Printed circuit board

Abstract

The invention provides a printed circuit board. The printed circuit board comprises a glass layer, the first side surface and the second side surface are opposite to each other in a first direction; the third side surface and the fourth side surface are opposite to each other in a second direction; the first corner part is used for connecting the first side surface and the third side surface with each other; the second corner part is used for connecting the first side surface and the fourth side surface with each other; a third corner portion connecting the second side surface and the third side surface to each other and a fourth corner portion connecting the second side surface and the fourth side surface to each other; a first insulating layer covering at least a portion of at least one of the first side surface to the fourth side surface; and a second insulating layer covering at least one of the first to fourth corner portions.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2023-0093569 filed on July 19, 2023 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] The present disclosure relates to a printed circuit board. Background Art

[0003] Recently, due to the development of artificial intelligence (AI) technology and the like, multi-chip packages including memory chips (such as high bandwidth memory (HBM)), processor chips (such as central processing units (CPUs), graphic processing units (GPUs)), and logic chips (such as application specific integrated circuits (ASICs), field programmable gate arrays (FPGAs)), etc., have been used for processing exponentially increased data. Therefore, attempts to use glass materials are continuing. However, when glass materials are used, there is a high possibility of defects due to damage such as cracks, and in particular, finished products including glass materials are susceptible to impacts at the singulation stage. Summary of the invention

[0004] One aspect of the present disclosure is to provide a printed circuit board including a glass layer.

[0005] An aspect of the present disclosure is to provide a printed circuit board having a low damage rate even in the case of singulation.

[0006] An aspect of the present disclosure is to provide a printed circuit board which can improve reliability.

[0007] According to one aspect of the present disclosure, a printed circuit board includes: a glass layer having a first side surface and a second side surface opposite to each other in a first direction, a third side surface and a fourth side surface opposite to each other in a second direction perpendicular to the first direction, a first corner portion connecting the first side surface and the third side surface to each other, a second corner portion connecting the first side surface and the fourth side surface to each other, a third corner portion connecting the second side surface and the third side surface to each other, and a fourth corner portion connecting the second side surface and the fourth side surface to each other; a first insulating layer disposed on the glass layer and covering at least a portion of at least one side surface from the first side surface to the fourth side surface; and a second insulating layer disposed on the first insulating layer and covering at least one corner portion from the first corner portion to the fourth corner portion.

[0008] According to one aspect of the present disclosure, a printed circuit board includes: a glass layer having a first side surface and a second side surface opposite to each other in a first direction, a third side surface and a fourth side surface opposite to each other in a second direction perpendicular to the first direction, a first corner portion connecting the first side surface and the third side surface to each other, a second corner portion connecting the first side surface and the fourth side surface to each other, a third corner portion connecting the second side surface and the third side surface to each other, and a fourth corner portion connecting the second side surface and the fourth side surface to each other; and an insulating material disposed on the glass layer and covering the first side surface to the fourth side surface and the first corner portion to the fourth corner portion. At least one of the first corner portion to the fourth corner portion has a plurality of edges.

[0009] According to one aspect of the present disclosure, a printed circuit board includes: a glass layer having an upper surface and a lower surface opposite to each other in one direction and a first side surface and a second side surface opposite to each other in another direction; a first insulating layer disposed on the glass layer to cover a portion of the first side surface and a portion of the second side surface and the upper surface; a second insulating layer disposed on the first insulating layer and extending to cover another portion of the first side surface and another portion of the second side surface; a through-hole passing through the glass layer; a first wiring layer disposed on the first insulating layer and covered by the second insulating layer; and a first via passing through the first insulating layer to connect the first wiring layer and the through-hole to each other. At an interface between the first via and the through-hole, a width of the first via is different from a width of the through-hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which: Figure 1 is a block diagram schematically illustrating an example of an electronic device system; Figure 2 is a perspective view schematically showing an example of an electronic device; Figure 3A is a cross-sectional view schematically showing an example of a printed circuit board; Figure 3B is a top cross-sectional view of a glass layer of a printed circuit board as viewed from above; FIG. 4A to FIG. 4D are a perspective view and a cross-sectional view showing an operation of forming a first through hole in a method of manufacturing a printed circuit board; FIG. 5A to FIG. 5D are a perspective view and a cross-sectional view showing an operation of forming a through-via in a method of manufacturing a printed circuit board; FIG. 6A to FIG. 6D are an exploded perspective view and a cross-sectional view illustrating an operation of forming a first insulating layer in a method of manufacturing a printed circuit board; FIG. 7A to FIG. 7D are an exploded perspective view and a cross-sectional view showing an operation of forming a first wiring layer in a method of manufacturing a printed circuit board; FIG. 8A to FIG. 8D are an exploded perspective view and a cross-sectional view illustrating an operation of forming a second through hole in a method of manufacturing a printed circuit board; 9A to 9D are an exploded perspective view and a cross-sectional view illustrating an operation of forming a second insulating layer in a method of manufacturing a printed circuit board; Fig.10 is a cross-sectional view showing an operation of further forming other configurations in the method of manufacturing a printed circuit board; Fig.11 is a cross-sectional view showing an operation of separating a unit region in a method of manufacturing a printed circuit board; and FIG. 12A to FIG. 12G is a top-view cross-sectional view of a respective glass layer of a printed circuit board according to various examples, viewed from above. DETAILED DESCRIPTION

[0011] Hereinafter, the present disclosure will be described with reference to the accompanying drawings. For clearer description, the shapes and sizes of elements in the drawings may be exaggerated or reduced.

[0012] Electronic Devices Figure 1 is a block diagram schematically illustrating an example of an electronic device system.

[0013] Reference Figure 1 , the electronic device 1000 may house a mainboard 1010 therein. Chip-related components 1020, network-related components 1030, other components 1040, etc. may be physically and / or electrically connected to the mainboard 1010. These components may be connected to other electronic components to be described below via various signal lines 1090.

[0014] The chip-related components 1020 may include: memory chips, such as volatile memory (e.g., dynamic random access memory (DRAM)), non-volatile memory (e.g., read-only memory (ROM), flash memory), etc.; application processor chips, such as central processing units (e.g., central processing units (CPUs)), graphics processors (e.g., graphics processing units (GPUs)), digital signal processors, cryptographic processors, microprocessors, microcontrollers, etc.; and logic chips, such as analog-to-digital converters (ADCs), application-specific integrated circuits (ASICs), etc. However, the chip-related components 1020 are not limited thereto, but may also include other types of chip-related components. In addition, the chip-related components 1020 may also be combined with each other. The chip-related components 1020 may be in the form of a package including the above-mentioned chips or electronic components.

[0015] The network-related components 1030 may include components that are compatible with or communicate according to protocols such as: Wireless Fidelity (Wi-Fi) (Institute of Electrical and Electronics Engineers (IEEE) 802.11 series, etc.), Worldwide Interoperability for Microwave Access (WiMAX) (IEEE 802.16 series, etc.), IEEE 802.20, Long Term Evolution (LTE), Evolution-Data Optimized (Ev-DO), High Speed ​​Packet Access + (HSPA+), High Speed ​​Downlink Packet Access + (HSDPA+), High Speed ​​Uplink Packet Access + (HSUPA+), Global System for Mobile Communications (GSM), Enhanced Data Rates for GSM Evolution (EDGE), Global Positioning System (GPS), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Time Division Multiple Access (TDMA), Digital Enhanced Cordless Telecommunications (DECT), Bluetooth, third generation mobile communication technology (3G) protocols, fourth generation mobile communication technology (4G) protocols, and fifth generation mobile communication technology (5G) protocols, as well as any other wireless protocols and wired protocols specified after the above protocols. However, the network-related component 1030 is not limited thereto, but may also include components compatible with or communicating with various other wireless standards or protocols or wired standards or protocols. In addition, the network-related component 1030 may be combined with the chip-related component 1020 described above.

