Attenuator unit, cluster attenuator, installation method, microwave circuit and quantum computer

Abstract

The present invention discloses an attenuator unit, a cluster attenuator, an installation method, a microwave circuit and a quantum computer, comprising: an attenuation chip; one end of the attenuation chip is fixedly electrically connected to a second inner conductor, the other end of the second inner conductor is arranged axially and back to the attenuation chip, and the other end is movably electrically connected to a first inner conductor arranged axially; the other end of the attenuation chip is fixedly electrically connected to a third inner conductor, the other end of the third inner conductor is arranged axially and back to the attenuation chip, and the other end is movably electrically connected to a fourth inner conductor arranged axially; when the first inner conductor or the fourth inner conductor moves relative to the attenuation chip, the stress generated is prevented from being transmitted to the attenuation chip; two sections of coaxially arranged inner conductors are respectively connected on both sides of the attenuation chip, and when the attenuator unit is connected, the axial and radial positions of the attenuation chip are limited to prevent relative rotation between the first connector and the second connector, which would damage the attenuation chip.

Description

Technical Field

[0001] The present invention relates to the field of quantum computers, and in particular to an attenuator unit, a cluster attenuator, an installation method, a microwave circuit and a quantum computer. Background Art

[0002] The cryogenic electronic devices of superconducting quantum computers include passive devices such as attenuators, adapters, connectors, low-pass filters, circulators, etc. To ensure the normal operation of superconducting quantum chips, superconducting quantum chips and cryogenic electronic devices are usually placed inside an insulated vacuum tank with a mK temperature provided by a dilution refrigerator. External control signals and power supply are transmitted into the dilution refrigerator by several coaxial microwave cables.

[0003] There are two ways to connect the inner conductor and the attenuation chip: spring elastic connection and welding. The spring elastic connection is simple to install, but the spring elasticity will fail at a temperature of 10mk, resulting in poor contact between the inner conductor and the attenuation chip, which in turn causes the microwave signal of the entire link to be blocked; the welding connection is reliable, but because the size of the attenuation chip and the inner conductor is less than 1mm, and the size and position have a relatively large impact on the characteristic impedance of the attenuator, characteristic impedance mismatch will cause microwave signal deterioration and inaccurate data.

[0004] During the installation and debugging process, the attenuator needs to be disassembled and assembled repeatedly. During the disassembly and assembly process, the connector will rotate together with the matching cable, causing the conductor inside the attenuator to rotate together with the conductor inside the connector, thereby damaging the attenuation chip. Summary of the invention

[0005] The purpose of the present invention is to solve the shortcomings of the prior art and to propose an attenuator unit, a cluster attenuator, an installation method, a microwave circuit and a quantum computer.

[0006] In order to achieve the above object, the present invention adopts the following technical solution: an attenuator unit, comprising:

[0007] Attenuation chip;

[0008] One end of the attenuation chip is fixedly electrically connected to the second inner conductor, the other end of the second inner conductor is arranged axially and facing away from the attenuation chip and the other end is movably electrically connected to an axially arranged first inner conductor;

[0009] The other end of the attenuation chip is fixedly electrically connected to the third inner conductor, and the other end of the third inner conductor is arranged axially and away from the attenuation chip, and the other end is movably electrically connected to an axially arranged fourth inner conductor, so as to prevent the stress generated when the first inner conductor or the fourth inner conductor moves relative to the attenuation chip from being transmitted to the attenuation chip.

[0010] As a further description of the above technical solution: the attenuation chip is installed between a first connector and a second connector, the first connector is provided with a first outer conductor and a first insulator in sequence from the outside to the inside, and the first insulator is provided with a first inner conductor coaxial with the second inner conductor on the inner side;

[0011] The second connector is provided with a second outer conductor and a second insulator in sequence from the outside to the inside, and a fourth inner conductor coaxial with the third inner conductor is provided inside the second insulator.

[0012] As a further description of the above technical solution: the second inner conductor and the third inner conductor are connected to the attenuation chip by fixed electrical connection, and the fixed electrical connection includes welding, bonding, and hot-melt connection;

[0013] The first inner conductor and the second inner conductor are in active electrical connection, and the third inner conductor and the fourth inner conductor are in active electrical connection. The active electrical connection includes abutting, plugging or setting a conductive medium for electrical connection.

