This invention relates to the field of
wafer testing technology, specifically to an
automated method and
system for handling false positives during
wafer testing. The method involves a
server that presets false positive blocking conditions and corresponding handling methods, and connects to a probe prober and a testing
machine. The testing
machine uploads real-time
test data to the
server. When the
server determines a false positive based on the preset conditions, it controls the probe prober to stop testing and issues an alarm, while simultaneously automatically generating a device anomaly report. Operators operate the probe prober according to the handling methods issued by the server, and the probe prober generates an operation
record and uploads it in real time. The server compares the operation
record with the preset methods for consistency and receives the retest results from the testing
machine. If the retest results are satisfactory, the server saves the
record, restores the
device status, and optimizes and updates the handling method by
parsing the operation record. This invention achieves a
fully automated closed-loop process for false positive detection, handling,
verification, and optimization, improving testing efficiency and
quality control.