[0016] Other components 1040 may include high frequency inductors, ferrite inductors, power inductors, ferrite beads, low temperature co-fired ceramic (LTCC) components, electromagnetic interference (EMI) filters, multilayer ceramic capacitors (MLCC), etc. However, other components 1040 are not limited thereto, but may also include passive components in the form of chip components for various other purposes. In addition, other components 1040 may also be combined with the above-mentioned chip-related components 1020 and / or network-related components 1030.

[0017] Depending on the type of the electronic device 1000, the electronic device 1000 may include other electronic components that are physically and / or electrically connected to the mainboard 1010 or that are not physically and / or electrically connected to the mainboard 1010. These other electronic components may include, for example, a camera 1050, an antenna 1060, a display 1070, a battery 1080, and the like. However, these other electronic components are not limited thereto, and may also be an audio codec, a video codec, a power amplifier, a compass, an accelerometer, a gyroscope, a speaker, a mass storage unit (e.g., a hard disk drive), a compact disk (CD) drive, a digital versatile disk (DVD) drive, and the like. In addition, depending on the type of the electronic device 1000, the electronic device 1000 may also include other electronic components for various purposes.

[0018] The electronic device 1000 may be a smart phone, a personal digital assistant (PDA), a digital video camera, a digital camera, a network system, a computer, a monitor, a tablet PC, a laptop PC, a netbook PC, a television, a video game console, a smart watch, an automobile component, etc. However, the electronic device 1000 is not limited thereto but may be any other electronic device that processes data.

[0019] Figure 2 is a schematic perspective view showing an example of an electronic device.

[0020] Reference Figure 2 , the electronic device may be, for example, a smart phone 1100. The mainboard 1110 is housed in the smart phone 1100, and the electronic component 1120 is physically connected or electrically connected to the mainboard 1110. In addition, other electronic components (such as a camera module 1130 and / or a speaker 1140) that are physically and / or electrically connected to the mainboard 1110 or that are not physically and / or electrically connected to the mainboard 1110 may be housed in the smart phone 1100. Some of the electronic components 1120 may be the above-mentioned chip-related components, for example, a component package 1121, but are not limited thereto. The component package 1121 may be in the form of a printed circuit board having an electronic component (including an active component and / or a passive component) mounted on its upper surface. Alternatively, the component package 1121 may be in the form of a printed circuit board having an electronic component (including an active component and / or a passive component) embedded therein. On the other hand, the electronic device need not be limited to the smart phone 1100, and may also be other electronic devices as described above.

[0021] Printed Circuit Board Figure 3A is a cross-sectional view schematically showing an example of a printed circuit board.

[0022] Reference Figure 3AAccording to an example, a printed circuit board may include a glass layer 110, a first insulating layer 111 disposed on the glass layer 110 and covering a portion of a side surface of the glass layer 110, and a second insulating layer 112 disposed on the first insulating layer 111 and covering the remaining portion of the side surface of the glass layer 110. According to an example, the printed circuit board may include a through-via 130 passing through the glass layer 110, a first wiring layer 121 disposed on and / or in the first insulating layer 111, a first via layer 131 (including a first via) passing through the first insulating layer 111 to connect the first wiring layer 121 and the through-via 130 to each other, a second wiring layer 122 disposed on and / or in the second insulating layer 112, and a second via layer 132 passing through the second insulating layer 112 to connect the second wiring layer 122 and the first wiring layer 121 to each other. In addition, the glass layer 110 may be spaced apart from the outer surface of the printed circuit board.

[0023] The printed circuit board according to the example includes a glass layer 110, and may basically have excellent flatness, and in addition, may be advantageously controlled by a low coefficient of thermal expansion (CTE). Specifically, the printed circuit board according to the example may have a glass layer 110 as a core layer, so that it may be advantageously controlled to control warpage even in an operation of stacking other insulating layers. In addition, since the first insulating layer 111 and the second insulating layer 112 are sequentially stacked on the glass layer 110, the flatness may be further improved. Therefore, it may be more advantageous to form a high-density fine circuit with a fine pitch. In addition, by the dielectric properties of the glass layer 110 (such as glass characteristics with a variable Dk (dielectric constant) of 2.5 to 11), the number of layers of the printed circuit board may be reduced, and the degree of freedom in design may also be increased.

[0024] The printed circuit board according to the example has a structure that can reduce the risk of damage in the operation of cutting the glass layer 110 into individual glass layers. The manufacturing stage of the printed circuit board including the glass layer 110 has a high risk of damage during the singulation process. The printed circuit board according to the example can protect the glass layer 110 by forming a through hole in the glass layer 110 in stages, and in the singulation process, cutting is performed to pass through the insulating layer filling the through hole, thereby reducing the risk of damage. For example, the side surface of the glass layer 110 may be covered by each of the first insulating layer 111 and the second insulating layer 112, and the glass layer 110 may not be exposed to the outside. After the first through hole h1 is formed along the cutting line u of the unit area, the first insulating layer 111 is stacked, and since the second insulating layer 112 is stacked after the second through hole h2 is formed, the side surface of the glass layer 110 may not be exposed to the outside, which will be described in more detail later during the manufacturing stage.

[0025] The glass layer 110 may include glass, which is an amorphous solid. The glass may include, for example, pure silicon dioxide (about 100% SiO2), soda-lime glass, borosilicate glass, aluminosilicate glass, etc., but the present disclosure is not limited thereto, and alternative glass materials such as fluorine glass, phosphate glass, chalcogenide glass, etc. may also be used as the material of the glass layer 110. In addition, other additives may also be included to form glass with specific physical properties. These additives include magnesium, calcium, manganese, aluminum, lead, boron, iron, chromium, potassium, sulfur, antimony, and carbonates (calcium carbonate (e.g., lime) and sodium carbonate (e.g., soda)) and / or oxides of these and other elements. The glass layer 110 is a layer (such as copper clad laminate (CCL), prepreg (PPG), etc.) other than a material including glass fiber (such as glass fabric exemplified by glass cloth), for example, the glass layer 110 may be understood as plate glass, etc.

[0026] The first insulating layer 111 and the second insulating layer 112 may each include an organic insulating material. The organic insulating material may include a thermosetting resin (such as an epoxy resin), a thermoplastic resin (such as polyimide), or a material prepared by impregnating an inorganic filler, an organic filler, and / or a glass fiber (such as a glass fabric such as glass cloth) into these resins. For example, the insulating material may be a non-photosensitive insulating material such as an Ajinomoto built-up film (ABF) or a prepreg (PPG), but is not limited thereto. In addition, other polymer materials may be used. In addition, the insulating material may be a photosensitive insulating material such as a photosensitive dielectric (PID). In addition, the insulating material may include a bonding sheet such as a bonding sheet (BS).

[0027] The first insulating layer 111 and the second insulating layer 112 may include the same insulating material. Specifically, the first insulating layer 111 and the second insulating layer 112 may each include an Ajinomoto built-up film (ABF), but are not limited thereto and may also include other organic insulating materials. In addition, the first insulating layer 111 and the second insulating layer 112 may include different materials.

