Electronic device and method of manufacturing electronic device

Abstract

An electronic device and a method of manufacturing the electronic device are provided. An electronic device includes a display panel foldable about a virtual folding axis and a support plate disposed under the display panel and including a porous substrate. The porous substrate includes a base material including a metal, a first porous membrane disposed on the base material and including a metal oxide, and a second porous membrane disposed under the base material and including a metal oxide.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and all benefits derived from Korean Patent Application No. 10-2023-0093312, filed on Jul. 18, 2023, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] Embodiments of the present disclosure described herein relate to electronic devices, and more particularly, to flexible electronic devices. Background Art

[0004] Electronic devices such as smartphones, digital cameras, notebook computers, car navigation units, smart TVs, etc. that provide images to users include a display device for displaying images. The display device generates images and provides the images to the user through a display screen.

[0005] As display device technology develops, various forms of display devices are being developed. For example, various display devices that can be bent, folded, or rolled are being developed. The display device can be easily carried and can improve user convenience.

[0006] The flexible display device may include a flexible display panel and a support plate disposed under the display panel and supporting the display panel. Summary of the invention

[0007] Embodiments of the present disclosure provide an electronic device with improved reliability for reducing or preventing damage due to external impact and damage or deformation due to repeated folding operations by improving shear stress, impact resistance, and elastic recovery force inside the electronic device.

[0008] According to an embodiment, an electronic device includes: a display panel foldable around a virtual folding axis and a support plate arranged below the display panel and including a porous substrate. The porous substrate includes a substrate containing a metal, a first porous membrane arranged on the substrate and including a metal oxide, and a second porous membrane arranged below the substrate and including a metal oxide.

[0009] Each of the metal oxide included in the first porous membrane and the metal oxide included in the second porous membrane may be an oxide of a metal included in the substrate.

[0010] The first porous film and the second porous film may be formed by an anodization process.

[0011] Each of the pores in the first porous membrane and the pores in the second porous membrane may have a column shape extending in the thickness direction in a cross-sectional view.

[0012] The porous substrate may further include a third porous membrane disposed between the substrate and the first porous membrane and a fourth porous membrane disposed between the substrate and the second porous membrane. The third porous membrane may have a porosity lower than that of the first porous membrane, and the fourth porous membrane may have a porosity lower than that of the second porous membrane.

[0013] The third porous film may have a hardness higher than that of the first porous film, and the fourth porous film may have a hardness higher than that of the second porous film.

[0014] Each of the metal oxide included in the first porous membrane and the metal oxide included in the second porous membrane may be an oxide of a metal included in the substrate, and each of the third porous membrane and the fourth porous membrane may include: an oxide of a metal included in the substrate.

[0015] The first to fourth porous films may be formed by a plasma electrolytic oxidation process.

[0016] Each of the pores in the first porous membrane, the pores in the second porous membrane, the pores in the third porous membrane, and the pores in the fourth porous membrane may have a column shape extending in the thickness direction in a cross-sectional view.

[0017] The metal included in the substrate may include one of aluminum, magnesium, and titanium.

[0018] The support plate may further include a first sealant filling pores in the first porous membrane and a second sealant filling pores in the second porous membrane.

[0019] Each of the first sealant and the second sealant may include one of a dye and an elastic material.

[0020] The support plate may further include a first cover substrate disposed on the first porous membrane and a second cover substrate disposed below the second porous membrane, and each of the first cover substrate and the second cover substrate may include a metal.

[0021] Each of the first cover substrate and the second cover substrate may include stainless steel ("SUS").

[0022] The support plate may further include a first adhesive support layer disposed between the first cover substrate and the first porous membrane and a second adhesive support layer disposed between the second cover substrate and the second porous membrane.

[0023] The display panel may include a folding region foldable about a folding axis, and first and second non-folding regions spaced apart from each other across the folding region in a second direction crossing the first direction.

[0024] The support plate may include a first support portion overlapping the first non-folding area, a second support portion overlapping the second non-folding area, and a third support portion overlapping the folding area, and the third support portion may define an opening penetrating the support plate from the front surface of the support plate to the rear surface of the support plate.

[0025] The openings may be arranged in a grid in plan view.

[0026] The support plate may include a first support portion overlapping the first non-folding area, a second support portion overlapping the second non-folding area, and a third support portion overlapping the folding area, and the third support portion may define a groove on a rear surface of the support plate.

[0027] The support plate may further include a filling member including an elastic material. The porous substrate may be provided in plurality, and the plurality of porous substrates may include a first plate overlapping the first non-folding region and a second plate overlapping the second non-folding region and spaced apart from the first plate. The filling member may overlap the folding region and may be arranged between the first plate and the second plate.

[0028] The support plate may further include a first sealing layer disposed on and covering the first porous membrane and a second sealing layer disposed under and covering the second porous membrane, and each of the first sealing layer and the second sealing layer may include an elastic material.

[0029] The support plate may include a first support portion overlapping the first non-folding area, a second support portion overlapping the second non-folding area, and a third support portion overlapping the folding area, and the third support portion may overlap the entire folding area.

[0030] The electronic device may further include a first lower plate arranged under the support plate and overlapping a portion of the first non-folding area and the folding area, and a second lower plate arranged under the support plate and overlapping another portion of the second non-folding area and the folding area, the second lower plate being spaced apart from the first lower plate. Each of the first lower plate and the second lower plate may include a lower substrate including a metal, a fifth porous membrane arranged on the lower substrate and including a metal oxide, and a sixth porous membrane arranged under the lower substrate and including a metal oxide.

[0031] The fifth porous film and the sixth porous film may be formed by an anodizing process.

[0032] Each of the first lower plate and the second lower plate may further include a seventh porous membrane disposed between the lower substrate and the fifth porous membrane and an eighth porous membrane disposed between the lower substrate and the sixth porous membrane. The fifth to eighth porous membranes may be formed by a plasma electrolytic oxidation process.

[0033] The seventh porous membrane may have a hardness higher than that of the fifth porous membrane, and the eighth porous membrane may have a hardness higher than that of the sixth porous membrane.

[0034] Each of the first and second lower plates may further include a third cover substrate disposed on the fifth porous membrane and a fourth cover substrate disposed under the sixth porous membrane, and each of the third and fourth cover substrates may include a metal.

[0035] Each of the first lower plate and the second lower plate may further include a first lower adhesive layer disposed between the third cover substrate and the fifth porous membrane, and a second lower adhesive layer disposed between the fourth cover substrate and the sixth porous membrane.

[0036] The electronic device may further include an electronic module disposed below the display panel and at least partially inserted into a hole defined in the support plate.

[0037] According to an embodiment, an electronic device includes a display panel foldable around a virtual folding axis and a support plate arranged below the display panel and including a porous substrate. The porous substrate includes a substrate containing a metal, a first oxide film arranged on the substrate and defining a first gap therein, and a second oxide film arranged below the substrate and defining a second gap therein.

[0038] The first oxide film and the second oxide film may be formed by an anodizing process.

[0039] The porous substrate may further include a third oxide film disposed between the substrate and the first oxide film and defining a third void therein, and a fourth oxide film disposed between the substrate and the second oxide film and defining a fourth void therein. The third oxide film may have a porosity lower than that of the first oxide film, and the fourth oxide film may have a porosity lower than that of the second oxide film.

[0040] The first to fourth oxide films may be formed by a plasma electrolytic oxidation process.

[0041] According to an embodiment, a method for manufacturing an electronic device includes: forming a support plate under a display panel, the display panel is foldable around a virtual folding axis extending in a first direction, wherein forming the support plate includes: forming a first porous membrane and a second porous membrane including a metal oxide, wherein, in forming the first porous membrane and the second porous membrane, the first porous membrane is formed on a substrate and the second porous membrane is formed under the substrate.

[0042] Forming the first porous film and the second porous film may be performed through an anodizing process.

[0043] In forming the first porous membrane and the second porous membrane, a third porous membrane may be further formed between the substrate and the first porous membrane, and a fourth porous membrane may be further formed between the substrate and the second porous membrane.

[0044] The forming of the first porous membrane and the second porous membrane may be performed by a plasma electrolytic oxidation process. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] The above and other aspects and features of the present disclosure will become apparent by describing in detail embodiments of the present disclosure with reference to the attached drawings.

[0046] Figure 1 is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0047] Figure 2 and Figure 3 is a perspective view of a folded electronic device according to an embodiment of the present disclosure.

[0048] Figure 4 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0049] Figure 5 is a block diagram of an electronic device according to an embodiment of the present disclosure.

[0050] Figure 6 is a cross-sectional view showing a display device according to an embodiment of the present disclosure.

[0051] Figure 7 is a cross-sectional view of a display panel according to an embodiment of the present disclosure.

[0052] Figure 8 is a perspective view of a support plate according to an embodiment of the present disclosure.

[0053] Fig. 9 yes Figure 8 An enlarged plan view of area AA'.

[0054] Fig. 10A is a cross-sectional view of a support plate according to an embodiment of the present disclosure.

[0055] Fig. 10B is a cross-sectional view showing a portion of a method of manufacturing a support plate according to an embodiment of the present disclosure.

[0056] FIG. 11A to FIG. 11C yes Fig. 10A An enlarged cross-sectional view of area BB'.

[0057] Fig. 12A is a cross-sectional view of a support plate according to another embodiment of the present disclosure.

[0058] Fig. 12B The present invention is a method for manufacturing an Fig. 12A A cross-sectional view of a portion of a support plate method.

[0059] FIG. 13A to FIG. 13C yes Fig. 12A An enlarged cross-sectional view of area CC'.

[0060] Fig.14 is a cross-sectional view of a support plate according to yet another embodiment of the present disclosure.

[0061] Fig.15 is a cross-sectional view of a support plate according to yet another embodiment of the present disclosure.

[0062] Fig.16 is a cross-sectional view of a support plate according to another embodiment of the present disclosure.

[0063] Fig.17 is a cross-sectional view of a support plate according to yet another embodiment of the present disclosure.

[0064] Fig.18A is a cross-sectional view of a support plate according to yet another embodiment of the present disclosure.

[0065] Fig.18B yes Fig.18A An enlarged cross-sectional view of region DD'.

[0066] Fig.19A and Fig.19B is a cross-sectional view showing a portion of a lower plate according to an embodiment of the present disclosure.

[0067] Fig. 20A and Fig. 20B is a cross-sectional view showing a portion of a lower plate according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0068] In this specification, when a component (or region, layer, portion, etc.) is referred to as being “on,” “connected to” or “coupled to” another component, this means that the component may be directly on, directly connected to or directly coupled to the other component, or a third component may be present therebetween.

[0069] The same reference numerals indicate the same parts. In addition, in the accompanying drawings, the thickness, ratio and size of the parts are exaggerated for effective description. The terms used herein are only used for the purpose of describing specific embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, "one", "the" and "at least one" as used herein do not represent the limitation of quantity, and are intended to include both the singular and the plural. For example, unless the context clearly indicates otherwise, "element" has the same meaning as "at least one element". "At least one" will not be interpreted as being limited to "one" or "one". "Or" means "and / or". As used herein, the term "and / or" includes all of one or more combinations defined by the relevant components.

[0070] Terms such as "first", "second", etc. may be used to describe various components, but the components should not be limited by the terms. Terms may be used only to distinguish one component from other components. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component without departing from the scope of the present disclosure. Unless otherwise specified, terms in the singular may include plural forms.

