Method for improving poor conduction of needle plate test IC support plate

Abstract

The invention relates to the technical field of I C support plate testing, in particular to a method for improving poor conduction of an I C support plate in a needle plate test, and the method comprises the steps: S1, obtaining the position of an interface board; judging whether the interface board is located at a preset position or not; s2, interface board information is read, and the air inlet pressure value of an air cylinder is obtained; s3, calculating the total elastic force of the probes of the interface board; s4, the clamping force required by the air cylinder is matched; whether the clamping force is within a preset interval or not is judged; the air inlet pressure value is adjusted to the preset interval; s5, the air cylinder clamping action is executed; judging whether the cylinder stroke reaches a set end point; and judging whether the interface board reaches a specified position. According to the invention, the input air pressure value of the air cylinder can be adjusted in real time, so that real-time adjustment can be carried out according to different interface boards to adapt to different types of interface boards.

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