[0028] The first wiring layer 121 and the second wiring layer 122 may each include a metal. The metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti) and / or alloys thereof. Specifically, the metal may include copper (Cu), but the present disclosure is not limited thereto. Depending on the design, the first wiring layer 121 and the second wiring layer 122 may each perform various functions. For example, the first wiring layer 121 and the second wiring layer 122 may include a signal pattern, a power pattern, a ground pattern, and the like. Each of these patterns may have various forms such as a line, a surface, a pad, and the like. Each of the first wiring layer 121 and the second wiring layer 122 may include an electroless plating layer (e.g., a chemical copper plating layer) and an electroplating layer (e.g., an electroplated copper layer), or may include a metal foil (e.g., a copper foil) and an electroplating layer (e.g., an electroplated copper layer). Alternatively, each of the first wiring layer 121 and the second wiring layer 122 may include a metal foil (e.g., a copper foil), an electroless plating layer (e.g., a chemical copper plating layer), and an electroplating layer (e.g., an electroplated copper layer). Each of the first wiring layer 121 and the second wiring layer 122 may include a sputtering layer instead of an electroless plating layer (e.g., a chemical copper plating layer), and may include both a sputtering layer and an electroless plating layer (e.g., a chemical copper plating layer) as needed.

[0029] The through via 130 may include a metal. The metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or alloys thereof. Specifically, the metal may include copper (Cu), but the present disclosure is not limited thereto. The through via 130 may pass between the upper surface and the lower surface of the glass layer 110. The upper surface and the lower surface of the through via 130 may be substantially coplanar with the upper surface and the lower surface of the glass layer 110, respectively. Figure 3A , the through via 130 is shown as a so-called filled via (passing through the upper and lower surfaces of the glass layer 110 and filled with a single metal layer), however, the present disclosure is not limited thereto. The specific method of forming the through via 130 is not limited thereto, and the through via 130 may be a conformal via provided along the wall of the via hole. The through via 130 may perform various functions according to the design, and may include, for example, a ground via, a power via, a signal via, and the like. The through via 130 may have a substantially circular shape, an elliptical shape, or a polygonal shape on a plane, but the present disclosure is not limited thereto. For example, in terms of ensuring adhesion by increasing the specific surface area, the through via 130 may have a complex shape in which various shapes are combined into one on a plane. The side surface of the through via 130 may be substantially perpendicular to the upper and lower surfaces of the through via 130, but is not limited thereto, and as required, the cross section of the through via 130 may be a tapered shape.

[0030] The first via layer 131 and the second via layer 132 may each include a metal. The metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti) and / or alloys thereof, and specifically, may include copper (Cu), but is not limited thereto. The first via layer 131 and the second via layer 132 may each include a filled via that fills the via hole, but may also include a conformal via disposed along the wall of the via hole. The first via layer 131 and the second via layer 132 may perform various functions according to the design, for example, may include a ground via, a power via, a signal via, and the like. Each of the first via layer 131 and the second via layer 132 may include an electroless plating layer (e.g., a chemical copper plating layer) and an electroplating layer (e.g., an electroplated copper layer). Each of the first and second via layers 131 and 132 may include a sputtering layer instead of an electroless plating layer (eg, a chemical copper plating layer), and may include both a sputtering layer and an electroless plating layer (eg, a chemical copper plating layer) as needed.

[0031] The first via layer 131 disposed on the upper surface of the glass layer 110 and the first via layer 131 disposed on the lower surface of the glass layer 110 may have shapes tapered in opposite directions in cross section. For example, the first via layer 131 has a tapered shape having a width that gradually decreases in a direction toward the through-hole 130. This is a characteristic that may occur because the printed circuit board according to the example is a so-called core-type printed circuit board having the glass layer 110 as a core layer, and since the first via layer 131 is formed by forming respective via holes in the first insulating layer 111 stacked on the upper and lower surfaces of the glass layer 110, each of the first via layers 131 disposed above and below the glass layer 110 may have different tapered directions. More specifically, as the first via layer 131 approaches the glass layer 110, the cross-sectional width of the first via layer 131 may become narrower.

[0032] On the other hand, in the printed circuit board according to the example, the upper and lower surfaces of the through-via 130 passing through the glass layer 110 may be directly connected to the lower and upper surfaces of the first via layer 131, respectively. This is because it is difficult to ensure the adhesion of the upper and lower surfaces of the glass layer 110 to the metal material, making it difficult to directly form a wiring layer. After the first insulating layer 111 is formed on the upper and lower surfaces of the glass layer 110, the first wiring layer 121 is formed on the first insulating layer 111, and the first wiring layer 121 may be connected to the through-via 130 through the first via layer 131. There is an interface between the first via layer 131 and the through-via 130, and at this cross section, the width of the via in the first via layer 131 is different from the width of the through-via 130 (for example, the width of the via in the first via layer 131 is smaller than the width of the through-via 130).

[0033] On the other hand, the printed circuit board according to the example may further include a third insulating layer 113 disposed on the second insulating layer 112, a third wiring layer 123 disposed on the third insulating layer 113, and a third via layer 133 passing through the third insulating layer 113 to connect the third wiring layer 123 to the second wiring layer 122 and / or to connect the third wiring layers 123 to each other. Each of the third insulating layer 113, the third wiring layer 123, and the third via layer 133 may include one or more layers, and may include a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers.

[0034] The third insulating layer 113 may include an insulating material. The insulating material may include a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a material prepared by impregnating inorganic fillers, organic fillers and / or glass fibers (such as glass fabrics such as glass cloth) into these resins. For example, the insulating material may be a non-photosensitive insulating material such as Ajinomoto built-up film (ABF) or prepreg (PPG), but is not limited thereto. In addition, other polymer materials may be used. In addition, the insulating material may be a photosensitive insulating material such as a photosensitive dielectric (PID). The third insulating layer 113 may include the same insulating material as the first insulating layer 111 and / or the second insulating layer 112, but is not limited thereto, and may include different insulating materials.

[0035] The third wiring layer 123 may include a metal. The metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti) and / or alloys thereof, etc. Specifically, the metal may include copper (Cu), but is not limited thereto. The third wiring layer 123 may perform various functions according to the design, for example, may include a signal pattern, a power pattern, a ground pattern, etc. Each of these patterns may have various forms, such as a line, a surface, a pad, etc. The third wiring layer 123 may include an electroless plating layer (e.g., a chemical copper plating layer) and an electroplating layer (e.g., an electroplated copper layer). Alternatively, a metal foil (e.g., a copper foil) and an electroplating layer (e.g., an electroplated copper layer) may be included. Alternatively, a metal foil (e.g., a copper foil), an electroless plating layer (e.g., a chemical copper plating layer), and an electroplating layer (e.g., an electroplated copper layer) may be included. The third wiring layer 123 may include a sputtering layer instead of an electroless plating layer (eg, a chemical copper plating layer), and may include both a sputtering layer and an electroless plating layer (eg, a chemical copper plating layer) as necessary.

[0036] The third via layer 133 may include a metal. The metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti) and / or alloys thereof, and specifically, may include copper (Cu), but is not limited thereto. The third via layer 133 may include a filled via that fills the via hole, but may also include a conformal via arranged along the wall of the via hole. The third via layer 133 may perform various functions according to the design. For example, it may include a ground via, a power via, a signal via, and the like. In the third via layer 133, the via layer disposed on the upper side of the glass layer 110 and the via layer disposed on the lower side of the glass layer 110 may have a shape tapered in opposite directions in a cross section. The third via layer 133 may include an electroless plating layer (e.g., a chemical copper plating layer) and an electroplating layer (e.g., an electroplated copper layer). The third via layer 133 may include a sputtering layer instead of an electroless plating layer (eg, a chemical copper plating layer), and may include both a sputtering layer and an electroless plating layer (eg, a chemical copper plating layer) as needed.