[0071] In addition, terms such as "below", "below", "above", and "on" are used to describe the relationship of components shown in the drawings. The terms are relative concepts and are described based on the directions shown in the drawings.

[0072] It should be understood that terms such as “includes,” “comprising,” and “having” when used in this document specify the presence of stated features, quantities, steps, operations, components, parts, or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, steps, operations, components, parts, or combinations thereof.

[0073] Unless otherwise defined, all terms (including technical or scientific terms) used herein have the same meaning as those generally understood by those skilled in the art to which the present disclosure belongs. Such terms as those defined in commonly used dictionaries will be interpreted as having the same meaning as the contextual meaning in the relevant technical field, and will not be interpreted as having an idealized or overly rigid meaning unless explicitly defined as having such a meaning in this application.

[0074] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0075] Figure 1 is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0076] Reference Figure 1 , the electronic device ED according to an embodiment of the present disclosure may have a rectangular shape including a long side extending in a first direction DR1 and a short side extending in a second direction DR2 crossing the first direction DR1. However, not limited thereto, the electronic device ED may have various shapes such as a circular shape, other polygonal shapes, etc. The electronic device ED may be a flexible display device.

[0077] Hereinafter, a direction substantially perpendicular to a plane defined by the first direction DR1 and the second direction DR2 is defined as a third direction DR3. In addition, the expression "from above a plane" used herein may mean observing it along the third direction DR3 (ie, a plan view).

[0078] The electronic device ED may include a folding area FA and a plurality of non-folding areas NFA1 and NFA2. The non-folding areas NFA1 and NFA2 may include a first non-folding area NFA1 and a second non-folding area NFA2. The folding area FA may be arranged between the first non-folding area NFA1 and the second non-folding area NFA2. The first non-folding area NFA1, the folding area FA, and the second non-folding area NFA2 may be arranged in a second direction DR2. The folding area FA may be referred to as a foldable area, and the first non-folding area NFA1 and the second non-folding area NFA2 may be referred to as a first non-foldable area and a second non-foldable area.

[0079] Despite Figure 1 , one folding area FA and two non-folding areas NFA1 and NFA2 are shown as an example, but the number of folding areas FA and the number of non-folding areas NFA1 and NFA2 are not limited thereto. For another example, the electronic device ED may include more than two non-folding areas and a plurality of folding areas, each of which is arranged between the non-folding areas.

[0080] An upper surface of the electronic device ED may be defined as a display surface DS, and the display surface DS may have a plane defined by a first direction DR1 and a second direction DR2. An image IM generated by the electronic device ED may be provided to a user through the display surface DS.

[0081] The display surface DS may include a display area DA and a non-display area NDA around the display area DA. The display area DA may display an image, and the non-display area NDA may not display an image. The non-display area NDA may surround the display area DA and may define a boundary of the electronic device ED printed in a predetermined color.

[0082] A sensor area ED-SA may be defined in the display area DA of the electronic device ED. Figure 1 , one sensor area ED-SA is shown as an example, but the number of sensor areas ED-SA is not limited thereto. The sensor area ED-SA may be a part of the display area DA. Therefore, the electronic device ED may display an image through the sensor area ED-SA. However, the present disclosure is not limited thereto. For another example, a portion of the display panel corresponding to the sensor area ED-SA may be removed, and the sensor area ED-SA may not display an image.

[0083] An electronic module may be arranged in an area overlapping with the sensor area ED-SA. The electronic module may receive an external input transmitted through the sensor area ED-SA, or may provide an output through the sensor area ED-SA. In an embodiment, for example, the electronic module may be a camera module, a sensor for measuring distance (e.g., a proximity sensor), a sensor for recognizing a part of the user's body (e.g., a fingerprint, an iris, or a face), or a small lamp that outputs light, but is not particularly limited thereto. Hereinafter, the electronic module overlapping with the sensor area ED-SA will be exemplified as a camera module.

[0084] Figure 2 and Figure 3 is a perspective view of a folded electronic device according to an embodiment of the present disclosure. Figure 2 and Figure 3 Shows Figure 1 The folded state of the electronic device is shown in .

[0085] Reference Figure 2 and Figure 3 , the electronic device ED may be a foldable electronic device that is folded or unfolded. In an embodiment, for example, the folding area FA may be bent around a virtual folding axis FX parallel to the first direction DR1, and the electronic device ED may be folded accordingly. The folding axis FX may be defined as a long axis parallel to the long side of the electronic device ED.

[0086] When the electronic device ED is folded, the first non-folding area NFA1 and the second non-folding area NFA2 may face each other, and the electronic device ED may be folded inwardly so that the display surface DS (refer to Figure 1 ) is not exposed to the outside. However, the embodiments of the present disclosure are not limited thereto. For another example, the electronic device ED may be folded around the folding axis FX in an outward folding manner so that the display surface DS is exposed to the outside.

[0087] The folding area FA may be curved to have a curvature radius R1. Figure 2 As shown in , the distance between the first non-folding area NFA1 and the second non-folding area NFA2 may be substantially the same as twice (eg, diameter) of the curvature radius R1. In this case, the electronic device ED may be folded into a "U" shape.

[0088] However, it is not limited to this. Figure 3 As shown in FIG. 1 , the distance between the first non-folding area NFA1 and the second non-folding area NFA2 may be less than twice the radius of curvature R1. In this case, the electronic device ED may be folded into a dumbbell shape.

[0089] Figure 4 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure. Figure 5 is a block diagram of an electronic device according to an embodiment of the present disclosure.

[0090] Reference Figure 4 and Figure 5 The electronic device ED may include a display device DD, a first electronic module EM1, a second electronic module EM2, a power module PM, and housings EDC1 and EDC2. Although not shown separately, the electronic device ED may also include a mechanical structure (eg, a hinge) for controlling a folding operation of the display device DD.

[0091] The display device DD may include a window module WM, a display module DM, and a lower module LM. The window module WM may provide a front surface of the electronic device ED. The window module WM may be arranged on the display module DM and may protect the display module DM. The window module WM may transmit light generated from the display module DM and may provide the light to a user.

[0092] The display module DM may include at least a display panel DP. The display module DM generates an image and detects an external input. Figure 4 In the embodiment, the display module DM is shown to be the same as the display panel DP. However, the display module DM may be substantially a stacked structure in which a plurality of components including the display panel DP are stacked. The stacked structure of the display module DM will be described in detail below.

[0093] The display panel DP may generate an image. The display panel DP may include display areas DA (refer to Figure 1 ) and non-display area NDA (refer to Figure 1 ) includes a display area DP-DA and a non-display area DP-NDA. The display area DP-DA may generate an image, and the non-display area DP-NDA may not generate an image. The expression “one area / portion corresponds to another area / portion” used herein means that the areas / portions overlap each other and are not limited to having the same area.

[0094] The display area DP-DA may include a first area A1 and a second area A2. The first area A1 may be aligned with the sensor area ED-SA (refer to Figure 1 ) overlap or correspond. Although the first area A1 is shown as a circular shape in the present embodiment, the first area A1 may have various shapes, such as a polygonal shape, an elliptical shape, a shape having at least one bent edge, or an irregular shape, and is not limited to any one embodiment. The first area A1 may be referred to as a component area, and the second area A2 may be referred to as a main display area or a normal display area.

[0095] The first area A1 may have a transmittance higher than that of the second area A2. Alternatively, the first area A1 may have a resolution lower than that of the second area A2. However, the present disclosure is not limited thereto. For another example, the first area A1 may have a transmittance higher than that of the second area A2, but may have a resolution substantially the same as that of the second area A2. The first area A1 may overlap with the camera module CMM to be described below. In an embodiment of the present disclosure, a portion of the display panel DP corresponding to the first area A1 may be removed. Therefore, an image may not be displayed on the first area A1.

[0096] The display panel DP may include a display layer 110 and a sensor layer 120 .

[0097] The display layer 110 may be a component that substantially generates an image. The display layer 110 may be an emissive display layer. In an embodiment, for example, the display layer 110 may be an organic light-emitting display layer, an inorganic light-emitting display layer, an organic-inorganic light-emitting display layer, a quantum dot display layer, a micro-LED display layer, or a nano-LED display layer.

[0098] The sensor layer 120 may sense an external input applied from the outside. The external input may be a user input. The user input may include various types of external inputs, such as a part of the user's body, light, heat, a pen, or pressure.

[0099] The display module DM may include a driver IC DIC disposed in the non-display area DP-NDA. The display module DM may further include a flexible circuit film FCB coupled to the non-display area DP-NDA.

[0100] The driver IC DIC may include a driving element (eg, a data driving circuit) for driving the pixels of the display panel DP. Figure 4 A structure in which the driver IC DIC is mounted on the display panel DP is shown, but the present disclosure is not limited thereto. For another example, the driver IC DIC may be mounted on a flexible circuit film FCB.

[0101] The lower module LM may be arranged below the display module DM. The lower module LM may be a component that supports the display module DM. The lower module LM may have a module hole MH defined therein. The module hole MH may correspond to a hole that penetrates the lower module LM. Although the lower module LM is briefly shown as a single component, the lower module LM may be a stacked structure in which a plurality of components are stacked. The module hole MH may be defined as a plurality of components that penetrate the lower module LM. The module hole MH may overlap with the first area A1 of the display area DP-DA. The stacked structure of the lower module LM will be described in detail below.

[0102] The power module PM supplies power for the overall operation of the electronic device ED. The power module PM may include a conventional battery module.

[0103] The first and second electronic modules EM1 and EM2 include various functional modules for operating the electronic device ED. The first and second electronic modules EM1 and EM2 may be directly mounted on a motherboard electrically connected to the display panel DP, or may be mounted on separate substrates and electrically connected to the motherboard through a connector (not shown).

[0104] The first electronic module EM1 may include a control module CM, a wireless communication module TM, an image input module IIM, a sound input module AIM, a memory MM, and an external interface IF.

[0105] The control module CM controls the overall operation of the electronic device ED. The control module CM may be a microprocessor. In an embodiment, for example, the control module CM activates or deactivates the display panel DP. The control module CM may control other modules such as the image input module IIM or the sound input module AIM based on a touch signal received from the display panel DP.

[0106] The wireless communication module TM can communicate with an external electronic device via a first network (e.g., a short-range communication network such as Bluetooth, WiFi Direct, or Infrared Data Association ("IrDA")) or a second network (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., "LAN" or "WAN")). The communication module included in the wireless communication module TM may be integrated into one component (e.g., a single chip), or may be implemented with multiple components (e.g., multiple chips) separated from each other. The wireless communication module TM may use a general communication line to send / receive sound signals. The wireless communication module TM may include a transmitter TM1 that modulates a signal to be transmitted and sends the modulated signal, and a receiver TM2 that demodulates a received signal.

[0107] The image input module IIM processes the image signal to convert the image signal into image data that can be displayed on the display panel DP. The sound input module AIM receives an external sound signal through a microphone in a voice recording mode or a voice recognition mode and converts the external sound signal into electrical voice data.

[0108] The external interface IF may include a connector capable of physically connecting the electronic device ED and an external electronic device. In an embodiment, for example, the external interface IF is used as an interface connected to an external charger, a wired / wireless data port or a card (e.g., a memory card or a SIM / UIM card) slot.

[0109] The second electronic module EM2 may include an audio output module AOM, a light emitting module LTM, a light receiving module LRM, and a camera module CMM. The audio output module AOM converts audio data received from the wireless communication module TM or audio data stored in the memory MM and outputs the converted data to the outside.

