Chip packaging positioning system and method based on big data

Abstract

The invention discloses a chip packaging positioning system and method based on big data, and relates to the technical field of chip packaging positioning, and the system comprises a chip positioning event obtaining module, a characterization positioning difference value analysis module, a target type chip marking module, a data association model construction module and a real-time early warning response module. The chip positioning event acquisition module is used for acquiring chip positioning events of various types of chips before packaging recorded by the chip packaging system, and the characterization positioning difference value analysis module analyzes a positioning result and characterization positioning difference values of the corresponding types of chips; the target type chip marking module is used for marking a chip type corresponding to the characterization positioning difference value greater than or equal to the characterization positioning difference value threshold as a target type chip, and the data association model building module is used for building a data association model of a test result and a positioning result; and the real-time early warning response module inputs a real-time test result to carry out early warning response of a positioning mode on the chips of the same type after the chip function test link is executed and before packaging and positioning.

Description

Technical Field

[0001] The present invention relates to the field of chip packaging positioning technology, and in particular to a chip packaging positioning system and method based on big data. Background Art

[0002] Chip packaging technology is an important part of modern electronic technology. It isolates the chip from the outside world, protects the chip from the external environment, and realizes the connection and information transmission between chips. The package is usually made of plastic, ceramic or metal materials, which can protect the chip from adverse factors such as temperature, humidity, dust, etc. Before chip packaging, it is usually necessary to cut and position the chip strips, and it is easy to cause damage to the corner chips during the cutting and transfer process, which causes the problem of positioning accuracy when positioning the corners. The existing technology avoids this problem by re-determining the angle of the positioning reference point. However, the problem of wear on the corners is not only caused by movement, but also may be caused by the processing of physically damaged chips in the previous functional test link. This concept can not only include the damage caused by the movement of the corners, but also accurately locate the cutting position of the damaged chip. However, due to the processing differences of the chips under different conditions, even the same type of chips may have differences in the final positioning reference points. How to effectively achieve efficient and convenient chip positioning based on the position data of the damaged chip in the test link is worth studying. Summary of the invention

[0003] The purpose of the present invention is to provide a chip packaging positioning system and method based on big data to solve the problems raised in the prior art.

[0004] To achieve the above object, the present invention provides the following technical solution: a chip packaging positioning method based on big data, the positioning method comprising the following steps:

[0005] Step S100: obtaining chip positioning events of various types of chips recorded by the chip packaging system before packaging, wherein various types of chips refer to chip types determined by the total length of the chip strip, the number of chips in rows and columns, and the step distance information before chip positioning;

[0006] Step S200: data association and storage of chip type and positioning results of chip positioning event records corresponding to the same type of chip, and analysis of positioning results and positioning difference values ​​characterized by corresponding type of chip;

[0007] Step S300: setting a threshold value for the difference value representing the positioning, marking the chip type corresponding to the difference value representing the positioning greater than or equal to the threshold value for the difference value representing the positioning as a target type chip, extracting data records of the chip function test link before executing the positioning event for each target type chip, analyzing the test results of the target type chip in the chip function test link, and constructing a data association model between the test results and the positioning results;

[0008] Step S400: Based on the data association model recorded for each target type chip, input the real-time test results for the same type of chips after executing the chip function test link and before packaging and positioning to perform an early warning response in the positioning mode.

[0009] Furthermore, the chip positioning event in step S100 specifically includes the following positioning steps:

[0010] Step S110: Taking the corner point of the chip strip as the initial positioning point, moving the visual camera so that the initial positioning point appears in the camera field of view, searching all complete chips in the camera field of view through the image processing algorithm, and measuring the center coordinates of the initial positioning point;

[0011] Step S120: the camera is displaced by L1 steps along the X axis and by T1 steps along the Y axis;

[0012] Step S130: searching for all intact chips within the camera field of view after displacement through an image processing algorithm, and if the chip is intact, outputting the position corresponding to the displacement as the first positioning point; and measuring the center coordinates of the first positioning point;