[0014] As a further description of the above technical solution: the attenuator unit also includes a positioning mechanism to position the attenuation chip, the positioning mechanism includes a first fixing frame and a second fixing frame, a guide rail is arranged between the first fixing frame and the second fixing frame, the guide rail passes through the first fixing frame and the second fixing frame, and the second inner conductor and the third inner conductor are plugged in using the positioning mechanism.

[0015] As a further description of the above technical solution: a third outer conductor is arranged on the outside of the attenuation chip, the outer diameter of the third outer conductor is adapted to the inner diameter of the second outer conductor, and the third outer conductor is located between the first fixing frame and the second fixing frame to limit the attenuation chip.

[0016] As a further description of the above technical solution: the inner sides of the first outer conductor and the second outer conductor are provided with a limiting portion extending radially inward, and at least one or more sliding grooves are provided on the limiting portion, and are adapted to the outer diameter shape of the first insulator or the second insulator.

[0017] As a further description of the above technical solution: the first insulator abuts against the first fixing frame, and the second insulator abuts against the second fixing frame.

[0018] Also included is a cluster attenuator, which is applicable to the attenuator unit of any one of the above technical solutions, including:

[0019] A housing, wherein a plurality of attenuator units are arranged on the housing;

[0020] A cover plate is provided on one side of the shell, and a volume cavity is formed by the shell and the cover plate being installed and connected. An elastic component and the attenuator unit are placed inside the volume cavity, and the elastic component is placed outside the first connector or the second connector.

[0021] As a further description of the above technical solution: the material of the shell, the first outer conductor, the second outer conductor, the third outer conductor, the first inner conductor, the second inner conductor, the third inner conductor and the fourth inner conductor is oxygen-free copper or non-magnetic beryllium copper, and the magnetic field strength is <10mGs.

[0022] Also included is a method for installing a clustered fast-insert attenuator, comprising:

[0023] S1. The second inner conductor and the third inner conductor are respectively mounted on the first fixing frame and the second fixing frame of the positioning mechanism, and solder paste is applied to both ends of the attenuation chip, and the two ends of the attenuation chip are coaxially fixed and electrically connected by blow soldering;

[0024] S2. The third outer conductor is disposed between the first fixing frame and the second fixing frame, and the third outer conductor is located outside the attenuation chip for limited fit, and the attenuation chip and the third outer conductor are welded;

[0025] S3. Place the positioning mechanism, attenuation chip and the third outer conductor on the inner side of the second connector, match the first connector with the second connector, make the first inner conductor and the second inner conductor coaxially movable electrically connected, and the third inner conductor and the fourth inner conductor coaxially movable electrically connected, to form an attenuator unit.

[0026] As a further description of the above technical solution: an elastic component is installed on one side of a plurality of attenuator units, and is placed in a volume cavity formed by assembling a shell and a cover plate to obtain a cluster attenuator.

[0027] It also includes a microwave line, one end of which is provided with an attenuator unit as described in any one of the above technical solutions.

[0028] It also includes a quantum computer, which is suitable for the attenuator unit and microwave circuit described in any one of the above technical solutions.

[0029] The above technical solution has the following advantages or beneficial effects:

[0030] 1. Connect two coaxial inner conductors on both sides of the attenuation chip. When the attenuator unit is connected, limit the axial and radial positions of the attenuation chip to prevent relative rotation between the first connector and the second connector, and between the attenuator unit and the connector during mating, or movement caused by tolerance, so that stress is transmitted to the attenuation chip and damage is caused.

[0031] 2. The first insulator and the second insulator are rotationally limited by cooperating with the positioning mechanism and the limiting part with the first insulator and the second insulator to ensure the coaxiality of the attenuation chip installation position and prevent rotation during the plugging process with the connector, thereby ensuring that the inner conductor and the attenuation chip are reliably connected after repeated disassembly and assembly of the attenuator unit, ensuring normal transmission of microwave signals in the attenuator unit, and further protecting the attenuation chip.