[0110] The light emitting module LTM generates and outputs light. The light emitting module LTM may output infrared light. The light emitting module LTM may include an LED element. The light receiving module LRM may sense infrared light. When infrared light above a predetermined level is sensed, the light receiving module LRM may be activated. The light receiving module LRM may include a CMOS sensor. After the infrared light generated by the light emitting module LTM is output, the infrared light may be reflected by an external object (e.g., a finger or face of a user), and the reflected infrared light may be incident on the light receiving module LRM.

[0111] The camera module CMM can take still images and videos. The camera module CMM may include a plurality of camera modules CMM. A portion of the plurality of camera modules CMM may overlap with the first area A1. At least a portion of the camera module CMM overlapping with the first area A1 may be inserted into the module hole MH. External input (e.g., light) may be provided to the camera module CMM through the first area A1. In an embodiment, for example, the camera module CMM may take an external image by receiving natural light passing through the first area A1.

[0112] The housings EDC1 and EDC2 can accommodate the display module DM, the lower module LM, the first electronic module EM1 and the second electronic module EM2, and the power module PM. The housings EDC1 and EDC2 protect components such as the display module DM, the lower module LM, the first electronic module EM1 and the second electronic module EM2, and the power module PM accommodated in the housings EDC1 and EDC2. Figure 4 , two housings EDC1 and EDC2 are shown separated from each other, but the present disclosure is not limited thereto. Although not shown, in another embodiment, the electronic device ED may further include a hinge structure for connecting the two housings EDC1 and EDC2. The housings EDC1 and EDC2 may be coupled to the window module WM.

[0113] Figure 6 1 is a cross-sectional view showing an electronic device according to an embodiment of the present disclosure. As used herein, a "cross-sectional view" is a view of an object cut by a plane (e.g., the second direction DR2 and the third direction DR3) parallel to the thickness direction (i.e., the third direction DR3) of the display panel DP. Figure 7 is a cross-sectional view of a display panel according to an embodiment of the present disclosure. Figure 8 is a perspective view of a support plate according to an embodiment of the present disclosure. Fig. 9 yes Figure 8An enlarged plan view of area AA'. Figure 6 , a cross section of the display device DD viewed in the first direction DR1 is shown. As used herein, a "plan view" is a view in the thickness direction of the display panel DP (ie, the third direction DR3). Figure 6 The display panel DP is omitted. Figure 4 The protruding portion of the driver IC DIC shown in FIG. 1 and the flexible circuit film FCB connected to the protruding portion of the display panel DP.

[0114] Reference Figure 6 , the display device DD may include a window module WM, a display module DM, a lower module LM, and adhesive layers 20 and 50. The display device DD may include a first non-folding area NFA1, a second non-folding area NFA2, and a folding area FA. The first non-folding area NFA1, the second non-folding area NFA2, and the folding area FA of the display device DD may correspond to the above reference Figure 1 The first non-folding area NFA1, the second non-folding area NFA2, and the folding area FA of the electronic device ED are described.

[0115] The window module WM may include a window WIN, a window protection layer WP, a hard coating layer HC, a bezel pattern PT, and a first adhesive layer 10 .

[0116] The window WIN may be disposed on the display module DM. The window WIN may protect the display module DM from external impact or scratches. The window WIN may include an optically transparent material. In an embodiment, for example, the window WIN may include glass or a synthetic resin film.

[0117] The window WIN may have a single layer structure or a multi-layer structure. In an embodiment, for example, the window WIN may include a plurality of synthetic resin films coupled by an adhesive, or may include a glass film and a synthetic resin film coupled by an adhesive.

[0118] The window protection layer WP may be arranged on the window WIN. The first adhesive layer 10 may be arranged between the window WIN and the window protection layer WP, and may connect the window WIN and the window protection layer WP. The first adhesive layer 10 may be a pressure-sensitive adhesive ("PSA") film or an optically clear adhesive ("OCA") member. The adhesive layer to be described below may also be the same as the first adhesive layer 10, and may include a conventional adhesive. However, not limited to this, the first adhesive layer 10 may be omitted, and the window protection layer WP may be directly arranged on the window WIN.

[0119] The window protection layer WP may include an organic material. In an embodiment, for example, the window protection layer WP may include at least one of polyimide, polycarbonate, polyamide, polymethyl methacrylate, polyethylene terephthalate, triacetyl cellulose, thermoplastic polyurethane ("TPU"), thermosetting polyurethane ("TSU"), polyether block amide ("PEBA"), and copolyester thermoplastic elastomer ("COPE"). However, the material of the window protection layer WP is not limited to the above examples.

[0120] The hard coating layer HC may be disposed on the window protection layer WP. The hard coating layer HC may be disposed at the top of the window module WM. The hard coating layer HC may be directly coated on the upper surface of the window protection layer WP. However, not limited thereto, the hard coating layer HC may be coupled to the window protection layer WP by a separate adhesive.

[0121] The hard coating layer HC may include a hard coating agent including at least one of an organic composition, an inorganic composition, and an organic-inorganic composite composition. In an embodiment, for example, the hard coating layer HC may include an acrylic compound, an epoxy compound, a siloxane-based compound, or a urethane-based compound. The hard coating layer HC may improve the durability of the window module WM, may prevent scratches caused by external factors, and may provide a flat upper surface.

[0122] The hard coating layer HC may further include an additional functional layer such as an anti-fingerprint layer, an antistatic layer or an anti-pollution layer. However, not limited thereto, the hard coating layer HC may be provided as a single layer and may further include a functional material such as an anti-fingerprint coating agent (such as a fluorine-containing compound), an anti-reflective agent or an anti-glare agent.

[0123] The frame pattern PT may be arranged on the lower surface of the window protection layer WP. However, the position where the frame pattern PT is formed is not limited thereto, and in another embodiment, the frame pattern PT may be arranged on the upper surface or the lower surface of the window WIN. The frame pattern PT may be adjacent to the periphery of the window protection layer WP. The area where the frame pattern PT is arranged may correspond to the non-display area DP-NDA (refer to Figure 4 ). The bezel pattern PT may correspond to a layer formed by coating or printing a material having a color. The bezel pattern PT may prevent a component of the display module DM, which is arranged to overlap the bezel pattern PT in a plan view, from being visible from the outside.

[0124] The second adhesive layer 20 may be disposed between the window module WM and the display module DM, and may couple the window module WM and the display module DM.

[0125] The display module DM may include an anti-reflection member ARM, a display panel DP, a lower protection film LPF, a third adhesive layer 30 , and a fourth adhesive layer 40 .

[0126] The anti-reflection member ARM may be referred to as an anti-reflection layer. The anti-reflection member ARM may reduce the reflectivity of external light incident toward the display panel DP. In an embodiment, the anti-reflection member ARM may include a polarizer film. The polarizer film may include a phase retarder and / or a polarizer.

[0127] In an embodiment, the anti-reflection member ARM may include a color filter having a predetermined arrangement. In an embodiment, for example, the color filter may be arranged to correspond to the color of light emitted by the pixels included in the display panel DP. The color filter can reduce the reflectivity of the external light by filtering the external light into the color of the light emitted by the pixel. In addition, the anti-reflection member ARM may further include a black matrix adjacent to the color filter.

[0128] The third adhesive layer 30 may be disposed between the anti-reflection member ARM and the display panel DP, and may couple the anti-reflection member ARM and the display panel DP. However, not limited thereto, the third adhesive layer 30 may be omitted, and the anti-reflection member ARM may be directly disposed on the display panel DP.

[0129] The display panel DP may include a first non-folding region DP-NFA1 corresponding to the first non-folding region NFA1 of the display device DD, a second non-folding region DP-NFA2 corresponding to the second non-folding region NFA2 of the display device DD, and a folding region DP-FA corresponding to the folding region FA of the display device DD.

[0130] Reference Figure 7 The display panel DP may be a component that generates an image and senses an input applied from the outside. In an embodiment, for example, the display panel DP may include a display layer 110 and a sensor layer 120.

[0131] The display layer 110 may be a component that substantially generates an image. The display layer 110 may be an emissive display layer. In an embodiment, for example, the display layer 110 may be an organic light emitting display layer, a quantum dot display layer, or a micro LED display layer.

[0132] The display layer 110 may include a base layer 111 , a circuit layer 112 , a light emitting element layer 113 , and an encapsulation layer 114 .

[0133] The base layer 111 may include a synthetic resin film. The synthetic resin film may include a thermosetting resin. The base layer 111 may have a multilayer structure. In an embodiment, for example, the base layer 111 may have a three-layer structure including a synthetic resin layer, an adhesive layer and a synthetic resin layer. In particular, the synthetic resin layer may be a polyimide resin layer, and its material is not particularly limited. The synthetic resin layer may include at least one of acrylic resin, methacrylic resin, polyisoprene resin, vinyl resin, epoxy resin, urethane-based resin, cellulose resin, siloxane-based resin, polyamide resin and perylene-based resin. In addition, the base layer 111 may include a glass substrate, an organic / inorganic composite substrate, etc.

[0134] The circuit layer 112 may be disposed on the base layer 111. The circuit layer 112 may include an insulating layer, a semiconductor pattern, a conductive pattern, and a signal line. The insulating layer, the semiconductor layer, and the conductive layer may be disposed on the base layer 111 by a process such as coating or deposition, and may be selectively subjected to patterning by performing a photolithography process multiple times. Thereafter, the semiconductor pattern, the conductive pattern, and the signal line included in the circuit layer 112 may be formed.

[0135] The light emitting element layer 113 may be disposed on the circuit layer 112. The light emitting element layer 113 may include a light emitting element. In an implementation, for example, the light emitting element layer 113 may include an organic light emitting material, a quantum dot, a quantum rod, or a micro LED.

[0136] The encapsulation layer 114 may be disposed on the light emitting element layer 113. The encapsulation layer 114 may include an inorganic layer, an organic layer, and an inorganic layer sequentially stacked on each other. However, the layers constituting the encapsulation layer 114 are not limited thereto.

[0137] The inorganic layer can protect the light emitting element layer 113 from moisture and oxygen, and the organic layer can protect the light emitting element layer 113 from foreign matter such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include, but is not limited to, an acrylic organic layer.

[0138] The sensor layer 120 may be disposed on the display layer 110. The sensor layer 120 may sense an external input applied from the outside. The external input may be a user input. The user input may include various types of external inputs, such as a part of the user's body, light, heat, a pen, or pressure.

[0139] The sensor layer 120 may be disposed on the display layer 110 through a continuous process. In this case, the sensor layer 120 may be expressed as being directly disposed on the display layer 110. When the sensor layer 120 is directly disposed on the display layer 110, this may mean that a third component is not disposed between the sensor layer 120 and the display layer 110. That is, a separate adhesive member may not be disposed between the sensor layer 120 and the display layer 110.

[0140] Alternatively, the sensor layer 120 may be coupled with the display layer 110 by an adhesive member. The adhesive member may include a conventional adhesive or sticky substance.

[0141] Refer again Figure 6 , the lower protective film LPF may be coupled to the rear surface of the display panel DP through the fourth adhesive layer 40. The lower protective film LPF may prevent scratches on the rear surface of the display panel DP during the manufacturing process of the display panel DP. The lower protective film LPF may be a colored polyimide film. In an embodiment, for example, the lower protective film LPF may be an opaque yellow film, but is not limited thereto.

