Destroying circuit

Abstract

According to the destroying circuit, destroying control is carried out through a general purpose input / output (GPIO) port of a master controller, only a simple control program needs to be added, a control chip or a control module does not need to be additionally added, and the composition of the destroying circuit is simplified; the destroying action of the storage particles is controlled one by one through the master control GPIO, so that the power supply pressure of the destroying power supply is reduced; the current limiting module can control the safety current according to the power supply capability of the destroying power supply; the boosting module is used for boosting the voltage, the voltage of the destroying power supply does not need to be fixed and can be flexibly selected and matched, and the application requirement of the destroying voltage is reduced; the high heat generated by the large current is utilized to physically damage the storage particles, and the voltage obtained by the boosting module is utilized to damage logic devices in the storage particles, so that the destruction quality of the storage particles is improved.

Description

Technical Field

[0001] This article relates to solid state drive technology, and more particularly to a destruction circuit. Background Art

[0002] The destruction circuit can destroy the storage particles and the main control module on the solid-state storage hard disk, thereby destroying the solid-state storage hard disk that needs to be destroyed; Figure 1 Schematic diagram of the destruction circuit for related technologies, such as Figure 1 As shown, the interface circuit provides two power supplies, one is the working power supply required for the normal operation of the hard disk, and the other is the independent power supply required by the destruction circuit. The independent power supply part will have a destruction command signal input, and use an independent microcontroller (MCU) chip for control. The destruction command is directly issued to the MCU. After receiving the destruction command, the MCU starts the destruction program and controls each circuit to use a large current to destroy the target storage particles one by one with sufficient burning time; among them, the independent power supply is responsible for supplying power to the destruction circuit. The destruction circuit uses a high-power power conversion chip to convert the voltage, converting the 12-36 volt or higher voltage into a small voltage of 3 / 5 volts to obtain a considerable large current output, such as a fake Assume a 60-watt power supply with an output of 3 volts, then there is a current output of 60 / 3=20 amps. The target storage particles are continuously discharged using a current of 20 amps. As long as the time is sufficient, the large current will generate enough heat to melt the storage particles. The above entire process is controlled by an independent MCU chip. A switch MOS is hung under each target storage particle to be destroyed. One end of the MOS is grounded, and the other end is connected to the destruction power supply. The destruction power supply also acts on the storage particles to be destroyed, and the switch of the MOS is controlled by the MCU. The destruction time of each storage particle is also set by the MCU. When the destruction command is issued, the MCU executes the destruction program and melts the target storage particles one by one.

[0003] The destruction circuit in the related art has the following problems: a large number of power processing chips are used, including current limiting chips and power conversion chips. Since the power of a power conversion chip is fixed, a large current and large power consumption are required to destroy the storage particles. Therefore, three power conversion chips are needed, plus a current limiting chip and a power conversion chip dedicated to the MCU, which adds up to a total of 6 chips. In addition, the peripheral logic circuit of each chip inevitably increases the total circuit scale and space occupancy rate. The original design of the solid-state hard disk is to be small, light and thin, and to achieve the maximum storage rate in a limited area. The destruction circuit will occupy half of the wall space of the solid-state hard disk. This destruction circuit is contrary to the overall design of the solid-state hard disk; 2 Only using large current to destroy the target has low destruction efficiency and thoroughness. This single large current comes at a price. Large current destruction is overheating and burning. The whole process needs to give sufficient time for the heat to rise and melt the packaging and DIE of the target storage particles. During the melting process, the particles and PCB are damaged at the same time. It is uncertain whether the current can continue to flow during the destruction of the PCB. When the current path is destroyed and the current cannot flow, the destruction process is terminated. At this time, there is uncertainty whether the storage particles are completely destroyed. Therefore, there are certain defects in the destruction efficiency and thoroughness.