[0037] On the other hand, the printed circuit board according to the example may further include a solder resist layer 140 on the third insulating layer 113. The solder resist layer 140 is disposed on the outermost surface of the printed circuit board to protect the printed circuit board from external influences. The solder resist layer 140 may use a known solder resist, and the solder resist layer 140 may include a liquid solder resist or a film type solder resist, but is not limited thereto, and may include other types of insulating materials, may include a thermosetting resin and an inorganic filler dispersed in the thermosetting resin, but may not include glass fiber. The insulating resin may be a photosensitive insulating resin, and the filler may be an inorganic filler and / or an organic filler, but is not limited thereto. If necessary, other polymer materials may be used. The solder resist layer 140 may have an opening, and at least a portion of the third wiring layer 123 may be exposed through the opening. The portion of the third wiring layer 123 exposed through the opening may be connected to a mainboard or other printed circuit boards, and may also be connected to other devices such as semiconductor chips. If necessary, a surface treatment layer may also be formed on the portion of the third wiring layer 123 exposed through the opening. Optionally, a metal bump may also be formed on the portion of the third wiring layer 123 exposed through the opening.

[0038] On the other hand, the printed circuit board according to the example is not limited to Figure 3A The configuration shown in , and may also include a general configuration of a printed circuit board, and specifically, may include additional configurations that may be used by a person of ordinary skill in the art.

[0039] Figure 3B FIG. 1 is a top cross-sectional view of the glass layer 110 of the printed circuit board as viewed from above.

[0040] Figure 3BThe cross-sectional view may be a top view obtained by horizontally cutting between the upper surface and the lower surface of the glass layer 110 as viewed from the top.

[0041] Reference Figure 3B , the side surface and corner portion of the glass layer 110 of the printed circuit board according to the example may be covered by the first insulating layer 111 and the second insulating layer 112. The glass layer 110 may not be exposed to the outside of the printed circuit board. A portion of the side surface of the glass layer 110 may be covered by the first insulating layer 111, and the remaining portion of the glass layer 110 may be covered by the second insulating layer 112.

[0042] More specifically, the glass layer 110 may have a first side surface and a second side surface that are opposite to each other in a first direction perpendicular to the stacking direction (for example, the direction along which the first insulating layer 111, the second insulating layer 112, and the third insulating layer 113 in the printed circuit board according to the example are stacked on each other), and may have a third side surface and a fourth side surface that are opposite to each other in the second direction perpendicular to the stacking direction and the first direction. In addition, the glass layer 110 may have a first corner portion connecting the first side surface and the third side surface to each other, a second corner portion connecting the first side surface and the fourth side surface to each other, a third corner portion connecting the second side surface and the third side surface to each other, and a fourth corner portion connecting the second side surface and the fourth side surface to each other. The first side surface to the fourth side surface are Figure 3B In FIG. 1 , the edge of the glass layer is indicated, and the first to fourth corner portions are Figure 3B It is represented as a connecting line connecting two side surfaces adjacent to the corner portion of the glass layer.

[0043] Reference Figure 3B , at least one of the first to fourth corners of the glass layer 110 may have a plurality of edges. An edge may be understood as a boundary line formed when two surfaces intersect. For example, the first corner connecting the first side surface and the third side surface having an edge means that the first side surface and the third side surface are in direct contact to form a corner. In the printed circuit board according to the example, the first corner connecting the first side surface and the third side surface has a first corner surface different from the first side surface and the third side surface, the first corner surface and the first side surface may have edges in contact with each other, and the first corner surface and the third side surface may have edges in contact with each other. In this way, in the printed circuit board according to the example, the first corner may include a plurality of corners. On the other hand, when the first side surface and the third side surface are in direct contact, the edge caused by the step caused by the error in the manufacturing stage, etc. is not understood as a plurality of edges. If the first corner has a separate corner surface different from the first side surface and the third side surface, and the first corner substantially includes a plurality of edges, it may be understood as having a plurality of edges.

[0044] On the other hand, the printed circuit board according to the example may have a first corner portion having a curved surface in the manufacturing stage. In this case, the discontinuous position where the extended surface of the first side surface is inconsistent with the first corner portion may be understood as the starting point of the first corner, and at this time, the discontinuous position may be understood as an edge. In this case, since the first corner portion may have a discontinuous position inconsistent with the extended surface of the first side surface, and may have a discontinuous position inconsistent with the extended surface of the third side surface, the first corner portion has an edge at each position and may be understood as having a plurality of edges.

[0045] On the other hand, the first corner portion may be understood as having a separate first corner portion surface that is substantially different from the first side surface and the third side surface, which may be the result of processing to form the first corner portion in an operation of cutting along the first side surface and an operation of cutting along the third side surface in the manufacturing operation of the printed circuit board according to the example. However, the present disclosure is not limited thereto. On the other hand, the description of the relationship between the first side surface and the third side surface and the first corner portion may be equally applicable to other side surfaces and other corner portions. For example, the relationship may be equally applicable to the second corner portion between the first side surface and the fourth side surface, and may be equally applicable to the third corner portion between the second side surface and the third side surface and the fourth corner portion between the second side surface and the fourth side surface.

[0046] Reference Figure 3B , at least a portion of at least one of the first to fourth side surfaces of the glass layer 110 may be covered by the first insulating layer 111, and the remaining portion may be covered by the second insulating layer 112. The glass layer 110 may have a structure in which the first insulating layer 111 and the second insulating layer 112 are alternately disposed on at least one of the first to fourth side surfaces. For example, the first insulating layer 111 may cover and contact a portion of at least one of the first to fourth side surfaces of the glass layer 110 and the upper surface of the glass layer 110, and the second insulating layer 112 may cover and contact another portion of at least one of the first to fourth side surfaces of the glass layer 110. The region where the first insulating layer 111 is disposed corresponds to the region where the first through hole h1 is formed in the manufacturing stage, and the region where the second insulating layer 112 is disposed may correspond to the region where the second through hole h2 is formed. Since the first through hole h1 and the second through hole h2 having a narrow width are alternately arranged in the manufacturing stage, the stress applied to the glass layer 110 may be dispersed when the through hole is formed, so that the stress is not concentrated. On the other hand, the first insulating layer 111 and the second insulating layer 112 may have a narrower width and may be arranged so that Figure 3BIn addition, the second insulating layer 112 extends from another portion of at least one of the first side surface to the fourth side surface to cover a portion of the first insulating layer 111 covering the lower surface of the glass layer 110. In another embodiment, of the first insulating layer 111 and the second insulating layer 112, only the first insulating layer 111 is in contact with the upper surface of the glass layer 110.

[0047] Reference Figure 3B At least one of the first to fourth corners of the glass layer 110 may be covered by the second insulating layer 112. Figure 3B As shown in , the first to fourth corner portions may all be covered by the second insulating layer 112, but are not limited thereto, and may also be covered by the first insulating layer 111. As described above, the region where the first insulating layer 111 is provided corresponds to the region where the first through hole h1 is formed in the manufacturing stage, and the region where the second insulating layer 112 is provided corresponds to the region where the second through hole h2 is formed. For example, the first through hole h1 formed first in the manufacturing step is formed on the first to fourth side surfaces of the glass layer 110, and the second through hole h2 formed after the first insulating layer 111 is formed may be formed in the region of the first to fourth corner portions of the glass layer 110. In the operation of forming the first through hole h1 in the glass layer 110, if the first through hole h1 is formed in the edge region of the glass layer 110, the stress applied to the glass layer 110 may be concentrated, and the risk of damage is increased. Therefore, the first through hole h1 may be preferentially formed in the side surface region of the glass layer 110, and after the first insulating layer 111 is formed, the second through hole h2 may be formed in the corner region of the glass layer 110.