[0142] The lower module LM may be disposed under the display panel DP. The lower module LM may include a cushion member CSM, a support plate SPT, a cover layer CVL, a lower plate LPT, a sixth adhesive layer 60 and a seventh adhesive layer 70.

[0143] The cushion member CSM may be disposed under the lower protective film LPF. The fifth adhesive layer 50 may be disposed between the lower protective film LPF and the cushion member CSM, and may couple the lower protective film LPF and the cushion member CSM.

[0144] The cushion member CSM may protect the display panel DP from impact transmitted from below. The anti-impact characteristics of the display device DD may be improved by the cushion member CSM.

[0145] The cushion member CSM may include a barrier film BRF and a cushion layer CSL. Components included in the cushion member CSM are not limited to the above-mentioned components. At least a part of the above-mentioned components may be omitted, and other components may be added.

[0146] The barrier film BRF may improve the impact resistance. The barrier film BRF may be used to prevent deformation of the display panel DP. The barrier film BRF may be a synthetic resin film, for example, a polyimide film, but is not limited thereto.

[0147] The cushion layer CSL may include, for example, expanded foam or sponge. The expanded foam may include polyurethane foam or thermoplastic polyurethane foam. When the cushion layer CSL includes expanded foam, the cushion layer CSL may be formed using the barrier film BRF as a base layer. In an embodiment, for example, the cushion layer CSL may be formed by foaming a foaming agent on the barrier film BRF.

[0148] At least one of the barrier film BRF and the cushion layer CSL may have a color that absorbs light. In an embodiment, for example, at least one of the barrier film BRF and the cushion layer CSL may be black. In this case, components disposed under the cushion member CSM may be prevented from being visible from the outside.

[0149] In the present embodiment, a plurality of support plates for supporting the display panel DP may be disposed under the display panel DP. The plurality of support plates may include a support plate SPT and a lower plate LPT.

[0150] The support plate SPT may be disposed under the cushion member CSM. The sixth adhesive layer 60 may be disposed between the cushion member CSM and the support plate SPT, and may couple the cushion member CSM and the support plate SPT.

[0151] In the present embodiment, the support plate SPT may include a first support portion SA1 overlapping with the first non-folding area DP-NFA1 of the display panel DP, a second support portion SA2 overlapping with the second non-folding area DP-NFA2 of the display panel DP, and a third support portion SA3 overlapping with the folding area DP-FA of the display panel DP. The third support portion SA3 may be arranged between the first support portion SA1 and the second support portion SA2. That is, the first support portion SA1 and the second support portion SA2 may be spaced apart from each other in the second direction DR2 via the third support portion SA3. The third support portion SA3 may be foldable together with the folding area DP-FA of the display panel DP around a virtual folding axis extending in the first direction DR1.

[0152] In the present embodiment, the third supporting portion SA3 may have an opening OP defined therein. That is, the opening OP may be defined in an area overlapping with the folding area DP-FA of the display panel DP. The opening OP may be formed through the supporting plate SPT from the front surface F-SPT of the supporting plate SPT to the rear surface B-SPT. The front surface F-SPT of the supporting plate SPT may be adjacent to the display module DM, and the rear surface B-SPT of the supporting plate SPT may face away from the front surface F-SPT and may be adjacent to the lower plate LPT to be described below. A portion of the supporting plate SPT may be more easily deformed by the opening OP.

[0153] Reference Figure 8 and Fig. 9 , a plurality of openings OP may be defined in the third supporting portion SA3 in a grid pattern. The openings OP may be arranged according to a predetermined rule. Since the openings OP are defined in the third supporting portion SA3, the area of ​​the third supporting portion SA3 may be reduced, and thus the rigidity in the third supporting portion SA3 may be reduced. When the openings OP are defined in the third supporting portion SA3, the flexibility in the third supporting portion SA3 of the supporting plate SPT may be improved compared to when the openings OP are not defined in the third supporting portion SA3. Therefore, the supporting plate SPT may be bent more easily.

[0154] The openings OP may be arranged in the first direction DR1 and the second direction DR2. The openings OP may extend longer in the first direction DR1 than in the second direction DR2. In an embodiment, for example, the openings OP arranged in the hth column and the openings OP arranged in the (h+1)th column may be staggered relative to each other. "h" may be a natural number greater than 0, and the column may correspond to the first direction DR1.

[0155] The support plate SPT may have a hole SPT-MH defined therein. The hole SPT-MH may be defined to penetrate the support plate SPT. The hole SPT-MH of the support plate SPT may form a lower module LM (refer to Figure 4 ) module hole MH (refer to Figure 4 ) part. Camera module CMM (refer to Figure 4 ) may be arranged in the hole SPT-MH of the support plate SPT. According to the present embodiment, the lower module LM includes the support plate SPT having high shear stress and improved impact resistance and elastic restoring force. Therefore, even if the support plate SPT has the hole SPT-MH defined therein and an external impact is applied to the sensor area ED-SA (refer to Figure 1 ) adjacent parts, and can also reduce or prevent damage to the support plate SPT.

[0156] Refer again Figure 6 , the cover layer CVL may be attached to the bottom of the support plate SPT. The cover layer CVL may be attached to the third support portion SA3 of the support plate SPT. The cover layer CVL may cover the opening OP of the support plate SPT. Therefore, the cover layer CVL may prevent foreign matter from penetrating into the opening OP.

[0157] The cover layer CVL may include a material having an elastic modulus lower than that of the support plate SPT. In an embodiment, for example, the cover layer CVL may include thermoplastic polyurethane, but is not limited thereto.

[0158] The lower panel LPT may be arranged under the support panel SPT. The lower panel LPT may include a plurality of lower panels. The lower panel LPT may include a first lower panel LPT1 and a second lower panel LPT2. The first lower panel LPT1 may be arranged to overlap a first non-folding area DP-NFA1 and a portion of the folding area DP-FA of the display panel DP, and the second lower panel LPT2 may be arranged to overlap a second non-folding area DP-NFA2 and another portion of the folding area DP-FA of the display panel DP.

[0159] The first lower plate LPT1 and the second lower plate LPT2 may be spaced apart from each other. However, the first lower plate LPT1 and the second lower plate LPT2 may be positioned as close to each other as possible, and may support the area of ​​the support plate SPT in which the opening OP is formed. In an embodiment, for example, the first lower plate LPT1 and the second lower plate LPT2 may prevent the area of ​​the support plate SPT in which the opening OP is defined from being deformed due to pressure applied from above. A detailed description of the lower plate LPT will be given below.

[0160] The seventh adhesive layer 70 may be disposed between the support plate SPT and the lower plate LPT, and may couple the support plate SPT and the lower plate LPT. The seventh adhesive layer 70 may include a first portion 70-1 disposed between the support plate SPT and the first lower plate LPT1 and a second portion 70-2 disposed between the support plate SPT and the second lower plate LPT2.

[0161] In an embodiment, a functional layer may be additionally disposed under the lower plate LPT. The functional layer may include a heat dissipation layer, an insulation layer, and the like.

[0162] Fig. 10A is a cross-sectional view of a support plate according to an embodiment of the present disclosure. Fig. 10B is a cross-sectional view showing a portion of a method of manufacturing a support plate according to an embodiment of the present disclosure. FIG. 11A to FIG. 11C yes Fig. 10A An enlarged cross-sectional view of area BB'.

[0163] Reference Fig. 10A In this embodiment, the support plate SPT may include a porous substrate PRS. The porous substrate PRS may include a base material BM, a first porous membrane PL1, and a second porous membrane PL2. The first porous membrane PL1 and the second porous membrane PL2 may be spaced apart from each other in the thickness direction (ie, the third direction DR3) via the base material BM.

[0164] The substrate BM may include a metal. That is, the substrate BM may be a metal substrate. In an embodiment, for example, the substrate BM may include one of aluminum, magnesium, and titanium. However, without being limited thereto, the substrate BM may include a material capable of withstanding oxidation of an anode (or anodization) or plasma electrolytic oxidation ("PEO") to be described below. In an embodiment, the substrate BM may include a light metal.

[0165] The first porous membrane PL1 may be formed on the front surface F-BM of the substrate BM. The first porous membrane PL1 may include a metal oxide. The metal oxide included in the first porous membrane PL1 may be an oxide of a metal included in the substrate BM. The first porous membrane PL1 may be an oxide film formed on the front surface F-BM of the substrate BM. The first porous membrane PL1 may be referred to as a "first oxide film". In an embodiment, for example, the first porous membrane PL1 may be an aluminum oxide film, a magnesium oxide film, or a titanium oxide film.

[0166] The second porous membrane PL2 may be formed on the rear surface B-BM of the substrate BM. The second porous membrane PL2 may include a metal oxide. The metal oxide included in the second porous membrane PL2 may be an oxide of a metal included in the substrate BM. The second porous membrane PL2 may be an oxide film formed on the rear surface B-BM of the substrate BM. The second porous membrane PL2 may be referred to as a "second oxide film". In an embodiment, for example, the second porous membrane PL2 may be an aluminum oxide film, a magnesium oxide film, or a titanium oxide film.

[0167] In the present embodiment, the first porous membrane PL1 and the second porous membrane PL2 can be formed by anodizing the base material BM.

[0168] Fig. 10B Schematic diagram showing the process of anodizing the working substrate BM-W. Fig. 10B The anodizing device PD is briefly shown in FIG.

[0169] Reference Fig. 10B The working substrate BM-W can be provided for forming the porous membranes PL1 and PL2 (refer to Fig. 10A ) of a metal substrate. The anodizing device PD may include a power supply PWS for applying a voltage, an electrolytic tank ELZ containing an electrolyte ELT, a cooling device CLS for maintaining the temperature of the electrolyte ELT, and a bubble generator ARB for minimizing the concentration difference in the electrolyte ELT and replenishing oxygen ions consumed during electrolytic oxidation. During the anodizing process, the power supply PWS may apply a voltage of 15V to 50V.

[0170] The working substrate BM-W may be connected to the positive electrode of the power source PWS, and the auxiliary electrode AXE may be connected to the negative electrode of the power source PWS. The working substrate BM-W and the auxiliary electrode AXE may be immersed in the electrolyte ELT. When electrolysis is performed in this state, the surface of the working substrate BM-W may be oxygen (O 2 ) is oxidized, and an oxide film may be formed on the working substrate BM-W. The oxide film formed on the working substrate BM-W may correspond to Fig. 10A The first porous membrane PL1 and the second porous membrane PL2.

[0171] Refer again Fig. 10A In this embodiment, the opening OP defined in the support plate SPT (refer to Figure 6 ) may correspond to the opening OP1 defined in the porous substrate PRS. Each of the base material BM, the first porous membrane PL1, and the second porous membrane PL2 may have a Figure 6The openings OPb of the first porous membrane PL1, the openings OPa of the base material BM, and the openings OPc of the second porous membrane PL2 may be aligned in the third direction DR3 to form the openings OP1 defined in the porous substrate PRS.

[0172] In an embodiment, the opening OP1 of the porous substrate PRS may be formed by a photolithography process. A photoresist or a dry film resist ("DFR") may be used in the photolithography process for forming the opening OP1 of the porous substrate PRS.

[0173] Reference FIG. 10A to FIG. 11B , pores may be included in each of the first porous membrane PL1 and the second porous membrane PL2.