[0013] Step S140: the camera is displaced by L2 steps along the X axis, the position is output as the second positioning point, and the center coordinates of the second positioning point are measured; the camera is displaced by T2 steps along the Y axis, the position is output as the third positioning point, and the center coordinates of the third positioning point are measured; the camera is displaced by L2 steps along the X axis, the direction of which is opposite to the displacement direction of the second positioning point, the position is output as the fourth positioning point, and the center coordinates of the fourth positioning point are measured;

[0014] Step S150: Take the central coordinates of the four positioning points in step S120 and step S130 as the final positioning reference point; repeat step S120 when there is an incomplete chip in the camera field of view; and when there is an incomplete chip in the camera field of view during the determination of the second positioning point, the third positioning point and the fourth positioning point, adjust the number of moving steps until the chip in the field of view is complete.

[0015] Furthermore, step S200 includes the following specific steps:

[0016] Step S210: The positioning result includes the chip type and the final positioning reference point of the corresponding chip; extracting all chip positioning events recorded by the same type of chip, the same type of chip means that the total length of the strip, the number of rows and columns of chips and the step information of the chip before the functional test phase are the same;

[0017] Based on the positioning results, calculate the positioning index U of the i-th chip positioning event recorded by the same type of chip i , U i =a1×P1 / P0+a2×S0 / S1, where a1 and a2 represent the corresponding reference coefficients, P1 represents the minimum step difference between the center point of the graphic area formed by the final positioning reference points and the center point of the chip as a whole, P0 represents the minimum total length of the horizontal and vertical step lengths recorded by the chip strip, S1 represents the graphic area formed by the final positioning reference points, and S0 represents the graphic area of ​​the chip as a whole;

[0018] When the positioning points are only proportionally reduced, the center point of the final positioning reference point pattern area should be the same as the center point of the chip as a whole. Then the variable for measuring the positioning index is determined by the area ratio. The larger the positioning index is, the greater the distance from the positioning point at the corner of the chip is.

[0019] Step S220: Obtain m chip location events recorded for the same type of chip, i≤m, using the formula:

[0020] Q={[∑(U i -U0) 2 ] / m} 1 / 2 ;

[0021] Calculate the characterization positioning difference value Q under the same type of chip; where U0 represents the average positioning index of m chip positioning events recorded by the corresponding type of chip.

[0022] The larger the difference value of the characterization positioning, the larger the deviation of the final positioning reference point in the chip positioning events corresponding to the same type of chip; conversely, the smaller the difference value, the more uniform the chip positioning results under this type.

[0023] Furthermore, step S300 includes the following specific steps:

[0024] Step S310: The chip function test phase refers to the phase of functional testing of the electrical and physical properties of the chip before the chip is positioned and packaged; the data recording of the chip function test phase includes determining the chip number in the chip strip that has abnormal chip function test due to physical defects; marking the specific position of the chip strip corresponding to the chip number based on the camera visual image as the test result;

[0025] Step S320: extract the chip position of each target type chip that records the test results of the functional test link before the chip positioning event as the loss chip position, measure the graphic area S2 formed by each loss chip position in the camera field of view, based on the positioning result of the corresponding chip positioning event, extract the graphic area S1 formed by the final positioning reference point recorded in the positioning result and the overall image area S4 of the chip strip during the functional test link, calculate the discarded graphic area S3 of the corresponding chip strip under the camera field of view, S3 = S4-S1, and use the formula: z = S2 / S3 to calculate the loss ratio z of the corresponding chip strip;

[0026] Step S330: The loss ratio z recorded in the functional test phase of the same chip strip and the positioning index U recorded in the chip positioning event constitute a data pair A, A = (z, U); extract all chip positioning events recorded by the same target type chip and several data pairs A constituted by the functional test phase, and construct a data association model Y U , Y U = k1×z+ε; Substitute several data pairs A, calculate the coefficient k1 and error term ε of each target type chip based on the data association model; generate the data association model Y of each target type chip U .

