Camera module and manufacturing method thereof

Abstract

The invention discloses a camera module and a manufacturing method thereof, the camera module comprises a circuit board, a substrate, an image sensor, an optical filter and a conduction structure, and a mounting hole is formed through the circuit board; the substrate is arranged at one end of the mounting hole and comprises a supporting part extending into the mounting hole; the image sensor is accommodated in the mounting hole and is arranged on the supporting part; a connecting pad is arranged on the surface, deviating from the supporting part, of the image sensor; the optical filter is arranged on the image sensor, an opening is formed in the position, corresponding to the connecting pad, of the optical filter, one end of the conduction structure extends into the opening and is electrically connected to the connecting pad, and the other end of the conduction structure is electrically connected to the circuit layer of the circuit board. According to the camera module provided by the invention, the image sensor, the optical filter and the circuit board are integrally packaged, so that the overall thickness of the camera module can be reduced, and lightening and thinning of the camera module are facilitated.

Description

Technical Field

[0001] The present invention relates to the technical field of camera modules, and in particular to a camera module and a manufacturing method thereof. Background Art

[0002] As electronic products develop towards multifunctionality, the density of electronic components on printed circuit boards continues to increase, and printed circuit boards also need to develop towards lightness and thinness.

[0003] At present, the camera modules in electronic products are relatively thick and large in size, which is not conducive to the thinning and lightening of electronic products. Summary of the invention

[0004] In view of this, in order to overcome at least one of the above-mentioned defects, it is necessary to provide a camera module and a manufacturing method thereof.

[0005] An embodiment of the present application provides a camera module, which includes: a circuit board, a substrate, an image sensor, a filter and a conductive structure, the circuit board includes a first surface and a second surface arranged opposite to each other, and a mounting hole is formed through the first surface and the second surface; the substrate is arranged at one end of the mounting hole close to the first surface, and a part of the substrate extends into the mounting block to form a supporting portion; the image sensor is accommodated in the mounting hole and arranged on the supporting portion, and a connecting pad is provided on the surface of the image sensor away from the supporting portion; the filter is arranged on the image sensor, and an opening is formed in the filter corresponding to the connecting pad, and the connecting pad is exposed from the opening; one end of the conductive structure extends into the opening and is electrically connected to the connecting pad, and the other end is electrically connected to the circuit layer of the circuit board.

[0006] In some possible embodiments, a gap is formed between the support portion and the inner wall of the mounting hole, the gap extends to between the image sensor and the inner wall of the mounting hole, and a packaging layer is provided in the gap.

[0007] In some possible embodiments, an end surface of the packaging layer facing away from the substrate exceeds a surface of the image sensor facing away from the support portion, and a periphery of the filter is disposed on the end surface.

[0008] In some possible embodiments, the camera module further includes a bracket disposed at one end of the mounting hole close to the second surface and a lens assembly disposed on the bracket.

[0009] The support comprises:

[0010] a first portion received in the mounting hole, the first portion extending at least into the opening; and

[0011] A second portion extends out of the second surface, the second portion has a lens mounting hole, the lens assembly is disposed in the lens mounting hole, the filter is exposed from the lens mounting hole, and the photosensitive area of ​​the image sensor corresponds to the lens mounting hole, and the incident light can be incident on the photosensitive area of ​​the image sensor via the lens assembly and the filter in sequence.

[0012] In some possible embodiments, the second portion further includes a connecting portion extending to the second surface.

[0013] In some possible embodiments, the image sensor is connected to the support portion via a thermal conductive adhesive layer.

[0014] In some possible embodiments, the conductive structure includes a metal conductive line.

[0015] The present application also provides a method for manufacturing a camera module, the method comprising:

[0016] Provide a circuit board, the circuit board comprising a first surface and a second surface arranged opposite to each other, and a mounting hole is formed through the first surface and the second surface;

[0017] A substrate is disposed at one end of the mounting hole close to the first surface, and a portion of the substrate is extended into the mounting hole to form a supporting portion;

[0018] An image sensor is arranged on the support portion, and the image sensor is accommodated in the mounting hole, and a connection pad is arranged on a surface of the image sensor away from the support portion;

[0019] Disposing a filter on the image sensor and exposing the connection pad from an opening on the filter; and

[0020] The connection pad is electrically connected to the circuit layer of the circuit board using a conductive structure, thereby obtaining the camera module.