[0032] 3. The inner conductors welded on both sides of the attenuation chip are electrically connected to the inner conductors in the connector. This ensures that the attenuation chip is not affected by thermal expansion or contraction in the low temperature of the quantum computer (<10mk (-273.15°C) and ultra-vacuum state (5E^-6mbar~1E^-7mbar), thus avoiding the stress being transmitted to the attenuation chip and causing damage to the attenuation chip.

[0033] 4. Assemble the attenuator unit through the positioning mechanism, ensure that the inner conductor welded on the attenuation chip has a high coaxiality with the first inner conductor and the fourth inner conductor during the installation process, and use the positioning mechanism to assist the blow welding of the attenuation chip and the inner conductor to improve the assembly accuracy of the attenuation chip and facilitate installation. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 Schematic diagram of the matching structure of the attenuator unit and the connector (right side) in the present invention Figure 1 ;

[0035] Figure 2 Schematic diagram of the matching structure of the attenuator unit and the connector (right side) in the present invention Figure 2 ;

[0036] Figure 3 is a cross-sectional view of the attenuator unit of the present invention;

[0037] Figure 4 It is a three-dimensional diagram of the positioning mechanism in the present invention;

[0038] Figure 5 It is a schematic diagram of placing the attenuation chip on the first fixing frame in the present invention;

[0039] Figure 6 A schematic diagram of the welding process in the present invention;

[0040] Figure 7 It is a schematic diagram of the welding process of the third outer conductor and the attenuation chip in the present invention;

[0041] Figure 8 This is a flow chart of the installation method of the attenuator unit in the present invention.

[0042] Legend:

[0043] 1. Shell; 2. Cover; 3. Elastic component; 4. First connector; 41. First outer conductor; 42. First insulator; 43. First inner conductor; 44. Second inner conductor; 5. Second connector; 51. Second outer conductor; 52. Second insulator; 53. Third inner conductor; 54. Limiting portion; 55. Fourth inner conductor; 6. Positioning mechanism; 61. First fixing frame; 62. Second fixing frame; 63. Guide rail; 64. Notch; 65. Through hole; 7. Attenuation chip; 8. Third outer conductor; 9. Connector. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0046] Reference Figure 1-Figure 7 , an embodiment provided by the present invention:

[0047] An attenuator unit comprises: an attenuation chip 7; one end of the attenuation chip 7 is fixedly electrically connected to a second inner conductor 44, the other end of the second inner conductor 44 is arranged axially and away from the attenuation chip, and the other end is movably electrically connected to an axially arranged first inner conductor 43; the other end of the attenuation chip is fixedly electrically connected to a third inner conductor 53, the other end of the third inner conductor 53 is arranged axially and away from the attenuation chip 7, and the other end is movably electrically connected to an axially arranged fourth inner conductor 55; the stress generated when the first inner conductor 43 or the fourth inner conductor 55 moves relative to the attenuation chip 7 is prevented from being transmitted to the attenuation chip 7.

[0048] During the research, the applicant found that the attenuator unit is used together with the connector. The mechanical interface of the attenuator unit must be consistent with the mechanical interface of the connector to achieve mechanical intermatching. There are two connection methods for the inner conductor and the attenuation chip: spring elastic connection and welding. The spring elastic connection method is simple to install, but the spring elasticity will fail at a temperature of 10mk, resulting in poor contact between the inner conductor and the attenuation chip, and in severe cases, the microwave signal of the entire link will be blocked; the welding connection is reliable, but because the size of the attenuation chip and the inner conductor is less than 1mm, and the size and position have a relatively large influence on the characteristic impedance of the attenuator unit, the welding process is difficult to control and the yield rate is extremely low. At the same time, according to the basic principles of passive devices, characteristic impedance mismatch can cause microwave signal deterioration and inaccurate data.

[0049] In addition, the dilution refrigerator provides a low-temperature vacuum working environment for the superconducting quantum computer chip, and it will also generate mechanical vibrations due to the operation of the equipment itself. It takes 5 days for the dilution refrigerator to increase or decrease the temperature once. Due to the particularity of the superconducting quantum computer itself, troubleshooting is difficult. If the superconducting quantum computer cannot work properly due to poor contact of one of the attenuator units at a low temperature of <10mk, it is impossible to troubleshoot the problem and replace the attenuator unit at any time like other conventional equipment. Therefore, repeated disassembly and assembly testing are required during the installation and debugging process. At the same time, during the disassembly and assembly process, the connector will rotate with the matching cable, causing the conductor inside the attenuator unit to rotate together with the conductor inside the connector, resulting in the risk of the inner conductor falling off and damage to the attenuation chip.