[0004] In summary, designing a destruction circuit with small size and high destruction efficiency has become a problem to be solved. Summary of the invention

[0005] The embodiment of the present application provides a destruction circuit, comprising: a destruction power supply, a current limiting module, a boost module, a main control module including a first grounding switch, and one or more second grounding switches for connecting the boost module and storage particles; the control ends of the first grounding switch and the second grounding switch are connected to the general input and output GPIO of the main control module, the output end of the first grounding switch is grounded, and the input end of the first grounding switch is connected to the first predetermined pins of all storage particles and the second predetermined pin of the main control; the output end of the boost module is connected to the first predetermined pins of all storage particles and the second predetermined pin of the main control, the first predetermined pin of each storage particle is respectively connected to the first end of a second grounding switch, and the second end of the second grounding switch is grounded; wherein, The destroy power supply is set to: when a destroy command is received from the host, power is supplied to the current limiting module; The current limiting module is configured to: perform current control on the output power supply of the destruction power supply to ensure that the current flowing into the boost module is a safe and controllable current value; The boost module is configured to: boost the output voltage of the current limiting module to reach a preset voltage value; The master control is configured to gradually close its own first grounding switch and a predetermined group of second grounding switches of storage particles to be destroyed through GPIO according to a preset time interval when receiving a destruction command from the host.

[0006] The disclosed embodiment performs destruction control through the general input and output (GPIO) port of the main control itself, and only needs to add a simple control program, without adding a control chip or control module, thereby simplifying the composition of the destruction circuit; the destruction action of the storage particles is controlled one by one through the GPIO of the main control, thereby reducing the power supply pressure of the destruction power supply; the safety current can be controlled according to the power supply capacity of the destruction power supply through the current limiting module; the voltage is boosted by the boost module, and the voltage of the destruction power supply does not need to be fixed, but can be flexibly selected, thereby reducing the application requirements of the destruction voltage; while using the high heat generated by the large current to physically damage the storage particles, the voltage obtained by the boost module is used to destroy the logic devices inside the storage particles, thereby improving the destruction quality of the storage particles.

[0007] Other features and advantages of the present application will be described in the following description, and partly become apparent from the description, or be understood by implementing the present application. Other advantages of the present application can be realized and obtained by the schemes described in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The accompanying drawings are used to provide an understanding of the technical solution of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solution of the present application and do not constitute a limitation on the technical solution of the present application.

[0009] Figure 1 Schematic diagram of the destruction circuit for related technology; Figure 2 The figure is a structural block diagram of a destruction circuit according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0010] The present application describes multiple embodiments, but the description is exemplary rather than restrictive, and it is obvious to those skilled in the art that there may be more embodiments and implementations within the scope of the embodiments described in the present application. Although many possible feature combinations are shown in the drawings and discussed in the specific embodiments, many other combinations of the disclosed features are also possible. Unless specifically limited, any feature or element of any embodiment may be used in combination with any other feature or element in any other embodiment, or may replace any other feature or element in any other embodiment.

[0011] The present application includes and contemplates combinations of features and elements known to those of ordinary skill in the art. The embodiments, features and elements disclosed in the present application may also be combined with any conventional features or elements to form a unique invention scheme. Any features or elements of any embodiment may also be combined with features or elements from other invention schemes to form another unique invention scheme. Therefore, it should be understood that any feature shown and / or discussed in the present application may be implemented individually or in any appropriate combination. Therefore, except for the limitations made according to the attached claims and their equivalents, the embodiments are not subject to other restrictions. In addition, various modifications and changes may be made within the scope of protection of the attached claims.

[0012] In addition, when describing representative embodiments, the specification may have presented the method and / or process as a specific sequence of steps. However, to the extent that the method or process does not rely on the specific order of the steps described herein, the method or process should not be limited to the steps of the specific order described. As will be understood by those of ordinary skill in the art, other sequences of steps are also possible. Therefore, the specific sequence of the steps set forth in the specification should not be interpreted as a limitation to the claims. In addition, the claims for the method and / or process should not be limited to the steps of performing them in the order written, and those skilled in the art can easily understand that these sequences can be changed and still remain within the spirit and scope of the embodiments of the present application.