[0021] In some possible embodiments, after the step of disposing the image sensor in the mounting hole, the manufacturing method further includes:

[0022] Filling a packaging material in a gap between the support portion and an inner wall of the mounting hole and a gap between the image sensor and the inner wall of the mounting hole to form a packaging layer;

[0023] The end surface of the packaging layer facing away from the substrate exceeds the surface of the image sensor facing away from the supporting portion, and the periphery of the filter is arranged on the end surface.

[0024] In some possible embodiments, after the step of electrically connecting the connection pad to the circuit layer of the circuit board using a conductive structure, the manufacturing method further includes:

[0025] A bracket is disposed at one end of the mounting hole close to the second surface, the bracket comprising a first portion accommodated in the mounting hole and a second portion extending out of the second surface, the first portion at least extending into the opening, the second portion having a lens mounting hole, the filter being exposed from the lens mounting hole, and a photosensitive area of ​​the image sensor corresponding to the lens mounting hole; and

[0026] The lens assembly is installed in the lens installation hole, and the incident light can be emitted to the photosensitive area of ​​the image sensor through the lens assembly and the filter in sequence.

[0027] Compared with the prior art, the camera module provided in the embodiment of the present application, by installing the image sensor in the mounting hole of the circuit board and pre-opening a window to form an opening at the connection pad of the image sensor corresponding to the filter, can realize the electrical lead-out of the connection pad through the filter by a conductive structure (such as a metal wire), thereby achieving the purpose of integrated packaging of the image sensor, the filter and the circuit board. Moreover, the filter is directly installed in the mounting hole without being installed on a bracket, so the spacing between the image sensor and the filter can be flexibly adjusted, and the distance between the filter and the image sensor can be effectively reduced, thereby reducing the overall thickness of the camera module; in addition, the thickness of the camera module can be further reduced by embedding the bracket part in the mounting hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic diagram of the structure of a camera module provided in one embodiment of the present application.

[0029] Figure 2 A schematic diagram of the manufacturing process of a circuit substrate provided in one embodiment of the present application.

[0030] Figure 3 Schematic diagram of the structure of a circuit substrate according to an embodiment of the present application.

[0031] Figure 4 For Figure 3 The schematic diagram of the circuit substrate shown is a schematic diagram of adding layers on two surfaces.

[0032] Figure 5 For the general Figure 4 Schematic diagram of the circuit substrate and the build-up layer part after lamination.

[0033] Figure 6 For Figure 5 The schematic diagram of forming a first outer circuit layer and a second outer circuit layer on the circuit substrate after build-up is shown.

[0034] Figure 7 For Figure 6 The schematic diagram of forming a mounting hole and setting a substrate in the first area is shown.

[0035] Figure 8 For Figure 7 Schematic diagram of setting an image sensor in the mounting hole shown.

[0036] Fig. 9 For Figure 8 Schematic diagram of setting a packaging layer in the gap shown.

[0037] Fig.10 For Fig. 9 Schematic diagram of the surface mounted filter with encapsulation layer shown.

[0038] Fig.11 For Fig.10 A schematic diagram of a conductive structure provided between a connection pad and a circuit board is shown.

[0039] Fig.12 For Fig.11 Schematic diagram of setting a bracket in the mounting hole shown.