[0027] The purpose of analyzing the data association model is to find the impact of the chip function test phase before chip positioning, so that for each target category chip, the reference positioning point can be quickly evaluated immediately after the chip function test phase is completed, reducing the camera field of view for step-by-step positioning analysis, and reducing errors caused by the physical characteristics of the camera field of view itself, such as performance degradation, thereby improving the efficiency of chip positioning in the overall chip packaging process. Even if the estimated reference positioning point has deviations, it can be quickly corrected within the effective step range, which improves the positioning efficiency compared to gradual visual determination from the corners.

[0028] Furthermore, step S400 includes the following specific processes:

[0029] Obtain the chip type of the real-time functional test link, match the historical record chip type, if there is no real-time chip type that is the same as the historical record target type chip, extract the final positioning reference point of the historical record of the corresponding chip type for early warning response;

[0030] When there is a real-time chip type that is the same as the historical record target type chip, extract the data association model recorded by the target type chip, and use the real-time loss ratio recorded by the real-time chip type in the functional test phase as the input value to obtain the estimated positioning index based on the output of the data association model;

[0031] Based on the estimated positioning index, the historical record data pair A is traversed to determine the positioning result that is the same as or has the greatest similarity to the estimated positioning index, and the final positioning reference point recorded in the positioning result is extracted as the positioning method of the real-time chip type for early warning response.

[0032] A chip packaging positioning system based on big data, including a chip positioning event acquisition module, a characterization positioning difference value analysis module, a target type chip marking module, a data association model construction module and a real-time early warning response module;

[0033] The chip positioning event acquisition module is used to obtain the chip positioning events of various types of chips recorded by the chip packaging system before packaging.

[0034] The characterization positioning difference value analysis module is used to analyze the characterization positioning difference value of the positioning result and the corresponding type of chip;

[0035] The target type chip marking module is used to mark the chip type corresponding to the characterization positioning difference value greater than or equal to the characterization positioning difference value threshold as the target type chip.

[0036] The data association model building module is used to analyze the test results of the target type chip in the chip function test phase and build a data association model between the test results and the positioning results;

[0037] The real-time early warning response module is used to input the real-time test results of the same type of chips after executing the chip function test link and before packaging and positioning to perform early warning response in the positioning mode.

[0038] Further, the characterization positioning difference value analysis module includes a positioning index calculation unit and a characterization positioning difference value calculation unit;

[0039] The positioning index calculation unit is used to calculate the positioning index of the chip positioning events recorded by the same type of chips based on the positioning results;

[0040] The characterization positioning difference value calculation unit is used to obtain chip positioning events recorded by chips of the same type and calculate the characterization positioning difference value for chips of the same type.

[0041] Further, the data association model construction module includes a test result determination unit, a loss ratio analysis unit, a data pair construction unit and a data association model output unit;

[0042] The test result determination unit is used to mark the chip number corresponding to the specific position of the chip strip as the test result based on the camera visual image;

[0043] The loss ratio analysis unit is used to calculate the discarded pattern area of ​​the corresponding chip strip under the camera field of view, and calculate the loss ratio of the corresponding chip strip;

[0044] The data pair forming unit is used to form a data pair by combining the loss ratio recorded in the functional test link and the positioning index recorded in the chip positioning event of the same chip strip;

[0045] The data association model output unit is used to construct a data association model based on the data pairs.

[0046] Further, the real-time warning response module includes a chip type matching unit and a positioning result warning unit;

[0047] The chip type matching unit is used to obtain the chip type for real-time functional testing and match the historical record chip type.

[0048] The positioning result warning unit is used to extract the final positioning reference point recorded in the positioning result as a real-time chip type positioning method for early warning response.