[0013] Figure 2 FIG. 1 is a structural block diagram of a destruction circuit according to an embodiment of the present disclosure, such as Figure 2 As shown, it includes: a destruction power supply, a current limiting module, a boost module, a main control module including a first grounding switch, and one or more second grounding switches for connecting the boost module and the storage particles; the control ends of the first grounding switch and the second grounding switch are connected to the general input and output (GPIO) of the main control module, the output end of the first grounding switch is grounded, the output end of the first grounding switch is grounded, and the input end of the first grounding switch is connected to the first predetermined pins of all storage particles and the second predetermined pin of the main control; the output end of the boost module is connected to the first predetermined pins of all storage particles and the second predetermined pin of the main control, the first predetermined pin of each storage particle is respectively connected to the first end of a second grounding switch, and the second end of the second grounding switch is grounded; wherein, The destroy power supply is set to: when a destroy command is received from the host, power is supplied to the current limiting module; The current limiting module is configured to: perform current control on the output power supply of the destruction power supply to ensure that the current flowing into the boost module is a safe and controllable current value; The boost module is configured to: boost the output voltage of the current limiting module to reach a preset voltage value; The master control is configured to gradually close its own first grounding switch and a predetermined group of second grounding switches of storage particles to be destroyed through GPIO according to a preset time interval when receiving a destruction command from the host.

[0014] In the embodiment of the present disclosure, each time a group of storage particles to be destroyed is destroyed, the first ground switch remains closed. When the destruction is completed, the first ground switch is opened, and when the next group of storage particles to be destroyed is destroyed, it is closed again; that is, the first ground switch is closed and opened at a preset time interval, and the second ground switch that is closed each time is the second ground switch connected to the storage particles to be destroyed. In the embodiment of the present disclosure, when the main control receives a destruction instruction and starts the destruction process, the first ground switch of the main control and the second ground switch of a predetermined group of storage particles to be destroyed are gradually closed through GPIO, thereby realizing the destruction of the storage particles with the second ground switch closed.

[0015] The disclosed embodiment performs destruction control through the general input and output (GPIO) port of the main control itself, and only needs to add a simple control program, without adding a control chip or control module, thereby simplifying the composition of the destruction circuit; the destruction action of the storage particles is controlled one by one through the GPIO of the main control, thereby reducing the power supply pressure of the destruction power supply; the safety current can be controlled according to the power supply capacity of the destruction power supply through the current limiting module; the voltage is boosted by the boost module, and the voltage of the destruction power supply does not need to be fixed, but can be flexibly selected, thereby reducing the application requirements of the destruction voltage; while using the high heat generated by the large current to physically damage the storage particles, the voltage obtained by the boost module is used to destroy the logic devices inside the storage particles, thereby improving the destruction quality of the storage particles.

[0016] In an exemplary embodiment, the predetermined pin in the embodiment of the present disclosure may include a power pin or a data pin of a memory cell.

[0017] In an exemplary instance, the first grounding switch of the embodiment of the present disclosure is a triode or a metal oxide semiconductor field effect transistor (MOS) tube; when the first grounding switch is a MOS tube, the control level G of the switch is connected to the general input and output of the main control module, and the switch state is controlled by the main control, the predetermined pin (pin foot) of the D-level storage particle, and the S-level is grounded.

[0018] In an exemplary embodiment, the second grounding switch in the embodiment of the present disclosure is a triode or a metal oxide semiconductor field effect transistor (MOS) tube.

[0019] In an exemplary embodiment, the destruction power supply of the embodiment of the present disclosure is an independent external power supply. For example, the destruction power supply provided by the host end; because the standard power supply of the solid state drive has low power consumption and a specific trigger mechanism is required when triggering the destruction, the destruction power supply of the embodiment of the present disclosure is an independent power supply; the solid state drive of the embodiment of the present disclosure uses a standard power supply to work; the destruction power supply of the embodiment of the present disclosure is connected to the standard power supply through a pre-set interface.

[0020] In an exemplary embodiment, the voltage value preset in the embodiment of the present disclosure has a value range of 36 volts to 50 volts. The voltage value preset in the embodiment of the present disclosure is a voltage value for destroying storage particles; after the voltage value is set in the embodiment of the present disclosure, it can be adjusted according to the destruction quality of the storage particles when the voltage value is set. For example, when the destruction time is too long, the voltage value can be further increased within the allowable range of the circuit element to shorten the destruction time of the storage particles.