[0048] On the other hand, refer to Figure 3B In the top cross-sectional view (which may also be referred to as a top plan view) shown in FIG, at least one corner portion of the first to fourth corner portions may have an inclination and may form an obtuse angle with the first to fourth side surfaces. Figure 3B is a top cross-sectional view of the glass layer 110 of the printed circuit board as viewed from above, and as described above, the cross section is perpendicular to the stacking direction and passes through the glass layer 110. Figure 3BAs shown in , the corner portions of the glass layer 110 may each form an obtuse angle with the side surface of the glass layer 110, and when a portion of the corner portion of the glass layer 110 is removed in the manufacturing stage to form the second through hole h2, such a shape may occur because the corner portion of the glass layer 110 is removed together. When forming the second through hole h2, if the corners of the glass layer 110 are formed so that the side surfaces are perpendicular to each other, stress is concentrated at the corners. Since the risk of damage such as cracks occurring at the corners is high, when forming the second through hole h2, if a portion of the corners of the glass layer 110 is removed together so that the corners form an obtuse angle with the side surface, stress may be dispersed in the operation of forming the second through hole h2, thereby reducing the risk of damage. On the other hand, in Figure 3B In the figure, the slope of the corner portion is shown as a straight line so that it is substantially constant, but is not limited to Figure 3B As shown in . The corner portion may have a convex inclined surface or a concave inclined surface. For example, the first corner portion having a convex inclined surface may mean that the first corner portion protrudes more than the straight line connecting the first side surface and the third side surface to have a convex curve, and the first corner portion having a concave inclined surface means that the first corner portion may have a concave curve opposite to the convex curve. This may correspond to the case where the first corner portion has a curved surface. The description on this point may also apply to the second to fourth corner portions.

[0049] In this case, the first insulating layer 111 and the second insulating layer 112 may have an interlayer boundary. The first insulating layer 111 and the second insulating layer 112 may include the same insulating material, but since they are formed at different manufacturing stages, the first insulating layer 111 formed earlier and the second insulating layer 112 formed later may have an interlayer boundary so that they can be distinguished from each other. For example, the first insulating layer 111 and the second insulating layer 112 can be distinguished from each other on a cut surface of a printed circuit board.

[0050] On the other hand, Figure 3B , the first insulating layer 111 and the second insulating layer 112 are shown to be repeated with a constant width, but are not limited thereto. The widths of the first insulating layer 111 and the second insulating layer 112 may be adjusted according to the design, and the widths of the first insulating layer 111 and the second insulating layer 112 may include errors in the manufacturing stage or measurement. Of course, the number of repeating units of the first insulating layer 111 and the second insulating layer 112 may also be adjusted.

[0051] Method for manufacturing printed circuit board According to an example, the method of manufacturing a printed circuit board may include: forming a first through hole h1 and a via hole h0 in a glass layer 110 (the via hole h0 is used to form a through via 130), forming a first insulating layer 111 on the glass layer 110 by filling the first through hole h1, forming a first wiring layer 121 on the first insulating layer 111, forming a second through hole h2 in the first insulating layer 111 and the glass layer 110, forming a second insulating layer 112 on the first insulating layer 111 by filling the second through hole h2, and performing singulation. In addition, the method of manufacturing a printed circuit board may further include forming a second wiring layer 122 on the second insulating layer 112, forming a third insulating layer 113 on the second insulating layer 112, and forming a third wiring layer 123 on the third insulating layer 113.

[0052] Hereinafter, a method of manufacturing a printed circuit board according to an example will be described in more detail with reference to the accompanying drawings.

[0053] FIG. 4A to FIG. 4D 1 is a perspective view and a cross-sectional view showing a step of forming a first through hole h1 in a method for manufacturing a printed circuit board. Specifically, Figure 4A It is a stereogram. Figure 4B This is a top view. Figure 4C It is along Figure 4B The cross-sectional view taken along the line I-I' in FIG. Figure 4D It is along Figure 4B A cross-sectional view taken along line II-II'.

[0054] Reference FIG. 4A to FIG. 4D , a via hole h0 for penetrating the via hole 130 is formed in the cell region of the glass layer 110, and a first through hole h1 may be formed along a cutting line u for showing the cell region. In this case, the glass layer 110 may have a glass plate form of a strip-shaped cell before being cut into the cell region, but is not limited thereto.

[0055] The unit area refers to an area with a complete printed circuit board formed by performing the singulation process. The cutting line u is an imaginary line where the singulation process is performed, and corresponds to an area that will become the outermost surface of the printed circuit board. Other components of the printed circuit board, such as through vias, wiring layers, and via layers, are arranged within the cutting line u, which is the unit area. The via hole h0 is provided in the unit area of ​​the glass layer 110, and is formed in an area where the through via 130 will be formed.

[0056] The first through hole h1 and the via hole h0 may be formed by various methods such as laser processing, mechanical processing, and chemical processing. Since the first through hole h1 is formed in a strip-shaped unit glass plate, if the first through hole h1 is too large or the first through hole h1 is formed in an "L" shape orthogonal to the corner portion of the unit area, stress may be concentrated in the area where the first through hole h1 is formed. Therefore, the first through hole h1 is not disposed at the corner portion of the cutting line u, but is disposed at regular intervals along the cutting line u so that the stress can be dispersed. In this case, when the first through hole h1 is disposed as close to the corner portion as possible according to the second through hole h2 formed at the corner portion of the cutting line u, the stress generated when the second through hole h2 is formed can be dispersed.

[0057] The shape of the first through hole h1 is shown as having a rectangular shape when viewed from the top, but is not limited thereto, and may have a circular shape, an elliptical shape, or a rectangular shape with a longer horizontal length, but is not limited thereto, and may have a polygonal shape such as a square or a regular hexagon. In addition, the through hole may be formed to have a constant width in a cross-sectional view, but is not limited thereto.

[0058] exist FIG. 4A to FIG. 4D In the figure, the first through holes h1 are represented as three through holes formed along each cutting line u, but the number of the first through holes h1 is not limited thereto. In addition, in the drawings, the width of the first through holes h1 and the distance between the first through holes h1 are represented as constant, but the present disclosure is not limited thereto. The width, spacing and number can be adjusted by those skilled in the art within a changeable range.

[0059] FIG. 5A to FIG. 5D 1 is a perspective view and a cross-sectional view showing an operation of forming a through hole 130 in a method of manufacturing a printed circuit board. Specifically, Figure 5A It is a stereogram. Figure 5B This is a top view. Figure 5C It is along Figure 5B The cross-sectional view taken along the line I-I' in FIG. Figure 5D It is along Figure 5B A cross-sectional view taken along line II-II'.

[0060] Although the through via 130 is shown as a filled via filled with a metal layer, it is not limited thereto, and the through via 130 may be a conformal via provided along the wall of the via hole. The through via 130 may be filled by plating on a seed layer formed along the via hole h0, or may be formed by removing an unnecessary portion, but the present disclosure is not limited thereto. Any method of forming the through via 130 in the glass layer 110 may be used without limitation, such as filling the via hole h0 of the glass layer 110 with a paste including a metal material and then firing it. Specifically, a method of ensuring adhesion between the glass layer 110 and the through via 130 may be used.

[0061] FIG. 6A to FIG. 6D 1 is a perspective view and a cross-sectional view showing an operation of forming a first insulating layer 111 in a method of manufacturing a printed circuit board. Specifically, Fig. 6A It is an exploded stereogram. Figure 6B is a top plan view of the glass layer 110, Figure 6C is along Figure 6B A cross-sectional view taken along line II' in FIG. Fig.6D is along Figure 6B A cross-sectional view taken along line II-II'.

[0062] Reference Fig. 6A , a first insulating layer 111 may be formed above and below the glass layer 110. The first insulating layer 111 may be in the form of a film including an insulating material, but is not limited thereto. The first insulating layer 111 may have fluidity before being cured and may fill the first through hole h1. The operation of forming the first insulating layer 111 may be performed by placing and curing the first insulating layer 111, but the present disclosure is not limited thereto. The operation of forming the first insulating layer 111 may be performed using a known method of stacking insulating layers on a printed circuit board.