[0049] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention analyzes the data association model to find the influence of the chip function test link before chip positioning, so that for each target category chip, the reference positioning point can be quickly evaluated immediately after the chip function test link is completed, reducing the camera field of view for step-by-step positioning analysis, and also reducing the errors caused by the physical characteristics of the camera field of view itself such as performance degradation, thereby improving the efficiency of chip positioning in the overall chip packaging process, and even if the estimated reference positioning point has deviations, it can be quickly corrected within the effective step range, which improves the positioning efficiency compared to the gradual visual determination from the corners; and improves the a priori and preprocessing capabilities of data determination from a front-end perspective. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figure 1 It is a structural schematic diagram of a chip packaging positioning system based on big data of the present invention. DETAILED DESCRIPTION

[0051] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0052] Example: Figure 1 As shown, the present invention provides a chip packaging positioning system and method technical solution based on big data, a chip packaging positioning method based on big data, and the positioning method comprises the following steps:

[0053] Step S100: obtaining chip positioning events of various types of chips recorded by the chip packaging system before packaging, wherein various types of chips refer to chip types determined by the total length of the chip strip, the number of chips in rows and columns, and the step distance information before chip positioning;

[0054] Step S200: data association and storage of chip type and positioning results of chip positioning event records corresponding to the same type of chip, and analysis of positioning results and positioning difference values ​​characterized by corresponding type of chip;

[0055] Step S300: setting a threshold value for the difference value representing the positioning, marking the chip type corresponding to the difference value representing the positioning greater than or equal to the threshold value for the difference value representing the positioning as a target type chip, extracting data records of the chip function test link before executing the positioning event for each target type chip, analyzing the test results of the target type chip in the chip function test link, and constructing a data association model between the test results and the positioning results;

[0056] Step S400: Based on the data association model recorded for each target type chip, input the real-time test results for the same type of chips after executing the chip function test link and before packaging and positioning to perform an early warning response in the positioning mode.

[0057] The chip positioning event in step S100 specifically includes the following positioning steps:

[0058] Step S110: Taking the corner point of the chip strip as the initial positioning point, moving the visual camera so that the initial positioning point appears in the camera field of view, searching all complete chips in the camera field of view through the image processing algorithm, and measuring the center coordinates of the initial positioning point;

[0059] Step S120: the camera is displaced by L1 steps along the X axis and by T1 steps along the Y axis;

[0060] Step S130: searching for all intact chips within the camera field of view after displacement through an image processing algorithm, and if the chip is intact, outputting the position corresponding to the displacement as the first positioning point; and measuring the center coordinates of the first positioning point;

[0061] Step S140: the camera is displaced by L2 steps along the X axis, the position is output as the second positioning point, and the center coordinates of the second positioning point are measured; the camera is displaced by T2 steps along the Y axis, the position is output as the third positioning point, and the center coordinates of the third positioning point are measured; the camera is displaced by L2 steps along the X axis, the direction of which is opposite to the displacement direction of the second positioning point, the position is output as the fourth positioning point, and the center coordinates of the fourth positioning point are measured;

[0062] Step S150: Take the central coordinates of the four positioning points in step S120 and step S130 as the final positioning reference point; repeat step S120 when there is an incomplete chip in the camera field of view; and when there is an incomplete chip in the camera field of view during the determination of the second positioning point, the third positioning point and the fourth positioning point, adjust the number of moving steps until the chip in the field of view is complete.

[0063] In the above positioning process, the value range of L1 is generally 1 to 3, and the value range of T1 is 1 to 3; the L2 and T2 values ​​are determined by the total length of the strip, the number of row and column chips and the step information, which can be determined by the operator based on the chip situation in the camera field of view. The area of ​​the camera field of view must cover at least one complete chip.