[0021] In an exemplary embodiment, the boost module of the embodiment of the present disclosure is composed of more than one boost chip; wherein, the number of boost chips is determined according to the maximum power consumption that the destruction power supply can provide and the maximum current value that the boost chip can withstand; for example, the destruction power supply can provide a maximum power input of 36V and 10A, that is, 360W. If the maximum output voltage of the boost chip is 36V and the current is limited to 5A, that is, 180W, then two identical boost chips can be selected for parallel connection, or a 36V and 10A boost chip can be selected; the embodiment of the present disclosure does not restrict the selection of boost chips, and aims to maximize the use of the destruction power supply to maximize the voltage and current output effects, so as to improve the working efficiency of the destruction circuit.

[0022] In an exemplary embodiment, the current limiting module of the embodiment of the present disclosure is composed of one or more current limiting chips, and the current limiting chip is used to control the current output to the boost module to be less than a preset current threshold.

[0023] The current limiting module of the disclosed embodiment can use a current limiting chip. The selection of the current limiting chip is determined according to the supply voltage range of the destruction power supply and the total power consumption range. The current limiting chip is used to protect the safety and controllability of the back-end boost chip and the destruction of storage particles, and avoid circuit short circuit and damage to the boost module.

[0024] In an exemplary embodiment, the current limiting module of the embodiment of the present disclosure is composed of a fuse, which is used to control the current output to the boost module to be greater than or equal to a preset current threshold, thereby interrupting the connection between the destruction power supply and the boost module.

[0025] In an exemplary embodiment, a group of storage particles to be destroyed in the embodiment of the present disclosure includes more than one storage particle to be destroyed. The number of storage particles included in the group of storage particles to be destroyed can be adjusted by a technician with reference to the destruction quality.

[0026] In an exemplary embodiment, the current limiting chip in the current limiting module of the embodiment of the present disclosure can be selected by technicians according to the application scenario of the destruction circuit. For example, TI's TPS25983 can be used, which can withstand an input voltage range of 2.7-26V and a current limit range of 2A-18A, that is, it is allowed to work within the total power consumption of 468W provided by the destruction power supply. Within this power consumption range, the boost chip of the boost module is further selected, which is a reference design of the boost chip SY7219. The input voltage range of the boost chip is 3-5.5V, and the output voltage can be modulated to 36V at most, allowing a maximum output current of 9A. Because the current limiting chip at the front end can limit the current to 18A, two boost chips can be selected to work in parallel. However, considering that the boost chip is also It has a current limiting protection function. If the current limiting protection function of the boost chip is relied upon, the current limiting chip at the front end can be discarded and replaced with a fuse or a large current jumper resistor. In this way, the overall principle design can be further simplified, that is, the boost chip can both boost and have the function of current limiting protection. In this case, two boost chips can be used, and a fuse can also be used at the front end for secondary protection to further improve safety. Note that the maximum power consumption of the boost chip supports 36V and 9A, i.e. 324W. Note that the maximum power supply capacity of the destruction interface must be within 324W to ensure the safety of the power supply. This power consumption is also flexible and can be flexibly adjusted according to the power supply capacity of the destruction power supply. Two boost chips in parallel support a maximum power consumption of 648W, which can be used when the power supply capacity is stronger.

[0027] In the disclosed embodiment, the main control controls the control pin of the second ground switch through the GPIO pin. If there are several storage particles to be destroyed, there are several groups of second ground switches for short-circuiting the switch control circuit to respectively complete the destruction of the target storage particles. Note that the power MOS device also needs to consider the support capacity of power consumption, and the maximum through-current should not cause damage to the switch device. Therefore, the entire destruction circuit system is fully considered from the perspectives of power consumption, current limiting and through-current capacity, and is flexibly adjusted. In the process of the destruction action, the destruction circuit itself will not be damaged. The destruction circuit implements instantaneous electrical performance destruction on the target through high voltage, which can instantly cause breakdown damage to large-scale devices inside the storage chip, which is irreversible. At the same time, the switch circuit is directly short-circuited with the ground. At this time, the entire path will pass as large a current as possible. The large current will cause a heating effect in a short time. The high temperature will cause physical damage to the chip, and the duration of continuous heating is controlled by the destruction control program of the main control, which can be flexibly adjusted. The large current is under the control of the current limiting function and will not cause damage to devices other than the target. In summary, the overall design of the destruction circuit in the embodiment of the present disclosure is flexible and effective, and the simultaneous application of high voltage and high current can achieve the effect of completely destroying the storage particles.