[0063] When the first insulating layer 111 is formed to fill the first through hole h1, a portion of the side surface of the glass layer 110 may be covered by the first insulating layer 111. Fig.6D , a portion of the side surface of the glass layer 110 may be covered by the first insulating layer 111, and the remaining portion of the glass layer 110 may have a shape in which the glass layer 110 remains (e.g., the remaining portion of the glass layer 110 is not covered by the first insulating layer 111). The remaining portion corresponds to a region where a second through hole h2 will be formed and filled with the second insulating layer 112 in a process to be described later.

[0064] FIG. 7A to FIG. 7D 1 is an exploded perspective view and a cross-sectional view showing an operation of forming a first wiring layer 121 in a method of manufacturing a printed circuit board. Specifically, Fig. 7A It is an exploded stereogram. Figure 7B is a top plan view of the glass layer 110, Figure 7C is along Figure 7B A cross-sectional view taken along line II' in FIG. Fig.7D is along Figure 7B A cross-sectional view taken along line II-II'.

[0065] The first wiring layer 121 may be formed simultaneously with the first via layer 131. A via hole may be formed through the first insulating layer 111, and after performing electroless plating and electroplating patterning using a plating resist to form the first via layer 131 and the first wiring layer 121, unnecessary portions may be removed, but the present disclosure is not limited thereto. The operation of forming the first wiring layer 121 and the first via layer 131 may be used without limitation as long as it is a known wiring layer and via layer forming process.

[0066] Figure 7B This corresponds to a plan view in which the glass layer is viewed from above, and a first wiring layer 121 formed on the first insulating layer 111 is visible. In this case, the first wiring layer 121 may be displayed as a dotted line.

[0067] Fig.7D It is along Figure 7B The cross-sectional view taken along the line II-II' in FIG. 1 does not pass through the first wiring layer 121, and therefore, the first wiring layer 121 is not Fig.7D Shown in.

[0068] FIG. 8A to FIG. 8D 1 is an exploded perspective view and a cross-sectional view showing a step of forming a second through hole h2 in a method for manufacturing a printed circuit board. Specifically, Fig. 8A It is an exploded stereogram. Figure 8B is a top plan view of the glass layer 110, Figure 8C is along Figure 8B A cross-sectional view taken along line II' in FIG. Fig.8D is along Figure 8B A cross-sectional view taken along line II-II'.

[0069] The second through hole h2 may pass through the first insulating layer 111 and the glass layer 110 at the same time, and the second through hole h2 may be formed in a region of the glass layer 110 that is not filled with the first insulating layer 111. For example, the second through hole h2 may be formed to remove the remaining portion of the glass layer 110 except for the first insulating layer 111 along the cutting line u. When the first through hole h1 is formed to have a constant width and a constant distance, the second through hole h2 may be formed to have a constant distance and a constant width to correspond to the first through hole h1. Therefore, when the second through hole h2 is formed, the glass layer 110 may be separated into unit regions, but the first insulating layers 111 that have been formed may be connected to each other so that the glass layer 110 is not separated.

[0070] The cell area of ​​the glass layer 110 may be connected to the dummy area through the remaining portion not removed by the first through hole h1, and the second through hole h2 may remove the remaining portion. For example, since the operation of forming the second through hole h2 is performed with a portion of the glass layer 110 in the cell area removed, the removed area of ​​the glass layer 110 plays a role of absorbing stress, and thus damage in the cell area of ​​the glass layer 110 may be reduced.

[0071] Referring to FIG. 1 as a top plan view of the glass layer 110 Figure 8B , the inner side wall of the second through hole h2 may be formed obliquely at the corner region of the cutting line u. The second through hole h2 being inclined in the corner region of the cutting line u means that, based on a top plan view, the inner side wall of the second through hole h2 or its extended surface does not perpendicularly intersect the cutting line u or a line virtually extended from the cutting line u on the unit area. This means that when the unit area is defined as having a square shape or a rectangular shape, in which two faces face a first direction and two faces face a second direction perpendicular to the first direction, the inner side wall of the through hole is not perpendicular to the first direction and the second direction. For example, the second through hole h2 formed at the corner of the cutting line u does not have an "L" shape in which two arbitrary rectangular shapes perpendicularly intersect each other, and the second through hole h2 may be formed to have an inclination in the curved inner portion of the "L" shape so that the corners of the glass layer 110 do not intersect at right angles.

[0072] When processing the glass layer 110, if the corners of the glass layer 110 are formed so that the side surfaces of the glass layer 110 are perpendicular to each other, there is a risk that the glass layer 110 is damaged due to stress concentration at the corners. Since the second through hole h2 formed at the corner portion of the cutting line u has an inclination, the glass layer 110 has a more gentle corner portion and can better protect the glass layer 110 from the risk of cracking.

[0073] The second through hole h2 can be formed by various methods (such as laser processing, mechanical processing, chemical processing, etc.). FIG. 8A to FIG. 8D In the embodiment, the first insulating layer 111 and the glass layer 110 are described as being penetrated together, but are not necessarily limited thereto. After forming a through hole through the first insulating layer 111, a second through hole h2 may be formed through the glass layer 110 accordingly. In this case, the portion passing through the first insulating layer 111 and the portion passing through the glass layer 110 may be formed to have different widths on the cut surface. The taper may also vary.

[0074] 9A to 9D 1 is an exploded perspective view and a cross-sectional view showing an operation of forming a second insulating layer 112 in a method of manufacturing a printed circuit board. Specifically, Fig. 9A It is an exploded stereogram. Fig. 9B is a top plan view of the glass layer 110, Fig. 9C is along Fig. 9B A cross-sectional view taken along line II' in FIG. Fig.9D is along Fig. 9B A cross-sectional view taken along line II-II'.

[0075] Reference Fig. 9A , a second insulating layer 112 may be formed above and below the first insulating layer 111. The second insulating layer 112 may be formed by the same process as that used to form the first insulating layer 111, but is not limited thereto. The operation of forming the first insulating layer 111 may be performed using a known method of stacking insulating layers on a printed circuit board.

[0076] When the second insulating layer 112 is formed to fill the second through hole h2, a portion of the side surface of the glass layer 110 may be covered by the second insulating layer 112. Fig.9D , a portion of the side surface of the glass layer 110 is covered by the first insulating layer 111 , and the remaining portion of the side surface of the glass layer 110 is covered by the second insulating layer 112 .

[0077] Fig.10 2 is a cross-sectional view showing an operation of further forming other structures in the method of manufacturing a printed circuit board. Specifically, Fig.10 1 is a cross-sectional view showing that the second via layer 132 , the second wiring layer 122 , the third insulating layer 113 , and the third via layer 133 are further formed.

[0078] Fig.10 is based on Fig. 9C Indicated, Fig. 9C is along Fig. 9B A cross-sectional view taken along line II'. Fig.10 It means that a portion of the glass layer 110 is covered by the first insulating layer 111 , and the other portion is covered by the second insulating layer 112 .

[0079] Fig.11 is a cross-sectional view illustrating an operation of separating a unit region in a method of manufacturing a printed circuit board.

[0080] The printed circuit board can be divided into individual unit areas along the cutting line u, and unnecessary dummy areas can be removed. The operation of separating the unit areas can be understood as so-called singulation, and any known method of singulating a strip board (such as sawing or laser processing) can be used without limitation.

[0081] Printed Circuit Board FIG. 12A to FIG. 12G 1 is a top cross-sectional view of the glass layer 110 of each printed circuit board according to various examples, viewed from above. Specifically, the top of each figure shows a stage before singulation. At the bottom, a top cross-sectional view of the glass layer 110 of the printed circuit board after singulation is shown.

[0082] because Fig. 12A A top cross-sectional view of a glass layer 110 of a printed circuit board according to an example is shown, and thus a repeated description thereof will be omitted.