[0050] Two sections of coaxially arranged inner conductors are respectively connected on both sides of the attenuation chip 7. When the attenuator unit is connected, the axial and radial positions of the attenuation chip 7 are limited to prevent the attenuation chip between the first connector and the second connector from moving relative to the first inner conductor and the fourth inner conductor during the mating of the attenuator unit with the connector, or movement caused by tolerance, so that stress is transmitted to the attenuation chip and damage is caused.

[0051] The relative motions that occur include radial relative rotations between the first inner conductor and the second inner conductor, axial relative movement, and swings that occur at one end of the first inner conductor close to the second inner conductor due to tolerance fitting. The first inner conductor and the second inner conductor are electrically connected flexibly to avoid stress transmission to the attenuation chip 7.

[0052] Reference Figure 3 The attenuation chip 7 is installed between the first connector 4 and the second connector 5. The first connector 4 is provided with a first outer conductor 41 and a first insulator 42 in sequence from the outside to the inside. The first insulator 42 is provided with a first inner conductor 43 coaxial with the second inner conductor 44 on the inner side.

[0053] The second connector 5 is provided with a second outer conductor 51 and a second insulator 52 in sequence from the outside to the inside, and a fourth inner conductor 55 coaxial with the third inner conductor 53 is provided on the inner side of the second insulator 52. The second inner conductor 44 and the third inner conductor 53 are fixedly electrically connected to the attenuation chip 7; the fixed electrical connection includes welding, bonding, and hot-melt connection. The present application adopts welding, preferably blow welding.

[0054] The first inner conductor 43 and the second inner conductor 44 are in movable electrical connection, and the third inner conductor 53 and the fourth inner conductor 55 are in movable electrical connection. The movable electrical connection includes abutting, plugging or setting a conductive medium for electrical connection.

[0055] When a conductive medium is used for connection, there is a gap between the first inner conductor 43 and the second inner conductor 44 for placing the conductive medium, which may be an elastic conductive sheet, a conductive ring or a solid colloid doped with a conductive material.

[0056] When using plug-in, a circular hole is opened on one end face of the first inner conductor 43 or the fourth inner conductor 55 close to the attenuation chip 7 so that the second inner conductor 44 is inserted into the inner side of the first inner conductor 43 and the third inner conductor 53 is inserted into the inner side of the fourth inner conductor 55 .

[0057] Reference Figure 4-Figure 5 The attenuator unit also includes a positioning mechanism 6 for positioning the attenuation chip 7. The positioning mechanism 6 includes a first fixing frame 61 and a second fixing frame 62. A guide rail 63 is arranged between the first fixing frame 61 and the second fixing frame 62. The guide rail passes through the first fixing frame 61 and the second fixing frame 62. The second inner conductor 44 and the third inner conductor 53 are plugged in using the positioning mechanism.

[0058] In this embodiment, the coaxiality between the first fixing frame 61 and the second fixing frame 62 is limited by the guide rail 63 to ensure the installation position accuracy of the attenuation chip 7 .

[0059] A slot 64 is provided on one side of the first fixing frame 61 and the second fixing frame 62 to limit the attenuation chip in the radial direction, and a through hole 65 is provided at the end surface of one side of the slot 64. The second inner conductor 44 is placed on the first fixing frame 61, and the third inner conductor 53 is placed on the second fixing frame 62. The second inner conductor 44 and the third inner conductor 53 limit the attenuation chip 7 in the axial direction, so that the attenuation chip 7 is welded at the slot 64. The second inner conductor 44 and the third inner conductor 53 limit the installation position of the attenuation chip on the positioning mechanism, and limit the coaxiality of the attenuation chip.