[0028] It will be appreciated by those skilled in the art that all or some of the steps, systems, and functional modules / units in the methods disclosed above may be implemented as software, firmware, hardware, and appropriate combinations thereof. In hardware implementations, the division between the functional modules / units mentioned in the above description does not necessarily correspond to the division of physical components; for example, a physical component may have multiple functions, or a function or step may be performed by several physical components in cooperation. Some or all components may be implemented as software executed by a processor, such as a digital signal processor or a microprocessor, or implemented as hardware, or implemented as an integrated circuit, such as an application-specific integrated circuit. Such software may be distributed on a computer-readable medium, which may include a computer storage medium (or non-transitory medium) and a communication medium (or transient medium). As is known to those skilled in the art, the term "computer storage medium" includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tapes, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to store the desired information and can be accessed by a computer. In addition, it is well known to those skilled in the art that communication media typically contain computer-readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.

Claims

1. A destruction circuit, characterized in that: include: Destroy a power supply, a current limiting module, a boost module, a main control module including a first grounding switch, and one or more second grounding switches for connecting the boost module and the storage particles; the control ends of the first grounding switch and the second grounding switch are connected to the general input and output GPIO of the main control module, the output end of the first grounding switch is grounded, and the input end of the first grounding switch is connected to the first predetermined pins of all storage particles and the second predetermined pin of the main control; the output end of the boost module is connected to the first predetermined pins of all storage particles and the second predetermined pin of the main control, the first predetermined pin of each storage particle is respectively connected to the first end of a second grounding switch, and the second end of the second grounding switch is grounded; wherein, The destroy power supply is set to: when a destroy command is received from the host, power is supplied to the current limiting module; The current limiting module is configured to: perform current control on the output power supply of the destruction power supply to ensure that the current flowing into the boost module is a safe and controllable current value; The boost module is configured to: boost the output voltage of the current limiting module to reach a preset voltage value; The master control is configured to gradually close its own first grounding switch and a predetermined group of second grounding switches of storage particles to be destroyed through GPIO according to a preset time interval when receiving a destruction command from the host.

2. The destruction circuit according to claim 1, characterized in that: The destruction power supply is an independent external power supply.

3. The destruction circuit according to claim 1, characterized in that: The preset voltage value has a value range of: 36 volts to 50 volts.

4. The destruction circuit according to claim 1, characterized in that: The boost module is composed of one or more boost chips; The number of the boost chips is determined according to the maximum power consumption that the destruction power supply can provide and the maximum current value that the boost chip can withstand.

5. The destruction circuit according to claim 1, characterized in that: The current limiting module is composed of one or more current limiting chips, and the current limiting chip is used to control the current output to the boost module to be less than a preset current threshold.

6. The destruction circuit according to claim 1, characterized in that: The current limiting module is composed of a fuse, and the fuse is used to control the current output to the boost module to be greater than or equal to a preset current threshold, thereby interrupting the connection between the destruction power supply and the boost module.

7. The destruction circuit according to claim 1, characterized in that: The first predetermined pin includes: a power pin or a data pin of the storage particle; the second predetermined pin includes: a power pin or a data pin of the master control.

8. The destruction circuit according to claim 1, characterized in that: The first grounding switch is a triode or a metal oxide semi-conductor field effect transistor (MOS).

9. The destruction circuit according to claim 1, characterized in that: The second grounding switch is a triode or a metal oxide semi-conductor field effect transistor (MOS).

10. The destruction circuit according to any one of claims 1 to 9, characterized in that: The group of storage particles to be destroyed includes more than one storage particles to be destroyed.

Images