[0174] Pores defined in the first porous membrane PL1 (hereinafter referred to as first pores PR1 ) may be formed by removing a portion of the first porous membrane PL1 in a thickness direction (ie, third direction DR3 ). The first pores PR1 may be formed in a shape similar to a pillar shape.

[0175] Pores defined in the second porous membrane PL2 (hereinafter referred to as second pores PR2 ) may be formed by removing a portion of the second porous membrane PL2 in the thickness direction (ie, third direction DR3 ) The second pores PR2 may be formed in a shape similar to a pillar shape.

[0176] In an embodiment, if Fig.11A As shown in FIG. 1 , the first pores PR1 and the second pores PR2 may extend in a corrugated shape in the thickness direction in the cross-sectional view. However, the present disclosure is not limited thereto. Fig. 11B As shown in FIG. 1 , in another embodiment of the present disclosure, the first pores PR1 and the second pores PR2 may extend in a straight line in the thickness direction in a cross-sectional view.

[0177] According to this embodiment, when an external impact is directed toward the display device DD (refer to Figure 4 ) is applied, an empty space that can be squeezed can be provided by the pores PR1 and PR2 in the porous films PL1 and PL2. Therefore, the time for applying the impact can be increased, and the impact applied to the display device DD (refer to Figure 4 ) can be reduced. Therefore, the impact resistance of the support plate SPT to external impact can be improved, and the damage to the display device DD (refer to Figure 4 ) damage.

[0178] According to the present embodiment, the porous films PL1 and PL2 may be arranged not only on the front surface F-BM of the substrate BM but also on the rear surface B-BM, and thus the support plate SPT may be easily returned to its original state from a state in which the first porous film PL1 and the second porous film PL2 are squeezed by an external impact. That is, the elastic restoring force of the support plate SPT may be improved, and accordingly, the display device DD (refer to Figure 4 ) deformation.

[0179] According to the present embodiment, the porous substrate PRS may include a metal base material BM and porous membranes PL1 and PL2 formed on the front surface F-BM and the back surface B-BM of the metal base material BM, respectively. Therefore, the support plate SPT may have a high shear stress through the metal base material BM, and may have improved impact resistance through the porous membranes PL1 and PL2. When a metal plate is applied to the support plate, it is desirable to control the shear stress and impact resistance by changing the basic physical properties, size, specific gravity and / or thickness of the metal material included in the metal plate. However, there is a trade-off between the shear stress and the impact resistance of the metal material, and therefore it is difficult to improve both the shear stress and the impact resistance. In contrast, in the present embodiment, the porous membranes PL1 and PL2 may be formed by anodizing the metal base material BM. Therefore, the support plate SPT may have a high shear stress and improved impact resistance. Therefore, the reliability of the support plate SPT may be effectively improved. In addition, according to the present embodiment, the metal base material BM may include a light metal. Therefore, the support plate SPT may be made lightweight.

[0180] Reference Fig. 11C In this embodiment, the support plate SPT may include a porous substrate PRS, a first sealant SM1 and a second sealant SM2. Fig.11A Compared with the support plate SPT in the described embodiment, the support plate SPT may further include a first sealant SM1 and a second sealant SM2.

[0181] The first sealant SM1 may fill the first pores PR1 in the first porous membrane PL1. That is, the first sealant SM1 may be disposed in the first pores PR1. The second sealant SM2 may fill the second pores PR2 in the second porous membrane PL2. That is, the second sealant SM2 may be disposed in the second pores PR2.

[0182] In an embodiment, each of the first sealant SM1 and the second sealant SM2 may include a colorant. In an embodiment, for example, the colorant may include an organic pigment, an inorganic pigment, or an organic dye. Each of the first sealant SM1 and the second sealant SM2 may have a color. In an embodiment, for example, the first sealant SM1 and the second sealant SM2 may be black. Therefore, it is possible to prevent the electronic device ED (refer to Figure 4 ) external incident light is reflected, and thus when the light from the window module WM (refer to Figure 4 ) Observe the electronic device ED from above (refer to Figure 4 ), the support plate SPT and the components arranged under the support plate SPT may not be visible to the user.

[0183] In an embodiment, each of the first sealant SM1 and the second sealant SM2 may include an elastic material. In an embodiment, for example, each of the first sealant SM1 and the second sealant SM2 may include a silicone-based elastic material. Alternatively, each of the first sealant SM1 and the second sealant SM2 may include thermoplastic polyurethane (TPU). Each of the first sealant SM1 and the second sealant SM2 may include a gel-type material. By filling the pores PR1 and PR2 with elastic material, the impact resistance and elastic recovery force of the support plate SPT can be further improved.

[0184] Fig. 12A is a cross-sectional view of a support plate according to another embodiment of the present disclosure. Fig. 12B The present invention is a method for manufacturing an Fig. 12A A cross-sectional view of a portion of a support plate method. FIG. 13A to FIG. 13C yes Fig. 12A An enlarged cross-sectional view of area CC'.

[0185] Reference Fig. 12A In this embodiment, the support plate SPT-1 may include a porous substrate PRS-1. The porous substrate PRS-1 according to the present embodiment may include a base material BM, a first porous membrane PL1, a second porous membrane PL2, a third porous membrane PL3, and a fourth porous membrane PL4.

[0186] The first and third porous membranes PL1 and PL3 may be disposed on the substrate BM, and the second and fourth porous membranes PL2 and PL4 may be disposed below the substrate BM. The third porous membrane PL3 may be disposed between the substrate BM and the first porous membrane PL1, and the fourth porous membrane PL4 may be disposed between the substrate BM and the second porous membrane PL2.

[0187] After the first porous membrane PL1 and the second porous membrane PL2 are formed on the front surface F-BM and the back surface B-BM of the substrate BM, respectively, the third porous membrane PL3 may be formed at the interface between the substrate BM and the first porous membrane PL1, and the fourth porous membrane PL4 may be formed at the interface between the substrate BM and the second porous membrane PL2. Thus, a porous substrate PRS-1 including the substrate BM and the first to fourth porous membranes PL1 to PL4 may be formed.

[0188] The third porous membrane PL3 may include a metal oxide. The metal oxide included in the third porous membrane PL3 may be an oxide of a metal included in the substrate BM. The third porous membrane PL3 may be an oxide film formed at an interface between the substrate BM and the first porous membrane PL1. The third porous membrane PL3 may be referred to as a "third oxide film".

[0189] The fourth porous membrane PL4 may include a metal oxide. The metal oxide included in the fourth porous membrane PL4 may be an oxide of a metal included in the substrate BM. The fourth porous membrane PL4 may be an oxide film formed at an interface between the substrate BM and the second porous membrane PL2. The fourth porous membrane PL4 may be referred to as a "fourth oxide film".

[0190] In the present embodiment, the first to fourth porous membranes PL1 to PL4 may be formed by performing a plasma electrolytic oxidation (PEO) process on the base material BM.

[0191] Fig. 12B Schematic diagram showing a process of subjecting a working substrate BM-Wa to plasma electrolytic oxidation. Fig. 12B The plasma electrolytic oxidation device PDa is briefly shown in FIG.

[0192] Reference Fig. 12B The working substrate BM-Wa may be provided for forming the porous membranes PL1 to PL4 (refer to Fig. 12A ) of a metal substrate. The plasma electrolytic oxidation device PDa may include a power supply PWSa for applying a voltage, an electrolytic tank ELZa containing an electrolyte ELTa, a cooling device CLSa for maintaining the temperature of the electrolyte ELTa, and a bubble generator ARBa for minimizing the concentration difference in the electrolyte ELTa and replenishing oxygen ions consumed during electrolytic oxidation. During the plasma electrolytic oxidation process, the power supply PWSa may apply a voltage of 350V to 550V. When the plasma electrolytic oxidation process is performed, a voltage higher than the voltage when the anodizing process is performed may be provided.

[0193] The working substrate BM-Wa may be connected to the positive electrode of the power source PWSa, and the auxiliary electrode AXEa may be connected to the negative electrode of the power source PWSa. The working substrate BM-Wa and the auxiliary electrode AXEa may be immersed in the electrolyte ELTa. When electrolysis is performed in this state, the surface of the working substrate BM-Wa may be oxygen (O 2 ) is oxidized, and an oxide film can be formed on the working substrate BM-Wa. At this time, the strong current field formed locally can be generated from the oxygen (O 2 ) generates plasma PLS (or arc or spark), and the oxide formed instantly may be welded accordingly. When compared with the oxide film formed previously, the oxide film formed by the welding of the oxide formed instantly may have a high density characteristic. The oxide film formed previously may correspond to the first porous film PL1 and the second porous film PL2 (refer to Fig. 12A ), and the oxide film formed by the melting of the oxide formed instantly may correspond to the third porous film PL3 and the fourth porous film PL4 (refer to Fig. 12A ).

[0194] Refer again Fig. 12A In this embodiment, the opening OP defined in the support plate SPT-1 (refer to Figure 6 ) may correspond to the opening OP1-1 defined in the porous substrate PRS-1. Each of the substrate BM and the first to fourth porous membranes PL1 to PL4 may have a through opening defined therein in the thickness direction. The opening OPb of the first porous membrane PL1, the opening OPd of the third porous membrane PL3, the opening OPa of the substrate BM, the opening OPe of the fourth porous membrane PL4, and the opening OPc of the second porous membrane PL2 may be aligned in the third direction DR3 to form the opening OP1-1 defined in the porous substrate PRS-1.

[0195] In an embodiment, the opening OP1 - 1 of the porous substrate PRS- 1 may be formed by a photolithography process. A photoresist or a dry film resist (DFR) may be used in the photolithography process for forming the opening OP1 - 1 of the porous substrate PRS- 1 .

[0196] Reference FIG. 12A to FIG. 13B , each of the first to fourth porous membranes PL1 to PL4 may include pores. Fig.11A The description given can be similarly applied to the pores formed in the first porous membrane PL1 (ie, the first pores PR1 ) and the pores formed in the second porous membrane PL2 (ie, the second pores PR2 ).

[0197] Pores defined in the third porous membrane PL3 (hereinafter referred to as third pores PR3 ) may be formed by removing a portion of the third porous membrane PL3 in a thickness direction (ie, third direction DR3 ). The third pores PR3 may be formed in a shape similar to a pillar shape.

[0198] Pores defined in the fourth porous membrane PL4 (hereinafter referred to as fourth pores PR4 ) may be formed by removing a portion of the fourth porous membrane PL4 in the thickness direction (ie, third direction DR3 ). The fourth pores PR4 may be formed in a shape similar to a pillar shape.

[0199] The third pore PR3 in the third porous membrane PL3 may be smaller than the first pore PR1 in the first porous membrane PL1. In an embodiment, for example, in a cross-sectional view, the width of the third pore PR3 in the second direction DR2 may be smaller than the width of the first pore PR1 in the second direction DR2. The third pore PR3 may have a volume smaller than the volume of the first pore PR1. The porosity of the third porous membrane PL3 may be lower than the porosity of the first porous membrane PL1. The density of the third porous membrane PL3 may be higher than the density of the first porous membrane PL1. The first porous membrane PL1 may be referred to as a first low-density membrane, and the third porous membrane PL3 may be referred to as a first high-density membrane. The hardness of the third porous membrane PL3 may be higher than the hardness of the first porous membrane PL1.