[0083] Fig. 12B FIG. 1 is a top cross-sectional view of a glass layer 110 of a printed circuit board according to another example. Fig. 12B , some corners of the glass layer 110 are covered by the first insulating layer 111. This is the result of forming the first through hole h1 at the corners of the cutting line u when forming the first through hole h1. Although the first through hole h1 is formed at a part of the corners of the cutting line u, since the first through hole h1 is not formed at all the corners of the cutting line u, stress can be dispersed.

[0084] Fig. 12C FIG. 1 is a top cross-sectional view of a glass layer 110 of a printed circuit board according to another example. Fig. 12C , the second through hole h2 may be formed closer to the cutting line u, and may be formed to have a surface substantially the same as the surface corresponding to the cutting line u. For example, since the first through hole h1 is formed first, and the second through hole h2 is formed after the first insulating layer 111 is formed, the second through hole h2 only needs to separate the dummy area and the unit area by removing a portion of the glass layer 110. Therefore, the second through hole h2 may not be formed larger, and may be formed as small as the surface u corresponding to the cutting line of the unit area (that is, having a surface substantially the same as the surface corresponding to the cutting line u). Therefore, when the second through hole h2 is formed, stress may be dispersed. As described above, the second insulating layer 112 may be set according to the shape of the second through hole h2. On the other hand, a printed circuit board according to another example may have a structure that is the same as the structure of the printed circuit board according to the example after the singulation process.

[0085] Fig.12D FIG. 1 is a top cross-sectional view of a glass layer 110 of a printed circuit board according to another example. Fig.12D , the second through hole h2 formed at the corner portion of the cutting line u may have a step. Fig.12D, the second through hole h2 formed at the corner portion of the cutting line u may include a step in a stepped shape. For example, when the second through hole h2 is formed at the corner portion of the cutting line u, the second through hole h2 may have a step in a stepped shape to disperse stress. As described above, the second insulating layer 112 may be set according to the shape of the second through hole h2. The second insulating layer 112 covering the corner portion of the glass layer 110 may also have a step in a stepped shape when viewed from a top plan view. At this time, the first corner portion may have a plurality of first corner portion surfaces, and the first corner portion may include an edge where the first side surface contacts the first corner portion surface in addition to an edge where the third side surface contacts the first corner portion surface, and an edge where a plurality of first corner portion surfaces contact each other. For example, the first corner portion may have a plurality of corner portion surfaces between the first side surface and the third side surface, and the plurality of corner portion surfaces may be distinguished from the first side surface and the third side surface. On the other hand, the description of the first corner portion may of course be equally applicable to the second to fourth corner portions. In Fig.12D In the embodiment, each corner portion is shown as having three inflection points, but is not limited thereto, and may have more inflection points and more steps. On the other hand, as the number of inflection points increases, the stress acting on the glass layer 110 during through-hole processing can be more fully dispersed, and thus a structure more conducive to crack resistance can be obtained. On the other hand, the content is not limited to Fig.12D , and the first corner portion may have a curved surface. When the first corner portion has a curved surface, as described above in the printed circuit board according to the example, the discontinuous positions on the first side surface and the third side surface may be understood as corners, and the inflection points formed between the curved surfaces may be understood as edges. On the other hand, Fig.12D The shape of the corner portion of the glass layer 110 of the printed circuit board according to another example shown in FIG. 1 can of course also be applied to Fig. 12B A printed circuit board according to another example is shown in FIG.

[0086] Fig.12E FIG. 1 is a top cross-sectional view of a glass layer 110 of a printed circuit board according to another example. Fig.12E , the second through hole h2 may be formed closer to the cutting line u, and the second through hole h2 formed at the corner portion of the cutting line u may include a step in a stair-shaped manner. Fig. 12C Another example of a printed circuit board and a printed circuit board according to Fig.12D Another example of the structure of the printed circuit board shown in FIG. On the other hand, Fig.12E A printed circuit board according to another example shown in FIG. 1 may have a Fig.12D A printed circuit board according to another example is similar in structure to that shown in FIG.

[0087] Fig.12FFIG. 1 is a top cross-sectional view of a glass layer 110 of a printed circuit board according to another example. Fig.12F , the side surface of the glass layer 110 may be covered by the first insulating layer 111, and the corner portion of the glass layer 110 may be covered by the second insulating layer 112. The corner portion of the glass layer 110 may be formed to form an obtuse angle with the side surface of the glass layer 110. In the printed circuit board according to the example, the second through hole h2 does not extend to the edge area of ​​the cutting line u, so the second insulating layer 112 may cover the corner portion of the glass layer 110, and may only cover the corner portion of the glass layer 110. Of course, since the glass layer 110 does not have an orthogonal "L"-shaped corner, a stress dispersion effect can be obtained.

[0088] Figure 12G FIG. 1 is a top cross-sectional view of a glass layer 110 of a printed circuit board according to another example. Figure 12G , which is based on Fig.12F Another example of a modified shape of a corner portion of a glass layer 110 in a printed circuit board is shown in FIG. The second through hole h2 formed at the corner portion of the cutting line u may include a step in a stair-shaped step, and thus, the second insulating layer 112 covering the corner portion of the glass layer 110 may include a step in a stair-shaped step.

[0089] On the other hand, according to FIG. 12A to FIG. 12G In the various examples of printed circuit boards, descriptions other than the description of the shape of the glass layer, the arrangement of the first insulating layer 111 and the second insulating layer 112, etc. can be applied in the same manner as the description in the printed circuit board and the method for manufacturing a printed circuit board according to the examples, and thus repeated descriptions are omitted.

[0090] As described above, according to the embodiments, a printed circuit board including a glass layer and a method of manufacturing the printed circuit board may be provided.

[0091] A printed circuit board having a low probability of damage even when singulated and a method of manufacturing the printed circuit board can be provided.

[0092] A printed circuit board and a method of manufacturing the printed circuit board that can improve reliability can be provided.

[0093] In the present disclosure, the expression "covering" may include not only the case of covering the whole but also the case of covering at least a part, and may also include the case of direct covering as well as indirect covering. In addition, the expression "filling" may include not only the case of completely filling but also the case of approximately filling. For example, this may include the case of having some gaps.

[0094] The present disclosure may actually include process errors, position deviations, errors during measurement, etc. that occur during the manufacturing process. For example, substantially vertical may include not only completely vertical but also approximately vertical. In addition, substantially coplanar may include not only completely coplanar but also approximately coplanar.

[0095] In the present disclosure, the same insulating material may not only refer to the completely same insulating material, but may also include the same kind of insulating material. Therefore, the components of the insulating materials are substantially the same, but their specific component ratios may vary slightly.

[0096] It should be noted that, in the present disclosure, the meaning of the cross section may refer to the cross-sectional shape when the target object is cut vertically, or may refer to the cross-sectional shape when the target object is observed from the side. In addition, the meaning of the "plane" may refer to the plane shape when the target object is cut horizontally, or may refer to the plane shape when the target object is observed from a top-down perspective or an upward perspective.

[0097] In the present disclosure, for the sake of convenience, the term "lower" in "lower side", "lower part", "bottom", "lower surface", etc. is used to indicate a downward direction based on a cross section of the drawings. The term "upper" in "upper side", "upper part", "upper surface", etc. is used to indicate an opposite direction. However, this direction is defined for the convenience of explanation, and it goes without saying that the scope of the claims is not particularly limited by the description of this direction. The concept of upper / lower may be changed at any time.

[0098] In the present disclosure, "connection" is a concept that includes not only direct connection but also indirect connection through an adhesive layer or the like. In addition, "electrical connection" is a concept that includes both a case of physical connection and a case of no physical connection. In addition, expressions such as first, second, etc. are used to distinguish one component from another component and do not limit the order and / or importance of the components. In some cases, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component without departing from the scope of the claims.