[0040] Main component symbols

[0041] Camera module 100

[0042] Circuit Board 1

[0043] Base 11

[0044] The first inner circuit layer 12

[0045] The second inner circuit layer 13

[0046] The first insulating layer 14

[0047] The second insulating layer 15

[0048] The first outer circuit layer 16

[0049] The second outer circuit layer 17

[0050] The first reinforcement layer 181

[0051] The second reinforcement layer 182

[0052] Solder mask 19

[0053] First surface 101

[0054] Second surface 102

[0055] Mounting hole 103

[0056] Slot 104,105

[0057] Gap 106

[0058] Substrate 2

[0059] Supporting part 21

[0060] Connecting part 22

[0061] Conductive adhesive layer 23

[0062] Image sensor 3

[0063] The third surface 31

[0064] Fourth surface 32

[0065] Connection pad 33

[0066] Thermal conductive adhesive layer 34

[0067] Filter 4

[0068] Opening 41

[0069] Conductive structure 5

[0070] Encapsulation layer 6

[0071] End face 61

[0072] Bracket 7

[0073] Part 171

[0074] Part 272

[0075] Extension 73

[0076] Lens mounting hole 74

[0077] Lens assembly 8

[0078] Circuit board 10

[0079] First metal layer 20

[0080] The second metal layer 30

[0081] Intermediate circuit board 40

[0082] Peelable adhesive 50

[0083] First Area A

[0084] Second Area B

[0085] Connection area C

[0086] Extension direction a

[0087] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0088] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0089] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0090] It should be noted that, in the present application, if used, the terms "first", "second", etc. are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, "multiple" means two or more. Positional terms such as "upper", "lower", "left", and "right" are defined relative to the orientation of the components schematically placed in the accompanying drawings. It should be understood that these directional terms are relative concepts. They are used for description and clarification relative to, and they may change accordingly according to changes in the orientation of the components placed in the accompanying drawings. The term "direction" includes unidirectional or bidirectional along the straight line where the direction is located, and cannot be simply understood as unidirectional along the straight line where the direction is located.

[0091] In this application, if used, unless otherwise expressly specified and limited, the term "connection" should be understood in a broad sense, for example, "connection" can be fixed connection, detachable connection, or integrated; can be directly connected or indirectly connected through an intermediate medium. The term "and / or" used herein includes any and all combinations of one or more of the relevant listed items.

[0092] It will be understood that when a layer, region or component is referred to as being “on” another layer, region or component, it can be directly or indirectly on the other layer, region or component. That is, for example, intervening layers, regions or components may be present.

[0093] See also Figure 1, an embodiment of the present application provides a camera module 100, which includes: a circuit board 1, a substrate 2, an image sensor 3, a filter 4 and a conductive structure 5. The circuit board 1 includes a first surface 101 and a second surface 102 that are arranged opposite to each other, and a mounting hole 103 is formed through the first surface 101 and the second surface 102. The substrate 2 is arranged at one end of the mounting hole 103 close to the first surface 101, and the substrate 2 includes a support portion 21 extending into the mounting hole 103. The image sensor 3 is accommodated in the mounting hole 103 and is arranged on the support portion 21. The image sensor 3 includes a third surface 31 and a fourth surface 32 that are arranged opposite to each other, the third surface 31 is connected to the support portion 21, and a connection pad 33 is provided on the fourth surface 32. The filter 4 is disposed on the fourth surface 32, and an opening 41 is formed on the filter 4 corresponding to the connection pad 33, and the connection pad 33 is exposed by the opening 41; one end of the conductive structure 5 extends into the opening 41 and is electrically connected to the connection pad 33, and the other end is electrically connected to the circuit layer of the circuit board 1. Specifically, the conductive structure 5 can be a metal wire, such as a gold wire.

[0094] Please refer again Figure 1 The circuit board 1 may be a multilayer board. Specifically, the circuit board 1 includes a base layer 11, a first inner circuit layer 12 and a second inner circuit layer 13 located on two opposite surfaces of the base layer 11, a first insulating layer 14 disposed on the surface of the first inner circuit layer 12, a second insulating layer 15 disposed on the surface of the second inner circuit layer 13, a first outer circuit layer 16 disposed on the surface of the first insulating layer 14, and a second outer circuit layer 17 disposed on the surface of the second insulating layer 15. The first inner circuit layer 12, the second inner circuit layer 13, the first outer circuit layer 16, and the second outer circuit layer 17 may be electrically connected to each other in at least two layers. The surface of the first outer circuit layer 16 facing away from the first insulating layer 14 constitutes a first surface 101, and the surface of the second outer circuit layer 17 facing away from the second insulating layer 15 constitutes a second surface 102. One end of the conductive structure 5 away from the connection pad 33 is electrically connected to the second outer circuit layer 17.

