, thereby driving the planetary pot to swing back and forth continuously, thereby changing the tilt angle of the planetary pot during the coating process, especially for coating samples with inclined side wall angles, it can greatly improve the coating coverage at the inclined side wall of the sample, avoid the situation where the side wall thin film coating is disconnected or the connection strength is insufficient, and at the same time improve the coating uniformity on the sample surface.

[0007] Preferably, the planetary shaft is provided with a connecting shaft perpendicular to the planetary shaft, and both ends of the connecting shaft extend out of the planetary shaft. The rotating frame is rotatably connected with rotating shafts located on both sides of the planetary shaft, and the axis of the rotating shaft is perpendicular to the axis of the connecting shaft. The two rotating shafts are connected by two rotating rods, which are respectively located on both sides of the rotating shaft, and the rotating rods are parallel to the axis of the rotating shaft. A swivel is fixed on the rotating rod, and both ends of the connecting shaft are rotatably connected to the two swivel rings.

[0008] By adopting the above technical solution, the rotating shaft and the rotating rod cooperate with each other, which can not only support the planetary shaft and ensure the stability of the planetary shaft, but also provide multi-directional rotation space for the planetary shaft to ensure that the planetary shaft can rotate at multiple angles.

[0009] Preferably, the connecting rod is an electric telescopic rod, one end of which is connected to the driving shaft, and the other end of which is connected to the planetary shaft.

[0010] By adopting the above technical solution, the connecting rod can be retracted, so that the inclination angle of the planetary pot can be adjusted to meet the coating requirements of wafers of different specifications.

[0011] Preferably, the planetary shaft includes a hollow outer shaft and an inner shaft rotatably connected to the outer shaft, the end of the outer shaft is rotatably connected to the planetary pot, the end of the inner shaft is fixedly connected to the planetary pot, the connecting shaft is fixedly connected to the outer wall of the outer shaft, and the inner shaft is connected to a connecting rod.

[0012] By adopting the above technical solution, the planetary pot is connected to the rotating frame through the outer shaft, so as to achieve the purpose of reciprocating swing. At the same time, it can also rotate under the drive of the inner shaft, so as to realize the superposition of multiple motion states of the planetary pot, further improve the side wall coverage of the wafer sample coating, and improve the coating uniformity of the sample surface.

[0013] Preferably, a gear ring coaxially arranged with the driving shaft is fixed on the bracket, and a transmission shaft is rotatably connected to the side wall of the driving shaft. The axis of the transmission shaft is perpendicular to the axis of the driving shaft, and a gear meshing with the gear ring is coaxially fixed on the transmission shaft. The two ends of the connecting rod are respectively connected to the transmission shaft and the inner shaft through universal joints.

[0014] By adopting the above technical solution, when the driving shaft rotates, it drives the transmission shaft to revolve. The transmission shaft rotates synchronously with the cooperation of the ring gear and the gear. In this way, when the transmission shaft revolves, it will drive the connecting rod to revolve synchronously around the driving shaft, thereby driving the planetary pot to swing back and forth. The self-rotation of the transmission shaft itself will drive the connecting rod to rotate synchronously through the universal joint. When the connecting rod rotates, it drives the inner shaft to rotate through the universal joint at the other end, and the inner shaft drives the planetary pot to rotate. In this way, when the driving shaft rotates, it can drive the planetary pot to swing back and forth and rotate itself, thereby improving the side wall coverage of the wafer sample coating and improving the coating uniformity on the sample surface.

[0015] Preferably, an angle sensor is provided on the planetary shaft, a controller is provided in the vacuum chamber, the controller is electrically connected to the angle sensor, a servo motor is connected to the drive shaft, and the servo motor is electrically connected to the controller.

[0016] By adopting the above technical solution, the angle sensor and the servo motor respectively monitor and control the swing angle and the swing frequency of the planetary pot, thereby facilitating timely adjustment.

[0017] Preferably, a touch screen is provided on the outer surface of the vacuum chamber, and the touch screen is electrically connected to the controller.

[0018] By adopting the above technical solution, the operator can input parameters through the touch screen to control the controller, set different parameters for wafers of different specifications, and thus change the swing angle and frequency of the planetary pot.

[0019] Preferably, an annular track is provided in the vacuum chamber, and a roller that rolls along the track is rotatably connected to the bracket.

[0020] By adopting the above technical solution, the track and the roller cooperate to support and guide the rotation of the bracket, thereby improving the stability of the bracket and the planetary pot during revolution.

[0021] Preferably, a baffle for covering and opening the electron beam emission hole is horizontally rotatably connected in the vacuum chamber.