[0060] The third inner conductor 53 and the fourth inner conductor 55 are connected by quick plugging through the second fixing frame 62, and the second inner conductor 44 and the third inner conductor 53 are connected to the attenuation chip by welding; to ensure that the product is not affected by thermal expansion and contraction at low temperature <10mk (-273.15℃) and ultra-vacuum state (5E^-6mbar~1E^-7mbar), the positioning mechanism 6 ensures that the connection between the inner conductor and the attenuation chip is reliable after repeated disassembly and assembly of the attenuator unit, ensuring normal transmission of microwave signals in the attenuator unit.

[0061] A limiting portion 54 extending radially inward is provided on the inner side of the first outer conductor 41 and the second outer conductor 51. The limiting portion 54 is provided with at least one or more sliding grooves and is adapted to the outer diameter shape of the first insulator 42 or the second insulator 52. The first insulator 42 abuts against the first fixing frame 61, and the second insulator 52 abuts against the second fixing frame 62.

[0062] In this embodiment, the limiting portion cooperates with the first insulator and the second insulator to limit the rotation of the first insulator and the second insulator, thereby preventing the first connector or the second connector from rotating during the process of plugging with the connector, thereby preventing the attenuation chip from being damaged.

[0063] The limiting portion 54 is a barb or a platform extending radially and inwardly to limit the first insulator or the second insulator in the axial direction.

[0064] A limiting portion is arranged inside the first outer conductor and the second outer conductor, and two sliding grooves are punched on the limiting portion. The limiting portion is used to fix the axial moving position of the first insulator or the second insulator, and the sliding groove of the limiting portion is used to prevent the first insulator or the second insulator from rotating radially.

[0065] A third outer conductor is arranged outside the attenuation chip, the outer diameter of the third outer conductor matches the inner diameter of the second outer conductor, and the third outer conductor is located between the first fixing frame and the second fixing frame to limit the attenuation chip.

[0066] In this embodiment, barbs, knurling or limiting steps are provided on the curved surfaces of the first inner conductor and the fourth inner conductor to ensure that the first inner conductor and the fourth inner conductor are assembled at the insulator position of the connector mechanical interface, to ensure that the position size of the connector mechanical interface meets the requirements, and to ensure that the first inner conductor and the fourth inner conductor will not fall off; the first inner conductor and the second inner conductor are connected by a quick-insert method to prevent the second inner conductor from rotating when the first inner conductor rotates, thereby causing a break in the connection between the second inner conductor and the attenuation chip.

[0067] The shell 1, the first outer conductor 41, the second outer conductor 51, the third outer conductor 8, the first inner conductor 43, the second inner conductor 44, the third inner conductor 53 and the fourth inner conductor 55 are made of oxygen-free copper or non-magnetic beryllium copper, and the magnetic field strength is less than 10mGs. This is to reduce the magnetocaloric effect caused by the high-density bundle fast-insert attenuator unit, and increase the heat dissipation effect, electrical isolation, and contact reliability in a low-temperature environment.

[0068] The heat introduced from the outside of the cable is transferred to the housing through the first outer conductor and the second outer conductor, and then the heat is conducted to the dilution refrigerator refrigeration system through the housing to achieve rapid heat dissipation. In order to improve the heat dissipation effect, the surfaces of the metal parts (such as the housing 1, the first outer conductor 41, the second outer conductor 51, the third outer conductor 8, the first inner conductor 43, the second inner conductor 44, the third inner conductor 53 and the fourth inner conductor 55) in this application are mirror polished and gold-plated; at the same time, the attenuator unit and the connector should be in close contact, and the first outer conductor and the second outer conductor should be in close contact with the housing, so as to increase the contact area and improve the heat dissipation effect.

[0069] A cluster attenuator unit comprises: a shell 1, on which a plurality of attenuator units are arranged; a cover plate 2 is arranged on one side of the shell 1, and a volume cavity is formed by the shell 1 and the cover plate 2 being installed and connected, and an elastic component 3 is placed inside the volume cavity, and the elastic component 3 is placed outside a first connector 4 or a second connector 5.