[0095] Specifically, along the extension direction a of the circuit board 1, the circuit board 1 has a first area A, a second area B, and a connection area C provided between the first area A and the second area B, and the first area A is electrically connected to the second area B through the connection area C. The circuit board 1 further includes a first reinforcement layer 181 located on the surface of the first inner layer circuit layer 12 away from the base layer 11, and a second reinforcement layer 182 located on the surface of the second inner layer circuit layer 13 away from the base layer 11, and the first reinforcement layer 181 and the second reinforcement layer 182 are both located in the connection area C. In the connection area C, the first surface 101 is recessed toward the second surface 102 to form a groove 104, and the surface of the first reinforcement layer 181 is exposed by the groove 104, and the second surface 102 is recessed toward the first surface 101 to form another groove 105, and the second reinforcement layer 182 is exposed by the groove 105. The provision of the first reinforcement layer 181 and the second reinforcement layer 182 can improve the strength of the connection area C. In addition, the first reinforcement layer 1811 and the second reinforcement layer 182 may also extend into the first region A and the second region B, so that the strength of the connection region C may be further improved.

[0096] In some embodiments, a solder mask 19 may be provided on the surface of the first outer circuit layer 16 and the second outer circuit layer 17 to protect the circuits.

[0097] Please refer again Figure 1 The substrate 2 further includes a connecting portion 22 connected to the outer edge of the supporting portion 21, and the connecting portion 22 is located on the first surface 101. Specifically, the connecting portion 22 is electrically connected to the first outer circuit layer 16 through a conductive adhesive layer 23. When the solder mask 19 is provided on the surface of the first outer circuit layer 16, the connecting portion 22 is bonded to the surface of the solder mask 19 through the conductive adhesive layer 23 and is electrically connected to the first outer circuit layer 16.

[0098] Please refer again Figure 1 A gap 106 is formed between the support portion 21 and the side wall of the mounting hole 103, and a packaging layer 6 is provided in the gap 106, and the packaging layer 6 extends between the image sensor 3 and the inner wall of the mounting hole 103. Specifically, the material of the packaging layer 6 can be a filling glue, and by providing the filling glue in the gap 106 and curing it, the image sensor 3 can be fixed in the mounting hole 103, thereby improving the stability of the image sensor 3.

[0099] In some embodiments, the end face 61 of the encapsulation layer 6 facing away from the substrate 2 exceeds the fourth surface 32 of the image sensor 3, and the periphery of the filter 4 is arranged on the end face 61 of the encapsulation layer 6, so that the filter 4 can be installed on the encapsulation layer 6, so that the image sensor 3 and the filter 4 can be arranged at a certain distance, which is convenient for the installation and fixation of the filter 4. It can be understood that the distance between the filter 4 and the image sensor 3 can be controlled by adjusting the height of the encapsulation layer 6 exceeding the fourth surface 32, which is conducive to reducing the overall thickness of the camera module 100.

[0100] The filter 4 is provided with openings 41 penetrating the upper and lower surfaces of the filter 4 in advance. During assembly, the openings 41 are aligned with the connection pads 33 of the image sensor 3 to facilitate electrical extraction of the connection pads 33 .

[0101] The image sensor 3 may be a CMOS image sensor, and specifically, the third surface 31 of the image sensor 3 is connected to the support portion 21 via a thermal conductive adhesive layer 34. The thermal conductive adhesive layer 34 may improve the efficiency of heat removal from the image sensor 3 to reduce the risk of overheating and damage to the embedded image sensor 3.