[0064] Step S200 includes the following specific steps:

[0065] Step S210: The positioning result includes the chip type and the final positioning reference point of the corresponding chip; extracting all chip positioning events recorded by the same type of chip, the same type of chip means that the total length of the strip, the number of rows and columns of chips and the step information of the chip before the functional test phase are the same;

[0066] Based on the positioning results, calculate the positioning index U of the i-th chip positioning event recorded by the same type of chip i , U i =a1×P1 / P0+a2×S0 / S1, where a1 and a2 represent the corresponding reference coefficients, P1 represents the minimum step difference between the center point of the graphic area formed by the final positioning reference points and the center point of the chip as a whole, P0 represents the minimum total length of the horizontal and vertical step lengths recorded by the chip strip, S1 represents the graphic area formed by the final positioning reference points, and S0 represents the graphic area of ​​the chip as a whole;

[0067] The minimum step difference refers to the minimum step value that can be moved when any of the two center points is displaced;

[0068] When the positioning points are only proportionally reduced, the center point of the final positioning reference point pattern area should be the same as the center point of the chip as a whole. Then the variable for measuring the positioning index is determined by the area ratio. The larger the positioning index is, the greater the distance from the positioning point at the corner of the chip is.

[0069] Step S220: Obtain m chip location events recorded for the same type of chip, i≤m, using the formula:

[0070] Q={[∑(U i -U0) 2 ] / m} 1 / 2 ;

[0071] Calculate the characterization positioning difference value Q under the same type of chip; where U0 represents the average positioning index of m chip positioning events recorded by the corresponding type of chip.

[0072] The larger the difference value of the characterization positioning, the larger the deviation of the final positioning reference point in the chip positioning events corresponding to the same type of chip; conversely, the smaller the difference value, the more uniform the chip positioning results under this type.

[0073] Step S300 includes the following specific steps:

[0074] Step S310: The chip function test phase refers to the phase of functional testing of the electrical and physical properties of the chip before the chip is positioned and packaged; the data recording of the chip function test phase includes determining the chip number in the chip strip that has abnormal chip function test due to physical defects; marking the specific position of the chip strip corresponding to the chip number based on the camera visual image as the test result;

[0075] Step S320: extract the chip position of each target type chip that records the test results of the functional test link before the chip positioning event as the loss chip position, measure the graphic area S2 formed by each loss chip position in the camera field of view, based on the positioning result of the corresponding chip positioning event, extract the graphic area S1 formed by the final positioning reference point recorded in the positioning result and the overall image area S4 of the chip strip during the functional test link, calculate the discarded graphic area S3 of the corresponding chip strip under the camera field of view, S3 = S4-S1, and use the formula: z = S2 / S3 to calculate the loss ratio z of the corresponding chip strip;

[0076] Step S330: The loss ratio z recorded in the functional test phase of the same chip strip and the positioning index U recorded in the chip positioning event constitute a data pair A, A = (z, U); extract all chip positioning events recorded by the same target type chip and several data pairs A constituted by the functional test phase, and construct a data association model Y U , Y U = k1×z+ε; Substitute several data pairs A, calculate the coefficient k1 and error term ε of each target type chip based on the data association model; generate the data association model Y of each target type chip U .

[0077] Because when the camera field of view determines the positioning point, it analyzes whether there is a complete chip in the field of view. When the chip is defective, positioning will continue until a positioning point that can cover the complete chip in the field of view is selected. Therefore, in the previous test link, when there is a chip defect, whether it is the wear of adjacent chips caused by the processing of the defective chip in this link, or the processing of the defective chip after the chip is positioned, it will affect the result of the chip positioning link. The greater the proportion of defective chips, the greater the impact on the cutting corners of the chip strips, and the greater the impact, the greater the degree to which the reference positioning point may deviate from the corners.

[0078] The purpose of analyzing the data association model is to find the impact of the chip function test phase before chip positioning, so that for each target category chip, the reference positioning point can be quickly evaluated immediately after the chip function test phase is completed, reducing the camera field of view for step-by-step positioning analysis, and reducing errors caused by the physical characteristics of the camera field of view itself, such as performance degradation, thereby improving the efficiency of chip positioning in the overall chip packaging process. Even if the estimated reference positioning point has deviations, it can be quickly corrected within the effective step range, which improves the positioning efficiency compared to gradual visual determination from the corners.