[0022] Preferably, the bracket includes a horizontally arranged turntable, and a plurality of support plates arranged around the turntable at an evenly inclined circumferential direction, and the planetary shaft and the planetary pot are installed at one end of the support plate away from the turntable.

[0023] By adopting the above technical solution, multiple planetary pots can be set at one time to improve the coating efficiency.

[0024] In summary, the present application includes at least one of the following beneficial technical effects: Through the inclined connecting rod, the drive shaft and the planetary shaft axis are staggered, and when the drive shaft drives the planetary shaft to rotate, the planetary shaft drives the planetary pot to swing back and forth, thereby improving the side wall coverage of the wafer sample coating; The connecting rod is retractable to adjust the swing amplitude of the planetary pot to meet the coating requirements of wafers of different specifications; The connecting rod is connected to the transmission shaft and the inner shaft through universal joints at both ends. When the driving shaft rotates, it can drive the planetary pot to swing back and forth and also drive the planetary pot to rotate. While saving the power device, it greatly improves the side wall coverage of the wafer sample coating and improves the coating uniformity on the sample surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall structure of the embodiment; Figure 2 is a schematic diagram of the connection between the support plate and the planetary pot in the embodiment; Figure 3 Schematic diagram of the connection between the drive shaft and the planetary shaft in the embodiment.

[0026] Description of reference numerals: 1. Vacuum chamber; 11. Electron beam emission hole; 12. Track; 13. Baffle; 2. Crucible; 3. Bracket; 31. Turntable; 32. Support plate; 321. Gear ring; 33. Roller; 34. Male shaft; 4. Planetary pot; 5. Planetary shaft; 51. Outer shaft; 52. Inner shaft; 53. Connecting shaft; 6. Rotating frame; 61. Rotating shaft; 62. Rotating rod; 63. Rotating ring; 7. Driving shaft; 71. Transmission shaft; 72. Gear; 8. Connecting rod. DETAILED DESCRIPTION

[0027] The present application is further described in detail below in conjunction with all the accompanying drawings.

[0028] Example

[0029] The present application embodiment discloses a coating pot for electron beam evaporation coating, referring to Figure 1 , comprising a vacuum chamber 1, the inner cavity of the vacuum chamber 1 is used for wafer coating.

[0030] Reference Figure 1 The vacuum chamber 1 is provided with a support 3, an umbrella-shaped planetary pot 4, a circular track 12, a baffle 13, a crucible 2 and an electron beam emission hole 11 from top to bottom. The crucible 2 and the electron beam emission hole 11 are directly opposite, and the electron beam emission hole 11 heats the crucible 2. The baffle 13 is horizontally rotated and connected above the crucible 2, and the baffle 13 shields and protects the electron beam emission hole 11. When coating, the baffle 13 is removed, and the crucible 2 is placed at the electron beam emission hole 11.

[0031] Reference Figure 1and Figure 2 The support 3 includes a horizontally arranged turntable 31 and a plurality of support plates 32 uniformly arranged around the turntable 31. A male shaft 34 connected to the vacuum chamber 1 for rotation is fixed at the center of the turntable 31. The motor drives the male shaft 34 to rotate, thereby driving the entire support 3 to revolve.

[0032] Reference Figure 1 and Figure 2 The support plate 32 is connected to the turntable 31 obliquely, the track 12 is arranged outside the support plate 32, and the track 12 and the male shaft 34 are arranged coaxially. The outer side of the support plate 32 is rotatably connected with a roller 33 that matches the track 12. When the support plate 32 revolves, the roller 33 rolls on the track 12, thereby improving the stability of the support plate 32 when revolving.

[0033] Reference Figure 2 and Figure 3 , the planetary pot 4 is installed on the inner side of the lower end of the support plate 32, and a planetary pot 4 is independently installed on each support plate 32. A rotating frame 6 is provided on the inner side of the lower end of the support plate 32, and the planetary pot 4 is connected to the support plate 32 through the rotating frame 6. A planetary shaft 5 is provided at the center of the planetary pot 4, and the planetary shaft 5 includes an outer shaft 51 and an inner shaft 52. The outer shaft 51 is hollow, and the inner shaft 52 is rotatably connected to the outer shaft 51. The end of the outer shaft 51 is rotatably connected to the planetary pot 4, and the end of the inner shaft 52 is fixedly connected to the planetary pot 4. The outer shaft 51 is connected to the rotating frame 6. The rotating frame 6 supports the planetary pot 4 through the outer shaft 51, and the inner shaft 52 can drive the planetary pot 4 to rotate around its own axis, thereby improving the side wall coating coverage of the wafer sample and improving the coating uniformity on the sample surface.