[0200] The fourth pore PR4 in the fourth porous membrane PL4 may be smaller than the second pore PR2 in the second porous membrane PL2. In an embodiment, for example, in a cross-sectional view, the width of the fourth pore PR4 in the second direction DR2 may be smaller than the width of the second pore PR2 in the second direction DR2. The fourth pore PR4 may have a volume smaller than the volume of the second pore PR2. The porosity of the fourth porous membrane PL4 may be lower than the porosity of the second porous membrane PL2. The density of the fourth porous membrane PL4 may be higher than the density of the second porous membrane PL2. The second porous membrane PL2 may be referred to as a second low-density membrane, and the fourth porous membrane PL4 may be referred to as a second high-density membrane. The hardness of the fourth porous membrane PL4 may be higher than the hardness of the second porous membrane PL2.

[0201] In an embodiment, if Fig.13A As shown in FIG. 1 , the first to fourth pores PR1 to PR4 may extend in a corrugated shape in the thickness direction in the cross-sectional view. However, the embodiments of the present disclosure are not limited thereto. Fig. 13B As shown in , in another embodiment of the present disclosure, the first to fourth pores PR1 to PR4 may extend in a straight line in the thickness direction in a cross-sectional view.

[0202] According to the present embodiment, a porous substrate PRS-1 including high-density films PL3 and PL4 located between a substrate BM and low-density films PL1 and PL2 can be provided by plasma electrolytic oxidation. The high-density films PL3 and PL4 can improve the adhesion between the substrate BM and the low-density films PL1 and PL2. The high-density films PL3 and PL4 can provide a film with relatively high hardness between the substrate BM and the low-density films PL1 and PL2, while providing a space for impact dispersion between the substrate BM and the low-density films PL1 and PL2, thereby reducing or preventing damage to the porous films PL1 to PL4 due to external impact.

[0203] Reference Fig. 13C In this embodiment, the support plate SPT-1 may include a porous substrate PRS-1, a first sealant SM1-1 and a second sealant SM2-1. Fig.13A Compared with the support plate SPT-1 in the embodiment described above, the support plate SPT-1 may further include a first sealant SM1-1 and a second sealant SM2-1. Fig. 11C The description given is similarly applicable to the first sealant SM1 - 1 and the second sealant SM2 - 1 , and the following description will focus on the differences.

[0204] The first sealant SM1-1 may fill the first pores PR1 in the first porous membrane PL1. That is, the first sealant SM1-1 may be arranged in the first pores PR1. In an embodiment, some of the third pores PR3 may be connected to the first pores PR1 adjacent thereto, and some of the first sealant SM1-1 may fill the third pores PR3 connected to the first pores PR1. In the present specification, the first pores PR1 and the third pores PR3 connected to each other may refer to pores provided as an integral space.

[0205] The second sealant SM2-1 may fill the second pores PR2 in the second porous membrane PL2. That is, the second sealant SM2-1 may be arranged in the second pores PR2. In an embodiment, some of the fourth pores PR4 may be connected to the second pores PR2 adjacent thereto, and some of the second sealant SM2-1 may fill the fourth pores PR4 connected to the second pores PR2. In this specification, the second pores PR2 and the fourth pores PR4 connected to each other may refer to pores provided as an integral space.

[0206] Fig.14 is a cross-sectional view of a support plate according to another embodiment of the present disclosure. Figures 1 to 13C The same or similar components as those described above will be assigned the same or similar reference numerals, and duplicate description will be omitted.

[0207] Reference Fig.14In this embodiment, the support plate SPT-2 may include a porous substrate PRS, a first cover substrate CPT1 and a second cover substrate CPT2. Fig. 10A and Fig. 12A Compared to those in the described embodiments, the support plate SPT-2 may further include a first cover substrate CPT1 and a second cover substrate CPT2. The first cover substrate CPT1 and the second cover substrate CPT2 may be spaced apart from each other in the thickness direction (ie, the third direction DR3) via the porous substrate PRS.

[0208] exist Fig.14 In FIG. 1 , a porous substrate PRS is briefly shown. FIG. 10A to FIG. 11B The description given may be applicable to the porous substrate PRS. The porous substrate PRS may include a base material BM and a first porous membrane PL1 and a second porous membrane PL2. Alternatively, the above reference FIG. 12A to FIG. 13B The given description may be applicable to the porous substrate PRS.The porous substrate PRS may include a base material BM and first to fourth porous membranes PL1 to PL4.

[0209] The first cover substrate CPT1 may be arranged on the porous substrate PRS. The first cover substrate CPT1 may be arranged directly on the front surface F-PRS of the porous substrate PRS. The second cover substrate CPT2 may be arranged below the porous substrate PRS. The second cover substrate CPT2 may be arranged directly on the back surface B-PRS of the porous substrate PRS. In an embodiment, the first cover substrate CPT1 and the second cover substrate CPT2 may be arranged directly on the porous substrate PRS by a cladding process.

[0210] Each of the first cover substrate CPT1 and the second cover substrate CPT2 may include a first support portion SA1, a second support portion SA2 and a third support portion SA3. The first support portion SA1, the second support portion SA2 and the third support portion SA3 of each of the first cover substrate CPT1 and the second cover substrate CPT2 may correspond to the first support portion SA1, the second support portion SA2 and the third support portion SA3 of the support plate SPT-2.

[0211] The first cover substrate CPT1 may define an opening OP2 in the third support portion SA3. The opening OP2 of the first cover substrate CPT1 may be defined as penetrating the first cover substrate CPT1 in the thickness direction (i.e., the third direction DR3). The second cover substrate CPT2 may define an opening OP3 in the third support portion SA3. The opening OP3 of the second cover substrate CPT2 may be defined as penetrating the second cover substrate CPT2 in the thickness direction (i.e., the third direction DR3). The opening OP2 of the first cover substrate CPT1, the opening OP1 of the porous substrate PRS, and the opening OP3 of the second cover substrate CPT2 may be aligned in the third direction DR3 to form an opening OP-2 defined in the support plate SPT-2.

[0212] Each of the first cover substrate CPT1 and the second cover substrate CPT2 may include a metal. Each of the first cover substrate CPT1 and the second cover substrate CPT2 may be a metal substrate. In an embodiment, the metal included in each of the first cover substrate CPT1 and the second cover substrate CPT2 may include stainless steel (SUS). The cover substrates CPT1 and CPT2 may be arranged on a porous membrane having pores defined therein, and thus damage to the porous membrane may be reduced or prevented. Therefore, the reliability of the support plate SPT-2 may be effectively improved.

[0213] Fig.15 is a cross-sectional view of a support plate according to another embodiment of the present disclosure. Figures 1 to 14 The same or similar components as those described above will be assigned the same or similar reference numerals, and duplicate description will be omitted.

[0214] Reference Fig.15 In this embodiment, the support plate SPT-3 may include a porous substrate PRS, a first cover substrate CPT1, a second cover substrate CPT2, a first adhesive support layer SAL1 and a second adhesive support layer SAL2. That is, when compared with the reference Fig.14 Compared with the support plate SPT-2 in the described embodiment, the support plate SPT-3 may further include a first adhesive support layer SAL1 and a second adhesive support layer SAL2.

[0215] The first adhesive support layer SAL1 may be arranged between the porous substrate PRS and the first cover substrate CPT1. The first adhesive support layer SAL1 may couple the porous substrate PRS and the first cover substrate CPT1. The second adhesive support layer SAL2 may be arranged between the porous substrate PRS and the second cover substrate CPT2. The second adhesive support layer SAL2 may couple the porous substrate PRS and the second cover substrate CPT2.

[0216] Each of the first adhesive support layer SAL1 and the second adhesive support layer SAL2 may include a transparent adhesive such as a pressure sensitive adhesive (PSA) or an optically clear adhesive (OCA), but is not limited thereto. For another example, each of the first adhesive support layer SAL1 and the second adhesive support layer SAL2 may include thermoplastic polyurethane (TPU).

[0217] Openings OP2 of the first covering substrate CPT1, openings OP4 of the first adhesive support layer SAL1, openings OP1 of the porous substrate PRS, openings OP5 of the second adhesive support layer SAL2 and openings OP3 of the second covering substrate CPT2 may be aligned in a third direction DR3 to form openings OP-3 defined in the support plate SPT-3.

[0218] According to the present embodiment, the porous substrate PRS and the cover substrates CPT1 and CPT2 can be attached by the adhesive support layers SAL1 and SAL2, and the coupling force between the porous substrate PRS and the cover substrates CPT1 and CPT2 can be improved. Figure 1 ) can also stably maintain the connection state of the porous substrate PRS and the cover substrates CPT1 and CPT2, and reduce or prevent damage or deformation of the support plate SPT-3. Therefore, the reliability of the support plate SPT-3 can be effectively improved.

[0219] Fig.16 is a cross-sectional view of a support plate according to another embodiment of the present disclosure. Figures 1 to 15 The same or similar components as those described above will be assigned the same or similar reference numerals, and duplicate description will be omitted.

[0220] Reference Fig.16 In this embodiment, the support plate SPT-4 may include a porous substrate PRSa. FIG. 10A to FIG. 11C The given description may be applied to the porous substrate PRSa, and the porous substrate PRSa may include a base material BM (refer to FIG. 10A to FIG. 11C ) and the first porous membrane PL1 and the second porous membrane PL2 (refer to FIG. 10A to FIG. 11C ). Alternatively, the above reference FIG. 12A to FIG. 13C The given description may be applied to the porous substrate PRSa, and the porous substrate PRSa may include a base material BM (refer to FIG. 12A to FIG. 13C ) and the first porous membrane PL1 to the fourth porous membrane PL4 (refer to FIG. 12A to FIG. 13C ).

[0221] The third support portion SA3 of the porous substrate PRSa may define a groove GR therein. In the third support portion SA3, the groove GR may be defined on the back surface B-PRSa of the porous substrate PRSa. In the third support portion SA3, the groove GR may be defined by removing a portion of the porous substrate PRSa from the back surface B-PRSa of the porous substrate PRSa in the thickness direction. In an embodiment, for example, the groove GR may be defined by removing a portion of the porous substrate PRSa from the back surface B-PRSa of the porous substrate PRSa to a midpoint between the front surface F-PRSa and the back surface B-PRSa.

[0222] In an embodiment, when the porous substrate PRSa comprises as described above with reference to Fig. 10A When the porous substrate PRSa includes the first porous membrane PL1 and the second porous membrane PL2 as described above, the groove GR may penetrate the second porous membrane PL2 and may be formed by removing part of the porous substrate BM. Alternatively, in an embodiment, when the porous substrate PRSa includes the first porous membrane PL1 and the second porous membrane PL2 as described above, the groove GR may penetrate the second porous membrane PL2 and may be formed by removing part of the porous substrate BM. Fig. 12A When the base material BM and the first to fourth porous films PL1 to PL4 are described, the groove GR may penetrate the second porous film PL2 and the fourth porous film PL4 and may be formed by removing a portion of the base material BM.

[0223] The grooves GR may be arranged in a grid pattern in a plan view. The arrangement of the grooves GR in a plan view may be similar to Fig. 9 The openings OP are arranged in a plan view (ie, in a grid form).

[0224] When the electronic device ED (refer to Figure 1 ) When the porous substrate PRSa is folded in an inwardly folded manner, compressive stress may dominate in a portion of the porous substrate PRSa adjacent to the front surface F-PRSa, and tensile stress may dominate in a portion of the porous substrate PRSa adjacent to the back surface B-PRSa. According to the present embodiment, the groove GR is not arranged in a region where compressive stress dominates, and therefore, cracks in the porous substrate PRSa due to compressive stress can be minimized in a process in which the porous substrate PRSa is folded therein. Therefore, the reliability of the support plate SPT-4 can be effectively improved.