[0079] Step S400 includes the following specific processes:

[0080] Obtain the chip type of the real-time functional test link, match the historical record chip type, if there is no real-time chip type that is the same as the historical record target type chip, extract the final positioning reference point of the historical record of the corresponding chip type for early warning response;

[0081] When there is a real-time chip type that is the same as the historical record target type chip, extract the data association model recorded by the target type chip, and use the real-time loss ratio recorded by the real-time chip type in the functional test phase as the input value to obtain the estimated positioning index based on the output of the data association model;

[0082] Based on the estimated positioning index, the historical record data pair A is traversed to determine the positioning result that is the same as or has the greatest similarity to the estimated positioning index, and the final positioning reference point recorded in the positioning result is extracted as the positioning method of the real-time chip type for early warning response.

[0083] A chip packaging positioning system based on big data, including a chip positioning event acquisition module, a characterization positioning difference value analysis module, a target type chip marking module, a data association model construction module and a real-time early warning response module;

[0084] The chip positioning event acquisition module is used to obtain the chip positioning events of various types of chips recorded by the chip packaging system before packaging.

[0085] The characterization positioning difference value analysis module is used to analyze the characterization positioning difference value of the positioning result and the corresponding type of chip;

[0086] The target type chip marking module is used to mark the chip type corresponding to the characterization positioning difference value greater than or equal to the characterization positioning difference value threshold as the target type chip.

[0087] The data association model building module is used to analyze the test results of the target type chip in the chip function test phase and build a data association model between the test results and the positioning results;

[0088] The real-time early warning response module is used to input the real-time test results of the same type of chips after executing the chip function test link and before packaging and positioning to perform early warning response in the positioning mode.

[0089] The characterization positioning difference value analysis module includes a positioning index calculation unit and a characterization positioning difference value calculation unit;

[0090] The positioning index calculation unit is used to calculate the positioning index of the chip positioning events recorded by the same type of chips based on the positioning results;

[0091] The characterization positioning difference value calculation unit is used to obtain chip positioning events recorded by chips of the same type and calculate the characterization positioning difference value for chips of the same type.

[0092] The data association model construction module includes a test result determination unit, a loss ratio analysis unit, a data pair construction unit and a data association model output unit;

[0093] The test result determination unit is used to mark the chip number corresponding to the specific position of the chip strip as the test result based on the camera visual image;

[0094] The loss ratio analysis unit is used to calculate the discarded pattern area of ​​the corresponding chip strip under the camera field of view, and calculate the loss ratio of the corresponding chip strip;

[0095] The data pair forming unit is used to form a data pair by combining the loss ratio recorded in the functional test link and the positioning index recorded in the chip positioning event of the same chip strip;

[0096] The data association model output unit is used to construct a data association model based on the data pairs.

[0097] The real-time warning response module includes a chip type matching unit and a positioning result warning unit;

[0098] The chip type matching unit is used to obtain the chip type for real-time functional testing and match the historical record chip type.

[0099] The positioning result warning unit is used to extract the final positioning reference point recorded in the positioning result as a real-time chip type positioning method for early warning response.

[0100] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A chip packaging positioning method based on big data, characterized in that: The positioning method comprises the following steps: Step S100: obtaining chip positioning events of various types of chips recorded by the chip packaging system before packaging, wherein the various types of chips refer to chip types determined by the total length of the chip strip, the number of chips in rows and columns, and the pitch information before chip positioning; Step S200: data association and storage of chip type and positioning results of chip positioning event records corresponding to the same type of chip, and analysis of positioning results and positioning difference values ​​characterized by corresponding type of chip; Step S300: setting a threshold value for the difference value representing the positioning, marking the chip type corresponding to the difference value representing the positioning greater than or equal to the threshold value for the difference value representing the positioning as a target type chip, extracting data records of the chip function test link before executing the positioning event for each target type chip, analyzing the test results of the target type chip in the chip function test link, and constructing a data association model between the test results and the positioning results; Step S400: Based on the data association model recorded for each target type chip, input the real-time test results for the same type of chips after executing the chip function test link and before packaging and positioning to perform an early warning response in the positioning mode.