[0102] Please refer again Figure 1 The camera module 100 further includes a bracket 7 disposed on the side of the filter 4 away from the image sensor 3 and a lens assembly 8 disposed on the bracket 7. The bracket 7 includes: a first portion 71 accommodated in the mounting hole 103 and a second portion 72 extending out of the second surface 102. The first portion 71 at least extends into the opening 41, thereby further improving the stability of the filter 4. The second portion 72 has a lens mounting hole 74, the lens assembly 8 is disposed in the lens mounting hole 74, the filter 4 is exposed from the lens mounting hole 73, and the photosensitive area of ​​the image sensor 3 corresponds to the lens mounting hole 74, and the incident light can be sequentially projected to the photosensitive area of ​​the image sensor 3 via the lens assembly 8 and the filter 4.

[0103] In some embodiments, the first portion 71 also extends into the gap between the filter 4 and the mounting hole 103, thereby further improving the installation stability of the filter 4, and also increasing the contact area between the bracket 7 and the side wall of the mounting hole 103, thereby improving the bonding force between the bracket 7 and the circuit board 1.

[0104] In some embodiments, the second portion 72 further includes an extension portion 73 extending to the second surface 102 of the circuit board 1 . By providing the extension portion 73 , the connection stability between the bracket 7 and the circuit board 1 can be improved.

[0105] See also Figure 2 , and refer to Figure 1,as well as Figures 3 to 12 The present application also provides a method for manufacturing the camera module 100, which comprises the following steps:

[0106] Step S1, see also Figures 3 to 7 , a circuit board 1 is provided, wherein the circuit board 1 includes a first surface 101 and a second surface 102 which are arranged opposite to each other, and a mounting hole 103 is formed through the first surface 101 and the second surface 102 .

[0107] The manufacturing method of the circuit board 1 comprises the following steps:

[0108] Step S11, as Figure 3 As shown, a circuit substrate 10 is provided, the circuit substrate 10 has a first area A, a second area B, and a connection area C electrically connecting the first area A and the second area B. The circuit substrate 10 includes a base layer 11, a first inner circuit layer 12 and a second inner circuit layer 13 located on two opposite surfaces of the base layer 11 and electrically connected, a first reinforcement layer 181 located on the surface of the first inner circuit layer 12, and a second reinforcement layer 182 located on the surface of the second inner circuit layer 13. The first reinforcement layer 181 and the second reinforcement layer 182 are both located in the connection area C.

[0109] In some embodiments, the structures of the first reinforcement layer 181 and the second reinforcement layer 182 are substantially the same, both including a glue layer and a PI layer located on the glue layer, so as to improve the strength of the connection area C.

[0110] Step S12, as Figure 4 and Figure 5 As shown, the first insulating layer 14 and the first metal layer 20 are sequentially pressed on the surface of the first inner circuit layer 12, and the second insulating layer 15 and the second metal layer 30 are sequentially pressed on the surface of the second inner circuit layer 13.

[0111] Step S13, as Figure 6 As shown, the first metal layer 20 and the second metal layer 30 are patterned to form a first outer wiring layer 16 electrically connected to the first inner wiring layer 12, and a second outer wiring layer 17 electrically connected to the second inner wiring layer 13. The surface of the first outer wiring layer 16 facing away from the second outer wiring layer 17 constitutes a first surface 101, and the surface of the second outer wiring layer 17 facing away from the first outer wiring layer 16 constitutes a second surface 102, thereby obtaining an intermediate circuit board 40.

[0112] In some embodiments, a solder mask 19 may be formed on the surface of the first outer circuit layer 16 and the surface of the second outer circuit layer 17, respectively, and surface treatment may be performed to protect the internal circuits.

[0113] Step S14, as Figure 7 As shown, a mounting hole 103 penetrating the first surface 101 and the second surface 102 is formed at the first area A of the intermediate circuit board 40, and the first insulating layer 14 and the first outer circuit layer 16 at the connection area C are removed to form a groove 104, so that the first reinforcement layer 181 is exposed at the groove 104, and the second insulating layer 15 and the second outer circuit layer 17 at the connection area C are removed to form a groove 105, so that the second reinforcement layer 182 is exposed at the groove 105. Specifically, when forming the circuit substrate 10, a strippable adhesive 50 is provided on the surface of the first reinforcement layer 181 and the second reinforcement layer 182 to facilitate the formation of the grooves 104 and 105.