[0070] In this embodiment, a volume cavity is formed by installing and connecting the shell 1 and the cover plate 2 for placing the attenuator unit, wherein one side of the shell 1 extends outward, and a plurality of through holes are opened on one end face of the extension, so that the connector can be inserted into the through holes and plugged with the internal attenuator unit, and the cover plate 2 directly opens a plurality of through holes corresponding to the positions of the through holes on the shell, which are used to place the other port of the attenuator unit, and an elastic component 3 is placed on the inside of the volume cavity, and the elastic component 3 is sleeved on the outside of the first connector 4 or the second connector 5, and the other end of the elastic component 3 contacts the shell or the cover plate to limit the first connector 4 and the second connector 5 of the attenuator unit, and the elastic component is selected from springs, spring sheets, rubber gaskets or other materials with rebound function.

[0071] In order to meet the electrical performance of the attenuator unit, the size tolerance of the inner and outer conductors of the attenuator unit must be controlled within [-0.01, 0.01] mm, and the coaxiality of the inner and outer conductors must be controlled within [-0.01, 0.01] mm; the axial depth tolerance of each through hole in the attenuator unit housing and cover must be controlled within [-0.01, 0.01] mm, and the hole spacing tolerance must be controlled within [-0.01, 0.01] mm. It is difficult to ensure the consistency of part dimensions by relying on equipment. As long as one dimension deviates, the attenuator unit and the connector will not be able to mate properly, resulting in structural failure. This embodiment can effectively absorb the processing tolerance of parts and the overall assembly tolerance through the elastic component. The axial tolerance of each through hole of the attenuator unit can be relaxed from the original [-0.01, 0.01] mm to [-0.20, 0.20] mm, and the hole spacing tolerance is relaxed from the original [-0.01, 0.01] mm to [-0.20, 0.20] mm, reducing the processing difficulty and cost. The elastic component allows a single connector to move freely up, down, left and right, ensuring that the attenuator unit is automatically corrected and accurately connected when connected to the connector during the overall assembly process, and effectively avoiding the signal crosstalk problem of a single attenuator unit. The integrated module can effectively reduce the installation space, and more attenuator units can be installed in the same space, and installation is also much simpler.

[0072] Example 2

[0073] Reference Figure 8 , a method for installing a cluster attenuator unit, comprising:

[0074] S1. The second inner conductor and the third inner conductor are respectively mounted on the first fixing frame and the second fixing frame of the positioning mechanism, and solder paste is applied to both ends of the attenuation chip, and the two ends of the attenuation chip are coaxially fixed and electrically connected by blow soldering;

[0075] S2. The third outer conductor is disposed between the first fixing frame and the second fixing frame, and the third outer conductor is located outside the attenuation chip for limiting fit, and the attenuation chip and the third outer conductor are welded;

[0076] S3. Place the positioning mechanism, attenuation chip and the third outer conductor on the inner side of the second connector, match the first connector with the second connector, make the first inner conductor and the second inner conductor coaxially movable electrically connected, and the third inner conductor and the fourth inner conductor coaxially movable electrically connected, to form an attenuator unit.

[0077] In this embodiment, the second inner conductor and the third inner conductor are placed on the first fixing frame and the second fixing frame respectively, and then the attenuation chip is placed on the first fixing frame, and the first fixing frame and the second fixing frame are closed along the guide rail so that the attenuation chip is connected between the second inner conductor and the third inner conductor;

[0078] Reference Figure 6-Figure 7 , apply solder paste to both sides of the attenuation chip, use blow welding to fix the second inner conductor and the third inner conductor; connect the attenuation chip and the third outer conductor by resistance welding, place the positioning mechanism between the first connector and the second connector, and plug them in, insert the first inner conductor and the fourth inner conductor into the first fixing frame and the second fixing frame, and make the first insulator and the second insulator abut against the first fixing frame and the second fixing frame to complete the installation.

[0079] The substrate material of the attenuation chip is aluminum oxide, and the thin film resistor material is tantalum nitride;

[0080] In this embodiment, the outer dimensions of the attenuator unit are relatively small, which results in the internal attenuation chip and the inner conductor being smaller in size. At the same time, the attenuator unit is a coaxial passive device, and the coaxiality between the inner conductor and the outer conductor has a great influence on the electrical performance of the attenuator unit. The coaxiality should be controlled within [-0.01, 0.01] mm. It is particularly important to control the assembly dimensions of the attenuation chip and the inner and outer conductors.