[0034] Reference Figure 2 and Figure 3 The outer wall of the outer shaft 51 is vertically fixed with a connecting shaft 53, and the connecting shaft 53 is provided with two connecting shafts 53 respectively located on both sides of the outer shaft 51 and extending outward along the radial direction of the outer shaft 51. The rotating frame 6 is rotatably connected with rotating shafts 61 located on both sides of the outer shaft 51, and the axis of the rotating shaft 61 is perpendicular to the axis of the connecting shaft 53. The two rotating shafts 61 are fixedly connected by two rotating rods 62, and the two rotating rods 62 are respectively located on both sides of the rotating shaft 61, and the rotating rods 62 are parallel to the axis direction of the rotating shaft 61. The rotating rods 62 are provided with rotating rings 63 facing the connecting shaft 53, and the two ends of the connecting shaft 53 are rotatably connected with the two rotating rings 63 respectively.

[0035] Reference Figure 2 and Figure 3 The connecting shaft 53 and the rotating shaft 61 cooperate with each other to limit and support the outer shaft 51, thereby ensuring the stability of the planetary pot 4. At the same time, the outer shaft 51 itself can rotate around the rotating shaft 61 or the connecting shaft 53, thereby driving the planetary pot 4 to swing and deflect, and adjusting the angle of the planetary pot 4 during coating, which can meet the requirements of wafer samples with different side wall angles for side wall coating coverage.

[0036] Reference Figure 2 and Figure 3 The inner side of the lower end of the support plate 32 is rotatably connected to a drive shaft 7 located in the rotating frame 6, and the drive shaft 7 is staggered with the axis of the planetary shaft 5. The drive shaft 7 and the planetary shaft 5 are connected by an inclined connecting rod 8, and the drive shaft 7 drives the planetary shaft 5 to rotate through the connecting rod 8, and the connecting rod 8 is an electric telescopic rod.

[0037] Reference Figure 2 and Figure 3 , the side wall of the driving shaft 7 is rotatably connected with a transmission shaft 71, and the axis of the transmission shaft 71 is perpendicular to the axis of the driving shaft 7. A gear ring 321 coaxial with the driving shaft 7 is fixed on the support plate 32, and a gear 72 meshing with the gear ring 321 is coaxially fixed on the transmission shaft 71. When the driving shaft 7 rotates, the transmission shaft 71 revolves around the axis of the driving shaft 7. At the same time, the gear 72 and the gear ring 321 cooperate with each other, and the transmission shaft 71 will rotate around its own axis. Universal joints are provided at both ends of the connecting rod 8, and the two ends of the connecting rod 8 are respectively connected to the transmission shaft 71 and the inner shaft 52 through universal joints.

[0038] Reference Figure 2 and Figure 3 When the driving shaft 7 rotates, the transmission shaft 71 is driven to revolve around the axis of the driving shaft 7, thereby driving the connecting rod 8 and the end of the inner shaft 52 close to the connecting rod 8 to revolve synchronously. The middle position of the planetary shaft 5 is defined by the rotating shaft 61 and the connecting shaft 53, so that the end of the inner shaft 52 close to the planetary pot 4 rotates around the axis of the driving shaft 7, and the axis of the inner shaft 52 is staggered from the axis of the driving shaft 7, so the planetary pot 4 will reciprocate.

[0039] At the same time, the transmission shaft 71 rotates around its own axis driven by the gear ring 321 of the gear 72, and the rotation of the transmission shaft 71 is transmitted to the connecting rod 8 through the universal joint, and the connecting rod 8 is then transmitted to the inner shaft 52 through the universal joint, thereby driving the inner shaft 52 to rotate, and the inner shaft 52 drives the planetary pot 4 to rotate. In this way, the planetary pot 4 rotates while swinging back and forth, further improving the coating coverage of the side wall of the wafer sample and improving the coating uniformity of the sample surface.

[0040] The driving shaft 7 is controlled by a servo motor, an angle sensor is provided on the planetary shaft 5, a controller is provided in the vacuum chamber 1, a touch screen is provided on the outer surface of the vacuum chamber 1, and the touch screen, the angle sensor, the servo motor and the connecting rod 8 are all electrically connected to the controller. The angle sensor sends the rotation angle of the planetary shaft 5 to the controller, and the operator can set parameters to the controller through the touch screen. The controller controls the servo motor and the connecting rod 8, and adjusts the swing frequency of the planetary pot 4 by controlling the speed of the servo motor, and adjusts the swing angle of the planetary pot 4 by controlling the length of the connecting rod 8 to meet the coating requirements of wafers of different specifications.