2. The chip packaging positioning method based on big data according to claim 1, characterized in that: The chip positioning event in step S100 specifically includes the following positioning steps: Step S110: Taking the corner point of the chip strip as the initial positioning point, moving the visual camera so that the initial positioning point appears in the camera field of view, searching all complete chips in the camera field of view through the image processing algorithm, and measuring the center coordinates of the initial positioning point; Step S120: the camera is displaced by L1 steps along the X axis and by T1 steps along the Y axis; Step S130: searching for all intact chips within the camera field of view after displacement through an image processing algorithm, and if the chip is intact, outputting the position corresponding to the displacement as the first positioning point; and measuring the center coordinates of the first positioning point; Step S140: the camera is displaced by L2 steps along the X axis, the position is output as the second positioning point, and the center coordinates of the second positioning point are measured; the camera is displaced by T2 steps along the Y axis, the position is output as the third positioning point, and the center coordinates of the third positioning point are measured; the camera is displaced by L2 steps along the X axis, the direction of which is opposite to the displacement direction of the second positioning point, the position is output as the fourth positioning point, and the center coordinates of the fourth positioning point are measured; Step S150: Take the central coordinates of the four positioning points in step S120 and step S130 as the final positioning reference point; repeat step S120 when there is an incomplete chip in the camera field of view; and when there is an incomplete chip in the camera field of view during the determination of the second positioning point, the third positioning point and the fourth positioning point, adjust the number of moving steps until the chip in the field of view is complete.

3. The chip packaging positioning method based on big data according to claim 2, characterized in that: The step S200 includes the following specific steps: Step S210: The positioning result includes the chip type and the final positioning reference point of the corresponding chip; extracting all chip positioning events recorded by the same type of chip, wherein the same type of chip refers to the chips with the same total strip length, number of rows and columns of chips and step information before the functional test phase; Based on the positioning results, calculate the positioning index U of the i-th chip positioning event recorded by the same type of chip i , U i =a1×P1 / P0+a2×S0 / S1, where a1 and a2 represent the corresponding reference coefficients, P1 represents the minimum step difference between the center point of the graphic area formed by the final positioning reference points and the center point of the chip as a whole, P0 represents the minimum total length of the horizontal and vertical step lengths recorded by the chip strip, S1 represents the graphic area formed by the final positioning reference points, and S0 represents the graphic area of ​​the chip as a whole; Step S220: Obtain m chip location events recorded for the same type of chip, i≤m, using the formula: Q={[∑(U i -U0) 2 ] / m} 1 / 2 ; Calculate the characterization positioning difference value Q under the same type of chip; where U0 represents the average positioning index of m chip positioning events recorded by the corresponding type of chip.

4. The chip packaging positioning system and method based on big data according to claim 3, characterized in that: The step S300 includes the following specific steps: Step S310: The chip function test link refers to the link of functional testing the electrical and physical properties of the chip before the chip is positioned and packaged; the data recording of the chip function test link includes determining the chip number in the chip strip that has abnormal chip function test due to physical defects; marking the specific position of the chip strip corresponding to the chip number based on the camera visual image as the test result; Step S320: extract the chip position of each target type chip that records the test results of the functional test link before the chip positioning event as the loss chip position, measure the graphic area S2 formed by each loss chip position in the camera field of view, based on the positioning result of the corresponding chip positioning event, extract the graphic area S1 formed by the final positioning reference point recorded in the positioning result and the overall image area S4 of the chip strip during the functional test link, calculate the discarded graphic area S3 of the corresponding chip strip under the camera field of view, S3 = S4-S1, and use the formula: z = S2 / S3 to calculate the loss ratio z of the corresponding chip strip; Step S330: The loss ratio z recorded in the functional test phase of the same chip strip and the positioning index U recorded in the chip positioning event constitute a data pair A, A = (z, U); extract all chip positioning events recorded by the same target type chip and several data pairs A constituted by the functional test phase, and construct a data association model Y U , Y U =k1×z+ε; Substitute several data pairs A and calculate the coefficient k1 and error term ε of each target type chip based on the data association model; Generate the data association model Y for each target type chip U .