[0114] Step S2, also refer to Figure 7 A substrate 2 is disposed at one end of the mounting hole 103 close to the first surface 101 , and a portion of the substrate 2 extends into the mounting hole 103 to form a supporting portion 21 .

[0115] Step S3, see also Figure 8 The image sensor 3 is disposed on the support portion 21 and accommodated in the mounting hole 103 . A connection pad 33 is disposed on the surface of the image sensor 3 facing away from the support portion 21 .

[0116] The image sensor 3 includes a third surface 31 and a fourth surface 32 that are arranged opposite to each other, the third surface 31 is connected to the support portion 21, and the fourth surface 32 is provided with a connection pad 33. There can be multiple connection pads 33, and the multiple connection pads 33 are located at the periphery of the fourth surface 32 of the image sensor 3, and the area roughly in the middle of the image sensor 3 constitutes a photosensitive area.

[0117] In some embodiments, the image sensor 3 is bonded to the support portion 21 via a thermal conductive adhesive layer 34 .

[0118] In some embodiments, a gap 106 is formed between the support portion 21 and the inner wall of the mounting hole 103, and the gap 106 extends between the image sensor 3 and the mounting hole 103. After the image sensor 3 is mounted on the support portion 21, the manufacturing method further includes: providing a filling glue in the gap 106, and curing it to form a packaging layer 6. By forming the packaging layer 6, the image sensor 3 is packaged in the mounting hole 103, and the installation stability of the image sensor 3 is improved.

[0119] Step S4, see also Fig.10 , a filter 4 is disposed on the first image sensor 3 , and the connection pad 33 is exposed from the opening 41 on the filter 4 .

[0120] Specifically, openings 41 may be opened in advance at corresponding positions of the filter 4 through the upper and lower surfaces of the filter 4 .

[0121] In some embodiments, an end surface 61 of the packaging layer 6 facing away from the substrate 2 extends beyond the fourth surface 32 of the image sensor 3 . When the filter 4 is provided, the periphery of the filter 4 is provided on the end surface 61 of the packaging layer 6 .

[0122] Step S5, refer to Fig.11 The connection pad 33 is electrically connected to the circuit layer of the circuit board 1 by using a conductive structure 5 .

[0123] Step S6, also refer to Fig.12 A bracket 7 is provided on the side of the filter 4 facing away from the image sensor 3, the bracket 7 includes a first portion 71 accommodated in the mounting hole 103 and a second portion 72 extending out of the second surface 102, the first portion 71 at least extends into the opening 41, the second portion 72 has a lens mounting hole 74, the filter 4 is exposed from the lens mounting hole 74, and the photosensitive area of ​​the image sensor 3 corresponds to the lens mounting hole 74.

[0124] Step S7, see also Figure 1 , the lens assembly 8 is installed in the lens installation hole 74, thereby obtaining the camera module 100. Specifically, when installing the lens assembly 8, the lens assembly 8 needs to be electrically led out to the circuit layer of the circuit board 1. Among them, the incident light can be sequentially projected to the photosensitive area of ​​the image sensor 3 through the lens assembly 8 and the filter 4.

[0125] In summary, the manufacturing method of the camera module 100 provided in the embodiment of the present application, by installing the image sensor 3 in the mounting hole 103 of the circuit board 1, and pre-opening a window to form an opening 41 at the connection pad 33 of the image sensor 3 corresponding to the filter 4, can realize the electrical lead-out of the conductive structure 5 (such as a metal wire) through the filter 4 to the connection pad 33, thereby achieving the purpose of integrated packaging of the image sensor 3, the filter 4 and the circuit board 1. Moreover, the filter 4 is directly installed in the mounting hole 103 without being installed on the bracket 7, so that the spacing between the image sensor 3 and the filter 4 can be flexibly adjusted, and the distance between the filter 4 and the image sensor 3 can be effectively reduced, thereby reducing the overall thickness of the camera module 100; in addition, the bracket 7 is partially embedded in the mounting hole 103, which can further reduce the thickness of the camera module 100.