[0041] The implementation principle of the coating pot for electron beam evaporation coating in the embodiment of the present application is as follows: the operator mounts the wafer on the planetary pot 4, and the planetary pot 4 is mounted on the support plate 32. The operator sets parameters through the touch screen, and the controller controls the swing angle and frequency of the planetary pot 4 to ensure the coating coverage of the side wall of the wafer sample and the coating uniformity on the surface.

[0042] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A coating pot for electron beam evaporation coating, comprising a vacuum chamber (1), wherein an electron beam emission hole (11) is provided at the bottom of the vacuum chamber (1), a crucible (2) located above the electron beam emission hole (11) is provided in the vacuum chamber (1), a support (3) located above the crucible (2) is rotatably connected in the vacuum chamber (1), and a plurality of planetary pots (4) are connected to the support (3), wherein: A planetary shaft (5) is provided at the center of the planetary pot (4), and the planetary shaft (5) is rotatably connected to the support (3) through a rotating frame (6), and a driving shaft (7) is rotatably connected to the support (3), and the axis of the driving shaft (7) is staggered with the axis of the planetary shaft (5), and the driving shaft (7) is connected to the planetary shaft (5) through an inclined connecting rod (8).

2. The electron beam evaporation coating pot according to claim 1, characterized in that: The planetary shaft (5) is provided with a connecting shaft (53) perpendicular to the planetary shaft (5), and both ends of the connecting shaft (53) extend out of the planetary shaft (5). The rotating frame (6) is rotatably connected with rotating shafts (61) located on both sides of the planetary shaft (5), and the axis of the rotating shaft (61) is perpendicular to the axis of the connecting shaft (53). The two rotating shafts (61) are connected via two rotating rods (62), and the two rotating rods (62) are respectively located on both sides of the rotating shaft (61), and the axis direction of the rotating rods (62) and the rotating shaft (61) are parallel. A rotating ring (63) is fixed on the rotating rod (62), and both ends of the connecting shaft (53) are rotatably connected to the two rotating rings (63).

3. The electro-beam evaporation coating pot according to claim 1, characterized in that: The connecting rod (8) is an electric telescopic rod, one end of which is connected to the driving shaft (7), and the other end of which is connected to the planetary shaft (5).

4. The electro-beam evaporation coating pot according to claim 2, characterized in that: The planetary shaft (5) comprises a hollow outer shaft (51) and an inner shaft (52) rotatably connected to the outer shaft (51); the end of the outer shaft (51) is rotatably connected to the planetary pot (4); the end of the inner shaft (52) is fixedly connected to the planetary pot (4); the connecting shaft (53) is fixedly connected to the outer wall of the outer shaft (51); and the inner shaft (52) is connected to a connecting rod (8).

5. The electro-beam evaporation coating pot according to claim 4, characterized in that: A gear ring (321) coaxially arranged with the drive shaft (7) is fixed on the bracket (3); a transmission shaft (71) is rotatably connected to the side wall of the drive shaft (7); the axis of the transmission shaft (71) is perpendicular to the axis of the drive shaft (7); a gear (72) meshing with the gear ring (321) is coaxially fixed on the transmission shaft (71); and two ends of the connecting rod (8) are respectively connected to the transmission shaft (71) and the inner shaft (52) via universal joints.

6. The electro-beam evaporation coating pot according to claim 3, characterized in that: An angle sensor is provided on the planetary shaft (5), a controller is provided in the vacuum chamber (1), the controller is electrically connected to the angle sensor, and a servo motor is connected to the drive shaft (7), the servo motor is electrically connected to the controller.

7. The electro-beam evaporation coating pot according to claim 6, characterized in that: The outer surface of the vacuum chamber (1) is provided with a touch screen, and the touch screen is electrically connected to the controller.

8. The electro-beam evaporation coating pot according to claim 1, characterized in that: An annular track (12) is provided in the vacuum chamber (1), and a roller (33) is rotatably connected to the bracket (3) and rolls along the track (12).

9. The electro-beam evaporation coating pot according to claim 1, characterized in that: A baffle (13) for covering and opening the electron beam emission hole (11) is horizontally rotatably connected in the vacuum chamber (1).

10. The electro-beam evaporation coating pot according to claim 1, characterized in that: The support (3) comprises a horizontally arranged turntable (31) and a plurality of support plates (32) arranged around the turntable (31) at an evenly inclined angle in the circumferential direction. The planetary shaft (5) and the planetary pot (4) are mounted on one end of the support plate (32) away from the turntable (31).

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