[0225] Fig.17 is a cross-sectional view of a support plate according to another embodiment of the present disclosure. Figures 1 to 15 The same or similar components as those described above will be assigned the same or similar reference numerals, and duplicate description will be omitted.

[0226] exist Fig.17 For the convenience of description, the support plate SPT-5 is shown with the display module DM (refer to Figure 6)'s first non-folding area NFA1, the second non-folding area NFA2 and the area corresponding to the folding area FA.

[0227] Reference Fig.17 In this embodiment, the support plate SPT-5 may include a porous substrate PRSb and a filling member FM.

[0228] The porous substrate PRSb may include a plurality of porous substrates. The plurality of porous substrates PRSb may include a first plate PT1 overlapping the first non-folding area NFA1 and a second plate PT2 overlapping the second non-folding area NFA2. The first plate PT1 and the second plate PT2 may be spaced apart from each other. That is, in the present embodiment, the porous substrate PRSb may not be arranged in a position close to the display module DM (refer to Figure 6 ) in the area where the folding area FA overlaps.

[0229] The filling member FM may be disposed between the first plate PT1 and the second plate PT2. The filling member FM may overlap the folding area FA.

[0230] In this embodiment, the first support portion SA1 (see Figure 6 ) may correspond to the portion where the first plate PT1 is arranged, the second support portion SA2 of the support plate SPT-5 (refer to Figure 6 ) may correspond to the portion where the second plate PT2 is arranged, and the third support portion SA3 (refer to Figure 6 ) may correspond to a portion where the filling member FM is arranged.

[0231] In the present embodiment, the filling member FM may include an elastic material. In an embodiment, for example, the filling member FM may include a silicone-based elastic material. Alternatively, the filling member FM may include thermoplastic polyurethane (TPU). The filling member FM may include a gel-type material.

[0232] According to the present embodiment, the filling member FM may be arranged in a portion overlapping with the folding area FA, and thus the porous substrate PRSb may not include an opening or a groove. Therefore, a process of forming an opening or a groove in the support plate SPT-5 may be omitted. Therefore, the manufacturing process may be simplified, and the manufacturing cost may be reduced. In addition, when selecting the material of the support plate SPT-5, whether the opening or the groove can be formed (for example, whether patterning can be performed by a photolithography process) may not be considered, and thus the degree of freedom of selection of the material may be increased.

[0233] Since the support plate SPT-5 according to the present embodiment does not define an opening therein, the cover layer CVL (refer to FIG. 5 ) attached to the support plate SPT-5 to prevent penetration of foreign matter may be omitted. Figure 6 ).

[0234] although Fig.17 An example in which the support plate SPT-5 includes only the porous substrate PRSb and the filling member FM is shown, but the present disclosure is not limited thereto. Fig.14 The first cover substrate CPT1 and the second cover substrate CPT2 described above may be additionally attached to the first plate PT1 and the second plate PT2 of the support plate SPT-5. Alternatively, the first cover substrate CPT1 and the second cover substrate CPT2 may be attached to the first plate PT1 and the second plate PT2 of the support plate SPT-5 by referring to the above. Fig.15 The depicted first and second adhesive support layers SAL1, SAL2 are coupled to the first and second panels PT1, PT2.

[0235] Fig.18A is a cross-sectional view of a support plate according to yet another embodiment of the present disclosure. Fig.18B yes Fig.18A An enlarged cross-sectional view of the region DD'. Figures 1 to 15 The same or similar components as those described above will be assigned the same or similar reference numerals, and duplicate description will be omitted.

[0236] Reference Fig.18A and Fig.18B In this embodiment, the support plate SPT-6 may include a porous substrate PRSc, a first sealing layer SLL1, and a second sealing layer SLL2. The first sealing layer SLL1 and the second sealing layer SLL2 may be spaced apart from each other in the thickness direction (ie, the third direction DR3) via the porous substrate PRSc.

[0237] The first sealing layer SLL1 may be disposed on the porous substrate PRSc. Fig.18B As shown in , the first sealing layer SLL1 may be attached to the first porous membrane PL1 inside the porous substrate PRSc. The first sealing layer SLL1 may cover the first porous membrane PL1. The first sealing layer SLL1 may fill the first pores PR1 of the first porous membrane PL1 and may cover the first porous membrane PL1.

[0238] The second sealing layer SLL2 may be arranged below the porous substrate PRSc. Fig.18B As shown in , the second sealing layer SLL2 may be attached to the second porous membrane PL2 inside the porous substrate PRSc. The second sealing layer SLL2 may cover the second porous membrane PL2. The second sealing layer SLL2 may fill the second pores PR2 of the second porous membrane PL2 and may cover the second porous membrane PL2.

[0239] although Fig.18B An embodiment is shown in which the porous substrate PRSc includes a base material BM and a first porous membrane PL1 and a second porous membrane PL2, but the porous substrate PRSc may include Fig. 12AIn this case, the first sealing layer SLL1 may fill the third pores PR3 (refer to Fig.13A ) are exposed from the first porous membrane PL1, and the second sealing layer SLL2 may fill the fourth pores PR4 (refer to Fig.13A ) are exposed from the second porous membrane PL2.

[0240] According to the present embodiment, the first sealing layer SLL1 and the second sealing layer SLL2 may be attached to the porous substrate PRSc. When the support plate SPT-6 is folded inwardly, the first sealing layer SLL1 may prevent damage to the portion where compressive stress is dominant, and the second sealing layer SLL2 may prevent damage to the portion where tensile stress is dominant. Therefore, the portion of the porous substrate PRSc overlapping with the folding area FA may not define an opening or a groove therein. The third supporting portion SA3 may overlap with the entire folding area FA. Therefore, the process of forming an opening or a groove in the support plate SPT-6 may be omitted. As a result, the manufacturing process may be simplified, the manufacturing cost may be reduced, and the degree of freedom in the selection of materials may be increased.

[0241] Furthermore, since the support plate SPT-6 does not define an opening therein, the cover layer CVL (refer to FIG. 5 ) attached to the support plate SPT-6 to prevent penetration of foreign matter may be omitted. Figure 6 ).

[0242] Fig.19A and Fig.19B is a cross-sectional view showing a portion of a lower plate according to an embodiment of the present disclosure. Fig. 20A and Fig. 20B is a cross-sectional view showing a portion of a lower plate according to an embodiment of the present disclosure. FIG. 19A to FIG. 20B In the figure, only the first lower plates LPT1, LPT1-1, LPT1-2 and LPT1-3 are shown as examples. FIG. 19A to FIG. 20B The description given for the first lower plates LPT1, LPT1-1, LPT1-2 and LPT1-3 is also applicable to the second lower plate LPT2 (see Figure 6 ). Figures 1 to 15 The same or similar components as those described above will be assigned the same or similar reference numerals, and duplicate description will be omitted.

[0243] Reference Fig.19A In this embodiment, the first lower plate LPT1 may include a lower porous substrate LPRS. The lower porous substrate LPRS may include a lower base material LBM, a fifth porous membrane PL5, and a sixth porous membrane PL6. The fifth porous membrane PL5 and the sixth porous membrane PL6 may be spaced apart from each other in the thickness direction (ie, the third direction DR3) via the lower base material LBM.

[0244] The lower substrate LBM may be a metal substrate. The fifth porous membrane PL5 may be an oxide film formed on the front surface F-LBM of the lower substrate LBM, and the sixth porous membrane PL6 may be an oxide film formed on the rear surface B-LBM of the lower substrate LBM. FIG. 10A to FIG. 11C The description given for the substrate BM is analogously applicable to the lower substrate LBM, and the above references FIG. 10A to FIG. 11C The description given of the first porous membrane PL1 and the second porous membrane PL2 may be similarly applied to the fifth porous membrane PL5 and the sixth porous membrane PL6. That is, the fifth porous membrane PL5 and the sixth porous membrane PL6 may be formed by anodizing the lower substrate LBM. Each of the fifth porous membrane PL5 and the sixth porous membrane PL6 may define pores therein.

[0245] According to this embodiment, the lower plate LPT (see Figure 6 ) to external impact resistance, and can reduce or prevent the display device DD (reference Figure 6 ) damage. Can improve the lower plate LPT (refer to Figure 6 ) and can accordingly reduce or prevent the display device DD (refer to Figure 6 ) deformation. Lower plate LPT (refer to Figure 6 ) can have high shear stress and improved impact resistance, and can effectively improve the lower plate LPT (refer to Figure 6 ) reliability. In addition, the lower substrate LBM may include a light metal. Therefore, the lower plate LPT (refer to Figure 6 ) can be made lightweight.

[0246] In an embodiment, the first lower plate LPT1 may further include a sealant filling the pores in the fifth porous membrane PL5 and a sealant filling the pores in the sixth porous membrane PL6. In an embodiment of the present disclosure, the first lower plate LPT1 may further include a sealing layer filling the pores in the fifth porous membrane PL5 and covering the fifth porous membrane PL5 and a sealing layer filling the pores in the sixth porous membrane PL6 and covering the sixth porous membrane PL6.

[0247] Reference Fig.19B In this embodiment, the first lower plate LPT1-1 may include a lower porous substrate LPRS-1. The lower porous substrate LPRS-1 may include a lower base material LBM, a fifth porous membrane PL5, a sixth porous membrane PL6, a seventh porous membrane PL7, and an eighth porous membrane PL8.

[0248] The fifth porous membrane PL5 and the seventh porous membrane PL7 may be arranged on the lower substrate LBM, and the sixth porous membrane PL6 and the eighth porous membrane PL8 may be arranged below the lower substrate LBM. The seventh porous membrane PL7 may be arranged between the lower substrate LBM and the fifth porous membrane PL5, and the eighth porous membrane PL8 may be arranged between the lower substrate LBM and the sixth porous membrane PL6.

[0249] In this embodiment, the above reference FIG. 12A to FIG. 13C The description given for the substrate BM is analogously applicable to the lower substrate LBM, and the above references FIG. 12A to FIG. 13C The description of the first porous membrane PL1 to the fourth porous membrane PL4 given may be similarly applicable to the fifth porous membrane PL5 to the eighth porous membrane PL8. That is, the fifth porous membrane PL5 to the eighth porous membrane PL8 may be formed by plasma electrolytic oxidation of the lower substrate LBM. Each of the fifth porous membrane PL5 to the eighth porous membrane PL8 may define pores therein. The seventh porous membrane PL7 and the eighth porous membrane PL8 may have a lower porosity, a high density and a high hardness than the fifth porous membrane PL5 and the sixth porous membrane PL6, respectively. The fifth porous membrane PL5 and the sixth porous membrane PL6 may be referred to as low-density membranes, and the seventh porous membrane PL7 and the eighth porous membrane PL8 may be referred to as high-density membranes.

[0250] According to the present embodiment, the lower porous substrate LPRS-1 may include high-density films PL7 and PL8, and thus may effectively improve the adhesion between the lower base material LBM and the low-density films PL5 and PL6. The high-density films PL7 and PL8 may provide a film having a relatively high hardness between the lower base material LBM and the low-density films PL5 and PL6, while providing a space for impact dispersion between the lower base material LBM and the low-density films PL5 and PL6, thereby reducing or preventing damage to the porous films PL5 to PL8 due to external impact.