[0099] The expression "example" used in this disclosure does not mean the same embodiment, but is provided to emphasize and illustrate different unique features. However, the examples presented above do not exclude implementation in combination with features of other examples. For example, even if the content described in an example is not described in another example, unless there is an opposite or contradictory description in the other example, the content can also be understood as a description related to the other example.

[0100] The terms used in the present disclosure are only for describing examples and are not intended to limit the present disclosure. In this case, unless the context clearly indicates otherwise, a singular expression includes a plural expression.

[0101] While example embodiments have been shown and described above, it will be readily apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A printed circuit board, comprising: a glass layer having a first side surface and a second side surface opposite to each other in a first direction, a third side surface and a fourth side surface opposite to each other in a second direction perpendicular to the first direction, a first corner portion connecting the first side surface and the third side surface to each other, a second corner portion connecting the first side surface and the fourth side surface to each other, a third corner portion connecting the second side surface and the third side surface to each other, and a fourth corner portion connecting the second side surface and the fourth side surface to each other; a first insulating layer, disposed on the glass layer and covering at least a portion of at least one side surface from the first side surface to the fourth side surface; as well as The second insulating layer is disposed on the first insulating layer and covers at least one corner portion from the first corner portion to the fourth corner portion.

2. The printed circuit board according to claim 1, wherein: The first to fourth corner portions are covered by the second insulating layer.

3. The printed circuit board according to claim 1, wherein: A portion of the at least one side surface among the first to fourth side surfaces is covered by the first insulating layer, and another portion of the at least one side surface among the first to fourth side surfaces is covered by the second insulating layer.

4. The printed circuit board according to claim 3, wherein: The first insulating layers and the second insulating layers are alternately disposed on the at least one side surface among the first to fourth side surfaces.

5. The printed circuit board according to claim 1, wherein On a plane, at least one of the first to fourth corner portions is inclined.

6. The printed circuit board according to claim 5, wherein: On a plane, the at least one corner portion among the first to fourth corner portions forms an obtuse angle with the at least one side surface among the first to fourth side surfaces.

7. The printed circuit board according to claim 1, wherein: In a plane, at least one of the first to fourth corner portions has a step.

8. The printed circuit board according to claim 1, wherein: The first insulating layer and the second insulating layer include the same material, There is an interlayer boundary between the first insulating layer and the second insulating layer.

9. The printed circuit board according to claim 1, wherein: The first insulating layer and the second insulating layer include different materials.

10. The printed circuit board according to any one of claims 1 to 9, further comprising: a through hole passing through the glass layer; A first wiring layer, disposed on the first insulating layer; a first via layer passing through the first insulating layer to connect the first wiring layer and the through via to each other; A second wiring layer, disposed on the second insulating layer; as well as A second via layer passes through the second insulating layer to connect the second wiring layer and the first wiring layer to each other.

11. The printed circuit board according to claim 10, further comprising: a third insulating layer, disposed on the second insulating layer; A third wiring layer, disposed on the third insulating layer; as well as A third via layer passes through the third insulating layer to connect the third wiring layer and the second wiring layer to each other.

12. A printed circuit board, comprising: a glass layer having a first side surface and a second side surface opposite to each other in a first direction, a third side surface and a fourth side surface opposite to each other in a second direction perpendicular to the first direction, a first corner portion connecting the first side surface and the third side surface to each other, a second corner portion connecting the first side surface and the fourth side surface to each other, a third corner portion connecting the second side surface and the third side surface to each other, and a fourth corner portion connecting the second side surface and the fourth side surface to each other; as well as an insulating material, disposed on the glass layer and covering the first side surface to the fourth side surface and the first corner portion to the fourth corner portion, Wherein, at least one corner portion among the first corner portion to the fourth corner portion has a plurality of edges.

13. The printed circuit board according to claim 12, wherein: The first corner portion includes a first corner portion surface in contact with the first side surface and the third side surface, and The plurality of edges include an edge at which the first corner surface contacts the first side surface and another edge at which the first corner surface contacts the third side surface.

14. The printed circuit board according to claim 12, wherein: The first corner portion includes a plurality of first corner portion surfaces respectively contacting the first side surface and the third side surface and contacting each other, and The plurality of edges include edges where the plurality of first corner surface contacts each other.

15. The printed circuit board according to claim 12, wherein: On a plane, at least one of the first to fourth corner portions has an inclination.

16. The printed circuit board according to claim 12, wherein: In a plane, at least one of the first to fourth corner portions has a step.

17. The printed circuit board according to claim 16, wherein: In a cross section in a direction perpendicular to the stacking direction, the step includes a staircase shape.

18. The printed circuit board according to claim 12, wherein: The insulating material includes a first insulating material disposed on the glass layer and a second insulating material disposed on the first insulating material, The first insulating material covers the first side surface to the fourth side surface of the glass layer and a portion of the first corner portion to the fourth corner portion, and The second insulating material covers the first to fourth side surfaces of the glass layer and remaining portions of the first to fourth corner portions.

19. The printed circuit board according to any one of claims 12 to 18, further comprising: a through hole passing through the glass layer; A wiring layer, disposed on or within the insulating material; as well as A via layer passes through at least a portion of the insulating material to connect the wiring layer and the through via to each other.

20. A printed circuit board, comprising: a glass layer having an upper surface and a lower surface opposite to each other in one direction and a first side surface and a second side surface opposite to each other in another direction; a first insulating layer disposed on the glass layer to cover a portion of the first side surface, a portion of the second side surface, and the upper surface; a second insulating layer disposed on the first insulating layer and extending to cover another portion of the first side surface and another portion of the second side surface; a through hole passing through the glass layer; a first wiring layer, disposed on the first insulating layer and covered by the second insulating layer; as well as a first via hole penetrating through the first insulating layer to connect the first wiring layer and the through via hole to each other, Wherein, at an interface between the first via hole and the through via, a width of the first via hole is different from a width of the through via.

21. The printed circuit board according to claim 20, further comprising: A second wiring layer, disposed on the second insulating layer; as well as A second via layer passes through the second insulating layer to connect the second wiring layer and the first wiring layer to each other.

22. The printed circuit board according to claim 20, wherein: The first insulating layer is in contact with the portion of the first side surface, the portion of the second side surface, and the upper surface, and The second insulating layer contacts the other portion of the first side surface and the other portion of the second side surface.

23. The printed circuit board according to claim 22, wherein: Of the first insulating layer and the second insulating layer, only the first insulating layer is in contact with the upper surface.

24. The printed circuit board according to claim 20, wherein: An inclination angle of the first via hole relative to the upper surface is different from an inclination angle of the through via hole relative to the upper surface.

25. The printed circuit board according to claim 20, wherein The first via hole has a tapered shape having a width gradually decreasing in a direction toward the through via hole.

26. The printed circuit board according to claim 20, wherein The first insulating layer extends from the portion of the first side surface and the portion of the second side surface to cover the lower surface, and The second insulating layer extends from the other portion of the first side surface and the other portion of the second side surface to cover a portion of the first insulating layer covering the lower surface.

27. The printed circuit board according to claim 20, wherein: The first insulating layer extends from the portion of the first side surface and the portion of the second side surface to cover the lower surface, and The printed circuit board further includes another via hole, the other via hole passing through a portion of the first insulating layer covering the lower surface and connected to the through via hole, Wherein, at the interface between the another via hole and the through via hole, the width of the another via hole is different from the width of the through via hole.

28. The printed circuit board according to claim 27, wherein The first via hole and the another via hole have tapered shapes tapering in opposite directions.

29. The printed circuit board according to claim 20, wherein: The glass layer is spaced apart from an outer surface of the printed circuit board.

30. The printed circuit board according to claim 20, wherein: At an interface between the first via hole and the through via, the width of the first via hole is smaller than the width of the through via hole.

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