[0081] The second inner conductor is welded together with the attenuation chip. The second inner conductor is first mounted on the first fixing frame. Then the attenuation chip is placed on the first fixing frame. Solder paste is applied at the welding position. The third inner conductor is placed on the second fixing frame. The second fixing frame is closed toward the first fixing frame. The second inner conductor and the third inner conductor cooperate with the attenuation chip. Hot air is blown downward from the top of the positioning mechanism by hot air welding (non-contact welding). The second inner conductor, the third inner conductor and the attenuation chip 7 are welded together.

[0082] Since the attenuation chip and the second inner conductor are relatively small in size and the structural position is relatively demanding, high-frequency induction welding and electric soldering iron cannot be used. After welding, the first fixing frame and the second fixing frame are separated to take out the attenuation chip.

[0083] The attenuation chip is welded to the third outer conductor. The second inner conductor welded to the attenuation chip is relatively close to the third outer conductor. If hot air welding and high-frequency induction welding are used to weld the third outer conductor, the tin on the second inner conductor will be melted, causing the position of the second inner conductor to deviate. In order to solve this problem, the process is changed to resistance welding when welding the third outer conductor. The welding method of the other end of the attenuation chip and the third inner conductor is the same.

[0084] After completion, place the attenuation chip 7 and the third outer conductor 8 between the first fixing frame 61 and the second fixing frame 62, insert the second inner conductor 44 into the first fixing frame 61, and insert the third inner conductor 53 into the second fixing frame 62, and move the third outer conductor 8 and the attenuation chip 7 again by the guide rail to limit the position.

[0085] The first fixing frame 61 and the second fixing frame 62 of the positioning mechanism are integrally formed by a machining center, which effectively ensures the dimensional tolerance of the through hole for placing the second inner conductor and the third inner conductor and the attenuation chip placement position, and the dimensional tolerance can be controlled within [-0.002, 0.002] mm; the guide rail can ensure the accuracy of the moving position of the first fixing frame and the second fixing frame during use, and the movement error is controlled within [-0.002, 0.002] mm. During use, the first fixing frame and the second fixing frame are placed flat on the work platform to ensure the position accuracy of the assembly.

[0086] The positioning mechanism, attenuation chip and the third outer conductor are placed on the inner side of the second connector, the first connector 4 is matched with the second connector 5, and they are connected and fixed by welding. The first inner conductor 43 and the second inner conductor 44 are coaxially movable electrically connected, the third inner conductor 53 and the fourth inner conductor 55 are coaxially movable electrically connected, and the first insulator is abutted against the first fixing frame 61, and the second insulator is abutted against the second fixing frame 62, to form an attenuator unit.

[0087] An elastic component is installed on one side of a plurality of attenuator units, and the attenuator units are placed in a volume cavity formed by assembling a shell and a cover plate, so as to obtain a clustered attenuator unit.

[0088] An elastic component 3 is sleeved on one end of the attenuator unit, and several attenuator units are placed on the inner side of the shell 1. The shell 1 is connected to the cover 2 to encapsulate the attenuator unit. One side of the elastic component contacts the shell 1 or the cover 2, and the other end contacts the attenuator unit.

[0089] Example 3

[0090] The present invention also provides a microwave circuit, which includes the attenuator unit of each of the above embodiments. The specific structure of the attenuator unit refers to the above embodiments. Since the microwave circuit adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0091] Example 4

[0092] The present invention further proposes a quantum computer, which includes an attenuator unit provided in the above embodiment. The specific structure of the attenuator unit refers to the above embodiment. Since the quantum computer adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0093] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An attenuator unit, characterized in that: include: Attenuation chip; One end of the attenuation chip is fixedly electrically connected to one end of the second inner conductor, the other end of the second inner conductor is arranged axially and facing away from the attenuation chip, and the other end of the second inner conductor is movably electrically connected to an axially arranged first inner conductor; The other end of the attenuation chip is fixedly electrically connected to one end of the third inner conductor, the other end of the third inner conductor is arranged axially and facing away from the attenuation chip, and the other end of the third inner conductor is movably electrically connected to an axially arranged fourth inner conductor; to prevent the stress generated when the first inner conductor or the fourth inner conductor moves relative to the attenuation chip from being transmitted to the attenuation chip; The attenuation chip is installed between the first connecting body and the second connecting body.