[0251] In an embodiment of the present disclosure, the first lower plate LPT1 - 1 may further include a sealant filling pores in the fifth porous membrane PL5 and a sealant filling pores in the sixth porous membrane PL6 .

[0252] Reference Fig. 20A In this embodiment, the first lower plate LPT1-2 may include a lower porous substrate LPRS, a third cover substrate CPT3 and a fourth cover substrate CPT4. Fig.19A and Fig.19B Compared to those in the described embodiments, the first lower plate LPT1-2 may further include third and fourth cover substrates CPT3 and CPT4. The third and fourth cover substrates CPT3 and CPT4 may be spaced apart from each other in the thickness direction (ie, third direction DR3) via the lower porous substrate LPRS.

[0253] exist Fig. 20A In FIG. 1 , the lower porous substrate LPRS is briefly shown. Fig.19A The description given may be applicable to the lower porous substrate LPRS. The lower porous substrate LPRS may include a lower base material LBM and a fifth porous membrane PL5 and a sixth porous membrane PL6. Alternatively, the above reference Fig.19B The given description may be applicable to the lower porous substrate LPRS.The lower porous substrate LPRS may include a lower base material LBM and fifth to eighth porous membranes PL5 to PL8.

[0254] The third cover substrate CPT3 may be arranged on the lower porous substrate LPRS. The third cover substrate CPT3 may be arranged directly on the front surface F-LPRS of the lower porous substrate LPRS. The fourth cover substrate CPT4 may be arranged below the lower porous substrate LPRS. The fourth cover substrate CPT4 may be arranged directly on the back surface B-LPRS of the lower porous substrate LPRS.

[0255] Each of the third cover substrate CPT3 and the fourth cover substrate CPT4 may include a metal. Each of the third cover substrate CPT3 and the fourth cover substrate CPT4 may be a metal substrate. In an embodiment, the metal included in each of the third cover substrate CPT3 and the fourth cover substrate CPT4 may include stainless steel (SUS). The cover substrates CPT3 and CPT4 may be arranged on a porous membrane having pores defined therein, and thus damage to the porous membrane may be reduced or prevented. Therefore, the lower plate LPT (refer to Figure 6 ) reliability.

[0256] Reference Fig. 20B In this embodiment, the first lower plate LPT1-3 may include a lower porous substrate LPRS, a third cover substrate CPT3, a fourth cover substrate CPT4, a first lower adhesive layer LAL1 and a second lower adhesive layer LAL2. That is, when compared with the reference Fig. 20A Compared with the first lower panel LPT1-2 in the described embodiment, the first lower panel LPT1-3 may further include a first lower adhesive layer LAL1 and a second lower adhesive layer LAL2.

[0257] The first lower adhesive layer LAL1 may be arranged between the lower porous substrate LPRS and the third cover substrate CPT3. The first lower adhesive layer LAL1 may couple the lower porous substrate LPRS and the third cover substrate CPT3. The second lower adhesive layer LAL2 may be arranged between the lower porous substrate LPRS and the fourth cover substrate CPT4. The second lower adhesive layer LAL2 may couple the lower porous substrate LPRS and the fourth cover substrate CPT4.

[0258] Each of the first lower adhesive layer LAL1 and the second lower adhesive layer LAL2 may include a transparent adhesive such as a pressure sensitive adhesive (PSA) or an optically clear adhesive (OCA), but is not limited thereto. For another example, each of the first lower adhesive layer LAL1 and the second lower adhesive layer LAL2 may include thermoplastic polyurethane (TPU).

[0259] According to this embodiment, even if the electronic device ED (see Figure 1 ) can also stably maintain the connection state between the lower porous substrate LPRS and the covering substrates CPT3 and CPT4, and can reduce or prevent the lower plate LPT (refer to Figure 6 ) damage or deformation. Therefore, it can effectively improve the lower plate LPT (refer to Figure 6 ) reliability.

[0260] According to the present disclosure, an electronic device may include a support plate having high shear stress and improved impact resistance and elastic recovery. Therefore, damage to the electronic device due to external impact may be reduced or prevented, and damage or deformation of the electronic device due to repeated folding operations may be reduced or prevented. Therefore, the reliability of the electronic device may be effectively improved.

[0261] While the present disclosure has been described with reference to the embodiments thereof, it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the disclosure as set forth in the appended claims.

Claims

1. An electronic device, comprising: a display panel, wherein the display panel is foldable about a virtual folding axis extending in a first direction; as well as a support plate, the support plate being arranged below the display panel, the support plate comprising a porous substrate, Wherein, the porous substrate comprises: a substrate, the substrate comprising a metal; a first porous membrane disposed on the substrate, the first porous membrane comprising a metal oxide; and A second porous membrane is disposed below the substrate, the second porous membrane comprising a metal oxide.

2. The electronic device according to claim 1, wherein: Each of the metal oxide included in the first porous film and the metal oxide included in the second porous film is an oxide of the metal included in the substrate.

3. The electronic device according to claim 1, wherein: Each of the pores in the first porous membrane and the pores in the second porous membrane has a column shape extending in a thickness direction in a cross-sectional view.

4. The electronic device according to claim 1, wherein: The porous substrate further comprises: a third porous membrane disposed between the substrate and the first porous membrane; and a fourth porous membrane, the fourth porous membrane being arranged between the substrate and the second porous membrane, wherein the third porous membrane has a porosity lower than that of the first porous membrane, and The fourth porous membrane has a porosity lower than that of the second porous membrane.

5. The electronic device according to claim 4, wherein: The third porous film has a hardness higher than that of the first porous film, and The fourth porous membrane has a hardness higher than that of the second porous membrane.

6. The electronic device according to claim 4, wherein: Each of the metal oxide included in the first porous film and the metal oxide included in the second porous film is an oxide of the metal included in the substrate, and Wherein, each of the third porous membrane and the fourth porous membrane includes: an oxide of the metal included in the substrate.

7. The electronic device according to claim 4, wherein: Each of the pores in the first porous membrane, the pores in the second porous membrane, the pores in the third porous membrane, and the pores in the fourth porous membrane has a column shape extending in the thickness direction in a cross-sectional view.

8. The electronic device according to claim 1, wherein: The metal included in the substrate includes one of aluminum, magnesium, and titanium.

9. The electronic device according to claim 1, wherein: The support plate also includes: a first sealant that fills pores in the first porous membrane; and A second sealant is provided to fill pores in the second porous membrane.

10. The electronic device according to claim 9, wherein: Each of the first sealant and the second sealant includes one of a dye and an elastic material.

11. The electronic device according to claim 1, wherein: The support plate also includes: a first cover substrate disposed on the first porous membrane; and a second cover substrate disposed below the second porous membrane, and Wherein, each of the first cover substrate and the second cover substrate comprises metal.

12. The electronic device according to claim 11, wherein: Each of the first cover substrate and the second cover substrate includes stainless steel.

13. The electronic device according to claim 11, wherein: The support plate also includes: a first adhesive support layer disposed between the first cover substrate and the first porous membrane; and A second adhesive support layer is disposed between the second cover substrate and the second porous membrane.

14. The electronic device according to claim 1, wherein: The display panel includes a folding area and first and second non-folding areas, the folding area is foldable around the folding axis, and the first and second non-folding areas are spaced apart from each other across the folding area in a second direction intersecting the first direction.

15. The electronic device according to claim 14, wherein: The support plate includes a first support portion configured to overlap the first non-folding area, a second support portion configured to overlap the second non-folding area, and a third support portion configured to overlap the folding area, and The third support portion defines an opening penetrating the support plate from a front surface of the support plate to a rear surface of the support plate.

16. The electronic device according to claim 15, wherein: The openings are arranged in a grid in plan view.

17. The electronic device according to claim 14, wherein: The support plate includes a first support portion configured to overlap the first non-folding area, a second support portion configured to overlap the second non-folding area, and a third support portion configured to overlap the folding area, and Wherein, the third support portion defines a groove on the rear surface of the support plate.

18. The electronic device according to claim 14, wherein: The support plate further comprises a filling member, wherein the filling member comprises an elastic material, wherein the porous substrate is provided in plurality, and the plurality of porous substrates include a first plate configured to overlap the first unfolded region and a second plate configured to overlap the second unfolded region and spaced apart from the first plate, and The filling member overlaps the folding area and is arranged between the first plate and the second plate.

19. The electronic device according to claim 14, wherein: The support plate also includes: a first sealing layer disposed on and covering the first porous membrane; and a second sealing layer disposed below and covering the second porous membrane, and Wherein, each of the first sealing layer and the second sealing layer comprises an elastic material.

20. The electronic device according to claim 19, wherein: The support plate includes a first support portion configured to overlap the first non-folding area, a second support portion configured to overlap the second non-folding area, and a third support portion configured to overlap the folding area, and Wherein, the third supporting portion overlaps with the entire folding area.

21. The electronic device according to claim 16, further comprising: a first lower plate disposed below the support plate and configured to overlap the first non-folding area and a portion of the folding area; as well as a second lower plate, the second lower plate being arranged below the support plate and configured to overlap the second non-folding area and another portion of the folding area, the second lower plate being spaced apart from the first lower plate, Wherein, each of the first lower plate and the second lower plate comprises: a lower substrate, the lower substrate comprising metal; a fifth porous membrane disposed on the lower substrate, the fifth porous membrane comprising a metal oxide; and A sixth porous membrane is disposed below the lower substrate, and the sixth porous membrane includes a metal oxide.

22. The electronic device according to claim 21, wherein: Each of the first lower plate and the second lower plate further includes: a seventh porous membrane disposed between the lower substrate and the fifth porous membrane; and An eighth porous membrane is disposed between the lower substrate and the sixth porous membrane.

23. The electronic device according to claim 22, wherein: The seventh porous film has a hardness higher than that of the fifth porous film, and The eighth porous membrane has a hardness higher than that of the sixth porous membrane.

24. The electronic device according to claim 21, wherein: Each of the first lower plate and the second lower plate further includes: a third cover substrate disposed on the fifth porous membrane; and a fourth cover substrate disposed below the sixth porous membrane, and Wherein, each of the third cover substrate and the fourth cover substrate comprises metal.

25. The electronic device according to claim 24, wherein: Each of the first lower plate and the second lower plate further includes: a first lower adhesive layer disposed between the third cover substrate and the fifth porous membrane; and A second lower adhesive layer is disposed between the fourth cover substrate and the sixth porous membrane.

26. The electronic device according to claim 1, further comprising: An electronic module is disposed below the display panel and at least partially inserted into a hole defined in the support plate.

27. A method of manufacturing an electronic device, comprising: forming a support plate below a display panel, wherein the display panel is foldable about a virtual folding axis extending in a first direction, Wherein, forming the support plate comprises: forming a first porous membrane and a second porous membrane including a metal oxide, Here, in forming the first porous membrane and the second porous membrane, the first porous membrane is formed on a substrate and the second porous membrane is formed under the substrate.

28. The method for manufacturing an electronic device according to claim 27, wherein: Forming the first porous film and the second porous film is performed by an anodizing process.

29. The method for manufacturing an electronic device according to claim 27, wherein: In forming the first porous membrane and the second porous membrane, a third porous membrane is further formed between the substrate and the first porous membrane, and a fourth porous membrane is further formed between the substrate and the second porous membrane.

30. The method for manufacturing an electronic device according to claim 29, wherein: The forming of the first porous film and the second porous film is performed by a plasma electrolytic oxidation process.

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