Claims

1. A camera module, characterized in that: include: The circuit board comprises a first surface and a second surface arranged opposite to each other, and a mounting hole is formed through the first surface and the second surface; A base plate, disposed at one end of the mounting hole close to the first surface, with a portion of the base plate extending into the mounting block to form a supporting portion; An image sensor is accommodated in the mounting hole and disposed on the support portion, and a connection pad is disposed on a surface of the image sensor facing away from the support portion; A filter, disposed on the image sensor, wherein the filter is formed with an opening corresponding to the connection pad, and the connection pad is exposed from the opening; as well as A conducting structure, one end of which extends into the opening and is electrically connected to the connection pad, and the other end of which is electrically connected to the circuit layer of the circuit board.

2. The camera module according to claim 1, characterized in that: A gap is formed between the support portion and the inner wall of the mounting hole. The gap extends to between the image sensor and the inner wall of the mounting hole. A packaging layer is arranged in the gap.

3. The camera module according to claim 2, characterized in that: The end surface of the packaging layer facing away from the substrate exceeds the surface of the image sensor facing away from the supporting portion, and the periphery of the filter is arranged on the end surface.

4. The camera module according to claim 1, characterized in that: It also includes a bracket disposed at one end of the mounting hole close to the second surface and a lens assembly disposed on the bracket. The support comprises: a first portion received in the mounting hole, the first portion extending at least into the opening; and A second portion extends out of the second surface, the second portion has a lens mounting hole, the lens assembly is disposed in the lens mounting hole, the filter is exposed from the lens mounting hole, and the photosensitive area of ​​the image sensor corresponds to the lens mounting hole, and the incident light can be incident on the photosensitive area of ​​the image sensor via the lens assembly and the filter in sequence.

5. The camera module according to claim 4, characterized in that: The second portion further includes a connecting portion extending to the second surface.

6. The camera module according to claim 1, characterized in that: The image sensor is connected to the support portion through a thermal conductive adhesive layer.

7. The camera module according to claim 1, characterized in that: The conductive structure includes a metal conductive line.

8. A method for manufacturing a camera module, characterized in that: include: Provide a circuit board, the circuit board comprising a first surface and a second surface arranged opposite to each other, and a mounting hole is formed through the first surface and the second surface; A substrate is disposed at one end of the mounting hole close to the first surface, and a portion of the substrate is extended into the mounting hole to form a supporting portion; An image sensor is arranged on the support portion, and the image sensor is accommodated in the mounting hole, and a connection pad is arranged on a surface of the image sensor away from the support portion; Disposing a filter on the image sensor, and exposing the connection pad from an opening on the filter; as well as The connection pad is electrically connected to the circuit layer of the circuit board using a conductive structure, thereby obtaining the camera module.

9. The method for manufacturing a camera module according to claim 8, characterized in that: After the step of arranging the image sensor in the mounting hole, the manufacturing method further comprises: Filling a packaging material in a gap between the support portion and an inner wall of the mounting hole and a gap between the image sensor and the inner wall of the mounting hole to form a packaging layer; The end surface of the packaging layer facing away from the substrate exceeds the surface of the image sensor facing away from the supporting portion, and the periphery of the filter is arranged on the end surface.

10. The method for manufacturing a camera module according to claim 8, characterized in that: After the step of electrically connecting the connection pad to the circuit layer of the circuit board using a conductive structure, the manufacturing method further includes: A bracket is disposed at one end of the mounting hole close to the second surface, the bracket comprising a first portion accommodated in the mounting hole and a second portion extending out of the second surface, the first portion at least extending into the opening, the second portion having a lens mounting hole, the filter being exposed from the lens mounting hole, and a photosensitive area of ​​the image sensor corresponding to the lens mounting hole; and The lens assembly is installed in the lens installation hole, and the incident light can be emitted to the photosensitive area of ​​the image sensor through the lens assembly and the filter in sequence.

Images