2. The attenuator unit according to claim 1, characterized in that: The first connector is provided with a first outer conductor and a first insulator in sequence from the outside to the inside, and a first inner conductor coaxial with the second inner conductor is provided on the inner side of the first insulator; The second connector is provided with a second outer conductor and a second insulator in sequence from the outside to the inside, and a fourth inner conductor coaxial with the third inner conductor is provided inside the second insulator.

3. The attenuator unit according to claim 2, characterized in that: The second inner conductor and the third inner conductor are fixedly electrically connected to the attenuation chip, and the fixed electrical connection includes welding, bonding or hot-melt connection; The first inner conductor and the second inner conductor are in active electrical connection, and the third inner conductor and the fourth inner conductor are in active electrical connection. The active electrical connection includes abutting, plugging or setting a conductive medium for electrical connection.

4. The attenuator unit according to claim 2, characterized in that: The attenuator unit also includes a positioning mechanism for positioning the attenuation chip. The positioning mechanism includes a first fixing frame and a second fixing frame. A guide rail is arranged between the first fixing frame and the second fixing frame. The guide rail passes through the first fixing frame and the second fixing frame. The second inner conductor and the third inner conductor are plugged in using the positioning mechanism.

5. The attenuator unit according to claim 4, characterized in that: A third outer conductor is disposed outside the attenuation chip, the outer diameter of the third outer conductor is matched with the inner diameter of the second outer conductor, and the third outer conductor is located between the first fixing frame and the second fixing frame to limit the attenuation chip.

6. The attenuator unit according to claim 3, characterized in that: The inner sides of the first outer conductor and the second outer conductor are provided with limiting portions extending radially inwards, and the limiting portions are provided with at least one or more sliding grooves, and are adapted to the outer diameter shape of the first insulator or the second insulator.

7. The attenuator unit according to claim 4, characterized in that: The first insulator abuts against the first fixing frame, and the second insulator abuts against the second fixing frame.

8. A cluster attenuator, characterized in that: The cluster attenuator is applicable to the attenuator unit described in any one of claims 1 to 7, comprising: A housing, wherein a plurality of attenuator units are arranged on the housing; A cover plate is provided on one side of the shell, and a volume cavity is formed by the shell and the cover plate being installed and connected. An elastic component and the attenuator unit are placed inside the volume cavity, and the elastic component is placed outside the first connector or the second connector.

9. The cluster attenuator according to claim 8, characterized in that: The shell, the first outer conductor, the second outer conductor, the third outer conductor, the first inner conductor, the second inner conductor, the third inner conductor and the fourth inner conductor are made of oxygen-free copper or non-magnetic beryllium copper, and the magnetic field strength is less than 10mGs.

10. A method for installing an attenuator unit, characterized in that: include: S1. The second inner conductor and the third inner conductor are respectively mounted on the first fixing frame and the second fixing frame of the positioning mechanism, and solder paste is applied to both ends of the attenuation chip, and the second inner conductor and the third inner conductor are respectively coaxially fixedly electrically connected to both ends of the attenuation chip by blow soldering; S2. The third outer conductor is disposed between the first fixing frame and the second fixing frame, and the third outer conductor is located outside the attenuation chip for limited fit, and the attenuation chip and the third outer conductor are welded; S3. Place the positioning mechanism, attenuation chip and the third outer conductor on the inner side of the second connector, match the first connector with the second connector, make the first inner conductor and the second inner conductor coaxially movable electrically connected, and the third inner conductor and the fourth inner conductor coaxially movable electrically connected, to form an attenuator unit.

11. A method for installing a cluster attenuator, characterized in that: A cluster attenuator is obtained by installing elastic components on one side of a plurality of attenuator units as described in any one of claims 1 to 7 and placing them in a volume cavity formed by assembling a shell and a cover plate.

12. A microwave line, characterized in that: One end of the microwave line is provided with an attenuator unit according to any one of claims 1 to 7 or a cluster attenuator according to any one of claims 8 to 9.

13. A quantum computer, characterized in that: The quantum computer comprises the attenuator unit according to any one of claims 1 to 7, the cluster attenuator according to any one of claims 8-9, or the microwave line according to claim 12.

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