5. The chip packaging positioning system and method based on big data according to claim 1, characterized in that: The step S400 includes the following specific processes: Obtain the chip type of the real-time functional test link, match the historical record chip type, if there is no real-time chip type that is the same as the historical record target type chip, extract the final positioning reference point of the historical record of the corresponding chip type for early warning response; When there is a real-time chip type that is the same as the historical record target type chip, extract the data association model recorded by the target type chip, and use the real-time loss ratio recorded by the real-time chip type in the functional test phase as the input value to obtain the estimated positioning index based on the output of the data association model; Based on the estimated positioning index, the historical record data pair A is traversed to determine the positioning result that is the same as or has the greatest similarity to the estimated positioning index, and the final positioning reference point recorded in the positioning result is extracted as the positioning method of the real-time chip type for early warning response.

6. A chip packaging positioning system based on big data, such as using a chip packaging positioning method based on big data as described in any one of claims 1 to 5, characterized in that: It includes a chip positioning event acquisition module, a characterization positioning difference value analysis module, a target type chip marking module, a data association model construction module and a real-time warning response module; The chip positioning event acquisition module is used to acquire chip positioning events of various types of chips recorded by the chip packaging system before packaging. The characterization positioning difference value analysis module is used to analyze the characterization positioning difference value between the positioning result and the corresponding type of chip; The target type chip marking module is used to mark the chip type corresponding to the characterization positioning difference value being greater than or equal to the characterization positioning difference value threshold as the target type chip, The data association model building module is used to analyze the test results of the target type chip in the chip function test link, and build a data association model between the test results and the positioning results; The real-time early warning response module is used to input the real-time test results of the same type of chips after executing the chip function test link and before packaging and positioning to perform early warning response in the positioning mode.

7. The chip packaging positioning system based on big data according to claim 6, characterized in that: The characterizing positioning difference value analysis module includes a positioning index calculation unit and a characterizing positioning difference value calculation unit; The positioning index calculation unit is used to calculate the positioning index of the chip positioning events recorded by the same type of chips based on the positioning results; The characterization positioning difference value calculation unit is used to obtain chip positioning events recorded by chips of the same type and calculate the characterization positioning difference value for chips of the same type.

8. The chip packaging positioning system based on big data according to claim 1, characterized in that: The data association model construction module includes a test result determination unit, a loss ratio analysis unit, a data pair construction unit and a data association model output unit; The test result determination unit is used to mark the chip number on the camera visual image and correspond to the specific position of the chip strip where the chip is located as the test result; The loss ratio analysis unit is used to calculate the discarded pattern area of ​​the corresponding chip strip under the camera field of view, and calculate the loss ratio of the corresponding chip strip; The data pair forming unit is used to form a data pair by combining the loss ratio recorded in the functional test phase and the positioning index recorded in the chip positioning event of the same chip strip; The data association model output unit is used to construct a data association model based on the data pairs.

9. The chip packaging positioning system based on big data according to claim 1, characterized in that: The real-time warning response module includes a chip type matching unit and a positioning result warning unit; The chip type matching unit is used to obtain the chip type for real-time functional testing and match the historical record chip type. The positioning result warning unit is used to extract the final positioning reference point recorded in the positioning result as a real-time chip type positioning method for early warning response.

Images